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INTORDUCTION
Now a day’s technology is growing very rapidly. We have a lot of advantages of modern
technology. Fire sensor is one of those advantages. With the help of fire sensor we can sense the
fire in some particular area. Fire sensors are placed in some particular area. When a fire sensor is
installed in particular area then we needs not some human being as a security guard. A fire sensor
works continuously and over 24 hours of a day. Whenever it detects a fire it indicates that situation
by the alarm. So that our security can get alert. A fire sensor is very common in now days. We
can see it in a lot of public places, offices, research centers. With the help of fire sensor we can
save our building or some precious goods. It’s very helpful in our real life.
BLOCK DIAGRAM
CIRCUIT DIAGRAM
MATERIAL USED
1. Battery
2. Voltage Regulator
3. Capacitor
4. Resistor
5. LED
6. Microcontroller
7. Crystal
8. Fire Sensor
9. Buzzer
10. Transistor
11. PCB
12. Soldering Iron
13. Soldering Wire
COMPONENTS DESCRIPTION
RESISTORS
The flow of charge (or current) through any material, encounters an opposing force similar in many
respect to mechanical friction. This opposing force is called resistance of the material. It is
measured in ohms. In some electric circuits resistance is deliberately introduced in the form of the
resistor.
Resistors are of following types:
1. Wire wound resistors.
2. Carbon resistors.
3. Metal film resistors.
Carbon Resistors:
Carbon resistors are divided into three types:
a. Carbon composition resistors are made by mixing carbon grains with binding material (glue)
and moduled in the form of rods. Wire leads are inserted at the two ends. After this an insulating
material seals the resistor. Resistors are available in power ratings of 1/10, 1/8, 1/4 , 1/2 , 1.2
watts and values from 1 ohm to 20 ohms.
b. Carbon film resistors are made by deposition carbon film on a ceramic rod. They are
cheaper than carbon composition resistors.
c. Cement film resistors are made of thin carbon coating fired onto a solid ceramic substrate.
The main purpose is to have more precise resistance values and greater stability with heat.
They are made in a small square with leads.
Metal Film Resistors:
They are also called thin film resistors. They are made of a thin metal coating deposited on a
cylindrical insulating support. The high resistance values are not precise in value; however, such
resistors are free of inductance effect that is common in wire wound resistors at high frequency.
Variable Resistors:
Potentiometer is a resistor where values can be set depending on the requirement. Potentiometer
is widely used in electronics systems. Examples are volume control, tons control, brightness and
contrast control of radio or T.V. sets.
RESISTOR COLOR CODE
Color 1st band 2nd band 3rd band (multiplier) 4th band (tolerance) Temp. Coefficient
Black 0 0 ×100
White 9 9 ×109
Band 2
Band 3
Band 4
CAPACITORS
A capacitor can store charge, and its capacity to store charge is called capacitance. Capacitors
consist of two conducting plates, separated by an insulating material (known as dielectric). The
two plates are joined with two leads. The dielectric could be air, mica, paper, ceramic, polyester,
polystyrene, etc. This dielectric gives name to the capacitor. Like paper capacitor, mica capacitor
etc.
Types of Capacitors:- Capacitors are of two Types Fixed and variable capacitor.
Fixed types of capacitor are further of two types:-
Polar Capacitor:- Those capacitor have polarity are known as polar capacitor. Electrolytic
capacitor are the example of polar capacitors.
Non Polar Capacitor:- Those capacitor have no polarity are known as NON- polar capacitor.
Ceramic capacitor are the example of non polar capacitors
Electrolytic Capacitor: Electrolytic capacitors have an electrolyte as a dielectric. When such an
electrolyte is charged, chemical changes takes place in the electrolyte. If its one plate is charged
positively, same plate must be charged positively in future. We call such capacitors as polarized.
Normally we see electrolytic capacitor as polarized capacitors and the leads are marked with
positive or negative on the can. Non-electrolyte capacitors have dielectric material such as paper,
mica or ceramic. Therefore, depending upon the dielectric, these capacitors are classified.
Ceramic Capacitor: Such capacitors have disc or hollow tabular shaped dielectric made of
ceramic material such as titanium dioxide and barium titanate. Thin coating of silver compounds
is deposited on both sides of dielectric disc, which acts as capacitor plates. Leads are attached to
each sides of the dielectric disc and whole unit is encapsulated in a moisture proof coating. Disc
type capacitors have very high value up to 0.001uf. Their working voltages range from 3V to
60000V. These capacitors have very low leakage current. Breakdown voltage is very high.
Transistor:-
The schematic representation of a transistor is shown. Note the arrow pointing down towards the
emitter. This signifies it's an NPN transistor A transistor is basically a current amplifier. Say we
let 1mA flow into the base. We may get 100mA flowing into the collector. Note: The currents
flowing into the base and collector exit through the emitter (sum off all currents entering or leaving
a node must equal zero). The gain of the transistor will be listed in the datasheet as either β DC or
Hfe. The gain won't be identical even in transistors with the same part number. The gain also varies
Voltage Regulator The LM78XX 3-terminal positive voltage regulators employ internal current-
limiting, thermal shutdown and safe-area compensation, making them essentially indestructible.
Heat sinking is provided; they can deliver over 1.0A output current. They are intended as fixed
voltage regulators in a wide range of applications including local (on-card) regulation for
elimination of noise and distribution problems associated with single-point regulation. In addition
to use as fixed voltage regulators.
Features
■ Output current up to 1 A
MICROCONTROLLERS (MCU)
8051 MICROCONTROLLER
Description:-
Features:-
• 8K Bytes of In-System Programmable (ISP) Flash Memory
– Endurance: 1000 Write/Erase Cycles
• 4.0V to 5.5V Operating Range
• Fully Static Operation: 0 Hz to 33 MHz
• Three-level Program Memory Lock
• 256 x 8-bit Internal RAM
• 32 Programmable I/O Lines
• Three 16-bit Timer/Counters
• Eight Interrupt Sources
• Full Duplex UART Serial Channel
• Low-power Idle and Power-down Modes
• Interrupt Recovery from Power-down Mode
• Watchdog Timer
• Dual Data Pointer
• Power-off Flag
• Fast Programming Time
• Flexible ISP Programming (Byte and Page Mode)
PIN CONFIGURATION OF 8051 MICROCONTROLLER
VCC:
Pin 40 provides supply voltage to the chip. The voltage source is +5 Volts.
GND:
Pin 20 is the ground.
The 8051 has an on chip oscillator but requires an external clock to run it. Most
often a quartz crystal oscillator is connected to inputs XTAL1 (pin 19) and XTAL2 (pin
18). The quartz crystal oscillator connected to XTAL1 and XTAL2 also needs two
capacitors of 27 pf value. One side of each capacitor is connected to the ground. Speed
refers to the maximum oscillator frequency connected to XTAL .When the 8051 is
connected to a crystal oscillator is powered up we can observe the frequency on the
XTAL2 pin using the oscilloscope.
RST:
Pin 9 is the RESET pin. It is an input and is active high. Upon applying a high
pulse to this pin the microcontroller well reset and terminate all activities. This is
often referred to as a power on reset .Activating a power on reset will cause all values
the registers to be lost. It will set program counter to all 0s.
In order for the RESET input to be effective it must have a minimum duration of two
machine cycles. In other words the high pulse must be high for a minimum of two
machine cycles before it is allowed to go low.
EA:
The 8051 family members such as the 8751/52, 89C51/52 or DS89C4*0 all
come with on chip ROM to store programs. In such cases the EA pin is connected to
Vcc. For family members such as the 8031 and 8032 in which there is no on chip ROM,
code is stored on an external ROM and is fetched by 8031/32. Therefore for the 8031
the EA pin must be connected to GND to indicate that the code is stored externally. EA
which stands for “external access” is pin number 31 in the DIP packages. It is an input
pin and must be connected to either Vcc or GND. In other words it can not be
unconnected.
PSEN:
This is an output pin. PSEN stands for “program store enable”. In an 8031
based system in which an external ROM holds the program code, this pin is connected
to the OE pin of the ROM.
ALE: ALE stands for “address latch enable. It is an output pin and is active high. When
connecting an 8031 to external memory, port 0 provides both address and data. In
other words the 8031 multiplexes address and data through port 0 to save pins. The
ALE pin is used for de-multiplexing the address and data by connecting to G pin of the
74LS373 chip.
PORTS 0,1,2,3:
All the ports upon RESET are configured as input, since P0-P3 have value FFH
on them. The following is a summary of features of P0-P3.
PORT 0:
PORT 1, PORT 2:
PORT 3:
P3.0 RxD 10
P3.1 TxD 11
P3.2 INT0 12
P3.3 INT1 13
P3.4 T0 14
P3.5 T1 15
P3.6 WR 16
P3.7 RD 17
PROGRAMMING MODEL
In programming model of 8051 we have different types of registers are available and
te4hse registers are used to store temporarily data is then the information could be a
byte of data to be processed or an address pointing to the data to be fetched the
majority of registers is 8051 are 8-bikt registers.
b) B REGISTER:
B register is same as that of accumulator of. It is also an 8 bit register and every bit of
this is accessible. This is also a mathematical register B which is used mostly for
multiplication and division.
Program status word register is an 8 bit register. It is also referred to as the flag
register. Although the PSW register is 8 bits wide, only 6 bits of it are used by the
8051. The unused bits are user-definable flags. Four of the flags are called conditional
flags, meaning that they indicate some conditions that result after an instruction is
executed. These four are CY (carry), AC (auxiliary carry), P (parity) and OV
(overflow).
AC PSW.6 Auxiliary
Carry Flag
F0 PSW.5 Available to
the user for
General
Purpose
OV PSW.2 Overflow
Flag
-- PSW.1 User
Definable Bit
This is the stack pointer of the microcontroller. This SFR indicates where the
next value to be taken from the stack will be read from in Internal RAM. If you push a
value onto the stack, the value will be written to the address of SP + 1. That is to say,
if SP holds the value 07h, a PUSH instruction will push the value onto the stack at
address 08h. This SFR is modified by all instructions, which modify
The stack, such as PUSH, POP, LCALL, RET, RETI, and whenever interrupts are
provoked by the microcontroller.
The SFRs DPL and DPH work together to represent a 16-bit value called the
Data Pointer. The data pointer is used in operations regarding external RAM and some
instructions involving code memory. Since it is an unsigned two-byte integer value, it
can represent values from 0000h to FFFFh (0 through 65,535 decimal).
Transistor:-
The schematic representation of a transistor is shown. Note the arrow pointing down
towards the emitter. This signifies it's an NPN transistor A transistor is basically a current
amplifier. Say we let 1mA flow into the base. We may get 100mA flowing into the
collector. Note: The currents flowing into the base and collector exit through the emitter
(sum off all currents entering or leaving a node must equal zero). The gain of the transistor
will be listed in the datasheet as either βDC or Hfe. The gain won't be identical even in
transistors with the same part number. The gain also varies with the collector current and
temperature.
APPLICATIONS
Program
Org 0000h
Main:
Jnb p1.0,on
Setb p2.0
Call delay
Jmp main
Call delay
Jmp main
Aa: Nop
Djnz,r7,aa
ret
end