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Welcome to the lecture:

Microsystems
Engineering

Microsystems Engineering Prof. Dr. Michael Rüb 1


1. Introduction Ernst-Abbe Hochschule Jena
Introduction
Michael Rüb, german, married, two children

1993, Physics Diploma


University Erlangen-Nürnberg
Imperial College London
Associate of CERN
INETI, Lisbon
1997, PhD
Friedrich-Schiller-University Jena
1997, Technology Development Power Semiconductors - CoolMOS
Infineon Technologies Austria AG
2008, Professor for „Physikintensive Technologien und Mikrostrukturierung“
Ernst-Abbe-Hochschule - University of Applied Sciences Jena

Microsystems Engineering Prof. Dr. Michael Rüb


1. Introduction Ernst-Abbe Hochschule Jena 2
Microsystems Engineering

Post graduate basic module


(Postgraduales Basismodul)

Master, Scientific Intrumentation, 1. Semester


Master, Werkstofftechnik, 1. Semester

Lecture: 2 SWS (hours/week)

Seminar: biweekly

Assessment:
Written exam, 90 minutes

Microsystems Engineering Prof. Dr. Michael Rüb 3


1. Introduction Ernst-Abbe Hochschule Jena
Context of other lectures

Physikalische Technologien Fundamental techniques for


Mikrotechnik creating microstructures
BSc. PT
MicrosystemsMicrosystems
Engineering as an application of
5.Sem.
Mikrosystemtechnik Microtechnolgy and special
processes.

Thin Films Manufacturing, characterization


and application of thin films
MSc. PT
Micro- and Nanostructures 3. Sem. Lithography
Semiconductor Devices
Nanotechnology

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1. Introduction Ernst-Abbe Hochschule Jena
Where can you find the lecture notes?

Microsystems Engineering Prof. Dr. Michael Rüb 5


1. Introduction Ernst-Abbe Hochschule Jena
Microsystems Engineering Prof. Dr. Michael Rüb 6
1. Introduction Ernst-Abbe Hochschule Jena
Password:
msews1516

Microsystems Engineering Prof. Dr. Michael Rüb 7


1. Introduction Ernst-Abbe Hochschule Jena
Course Outline

1. Introduction
2. Materials of Microsystems Engineering
3. Clean Rooms/Yield
4. Thin Films
5. Lithography
6. Surface Micromachining
7. Bulk Micromachining
8. LIGA
9. Packaging Technology

Microsystems Engineering Prof. Dr. Michael Rüb 8


1. Introduction Ernst-Abbe Hochschule Jena
Literature
[1] Microsystem Technology, Menz, Mohr, Paul, ISBN-10: 3527296344

[2] Praxiswissen Mikrosystemtechnik, F. Völklein, Th. Zetterer


Vieweg Praxiswissen, ISBN: 3-528-13891-2

[3] Lecture Mikrosystemtechnik WS 2008, Prof. Zengerle, IMTEK Karlsruhe,

Microsystems Engineering Prof. Dr. Michael Rüb 9


1. Introduction Ernst-Abbe Hochschule Jena
Typical Process Steps in a Planar Technology – Top Down Technology
Repeating sequence of deposition, lithography and etching process steps

Resist

SiO2 Silicon

Silicon
1.step Silicon

Silicon
Silicon

Silicon
Silicon

Microsystems Engineering Prof. Dr. Michael Rüb


1. Introduction Ernst-Abbe Hochschule Jena 10
Microsystems Engineering Prof. Dr. Michael Rüb
1. Introduction Ernst-Abbe Hochschule Jena 11
TI: digital light projectors
ST: smart phone inertial sensors

Microsystems Engineering Prof. Dr. Michael Rüb


1. Introduction Ernst-Abbe Hochschule Jena 12
Microsystems Engineering Prof. Dr. Michael Rüb 13
1. Introduction Ernst-Abbe Hochschule Jena
Microsystems Engineering Prof. Dr. Michael Rüb 14
1. Introduction Ernst-Abbe Hochschule Jena
1. Introduction

1.1. Historical Considerations


1.2. Characteristics of Microelectonics
1.3. What is Microsystems Engineering?

Microsystems Engineering Prof. Dr. Michael Rüb 15


1. Introduction Ernst-Abbe Hochschule Jena
Some randomly selected chapters from

Microelectronics
History

Microsystems Engineering Prof. Dr. Michael Rüb 16


1. Introduction Ernst-Abbe Hochschule Jena
Ferdinand Braun
German Phycisist: 1850 – 1918
Nobel Prize: 1909

• Investigation of current flow through contacts


of metal wire on sulphor-metal crystals

-> deviation from ohmic resistance

• Application:

-> rectifier in wireless communication technology


(early 20th century)

In 1901 Braun co-founded the „Gesellschaft für


Drahtlose Telegraphie Braun-Siemens“ in order
to commerialize the so called „detector-crystals“.

Microsystems Engineering Prof. Dr. Michael Rüb 17


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
„Braun´sche Röhre“ and electron beams

• Karl Ferdinand Braun´s most important invention in 1897:


„Die Braun´sche Röhre“ – „Cathode Ray Tube“

Basis for many tools that allow us to access to the microworld

Microsystems Engineering Prof. Dr. Michael Rüb 18


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
Electron microscope
invented in 1931 by E.Ruska and M.Knoll
Nobel Prize: 1987

• Human eye can resolve structures down to 100µm


• Conventional microscopes can map structures down to approx. 1µm

-> Restriction is related to available wavelength and quality of optics

• Smaller things require smaller wavelenths


e.g. Scaning Electron Microscope (SEM)
in german: Rasterelektronen Mikroskop (REM)

Microsystems Engineering Prof. Dr. Michael Rüb 19


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
Electron microscope
electron source •point by point scanning of object
surface by an e-beam which is
steered by magnetic coils.
condensor
lens •electrons are backscattered
(BE) or secondary electrons (SE)
are emitted; x-rays are also
scan cathode emitted;
coils -ray
BSE tube
X-ray •BE and/or SE signals are
(EDX) SE
detected in a point by point
object manner

spatial resolution: a few nm •non-conducting surfaces must


depending on material, e-energy and topography be coated with a conducting
material in order to avoid electric
typical e-energies: 1-5 keV – 30keV
charging of the object

Microsystems Engineering Prof. Dr. Michael Rüb 20


1. Introduction Ernst-Abbe Hochschule Jena
Electron microscope
a very powerful tool indeed....

SE image BE image
= secondary electron image = backscattered electron image

also EDX material analyis by detecting characteristic x-rays

-> spatial and chemical information

Microsystems Engineering Prof. Dr. Michael Rüb 21


1. Introduction Ernst-Abbe Hochschule Jena
Semiconductor-Metal Junction
• Schottky´s opinion on Ferdinand Braun´s
rectifiers:
„ Lack of understanding of the
functional mechanisms of such a widespread
application is unbearable“

• In 1939 Schottky solved the „Shame of the


Detector Problem“ Walter Schottky
1886 (Zürich) – 1976 (Pretzfeld)
• Theory of Metal-SC Junction
• Rectifying effect is related to the depletion of
charge carriers at the metal-sc junction
• Schottky – Diode in commercial use today!

Microsystems Engineering Prof. Dr. Michael Rüb 22


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
The First (Bipolar) Transistor
•Based on W. Schottkys findings, in 1947 Schockley, Bardeen and Brattain
developped the first bipolar transistor.
Nobel Prize: 1956

•This invention was followed by the founding of several companies, also in


Santa Clara -> beginning of Silicon Valley

Microsystems Engineering Prof. Dr. Michael Rüb 23


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
What is a Transistor?

A Transfer resistor is an
electonic semiconductor device with three
terminals (Source, Gate, Drain) that is
used to switch and amplify electrical current

Microsystems Engineering Prof. Dr. Michael Rüb 24


1. Introduction Ernst-Abbe Hochschule Jena
The First Integrated Circuit
In 1958, Jack Kilby, a Texas Instruments
Scientist, created the first integrated
circuit to prove that resistors, transistors
and capacitors could exist on the
same piece of semiconductor material.

Fundamental new approach:


From mechanical assembly of different
components to one circuit to
lithographic „printing“ of integrated Jack Kilby
circuits Nobel Prize: 2000

-> size reduction


-> complexity increase
-> cost reduction

Microsystems Engineering Prof. Dr. Michael Rüb 25


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
Many more important milestones...
1958 J.Kilby, Texas Intruments first IC
J.Hoerni, Fairchild first planar transistor
1959 R.Noyce, Fairchild first planar IC

1960 Atalla & Kangh, Bell Labs first MOSFET

1961 Fairchild first commercial monolithic


IC
1967 Fairchild first standard MOS product

1970 Intel first DRAM

1981 IBM/Intel/Microsoft the PC

Microsystems Engineering Prof. Dr. Michael Rüb 26


1. Introduction Ernst-Abbe Hochschule Jena
Moore´s Law
Moore´s law in its simple form states that,
„the complexity of integrated circuits doubles every 24months“

Co-founder of
Intel published
Moore´s Law
in 1965

Microsystems Engineering Prof. Dr. Michael Rüb 27


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
ITRS Roadmap 2007
www.itrs.net

Microsystems Engineering Prof. Dr. Michael Rüb 28


1. Introduction Ernst-Abbe Hochschule Jena
ITRS 2013 Roadmap - MEMS

Microsystems Engineering Prof. Dr. Michael Rüb


1. Introduction Ernst-Abbe Hochschule Jena 29
ITRS 2013 Roadmap –Markets - MEMS

Source [10]
Microsystems Engineering Prof. Dr. Michael Rüb
1. Introduction Ernst-Abbe Hochschule Jena 30
Microsystems Engineering Prof. Dr. Michael Rüb
1. Introduction Ernst-Abbe Hochschule Jena 31
ITRS 2013 Roadmap – MEMS

Microsystems Engineering Prof. Dr. Michael Rüb


1. Introduction Ernst-Abbe Hochschule Jena 32
1. Introduction

1.1. Historical Considerations


1.2. Characteristics of Microelectonics
1.3. What is Microsystems Engineering?

Microsystems Engineering Prof. Dr. Michael Rüb 33


1. Introduction Ernst-Abbe Hochschule Jena
Essentials of
Microelectronics

Microsystems Engineering Prof. Dr. Michael Rüb 34


1. Introduction Ernst-Abbe Hochschule Jena
1. CAD; all aspects of an IC are „simulated“ before
manufacturing
• Device Simulation
– e.g. threshold voltage; on-resistance; switching speed
• Technology Simulation
– e.g doping profiles; implantation profiles; diffusion; oxidation
– (ICECREM; T-SUPREM)

• Analogue/digital Circuit Design/Simulation


– e.g. functional elements from a technolgy library are connected to form
the functionality needed by customer
• Layout/Mask Design
– e.g. design, verification (DRC = design rule checker)

• Fabrication Process Simulation


– capacity of facilities must fit to manufactured process

Microsystems Engineering Prof. Dr. Michael Rüb 35


1. Introduction Ernst-Abbe Hochschule Jena
2. Lithographic reproduction of structures

Microsystems Engineering Prof. Dr. Michael Rüb 36


1. Introduction Ernst-Abbe Hochschule Jena
2. Lithographic reproduction of structures

• Reproduction of structural information is without „tear and wear“; nearly


unlimited reuse of masks possible
• Parallel information transfer:
– 0.13µm structures on 1cm² = 5x10E9 Pixel
• Shrinking as a major factor to
– reduce size and cost
– increase complexity and performance

Shrinking of lithographic structures is a major tool


to follow Moore´s Law
(see ITRS Roadmap)

• Restriction to mainly 2-dim structures

Microelectronics is essentially planar (!)

Microsystems Engineering Prof. Dr. Michael Rüb 37


1. Introduction Ernst-Abbe Hochschule Jena
3. Parallel processing of many devices/wafers

• high packing density means/requires small process deviations

• overcompensation of high manufacturing costs by ever increasing device


performance and parallel device production

Inrcreasing wafer sizes are a major


tool to reduces cost/function
(see ITRS Roadmap)

Microsystems Engineering Prof. Dr. Michael Rüb 38


1. Introduction Ernst-Abbe Hochschule Jena
Economic Impact of Wafer Size
Note:
100000 10 in 2010 TSMCs
Fab15
Fab Cost ($M)
was announced to
Linewidth (nm) cost $9.3billion
10000

Linewidth (um)
Fab Cost ($M)

1000

100
0.1

10

100mm 150mm 200mm 300mm 450mm


1 0.01
1975 1980 1985 1990 1995 2000 2005 2010 2015 2020 2025

from: A position paper report submitted by the ITRS Starting Materials Sub-TWG), June 2005

Microsystems Engineering Prof. Dr. Michael Rüb 39


1. Introduction Ernst-Abbe Hochschule Jena
It´s expensive, but it works…

Source: www.asml.com

Source: SUSS MicroOptics, R. Voelkel, Optical Lithography, Workshop Hilpert, 2013

Prof. Dr. Michael Rueb - EAH Jena


1. Introduction

1.1. Historical Considerations


1.2. Characteristics of Microelectonics
1.3. What is Microsystems Engineering?

Microsystems Engineering Prof. Dr. Michael Rüb 41


1. Introduction Ernst-Abbe Hochschule Jena
What is Mircosystem Engineering,
Microsystem Technology?

Scale

just being small is not enough !!

Microsystems Engineering Prof. Dr. Michael Rüb 42


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
What is Microsystemtechnology?
Methodological Approach

Microsystemtechnology essentially is the result of the expansion of


microelectonic technology/approach to non electronic areas, like

• mechanics (MEMS, NEMS)


• optics (MOEMS)
• fluidics
• chemistry
• biochemistry

Remember, microeletronic approach:


1. CAD; all aspects of an IC are „simulated“
before manufacturing

2. Lithographic reproduction of structures

3. Parallel processing of many devices/wafers


Microsystems Engineering Prof. Dr. Michael Rüb 43
1. Introduction Ernst-Abbe Hochschule Jena
What is Microsystemtechnology?
System Approach

hybrid or monolithical
integration scheme

Microsystems Engineering Prof. Dr. Michael Rüb 44


1. Introduction Ernst-Abbe Hochschule Jena
What is Microsystemtechnology

Approach from Application


Visions, like

Microrobots („Micro Doctor“)


Micromotors
Imitating Nature (DNA information storage etc.)

have existed for long

Microsystems Engineering Prof. Dr. Michael Rüb 45


1. Introduction Ernst-Abbe Hochschule Jena
Vision: Micro „Doctor“

Microsystems Engineering Prof. Dr. Michael Rüb 46


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
Examples of „Volume“ Microsystems

Microsystems Engineering Prof. Dr. Michael Rüb 47


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
Ink Jet Printer

Microsystems Engineering Prof. Dr. Michael Rüb 48


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
Products
Acceleration
Pressure
Rate
Features
Low energy consumption
Reduced dimensions

Applications
Notebooks
Cell phones
Camera Video

Microsystems Engineering Prof. Dr. Michael Rüb 49


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]
TV and Videoprojection (ca. 2001)
Digital Mirror Devices

 Mirror size: 17 x 178µm²


 No. of mirrors: typical 1280x768
 Development cost: approx. 1 billion $

Microsystems Engineering Prof. Dr. Michael Rüb 50


1. Introduction Ernst-Abbe Hochschule Jena
source: [3]

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