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AN7522
Dual 3-W BTL audio power amplifier
■ Overview
AN7522 is an audio power amplifier IC for the stereo system. In the BTL (balanced transformerless) method, fewer
external parts and easier design for applications are required.
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■ Features
• 3-W output (8 Ω) with supply voltage of 8 V
• On-chip standby function
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• On-chip volume function
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■ Applications
• Televisions, audio equipment, personal computers, and active speakers
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■ Package
• HSIP012-P-0000E
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GND 11
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VCC 1
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Ch.2 output
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Ch.2 output
GND
(Ch.1 output)
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Ch.1 output
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■ Pin Descriptions
Pin No. Descriptions Pin No. Descriptions
1 Supply voltage 7 Ground (input)
2 Ch.1 + output 8 Ch.2 input
3 Ground (output ch.1) 9 Volume (max. volume if this pin is open.)
4 Ch.1 − output 10 Ch.2 − output
5 Standby (standby state if this pin is open.) 11 Ground (output ch.2)
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6 Ch.1 input 12 Ch.2 + output
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Parameter Symbol Rating Unit
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Supply voltage VCC 14 V
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Supply current ICC 2.0 A
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Power dissipation *3 PD 1.92 W
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Operating ambient temperature *1 Topr −25 to +70 °C
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−55 to +150 °C
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Storage temperature *1 Tstg
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Note) *1: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C.
*2: At no signal.
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*3: The power dissipation shown is the value for Ta = 70°C.
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■ Recommended Operating Range
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Supply voltage VCC 3.5 to 13.5
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Maximum output power PO1 THD = 10%, Vol. = 1.25 V 2.4 3.0 W
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VR = 1 V[rms], fR = 120 Hz
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2 SDB00117AEB
AN7522
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200 Ω
50 Ω 2
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800 Ω 20 kΩ
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200 Ω
50 Ω 4
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1/2 VCC
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800 Ω 20 kΩ
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5 Standby pin 0 V or 5 V
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VCC
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Standby at 0.4 V
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5 10 kΩ
200 Ω
2 kΩ 50 kΩ
12 kΩ 1/2 VCC
33 kΩ 10 kΩ
To the constant
5 kΩ current circuit
SDB00117AEB 3
AN7522
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1 kΩ
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1 kΩ 1 kΩ 500 Ω
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7 GND 0V
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8 Ch.2 input pin 1.4 V
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VREF1 (1.4 V)
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bias voltage is
50 µA 50 µA 100 µA
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30 kΩ output.)
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1 kΩ 1 kΩ 500 Ω
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0 V to 1.25 V
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1 kΩ
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4 SDB00117AEB
AN7522
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200 Ω
50 Ω 10
1/2 VCC
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800 Ω 20 kΩ
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11 GND 0V
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12 Ch.2 + output pin 3.6 V
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VCC
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1/2 VCC
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■ Usage Notes
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• The thermal shutdown circuit operates at about Tj = 150°C. However, the thermal shutdown circuit is reset
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• Please carefully design the heat radiation especially when you take out high power at high VCC .
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• Please connect only the ground of signal with the signal GND of the amplifier in the previous stage.
SDB00117AEB 5
AN7522
■ Technical Data
• PD Ta curves of HSIP012-P-0000A
PD Ta
13
Independent IC
12 without a heat sink
5°C/W heat sink Rthj-a = 41.7°C/W
11
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4 20°C/W heat sink
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0 25 50 70 75 100 125 150
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Ambient temperature Ta (°C)
• Main characteristics
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7 60
RL = 8 Ω, 16 Ω
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400 Hz HPF 8.0
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Standby current ISTB (µA)
6 30 kHz LPF
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Output power PO (W)
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Rg = 10 kΩ ICQ
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5
VSTB = 5 V
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40
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Vol. = 1.25 V
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Both ch. input
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Ch.2 (8 Ω) Rg = 10 kΩ 3.0
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2 VSTB = 0 V/5 V
Vol. = 0 V 2.0
Ch.1, Ch.2 (16 Ω)
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Ch.1 (8 Ω)
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1 10 ISTB
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0 0 0.0
0 2 4 6 8 10 12 14 0 2 4 6 8 10 12 14
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f = 1 kHz Rg = 10 kΩ
RL = 8 Ω VSTB = 5 V
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Vol. = 1.25 V 3.0 PC (8 Ω)
Total harmonic distortion THD (%)
400 Hz HPF
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1 10
Supply current ICC (A)
2.5
Output power PO (W)
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ICC (8 Ω) 1.2
THD
(ch.1, 100 kHz) THD 2.0
(ch.2, 100 kHz) PC (16 Ω) 1.0
0.1 1
1.5 0.8
THD (ch.2, 10 kHz) VCC = 8 V Both ch. input
f = 1 kHz Rg = 10 kΩ 0.6
THD (ch.1, 10 kHz)
1.0 RL = 8 Ω, 16 Ω VSTB = 5 V
0.01 0.1
PO (ch.1) ICC (16 Ω) 400 Hz HPF Vol. = 1.25 V 0.4
THD THD (ch.2, 1 kHz) 30 kHz LPF
(ch.1, 1 kHz) 0.5
0.2
PO (ch.2)
0.001 0.01 0.0 0.0
1 10 100 1 000 0.0 1.0 2.0 3.0 4.0 5.0
6 SDB00117AEB
AN7522
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30 1.0
GV(ch.2)
29 0.8 Ch.2
VCC = 8 V Both ch. input 0.1
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28 f = 1 kHz Rg = 10 kΩ 0.6
RL = 8 Ω VSTB = 5 V
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400 Hz HPF Vol. = 1.25 V 0.4
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30 kHz LPF
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10 100 1 000 10 000 100 000 10 100 1 000 10 000 100 000
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Frequency f (Hz) Frequency f (Hz)
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GV , THD VCC RR VCC
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35 1.0 80
34 0.9
.se ng ntin tin ty e ty ur Ch.1, Ch.2
GV (ch.1)
70
Total harmonic distortion THD (%)
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33 0.8
Ripple rejection ratio RR (dB)
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GV (ch.2) 60
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Voltage gain GV (dB)
RL = 8 Ω Vol. = 0 V/1.25 V
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32 0.7
PO = 0.5 W 30 kHz LPF VRIPPLE = 0.5 V[rms]
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f = 1 kHz 50 Rg = 10kΩ fRIPPLE = 120 Hz
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VSTB = 5 V
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30 kHz LPF
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Ch.2 (vol.-max.)
29 Both ch. input 0.4
30
Rg = 10 kΩ
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28 VSTB = 5 V 0.3
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Vol. = 1.25 V 20
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Ch.1 (vol.-max.)
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THD (ch.2)
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RR VRIPPLE RR fRIPPLE
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Ripple rejection ratio RR (dB)
Ripple rejection ratio RR (dB)
Ch.2
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VCC = 8 V VSTB = 5 V
RL = 8 Ω Vol. = 0 V/1.25 V
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0 0
10 100 1 000 10 000 10 100 1 000 10 000
Power supply ripple voltage VRIPPLE (mV[rms]) Power supply ripple frequency fRIPPLE (Hz)
SDB00117AEB 7
AN7522
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Ch.2
Crosstalk CT (dB)
60
50
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Ch.2 50
40
Ch.1 40
PO = 0.5 W
30
f = 1 kHz
30
RL = 8 Ω
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20 400 Hz HPF
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30 kHz LPF
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Rg = 10 kΩ
10
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10 VSTB = 5 V
Vol. = 1.25 V
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Volume voltage Vol. (V) Supply voltage VCC (V)
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CT VIN CT f
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80 Ch.1
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Ch.1
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Ch.2
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Crosstalk CT (dB)
Crosstalk CT (dB)
60 60
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VCC = 8 V VCC = 8 V
f = 1 kHz PO = 0.5 W
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RL = 8 Ω RL = 8 Ω
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400 Hz HPF Rg = 10 kΩ
20 20
30 kHz LPF VSTB = 5 V
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Rg = 10 kΩ Vol. = 1.25 V
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10 VSTB = 5 V 10
Vol. = 1.25 V
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Rg = 10 kΩ RL = 8 Ω
Din audio filter Din audio filter
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Output noise voltage VNO (µV[rms])
VSTB = 5 V VSTB = 5 V
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0 0
0 2 4 6 8 10 12 14 10 100 1 000 10 000 100 000
8 SDB00117AEB
AN7522
1 000 Vol. = 0 V
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RL = 8 Ω ICQ
600 Rg = 10 kΩ 0.05
Din audio filter
VSTB = 5 V 0.04
400
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0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 1 2 3 4 5
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Volume voltage Vol. (V) Standby voltage VSTB (V)
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Att VCC Att VIN
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90 90
Volume attenuation Att (dB)
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PO = 0.5 W VCC = 8 V
f = 1 kHz
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RL = 8 Ω
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60 RL = 8 Ω 60
400 Hz HPF 400 Hz HPF
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50 Rg = 10 kΩ 50 Rg = 10 kΩ
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VSTB = 5 V VSTB = 5 V
Vol. = 0 V Vol. = 0 V
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0 2 4 6 8 10 12 14 1 10 100 1 000
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Volume attenuation Att (dB)
Volume attenuation Att (dB)
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85 Ch.1, Ch.2
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Ch.1, Ch.2
80
40
75
50
70 VCC = 8 V
VCC = 8 V
PO = 0.5 W
PO = 0.5 W 60
65 f = 1 kHz
RL = 8 Ω
RL = 8 Ω
Rg = 10 kΩ 70
60 400 Hz HPF
VSTB = 5 V
30 kHz LPF
Vol. = 0 V
55 80 Rg = 10 kΩ
VSTB = 5 V
50 90
10 100 1 000 10 000 100 000 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
SDB00117AEB 9
AN7522
f = 1 kHz Rg = 10 kΩ
RL = 8 Ω VSTB = 5 V
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Ch.1, Ch.2 10
VCC = 8 V Both ch. input
f = 1 kHz Rg = 10 kΩ
RL = 8 Ω VSTB = 5 V
0.1
Vol. = 1.25 V
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400 Hz HPF
30 kHz LPF
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0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1 10 100 1 000 10 000
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Volume voltage Vol. (V) Input voltage VIN (mV[rms])
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• Example of PCB pattern
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VCC 1 2 3 4 5 6 7 8 9 10 11 12
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1.0 µF 1.0 µF
8Ω 8Ω
270 kΩ
68 kΩ
10 kΩ
10 kΩ
10 SDB00117AEB
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
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ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
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provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
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Standards in advance to make sure that the latest specifications satisfy your requirements.
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(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
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maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
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defect which may arise later in your equipment.
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Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
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mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
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or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
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(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
.se ng ntin tin ty e ty ur
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
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damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
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