Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Microsystems
Engineering
Seminar: biweekly
Assessment:
Written exam, 90 minutes
1. Introduction
2. Materials of Microsystems Engineering
3. Clean Rooms/Yield
4. Thin Films
5. Lithography
6. Surface Micromachining
7. Bulk Micromachining
8. LIGA
9. Packaging Technology
Resist
SiO2 Silicon
Silicon
1.step Silicon
Silicon
Silicon
Silicon
Silicon
Microelectronics
History
• Application:
SE image BE image
= secondary electron image = backscattered electron image
A Transfer resistor is an
electonic semiconductor device with three
terminals (Source, Gate, Drain) that is
used to switch and amplify electrical current
Co-founder of
Intel published
Moore´s Law
in 1965
Source [10]
Microsystems Engineering Prof. Dr. Michael Rüb
1. Introduction Ernst-Abbe Hochschule Jena 30
Microsystems Engineering Prof. Dr. Michael Rüb
1. Introduction Ernst-Abbe Hochschule Jena 31
ITRS 2013 Roadmap – MEMS
Linewidth (um)
Fab Cost ($M)
1000
100
0.1
10
from: A position paper report submitted by the ITRS Starting Materials Sub-TWG), June 2005
Source: www.asml.com
Scale
hybrid or monolithical
integration scheme
Applications
Notebooks
Cell phones
Camera Video