Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Introduction:
Embedded Systems are application specific electronic sub-systems which are completely
encapsulated by the main system it belongs to. The main system can range from household
appliances, home automation, consumer electronics, ATMs, network routers, automobiles,
aircrafts, IoT, etc. The M. Tech. programme in Embedded Systems and Solution (ESS) has been
introduced in the Department to foster growth and entrepreneurship in Electronics System Design
and Manufacturing (ESDM) and to help meet growing demand of highly skilled manpower in
various domains of Embedded System Design which is essential to support Electronics System
Design and Manufacturing (ESDM), a much sort-after destination as endorsed in National Policy
on Electronics by the Govt. of India.
Duration:
Eligibility:
Mode of Selection:
Selection of candidates to the programme shall be made on the basis of a valid GATE Score.
Intake Capacity:
TWENTY (20) (for academic Year 2016-2017) to be filled up from Open Merit and Reserved
Categories as per the University Admission Policy.
Course Fee:
Total Fees: Rs. 1,46,750/= (Part A: Rs. 10,000/= per year; Part B: Rs. 31,250/= per semester; Part
C: Rs. 1,750/= per year)
Course Structure and Syllabus of M. Tech. in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
2
Course Structure:
The M. Tech. programme in Embedded Systems and Solutions (ESS) is a four semester
programme. The first three semesters of the programme comprise of academic course
work. During the fourth semester, a student has to take up an industry internship, or
pursue academic research in the Department leading to M. Tech. thesis (no grouping is
permitted). The programme also includes a unique 4-week period at the beginning of the
programme called a “Preparatory Term”. The preparatory term in intended to bring
all the incoming students up to a uniform background that is considered essential to
embark on M. Tech. degree in Embedded Systems and Solutions. This Preparatory Term
covers a programming course and a course on electronic circuits and systems. After the
4-week preparatory term, the first semester of the M. Tech. programme consists of
foundational courses in Embedded Systems that include the fundamentals of embedded
systems, microcontrollers, digital system design and wireless communication and
networks. The second semester includes an 8-week period called the “Winter Term”
which is intended to build foundation of research aptitude and presentation skills in the
students. In this term the students through self-study will learn various research
methodologies and prepare seminar presentation on some contemporary topic in
electronic system design. The second and third semesters includes advanced topics in
embedded system design that include embedded programming languages, system design
with ARM Cortex microcontrollers, VLSI architecture and design methodologies,
digital signal processor and architecture and internet of things. Students shall have to
choose four elective courses in their area of interest and specialization. The final
semester is designated for industry Internship or a research Thesis.
End Term
Practical
Course
Tutorial
Internal
Lecture
Total
Code
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
3
Semester – II (JAN – JUN)
Hours Marks
End Term
Credits
Practical
Tutorial
Course
Internal
Lecture
Term Course Title
Total
Code
End Term
Credits
Practical
Course Tutorial
Internal
Lecture
Total
Code
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
4
Semester – IV (JAN – JUN)
Hours Marks
Credits
End Term
Practical
Course
Tutorial
Internal
Lecture
Term Course Title
Total
Code
Semester IV
Internship ESS-401I Internship 0 0 48 24 900 0 900
(JAN – JUN)
Semester IV
Thesis ESS-401T Project and Thesis 0 0 48 24 200 700 900
(JAN – JUN)
900/ 0/
Semester – IV (Internship/Thesis) Total 0 0 48 24 900
200 700
Examinations:
Semester – I:
a) Preparatory Term Examination: on 1st and 2nd working days of August; Students who
do not qualify the Preparatory Term shall have to qualify it before appearing in Course work
examination of 1st semester. This term is of Pass/Fail Nature and therefore, students will
not secure any credit or marks in this term.
b) Course Work Examination: Commences in 2nd Week of December.
Semester – II:
a) Winter Term Examination: 1st Week of March; Students who do not qualify the Winter
Term shall have to qualify it before appearing in Course work examination of 2nd semester.
b) Course Work Examination: Commences in 2nd Week of June.
Semester – III:
a) Course Work Examination: Commences in 2nd Week of December.
Semester – IV:
a) Internship and Thesis Examination: Commences in 2nd Week of July.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
5
Students entering the M. Tech in Embedded Systems and Solutions programme are
expected to come with prior knowledge of programming and electronic system design.
While we do not wish to conduct full-fledged programming courses at the Masters level,
we will provide an opportunity for the students to hone up their programming skills in
a structured way as part of the preparatory term. The preparatory term has one course
in programming (covering essentials of programming languages in general). The other
course on electronic system design will provide an opportunity to get hands-on with
electronic circuits, systems and simulation tools. The two courses will not carry any
credits. However, they are mandatory courses with a PASS/FAIL grade. The
Programming and Electronic Circuits and Systems will be taught with emphasis on
hands-on activities.
In Pre-Internship, students shall choose a specific domain for their Internship and
identify prospective organizations and apply for Internship programmes. For Pre-
Internship work, a counselor will be assigned to each student, who at the beginning of
the 3rd semester shall guide him/her regarding identifying the prospective
organizations and applying therein.
Internship shall be of six months (Minimum 18 weeks’) duration and a student can
accumulate 24 credits on successful completion of internship. Internships shall be
considered as six months (not less than 18 weeks) of supervised learning carried out at
industry or some academic institution of excellence. Students are encouraged to apply
for internship in 3rd semester to companies or academic institutions so that its
commencement is ensured at the beginning of 4th semester.
In the Pre-Project work, students shall choose a specific topic/area for their project.
A supervisor will be assigned to each student, who at the beginning of the 3rd semester
shall provide a syllabus and plan of study including relevant research papers to the
student.
Project and Thesis shall be of six months (Minimum 18 weeks’) duration and a student
can accumulate 24 credits on successful completion of Project. This is in addition to
pre-project work in 3rd semester wherein students shall choose a specific topic/area
for their project and undertake its study.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
6
Learning Objectives
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
7
Learning Objectives
To understand the basic concepts of problem solving approaches from the basics of mathematical functions and operators to the
design and use of techniques such as codes, arrays, pointers, other data structures, and object-oriented programming concepts.
To explore problem-solving tools, such as problem analysis charts, interactivity charts, IPO charts, algorithms, and flowcharts
and Universal Modelling Language (UML), to design a solution to a problem.
To design, implement, test, and apply various logic structures, data structures and advanced concepts such as libraries, and
multi file programming paradigms through C programming language.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
8
Learning Objectives
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
9
Learning Objectives
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
10
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
11
Learning Objectives
To Study the Fundamentals of Wireless Networks, and Existing Architecture of Wireless Networks, To provide a
comprehensive background knowledge of Wireless Communication, To Define different types of Wireless Topologies,
constraints of wireless Networks, Need of the wireless and Adhoc Networks, To learn Protocols used in the Wireless
Networks and Security of the wireless Sensor Networks.
Unit 1: The Cellular Concept-System Design Fundamentals
Introduction, Frequency Reuse, Channel Assignment Strategies, Handoff Strategies, Practical Handoff
Considerations, Interference and System capacity – Co channel Interference and system capacity, Channel planning
for Wireless Systems, Adjacent Channel interference, Improving Coverage & Capacity in Cellular Systems- Cell
Splitting, Sectoring.
Unit 2: Mobile Radio Propagation: Large-Scale Path Loss
Introduction to Radio Wave Propagation, Free Space Propagation Model, Basic Propagation Mechanisms,
Reflection-Reflection from Dielectrics, Brewster Angle, Reflection from prefect conductors, Ground Reflection
(Two-Ray) Model, Diffraction-Fresnel Zone Geometry, Knife-edge Diffraction Model, Scattering, Outdoor
Propagation Models, Partition losses between Floors, Log-distance path loss model, Ericsson Multiple Breakpoint
Model, Attenuation Factor Model, Signal penetration into buildings, Ray Tracing and Site Specific Modelling.
Unit 3: Mobile Radio Propagation: Small Scale Fading and Multipath
Small Scale Multipath propagation-Factors influencing small scale fading, Doppler shift, Impulse Response Model
of a multipath channel- Relationship between Bandwidth and Received power, Small-Scale Multipath
Measurements, Spread Spectrum Sliding Correlator Channel Sounding, Frequency Domain Channels Sounding,
Parameters of Mobile Multipath Channels-Time Dispersion Parameters, Coherence Bandwidth, Doppler Spread
and Coherence Time, Types of Small-Scale Fading-Fading effects, Statistical Models for multipath Fading Channels
Introduction to RAKE Receiver.
Unit 4: Equalization and Diversity
Introduction, Fundamentals of Equalization, Training A Generic Adaptive Equalizer, Equalizers in a
communication Receiver, Linear Equalizers, Nonlinear Equalization, Maximum Likelihood Sequence Estimation
(MLSE) Equalizer, Algorithms for adaptive Equalization, Diversity principles and Techniques, Maximal Ratio
Combining, Equal Gain Combining, Polarization Diversity, Frequency Diversity, Time Diversity.
Unit 5: Wireless Networks
Introduction to wireless Networks, Various Wireless technologies, Shared Wireless Access Protocol (SWAP),
WLAN Topologies, WLAN Standard IEEE 802.11, IEEE 802.11 Medium Access Control, Comparison of IEEE
802.11 a, b, g and n standards, IEEE 802.16 and its enhancements, Wireless PANs (architecture and applications),
Introduction to Hipper LANS, WLL.
Text and Reference Books:
1. Wireless Communication and Networks, William Stallings, prentice Hall Ltd...
2. Wireless Communications: Principles & Practices, Rappaport, Prentice Hall Ltd.
3. Modern Wireless Communications, Haykin and Moher, Prentice Hall Ltd.
4. Fundamentals of Wireless Communication, David Tse, Pramod Vishwanath, Cambridge University Press.
5. Handbook of Wireless & Mobile Computing, Ivan Stojmenovic, john Wiley and Sons.
6. Wireless Communication and Networking, Vijay Garg, Morgan koufman, Elsevier.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
12
List of Experiments
List of Experiments
Experiments on Advanced Digital System Design
1. Review Experiments using Cadence Virtuso tool kit on the design of
Combinational logic circuits
Sequential logic circuits
Arithmetic circuits
2. Experiments on the design of subsystems on Cadence Virtuso tool kit.
3. Learning Layout in Cadence Virtuso tool kit.
4. Programs using VHDL on the design of
Combinational logic circuits
Sequential logic circuits
Arithmetic circuits
Experiments on Wireless Communication
5. To Demonstrate Infrastructure and Adhoc wireless Network.
6. To establish the connectivity between devices using Bluetooth and infrared
7. To Design a wireless communication System using RF transmitter and receiver kit/RF Modules.
8. To configure a wireless network using Raspberry PI/Arduino/LPC Boards.
9. To design a wireless network using Wi-Fi IEEE 802.11 Wireless Module Hardware.
10. To configure the Simple Web Server using Raspberry PI/Arduino/LPC Boards.
11. Ten Experiments on Wireless Communication and Networks using Matlab.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
13
Learning Objectives
Unit 1: Introduction
Definition, mathematical tools for analysis, Types of research, exploratory research, conclusive research,
modelling research, algorithmic research, Research process- steps. Data collection methods- Primary data –
observation method, personal interview, telephonic interview, mail survey, questionnaire design. Secondary
data- internal sources of data, external sources of data.
Unit 2: Sampling Methods
Scales – measurement, Types of scale – Thurstone’s Case V scale model, Osgood’s Semantic Differential scale,
Likert scale, Q- sort scale. Sampling methods- Probability sampling methods – simple random sampling with
replacement, simple random sampling without replacement, stratified sampling, cluster sampling. Non-
probability sampling method – convenience sampling, judgment sampling, quota sampling.
Unit 3: Hypotheses Testing
Testing of hypotheses concerning means -one mean and difference between two means -one tailed and two
tailed tests, concerning variance – one tailed Chi-square test.
Unit 4: Research in Embedded Systems
Embedded System: Scope – Economics Stakes – Trends – State of Art – Examples: Air Traffic control – The
Next Generation: Technological challenges – Scientific challenges - Cost.
Unit 5: Challenges and Case Study
Physical Systems Engineering: Analytical Models – Computing Systems Engineering: Computational Models
– Proposed Vision: Multidisciplinary Integration – Sub – Challenge: Integrate Analytical and Computational
Models. Case Study: apply Research Methodology principles into design and manufacturing field.
Text and Reference Books:
1. Kothari, C.R., Research Methodology –Methods and Techniques, New Age Publications, New Delhi, 2009.
2. Panneerselvam, R., Research Methodology, Prentice-Hall of India, New Delhi, 2004.
Details
Each student shall present a seminar in the 2nd semester on a topic relevant to Embedded Systems for about
30 minutes. The topic should not be a replica of what is contained in the syllabus. The topic shall be approved
by the Seminar Evaluation Committee of the Department. The committee shall evaluate the presentation of
students. Seminar report in the prescribed form shall be submitted to the department after the approval from
the committee.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
14
Learning Objectives
To impart advanced concepts of programming languages such as libraries, low level features, programme structures, pre-
processor directives, project files, and other concepts as applicable to embedded systems.
To introduce object oriented programming concepts such as classes and templates for real time programming and writing
code for microcontrollers using C++.
You also learn how to use the Keil uVision IDE to create projects, build and download them to the board.
To provide hands-on-skills with the use of Embedded Java and Note.js for making embedded systems accessible through
the Web.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
15
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
16
Learning Objectives
While there has been a lot of growth in embedded systems, recent tight integration of sensors and actuators, coupled with readily
available networking, provide opportunity for even more explosive growth. The major architecture of embedded processors is ARM.
It has recently created much more useable, efficient and powerful processor families that facilitate faster and better all-integrated
development of embedded hardware, software, networking and sensing/actuating functions. The Course objectives include
understanding of the design methods, tools and flows in developing embedded systems; understand modern embedded processor
architectures; learn the advantages of modern ARM Cortex M processors for faster/better design, debug and execution; to be able
to use modern software frameworks for embedded systems including CMSIS-DSP and CMSIS-RTOS.
Unit 1: Introduction to ARM
A brief history of ARM, evolution, Architecture versions and Thumb ISA, Processor naming and ARM
ecosystem, Cortex - M processor family, Advantages of the Cortex -M processors, Applications of the ARM
Cortex-M processors, Introduction to Cortex-M3 and Cortex-M4 processors (Processor architecture,
Instruction set, Block diagram, Memory system, Interrupt and exception support).
Unit 2: Architecture of Cortex M3 and M4 Processors
Programmer’s model, Operation modes, Registers, Memory System, features, stack memory, memory
requirements, endianness, bit band operations, access permissions and attributes, memory barriers, Low power
design and features, low power application development, overview of exceptions and interrupts, exception
types and interrupt management, vector table, exception sequence, use of NVIC register, SCB register and
other special registers for exception and interrupt control, configuration control and auxiliary control registers.
Unit 3: Instruction Set of Cortex M3 and M4 Processors
Evolution of ARM ISA, Comparison of the instruction set in ARM Cortex-M Processors, Unified Assembly
Language, Addressing modes, Instruction set, Program flow control (branch, conditional branch, conditional
execution, and function calls), Multiply accumulate (MAC) instructions, Divide instructions, Memory barrier
instructions, Exception-related instructions, Sleep mode-related instructions, Other functions, Introduction to
Cortex-M4 processor support for Enhanced DSP instructions, Writing C and Assembly language programs.
Unit 4: Cortex OS Support and Memory Protection
OS support features, Shadowed stack pointer, SVC and PendSV exception, Context switching, Exclusive
accesses and embedded OS, MPU overview, MPU registers (type, control, region number, region base attribute,
region base address, alias), memory barrier configuration, memory management faults, fault handlers, exception
handling faults.
Unit 5: Floating Point Operations
Review of floating point numbers, Cortex M4 floating point unit (FPU), floating point registers, Lazy stacking,
interrupt of lazy stacking, Floating point exceptions. Introduction to advanced features of Cortex M3 and M4
processors. Introduction to Debug and trace, Debug architectures, modes and events.
Text and Reference Books:
1. The Definitive Guide to ARM Cortex M3 and Cortex-M4 Processors, Third Edition, Joseph Yiu, Elsevier Publication,
2015.
2. Assembly Language Programming ARM Cortex-M3 by Vincent Mahout Wiley Publication, 2012.
3. Embedded Systems with ARM Cortex-M Microcontrollers in Assembly Language and C, Yifeng Zhu, 2nd Edition, E-
Man Press LLC Publication, 2015.
4. ARM Assembly Language Fundamentals and Techniques, William Hohl and Christopher Hinds, CRC Press, 2015.
5. Embedded Systems: Introduction to Arm(r) Cortex -M Microcontrollers: 1, Jonathan W Valvano, 2015.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
17
Learning Objectives
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
18
Learning Objectives
Learning Objectives: To expose students to various types of Transducers, To expose students to various applications of
Transducers and To acquaint students with the design of various types of Transducers.
Course Outcomes: After going through this course the student will be able to use sensors for particular application,
Design sensors for particular application and Think about the design of new types of sensors.
Unit 1: Introduction
Sensors / Transducers: Principles – Classification – Parameters – Characteristics – Environmental Parameters
(EP) – Characterization. Mechanical and Electromechanical Sensors: Introduction – Resistive Potentiometer
– Strain Gauge – Resistance Strain Gauge – Semiconductor Strain Gauges -Inductive Sensors: Sensitivity and
Linearity of the Sensor –Types-Capacitive Sensors.
Unit 2: Thermal Sensors:
Introduction – Gas thermometric Sensors – Thermal Expansion Type Thermometric Sensors – Acoustic
Temperature Sensor – Dielectric Constant and Refractive Index thermos-sensors – Helium Low Temperature
Thermometer – Nuclear Thermometer – Magnetic Thermometer – Resistance Change Type Thermometric
Sensors –Thermo-emf Sensors– Junction Semiconductor Types– Thermal Radiation Sensors –Quartz Crystal
Thermoelectric Sensors – NQR Thermometry – Spectroscopic Thermometry – Noise Thermometry – Heat
Flux Sensors.
Unit 3: Radiation Sensors:
Introduction – Basic Characteristics – Types of Photosensistors/Photo detectors– X-ray and Nuclear
Radiation Sensors– Fiber Optic Sensors
Unit 4: Smart Sensors:
Introduction – Primary Sensors – Excitation – Amplification – Filters – Converters –Compensation–
Information Coding/Processing - Data Communication – Standards for Smart Sensor Interface – The
Automation.
Unit 5: Actuators:
Pneumatic and Hydraulic Actuation Systems- Actuation systems – Pneumatic and hydraulic systems -
Directional Control valves – Pressure control valves – Cylinders - Servo and proportional control valves –
Process control valves – Rotary actuators Mechanical Actuation Systems- Types of motion – Kinematic chains.
Text and Reference Books:
Text Books
1. D. Patranabis – “Sensors and Transducers” –PHI Learning Private Limited.
2. W. Bolton – “Mechatronics” –Pearson Education Limited.
Reference Books
3. Sensors and Actuators – D. Patranabis – 2nd Ed., PHI, 2013.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
19
Learning Objectives
Learning Objectives: The course aims to provide an appreciation for the motivation behind SoC design, the challenges of
SoC design, and the overall SoC design flow and to understand SoC Verification flow and complexity in SoC
verification.
Course Outcomes: After successful completion of the course, students should be able to: Understand the concept of System
on Chip., Get detailed knowledge of SoC Design flow, Get detailed understanding of System on Chip Design process,
Get detailed understanding of complexity in verification and to build SoC Verification environment., Understand the
different communication architecture used in MpSoC and CO5 Design memory and component based application on
MpSoC.
Unit 1: Motivation for SoC Design
Review of Moore‟s law and CMOS scaling, benefits of system-on-chip integration in terms of cost, power,
and performance. Comparison on System-on-Board, System-on-Chip, and System-in-Package. Typical goals
in SoC design – cost reduction, power reduction, design effort reduction, performance maximization.
Productivity gap issues and the ways to improve the gap – IP based design and design reuse.
Unit 2: System On Chip Design Process
A canonical SoC Design, SoC Design flow, waterfall vs spiral, top down vs bottom up, Specification
requirement, Types of Specification, System Design Process, System level design issues, Soft IP vs Hard IP, IP
verification and Integration, Hardware-Software codesign, Design for timing closure, Logic design issues,
Verification strategy, On chip buses and interfaces, Low Power, Hardware Accelerators in Soc.
Unit 3: Embedded Memories
Cache memories, flash memories, embedded DRAM. Topics related to cache memories. Cache coherence.
MESI protocol and Directory-based coherence.
Unit 4: Interconnect architectures for SoC
Bus architecture and its limitations. Network on Chip (NOC) topologies. Mesh-based NoC. Routing in an
NoC. Packet switching and wormhole routing.
Unit 5: MPSoCs and Case Study
MPSoCs: What, Why, How MPSoCs, Techniques for designing MPSoCs, Performance and flexibility for
MPSoCs design. Case Study: A Low Power Open Multimedia Application Platform for 3G Wireless.
Text and Reference Books:
Reference Books:
1. “SoC Verification-Methodology and Techniques”, Prakash Rashinkar, Peter Paterson and Leena Singh. Kluwer Academic
Publishers, 2001.
2. Sudeep Pasricha and Nikil Dutt,"On-Chip Communication Architectures: System on Chip Interconnect”, Morgan
Kaufmann Publishers © 2008.
3. Rao R. Tummala, Madhavan Swaminathan, “Introduction to system on package sop- Miniaturization of the Entire Syste”,
McGraw-Hill, 2008.
4. James K. Peckol, “Embedded Systems: A Contemporary Design Tool”, Wiley Student Edition.
5. Michael Keating, Pierre Bricaud, “Reuse Methodology Manual for System on Chip designs”, Kluwer Accademic Publishers,
2nd edition, 2008.
6. Sung-Mo Kang, Yusuf Leblebici, “CMOS Digital Integrated Circuits”, Tata Mcgraw-Hill, 3rd Edition.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
20
Learning Objectives
Learning Objectives: To Identify Different MOS Technologies, their fabrication process, trends and projections, understand
basic electrical properties, threshold voltage concepts inform of mathematical equations, Design of combinational networks,
analyzation of power optimization, Apply these Concepts to Design validation, Need for clocking disciplines, methods,
design validation and testing and understanding of Different Floor planning methods, high level synthesis, off-chip
connections.
Course Outcomes: After going through this course the student will be able to Understand the importance of multimedia in
today’s online and offline information sources and repositories, Understand how Text, Audio, Image and Video information
can be represented digitally in a computer, so that it can be processed, transmitted and stored efficiently, Gain a basic
understanding of Information Theory which underpins multimedia data compression Algorithms, Understand statistical
coding techniques including basic and advanced Video Compression Techniques including MPEG techniques. And
Understand the basic audio coding techniques including predictive coding and more advanced techniques based around LPC
and sub-band coding.
Unit 1: Introduction
Introduction to Multimedia: Multimedia, World Wide Web, Overview of Multimedia Tools, Multimedia
Authoring, Graphics/ Image Data Types, and File Formats. Color in Image and Video: Color Science – Image
Formation, Camera Systems, Gamma Correction, Color Matching Functions, White Point Correction, XYZ
to RGB Transform, Color Models in Images and video, Transformation from RGB to CMYK, Video Color
Transforms.
Unit 2: Video and Audio Concepts
Video Concepts: Types of Video Signals, Analog Video, Digital Video. Audio Concepts: Digitization of Sound,
Quantization and Transmission of Audio.
Unit 3: Compression Algorithms
Lossless Compression Algorithms: Run Length Coding, Variable Length Coding, Arithmetic Coding, Lossless
JPEG, Image Compression. Lossy Image Compression Algorithms: Transform Coding: KLT and DCT
Coding, Wavelet Based Coding. Image Compression Standards: JPEG and JPEG2000.
Unit 4: Video Compression Techniques
Introduction to Video Compression, Video Compression Based on Motion Compensation, Search for Motion
Vectors, H.261- Intra-Frame and Inter-Frame Coding, Quantization, Encoder and Decoder, Overview of
MPEG1 and MPEG2.
Unit 5: Audio Compression Techniques
ADPCM in Speech Coding, G.726 ADPCM, Vocoders – Phase Insensitivity, Channel Vocoder, Formant
Vocoder, Linear Predictive Coding, CELP, Hybrid Excitation Vocoders, MPEG Audio – MPEG Layers,
MPEG Audio Strategy, MPEG Audio Compression Algorithms, MPEG-2 AAC, MPEG-4 Audio.
Text and Reference Books:
Text Books
1. Fundamentals of Multimedia – Ze- Nian Li, Mark S. Drew, PHI, 2010.
2. Multimedia Signals & Systems – Mrinal Kr. Mandal Springer International Edition 1st Edition, 2009
Reference Books
3. Multimedia Communication Systems – Techniques, Stds&Netwroks K.R. Rao, Zorans. Bojkoric, Dragorad
A.Milovanovic, 1st Edition, 2002.
4. Fundamentals of Multimedia Ze- Nian Li, Mark S.Drew, Pearson Education (LPE), 1st Edition, 2009.
5. Multimedia Systems John F. KoegelBufond Pearson Education (LPE), 1st Edition, 2003.
6. Digital Video Processing – A. Murat Tekalp, PHI, 1996.
7. Video Processing and Communications – Yaowang, JornOstermann, Ya-QinZhang, Pearson, 2002
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
21
List of Experiments
1.
Exploring GPIO lines of LPC1768 and interfacing it with LEDs and blinking it in different
fashion.
Interface Switch and Relay to LPC1768. If a switch is pressed then the relay would be ON and if
2.
another switch is pressed relay would be OFF.
3. Interface 16X2 LCD to LPC1768 and display a string on it.
4.
Study UART protocol and perform following experiments in polling mode as well as Interrupt
mode. a) Transmit a string of characters on UART; b) Receive a string of characters on UART.
5. Interfacing Seven Segment Display to LPC1768.
6. Write a program to show digital values using on chip ADC.
7. Interfacing TFT display to LPC1768.
8. Implementing ETHERNET protocol using LPC1768.
Additional Experiments (using Cortex M4) (Any Three)
Explore GPIO lines of ARM Cortex M4 and interface Matrix Keypad to it and display key code
9.
of the corresponding key pressed.
10.
Study I2C protocol and interface I2C based EEPROM to ARM Cortex M4 and write and read a
character on EEPROM.
11.
Study SPI protocol and interface SPI based EEPROM to ARM Cortex M4 and write and read a
character on EEPROM.
12. Write a program to set and display date and time of on chip RTC.
13. Write a program to generate different wave form like square, triangular, Sine wave using DAC.
14. Study CAN protocol and Write a program for CAN self-test
15. Write a program to understand watch dog timer.
List of Experiments
1. Study of Xilinx boards.
2. Study of Actel boards.
3. Designing combinational and sequential circuits on FPGA Kit.
a) Adders and subtarctors.
b) Multiplexers and demultiplexers
c) Encoders and decoders
d) Flip-Flops
e) Counters
f) Shift Registers
g) RAM
h) Basic Microprocessor
4. Designing combinational and sequential circuits using VHDL.
a) Counters
b) Shift Registers
c) RAM
d) Basic Microprocessor
5. Experiments on FPGA applications
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
22
Learning Objectives
Learning Objectives: To cover techniques for designing efficient DSP architectures, To study the Architectural details of
TMS320C54xx DSPs and the concepts involved in execution control and pipelining, To present clear idea of Number
formats for signals and sources of errors in DSP implementation, Memory & I/O interfacing for digital signal processors
and Implementations of basic DSP algorithms.
Course Outcomes: After going through this course the student will be able to Understand concepts of Digital signal
processor, like its architecture, registers etc., Writing programs using the instruction set of DSP processor, Interfacing
different devices to the processor., Understand all the peripherals existing on the DSP processor, Apply DSP processors
in real time and Ability to analyze the DSP algorithms.
Unit 1: Introduction
Introduction to DSP Processors: Digital Signal Processors, various architectures: VLIW Architecture, Multiprocessor
DSPs, SHARC, SIMD, MIMD, RISC and CISC. Execution Control and Pipelining: Hardware looping, Interrupts, Stacks,
Relative Branch support, Pipelining and Performance, Pipeline Depth, Interlocking, Branch effects, Interrupt effects,
Pipeline Programming models.
Unit 2: Typical real-time DSP Systems
Data representations and arithmetic, Conventional number system, redundant number system, residue number system-
bit- parallel and bit-serial arithmetic, basic shift accumulator, reducing the memory size, complex multipliers, improved
shift – accumulator, Analog - to – digital conversion process, Uniform and non-uniform quantization and encoding,
Oversampling in A/D conversion, Digital to analog conversion process: signal recovery, the DAC, Anti-imaging filtering,
Oversampling in D/A conversion, Analog I/O interface for real-time DSP systems, sources of errors in DSP
implementation, real time implementation considerations.
Unit 3: Fixed-Point DSP Processors
Architecture of TMS 320C 5X, C54X Processors, addressing modes, Memory space of TMS320C54XX Processors,
Program Control, TMS320C54XX instructions and Programming, On-Chip Peripherals, Interrupts of TMS320C54XX
processors, Pipeline operation of TMS320C54XX Processors, speed issues.
Unit 4: Memory and I/O Interfacing
External bus interfacing signals, Memory interface, Parallel I/O interface: Programmed I/O, Interrupts and I/O, Direct
memory access (DMA). Hardware interfacing, Multichannel Buffered Serial Port (McBSP), McBSP Programming,
CODEC interface circuit.
Unit 5: Implementation of DSP Algorithms
The Q-notation, FIR Filters, IIR Filters, Interpolation Filters, Decimation Filters, PID Controller, Adaptive Filters, 2-D
Signal Processing. An FFT Algorithm for DFT Computation, A Butterfly Computation, Overflow and scaling, Bit-
Reversed index generation, An 8-Point FFT implementation on the TMS320C54XX.
Text and Reference Books:
Text Books
1. Digital Signal Processing – Avtar Singh and S. Srinivasan, Thomson Publications, 2004.
2. Digital Signal Processing A Practical approach, Second Edition, Emmanuel C. Ifeachor,Barrie W Jervis, Pearson
Publications. 2002.
3. Keshab K. Parhi, VLSI digital Signal Processing Systems design and Implementation, John Wiley and Sons, 2004.
Reference Books
4. Digital Signal processors Architectures, implementations and Applications-SenM.Kuo, Woon-SengS.Gan, Pearson
Publications, 2009.
5. Digital Signal Processors, Architecture, Programming and Applications – B. VenkataRamani and M. Bhaskar,TMH,
2004.
6. Digital Signal Processing – Jonatham Stein, John Wiley, 2005.
7. DSP Processor Fundamentals, Architectures and Features – Lapsley , S. Chand, 2000.
8. “DSP Applications with TMS 320 Family”, K. Shin, Prentice Hall, 1987.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
23
Learning Objectives
Learning Objectives: To introduce the principles of Analog and Mixed Signal System Design, Design and Analysis of
Complex Analog and Mixed CMOS Circuits to provide a foundation for more complicated and advanced Designs, To
introduce the concept of switched capacitor techniques and To address practical issues in Analog and Mixed Signal
System Design
Course Outcomes: After successful completion of the course, students should be able to: Detailed knowledge of static and
dynamic behavior of CMOS logic, Detailed understanding of CMOS Digital Subsystem Design, Timing analysis and
synchronization of digital design, Basic understanding of Analog circuit building blocks, Detailed understanding of
Analog Mixed Signal Circuit Design and Detailed Understanding of Data Converters.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
24
Learning Objectives
To introduction of embedded security issue. Security major concerns data, design and system protection.
To learn cryptographic concepts in the context of embedded systems and their unique constraints and requirements.
To expose to forensics procedures and digital data acquisition mechanisms using FKT and FRED
Unit 1: Introduction
The CIA Triad, Identification, Authentication and Authorization, Security Principles and Models. Network
Attacks - Types and Sources, Architecture Security, Secure Network design, Firewalls, introduction to Intrusion
Controls (IDS/IPS), Introduction to Wireless LAN Security Standards, The One-Time Pad, Cryptographic
Modes, Block Ciphers, Authenticated Encryption, Public Key Cryptography, Key Agreement, Public Key
Authentication
Unit 2: Embedded Cryptography
Elliptic Curve Cryptography, Cryptographic Hashes, Message Authentication Codes, Random Number
Generation, Key Management for Embedded Systems, Cryptographic Certifications. Introduction to data
protection protocols for embedded systems. Internet security for embedded systems, IPsec.
Unit 3: Embedded Systems Security
Embedded system security requirements and issues, embedded software attacks and countermeasures,
Hardware Security in Embedded Systems, secured hardware architectures for embedded systems, tamper-
resistant hardware, Introduction to trust models for secure embedded hardware and software embedded
processing architectures for security, Communications Security in Embedded Systems.
Unit 4: Digital Forensics
The Six A's, Forensic Types: Disk Forensics, Network Forensics, Mobile Device Forensics, Live Forensics,
Memory Forensics, Multimedia Forensics, Internet Forensics, Cyber Crime Investigations and Digital
Forensics, Disk Based Forensics, Cybercrime, Forensic process and methodology, Digital evidence, Incident
response, Searching and analysis tools, Email & Browsers, Intrusion detection, Attack trace-back, Packet
inspection, Log analysis, Hashing issues, Anti-forensics (encryption and stealth techniques), Forensics in
embedded systems.
Unit 5: Practice with Forensic Tools
Data Acquisition Hardware Tools, Use FRED to create images on different media, recovering the deleted files,
Investigative tools (Open Source and Proprietary), Using Forensic Software such as FTK/Encase etc. Use
FTK preview evidence, export evidence files, create forensic images and convert existing images, create a case
in FTK, Use FTK to process and analyze documents, metadata, graphics and e-mail, Use the FTK Data
Carving feature to recover files from unallocated disk space. Web/E-mail forensics analysis, Mobile evidence,
Extracting and analysing mobile evidence.
Text and Reference Books:
1. David Kleidermacher, Mike Kleidermacher, Embedded Systems Security - Practical Methods for Safe and Secure
Software and Systems Development, Newnes, Elsevier, 2012.
2. Charlie Kaufman, Radia Perlman, and Mike Speciner, Network Security: PRIVATE Communication in a PUBLIC
World, Prentice Hall.
3. Francine Krief (Editor), Communicating Embedded Systems: Networks Applications, Wiley.
4. John Sammons, Digital Forensics with the AccessData Forensic Toolkit (FTK), MCGRAW HILL COMPANIES
5. CEH: Certified Ethical Hacker Version 8 Study Guide by Sean-Philip Oriyano (Author) Publisher sybex
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
25
Learning Objectives
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
26
Learning Objectives
Unit 1: Introduction
Fundamentals of Wireless Communication Technology – The Electromagnetic Spectrum – Radio propagation
Mechanisms – Characteristics of the Wireless Channel -mobile ad hoc networks (MANETs) and wireless
sensor networks (WSNs): Concepts and architectures. Applications of Ad Hoc and Sensor networks. Design
Challenges in Ad hoc and Sensor Networks.
Unit 2: MAC Protocols for AD HOC Wireless Networks
Issues in designing a MAC Protocol- Classification of MAC Protocols- Contention based protocols-
Contention based protocols with Reservation Mechanisms- Contention based protocols with Scheduling
Mechanisms – Multi channel MAC-IEEE 802.11
Unit 3: Routing Protocols and Transport Layer in Ad Hoc Wireless Networks
Issues in designing a routing and Transport Layer protocol for Ad hoc networks- proactive routing, reactive
routing (on-demand), hybrid routing- Classification of Transport Layer solutions-TCP over Ad hoc wireless
Networks.
Unit 4: WSN and MAC Protocols
Single node architecture: hardware and software components of a sensor node – WSN Network architecture:
typical network architectures-data relaying and aggregation strategies -MAC layer protocols: self-organizing,
Hybrid TDMA/FDMA and CSMA based MAC- IEEE 802.15.4.
Unit 5: WSN Routing, Localization & QOS
Issues in WSN routing – OLSR- Localization – Indoor and Sensor Network Localization-absolute and relative
localization, triangulation-QOS in WSN-Energy Efficient Design-Synchronization-Transport Layer issues.
Text and Reference Books:
1. Carlos De Morais Cordeiro, Dharma Prakash Agrawal “Ad Hoc & Sensor Networks: Theory and Applications”, World
Scientific Publishing Company, 2006.
2. Feng Zhao and Leonides Guibas, “Wireless Sensor Networks”, Elsevier Publication – 2002.
3. Holger Karl and Andreas Willig “Protocols and Architectures for Wireless Sensor Networks”, Wiley, 2005
4. Kazem Sohraby, Daniel Minoli, & Taieb Znati, “Wireless Sensor Networks-Technology, Protocols, and Applications”,
John Wiley, 2007.
5. Anna Hac, “Wireless Sensor Network Designs”, John Wiley, 2003.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
27
Learning Objectives
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
28
Learning Objectives
To learn concepts of convergence of technologies leading to the new buzzes such as “Internet of Things” and “Web of
Things”.
To understand the architecture, communication pattern and protocols of Internet of Things.
To explore the emerging applications of Internet of Things.
To develop application for Internet of things.
To use hardware platforms such as Raspberry Pi and Arduino to build Internet of Things.
Unit 1: Introduction
Introduction to concepts behind the Internet of Things, Review of technologies enabling IoT- Sensors, Networks,
Standards, Augmented intelligence and Augmented behaviour, Applications of internet of things, IoT Communication
Pattern and Layering concepts, Cellular IoT, IoT cloud.
Unit 2: IoT Architectures and Models
Overview of various IoT architectures (European FP7, WSO2, IVM, CISCO, IoT-A, RAMI4.0, IIRA),IEEE P2413
reference architecture model, Functions of application, network, adaptation, MAC and PHY layers, IEEE 802.15.4
standard (Modulation techniques, Frames, Multi-hop communication), Overview of security in IEEE 802.15.4.
Unit 3: IoT Protocols
IoT protocol stack verses traditional protocol stack, CoAP - Working, Frame structure, Security modes and URI
addressing, 6LoWPAN - Frame Structure, Header Compression, Fragmentation, Mesh Addressing, RPL – Routing,
DODAGE, ICMPV6, DTLS – handshaking, Frame structure, Overview of various other infrastructure, identification,
transport, discovery, data, device and semantic protocols.
Unit 4: IoT Hardware & Software
Overview of IoT supported Hardware platforms - Raspberry Pi, ARM Cortex Processors, Arduino and Intel Galileo
boards. Sensors and Sensor Node and interfacing using any Embedded target boards (Raspberry Pi / Intel Galileo/ARM
Cortex/ Arduino), Operating systems for IoT, Introduction to IoT web services,
Unit 5: IoT Application Development
Introduction to Integrating Internet Services. XML and JSON. HTTP APIs for accessing popular Internet services
(Facebook, Twitter, and others). Practice with developing IoT applications (Sensor integration, node communication,
cloud communication and integrating web services).
Text and Reference Books:
1. .6LoWPAN: The Wireless Embedded Internet, Zach Shelby, Carsten Bormann, Wiley.
2. Internet of Things: Converging Technologies for Smart Environments and Integrated Ecosystems, Dr. Ovidiu Vermesan,
Dr. Peter Friess, River Publishers.
3. Interconnecting Smart Objects with IP: The Next Internet, Jean-Philippe Vasseur, Adam Dunkels, Morgan Kuffmann
4. The Internet of Things: From RFID to the Next-Generation Pervasive Networked Lu Yan, Yan Zhang, Laurence T.
Yang, Huansheng Ning.
5. Internet of Things (A Hands-on-Approach), Vijay Madisetti , Arshdeep Bahga.
6. Designing the Internet of Things, Adrian McEwen (Author), Hakim Cassimally.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
29
Learning Objectives
To introduce the principles of RF components and devices.
To introduce high frequency amplifier design.
To introduce RF filter design
To introduce low noise amplifiers.
To introduce RF PLL models, RF oscillators and Mixers
Course Outcomes:
After successful completion of the course, students should be able to:
Detailed knowledge of RF design of amplifiers and filters.
Detailed understanding of RF oscillators and mixers.
Detailed understanding of high frequency PLLs.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
30
Learning Objectives
To learn about the hardware, controls, peripheral equipment, and successful implementation of a robotic system in a
flexible production environment.
To learn factory communications.
To describe the structure of robot manipulator.
Students will be equipped with the automation and brief history of robot and applications.
Students will be familiarized with the kinematic motions of robot.
Students will have good knowledge about robot end effectors and their design concepts.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
31
Learning Objectives
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
32
Learning Objectives
Unit 1: Introduction
Digital communication system (description of different modules of the block diagram), Complex baseband
representation of signals, Gram-Schmidt orthogonalization procedure. M-ary orthogonal signals, bi-orthogonal
signals, simplex signal waveforms.
Unit 2: Digital Modulation Techniques
Pulse amplitude modulation (binary and M-ary, QAM), Pulse position modulation (binary and M-ary), Carrier
modulation (M-ary ASK, PSK, FSK, DPSK), Continuous phase modulation (QPSK and variants, MSK,
GMSK).
Unit 3: Receiver in additive white Gaussian noise channels
Coherent and non-coherent demodulation: Matched filter, Correlator demodulator, square-law, and envelope
detection; Detector: Optimum rule for ML and MAP detection Performance: Bit-error-rate, symbol error rate
for coherent and non-coherent schemes.
Unit 4: Band-limited channels
Pulse shape design for channels with ISI: Nyquist pulse, Partial response signalling (duo-binary and modified
duo binary pulses), demodulation; Channel with distortion: Design of transmitting and receiving filters for a
known channel and for time varying channel (equalization); Performance: Symbol by symbol detection and
BER, symbol and sequence detection, Viterbi algorithm.
Unit 5: Synchronization and Communication over Fading Channels
Different synchronization techniques (Early-Late Gate, MMSE, ML and spectral line methods). Characteristics
of fading channels, Rayleigh and Rician channels, receiver performance-average SNR, outage probability,
amount of fading and average bit/symbol error rate
Text and Reference Books:
1. Digital Communication, Barry, John R., Lee, Edward A., Messerschmitt, David G. Springer.
2. Digital Communications, John G. Proakis, Masoud Salehi, 5th Edition, McGraw-Hill Education.
3. Digital Communications, Haykin, John Wiley and Sons.
4. Digital Communications, Fundamentals and Applications, Bernard Sklar, Prentice Hall Ltd
5. Introduction to Digital communications, Micheal. B. Pursley, prentice Hall Ltd.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
33
Learning Objectives
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
34
Learning Objectives
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
35
List of Experiments
Experiments on Mixed Signal Systems
Design of following using in standard technology node
1. Current Mirrors.
2. Single stage amplifier
3. Source follower
4. Differential Amplifier
5. Gilbert Cell
6. Operational Amplifier
7. PLL
8. Bandgap Reference
9. Digital to Analog Converters
10. Analog to Digital Converters
Experiments on DSP
Write a program to implement convolution of x(n) with h(n) using linear convolution and verify
11. the result y(n) as below. x(n) = [1,1,1,1,0.5,0.5,0.5,0.5 ] , h(n) = [0.3,0.25,0.2,0.15,0.1,0.05] and
y(n) = [0.3, 0.55,0.75,0.9,0.85,0.775,0.675,0.6,0.4.0.25,0.15,0.075,0.025]
12.
Write a program for circular convolution of the following inputs x(n) and h(n) and Verify the
output y(n) as given below: x(n) = [1,1,1,2,1,1] , h(n) = [1,1,2,1] and y(n) = [6,5,5,6,6,7]
Implement an 8-point DFT for the inputs x(n) and verify the result as X(K). Where, x(n) =
13. [1,1,1,1,1,1,0,0] and X(K) = [ 6,-0.707-j1.707,1-j,0.707+j0.293,0,0.707-j0.293,1+j,-
0.707+j1.707].
14.
Find IDFT of the sequence X(K) = [ 11110000]. Verify that x (n) = [0.5,0.125+j0.30175,
0,0.125+j0.05175, 0,0.125-j0.05175, 0,0.125-j0.30175]
Generate the following waveforms using TMS320XX DSP kit and verify the outputs for different
15.
frequencies (1KHz, 2KHz etc.) a) Sine wave, b) Square wave
Tone Generation using the DAC of TMS320XX DSP kit. a) Generate a simple tone of a fixed
16. frequency (1 KHz), b) Generate multiple tones at frequencies starting from 300Hz to 3 KHz with
an increment of 100Hz each tone for duration of 1second using timer interrupt.
Design an FIR Low pass Filter with following specification. fp = 1500Hz, fs = 2000Hz, Pass
17.
band attenuation = 0.01dB, Stop band attenuation = 40dB and Fs = 8000 Hz using Kaiser window.
Real-time Implementation of FIR filters: a) Generate the filter coefficients using Kaiser Window
for a low pass FIR filter for the specification as given in experiment 1 of module 2, b) Apply an
18. input signal through ADC and implement the filter on ARM Cortex M3/M4. Vary the input signal
frequency and observe the output on an Oscilloscope, c) Repeat the filter for Band pass and High
pass, d) Repeat the same with hamming window.
Perform FFT analysis for the signal input through ADC and display the input signal as well as the
19. FFT output on PC using Probe point facility. Perform FFT operation for 16, 32 and 64-point FFT.
Compute the power spectrum X(K) * X(K) = |X(K)|² = Xreal² + Ximag² and plot the same in PC.
DTMF Tone Generation and Detection and its implementation: a) Generate DTMF Tones. Detect
20.
the DTMF tone input trough the ADC, b) Implement the program with Geortzel algorithm.
21. Filter design using TMS Processor.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
36
Pre-Project Description
In the Pre-Project work, students shall choose a specific topic/area for their project. A supervisor will be assigned
to each student, who at the beginning of the 3rd semester shall provide a syllabus and plan of study including
relevant research papers to the student. Each student at the end of the course will submit a survey report regarding
the final project and the same will be evaluated for final award of the course. Each Pre-Project work shall be
evaluated for correctness, length and breadth of the background work undertaken by the student.
Pre-Internship Description
In Pre-Internship, students shall choose a specific domain for their Internship and identify prospective
organizations and apply for Internship programmes. For Pre-Internship work, a counselor will be assigned to each
student, who at the beginning of the 3rd semester shall guide him/her regarding identifying the prospective
organizations and applying therein. At the successful completion of this course, students will: be able to articulate
the mechanics of locating internships and behaving professionally; have produced the tools necessary to secure an
appropriate internship; have created a professional portfolio that highlights their accomplishments. The student
at the end of the course will submit a survey report regarding the procedure adopted and efforts made by the
student in securing an Intern position and the same will be evaluated for final award of the course.
Semester – IV (Internship)
ESS-401I: Internship
Hours per Week Maximum Marks Examination
Credits
Lecture Tutorial Practical Internal End Term Total Hours
0 0 48 24 200 700 900 3 Hours
Description
Internship shall be of six months (Minimum 18 weeks’) duration and a student can accumulate 24 credits on
successful completion of internship.
Internships shall be considered as six months (not less than 18 weeks) of supervised learning carried out at
industry or some academic institution of excellence. Students are encouraged to apply for internship in 3rd
semester to companies or academic institutions so that its commencement is ensured at the beginning of 4th
semester.
The head of the Department and counsellor will collect a mid-term feedback to ensure smooth progress
towards the completion of internship. At the time of completion of the internship, a certificate
(satisfactory/unsatisfactory) and marks from concerned person of the organization shall be collected by the
head of the Department. An Internship committee comprising of Head of the Department, External Expert,
counsellor, and two faculty members of the department shall collect the report from the student and evaluate
it. The certificate from the organization where internship was carried will be given due consideration. If the
certificate is unsatisfactory then the Internship committee will review the matter and if they agree with the
given certificate, the student has to carry on the internship again at same or different place.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006
37
Semester – IV (Thesis)
ESS-402T: Project and Thesis
Hours per Week Maximum Marks Examination
Credits
Lecture Tutorial Practical Internal End Term Total Hours
0 0 48 24 200 700 900 3 Hours
Description
Project and Thesis shall be of six months (Minimum 18 weeks’) duration and a student can accumulate 24 credits
on successful completion of Project. This is in addition to pre-project work in 3rd semester wherein students shall
choose a specific topic/area for their project and undertake its study.
A thesis committee comprising of the head of the Department, external expert, supervisor and at least two
more faculty members will serve thesis and oral examiners for each student pursuing thesis.
A soft copy of the thesis in .pdf format (in specific style) should be sent to thesis committee, before its final
submission. The Thesis committee shall examine it for suitability of publication (including any possible
plagiarism) before the thesis goes in print and for binding.
The external marks of 700 shall be evaluated with a breakup 500 for viva-voce and evaluation of
thesis/project and 200 for a publication/s in indexed journal/conference. The publication will be
verified by the thesis committee on the day of viva-voce.
The publication must be the sole work of the student. Further, for conference publication, the student
should produce presentation certificate to the thesis committee.
Course Structure and Syllabus of M. Tech. Programme in Embedded Systems and Solutions (Revision: 2016)
PG Department of Electronics and Instrumentation Technology
University of Kashmir, Srinagar – 190006