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SHT21
EN DE FR
This Datasheet is presented by Dieses Datenblatt wird vom Cette fiche technique est
the manufacturer Hersteller bereitgestellt présentée par le fabricant
Datasheet SHT21
Humidity and Temperature Sensor IC
Fully calibrated
Digital output, I2C interface
Low power consumption
Excellent long term stability
DFN type package – reflow solderable
Product Summary
SHT21, the new humidity and temperature sensor of Every sensor is individually calibrated and tested. Lot
Sensirion is about to set new standards in terms of size identification is printed on the sensor and an electronic
and intelligence: Embedded in a reflow solderable Dual identification code is stored on the chip – which can be
Flat No leads (DFN) package of 3 x 3mm foot print and read out by command. Furthermore, the resolution of
1.1mm height it provides calibrated, linearized signals in SHT21 can be changed by command (8/12bit up to
digital, I2C format. 12/14bit for RH/T), low battery can be detected and a
checksum helps to improve communication reliability.
With a completely new designed CMOSens® chip, a
reworked capacitive type humidity sensor and an With made improvements and the miniaturization of the
improved band gap temperature sensor the performance sensor the performance-to-price ratio has been improved
has been lifted even beyond the outstanding level of the – and eventually, any device should benefit from the
previous sensor generation (SHT1x and SHT7x). For cutting edge energy saving operation mode. For testing
example, measures have been taken to stabilize the SHT21 a new evaluation Kit EK-H4 is available.
behavior at high humidity levels.
3.0
processing unit.
0.8 typ
2.2 1.1 Material Contents
While the sensor itself is made of Silicon the sensors’
0.2
0.4
2.4
1.5
±0 ± 0.0
0 10 20 30 40 50 60 70 80 90 100 -40 -20 0 20 40 60 80 100 120
Relative Humidity (%RH) Temperature (°C)
Figure 2 Typical and maximal tolerance at 25°C for relative Figure 3 Typical and maximal tolerance for temperature sensor
humidity. For extensive information see Users Guide, Sect. 1.2. in °C.
Electrical Specification
Packaging Information
Parameter Condition min typ max Units
Supply Voltage, VDD 2.1 3.0 3.6 V Sensor Type Packaging Quantity Order Number
Tape & Reel 400 1-100707-01
sleep mode 0.15 0.4 µA
Supply Current, IDD 6 SHT21 Tape & Reel 1500 1-100645-01
measuring 200 300 330 µA
sleep mode 0.5 1.2 µW Tape & Reel 5000 1-100694-01
Power Dissipation 6 measuring 0.6 0.9 1.0 mW
average 8bit 3.2 µW
Heater VDD = 3.0 V 5.5mW, ∆T = + 0.5-1.5°C
Communication digital 2-wire interface, I2C protocol
Table 1 Electrical specification. For absolute maximum
values see Section 4.1 of Users Guide. This datasheet is subject to change and may be amended
without prior notice.
1 Default measurement resolution is 14bit (temperature) / 12bit (humidity). It can
be reduced to 12/8bit, 11/11bit or 13/10bit by command to user register.
2 Accuracies are tested at Outgoing Quality Control at 25°C and 3.0V. Values 5 Value may be higher in environments with vaporized solvents, out-gassing
exclude hysteresis and long term drift and are applicable to non-condensing tapes, adhesives, packaging materials, etc. For more details please refer to
environments only. Handling Instructions.
3 Time for achieving 63% of a step function, valid at 25°C and 1m/s airflow. 6 Min and max values of Supply Current and Power Dissipation are based on
4 Normal operating range: 0-80%RH, beyond this limit sensor may read a fixed VDD = 3.0V and T<60°C. The average value is based on one 8bit
reversible offset with slow kinetics (+3%RH after 60h at humidity >80%RH). For measurement per second.
more details please see Section 1.1 of the Users Guide. 7 Response time depends on heat conductivity of sensor substrate.
4
80 3
2
60
Normal Max. 1
40 Range Range 0
0 20 40 60 80 100 120
20
Temperature (°C)
0
Figure 6 Typical dependency of supply current (sleep mode)
-40 -20 0 20 40 60 80 100 120 versus temperature at VDD = 3.0V. Please note that the
Temperature (°C)
variance of these data can be above ±25% of displayed value.
Figure 4 Operating Conditions
20
Supply Current IDD (nA)
±6 ±5 ±5 ±7 ±8 8
90 ±4
80 6
70 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5
60
±4 ±3 ±3 ±3 ±4 ±6 Supply Voltage (VDD)
50
40
30 Figure 7 Typical dependency of supply current (sleep mode)
20 versus supply voltage at 25°C. Please note that deviations may
±6 ±5 ±5
10 ±4 ±7 be up to ±50% of displayed value. Values at 60°C scale with a
0 ±5 factor of about 15 (compare Table 1).
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80
Temperature (°C)
Figure 5 Maximal tolerance of relative humidity measurements
given in %RH for temperatures 0 – 80°C.
2 Application Information centered on the thermal land area. It can also be split in
two openings.
2.1 Soldering Instructions
Due to the low mounted height of the DFN, “no clean”
The DFN’s die pad (centre pad) and perimeter I/O pads
type 3 solder paste10 is recommended as well as Nitrogen
are fabricated from a planar copper lead-frame by over-
purge during reflow.
molding leaving the die pad and I/O pads exposed for
mechanical and electrical connection. Both the I/O pads TP tP
and die pad should be soldered to the PCB. In order to
prevent oxidation and optimize soldering, the bottom side
Temperature
TL tL
of the sensor pads is plated with Ni/Pd/Au.
TS (max)
On the PCB the I/O lands8 should be 0.2mm longer than
the package I/O pads. Inward corners may be rounded to
match the I/O pad shape. The I/O land width should match
the DFN-package I/O-pads width 1:1 and the land for the
die pad should match 1:1 with the DFN package – see preheating critical zone
Figure 8. Time
The solder mask9 design for the land pattern preferably is Figure 9 Soldering profile according to JEDEC standard. TP <=
260°C and tP < 30sec for Pb-free assembly. TL < 220°C and tL <
of type Non-Solder Mask Defined (NSMD) with solder
150sec. Ramp-up/down speeds shall be < 5°C/sec.
mask openings larger than metal pads. For NSMD pads,
the solder mask opening should be about 120µm to It is important to note that the diced edge or side faces of
150µm larger than the pad size, providing a 60µm to 75µm the I/O pads may oxidise over time, therefore a solder fillet
design clearance between the copper pad and solder may or may not form. Hence there is no guarantee for
mask. Rounded portions of package pads should have a solder joint fillet heights of any kind.
matching rounded solder mask-opening shape to minimize
For soldering SHT2x, standard reflow soldering ovens may
the risk of solder bridging. For the actual pad dimensions,
be used. The sensor is qualified to withstand soldering
each pad on the PCB should have its own solder mask
profile according to IPC/JEDEC J-STD-020 with peak
opening with a web of solder mask between adjacent
temperatures at 260°C during up to 30sec for Pb-free
pads.
assembly in IR/Convection reflow ovens (see Figure 9).
0.4 0.3
0.2
recommended to further process the sensors within 1 year 10% of the time – e.g. maximum two measurements per
after date of delivery. second at 12bit accuracy shall be made.
It is of great importance to understand that a humidity
sensor is not a normal electronic component and needs to
be handled with care. Chemical vapors at high
concentration in combination with long exposure times
may offset the sensor reading.
For this reason it is recommended to store the sensors in
original packaging including the sealed ESD bag at
following conditions: Temperature shall be in the range of
10°C – 50°C and humidity at 20 – 60%RH (sensors that
are not stored in ESD bags). For sensors that have been
Figure 10 Top view of example of mounted SHT2x with slits
removed from the original packaging we recommend to
milled into PCB to minimize heat transfer.
store them in ESD bags made of metal-in PE-HD11.
In manufacturing and transport the sensors shall be 2.5 Light
prevented of high concentration of chemical solvents and The SHT2x is not light sensitive. Prolonged direct
long exposure times. Out-gassing of glues, adhesive tapes exposure to sunshine or strong UV radiation may age the
and stickers or out-gassing packaging material such as sensor.
bubble foils, foams, etc. shall be avoided. Manufacturing
area shall be well ventilated. 2.6 Materials Used for Sealing / Mounting
For more detailed information please consult the Many materials absorb humidity and will act as a buffer
document “Handling Instructions” or contact Sensirion. increasing response times and hysteresis. Materials in the
vicinity of the sensor must therefore be carefully chosen.
2.3 Reconditioning Procedure Recommended materials are: Any metals, LCP, POM
As stated above extreme conditions or exposure to solvent (Delrin), PTFE (Teflon), PEEK, PP, PB, PPS, PSU, PVDF,
vapors may offset the sensor. The following reconditioning PVF.
procedure may bring the sensor back to calibration state: For sealing and gluing (use sparingly): Use high filled
Baking: 100 – 105°C at < 5%RH for 10h epoxy for electronic packaging (e.g. glob top, underfill),
Re-Hydration: 20 – 30°C at ~ 75%RH for 12h 12. and Silicone. Out-gassing of these materials may also
contaminate the sensor (see Section 2.2). Therefore try to
2.4 Temperature Effects add the sensor as a last manufacturing step to the
assembly, store the assembly well ventilated after
Relative humidity reading strongly depends on
manufacturing or bake at >50°C for 24h to outgas
temperature. Therefore, it is essential to keep humidity
contaminants before packing.
sensors at the same temperature as the air of which the
relative humidity is to be measured. In case of testing or
2.7 Wiring Considerations and Signal Integrity
qualification the reference sensor and test sensor must
show equal temperature to allow for comparing humidity Carrying the SCL and SDA signal parallel and in close
readings. proximity (e.g. in wires) for more than 10cm may result in
cross talk and loss of communication. This may be
If the sensor shares a PCB with electronic components resolved by routing VDD and/or VSS between the two
that produce heat it should be mounted in a way that SDA signals and/or using shielded cables. Furthermore,
prevents heat transfer or keeps it as low as possible. slowing down SCL frequency will possibly improve signal
Measures to reduce heat transfer can be ventilation, integrity. Power supply pins (VDD, VSS) must be
reduction of copper layers between the sensor and the decoupled with a 100nF capacitor – see next Section.
rest of the PCB or milling a slit into the PCB around the
sensor – see Figure 10.
Furthermore, there are self-heating effects in case the
measurement frequency is too high. To keep self heating
below 0.1°C, SHT2x should not be active for more than
13 For sensors with alternative I2C address please contact Sensirion via
info@sensirion.com.
ACK
ACK
S 1 0 0 0 0 0 0 0 1 1 1 1 0 1 0 1
5.4 Hold / No Hold Master Mode I2C address + write Command (see Table 6)
There are two different operation modes to communicate 19 20 21 22 23 24 25 26 27
with the sensor: Hold Master mode or No Hold Master
NACK
mode. In the first case the SCL line is blocked (controlled Measurement S 1 0 0 0 0 0 0 1
by sensor) during measurement process while in the latter measuring I2C address + read
case the SCL line remains open for other communication 19 20 21 22 23 24 25 26 27
while the sensor is processing the measurement. No hold
ACK
master mode allows for processing other I2C Measurement S 1 0 0 0 0 0 0 1
communication tasks on a bus while the sensor is continue measuring I2C address + read
measuring. A communication sequence of the two modes 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45
is displayed in Figure 15 and Figure 16, respectively. ACK
ACK
0 1 1 0 0 0 1 1 0 1 0 1 0 0 1 0
In the hold master mode, the SHT2x pulls down the SCL
line while measuring to force the master into a wait state. Data (MSB) Data (LSB) Stat.
By releasing the SCL line the sensor indicates that internal 46 47 48 49 50 51 52 53 54
processing is terminated and that transmission may be
NACK
0 1 1 0 0 1 0 0 P
continued.
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
Checksum
ACK
ACK
ACK
46 47 48 49 50 51 52 53 54
The maximum duration for measurements depends on the
type of measurement and resolution chosen – values are
NACK
ACK
15ms. S 1 0 0 0 0 0 0 0 1 1 1 0 0 1 1 1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
I2C address + write Read Register
ACK
ACK
S 1 0 0 0 0 0 0 0 1 1 1 1 1 1 1 0 P 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
NACK
ACK
37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54
5.6 User Register
ACK
ACK
S 1 0 0 0 0 0 0 0 1 1 1 0 0 1 1 0
The content of User Register is described in Table 8.
Please note that reserved bits must not be changed and I2C address + write Write Register
default values of respective reserved bits may change 55 56 57 58 59 60 61 62 63
over time without prior notice. Therefore, for any writing to
ACK
0 0 0 0 0 0 1 1 P
the User Register, default values of reserved bits must be
read first. Thereafter, the full User Register string is Register content to be written
composed of respective default values of reserved bits Figure 18 Read and write register sequence – grey blocks are
and the remainder of accessible bits optionally with default controlled by SHT2x. In this example, the resolution is set to 8bit
or non-default values. / 12bit.
The end of battery alert is activated when the battery
power falls below 2.25V. 5.7 CRC Checksum
SHT21 provides a CRC-8 checksum for error detection.
The heater is intended to be used for functionality The polynomial used is x8 + x5 + x4 +1. For more details
diagnosis – relative humidity drops upon rising and implementation please refer to the application note
temperature. The heater consumes about 5.5mW and “CRC Checksum Calculation for SHT2x”.
provides a temperature increase of about 0.5 – 1.5°C.
OTP Reload is a safety feature and loads the entire OTP
settings to the register, with the exception of the heater bit, 14 This status bit is updated after each measurement
1.75
2.0
0.3 4.0 Ø0.15 MIN
D0AC4
R0.3 MAX
5.5
12.0
Figure 19 Laser marking on SHT21. For details see text.
3.3
Figure 20: First label on reel: XX = Sensor Type (21 for SHT21), 9 Compatibility to SHT1x / 7x protocol
O = Output mode (D = Digital, P = PWM, S = SDM), NN =
SHT2x sensors may be run by communicating with the
product revision no., Y = last digit of year, RRR = number of
sensors on reel divided by 10 (200 for 2000 units), TTTTT =
Sensirion specific communication protocol used for SHT1x
Traceability Code. and SHT7x. In case such protocol is applied please refer
to the communication chapter of datasheet SHT1x or
SHT7x. Please note that reserved status bits of user
register must not be changed.
Please understand that with the SHT1x/7x communication
protocol only functions described in respective datasheets
can be used with the exception of the OTP Reload
function that is not set to default on SHT2x. As an
Revision History
Date Version Page(s) Changes
6 May 2009 0.3 1–9 Initial preliminary release
21 January 2010 1.0 1 – 4, 7 – 10 Complete revision. For complete revision list please require respective document.
5 May 2010 1.1 1 – 12 Typical specification for temperature sensor. Elimination of errors. For detailed
information, please require complete change list at info@sensirion.com.
9 May 2011 2 1 – 7, 10 – Updated temperature accuracy specifications, MSL and standards. Elimination of
13 errors. For detailed information, please require complete change list at
info@sensirion.com.
December 2011 3 1, 7-10 Tolerance of threshold value for low battery signal, minor text adaptations and
corrections.
phone: +41 44 306 40 00 Sensirion Japan Co. Ltd. Sensirion China Co. Ltd.
fax: +41 44 306 40 30 phone: +81 3 3444 4940 phone: +86 755 8252 1501
info@sensirion.com info@sensirion.co.jp info@sensirion.com.cn
www.sensirion.com www.sensirion.co.jp www.sensirion.com.cn
Sensirion AG (Germany)
phone: +41 44 927 11 66
info@sensirion.com
www.sensirion.com To find your local representative, please visit www.sensirion.com/contact
DE - Informationen zu Preisen und Verfügbarkeit in Ihrem Land erhalten Sie über die unten aufgeführten Links:
FR - Pour connaître les tarifs et la disponibilité dans votre pays, cliquez sur l'un des liens suivants:
SHT21
EN DE FR
This Datasheet is presented by Dieses Datenblatt wird vom Cette fiche technique est
the manufacturer Hersteller bereitgestellt présentée par le fabricant