Service Manual Nokia 9110

Programs After Market Services (PAMS)
Technical Documentation

[NMP Part No.0275406 + 0275486]
RAE–2
CELLULAR PHONE/
PERSONAL DIGITAL
ASSISTANT
RAE–2 ISSUE 2 10/2000
Copyright 1999. Nokia Mobile Phones. All Rights Reserved.

RAE–2 PAMS
Foreword Technical Documentation
AMENDMENT RECORD SHEET

Amendment Date Inserted By Comments
Number
02/99 Original
ISSUE 2 10/2000 1: General information:
Updated pages 1, 2(ARS), 6, 7,
8, 9, 16, 23, 29
9110i labels p.33 added
Issue 2 10/2000 OJuntune 2: Baseband: Updated pages 1,
2 (ARS)
Fig 5 on p.11 corrected
Issue 2 10/2000 OJuntune 8: Updated p.1, 2(ARS), warranty
transfer guide added p.24 to 26
Issue 2 10/2000 OJuntune 9: Mechanical parts:

Updated pages 1, 2, 6, 7, 9 10
Issue 2 10/2000 OJuntune 10:Schematic diagrams:

Updated A4 p.1, 2, lists p.3 ,
new versions added p.4
New A3 pages 23 to 50
Issue2 10/2000 OJuntune 11: Parts lists:
Updated pp.1, 2
versions added pp. 19 to 34
Issue 2 10/2000 OJuntune 13: Accesssories:
Updated pp 1, 2, Table on p.4,
HSU–1 page removed,
repaginated 1 – 14
ISSUE 2 10/2000 OJuntune Secton Loopset LPS–1/2
removed entirely
Page 2 Issue 2 10/00

PAMS RAE–2
Technical Documentation Foreword
RAE–2 SERVICE MANUAL

OVERALL CONTENTS
1 Overview of NOKIA communicator

2 Baseband Module
3 RF Modules
4 UIF Modules
5 PDA module
6 Service Software
7 Troubleshooting / Disassembly
8 Service Tools
9 List of Variants
10 Schematic / Component Layout Diagrams
11 Parts Lists
12 Quick Guide
13 Accessories
14 Vehicle Installation Guide
Issue 2 10/00 Page 3

RAE–2 PAMS
IMPORTANT
This document is intended for use by qualified service personnel only.
Company Policy
Our policy is of continuous development; details of all technical modifications will
be included with service bulletins.
While every endeavour has been made to ensure the accuracy of this document,
some errors may exist. If any errors are found by the reader, NOKIA MOBILE
PHONES Ltd should be notified in writing.
Please state:
Title of the Document + Issue Number/Date of publication
Latest Amendment Number (if applicable)
Page(s) and/or Figure(s) in error
Please send to: Nokia Mobile Phones Ltd

PAMS Technical Documentation
PO Box 86
24101 SALO
Finland

PAMS RAE–2
Technical Documentation Foreword
Warnings and Cautions

Please refer to the phone’s user guide for instructions relating to operation,
care and maintenance including important safety information. Note also the
following:
Warnings:
CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH
ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI–SKID
BRAKING SYSTEMS. UNDER CERTAIN FAULT CONDITIONS, EMITTED
RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY,
CONSULT THE VEHICLE DEALER/MANUFACTURER TO DETERMINE THE
IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY
THE HANDPORTABLE TELEPHONE MUST NOT BE OPERATED IN AREAS
LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES EG
PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.
OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING
CELLULAR TELEPHONES, MAY INTERFERE WITH THE FUNCTIONALITY
OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A
PHYSICIAN OR THE MANUFACTURER OF THE MEDICAL DEVICE IF YOU
HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY ALSO
BE SUBJECT TO INTERFERENCE.
CLASS 1 LASER PRODUCT. See IEC60825–1 specification: 825–1;
5: Labelling, 5.1: General, 5.2: Class 1
Cautions:
1. Servicing and alignment must be undertaken by qualified personnel only.
2. Ensure all work is carried out at an anti–static workstation and that an
anti–static wrist strap is worn.
3. Ensure solder, wire, or foreign matter does not enter the telephone as
damage may result.
4. Use only approved components as specified in the parts list.
5 Ensure all components, modules screws and insulators are correctly
re–fitted after servicing and alignment. Ensure all cables and wires are
repositioned correctly.
6 All PC’s used with NMP Service Software for this produce must be bios and
operating system ”Year 2000 Compliant”
Issue 2 10/00 Page 5

RAE–2 PAMS
This page intentionally left blank.

RAE–2 Series Transceiver
Chapter 1
GENERAL
INFORMATION
Issue 2 10/00 Copyright 1999 Nokia Mobile Phones. All rights reserved.
RAE–2 PAMS
General Information Technical Documentation

Number
02/99 Original
Issue 2 10/00 OJuntune Updated pages:
6, 7, 8, 9, 16, 23, 29
9110i labels p.33 added
Page 1–2 Issue 2 10/00

PAMS RAE–2
Technical Documentation General Information
CHAPTER 1 – GENERAL INFORMATION

Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–5
Technical Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–5
Product Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–6
Units and Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–7
Accessories for PC connection . . . . . . . . . . . . . . . . . . . . . . . Page 1–7
Audio Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–8
Battery and Chargers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–9
Other Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–9
Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–10
List of Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–10
Basic Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–11
Type Labels for 9110 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–11
Keymat Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–13
Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–16
Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–16
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–16
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–16
Average Current Consumption . . . . . . . . . . . . . . . . . . . . . Page 1–16
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–16
EL Characteristics, PDA and CMT . . . . . . . . . . . . . . . . . Page 1–16
Main RF Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–17
Interconnection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–18
External connections and signals . . . . . . . . . . . . . . . . . . . . . Page 1–19
List of external connectors . . . . . . . . . . . . . . . . . . . . . . . . Page 1–19
Battery Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–20
System Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–21
MMC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–23
Mechanical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–24
User Interface specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–25
User Interface Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–25
Temperature and Environmental Conditions . . . . . . . . . . . Page 1–26
Warnings and Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–26
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–27
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–27
PDA Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–28
CMT Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–28
Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–29
Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–29
Software Specifications of Interfaces . . . . . . . . . . . . . . . . . . . . Page 1–30
Issue 2 10/00 Page 1–3

RAE–2 PAMS
External Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–30

Interfaces Between Transceiver Processors . . . . . . . . . . . Page 1–30
Software–Hardware Interface . . . . . . . . . . . . . . . . . . . . . . . . Page 1–30
Alignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–31
Flashing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–32
Type Labels for 9110i . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–33
Vocabulary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–34

PAMS RAE–2
Introduction
RAE–2N is the 2nd generation communicator for GSM 900 network. Communi-
cator extends the basic digital cellular phone with in–built data capabilities and
applications.
RAE –2 is a phase 2, class4 transceiver with 2W peak TX power.
The device has two user interfaces. The conventional phone interface on the
front cover. By opening the device the user can access the graphical user inter-
face which can utilize the full communicator functionality.
Technical Summary
The Communicator is divided into two main domains: phone and personal digi-
tal assistant (PDA). Phone manages speech and data connections to GSM net-
work. It also handles audio input and output. PDA runs all the applications (e.g.
calendar, contact database etc...) and utilizes the data connections made by
the phone.
The phone is based on DCT3 technology and CUI style user interface soft-
ware. PDA uses AMD’s 486 CPU and GEOS operating system.
Battery technology is Li–ion.
The product has earpiece for conventional phone use but it also has an internal
handsfree speaker.
Connection to the other devices can be handled with 115kbps serial cable or
115kbps IR. Product is IrDA compatible.

RAE–2 PAMS
The phone display is graphical, transflective FSTN LCD display. Display resolu-
tion is 84x48 pixels. The PDA display is graphical, transflective FSTN LCD dis-
play. Display resolution is 640x200 pixels and dot pitch is 0.17mm. Contrast is
good enough to show 16 gray scales.
Both LCD displays are backlit with EL–panel.
In addition to the fixed memory the product can use memory extension module,
MMC, to expand the user file system area. The MMC supports hot insertion.
NOTE: Due to the infrared data link the RAE–2 is officially specificed as :
CLASS 1 LASER PRODUCT.
See IEC 60825–1 specification 825–1; Labelling, 5.1 General 5.2 Class 1.
Product Selection
The product has only one design, however each user interface language ver-
sion has its own product code. Some countries have e.g. English communicator
but manuals in the local language.
Name of Sales Package Sales Sales Notes

Package Package
code code
9110 9110i
Nokia RAE–2NA 0069108 0068061 English
Nokia RAE–2NC 0069109 0069220 France
Nokia RAE–2NB 0069110 0068062 German
Nokia RAE–2NA Benelux 0069111 0069245 Benelux
Nokia RAE–2NS 0069112 0069219 Swedish
Nokia RAE–2NN 0069113 0069221 Norwagian
Nokia RAE–2NP 0069114 0069222 Danish
Nokia RAE–2NM 0069115 0069217 Finnish
Nokia RAE–2NR 0069116 0069126 Italian
Nokia RAE–2NA S/Africa 0069126 0069254 South Africa
Nokia RAE–2NA Poland 0069127 0069252 Polish
Nokia RAE–2NA Baltic 0069128 0069247 Estonian, Latvian, Lithuanian
Nokia RAE–2NF 0069129 0069223 Spanish
Nokia RAE–2NG 0069130 0069224 Portuguese
Nokia RAE–2NA Euro1 0069131 0069248 Hungarian, Turkish, Czech, Romanian
Nokia RAE–2NA Euro2 0069132 0069249 Greek, Romanian, Slovenian
Nokia RAE–2NA Russian 0069133 0069251 Russian
Nokia RAE–2ND, Tim Ital- 0069186 0069227 Tim (Italy)
ian
Nokia RAE–2NK, Movistar 0069168 0069229 Movistar (Spain)
Nokia RAE–2NJ, Airtel 0069169 0069226 Airtel (Spain)
Nokia RAE–2NL France 0069185 Not yet FT (France)
Telecom available

PAMS RAE–2
Units and Accessories
Name of unit or accessory Type code Material Notes

code
Battery BLN–3 0670226 1080 mAh, Li–Ion
Performance Charger ACP–9E 0675149 Fore EURO version
Mobile Charger LCH–9 0271056
Advanced Desktop Stand DCH–7 0271365
RS–232 Adapter Cable DLR–2 0730132
Headset HDC–8 0271368
Advanced HF Car Kit CARK–99 0085155
Upgrade HF Car Kit CARK–102
Memory Card DTS–8 0271581 Removable memory card MMC
Carrying Case CBR–4 0271410
Upgrade Kit For 9110 0086064
Accessories for PC connection
DLR–2
DCH–7

RAE–2 PAMS
The desktop stand can charge the transceiver and one BLN–3 battery simulta-
neously. It also provides connectivity to personal computer. The button in the
front of the deskstand starts synchronization operation if the deskstand is con-
nected to PC with serial cable (DLR–2) and the connectivity software in PC is
activated.
Audio Accessories
HDC–8 CARK–99
Headset differs from DCT3 headset, having a different connector.

The Car kit has a product specific cradle. It is possible to connect DLR–2 PC–
connectivity cable to cradle. Privacy handset (HSU–1) is the same as used
with DCT3 products .

PAMS RAE–2
Battery and Chargers
Battery European charger UK charger Australian charger
BLN–3 ACP–9E ACP–9X ACP–9A
Travel charger
LCH–9
Other Accessories
The Memory card DTS–8 provides additional 8MB of user memory into the
product. Memory cards complies to the open MMC specification. In the future
there will be also larger memory capacities available.

RAE–2 PAMS
Structure
RAE–2Nx consists of three electrical sub–modules and several mechanical
parts. The structure is basically the same for all the language versions. The
only parts that are unique to each language version are located on the first hier-
archy level of the product structure; namely PDA keyboard, Language software
and type label. All other parts and modules are language independent.
RAE–2Nx
Lid PDA CMT AssemblyParts PDA co–label type LanguageSW

MS1 BS1 BS8 MRAE2 keyboard label
UI AssemblyParts
BS2 MRAE2L
List of Modules
Name of module Type code Material Notes

code
MS1 0201224 Lid sub–assembly, contains UI
BS1 BS1 0201096 PDA module, includes CPU and memories
BS8 BS8 0201095 GSM phone module
MRAE2 0261780 Mechanical assembly parts , no language dependent
parts
BS2 BS2 0201097 UI module, includes both LCD’s
MRAE2L 0261786 Assembly parts for lid sub–assembly
Page 1–10 Issue 2 10/00

PAMS RAE–2
Basic Specifications
Dimensions 56x159x25 mm
Weight 200g (excluding battery)
Battery BLN–3, Li–Ion, 1030mAh, 3.6V, 49,1g
Standby time 5–7 days
Talk time 3–7h
Transceiver GSM, class 4
PDA cpu AMD 486, 33MHz
Fixed user memory 2Mbytes
Fixed application memory 4Mbytes
RAM memory (PDA) 2Mbytes
Type Labels for 9110

Each transceiver with unique mechanics or software has its own type label.
The label types for 9110 are illustrated in the two following figures.
UK English German French
Scandinavian Finnish Norwegian
Danish Italian Swedish
Issue 2 10/00 Page 1–11

RAE–2 PAMS
APAC1 APAC2 Spanish
Portuguese Airtel Movistar
FT TIM
APAC1 and APAC2 are products with UK English user interface with software
settings meant for APAC. Scandinavian product has Scandinavian keyboard but
UK English user interface.
Type labels for 9110i are listed on p. 33.
Page 1–12 Issue 2 10/00

PAMS RAE–2
Keymat Variants
The keymat used depends in the language environment.
Figure 1. English keymat
Figure 2. French keymat
Issue 2 10/00 Page 1–13

RAE–2 PAMS
Figure 3. German keymat
Figure 4. Italian keymat
Page 1–14 Issue 2 10/00

PAMS RAE–2
Figure 5. Spanish keymat
Figure 6. Scandinavian keymat
Issue 2 10/00 Page 1–15

RAE–2 PAMS
Technical Specifications
Modes of Operation
The Communicator has several different operating modes depending on the
activity of CMT and PDA modules. CMT unit can be switched off, idle or call.
PDA can be active, standby, suspended or reset. If the battery voltage is too
low PDA is held in reset–mode.
Electrical Specifications
DC Characteristics
DC–supply for the product is BLN–3 Li–Ion battery. Nominal voltage is 3.6V,
Capacity is 1080mAh .
Nominal system voltage for both PDA and CMT is 2.8V.
Average Current Consumption
CMT mode
PDA mode Off Idle Call
Active 90 100 240
Standby 60.5 63 185
Suspended 3.2 5.5 165
Backlight power consumption is 60mA. Handsfree consumes about 80mA.
AC Characteristics
Product contains two EL–panels for CMT and PDA display backlighting.
EL Characteristics, PDA and CMT
Parameter Minimum Typical / Nominal Maximum Unit

Frequency 60 70 180 Hz
Peak–to–peak voltage 170 175 180 V
RMS voltage 70 72 75 V
Page 1–16 Issue 2 10/00

PAMS RAE–2
Main RF Characteristics
Item Values
Receive frequency range 935 ... 960 MHz
Transmit frequency range 890 ... 915 MHz
Duplex spacing 45 MHz
Channel spacing 200 kHz
Number of RF channels 124
Power class 4
Number of power levels 15
Transmitter characteristics
Item Values
Type Upconversion, nonlinear, FDMA/TDMA
Intermediate frequency ( phase modulated ) 116 MHz
LO frequency range 1006 ... 1031 MHz
Output power 2 W peak ( 33 dBm )
Power control range min. 5 ... 30 dBm
Maximum phase error ( RMS/peak ) max 5 deg./20 deg. peak
Receiver characteristics
Item Values
Type Linear, FDMA/TDMA
IF frequencies 1st 71 MHz, 2nd 13 MHz
LO frequencies 1st LO 1006 ... 1031 MHz, 2nd LO 58 MHz
Typical 1 dB bandwidth +/– 90 kHz
Sensitivity min. – 102 dBm , S/N >8 dB
Total typical receiver voltage gain ( from antenna 73 dB
to RX ADC )
Receiver output level ( RF level –95 dBm ) 50 mVpp ( typical balanced signal level of 13 MHz
IF in RF BB interface = input level to
RX ADCs )
Typical AGC range –17 ... +40 dB
Accurate AGC control range 57 dB
Typical AGC step in LNA –15 dB
Usable input dynamic range –102 ... –10 dBm
RSSI dynamic range –110 ... –46 dBm
AGC relative accuracy on channel ( accurate +/– 0.8 dB
range )
Compensated gain variation in receiving band +/– 1.0 dB
Issue 2 10/00 Page 1–17

RAE–2 PAMS
Audio characteristics
Minimum Typical / Maximum Unit / Notes

Nominal
Output freq. range (earpiece) 300 3400 Hz
Output freq. range (HF speak- 300 3400 Hz
er)
Mic. input range. 300 3400 Hz
ringing tone SPL 105 dB at 5 cm
HF speaker SPL 65 dB at 50 cm
Sampling rate 8 kHz
Dynamic range (input) 13 bits
Dynamic range (output) 13 bits
Interconnection Diagram
RAE–2Nx
UI, BS2
battery connector
hinge–flex
coax
4 4
Battery b2b Memory Card
CMT, BS8 PDA, BS1
Card connector
SIM
5
16
SIM connector Test equipment
ÉÉÉÉÉÉÉÉ
3
ÉÉÉÉÉÉÉÉ
system connector Test pads
Charger Accessories PC
Page 1–18 Issue 2 10/00

PAMS RAE–2
External connections and signals

External Connections:
Battery Connector
Sim Connector
under the card lid
Test Pads
under the battery
MMC Connector
under the card lid
System Connector
IR Window
List of external connectors
Connector Name Code Notes Specifications / Ratings

Battery connector 5469087
System connector 5469091 includes also DC and RF
Memory card connector 5469085 removable memory card
SIM connector 5409089
Test pads PCB test pads for production
and after sales
SIM and MMC cards cannot be removed until the BLN–3 battery has been re-
moved.
Issue 2 10/00 Page 1–19

RAE–2 PAMS
Battery Connector
The Battery connector connects BLN–3 battery to the transceiver. The connec-
tor indicates the removal of battery about 5ms before the loss of power be-
cause pins BSI and BTEMP are shorter than BVOLT and BGND.
Pin Name Min Typ Max Unit Notes

1 VBATT 3.0 3.6 4.1 V Battery voltage
2 BSI 0 2.85 V Battery size indication
Phone has 180kohm pull up resistor.
SIM Card removal detection
(Threshold is 2.4V@VBB=2.8V)
21.8 22 22.2 kohm BBS–5 Service battery (No cells)
31.35 33 34.65 kohm BLN–3 Li–Ion battery (4.1V)
5 ms The minimum time from BSI contact dis-
engaged its battery contact to VBATT/
GND disengaged its battery contacts
when battery is removed.
3 BTEMP 0 1.4 V Battery temperature indication
Phone has a 100k (+–5%) pull–up resis-
tor,
Battery package has a NTC pull–down re-
sistor:
47k+–5%@+25C , B=4050+–3%
4 GND 0 0 V Battery ground
Page 1–20 Issue 2 10/00

PAMS RAE–2
System Connector
The System connector combines the charger, external RF and system func-
tions. External signals can connect to e.g. car kit, headset and PC.
The system connector is not physically compatible with DCT3 connectors ex-
cept charger.
PDA SIDE
External RF with switch

PDA connections TX GND
RX DTR
MBUS
XMIC
XEAR
SGND
DC–jack CHRG_CTRL
VIN
GND
CMT SIDE
Guiding and locking holes
Contact Line Symbol CMT Function

PDA SI
1 L_GND Charger ground
DC–jack L_GND Charger ground
DC–jack
side contact
(DC–plug ring)
DC–jack VIN Charger inputGND
voltage
center pin
DC–jack CHRG_CTRL Charger control output (from CMT)
side contact
(DC–plug jacket)
2 VIN Charger input voltage
3 CHRG_CTRL Charger control output (from CMT)
Issue 2 10/00 Page 1–21

RAE–2 PAMS
Contact Line Symbol CMT Function

4 SGND Accessory signal ground
5 XEAR Accessory earphone signal output (from CMT)
6 XMIC Accessory microphone signal input (to CMT)
7 MBUS MBUS, bidirectional serial data I/O (DCD in PC use)
8 DCE_RX serial_RX data. (input)
9 DCE_TX serial_TX data. (output)
10 DTR Data Terminal Ready (DTR). No CMT use
11 GND Ground from BS1 module
12,15 GND GND contacts for RF ground
13 RF_OUT RF signal from RF switch to internal antenna
14 RF_IN RF signal from Duplexer to RF switch
Page 1–22 Issue 2 10/00

PAMS RAE–2
MMC Connector
The MMC connector connects a MMC card to the product.
1234567
Pin I/O Name Function Min Typ Max Unit Description / Note
1 RSV Reserved Reserved for future use
2 I/O MMC_CMD MMC Command / Address / 0 0 0.45 VDC Low, Data to the card
R
Response, Bidirectional
Bidi ti l
2.3 2.8 2.85 VDC High, Data to the card,
pulled up with 10kohm re-
sistor to MMC_VSYS in
CMT module
0.34 VDC Low, Data from the card
2.1 VDC High, Data from the card,
CMT module
259.3 kHz Frequency
3 MMC_GND MMC ground VDC
4 I MMC_VSYS MMC Power Supply 2.75 2.85 VDC
5 I MMC_CLK MMC Clock 0 0 0.45 VDC Low
2.3 2.8 2.85 VDC High
0.2592 8.294 MHz Frequency
6 MMC_GND MMC Ground Ground line reserved for
MMC use
Issue 2 10/00 Page 1–23

RAE–2 PAMS
Pin I/O Name Function Min Typ Max Unit Description / Note
7 I/O MMC_DATA MMC Bidirectional Data 0 0 0.45 VDC Low, Data to the card
2.3 2.8 2.85 VDC High, Data to the card,
CMT module
0 0 0.34 VDC Low, Data from the card
2.1 VDC High, Data from the card,
CMT module
8.294 MHz Frequency
Mechanical Characteristics
Visible product material is ABS+PC except the lens which is clear PMMA. The
bottom part of the device has a magnesium chassis.
Unit Dimensions (mm) Weight

(W x H x D) (g)
Transceiver, RAE–2Nx 56x159x25 202.6
Battery, BLN–3 56x58x12 49.1
Page 1–24 Issue 2 10/00

PAMS RAE–2
User Interface specifications

The product has tho separate user interfaces (UI): CMT UI on the front cover
and PDA UI which can be accessed by opening the device.
CMT UI conforms to Jack–style defined by NMP. The detailed feature list and
UI specifications can be found in PCMS.
User Interface Features

The RAE–2 has two separate user interfaces (UI): CMT UI on the front cover
and PDA UI which can be accessed by opening the device.
Highlights of the CMT interface are:
Graphical user
interface, scal-
able text.
Separate PRO- Voice recorder

FILE–button for se- can be activated
lecting CMT profile from UI.
PDA UI is based on the previous Nokia Communicator product, N9000. The

main difference is that leftmost scroll buttons are replaced by Menu, Zoom and
Backlight buttons.
Issue 2 10/00 Page 1–25

RAE–2 PAMS
Menu
Zoom
Backlight
Menu–button activates an additional pop–up menu window. The contents of the

window depend on the current application. They can be e.g. settings for the
telephone application.
Zoom–button toggles the font size of certain views. The zoomable view de-
pends on the current application. The device has three different zoom levels.
Backlight–button activates the backlight for a pre–set period or until the button
is pressed again. Backlight makes it possible to use the product in low light
conditions.
Temperature and Environmental Conditions

Allowed ambient temperature ranges are listed below:
Ambient temperature Notes

(degrees Celcius)
Operating range –10 . . . +55 GSM phase2 requirements ful-
filled.
Extended operating range –20 . . . +70 Device works but not necessarily
fullfill all GSM requirements.
Storage –30 . . . +70 execept battery
Long time storage (sales pack- 0 . . . +30
age)
Allowed ambient relative humidity :
Ambient relative humidity Notes

Relative humidity 5 . . . 95 % except battery
The transceiver is not protected against ingress of water. The transceiver may
be instantaneously subjected to dripped or condensed water. Longer term con-
tact with water will cause permanent damage.
Warnings and Restrictions

See the User Manual.
Page 1–26 Issue 2 10/00

PAMS RAE–2
Functional Description
The Communicator comprises two functionally independent units: PDA and
CMT.
The PDA implements the communicator application platform.
The CMT implements the GSM transceiver and basic data functionality, both
transparent and non–transparent data. All UI functionality is combined into one
UI module (BS2) but both PDA and CMT control their respective UI indepen-
dently.
The Functional units and the implementation differ slightly. Due to mechanical
reasons some components are placed into a different module than they func-
tionally belong. E.g. audio components are placed into BS1 (PDA) module
even if they functionally belong to the CMT.
Block Diagram
The following diagram describes the functional RAE–2N block diagram.
Antenna
PDA CMT
SCOTTY FLASH 2MBx16 RF
JTAG x486 CPU FLASH 2MBx16 PA Ext. ant. conn.
FLASH 2MBx16 CRFU
DRAM controller DRAM 2MBx16 SUMMA
Lid buttons
Keyboard KB controller Earphone BB

4
HF speaker COBBA Dualaction mic
PDA LCD LCD controller
–backlight CMT LCD
7 MAD
–backlight
UART2 FLASH 1MBx16
CMT keyboard
PLL 32kHz crystal SRAM 128kB
Memory card
2MB – 10MB MMC controller EEPROM 8kB
UART1
CCONT SIM
2 4
PHASER Battery CHAPS
LiIon 1140mAh
3.6V Bottom connector
–charging –ext. audio
IrDA 115.2kb/s –MBUS
PC connectivity CMT Accessories
Issue 2 10/00 Page 1–27

RAE–2 PAMS
PDA Module
The PDA modules has its own power management chip, the Phaser. The
Phaser regulates the voltages for PDA components. It also controls PDA pow-
er–up/down procedure by providing POWERGOOD and RESET signals to
Scotty.
The PDA processor Scotty is an embedded 486 processor manufactured by
AMD. The Scotty contains a set of PC peripherals except a parallel port. It
also has some additional peripherals like LCD controller and MMC host control-
ler which are not standard to PCs. CPU has a 8k cache.
The PDA interfaces the CMT with 115kbps serial bus (FBUS). It also provides
low frequency clock (32kHz) to CMT. PDA also can get information about CMT
state (on/off) and wake up CMT.
CMT Module
The CMT is based on DCT3 engine and it is functionally the same. Sleep clock
(32kHz) is received from PDA side.
All the audio components are controlled by CMT (COBBA). It PDA wishes to
play sounds those are first sent to CMT. Keyclicks and some system sounds
are exceptions and are played directly by PDA.
Page 1–28 Issue 2 10/00

PAMS RAE–2
Power Distribution
All the digital circuitry modules use 2.8V nominal operating voltage. Power is
drawn from the 1080mAh Li–Ion battery. Higher voltages are generated for
LCD, SIM and backlighting.
The diagram below describes the power distribution of the product.
Audio
The transceiver has two speakers; earpiece for the telephone interface and
handsfree (HF) speaker. Different kind of tones can be played through speak-
ers. HF speaker is driven only by CMT module. The earpiece can be driven
either by the PDA or the CMT. The transceiver has one microphone connected
to the CMT module.
The speakers are used :
Issue 2 10/00 Page 1–29

RAE–2 PAMS
1 HF speaker:
Ringing tones
All PDA tones that can be WAV–type
Talk when HF speaker is enabled
2 Earpiece:
Talk and WAV–sounds when HF disabled
Keyclicks
Fixed PDA tones
Software Specifications of Interfaces

CMT SW is based on HD943. This product program has added internal data
functionality and ECI message interface.
External Devices
External devices can be connected through serial cable (DLR–2) or IR. The
protocols used are:
IrOBEX (ir–connectivity),
UltraIR (DCT3 connectivity),
IrDA (PC–connectivity)
IrTranP (camera connectivity).
The PC connectivity uses a specific PCCOM protocol on top of the IrDA or seri-
al connection.
Interfaces Between Transceiver Processors

PDA and CMT processors interface through serial FBUS channel. On top of the
physical FBUS link two separate protocols are used. The Phonet protocol is
used to transport CMT related control information and data–frames. ”RBUS” is
used to transport ECI (External Control Interface) messages between PDA UI
and CMT.
Software–Hardware Interface
CMT sw/hw interface is the same as hd940 is using.
PDA software is running on AMD Elan SC450 processor. Operating frequency
is 33MHz.
Page 1–30 Issue 2 10/00

PAMS RAE–2
GEOS Applications
Manufacturing,
GEOS Kernel & Services
After Sales
and
R&D services
GEOS Spock GS–DOS
CMT HW–
Drivers
Spock GS–BIOS
Testmode PC
Connectivity
PDA HW Module (BS1)
The lowest level of HW/SW interface is handled by the BIOS which provides
some basic services for upper sw layers. E.g. read data from memory card.
Testmode is used by production and After Sales. It provides the interface to
test and program PDA and CMT modules.
DOS layer implements only a subset of DOS functions known from convention-
al PC. DOS is used mainly in testmode and to launch GEOS.
GEOS is the basic SW platform to all applications that user sees. It however
interfaces directly to some HW resources, like LCD display or serial ports, by
its own HW drivers.
Alignment
Both PDA and CMT modules require alignment. Alignment is done at module
level to modules BS8 and BS1. LCD temperature measurement can be done
only after the assembly of the product.
The following parameters are adjusted in CMT module (BS8): TX power, RSSI,
AFC ,TX I&Q, battery voltage and charging current.
PDA module (BS1) needs alignment of: battery voltage, LCD contrast voltage.
Alignment is software based. Predefined reference point measurements are
stored into EEPROM (CMT) or flash (PDA).
Issue 2 10/00 Page 1–31

RAE–2 PAMS
Flashing
Product requires two separate flash images for executable code: one for the
CMT and one for the PDA system. Language versions are held in separate
files.
CMT flashing uses partly the same equipment as other DCT3 family products.
PDA flashing can be done with JTAG (low level flashing) or WinTesla. WinTesla
flashing is recommended.
Page 1–32 Issue 2 10/00

PAMS RAE–2
Type Labels for 9110i

Each transceiver with unique mechanics or software has its own type label.
0630312 0630313 0630319
English German French
0630316 0630315 0630320
Scandinavian Finnish Norwegian
0630321 0630314
0630317
Danish Italian Swedish
H
0630322
0630322 0630323
APAC GER_ALS Spanish
0630324 0630318 0630325
Portuguese TIM Movistar
0630326
Airtel
Issue 2 10/00 Page 1–33

RAE–2 PAMS
Vocabulary
AMD Advanced MIcro Devices
BIOS basic input/output system
CMT cellular mobile telephone
FSTN Film compensated Super Twisted Nematic
HF Hands Free
IR infra red
IrDA IR data association
MMC Multi Media Card
PDA personal digital assistant
RX receive
TX transmit
Page 1–34 Issue 2 10/00

RAE–2 Series PDA Phone
Chapter 2
–Transceiver BS8–
Baseband Block
RAE–2 PAMS
Baseband Technical Documentation

Number
11/98 Original
Issue 2 10/00 OJuntune ARS updated
Fig 5 on p.11 corrected
Page 2– 2 Issue 2 10/00

PAMS RAE–2
Technical Documentation Baseband
CONTENTS –Baseband
Page No
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 5
Technical Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 5
Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 8
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 8
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 8
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 8
Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 9
External Connections from Baseband section of BS8 module 2– 9
Connectors to other modules of the product . . . . . . . . . . . . . . 2– 9
Bottom Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 9
Battery Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 11
SIM card Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 12
Memory Card Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 13
Board to Board Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 14
RF Coax cable connector . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 17
Internal Signals and Connections . . . . . . . . . . . . . . . . . . . . . . . 2– 17
Microphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 17
RF– Baseband interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 18
Functional Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 21
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 21
Battery identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 22
Battery charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 23
Startup charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 23
Battery overvoltage protection . . . . . . . . . . . . . . . . . . . . . . . 2– 24
Battery removal during charging . . . . . . . . . . . . . . . . . . . . . . 2– 25
PWM control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 25
Battery temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 25
Supply voltage regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 26
MAD core regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 27
Switched mode supply VSIM . . . . . . . . . . . . . . . . . . . . . . . . 2– 28
Power up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 28
Power up with power switch (PWRKEYx) . . . . . . . . . . . 2– 28
Power up with a charger . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 29
Service Request State (SRS) . . . . . . . . . . . . . . . . . . . . . . 2– 30
Active Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 31
Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 32
Charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 32
Power Off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 32
Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 33
Issue 2 10/00 Page 2– 3

RAE–2 PAMS
Audio control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 33
PDA Tones . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 34
CMT Alert Signal Generation . . . . . . . . . . . . . . . . . . . . . . . . 2– 34
External audio connections . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 34
Analog audio accessory detection . . . . . . . . . . . . . . . . . . . . 2– 36
Headset detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 36
Headset switch detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 36
Internal audio connections . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 37
4–wire PCM serial interface . . . . . . . . . . . . . . . . . . . . . . . . . 2– 37
Digital control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 38
MAD2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 38
MAD2 memory configuration . . . . . . . . . . . . . . . . . . . . . . 2– 40
MCU Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 41
Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 41
Program Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 41
SRAM Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 42
EEPROM Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 42
Flash Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 43
RAE–2 Flashing connections . . . . . . . . . . . . . . . . . . . . . . 2– 43
Flashing methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 43
Flashing procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 44
Security . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 45
COBBA–GJ ASIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2– 45
Page 2– 4 Issue 2 10/00

PAMS RAE–2
Introduction
This document contains the specification to the Baseband section of the
BS8 module. The BS8 module carries out almost all CMT functions of
RAE–2. BS8 can be divided into two functional sections; BaseBand (BB)
and RF. Some of CMT baseband circuits are implemented to both BS1
and BS2 modules.
The Baseband module BS8 comprises four ASICs (CHAPS, CCONT,
COBBA–GJ and MAD2) that perform the baseband functions of the mod-
ule.
BS1 BS8 AFC

VCTCXO
VCOPWR
Synthesizer 13MHz
TX/RX control RF SUPPLIES
TXC RXC TXPa LNA PA SUPPLY
RF
earphone BB
VREF
HF COBBA CCONT SIMCONN

VCOBBA VSIM
32kHz
MIC
VBB
MMC
MMC IF MAD
CONN
SCOTTY +
BATT.CONN
Memories VBATT
CMT–PDA IF MAD BATTERY
Flash Sram Eeprom
512k 256k 8k
VCHARG
LIM
CHAPS
CMTUI IF
CMT
MBUS
UI
BS2 Ext. audio

IF Charger IF
BOTTOM CONNECTOR
Figure 1. BS8 BaseBand block in RAE–2 product
Technical Summary
The BS8 module is implemented on a single double side 8–layer printed
circuit board. The main part of the baseband area is located on the bot-
tom side of the PCB and only some components (bottom connector, bat-
tery connector and some filter components) are placed on the upper side
(RF side). Component height space on the baseband is 2.0mm.
Issue 2 10/00 Page 2– 5

RAE–2 PAMS
The baseband is running from a 2.8V power rail, which is supplied by the
power controlling ASIC. In the CCONT ASIC there are 6 individually con-
trolled regulator outputs for RF–section and two outputs for the base-
band. In addition there is one +5V power supply output (V5V) for flash
programming voltage and for other purposes where a higher voltage is
needed. The CCONT contains also a SIM interface, which supports both
3V and 5V SIM–cards.
BaseBand Side RF Side
Figure 2. BS8 Module
The interface between the baseband and the RF section is handled by

the specific ASIC COBBA. The COBBA provides:
– A/D and D/A conversion of the in–phase and quadrature receive and
transmit signal paths
– A/D and D/A conversions of received and transmitted audio signals to
and from the UI section.
The COBBA supplies the analog TXC and AFC signals to the RF section
according to the MAD DSP digital control and converts the analog AGC
into digital signal for the DSP. The data transmission between the COB-
BA and the MAD is implemented using a parallel connection for high
speed signalling and a serial connection for PCM coded audio signals.
Digital speech processing is handled by the MAD asic.
The COBBA is a dual voltage circuit, the digital parts are running from the
baseband supply VBB and the analog parts are running from the analog
supply VCOBBA.
Page 2– 6 Issue 2 10/00

PAMS RAE–2
The COBBA supports three microphone inputs and two earphone out-
puts. The inputs can be taken from an internal microphone, a headset mi-
crophone or from an external microphone signal source.
The output for the internal earphone is a dual ended type output capable
of driving a dynamic type speaker. Input and output signal source selec-
tion and gain control are performed inside the COBBA according to con-
trol messages from the MAD. Call alerts, keypad tones, DTMF, and other
audio tones are generated and encoded by the MAD and transmitted to
the COBBA for decoding.
EMC shielding (figure below) is implemented on the BB side using a me-
tallized plastic B–cover and conductive gasket between the B–cover and
the PCB. On the RF side the engine is shielded with a conductive frame
which makes a contact to a ground ring of the CMT board and a ground
plane of the PDA board. There is a conductive gasket between the frame
and the PCB for ensuring proper shielding. In addition he RF area has
three metal cans for RF shielding. Heat generated by the circuitry is con-
ducted out mainly via the PCB ground planes.
Conductive frame +gasket
Metallized B–cover
4 srews for fastening
BS8 module B–cover to frame
Metal
gasket
Metal cans
Microphone
Bottom connector
Issue 2 10/00 Page 2– 7

RAE–2 PAMS
Maximum Ratings
Parameter Rating
Battery voltage, idle mode –0.3 ... 4.1V without charger
Charger input voltage –5.0 ... 16V
Operating temperature range –25C to +70 C
Storage temperature range –40C to +85 C
DC Characteristics
Supply voltages
Line Symbol Minimum Typical / Maximum Unit / Notes
Nominal
Supply battery voltage 3.0 3.6 4.1 V
Battery powerup voltage (HW) 2.9 3.0 3.1 V
Battery cut off voltage (HW) 2.7 2.8 2.9 V
Regulated baseband supply voltage 2.7 2.8 2.85 V
Regulated baseband supply current 3 50 125 mA
Regulated VCORE supply voltage 1.3 – 2.65 V (changeable)
Regulated VCORE supply current 50 mA
COBBA analog supply voltage 2.7 2.8 2.85 V
COBBA analog supply current 5 20 100 mA
Regulated 5V supply voltage 4.8 5.0 5.2 V
Regulated 5V supply current 0 1 30 mA
Regulated 5V SIM supply voltage 4.8 5.0 5.2 V
Regulated 5V SIM supply current 3 10 30 mA
Regulated 3V SIM supply voltage 2.8 3.0 3.2 V
Regulated 3V SIM supply current 1 6 30 mA
Voltage reference 1.4775 1.5 1.5225 V
Note: The RF voltages are described later
AC Characteristics
Table 1. AC Specifications
Line symbol Minimum Typical / Maximum Unit / Notes
Nominal
32kHz 32768 Hz, Sleep clock
RFIClk 13 MHz, System clock
PCMClk 8 kHz, PCM clock
SIMClk 3.25 MHz, SIM Clock
Page 2– 8 Issue 2 10/00

PAMS RAE–2
Connectors
External Connections from Baseband section of BS8

module
This section describes the external electrical connections and interface
levels on the baseband section of the BS8 module. The electrical inter-
face specifications are collected into tables that cover a connector or a
defined interface each.
Connectors to other modules of the product
Bottom Connector
The bottom connector has spring type of connections. In BS8 module
there are contact pads for the spring connections.
X170 Á Á
10
9
11
6
8
7
1
4
3
2
Á Á
Figure 3. Bottom connector pads in BS8 module
The electrical specifications in the next table show the bottom connector
signals and levels on the baseband. The system connector is used to
connect the transceiver to accessories. The table gives the idle voltage
produced by the acceptable chargers at the DC connector input. The ab-
solute maximum input voltage is 30 V due to the transient suppressor that
is protecting the charger input.
Issue 2 10/00 Page 2– 9

RAE–2 PAMS
Table 2. Baseband signals of the bottom connector (X170)
1 L_GND 0 0 V Supply ground
2 VIN 7.25 7.6 7.95 V Unloaded ACP–7 Charger (5kohms load)

16.9 V Peak charger output voltage (5kohms load)
3.25 3.6 3.95 V Loaded charger output voltage (10ohms load)
320 370 420 mA Supply current
7.1 8.4 9.3 V Unloaded ACP–9 Charger
3.25 3.6 3.95 V Loaded charger output voltage (10ohms load)
720 800 850 mA Supply current
3 CHRG_ 0 0.5 V Charger control PWM low

CTRL
2.0 2.85 V Charger control PWM high
32 Hz PWM frequency for a ACP–9
1 99 % PWM duty cycle
4 SGND 47 Ω Output AC impedance (ref. GND)

10 µF Series output capacitance
380 Ω Resistance to phone ground
5 XEAR 47 Ω Output AC impedance (ref. GND)

10 µF Series output capacitance
16 300 Ω Load AC impedance to SGND (Headset)
4.7 10 kΩ Load AC impedance to SGND (Accessory)
1.0 Vpp Maximum output level (no load)
22 626 mV Output signal level
10 kΩ Load DC resistance to SGND (Accessory)
16 1500 Ω Load DC resistance to SGND (Headset)
2.8 V DC voltage (47k pull–up to VBB)
HEAR 28 626 mV Earphone signal (HF– HFCM)
Connected to COBBA HF output
6 XMIC 2.0 2.2 kΩ Input AC impedance

1 Vpp Maximum signal level
1.47 1.55 V Mute (output DC level)
2.5 2.85 V Unmute (output DC level)
100 600 µA Bias current
58 490 mV Maximum signal level
HMIC 0 3.2 29.3 mV Microphone signal
Connected to COBBA MIC3P input
7 MBUS 0 logic low 0.5 V Serial bidirectional control bus.

2.1 logic high 2.85 Baud rate 9600 Bit/s
Phone has a 4k7 pullup resistor
12,1 GND 0 0 V RF ground

5
13 RF_OUT 5 (TX levels) 33 dBm RF signal from RF switch to internal antenna
14 RF_IN 5 (TX levels) 33 dBm RF signal from PA to RF switch.
Page 2– 10 Issue 2 10/00

PAMS RAE–2
The bottom connector has mounting holes for a fastening to a shielding

frame located between the PDA and CMT modules. The bottom connec-
tor has spring type connections to the CMT and the PDA module.
The bottom connector includes the following parts:
– DC connector for external plug–in charger and a desktop charger
– System connector for accessories.
– Connector for external RF signal. This connector is equipped with
throw–over–switch. This is needed to change the RF signal path be-
tween external and internal antenna depending whether the ext anten-
na cable is connected or not.
PDA SIDE
External RF with switch

PDA connections TX GND
RX DTR
MBUS
XMIC
XEAR
SGND
DC–jack CHRG_CTRL
VIN
GND
CMT SIDE
Guiding and locking holes
Figure 4. Bottom Connector
Battery Connector
The electrical specifications for the battery connector are listed in the
next table. The BSI contact of the battery connector is also used to detect
when the battery is removed suddenly.
This information is needed for driv-

ing the SIM card safely down before
supply voltage is lost. The BSI con-
tact in the battery connector has
0.5mm shorter working length than X160
the supply power contacts to give
enough time for the SIM shut down.
BTEMP BSI
GND VBATT
Figure 5. Battery Connector
Issue 2 10/00 Page 2– 11

RAE–2 PAMS
Table 3. Battery Connector Electrical Specifications (X160)

1 VBATT 3.0 3.6 4.1 V Battery voltage
2 BSI 0 2.85 V Battery size indication
CMT has 180kohm pull up resistor.
SIM Card removal detection
(Threshold is 2.4V@VBB=2.8V)
17.1 18 18.9 kohm Field Test Battery (4.1V)
21.8 22 22.2 kohm BBS–5 Service battery (No cells)
31.35 33 34.65 kohm BLN–3 Li–ion battery (4.1V)
5 ms The minimum time from BSI contact disengaged its bat-
tery contact to VBATT/GND disengaged its battery con-
tacts when battery is removed.
3 BTEMP 0 1.4 V Battery temperature indication
CMT has a 100k (+–5%) pullup resistor,
Battery package has a NTC pulldown resistor:
47k+–5%@+25C , B=4050+–3%
0 1 kohm Local mode initialization (in production)
4 GND 0 0 V Battery ground
SIM card Connector
The SIM card connector is located on the baseband side of the BS8 mod-
ule. The contacts of the SIM card connector are protected against elec-
tric discharge with ESD protection components.
SIMRST
SIMCLK
VSIM
X150
SIMDATA
VSIM
GND
Figure 6. SIM Card Connector
Page 2– 12 Issue 2 10/00

PAMS RAE–2
Table 4. SIM Connector Electrical Specifications (X150)

Pin Name Parameter Min Typ Max Unit Notes
4 GND GND 0 0 V Ground
3, 5 VSIM 5V SIM Card 4.8 5.0 5.2 V Supply voltage
3V SIM Card 2.8 3.0 3.2
6 DATA 5V Vin/Vout 4.0 ”1” VSIM V SIM data
0 ”0” 0.5 Trise/Tfall max 1us
3V Vin/Vout 2.8 ”1” VSIM
0 ”0” 0.5
2 SIMRST 5V SIM Card 4.0 ”1” VSIM V SIM reset
3V SIM Card 2.8 ”1” VSIM
1 SIMCLK Frequency 3.25 MHz SIM clock

Trise/Tfall 25 ns
VSIM supply voltages are specified to meet type approval requirements

regardless the tolerances in components.
Memory Card Connector

The Memory card connector locates on BS8 module. Memory card is a
changeable Flash or ROM memory with variable memory size. The PDA
CPU can access with Memory card via synchronous serial interface.
Memory card signals are routed from BS1 module to BS8 module through
board to board connector.
X191
MMC_DATA
MMC_GND
MMC_CLK
MMC_VSYS
MMC_GND
MMC_CMD
NC
Figure 7. Memory Card Connector
The signals of the MMC connector are specified in the board to board
connector table.
Issue 2 10/00 Page 2– 13

RAE–2 PAMS
Board to Board Connector
pin 1 pin 25
All interfaces (except RF antenna
signal) from the BS8 module to the
X190
other RAE–2 modules are routed
over a 50–pins board to board con-
nector. The interfaces can be di- pin 50 pin 26
vided into several groups; CMT–UI,

CMT–HF audio, CMT–PDA, MMC– Figure 8. BoBo Connector
PDA and supply lines for the BS1
and the BS2 modules.
The CMT keyboard with keyboard illumination parts and the CMT display
module with display illumination parts are implemented on a separate UI
module (BS2), which contains also the PDA user interface and an anten-
na matching circuit. The baseband signals to the UI are routed over an
board to board connector to the BS1 module and from the BS1 module
through the hinge flex to the BS2 module.
The Handsfree speaker and earpiece are included in the audio holder.
Because the audio holder and the HF amplifier are located on the PDA
module, several signals through the board to board connector are need-
ed for carrying audios from the CMT to the PDA.
There are data signals for data transmission between the CMT and the
PDA modules. Some I/O signals are needed for carrying logic state in-
formation between modules.
Signal definition and the most important specifications of signals are listed
in the next table.
Table 5. Board to Board Connector (X190)
Pin I/O Name Function Min Typ Max Unit Description /
Note
1,2, VBATT Battery Positive 3.0 3.6 4.1 VDC Unregulated Bat-
tery Voltage
34
3,4,
1.5 1000 mA Current to BS1
5 and BS2 module
(max=peak cur-
rent)
6 O XEAR Audio Output for Handsfree 500 mVpp
7 GND Global Ground Reference for oth-
er signals
8 O BATTDET Battery Position Information 0.23 0.26 0.28 VDC Field Test battery
(only R&D use)
0.28 0.30 0.33 VDC Service battery
(BBS–5)
0.39 0.43 0.48 VDC BLN–3 battery
9 O HFENA Internal Handsfree Amplifier 0 0.5 VDC Low, HF amplifier
Control disabled
2.1 2.85 VDC High, HF amplifier
enabled
Page 2– 14 Issue 2 10/00

PAMS RAE–2
Table 5. Board to Board Connector (X190) (continued)

Note
10 O EARP Earpiece Positive 50 223 mVpp Differential voltage
between EARP
11 O EARN Earpiece Negative and EARN nodes
12 GND Global Ground
13 I PWRONx PDA start CMT to Service Re- 0 0.45 VDC Active state, min.
quest State (SRS) 64ms
2.3 2.8 2.85 VDC Inactive state
14 I 32kHz Sleep clock to CMT 0 0.45 VDC Pulse low level

2.3 2.8 2.85 VDC Pulse high level
12 mA Maximum current
from PDA
32768 Hz Pulse frequency
20 50 80 % Duty cycle (CMT
requirements)
1 % Jitter (CMT re-
quirements)
16 O VBB CMT regulated system volt- 2.7 2.8 2.85 VDC Regulated CMT
age baseband voltage
17 I PWRKEYx CMT Power On/Off Switch 0 0.5 Low, active state

2.7 2.85 VDC High, inactive state
18 O CMT_BL_ON CMT UI Backlight On 0 0.5 VDC Low, backlight off

2.1 2.8 2.85 VDC High, backlight on
19 I ROW3 CMT Keys Row 3 0 0.2 VDC Low
2.5 2.8 2.85 VDC High

2.5 2.8 2.85 VDC High

2.5 2.8 2.85 VDC High
2.5 2.8 2.85 VDC High
24 O COL4 CMT Keys Column 4 0 0.5 VDC Low

2.1 2.85 VDC High

2.1 2.85 VDC High
2.1 2.85 VDC High

2.1 2.85 VDC High

2.1 2.85 VDC High
Issue 2 10/00 Page 2– 15

RAE–2 PAMS

Note
30 O LCDCD CMT LCD Command / Data 0 0.5 VDC Low, Command
S l t
Select
2.1 2.85 VDC High, Data
31 O LCDRSTx CMT LCD Reset 0 0.5 VDC Low, Reset active
2.1 2.85 VDC High, Reset inac-
tive
32 O LCDCSx CMT LCD Chip Select 0 0.5 VDC Low, active
2.1 2.85 VDC High, inactive
34 O GENSCLK CMT LCD and CCONT Serial 0 0.5 VDC Low
Cl k
Clock
2.1 2.85 VDC HIgh
3.250 MHz Pulse frequency in
active state (LCD
communication)
35 O GENSDIO CMT LCD and CCONT Serial 0 0.5 VDC Low
D t
Data
2.1 2.85 VDC High
1.625 MHz Maximum pulse
frequency
37 I FBUS_RXD Fast Serial Data to CMT 0 0.45 VDC Low
2.3 2.85 VDC High
220 k Pulldown resistor
in CMT
38 0 FBUS_TXD Fast Serial Data to PDA 0 0.5 VDC Low
2.1 2.85 VDC High
47 k Pullup resistor in
CMT
40 I/O MBUS Bidirectional Serial Bus 0 0.5 VDC Low, to the PDA
2.1 2.85 VDC Low, to the PDA
0 0.45 VDC Low, from the PDA
2.3 2.8 2.85 VDC High, from the
PDA
47 k Pullup resistor in
CMT
41 I VSYS PDA regulated system voltage 2.75 2.8 2.85 VDC Max current 1mA
42 I LIDSWITCH Lid State Information 0 VDC Low, Lid closed
2.75 2.8 2.85 VDC High, Lid open
10 kohm Pull–up resistor in
PDA
43 THIS SIGNAL IS NOT IN
USE!
Page 2– 16 Issue 2 10/00

PAMS RAE–2

Note
45 I/O MMC_CMD Memory Card Command / Ad- 0 0 0.45 VDC Low, Data to the
dress / Response, Bidirection- card
al
2.3 2.8 2.85 VDC High, Data to the
card, pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT module
0.34 VDC Low, Data from the
card
2.1 VDC High, Data from
the card, pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT module
259.3 kHz Frequency
46 I MMC_VSYS Memory Card Power Supply 2.75 2.85 VDC
47 I/O MMC_DATA Memory Card Bidirectional 0 0 0.45 VDC Low, Data to the
Data card
2.3 2.8 2.85 VDC High, Data to the
card, pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT module
0 0 0.34 VDC Low, Data from the
card
2.1 VDC High, Data from
the card, pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT module
8.294 MHz Frequency
49 I MMC_CLK Memory Card Clock 0 0 0.45 VDC Low
2.3 2.8 2.85 VDC High
RF Coax cable connector

A small SMD coax cable connector is situated on the baseband side of
the BS8 module. It comprises the RF output for the internal antenna.
Internal Signals and Connections

This section describes the internal electrical connections and interface
levels on the baseband part of the BS8 module. The electrical interface
specifications are collected into tables that cover a connector or a defined
interface each.
Microphone
The internal microphone is connected to the PCB with spring contacts.
The microphone input level is specified in the table below. The micro-
Issue 2 10/00 Page 2– 17

RAE–2 PAMS
phone requires a bias voltage to operate. The bias voltage is generated

from the VCOBBA supply with a transistor which is driven by the MAD
general I/O signal (MCUGenOut5).
Table 6. Microphone signals (B250)

6 MICP 3.2 20 mVpp Differential voltage between MICP and MICN
RF– Baseband interface

The interface signals between the BB and the RF section are shown in
next the table as a logical interface. On PCB level the baseband sup-
plies voltages from the CCONT to the separate rf–sub–blocks. The maxi-
mum values specified for the digital signals in the table are the absolute
maximum values from the RF interface point of view.
Table 7. AC and DC Characteristics of RF/BB signals

Signal name From Parameter Mini- Typical Maxi- Unit Function
To mum mum
VBATT Battery Voltage 3.0 3.6 5.0/6.0 V Supply voltage for RF
RF (PA on/PA off)
Current 3500 mA
VXOENA MAD Logic high ”1” 2.1 2.85 V VR1, VR6 in CCONT ON
CCONT
Logic low ”0” 0 0.5 V VR1, VR6 in CCONT
OFF
SYNPWR MAD Logic high ”1” 2.1 2.85 V VR3, VR4 in CCONT ON
CCONT
Logic low ”0” 0 0.5 V VR3,VR4 in CCONT OFF
RXPWR MAD Logic high ”1” 2.1 2.85 V VR2, VR5 in CCONT ON
CCONT
Logic low ”0” 0 0.5 V VR2, VR5 in CCONT OFF
TXPWR MAD Logic high ”1” 2.1 2.85 V VR7 in CCONT ON
CCONT
Logic low ”0” 0 0.5 V VR7 in CCONT OFF
VREF CCONT Voltage 1.478 1.5 1.523 V Reference voltage for
SUMMA SUMMA and CRFU1a
Current 100 uA
Source resistance 10 ohm
PDATA0 MAD Logic high ”1” 2.1 2.85 V Nominal gain in LNA
CRFU1A
Logic low ”0” 0 0.5 V Reduced gain in LNA
SENA MAD Logic high ”1” 2.1 2.85 V PLL enable
SUMMA
Logic low ”0” 0 0.5 V
SDATA MAD Logic high ”1” 2.1 2.85 V Synthesizer data
SUMMA
Data rate frequency 3.25 MHz
SCLK MAD Logic high ”1” 2.1 2.85 V Synthesizer clock
SUMMA
Data rate frequency 3.25 MHz
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PAMS RAE–2
Table 7. AC and DC Characteristics of RF/BB signals (continued)

To mum mum
AFC COBBA Voltage 0.046 2.254 V Automatic frequency control

VCTCXO signal for VC(TC)XO
Resolution 11 bits
Load resistance (dynam- 10 kohm
ic)
Load resistance (static) 1 Mohm

Noise voltage 500 uVrms 10...10000Hz
Settling time 0.5 ms
RFC VCTCXO Frequency 13 MHz High stability clock signal for

MAD the logic circ
circuits
its
Signal amplitude 0.5 1.0 2.0 Vpp
Load resistance 10 kohm
Load capacitance 5 7 10 pF
RXIP/RXIN SUMMA Output level 50 1344 mVpp Differential RX 13 MHz sig-

COBBA nal to baseband
Source impedance 600 ohm
Load resistance 1 Mohm
Load capacitance 4 pF
TXIP/TXIN COBBA Differential voltage swing 0.75 x 0.75 x 0.75 x Vpp Differential in–phase TX
SUMMA 1.022 1.1 1.18 baseband signal for the RF
modulator
DC level 0.784 0.8 0.816 V
Differential offset voltage +/– 2.0 mV
(corrected)
Diff. offset voltage temp. +/– 1.0 mV

dependence

DNL +/– 0.9 LSB
INL +/–1 LSB
Group delay missmatch 100 ns
TXQP/TXQN COBBA Differential voltage swing 0.75 x 0.75 x 0.75 x Vpp Differential quadrature phase
SUMMA 1.022 1.1 1.18 TX baseband signal for the
RF modulator
DC level 0.784 0.8 0.816 V
Differential offset voltage +/– 2.0 mV
(corrected)
Diff. offset voltage temp. +/– 1.0 mV

dependence

Resolution 8 bits
DNL +/– 0.9 LSB
INL +/–1 LSB
Group delay mismatch 100 ns
Issue 2 10/00 Page 2– 19

RAE–2 PAMS

To mum mum
TXP MAD Logic high ”1” 2.1 2.85 V Transmitter power control
SUMMA enable
TXC COBBA Voltage Min 0.12 0.18 V Transmitter power control
SUMMA
Voltage Max 2.27 2.33 V
Vout temperature depen- 10 LSB
dence

active state
Source impedance high Z

power down state
Input resistance 10 kohm

Input capacitance 10 pF
Settling time 10 us
Noise level 500 uVrms 0...200 kHz
Resolution 10 bits
DNL +/–0.9 LSB
INL +/– 4 LSB
Timing inaccuracy 1 us
RXC COBBA Voltage Min 0.12 0.18 V Receiver gain control
SUMMA
Voltage Max 2.27 2.33 V
Vout temperature depen- 10 LSB
dence

active state
Source impedance grounded

power down state
Input resistance 1 Mohm

Input capacitance 10 pF
Settling time 10 us
Noise level 500 uVrms 0...200 kHz
Resolution 10 bits
DNL +/–0.9 LSB
INL +/– 4 LSB
NOTE: Logic controls in low state when RF in power off.
Page 2– 20 Issue 2 10/00

PAMS RAE–2
Functional Descriptions
Power Management
RF SUPPLIES
SYNPWR
VSYN
VREF
VRX
VCP
VTX
PA SUPPLY 13MHz
CLK
RF VCO
BASEBAND
HF–amp VREF
HF COBBA CCONT SIMCONN

VCOBBA
VSIM
PWRKEYx
VCORE
VBB
SCOTTY MAD
MAD
+ PURX
MEMORIES
PHASER VBATT
BATT.CONN
Li–ion
Battery
CMT 3.6V
CHAPS
UI
BS1 BS8 LIM
AGND GND
VIN
BS2
BOTTOM CONNECTOR
CHARGER IF
Figure 9. CMT power distribution
In normal operation the baseband is powered from the phone Li–ion bat-
tery. The battery consists of two Lithium–Ion cell connected in parallel.
An external charger is used for recharging the battery and supplying pow-
er to the phone. The charger is a ”performance travel charger” (Nokia
ACP–9) that can deliver supply current up to 850 mA . It is also possible
to use a standard travel charger (Nokia ACP–7). The ACP–7 delivers
only 400 mA which is too little for charging the battery during a call.
The baseband contains components that control power distribution to the
CMT parts excluding those that use continuous battery supply. The bat-
tery feeds power directly to three CMT parts of the system: CCONT, pow-
er amplifier, and CMT UI. The figure above is the block diagram of the
power distribution.
Issue 2 10/00 Page 2– 21

RAE–2 PAMS
The charging control ASIC called CHAPS provides protection against

overvoltages, charger failures and pirate chargers etc. that would other-
wise cause damage to the phone.
Battery identification
Battery types are identified by a pulldown resistor inside the battery pack.
The MCU can identify the battery by reading the BSI line DC–voltage lev-
el with a CCONT A/D converter.
Also the PDA needs to know whether the battery is connected or not. The
BSI line inside transceiver has a 180k pullup to PDA system voltage,
VSYS. CMOS switch (D100) is added between VSYS powered and VBB
powered circuits for preventing leakage current.
BATTERY VBATT To PDA VSYS VSYS BS8

BLN–3
BTEMP
180k
D100
10k VCC
BSI
BSI CCONT
EN
33k
27p 2n2 100k
GND
SIMCardDetX MAD
VBB
Figure 10. BSI connections
The battery identification line is used also for battery removal detection on
the CMT side. The BSI line is connected to a SIMCardDetX line of MAD2
(D200). SIMCardDetX is a threshold detector with a nominal input switch-
ing level 0.85xVcc for a rising edge and 0.55xVcc for a falling edge. The
battery removal detection is used as a trigger to power down the SIM card
before the power is lost. The working length of the BSI contact in the bat-
tery connector is made 0.5 mm shorter than the supply voltage contacts
so that there is a delay between battery removal detection and supply
power off.
Page 2– 22 Issue 2 10/00

PAMS RAE–2
Vcc
0.850.05 Vcc
0.550.05 Vcc
SIMCARDDETX
GND SIGOUT
Figure 11. SIMCardDetX detection levels
Battery charging
The electrical specifications define the idle voltages generated by the ac-
ceptable chargers at the DC connector input. The absolute maximum in-
put voltage is 30V due to the transient suppressor that is protecting the
charger input. At the phone end there is no difference between a plug–in
charger or a desktop charger. The DC–jack pins and bottom connector
charging pads are connected together inside the phone. Charging block
diagram is below.
MAD
BLN–3 To PA LIM BS8 CHARGER
VOUT
Li–ion 33R/ (ACP–7)
1030mAh CHAPS 33R/100MHz 1.5A
100MHz 0R22 VIN ACP–9
RSENSE VCH
LCH–9
PWM GND 1u
30V
47k
27p CHRG_
VBAT ICHAR CTRL
22k
NOT IN
PWM_OUT ACP–7
VCHAR
5.5V 4k7
CCONT 1n
MAD
CCONTINT
33R/
GND 100MHz
L_GND
Figure 12. Charging block diagram
Startup charging
When a charger is connected, the CHAPS is supplying a startup current
minimum of 130mA to the phone. The startup current provides initial
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RAE–2 PAMS
charging to a phone with an empty battery. The startup circuit charges

the battery until the battery voltage level 3.0V (+/– 0.1V) is reached. Then
the CCONT releases the PURX reset signal and the program execution
starts. The charging mode is changed from startup charging to PWM
charging that is controlled by the MCU software. If the battery voltage
reaches 3.55V (3.75V maximum) before the program has taken control
over the charging, the startup current is switched off. The startup current
is switched on again when the battery voltage has sunk to 100mV (nomi-
nal).
Table 8. Startup characteristics

Parameter Symbol Min Typ Max Unit
VOUT Start– up mode cutoff limit Vstart 3.45 3.55 3.75 V

VOUT Start– up mode hysteresis Vstarthys 80 100 200 mV
NOTE: Cout = 4.7 uF
Start–up regulator output current VOUT = 0V Istart 130 165 200 mA
... Vstart
Battery overvoltage protection

Output overvoltage protection is used to protect the phone from damage.
The power switch is immediately turned OFF if the voltage in VOUT rises
above VLIM1.
Table 9. VLIM characteristics

Parameter Symbol LIM input Min Typ Max Unit
Output voltage cutoff limit VLIM1 LOW 4.4 4.6 4.8 V
When the switch in output overvoltage situation has once turned OFF, it
stays OFF until the the battery voltage falls below VLIM1 and PWM =
LOW is detected. The switch can be turned on again by setting PWM =
HIGH.
Page 2– 24 Issue 2 10/00

PAMS RAE–2
VCH
VCH<VOUT
VOUT t
VLIM1
ON OFF ON
SWITCH
PWM (32Hz)
Figure 13. Output overvoltage protection( in principle; not in timescale)
Battery removal during charging

Output overvoltage protection is also needed in case the main battery is
removed when charger connected or charger is connected before the bat-
tery is connected to the phone.
If the battery is removed during charging, the SIMCardDetX signal goes
active and the SIMCard is driven down.
PWM control
The ACP–9 is controlled with PWM at a frequency of 32Hz. When the
PWM rate is 32Hz CHAPS keeps the power switch continuously in the ON
state.
SWITCH ON
PWM (32Hz)
Figure 14. Switch control with 32 Hz frequency (in this case 50% duty cycle)
Battery temperature
The battery temperature is measured with a NTC inside the battery pack
(see table 12). The BTEMP line in the transceiver has a 100k pull–up to
Issue 2 10/00 Page 2– 25

RAE–2 PAMS
the VREF. The MCU calculates the battery temperature by reading the
BTEMP line DC–voltage level with a CCONT A/D–converter.
BVOLT VREF
BATTERY CMT
BSI
100k
10k
BTEMP
BTEMP CCONT
RT
NTC
27p 10n
BGND
MAD
Figure 15. Standard battery BTEMP connection
Based on 47k ± 5 % NTC with B = 4090 ±1.5 %. Without any alignment,

with that and 1 % pull–up resistor, ± 2.5 _C accuracy is achieved between
– 20 and +60 _C (± 3.5 _C @ –40 ... +85 _C).
Table 10. Battery temperature vs. AD readings and NTC resistance

T [_C] AD R [k] T [_C] AD R [k] T [_C] AD R [k]
–40 963 1589 5 560 120.9 50 145 16.53
–35 942 1151 10 497 94.53 55 122 13.63
–30 915 842.8 15 436 74.40 60 103 11.30
–25 882 622.6 20 379 58.95 65 88 9.404
–20 842 464.1 25 327 47.00 70 74 7.865
–15 795 349.0 30 280 37.71 75 63 6.607
–10 743 264.6 35 238 30.43 80 54 5.573
–5 685 202.3 40 202 24.70 85 46 4.721
0 623 155.8 45 171 20.15 90 39 4.015
NOTE: NTC R values and corresponding AD values are calculated values. Because of toler-
ances real values may differ from the calculated values.
Supply voltage regulators

The heart of the CMT power distribution is the CCONT. It includes all the
voltage regulators and feeds power to the whole system. The baseband
digital parts are powered from the VBB regulator which provides 2.8V
baseband supply. The baseband regulator is active always when the
phone is powered on. The VBB baseband regulator feeds the MAD and
memories, the COBBA digital parts and the LCD driver in the UI section.
There is a separate regulator for the SIM card. The regulator is selectable
Page 2– 26 Issue 2 10/00

PAMS RAE–2
between 3V and 5V and controlled by the SIMPwr line from MAD to

CCONT. The COBBA analog parts are powered from a dedicated 2.8V
supply VCOBBA. The CCONT supplies also 5V for RF and for flash VPP.
Table 11. Regulator activity in different operating modes
Operating mode Vref RF REG VCOBBA VBB VSIM SIMIF

Power off Off Off Off Off Off Pull down
Power on On On/Off On On On On/Off
Reset On Off On On Off Pull down
VR1 On
Sleep On Off Off On On On/Off
NOTE: The COBBA regulator is off in SLEEP mode. Its output pin
may be fed from VBB in SLEEP mode by setting bit RFReg(5) to ’1’
(default).
CCONT includes also five additional 2.8V regulators providing power to
the RF section. These regulators are controlled either by the direct control
signals from the MAD or by the RF regulator control register in the
CCONT which the MAD updates. Below are the listed the MAD control
lines and the regulators they are controlling.
– TxPwr controls VTX regulator (VR5)
– RxPwr controls VRX regulator (VR2)
– SynthPwr controls VSYN_1 and VSYN_2 regulators (VR4 and VR3)
– VCXOPwr controls VXO regulator (VR1)
The CCONT generates also a 1.5 V reference voltage VREF to the COB-
BA, SUMMA and CRFU. The VREF voltage is also used as a reference
to some of the CCONT A/D converters.
In addition to the above mentioned signals, the MAD includes also a TXP
control signal to the SUMMA power control block and to the power ampli-
fier. The transmitter power control TXC is led from the COBBA to the-
SUMMA.
NOTE 1: Characteristics above are NOT valid if Vbat < 3.0V.
NOTE 2: Line regulation is 20dB for f<100kHz when battery volt-
age is lower than 3.1V.
MAD core regulator

This block includes a linear voltage regulator with programmable output
voltage, which supplies the MAD core. The output voltage can be
changed from typical 1.30 V to 2.65 V in 225mV steps. The default output
voltage is 1.975V. Control is possible via control register CVReg; the de-
tails are available in the digital specification of CCONT ASIC. If the regu-
lator is not used, the control must be set to ’0’, and the output left float-
ing.
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RAE–2 PAMS
The lower core voltage is used only with MAD c07 technology in near fu-
ture. There are two jumper resistors (R151 and R152, see the BS8 sche-
matics) in baseband for selecting between normal or lower MAD core
voltage.
Switched mode supply VSIM

There is a switched mode supply for SIM–interface. SIM voltage is se-
lected via serial IO. The 5V SMR can be switched on independently of the
SIM voltage selection, but can’t be switched off when the VSIM voltage
value is set to 5V.
In the next figure the principle of the SMR / VSIM–functions is shown.
CCONT External
V5V_4
VBAT
V5V_3
V5V_2
VSIM 5V5
V5V 5V
5/3V
Figure 16. Principle of the SMR power functions
Power up
The baseband is powered up by:
1. Pressing the power key
2. Connecting a charger to the phone.
3. PDA can power BB to SRS by pulling PWRONx line to low
state.
Power up with power switch (PWRKEYx)
When the power on switch is pressed, the PWRKEYx signal goes low and
pulls the CCONT PWRONx pin to low. The CCONT then switches on the
CCONT digital section and the VCXO as was the case with the charger
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PAMS RAE–2
driven power up. If the PWRONX is low when the 62 ms delay expires,
the PURX is released and the SLEEPX control goes to MAD. If the
PWRONX is not low when 62 ms expires, the PURX will not be released,
and CCONT will go to power off ( digital section will send power off signal
to analog parts).
SLEEPX
PURX
PWRONX
VR1,VR6
VBB (2.8V)
Vchar
1 2 3
1:Power switch pressed ==> Digital voltages on in CCONT (VBB)
2: CCONT digital reset released. VCXO turned on
3: 62 ms delay to see if power switch is still pressed.
Figure 17. Power up with switch
Power up with a charger
When the charger is connected, the CCONT switches on the CCONT dig-
ital voltage as soon as the battery voltage exceeds 3.0V. The reset for the
CCONT’s digital parts is released when the operating voltage is stabilized
(50 us from switching on the voltages). The operating voltage for the
VCXO is also switched on. The counter in the CCONT digital section
keeps the MAD in reset for 62 ms (PURX) to make sure that the clock
provided by VCXO is stable. After this delay the MAD reset is released,
and the VCXO –control (SLEEPX) is given to the MAD. The CMT start to
so called acting dead–state which means that only the charging software
is running and e.g. the RF is powered off.
The next diagram describes the power on procedure with charger (the
picture assumes empty battery, but the situation would be the same with
full battery):
Issue 2 10/00 Page 2– 29

RAE–2 PAMS
SLEEPX
PURX
VXO
Vbat
VR6
VR1
VBB (2.8V)
Vchar
Vref
1 2 3
1: Battery voltage over 3.0==>Digital voltages to CCONT (VBB)
2: CCONT digital reset released. VCXO turned on
3: 62ms delay before PURX released
Figure 18. Power up with charger
Service Request State (SRS)
If CMT is powered off, the PDA has a possibility to startup the CMT to
SERVICE REQUEST (SRS) state by using PWRONx line. The PDA can
do it by pulling the PWRONx line to the low (”0”) state. The difference be-
tween the SRS and acting dead is that the SRS is invisible to the user.
Also during the SRS the RF parts are always powered off.
The SRS is needed when the PDA is going to communicate with the CMT
(e.g. asking some SIM information or battery voltage information) when
the CMT is powered off.
Page 2– 30 Issue 2 10/00

PAMS RAE–2
PDA CMT 1k
ROW0
MAD
PWRKEYx
VBAT
SCOTTY 200k / 2k
pwroff / pwron
inactive: ”HighZ”
active: ”0”
PWRONx 10k PWRONX CCONT
0 1 2 3
CMT is powered ROW0
by PWRKEYx:
PWRONx
(CCONT pin 29)
VBB
0s 62ms
t
0 1 2 3
CMT is powered ROW0
by PWRONx:
PWRONx
(CCONT pin 29)
VBB
0s 62ms
t
0: –CCONT PWRONx input goes to ”0”. CCONT start power on se
quency and releases BB regulator (VBB 2.8V).
1: –When PWRONx has been ”0” at least 62ms, CCONT gives system
control to MAD. MAD start execute MCU SW.
2: –MCU SW read the state of the ROW0 signal.
– If it is ”1” MCU SW go to SRS
– If it is ”0” MCU SW continues to active state.
3: –Power on/off key or PWRONx are released.
Figure 19. SRS versus normal powerup.
Active Mode
In the active mode the phone is in normal operation, scanning for chan-
nels, listening to a base station, transmitting and processing information.
All the CCONT regulators are operating. There are several sub–states in
the active mode depending on if the phone is in burst reception, burst
transmission, if DSP is working etc..
Issue 2 10/00 Page 2– 31

RAE–2 PAMS
Sleep Mode
In the sleep mode all the regulators except the baseband VBB and the
SIM card VSIM regulators are off. Sleep mode is activated by the MAD
after MCU and DSP clocks have been switched off. The voltage regula-
tors for the RF section are switched off and the VCXO power control,
VCXOPwr is set low. In this state only the 32 kHz sleep clock oscillator in
CCONT is running. The flash memory power down input is connected to
the ExtSysResetX signal, and the flash is deep powered down during the
sleep mode.
The sleep mode is exited either by the expiration of a sleep clock counter
in the MAD or by some external interrupt, generated by a charger con-
nection, key press, headset connection etc. The MAD starts the wake up
sequence and sets the VCXOPwr and ExtSysResetX control high. After
VCXO settling time other regulators and clocks are enabled for active
mode.
If the battery pack is disconnected during the sleep mode, the CCONT
pulls the SIM interface lines low as there is no time to wake up the MCU.
Charging
Charging can be performed in any operating mode. The battery type is
indicated by a resistor inside the battery pack. The resistor value corre-
sponds to a specific battery capacity which is defined in the RAE–2 to
1030mAh.
The battery voltage, temperature, size and current are measured by the
CCONT controlled by the charging software running in the MAD.
The power management circuitry controls the charging current delivered
from the charger to the battery. Charging is controlled with a PWM input
signal, generated by the CCONT. The PWM pulse width is controlled by
the MAD and sent to the CCONT through a serial data bus. The battery
voltage rise is limited by turning the CHAPS switch off when the battery
voltage has reached 4.1V (Li–Ion). Charging current is monitored by mea-
suring the voltage drop across a 220mohm resistor.
Power Off
The baseband is powered down by:
1. Pressing the power key, that is monitored by the MAD, which
starts the power down procedure.
2. If the battery voltage is dropped below the operation limit, ei-
ther by not charging it or by removing the battery.
3. Letting the CCONT watchdog expire, which switches off all
CCONT regulators and the phone is powered down.
The power down is controlled by the MAD. When the power key has
been pressed long enough or the battery voltage is dropped below the
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PAMS RAE–2
limit, the MCU initiates a power down procedure and disconnects the SIM
power. Then the MCU outputs a system reset signal and resets the DSP.
If there is no charger connected, the MCU writes a short delay to CCONT
watchdog and resets itself. After the set delay the CCONT watchdog ex-
pires, which activates the PURX and all regulators are switched off and
the phone is powered down by the CCONT.
If a charger is connected when the power key is pressed the phone en-
ters into the acting dead mode.
Watchdog
The Watchdog block inside the CCONT contains a watchdog counter and
some additional logic which are used for controlling the power on and
power off procedures of CCONT. Watchdog output is disabled when
WDDisX pin is tied low. The WD-counter runs during that time, though.
Watchdog counter is reset internally to 32s at power up. Normally it is re-
set by the MAD writing a control word to the WDReg.
Audio control
The audio control and processing is controlled by the COBBA–GJ ASIC,
which contains the audio and rf codecs, and the MAD2, which contains
the MCU, ASIC and DSP blocks handling and processing the audio sig-
nals. The RAE–2 audio block diagram is presented in the figure next
page.
VCOBBA
Premult. COBBA
SCOTTY MIC Preamp Multipl.
PWM Bias+ MIC2
EMC MIC1 LP A
MIC3 Pre D
Serial
IF
HFCM
Amp
AuxOut Multipl.
Earphone HF D
LP A
FET
Switch Ear PCM BUS
Micbias MAD
DSP
HFena MCU encoding
HF–speaker decoding
HookDet VAD
amp Emc + Acc. echo cancel
Interface HeadDet equalization
XEAR
SGND
XMIC
BS1 BS8 EAD CCONT

BOTTOM CONNECTOR
Figure 20. RAE–2 audio block diagram

The baseband supports three microphone inputs and two earphone out-
puts. The inputs can be taken from an internal microphone, a headset mi-
Issue 2 10/00 Page 2– 33

RAE–2 PAMS
crophone or from an external microphone signal source. The microphone

signals from different sources are connected to separate inputs at the
COBBA–GJ. Inputs for the microphone signals are differential type.
The MIC3 input is used for a headset microphone that can be connected
directly to the system connector. The internal microphone is connected to
the MIC2 input and an external pre–amplified microphone (handset/
handsfree) signal is connected to the MIC1 input. In the COBBA there
are also three audio signal outputs of which dual ended EAR lines are
used for internal earpiece and HF line for accessory audio output. The
third audio output AUXOUT is used only for bias supply to the headset
microphone.
When the lid is open the downlink audios can be routed to the internal HF
amplifier. This amplifier and the HF speaker are located on the PDA mod-
ule. The MAD is able to enable the HF amplifier with an HFena–signal.
The internal microphone acts as a handsfree microphone during a HF
call. The microphone signal level is amplified more during an HF call than
a normal call.
PDA Tones
The PDA keyclicks and warning tones are played via the earphone.
There is an external paraller FET switch circuit with earphone located on
the PDA module. The PWM output of the PDA processor is connected to
this circuit and thus the PDA is able to play tones via the earphone.
CMT Alert Signal Generation

A HF speaker is used for giving alert tones and/or melodies as a signal of
an incoming call. The alert signals are routed to the XEAR line by the
DSP. Keypress and user function response beeps are generated with the
earphone.
External audio connections

The external audio connections are presented in the next figure. A head-
set can be connected directly to the system connector. The headset mi-
crophone bias is supplied from the COBBA AUXOUT output and fed to
the microphone through the XMIC line. The 330ohm resistor from the
SGND line to the AGND provides a return path for the bias current.
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PAMS RAE–2
2.8 V
Baseband
47k
22k
HookDet
MAD
22k
HeadDet
1u 100n
CCONT EAD
2.8 V
47k
2k2
AUXOUT
1m
450ohm/
10m 47R 100M
HF XEAR
22p
450ohm/
10m 47R 100M
HFCM SGND
22p
330R
COBBA
450ohm/
33n 100M
MIC1N XMIC
MIC1P
22p
33n
33n
MIC3N
MIC3P
33n
Figure 21. Combined headset and system connector audio signals

(Headset can be connected to system connector)
Issue 2 10/00 Page 2– 35

RAE–2 PAMS
Analog audio accessory detection

The XEAR signal line comprises a 47 kW pullup in the transceiver and 10
kW pulldown to SGND in the accessory. The XEAR is pulled down when
an accessory is connected, and pulled up when disconnected. The XEAR
is connected to the HookDet line (in MAD), an interrupt is given due to
both connection and disconnection. There is filtering between XEAR and
HookDet to prevent audio signal giving unwanted interrupts.
External accessory notices tha powered–up phone by detecting voltage in
XMIC line. The table below is a truth table for detection signals.
Table 12. Truth table for HookDet and HeadDet

Accessory connected HookDet HeadDet Notes
No accessory connected High High Pullups in the transceiver
Headset HDC–8 with a button switch pressed Low Low XEAR and XMIC loaded (dc)
Headset HDC–8 with a button switch released High Low *) XEAR unloaded (dc)
Handsfree (HFU–2) High High Detected via MBUS
*) HeadDet (MAD) cannot be used during a call, because of the 1.5V bias from
AUX OUT (COBBA)
Headset detection
The external headset device is connected to the system connector, from
which the signals are routed to the COBBA headset microphone inputs
and earphone outputs. In the XMIC line there is a (47 + 2.2) kW pull–up in
the transceiver. The microphone is a low resistance pull–down compared
to the transceiver pull–up.
When there is no call going, the AUXOUT is in high impedance state and
the XMIC is pulled up. When the headset is connected, the XMIC is
pulled down. The XMIC is connected to the HeadDet line (in MAD), an
interrupt is given due to both connection and disconnection. There is
filtering between the XMIC and the HeadDet to prevent audio signal giv-
ing unwanted interrupts (when an accessory is connected).
Headset switch detection

The XEAR line comprises a 47 kW pull–up in the transceiver. The ear-
phone is a low resistance pull–down compared with the transceiver pull–
up. When a remote control switch is open, there is a capacitor in series
with the earphone, so the XEAR (and HookDet) is pulled up by the phone.
When the switch is closed, the XEAR (and HookDet) is pulled down via
the earphone. So both press and release of the button gives an interrupt.
During a call there is a bias voltage (1.5 V) in the AUXOUT, and the
HeadDet cannot be used. The headset interrupts should to be disabled
during a call and the EAD line (AD converter in CCONT) should be polled
to see if the headset is disconnected.
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PAMS RAE–2
Internal audio connections
The speech coding functions are performed by the DSP in the MAD2 and
the coded speech blocks are transferred to the COBBA–GJ for digital to
analog conversion, down link direction. In the up link direction the PCM
coded speech blocks are read from the COBBA–GJ by the DSP.
There are two separate interfaces between the MAD2 and COBBA–GJ: a
parallel bus and a serial bus.
The parallel bus features 12 data bits, 4 address bits, read and write
strobes and a data available strobe. The parallel interface is used to
transfer all the COBBA–GJ control information (both the RFI part and the
audio part) and the transmit and receive samples.
The serial interface between MAD2 and COBBA–GJ includes transmit
and receive data, clock and frame synchronization signals. It is used to
transfer the PCM samples. The frame synchronization frequency is 8 kHz
which indicates the rate of the PCM samples and the clock frequency is 1
MHz. The COBBA generates both clocks.
4–wire PCM serial interface
The interface consists of the following signals:

a PCM codec master clock (PCMDClk),
a frame synchronization signal to DSP (PCMSClk),
a codec transmit data line (PCMTX) and
a codec receive data line (PCMRX).
The COBBA–GJ generates the PCMDClk clock, which is supplied to DSP
SIO. The COBBA–GJ also generates the PCMSClk signal to DSP by di-
viding the PCMDClk. The PCMDClk frequency is 1.000 MHz and is gen-
erated by dividing the RFIClk 13 MHz by 13. The COBBA–GJ further di-
vides the PCMDClk by 125 to get a PCMSClk signal, 8.0 kHz.
PCMDClk
PCMSClk
PCMTxData sign extended MSB LSB

15 14 13 12 11 10 0
PCMRxData sign extended MSB LSB
Issue 2 10/00 Page 2– 37

RAE–2 PAMS
Digital control
All the baseband functions are controlled by the MAD2 ASIC, which con-
sists of a MCU, a system ASIC and a DSP. In addition to the internal
RAM/ROM memory, the MAD2 has an external RAM memory and exter-
nal FLASH and EEPROM type of memories.
MAD2
MAD2 comprises the following building blocks:
– ARM RISC processor with both 16–bit instruction set (THUMB mode)
and 32–bit instruction set (ARM mode)
– TI Lead DSP core with peripherals:
– API (Arm Port Interface memory) for MCU–DSP commu-
nication, DSP code download, MCU interrupt handling vec-
tors (in DSP RAM) and DSP booting
– Serial port (connection to PCM)
– Timer
– DSP memory (80 kW RAM in PD version of MAD2)
– BUSC (BusController for controlling accesses from ARM to API, Sys-
tem Logic and MCU external memories, both 8– and 16–bit memories)
– System Logic
– CTSI (Clock, Timing, Sleep and Interrupt control)
– MCUIF (Interface to ARM via BUSC). Contains MCU Boo-
tROM
– DSPIF (Interface to DSP)
– MFI (Interface to COBBA AD/DA Converters)
– CODER (Block encoding/decoding and A51&A52 ciphering)
– AccIF(Accessory Interface)
– SCU (Synthesizer Control Unit for controlling 2 separate
synthesizer)
– UIF (Keyboard interface, serial control interface for COBBA
PCM Codec, LCD Driver and CCONT)
– SIMI (SimCard interface with enhanced features)
– PUP (Parallel IO, USART and PWM control unit for vibra
and buzzer)
The MAD2 operates from a 13 MHz system clock, which is generated
from the 13MHz VCXO frequency. The MAD2 supplies a 6,5MHz or a
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PAMS RAE–2
13MHz internal clock for the MCU and system logic blocks and a 13MHz
clock for the DSP, where it is multiplied to 45.5MHz DSP clock. The sys-
tem clock can be stopped for a system sleep mode by disabling the
VCXO supply power from the CCONT regulator output. The CCONT pro-
vides a 32kHz sleep clock for internal use and to the MAD2, which is used
for the sleep mode timing. The sleep clock is active when there is a bat-
tery voltage available i.e. always when the battery is connected.
MAD2
MCU SYSTEMLOGIC
UIF
ARM CORE BUSC M PUP
C
ICE
JTAG SIMIF
CRUSHER
U
TESTIF F CTSI
DSP
DSP
JTAG
API D MFI
PERIPHERALS
P CODER
DSP RAM LEAD CORE I

ACCIF
F
SCU
Figure 22. MAD2 ARCHITECTURE
Issue 2 10/00 Page 2– 39

RAE–2 PAMS
MAD2 memory configuration
MAD2 contains 12 kb RAM memory, 68 kb ROM memory. Memory is di-

vided as follows
– Data: 10 kb DARAM 2 kb API RAM
16 kb DROM
– Program: 48 kb PROM
– Program/Data: 4 kb PDROM
PROGRAM DATA
0000h 0000h
RESERVED (OVLY=1) MEMORY MAPPED REGISTERS
NOT USED (OVLY=0) 0060h SCRATCH–PAD RAM
0080h 0080h
ON–CHIP RAM (OVLY=1) ON–CHIP RAM
NOT USED (OVLY=0)
0800h 0800h
12 kW RAM
NOT USED (OVLY=0) ON–CHIP API RAM
API RAM (OVLY=1)
1000h 1000h
ON–CHIP RAM (OVLY=1) ON–CHIP RAM
NOT USED (OVLY=0)
3000h B 3000h A
5000h NOT USED

ON–CHIP PROGRAM ROM
(MPNMC=0)
48 kW PROM
5800h
B000h C
16 kW DROM
ON–CHIP DATA ROM

(DROM=1)
NOT USED (DROM=0)
F000h
4 kW PDROM
F000h
FFFFh FFFFh
BOUNDARIES
A INTERNAL DARAM TO EXTERNAL BOUNDARY
B EXTERNAL BOUNDARY TO INTERNAL PROM NOTE! MPNMC IS TIED TO 0
C EXTERNAL BOUNDARY TO INTERNAL PDROM
Figure 23. MAD2 12/68 DSP MEMORY MAP
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PAMS RAE–2
MCU Memory Map

The MAD2 supports a maximum of 4GB internal and 4MB external ad-
dress space. The external memories use address lines MCUAd0 to
MCUAd21 and 8–bit/16–bit databus. The BUSC bus controller supports
8– and 16–bit access for byte, double byte, word and double word data.
Access wait states (0, 1 or 2) and used databus width can be selected
separately for each memory block.
Table 13. MCU Memory map
Memory block Chip select Start address Stop address Size Size
boot ROM (*) internal 0000 0000 0000 FFFF 64k 64k
API RAM internal 0001 0000 0001 FFFF 64k 64k
System logic internal 0002 0000 0002 FFFF 64k 64k
API ctl reg. internal 0003 0000 0003 FFFF 64k 64k
Bus Controller Internal 0004 0000 0007 FFFF 256k 256k
The same as 0008 0000 000F FFFF 512 k 512 k
0–7FFFF
ext. RAM (*) RAMSelX 0010 0000 001F FFFF 1M 1M
ext. ROM1 ROM1SelX 0020 0000 005F FFFF 4M 4M
ext. ROM2 (*) ROM2SelX 0060 0000 009F FFFF 4M 4M
ext. EEPROM EEPROMSelX 00A0 0000 00DF FFFF 4M 4M
reserved 00E0 0000 00FF FFFF 4M 4M
The same as 0–FF 0100 0000 FFFF FFFF 4G – 16 M 4G – 16 M
FFFF
(*) After reset and when BootROMDis and ROM2Boot are low.
MCU can boot from different memory locations, depending on hardware
(GenSDIO0) and software settings.
Table 14. MCU boot memory selection
Start Stop BootROMDis=0 BootROMDis=1 BootROMDis=0 BootROMDis=1
address address ROM2Boot=0 ROM2Boot=0 ROM2Boot=1 ROM2Boot=1
0000 0000 0000 FFFF boot ROM External RAM ext. ROM2 External RAM
Memories
The BusController (BUSC) section in the MAD decodes the chip select
signals for the external memory devices and the system logic. The BUSC
controls the internal and external bus drivers and multiplexers connected
to the MCU data bus. The MCU address space is divided into access
areas with separate chip select signals. The BUSC supports a program-
mable number of wait states for each memory range.
The minimum access time for all external memories is specified to 120ns.
Program Memory
The MCU program code resides in the program memory. The program
memory size is 8Mbits (512kx16bit) and package is uBGA48.
Issue 2 10/00 Page 2– 41

RAE–2 PAMS
The flash memory has a power down pin that is kept low during the power
up phase of the flash to ensure that the device is powered up in the cor-
rect state, read only. The power down pin is utilized in the system sleep
mode by connecting the ExtSysResetX to the flash power down pin to
minimize the flash power consumption during the sleep.
SRAM Memory
The work memory is a static ram of size 2Mbits (256kx8bit) in a shrink

TSOP32 package. The work memory is supplied from the common base-
band VBB voltage and the memory contents are lost when the baseband
voltage is switched off. All retainable data is stored into the EEPROM (or
flash) when the phone is powered down.
EEPROM Memory
An EEPROM is used for a nonvolatile data memory to store the tuning

parameters and phone setup information. The short code memory for
storing user defined information is also implemented in the EEPROM.
The EEPROM size is 8kbytes and the default package is SO8. The
memory is accessed through a serial bus including also write protection
signal for protecting EEPROM content against any malfunctions.
Page 2– 42 Issue 2 10/00

PAMS RAE–2
Flash Programming
RAE–2 Flashing connections
the RAE–2 has two entities which can be programmed: PDA and CMT.
There are four different interfaces from outside to the RAE–2 which can
be used to transmit software code to the RAE–2. These interfaces are the
following:
– JTAG (PDA flashing only)
– MMC (PDA flashing only)
– FBUS/MBUS (PDA and/or CMT flashing)
PDA_MBUS
PDA FBUS_RX CMT

IR
ReLink
MMC FBUS_TX
5
FBUS_RX
FBUS_TX
MBUS
JTAG
DB_MBUS
Service battery
BC_MBUS
Bottom connector
Figure 24. SPOCK’s flashing connections
Flashing methods
During external CMT programming only the FBUS and MBUS is used for
transmitting software data. The data transmission is done in DCT3 way.
This means that the data is transmitted through the FBUS synchronously.
The clock signal is transmitted on the MBUS line. Since the FBUS does
not go directly to the CMT (as in DCT3 phone) the PDA has to be driven
to ReLink mode before the external CMT programming. In order to boot
the PDA to Relink mode Testmode connection has to established. This is
done inside the Service battery.
The relink causes changes to the DCT3 type power–up procedure during
programming. This is because if the RAE–2’s VBAT is turned off and on,
the PDA will lose the Relink mode. In order to prevent this the CMT is
started by using IBI pulse.
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RAE–2 PAMS
In the DCT3 type the CMT programming bootstrap code is used for start-
ing SW downloading. The bootstrap code resides in the small internal
ROM of the MAD. The bootstrap code is a small part of the download
code and is used only for downloading more code into the RAM.
Data on CMT Flash is divided on two parts:
– CMT SW code
– PPM
The idea is that first the CMT SW code is programmed and after that the
PPM is programmed in same method. This allows the change of lan-
guage without changing the software code.
Flashing procedure
The phone is connected to the flash loading adapter FLA–7 so that supply
voltage for the phone and data transmission lines can be supplied from/to
the FLA–7. When the FLA–7 triggers an IBI pulse to the phone, the pro-
gram execution starts from the BOOT ROM and the MCU investigates in
the early start–up sequence if the flash prommer is connected. This is
done by checking the status of the MBUS–line. Normally this line is high
but when the flash prommer is connected the line is forced low by the
prommer.
The flash prommer serial data receive line is in receive mode waiting for
an acknowledgement from the phone. The data transmit line from the
baseband to the prommer is initially high. When the baseband has recog-
nized the flash prommer, the TX–line is pulled low. This acknowledge-
ment is used to start to toggle MBUS (FCLK) line three times in order that
MAD2 gets initialized. This must be happened within 15 ms after TX line
is pulled low. After that the data transfer of the first two bytes from the
flash prommer to the baseband on the RX–line must be done within 1 ms.
When the MAD2 has received the secondary boot byte count information,
it forces TX line high. Now, the secondary boot code must be sent to the
phone within 10 ms per 16 bit word (If these timeout values are exceed-
ed, the MCU (MAD2) starts normal code execution from flash). After this,
the timing between the phone and the flash prommer is handled with
dummy bytes.
A 5V programming voltage is supplied inside the transceiver from the bat-
tery voltage with a switch mode regulator (5V/30mA) of the CCONT.
Table 15. Flash programming timing characteristic
Characteristics Min Typ Max Unit

Time from boot indication to MAD2 initialization sequence 15 ms
Time from MAD2 initialization sequence to byte lenght information 1 ms
Time from byte length information to end of secondary boot code load- 10 per16 bit ms
ing. word
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PAMS RAE–2
Security
The phone flash program and IMEI code are software protected using an
external security device that is connected between the phone and a PC.
The security device uses the phone given IMEI number, the software ver-
sion number and a 24bit hardware random serial number that is read
from the COBBA and calculates a flash authority identification number
that is stored into the phone EEPROM.
COBBA–GJ ASIC
The COBBA–GJ ASIC provides an interface between the baseband and
the RF–circuitry. The COBBA–GJ performs analogue to digital conver-
sion of the received signal. For transmit path the COBBA_GJ performs
digital to analogue conversion of the transmit amplifier power control
ramp and the in–phase and quadrature signals. A slow speed digital to
analogue converter will provide automatic frequency control (AFC).
The COBBA ASIC is at any time connected to the MAD ASIC with two in-
terfaces, one for transferring tx and rx data between the MAD and COB-
BA and one for transferring codec rx/tx samples.
Issue 2 10/00 Page 2– 45

RAE–2 PAMS
[This page intentionally left blank]
Page 2– 46 Issue 2 10/00

RAE–2 Series transceiver
Chapter 3
–Transceiver BS8 –
BS8_RF Block
Original 02/99 Copyright 1999 Nokia Mobile Phones. All rights reserved.
RAE–2 PAMS
BS8_RF Technical Documentation

Number
02/99 Original
Page 3 – 2 Original 02/99

PAMS RAE–2
Technical Documentation BS8_RF
CONTENTS – RF
Page No
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
Technical summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
RF Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–5
Transmitter Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–6
Output power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–6
Receiver characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–7
DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–8
Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–8
Power distribution diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3–8
Functional descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 10
Normal and extreme voltages . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 10
RF block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 10
Frequency synthesizers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 12
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 13
Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 14
AGC strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 16
AFC function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 17
RF block requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 18
Duplex filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 18
Receiver blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 18
LNA in CRFU_1a . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 18
RX interstage filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 19
1st mixer in CRFU_1a . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 19
1st IF–filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 20
AGC–stage and 2nd mixer in SUMMA . . . . . . . . . . . . . . 3 – 20
2nd IF Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 21
Buffer in SUMMA for 2nd IF . . . . . . . . . . . . . . . . . . . . . . . 3 – 21
Transmitter blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 21
IQ–modulator and TX–AGC in SUMMA . . . . . . . . . . . . . 3 – 21
116 MHz LC TX IF–filter . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 22
Upconversion mixer and in CRFU_1a . . . . . . . . . . . . . . 3 – 23
TX interstage filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 23
Power amplifier MMIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 24
Directional coupler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 25
Power detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 25
Power control section in SUMMA . . . . . . . . . . . . . . . . . . 3 – 26
Synthesizers blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 27
VCTCXO, reference oscillator . . . . . . . . . . . . . . . . . . . . . 3 – 27
VHF PLL in SUMMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 28
VHF VCO and low pass filter . . . . . . . . . . . . . . . . . . . . . . 3 – 28
Original 02/99 Page 3 – 3

RAE–2 PAMS
UHF PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 29
UHF VCO module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 30
UHF local signal input in CRFU_1a . . . . . . . . . . . . . . . . . . . 3 – 31
RF/BB/DSP Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 31
Interface Signal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 31
Data Interface and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 32
Transmit Power Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 34
SUMMA and Synthesizer Control . . . . . . . . . . . . . . . . . . . . . . . 3 – 35
Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 35
PLL Control Word Format . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 35
Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 35
Synthesizer clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 36
GSM Division ratios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 36
Clocking scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 36
SUMMA and Synthesizer Control . . . . . . . . . . . . . . . . . . . . . . . 3 – 35
List of abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 – 36

PAMS RAE–2
Introduction
This document defines the RF–module of the RAE–2 GSM–”engine”.
This section contains electrical specifications, functional descriptions,
block diagrams etc.
Technical summary
The RF in the RAE–2 GSM is based on the architecture used in DCT 3.

The RAE–2 RF Engine (figure below) is a single side design, on the
A–side, with all components located under the PDA unit. Shielding com-
prises three shielding cans with removable lids. The maximum building
height for the RF Engine is 2 mm.
ANT
71MHz
Match Match
SAW
CRFU RX
SAW 116MHz
232MHz
TX SUMMA 13MHz
VCO
SAW CER
DUPLEX
Loop
Filter Loop
Filter
13MHz
PA UHF
VCTCXO
VCO
Detect
stripline
ustripline
RF Characteristics
Table 1. Main RF characteristics

Item Values
Receive frequency range 935 ... 960 MHz
Transmit frequency range 890 ... 915 MHz
Duplex spacing 45 MHz
Channel spacing 200 kHz

RAE–2 PAMS
Table 1. Main RF characteristics (continued)
Item Values
Number of RF channels 124
Power class 4
Number of power levels 15
Note 1 : Standard of primary GSM 900 Band, P – GSM

890 – 915 MHz : Mobile transmit, Downlink
935 – 960 MHz : Mobile receive, Uplink
Transmitter Characteristics
Item Values
Type Upconversion, nonlinear, FDMA/TDMA
Intermediate frequency ( phase modulated ) 116 MHz
LO frequency range 1006 ... 1031 MHz
Output power 2 W peak ( 33 dBm )
Power control range min. 5 ... 33 dBm
Maximum phase error ( RMS/peak ) max 5 deg./20 deg. peak
Output power
Parameter Min. Typ. Max. Unit / Notes

Max. output power 33.0 dBm
Max. output power tolerance +/– 2.0 dB, normal cond.
(power level 5) +/– 2.5 dB, extreme cond.
Output power tolerance / +/– 3.0 dB, normal cond.
power levels 6...15 +/– 4.0 dB, extreme cond.
Output power tolerance / +/– 5.0 dB, normal cond.
power levels 16...19 +/– 6.0 dB, extreme cond.
Output power control step 0.5 2.0 3.5 dB
size
Note 1 : Output power refers to the measure of power when averaged over the use-
ful part of the burst. Power levels are measured at the antenna connector.
Note 2 : Interval between power steps shall be 2 +/–1.5 dB

PAMS RAE–2
Receiver characteristics
Item Values
Type Linear, FDMA/TDMA
IF frequencies 1st 71 MHz, 2nd 13 MHz
LO frequencies 1st LO 1006 ... 1031 MHz, 2nd LO 58 MHz
Typical 1 dB bandwidth +/– 90 kHz
Sensitivity min. – 102 dBm , S/N >8 dB
Total typical receiver voltage gain ( from anten- 73 dB
na to RX ADC )
Receiver output level ( RF level –95 dBm ) 50 mVpp ( typical balanced signal level of 13
MHz
IF in RF BB interface = input level to RX ADCs )
Typical AGC range (dynamic range –93dB) –17 ... +40 dB
Accurate AGC control range 57 dB
Typical AGC step in LNA –15 dB
Usable input dynamic range –102 ... –10 dBm
RSSI dynamic range –110 ... –48 dBm
AGC relative accuracy on channel ( accurate +/– 0.8 dB
range )
Compensated gain variation in receiving band +/– 1.0 dB

RAE–2 PAMS
DC characteristics
Regulators
Transceiver has got a multi function power management IC, which con-
tains among other functions, also 7 pcs of 2.8 V regulators. All regulators
can be controlled individually with 2.8 V logic directly or through control
register. In GSM direct controls are used to get fast switching, because
regulators are used to enable RF–functions.
Use of the regulators can be seen in the power distribution diagram.
CCONT also provides 1.5 V reference voltage for SUMMA and CRFU1a
( and for DACs and ADCs in COBBA too ).
All control signals are coming from MAD and they are 2.8 V logic signals..

Power distribution diagram
Technical Documentation
PAMS
Original 02/99
3.6 V
BATTERY VBATT
1.6 A
PA TXP
VXOENA
SYNPWR
RXPWR
C–CONT
TXPWR
VR VR VR VR VR VR VR VREF V5V
1 2 3 4 5 6 7
84 mA
2.3 mA 18 mA 0.1 mA
VCTCXO PLLs CRFU, SUMMA
BUFFER SUMMA CRFU
VXO VSYN_2 VREF_1
51 mA 19.5 mA VREF_2 1 mA
CRFU, VCOs VTX COBBA CHARGE
SUMMA BUFFERS ANAL. PUMPs
VRX VSYN_1 VCP
Page 3 – 9
BS8_RF
RAE–2
RAE–2 PAMS
Functional descriptions
RF block diagram
The RF block comprises a conventional dual conversion receiver and the
transmitter features an up–conversion mixer for the final TX–frequency.
The architecture contains three ICs. Most of the functions are horizontally
and vertically integrated. UHF functions except power amplifier and VCO
are integrated into CRFU_1a, which is a BiCMOS–circuit suitable for
LNA– and mixer–function. Most of the functions are in SUMMA, which
also is a BiCMOS–circuit. SUMMA is a IF–circuit including IQ–modulator
and PLLs for VHF– and UHF–synthesizers.
Power amplifier is also an ASIC, it is a so called MMIC ( monolithic mi-
crowave integrated circuit ). It has got three amplifier stages including in-
put and interstage matchings. Output matching network is external. Also
TX gain control is integrated into this chip.
See block diagram next page

PAMS RAE–2
SUMMA
TQFP–48
Power amplifier
ext.ant.conn.
two way switch

antenna
Figure 1.

RAE–2 PAMS
Frequency synthesizers
Both VCOs are locked with PLLs into stable frequency source, which is a
VCTCXO–module ( voltage controlled temperature compensated crystal
oscillator ). The VCTCXO is running at 13 MHz. Temperature effect is
controlled with AFC ( automatic frequency control ) voltage, the VCTCXO
is locked into the frequency of the base station. AFC is generated by
baseband with a 11 bit conventional DAC in COBBA.
The UHF PLL is located in the SUMMA. There is 64/65 (P/P+1) prescal-
er, N– and A–divider, reference divider, phase detector and charge pump
for the external loop filter.
The UHF local signal is generated by a VCO–module ( VCO = voltage
controlled oscillator ) and sample of frequency of VCO is fed to prescaler.
The prescaler is a dual modulus divider. The output of the prescaler is
fed to the N– and A–dividers, which produce the input to phase detector.
The phase detector compares this signal to reference signal, which is di-
vided with reference divider from VCTCXO output. Output of the phase
detector is connected into charge pump, which charges or discharges in-
tegrator capacitor in the loop filter depending on the phase of the mea-
sured frequency compared to reference frequency.
The loop filter filters out the pulses and generates the DC to control the
frequency of UHF–VCO. The loop filter defines step response of the PLL
( settling time ) and effects to stability of the loop, that’s why integrator ca-
pacitor has got a resistor for phase compensation.
The other filter components are for sideband rejection. Dividers are con-
trolled via serial bus. SDATA is for data, SCLK is serial clock for the bus
and SENA1 is a latch enable, which stores new data into dividers. The
UHF–synthesizer is the channel synthesizer, so the channel spacing is
200 kHz. 200 kHz is the reference frequency for the phase detector.

PAMS RAE–2
freq.
R reference
AFC–controlled VCTCXO
LP Kvco
f ref
PHASE CHG. f_out
f_out / M
DET. PUMP VCO
Kd
M = A(P+1) + (N–A)P= NP+A

M
VHF PLL is also located into SUMMA. It comprises a 16/17 ( P/P+1 )
dual modulus prescaler, N– and A–dividers, reference divider, phase de-
tector and charge pump for the loop filter. The VHF local signal is gener-
ated with a discrete VCO–circuit. The VHF PLL works in the same way
as UHF–PLL. The VHF–PLL is locked on fixed frequency, so higher ref-
erence frequency is used to decrease phase noise.
Receiver
Receiver is a dual conversion linear receiver.
The received RF–signal from the antenna is fed via the duplex filter to
LNA ( low noise amplifier ) in CRFU_1a. Active parts (RF–transistor and
biasing and AGC–step circuitry) are integrated into this chip. Input and
output matching networks are external.
Gain selection is carried out with PDATA0 control. Gain step in LNA is
activated when the RF–level in the antenna is about –45 dBm.
After the LNA amplified signal ( with low noise level ) is fed to bandpass
filter, which is a SAW–filter ( SAW, surface acoustic wave ).
This bandpass filtered signal is then mixed down to 71 MHz, which is the
first intermediate frequency. The 1st mixer is located into CRFU_1a
ASIC. This integrated mixer is a double balanced Gilbert cell. All active
parts and biasing are integrated and matching components are external.
Because this is an axtive mixer it also amplifies IF–frequency. Also local
signal buffering is integrated and upper side injection is used. First local
signal is generated by the UHF–synthesizer.
The first IF–signal is then bandpass filtered with a selective SAW–filter.
From the mixer output to the IF–circuit input the signal path is balanced.
The IF–filter provides selectivity for channels greater than +/–200 kHz.
Also it attenuates image frequency of the second mixer and intermodulat-

RAE–2 PAMS
ing signals. Selectivity is required in this place, because of needed lineari-

ty and adjacent channel interferers will be on too high signal level for the
stages following.
The next stage in the receiver chain is AGC–amplifier. It is integrated into
SUMMA–ASIC. The AGC has got analog gain control. The control volt-
age for the AGC is generated with DA–converter in COBBA in baseband.
AGC–stage provides accurate gain control range ( min. 57 dB ) for the
receiver.
After the AGC there is the second mixer, which generates the second in-
termediate frequency, 13 MHz. The local signal is generated in SUMMA
by dividing VHF–synthesizer output ( 232 MHz ) by four, so the 2nd LO–
frequency is 58 MHz.
The 2nd IF–filter is a ceramic bandpass filter at 13 MHz. It attenuates ad-
jacent channels, except for +/– 200 kHz there is not much attenuation.
Those +/– 200 kHz interferers are filtered digitally by the baseband. So
the RX DACs are so good, that there is enough dynamic range for the
faded 200 kHz interferer. Also the whole RX has to be able to handle sig-
nal levels in a linear way
After the 13 MHz filter there is a buffer for the IF–signal, which also con-
verts and amplifies single ended signal from filter to balanced signal for
the buffer and AD–converters in COBBA. Buffer in SUMMA has got volt-
age gain of 36dB and buffer gain setting in COBBA is 0 dB. It is possible
to set gainstep ( 9.5 dB ) into COBBA via control bus, if needed..
Transmitter
The transmitter chain consists of IQ–modulator, upconversion mixer, pow-
er amplifier and there is a power control loop.
I– and Q–signals are generated by baseband in COBBA–ASIC. After
post filtering ( RC–network ) they are fed into IQ–modulator in SUMMA. It
generates modulated TX IF–frequency, which is VHF–synthesizer output
divided by two, that is 116 MHz. The TX–amplifier in SUMMA has two se-
lectable gain levels. Output is set to maximum via control register of
SUMMA. After SUMMA there is a bandpass LC–filter for noise and har-
monic filtering before the signal is fed for upconversion into final TX–fre-
quency in CRFU_1a.
Upconversion mixer in CRFU_1a is a so called image reject mixer. It at-
tenuates the unwanted sideband in the upconverter output. The mixer
itself is a double balanced Gilbert cell. The phase shifters required for
image rejection are also integrated. The local signal needed in upconver-
sion is generated by the UHF–synthesizer, but buffers for the mixer are
integrated into CRFU_1a.
The output of the upconverter is buffered and matching network makes a
single ended 50 ohm impedance.
The next stage is a TX interstage filter, which attenuates the unwanted
signals from the upconverter, mainly LO–leakage and image frequency

PAMS RAE–2
from the upconverter. Also it attenuates the wideband noise. This band-
pass filter is a SAW–filter.
The final amplification is carried out by the third IC, the power amplifier
which is a MMIC. It features a 50 ohm input, output requires an external
matching network. The MMIC comprises three amplifier stages and inter-
stage matchings. Also included is a gain control, which is controlled with a
power control loop. The PA features over 35 dB power gain and it is able
to produce 2.5 W into output with 0 dBm input level. The gain control
range is over 35 dB to get desired power levels and power ramping up
and down.
The harmonics generated by the nonlinear PA ( class AB ) are filtered out
with the matching network and lowpass/bandstop filtering in the duplexer.
Bandstop is required because of wideband noise located on RX–band.
Power control circuitry consists of a power detector in the PA output and
an error amplifier in SUMMA. There is a directional coupler connected
between the PA–output and the duplex filter. It takes a sample from the
forward going power with certain ratio. This signal is rectified in a schott-
ky–diode and it produces a DC–signal signal after filtering. This peak–de-
tector is linear on absolute scale, except it saturates on very low and high
power levels – it produces a S–shape curve.
This detected voltage is compared in the error–amplifier in SUMMA to
TXC–voltage, which is generated by DA–converter in COBBA. Because
also gain control characteristics in PA are linear in absolute scale, control
loop defines a voltage loop, when closed. The closed loop tracks the
TXC–voltage quite linearly.
The TXC has got a raised cosine form ( cos4 – function ), which reduces
switching transients, when pulsing power up and down. Because dynam-
ic range of the detector is not wide enough to control the power ( actually
RF output voltage ) over the whole range, there is a control named TXP
to work under detected levels. Burst is enabled and set to rise with the
TXP until the output level is high enough, that feedback loop works. The
loop controls the output via the control pin in the PA MMIC to the desired
output level and burst has got the waveform of TXC–ramps. Because
feedback loops could be unstable, this loop is compensated with a domi-
nating pole. This pole decreases gain on higher frequencies to get phase
margins high enough.

RAE–2 PAMS
DIR.COUPLER PA
RF_OUT RF_IN
K cp
R1 K PA
DETECTOR
K K = –R1/R2
det
ERROR
AMPLIFIER
R2
R
DOMINATING
C POLE
TXC
Figure 2. Power control feedback loop
AGC strategy
The AGC–amplifier is used to maintain output level of the receiver almost
constant.
AGC has to be set before each received burst, this is called pre–monitor-
ing. The receiver is switched on before the burst begins, the DSP mea-
sures received signal level and adjusts RXC, which controls RX AGC–
amplifier or it switches off the LNA with PDATA0 control line. This pre–
monitoring is done in three phases and this sets the settling times for RX
AGC. Pre–monitoring is required because of linear receiver, received sig-
nal must be in full swing, no clipping is allowed and because DSP doesn’t
know, what is the level going to be in next burst.
There is at least 60 dB accurate gain control ( continuous, analog ) and
one digital step in LNA. It is typically about 30...35 dB.
RSSI must be measured on range –48...–110 dBm. After –48 dBm level
MS reports to base station the same reading.
Because of RSSI–requirements, gain step in LNA is used roughly on –45
dBm RF–level and up to –10 dBm input RF–level accurate AGC is used
to set RX output level. LNA is ON ( PDATA0 = ”0” ) below –47 dBm. from
–47 dBm down to –95 dBm
This accurate AGC in SUMMA is used to adjust the gain to desired value.
RSSI–function is in DSP, but it works out received signal level by measur-
ing RX IQ–level after all selectivity filtering ( meaning IF–filters, Σ∆±con-
verter and FIR–filter in DSP). So 50 dB accurate AGC dynamic range is

PAMS RAE–2
required. Remaining 10 dB is for gain variations in RX–chain ( for calibra-

tion )
Below –95 dBm RF–levels, output level of the receiver drops dB by dB.
At –95 dBm level output of the receiver gives 50 mVpp. This is the target
value for DSP. Below this it drops down to ca. 9 mVpp @ –110 dBm RF–
level.
This strategy is chosen because we have to roll off the AGC in PLUSSA
early enough, that it won’t saturate in selectivity tests. Also we can’t start
too early, then we will sacrifice the signal to noise ratio and it would re-
quire more accurate AGC dynamic range. 50 mVpp target level is set,
because RX–DAC will saturate at 1.4 Vpp. This over 28 dB headroom is
required to have margin for +/– 200 kHz faded adjacent channel ( ca. 19
dB ) and extra 9 dB for pre–monitoring.
Production calibration is done with two RF–levels, LNA gain step is not
calibrated. The gain changes in the receiver are taken off from the dy-
namic range of accurate AGC. Variable gain stage in SUMMA is designed
in a way, that it is capable of compensating itself, there is good enough
margin in AGC.
AFC function
AFC is used to lock the transceivers clock to the frequency of the base
station.
AFC–voltage is generated in the COBBA with a 11 bit AD–converter.
There is a RC–filter in AFC control line to reduce the noise from the con-
verter. Settling time requirement for the RC–network comes from signal-
ling, how often PSW ( pure sine wave ) slots occur. They are repeated af-
ter 10 frames , meaning that there is PSW in every 46 ms.
AFC tracks the base station frequency continuously, so the transceiver
has got a stable frequency, because changes in the VCTCXO–output
don’t occur so fast ( temperature ).
Settling time requirement comes also from the start up–time allowed.
When transceiver is in sleep mode and ”wakes” up to receive mode ,
there is only about 5 ms for the AFC–voltage to settle. When the first
burst comes in system clock has to be settled into +/– 0.1 ppm frequency
accuracy. Settling time requirement comes also from the start up–time al-
lowed. When transceiver is in sleep mode and ”wakes” up to receive
mode , there is only about 5 ms for the AFC–voltage to settle. When the
first burst comes in system clock has to be settled into +/– 0.1 ppm fre-
quency accuracy.
The VCTCXO–module requires also 5 ms to settle into final frequency.
Amplitude rises into full swing in 1 ... 3 ms, but frequency settling time is
longer so this oscillator must be powered up early enough.

RAE–2 PAMS
RF block requirements
Duplex filter
Parameter Transmit section Receive section unit

Center frequency, ftx : 902.5 frx : 947.5 MHz
ftx,frx
BW ( bandwidth ) at +/– 12.5 +/– 12.5 MHz
passband
Maximum insertion 1.6 ( at +25 deg. C ) 3.2 ( at +25 deg. C ) dB
loss at BW 1.9 ( at –20...+85 deg. C ) 3.7 ( at –20...+85deg. C )
Ripple at BW, peak to 1.1 1.5 dB
peak
Terminating imped- 50 50 ohms
ance
Maximum VSWR 2.2 1.8
Minimum attenuations Freq.range Att. Freq.range Att.
925...935 3 3...200 30 MHz/dB
935...960 15 200...500 16 MHz/dB
1780...1830 28 500...890 25 MHz/dB
2670...2745 35 890...915 26 MHz/dB
980...1000 21 MHz/dB
1000...1050 23 MHz/dB
1400...1500 35 MHz/dB
Permissible input pow- 4.0 AVG (12.5% duty cyclr) W
er
Part no: NMP code 4512075
Receiver blocks
LNA in CRFU_1a
Parameter Min. Typ. Max. Unit/Notes

Frequency band 935 – 960 MHz
Supply voltage 2.7 2.8 2.855 V
Current consumption 8 mA
Insertion gain 17.5 18.5 19.5 dB
Noise figure 1.7 2.2 dB,PDATA0=H
Input 1 dB compression point –19 dBm, PDATA0=H
Reverse isolation 15 dB
Input VSWR 2

PAMS RAE–2

Output VSWR 2
Gain reduction 30 35 dB,room temp.
Step accuracy –2 +2 dB,over temp.range
Noise figure, when PDATA=0 20 dB
RX interstage filter
Parameter Min. Typ. Max. Unit

Passband 935 – 960 MHz
Insertion loss 3.3 dB
Ripple in passband 1.3 dB
Attenuation DC...890 MHz 45 dB
Attenuation 890...915 MHz 25 dB
Terminating impedance UNBALANCED–BALANCED ohm
50/50
VSWR 2.0
Maximum drive level +15 dBm
Part no: NMP code 4511049
1st mixer in CRFU_1a
Parameter Min. Typ./ Max. Unit/Notes

Nom.
Current consumption 9 mA
RX frequency range 935 960 MHz
LO frequency range 1006 1031 MHz
IF frequency 71 MHz
Insertion gain 9 12 dB
NF, SSB 11.5 dB
IIP3 0 dBm
1 dB input compression point –10 dBm
IF/2 spurious level –30 dBm, *
LO power level in RF–port –25 dBm
Input VSWR 2
Output resistance (balanced) 10 k ohm
Output capacitance (bal- 1.2 pF
anced)

RAE–2 PAMS
1st IF–filter
Parameter min. typ. max. unit

Operating temperature range –20 +75 deg.C
Center frequency , fo 71 MHz
Maximum ins. loss at 1dBBW 11 dB
Group delay ripple at +/–90 kHz BW 1.3 us pp
Bandwidths relative to 71 MHz kHz
1 dB bandwidth +/– 70
3 dB bandwidth +/–120
Spurious rejection, fo +/– 26 MHz 65 dB, *
Terminating impedance ( balanced )
resistance input 1.1 kohm
resistance output 1.2 kohm
capacitance ( parallel ) input 15.6 pF
capacitance ( parallel) output 10.6 pF
* Matching network included. NMP part no. 4510137
AGC–stage and 2nd mixer in SUMMA

Current consumption 27 32 mA
Input frequency range 45 120 MHz
2nd IF frequency range 0.4 17 MHz
Total noise figure, SSB, 15 dB,
max. gain
Total noise figure, SSB, 65 dB,
min. gain
Max. voltage gain 40 dB
Min. voltage gain –20 dB
Control voltage for min. gain 0.5 V
Control voltage for max. gain 1.4 V
Output 1 dB compression 800 mVpp
point @ max. gain
Input 1 dB compresion point 80 mVpp
@ min. gain
IF input impedance (bal- 2.4/tbd 3.8/2 5.6/tbd kohm/pF
anced)
2nd mixer output impedance 100 ohm
( single output )

PAMS RAE–2
2nd IF Filter
Parameter min. typ. max. unit

Center frequency, fo 13 MHz
1 dB bandwidth, 1dBBW +/– 90 kHz
( relative to 13 MHz )
Amplitude ripple at 1dBBW 1.0 dB
Group delay ripple at 1 dB 1.5 us
BW, peak to peak
Attenuations, relative to dB
13 MHz
fo +/– 400 kHz 25
fo +/– 600 kHz 35
fo +/– 800 kHz 45
Terminating impedance 313 330 347 ohm
NMP part no. 4510009
Buffer in SUMMA for 2nd IF

Input frequency range 0.4 17 MHz
Voltage gain ( single ended 34 36 38 dB
input and balanced output )
1 dB output compression 1.4 Vpp
point ( Rload=10 kohm bal-
anced )
Input impedance 3.3/4 kohm/pF
Output impedance, balanced 600 ohm

RAE–2 PAMS
Transmitter blocks
IQ–modulator and TX–AGC in SUMMA

Current consumption 28 tbd. mA
Modulator Inputs (I/Q) Minimum Typical / Maximum Unit / Notes

Nominal
Input bias current (balanced) 100 nA
Input common mode voltage 0.8 V
Input level (balanced) 1.2 Vpp
Input frequency range 0 300 kHz
Input resistance (balanced) tbd kohms
Input capacitance (balanced) 2 pF
IQ–input phase balance –4 4 deg.
total, temperature included
IQ–input phase balance –2 2 deg.
temperature effect
IQ–input amplitude balance –0.5 0.5 dB
total, temperature included
IQ–input amplitude balance –0.2 0.2 dB
temperature effect
Modulator Output Minimum Typical / Maximum Unit / Notes
Nominal
Output frequency 85 400 MHz
Output power, high (bal- –5 –3 dBm
anced, into 100 ohm)
NOTE: Requires input level of
1.1 Vpp (difrential)
Output power, low (balanced, –10 –8 dBm
into 100 ohm )
NOTE: Requires input level of
1.1 Vpp (diff.)
Noise level in output –145 dBm/Hz avg.
Total gain control range 35 dB
Gain step 5 dB

PAMS RAE–2
Modulator Output Minimum Typical / Maximum Unit / Notes

Nominal
Absolute gain accuracy –2 +2 dB
Any gain step up/down set- 10 usec
tling time
Output 3rd Order Intermo- –35 dB
dulation products, when both
wanted signals are at the lev-
el of –12 dBm at the output
116 MHz LC TX IF–filter

Center frequency 116 MHz
Insertion loss @ 116 MHz 3.7 dB
Relative attenuation @ +/– 10 5 dB
MHz offset
Relative attenuation @ +/– 20 8 dB
MHz offset
Relative attenuation @ 232 15 dB
MHz
Relative attenuation @ 348 20 dB
MHz
Relative attenuation @ 25 dB
464–1000 MHz
Input impedance, balanced 100 ohm
Output impedance, balanced 200 ohm
Upconversion mixer and in CRFU_1a

Supply current 50 mA
Input frequency 116 MHz
Input level –5 –8 dBm
Output frequency range 890 915 MHz
Output level +3 +5 dBm
NF,SSB 20 dB
LO–signal level in output –29 dBc
Unwanted sideband level –15 dBc
fLO+/–2xIF spurious level –40 dBc
7x116 MHz spurious level –40 dBc

RAE–2 PAMS

8x116 MHz spurious level –55 dBc
Input impedance (balanced) 600//2 ohm//pF
Output VSWR, ( with match- 2
ing network and output balun)
TX interstage filter

Passband 890 – 915 MHz
Ripple in passband 1.5 dB
Attenuation DC...813 MHz 35 dB
Terminating impedance 50 ohm
VSWR 2.5
Maximum drive level +15 dBm
Power amplifier MMIC
Parameter Symbol Test condition Min Typ Max Unit

Operating freq. range 880 915 MHz
Supply voltage Vcc 3.0 3.5 5.0 V
Auxiliary supply voltage Vreg 2.7 2.8 2.9 V
Auxiliary supply current Ireg tdb. mA
Input power Pin Pout=35.0 dBm, Vcc=3.5 V, 0 2 5 dBm
Vpc=2.2 V,
Output power Pout Pin= 0 dBm, Vcc=3.0 V, 34.2 dBm
Vpc=2.2 V, Tamb=+85 deg.C
Gain control range Vpc= 0.5 ... 2.2 V 45 dB
( overall dynamic
range)
Gain control slope S Vpc1 @10 Vpeak output volt. 20 tbd. 40 V/V
( sensitivity at the linear Vpc2 @0.5 Vpeak output volt.
range ) S=((10–0.5)/(Vpc1–Vpc2))
V/V, Pin = 0...+5dBm

PAMS RAE–2
Parameter Symbol Test condition Min Typ Max Unit

Isolation Vcc=3.5 V, Vpc=0.2 V, Pin=0 –40 dB
dBm
Carrier switching time tr, tf Vcc=3.5 V, Pin=0 dBm 1 us
Vpc is a pulse from 0.2 to 2.2
V. Rise time up to –0.5 dB
from the final power. Fall time
vice versa.
Total efficiency η Pin= 0 dBm , Pout= +34.3 50 %
dBm, Vcc=3.5 V,
Tamb = + 25 deg. C
Control current Ipc Pin= 0...+5 dBm , Pout= +/– 3 mA
+34.8 dBm, Vcc=3.5 V peak
Harmonics –35 dBc
Input VSWR VSWRi1 Pin= 0...+5 dBm , Pout= 2:1
+34.0 dBm, Vcc=3.5 V
VSWRi2 Pin= 0...+5 dBm , Pout= +6.0 4:1
... +32.0 dBm, Vcc=3.5 V
Vpc adjusted for desired
power levels
Leakage current Ileak Vcc=3.5 V, Vpc=0 V, 10 uA
Vreg=0 V, no RF–drive
Intermodulation distor- IMD Pinwant= 0 dBm @ 915 MHz 5 dB
sion Pinint = –50 dBm @ 905 MHz
Poutwant= +34.8 dBm
Vcc=3.5 V,
Poutint @905 MHz
Poutimd @925 MHz
IMD=Poutint – Poutimd,
Tamb = + 25 deg. C
AM–PM conversion Kp Pin= –2.0 ... +5.0 dBm, 3 deg/dB
Pout= +6.0 ... +34.0 dBm
Vpc adjusted for desired out-
put power levels
Vcc=3.0 V
Receive band noise Pn Vcc=3.5 V , RBW=30kHz –80 dBm
power Pout = +34.8 dBm, Freq.
band: 925...960 MHz
Stability Pin= 0 dBm+/–3dBm, All spurious outputs more than 65
Vcc=3.0...5.0 V, dB below desired signal
Vpc=0 ... 2.2 V
Load VSWR 12:1, all phases
Load mismatch stress Pin= 0 dBm, Vcc=5.0 V, No module damage
Pout=Pmax
Load VSWR 20:1, all phases

RAE–2 PAMS
Directional coupler

Frequency range 890 915 MHz
Coupling factor 15 dB
Directivity 13 14 dB
Impedance level of the 50 ohm
main line
VSWR on main line 1.6
Impedance level of the 50 ohm
coupled line
Power detector

Supply current 2.0 mA
Frequency range 890 915 MHz
Dynamic range 45 dB
Linear range, * 35 dB
Bias current for detector 40 uA
diode
Input power range, ** –8 20 dBm
Output voltage 0.1 2.2 V
Variation of the detected volt- 0.7 mV/_C
age over temperature range
* RF input voltage versus detected output voltage

** Directional coupler coupling factor 14 dB
Power control section in SUMMA, closed loop characteristics

Supply current tbd. mA
TXP input voltage, LOW 0.5 V
TXP input voltage, HIGH 2.4 V
Detector input voltage 0.1 2.2 V
TXC input voltage 0.1 2.2 V

PAMS RAE–2

TXC and TXP input resis- 50 kohm
tance
TXC and TXP input capaci- 4 pF
tance
Output voltage (POP & POG) 0.5 2.2 V
POP– and POG–output im- 50 ohm
pedance
POP and POG –output cur- +/– 4 mA
rent driving capability
Switch on resistance (bet– tbd. ohm
ween INL& POP or POG)
Voltage of POP/POG when 0.1 V
inactive (max. 3.5mA sink)
Offset of OP1 and OP2 –40 40 mV
op.amp.
Temperature coefficient of the 30 uV/deg.C
offset voltage
Bandwidth ( OP1 & OP2 ), 6 MHz
unity gain
Open loop gain 20 dB
Closed loop gain 15 dB
Closed loop –3 dB bandwidth 70 kHz
Phase margin 45 60 degrees
Gain margin 30 dB
Synthesizers blocks
VCTCXO, reference oscillator
Parameter Min. Typ. Max Unit/.Notes

Supply voltage, Vcc 2.70 2.80 2.85 V
Current consumption, Icc 1.5 mA
Operating temperature range –20 +75 deg. C
Nominal frequency 13 MHz
Output voltage swing 800 mVpp
( swing of 13 MHz component, se-
lective measurement from the spec-
trum )
Load, resistance 2 kohm
capacitance 10 pF
Frequency tolerance @+25 deg. C – 1.0 + 1.0 ppm
Frequency tolerance after reflow – 2.0 + 2.0 ppm
( @ +25 deg. C )

RAE–2 PAMS
Parameter Min. Typ. Max Unit/.Notes

Frequency stability vs. temperature – 5.0 + 5.0 ppm
( ref. @+25 , –20....+75 deg. C )
Frequency stablity vs. supply volt- – 0.1 + 0.1 ppm
age ( 2.8 V +/– 100 mV )
Frequency stability vs. load change – 0.3 + 0.3 ppm
( 2 kohm//10 pF +/– 10 % )
Aging – 1.0 + 1.0 ppm/year
Nominal control voltage, Vc 1.15 V
Voltage control range 0.0 2.3 V
Voltage control characteristics +/– 12 +/– 24 ppm/V when
( see note 1. ) 0.3 V<Vc<2.3 V
Vc input resistance 1 Mohm
Frequency adjustment +/– ppm with inter–
3.0 nal trimmer
Harmonics ( with 2 kohm//10 pF ) –5 dBc
Start up time ms
output level within 90% 5
output frequency limits +/–0.05ppm 5
from the final value
Phase noise @ 1 kHz offset –130 dBc/Hz
VHF PLL in SUMMA
The same VHF VCO and also the same frequency is used so the VHF
PLL is common.
Table 2. VHF–synthesizer, specification

Start up settling time 3.0 ms
Phase error 1 deg./rms
Sidebands
+/– 1 MHz –70 dBc
+/– 2 MHz –80
+/– 3 MHz –80
> +/– 3.0 MHz –90
Table 3. VHF PLL block in SUMMA, specification
Parameter Min. Typ. Max. Unit/notes
Input signal level 80 800 mVpp
Input resistance tbd. kohm
Input capacitance tbd. pF
Supply current 3.5 mA
Reference input frequency 30 MHz

PAMS RAE–2
Table 3. VHF PLL block in SUMMA, specification (continued)

Phase comparison frequency 1 MHz
Charge pump output
current 1 0.5 mA
current 2 2.0
Sink to source current match- +/– 5 %
ing error of the charge pump
Charge pump current error +/– 10 %
Charge pump min. output 0.5 V
voltage
Charge pump max. output * V
voltage Vcp–0.5
Charge pump leakage current 5 nA
Phase detector phase noise –163 dBc/Hz
level
*Vcp = 5V
VHF VCO and low pass filter

Supply voltage range 2.7 2.8 2.85 V
Current consumption 4 7 mA
Control voltage 0.5 4.0 V
Operation frequency 232 MHz
Output level –13 –10 dBm ( output after
the lowpass filter )
Harmonics –30 dBc, ( filtered )
Phase noise,
fo +/– 600 kHz –120 dBc
fo +/– 1600 kHz –130
fo +/– 3000 kHz –140
Control voltage sensitivity 8.0 14.0 MHz/V
Pushing figure +/– 2 MHz/V
Frequency stability +/– 3 MHz ( over temper-
ature range –10...+75 C deg.)
Spurious content –70 dBc

RAE–2 PAMS
UHF PLL
Table 4. UHF–synthesizer,
Start up settling time 3.0 ms
Settling time +/– 25 MHz 500 800 us, ( into +/– 20 Hz
from final frequency )
Phase error 3.7 deg./rms
Sidebands
+/– 200 kHz –40 dBc
+/– 400 kHz –60
+/– 600...+/–1400 kHz –66
+/–1.4... +/– 3.0 MHz –76
> +/– 3.0 MHz –86
Table 5. UHF PLL block in SUMMA
Input signal level (f<1.5 GHz) 200 mVpp
Input resistance tbd. kohm
Input capacitance tbd. pF
Supply current 8 mA
Reference input frequency 30 MHz
Reference input level 100 mVpp
Reference input impedance tbd.
Phase comparison frequency 1 MHz
Charge pump output
current 1 0.5 mA
current 2 2.0
Sink to source current match- +/– 5 %
ing error of the charge pump
Charge pump current error +/– 10 %
Charge pump current temper- tbd. %
ature variation
Charge pump leakage current 5 nA
Phase detector phase noise –163 dBc/Hz
level
UHF VCO module
Parameter Conditions Rating Unit/

Notes
Supply voltage, Vcc 2.8 +/– 0.1 V
Supply current, Icc Vcc = 2.8 V, < 10 mA
Vc= 2.25 V
Control voltage, Vc Vcc = 2.8 V 0.8... 3.7 V

PAMS RAE–2
Parameter Conditions Rating Unit/

Notes
Oscillation frequency Vcc = 2.8 V
Vc = 0.8 V < 1006 MHz
Vc = 3.7 V > 1031 MHz
Tuning voltage in center frequency f = 1018.5 MHz 2.25 +/– 0.25 V
Tuning voltage sensitivity in operating Vcc = 2.8 V 14 +/– 2 MHz/V
frequency range on each spot freq. f=1006...1031
MHz
Output power level Vcc=2.7 V –6.0 min. dBm
f=1006...1031
MHz
Output impedance and VSWR f=1006...1031 50 ohms,VSWR
MHz <2
Phase noise, fo +/– 25 kHz Vcc=2.8 V –100 dBc/Hz
fo +/– 600 kHz f=1006...1031 –120 max.
fo +/– 1600 kHz MHz –130
fo +/– 3000 kHz –140
Pulling figure VSWR=2, any +/– 1.0 MHz
phase max.
Pushing figure Vcc=2.8 +/– 0.1 +/– 2.0 MHz/V
V max.
Frequency stability over temperature Ta=–20 ... +75 +/– 3.0 MHz
range deg. C max.
Harmonics –10 max. dBc
Spurious Vcc=2.8 V, –70 max. dBc
Vc=0...6 V
Input capacitance in Vc–pin Vc= 0 V 100 max. pF
UHF local signal input in CRFU_1a

Input level 200 700 mVpp
Input resistance 100 ohm
Input capacitance 1.5 pF

RAE–2 PAMS
RF/BB/DSP Interface
The following three sections describe the hardware and timing interface
between RF and the BB/DSP section of the RAE–2.
Interface Signal Characteristics
The interface signals between the BB and the RF section are shown in
the next table as a logical interface. On physical board level baseband
supplies voltages from CCONT to separate RF sub–blocks. The maxi-
mum values specified for the digital signals in the table are the absolute
maximum values from the RF interface point of view.
Table 6. AC and DC Characteristics of RF/BB signals

Signal name From - To Function
VBATT Batteryy RF Supplyy voltage
g for RF
(PA on/PA off)
VXOENA MAD CCONT VR1, VR6 in CCONT ON

VR1, VR6 in CCONT
OFF
SYNPWR MAD CCONT VR3, VR4 in CCONT ON

VR3,VR4 in CCONT OFF
RXPWR MAD CCONT VR2, VR5 in CCONT ON
VR2, VR5 in CCONT OFF
TXPWR MAD CCONT VR7 in CCONT ON
VR7 in CCONT OFF
VREF CCONT SUMMA Reference voltage for
SUMMA and CRFU1a
PDATA0 MAD CRFU1A Nominal gain in LNA

Reduced gain in LNA
SENA MAD SUMMA PLL enable
SDATA MAD SUMMA S th i
Synthesizer data
d t
SCLK MAD SUMMA S th i

Synthesizer clock
l k
AFC COBBA VCTCXO A t ti frequency

Automatic f control
t l signal
i l ffor VC(TC)XO
10 10000Hz
10...10000Hz
RFC VCTCXO MAD Hi h stability
High t bilit clock
l k signal
i l for
f the
th logic
l i circuits
i it
RXIP/RXIN SUMMA COBBA Diff

Differential
ti l RX 13 MHz
MH signal
i l to
t baseband
b b d
TXIP/TXIN COBBA SUMMA Differential

Diff in–phase
ti l in
i hase
h TX baseband
b b d signal
i l ffor th
the
RF modulator
TXQP/TXQN COBBA SUMMA Differential quadrature

q phase TX baseband signal
g
for the RF modulator
TXP MAD SUMMA Transmitter power control enable

PAMS RAE–2

Signal name From - To Function
TXC COBBA SUMMA T itt power
Transmitter ower control
t l
0...200 kHz
RXC COBBA SUMMA Receiver gain control
0...200 kHz
TXC and AGC signals originate from the same DAC, controlled in COBBA
Data Interface and Timing

The SUMMA is programmed via the serial bus SENA, SDATA and SCLK.
The data of the SDATA is clocked by rising edge of SCLK. The data is fed
MSB first and address bits before data bits. The data for the Program-
mable dual modulus counter is fed first and the Swallow counter last.
SENA is kept low while clocking the data. (Figure below)
During programming, the charge pump attached to programmed divider is
switched to high impedance state. Also all counters connected to the PLL
that is programmed, are kept on reset while the SENA is low.
Table 7. Logic levels

Parameters Min Typ Max Units
High 2 Volt
Low 0.8 Volt
6.9 ms ( 1.5 x 4.6 ms ( frame )

100 us 10 us 10 us 10 us 10 us 8 us
min.
RXPWR
SYNPWR 2us min
SENA
SDATA/
SCLK MODE VHF R VHF N/A UHF R UHF N/A
#bits 23 23 23 23 23

RAE–2 PAMS
MON RX MON RX MON RX MON RX
20 ms 4.6 ms 0.5–2 sec.
VCXOEN 6.9 ms
150 us 150 us
SYNPWR
RXPWR
AGC
SENA
SDATA/
SCLK
Figure 3. Synthesizer timing / IDLE, one monitoring/frame, frame can start also from RX–burst
RX TX MON RX
time slots
0 1 2 3 4 5 6 7 0
SYNPWR
RXPWR
TXPWR
TXP
SENA
SDATA/
SCLK RX TX MON RX
ONLY UHF–
PLL N AND A
REGISTERS
CLOCKED 50 us max. 50 us max. 50 us max.
Figure 4. UHF–synthesizer timing/clocking on traffic channel

PAMS RAE–2
Transmit Power Timing
542.8 us
Pout
8.3...56.7 us
TXC
TXP
0...56.7 us
0...58 us
TXPWR
150 us 50 us
Figure 5. Transmitter timing diagram for normal bursts

RAE–2 PAMS
SUMMA and Synthesizer Control
Registers
The following table shows the programmable registers in SUMMA which

are used for programmable counters and mode selection.
Table 8. Registers addressing

A2 A1 A0 HEX Bits Register
addr.
0 0 0 0 18 Control register
0 0 1 1 15 VHF VDIV (VDIV2)
0 1 0 2 12 VHF RDIV (RDIV2)
0 1 1 3 18 UHF VDIV
1 0 0 4 12 UHF RDIV
PLL Control Word Format
Serial data format is shown below. Amount of bits needed for each ad-
dress can be seen from Table 2. When less bits are sent, dummy bits
must be inserted between the address and the real data.
MSB LSB
A2 A1 A0 ... ... S9 S8 S7 S6 S5 S4 S3 S2 S1
Control Register
Bit no Sign. BS8 Name Purpose

Def.
S1 LSB 0 VHFOFF 1=VHF synth power down
S2 0 NF No Function
S3 1 MODE1 Mode selection LSB
S4 0 MODE2 Mode selection MSB
S5 0 TEST Test Mode selection
S6 0 VHFCPCS VHF charge pump current Set = 0 (0.5 mA)
1(2.0 mA)
S7 0 UHFCPCS UHF charge pump current Set 0 (0.5 mA)
1(2.0mA)
S8 0 VPDMOD Logic high keeps counters reset
S9 0 ADDBIAS Extra bias for UHF prescaler
S10 1 G1 TX AGC step
S11 0 NF No Function

PAMS RAE–2
Bit no Sign. BS8 Name Purpose

Def.
S14 1 fast Add current to chargepump
S15 0 PD_lin UHF Phase detector mode
S16 0 UHFOFF 1=UHF synthesizer power down
S17 0 RX_SEL digital RX on
S18 1 OA_sel Selects pwrctrl opamp
S19 MSB 1 TX_AGC_LATCH TXP driven agc gain latching
NOTE: NDIV2 divides reference frequency by programmable figure of 2–2047.

Divide ratio less than 2 is prohibited.
Synthesizer clocking
GSM Division ratios
The values of ch range from 1 to 124

UHF synthesizer
reference divider ratio R=65
N counter division ratio N=INT((ch + 5030)/64)
A counter division ratio A=MOD((ch + 5030)/64)
VHF synthesizer
reference divider ratio R=13
N counter division ratio N=14
A counter division ratio A=8
Clocking scheme
During power up ( first clocking ) SUMMA synthesizers should be enabled

in the following order :
1. Mode setting (GSM)
2. reference divider for VHF PLL
3. N and A dividers for VHF PLL
4. reference divider for UHF PLL
5. N and A dividers for UHF PLL
When transceiver is on allocated channel, then only (N and A dividers)
UHF PLL is controlled, because it is the channel synthesizer. Mode set-
tings and VHF PLL division ratios are fixed.

RAE–2 PAMS
List of abbreviations
ADC Analog to Digital Converter
AFC Automatic Frequency Control
AGC Automatic Gain Control
AM Amplitude Modulation
ASIC Application Specific Integrated Circuit
AVG Average
BB Baseband
BiCMOS Bipolar and Complementary Metal Oxide Semiconductor process
BT Bandwidth x symbol time (GMSK filter parameter)
BW Bandwidth
CCONT DCT3 power management ASIC
CLK Clock
COBBA DCT3 RF/BB and audio interface ASIC
CRFU1A DCT3 dualband RF ASIC
CW Continuous Wave
DAC Digital to Analog Converter
DC Direct Current
DCS Digital Cellular System
DCT Digital Core Technology
DSP Digital Signal Processing or Digital Signal Processor
E–GSM Extended GSM (wider TX/RX bands)
ESD Electrostatic Discharge
ESR Effective Series Resistance
ETSI European Telecommunications Standard Institute
FDMA Frequency Division Multiple Access
FIR Finite Impulse Response
GMSK Gaussian Minimum Shift Keying
GND Ground
GSM Global System for Mobile communications
HT Hilly Terrain (GSM standard fading profile)
IC Integrated Circuit
IF Intermediate Frequency
IIP3 3rd order intermodulation Input Intercept Point

PAMS RAE–2
IMD Intermodulation Distortion

LNA Low Noise Amplifier
LO Local Oscillator
MAD DCT3 DSP/MCU/system logic ASIC (MCU–ASIC–DSP)
MMIC Monolithic Microwave Integrated Circuit
MON Monitoring slot
MS Mobile Station
NF Noise Figure
OIP3 3rd order Output Intercept Point
PA Power Amplifier
PCB Printed Circuit Board
PLL Phase Locked Loop
PM Phase Modulation
RA Rural Area (GSM standard fading profile)
RBW Resolution Bandwidth
RF Radio Frequency
RMS Root Mean Square
RSSI Received Signal Strength Indicator
RX Receiver
RXLEV RX Level
SAW Surface Acoustic Wave
SACCH Slow Associated Control Channel
SPR Standard Product Requirements (NMP’s internal standard)
SSB Single Sideband
SUMMA DCT3 dualband IF ASIC
TCH Traffic Channel
TDMA Time Division Multiple Access
TU Typical Urban (GSM standard fading profile)
TX Transmitter
UHF Ultra High Frequency (300 MHz ... 3 GHz)
VCO Voltage Controlled Oscillator
VCTCXO Voltage Controlled Temperature Compensated Crystal
Oscillator
VHF Very High Frequency (30 MHz ... 300 MHz)
VSWR Voltage Standing Wave Ratio

RAE–2 PAMS

Chapter 4
UIF Module BS2
Original 02/99 Copyright 1999 Nokia Mobile Phones. All rights reserved.
RAE–2 PAMS
UIF Module BS2 Technical Documentation

Number
02/99 Original

PAMS RAE–2
Technical Documentation UIF Module BS2
CONTENTS – User Interface
Page No
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
Technical Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–4
Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6
Interface to BS1 PDA Module . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6
Interface to BS8 CMT Module . . . . . . . . . . . . . . . . . . . . . . . . . . 4 – 10
Interface to BC2 LCD Module . . . . . . . . . . . . . . . . . . . . . . . . . . 4 – 10
Interface to PDA LCD Display . . . . . . . . . . . . . . . . . . . . . . . . . 4 – 11
Interconnection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 – 14
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 – 14
Power Distribution Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 – 14
CMT LCD Display Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 – 15
PDA LCD Display Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . 4 – 16
Backlighting Circuit of CMT LCD And Keyboard . . . . . . 4 – 17
PDA LCD Backlighting Circuit . . . . . . . . . . . . . . . . . . . . . 4 – 18
PDA Function Keyboard And CMT Keyboard Circuit . . 4 – 19

RAE–2 PAMS
Introduction
This document describes the RAE–2 UI module BS2. The module com-
prises PDA LCD display and function keys and all CMT UI electronics ex-
cept the audio components.
Technical Summary
The following sections of circuitry are included in the BS2 UI module:
– External components of BC2 CMT LCD module
– External components of PDA LCD display
– Backlighting circuit of CMT LCD display and keyboard
– PDA display backlighting circuit
– PDA function keyboard and CMT keyboard switch matrices including
key dome sheets (3 pcs)
– RF coaxial cable connector and antenna clip
Other parts covered in this document:
– BC2 CMT LCD module
– PDA LCD display
– PDA LCD display EL backlighting panel
– CMT LCD display and keyboard EL backlighting panel

PAMS RAE–2
DC Characteristics
Pin / Line Sym- Parame- Mini- Typical / Maxi- Unit Notes

Conn. bol ter mum Nominal mum
1/X700 VPDA Filtered 3.0 3.6 4.1 V
b tt
battery
0 mA PDA and CMT
voltage
LCD backlights
from PDA
OFF
13 30 mA PDA LCD back-
light ON
7 15 mA CMT LCD
backlight ON
3/X700 VBB Regu- 2.7 2.8 2.85 V
lated
baseband 300 A
voltage
42/X700 V17_i4 PDA LCD 1.3 1.5 1.7 V 1/13xV17_OUT
inter- Throughout the
mediate whole tempera-
bias volt- ture range
age
1.4 1.5 1.6 V At +20°C
43/X700 V17_i3 PDA LCD 2.6 3.0 3.3 V 2/13xV17_OUT
inter- Throughout the
mediate whole tempera-
bias volt- ture range
age
2.9 3.0 3.2 V At +20°C
44/X700 V17_i2 PDA LCD 13.5 16.4 18.6 V 11/13xV17_OU
inter- T Throughout
mediate the whole tem-
bias volt- perature range
age
15.4 16.4 17.4 V At +20°C
45/X700 V17_i1 PDA LCD 14.7 17.9 20.3 V 12/13xV17_OU
inter- T Throughout
mediate the whole tem-
bias volt- perature range
age
16.8 17.9 19.0 V At +20°C
47/X700 V17_OUT PDA LCD 16.0 19.4 22.0 V Throughout the
bias volt- whole tempera-
age ture range
18.2 19.4 20.6 V At +20°C

RAE–2 PAMS
Pin / Line Sym- Parame- Mini- Typical / Maxi- Unit Notes

Conn. bol ter mum Nominal mum
49/X700 V28_1 PDA LCD 2.7 2.8 2.85 V
logic
g sup-
ply volt- 0.3 2.0 mA
age
5,7,9,31, GND 0 V
34,36,38,
41,46,51/
X700
AC Characteristics
Pin / Parameter Minimum Typical / Maximum Unit Notes

Conn. Nominal
6,7/ Frequency 152 158 165 Hz Differential mea-
N700 surementt bbetween
t
Peak–to–peak volt- 155 164 175 V
the pins, NOT be-
age
tween pin
in and
RMS voltage 58 63 70 V ground
6,7/ Frequency 148 156 168 Hz Differential mea-
N730 surementt bbetween
t
Peak–to–peak volt- 160 164 170 V
the pins, NOT be-
age
tween pin
in and
RMS voltage 61 65 70 V ground
X790, Transmitter fre- 890 915 MHz
X791 quency
Receiver frequency 935 960 MHz
Interface to BS1 PDA Module
Pin I/O Line Symbol Parameter Mini- Typical / Maxi- Unit Notes
mum Nominal mum
1 VPDA Filtered bat- 3.0 3.6 4.1 V
t
tery voltage
lt
0 mA PDA and CMT
from PDA
backlights
OFF
13 30 mA PDA LCD
backlight ON
7 15 mA CMT LCD
backlight ON
2 O PWRKEYx Power on key 0 0.3xVBB V Low, Power
key pressed
0.7xVBB VBB High
3 VBB Regulated 2.7 2.8 2.85 V
baseband volt-
age 300 A

PAMS RAE–2
mum Nominal mum
4 I LCDRSTx CMT LCD 0 0.3xVBB V Low, Reset
driver reset active
0.7xVBB VBB High, Reset in-
active
5 GND 0 V
6 I GENSDIO CMT LCD 0 0.3xVBB V Low
driver serial 0.7xVBB VBB High
d t
data
0 4.0 MHz
7 GND 0 V
8 I GENSCLK CMT LCD 0 0.3xVBB V Low
driver bus 0.7xVBB VBB High
l k
clock
0 3.2 4.0 MHz
9 GND 0 V
10 I LCDSCx CMT LCD 0 0.3xVBB V Low, Chip se-
driver chip selected
lect 0.7xVBB VBB High, Chip un-
selected
11 I LCDCD CMT LCD 0 0.3xVBB V Low, Com-
driver com- 0.7xVBB VBB mand
mand/data High, Data
selection
12 I APP_COL0 PDA function 0 0.3xVSY V Low
keyboard col- 0.7xVSY S High
umn 0 S VSYS
umn 1 S VSYS
umn 2 S VSYS
umn 3 S VSYS
16 O APP_ROW0 PDA function 0 0.3xVSY V Low
keyboard row 0.7xVSY S High
0 S VSYS
17 O APP_ROW1 PDA function 0 0.3xVSY V Low
keyboard row 0.7xVSY S High
1 S VSYS
18 I COL0 CMT Key- 0 0.3xVBB V Low
board column 0.7xVBB VBB High
0
1

RAE–2 PAMS
mum Nominal mum
2
3
22 I COL4 CMT keyboard 0 0.3xVBB V Low
column 4 0.7xVBB VBB High
23 O ROW0 CMT keyboard 0 0.3xVBB V Low
row 0 0.7xVBB VBB High
27 I CMT_BL_ON CMT LCD and 0 0.3xVBb V Low, backlight
keyboard OFF
backlight en- 0.7xVBB VBB High, backlight
able ON
28 I PDA_BL_ON PDA LCD 0 0.3xVSY V Low, backlight
backlight en- S OFF
able 0.7xVSY High, backlight
S VSYS ON
29 I LCDD3 PDA LCD 0 0.2xVSY V Low
data, leftmost 0.8xVSY S High
pixel S VSYS
30 I LCDD2 PDA LCD data 0 0.2xVSY V Low
0.8xVSY S High
S VSYS
31 GND 0 V
32 I LCDD1 PDA LCD data 0 0.2xVSY V Low
0.8xVSY S High
S VSYS
33 I LCDD0 PDA LCD 0 0.2xVSY V Low
data, right- 0.8xVSY S High
most pixel S VSYS
34 GND 0 V
35 I SCK PDA LCD bus 0 0.2xVSY V Low
clock 0.8xVSY S High
S VSYS
0 2.3 3.2 MHz
36 GND GND 0 V

PAMS RAE–2
mum Nominal mum
37 I LC PDA LCD line 0 0.2xVSY V Low
pulse 0.8xVSY S High
S VSYS
0 13.6 20 kHz
870 ns Pulse ’high’
time
38 GND 0 V
39 I M PDA LCD AC 0 0.2xVSY V Low
modulation 0.8xVSY S High
S VSYS
0 1 kHz
40 I FRM PDA LCD 0 0.2xVSY V Low
frame pulse 0.8xVSY S High
S VSYS
0 67 100 Hz
75 s Pulse ’high’
time
41 GND 0 V
42 V17_i4 PDA LCD in- 1.3 1.5 1.7 V 1/13xV17_OU
termediate T Throughout
bias voltage the whole tem-
perature range
1.4 1.5 1.6 V At +20°C
43 V17_i3 PDA LCD in- 2.6 3.0 3.3 V 2/13xV17_OU
termediate T Throughout
bias voltage the whole tem-
perature range
2.9 3.0 3.2 V At +20°C
44 V17_i2 PDA LCD in- 14.4 16.4 18.3 V 11/13xV17_O
termediate UT Through-
bias voltage out the whole
temperature
range
16.1 16.8 17.4 V At +20°C
45 V17_i1 PDA LCD in- 15.8 17.9 19.9 V 12/13xV17_O
termediate UT Through-
bias voltage out the whole
temperature
range
17.5 18.3 19.0 V At +20°C
46 GND 0 V
47 V17_OUT PDA LCD bias 17.1 19.8 21.6 V Throughout
voltage the whole tem-
perature range
19.0 19.8 20.6 V At +20°C

RAE–2 PAMS
mum Nominal mum
48 I LCD_ON PDA LCD en- 0 0.2xVSY V Low
able 0.8xVSY S High
S VSYS
49 V28_1 PDA LCD log- 2.7 2.8 2.85 V
ic supply
su ly volt-
age 0.3 2.0 mA
50 O LCD_TEMP PDA LCD 0.2 0.9 2.5 V Voltage range

temperature throughout the
whole temper-
ature range
0.88 0.90 0.91 V At +25°C
51 GND 0 V
Note: VSYS is PDA system voltage used in BS1 module, min. 2.75 V, typ. 2.80 V, max. 2.85
V.
Interface to BS8 CMT Module

Conn. Parameter Mini- Typical / Nomi- Maxi- Unit / Notes
mum nal mum Notes
X790, Impedance 50 W
X791
Transmitter frequency 890 915 MHz
Receiver frequency 935 960 MHz
Max. output power 2W (33 dBm)
Interface to BC2 LCD Module

Pin Line Symbol Parameter Mini- Typical Maxi- Unit Notes
mum mum
1 VBB Supply voltage 2.7 2.8 2.85 V
300 mA
2 GENSCLK Serial clock input 0 3.2 4.0 MHz
0 0.3xVBB V Low
0.7xVBB VBB V High
3 GENSDIO Serial data input 0 0.3xVBB Low
0.7xVBB VBB High
4 LCDCD Control/display data 0 0.3xVBB Low, Control
flag input
0.7xVBB VBB High, Data
5 LCDCSx Chip select input 0 0.3xVBB Low, Chip se-
lected
0.7xVBB VBB High, Chip
unselected

PAMS RAE–2
Pin Line Symbol Parameter Mini- Typical Maxi- Unit Notes

mum mum
6 OSC* External clock for LCD 30.4 32.0 33.6 kHz Connected to
VBB on UI
7 GND Ground 0 V
8 VOUT DC/DC voltage con- 6.8 9
verter output
9 LCDRSTx Reset 0 0.3xVBB Low, Reset
Active
0.7xVBB VBB High,Reset
Inactive
* External oscillator is not used in BS2.
Connection layout diagram of interface to BC2 module
9 1
Display Driver IC
Viewing through LCD cell
Interface to PDA LCD Display
Table 1. Interface to PDA LCD display, connector X730.

Pin Line Symbol Parameter Minimum Typical / Maxi- Unit Notes
Nominal mum
1 V17_OUT PDA LCD bias 16.0 19.4 22.0 V Throughout the
2 voltage whole tempera-
ture range
18.2 19.4 20.6 V At +20°C
3 V17_i1 PDA LCD inter- 14.7 17.9 20.3 V 12/13xV17_OU
mediate bias T Throughout
perature range
16.8 17.9 19.0 V At +20°C

RAE–2 PAMS
Table 1. Interface to PDA LCD display, connector X730. (continued)

Nominal mum
4 V17_i2 PDA LCD inter- 13.5 16.4 18.6 V 11/13xV17_OU
mediate bias T Throughout
perature range
15.4 16.4 17.4 V At +20°C
5 V17_i3 PDA LCD inter- 2.6 3.0 3.3 V 2/13xV17_OUT
mediate bias Throughout the
voltage whole tempera-
ture range
2.9 3.0 3.2 V At +20°C
6 V17_i4 PDA LCD inter- 1.3 1.5 1.7 V 1/13xV17_OUT
mediate bias Throughout the
voltage whole tempera-
ture range
1.4 1.5 1.6 V At +20°C
7 GND 0 V
8 GND 0 V
9 V28_1 2.7 2.8 2.85 V PDA LCD logic
supply voltage
10 FRM PDA LCD frame 0 0.2xVSY V Low
S VSYS
70 100 Hz
75 s Pulse ’high’
time
11 SCK PDA LCD bus 0 0.2xVSY V Low
clock 0.8xVSY S High
S VSYS
0 2.3 3.2 MHz
12 M PDA LCD AC 0 0.2xVSY V Low

modulation 0.8xVSY S High
S VSYS
0 2.5 3.4 kHz
13 LC PDA LCD line 0 0.2xVSY V Low
S VSYS
0 32 44.5 kHz
870 ns Pulse ’high’
time

PAMS RAE–2
Table 1. Interface to PDA LCD display, connector X730. (continued)

Nominal mum
14 LCD_ON PDA LCD en- 0 0.2xVSY V Low, Display
able 0.8xVSY S OFF
S VSYS High, Display
ON
15 LCDD3 PDA LCD data, 0 0.2xVSY V Low
leftmost pixel 0.8xVSY S High
S VSYS
16 LCDD2 PDA LCD data 0 0.2xVSY V Low
0.8xVSY S High
S VSYS
17 LCDD1 PDA LCD data 0 0.2xVSY V Low
0.8xVSY S High
S VSYS
18 LCDD0 PDA LCD data, 0 0.2xVSY V Low
rightmost pixel 0.8xVSY S High
S VSYS
Note: VSYS is PDA system voltage used in BS1 module, min. 2.75 V, typ. 2.80 V, max. 2.85
V.
Signal number 1 is marked with a triangle in the connector X730.

RAE–2 PAMS
BC2 CMT CMT Keyboard and CMT Keyboard PDA Function PDA Display Display
LCD Module Display Backlight Keyboard Backlight PDA LCD
BS2
Hinge Flex
5 10 6 10
Scotty
BS1
BoBo Connector
MAD
Coaxial Cable
BS8
Power Distribution Diagram
V28_1
V17_OUT
V17_i1
V17_i2
V17_i3
V17_i4
VPDA
VBB
CMT LCD CMT LCD CMT EL PDA LCD PDA EL PDA LCD
Backlight Panel Backlight Panel
Driver Driver
GND

PAMS RAE–2
CMT LCD Display Circuit

The display circuit includes the LCD module BC2 and two capacitors. The
LCD module uses COG (Chip On Glass) technology. The connection
method for chip on the glass is ACF, Adhesive Conductive Film. The LCD
module is electrically connected to UI board with gold wired elastomer.
Two external capacitors are placed on UI PCB.
The display driver includes hw–reset, voltage tripler or quadrupler which
depends on temperature, temperature compensating circuit and low pow-
er control. The driver includes a 84x48 RAM memory which is used for
storing display data. The driver does not include character generator
ROM. One bit in RAM is mapped directly to one pixel on display.
Main characteristics of the CMT LCD display:
– Display resolution: 84 x 48
– Viewing area: 34.96 x 23.50 mm
– Dot size: 0.31 x 0.37 mm
– Dot pitch: 0.345 x 0.405 mm
– Display type: Transflective black and white FSTN

RAE–2 PAMS
PDA LCD Display Circuit

The PDA LCD display circuit consists of the LCD display 4850049, logic
and bias voltage filtering capacitors and an NTC resistor that is used to
measure the temperature of the display. The voltage over the NTC is
read by PDA SW via Phaser power supply ASIC and the information is
used for contrast control of the display.
Main characteristics of the PDA LCD display:
– Display resolution: 640 x 200
– Viewing area: 111.8 x 37.0 mm
– Dot size: 0.16 x 0.16 mm
– Dot pitch: 0.17 x 0.17 mm
– Display type: Transflective black and white FSTN
The PDA LCD interface is a typical black–and–white LCD interface with
four data bits, pixel clock, line and frame pulse signals, AC modulation
signal and enable signal. Logic and bias voltages are supplied by the
Phaser power supply ASIC located in the PDA module.

PAMS RAE–2
Backlighting Circuit of CMT LCD And Keyboard
An electroluminescent (EL) panel is used for CMT LCD and keyboard

backlighting. Electrically it can be considered as a capacitor. An inverter
circuit is used to generate the high voltage AC to drive the EL panel. The
inverter can be divided into two sections: power converter section and
lamp driver section.
The power converter section employs a switch–mode converter to gener-
ate a voltage of maximum 90V. This voltage is connected to the EL panel
through the lamp driver section, which changes the polarity of the output
pins at a frequency that is set by one external resistor. Since the switch–
mode converter’s output is regulated to 90 volts at maximum, it is pos-
sible to achieve almost constant illuminance from the EL panel throughout
the battery voltage range.
Connection between the EL panel and the PCB is a simple pressure con-
tact. The frame of the CMT display module has two springs that press
the EL panel against the pads on the PCB.
NOTE: The EL driver output voltage between pins 6 and 7 is over 150 V
peak–to–peak. When making measurements, be sure that measuring
equipment like oscilloscope, probe etc. have high enough voltage rating.
There is no risk of getting a harmful or fatal electric shock due to low cur-
rent driving capability of the inverter.
Table 2. CMT display illuminance measured with Tektronics J17 on the surface of the dis-
play lense.
Parameter Minimum Typical / Maximum Unit Notes
Nominal
Display illuminance 1.5 2.1 cd/m2 Throughout the
VPDA voltage range
1.6 1.8 2.0 cd/m2 VPDA = 3.5 V

RAE–2 PAMS
PDA LCD Backlighting Circuit

Electroluminescent (EL) panel is used for PDA LCD backlighting. The cir-
cuit is similar to the CMT keyboard and the display backlighting circuit,
only some component values are different.
PDA display frame presses the EL panel contacts against the pads on
PCB.
NOTE: The EL driver output voltage between pins 6 and 7 is over 150 V
peak–to–peak. When making measurements, be sure that measuring
equipment like oscilloscope, probe etc. have high enough voltage rating.
There is no risk of getting a harmful or fatal electric shock due to low cur-
rent driving capability of the inverter.
Table 3. PDA display illuminance measured with Tektronics J17 on the surface of the dis-
play.
Parameter Minimum Typical / Maximum Unit Notes
Nominal
Display illuminance 1.0 2.0 cd/m2 Throughout the
VPDA voltage range
1.2 1.5 1.8 cd/m2 VPDA = 3.5 V

PAMS RAE–2
PDA Function Keyboard And CMT Keyboard Circuit

There are 5 columns and 4 rows in the CMT keyboard matrix and 2 rows
and 4 columns in the PDA function keyboard matrix. The power key is
connected to the CMT row 0 through a diode, that prevents the POWER-
KEYx line from being pulled down when the other keys are scanned. A
normal keyboard scanning is used to read both matrices.

RAE–2 PAMS

RAE–2 Series PDA
Chapter 5
BS1 PDA Module
Section 02/99 Copyright 1999. Nokia Mobile Phones. All Rights Reserved.
RAE–2 PAMS
BS1 Technical Documentation

Number
02/99 OJuntune Original
Page 5 – 2 Section 02/99

PAMS RAE–2
Technical Documentation BS1
CONTENTS – PDA module BS1
Page No
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4
Technical Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4
Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5
Interconnection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8
External Signals and Connections . . . . . . . . . . . . . . . . . . . . . . 5–8
UI flex connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9
Board to board connector signals . . . . . . . . . . . . . . . . . . . . . 5 – 12
System connector pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 16
Audio connector pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 17
Backup battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 17
Internal Signals and Connections . . . . . . . . . . . . . . . . . . . . . . . 5 – 18
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 20
Power Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 20
Input filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 21
Linear regulator V28 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 21
Linear regulator V28_1,_2,_3 . . . . . . . . . . . . . . . . . . . . . . 5 – 21
Switchmode regulator V17 . . . . . . . . . . . . . . . . . . . . . . . . 5 – 21
Backup battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 21
Reset and power management . . . . . . . . . . . . . . . . . . . . 5 – 22
PDA CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 22
I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 24
Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 25
DRAM memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 25
Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 25
External Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 26
IR–Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 26
Handsfree loudspeaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 26
Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 26
Test pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 28
Testpoints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 – 30
Section 02/99 Page 5 – 3

RAE–2 PAMS
Introduction
The function of the BS1 PDA module in RAE–2 Communicator device is
to run all applications that utilize the PDA LCD display of the device. The
GEOS operating system is applied on a 486 based PDA module platform.
This processing platform utilizes the communicator–type user interface
which is accessible when the RAE–2 is opened.
Technical Summary
The BS1 PDA module consists of a printed circuit board with a CPU, two
kinds of memories, a Power unit, HF amplifier circuitry, and an IR–trans-
ceiver.
The PDA module is assembled on a single 8–layer printed circuit board.
All components are assembled on one single side. The other side is re-
served for keyboard keypads.
Serial ports, DMA– and LCD controller for timers are integrated in the
CPU. The operating system is GEOS supplied by Geoworks.
The BS1 module includes three non–volatile Flash memories which are
used for two kind of purposes. XIP (executed in place) memory is used
for program file storage and RFD (resident flash disk) memory is write-
able for user data.
One DRAM Memory is used for the code execution and for the volatile
storage of the internal run–time system data.
Both memory types (DRAM and Flash) have their own address– and data
bus, routed directly from the CPU.
Table 1. Used memory blocks

Memory type Amount (Bytes)
Flash (XIP) 4M
Flash (RFD) 2M
DRAM 2M
The BS1 PWRU block regulates the PDA module power and controls the
power-up and -down. After a battery has been connected, the PWRU
gives the CPU system voltage and releases the reset as fast as possible
after which the CPU SW has full power management control. The PWRU
also generates and controls the voltages that the PDA LCD uses. The
PDA has a rechargeable back–up battery which the PWRU block charges
when the main battery is connected. The VBACK voltage is normally al-
ways available for real time clock. Power is fed from the battery through
the CMT module to the PDA PWRU. The PWRU has a filter in battery
line to reduce interference from the CMT module. The PWRU provides

PAMS RAE–2
A/D converter readings of the battery voltage and temperature via a par-
allel interface to the CPU. Many PWRU items can be controlled by regis-
ter writing or directly via pin. The system voltage is always present until
battery voltage drops below 3.0V.
Electronics
The following sections of circuitry are included on the BS1:
Function
PWRU Power supply unit
PDA CPU
IR transceiver
DRAM memory
Flash memory
HF Amplifier
QWERTY Keyboard pads

RAE–2 PAMS
PDALCD
BS2 Softkeys CMT
CMT LCD
Keypad
GND CMTLCD(5:0)
Flex connector X800
FLASH FLASH FLASH

BS1
LCD PWR IF(6:0) 1Mx16 1Mx16 1Mx16
VSYS D6:0
SA1:0
PWRU
control (6:0)
Charging
C(3:0), R(1:0)
LCD(10:0)
D(15:0)
MA(11:0)
VBATT
V28_3
io(3:0)
VPDA
VBACK
C(7:0), R(9:0) QWERTY
Keyboard
Backupbattery
Am486 CPU io(1:0) Audio

Earpiece
HF
HF_IF(1:0), EAR(1:0)
X32kHz out
RS_IF(2:0)
X32kHz in
MMC(3:0)
SD(15:0)
SA(21:0)
JTAG(4:0)
sio(1:0)
io(5:0)
FBUS_RXD
FBUS_TXD
MBUS
io(3:0)
x32
System connector X810

FBUS_RXD
DRAM Test– FBUS_TXD
IR transceiver pads FBUS_TXD2
1Mx16 MBUS
GND
BoBo
Connector X830
PWRKEY
C4:0,R3:0
VBATT GND
Memory Card BS8
CMT
Figure 1. BS 1 PDA block in RAE–2 product

NOTE: All modules have same ground.

PAMS RAE–2
DC Characteristics
Table 2. Supply Voltages and Power Consumption

Pin / Line Symbol Minimum Nominal Maximum Unit Notes
Conn.
1,2,3,4,5/ VBATT 3.0 3.6 4.1 VDC Battery voltage,
X830 SW limit
1 2 3 4 5/
1,2,3,4,5/
X830 900 mA Current
E307 VBACK 2.4 3.0 3.15 VDC Backup battery

voltage
0.4 0.5 0.7 mA Charge current
0.25 0.4 mA Quiescent current
in suspend mode
E312 VSYS 2.75 2.8 2.85 VDC System voltage
0.050 300 450 mA Current
E300 V17_OUT 17.1 19.4 21.6 VDC LCD Biasing volt-
age, NOTE1
19.0 19.8 20.6 VDC LCD Biasing volt-
age, at +20C
2 5 mA Current
7/X800 V17_i1 15.8 17.9 19.9 VDC LCD intermediate
voltage1
(12/13xV17_OUT
). NOTE1
17.5 18.3 19.0 VDC at +20C
4 mA Current
voltage2
(11/13xV17_OUT
). NOTE1
16.1 16.8 17.4 VDC at +20C
4 mA Current
voltage3
(2/13xV17_OUT).
Max range
2.9 3.0 3.2 VDC at +20C
4 mA Current
voltage4
(1/13xV17_OUT).
NOTE1
1.4 1.5 1.6 VDC at +20C
4 mA Current

RAE–2 PAMS
Table 2. Supply Voltages and Power Consumption (continued)

Pin / Line Symbol Minimum Nominal Maximum Unit Notes
Conn.
3/X800 V28_1 2.70 2.80 2.85 VDC LCD Logic volt-
age
1 4 mA Current
21/N450 V28_2 2.70 2.8 2.85 VDC IrDA Logic volt-
age
2 4 mA Current
46/X830 V28_3 2.75 2.8 2.85 VDC MMC supply volt-
age
0.01 50 100 mA Current
16/X830 VBB 2.75 2.8 2.85 VDC Base Band oper-
ating voltage
mA Current
NOTE : Complete temperature range

AC Characteristics
Minimum Nominal Maximum Unit / Notes
External XTAL 32.768 kHz
20 ppm, accuracy
CPU clock 33.18 MHz, Rise time
1–2ns
Memory bus clock 33.18 MHz, Rise time
2–3ns
Memory Controller clock 66.3552 MHz, Rise time
1–2ns
MMC clock during data 0.2592 8.294 Mhz, Rise time
2–3ns, NOTE1
MMC clock during identifica- 259.2 kHz, Rise time 2–3ns
tion
NOTE: Frequency is a multiple of 259.2kHz
External Signals and Connections

This section describes the external electrical connection and interface lev-
els on BS1 module. The electrical interface specifications are collected
into tables that cover each connector and defined interface.
Table 3. List of Connectors and testpoints
Connector Name Code Notes
UI flex connector X800 CMT/PDA LCD– and Keyboard signals
Board to Board connector X830 CMT PDA interface
System connector pads X810

PAMS RAE–2
Table 3. List of Connectors and testpoints (continued)
Connector Name Code Notes

Audio connector pads E880, E881, HF–speaker connection and earpiece connection
E850, E851
Backup battery holder X451
Testpads E300–E315 Testpads ”under” battery pack
Frame connector pads X840 Include manufacturing testpads. Is removed before
assembly
Testpoints J310, Testpoints around the BS1 PCB.
J400–J404,
J430, J434,
J435,
J440 – J456,
J497 – J499,
J801, J803,
J804, J808,
J854, J880,
J881
UI flex connector
The Interface between the BS2 and BS1 modules comprises a 51–pin
flex connector. The connector includes supply voltage for the BS2 mod-
ule, and required information signals. Signals from the BS8 module are
also carried via the flex connector.
Table 4. UI flex Connector X800

Pin I/O Name Function Min Nom Max Unit Description /
Note
1 GND Global Ground
2 I LCD_TEMP PDA LCD Temperature 0.2 0.9 2.5 VDC Voltage range
throught the whole
temperature range.
0.2 0.9 0.91 VDC At +25_C
3 O V28_1 PDA LCD Logic voltage 2.70 2.80 2.85 VDC
4 O LCD_ON PDA LCD enable 2.30 2.8 2.85 VDC High
0 0.4 VDC Low
5 O V17_OUT PDA LCD Biasing voltage 19.0 19.8 20.6 VDC Range at +20C.
Whole range can
be seen from
table2
6 GND Global Ground
7 O V17_i1 PDA LCD Intermediate bias 17.5 18.3 19.0 VDC Range at +20C.
voltage
lt Wh l range can
Whole
8 O V17_i2 16.1 16.8 17.4 VDC be seen from
9 O V17_i3 2.9 3.0 3.2 VDC table2
10 O V17_i4 1.4 1.5 1.6 VDC


RAE–2 PAMS
Table 4. UI flex Connector X800 (continued)

Note
12 O FRM PDA LCD Frame pulse 2.30 2.80 2.85 VDC High
0 0.45 VDC Low
72 100 Hz
% Duty cycle
13 O M PDA LCD AC Modulation 2.30 2.80 2.85 VDC High
0 0.45 VDC Low
2.5 3.4 kHz
15 O LC PDA LCD Line pulse 2.30 2.80 2.85 VDC High
0 0.45 VDC Low
32 44.5 kHz
17 O SCK PDA LCD bus clock 2.30 2.80 2.85 VDC High
0 0.45 VDC Low
2.3 3.2 MHz
19 O LCDD0 PDA LCD Data signal 2.30 2.80 2.85 VDC High
0 0.45 VDC Low
0 0.45 VDC Low
0 0.45 VDC Low
0 0.45 VDC Low
24 O PDA_BL_ON PDA LCD Backlight enabled 2.30 2.80 2.85 VDC High, backlight en-
abled
0 0.45 VDC Low
25 O CMT_BL_ON CMT Backlight enabled 2.1 2.80 2.85 VDC High, backlight en-
abled
0 0.5 VDC Low
26 I ROW3 CMT Keys Row3, Lid closed, 2.1 2.80 2.85 VDC High
B
Base b
band
d powered
d
0 0.5 VDC Low
B
Base b d powered
band d
0 0.5 VDC Low
B
Base b
band
d powered
d
0 0.5 VDC Low
B
Base b
band
d powered
d
0 0.5 VDC Low
30 O COL4 CMT Keys Col4 2.1 2.80 2.85 VDC High
0 0.5 VDC Low
0 0.5 VDC Low

PAMS RAE–2
Table 4. UI flex Connector X800 (continued)

Note
0 0.5 VDC Low
0 0.5 VDC Low
0 0.5 VDC Low
35 I APP_ROW1 PDA Application row1 2.0 2.80 2.85 VDC High
0 0.8 VDC Low
36 I APP_ROW0 PDA Application row0 2.0 2.80 2.85 VDC High
0 0.8 VDC Low
37 O APP_COL3 PDA Application col3 2.3 2.80 2.85 VDC High
0 0.45 VDC Low
0 0.45 VDC Low
0 0.45 VDC Low
0 0.45 VDC Low
41 O LCDCD CMT LCD driver command/ 2.1 2.80 2.85 VDC High, data
d t selection
data l ti
0 0.5 VDC Low, command
42 O LCDSCx CMT LCD driver chip select 2.1 2.80 2.85 VDC High
0 0.5 VDC Low, chip selected
44 O GENSCLK CMT LCD driver bus clock 2.1 2.80 2.85 VDC High
0 0.5 VDC Low
4.0 MHz
46 O GENSDIO CMT LCD driver serial data 2.1 2.80 2.85 VDC High
0 0.5 VDC Low
4.0 MHz
48 O LCDRST CMT LCD Reset 2.1 2.80 2.85 VDC High
0 0.5 VDC Low
49 VBB 2.7 2.8 2.85 VDC
50 I PWRKEY CMT Power switch 2.1 2.80 2.85 VDC Inactive state
0 0.45 VDC L(Pulse)=Power
on/off, min 64ms
51 VPDA Filtered battery voltage from 3.0 3.6 4.1 V
PDA
0 mA PDA and CMT
backlights off
light ON
light OFF

RAE–2 PAMS
Board to board connector signals
All interfaces from the BS8 module to the BS1 module are fed over a
50–pin board-to-board connector.
The function of the Interface is to transfer the battery voltage from the
BS8 module, and transfer data between the BS8, BS2, and BS1 modules.
The signal definition and the most significant specifications of signals are
collected in the next table.
Table 5. Board to board connector X830

Note
1 VBATT Battery Positive 3.0 3.6 4.1 V Unregulated Bat-
tery Voltage
2 0.3 1000 mA Current from BS8

module
d l
3
4
5
6 I XEAR Audio Output for Handsfree 500 mVpp
and Car Kit Use
7 GND Global Ground Reference for oth-

er signals
8 I BATTDET Battery Position Information 2.0 2.80 2.85 VDC
0 0 0.8 VDC
9 I HFENA Internal Handsfree Amplifier 2.1 2.80 2.85 VDC High, HF amplifier
Control enabled
0 0.5 VDC Low, HF amplifier
disabled
10 EARP Earpiece Positive 50 223 mVpp Differential signal
11 EARN Earpiece Negative
13 O PWRONx PDA start baseband to ser- 2.30 2.8 2.85 VDC High
vice
i R Requestt St
State
t (SRS)
0 0.45 VDC Low, powering up
the CMT
14 O 32kHz Sleep clock for the CMT 2.30 2.8 2.85 VDC high
0 0.45 VDC low
for PDA
32768 Hz Pulse frequency
20 50 80 % Duty cycle
1 % Jitter
16 VBB CMT System Power 2.7 2.8 2.85 VDC Regulated CMT
baseband voltage
17 O PWRKEYx CMT Power Switch 2.0 2.80 2.85 VDC Inactive state
0 0.45 VDC L(Pulse)=Power
on/off, min. 64ms

PAMS RAE–2
Table 5. Board to board connector X830 (continued)

Note
18 I CMT_BL_ON CMT UI Light On 2.1 2.8 2.85 VDC High, backlight en-
abled
0 0.5 VDC Low
19 O ROW3 CMT Keys Row 3 2.5 2.8 2.85 VDC High
0 0.2 VDC Low
0 0.2 VDC Low
0 0.2 VDC Low
0 0.2 VDC Low
24 I COL4 CMT Keys Column 4 2.1 2.80 2.85 VDC High
0 0.5 VDC Low
0 0.5 VDC Low
0 0.5 VDC Low
0 0.5 VDC Low
0 0.5 VDC Low
30 I LCDCD CMT LCD Command / Data 2.1 2.80 2.85 VDC High, data
S l t
Select
31 I LCDRSTx CMT LCD Reset 2.1 2.80 2.85 VDC High
0 0.5 VDC Low, LCD reset
32 I LCDCSx CMT LCD Chip Select 2.1 2.80 2.85 VDC High
0 0.5 VDC Low, chip selected
34 I GENSCLK CMT LCD and CCONT Serial 2.1 2.80 2.85 VDC High
Cl k
Clock
0 0.5 VDC Low
3.250 MHz Pulse frequency in
active state
35 I GENSDIO CMT LCD and CCONT Serial 2.1 2.80 2.85 VDC High
D t
Data
0 0.5 VDC Low
1.625 MHz Maximum pulse
frequency
37 O FBUS_RXD Fast Serial Data to CMT 2.30 2.80 2.85 VDC High
0 0.45 VDC Low
38 I FBUS_TXD Fast Serial Data to PDA 2.1 2.80 2.85 VDC High
0 0.5 VDC Low

RAE–2 PAMS

Note
40 I/O MBUS Bidirectional Serial Bus 2.30 2.80 2.85 VDC High, to the CMT
0 0.45 VDC Low, to the CMT
CMT
0 0.5 VDC Low, from the CMT
41 VSYS PDA System voltage 2.75 2.80 2.85 VDC
2 mA
42 O LIDSWITCH Lid State Information 2.75 2.80 2.85 VDC High, Cover open
0 VDC Low, Cover closed
10 kohm. Pull–up resistor
43 I MMC_SWITCH MMC Cover State Information 2.75 2.80 2.85 VDC High, Cover open
0 VDC Low, Cover closed
44 GND Global ground
45 I/O MMC_CMD MMC Command / Address / 2.30 2.80 2.85 VDC Data to the card
Response, Bidirectional High, Pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT Module
0 0.45 VDC Data to the Card
Low
2.1 2.80 2.85 VDC data from the card
High, Pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT Module
0.34 VDC Data from the card
Low
259.3 kHz frequency
46 MMC_VSYS MMC Power Supply 2.75 2.85 VDC
0.01 100 mA Current
47 I/O MMC_DATA MMC Bidirectional Data 2.30 2.80 2.85 VDC Data to the Card
High, Pulled up
with 10kohm resis-
tor to MMC_VSYS
in CMT Module
0 0.45 VDC Data to the card
Low
2.1 2.80 2.85 VDC Data from the
Card High, Pulled
up with 10kohm
resistor to
MMC_VSYS in
CMT Module
0 0.34 VDC Data from the card
Low
8.294 MHz frequency

PAMS RAE–2

Note
49 O MMC_CLK MMC Clock 2.30 2.80 2.85 VDC High
0 0.45 VDC Low

RAE–2 PAMS
System connector pads

The RAE–2 System connector is a multipurpose connector, which is
shared with the BS8 module. In this section are described only the sig-
nals that are connected to the BS1 module. These signals are needed for
PC–connectivity. The connector comprises spring type contacts to the
BS1 and BS8 module. The PCB comprises pads on which the springs
are pressed.
Table 6. System Connector pads X810

Pin Line Parameter Minimum Nominal Maximum Unit Unit / Notes
Symbol
8 DCT_TX PDA CPU Receive 2.0 2.80 2.85 VDC
data
0 0.8 VDC
9 DCE_RX PDA CPU Transmit 2.30 2.80 2.85 VDC
data
0 0.45 VDC
10 DCE_DTR PDA CPU Data set 2.0 2.80 2.85 VDC
read
ready
0 0.8 VDC

PAMS RAE–2
Audio connector pads

The audio connector has two contact types. The earpiece contacts are of
spring type, and the contacts for the handsfree speaker are elastomeric
contacts.
Table 7. Audio connector pads

Pin Line Parameter Minimum Nominal Maximum Unit Unit / Notes
Symbol
E850 EARP Earpiece positive 50 223 mVpp Differential voltage between
node EARP and EARN nodes
E851 EARN Earpiece negative
node
E880 PHFEARN Handsfree speaker 6.0 Vpp VBATT=4.4V. Differential volt-

negative node age between PHFEARN and
PHFEARP nodes
4.4 Vpp VBATT=3.6V. Differential volt-
age between PHFEARN and
PHFEARP nodes
E881 PHFEARP Handsfree speaker 6.0 Vpp VBATT=4.4V. Differential volt-
positive node age between PHFEARN and
PHFEARP nodes
4.4 Vpp VBATT=3.6VBATT=4.4V. Dif-
ferential voltage between
PHFEARN and PHFEARP
nodes.
Backup battery
Figure 2. Backup battery insertion direction
NOTE: Positive node is against PCB, it can be identified by 2mm diame-

ter contact plate
Table 8. Backup battery holder X450

Pin Name Function Min Nom Max Unit Description / Note
VBACK Backup battery voltage 2.4 3.0 3.1 VDC
GND Global ground

RAE–2 PAMS
Internal Signals and Connections

Table 9. IR–transceiver (N300) signals
Pin Line Parameter Minimum Nominal Maximum Unit / Notes
Symbol
3 TXD Transmit data from CPU 2.30V 2.80V 2.85V
0V 0.45V
4 RXD Receive data to CPU 2.0V 2.8V 2.85V
0 0.8V
Table 10. Signals between PDA CPU and Flash memories

Name Function Min Nom Max Unit Description / Note
SA(21:1) System address 2.30 2.80 2.85 VDC High
0 0.4 VDC Low
SD(15:0) System data from CPU 2.30 2.8 2.85 VDC High
0 0.4 VDC Low
System data from memory 2.40 2.8 2.85 VDC High
0 0.4 VDC Low
ROMCS(2:0) Chip selects for Flash memo- 2.30 2.80 2.85 VDC High
i
ries
0 0.4 VDC Low
FLSHWRx Flash write signal 2.30 2.80 2.85 VDC High
0 0.4 VDC Low, write enabled
ROMRDx Flash read signal 2.30 2.80 2.85 VDC High
0 0.4 VDC Low, read enabled
GPIO_CS1 Write protect for RFD memory 2.30 2.80 2.85 VDC High
0 0.4 VDC Low, powered down
GPIO_CS7 RFD Flash ready 2.0 2.80 2.85 VDC High, ready
0 0.8 VDC Low, busy
Table 11. Signals between PDA CPU and DRAM Memory

MA(11:0) Memory address 2.30 2.80 2.85 VDC High
0 0.4 VDC Low
SD(15:0) Memory data from CPU 2.30 2.8 2.85 VDC High
0 0 0.4 VDC Low
Memory data from memory 2.0 2.8 2.85 VDC High
0 0 0.6 VDC Low
RAS0 Row access strobe 2.30 2.80 2.85 VDC High
0 0.4 VDC Low
CAS(1:0) Column access strobe 2.30 2.80 2.85 VDC High
0 0.4 VDC Low
MWEx Memory write enable 2.30 2.80 2.85 VDC High

PAMS RAE–2
Table 12. Signals between PDA CPU and PWRU

SA(2:0) System address 2.30 2.80 2.85 VDC High
0 0.4 VDC Low
SD(6:0) System data 2.40 2.8 2.85 VDC High
0 0.4 VDC Low
CS3x Chip select for Phaser 2.30 2.80 2.85 VDC High
0 0.4 VDC Low
IOWx Phaser write signal 2.30 2.80 2.85 VDC High
IORx Phaser read signal 2.30 2.80 2.85 VDC High
0 0.4 VDC Low, read enabled
RESETx Reset for CPU, and for Flash 2.30 2.80 2.85 VDC High
memories.
i
0 0.4 VDC Low
VBACK Back–up battery voltage 2.40 3.0 3.1 VDC High
V17_EN LCD bias voltage enable 2.30 2.80 2.85 VDC High
0 0.4 VDC Low
V28_1EN LCD logic voltage enable 2.30 2.80 2.85 VDC High
0 0.4 VDC Low

RAE–2 PAMS
Power Unit
BS2
V28_1
VPDA
VBB
V17
TESTPADS
BS1
VSYS
MMC
Interm.voltages 1–4
V28_1
V28_3 V28
VPDA
DRAM
IOW
FRAME CONNECTOR
IOR VSYS
IrDA V28_2
VPDA
ADD(2:0) VSYS
XIPXIPVPP
DATA (6:0) Flashes
CS3x Am486 CPU RESETx
PWRU
V28_EN
VPDA PWRGOOD
HF– V17_EN VSYS
VPP RFD
RFD
power amp. PWRGOOD RESETx Write protect Flash
VBATT Charging RESETx
NMI
NMI
PMI
PMI
VBACK
Backupbattery
Lid Switch
VSYS
VBATT
VBB
MMC_SWITCH
BATTDET
BS8
Figure 3. PDA Power distribution diagram
Battery voltage is supplied from the BS8 module through a board to board
connector. In the BS1 module the battery voltage is filtered and then sup-
plied to the Phaser, IR–transceiver circuit, BS2 module, and PHF–speak-
er circuitry.
The phaser generates internally the system voltage V28, switched volt-
ages V28_1 ,V28_2, V28_3, the LCD bias voltage V17, the LCD inter-
mediate voltages V17_ix, x=1–4 and the backup battery charging voltage
VBACK.
When the battery voltage level is adequate, the PWRU switches V28 on
and after a certain time releases the reset–signal for the CPU. The CPU

PAMS RAE–2
controls the LCD, MMC, and IR–transceiver logic voltages by writing com-
mand to the PWRU register. Optionally the CPU can control the LCD log-
ic- and biasing voltage directly by means of I/O signals.
The backup battery supplies power to the CPU’s real time clock. The
PWRU charges the backup battery when the main battery is connected.
The CPU puts the Flash memories to power down mode when they are
not used.
The BS8 signal BATTDET is a warning signal that the battery will be re-
moved soon, when power down procedure is started. VBB is the supply
voltage for the CMT display, located in the BS2 module, and the VBB
provides information for the BS1 CPU whether the CMT powered or not
and it enables the keyboard buffer. The MMC_SWITCH indicates that the
MMC card will be removed, when the CPU controls the Phaser to turn the
V28_3 off.
Input filter
The Battery voltage is fed from the BS8 module and then filtered by using
a LC–lowpass filter, after filtering the voltage is named VPDA. The VPDA
is then fed to the PWRU, the IR–transceiver, the PHF–speaker circuitry,
and to the BS2 module.
Linear regulator V28
System voltage V28 is generated by a linear regulator. V28 stays on all

the time when the battery voltage is higher than cutoff limit.
Linear regulator V28_1,_2,_3
These regulators are controlled by the CPU. The CPU can enable these
regulators by writing a command to the PWRU’s register. V28_1 is the
switched V28 and is used for the LCD logic. V28_2 is the switched V28
and is used for the IRDA logic. V28_3 is the MMC voltage.
Switchmode regulator V17
The LCD bias voltage V17 is generated by a step–up DC–DC converter.

The control scheme is the current limited pulse width modulation (PWM).
The switching transistor is internal. The regulator output, too, is sepa-
rated from the battery line by an integrated switch transistor between the
regulator output and load.
Backup battery
The Real time clock is kept running by a backup battery only when the
main battery is not connected. At the nominal RTC load used , the
12mAh capacity of the backup battery provides about 40 days of RTC op-
eration when the main battery is not connected. The backup battery is

RAE–2 PAMS
rechargeable. It is charged by the Phaser VBACK regulator using 0.5mA

current when the main battery is connected.
Reset and power management

The Phaser is connected to the I/O space of the H3 by using a 7 bit wide
data bus and a 3 bit wide address bus. The BS2 PDAPWRU on the PDA
board supplies two different voltage levels to the system;
2.85V is used as the main operating voltage for all circuits and
about 19V that is needed for the LCD bias (V17). The LCD bias voltage is
used to adjust the contrast ratio of the LCD screen. The LCD bias volt-
age is controlled by the Phaser ASIC.
The V17 and V28_1 ON/OFF are switched by the Phaser, but optionally
also the CPU can control these signals directly with HW means, indepen-
dently of the SW controlled register settings. The phaser provides also
the POWERGOOD signal for the CPU. The system reset circuit is part of
the power supply. When the battery voltage is higher than 3.4V a
PWRGOOD is generated for the CPU. The reset circuit also asserts the
reset signal whenever the Vcc supply voltage declines below the thresh-
old, keeping it asserted for at least 50ms after Vcc has risen above the
reset threshold. The reset circuit is designed to ignore fast transients
(t < 64µs) in Vcc.
There is an undervoltage lockout (UVLO) block inside the Phaser. Below
the threshold limit the comparator shuts down all Phaser functionality to
prevent the battery from overdischarge. Otherwise the VSYS regulator
current drains the battery when left unused for long period. After the
UVLO there is only reference block in the Phaser drawing current from
the battery. The UVLO has a little hysteresis and is cancelled when the
battery voltage has risen to 2.7V. However, reset to the CPU is given only
when battery voltage rises to 3.45V. This in order to avoid unsuccessful
power–ups. When the lockout voltage level is reached, the battery volt-
age rises because the load is removed.
PDA CPU
The PDA CPU is a SC450–33CC in a 256 pin plastic ball grid array pack-
age.
The core features a 32–bit architecture with internal 8k write–back cache.
The clock rate is 33MHz, which can be slowed down to1MHz. The de-
fault clock rate on reset is 8.29MHz. The bus clock rate is 33MHz. A
32kHz clock signal for the BS8 module is provided by the CPU PLL cir-
cuit. The clock signal is started when ever the system voltage is applied
to the CPU.
The CORE starts when the reset signal is provided and then it begins to
execute the program code from the Flash memory. The external pull–up
resistor controls the start–up procedure (Boot code Chip select, and data
bus width).

PAMS RAE–2
The memory controllers are integrated to the chip. A ROM controller is

used for Flash interface and a DRAM controller supports extended data
out (EDO) page mode DRAMs. Both memory types (DRAM and Flash)
have their own address and data bus routed directly to the CPU. The
power unit is controlled via an I/O-mapped 7-bit wide data- and 3-bit wide
address bus, which is shared with Flash data- and address bus. The CPU
block diagram is the figure below.
Addr
Am486SLE Memory SA bus
Core Data management
unit
DMA Addr
controller Address
8237 decoder
Data Data bus

Power steering
Reset management
unit
Graphics LCD
controller
Loop filters Clock
generation
x32kHz
MMC bus MMC bus
Real time controller
32kHz xtal
clock
Memory DRAM control

controller
JTAG port Boundary ROM control
scan
Columns
AT port Keyboard cntrl
logic matrix/XT Rows
Timer UART FBUS

8254 16550
Serial port
UART
Interrupt
16550
controller
8259
IrDA
GPIO’s infrared R–tranceiver
controller
Elan SC450–33CC
For serial interface two UART circuits are used. UART2 is a serial inter-
face reserved for data transfer between the BS1 and BS8 modules.
UART2 is disabled or enabled according to the CMT voltage. UART1 is
used for RS–232 interface with external level changer. The UARTs can be
connected together to establish Re–Link connection, where received data
is directly linked to the UART’s transmit data pin. That way the BS8 mod-
ule can be programmed by using an external RS-interface. Autobauding
detection circuitry is included in the UART1 block.

RAE–2 PAMS
The LCD–controller supports a 4-bit data and 16-grey shades. The dis-
play control signals are routed from the CPU. The bigger (640x200) LCD
is located in the lid. The interconnection between the CPU and the LCD
comprises a flex through the hinge. Data and control signals are provided
by the CPU. The required voltages are supplied by the PWRU.
The PDA CPU supports a synchronous serial interface that is compatible
with the Multimedia Card Bus (MMC) Protocol. The MMC is changeable
Flash or ROM memory card with variable memory size. The MMC con-
nector is located on the BS8 Module. MMC signals are routed to the BS8
module through a Board to board connector. The interface consists of
three pins: one clock(output), one command/response (bidirectional), and
one data pin (bidirectional). The controller is capable up to 8Mbits/second
transfer rate.
The keyboard controller includes a matrix keyboard which is used for
PDA keyboard and for PDA lid keys. The PC/AT standard core includes
a 8254 programmable interval timer, two 8259 programmable interrupt
controllers, and a real time clock. The CPU’s general purpose input/out-
puts (GPIO) are controlled by the CPU’s registers.
I/O Signals
In the Table 13 below are listed BS1 module I/O signals which are
mapped to general purpose pins of the CPU.
Table 13. Spock CPU Controllable I/O Signals
Scotty Pin Signal Name Low High Note
GPIO_CS1 RFD_WPx Write operation Write not possible
GPIO_CS2 XIP_STS Memory busy Memory ready Input, CS(1:0) Flash memory status
GPIO_CS5 TESTMODEx Testmode acti- Reset, Suspend, Input.
vated Operation
GPIO_CS6 PWRONx Powering the Reset, Suspend Activate the power on procedure for the
CMT up CMT
GPIO_CS7 Flash_RDY Flash performing Flash ready for Input. Open drain output, processor’s
an internal opera- new command internal pull–up is used. (Only for the
tion RFD)
GPIO_CS8 MMC_Switch MMC cover Reset, MMC cov- Input. MMC cover status indication
closed er open
GPIO_CS9 MBUS Output during BS8 Flashing from BS1
module, Input otherwise.
GPIO_CS11 Phaser_CSx Chip Selected Chip not selected Output.
GPIO_CS12 VBB CMT off Reset, CMT on Input.
GPIO_CS13
GPIO16 LCDBL_EN Reset, Suspend, Backlight acti- Backlight EL driver controller.
BL disabled vated
GPIO18 BZR_EN Reset, Suspend Operation Enables the PA.
BL1 BATTDET Battery con- Battery removed Indicates when the battery is going to
nected be removed. Pin has build in 15ms de-
bounce
SUS/RES LIDSWITCH Cover closed Cover open STI. Indicates when the coved is open
or closed

PAMS RAE–2
Table 13. Spock CPU Controllable I/O Signals (continued)

LVDD LVDD Reset, Suspend PDA LCD Logic Routed to the Phaser
voltage activated
LVEE LVEE Reset, Suspend PDA LCD bias Routed to the Phaser
voltage activated
Memories
The memory units of the module are connected to the CPU via a 16–bit
wide data bus. Both memory types (DRAM and Flash) have an own
data– and address bus.
MD [15:0] DRAM
MA [11:0]
control [3:0]
control [7:0]
RFD Flash XIP Flash 1 XIP Flash 0

BS1 CPU
SD [15:0]
SA [21:0]
DRAM memory
The 1Mx16bit DRAM is connected to the CPU with a dedicated 16–bit
wide data- and 12-bit wide address bus. The DRAM type used is the ex-
tended data out (EDO) DRAM with 60ns access time, and self–refresh
capability. DRAM is packaged in a 5.55mmX9.10mm, 40–ball uBGA
package.
When the DRAM is driven by the CPU, no wait states is needed.
Flash memory
Three 1Mx16bit Flash memory devices are used for non–volatile memory.
The Flash type features a 120ns access time. The Flash is packaged in
8mmX11mm 64–ball CSP package. When the Flash is read by the CPU,
4 wait states are needed to ensure proper timing.

RAE–2 PAMS
External Serial Interface

The UART1 External serial interface is used for PC–connectivity. The RS–
connection is provided by a 3–signal interface (RXD,TXD, and DTR)
which is routed to the system connector. Maximum data rate is
230.4kbps.
The re–link feature connects the UART1 and the UART2 (FBUS) internal-
ly together. This provides the signal routing from the system connector to
the CMT.
The Autobaud detection circuitry can detect bit rates from 300 bps tp
115.2kbps. The autobaud state machine starts when enabled by the CPU.
The bit rate measurement begins on the first negative edge of the
CPU_RXD line. After detecting the start bit width, and therefore the bit
rate, the remainder of the incoming data stream is sampled at this rate.
This UART is shared with the IrDA circuitry and thus only one of them can
be used at a time.
IR–Transceiver
The IR–transceiver controller is shared with the UART1. Infrared data
transfer is started with 9600bps and then the data rate is increased to
115.2kbps if the connected device supports higher speed. The protocol is
the standard one of the Infrared Data Association. The CPU hardware
implementation includes bit stuffing (when transmitting), CRC calculation,
removing bit stuffing, and removing beginning of frame (when receiving) .
Handsfree loudspeaker
The Handsfree speaker power amplifier circuitry is located on the BS1
module. The HF–speaker is used to produce the PDA key–click sounds,
error beeps, and tunes. When the lid is opened, the loudspeaker is used
as an handsfree speaker, producing key–click sound when a PDA
QWERTY key is pressed, and producing tunes. The HF–speaker power
amplifier can be controlled by the PDA CPU, or CMT.
Keyboard
The keyboard interface comprises 10x8 matrix lines. The QWERTY key-
board pads are located on the other side of the BS1 module board. 4x2
(2Row/4Column) matrix is routed to the lid. Four columns are multiplexed
with CMT keyboard columns. Multiplexing is done by using buffer located
on the BS1 module. This buffer is controlled by Baseband voltage (VBB).
When the lid is closed these four columns are switched to inputs and they
are not read by the CPU.

PAMS RAE–2
Table 14. Key Reference Numbers vs. Senses and Drives.

Column
Col0 Col1 Col2 Col3 Col4 Col5 Col6 Col7
Row0 S730 S732 S734 S736 S331 S337 S343
Row1 S731 S733 S735 S325 S330 S336 S341 S342
Row2 S300 S318 S347 S324 S335 S311 S303 S305
Row3 S306 S307 S308 S327 S328 S310 S309 S323,
S329,
S334
Row4 S312 S313 S314 S332 S333 S316 S315 S317
Row5 S301 S319 S320 S321 S322 S348 S349 S302
Row6 S352 S353 S354 S338 S339 S356 S355
Row7 S357 S358 S359 S344 S345 S361 S360 S346
Row8 S362 S363 S364 S326 S351 S365 S350
Row9 S304,
S340
NOTE1: Shift pads has dedicated Sense line (ROW9), These shift pads
are connected parallel
NOTE2: Grey shaded switches are located in BS2 module.
Figure 4. BS1 PDA keyboard

RAE–2 PAMS
Test pads
Test pads are located under the battery pack. They include JTAG port
which is used for After Sales Flashing purposes. The different voltages
can be measured from these testpads. Serial data transfer test pads are
used for data transfer between the BS1 and BS8 modules.
Figure 5. Test pad layout

PAMS RAE–2
Table 15. Test pads

Note
E300 V17_OUT PDA LCD Biasing voltage 13.8 19.4 22.2 VDC High
0 VDC Low
E301 I BNDSCN_TMS Boundary scan Test mode se- 2.0 2.80 2.85 VDC High, test mode
lect selected
0 0.8 VDC Low
E302 I BNDSCN_TCK Boundary scan test clock 2.0 2.80 2.85 VDC High
0 0.8 VDC Low
E303 I BNDSCN_TDI Boundary scan data in 2.0 2.80 2.85 VDC High
0 0.8 VDC Low
E304 O BNDSCN_TDO Boundary scan data out 2.30 2.80 2.85 VDC High
0 0.45 VDC Low
E305 I BNDSCN_EN Boundary scan enabled 2.0 2.80 2.85 VDC High, boundary
scan enabled
0 0.8 VDC Low
E306 I Flash VPP Flashing voltage for XIP 2.75 2.80 2.85 VDC Connected to
Flashes. VBATT inside
the Service
battery.
E307 VBACK Backup battery voltage 2.40 3.0 3.10 VDC High
E308 O FBUS_RXD PDA CPU Tx–pin 2.30 2.80 2.85 VDC High
0 0.45 VDC Low
E309/ I FBUS_TXD1,2 PDA CPU Rx–pin 2.0 2.80 2.85 VDC High
E310
0 0.8 VDC Low
E311 I/O MBUS Bidirectional Serial Bus 2.30 2.80 2.85 VDC High, to the
CMT
0 0.45 VDC Low, to the
CMT
CMT
0 0.5 VDC Low, from the
CMT
E312 VSYS System voltage 2.75 2.80 2.85 VDC
E313 GND Global Ground
E314 I FLSHWRx Write signal for Flash memo- 2.30 2.80 2.85 VDC High
ries
i
0 0.45 VDC Low, write en-
abled
E315 I TESTMODEx testmode activation 2.0 2.80 2.85 VDC High
0 0.8 VDC Low, testmode
enabled
NOTE : Testpad E308 ... E310 is reserved for R&D use.

RAE–2 PAMS
Testpoints
Testpoints are located around the PDA PCB. They include clock, control,
data signals and voltages which is used for R&D, fault finding and testing
purposes.
Figure 6. Testpoints layout
Table 16. Testpoints

Point I/O Name Function Min Nom Max Unit Description /
Note
J310 LID_SWITCH_IF Lid switch state 2.75 2.8 2.85 VDC High, lid open
0 VDC Low, lid closed
J400 33MHz CPU core clock 2.3 2.80 2.85 VDC High
0 0.45 VDC Low
J401 O X32_CLK CMT sleep clock 2.3 2.80 2.85 VDC High
0 0.45 VDC Low
J402 I VBB CMT baseband voltage 2.7 2.80 2.85 VDC High
1.0 mA Maximum cur-
rent

PAMS RAE–2
Table 16. Testpoints (continued)

Note
J403 I/O MBUS Bidirectional Serial Bus 2.30 2.80 2.85 VDC High, to the
CMT
0 0.45 VDC Low, to the
CMT
CMT
0 0.5 VDC Low, from the
CMT
J404 O PWR_ONx 2.0 2.80 2.85 VDC High

0 0.45 VDC Low
J430 LF_INT Intermidiate PLL loop filter 1.2 VDC When PLLs are
locked
J434 I X32IN 1.35 VDC High, Sini vawe

0 VDC Low
J435 O X32OUT 1.0 VDC High
–0.3 VDC Low
J440 ROMCS2 RFD flash chip select 2.3 2.80 2.85 VDC High
0 0.45 VDC Low, chip se-
lected
J441 ROMCS0 XIP1 flash chip select 2.3 2.80 2.85 VDC High
lected
J442 FLASHWRx XIP and RFD flashes write 2.3 2.80 2.85 VDC High
enable
bl ffrom CPU
0 0.45 VDC Low, write en-
abled
I XIP and RFD flashes write 2.0 2.80 2.85 VDC High
enable
bl from
f frame
f connector
t
or testpads 0 0.8 VDC Low, write en-
abled
J443 ROMRDx RFD flash read enable 2.3 2.80 2.85 VDC High
0 0.45 VDC Low, read en-
abled
J444 WP RFD flash write protect 2.3 2.80 2.85 VDC High
0 0.45 VDC Low, write pro-
tected
J445 ROMCS1 XIP2 flash chip select 2.3 2.80 2.85 VDC High
0 0.45 VDC Low
J446 RASx DRAM row address strobe 2.3 2.80 2.85 VDC High
0 0.45 VDC Low
J447 MWEx DRAM write enable 2.3 2.80 2.85 VDC High
0 0.45 VDC Low
J448 CASL1x DRAM upper column address 2.3 2.80 2.85 VDC High
select
l t
0 0.45 VDC Low
J449 CASL0x DRAM lower column address 2.3 2.80 2.85 VDC High
select
l t
0 0.45 VDC Low
J450 FLASH_CTRL2 RFD flash status 2.4 2.80 2.85 VDC High
0 0.4 VDC Low

RAE–2 PAMS
Table 16. Testpoints (continued)

Note
J451 STS1 XIP1 flash status 2.4 2.80 2.85 VDC High
0 0.4 VDC Low
J452 STS2 XIP2 flash status 2.4 2.80 2.85 VDC High
0 0.4 VDC Low
J453 SD1 System data bus line 1 2.3 2.80 2.85 VDC High, data to
memory
0 0.45 VDC Low, data to
memory
2.4 2.8 2.85 VDC High, data to
CPU
0 0.4 VDC Low, data to
CPU
J454 SA4 System address bus line 4 2.3 2.80 2.85 VDC High
0 0.45 VDC Low
J455 D0 Memory data bus line 0 2.3 2.80 2.85 VDC High
0 0.45 VDC Low
J456 MA3 Memory address bus line 3 2.3 2.80 2.85 VDC High
0 0.45 VDC Low
J497 VCOMP1 1.24 1.285 VDC
J498 CS3x Phaser chip select 2.3 2.80 2.85 VDC High
lected
J499 RESETx Reset from Phaser to CPU 2.5 2.80 2.85 VDC High
and
d flash
fl h memories
i
0 0.5 VDC Low
J801 O GENSDIO CMT LCD and CCONT serial 2.0 2.80 2.85 VDC High
d t
data
0 0.5 VDC Low
J803 I/O LCDCD CMT LCD command / data 2.0 2.80 2.85 VDC High, data
select
l t
J804 I/O LCDCSx CMT LCD chip select 2.1 2.80 2.85 VDC High
lected
J808 O SCK PDA LCD data clock 2.3 2.80 2.85 VDC High
J854 BZR_IF Buzzer signal 2.0 2.80 2.85 VDC High
0 0.6 VDC Low
J880 HFENA Handsfree earpiece enable 2.3 2.80 2.85 VDC High, HF ampli-
fied enabled
0 0.45 VDC Low, HF ampli-
fied disabled
J881 O XEAR Audio output for handsfree 2.0 Vpp
use

RAE-2 Series
Chapter 6
Service SW and Tuning

Instructions
Original, 02/99 Copyright 1999. Nokia Mobile Phones. All Rights Reserved.
RAE-2 PAMS
Service SW and Tuning Instructions Technical Documentation

Number
02/99 Original
Page 6– 2 Original, 02/99

PAMS RAE-2
Technical Documentation Service SW and Tuning Instructions
CONTENTS – Service Software
Page No
Service Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 5
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 5
Hardware requirements for Windows 3.1x . . . . . . . . . . . 6– 5
Hardware requirements for Windows 95 . . . . . . . . . . . . 6– 5
Software Environment of the Support Modules . . . . . . . . . 6– 5
Required Servicing Equipment . . . . . . . . . . . . . . . . . . . . . . . 6– 6
Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 7
Mechanical Connections . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 7
Installing the software on PC Hard Disk . . . . . . . . . . . . . 6– 7
Common Properties of the User Interface . . . . . . . . . . . . . . . . . . 6– 8
Login Dialog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 8
Main Window . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 9
Using Help . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 9
SW Update Concepts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 10
Equipment for Nokia RAE-2 the PDA Flash programming . . . . 6– 11
Wintesla RS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 11
Multimedia card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 12
Equipment for RAE–2N the CMT SW Upgrade . . . . . . . . . . . . . 6– 13
Complete Equipment for RAE–2N* the CMT SW Upgrade . 6– 13
Upgrade Equipment for RAE–2N* the CMT SW Upgrade . . 6– 15
Software Update Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 16
the PDA Software Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 16
Wintesla RS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 16
Multimedia card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 17
Creating Flash programming Multimedia card . . . . . . . . . . 6– 17
the PDA SW uthe PDAte with Multimedia card . . . . . . . . . 6– 18
the CMT Software Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 19
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 19
Equipment Setup instructions . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 19
Setting up the PC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 19
Programming with Wintesla interface . . . . . . . . . . . . . . . . . . . . 6– 19
Troubleshooting for the CMT SW upgrade . . . . . . . . . . . . . . . 6– 20
RF Tuning Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 22
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 22
Required Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 22
Equipment Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 22
Equipment Setup for RF Tuning RAE–2 Phone
Without Removing Covers . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 24
Original, 02/99 Page 6– 3

RAE-2 PAMS
Tuning RF with covers Off –using Module Jig MJS–4 . . . 6– 25

Tuning EM without removing covers . . . . . . . . . . . . . . . . . . 6– 26
Tuning Steps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 27
RX Calibration (AGC + AFC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 27
I/Q Modulator Amplitude Balance and Phase Shift Tuning . . 6– 27
Tuning of Transmitter Power Levels . . . . . . . . . . . . . . . . . . . . . 6– 29
Energy Management Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 30
Battery & charger default values . . . . . . . . . . . . . . . . . . 6– 30
Battery voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 30
Charger voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 30
Battery size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 30
Battery temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 30
Charge current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6– 30

PAMS RAE-2
Service Software
General
Wintesla software is used to perform service functions of the RAE–2N* PDA.
This SW consists of Wintesla service software and product specific DLL’s
(Dynamically Linked Libraries). Both the CMT(Cellular Mobile Telephone)
and the PDA (Personal Digital Assistant) have their own DLL’s, but those
DLL’s are delivered as one SW package. To run WinTesla SW, a parallel port
software protection device (PKD–1) has to be connected. TDF–4 box must
connected to PC as described on following pages to perform the CMT
flashing functions. If only controls of the CMT and the PDA are neccessary,
RAE–2N* can be controlled using equipment setup described in the Wintesla
RS chapter. The test functions send test messages from PC to MS and
receive results and show them in the PC display. The messages to the CMT
and the PDA can be sent via DAU–9C cable. The DLR–2 cable can send
messages only to the PDA.
Note: if this software is to be run on laptops, the power saving feature MUST
be switched off.
Hardware requirements for Windows 3.1x
The recommended minimum hardware standard to run Service Software is

any computer which is 386 33 MHz or greater with at least 4 MB of memory
and VGA type display (640 x 480). This assumes that only the WinTesla with
After Sales Support Modules is active, i.e. other Windows packages are not
running in the background.
Hardware requirements for Windows 95
The recommended minimum hardware standard to run Service Software is

any computer which has Pentium processor, memory 8 MB and meets HW
requirements recommended by Microsoft.
Software Environment of the Support Modules

The Service Software user interface is intended for the following
environments: Microsoft Windows 3.1x (enhanced mode) and Windows
95environment running in enhanced mode. Support for Microsoft NT may be
added, if required. Detailed information about Windows and application
usage can be found from the Microsoft Windows Version 3.1 Users Guide
chapter one (Windows Basics) and chapter two (Application Basics).
As an ordinary Windows application, the main idea in the user interface is
that selections are made with menus, push buttons and shortcut keys.
Selections can be done by using keyboard and/or mouse. There is always
a status bar displayed at the bottom of the main window which contains
information about current actions.

RAE-2 PAMS
Required Servicing Equipment

– Computer: At least IBM 80386 or compatible with one unused serial
port (COM1 or COM2) *), one parallel port (LPT1), hard disk
recommended
– Operating System: DOS Version 3.2 or later
– If PCLStart in use: DOS 6.22 and IBM 80486 or compatible
– Display: Any 80–character text display
– Service software version for 3.5” disk (product code: 0774080)
Rest of the needed service equipment depends on what kind of operations

service personnel wants to perform. Different configurations are described
later in this chapter.
*) Note: A number of PC’s of an older generation use the Intel, National Semiconductor, or United
Microelectronics IC 8250 as the serial port UART. This is a comparatively inefficient circuit for current
purposes and does not necessarily support the M2BUS adapter at 9600 baud. The newer UART’s
NS16450 and NS16550AF of National Semiconductor offer solutions for these problems.

PAMS RAE-2
Installation
Mechanical Connections
Caution: Make sure that you have switched off the PC and the printer
before making connections.

Caution: Do not connect the PKD–1 key to the serial port. You may
damage your PKD–1 !
The software controls RAE–2N via a separate adapter connected to the
serial port of the PC, and to the communicator’s bottom connector (DAU–9C
cable).
Attach the dongle PKD–1 to the parallel port 1 (25–pin female D–connector)
of the PC. When connecting PKD–1 to the parallel port, be sure that you
insert the computer side of the PKD–1 to the PC (male side). If you use a
printer on parallel port 1, install the PKD–1 between the PC and your printer
cable.
The PKD–1 should not affect devices working with it. If some errors occur
(errors in printing are possible) please try printing without the PKD–1. If
printing is OK without the PKD–1 please contact your dealer. We will offer
you a new PKD–1 in exchange for your old one.
The program is delivered on a diskette and is copy protected with a dongle
PKD–1. It must be present in parallel port when using Service software.
Installing the software on PC Hard Disk
The program can also be installed on the hard disk, which is recommendable
to obtain a maximum data access rate.
Keep the original diskette safe to enable upgrading of the program !
If you plan to use PCL Start service software, you must install it before
installing Service software, see PCL Start installation instructions.
To install the new Service software program, follow the steps below:
1. insert the new Service software diskette

into drive A: of your computer
2. start Windows, and open File Manager
log into drive a: type A: and press <Enter>
3. start INSTALL.EXE and type C: and press <Enter>
install Service software to drive C:
To install product specific DLL’s, take your RAE–2N DLL disks, and repeat
the steps above.

RAE-2 PAMS
Common Properties of the User Interface

This chapter describes how the User Interface CLF must appear to the user.
The User Interface MUST be capable of being driven without the use of a
mouse, as the service engineer rarely has space on the bench to use a
mouse.
Login Dialog
When the Service Software application is invoked, by checking on the
Service Software icon, the Login dialog box will be displayed on the screen.
Nokia logo and

application name
Application version
Copyright version
Login box
Nokia logo and application name bitmap (–)

Displays Nokia logo and name of the application.
Application version static text (–)
Contains the name and version of the application.
Copyright notice static text (–)
Copyright is informed as: “Nokia Mobile Phones (c) 1996. All
Rights Reserved”.
Login Box edit box (–)
The user Login ID edit box, where the user enters his faultlog
user name. (See Faultlog User Guide)
OK button (default key)
The user name is stored in memory and the dialog box is
closed. When the dialog box is closed, the application starts.

PAMS RAE-2
Cancel button (ESC)

The Dialog box is closed and application is started, but the
Faultlog feature is disabled.
Help button (F1)
Activates the Windows Help application and displays context
sensitive Help.
Main Window
When Wintesla opens the basic screen, product specific DLL’s must be
activated using mouse to select Product –> Open
– If you want to control the CMT side, select RAE–2

– If you want to control the PDA side, select RAE2PD
Using Help
When DLL’s are active , menu bar contains several items, including help
texts, as shown in the picture below.
Instructions for service software use can be found in the help texts. Step
by step instructions for complex operations like SW upgrades and tunings
can be found in the end of this chapter.

RAE-2 PAMS
SW Update Concepts
The following lists describe the equipment which can be used in the RAE–2
software update. Nokia RAE–2 contains two main processors, one for the
PDA (Personal Digital Assistant) and one for the CMT (Cellular Mobile
Telephone). Both of these main processors have their own SW package, and
to ensure proper functionality between softwares both the CMT and the PDA
SW upgrade must be done.
Service points can perform the PDA SW upgrade only by using WinTesla RS
method. the PDA SW upgrade using multimedia card is limited only to
services with PKD1–CS or PKD–1NS SW protection key.
NOTE! All power supplies are designed to be used in Finland or in countries
with the same voltage (230 AC) and the same AC plug. More information
about power supplies with different voltages and plugs will be available later

PAMS RAE-2
Equipment for Nokia RAE-2 the PDA Flash

programming
Wintesla RS
6.
9.
7.
4.
1.
8.
2. and 3.
5.
List of required equipment:
Item: Service accessory: Product code:
1 PC environment
486 processor or newer
WIN3.11/Win 95 (NT is not supported ) OS
2 Wintesla service SW 0774046
3 RAE–2N* Wintesla DLL package 0774126
4 PKD–1 SW protection key 0750018
5 DLR–2 cable or DAU–9C cable 0730138*
6 PKD–4F the PDA Flash programming dongle
0750124
7 BBS–5 Service battery 0770117
8 FLA–7 Flash Loading Adapter 0770119
9 ACL–3E power supply (FLA–7’s power supply) 0680015
*) Product code for DAU–9C. DAU–9C can control both the PDA and the
CMT, DLR–2 can control only the PDA.

RAE-2 PAMS
Multimedia card
This setup can be used only if you have a PKD–1CS or PKD–1NS SW
protection key.
1.
3.
1. 2.
4.
3.
2.
Equipment list
(All product codes on the list include only one piece of equipment)
1 Eight PKD–4F the PDA Flash programming dongle’s 0750124
2 Eight BBS–5 Service batteries 0770117
3 Eight Flash Multimedia cards 4340513
4 One power junction unit JBP–8 0770141
** One lab. power supply
(Output curr. min. 3A, output voltage 4.1 V)
See details how to create Multimedia cards with the PDA SW upgrade
capability in SW update instructions.

PAMS RAE-2
Equipment for RAE–2N the CMT SW Upgrade
Complete Equipment for RAE–2N* the CMT SW Upgrade

NOTE!
If you already have DCT3 SW upgrade equipment and you want to
change it to be capable to perform RAE–2N the CMT SW upgrade The
you already have most of the equipment on your desk.
The complete equipment list and the list of equipment which is needed to
change DCT3 SW upgrade equipment to perform RAE–2N the CMT SW
upgrade are illustrated in next two figures.
4.
15. 1.
16.
7.
9. 2. and 3. 10.
8.
5. 14.
10.
6.
12.
11.
13.
Complete equipment list

1 PC environment
486 processor or newer

RAE-2 PAMS
WIN3.11/Win 95 (NT is not supported ) OS

2 Wintesla service SW 0774046
3 RAE–2N* Wintesla DLL package 0774126
4 PKD–1 SW protection key 0750018
5 AXS–5 cable 0730091
6 SCH–8 cable 0730137
7 Service battery BBS–5 0770117
8 FLA–7 Flash loading adapter 0770119
9 DC power cable SCF–7 0730141
10 Two AXS–4 cables 0730090
NOTE! One AXS–4 cable included to Flash prommer (FPS–4) sales
package
11 Modular cable XCM–1 4626131
12 Flash security box TDF–4 0770106
Flash prommer FPS–4 sales package 0085095
The following items are included in FPS–4 sales package:

13 FPS–4 Flash prommer
14 Centronics cable 0730029
15 ACL–3E power supply 0680015
NOTE! FPS–Item 4 Must be ordered with memory extension modules:

1*SRAM type SF6 0200742
4*FLASH type SF7 0200743
16 ACH–6E power supply (TDF–4’s power supply) 0675084

PAMS RAE-2
Upgrade Equipment for RAE–2N* the CMT SW Upgrade

Here is the equipment list in case you already have Nokia 61XX/51XX
SW update capability.
6.
3.
5.
4.
1.
2.

1 SCH–8 cable 0730137
2 Modular cable XCM–1 4626131
4 FLA–7 Flash loading adapter 0770119
5 DC power cable SCF–7 0730141
6 ACL–3E power supply 0680015
RAE–2N* Wintesla DLL package 0774126
NOTE ! One ACL–3E is included to Standard (FPS–4) sales package. If

FPS–4 has been delivered with other kind power supply then ACL–3E is
needed).

RAE-2 PAMS
Software update Instructions

Previous pages introduced all possible configurations that can be used in
RAE–2N* software upgrade. The following chapters contain detailed
step–by–step instructions how to perform this upgrade.
In case that equipment is not working properly:
– Check that connections are made according to insructions.
– Switch the power off from the boxes and PC and restart the whole
system.
– Clean the contact surfaces.
PDA Software Upgrade
Wintesla RS
Currently the PDA Software upgrade with Wintesla (running on Win95) lasts
approximately 8 min 30 sec. If Wintesla is running on Windows 3.11 upgrade
time approximately double (18 minutes).
NOTE! Remember to backup user data before SW upgrade. All user data
must be removed from the device after SW upgrade. After that user data
backups can be restored to the device.
Steps to perform upgrade:
1. Insert service battery BBS–5. Remember to check that the
switch on the battery is turned to ’Test’ position (Check the
label under the battery for position information).
2. Connect PKD–4F to service battery.
3. Connect DLR–2 (or DAU–9C) cable to PC’s serial (COM) port.
4. Connect other end of DLR–2 (or DAU–9C) to Nokia 9110
bottom connector.
5. Start Wintesla software.
6. Select ’Open’ from Wintesla command menu.
7. Select RAE2PD from the list.
8. Press ”OK”.
9. Update settings:
9..a Speed: 115200 (If Wintesla is running in WIN3.11 then
use: 57600).
9..b Port: Com1 (or 2 depending of your setup).
9..c Choose RS protocol.

PAMS RAE-2
10. Press ”OK”.

11. Insert Service battery’s power cable to FLA–7.
12. Once Wintesla informs ”the PDA responding in BIOS mode”
press ok. Otherwise press ”cancel” and start again from step 9.
13. Select memory –> SW update.
14. Select wanted image (*.hdr).
15. Press ok.
16. Once programming is done service SW will prompt ’ SW
utpdate successful’. Cables can now be disconnected.
17. Now the PDA software is updated. Format the file system by
pressing SHIFT–TAB–F and connect BLN–3 battery at the
same time. This will remove all user data from the device.
NOTE: Make sure that backup file you have created is stored
in a secure location before formatting file system.
Multimedia card
This procedure is possible only with PKD–1CS or PKD–1NS SW protection
key. For security reasons this procedure is not authorized with other PKD–1
SW protection keys.
Creating Flash programming Multimedia card

Note! You need to have PC which has Wintesla version 3.0 or newer. See
chapter 3.3 for information about installation. You also need to have PKD–1
CS/NS SW protection key connected to your PC.
1. Insert empty Flash Multimedia card to RAE–2N* Multimedia
card slot
2. Insert service battery. Remember to check that Testmode
switch is turned to Testmode position (Check the label under
the battery for position information).
3. Connect DLR–2 (or DAU–9C) cable to PC’s serial (COM) port.
4. Connect other end of DLR–2 (or DAU–9C) to RAE–2N* bottom
connector.
5. Start Wintesla software from Windows desktop.
6. Select Product –> Open from Wintesla command menu.
7. Select RAE2PD from the list.
8. Press ok.
9. Update settings:
9..a Speed: 115200 (If Wintesla is running in WIN3.11 then
use: 57600).

RAE-2 PAMS
9..b Port: Com1 (or 2 depending of your setup).

9..c Use RS protocol.
10. Press ok.
11. Insert Service battery’s power cable to FLA–7.
12. Once Wintesla informs ”the PDA responding in BIOS mode”
press ok. Otherwise press ”cancel” and start again from step 9.
13. Select memory –> Write Memory Card from menus.
14. Choose correct Multimedia card image file and press OK.
15. Select Memory–>Update Memory Card NMP ID
16. Disconnect Multimedia card.
the PDA SW Update with Multimedia card
NOTE! Remember to backup user data before SW upgrade. All user data
must be removed from the device after SW upgrade. After that user data can
be restored to the device.
1. Insert Multimedia card to RAE–2N* Multimedia card slot.
2. Insert service battery BBS–5.
NOTE! Check that the switch on BBS–5 is turned to ’Normal’ position (Check
the label under the battery for position information)
3. Connect PKD–4F dongle to BBS–5 Service Battery.
4. Connect BBS–5 Service Battery power cable to Power
Junction Unit JBP–8 or to flash loading adapter FLA–7.
5. Programming starts automatically and will last approximately 2
minutes .
6. Once programming is done remove all user generated data
from the device by pressing SHIFT–TAB–F.
NOTE: Make sure that backup file you have created is stored
in a secure location before formatting file system.

PAMS RAE-2
the CMT Software Upgrade
General
the CMT software upgrade is currently possible only by using software
upgrade equipment described earlier.
Equipment Setup instructions

1. Once TDF–4 box is first time used it has to be activated
according to instructions which come inside the TDF–4
package.
2. Connect boxes, cables and PC according to connection
drawing (Appendix).
3. Install FPS4 Prommer SW (release 2.00 or newer)
Installation diskettes (Product code 8400041) come with
FPS–4S (Sales pack)
4. Run setup (type ”setup .”).
5. Answer setup program’s questions according to your
environment.
Setting up the PC
1. Install WinTesla (version 5.31 or newer, rather at least 5.34)
Floppy disks can be ordered with product code 0774046
2. Install dongle drivers (combined Win3.1x, 95 and NT)
http://casw–www.ca.nmp.nokia.com/swline/WinTesla/wt_dngl.h
tm
3. Install the CMT & the PDA DLL’s
Order 3.5” floppy disks using product code 0774126
Programming with Wintesla interface

When the system has been set up, SW upgrade can be preformed according
to following instructions.
1. Insert BBS–5 service battery. Remember to check that switch
on the battery is in ’Test’ position (Check the label under the
battery for position information).
2. Connect SCH–8 cable to FLA–7’s ”service cable” connector.
3. Connect power cable to FLA–7’s ”service battery
communicator” connector.

RAE-2 PAMS
4. Connect SCH–8 cable to N9110’s bottom connector by using

bottom connector adapter.
5. Turn the CMT on by pressing power button.
6. Start Wintesla software.
7. Select Product –> Open –> RAE2.
8. Press F5 to initialize phone in local mode.
9. Select Software –> Flash Phone.
10. New dialog opens.
11. Select software image: Press ”Load image” button.
12. Select PPM image: Press ”Load PPM” button.
13. Check from the PDA display that Relink –connection is ready.
14. Press ”Flash” button.
15. Once program is prompting for restoring user data choose
either YES or NO.
NOTE! If you select YES user data (the CMT profile settings, Voice mail
number, Welcome graphics, dealer&operator setting and divert number
settings) will be saved to file.
16. Programming starts.
17. When service SW asks you to check that phone is on, switch
the phone on if necessary.
18. Flash authority ID, Factory setup values and user settings
(optional) are updated.
19. After flash programming completed message you can close the
flash dialog.
20. Disconnect Nokia 9110.
Troubleshooting for the CMT SW upgrade

If something went wrong during flashing:
1. Switch the phone on and scan the CMT with CTRL–R.
2. Flash again without restoring user settings.
3. Restore user settings that were read during first attempt by
using ’Dealer–>SCM&User settings’ Select file with ”Select
File” button and then press ’Save’ button.
If you have a dead the CMT:
1. Do not try to switch phone on.
2. Use Product–>Open–>RAE–2. Wintesla will prompt you
’Found COMBOX without phone, open flash only menu?’
Answer Yes and then use Software –>Flash Phone.

PAMS RAE-2
3. This time user settings can not be read. After flashing ’Restore
Default User Settings’ dialog is opened and you can select
which default settings you want to download to the CMT.
4. Later you can use ’Dealer–>SCM&User settings’ to return your
the CMT settings if you have earlier saved them to a file. the
CMT settings can be saved by using ’Dealer–>SCM&User
settings’ and ’Read Phone’ button.

RAE-2 PAMS
RF Tuning Instructions
General
All tuning operations of the RAE–2 are carried out using the service
software. The service software turns the phone into the locals mode, in
which the phone can be outwardly controlled via the MBUS interface. This
MBUS interface can be found from the bottom of the phone.
Tuning is based on the software communicating with the D/A and A/D
converters of the phone. In some instances the phone processor will also
calculate the required correction parameter.
The tuning values of the phone reside on the EEPROM. The contents of the
EEPROM can be read by the service software and saved as a file. This is
advisable when there is need to retain that information, e.g. in view of
replacement of the circuit. The program also enables writing the default
parameters on the EEPROM, in which case all tuning steps should be carried
out.
During tuning, proceed as follows:

– Take care not to damage sensitive measuring instruments with
excessive RF power.
– Carry out all tuning steps in the shortest possible time to avoid
excessive heating of RF units.
– Perform all tuning steps in the order presented.
– Never try to mask a fault by tuning it out!
Required Equipment
– PC/AT computer with service software; see separate section for
instructions on installation and use.
– Service accessories; see equipment setup lists.
– Multimeter or DVM.
– GSM radio telephone test station or separate measuring equipment as
follows:
– RF generator
– pulse power meter
– spectrum analyzer
– attenuator and branching unit
Equipment Setup
Caution: Make sure that you have switched off the PC and the printer
before making connections !

PAMS RAE-2
Caution: Do not connect the PKD–1 key to the serial port. You may
damage your PKD–1 !
Attach the protection key PKD–1 to parallel port one (25–pin female
D–connector) of the PC. When connecting the PKD–1 to the parallel port be
sure that you insert the PC end of the PKD–1 to the PC (male side). If you
use a printer on parallel port one, place the PKD–1 between the PC and your
printer cable.
Next see the following lists for correct equipment. Different equipment is
needed when tuning phone without removing covers or when tuning phone
with covers removed.

RAE-2 PAMS
Equipment Setup for RF Tuning RAE–2 Phone Without Removing

Covers
1.
2.
5.
3.
7. and 8.
4.
6.

2 Calibration Unit JBE–1 (* 0770118
3 Service Car Kit HCR–2 0770146
4 Modular T–adapter 4626134
5 Software protection key PKD–1 0750018
6 MBUS cable DAU–9S 0730108
7 Wintesla Service SW 0774060
8 WinTesla product specific DLL’s for RAE–2N* 0774126
** Laboratory power supply 3A/12V (adjustable)
*) Never use FLA–7 for tunings.

PAMS RAE-2
Tuning RF with covers Off –using Module Jig MJS–4
4.
2.
3.
5. and 6.
1.
1 Module Jig MJS–4 0770116

2 MBUS cable DAU–9S 0730108
3 Modular T–adapter 4626134

RAE-2 PAMS
Tuning EM without removing covers

NOTE: EM values can not be tuned in module jig MJS–4
1.
2. 3.
5.
6. and 7.
4.

2 Calibration Unit JBE–1 0770118
4 MBUS cable DAU–9C 0730138
5 DC cable SCB–3 0730114

PAMS RAE-2
Tuning Steps
RX Calibration (AGC + AFC)

Reference values for the received signal strength meter are program tuned.
RSSI reference signal level programming:
– Select Tuning –> RX Calibration

– Connect RF generator to service jig antenna connector at 947.067710
MHz.
– Adjust signal generator level to –55 dBm + cable attenuation.
– Press OK button
– Adjust signal generator level to –80 dBm + cable attenuation.
– Press OK button.
Service software reports:
A Table of AFC Parameters:

AFC INIT Value
AFC Slope
PSW Slope
A Table for AGC Calibration:
AGC in 3 db steps 0...57 dB
DAC and voltage reading for each gain value
– Press SAVE button
I/Q Modulator Amplitude Balance and Phase Shift Tuning

The purpose of this tuning operation is to adjust the I/Q modulator d.c.
offsets and the I/Q modulator amplitude balance and phase shift.
I/Q modulator d.c. offsets, amplitude balance and phase shift tuning:
– Select Tuning –> TX I/Q...

– Select I/Q tuning values from PC’s memory, phone’s EEPROM or
factory default values.
– Connect spectrum analyzer (with attenuator if needed) to service jig
antenna connector.
– Check that TX power level is level 10, channel is 60 and TX data type
is 1.
– Adjust spectrum analyzer centre frequency to 902 MHz, Span 200
kHz, Res BW 10 kHz, Video BW 1 kHz and Sweep time 0.5 s.

RAE-2 PAMS
CHF
–67.71 kHz +67.71 kHz
D.C. offset
tunings:
Set this value
to minimum > 30 dB > 35 dB Amplitude &
phase difference:
Set this value
to minimum
– Select the ”TX I d.c. offset” option.

– Adjust the level of centre frequency (CHF signal) to minimum by
varying D/A converter value with <– and –> buttons.
– The amplitude difference between CHF–67.7 kHz and CHF should be
>30 dB.
– Select option ”TX Q d.c. offset”.
– Adjust the level of signal CHF to minimum by varying D/A converter
value with <– and –> keys.
– Use the ”Amplitude Difference” option.
– Adjust the level of signal CHF+67.7 kHz (902.06777 MHz) to minimum
by varying D/A converter value with <– and –> keys.
– The amplitude difference between CHF+67.7 kHz and CHF–67 kHz
should be >35 dB.
– Select the ”Phase Difference” option.
– Adjust the level of signal CHF+67.7 kHz to minimum by varying D/A
converter value with <– and –> keys.
– When values are correct press SAVE button.

PAMS RAE-2
Tuning of Transmitter Power Levels

This adjustment loads the power levels of the phone transmitter into the
EEPROM. When doing this, a pulse power meter or spectrum analyzer must
be used.
Power levels programming:
– Select Tuning –> TX Power...

– Select I/Q tuning values from PC’s memory, phone’s EEPROM or
factory default values.
– Set power supply voltage 3.7 V to module jig (MJS–4). When tuning
without removing covers, supply 7.0V to JBE–1.
– Connect pulse power meter or spectrum analyzer to antenna
connector.
– Check that channel is 60.
– Adjust the power level (levels 5, 15 and 19) by clicking the + and –
buttons, and change levels with ↑ and ↓ keys.
Power level Tuning POUT/dBm

(CH 60)
5 32.7
15 13.0
19 7.0
Base –25.0
Note: If the base calculation feature is enabled, then the base level is
calculated automatically.
– Press Calculate button to calculate all other levels.
– Once all TX levels are correct, press SAVE button.

RAE-2 PAMS
Energy Management Calibration

NOTE: This can not be done in module jig MJS–4. EM calibration is
possible only when phone is completely assembled.
– Connect DAU–9C cable and BBS–5 battery to RAE–2N phone
– Connect BBS–5 to the calibration unit JBE–1 and DC cable SCB–3
between phone and calibration unit.
– Connect JBE–1 to laboratory power supply which is adjusted to 7.0V
– Start Wintesla service SW
– Select Tuning –> Energy Management Calibration
– Run calibrations separately or all at once as described in the following
list. Connect 10.5V to the calibration unit JBE–1 as prompted by service
SW.
– Select calibrations:
Battery & charger default values
– Select 1.Run Battery & charger default values

checkbox
Battery voltage
– Select 2.Battery voltage checkbox
Charger voltage
– Select 3.Charger voltage checkbox
Battery size
– Select 4.Battery size checkbox
Battery temperature
– Select 5.Battery temperature checkbox
Charge current
– Select 6.Charge current

– Select Save without confirmation, if you don’t want
confirm all the selected calibration values before saving
– Run calibrations by pressing Run button
– Set supply voltage back to 7.0 V
[] 1

RAE–2 Series
Chapter 7
Troubleshooting
Original 02/99 Copyright 1999. Nokia Mobile Phones. All Rights Reserved.
RAE–2 PAMS
Troubleshooting Technical Documentation

Number
02/99 Original

PAMS RAE–2
Technical Documentation Troubleshooting
CONTENTS –Troubleshooting
Page No
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 –5
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 –5
Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 –5
Finding faulty module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 –5
CMT Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 –7
Baseband faults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 –7
CMT is totally dead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 –8
Power doesn’t stay on or phone is jammed . . . . . . . . . . . . 7 –9
Display Information: Contact Service . . . . . . . . . . . . . . . . . . 7 – 10
The phone doesn’t register to the network... . . . . . . . . . . . 7 – 10
SIM card is out of order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 13
Audio fault . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 14
Charging fault . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 16
Flash programming doesn’t work . . . . . . . . . . . . . . . . . . . . . 7 – 17
RF Fault . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 21
Required Servicing Equipment: . . . . . . . . . . . . . . . . . . . . . . 7 – 21
Test Points on BS8 Module . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 21
Transmitter fault . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 24
Receiver fault . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 26
AFC Fault . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 27
1st IF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 28
2nd IF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 29
UHF LO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 30
VHF LO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 31
PDA Troubleshooting and Service . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 32
Required Servicing Equipment: . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 32
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 32
BS1 PDA Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 34
BS1 Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 35
Power–on malfunction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 37
Power Circuitry Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 39
Troubleshooting Diagram of the PLL clock . . . . . . . . . . . . 7 – 40
Troubleshooting Diagram of the LCD . . . . . . . . . . . . . . . . . 7 – 44
Troubleshooting Diagram of the PDA LCD Backlight . . . . 7 – 45
Troubleshooting Diagram of the PDA Keyboard . . . . . . . . 7 – 46
Troubleshooting Diagram of the serial connections . . . . . 7 – 47
Troubleshooting Diagram of the IR connection . . . . . . . . . 7 – 49
Troubleshooting Diagram of the lid switch . . . . . . . . . . . . . 7 – 50
Troubleshooting Diagram of the HF Speaker . . . . . . . . . . . 7 – 51
Troubleshooting Diagram of the Earphone . . . . . . . . . . . . . 7 – 52

RAE–2 PAMS
Troubleshooting Diagram of the Memory Card interface . 7 – 53

POST BEEP Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 54
UI Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 55
Mechanical Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 55
Keyboard Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 – 55
CMT LCD Module Troubleshooting . . . . . . . . . . . . . . . . . . . . . 7 – 56
PDA LCD Display Troubleshooting . . . . . . . . . . . . . . . . . . . . . . 7 – 59
CMT Backlighting Circuit Troubleshooting . . . . . . . . . . . . . . . . 7 – 63
PDA LCD Backlighting Circuit Troubleshooting . . . . . . . . . . . 7 – 64

PAMS RAE–2
Introduction
This document is intend to be a guide for localizing and repairing electri-
cal faults in RAE–2 device. First there is short guide for fault localizing.
Then fault repairing is divided into three troubleshooting paths, each per
any module. Needed equipments are present before any actions.
Before any service operation you must be familiar with RAE–2 product
and module level architecture. You must also be familiar with RAE–2
specified service tools like the WinTesla service software, Flashing tools
and softwares. Basic skills of using RF measurement devices are re-
quired when you are starting to follow RF troubleshooting paths.
General
When you have a faulty RAE–2 device and you are starting troubleshoot-
ing it, check first the following basics.
– Device hasn’t any mechanical damage.
– Device, especially connectors, are not dirty or moist.
– Screws are tightened as specificed.
– Battery voltage is high enough (nominal battery voltage is 3.6V).
– Current consumption is in normal area (this can be checked with Service Battery
BBS–5, if ReLink mode is disabled).
Current consumption
CMT mode (CMT current)
PDA mode (PDA current) Off (< 1.0mA) Idle (3–40mA) Call (140–320mA)
Active (200–380mA) 200–380mA 203–420mA 340mA–700mA
Standby (35–65mA) 35–45mA 38–85mA 175–365mA
Suspended (2–4mA) 2–3mA 5–43mA 142–323mA
Reset <1.0mA 3–40mA 140–320mA
Note1: CMT peak current consumption might be 5x more than is specified above.
Finding faulty module

Then you define the faulty module. Normally this isn’t difficult because
the RAE–2 device has three quite independent modules; CMT, PDA and
UI.
If you can’t conclude which is the faulty module, try to program new soft-
ware to the RAE–2. Usually when a module has a real fault also its pro-
gramming fails. If programming succeeds, it means that the CMT and

RAE–2 PAMS
PDA modules basically work and the fault might be in UI module or flex
connectors between PDA and UI module. Before CMT programming
check that PDA goes to the ReLink mode (use BBS–5 service battery).
After that you can replace the faulty module with the reference (Golden
Sample) module and be sure that module is really faulty. Alternatively
you can change the suspected faulty module to the reference RAE–2 de-
vice. After this cross–checking you should have found certainty about the
faulty module(s) and you can start to study module level problems.

PAMS RAE–2
CMT Troubleshooting
The following hints should facility finding the cause of the problem when
the CMT circuitry seems to be faulty. This troubleshooting instruction is
divided in main level to BaseBand and RF faults.
The first thing to do is carry out a through visual check of the module. En-
sure in particular that there are not any mechanical damages and sol-
dered joints are OK. If the CMT module is able to communicate with Win-
Tesla software, you can use it to find out faulty circuits from CMT module.
Selftest checks all CMT baseband Asics and memory components and
reports the result as passed or failed. If every test is passed, you can
perform different kind of calibration and tuning operations and deduce
which is the faulty circuit.
Baseband faults
At least the following measurement devices are needed for fault debug-
ging in BaseBand section:
– PC for the Wintesla with software protection key (dongle)
– RS–232 cable (DAU –9C)
– Repairing jig MJS–4
– Flashing Tools FLA–7, FPS–4 and TDF–4
– Service Battery BBS–5
– Calibration Unit JBE–1
– power supply, digital multimeter and oscilloscope

RAE–2 PAMS
CMT is totally dead
This means that CMT doesn’t take current at all when

the power switch is pressed or when the Watchdog
Disable signal (J113) is rounded. Used battery volt-
age must be at least the nominal, 3.6 V.
Phone is totally dead
YES
J111 NO Failure in VBAT line

VBAT is 3.6 V Check X160,L103
Check shortcircuits
YES
NO
J113 (PWRONx) 3.6 V Faulty circuit N110
YES
J109 (VBB) 2.8 V PWRONX level (J113) low when Check V195, R195
NO NO
N110 pin 25 (VXO) 2.8 V PWR switch is pressed or Check UI module
watchdog disable pin is (J100)
when PWR switch is pressed
grounded
or watchdog disable pin is grounded
YES
YES
Faulty circuit N110

See section: Power Doesn’t Stay On
Figure 1. Trouble Shooting Diagram for Phone is totally dead failure

PAMS RAE–2
Power doesn’t stay on or phone is jammed
Normally the power will be switched off by CCONT (N110) after 30 se-
conds, if the watchdog of the CCONT can not be served by software. The
watchdog updating can be seen by oscilloscope at pin 50 (DataselX) of
CCONT. In normal case there is a short pulse from ”1” –> 0 every 8 se-
conds.
The power off function of CCONT can be prevented by connecting a short
circuit wire from CCONT pin 29 (or J113) to ground.
Power doesn’t stay on or phone is jammed
YES
software is able to run
check UI module
CCONT watchdog is served? YES
(pin 50 pulses 1 –> 0) If power is switched off
after few seconds, check
BSI and BTEM lines
NO
connect the shortcircuit wire from J113 to ground (watchdog)
OK
J109 (VBB) 2.8V NO YES

VBAT is correct
J704 (VXO) 2.8V N110 is faulty
3.6 V
YES
N110 is faulty
YES
NO J241 sleep clock (SLCK) NO

32 kHz in J100?
check C213, R213 J240 master reset (Purx) =”1” (2.8V) square wave 32 kHz
YES
YES NO
YES
NO Faulty circuit N110 check PDA 32kHz
J706 (RFC) 13 MHz J219: 13MHz sine wave circuit and its
800 mV min clock signal: 500 mVpp min. or over loaded PURX line
connections to
NO YES CMT
check buffer V702 and Open pins or faulty circuit:

VCXO G690 D200, D210, D221, N110
Figure 2. Trouble Shooting Diagram for Power Doesn’t Stay On or phone is jammed failures

RAE–2 PAMS
Display Information: Contact Service
This fault means that software is able to run and thus the watchdog of
CCONT (N110) can be served. Selftest functions are run when power is
switched on and the software is started to execute from flash. If any of the
self–tests fails, Contact Service text will be shown on the display. Find
out which circuit is faulty using the WinTesla software (select from Testing
menu item Self Tests... and WinTesla shows which circuit are not passed
selftests).
The phone doesn’t register to the network or phone doesn’t make a call
If the phone does not register to the network or the phone does not make
a call, the reason could be either the baseband or the RF part. The phone
can be set to wanted mode by WinTesla service software and determinate
if the fault is in RF or in baseband part (RF interface measurements).
The control lines for RF part are supplied both the System Asic (MAD2;
D200) and the RFI (Cobba; N250). MAD2 handles the digital control lines
(like synthe, TxP etc.) and Cobba handles the analog control lines (like
AFC, TxC etc.).
The DSP software is constructed so that the operation states of DSP
(MAD2) can be seen in external flag (DSPXF) output pin (J222). After
power up, the DSP signals all completed functions by changing the state
of the XF pin.
1. DSP initialization done

2.Synchronization to network
done
3. Registrarition to network
done.
1 2 3
MAD2 (DSPXF)
J222

PAMS RAE–2
1
dsp
constants
init download
patch code
initialize download
initialization
done
MAD2 (DSPXF)
J222
PSW
search last PSW
OK
channel synchronization
scan starts OK
MAD2 (DSPXF)
J222
go SDCCH
send RACH imediate assigment
RACH OK OK
MAD2 (DSPXF)
J222
Figure 3. The states of DSP after power on

RAE–2 PAMS
Phone doesn’t register to the network

or
phone doesn’t make a call
YES
NO Check VCOBBA line

Analog supply voltage VCOBBA is >2.7 V) and N110 (CCONT)
at testpad J110
YES
NO Check
Analog reference voltage Vref is 1.5 V
R251
at J107
YES
Supply voltage VCP (N110 pin 32) > 4.8 V

Supply voltage VRX (N110 pin 9) > 2.7 V
Supply voltage VSYN_1 (N110 pin 15) > 2.7 V NO Fault in N110 (CCONT)
Supply voltage VSYN_2 (N110 pin 4) > 2.7 V or D200 (MAD2)
during the receiving slot
Supply voltage VTX (N110 pins 11, 20) > 2.7 V
during the transmitting slot
YES
Synthesizer lines: SEna (N690 pin 7),

SClk (N690 pin 5) NO
Fault in
SData (N690 pin 6) D200 (MAD2)
pulses 0 –> 1 during receiving slot
YES
NO
RF control lines: RxC (N690 pin 36) 0 –> 2.3 Vmax during receiving slot Fault in
AFC (R547) 0 – 1.2 V typ. during receiving slot N250 (COBBA)
YES
Fault in
Analog data signal RxIP (N690 pin 24) 0–> 1.5 V DC during receiving slot NO
N250 if DC is failed
Analog data signal RxIN (N690 pin 23) 0–> 1.5 V DC during receiving slot
Check
Used benefit signal is biased to DC and its amplitude is 50 mVpp
nominal and frequency is 13 MHz RF part if benefit signal is failed
YES
NO
Fault in
DAX signal (J254) pulses 1 –> 0 during receiving slot N250 (COBBA)
YES
Fault in
RF control lines: TxC (N690 pin 34) 0 –> 2.3 Vmax during transmit slot NO N250 if TxC is failed
TxP (N690 pin 32) 0–>1 (2.8 V) during transmit slot Check
D200 if TxP is failed
YES
NO
Analog data signals: TxIN (N690 pin 3) 0–> 0.8 V DC during transmit slot Fault in
TxIP (N690 pin 4) 0 –>0.8 V DC during transmit slot N250 (COBBA)
TxQN (N690 pin 1) 0 –>0.8 V DC during transmit slot
TxQP (N690 pin 2) 0 –>0.8 V DC during transmit slot
YES Check
Used benefit signal is biased to DC and its amplitude is 300 mVpp
nominal and frequency is 64 kHz RF part
Figure 4. The phone doesn’t register or doesn’t make a call

PAMS RAE–2
SIM card is out of order
The hardware of the SIM interface from the MAD2 (D200) to the SIM con-
nector (X150) can be tested without SIM card. When the power is
switched on and if the BSI line (X160;2) is grounded by resistor, all the
used lines (VSIM, RST, CLK, DATA) rise up to 5 V four times. Thus ”In-
sert SIM card” faults can be found without SIM card. The fault informa-
tion ”Card rejected” means that the ATR message (the first message is
always sent from card to phone) is sent from card to phone but the mes-
sage is somehow corrupted, data signal levels are wrong etc. or factory
set values (stored to the EEPROM) are not correct.
Card Rejected fault
YES
VSIM is according the specification NO faulty circuit

VSIM = 2.8 V min (with 3 V SIM card) N110 (CCONT)
VSIM = 4.5 V min (with 5 V SIM card)
YES
NO Check X302, R124,

The ATR data can be seen at pin 43 X150 and shorcircuit
(CCONT, N110) in V140, R141
YES
Insert SIM card fault
The ATR data can be seen NO Fault in
N110 (CCONT) YES
at pin 44 (CCONT, N110)
YES Voltage level < 1.5 V NO

Check
at pin 2 of D100 when
NO
Fault in R120, R122, X160
SIMIOControl line (N110 pin 39) BSI resistor is connected
is ”1”during the ATR message D200 (MAD2)
YES
YES
VSIM, DATA, RESET and CLOCK lines
YES Check
Check D200 rises up to 5 V after power on at pins
SIM card and SIM
of SIM card reader connectors
NO
YES Check X105,

VSIM(36), DATAO(43),SIMRSTO(42) and SIMCLKO(38) lines
R124, R125,
rises up to 5 V after power on at pins of N110 (CCONT) R128, V140,
R141
NO
YES
SIMPWR(30), DATAA(44), SIMRSTA(40), SIMCLK(41) and faulty circuit
SIMIOC(39) lines rises up to 2.8V after power on pins of N110 N110 (CCONT)
NO
Check again that voltage level at pin 2 (SIMCardDetX) of D110 is lower than 1.5V
If it is, change D200
Figure 5. Troubleshooting for SIM card faults

RAE–2 PAMS
Audio fault
Troubleshooting tree for Audio fault:
Uplink (microphone) and downlink (earphone) are broken
YES
Voltage at resistor R260 is 2.8 V NO Check

(without external audio devices) R259, R260
HOOKDET
YES
Voltage at resistor R261 is 2.8 V NO Check

(without external audio devices) R257, R256, R261
HEADDET
YES
NO
Frequency at J256 is 1 MHz, square Fault in
wave 2.8 Vpp N250 (Cobba)
YES
NO
Frequency at J257 is 8 kHz, square Fault in
wave 2.8 Vpp N250 (Cobba)
Uplink (microphone) is broken
YES
Check microphone, mic connections to

Voltage at pin 1 of V271 is 1.8 V NO PCB and micbias components V250...
Voltage at pin 3 of V271 is 0.3 V If OK, check that micbias control line
during a call is (V270 base) 2.8 V during a call.
If no there is fault in D200 (MAD)
YES
NO Fault in
DC voltage at capacitors C273 and
C274 is 1.4 V during a call N250 (Cobba)
YES
Check
Analog audio signal (few millivolts) at capacitors C273 NO
and C274 during a call C273, C274 and PCB
routings
YES
NO
Fault in
Digital PCM data at J255 during a call
N250 (Cobba)
Figure 6. Trouble Shooting Diagram for Audio Failure

PAMS RAE–2
Downlink (earphone) is broken
YES
NO
Digital PCM data at J258 during a call Fault in
D200 (MAD2)
YES
NO Fault in
DC voltage at capacitors C252
and C256 is 1.4 V during a call N250 (Cobba)
YES
NO Fault in
Analog audio signal (some ten millivolts) at C252 and
C256 during a call N250 (Cobba)
YES
Check earpeace connections to PDA module and

earpiece signal routing from CMT to PDA.
Figure 7. Trouble Shooting Diagram for Audio Failure

RAE–2 PAMS
Charging fault
When you are charging totally empty battery, remember that start–up
charging might take 2 minutes with ACP–9 charger and several minutes
with ACP–7 charger. During this time display is blank.
If charger is not
NMP approved type
Nothing happens when charger is connected
then the software
doesn’t start charg- YES
ing. Check
Voltage level at pin 60 of CCONT (N110) NO
X170, F170
Remove and recon- is higher than 0.4 V when charger is con-
L170 and R170
nected
nect battery and
YES
charger few times
before you start to
Check with WinTesla software if SW has NO
measure module. detected charger and measured charger
Fault in N110
(CCONT)
This check ensure if current and voltage properly.
module fault really YES
exist. Perform Energy Management

Calibration with WinTesla soft-
ware and JBE–1 set and recheck
charger detection. If still fails
Display Information: Not charging (CHAPS or CCONT) is broken.
YES
Voltage level at pin 62 of CCONT (N110) NO Check

is about 0.45 V when power is connected. X160, R121, R122,
BSI resistor value should be 33 k D100, R123 and
VSYS = 2.8V
YES
Voltage level at pin 63 of CCONT (N110) NO Check

is about 0.5 V when power is connected X160, R121, R122
BTEMP resistor value should be 47 k
YES
Perform Energy Management

Check with WinTesla software if SW is NO Calibration with WinTesla soft- NO
detected approved charger and measured ware and JBE–1 set and re- Fault in
charger current and voltage properly. check charger detection, char- N110 (CCONT)
YES ger voltage and current. OK?
YES
32 Hz square wave frequency at pin 7 of CHAPS (N120)
NO Fault in N110
YES
Charging? (CCONT) or
SW corrupted
NO
Voltage levels at pins 5 and 12 of CHAPS (N120) Check
are same as VB R131, N120
(CHAPS)
YES
NO Fault in
Voltage levels at pins 5 and 12 of CHAPS (N120)
rises when charger is connected N120 (CHAPS)
Figure 8. Trouble Shooting Diagram for Charging Failure

PAMS RAE–2
Flash programming doesn’t work
The flash programming is done over the system connector X170.

In flash programming error cases the flash prommer can give some in-
formation about a fault. The fault information messages could be:
– MCU doesn’t boot
– Serial clock line failure
– Serial data line failure
– External RAM fault
– Algorithm file or alias ID don’t find
– MCU flash Vpp error
In cases that the flash programming doesn’t succeed there is a possibility
to check short circuits between the memories and the MCU (MAD2).This
test is useful to do, when the fault information is:
MCU doesn’t boot,
Serial clock line failure or
Serial data line failure.
The test procedure is following:
1. Connect the short circuit wire between the test points J229 and ground.
2. Switch power on
3. If the voltage level in testpoint J203 is 2.8 V (”1”), the interface is OK. If
there is a short circuit, the voltage level in testpoint J203 stays low and
32kHz square wave signal can be seen in the lines which are al-
ready tested.
One must be noticed that this test can be found only short circuits, not
open pins. Also upper data lines (15:8) of flash circuit D210 are not in-
cluded to this test.

RAE–2 PAMS
CCONT pin 54 (PURX)

J240
MAD pin N3 (MCUAD0)

SRAM pin 20
selftest MAD pin B15 (FlashRP)

passed
J203
Figure 9. MAD selftest indication after power on (passed)

PAMS RAE–2
YES
If the fault information from the prommer is:

Note:
a) MCU doesn’t boot
When b) serial data line failure
Relink c) serial clock line failure
OK,
PDA display
shows text
NOT OK
”Relink en- Check ReLink PDA fault
abled”.
OK
connect the short circuit wire J113 (WDOG) to ground
OK
EEPROM (D240) pin 8 (VBB) 2.8 V NO YES

VBAT is correct
J704 (VXO) 2.8 V N110 is faulty
3.6 V
YES
NO J100 sleep clock (clk32k) NO Check 32kHz

check C213, R213, V702 ... J240 master reset (PURX) = ’1’ (2.8 V) square wave 32 kHz clock line
YES X173 pin 9
YES or
YES
C190 pin 14
NO Faulty circuit N110
J706 (RFC) 13 MHz J219: 13 MHz sine wave
800 mV min clock signal: 500 mVpp min. or overloaded PurX line
pin 14 –> J100
NO YES
check Check that following lines are correct:

VCXO G690 FCLK (MBUS) line: X170 pin 7 –> J208
FTX (fbus_tx) line: X190 pin 38 –> J207
FRX (fbus_rx) line: X190 pin 37 –> J206
check also pullup and pulldown resistors: R216, R215, R201
and series resistors R240
GND : X170 pin 1 –> GND
OK
Enable the selftest function of D200 by connecting

shortcircuit between testpoints J229 and ground
Connect an oscilloscope to testpoint J203 and switch

power on
There is a shortcircuit
NO
somewhere in memory control
Voltage level rises to ”1” after power on at testpoint J203 lines or MCU address lines or
MCU lower (7:0) data lines
YES
There could be open pins in circuits D200 (D210, D230)

If not, the PCB or D200 (D210, D230) is faulty
Figure 10. Trouble Shooting Diagram for flash programming doesn’t work (via system connector X170)

RAE–2 PAMS
YES

External RAM fault
YES
Check pins of SRAM (D220)

Check control lines of SRAM:
RAMSelX ...
YES

Algorithm file or alias ID don’t find, ID is un-
known etc.
YES
Faulty component D210 or faulty lines
YES

MCU flash Vpp error
YES
NO YES
Check regulator N201
Vpp > 4.5 V in C212 Vpp > 4.5 V in C131
YES NO
Check components C212, R211 Check C131, C132, V116, N110...
OK
Faulty component D210
Figure 11. Trouble shooting Diagram for Flash programming doesn’t work (via system connector X170)

PAMS RAE–2
RF Fault
Here is a block diagram for repairing the RF section. First select the fault
and follow the diagram.
Required Servicing Equipment:
– PC for the Wintesla

– Power supply
– Digital multimeter
– Oscilloscope
– Spectrum analyzer
– GSM MS test set
– Signal generator
– RF probe
– Phone test jig
Test Points on BS8 Module
Test points are placed on baseband for service and production trouble
shooting purposes in some supply voltage and signal lines.
Because some of baseband signal are routed totally inner layers (due to
uBGA packages) some testpoints are added for these signals.

RAE–2 PAMS
D220 Flash Chip Select
D210
MCUGenIO8
MCUGenIO15
MCUGenIO14
MCUGenIO12
MCUGenIO13
MCUGenIO10
MCUGenIO11
ExtSysRSTX
MCUAD18
MCUAD19
Flash Write Protection
McuGenIO1 MCUGenIO09
N120
DSPXF
RFClk
D200
AccRxData
McuGenIO4 ROW5LCDCD
AccTXData
SLCLK VB
COBBADAX
PCMRxData
COBBACKL
PCMTxData
COBBAAd0
GENSCLK 32kHz
PCMDCLK
PCMSLCK
CCONTINT
TestMode
COBBADa0 V5V
ResetX
PURX GENSIO PWRONx
DSPGenOut1
VBB N110
RFIRdX VCXOPwr
RFIWrX MBUS VCORE
VCOBBA
D250
VREF
The figure above describes and the next table lists the test points.

PAMS RAE–2
Test Point Name Description

J100 32kHz 32kHz clock from BS1 module
J103 CCONTINT CCONT interrupt output
J105 GENSCLK Serial data clock
J106 GENSIO Serial data
J107 VREF Reference voltage
J108 V5V Supply voltage for flash programming (Vpp) and RF circuits.
J109 VBB Supply voltage for digital circuits
J110 VCOBBA Supply voltage for analog circuits
J111 VB Battery voltage
J112 VCORE Supply voltage for MAD c07 core
J113 PWRONx CCONT’s PWRONx / Watchdog disable signal
J203 ExtSysRSTX Testpoint for fault diagnostic. If missing, check power supply, PurX line and 13 MHz clock
signal.
J204 VCXOPwr Control line for VCXO module. If low, 13 MHz clock signal for baseband is disable.
J206 AccRxData FBUS RX
J207 AccTxData FBUS TX
J208 MBUS Serial data bus max 9600b/s. Flash programming clock
J209 McuGenio4 General purpose out in MAD
J211–J218 MCUGenIO(8:15) Test point for fault diagnostic. MCUDA(15:8)
J219 RFClk 13 Mhz System clock
J220 TestMode MAD test mode select input
J221 DSPGenOut1 General purpose DSP out
J222 DSPXF Test point for fault diagnostic.
J223–J224 MCUAD(18:19) Memory address signals
J225 Flash Chip Sel Flash chip select pin
J226 Flash Write Prot Flash write protection pin
J229 ROW5LCDCD Selftest pin. If shortcircuit is made between testpoint J229 and J230, the selftest will be
executed.
J232 COBBAAd0
J233 COBBADa0
J240 PurX Reset line from CCONT to MAD. If low, the BB circuits are in reset state.
J241 SLCLK 32 kHz clock from CCONT to MAD
J243 McuGenio1 General purpose input in MAD
J250 RFIRdX COBBA paraller interface read strobe
J251 RFIWrX COBBA paraller interface write strobe
J252 ResetX COBBA master reset
J253 COBBACLK COBBA 13Mhz clock
J254 COBBADAX COBBA paraller interface data available strobe
J255 PCMTxData COBBA PCM bus transmit data
J256 PCMDCLK COBBA bus data transfer clock
J257 PCMSCLK COBBA bus 8kHz frame sync
J258 PCMRxData COBBA PCM bus receive data

RAE–2 PAMS
Transmitter fault
Troubleshooting tree for Transmitter fault:
Ref1
ref2
ref3
ref4
ref5
Figure 12. Transmitter fault TX level 5

PAMS RAE–2
ref6
ref7
ref8
ref9
ref10
ref11
ref12
Figure 13. Transmitter 1 TX level 5

RAE–2 PAMS
Receiver fault
Troubleshooting tree for Receiver fault:

PAMS RAE–2
AFC Fault
Troubleshooting tree for AFC fault:
Figure 14. AFC

RAE–2 PAMS
1st IF
Troubleshooting tree for First IF fault:
ref20
ref19
ref21
ref22
ref23
N690
ref24
Figure 15. 1st IF 71MHz

PAMS RAE–2
2nd IF
Troubleshooting tree for Second IF fault:
ref25
ref26
ref27
ref28
ref29
ref30
ref31
900X910
Figure 16. 2nd IF 13MHz

RAE–2 PAMS
UHF LO
Troubleshooting tree for UHF LO fault:
Figure 17. UHF LO

PAMS RAE–2
VHF LO
Troubleshooting tree for VHF LO fault:
2.5V
1.2V
1.8V
Figure 18. VHF LO

RAE–2 PAMS
PDA Troubleshooting and Service

The purpose of this sectionis to provide methods to find the component
that is malfunctioning in the PDA module of the RAE–2. Due to the large
integration scale of used components, it is always not possible to point
the faulty component for sure. However the flow diagram introduced here
is made to fulfill the aim as well as it is possible.
Required Servicing Equipment:

– PC for the Wintesla
– Service battery BBS–5
– Service cable DAU–9C
– Combox TDC–4
– IR transceiver module JLP–1
– digital multimeter
– oscilloscope
– frequency counter (optional)
Block Diagram
The block diagram of the BS1 PDA is described in the next figure:

PAMS RAE–2
PDALCD
BS2 Softkeys CMT
CMT LCD
Keypad
GND CMTLCD(5:0)
Flex connector X800
FLASH FLASH FLASH

BS1
LCD PWR IF(6:0) 1Mx16 1Mx16 1Mx16
VSYS D6:0
SA1:0
PWRU
control (6:0)
Charging
C(3:0), R(1:0)
LCD(10:0)
D(15:0)
MA(11:0)
VBATT
V28_3
io(3:0)
VPDA
VBACK
C(7:0), R(9:0) QWERTY
Keyboard
Backupbattery
Am486 CPU io(1:0) Audio

Earpiece
HF
HF_IF(1:0), EAR(1:0)
X32kHz out
RS_IF(2:0)
X32kHz in
MMC(3:0)
SD(15:0)
SA(21:0)
JTAG(4:0)
sio(1:0)
io(5:0)
FBUS_RXD
FBUS_TXD
MBUS
io(3:0)
x32
System connector X810

FBUS_RXD
DRAM Test– FBUS_TXD
IR transceiver pads FBUS_TXD2
1Mx16 MBUS
GND
BoBo
Connector X830
PWRKEY
C4:0,R3:0
VBATT GND
Memory Card BS8
CMT
Figure 19. BS 1 PDA block in RAE–2 product

RAE–2 PAMS
BS1 PDA Components

The following components of the BS1 have an dramatic effect to the
functionality of the module, a fault in any of these may cause the module
to appear totally ‘dead’:
– PDA power unit
– CPU
– PLL clock generation circuit
– UCS Flash chip
If the device has some functionality, then the following components, along
with the ones above, can be tested:
– DRAM chip
– CS1 and CS0 Flash chips
– Handsfree speaker circuitry
– Earpice circuitry
– IR transceiver
– keyboard
– LCD module
– Memory Card interface
– Serial connections (FBUS and system bus)

PAMS RAE–2
BS1 Troubleshooting
The highest level of the RAE–2 PDA troubleshooting diagram is shown in
the following figure. All the diagrams are made assuming that there is no
visible faults, such as short–circuits or loose pins, on the PDA.
The module check begins with connecting the supply voltage to the PDA.
If the current consumption differs a great deal from the normal limits, it is
good to proceed to the Power–On check.
During BIOS detects some error during POST it tries to beep the buzzer
for further fault analysis for the user. The POST beep codes, number of
beeps are in the Appendix A on p.54.
If the current consumption is OK, it can be tried if the wintesla service
software is able to get connection to the PDA. If the target PDA does not
respond to the pings from the host, it is good to check the Power–On pro-
cedure.
When the PDA responds to the wintesla, further peripheral tests may be
carried out. The execution order is not significant and it may be freely
changed. Along with the actual tests, wintesla offers advanced methods
for isolating the possible cause of the fault.
After all the functional tests are working, the device under test should be
re–booted, and the normal usability of the GEOS, along with the CMT
module should be checked before the PDA can be considered to be fully
functional.

RAE–2 PAMS
PDA MODULE CHECK
Connect VBatt
Current NO See Power On

consumption
OK? malfunctions
YES
Respond NO See Power On

to wintesla? malfunctions
YES
POST–code
check
PLL clock circuits

check
DRAM
check
Flash memories
check
LCD
check
Backlight
check
keyboard
check
Serial connections
check
IR
check
Lid Switch
check
Handsfree speaker
check
Earphone
check
Memory card interface

check
OS BOOT
GEOS
Usage Test
OK
Figure 20. The highest level of the PDA troubleshooting diagrams

PAMS RAE–2
Power–on malfunction
The following picture illustrates the troubleshooting diagram for Power–

On malfunctions.
Start
POST
BEEP Code NO Vsys NO
error? OK? E312
YES YES
CPU NO Memory INT_PLL NO

related error? fault OK? J400 Check
(1.4MHZ) PLL–circuit
YES YES
Memory
fault NO Check PDA
Bus activity? Reset OK ?
D/A, R/W, CS J449 power unit
J440–J449
YES
5.
Program Reboot and ping
flash from the wintesla
while in TestMode
NO
Valid boot code NO Respond to

in Flash PING from host?
YES
YES
Check
External RS Power On
OK!
Figure 21. Troubleshooting of the power–on malfunction

RAE–2 PAMS
Power Circuitry Check

The following figure illustrates how to check power circuits. The upper
part of the flowchart must be passed before the swicthable voltages (low-
er part of the flowchart) can be considered to be alright.
The LCD temperature compensation affects the LCD bias voltage values.
Because of this temperature compensation, the LCD bias voltages are
different in different temperatures, but anyway bias voltage maximum and
minimum values should differ 4 Volts from the typical value (DAC 63) in
every temperature.
Figure on the next page.

PAMS RAE–2
Check
Power CMT
check
YES
VBATT NO Board to board NO Change

OK? connector connector
OK?
YES
VPDA NO Check
OK? Input filter
YES
NO Power ASIC
VBACK
OK? fault
YES
Check
Power ASIC R461 – R463
VSYS NO R469
fault R493 – R495
OK?
NO YES
YES YES
RESET NO BATTDET YES VCOMP1 NO N496 NO Change

OK? OK? N496
OK? OK?
YES
SELECT TROUBLE RELATED BRANCH
(If you can not enable some voltage, try enable some other to be sure that CPU and bus from/to it is OK)
Select Select Select Select Select

I/O functions/ I/O functions/ I/O functions/ I/O functions/ I/O functions/
Phaser calibration Phaser calibration Signal control Signal control Signal control
in WinTesla in WinTesla in WinTesla in WinTesla in WinTesla
Select max. Enable

V17OUT Enable LCD Enable IR
LCDTEMP MMC power
OK?
NO
V17OUT NO V28_2 YES V28_3 YES
MAX voltage? V28_1
OK? OK? OK?
Hinge flex PDA LCD IR– Memory
OK? YES locig NO transceiver NO card
Power ASIC voltage OK logic power OK
YES Select voltage OK
DAC value 63 fault
NTC OK
on UI? V17OUT NO Power ASIC
typical vol– fault
YES tage?
YES
Power ASIC
fault PDA LCD
bias voltage OK
Figure 22. Power unit troubleshooting diagram

RAE–2 PAMS
Troubleshooting Diagram of the PLL clock generation circuit

The following diagram illustrates how to check PLL clock generation cir-
cuits.
PLL Circuit
check
X32_CLK NO NO Check power

Vback OK?
OK? E307 ASIC N450
J401
YES YES
XTAL OK? NO
NO 1.4MHZ 32kHz Check
OK? J434, J435 XTAL
J400
YES
PLL intermediate NO
voltage 1.2V? PLLs
J430 OK
YES
Discrete Change faulty
components on NO discrete
check
XIP PLL OK? component
flashes
YES
XIPs YES CPU

OK? fault
Figure 23. PLL clock generation circuit check

PAMS RAE–2
Troubleshooting Diagram of the DRAM
The following figure illustrates how to check DRAM. Open DRAM test in
WInTesla and select RandomTest. If test passed DRAM should be alright.
If the test is not passed, run test again and measure the data and control
lines activity.
DRAM
check
Start the DRAM

Random test
Bus activity?
NO NO
DRAM test (R/W, CAS, RAS, ADD) CPU
succesful? J446–J449 fault
J4555,J456
YES
YES
DRAM
OK DRAM or
CPU fault
Figure 24. DRAM troubleshooting diagram

RAE–2 PAMS
Troubleshooting Diagram of the Flash memories
The PDA comprises two kind of flash memories, two XIP (eXecute In
Place) flashes and one RFD flash.
The XIP flash can be checked by comparing image checksum and calcu-
lated checksum.
If you can read and write from/to RFD flash, it is likely to be OK.

PAMS RAE–2
XIP
Flashes
check
Read
image checksum
Compare
calculated checksum
and Flash fault
image checksum
NO
Flash
Are NO Bus activity ? YES status output
Checksums (AD, D, CE, WE) STSx(J451 or J452)
equal? J441, J442 OK?
J453, J454
YES YES
NO
XIP flashes
OK CPU fault
CPU
fault
RFD
flash
check
Write to
RFD flash
Read from
RFD flash Flash fault
NO
Bus activity ? Flash
write and read NO YES
(AD, D, CE, OE, WE, WP) status output
OK? J440, J442–J444 STSx (J450)
J453, J454 OK?
YES
YES
RFD flash NO
OK CPU fault
CPU
fault
Figure 25. Flash memories troubleshooting diagrams

RAE–2 PAMS
Troubleshooting Diagram of the LCD

The idea of the following diagram of the LCD Check is to make the differ-
ence whether the LCD BS2 module or the PDA BS1 is broken. The case
where the fault is in the BS2 module is beyond the scope of this docu-
ment. The fix in that case is likely the change of the whole module.
0.
Start
1.
NO 1.1
LCD ON? Disconnect UI
flex
YES
1.2 1.2.1
V28_1 NO V28_OUT
active?
OK? N450/22
N450/61
YES
1.2.2 NO
CPU fault
NO
1.3 1.3.1
V17 NO V17_OUT YES
OK? active?
E300 N450/60
5. YES
Test–patterns NO 1.3.2 Check
PDA PWRU
OK?
YES 1.5.2
CPU fault
NO
1.4 1.5
LCD OK! LCD control
UI flex OK? signals OK?
J805–J808
NO YES
1.4.1 UI flex 1.5.1 LCD

fault module fault
Figure 26. Troubleshooting of LCD signals

PAMS RAE–2
Troubleshooting Diagram of the PDA LCD Backlight

This troubleshooting diagram describe troubleshooting procedure on the
PDA LCD backlight. If PDA is OK, look then backlight troubleshooting pro-
cedure from next chapter UI TROUBLESHOOTING.
PDA LCD
Backlight
check
Check
Enable hinge flex
backlight connector
NO
NO Disconnect Backlight YES VPDA

Backlight enable signal OK?
OK? hinge (X800/24)
flex (X800/51)
OK?
YES NO YES
Backlihgt Check
OK CPU fault backlight
connections
on UI module
Figure 27. PDA LCD backlight troubleshooting

RAE–2 PAMS
Troubleshooting Diagram of the PDA Keyboard

This section describe PDA keyboard troubleshooting procedure. Possible
cause to keyboard faults are keyboard interface in CPU, broken keymat
or keydomes (UI) . Also, dirty keymat or keypad area can cause the fault.
Keyboard
check
Start the
keyboard test
Press a QWERTY/
softkey
NO Other Was
Keypress same row or YES NO Keypad
column keys pressed key or keymat
regognized? a lidkey
regognized? fault
NO YES
YES
CPU fault Check
NO All hinge flex and
keys softkey domes on UI
pressed
YES
keyboard
OK
Figure 28. Keypad troubleshooting diagram

PAMS RAE–2
Troubleshooting Diagram of the serial connections

External bus connection is alright if the device is PINGing, if not is good to
check system connector and discrete components on RX and TX lines.
External bus use RS232 data protocol, but signal voltage levels on PDA
and system connector are only 2.8V digital voltage levels. External buffer
cable needed (DLR–2) for connecting to PC.
Serial connection between CMT and PDA (FBUS) can be checked as fol-
lowing flow chart described.
FBUS
check
Open RS test Check

and run COM2 CMT side
local loop test
YES
Remove CMT
COM2 YES and connect Run COM2 COM2
local loop test RX and TX external loop external loop
OK? together on test OK?
board to board
connector
NO NO
CPU Check
fault board to board
connector
Figure 29. FBUS troubleshooting diagram

RAE–2 PAMS
External
RS
check
PiNG YES External

RS
target? OK
NO
Test RX TX
YES YES signal OK?
connections signal OK?
OK? (X810/8) (X810/9)
NO NO NO
Repair
test X810
connections X810 and
V870, V871, V870
R806 OK?
OK?
YES CPU YES
fault
Figure 30. External serial connection troubleshooting diagram

PAMS RAE–2
Troubleshooting Diagram of the IR connection

This section describe infrared connection troubleshooting procedure.
IR test need Combox TDC–4 with IR transceiver JLP–1.
Place PDA so that IR transceiver have clear light route to JLP–1 and run
the IR test. If test not passed follow flowchart to find out the fault.
IR shutdown is not in use.
Check
power ASIC
N450
YES Check
IR Repair R300,
check test R302–R304
connections R301, C301
OK? C300
NO
NO NO
IR External V28_2 YES VPDA
NO
test test connections YES OK? OK?
OK? Ok? (N300/6) (N300/1)
YES YES
IrDA COM1 TXD
OK NO local loop NO OK?
CPU fault
CPU fault
test OK? (N300/3)
YES YES
IR– RXD
transceiver NO OK?
fault (N300/4)
YES
Figure 31. IR connections troubleshooting diagram

RAE–2 PAMS
Troubleshooting Diagram of the lid switch

The idea of this diagram is to find out whether the CPU or the reed relay
circuit is not working.
If CPU and reed relay circuit on PDA is alright, then possible cause of
fault is magnet in lid.
Lid
switch
check
Open Lid switch

WinTesla OK
Signal control
YES Place magnet Select

LID OPEN? near the reed Refresh LID CLOSED?
relay in WinTesla
NO NO
LID_SWITCH_IF YES CPU YES LID_SWITCH_IF

high? fault low?
J310 J310
NO NO
R310 Reed relay

fault
OK?
NO
Change
R310
Figure 32. Lid switch troubleshooting diagram

PAMS RAE–2
Troubleshooting Diagram of the HF Speaker

The idea of this diagram is to find out whether the CPU, loudspeaker, or
power amplifier or it circuitry is not working.
Start
VAMP OK? NO Check

R855/R856 R891, R892 and
C880 – C882, C892
YES
Signal from NO
COBBA OK?
Check COBBA
J881 on CMT
YES
PA–Enabled? YES NO
Signal amplified? HFPA–Fault
N880/1
N880/5,8
NO YES
V880 NO
OK? Change V880
Speaker fault
Check
CMT CPU
Figure 33. HF–Speaker troubleshooting diagram

RAE–2 PAMS
Troubleshooting Diagram of the Earpiece

The following diagram illustrates how to check earpiece connections on
the PDA side.
Run the wintesla buzzer test. If the sound is not good then check ear-
piece connections as following flowchart illustrates.
Earpiece
connection
check
Start
buzzer
test
Buzzer YES
Buzzer OK
sound Ok?
NO
BZR_IF NO
signal OK? Check PDA CPU
J854
YES
YES V872 YES

VAMP OK? and Check
(R855/R856) V873 Earphone
OK?
NO NO
Change faulty
component
Check
R891, R892 and
C880 – C882,
C892
Figure 34. Earphone troubleshooting diagram

PAMS RAE–2
Troubleshooting Diagram of the Memory Card interface

To check the memory card interface:
Take a good memory card and place it in the memory card
connector.
Run Wintesla MMC test. If test failed then take memory
card out and run test again.
Measure memory card system voltage and bus signals
when test running.
If the signal and the card voltage are OK, then the interface is likely to be
OK. If everything is not alright check interface connections as the flow-
chart illustrate.
Memory Card
interface
check
Run
MMC
test
Test
OK?
NO
MMC_DAT, Board to NO Change

MMC_CMD and NO board and memory faulty
MMC_CLK card connectors connector
OK? OK?
YES YES
MMC_SYS YES CPU

OK? fault
NO
Enable
MMC power
in WinTesla
V28_3 NO Check
OK? Power ASIC
(X830/46) N450
YES
Check Figure 35. Memory card interface troubleshooting diagram
CMT side

RAE–2 PAMS
POST BEEP Codes
1 Memory refresh is not working.

3 Memory failure in 1st 64kB of memory.
4 Timer T1 not operational.
5 CPU test failed.
6 Gate A20 failure.
10 CMOS shutdown register failed.
13 Exhaustive low memory test failed.
14 Exhaustive extended memory test failed.
15 CMOS restart byte can’t hold data.
16 Address line test failed.
18 Interrupt controller failure.

PAMS RAE–2
UI Troubleshooting
Mechanical Troubleshooting
In mechanical failures it is better to replace a whole unit or module than try
to fix it in service. The replaceable units or modules on BS2 UI module are:
– BC2 CMT LCD module
– PDA LCD display
– UI PCB
– EL backlight panels
– Keydome sheets
Keyboard Troubleshooting
– Equipment: Resistance meter (multimeter)
– If CMT keyboard does not function when the lid is closed, it is possible
that reed relay (in the BS1 module) is damaged. If text ”Please close
cover” comes to CMT LCD when a CMT key is pressed when lid is
closed, the reed relay is probably damaged.
– Check that the dome sheets are properly placed. Improperly placed
dome sheet may cause malfunction of some key(s) or power down of
the CMT when a key is pressed.
Table 1. CMT keyboard checklist.
Non–functioning CMT keys Check components

6, 9, # R704, C707
1, 2, 3, Soft_left R705, C706
4, 5, Send, Up R705, C714
7, 8, End, Down R705, C713
0, *, Mode, Soft_right R706, C712
3, 6, Send, End, Mode R706, C708
9, Soft_left, Soft_right, Up, Down R707, C709
1, 4, 7, #, * R707, C710
2, 5, 8, 0 R708, C711

RAE–2 PAMS
CMT LCD Module Troubleshooting
Start
Display shows unexpected

characters Display does not work
What is the
problem?
Pixel line(s) missing.
No LCD glass is probably

Is display properly mechanically dam- Is display properly No
Yes
on its place? aged. Inspect and re- on its place?
place.
Yes
Can Vout voltage be Remove and put the dis-

Remove and put the dis- measured from play back to its place and
play back to its place and Yes J715 when display No test again.
test again. is on its place.It
must be 6...9 volts.
Check C705 and in

BS2_10 R709.
Is VBB (J713) OK?

Press some phone
key. Are GENSCLK Yes
(J706), GENSDIO
Yes
(J707) OK and is No
LCDRSTx (J708)
’high’?
No
Remove LCD and check

the elastomer. Clean
contact pads on PCB and
Problem might be some try again.
randomize behavior or
unclean contact pads of
CMT LCD. Clean con-
tacts and try again.
Problem might be elasto-

mer or misaligned hinge
flex. Remove and con-
nect hinge flex again.
Check elastomer.
Does display work OK? No
Yes
End
Figure 36. Flow chart for the troubleshooting of CMT LCD module.
– Testing equipment: Multimeter and oscilloscope.

PAMS RAE–2
Figure 37. GENSCLK (J706) and LCDCSx (pin 5/H700) , LCD active after
pressing a key.
Figure 38. GENSCLK (J706) and LCDCSx (pin 5/H700), LCD inactive, serial
bus used for communication between MAD and CCONT.

RAE–2 PAMS
Figure 39. GENSDIO (J707)

PAMS RAE–2
PDA LCD Display Troubleshooting
START
Display does not work Bad picture quality

What is wrong?
Large part of the

Make sure that the display is black
Yes flex of the display is or dark blue or
properly connected pixel line(s) is
to X730. Does the missing
display work now?
LCD is mechanically
No damaged. Replace
the display.
Check C740–C744 Make sure that the

Yes and in BS2_10 flex of the display is
R736–R739. Does properly connected
the display work to X730. Does the
now? Check C740–C744 display work now?
No No and in BS2_10 No Yes
R736–R739. Does
the display work
now?
Are V28_1 Yes
(J700) and
LCD_ON (J701) No
about 2.8V?
Yes
Is V17_OUT (J709)
as specified?
No
Yes Reason may be
misaligned hinge
flex. Remove and
connect flex No
Are FRM (J702), M again and test
(J703), LC (J704) display again.
and SCK (J705) as No Does the display
specified? work OK now?
Yes
Yes
Display is probably
damaged. Replace
it with a new
display.
END
Figure 40. Flowchart for troubleshooting of the PDA LCD.
– Testing equipment: Multimeter and oscilloscope.

RAE–2 PAMS
Figure 41. LCDD0 (J712)
Figure 42. LC (J704)

PAMS RAE–2
Figure 43. M (J703)
Figure 44. SCK (J705)

RAE–2 PAMS
Figure 45. FRM (J702)

PAMS RAE–2
CMT Backlighting Circuit Troubleshooting

When troubleshooting the CMT backlighting circuit, remember that back-
lighting goes off after a certain period from the last key pressing.
START
Yes Check that EL panel

contacts are OK.
Does the backlight
work now?
No
Yes Is VPDA voltage OK No

on UI board (J714)?
Is the voltage of pin No Is CMT_BL_ON No

1/N700 higher than signal voltage at
3.0 V? J710 about 2.8V?
Yes
Yes
Is driver circuit’s out– Try with a new EL No
Yes
put as specified panel. Does the
(6,7/N700)? backlight work
now? Reason may be
No Yes misaligned hinge
V702 or V703 is flex. Remove and
damaged. connect flex
Are coil L700, diode V701, again and test
Replace them.
capacitors C701–C703 and display again.
resistors R700–R702 Does the
(R703 in BS2_10) OK? backlight work
No Replace faulty com– OK now?
ponents. Does the
backlight work now? No
Yes
Yes
Inverter is damaged. No Yes
Replace with new
circuit.
END
Figure 46. Flowchart for troubleshooting of the CMT backlighting circuit.

RAE–2 PAMS
PDA LCD Backlighting Circuit Troubleshooting
For PDA backlighting troubleshooting you can use test mode and WinTes-
la SW to set the backlighting on all the time.
START
Yes Check that EL panel

contacts are OK.
Does the backlight
work now?
No
Yes Is VPDA voltage OK No

on UI board (J714)?
Is the voltage of pin No Is PDA_BL_ON No

1/N730 higher than signal voltage at
3.0 V? J711 about 2.8V?
Yes
Yes
Is driver circuit’s out– Try with a new EL No
Yes
put as specified panel. Does the
(6,7/N730)? backlight work
now? Reason may be
No Yes misaligned hinge
V731 or V732 is flex. Remove and
damaged. connect flex
Are coil L730, diode V730, again and test
Replace them.
capacitors C736–C738 and display again.
resistors R730–R732 Does the
(R733 in BS2_10) OK? backlight work
No Replace faulty com– OK now?
ponents. Does the
backlight work now? No
Yes
Yes
Inverter is damaged. No Yes
Replace with new
circuit.
END
Figure 47. Flowchart for troubleshooting of the PDA backlighting circuit.
– Testing equipment: Multimeter and oscilloscope. Note that voltage rat-

ing of the oscilloscope and probe must be over 250 V peak–to–peak.

PAMS RAE–2
Figure 48. Example of a typical EL driver output waveform,

measured between pins 6 and 7 of the driver.

RAE–2 PAMS

RAE–2 Series
Chapter 8
Service Tools
issue 2 10/2000 Copyright 1999. Nokia Mobile Phones. All Rights Reserved.
RAE–2 PAMS
Service Tools Technical Documentation

Number
02/99 Original
Issue 2 10/2000 OJuntune Updated p.1, 2, warranty
transfer guide added p.24 to
26
Page 8 – 2 issue 2
10/2000
PAMS RAE–2
Technical Documentation Service Tools
CONTENTS -Service Tools
Page No
Service Battery BBS-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–5
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–5
View of BBS-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–5
Module Jig MJS-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6
View of MJS-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6
Flash Loading Adapter FLA-7 . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
View of FLA-7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–7
Calibration Unit JBE-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
View of JBE-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
Power Junction Unit JBP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–8
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–9
View of JBP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–9
Service Car Kit HCR-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 10
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 10
View of HCR-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 10
Flash Prommer FPS-4S (Sales Pack) . . . . . . . . . . . . . . . . . . . 8 – 11
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 11
View of FPS-4S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 11
Security Box TDF-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 12
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 12
View of TDF-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 12
Service Cable SCH-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 13
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 13
View of SCH-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 13
DC Power Cable SCF-7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 14
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 14
View of SCF-7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 14
D15-D15 Cable AXS-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 15
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 15
View of AXS-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 15
JTAG Cable DKS-6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 16
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 16
View of DKS-6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 16
DC Cable SCB-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 17
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 17
View of SCB-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 17
MBUS Cable DAU-9S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 18
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 18
issue 2 10/2000 Page 8 – 3

RAE–2 PAMS
View of DAU-9S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 18
MBUS Cable DAU-9C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 19
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 19
View of DAU-9C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 19
D9-D9 Cable AXS-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 20
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 20
View of AXS-4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 20
Modular T-adapter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 21
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 21
View of Modular T-adapter . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 21
SW Security Device PKD-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 22
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 22
View of SW Security Device . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 22
Protection Key PKD-4F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 23
Product Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 23
View of PKD-4F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 23
GUIDE TO WARRANTY INFORMATION TRANSFER . . . . . . . 8 – 24
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 24
Warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 24
Vocabulary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 24
Description of a Warranty mode session . . . . . . . . . . . . . . . . . . . 8 – 24
Host sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 25
10/2000
PAMS RAE–2
Service Battery BBS-5

The service battery BBS-5 is used in place of the normal battery of the com-
municator during service to supply a controlled operating voltage from
JBE-1, JBP-8 or FLA-7.
NOTE: DO NOT connect BBS-5 straight to a voltage source . The service
battery is also required when flashing the phone.
Product Code
Service Battery BBS-5: 0770117
View of BBS-5
issue 2 10/2000 Page 8 – 5

RAE–2 PAMS
Module Jig MJS-4

The module jig MJS-4 is used for RAE-2 module testing and repairing. There
are slots for each module in the jig. The jig includes connections for charger,
power supply, external RF, audios and FBUS/MBUS. Slots for Memory card
and SIM card are also included. This equipment is powered by a laboratory
source.
Product Code
Module Jig MJS-4: 0770116
View of MJS-4
Note: The nominal supply voltage for MJS-4 is +4.0 V.

The supply voltage must not exceed +4.1 V.
10/2000
PAMS RAE–2
Flash Loading Adapter FLA-7

The flash loading adapter FLA-7 is used with the service battery BBS-5 and
service cable SCH-8. Power is supplied to the FLA-7 from the ACL-3 char-
ger. Power for the FPS-4 can be connected via the FLA-7 by SCF-7 DC pow-
er cable. The adapter is connected to the flash prommer FPS-4S by the
AXS-5 cable and to the security box TDF-4 by the XCM-1 cable.
Product Code
Flash Loading Adapter FLA-7: 0770119
View of FLA-7
issue 2 10/2000 Page 8 – 7

RAE–2 PAMS
Calibration Unit JBE-1

The calibration unit JBE-1 is used for power management calibrations of a
RAE-2 communicator. The calibration unit is also a voltage source for the
service battery BBS-5. This equipment is powered by a laboratory source.
Product Code
Calibration Unit JBE-1: 0770118
View of JBE-1
Note: The nominal supply voltages for JBE-1 are

+7,0 V for normal service activities and
10,5 V for calibrations.
The supply voltage must not exceed +12,0 V
10/2000
PAMS RAE–2
Power Junction Unit JBP-8

The power junction unit JBP-8 is used to provide power for eight BBS-5 ser-
vice batteries at the same time. This is how eight PDA memories of RAE-2
phone can be updated at the same time. This equipment is powered by a
laboratory source.
Product Code
Power Junction Unit JBP-8 0770141
View of JBP-8
Note: The nominal supply voltage for JBP-8 is +4,0 V.

The supply voltage must not exceed +4.1 V.
issue 2 10/2000 Page 8 – 9

RAE–2 PAMS
Service Car Kit HCR-2

The service car kit HCR-2 is modified from CRH-2 car kit of RAE-2 phone.
HCR-2 is used as interface between RAE-2 phone and service software
while doing RF tuning
Product Code
Service Car Kit HCR-2 0770146
View of HCR-2
10/2000
PAMS RAE–2
Flash Prommer FPS-4S (Sales Pack)

The flash prommer FPS-4S is used to update the main software of the
phone. Updating is done by first loading the new MCU software from the PC
to the flash prommer, and then loading the new SW from the prommer to the
phone. When updating more than one phone in succession, the MCU soft-
ware only needs to be loaded to the prommer once.
The sales pack includes:
- Charger ACL-3E 0680015
- Printer Cable 0730029
- D9 - D9 Cable AXS-4 0730090
- Installation software for FPS-4 8400041
Product Code
Flash Prommer FPS-4S: 0080178
View of FPS-4S
issue 2 10/2000 Page 8 – 11

RAE–2 PAMS
Security Box TDF-4

The security box TDF-4 is required for updating MCU software, and infra red
testing.
Note2: The infra red module JLP-1 is not included in the TDF-4 sales
package
Product Code
Security Box TDF-4: 0770106
View of TDF-4
10/2000
PAMS RAE–2
Service Cable SCH-8

The service cable SCH-8 is used between the phone and the modular
T-adapter or between the phone and the flash loading adapter FLA-7.
Product Code
Service Cable SCH-8: 0730137
View of SCH-8
issue 2 10/2000 Page 8 – 13

RAE–2 PAMS
DC Power Cable SCF-7

The DC power cable SCF-7 is used for connecting power from ACL-3 char-
ger via FLA-7 to FPS-4.
Product Code
DC Power Cable SCF-7: 0730141
View of SCF-7
10/2000
PAMS RAE–2
D15-D15 Cable AXS-5

The D15-D15 cable AXS-5 is used to connect two 15 pin D connectors. e.g.
between FLA-7 and FPS-4S.
Product Code
D15-D15 Cable AXS-5: 0730091
View of AXS-5
issue 2 10/2000 Page 8 – 15

RAE–2 PAMS
JTAG Cable DKS-6

The JTAG cable DKS-6 is used for connecting the JTAG tap pod to a service
battery BBS-5.
Product Code
JTAG Cable DKS-6: 0730139
View of DKS-6
10/2000
PAMS RAE–2
DC Cable SCB-3
The DC cable SCB-3 is used to connect the calibration unit JBE-1 to the char-
ger connection Vin of the RAE-2 phone when doing the charger calibration
service procedure.
Product Code
DC Cable SCB-3: 0730114
View of SCB-3
issue 2 10/2000 Page 8 – 17

RAE–2 PAMS
MBUS Cable DAU-9S

The MBUS cable DAU-9S has a modular connector, and is used with the ser-
vice car kit HCR-2 and the module jig MJS-4 with a modular T-adapter.
Product Code
MBUS Cable DAU-9S: 0730108
View of DAU-9S
10/2000
PAMS RAE–2
MBUS Cable DAU-9C

The MBUS cable DAU-9C has a RAE-2 phone system connector, and is
used between the phone and external devices (laptops, PCs).
Product Code
MBUS Cable DAU-9C: 0730138
View of DAU-9C
issue 2 10/2000 Page 8 – 19

RAE–2 PAMS
D9-D9 Cable AXS-4

The D9-D9 cable AXS-4 is used to connect two 9 pin D connectors. e.g. be-
tween PC and TDF-4 security box.
Product Code
D9 - D9 Cable AXS-4: 0770036
View of AXS-4
10/2000
PAMS RAE–2
Modular T-adapter
The modular T-adapter is a suitable branching unit to provide the needed
parallel modular connections.
Product Code
Modular T-adapter: 4626134
View of Modular T-adapter
issue 2 10/2000 Page 8 – 21

RAE–2 PAMS
SW Security Device PKD-1

SW security device is a piece of hardware enabling the use of the service
software when connected to the parallel (LPT) port of the PC. Without the
dongle present it is not possible to use the service software. Printer or any
such device can be connected to the PC through the dongle if needed.
Caution: Make sure that you have switched off the PC and the printer be-
fore making connections!
Caution: Do not connected the PKD-1 to the serial port. You may damage
your PKD-1!
Product Code
SW Security Device PKD-1: 0750018
View of SW Security Device
10/2000
PAMS RAE–2
Protection Key PKD-4F

This protection key is needed for the delivery of the PDA flash voltage. With-
out it the PDA flash circuits do not receive a programming voltage and the
update fails. The PKD-4F is connected to the JTAG connector of the BBS-5
service battery.
Caution: PKD-4F IS ALLOWED TO BE CONNECTED ONLY WHILE UP-
DATING PDA SOFTWARE!
Product Code
Protection Key PKD-4F: 0750124
View of PKD-4F
issue 2 10/2000 Page 8 – 23

RAE–2 PAMS
GUIDE TO WARRANTY INFORMATION TRANSFER
Introduction
This Technical bulletin discribes how tha warranty transfer can be made with
warranty transfer memory card 0770190.
Warnings
Warranty transwer can be made only once. After the transwer user data and
warranty information will be automatically deleted from the warranty tran-
swer memory card.
After the transwer the destination tranciever will be locked. It can be opened
in service.
Don’t format the Warranty Transwer Memory Card even if the device sug-
gests it.
Equipement needed
0770190 Warranty transfer memory card
SWAP unit
Purchasing receipt to verify that warranty of broken 9110 transceiver is valid!
Vocabulary
CMT Cellular Mobile Telephone, the phone module of the device.
host The (broken) device where the Warranty information is read from.
PDA Personal Digital Assistant, a palmtop computer module of the device.
PPM Programmable Product Memory. Contains language version specific data.
RFD Resident Flash Disk, 2 M byte flash memory area dedicated to store user data.
SIM Subscriber Identity Module.
Target The (replacement) device where the Warranty data and user data is written to.
user data All data created by user actions; Settings, profiles, logs, messages, files, etc.
Warranty data Data stored in the CMT module to provide warranty to the device.
Warranty in- All data to be transferred from the host device to the target device. Consists of War-
formation ranty data and user data.
Description of a Warranty mode session

Read through these instructions before you proceed with the Warranty in-
formation transfer.
Before transfer – things to note
First of all, you need a Warranty memory card with minimum 2 200 000 bytes
of free space. There must also be an utility named warrdos.exe in \warranty
directory in the root directory of the memory card.
10/2000
PAMS RAE–2
Check that the type labels in the two devices match; they must have same
type and model.
Keep the phone module powered on. SIM card is not needed.
Don’t format the memory card, even if asked. If you do, the memory card will
no more quilify as a Warranty memory card.
If you need to use another target device (e.g. transfer fails to complete), see
that data in the previous target device is erased!
Host sequence
Insert a Warranty memory card in the host device. Attach battery. GEOS will
boot up. Don’t format the memory card if the device suggests it. Turn on the
phone module.
Open the Warranty application. This is done by entering code *#92702689#
to the PDA side, phone application. Copy the purchasing month into war-
ranty information screen from the purchasing receipt if there is not this
information. Set the device to host. If the memory card is not a Warranty
memory card a note requesting to insert one pops up. If there is not enough
free space in the Warranty memory card a note will pop up.
Enter the Lock code. If the Lock code is not accepted a note will come up and
stay for a while. After the Lock code is accepted the Warranty state of the
device is checked. If the Warranty data is already transferred from this device
it can not be done again. A note will pop up to indicate this. If the device is
ready for the transfer the Warranty data is read from the CMT and written to
the Warranty memory card.
When the transfer is done a note will pop up. Read the instructions in the note
and press OK to dismiss it. The device will now reboot. Do not remove the
memory card yet!
After the reboot, but before GEOS is loaded, the user data residing in the
RFD is transferred to the Warranty memory card. When the RFD has been
read it is erased in the device.
There will be a notification text on the screen to indicate that the RFD has
been read and erased. Follow instructions; Remove the battery and insert
the Warranty memory card in the other device.
The host device may now be sent to repair.
issue 2 10/2000 Page 8 – 25

RAE–2 PAMS
Target sequence
Insert the Warranty memory card in the target device and attach battery. The device is booting
up but not loading GEOS yet. The RFD in the device is erased and user data in the Warranty
memory card is written to it. When the RFD has been written GEOS will boot up. Don’t format
the memory card if the device suggests it. In GEOS, verify that the user data was transferred
correctly (check the Contacts and Calendar databases). If there happens to be something wrong
with the RFD, remove battery and restart the target sequence.
Turn on the phone module. Open the Warranty application (Use code *#92702689# on tele-
phone application on the PDA side. See that the Purchasing month –field is editable and empty.
If it isn’t, use another target device. Remember to erase all data in this target device first! Set the
device to target. If the memory card is not a Warranty memory card or it does not contain War-
ranty data a note requesting to insert proper Warranty memory card pops up.
Enter the Lock code. If the Lock code is not accepted a note will come up and stay for a while.
After the Lock code is accepted the compatibility and state of the device is checked. If either the
language version (PPM) or the SIM lock state do not match with the Warranty data stored in the
Warranty memory card the transfer can not be done. Also, if the Warranty data is already trans-
ferred to this device it can not be done again. Proper notes to indicate such conditions are
popped up. If the transfer can be done the Warranty data is read from the Warranty memory card
and written to the CMT. This will take a little bit longer than reading the data in the host.
When the transfer is done the Warranty data and the RFD image files are deleted from the War-
ranty memory card. A note will pop up to indicate complete Warranty data transfer. Press OK to
dismiss the dialog. Remove battery and the Warranty memory card.
After the transfer

Insert user’s SIM card, attach the battery and turn on the phone module. Check that the device
boots up and works correctly. Open the Warranty application and check the that warranty in-
formation was transferred correctly. Give the device to the user and also ask him to check that
the device is ok to complete Warranty mode session.
[] 1
10/2000
Chapter 09
Mechanical Parts and

Disassembly
RAE–2 PAMS
Mechanical Parts Technical Documentation

Number
02/99 Original
Issue 2 10/00 OJuntune Updated pages 1, 2, 6, 7, 9 10
Page – 2 Issue 2 DRAFT

10/00
PAMS RAE–2
Technical Documentation Mechanical Parts
CONTENTS
Page No
Exploded Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –4
List of Mechanic Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5
LCD / UI Module Disassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . –6
System Module Disassembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –8
Issue 2 DRAFT Page – 3

10/00
RAE–2 PAMS
RAE–2 Exploded diagram below
2 3
5
4
6 7
8 9
10
12 11
14
13
16
15
17
18 19
21
20
24 22
26
23
28
25
30 27
32 29
33 31
34

10/00
PAMS RAE–2
List of Mechanic Parts
Item Code Description Specifications / Ratings

1 9456203 Front cover with lens
2 6190033 Screw M1,6x5 6 pcs 6x M1,6X5
3 9790326 Phone keypad
4 0201097 Phone UI PCB
5 4850063 Phone LCD
6 4850801 PDA Display ELbacklight
7 9855044 Hingle flex
8 4850049 PDA LCD
9 9780269 Coaxial cable
10 9460251 Flex cover
11 9460248 Hinge end
12A 9460249 Latch
12B 6402165 Spring
13 0660183 Antenna
14 9790330 Function keypad left
15 9790320 Function keypad right
16 9451258 IR window
17 9456209 Screen frame
18 0201096 PDA PCB
19 9367026 Keypad frame
20 9547007 Chassis
21 9790313 QWERTY keypad Note: English language keypad
22 ** CMT PCB Not available as spare part
23 5140119 HF speaker
24 5469091 System connector
25 9467029 Audio holder
26 9510421 Metal gasket
27 5140067 Earpiece
28 5140133 Microphone
29 9451261 Audio cover
30 9456156 Back cover
31 6190013 Screws 6 x M1,6x7
32 9451257 Card cover
33 9510425 Card shield
34 9470052 Plug 4 pcs

10/00
RAE–2 PAMS
LCD / UI Module Disassembly

1. Remove battery.
2. Remove cover label (A) and screw (B).
3. Gently lift off front cover starting from both sides in the bottom
end of the phone or by pulling the top end of front cover.
4. Remove phone keymat.
5. Remove 5 screws (C) and 2 washers (D).
6. Disconnect flex connectors by releasing connector clips. Con-
nectors will be opened by lifting the clip up.
7. Unplug the coaxial cable.
8. Unclip UI PCB from PDA LCD by lifting up 3 metal clips (E).
9. Remove phone LCD. Do not try to remove phone LCD without
opening the metal clip. Elastomer might be damaged.
10. Remove UI PCB, display EL backlight, PDA LCD and function
keypads.
Note 1: Latch and spring, spring flies away quite easily.
Note 2: PDA LCD is connected to screen frame with tapes. Al-
ways use new tapes when re–assembling.
11. Remove antenna. Use a knife or a small screwdriver to lift
plastic clip which blocks the antenna.
12. Re–assemble in reverse order and observe the following
points:
–Check that coaxial cable goes behind guide pin and does not
get trapped under front cover.
See further details in figure1
–Note that torque of the screws must be 10 Ncm.
–Assembly flex cover so that the mat side is inside the phone.
The correct way to assemble the coaxial cable is described in the next
page.
For details, refer to the Service Bulletin TB–022 dated 14Sept2000.

10/00
PAMS RAE–2
Figure1. Correct way to assemble the coaxial cable in the lid part.
Cable mounting route must be under BS1 (UI) PCB. Make sure that the
cable goes freely between the plastic pin and the metal frame of the LCD.
Figure 2. Coaxial cable routing in side the back cover.

Make sure that the cable is
routed between the mounting
pins of the chassis.

10/00
RAE–2 PAMS
System Module Disassembly

1. Remove battery.
2. Remove four plugs (34) and six screws (31).
3. Remove audio cover, audio holder and back cover, be careful
not to touch sensitive parts of earpiece.
4. Unplug the coaxial cable.
5. Remove CMT PCB, system connector and IR window. CMT
PCB might be very tightly connected, use necessary force to
remove it.
6. Open chassis. Disconnect flex connector by releasing connec-
tor clip. Connector will be opened by lifting the clip up.
7. Remove PDA PCB.
8. Remove chassis; at first from the lower hinge, easiest position
is to put the hinge almost 180° angle, and remove the chassis
then. Be careful not to damage coaxial cable.
9. Remove QWERTY keypad and keypad frame. Do not touch
carbon connections surfaces on QWERTY keypad.
10. Re–assemble in reverse order and observe following points:
–Re–assemble chassis first to the upper hinge and check
coaxial cable.
–Re–assemble PDA PCB and connect flex connector when
chassis is open.
–Coaxial cable must go under the hinge flex and between two
bulbs on keypad frame. See picture. (figure 4)
–Check that coaxial cable does not get trapped.
–Check that coaxial cable goes to CMT PCB between two
bulbs. See pictures.(figure 2 and figure 3)
–Notice that torque of screws must be 15 Ncm.
11. Figures 2 to 4 : The correct way to assemble coaxial cable.

10/00
PAMS RAE–2
Figure 1.
Figure 3. Correct way to assemble coaxial cable between the guiding

pins.
Figure 4. Correct way to assemble coaxial cable under hinge flex cover.

10/00
RAE–2 PAMS

10/00
Chapter 10
Schematic Diagrams of
RAE–2 PDA Phone
RAE–2 PAMS
Schematic Diagrams Technical Documentation

Number
02/99 Original
Issue 2 10/2000 OJuntune Updated p.1, 2, lists p.3 ,

new versions added p.4
Page – 2 Issue 2 10/00

After Sales RAE–2
Technical Documentation Schematic Diagra
Schematic Diagrams for 9110 HW 3500 – 5100

LIST OF CONTENTS / SCHEMATIC DIAGRAMS
Block Diagram of PDA (0.0 edit 103 v _10) . . . . . . . . . . . . . . . . A3–1
Circuit Diagram of UI FLEX IF (0.0 Edit 72) for ver_10 . . . . A3–2
Circuit Diagram of PDA QWERTY kb (0.0 Edit 23) for ver_10 A3–3
Circuit Diagram of BS1 PDA PWRU (0.0 Edit 137) for ver_10 A3–4
Circuit Diagram of BS1 PDA MEM (0.0 Edit 64) for ver_10 A3–5
Circuit Diagram of BS1 PDA MCU Block (0.0 Edit 192)
for ver_10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–6
Circuit Diagram of BS1 PDA B0B0 (0.0 Edit 55) for ver_10 . A3–7
Circuit Diagram of BS1 PDA Internal HF IF (0.0 Edit 83)
for ver_10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–8
Circuit Diagram of BS1 PDA Earphone (0.0 Edit 25)
for ver_10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–8
Circuit Diagram of BS1 PDA PLL (0.0 Edit 42) for ver_10 . . A3–9
Circuit Diagram of BS1 PDA IRDA (0.0 Edit 27) for ver_10 A3–9
Circuit Diagram of BS1 System Connector Pads (0.0 Edit 26)
for ver_10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–10
Circuit Diagram of BS1 Lid Switch (0.0 Edit 26) for ver_10 A3–10
Circuit Diagram of BS1 PDA Test Pads (0.0 Edit 39)
for ver_10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–11
Parts Placement Diagram of BS1 PDA 1/2 (0.0 ) _10 . . . . . A3–12
Parts Placement Diagram of BS1 PDA 2/2 (0.0 ) _10 . . . . . A3–12
Circuit Diagram of BS2 (0.0 Edit 116 ) _09 . . . . . . . . . . . . . . . . A3–13
Parts Placement Diagram of BS2 1/2 ) _09 . . . . . . . . . . . . . . A3–14
Parts Placement Diagram of BS2 2/2 (0.0 ) _09 . . . . . . . . . A3–14
Block Diagram of BS8 (3.0 edit 57) v _09 . . . . . . . . . . . . . . . . . . A3–15
Circuit Diagram of BS8 GSM RF (2.0 Edit 104 ) v_09 . . . . A3–16
Circuit Diagram of BS8 CMT Power (3.1 Edit 111 ) ver_09 A3–17
Circuit Diagram of BS8 System Connector (3.1 Edit 61 )
_09 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–18
Circuit Diagram of BS8 CMT CPU (3.1 Edit 124 ) _09 . . . A3–19
Circuit Diagram of BS8 Baseband Connector (3.1 Edit 50) _09 . . . . . . . . .
A3–20
Circuit Diagram of BS8 CMT Audio (3.1 Edit 79) _09 . . . A3–21
Parts Placement Diagram of BS2 _09 . . . . . . . . . . . . . . . . . . A3–22
Issue 2 10/00 Page – 3

RAE–2 PAMS
Schematic Diagrams Technical Documentation
Schematic Diagrams for 9110/9110i HWID 5200

LIST OF CONTENTS / SCHEMATIC DIAGRAMS
Block Diagram of PDA v _12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–23
Circuit Diagram of UI FLEX IF for ver_12 . . . . . . . . . . . . . . . . . A3–24
Circuit Diagram of PDA QWERTY Keyboard for ver_10 . . . . . A3–25
Circuit Diagram of BS1 PDA PWRU for ver_12 . . . . . . . . . . . . A3–26
Circuit Diagram of BS1 PDA MEM for ver_12 . . . . . . . . . . . . . . A3–27
Circuit Diagram of BS1 PDA MCU Block for ver_12 . . . . . . . . A3–28
Circuit Diagram of BS1 PDA B0B0 for ver_12 . . . . . . . . . . . . . . A3–29
Circuit Diagram of BS1 PDA Internal HF IF for ver_12 . . . . . . A3–30
Circuit Diagram of BS1 PDA Earphone for ver_12 . . . . . . . . . . A3–30
Circuit Diagram of BS1 PDA PLL for ver_12 . . . . . . . . . . . . . . . A3–31
Circuit Diagram of BS1 PDA IRDA (0.0 Edit 27 ) for ver_10 A3–31
Circuit Diagram of BS1 System Connector Pads (0.0 Edit 26 )
for ver_10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–32
Circuit Diagram of BS1 Lid Switch (0.0 Edit 26 ) for ver_10 . A3–32
Circuit Diagram of BS1 PDA Test Pads for ver_12 . . . . . . . . . . A3–33
Parts Placement Diagram of BS1 PDA 1/2 v.12 . . . . . . . . . . . . . A3–34
Parts Placement Diagram of BS1 PDA 2/2 v.12 . . . . . . . . . . . . . A3–34
Circuit Diagram of BS2 v.10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–35
Parts Placement Diagram of BS2 1/2 v.10 . . . . . . . . . . . . . . . . . A3–36
Parts Placement Diagram of BS2 2/2 v.10 . . . . . . . . . . . . . . . . . A3–36
Block Diagram of BS8 v .11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A3–37
Circuit Diagram of BS8 GSM RF v.11 . . . . . . . . . . . . . . . . . . . . . A3–38
Circuit Diagram of BS8 CMT Power v. 11 . . . . . . . . . . . . . . . . . . . A3–39
Circuit Diagram of BS8 System Connector v.11 . . . . . . . . . . . . . A3–40
Circuit Diagram of BS8 CMT CPU v.11 . . . . . . . . . . . . . . . . . . . . A3–41
Circuit Diagram of BS8 Baseband Connector v.11 . . . . . . . . . . A3–42
Circuit Diagram of BS8 CMT Audio v.11 . . . . . . . . . . . . . . . . . . . A3–43
Parts Placement Diagram of BS8 v.11 . . . . . . . . . . . . . . . . . . . . A3–44

Chapter 11
Parts Lists
RAE–2 PAMS
Parts Technical Documentation

Number
02/99 Original
Issue2 10/2000 OJuntune Updated pp.1, 2
versions added
pp. 19 to 34

PAMS RAE–2
Technical Documentation Parts
CONTENTS
Page No

GSM Module BS8 Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –4
PDA Module BS1 Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 12
UIF Module BS2 Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 17

GSM Module BS8 v.11 Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 19
PDA Module BS1 v.12 Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 27
UIF Module BS2 v.10 Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 32

RAE–2 PAMS
GSM Module BS8 Parts List

0201095 BS8 GSM CMT MODULE EDMS Issue: 6.2
Item Code Description Value/Type
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
R103 1430770 Chip resistor 4.7 k 5 % 0.063 W 0402
R104 1430796 Chip resistor 47 k 5 % 0.063 W 0402
R122 1620019 Res network 0w06 2x10k j 0404
R124 1430718 Chip resistor 47 5 % 0.063 W 0402
R125 1430718 Chip resistor 47 5 % 0.063 W 0402
R128 1430718 Chip resistor 47 5 % 0.063 W 0402
R131 1422881 Chip resistor 0.22 5 % 1 W 1218
R140 1620025 Res network 0w06 2x100k j 0404 0404
R142 1430718 Chip resistor 47 5 % 0.063 W 0402
R151 1430690 Chip jumper 0402
R152 1430690 Chip jumper 0402
R170 1825005 Chip varistor vwm14v vc30v 0805 0805
R172 1825003 Chip varistor vwm5.5v vc15.5 0805 0805
R173 1430726 Chip resistor 100 5 % 0.063 W 0402
R213 1430744 Chip resistor 470 5 % 0.063 W 0402
R215 1620029 Res network 0w06 2x4k7 j 0404 0404
R240 1620017 Res network 0w06 2x100r j 0404 0404
R252 1430740 Chip resistor 330 5 % 0.063 W 0402

PAMS RAE–2

R500 1430740 Chip resistor 330 5 % 0.063 W 0402
R501 1430700 Chip resistor 10 5 % 0.063 W 0402
R502 1430700 Chip resistor 10 5 % 0.063 W 0402
R504 1430144 Chip jumper 0603
R505 1430744 Chip resistor 470 5 % 0.063 W 0402
R506 1430144 Chip jumper 0603
R514 1430714 Chip resistor 33 5 % 0.063 W 0402
R517 1430740 Chip resistor 330 5 % 0.063 W 0402
R518 1430748 Chip resistor 680 5 % 0.063 W 0402
R520 1430744 Chip resistor 470 5 % 0.063 W 0402
R521 1430714 Chip resistor 33 5 % 0.063 W 0402
R522 1430730 Chip resistor 150 5 % 0.063 W 0402
R523 1430700 Chip resistor 10 5 % 0.063 W 0402
R526 1430734 Chip resistor 220 5 % 0.063 W 0402
R529 1430730 Chip resistor 150 5 % 0.063 W 0402
R530 1430710 Chip resistor 22 5 % 0.063 W 0402
R533 1430700 Chip resistor 10 5 % 0.063 W 0402
R535 1430710 Chip resistor 22 5 % 0.063 W 0402
R543 1430710 Chip resistor 22 5 % 0.063 W 0402
R545 1430710 Chip resistor 22 5 % 0.063 W 0402

RAE–2 PAMS

R553 1430740 Chip resistor 330 5 % 0.063 W 0402
R555 1430740 Chip resistor 330 5 % 0.063 W 0402
R556 1430752 Chip resistor 820 5 % 0.063 W 0402
R557 1430726 Chip resistor 100 5 % 0.063 W 0402
R558 1430740 Chip resistor 330 5 % 0.063 W 0402
R559 1430726 Chip resistor 100 5 % 0.063 W 0402
R560 1430690 Chip jumper 0402
R570 1430700 Chip resistor 10 5 % 0.063 W 0402
R622 1430718 Chip resistor 47 5 % 0.063 W 0402
R677 1430726 Chip resistor 100 5 % 0.063 W 0402
R690 1820031 NTC resistor 330 10 % 0.12 W 0805
R691 1430744 Chip resistor 470 5 % 0.063 W 0402
C104 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C105 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C106 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C108 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C120 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402
C121 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C127 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C128 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C129 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C130 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C131 2610005 Tantalum cap. 10 u 20 % 16 V
3.5x2.8x1.9
C132 2312403 Ceramic cap. 2.2 u 10 % 10 V 1206
C133 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C134 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C135 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C136 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C137 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C138 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C139 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C140 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C160 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C161 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C170 2604127 Tantalum cap. 1.0 u 20 % 35 V
3.5x2.8x1.9
C171 2320546 Ceramic cap. 27 p 5 % 50 V 0402

PAMS RAE–2
C172 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402

C173 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C174 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C175 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C176 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C177 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C178 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C179 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C180 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C181 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C182 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C183 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C201 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C202 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C203 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C204 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C205 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C206 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C207 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C208 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C209 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C211 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C212 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C213 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C221 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C231 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C240 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C241 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C250 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C251 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C252 2312296 Ceramic cap. Y5 V 1210
C253 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C254 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C255 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C256 2312296 Ceramic cap. Y5 V 1210
C257 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C258 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C259 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C260 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C261 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C262 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C263 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C264 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C270 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C271 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C272 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805

RAE–2 PAMS
C273 2320131 Ceramic cap. 33 n 10 % 16 V 0603

C274 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C275 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C280 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C281 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C282 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C500 2320518 Ceramic cap. 1.8 p 0.25 % 50 V 0402
C501 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C502 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C503 2320534 Ceramic cap. 8.2 p 0.25 % 50 V 0402
C504 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C505 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C506 2320514 Ceramic cap. 1.2 p 0.25 % 50 V 0402
C507 2320532 Ceramic cap. 6.8 p 0.25 % 50 V 0402
C508 2320534 Ceramic cap. 8.2 p 0.25 % 50 V 0402
C509 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C510 2320508 Ceramic cap. 1.0 p 0.25 % 50 V 0402
C511 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C512 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C513 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C514 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C515 2320540 Ceramic cap. 15 p 5 % 50 V 0402
C516 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C517 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C518 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C519 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C520 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C521 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C522 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C523 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C524 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C525 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C526 2320522 Ceramic cap. 2.7 p 0.25 % 50 V 0402
C527 2320508 Ceramic cap. 1.0 p 0.25 % 50 V 0402
C528 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C529 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C530 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C531 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402
C532 2320526 Ceramic cap. 3.9 p 0.25 % 50 V 0402
C533 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C534 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C535 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C536 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C537 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C538 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C539 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C540 2320560 Ceramic cap. 100 p 5 % 50 V 0402

PAMS RAE–2
C541 2320536 Ceramic cap. 10 p 5 % 50 V 0402

C542 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C543 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C544 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C545 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C546 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C547 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C548 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C549 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C550 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C551 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C552 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C553 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C554 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C556 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C558 2310181 Ceramic cap. 1.5 n 5 % 50 V 1206
C559 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C560 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C562 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C563 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C564 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C565 2611691 Tantalum cap. 470 u 20 % 10 V
7.3x4.3x4.1
C566 2611691 Tantalum cap. 470 u 20 % 10 V
7.3x4.3x4.1
C567 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C568 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C569 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C571 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C572 2610024 Tantalum cap. 2.2 u 20 % 16 V
3.2x1.6x1.6
C573 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C574 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C575 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C576 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C577 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C579 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C580 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C581 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C582 2320540 Ceramic cap. 15 p 5 % 50 V 0402
C583 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C584 2310248 Ceramic cap. 4.7 n 5 % 50 V 1206
C585 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C586 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C587 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C588 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402
C589 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402

RAE–2 PAMS
C590 2320534 Ceramic cap. 8.2 p 0.25 % 50 V 0402

C591 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C592 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C593 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C595 2320532 Ceramic cap. 6.8 p 0.25 % 50 V 0402
C596 2320532 Ceramic cap. 6.8 p 0.25 % 50 V 0402
C597 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C598 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C599 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C601 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C618 2320483 Ceramic cap. 68 n 10 % 16 V 0603
C627 2610023 Tantalum cap. 4.7 u 20 % 10 V
3.5x2.8x1.2
L103 3203701 Ferrite bead 33r/100mhz 0805 0805
L172 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
L173 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
L174 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
L500 3645121 Chip coil 6n 5 % Q=32/800M
0603
L501 3641626 Chip coil 220 n 2 % Q=30/100 MHz
0805
L502 3608326 Chip coil 330 n 5 % Q=33/50 MHz
1206
L503 3645121 Chip coil 6n 5 % Q=32/800M
0603
L504 3641626 Chip coil 220 n 2 % Q=30/100 MHz
0805
L505 3643039 Chip coil 220 n 5 % Q=35/100 MHz
0805
L506 3645131 Chip coil 8n 5 % Q=8/100M 0603
L507 3643039 Chip coil 220 n 5 % Q=35/100 MHz
0805
L508 3645131 Chip coil 8n 5 % Q=8/100M 0603
L509 3645175 Chip coil 12 n 5 % Q=12/100 MHz
0603
L510 3203705 Ferrite bead 0.015r 42r/100m 0805 0805
L511 3648808 Chip coil 10 % Q=50 1206
L512 3645161 Chip coil 150 n 5 % Q=14/100 MHz
0603
L513 3643025 Chip coil 56 n 5 % Q=40/200 MHz
0805
L514 3645157 Chip coil 100 n 10 % Q=12/100 MHz
0603
L515 3645157 Chip coil 100 n 10 % Q=12/100 MHz
0603
Page – 10 Issue 2 10/00

PAMS RAE–2

G601 4350143 Vco 1006–1031mhz 2.8v 10ma gsm
G690 4510217 VCTCXO 13.000 M +–5PPM 2.8V
F170 5119019 SM, fuse f 1.5a 32v 0603
Z500 4512075 Dupl 890–915/935–960mhz 15.0x8.2 15.0x8.2
Z601 4511049 Saw filter 947.5+–12.5 M 3.1x3.1
Z602 4511015 Saw filter 902.5+–12.5 M /3.8DB 4X4
Z650 4510137 Saw filter 71+–0.09 M 14.2x8.4
Z701 4510009 Cer.filt 13+–0.09mhz 7.2x3.2 7.2x3.2
V104 4113651 Trans. supr. QUAD 6 V SOT23–5
V116 4110067 Schottky diode MBR0520L 20 V 0.5 A SOD123
V140 4219904 Transistor x 2 UMX1 npn 40 V SOT363
V195 4110014 Sch. diode x 2 BAS70–07 70 V 15 mA SOT143
V270 4210100 Transistor BC848W npn 30 V SOT323
V271 4113601 Emi filter emif01–5250sc5 sot23–5 SOT23–5
V502 4551001 Dir.coupler 0.8–1ghz 3.5x1.8x1.2 3.5x1.8x1.2
V660 4210066 Transistor BFR93AW npn 12 V 35 mA
SOT323
V700 4110018 Cap. diode BB135 30 V SOD323
D100 4340523 IC, 1xbilater. switch sot3 TC7S66FU SOT353
D200 4370421 Mad2 rom4 v14 f721727 c10 UBGA176
D210 4340507 IC, flash mem. CSP48
D220 4340499 IC, SRAM STSOP32
D230 4342264 IC, EEPROM SO8S
D250 4370371 Cobba gj b09 bb asic UBGA
N110 4370391 Ccont2h dct3 bb asic TQFP64
N120 4370165 Chaps charger control SO16
N201 4340164 IC, regulator TK11247 4.75 V 180 mA SSO6
N500 4370451 Rf9117e6 pw amp 890–915mhz
N600 4370253 Crfu1a rx+tx uhf gsm v5 sot401–1 SOT401–1
N690 4370351 Summa v2 rx,tx,pll,pcontr. tqfp48 TQFP48
X150 5409089 SM, sim conn 2x3pol p2.54 1a h1. H1.5
X160 5469087 SM, battery conn 2dc+2af 12vdc 2 2A
X171 5429011 SM, coax conn f 50r 100v 0.3a 3g 3GHZ
X190 5469095 SM, conn 2x25 m p0.5 str. pcb/pc PCB/PCB
X191 5469093 SM, mmc conn 7pol p2.5 5vdc 100m 100MA
A500 9517021 RF shield large dmc01227 rae– RAE–2
A501 9517022 RF shield medium dmc01228 rae– RAE–2
A502 9517023 RF shield small dmc01229 rae– RAE–2
9854299 PCB BS8 73.70X50.90X1.3 M8 8/PA
Issue 2 10/00 Page – 11

RAE–2 PAMS
PDA Module BS1 Parts List

0201096 BS1 PDA MODULE EDMS Issue: 6.3
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
R300 1430693 Chip resistor 5.6 5 % 0.063 W 0402
R301 1430726 Chip resistor 100 5 % 0.063 W 0402
R302 1430693 Chip resistor 5.6 5 % 0.063 W 0402
R303 1430693 Chip resistor 5.6 5 % 0.063 W 0402
R304 1430693 Chip resistor 5.6 5 % 0.063 W 0402
R403 1430742 Chip resistor 390 5 % 0.063 W 0402
R428 1430690 Chip jumper 0402
R430 1430700 Chip resistor 10 5 % 0.063 W 0402
R460 1430744 Chip resistor 470 5 % 0.063 W 0402
R461 1430298 Chip resistor 1.0 M 2 % 0.063 W 0603
R802 1430726 Chip resistor 100 5 % 0.063 W 0402
R803 1430722 Chip resistor 68 5 % 0.063 W 0402
R804 1430726 Chip resistor 100 5 % 0.063 W 0402
R805 1430722 Chip resistor 68 5 % 0.063 W 0402
R808 1430714 Chip resistor 33 5 % 0.063 W 0402
R809 1430714 Chip resistor 33 5 % 0.063 W 0402
R810 1430720 Chip resistor 56 5 % 0.063 W 0402
R811 1430726 Chip resistor 100 5 % 0.063 W 0402
R812 1430722 Chip resistor 68 5 % 0.063 W 0402
R813 1430726 Chip resistor 100 5 % 0.063 W 0402
Page – 12 Issue 2 10/00

PAMS RAE–2
R814 1430722 Chip resistor 68 5 % 0.063 W 0402

R815 1430726 Chip resistor 100 5 % 0.063 W 0402
R816 1430722 Chip resistor 68 5 % 0.063 W 0402
R818 1430726 Chip resistor 100 5 % 0.063 W 0402
R819 1430722 Chip resistor 68 5 % 0.063 W 0402
R821 1430726 Chip resistor 100 5 % 0.063 W 0402
R822 1430722 Chip resistor 68 5 % 0.063 W 0402
R844 1430726 Chip resistor 100 5 % 0.063 W 0402
R845 1430726 Chip resistor 100 5 % 0.063 W 0402
R846 1430726 Chip resistor 100 5 % 0.063 W 0402
R847 1430726 Chip resistor 100 5 % 0.063 W 0402
R848 1430726 Chip resistor 100 5 % 0.063 W 0402
R849 1430726 Chip resistor 100 5 % 0.063 W 0402
R850 1430726 Chip resistor 100 5 % 0.063 W 0402
R851 1430722 Chip resistor 68 5 % 0.063 W 0402
R852 1430726 Chip resistor 100 5 % 0.063 W 0402
R853 1430722 Chip resistor 68 5 % 0.063 W 0402
R856 1430714 Chip resistor 33 5 % 0.063 W 0402
R891 1430691 Chip resistor 2.2 5 % 0.063 W 0402
R892 1430691 Chip resistor 2.2 5 % 0.063 W 0402
C300 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C301 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C302 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C401 2320481 Ceramic cap. 5R 1 u 10 % 0603
C402 2320481 Ceramic cap. 5R 1 u 10 % 0603
C403 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C404 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C405 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C406 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C407 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C408 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C409 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C410 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C411 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C413 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C414 2320604 Ceramic cap. 18 p 5 % 50 V 0402
C415 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C416 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C417 2320604 Ceramic cap. 18 p 5 % 50 V 0402
Issue 2 10/00 Page – 13

RAE–2 PAMS
C430 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402

C431 2320588 Ceramic cap. 1.5 n 5 % 50 V 0402
C432 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C433 2320576 Ceramic cap. 470 p 5 % 50 V 0402
C434 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C435 2320576 Ceramic cap. 470 p 5 % 50 V 0402
C436 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C437 2320576 Ceramic cap. 470 p 5 % 50 V 0402
C438 2320540 Ceramic cap. 15 p 5 % 50 V 0402
C439 2320572 Ceramic cap. 330 p 5 % 50 V 0402
C440 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C441 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C442 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C443 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C444 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C445 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C446 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C447 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C448 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C470 2310003 Ceramic cap. 470 n 10 % 16 V 0805
C471 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C472 2611695 Tantalum cap. 100 u 20 % 6.0x3.2x2.6
C473 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C474 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C475 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C476 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C477 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C478 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C479 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C480 2310791 Ceramic cap. 33 n 20 % 50 V 0805
C481 2611683 Tantalum cap. 33 u 10 % 35 V
7.3x4.3x2.9
C482 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C483 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C484 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C485 2320801 Ceramic cap. 100 n 20 % Y5 V 0603
C486 2611697 Tantalum cap. 33 u 20 % 10 V
6.0x3.2x2.6
C487 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C488 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C489 2320572 Ceramic cap. 330 p 5 % 50 V 0402
C490 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C491 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C492 2320801 Ceramic cap. 100 n 20 % Y5 V 0603
C493 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C494 2320588 Ceramic cap. 1.5 n 5 % 50 V 0402
Page – 14 Issue 2 10/00

PAMS RAE–2
C495 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402

C496 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C800 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C801 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C802 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C803 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C804 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C807 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C808 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C809 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C815 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C819 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C820 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C821 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C822 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C850 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C851 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C852 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C853 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C854 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C855 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C880 2611691 Tantalum cap. 470 u 20 % 10 V
7.3x4.3x4.1
C881 2611691 Tantalum cap. 470 u 20 % 10 V
7.3x4.3x4.1
C882 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C883 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C884 2320781 Ceramic cap. 47 n 20 % 16 V 0603
C885 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C886 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C887 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C888 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C889 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C890 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C891 2320572 Ceramic cap. 330 p 5 % 50 V 0402
C892 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C893 2320560 Ceramic cap. 100 p 5 % 50 V 0402
L455 3640473 Chip coil 20 % 245 mA
4.8x4.8x2.3
L456 3640517 Chip coil 20 % 0.79 A 1210
B430 4510003 Crystal 32.768 k +–20PPM 8x3.8
V872 4211202 DM MosFet p–ch 50 V 0.13 A
SOT23
V873 4200603 Transistor BCX17 pnp 45 V 500 mA
SOT23
Issue 2 10/00 Page – 15

RAE–2 PAMS

D443 4340571 Dram 1mx16 60ns 2v7 csp40 CSP40
N300 4860031 Tfdu4100 irda tx/rx>2.7v 115kbits 115KBITS
N400 4370447 IC, MCU PBGA256
N450 4370477 Phaser21 pda power asic tqfp64 TQFP64
N496 4340405 IC, comparat. 2–8v sot23LMC7215IM5 SOT23–5
N880 4340303 IC, af amp 1.1w 2.0–5.5v so LM4861 SO8S
S390 5309001 Reed relay 0.5a 08–15.5at d2.5x1 d2.5x15
X451 9510424 Backup battery holder dmd03475
X800 5460029 SM, fpc conn 51pol p0.3 90deg l. L.C
X830 5469097 SM, conn 2x25 f p0.5 str. pcb/pc PCB/PCB
9854301 PCB BS1 143.0X49.3X0.8 M8 4/PA
Page – 16 Issue 2 10/00

PAMS RAE–2
UIF Module BS2 Parts List

0201097 BS2 UI MODULE EDMS Issue: 2.13
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
R734 1820033 NTC resistor 0805
C701 2312207 Ceramic cap. 10.F n 10 % 250 V 0805
C702 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C703 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C704 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C705 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C706 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C707 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C708 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C709 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C710 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C711 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C712 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C713 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C714 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C731 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C732 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C733 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C734 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C735 2611705 Tantalum cap. 220 n 20 % 50 V
3.2x1.6x1.6
C736 2312207 Ceramic cap. 10.F n 10 % 250 V 0805
C737 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C738 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C739 2310003 Ceramic cap. 470 n 10 % 16 V 0805
C740 2604022 Tantalum cap. 0.1 u 20 % 35 V
3.2x1.6x1.6
C741 2604022 Tantalum cap. 0.1 u 20 % 35 V
3.2x1.6x1.6
C742 2604054 Tantalum cap. 0.47 u 20 % 35 V
Issue 2 10/00 Page – 17

RAE–2 PAMS
3.5x2.8x1.9
C743 2604022 Tantalum cap. 0.1 u 20 % 35 V
3.2x1.6x1.6
C744 2604022 Tantalum cap. 0.1 u 20 % 35 V
3.2x1.6x1.6
C745 2320544 Ceramic cap. 22 p 5 % 50 V 0402
L700 3640493 Chip coil 10 % 72 mA SMD
L730 3640491 Chip coil 20 % 104 mA SMD
V700 4110078 Schdix2 bas70–05w 70v 70ma SOT323
V701 4115841 Diode FAST 200 V TRR<60 ns SC59
V702 4210052 Transistor DTC114EE npn RB V EM3
V703 4211477 MosFet p–ch 16 V 16V1 A SOT143
V730 4115841 Diode FAST 200 V TRR<60 ns SC59
V731 4211477 MosFet p–ch 16 V 16V1 A SOT143
N700 4340489 Hv823 hv el lamp driver 400mw SO8
N730 4340489 Hv823 hv el lamp driver 400mw SO8
X730 5469083 SM, fpc conn 18pol p0.5 0.4a l.c
X791 9510427 Antenna contact dmd03810 RAE–2
9795052 Keydome sheet dmd03766 rae–2
9854300 PCB BS2 145.25X51.0X0.6 M4 4/PA
Page – 18 Issue 2 10/00

PAMS RAE–2
GSM Module BS8 Parts List

0201095 BS8 GSM CMT MODULE EDMS Issue: 8.2
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
R124 1430718 Chip resistor 47 5 % 0.063 W 0402
R125 1430718 Chip resistor 47 5 % 0.063 W 0402
R128 1430718 Chip resistor 47 5 % 0.063 W 0402
R131 1422881 Chip resistor 0.22 1 W 1218
R151 1430690 Chip jumper 0402
R170 1825005 Chip varistor vwm14v vc30v 0805 0805
R172 1825003 Chip varistor vwm5.5v vc15.5 0805 0805
R173 1430726 Chip resistor 100 5 % 0.063 W 0402
R213 1430744 Chip resistor 470 5 % 0.063 W 0402
R252 1430740 Chip resistor 330 5 % 0.063 W 0402
R500 1430740 Chip resistor 330 5 % 0.063 W 0402
R501 1430700 Chip resistor 10 5 % 0.063 W 0402
R502 1430700 Chip resistor 10 5 % 0.063 W 0402
Issue 2 10/00 Page – 19

RAE–2 PAMS

R504 1430144 Chip jumper 0603
R505 1430744 Chip resistor 470 5 % 0.063 W 0402
R506 1430144 Chip jumper 0603
R514 1430714 Chip resistor 33 5 % 0.063 W 0402
R517 1430740 Chip resistor 330 5 % 0.063 W 0402
R518 1430748 Chip resistor 680 5 % 0.063 W 0402
R520 1430744 Chip resistor 470 5 % 0.063 W 0402
R521 1430714 Chip resistor 33 5 % 0.063 W 0402
R522 1430730 Chip resistor 150 5 % 0.063 W 0402
R523 1430700 Chip resistor 10 5 % 0.063 W 0402
R526 1430734 Chip resistor 220 5 % 0.063 W 0402
R529 1430730 Chip resistor 150 5 % 0.063 W 0402
R530 1430710 Chip resistor 22 5 % 0.063 W 0402
R533 1430700 Chip resistor 10 5 % 0.063 W 0402
R535 1430710 Chip resistor 22 5 % 0.063 W 0402
R543 1430710 Chip resistor 22 5 % 0.063 W 0402
R545 1430710 Chip resistor 22 5 % 0.063 W 0402
R553 1430740 Chip resistor 330 5 % 0.063 W 0402
Page – 20 Issue 2 10/00

PAMS RAE–2

R555 1430740 Chip resistor 330 5 % 0.063 W 0402
R556 1430752 Chip resistor 820 5 % 0.063 W 0402
R557 1430726 Chip resistor 100 5 % 0.063 W 0402
R558 1430740 Chip resistor 330 5 % 0.063 W 0402
R559 1430726 Chip resistor 100 5 % 0.063 W 0402
R560 1430690 Chip jumper 0402
R570 1430700 Chip resistor 10 5 % 0.063 W 0402
R622 1430718 Chip resistor 47 5 % 0.063 W 0402
R677 1430726 Chip resistor 100 5 % 0.063 W 0402
R690 1820031 NTC resistor 330 10 % 0.12 W 0805
R691 1430744 Chip resistor 470 5 % 0.063 W 0402
C104 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C105 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C106 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C108 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C120 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402
C121 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C127 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C128 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C129 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C130 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C131 2610005 Tantalum cap. 10 u 20 % 16 V
3.5x2.8x1.9
C132 2312403 Ceramic cap. 2.2 u 10 % 10 V 1206
C133 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C134 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C135 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C136 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C137 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C138 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C139 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C140 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C160 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C161 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C170 2604127 Tantalum cap. 1.0 u 20 % 35 V
3.5x2.8x1.9
C171 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C172 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C173 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C174 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C175 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C176 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C177 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
Issue 2 10/00 Page – 21

RAE–2 PAMS
C178 2320620 Ceramic cap. 10 n 5 % 16 V 0402

C179 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C180 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C181 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C182 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C183 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C201 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C202 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C203 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C204 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C205 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C206 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C207 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C208 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C209 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C211 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C212 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C213 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C221 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C231 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C240 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C241 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C250 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C251 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C252 2312296 Ceramic cap. Y5 V 1210
C253 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C254 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C255 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C256 2312296 Ceramic cap. Y5 V 1210
C257 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C258 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C259 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C260 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C261 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C262 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C263 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C264 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C271 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C272 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C273 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C274 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C275 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C280 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C281 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C282 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C290 2320544 Ceramic cap. 22 p 5 % 50 V 0402
Page – 22 Issue 2 10/00

PAMS RAE–2
C291 2320544 Ceramic cap. 22 p 5 % 50 V 0402

C292 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C293 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C500 2320518 Ceramic cap. 1.8 p 0.25 % 50 V 0402
C501 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C502 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C503 2320534 Ceramic cap. 8.2 p 0.25 % 50 V 0402
C504 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C505 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C506 2320514 Ceramic cap. 1.2 p 0.25 % 50 V 0402
C508 2320534 Ceramic cap. 8.2 p 0.25 % 50 V 0402
C509 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C511 2320550 Ceramic cap. 39 p 5 % 50 V 0402
C512 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C513 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C514 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C515 2320540 Ceramic cap. 15 p 5 % 50 V 0402
C516 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C517 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C518 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C519 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C520 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C521 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C522 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C523 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C524 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C525 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C526 2320522 Ceramic cap. 2.7 p 0.25 % 50 V 0402
C527 2320508 Ceramic cap. 1.0 p 0.25 % 50 V 0402
C528 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C529 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C530 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C531 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402
C532 2320526 Ceramic cap. 3.9 p 0.25 % 50 V 0402
C533 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C534 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C535 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C536 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C537 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C538 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C539 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C540 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C541 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C542 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C543 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C544 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C545 2320546 Ceramic cap. 27 p 5 % 50 V 0402
Issue 2 10/00 Page – 23

RAE–2 PAMS
C546 2320552 Ceramic cap. 47 p 5 % 50 V 0402

C547 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C548 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C549 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C550 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C551 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C552 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C553 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C554 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C556 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C558 2310181 Ceramic cap. 1.5 n 5 % 50 V 1206
C559 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C560 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C562 2320596 Ceramic cap. 3.3 n 5 % 50 V 0402
C563 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C565 2611751 Tantalum cap. 470 u 20 % 10 V
7.3x4.3x4.1
C566 2611751 Tantalum cap. 470 u 20 % 10 V
7.3x4.3x4.1
C567 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C568 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C569 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C571 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C572 2610024 Tantalum cap. 2.2 u 20 % 16 V
3.2x1.6x1.6
C573 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C574 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C575 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C576 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C577 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C579 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C580 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C581 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C582 2320540 Ceramic cap. 15 p 5 % 50 V 0402
C583 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C584 2310248 Ceramic cap. 4.7 n 5 % 50 V 1206
C585 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C586 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C587 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C588 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402
C589 2320602 Ceramic cap. 4.7 p 0.25 % 50 V 0402
C590 2320534 Ceramic cap. 8.2 p 0.25 % 50 V 0402
C591 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C592 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C593 2320554 Ceramic cap. 56 p 5 % 50 V 0402
C595 2320532 Ceramic cap. 6.8 p 0.25 % 50 V 0402
C596 2320532 Ceramic cap. 6.8 p 0.25 % 50 V 0402
Page – 24 Issue 2 10/00

PAMS RAE–2
C597 2320536 Ceramic cap. 10 p 5 % 50 V 0402

C601 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C618 2320483 Ceramic cap. 68 n 10 % 16 V 0603
C627 2610023 Tantalum cap. 4.7 u 20 % 10 V
3.5x2.8x1.2
L172 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
L173 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
L174 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
L500 3645121 Chip coil 6. Q n 5 % Q=32/800M
0603
L501 3641626 Chip coil 220 n 2 % Q=50/250 MHz
0805
L502 3608326 Chip coil 330 n 5 % Q=33/50 MHz
1206
L503 3645121 Chip coil 6. Q n 5 % Q=32/800M
0603
L504 3641626 Chip coil 220 n 2 % Q=50/250 MHz
0805
L505 3643039 Chip coil 220 n 5 % Q=35/100 MHz
0805
L506 3645131 Chip coil 8. Q n 5 % Q=8/100M 0603
L507 3643039 Chip coil 220 n 5 % Q=35/100 MHz
0805
L508 3645131 Chip coil 8. Q n 5 % Q=8/100M 0603
L509 3645175 Chip coil 12.Q n 5 % Q=12/100 MHz
0603
L511 3648808 Chip coil 10.Q u 10 % Q=50 1206
L512 3645161 Chip coil 150 n 5 % Q=14/100 MHz
0603
L513 3643025 Chip coil 56 n 5 % Q=40/200 MHz
0805
L514 3645157 Chip coil 100 n 10 % Q=12/100 MHz
0603
L515 3645157 Chip coil 100 n 10 % Q=12/100 MHz
0603
G601 4350143 Vco 1006–1031mhz 2.8v 10ma
G690 4510217 VCTCXO 13.000 M +–5PPM 2.8V
F170 5119019 SM, fuse f 1.5a 32v 0603
Z500 4512075 Dupl 890–915/935–960mhz 15.0x8.2
Z601 4511049 Saw filter 947.5+–12.5 M 3.1x3.1
Z602 4511015 Saw filter 902.5+–12.5 M /3.8DB 4X4
Z650 4510137 Saw filter 71+–0.09 M 14.2x8.4
Issue 2 10/00 Page – 25

RAE–2 PAMS
Z701 4510009 Cer.filt 13+–0.09mhz 7.2x3.2

V116 4110067 Schottky diode MBR0520L 20 V 0.5 A SOD123
V271 4113601 Emi filter emif01–5250sc5 SOT23–5
V502 4551001 Dir.coupler 0.8–1ghz 3.5x1.8x1.2
V660 4210066 Transistor BFR93AW npn 12 V 35 mA
SOT323
V700 4110018 Cap. diode BB135 30 V SOD323
D100 4340523 IC, 1xbilater. switch sot3 TC7S66FU SOT353
D200 4370611 Mad2 rom4 v27 f731929h c07 UBGA
D220 4340499 IC, SRAM STSOP32
D230 4342264 IC, EEPROM SO8S
D250 4370371 Cobba gj b09 bb asic UBGA
N110 4370717 Ccont 2m wfd163mt64t
N120 4370165 Chaps uba2006t/n2/118 SO16
N201 4340164 IC, regulator TK11247 4.75 V 180 mA SSO6
N500 4370577 Rf9117e7/6 pw amp 890–915mhz
N600 4370253 Crfu1a rx+tx uhf gsm v5 SOT401–1
N690 4370351 Summa v2 wfd167ct48t TQFP48
X150 5409089 SM, sim conn 2x3pol p2.54 1a H1.5
X160 5469087 SM, battery conn 2dc+2af 12vdc 2 2A
X190 5469095 SM, conn 2x25 m p0.5 str. PCB/PCB
X191 5469093 SM, mmc conn 7pol p2.5 5vdc 100MA
A500 9517021 RF shield large dmc01227 RAE–2
A501 9517022 RF shield medium dmc01228 RAE–2
A502 9517023 RF shield small dmc01229 RAE–2
9854299 PCB BS8 73.70X50.90X1.3 M8 8/PA
Page – 26 Issue 2 10/00

PAMS RAE–2
PDA Module BS1 Parts List

0201096 BS1 PDA MODULE EDMS Issue: 7.2
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
R300 1430693 Chip resistor 5.6 5 % 0.063 W 0402
R301 1430726 Chip resistor 100 5 % 0.063 W 0402
R302 1430693 Chip resistor 5.6 5 % 0.063 W 0402
R303 1430693 Chip resistor 5.6 5 % 0.063 W 0402
R304 1430693 Chip resistor 5.6 5 % 0.063 W 0402
R403 1430742 Chip resistor 390 5 % 0.063 W 0402
R428 1430690 Chip jumper 0402
R430 1430700 Chip resistor 10 5 % 0.063 W 0402
R460 1430744 Chip resistor 470 5 % 0.063 W 0402
R802 1430726 Chip resistor 100 5 % 0.063 W 0402
R803 1430722 Chip resistor 68 5 % 0.063 W 0402
R804 1430726 Chip resistor 100 5 % 0.063 W 0402
R805 1430722 Chip resistor 68 5 % 0.063 W 0402
R808 1430714 Chip resistor 33 5 % 0.063 W 0402
R809 1430714 Chip resistor 33 5 % 0.063 W 0402
R810 1430720 Chip resistor 56 5 % 0.063 W 0402
R811 1430726 Chip resistor 100 5 % 0.063 W 0402
R812 1430722 Chip resistor 68 5 % 0.063 W 0402
R813 1430726 Chip resistor 100 5 % 0.063 W 0402
Issue 2 10/00 Page – 27

RAE–2 PAMS
R814 1430722 Chip resistor 68 5 % 0.063 W 0402

R815 1430726 Chip resistor 100 5 % 0.063 W 0402
R816 1430722 Chip resistor 68 5 % 0.063 W 0402
R818 1430726 Chip resistor 100 5 % 0.063 W 0402
R819 1430722 Chip resistor 68 5 % 0.063 W 0402
R821 1430726 Chip resistor 100 5 % 0.063 W 0402
R822 1430722 Chip resistor 68 5 % 0.063 W 0402
R844 1430726 Chip resistor 100 5 % 0.063 W 0402
R845 1430726 Chip resistor 100 5 % 0.063 W 0402
R846 1430726 Chip resistor 100 5 % 0.063 W 0402
R847 1430726 Chip resistor 100 5 % 0.063 W 0402
R848 1430726 Chip resistor 100 5 % 0.063 W 0402
R849 1430726 Chip resistor 100 5 % 0.063 W 0402
R850 1430726 Chip resistor 100 5 % 0.063 W 0402
R851 1430722 Chip resistor 68 5 % 0.063 W 0402
R852 1430726 Chip resistor 100 5 % 0.063 W 0402
R853 1430722 Chip resistor 68 5 % 0.063 W 0402
R856 1430714 Chip resistor 33 5 % 0.063 W 0402
R891 1430691 Chip resistor 2.2 5 % 0.063 W 0402
R892 1430691 Chip resistor 2.2 5 % 0.063 W 0402
C300 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C301 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C302 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C401 2320481 Ceramic cap. 5R 1 u 10 % 0603
C402 2320481 Ceramic cap. 5R 1 u 10 % 0603
C403 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C404 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C405 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C406 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C407 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C408 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C409 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C410 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C411 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C413 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C414 2320604 Ceramic cap. 18 p 5 % 50 V 0402
C415 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C416 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C417 2320604 Ceramic cap. 18 p 5 % 50 V 0402
Page – 28 Issue 2 10/00

PAMS RAE–2
C430 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402

C431 2320588 Ceramic cap. 1.5 n 5 % 50 V 0402
C432 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C433 2320576 Ceramic cap. 470 p 5 % 50 V 0402
C434 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C435 2320576 Ceramic cap. 470 p 5 % 50 V 0402
C436 2320548 Ceramic cap. 33 p 5 % 50 V 0402
C437 2320576 Ceramic cap. 470 p 5 % 50 V 0402
C438 2320540 Ceramic cap. 15 p 5 % 50 V 0402
C439 2320572 Ceramic cap. 330 p 5 % 50 V 0402
C440 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C441 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C442 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C443 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C444 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C445 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C446 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C447 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C448 2320620 Ceramic cap. 10 n 5 % 16 V 0402
C470 2310003 Ceramic cap. 470 n 10 % 16 V 0805
C471 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C473 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C474 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C475 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C476 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C477 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C478 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C479 2320618 Ceramic cap. 4.7 n 5 % 25 V 0402
C480 2310791 Ceramic cap. 33 n 20 % 50 V 0805
C481 2611683 Tantalum cap. 33 u 10 % 35 V
7.3x4.3x2.9
C482 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C483 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C484 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C485 2320801 Ceramic cap. Y5 V 0603
C486 2611697 Tantalum cap. 33 u 20 % 10 V
6.0x3.2x2.6
C487 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C488 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C489 2320572 Ceramic cap. 330 p 5 % 50 V 0402
C490 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C491 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C492 2320801 Ceramic cap. Y5 V 0603
C493 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C494 2320588 Ceramic cap. 1.5 n 5 % 50 V 0402
Issue 2 10/00 Page – 29

RAE–2 PAMS
C495 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402

C496 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C800 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C801 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C802 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C803 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C804 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C807 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C808 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C809 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C815 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C819 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C820 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C821 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C822 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C850 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C851 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C852 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C853 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C854 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C855 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C880 2611751 Tantalum cap. 470 u 20 % 10 V
7.3x4.3x4.1
C881 2611751 Tantalum cap. 470 u 20 % 10 V
7.3x4.3x4.1
C882 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C883 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C884 2320781 Ceramic cap. 47 n 20 % 16 V 0603
C885 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C886 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C887 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C888 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C889 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C890 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C891 2320572 Ceramic cap. 330 p 5 % 50 V 0402
C892 2320805 Ceramic cap. 100 n 10 % 10 V 0402
C893 2320560 Ceramic cap. 100 p 5 % 50 V 0402
L455 3640473 Chip coil 33.2 u 20 % 245 mA
4.8x4.8x2.3
L456 3640517 Chip coil 2. 0 u 20 % 0.79 A 1210
B430 4510003 Crystal 32.768 k +–20PPM 8x3.8
V872 4211233 MosFet SOT23
V873 4200603 Transistor BCX17 pnp 45 V 500 mA
SOT23
Page – 30 Issue 2 10/00

PAMS RAE–2

D443 4340571 Dram 1mx16 60ns 2v7 CSP40
N300 4860031 Tfdu4100 irda tx/rx>2.7v 115kbits 115KBITS
N400 4370447 IC, MCU PBGA256
N450 4370477 Phaser21 l6906v21 TQFP64
N496 4340405 IC, comparat. 2–8v sot23LMC7215IM5 SOT23–5
N880 4340303 IC, af amp 1.1w 2.0–5.5v LM4861 SO8S
S390 5309005 SM, reed switch 175v 0.5a 08–14AT
X451 9510424 Backup battery holder dmd03475
X830 5469097 SM, conn 2x25 f p0.5 str. PCB/PCB
9854301 PCB BS1 143.0X49.3X0.8 M8 4/PA
Issue 2 10/00 Page – 31

RAE–2 PAMS
UIF Module BS2 Parts List

0201097 BS2 UI MODULE EDMS Issue: 2.18
––––––––––––––––––––––––––––––––––––––––––––––––––––––––
R736 1430690 Chip jumper 0402
R737 1430690 Chip jumper 0402
R738 1430690 Chip jumper 0402
R739 1430690 Chip jumper 0402
R740 1430690 Chip jumper 0402
R702 1430744 Chip resistor 470 5 % 0.063 W 0402
R703 1430744 Chip resistor 470 5 % 0.063 W 0402
R732 1430744 Chip resistor 470 5 % 0.063 W 0402
R733 1430744 Chip resistor 470 5 % 0.063 W 0402
R734 1820033 NTC resistor 0805
C739 2310003 Ceramic cap. 470 n 10 % 16 V 0805
C701 2312207 Ceramic cap. 10.F n 10 % 250 V 0805
C736 2312207 Ceramic cap. 10.F n 10 % 250 V 0805
C702 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C737 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805
C731 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C732 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C733 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C734 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C745 2320544 Ceramic cap. 22 p 5 % 50 V 0402
C706 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C707 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C708 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C709 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C710 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C711 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C712 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C713 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C714 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C703 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C738 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
Page – 32 Issue 2 10/00

PAMS RAE–2
C704 2320779 Ceramic cap. 100 n 10 % 16 V 0603

C705 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C742 2604054 Tantalum cap. 0.47 u 20 % 35 V
3.5x2.8x1.9
C740 2604079 Tantalum cap. 0.22 u 20 % 35 V
3.2x1.6x1.6
C741 2604079 Tantalum cap. 0.22 u 20 % 35 V
3.2x1.6x1.6
C743 2604079 Tantalum cap. 0.22 u 20 % 35 V
3.2x1.6x1.6
C744 2604079 Tantalum cap. 0.22 u 20 % 35 V
3.2x1.6x1.6
C735 2611705 Tantalum cap. 220 n 20 % 50 V
3.2x1.6x1.6
L730 3640491 Chip coil 470 u 20 % 104 mA SMD
L700 3640493 Chip coil 10 % 72 mA SMD
V700 4110078 Schdix2 bas70–05w 70v 70ma sot323 SOT323
V701 4115841 Diode FAST 200 V TRR<60 ns
SC59
V730 4115841 Diode FAST 200 V TRR<60 ns
SC59
V703 4211477 MosFet MIC94031 p–ch 16 V 16V1 A
SOT143
V731 4211477 MosFet MIC94031 p–ch 16 V 16V1 A
SOT143
N700 4340489 Hv823 hv el lamp driver 400mw so8 SO8
N730 4340489 Hv823 hv el lamp driver 400mw so8 SO8
X730 5469083 SM, fpc conn 18pol p0.5 0.4a l.c
X791 9510427 Antenna contact dmd03810 rae–2 RAE–2
9854300 PCB BS2 145.25X51.0X0.6 M4 4/PA
9854300 PC board BS2 145.25x51.0x0.6 m4
4/pa
Issue 2 10/00 Page – 33

RAE–2 PAMS
Page – 34 Issue 2 10/00

RAE–2 series PDA Phone
Chapter 12
QUICK GUIDE
Draft 01/99 Copyright 1999 Nokia Mobile Phones. All rights reserved.
RAE–2 series PDA Phone PAMS
Quick Guide Technical Documentation
Contents
Page No
Quick guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 4
First start–up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 4
To charge the battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 5
To use the battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 6
Note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 6
Communicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 7
Display elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 7
To connect to a PC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 7
To use the PC Suite with an infrared connection . . . . . 12 – 8
To use the PC Suite with a cable connection . . . . . . . . . 12 – 8
To use the Nokia Communicator Server . . . . . . . . . . . . . 12 – 8
Contacts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 8
To make a contact card . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 8
Telephone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 9
To make a call . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 9
To answer a call . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 9
Flight profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 9
Fax . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 10
To send a fax . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 10
To read a received fax . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 10
Short messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 10
To send a message . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 11
To read a received message . . . . . . . . . . . . . . . . . . . . . . 12 – 11
Internet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 11
Mail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 11
World Wide Web . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 12
To open a WWW page . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 12
Telnet and Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 12
To connect to a Telnet or Terminal host . . . . . . . . . . . . . 12 – 13
Text Web . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 13
To fetch information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 13
Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 13
To write a note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 13
To read documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 13
To send a document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 14
Calendar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 14
Monthly schedule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 14
Weekly schedule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 14
Daily schedule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 14
To book events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 14
Page 12 – 2 Draft 01/99

PAMS RAE–2 series PDA Phone
Technical Documentation Quick Guide
System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 14
To lock the communicator . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 15
To unlock the communicator . . . . . . . . . . . . . . . . . . . . . . . 12 – 15
Infrared activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 15
Digital camera connectivity . . . . . . . . . . . . . . . . . . . . . . . . 12 – 15
To use the communicator as a fax modem . . . . . . . . . . 12 – 15
To remove data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 16
Calculator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 16
Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 16
Alarm clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 16
Composer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 16
Voice recorder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 16
Help . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 17
Phone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 17
To make and answer calls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 17
Keys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 17
Accessories guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 18
Memory Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 18
Headset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 18
Advanced Desktop Stand . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 18
Convenient data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 19
Advanced HF Car Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 19
Handset Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 19
To connect to a computer . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 20
Ignition sense . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 20
Car radio mute . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 21
Antenna motor control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 21
Carrying Case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 21
Other available accessories . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 21
Nokia Wireless Data Forum . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 21
Care and maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 23
Important safety information . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 – 23
Draft 01/99 Page 12 – 3

Quick guide
FOR YOUR SAFETY Read these simple guidelines. Breaking the rules
may be dangerous or illegal. Further detailed information is given in this
manual.
ROAD SAFETY COMES FIRST Do not use the communicator while
driving; park the vehicle first.
INTERFERENCE All wireless phones may get interference which could
affect performance.
SWITCH OFF IN HOSPITALS Follow any regulations or rules. Switch off
the phone near medical equipment.
SWITCH OFF IN AIRCRAFT Wireless phones can cause interference.
Using them on aircraft is illegal.
SWITCH OFF WHEN REFUELLING Do not use the phone at a refuelling
point. Do not use near fuel or chemicals.
SWITCH OFF NEAR BLASTING Do not use the phone where blasting is
in progress. Observe restrictions, and follow any regulations or rules.
USE SENSIBLY Use only in the normal position (to ear). Do not touch the
antenna unnecessarily.
USE QUALIFIED SERVICE Only qualified service personnel must install
or repair equipment.
ACCESSORIES AND BATTERIES Use only approved accessories and
batteries. Do not connect incompatible products.
MAKING CALLS VIA THE PHONE Close the cover and ensure the phone
is switched on and in service. Enter the phone number, including the
area code, then press ”CALL”. To end a call press ”END CALL”. To
answer a call press ”CALL” .
EMERGENCY CALLS Close the device cover. Ensure the phone is
switched on and in service. Hold for several seconds, to clear the display.
Enter the emergency number, then press ”CALL”. Give your location. Do
not end the call until told to do so.
MAKE BACKUP COPIES Remember to make backup copies of all
important data.
CONNECTING TO OTHER DEVICES When connecting to any other
device, read its user’s guide for detailed safety instructions. Do not
connect incompatible products.
INFRARED PRECAUTIONS Do not point the IR beam at anyone’s eye or
allow it to interfere with other IR devices.
First start–up
The Nokia 9110 Communicator can send and receive calls and messages
only when the phone is switched on, has a valid SIM card fitted, and is
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located in the service area of the cellular network. However, emergency

calls to the international emergency number 112 may be made without
the SIM card in some networks. Please, check with your network
operator.
1 Close the device cover and ensure that the phone is switched off. If it is
on, press the power on/off switch
2 If the battery is connected to the communicator, remove the battery:
press the catch at the top of the battery and lift the battery away from the
battery cavity.
3 Slide the SIM card into the SIM card slot: ensure that the gold contacts
of the SIM card are facing down and that the bevelled corner of the card
is on the right.
Note: Keep all miniature SIM cards out of small children’s reach.
4 When the SIM card is properly inserted into the SIM card slot, the
bevelled corner will remain visible.
5 When you are sure that the SIM card is correctly installed, replace the
battery. If there is little or no charge in the battery, it is recommended that
you connect the communicator to the charger and start charging the
battery before continuing with the start–up procedure. See below.
6 Open the cover of the communicator. You will see a welcome screen
while the communicator performs a self–test.
7 After the self–test is complete, you will see a list of countries on the
display, see figure 4. Scroll the dark grey selection frame using the arrow
keys on the keyboard over the name of your home country. Press
thebutton on the right side of the display next to the command OK.
Thecapital of your home country will be set as your home city.
8 Write the current date in the input field using the format dd.mm.yy,
forexample 22.03.98, and press OK.
Note: The battery does not fit into place if the SIMcard is not correctly
installed. Do not force the battery into place! Check that you have
inserted the SIM card into the slot as described above. If the SIM card is
incorrectly installed, remove it by pulling it away from the slot, and insert it
again.
9 Write the current time using the 24–hour format hh:mm, for example
17:25, and press OK.
10 Enter your contact information in the user data card and press OK.
The first start–up is now completed.
After the start–up, do not immediately remove the battery, as the battery
charges the backup battery that supplies power to the real–time clock of
the communicator.
To charge the battery

1 Connect the charger lead to the bottom of the communicator:
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2 Connect the charger to the proper voltage AC wall outlet. While

charging is in progress, the battery charge indicator scrolls on the display.
To use the battery

Use only batteries approved by the communicator manufacturer and
recharge the battery only with the chargers approved by the
manufacturer. With approved chargers and accessories, the battery can
be charged continuously. The battery need not be fully discharged before
recharging. When a charger is not in use, disconnect it from the power
source. Do not leave the battery connected to a charger for longer than a
week, since excessive charging may shorten its life. If left unused, a fully
charged battery will discharge itself over time.
The battery can be charged and discharged hundreds of times, but it will
eventually wear out. When the operating time (talk–time and standby
time) is noticeably shorter than normal, it is time to buy a new battery.
Note: The communicator can be used normally during charging.
Temperature extremes will affect the ability of your battery to charge:
allow it to cool down or warm up first.
Battery operation time is affected by the following: whether both the
phone and the communicator interface are on, radio signal strength,
various phone settings, the use of the backlight, and the length of the
screen blanker period.
It is recommended always to keep a charged battery in the communicator.
Keeping the battery charged maximises the lifetime of the backup battery
supplying power to the real–time clock of the communicator. In case the
backup battery is drained, it will be automatically charged the next time a
charged battery is reconnected to the communicator.
Always close the device cover before removing the battery. Closing the
cover will save all data.
Note
Use the battery only for its intended purpose.
Never use any charger or battery that is damaged or worn out.
Do not short–circuit the battery. Accidental short–circuiting can occur
when a metallic object (coin, clip or pen) causes direct connection of the +
and –terminals of the battery (metal strips on the back of the battery), for
example, when you carry a spare battery in your pocket or purse.
Short–circuiting the terminals may damage the battery or the connecting
object.
Leaving the battery in hot or cold places, such as in a closed car in
summer or winter conditions, will reduce the capacity and lifetime of the
battery. Always try to keep the battery between +15°C (+59°F) and +25°C
(+77°F). A communicator with a hot or cold battery may temporarily not
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work, even when the battery is fully charged. The performance of

Lithium–ion batteries is particularly limited in temperatures below 0°C
(+32°F).
Do not dispose of batteries in a fire!
Batteries must be recycled or disposed of properly. Batteries must not be
disposed of in municipal waste.
Communicator
To switch on the communicator interface:
The communicator interface is switched on simply by opening the cover.
The application that was active the last time the communicator was used
is shown on the display. When you close the cover, the communicator
interface switches off its display and saves all data.
Display elements
The indicators show the currently active application along with other
information about the communicator, e.g. battery level and field strength.
The commands always relate to the four command buttons. In this guide,
commands are in bold and items shown on the display are in italics.
When this guide instructs you, for example, to press Open, it means that
you must press the command button next to the command name.
When the search field is shown at the bottom of the display, you can
search for items by using the keyboard to enter text into the search field.
The scroll bar indicates that there are more items than currently shown on
the display. You can scroll the display with the arrow keys of the
keyboard.
When the selection frame is shown, one item is always automatically
selected. You can select other items by moving the selection frame with
the arrow keys on the keyboard. After the correct item has been selected,
press the command you wish to apply to the item, for example, Open or
Delete.
The Menu button opens up a new set of options.
The Zoom button magnifies the view on the display.
The Backlight button switches the display light on and off.
To connect to a PC
You can connect your communicator to a suitable PC using the PC Suite

for Nokia 9110 Communicator program, which is found on the CD–ROM
supplied in the communicator sales package. With the PC Suite you can
synchronise contact information, calendar and To–do list between your
communicator and a PC, transfer and backup data, and install various
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software on your communicator. You need only to connect your

communicator to a PC; everything else is done on the PC.
The PC Suite for Nokia 9110 Communicator works with Windows 95/98
and NT.
When connecting your communicator to a PC, you can also select
whether to use the infrared or the cable connection.
To use the PC Suite with an infrared connection

1 Make sure that the infrared port of the communicator faces the infrared
port of the PC.
2 Start the PC Suite software on the PC.
3 Start the Infrared activation application on your communicator and
press Activate. See ”System” in this guide.
To use the PC Suite with a cable connection

1 Connect the 9–pin end of the RS–232 cable to the COM port of the PC,
and the other end to the connector at the bottom of the communicator.
2 Start the PC Suite software on the PC.
To use the Nokia Communicator Server

If you have Windows 3.11 or Apple Macintosh, use the Nokia
Communicator Server program for PC connectivity. The Windows version
of the Nokia Communicator Server is found on the diskette in the sales
package, and the Apple Macintosh version is on the CD–ROM.
With the Nokia Communicator Server you can use the communicator
applications that require PC connectivity. You need to connect your
communicator to a PC and start the necessary application on the
communicator.
Contacts
Contacts is used to manage contact information, such as phone numbers
and addresses. The entries in the Contacts directory are called contact
cards. The Contacts directory is used by all the communications
applications: Telephone, Fax, SMS and Mail.
To make a contact card

1 Press the Contacts application button on the communicator keyboard to
start the Contacts application.
2 Press New and write the necessary contact information in the empty
contact card.
Caution: Beware of viruses. Only install on the communicator software
you have obtained from sources that offer adequate protection against
viruses.
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Telephone
Telephone is used for making and receiving voice calls and adjusting the
Telephone settings. To start the Telephone application, press the Tel.
application button on the keyboard.
To make a call
There are two ways to make a call via the communicator interface:
1 Select a contact from the Telephone directory by moving the selection
frame over the contact’s name, and press Call. If the contact has only
one phone number, the number is called directly.
If the contact has several phone numbers, a pop–up box opens, listing
the phone numbers. Choose a number from the list and press Call. Or,
2 Type the phone number in the search field with the keyboard and press
Call.
To answer a call
You can answer a call either via the phone or the communicator interface.
When you receive a phone call, a note appears on the communicator
interface display. Press Answer to answer the call, or press End call to
dismiss the call.
Flight profile
The flight profile prevents you from accidentally turning on your phone in
an aircraft.
To set on the flight profile
1 Press Settings in the Telephone main view.
2 Choose Profiles and press Change.
3 Select Profile in use, press Change and scroll to Flight.
4 Press OK.
With the flight profile active, you may read previously downloaded mail,
write mail, notes, short messages, faxes, or update your calendar. Once
you have left the aircraft, you can turn off the flight profile by pressing Exit
profile, turn on the phone by pressing , and your short messages, faxes
and mail will be sent automatically.
When the communicator is in the flight profile, emergency calls must be
made from the phone:
1 Press ”CALL” . The phone display will read FLIGHT PROFILE ACTIVE.
2 While the FLIGHT PROFILE ACTIVE text is visible (for approximately
five seconds) you can dial the emergency number, e.g. 112.
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3 Press ”CALL”.
IMPORTANT! Never use the phone when in an aircraft. If the aircraft
personnel allow use of the communicator interface, you MUST activate
the flight profile. The flight profile will allow use of the communicator
interface only and will prevent use of the phone.
Be aware that all communications applications, Telephone, Fax, SMS,
Mail, and Internet, require use of the phone.
Fax
To start the Fax application, press the Fax button on the communicator
keyboard.
Fax sending and receiving requires that fax calls are supported by the
network you are using and that the fax service is activated for your SIM
card. Contact your service provider for details.
To send a fax
1 Press Write fax, and write the fax message.
2 Press Recipient. The Fax directory opens.
3 Select a recipient and press Select.
4 Press Send to send the fax.
To read a received fax

Faxes are received automatically. There are two ways to read a received
fax:
1 When you receive a note informing you that you have received a fax,
press View. To read the fax later, press Cancel. Or,
2 Select the Received faxes folder and press Open. Select the fax and
press Open.
Use the arrow keys to scroll up and down in the fax, or from left to right.
To zoom the fax, press View, and then Zoom in or Zoom out.
Short messages
To start the short message application, press the SMS application button
on the communicator keyboard.
Short message sending and receiving requires that the Short Message
Service (SMS) is available in the network you are using and activated for
your SIM card. Contact your service provider for details.
Before you can send short messages, you must store the SMS message
centre number in the settings of the SMS application.
To send a message
1 Press Write message and write the message contents.
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2 Press Recipient. The SMS directory opens.

3 Select a recipient and press Select.
4 Press Send. If your message is longer than 160 characters, it will be
sent as several short messages, provided that your network support this
function.
To read a received message
There are two ways to read a received message:

1 When you receive a note informing you that you have received a
message, press View. To read the message later, press Cancel. Or,
2 Select the Received messages folder and press Open. Select the
message and press Open.
Internet
Internet access requires that you have obtained an Internet access point
from an Internet service provider and configured the Internet settings
correctly.
Contact your dealer for details.
1 Press the Internet application button on the communicator keyboard.
2 Choose one of the applications and press Select.
The connection to the Internet is established via a data call. This requires
that data calls are supported by the network you are using and that this
service is activated for your SIM card. Contact your service provider for
details.
To close the connection to the Internet, press Hang up in the Internet
main view.
Mail
Mail enables you to send and receive e–mail. Mail is compliant with the
Internet standards SMTP, IMAP4, POP3, MIME1 and MIME2. Before
using this application, be sure to enter the correct Mail settings.
1 Press Write mail and write the message.
2 Press Recipient. The Mail directory opens.
3 Select a contact and press Select. If the contact has several mail
addresses, choose the address from the pop–up box and press Select.
4 The Mail envelope opens. In the Mail envelope you can check the
sending information and add more recipients by pressing Add recipient
or entering addresses manually.
5 Press Send.
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The Mail application main view shows the Remote mailbox. The Remote
mailbox, which receives all your mail, is located on a remote computer.
1 Move the selection frame over the Remote mailbox and press Connect.
The communicator connects to the Remote mailbox. All mail in the
Remote mailbox is shown. An unread message has the icon next to it.
2 Fetch all new mail by pressing Fetch new, or fetch individual messages
by selecting the message(s) and pressing Fetch selected. All fetched
mail goes to the Received mail folder of the communicator.
3 When you have fetched all the mail messages you want, disconnect
from the Remote mailbox by pressing Hang up. If you have pressed
Fetch new, the connection is closed automatically after the message(s)
have been fetched.
4 In the Mail application, select the Received mail folder and press Open.
Select a message and press Open again to read the message.
World Wide Web

The World Wide Web application is a hypertext–based system for finding
and accessing resources on the Internet.
To open a WWW page

1 Write the URL address of the page in the input field, or select a page
from the Bookmarks list in the WWW main view.
2 Press Go.
3 A data call is made to your Internet access point. After a connection has
been established, the chosen page is fetched from the Internet and
shown on the display.
4 To follow a hyperlink, select it with the selection frame and press Go.
Telnet and Terminal

These applications allow your communicator to connect to computers, like
mainframe computers, which provide terminal services through the
Internet (Telnet) or direct dial–in terminal services (Terminal). Both
applications emulate the VT100 terminal.
To connect to a Telnet or Terminal host

1 Press Define and define a new host (press New) or edit an existing host
(press Edit).
2 Return to the Telnet or Terminal main view, select a host and press
Connect.
3 To send or copy texts between the host computer and the
communicator, press Send text or Capture text. The command is
available once you have connected to the host.
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4 To disconnect from the host, press Hang up.

Note: The Telnet application canbe installed to your communicator from
the CD–ROM included in the sales package.
Text Web
With Text Web you can fetch information from the Internet, using SMS.
You can also access services provided by your network operator and
Nokia. To define services
1 Press Settings in the Text Web main view.
2 Press New to open an empty service information card, or press Edit to
modify an existing service. Enter the title of the service, the server
number, and the service number.
To fetch information
1 In the Text Web main view, scroll to one of the service access points
that you have defined and press Select.
2 Enter in the space provided a keyword that describes the type of
information you are looking for.
3 Press Send. When you receive a reply from the service provider, the
TTML browser opens up. Press the arrow keys on the keyboard to move
from one hotspot to another. To follow a hyperlink, press Fetch.
Notes
Notes is used for writing texts and managing documents stored on the
communicator.
To start the Notes application, press the Notes application button on the
communicator keyboard.
To write a note
1 Press Write note in the Notes main view. If you want to format the text,
press Style.
To read documents
1 Select a folder in the Notes main view and press Open.

2 Select a document and press Open.
To send a document
1 Press Send in the opened Note editor.

2 Select one of the following options and press Select:
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To send as a fax, select Send as fax.

To send as a short message, select Send as short message.
To send as e–mail, select Send as mail.
Calendar
To start the Calendar application, press the Calendar application button
onthe communicator keyboard.
Monthly schedule
The monthly schedule is the main view of the Calendar. The daily events
list on
the right side of the display can be edited in the daily schedule.
Weekly schedule
To check the weekly schedule, press Week in the monthly or the daily
schedule. The weekly schedule shows the timetable of the selected week.
Daily schedule
The daily schedule is opened by pressing Day in the monthly or the
weekly schedule. The daily schedule displays the events of the selected
day. To adjust the details of the selected event, press Details.
To book events
You can book events in other communicators or remote calendar servers.
1 Select an event in the daily schedule or write a new one.
2 Press Calendar booking in the Details view and select whether to make
the booking as a request or a reservation.
3 Press Send as SMS to open the SMS directory where you can select
the recipient.
4 Press Send to send the booking.
System
To start one of the System applications, press the System application
button on the communicator keyboard, choose an application and press
Select.
The Install/Remove software and Backup/restore applications require the
use of either the PC Suite or the Nokia Communicator Server.
To lock the communicator

1 Open the Security application and press Lock system.
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2 Enter your lock code if prompted.
To unlock the communicator
1 Enter your lock code in the input field.

2 Press OK.
Infrared activation
If you want to use the PC Suite for Nokia 9110 Communicator program
with the infrared connection, or you want to transfer data between your
communicator and another device via the infrared, you need to use the
Infrared activation application.
1 Make sure that the infrared port of the communicator faces the infrared
port of the PC or another device.
2 Open the Infrared activation application on the communicator.
3 Press Activate. When transferring data between two communicators,
the activation is done in the communicator that receives the data.
4 To end the infrared connection, press Disable.
Digital camera connectivity
The Digital camera connectivity application enables you to transfer

images between your communicator and a digital still camera via the
infrared connection.
1 Open the Digital camera connectivity application and press Image list.
2 If you are transferring files from your communicator, select the UPF
image(s) you want to transfer.
3 Make sure that the infrared port of your communicator faces the
infrared port of the other device.
4 Press Send to send the images from your communicator, or press
Receive to start transferring images from the other device to your
communicator.
To use the communicator as a fax modem
The communicator can be used as a PC fax modem. This requires that

data calls are supported by the network you are using and that this
service is activated for your SIM card. Contact your service provider for
details.
1 Open the Fax modem application, press Settings and select either the
cable or the infrared connection. The infrared connection is
recommended.
2 Connect the communicator to a PC.
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3 Press Activate. When the communicator is used as a fax modem, the

communications features of the communicator are disabled.
4 To stop using the communicator as a fax modem, press Disable.
To remove data
Data removal enables you to remove data from your communicator.
1 Select one of the data groups: All device data, Calendar data,
Documents,
Contacts and speed dials.
2 Press Delete. Before the data is removed, you will be prompted for your
lock code.
To start one of the Extras applications, press the button on the
communicator keyboard, select an application and press Select.
Calculator
Write the calculation in the input field with the keyboard. Press Enter to
perform the calculation. Previous calculations are shown in the list above
the input field.
Clock
The Clock shows the time and date in your home city and country, as well
as in several other cities and countries throughout the world. The time
and date can be adjusted in the Clock settings.
Alarm clock
Press Alarm clock in the Clock main view to access the Alarm clock.
Adjust the alarm time with the + and – command buttons. The alarm
occurs according to the home city time.
Composer
The Composer enables you to compose ringing tones. To compose a new
tune, press Compose.
Voice recorder
The Voice recorder enables you to record telephone conversations,
voicememos, and other sounds. You can also listen to your recordings
and other sound files.
Help
Press the button on the communicator keyboard. The application icon in
the indicator area on the left side of the screen remains in view, reminding
you of the application from where the help was launched.
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To view the help topics for the current application, press Application
help.
To view general help topics about the communicator, press General help.
To exit the help, press Close.
Phone
To switch on the phone:
1 Close the device cover, if it is open.
2 Press and hold to switch on the phone.
If you are prompted for the PIN code, enter your PIN code, which is
provided with the SIM card, and press the key directly under the OK text
on the display.
As with any other radio transmitting device, do not touch the antenna
unnecessarily when the phone is switched on. Contact with the antenna
affects call quality and may cause the phone to operate at a higher power
level than otherwise needed.
To make and answer calls

To make a call, enter the area code and the phone number, then press
”CALL”.
To answer a call press ”CALL”.
To end a call press ”END CALL” .
IMPORTANT! Do not switch on the phone when wireless phone use is
prohibited or when it may cause interference or danger.
Keys
— Switches between different operating environments.
— Scroll through menus, submenus or settings. When a call is active,
pressing the scroll keys adjusts the volume level. 0 ... 9
— The number and alphabet keys. To call your voice mailbox, press and
hold 1.
— Used for special purposes in certain functions.
— The function of these two selection keys depends on the text
shown on the bottom line of the display.
Accessories guide
The Nokia 9110 Communicator accessories have been designed for
different users and communication needs. For availability of approved
accessories, please check with your local dealer.
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Use only batteries, chargers, and accessories approved by the

communicator manufacturer for use with this particular communicator
model. The use of any other types will invalidate any approval or warranty
applying to the communicator, and may be dangerous.
Memory Card
The postage stamp sized Memory Card DTS–4 provides 4 MB of
removable storage for the communicator. The memory card increases the
available memory for data and software applications. For further
information, see chapter 3 “Special features” of the User’s manual.
Note: Keep all memory cards out of small children’s reach.
Headset
The Headset HDC–8 offers private headset audio operation. With the
remote control button, which is located in the microphone part of the
headset, you can answer and later end a call. The Headset connects
directly to the connector at the bottom of the communicator.
Advanced Desktop Stand

The Advanced Desktop Stand DCH–7 enables charging of the battery of
the communicator, when the communicator is placed in the stand. The
advanced feature of the stand is the easy connection to a computer. The
stand also has a slot for charging batteries separately from the
communicator. This is especially convenient for charging spare batteries.
To charge the communicator battery with the desktop stand
1 Plug the Performance Travel Charger into the stand.
2 Place the communicator in the desktop stand connector end first.
3 Plug the charger into a mains outlet.
To charge a spare battery with the desktop stand
1 Plug the Performance Travel Charger into the stand.
2 Insert the battery in the second slot the golden contacts first. Push the
battery slightly backwards. Ensure that the battery clicks into place.
3 Plug the charger into a mains outlet. Check that the light on the left of
the stand is on. The red light indicates charging, and the steady green
light indicates that the battery is charged.
4 To remove the battery, reverse the procedure
To connect to a PC
With the communicator in the desktop stand, you can connect to a PC
with the RS–232 adapter cable DLR–2.
1 Plug the adapter cable into the connector at the back of the stand.
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2 Connect the other end of the cable to the PC.

Note: If the communicator is also charging in the desk stand, the charging
of the spare battery will cease until the battery in the communicator is
charged.
3 Place the communicator in the desktop stand connector end first.
4 Start the PC Suite for Nokia 9110 Communicator program on the PC.
Convenient data transfer
You can also synchronise data between your communicator and a

compatible PC organiser program with a single press of the button. For
more information, see the CD–ROM supplied with your communicator.
Advanced HF Car Kit
The Advanced HF Car Kit CARK–99 offers a convenient handsfree option

for using the communicator in a car. The handsfree microphone and
external loudspeaker are always on when the communicator is placed in
its holder. The car kit provides automatic charging and improves network
reception for your communicator. Battery charging times are the same as
those for the charger ACP–9. The car kit must be installed by qualified
personnel.
Note: For correct button operation, the ACP–9 charger must be
connected to the desk stand.
To place the communicator in the holder
1 Close the cover of the communicator and turn the antenna to a closed
position.
2 Insert the communicator in the car kit holder connector end first.
3 In order not to damage the connectors, press the communicator down
gently until it is securely held by the locking mechanism.
Handset Kit
The optional Handset Kit HSU–1 is a simple handset with no display or

keypad.
It provides privacy for conversation and comfort in a car environment
while your communicator is connected to the car antenna for better
reception. However, do not use the handset while in motion.
To make a call with the car kit
1 Key in the desired number with the keypad.
2 Press . For a private call, lift the handset if installed.
To answer a call
1 Press , or, if the handset is installed, lift the handset.
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If you set the Automatic answer feature on in the Car profile, the
communicator will automatically answer incoming calls.
To switch from handset operation to handsfree operation
Press the Options selection key once and replace the handset in 5
seconds. If you do not press Options before replacing the handset, the
call will end.
To end a call
Press , or, if the handset is installed, replace the handset.
To connect to a computer
With the RS–232 adapter cable DLR–2 you can connect the
communicator to a laptop computer for fax modem use or PC Suite
operation.
1 Close the device cover and place the communicator securely in the car
kit holder.
2 Insert the plug of the adapter cable into the connector of the holder. The
connector is located at the bottom of the holder.
Note: The car kit does not include an antenna. Ask your car kit dealer for
available products.
3 Connect the other end of the adapter cable to the serial port of the
computer.
4 Start the necessary application on the computer. If you want to use the
communicator as a fax modem, see chapter 11 “System: Fax modem” of
the User’s manual.
Ignition sense
The ignition sense feature allows the communicator to be automatically
switched on or off whenever the communicator is in the charging holder
and the vehicle is started or switched off. This prevents the communicator
from draining the car battery, if accidentally left on for a long period of
time. If installed, the ignition sense is always available. If you do not wish
to enable the ignition sense, ask your dealer to leave it uninstalled.
When the ignition is turned off, the message Phone will power off, if not
used is displayed. The communicator will be switched off after 15
seconds unless
you press any key or take the communicator from the holder during this
time.
Car radio mute

This feature mutes the car radio during a phone call, if supported by the
car radio. Ask your dealer to connect the car radio mute during
installation.
Page 12 – 20 Draft 01/99

Antenna motor control
If installed, this feature will activate the electrical motor of the mobile
antenna.
Carrying Case
The convenient Carrying Case (CBR–4, CBR–5) protects the

communicator wherever you are, and keeps the communicator always at
hand.
Mobile Charger
The Mobile Charger LCH–9 provides an easy and convenient way to
charge the communicator battery in a vehicle. It is suitable for most
vehicles’ cigarette lighter sockets. Plug the lead from the Mobile Charger
into the bottom connector of the communicator.
Other available accessories

High Power Battery BLN–3 — This is a powerful slim Lithium–ion battery.
It provides the same capacity as the battery supplied with your
communicator.
RS–232 Adapter Cable DLR–2 — The cable provides a convenient way
to connect your communicator to a PC or to a printer.
Performance Travel Charger ACP–9 — This charger is a lightweight and
durable charger which functions over most mains voltages. The
communicator can be operated normally during charging. Charging time
is typically 2 hours, depending on how drained the battery is. To charge
the communicator, connect the charger lead to the bottom connector of
the communicator and plug the charger into the mains.
Upgrade HF Car Kit — The Upgrade HF Car Kit CARK–102 offers an
easy way to upgrade from CARK–74, which is compatible with the Nokia
8100 series and 3110 wireless phones, to CARK–99.
Note: Use only the ACP–9 and LCH–9 chargers with the communicator.
Nokia Wireless Data Forum

Nokia Wireless Data Forum is a Web service that offers support for Nokia
9110 Communicator and the other Nokia wireless data products. The
Web site contains documents, drivers, manuals, information on
compatibility issues, etc.
The main focus of the Nokia Wireless Data Forum is to serve corporate
and business users. It provides, for example, references on solutions that
have been tailored for the needs of corporate customers.
Nokia Wireless Data Forum can be found at http://www.forum.nokia.com
Club Nokia Careline
Draft 01/99 Page 12 – 21

You can contact the Club Nokia Careline for help or questions you may
have concerning the Nokia 9110 Communicator and its functions.
Free support is available for Club Nokia Careline members for the first
membership year. Before calling you have to register with Club Nokia
either via http://club.nokia.com or by sending the invitation, enclosed in
the sales package, to Club Nokia.
Please look up the serial number of your device before calling. It is visible
when you remove the battery from the device. The serial number appears
on the sticker attached to the device. You also need to note your Club
Nokia membership number.
The Club Nokia Careline is available Monday–Friday 9.00 am to 5.30 pm
local time, but not on national holidays. Nokia reserves the right to
changes without prior notice.
Club Nokia Careline phone numbers
Non–members
If you are not a member of Club Nokia you can call +32 70 23 30 58
(charge for international call) from all the countries mentioned above.
You can also contact your dealer when you have a problem.
Country Careline number Tariff per minute
Austria 0660 7420 charge for local call
Belgium 0800 965 76 charge for local call
Czech Republic +3270 233 412 charge for international call
Denmark 8001 5437 charge for local call
Finland 0800 113 275 charge for local call
France 0800 901 953 charge for local call
Germany 0130 860 355 charge for local call
Greece 00800 3222 303 charge for local call
Hungary 00800 125 31 charge for local call
Ireland 1800 55 32 75 charge for local call
Italy 1677 803 06 charge for local call
Luxembourg 0800 2493 charge for local call
Netherlands 0602 248 98 charge for local call
Norway 8001 1475 charge for local call
Poland 00800 3211 231 charge for local call
Portugal 0505 329 930 charge for local call
Spain 9009 832 30 charge for local call
Sweden 0207 945 38 charge for local call
Page 12 – 22 Draft 01/99

Switzerland 0800 557 749 charge for local call

Turkey 00800 3291 303 charge for local call
UK 0800 898 397 charge for local call
Care and maintenance

Your Nokia 9110 Communicator is a product of superior design and
craftsmanship and should be treated with care. The suggestions below
will help you fulfil any warranty obligations and enjoy this product for
many years.
When using your communicator, battery, charger OR any accessory:
Keep it and all its parts and accessories out of small children’s reach.
Keep it dry. Precipitation, humidity and liquids contain minerals that will
corrode electronic circuits.
Do not use or store it in dusty, dirty areas. Its moving parts can be
damaged.
Do not store it in hot areas. High temperatures can shorten the life of
electronic devices, damage batteries, and warp or melt certain plastics.
Do not store it in cold areas. When the communicator warms up (to its
normal temperature), moisture can form inside the communicator, which
may damage electronic circuit boards.
Do not attempt to open it. Non–expert handling of the device may
damage it. Do not drop, knock or shake it. Rough handling can break
internal circuit boards.
Do not use harsh chemicals, cleaning solvents, or strong detergents to
clean it. Wipe it with a soft cloth slightly dampened in a mild
soap–and–water solution.
Do not paint it. Paint can clog the device’s moving parts and prevent
proper operation.
Use only the supplied or an approved replacement antenna.
Unauthorised antennas, modifications or attachments could damage the
communicator and may violate regulations governing radio devices.
If the communicator, battery, charger or any accessory is not working
properly, take it to your nearest qualified service facility. The personnel
there will assist you and, if necessary, arrange for service.
Important safety information

Traffic safety
Do not use a communicator while driving a vehicle. If using a
communicator, park the vehicle first. Always secure the communicator in
its holder; do not place the communicator on the passenger seat or where
it can break loose in a collision or sudden stop.
Draft 01/99 Page 12 – 23

The use of an alert device to operate a vehicle’s lights or horn on public

roads is not permitted.
Remember, road safety always comes first!
Operating environment
Remember to follow any special regulations in force in any area and
alwaysswitch off the phone of your communicator whenever it is forbidden
to use it, or when it may cause interference or danger.
When connecting the communicator or any accessory to another device,
read its user’s guide for detailed safety instructions. Do not connect
incompatible products.
As with other mobile radio transmitting equipment, users are advised that
for the satisfactory operation of the equipment and for the safety of
personnel, it is recommended that the equipment should only be used in
the normal operating position (held to your ear with the antenna pointing
over your shoulder).
Do not point the infrared beam at anyone’s eye or allow it to interfere with
other infrared devices.
Electronic devices
Most modern electronic equipment is shielded from radio frequency (RF)
signals. However, certain electronic equipment may not be shielded
against the RF signals from your communicator.
Pacemakers: Pacemaker manufacturers recommend that a minimum
separation of 20 cm (6 inches) be maintained between a handheld
wireless phone and a pacemaker to avoid potential interference with the
pacemaker.
These recommendations are consistent with the independent research by
and recommendations of Wireless Technology Research. Persons with
pacemakers:
Should always keep the communicator more than 20 cm (6 inches) from
their pacemaker when the phone is switched on;
Should not carry the communicator in a breast pocket;
Should use the ear opposite the pacemaker to minimise the potential for
interference.
If you have any reason to suspect that interference is taking place, switch
off the phone of your communicator immediately.
Hearing aids: Some digital wireless phones may interfere with some
hearing aids.
In the event of such interference, you may want to consult your service
provider.
Other medical devices: Operation of any radio transmitting
equipment,including communicators, may interfere with the functionality
Page 12 – 24 Draft 01/99

of inadequately protected medical devices. Consult a physician or the

manufacturer of the medical device to determine if they are adequately
shielded from external RF energy or if you have any questions. Switch off
the phone of your communicator in health care facilities when any
regulations posted in these areas instruct you to do so. Hospitals or
health care facilities may be using equipment that could be sensitive to
external RF energy.
Vehicles: RF signals may affect improperly installed or inadequately
shielded electronic systems in motor vehicles (e.g. electronic fuel injection
systems, electronic anti–skid (anti–lock) braking systems, electronic
speed control systems, air bag systems). Check with the manufacturer or
its representative regarding your vehicle. You should also consult the
manufacturer of any equipment that has been added to your vehicle.
Posted facilities: Switch off the phone of your communicator in any facility
where posted notices so require.
Potentially explosive atmospheres Switch off the phone of your
communicator when in any area with a potentiallyexplosive atmosphere
and obey all signs and instructions. Sparks in such areas could cause an
explosion or fire resulting in bodily injury or even death.
Users are advised to switch off the phone when at a refuelling point
(service station). Users are reminded of the need to observe restrictions
on the use of radio equipment in fuel depots (fuel storage and distribution
areas), chemical plants or where blasting operations are in progress.
Areas with a potentially explosive atmosphere are often but not always
clearly marked. They include below deck on boats; chemical transfer or
storage facilities; vehicles using liquified petroleum gas (such as propane
or butane); areas where the air contains chemicals or particles, such as
grain, dust or metal powders; and any other area where you would
normally be advised to turn off your vehicle engine.
Vehicles
Only qualified personnel should service the communicator, or install the
communicator in a vehicle. Faulty installation or service may be
dangerous and may invalidate any warranty which may apply to the unit.
Check regularly that all wireless phone equipment in your vehicle is
mounted and operating properly.
Do not store or carry flammable liquids, gases or explosive materials in
the same compartment as the communicator, its parts or accessories.
For vehicles equipped with an air bag, remember that an air bag inflates
with great force. Do not place objects, including both installed or portable
wireless
equipment in the area over the air bag or in the air bag deployment area.
If in–vehicle wireless equipment is improperly installed and the air bag
inflates, serious injury could result.
Switch off the phone of your communicator before boarding an aircraft.
The use of wireless telephones in an aircraft may be dangerous to the
Draft 01/99 Page 12 – 25

operation of the aircraft, disrupt the wireless telephone network and may
be illegal. Failure to observe these instructions may lead to suspension or
denial of telephone services to the offender, or legal action or both.
Emergency calls
IMPORTANT!
The Nokia 9110 Communicator, like any wireless phone, operates using
radio signals, wireless and landline networks as well as
user–programmed functions which cannot guarantee connection in all
conditions. Therefore you should never rely solely upon any wireless
phone for essential communications (e.g. medical emergencies).
Remember, to make or receive any calls the phone must be switched on
and in a service area with adequate signal strength. Emergency calls may
not be possible on all wireless phone networks or when certain network
services and/ or phone features are in use. Check with local service
providers.
To make an emergency call
1 If the device cover is open, close the cover.
2 If the phone is not on, switch it on (press the key). Some networks may
require that a valid SIM card is properly inserted in the communicator.
3 Press and hold the key for several seconds to ready the phone for calls
and to end possible active data or fax calls.
4 Key in the emergency number for your present location (e.g. 112 or
other official emergency number). Emergency numbers vary by location.
5 Press the key.
If certain features are in use (call barring, fixed dialling, closed user
group, system lock, etc.), you may first need to turn those features off
before you can make an emergency call. Consult the User’s manual and
your local cellular service provider.
When making an emergency call, remember to give all the necessary
information as accurately as possible. Remember that your communicator
may be the only means of communication at the scene of an accident –
do not cut off the call until given permission to do so.
To use this guide
The wireless phone described in this guide is approved for use in the
GSMnetworks.
A number of features included in this manual are called network services.
They are special services provided by wireless service providers. Before
you cantake advantage of any of these network services, you must
subscribe to theservice(s) you require from your home service provider
and obtain instructionsfor their use. You can then activate these functions
as described in this manual. The manual activation commands for various
services are not presented in this manual (e.g. using the and characters
Page 12 – 26 Draft 01/99

for activating or deactivating services). The Nokia 9110 Communicator is,

nevertheless, capable of handling commands given in that form. For
these commands, please consult with your service providers.
WARNING! This apparatus is intended for use when supplied with power
from a Lithium–ion battery and chargers ACP–9E, ACP–9X and ACP–9A.
Other usage will invalidate any approval given to this apparatus and may
be dangerous.
Draft 01/99 Page 12 – 27

Page 12 – 28 Draft 01/99

Chapter 13
Accessories
Issue 2_10/00 Copyright 1999 Nokia Mobile Phones. All rights reserved.
RAE–2 PAMS
Accessories Technical Documentation

Number
02/99 Original
Issue 2 10/00 OJuntune Updated pages 1, 2,
Table on page 4,
HSU–1 page removed,
repaginated

09/00
PAMS RAE–2
Technical Documentation Accessories
CONTENTS
Page No
Units and Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –4
Headset HDC-8 (0271368) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5
Technical Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5
Desktop Charger DCH–7 (0271365) . . . . . . . . . . . . . . . . . . . . . . . –6
Technical Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –6
Rear Connector View Desk Stand . . . . . . . . . . . . . . . . . . . . –7
Interconnection Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . –8
Memory Card MMC DTS–8 (0271581) . . . . . . . . . . . . . . . . . . . . . –9
Fast Travel Charger ACP–9 (0675149) . . . . . . . . . . . . . . . . . . . . – 10
Product Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 10
Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 10
RS232 Adapter Cable DLR–2 (073077) . . . . . . . . . . . . . . . . . – 11
Cigarette Lighter Charger LCH–9 (0675005) . . . . . . . . . . . . . – 12
Active Car Holder CRH-2 (0620049) . . . . . . . . . . . . . . . . . . . . – 13

09/00
RAE–2 PAMS
Units and Accessories

All RAE–2N accessories are non–serviceable.
Name of unit or accessory Type code Material Notes

code
Battery BLN–3 0670226 1080 mAh, Li–Ion
Performance Charger ACP–9E 0675149 Fore EURO version
Mobile Charger LCH–9 0271056
Advanced Desktop Stand DCH–7 0271365
RS–232 Adapter Cable DLR–2 0730132
Headset HDC–8 0271368
Advanced HF Car Kit CARK–99 0085155
Upgrade HF Car Kit CARK–102
Memory Card DTS–8 0271581 Removable memory card MMC
Carrying Case CBR–4 0271410

09/00
PAMS RAE–2
Headset HDC-8 (0271368)

Connect the HDC–8 to the bottom connector of phone, and it is ready to
use. The push button at the microphone part can be used for answering
and ending the call.
Technical Summary
HDC–8 headset contains a microphone, a speaker, EMI–components
and CONTROL button . Headset is connected to the bottom connector of
the phone.
Headset can be used also with the car kit.

09/00
RAE–2 PAMS
Desktop Charger DCH–7 (0271365)

Desktop charger DCH–7 is designed for the charging of the RAE–2 PDA
and a spare battery.
Technical Summary
The desktop charger DCH–7 is a two–slot stand designed to be placed on
a desk–top. The front slot holds and charges the phone, and the rear slot
holds and charges a spare battery.
The desk stand includes red and green LEDs to show the status of the
spare battery charging in the rear slot.
The desk stand supports charging of 4.1V and 4.2V lithium–ion batteries.
The desk stand is powered by an external ACP–9A/E/U/X performance
travel charger. When a RAE–2 is placed in the front slot it is charged at
the same rate as if the external charger was connected directly to the
phone. When a spare battery is placed in the rear slot, it is charged at a
slower rate. Charging of the spare battery is delayed until the phone has
finished charging.
The front slot provides data connection between the deskstand connected
PC and the RAE–2. The host PC is connected by Nokia data cable to the

09/00
PAMS RAE–2
rear of the desk stand. The PC must have the Nokia ”Share” software
running for the data transfer to the PC to be successful.
The desk stand provides a convenient push button, called a ”Share” but-
ton to initiated the phone to PC data synchronization. The data transfer
from the phone to the PC is then achieved via the phone serial data link
[Fbus]. The Nokia Data cable is required for connection of the desk stand
to the PC.
Rear Connector View Desk Stand

The rear connector allows for the Nokia PC data cable to be connected to
the Spock whilst in the desk stand. The cable is connected to the rear of
the desk stand and the desk stand provides routing of the signals to the
Spock phone.
The rear connector provides for connection of the charger to the desk
stand.

09/00
RAE–2 PAMS
PC serial cable
Fbus to Rs232 PHONE
DESKSTAND
Fbus Front
slot
CHARGER
SPARE BATTERY
3–wire DC–jack
Rear
AC supply slot
Figure 1. Interconnection Diagram

09/00
PAMS RAE–2
Memory Card MMC DTS–8 (0271581)

The PDA includes a synchronous serial interface that is compatible with
the Multimedia Card Bus (MMC) Protocol. The MMC is a changeable
Flash or ROM memory card with variable memory size. The MMC con-
nector is located on the BS8 Module..
1 2 3 4 5 6 7
32mm
1.5mm
24mm
Figure 2. DTS–4 Dimensions

09/00
RAE–2 PAMS
Fast Travel Charger ACP–9 (0675149)

Operating within the voltage range 90 V...264 V AC (50 Hz...60 Hz), the Fast
Travel Charger is practically current independent in normal office and house-
hold use. Like the standard charger, it is compatible with all battery options
and is available for different wall sockets.
The Fast Travel Charger can also be used with basic stand and desktop
stand.
ACP–9E ACP–9U
ACP–9X
ACP–9A
Product Codes
Fast Travel Charger (Euro plug) 90–264 Vac ACP–9E 0675149
Fast Travel Charger (US plug) 90–264 Vac ACP–9U 0675151
Fast Travel Charger (UK plug) 90–264 Vac ACP–9X 0675150
Fast Travel Charger (Australia) 90–264 Vac ACP–9A 0675152
Output cable PCC–1 (supplied with ACP–9): 0730076
Specification
Output connectors: 3.5 mm DC plug, 3–pole (+, –, control)
Protection: output current limiting, max. 850 mA
output voltage limiting, max. 9.3 V (unloaded)
Output voltage/current (typ): 8.4 V / 800 mA

09/00
PAMS RAE–2
RS232 Adapter Cable DLR–2 (073077)

Purpose Connects an external computer with RAE–1N
(via PAR–1) see below
Cable length 950mm 25 mm (3 wire, 3.5 mm)
D connector D9 connector female
Stereo connector Stereo plug (2.5 mm)
with 3.5 mm strain relief

09/00
RAE–2 PAMS
Cigarette Lighter Charger LCH–9 (0675005)
Purpose charging adapter for car environment; input voltage

9...32 V
Charger type Switching mode power supply
Operation quick charge (< 0.5–2.5 h), trickle charge
Protection input fused, output current limit
Connectors output: 3.8 mm standard DC plug;
input: D 21 / 23 mm
Weight <120 g
Cable 2 m curly cable
NOTE! The current version of LCH–2 does not indicate (led illumination) in
a correct way what is the status of the charging with Li batteries.
For quick car installation, the user can utilise the Cigarette Lighter Charger
LCH–2, Power Adapter PAR–1, and RS232 serial cable DLR–1 Mobile
Holder MBR–1 cannot be used in this context.

09/00
PAMS RAE–2
Active Car Holder CRH-2 (0620049)
The holder for the mobile phone is attached to the vehicle’s interior in a
convenient position using the swivel mount HHS–10. The mounting is
secured with a screw (included with HHS–10). The screw recess is
covered with the NOKIA logo plate (see Figure 2.)
The cable with the plug–in connector from CRH–2 connects to the
PHONE socket in HFU–2. (The other cable from CRH–2 connects to the
external antenna.)

09/00
RAE–2 PAMS

09/00
Chapter 14
Vehicle Installation Guide
Original, 05/98 Copyright 1998 Nokia Mobile Phones. All rights reserved.
RAE–2 PAMS
Vehicle Installation Guide Technical Documentation

Number
Page Cark– 2 Original, 05/98

PAMS RAE–2
Technical Documentation Vehicle Installation Guide
CONTENTS – Vehicle Installation Guide
Page No
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 4
Advanced HF Car Kit CARK–99 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 5
Unpacking CARK–99 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 5
Component Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 5
Advanced Active Holder CRH–2 . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 5
Advanced HF Unit HFU–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 5
Swivel Mount HHS–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 6
HF Microphone HFM–8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 6
HF Speaker HFS–12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 6
Power Cable PCH–4J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 6
External Mobile Antenna (not supplied) . . . . . . . . . . . . . . . . . . . . Cark– 7
Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 7
Ignition Sense IGNS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 7
Car Radio Muting CRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 8
Antenna Motor Control AMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 8
Car Radio Muting CRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 9
Automatic Answering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 9
Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 9
Upgrade Car Kit CARK–102 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 10
Unpacking CARK–102 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 10
Component Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 10
Advanced Active Holder CRH–2 . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 10
Advanced HF Unit HFU–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 10
Swivel Mount HHS–10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 11
Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 11
Ignition Sense IGNS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 12
Car Radio Muting CRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 12
Automatic Answering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 12
Antenna Motor Control AMC . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 13
Car Radio Muting CRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 13
Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Cark– 13
Original, 05/98 Page Cark– 3

RAE–2 PAMS
Introduction
This installation guide has been prepared to provide the basic information
necessary to install this car kit. This guide is not intended to be definitive, be-
cause different types and models of vehicles will require different installation
work. The information given is for general guidance only.
The terms of warranty demand that this car kit be installed by an experienced
installer and only genuine Nokia parts be used. An end user should never
attempt to install this car kit without professional assistance as the installa-
tion requires special tools and knowledge.
Please refer to the RAE–2 User’s Manual and Accessory Guide for instruc-
tions on the telephone’s operation, care and maintenance, including impor-
tant safety information.
Note: Read the warnings below before beginning the installation
procedure.
WARNINGS
ENSURE THAT THE VEHICLE’S BATTERY IS DISCONNECTED
BEFORE YOU START THE INSTALLATION PROCEDURE, AND THAT
IT REMAINS DISCONNECTED DURING THE PROCEDURE.
DO NOT SMOKE OR USE OPEN FLAMES WHEN WORKING NEAR
THE VEHICLE’S FUEL SYSTEM.
ENSURE THAT ELECTRICAL CABLES, HYDRAULIC LINES AND FUEL
LINES ARE NOT DAMAGED DURING INSTALLATION.
ENSURE THAT NORMAL CONTROL AND OPERATION OF THE
VEHICLE IS NOT IMPAIRED BY THE INSTALLATION, PARTICULARLY
THE BRAKES AND STEERING.
ELECTRONIC AND OTHER SOPHISTICATED SYSTEMS (e.g. SPEED
CONTROL, ABS ANTI–LOCK BRAKE, FUEL INJECTION,
NAVIGATION, AND AIR–BAG SYSTEMS) ARE RELATIVELY IMMUNE
TO MALFUNCTION CAUSED BY NEARBY RADIO TRANSMISSIONS.
HOWEVER, SHOULD YOU EXPERIENCE FALSE OPERATION OF
THESE SYSTEMS OR ARE IN ANY DOUBT WHATSOEVER AS TO
THEIR FUNCTIONALITY, PLEASE CONSULT THE VEHICLE’S
DEALER.
THE CAR KIT IS SUITABLE FOR USE ONLY IN VEHICLES WITH A
12 V NEGATIVE GROUNDING. USE ON OTHER SUPPLY VOLTAGES
OR ALTERNATIVE POLARITY WILL DAMAGE THE EQUIPMENT.
THE COMMUNICATOR SHOULD NOT BE LEFT SWITCHED ON FOR
EXTENDED PERIODS WITHOUT RUNNING THE VEHICLE’S ENGINE.
FAILURE TO COMPLY COULD DRAIN THE VEHICLE’S BATTERY.

PAMS RAE–2
Advanced HF Car Kit CARK–99
Unpacking CARK–99
Carefully unpack the equipment and ensure that the following items are
present.
Advanced Active Car Holder CRH–2
Advanced HF Unit HFU–2
Power Cable PCH–4J
Mounting Plate MKU–1
Swivel Mount HHS–10
HF Microphone HFM–8
HF Speaker HFS–12
HHS–10
MKU–1
CRH–2 HFU–2
PCH–4J
HFS–12 HFM–8
Component Parts
Advanced Active Holder CRH–2

The holder allows the Communicator to be firmly located in a convenient
position. The holder is attached to the vehicle’s interior using the swivel
mount HHS–10. The mounting must be secured with a screw (included with
HHS–10). The screw recess can then be covered with the NOKIA logo plate.

The handsfree unit enables the communicator to operate in handsfree
mode. The unit is attached to the vehicle interior using the mounting plate
MKU–1. The mounting must be secured with a screw (included with

RAE–2 PAMS
MKU–1). A temporary installation can be achieved using installation belts

(not supplied).
Power is supplied from the vehicle’s battery via the power cable PCH–4J.
The handsfree unit provides the power supply to the communicator via the
system connector.
The HF microphone HFM–8, connects to the MIC socket, and the HF speak-
er HFS–12, connects to the socket.

HHS–10 offers two installation methods for the holder.
Either use all components to make a swivel mount,
or just use the flat mounting plate
for a fixed position.
HF Microphone HFM–8
The HF microphone connects directly to the handsfree unit ( MIC socket).
Insert the plug into the MIC socket and twist 90° to lock firmly in place.
HF Speaker HFS–12
The HF speaker connects directly to the handsfree unit ( socket).
Insert the plug into the socket and twist 90° to lock firmly in place.
Power Cable PCH–4J

The power cable connects the advanced handsfree unit HFU–2 to the ve-
hicle’s power supply. The red wire must be connected to the + voltage on the
vehicle’s power supply via the supplied fused connector. The black wire
must be attached to a good negative GND connection.
The blue ignition sense (IGNS) wire is connected to +12 V voltage con-
trolled by the vehicle’s ignition key via the supplied fused connector.
See section ”Ignition Sense”.
The yellow wire is used for car radio muting (XCRM). The line goes down to
0 volts during a call. See section ”Car Radio Muting”. The green wire is used
for motor antenna (AMC). The voltage in this output is +12 V whenever the
communicator is on. See section ”Antenna Motor Control”.

PAMS RAE–2
External Mobile Antenna (not supplied)

The Hands–Free Car Kit is designed to operate with a high quality external
antenna. However, due to many different types of antennas being available,
an antenna is NOT included as part of this kit. Please, consult the dealer to
find out which is the most suitable antena type for your installation.
Installation
There are some important aspects that require special attention in position-
ing Hands–Free Car Kit accessories.
The positioning of the Phone Holder is the most important factor when trying
to achieve the most comfortable position for the user. The location of the
Holder should be selected so that the visibility of the Communicator’s display
is good under all lighting conditions, but not so that the driver’s attention is
easily distracted. The Holder should be located so that the driver can easily
reach the keypad. Under no circumstances should the Holder prevent the
driver from controlling or operating the vehicle in any way or observing traffic.
The Hands–Free Microphone should be installed according to the directions
in the separate microphone installation guide. Ensure the microphone is as
close to the driver’s mouth as possible, and attached to a surface that is me-
chanically quiet. The microphone should be mounted at least 3 ft/1 m away
from the Hands–Free Speaker to avoid acoustic feedback.
Ensure cables are routed as far away as possible from the vehicle’s electron-
ic systems (refer to WARNINGS). In addition, ensure cables are not sub-
jected to undue mechanical stress for example, under seats or against sharp
edges.
All installations should take into account any special requirements of the cus-
tomer. However, should the customer require an installation that is illegal or
unsafe, these facts must be pointed out to the customer and a policy of non–
compliance adopted.
Ignition Sense IGNS

The Ignition Sense feature prevents your Communicator from draining the
car battery by executing an auto power off in 20 seconds after the ignition
key has been turned off. The blue wire of the power cable is used for the igni-
tion sense feature. The use of ignition sense is recommended to prevent ac-
cidental draining of the car’s battery. The wire is connected via a 200 mA fuse
to a 12/24 volt potential that is controlled by the ignition key. Do not connect
it directly to the high voltage sections of the ignition circuit.
Car Radio Muting CRM

The Car Kit offers a feature that can mute the car radio automatically during
a conversation. This feature is convenient and provides for safer hands–free
operation. The Car Radio Muting feature is based on a grounded line, so it

RAE–2 PAMS
means that in standby, the yellow wire (XCRM) is not grounded and car radio
works normally, but during a call, line is grounded and car radio is muted. The
maximum load that this line can handle is 250 mA. Note that an auxiliary relay
or muting unit must be used when the car radio doesn’t have a mute feature
available.
When a relay is used this should be connected in series with the car radio
main supply. A 200 mA fuse should be used to protect the XCRM output in
event of a short circuit. Some radios have separate supplies for amplifiers
and motors, and another for memory backup purposes. Very often these ra-
dios also have a secret code system, which activates itself if a break in the
memory supply is detected. Be careful when installing the relay not to break
the memory supply (usually marked ACC or +MEM), but to install the relay
in the main supply feed.
Bosch P/N 0–332–204–150
GND CAR 87A 12 V, 30 A. SPDT
RADIO
30 12 V d.c.
Supply for
87 car radio
To XCRM line 85 86 12 V d.c.

(yellow wire)
Fuse 200 mA
(not supplied)
Figure 1. Radio Muting Circuit

Another possibility is to use a special muting unit, which mutes the radio by
connecting load resistors to the speaker lines of the car radio.
Antenna Motor Control AMC

The antenna motor control offers a feature, green wire of the system cable
(AMC), that may be used to control different devices on and off. The voltage
in this output is +12 V whenever the communicator is on. If the communicator
is turned off, the voltage disappeares. The maximum output current is 200
mA, therefore for example motorized antenna must be controlled via a relay,
see the picture below.
Bosch P/N 0–332–204–150 12 V, 30 A. SPDT
87A
12 V d.c. 30
CONTROLLED
Supply for device
DEVICE e.g.
MOTOR ANTENNA
87 GND
From AMC line (green wire) 86 85 GND
Fuse 1 A

When the communicator is placed in the car kit, with the vehicle ignition on,
the CAR profile is enabled. This contains specific phone settings that can be

PAMS RAE–2
adjusted by the user. When the automatic answering setting is on, the com-
municator will answer calls without user intervention.
Automatic Answering
Testing
Once installed, the equipment should be tested to ensure that it is operating
satisfactorily and that the position of the units does not impair on the driver’s
ability to control and operate the vehicle in any way.
Use the Communicator to make a call when the vehicle is parked with the
engine running. During the call, switch off the engine. Ensure that the phone
is operational with the engine running and with the engine switched off. For
operating information refer to the ’Accessories Guide’ supplied with the
Communicator.
Upgrade Car Kit CARK–102
Unpacking CARK–102
Carefully unpack the equipment and ensure that the following items are
present.
Advanced Active Car Holder
CRH–2
Advanced HF Unit
HFU–2
Mounting Plate
MKU–1

RAE–2 PAMS
HHS–10
MKU–1
HFU–2
CRH–2
PCH–4J
(not included)
HFS–12 HFM–8
(not included) (not included)
Component Parts
Advanced Active Holder CRH–2

The holder allows the Communicator to be firmly located in a convenient
position. The holder is attached to the vehicle’s interior using the swivel
mount HHS–10. The mounting must be secured with a screw (included with
HHS–10). The screw recess can then be covered with the NOKIA logo plate.

The handsfree unit enables the communicator to operate in handsfree
mode. The unit is attached to the vehicle interior using the mounting plate
MKU–1. The mounting must be secured with a screw (included with
MKU–1). A temporary installation can be achieved using installation belts
(not supplied).
Power is supplied from the vehicle’s battery via the power cable PCH–4J.
The handsfree unit provides the power supply to the communicator via the
system connector.
The HF microphone HFM–8, connects to the MIC socket, and the HF speak-
er HFS–12, connects to the socket.

HHS–10 offers two installation methods for the holder.
Either use all components to make a swivel mount,
or just use the flat mounting plate

PAMS RAE–2
for a fixed position.
Installation
There are some important aspects that require special attention in position-
ing Hands–Free Car Kit accessories.
The positioning of the Phone Holder is the most important factor when trying
to achieve the most comfortable position for the user. The location of the
Holder should be selected so that the visibility of the Communicator’s display
is good under all lighting conditions, but not so that the driver’s attention is
easily distracted. The Holder should be located so that the driver can easily
reach the keypad. Under no circumstances should the Holder prevent the
driver from controlling or operating the vehicle in any way or observing traffic.
The Hands–Free Microphone should be installed according to the directions
in the separate microphone installation guide. Ensure the microphone is as
close to the driver’s mouth as possible, and attached to a surface that is me-
chanically quiet. The microphone should be mounted at least 3 ft/1 m away
from the Hands–Free Speaker to avoid acoustic feedback.
Ensure cables are routed as far away as possible from the vehicle’s electron-
ic systems (refer to WARNINGS). In addition, ensure cables are not sub-
jected to undue mechanical stress for example, under seats or against sharp
edges.
All installations should take into account any special requirements of the cus-
tomer. However, should the customer require an installation that is illegal or
unsafe, these facts must be pointed out to the customer and a policy of non–
compliance adopted.
Ignition Sense IGNS

The Ignition Sense feature prevents your Communicator from draining the
car battery by executing an auto power off in 20 seconds after the ignition
key has been turned off. The blue wire of the power cable is used for the igni-
tion sense feature. The use of ignition sense is recommended to prevent ac-
cidental draining of the car’s battery. The wire is connected via a 200 mA fuse
to a 12/24 volt potential that is controlled by the ignition key. Do not connect
it directly to the high voltage sections of the ignition circuit.

RAE–2 PAMS

The Car Kit offers a feature that can mute the car radio automatically during
a conversation. This feature is convenient and provides for safer hands–free
operation. The Car Radio Muting feature is based on a grounded line, so it
means that in standby, the yellow wire (XCRM) is not grounded and car radio
works normally, but during a call, line is grounded and car radio is muted. The
maximum load that this line can handle is 250 mA. Note that an auxiliary relay
or muting unit must be used when the car radio doesn’t have a mute feature
available.
When a relay is used this should be connected in series with the car radio
main supply. A 200 mA fuse should be used to protect the XCRM output in
event of a short circuit. Some radios have separate supplies for amplifiers
and motors, and another for memory backup purposes. Very often these ra-
dios also have a secret code system, which activates itself if a break in the
memory supply is detected. Be careful when installing the relay not to break
the memory supply (usually marked ACC or +MEM), but to install the relay
in the main supply feed.
Bosch P/N 0–332–204–150
GND CAR 87A 12 V, 30 A. SPDT
RADIO
30 12 V d.c.
Supply for
87 car radio
To XCRM line 85 86 12 V d.c.

(yellow wire)
Fuse 200 mA
(not supplied)
Figure 2. Radio Muting Circuit
Another possibility is to use a special muting unit, which mutes the radio by
connecting load resistors to the speaker lines of the car radio.
Automatic Answering
Antenna Motor Control AMC

The antenna motor control offers a feature, green wire of the system cable
(AMC), that may be used to control different devices on and off. The voltage
in this output is +12 V whenever the communicator is on. If the communicator
is turned off, the voltage disappeares. The maximum output current is 200
mA, therefore for example motorized antenna must be controlled via a relay,
see the picture below.

PAMS RAE–2
Bosch P/N 0–332–204–150 12 V, 30 A. SPDT
87A
12 V d.c. 30
CONTROLLED
Supply for device
DEVICE e.g.
MOTOR ANTENNA
87 GND
From AMC line (green wire) 86 85 GND
Fuse 1 A

Testing
Once installed, the equipment should be tested to ensure that it is operating
satisfactorily and that the position of the units does not impair on the driver’s
ability to control and operate the vehicle in any way.
Use the Communicator to make a call when the vehicle is parked with the
engine running. During the call, switch off the engine. Ensure that the phone
is operational with the engine running and with the engine switched off.
For operating information refer to the ’Accessories Guide’ supplied with the
Communicator.

RAE–2 PAMS

HFU–2
Original 11/97
PAMS
HFU–2 Technical Documentation
CONTENTS
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Technical Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
List of Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Supply Voltage and Power Consumption . . . . . . . . . . . . . . . . 4
Charging voltage limits within current specifications fulfilled 5
Audio Specifications, electrical . . . . . . . . . . . . . . . . . . . . . . . . . 5
HFS–12 Audio Specifications, acoustic . . . . . . . . . . . . . . . . . . 6
HFM–8 Audio Specifications, acoustic . . . . . . . . . . . . . . . . . . . 6
Audio signal levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Signals and Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Exploded View of HFU–2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Parts list of ED2 (EDMS Issue )
Code: 0200948 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Page 2 Original 11/97

PAMS
Technical Documentation HFU–2
Introduction
The HFU–2 is a handsfree unit for DCT3 compatible handportable
phones. It provides rapid charging for the phone, a possibility to use HF–
operation and connections to the data–card and handset unit. The HF
box can be connected directly to the Mobile holder MCC–1 via the exter-
nal cable.
Technical Summary
The HFU–2 has connections to car battery, car ignition sense, car radio
muting, antenna motor control, data–card, handset HSU–1, external
speaker and microphone. The unit has a System–connector that pro-
vides an interface to the Mobile holder MCC–1 via the external cable.
The unit consists of a rapid charger, HF–microphone– and speaker ampli-
fiers, interface to handset, – datacard and –phone, voltage regulators and
control circuit (microprocessor).
The HFU–2 is always connected to the car battery. To save the car bat-
tery, HFU–2 goes in to the sleep mode if the car is not running and/or the
phone is not connected.
Original 11/97 Page 3

PAMS
List of Modules
Name of module Type code Material Notes

code
HF unit HFU–2 0694049 Advanced handsfree unit
HF module ED2 0200948 ED2 Advanced hadsfree module
Assembly parts MHFU–2 0261602 Mechanical Parts
Operation
Phone not connected (sleep mode):

When the phone is not connected the current consumption of
the device has been minimized. The switching mode power
supply (SMPS) and audio circuits has been turned off. HFU–2
is only waiting a phone to be connected.
Phone connected (active mode):

When the phone is connected to the HFU–2 it goes into the ac-
tive mode. In the active mode the device provides charging
current to the phone. It also can provide hands free call option
using the external speaker and the external microphone or
micspeaker unit. If more private call wants to be made, the
phone itself can be used as a handset without losing the exter-
nal antenna connection or with handset (option).
The phone controls all functions of HFU–2. In the active mode
the HFU–2 sends all state transitions to phone via mbus.
HFU–2 also provides car radio mute function during call.
HFU–2 can control the mobile antenna motor if it is installed to

the car.
Supply Voltage and Power Consumption
Conn. / pin Line Symbol Minimum Typical / Maximum Unit / Notes

Nominal
X300 / 6 GND 0 VDC
X300 / 1 VB 8.0 16 VDC (working)
X300 / 1 VB 10.8 13.5 16 VDC (spec. fulfill)
X300 / 1 VB 0.05 1 2 IDC/A (operating)
X300 / 1 VB 0.2 0.8 1 IDC/mA (sleep
mode)

PAMS
Charging voltage limits within current specifications fulfilled

Nominal
X200 / 7 GND 0 0 0.1 VDC
X200 / 2 +10VA 9.50 10.0 10.55 VDC
X200 / 2 +10VA 11 200 IDC / mA

Nominal
X100 / GND 0 0 0.1 VDC
5,6,11
X100 / 8,9 V_IN 3 8.5 VDC
X100 / 12 VB 8 16 VDC / car battery
X100 / 12 VB 500 IDC / mA
Audio Specifications, electrical

Nominal
Max speaker output power at 3.0 3.1 W / Rload = 8 ohm
distortion=1%, 1 kHz sine
HF–speaker amplifier gain 27 29 31 dB
PSRR, XEAR line –60 –68 dB
CMRR, XEAR–SGND to –50 –55 dB
speaker
HF–mic amplifier gain 27 30 33 dB
Mic level at XMIC–SGND, 2000 2800 mVpp
(clipping level)
Mic distortion at XMIC– 0.15 0.4 %
SGND, at Vo = 100 mVrms,
1 kHz
Noise voltage, HFMIC 5 uVrms psofometric
PSRR, XMIC –60 –67 dB
Crosstalk XEAR–SGND to – 55 – 45 dB / electrical, 1kHz
XMIC

PAMS
HFS–12 Audio Specifications, acoustic

Nominal
Electroacoustic transfer func- 11 15 19 dBPa / 1V at system
tion (RX) dBPa/1V/0.5m connector is theoreti-
cal level
Speaker distortion level at 354 mVrms
XEAR–SGND, d=5%
HF–speaker: SPL, approxi- 87 89 91 dB / 1W / 1m
mate over 500 ... 3000 Hz –4 –2 0 dBPa / 0.5W at 0,5m
Equivalent input noise, 10 uVrms psofometric
XEAR
Total noise, HF speaker 200 400 uVrms psofometric
HFM–8 Audio Specifications, acoustic

Nominal
Electroacoustic transfer func- –28 –24 –20 dBV/–5dBPa/0.5m
tion (TX) dBV/dBPa/0.5m
Total noise, XMIC–SGND 140 300 uVrms psofometric
Audio signal levels
Signal name / conn. / pin Minimum Typical / Maximum Unit / Notes

Nominal
XEAR / X100 / 4 80 354 mVrms
SGND / X100 / 3 0 mVrms
XMIC / X100 / 2 60 990 mVrms
HFMIC / X400 / 2 2.0 mVrms
SPEAKER / X500 / 1 & 2 0.75 5 V rms
Signals and Connections
Connector Name Code Notes Specifications / Ratings

System connector X100 Charge, Mbus, Fbus, audio Modular 15 pin.
lines, VB
Handset / Data connector X200 Mbus, Fbus, Handset au- Modular 10 pin.
dio– lines, Hshook, 10V
Car connector X300 +VB, –VB, ign. sense, car 2 X 3 Power conn.
radio mute, antenna motor
control
HFMIC connector X400 External microphone 2.5 mm jack
EXT. SPEAKER connector X500 External speaker 3.2 mm jack

PAMS
Block Diagram
CRM VCC
EXTERNAL AMC protec– DC connector

I/O tion X300
IGNS
CHARGE
SMPS
VCC
CRM IGNS
AMC
CHGON
RESET
V_IN CHRG_CTRL
CONTROL POWER
CIRCUITS SUPPLY
MBUS
PWRON
MUTE
System con- protec– AUDIO AUDIO MICROPHONE

MUTE
nector X100 tion INTERFACE AMPLIFIER
LOGIC
FBUS
AUDIO MUTE
EAR
PASSIVE
MIC
HS / Data con– protec– POWER
nector X200 tion AMPLIFIER protec– External Microphone
tion Connector X200
EAR protec– External Speaker

tion Connector X500

PAMS
Exploded View of HFU–2

PAMS
Parts list of ED2 (EDMS Issue 5.1) Code: 0200948
ITEM CODE DESCRIPTION VALUE TYPE
R200 1415960 Melf resistor 33.2 k 1 % 0.2 W 0204

R203 1413829 Chip resistor 10 5 % 0.1 W 0805
R204 1413829 Chip resistor 10 5 % 0.1 W 0805
R205 1419007 Chip resistor 0.22 2 % 1210
R207 1416393 Melf resistor 221 k 1 % 0.2 W 0204
R209 1430001 Chip resistor 100 5 % 0.063 W 0603
R210 1415791 Melf resistor 100 1 % 0.2 W 0204
R218 1412328 Chip resistor 820 5 % 0.1 W 0805
R219 1416798 Melf resistor 681 1 % 0.2 W 0204
R233 1430015 Chip resistor 470 5 % 0.063 W 0603
R240 1430001 Chip resistor 100 5 % 0.063 W 0603
R310 1412261 Chip resistor 100 5 % 0.1 W 0805

PAMS

R405 1430167 Chip resistor 47 5 % 0.063 W 0603
R426 1430142 Chip resistor 4.7 5 % 0.063 W 0603
R427 1430142 Chip resistor 4.7 5 % 0.063 W 0603
R429 1430167 Chip resistor 47 5 % 0.063 W 0603
R430 1430167 Chip resistor 47 5 % 0.063 W 0603

PAMS

R436 1430159 Chip resistor 22 5 % 0.063 W 0603
R444 1430167 Chip resistor 47 5 % 0.063 W 0603
R467 1430001 Chip resistor 100 5 % 0.063 W 0603
R468 1430001 Chip resistor 100 5 % 0.063 W 0603
R469 1430001 Chip resistor 100 5 % 0.063 W 0603
C201 2503072 Electrol. cap. 470 u 20 % 16 V 10x16
C202 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C203 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C205 2320083 Ceramic cap. 1.0 n 5 % 50 V 0603
C206 2505261 Electrol. cap. 220 u 20 % 25 V 8.5x11.5
C207 2320083 Ceramic cap. 1.0 n 5 % 50 V 0603
C208 2604209 Tantalum cap. 1.0 u 20 % 16 V 3.2x1.6x1.6
C213 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C219 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C301 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C304 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C306 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C308 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C309 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C316 2320043 Ceramic cap. 22 p 5 % 50 V 0603
C318 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C321 2320059 Ceramic cap. 100 p 5 % 50 V 0603
C322 2320059 Ceramic cap. 100 p 5 % 50 V 0603

PAMS
C323 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603

C326 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C329 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C334 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C335 2505261 Electrol. cap. 220 u 20 % 25 V 8.5x11.5
C338 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C339 2320043 Ceramic cap. 22 p 5 % 50 V 0603
C340 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C400 2320069 Ceramic cap. 270 p 5 % 50 V 0603
C402 2320079 Ceramic cap. 680 p 5 % 50 V 0603
C403 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C404 2320043 Ceramic cap. 22 p 5 % 50 V 0603
C405 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C406 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C407 2320083 Ceramic cap. 1.0 n 5 % 50 V 0603
C408 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C409 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C410 2320043 Ceramic cap. 22 p 5 % 50 V 0603
C413 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C414 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C416 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C417 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C418 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C419 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C420 2320083 Ceramic cap. 1.0 n 5 % 50 V 0603
C422 2320083 Ceramic cap. 1.0 n 5 % 50 V 0603
C423 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C425 2320083 Ceramic cap. 1.0 n 5 % 50 V 0603
C427 2320043 Ceramic cap. 22 p 5 % 50 V 0603
C429 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C430 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C431 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C432 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C433 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C434 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C435 2310791 Ceramic cap. 33 n 20 % 50 V 0805
C436 2320043 Ceramic cap. 22 p 5 % 50 V 0603
C437 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C438 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C439 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C440 2320043 Ceramic cap. 22 p 5 % 50 V 0603
C441 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C442 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603

PAMS
C443 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603

C444 2320043 Ceramic cap. 22 p 5 % 50 V 0603
C445 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C446 2320083 Ceramic cap. 1.0 n 5 % 50 V 0603
C447 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C449 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C450 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C453 2320063 Ceramic cap. 150 p 5 % 50 V 0603
C454 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603
C455 2320043 Ceramic cap. 22 p 5 % 50 V 0603
C456 2604431 Tantalum cap. 10 u 20 % 16 V 6.0x3.2x2.5
C458 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C460 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C465 2320083 Ceramic cap. 1.0 n 5 % 50 V 0603
C470 2310784 Ceramic cap. 100 n 10 % 25 V 0805
C490 2320043 Ceramic cap. 22 p 5 % 50 V 0603
L200 3609001 Coil 100 u 10 % Q=20/796 kHz
Q20/796 kHz 8X11
L201 3609001 Coil 100 u 10 % Q=20/796 kHz
Q20/796 kHz 8X11
L301 3641262 Ferrite bead 30r/100mhz 2a 1206 1206
Z300 4507733 Cer.reson 1.0mhz+–0.5% 8.0x5.0smd 8.0x5.0smd
Z400 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
Z401 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
Z402 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
V200 4110195 Zener diode BZX84 5 % 18 V 0.3 W SOT23
V201 4200917 Transistor BC848B/BCW32 npn 30 V 100 mA SOT23
V202 4211423 MosFet MTB30 D2PAK
V203 4108639 Diode x 2 BAS28 75 V 250 mA SOT143
V204 4200909 Transistor BC858B/BCW30 pnp 30 V 100 mA SOT23
V205 4110074 Schottky diode STPS340U 40 V 3 A SOD6
V302 4100285 Diode x 2 BAV99 70 V 200 mA SER.SOT23

PAMS

V311 4210096 Transistor BCP54 npn 45 V 1.5 A SOT223
V313 4210020 Transistor BCP69–25 pnp 20 V 1 A SOT223
V315 4100218 Trans. supr. LDP24A 100 V 30A/40 ms AG
V318 4108639 Diode x 2 BAS28 75 V 250 mA SOT143
D300 4370315 IC, MCU QFP44
D400 4309431 IC, 4 x bi.switch 4066 SO14S
N200 4340127 Mic29152 reg ld adj 1.5a to263–5 TO263–5
N201 4305733 IC, 4 x comp LM2901 SO14S
N202 4340067 IC, regulator LP2951 3.3 V 100 mA
N204 4340067 IC, regulator LP2951 3.3 V 100 mA
N400 4301182 IC, 2 x op.amp. LM2902 SO14S
N401 4340125 L2726 2xop.amp pw5w1a 4–28v so20w SO20W
N402 4301199 IC, 2 x op.amp. LM2904 SO8S
S001 9510365 RF shield dmd02481 hfu–1
X100 5400087 Modular jack 15pol f p2.04 90deg 90DEG
X200 540Y031 Use code 5400103
X300 540Y021 Use code 5400093
X400 5409057 Jack 2.5mm+sw+lock f 4pol str. s SM
X500 5409059 Jack 3.5mm+sw+lock f 3pol str. s SM
9854195 PCB ED2 110.0X75.01.6 D 4/PA
9854195 PC board ED2 110.0x75.01.6 d 4/pa

Hands Free Unit HFU–2
Block Diagram of Power & Charging (Version 5 Edit 94) for layout version 05
Original 11/97 HFU–2/A–1

Circuit Diagram of Audio (Version 5 Edit 87) for layout version 05

Layout Diagram of ED2 (Version 05)

System Module LPS–1/2
Circuit Diagram of LPS–1 module (Version 03 Edit 145)
Original 10/98 3/A3–1

System Module LPS–1/2
Layout Diagram LPS–1 module (Version 03 Edit 145)
Original 10/98 3/A3–2

After Sales Technical Documentation
Loopset LPS-1/2
Original 10/98
PAMS
Loopset LPS-1/2 Technical Documentation

Number
10/98 OJuntune Original

PAMS
Technical Documentation Loopset LPS-1/2
CONTENTS
Page No
Loopset LPS-1/2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Basic Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Loopset detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Loop Adapter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Magnetic Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Reception Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Automatic Gain Control (AGC . . . . . . . . . . . . . . . . . . . . . . . . 7
Magnetic Field frequency response window . . . . . . . . . 8
Functional Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Distortion and noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Microphone response window . . . . . . . . . . . . . . . . . . . . . 9
External Signals and Connections . . . . . . . . . . . . . . . . . . . . . . 10
Exploded View of LPS-1/2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Assembly parts of LPS-1/2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Parts List of LPS–1/2 (Version 6.1) Code: 0201179 . . . . 13

PAMS
Loopset LPS-1/2
Introduction
Hearing impaired people, who use hearing aids (HA), have problems in
using cellular phones. They can’t identify speech, partly due to poor
S/N–ratio and partly because of interference. Most HA have poor protec-
tion for interferences. By using the Loopset the interference problems are
minimized. LPS–1 is designed for 5100 and 6100 series phones. LPS–2
is compatible with Communicator N9110 .
The Loopset has been developed for hearing aid users to allow them to
use mobile phones. It is based on induction technology. These kind of
induction devices are widely used with hearing aids, but never before im-
plemented with cellular phones.
All hearing aids have support for induction loop, ie. they have a little tele-
coil inside. This coil can capture the signal supplied to the loop.
Standard hearing aids have two operation modes; M–mode for normal
microphone use and T–mode for telecoil use
The T–mode is used in places where the inductive loop has been as-
sembled, for example in public halls, churches and places of assembly.
The reason for T–mode use is much better S/N–ratio.
The Loopset provides clear acoustic quality. Automatic gain control (AGC)
in the Loopset ensures that there is the correct field strength in the Loop-
set. The Loopset also dampens backgroud noise to make it easier to con-
verse in a noisy environment, in the car for instance.
The Loopset can be used with all the mobile phones, which supports nor-
mal headset and vibra alarm. Vibra is needed just for call indication. The
earpiece of a headset is replaced by a wireloop. Loopset has also inte-
grated microphone.
The earpiece of a headset is replaced by a wireloop. Loopset has also
integrated microphone.
The function is very simple and the use is environmentally friendly. Loop-
set is passed around the neck. The system doesn’t disturb anybody due
to the silent service. When the phone is set to auto–answer mode, a user
don’t have to do anything but switch the hearing aid to T–mode.
Loopset is an economic and simple solution for hearing aid users. Most
hearing aids are compatible to this kind of wireless handsfree.

PAMS
Basic Specification
List of Modules
Name of module Type name Material code Note

LPS–1 Product LPS–1 0630146
LPS–1 Module LPS–1 0201179
Assembly parts MLPS1 0261661
LPS–2 Product LPS–2 0630201
Assembly parts MLPS2 0261898

PAMS
Recommended batteries:
Type Size Min Vout Max Vout Rated ca- Rated Time of Lop-
pacity set. Speech in 1.0h
days (4,2%). Con-
sumption 8mA of
the current.
Zinc Air 675 (LR44) 1.15 1,40 550 mAh 68 day (and hour).
Hearing Aid
Battery
Mercuric 675 (LR44) 1.25 1,45 280 mAh 35 day (and hour).
Hearing Aid
Battery
Alkaline Bat- LR44 1.25 1,45 150 mAh 19 day (and hour).
tery
The Nokia LPS–1 Loopset is powered by three hearing aid batteries and
comes pre–packaged with six zinc air batteries.
The ”auto answer” feature of the phone allows the users to be ”hands
free” while using either the Nokia LPS–1 Loopset or headset accessories.
The interface between Loopset and phone is similier to a headset. Except
the hight impedance input.
Name of function Specification

Supply voltage 2,7 ... 4,5 V
Supply current current peak<16 mA (nominal 5–6mA)
Unit Max. dimensions (mm) Notes

(W x H x D)
LPS–1 41x36x18 Weight 60g
Modes of Operation
When the Loopset is identified the audio of the phone will be routed to the
Loopset and the identification voltage is turned ON. Mic bias voltage 1.5
V is turned ON only in call state.
When the phone is turned off also the Loopset is in off–mode.
Loopset detection
In XMIC line there is a (47 + 2.2) k pull–up in phone. A microphone is a low

resistance pull down compared to that.

PAMS
When there is no call going, AUXOUT is in high impedance state and XMIC
is pulled up. When loopset is connected, XMIC is pulled down. XMIC is
connected to HeadsetInt line (in MAD), so an interrupt is given due to both
connection and disconnection.
During a call there is bias voltage (1.5 V) in AUXOUT. The state of HeadsetInt
can’t be sure. It is better to disable loopset interrupt during a call and poll from
EAD line (AD converter in CCONT) to see if loopset is disconnected. Actually
disconnection of a headset without remote control switch could be seen in
HookInt, but headset with the switch could not.
Loop Adapter
Connection resistance must be under 3mΩ.
Magnetic Loop
The magnet field is based on the IEC 118–4 and BS 6083 part 4 stan-
dard.
Specification
Reception Specifications
Type of Function Specification Notes

Impedance 100k ohm +/– 5 % at 1 kHz
Frequency responce See figure 1
Magnetic field 100mA/m (RMS) 3dB ref. The strength of the magnetic
1kHz=0dB field measured next to the
400mA/m +12dB,125 ms RMS– ear. (or measured in the hor-
peaks izontal plate and 170mm trip
from the curve of the loop.)
Loop Current 700mA(RMS) 3dB ref. 1kHz
=>0dB
2,8A (RMS), 125 ms RMS
peaks =>+12dB
Automatis Gain Control Response time <35 ms
Resetting time 0,5–5dB/s
Signal to Noise Ratio 48 dB nominal level (46 mVrms)/ 1kHz
Ratings
Determined as defined by IEC 268 using signal limited to frequency range

300 ... 3400 Hz.
Automatic Gain Control (AGC
Automatic gain control value is >30 decibels

PAMS
Magnetic Field frequency response window
dBr
+10
+5 +3 dB +3 dB +3 dB +3 dB
+1 dB
0
–5 –3 dB –3 dB –3 dB –3 dB
–5 dB
–10
–15
–20 300 Hz 3 kHz

250 500 1k 2k 4k
Figure 1. Magnetic field frequency response window of Loopset.
Functional Blocks
Table 1. Transmission Specifications

Object Specification Notes
Output impedance 1600 ohm +/– 30% 1kHz
Frequency response See Figure 2
Sensitivity –48 dB +6/–3 dB at 1kHz 0dBv/PA
Sensitivity dBm0 –13 dBm0 +6/–3 dBm0 at 1kHz 0dBv/PA – 4,7 dBPA
Sensitivity –59 dB +6/–3 dB at 1kHz 0dBv/PA.
Sensitivity dBm0 –24 dBm0 +6/–3 dBm0 at 1kHz

Directivity mic (acuctic) OMNI–directional
Signal to Noise Ratio 55 dB 1Pa/1kHz
Distortion and noise

Total distortion: Max 3 % 300...3400Hz with sound pressure 0 dBPa
at the microphone.

PAMS
Microphone response window
dBr
+10
+5 +3 dB +3 dB +3 dB +3 dB
+1 dB
0
–5 –3 dB –3 dB –3 dB –3 dB
–5 dB
–10
–15
–20 300 Hz 3 kHz

250 500 1k 2k 4k
Figure 2. Mic response window of Loopset.

PAMS
External Signals and Connections
AGC
Control
Vout
XEAR Vout
+
L_GND
Battery
Phone VOX
XMIC
SGND
Figure 3. Combined Loopset and system connector audio signals

PAMS
Table 2. X100 connector signals

Pi Pi Name Function Min Typ Ma Unit Description
n n x
in
x
10
0
1 1 XMIC 1.6 kW Headset source AC impedance
Headset microphone in
in-
put 100 400 mA Bias current
(from accessory to
phone) 200 mV- Maximum signal level
p–p
Headset detection 1.4 2.9 V No headset (ref. SGND).

(from accessory to 7
h
phone))
0 1.3 V Headset connected (ref. SGND).
3
2 2 SGND Audio signal ground. 380 W Resistance to phone ground (DC) (in phone)
Separated from phone 10 nF Series output capacitance
GND
(from phone to accesso-
ry)
3 3 XEAR Analog audio input 47 W Output AC impedance (ref. GND)
(from phone to accesso
accesso-
ry 10 nF Series output capacitance
16 100 W Load AC impedance to SGND: Headset

k
1.0 V Max. input level. No load
4 – ––––– Not Connected ––––––––––––––––––––––––––

5 – ––––– Not Connected ––––––––––––––––––––––––––
6 – ––––– Not Connected ––––––––––––––––––––––––––
7 4 L_GND Ground for Xear signals

PAMS
Exploded View of LPS-1/2
Assembly parts of LPS-1/2

ITEM Q’TY CODE DESCRIPTION VALUE, TYPE
1 0201179 Module lps-1

2 9780224 Loop set Cable LPS–1 DMD02438
alt 9780241 Loop set Cable LPS–2 DMD04474
3 9451016 B–cover DMD02639
4 9451015 A–cover DMD02638
5 2 6290021 PT-screw 1,8x8 feznTX6
6 9451246 Battery lid DMD03654

PAMS
Parts List of LPS–1 (Version 6.1) Code: 0201179
ITEM CODE DESCRIPTION VALUE TYPE

C002 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C005 2610003 Tantalum cap. 10 u 20 % 10 V
3.2x1.6x1.6
C006 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C009 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402
C010 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C015 2320580 Ceramic cap. 680 p 5 % 50 V 0402
C017 2320580 Ceramic cap. 680 p 5 % 50 V 0402
C018 2320469 Ceramic cap. Y5 V 0603
C021 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C022 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402
C023 2320580 Ceramic cap. 680 p 5 % 50 V 0402
C024 2320107 Ceramic cap. 10 n 5 % 50 V 0603

PAMS
C025 2320546 Ceramic cap. 27 p 5 % 50 V 0402

C026 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C027 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C029 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C030 2320107 Ceramic cap. 10 n 5 % 50 V 0603
C031 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C033 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C034 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C035 2320592 Ceramic cap. 2.2 n 5 % 50 V 0402
C038 2320564 Ceramic cap. 150 p 5 % 50 V 0402
C039 2320469 Ceramic cap. Y5 V 0603
C040 2320469 Ceramic cap. Y5 V 0603
C041 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C053 2320584 Ceramic cap. 1.0 n 5 % 50 V 0402
C221 2320779 Ceramic cap. 100 n 10 % 16 V 0603
C261 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C262 2320546 Ceramic cap. 27 p 5 % 50 V 0402
B001 5140117 Cond mic 45+– 3DB 33PF 2K D5.8/9.D5.8/9.0
Z001 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
Z002 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603
T001 3640073 Af–transformer for manual p&p smd SMD
V400 4219922 Transistor x 2 UM6
V401 4219922 Transistor x 2 UM6
V405 4219904 Transistor x 2 UMX1 npn 40 V SOT363
V406 4219908 Transistor x 2 SOT363
N003 4340379 IC, 2xop amp 2.7/3v ssoLMC6572BIMM SSOP8
N402 4340331 IC, Power amp. LM4862 P W SO8S
X100 5409067 SM, pin header 1x04 p1.25 1a STR.
X200 5400125 SM, pcb conn 4mm f 90degree
6400039 Battery spring dmd03655
9854251 PCB LPS1 28.2X33.1X1.0 M4 24/PA

RAE–2 SCHEMATICS
Block Diagram of PDA (0.0 edit 103 v _10)
BoBo_IF_CMT
UI_FLEX
IF
EARPHONE
PDA
INTERNAL_HANDSFREE
RS_IF(2:0)
SYSTEM CONNECTOR
RS_RX
Original 02/99 A3–1

RAE–2 SCHEMATICS
Circuit Diagram of UI FLEX IF (0.0 Edit 72 ) for ver_10

RAE–2 SCHEMATICS
Circuit Diagram of PDA QWERTY Keyboard (0.0 Edit 23 ) for ver_10

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA PWRU (0.0 Edit 137 ) for ver_10

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA MEM (0.0 Edit 64 ) for ver_10

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA MCU Block (0.0 Edit 192 ) for ver_10
PDA PLL

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA B0B0 (0.0 Edit 55 ) for ver_10

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA Internal HF IF (0.0 Edit 83 ) for ver_10
Circuit Diagram of BS1 PDA Earphone (0.0 Edit 25 ) for ver_10

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA PLL (0.0 Edit 42 ) for ver_10
Circuit Diagram of BS1 PDA IRDA (0.0 Edit 27 ) for ver_10

RAE–2 SCHEMATICS
Circuit Diagram of BS1 System Connector Pads (0.0 Edit 26 ) for ver_10
Circuit Diagram of BS1 Lid Switch (0.0 Edit 26 ) for ver_10

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA Test Pads (0.0 Edit 39 ) for ver_10

RAE–2 SCHEMATICS
Parts Placement Diagram of BS1 PDA 1/2 (0.0 ) _10
Parts Placement Diagram of BS1 PDA 2/2 (0.0 ) _10

RAE–2 SCHEMATICS
Circuit Diagram of BS2 (0.0 Edit 116 ) _09

RAE–2 SCHEMATICS
Parts Placement Diagram of BS2 1/2 ) _09
Parts Placement Diagram of BS2 2/2 (0.0 ) _09

RAE–2 SCHEMATICS
Block Diagram of BS8 (3.0 edit 57) v _09
C M T _ C P U
R F
C M T _ A U D I O
C M T _ P O W E R

RAE–2 SCHEMATICS
Circuit Diagram of BS8 GSM RF (2.0 Edit 104 ) _09

RAE–2 SCHEMATICS
Circuit Diagram of BS8 CMT Power (3.1 Edit 111 ) _09

RAE–2 SCHEMATICS
Circuit Diagram of BS8 System Connector (3.1 Edit 61 ) _09

RAE–2 SCHEMATICS
Circuit Diagram of BS8 CMT CPU (3.1 Edit 124 ) _09
. S

RAE–2 SCHEMATICS
Circuit Diagram of BS8 Baseband Connector (3.1 Edit 50) _09

RAE–2 SCHEMATICS
Circuit Diagram of BS8 CMT Audio (3.1 Edit 79) _09

RAE–2 SCHEMATICS
Parts Placement Diagram of BS2 _09

RAE–2 SCHEMATICS
Block Diagram of PDA v _12
65 KEY QWERTY KEYBOARD
IrDA
TEST_PADS
LID SWITCH
PDA_PWRU
Issue 2 10/00 A3–23

RAE–2 SCHEMATICS
Circuit Diagram of UI FLEX IF for ver_12
Issue 2 10/00 A3–24

RAE–2 SCHEMATICS
Circuit Diagram of PDA QWERTY Keyboard for ver_12 **
Issue 2 10/00 A3–25

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA PWRU for ver_12
Issue 2 10/00 A3–26

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA MEM for ver_12
Issue 2 10/00 A3–27

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA MCU Block for ver_12
PDA PLL
Issue 2 10/00 A3–28

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA B0B0 for ver_12
Issue 2 10/00 A3–29

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA Internal HF IF for ver_12
Circuit Diagram of BS1 PDA Earphone for ver_12
Issue 2 10/00 A3–30

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA PLL for ver_12
R429 Not Assembled !
R426 Not Assembled !
Circuit Diagram of BS1 PDA IRDA (0.0 Edit 27 )
Issue 2 10/00 A3–31

RAE–2 SCHEMATICS
Circuit Diagram of BS1 System Connector Pads (0.0 Edit 26 ) for ver_10
Circuit Diagram of BS1 Lid Switch (0.0 Edit 26 ) for ver_10
Issue 2 10/00 A3–32

RAE–2 SCHEMATICS
Circuit Diagram of BS1 PDA Test Pads for ver_12
Issue 2 10/00 A3–33

RAE–2 SCHEMATICS
Parts Placement Diagram of BS1 PDA 1/2 v.12
Parts Placement Diagram of BS1 PDA 2/2 v.12
Issue 2 10/00 A3–34

RAE–2 SCHEMATICS
Circuit Diagram of BS2 v.10
Issue 2 10/00 A3–35

RAE–2 SCHEMATICS
Parts Placement Diagram of BS2 1/2 v.10
Parts Placement Diagram of BS2 2/2 v.10
Issue 2 10/00 A3–36

RAE–2 SCHEMATICS
Block Diagram of BS8 v .11
B–B
CONNECTOR
CMT_CPU
RF
CMT_AUDIO
SYSTEM
CONNECTOR
CMT_POWER
Issue 2 10/00 A3–37

RAE–2 SCHEMATICS
Circuit Diagram of BS8 GSM RF v.11
WORK
Issue 2 10/00 A3–38

RAE–2 SCHEMATICS
Circuit Diagram of BS8 CMT Power v. 11
Issue 2 10/00 A3–39

RAE–2 SCHEMATICS
Circuit Diagram of BS8 System Connector v.11
Issue 2 10/00 A3–40

RAE–2 SCHEMATICS
Circuit Diagram of BS8 CMT CPU v.11
Issue 2 10/00 A3–41

RAE–2 SCHEMATICS
Circuit Diagram of BS8 Baseband Connector v.11
Issue 2 10/00 A3–42

RAE–2 SCHEMATICS
Circuit Diagram of BS8 CMT Audio v.11
Issue 2 10/00 A3–43

RAE–2 SCHEMATICS
Parts Placement Diagram of BS8 v.11
Issue 2 10/00 A3–44

Service Manual Nokia 9110

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Service Manual Nokia 9110

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Programs After Market Services (PAMS)

RAE–2 ISSUE 2 10/2000

Copyright 1999. Nokia Mobile Phones. All Rights Reserved.

AMENDMENT RECORD SHEET

Issue 2 10/2000 OJuntune 9: Mechanical parts:

Issue 2 10/2000 OJuntune 10:Schematic diagrams:

Page 2 Issue 2 10/00

RAE–2 SERVICE MANUAL

1 Overview of NOKIA communicator

Issue 2 10/00 Page 3

Please send to: Nokia Mobile Phones Ltd

Page 4 Issue 2 10/00

Warnings and Cautions

Issue 2 10/00 Page 5

This page intentionally left blank.

Page 6 Issue 2 10/00

AMENDMENT RECORD SHEET

Page 1–2 Issue 2 10/00

Technical Documentation General Information

CHAPTER 1 – GENERAL INFORMATION

Issue 2 10/00 Page 1–3

External Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1–30

Page 1–4 Issue 2 10/00

Technical Documentation General Information

Issue 2 10/00 Page 1–5

Name of Sales Package Sales Sales Notes

Page 1–6 Issue 2 10/00

Technical Documentation General Information

Units and Accessories

Name of unit or accessory Type code Material Notes

Accessories for PC connection

Issue 2 10/00 Page 1–7

Headset differs from DCT3 headset, having a different connector.

Page 1–8 Issue 2 10/00

Technical Documentation General Information

Battery and Chargers

Battery European charger UK charger Australian charger

BLN–3 ACP–9E ACP–9X ACP–9A

Issue 2 10/00 Page 1–9

Lid PDA CMT AssemblyParts PDA co–label type LanguageSW

Name of module Type code Material Notes

Page 1–10 Issue 2 10/00

Technical Documentation General Information

Type Labels for 9110

UK English German French

Scandinavian Finnish Norwegian

Danish Italian Swedish

Issue 2 10/00 Page 1–11

APAC1 APAC2 Spanish

Portuguese Airtel Movistar

Page 1–12 Issue 2 10/00

Technical Documentation General Information

Figure 1. English keymat

Figure 2. French keymat

Issue 2 10/00 Page 1–13

Figure 3. German keymat

Figure 4. Italian keymat

Page 1–14 Issue 2 10/00

Technical Documentation General Information

Figure 5. Spanish keymat

Figure 6. Scandinavian keymat

Issue 2 10/00 Page 1–15

Average Current Consumption

Backlight power consumption is 60mA. Handsfree consumes about 80mA.