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Student Name
Research Centre
College of Engineering
Swansea University
Swansea UK
e-mail address of Student
Abstract— Control engineers are having a hard time nonparametric tests. Statistical analysis also helps to determine
manufacturing uniform wafers. Uniformity of a manufactured how the various process variable interact to determine
wafer determines yield of the given wafer which is the uniformity and which combination of these variables will
proportion of chips on the wafer that are acceptable for use. maximize yield. By using regression analysis methods, we can
Wafer production involves three process variables that interact fit the data to appropriate models for prediction of how the
with each other to determine the thickness of the wafer at a various process variables will affect uniformity of wafers. With
given point of production. A detailed statistical investigation this deeper understanding, better control and optimization of
was carried out on data that based on experimentation that was wafer yield can be achieved.
carried out at Swansea university where coating thickness of
each wafer in a sample of forty wafers was measured along II. OBJECTIVES
various locations of each of the wafer. The standard deviations A. General objective
of these measurements represented of uniformity of coating
To carry out a detailed statistical investigation of data in order
thickness of each wafer. As a result, a greater understanding of
to get a greater understanding of how to produce uniform
the experimental data sets was achieved with regard to control
thickness of wafers and with an aim of achieving maximum
and optimization of wafer yields.
yield.
B. Specific objectives
Keywords—wafer; response surface; parametric;
yield;nonparametric tests; multiple linear regression; variability; Describe variability present in each set of data in the first
semiconductor experiment and highlighting similarities and differences that
may exist between the two data sets.
I. INTRODUCTION Constructing parametric and nonparametric tests to evaluate the
There is need to control wafer production process in order to claim that the coating thickness uniformity is different for both
optimize wafer yield and as a result minimize semiconductor speeds stating assumptions, advantages and disadvantages of
production costs. A wafer is simply a substrate of each test.
microelectronic devices. It can be defined as a thin slice of Estimation of 𝛽 parameters of a second-order response surface
highly pure, nearly defect free crystalline material such as model, using technique of multiple least squares and data set
crystalline silicon which is used for fabrication of integrated collected in Experiment 2.
circuits(1). A wafer undergoes many microfabrication process Derivation of simplified version of the model
steps such as iron implantation or doping, etching and material
III. METHOD
disposition, photolithographic patterning and finally separation
of the various micro circuits for packaging(2). During wafer In order to get an understanding of how uniform thickness of
production, there are three process variables that determines the wafers can be produced, experimentation was carried out in
thickness of the wafer during production. Uniformity of wafer Swansea laboratories. The experimentation was done using
thickness determines wafer yield among other factors. When forty wafer samples which had been supplied by a given
the coating material thickness is uniform, yield is greatest. company. It involved measuring of thickness at different
Standard deviation of thickness of the wafer at different locations of each wafer in the sample. The standard deviation
locations of the wafer can be used as a measure of uniformity of the coating thickness of each wafer was determined. The
of the wafer. Statistical analysis of such data entails the use of standard deviation represented the uniformity in thickness of
statistical methods to determine variability in the data that may each wafer in the sample. The experimentation was done in two
exist when a given process variable is varied. They can also be phases as outlined below.
used to determine if a given process variable affects the
uniformity of the wafer thickness using parametric and
A. Experiment 1 16 87.8 36 146.1
The first experiment involved measuring the thickness of the 17 88.9 37 161.4
wafers with respect to varying speed. The sample of forty
wafers was divided into two. Twenty of the wafers were 18 102.7 38 178.9
subjected to low speed. The other process variables were held 19 95.9 39 160.5
at low. The thickness at different locations of each wafer is
measured at this low speed and the standard deviation of the 20 95.5 40 142.2
thickness of each wafer is determined. The other twenty wafers The standard deviation of wafer coating thickness measured at
were subjected to high speeds and the standard deviations of the different test conditions of the combinations of low,
wafer thickness were obtained for each wafer. The data of medium and high amounts of the three process variables is
standard deviation for the forty wafers at the two different shown in the table below.
speeds was recorded in sheet1 of the Data Sheet.
Table 2
B. Experiment 2
This experiment was used to study the effect of all the three Speed, Pressure, Distance, Costing
process variables which were pressure, distance and speed on X1 X2 X3 thickness
the uniformity of coating thickness of a wafer. These variables
are represented by 𝑥1 , 𝑥2 and 𝑥3 respectively. Each of the
standard
variable has been given codes −,0 𝑎𝑛𝑑 + These codes signified deviation,
low, medium and high levels of the variables used during the Y.
process. The standard deviation(Y) in the coating thickness of −1 −1 −1 24
the wafer corresponding to the different test conditions were
recorded in sheet2 of the Data Sheet.
0 −1 −1 120.3
1 −1 −1 213.7
IV. RESULTS
−1 0 −1 86
The standard deviations for the forty wafers half at low speed
and half at high speed with distance and pressure fixed at a low 0 0 −1 136.6
value are shown in the table below: 1 0 −1 340.7
−1 1 −1 112.3
Table 1
0 1 −1 256.3
Distance and pressure are fixed at a low value 1 1 −1 271.7
while these 40 tests were being done. −1 −1 0 81
Sample Low Sample High 0 −1 0 101.7
number Speed number Speed
1 −1 0 357
1 74 21 151.1
−1 0 0 171.3
2 78.9 22 136.8
0 0 0 372
3 90.3 23 161.8
1 0 0 501.7
4 82.1 24 147
−1 1 0 264
5 89.4 25 154.7 0 1 0 427
6 90.9 26 143.1 1 1 0 730.7
7 90.2 27 150.2 −1 −1 1 220.7
8 69.2 28 150.3 0 −1 1 239.7
9 76.2 29 135.9 1 −1 1 422
10 82.2 30 141.1 −1 0 1 199
11 81.9 31 145.5 0 0 1 485.3
12 87.3 32 149.2 1 0 1 673.7
13 104.9 33 152.3 −1 1 1 176.7
14 74.4 34 168.7 0 1 1 501
15 87.7 35 152.9 1 1 1 1010
Histogram and Box plots for Standard deviation of wafer
coating thickness at Low Speed are shown in figure three and
V. DISCUSSION figure four respectively:
From table one, it is evident that the standard deviation of
coating thickness increases with speed and was generally higher
for wafers which were subjected to higher speeds than for those
which were produced in low speed. Higher speed therefore
leads to less uniformity of the coating thickness of the wafer.
From the first experiment, we shall plot box plot and a
histogram for both the low speed and highspeed standard
deviation data of wafer coating thickness in MATLAB. Though
both can indicate the variability of data, a histogram is essential
as it helps to point out similarities and differences that may exist
between the data sets such as detecting symmetry that exist in
each data set which can’t be directly identified from the box
plots(3). Box plots have a great upside because one can be able
to identify definite measures of spread/variability and center
straight from the box plot. The following are histograms and
box plots for each of the given data set in Experiment two.
Histogram and Box plots for Standard deviation of wafer
Figure 3
coating thickness at Low Speed are shown in figure one and
figure two respectively:
Figure 4
Figure 1
alpha=0.05;%significance level Matlab script code for simplified version of the model
tail='both';%equal or not equal to %The different variables are imported in
[h, p, ci, stats]=ttest2(Lowspeed_sd, MATLAB independetly.
Highspeed_sd, alpha, tail)%two-side t- %Speed,pressure and distance are imported
test as categorical variables X1,X2
%and X3 and standard deviation as numeric
Matlab script code for Mann Whitney test variable y
%The variables are converted to arrays
clc %clear screen
%----------------------------------
%low speed standard deviation
X1=table2array(X1);
%--------------------------------
X2=table2array(X2);
Lowspeed_sd=[74 78.9 90.3 82.1 89.4 90.9
X3=table2array(X3);
90.2 69.2 76.2 82.2 81.9 87.3 104.9 74.4
y=table2array(y);
87.7 87.8 88.9 102.7 95.9 95.5];
%----------------------------------
%--------------------------------
%A sample dataset is created
%standard deviation data at speed
%----------------------------------
%--------------------------------
X=dataset(X1,X2,X3,y);
Highspeed_sd=[151.1 136.8 161.8 147 154.7
%---------------------------------
143.1 150.2 150.3 135.9 141.1 145.5 149.2
%A linear model is created with only
152.3 168.7 152.9 146.1 161.4 178.9 160.5
relevant/significant terms
142.2];
%----------------------------------
%--------------------------------
mdls =stepwiselm(X,'y ~
[p,h,stat] = ranksum(Lowspeed_sd,
X1+X2+X3+X1^2+X2^2+X3^2+X1*X2+X1*X3+X2*X3
Highspeed_sd,'alpha',0.05,'tail','both')%
')
mann-whitney test function alpha is
%A variable plot of the model was created
significance level and tail is both
%----------------------------------------
figure(7);
plot(mdls)
Matlab script code for second order multiple linear regression %A normal probability plot of the model
%---------------------------------- was created
X1=table2array(X1); %----------------------------------------
X2=table2array(X2); figure(8);
X3=table2array(X3); plotResiduals(mdls,'probability')