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U/Y-Platforms
Datasheet, Volume 1 of 2
2 Datasheet, Volume 1 of 2
Contents
1 Introduction ............................................................................................................ 11
1.1 Supported Technologies ..................................................................................... 13
1.2 Power Management Support ............................................................................... 13
1.2.1 Processor Core Power Management........................................................... 13
1.2.2 System Power Management ..................................................................... 13
1.2.3 Memory Controller Power Management...................................................... 14
1.2.4 Processor Graphics Power Management ..................................................... 14
1.2.4.1 Memory Power Savings Technologies ........................................... 14
1.2.4.2 Display Power Savings Technologies ............................................ 14
1.2.4.3 Graphics Core Power Savings Technologies................................... 14
1.3 Thermal Management Support ............................................................................ 14
1.4 Package Support ............................................................................................... 15
1.5 Processor Testability .......................................................................................... 15
1.6 Terminology ..................................................................................................... 15
1.7 Related Documents............................................................................................ 18
2 Interfaces................................................................................................................ 19
2.1 System Memory Interface................................................................................... 19
2.1.1 System Memory Technology Supported ..................................................... 19
2.1.1.1 DDR3L/-RS Supported Memory Modules and Devices ..................... 20
2.1.1.2 DDR4/-RS Supported Memory Modules and Devices....................... 21
2.1.1.3 LPDDR3 Supported Memory Devices ............................................ 21
2.1.2 System Memory Timing Support ............................................................... 22
2.1.3 System Memory Organization Modes ......................................................... 23
2.1.4 System Memory Frequency...................................................................... 24
2.1.5 Technology Enhancements of Intel® Fast Memory Access............................. 24
2.1.6 Data Scrambling .................................................................................... 25
2.1.7 DDR I/O Interleaving .............................................................................. 25
2.1.8 Data Swapping....................................................................................... 26
2.1.9 DRAM Clock Generation........................................................................... 26
2.1.10 DRAM Reference Voltage Generation ......................................................... 26
2.2 Processor Graphics ............................................................................................ 26
2.2.1 Operating Systems Support ..................................................................... 27
2.2.2 API Support (Windows*) ......................................................................... 27
2.2.3 Media Support (Intel® QuickSync & Clear Video Technology HD)................... 27
2.2.3.1 Hardware Accelerated Video Decode ............................................ 27
2.2.3.2 Hardware Accelerated Video Encode ............................................ 28
2.2.3.3 Hardware Accelerated Video Processing ....................................... 29
2.2.3.4 Hardware Accelerated Transcoding .............................................. 29
2.2.4 Camera Pipe Support .............................................................................. 29
2.2.5 Switchable/Hybrid Graphics ..................................................................... 30
2.2.6 Gen 9 LP Video Analytics ......................................................................... 30
2.2.7 Gen 9 LP (Generation 9 Low Power) Block Diagram ..................................... 31
2.2.8 GT2/3/4 Graphics Frequency.................................................................... 31
2.3 Display Interfaces ............................................................................................. 32
2.3.1 DisplayPort* .......................................................................................... 35
2.3.2 High-Definition Multimedia Interface (HDMI*) ............................................ 36
2.3.3 Digital Video Interface (DVI) .................................................................... 37
2.3.4 embedded DisplayPort* (eDP*) ................................................................ 37
2.3.5 Integrated Audio .................................................................................... 37
2.3.6 Multiple Display Configurations (Dual Channel DDR).................................... 38
2.3.7 Multiple Display Configurations (Single Channel DDR).................................. 39
2.3.8 High-Bandwidth Digital Content Protection (HDCP)...................................... 40
Datasheet, Volume 1 of 2 3
2.3.9 Display Link Data Rate Support................................................................ 40
2.3.10 Display Bit Per Pixel (BPP) Support........................................................... 41
2.3.11 Display Resolution per Link Width ............................................................ 41
2.4 Platform Environmental Control Interface (PECI) ................................................... 42
2.4.1 PECI Bus Architecture............................................................................. 42
3 Technologies........................................................................................................... 45
3.1 Intel® Virtualization Technology (Intel® VT) ......................................................... 45
3.1.1 Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel®
Architecture (Intel® VT-X)....................................................................... 45
3.1.2 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d).... 47
3.2 Security Technologies........................................................................................ 50
3.2.1 Intel® Trusted Execution Technology (Intel® TXT) ...................................... 50
3.2.2 Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) ........ 51
3.2.3 PCLMULQDQ (Perform Carry-Less Multiplication Quad word) Instruction ........ 51
3.2.4 Intel® Secure Key .................................................................................. 51
3.2.5 Execute Disable Bit ................................................................................ 51
3.2.6 Boot Guard Technology........................................................................... 52
3.2.7 Supervisor Mode Execution Protection (SMEP) ........................................... 52
3.2.8 Intel Supervisor Mode Access Protection (SMAP) ........................................ 52
3.2.9 Intel® Memory Protection Extensions (Intel® MPX)..................................... 52
3.2.10 Intel® Software Guard Extensions (Intel® SGX) ......................................... 53
3.2.11 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d).... 53
3.3 Power and Performance Technologies .................................................................. 54
3.3.1 Intel® Hyper-Threading Technology (Intel® HT Technology) ........................ 54
3.3.2 Intel® Turbo Boost Technology 2.0........................................................... 54
3.3.2.1 Intel® Turbo Boost Technology 2.0 Frequency .............................. 54
3.3.3 Intel® Advanced Vector Extensions 2 (Intel® AVX2).................................... 55
3.3.4 Intel® 64 Architecture x2APIC ................................................................. 55
3.3.5 Power Aware Interrupt Routing (PAIR) ...................................................... 56
3.3.6 Intel® Transactional Synchronization Extensions (Intel® TSX-NI) ................. 57
3.4 Intel® Image Signal Processor (Intel® ISP) .......................................................... 57
3.4.1 Platform Imaging Infrastructure............................................................... 57
3.4.2 Intel® Image Signal Processor (Intel® ISP) ............................................... 58
3.5 Debug Technologies .......................................................................................... 58
3.5.1 Intel® Processor Trace ........................................................................... 58
4 Power Management ................................................................................................ 59
4.1 Advanced Configuration and Power Interface (ACPI) States Supported ..................... 61
4.2 Processor IA Core Power Management ................................................................. 63
4.2.1 OS/HW controlled P-States...................................................................... 63
4.2.1.1 Enhanced Intel® SpeedStep® Technology .................................... 63
4.2.1.2 Intel® Speed Shift Technology ................................................... 63
4.2.2 Low-Power Idle States ............................................................................ 64
4.2.3 Requesting Low-Power Idle States ........................................................... 64
4.2.4 Processor IA Core C-State Rules .............................................................. 65
4.2.5 Package C-States................................................................................... 66
4.2.6 Package C-States and Display Resolutions................................................. 69
4.3 Integrated Memory Controller (IMC) Power Management........................................ 70
4.3.1 Disabling Unused System Memory Outputs................................................ 70
4.3.2 DRAM Power Management and Initialization .............................................. 71
4.3.2.1 Initialization Role of CKE ........................................................... 72
4.3.2.2 Conditional Self-Refresh ............................................................ 72
4.3.2.3 Dynamic Power-Down ............................................................... 73
4.3.2.4 DRAM I/O Power Management ................................................... 73
4.3.3 DDR Electrical Power Gating (EPG) ........................................................... 73
4 Datasheet, Volume 1 of 2
4.3.4 Power Training ....................................................................................... 74
4.4 PCI Express* Power Management ........................................................................ 74
4.5 Processor Graphics Power Management ................................................................ 74
4.5.1 Memory Power Savings Technologies ........................................................ 74
4.5.1.1 Intel® Rapid Memory Power Management (Intel® RMPM) ............... 74
4.5.1.2 Intel® Smart 2D Display Technology (Intel® S2DDT) ..................... 74
4.5.2 Display Power Savings Technologies ......................................................... 75
4.5.2.1 Intel® (Seamless & Static) Display Refresh Rate Switching (DRRS)
with eDP* Port ......................................................................... 75
4.5.2.2 Intel® Automatic Display Brightness ............................................ 75
4.5.2.3 Smooth Brightness.................................................................... 75
4.5.2.4 Intel® Display Power Saving Technology (Intel® DPST) 6.0 ............ 75
4.5.2.5 Low-Power Single Pipe (LPSP)..................................................... 76
4.5.3 Processor Graphics Core Power Savings Technologies .................................. 76
4.5.3.1 Intel® Graphics Dynamic Frequency ............................................ 76
4.5.3.2 Intel® Graphics Render Standby Technology (Intel® GRST) ............ 76
4.5.3.3 Dynamic FPS (DFPS) ................................................................. 76
4.6 System Agent Enhanced Intel Speedstep® Technology ........................................... 76
4.7 Voltage Optimization.......................................................................................... 77
4.8 ROP (Rest Of Platform) PMIC .............................................................................. 77
5 Thermal Management .............................................................................................. 78
5.1 Processor Thermal Management .......................................................................... 78
5.1.1 Thermal Considerations........................................................................... 78
5.1.2 Intel® Turbo Boost Technology 2.0 Power Monitoring .................................. 79
5.1.3 Intel® Turbo Boost Technology 2.0 Power Control ....................................... 79
5.1.3.1 Package Power Control .............................................................. 79
5.1.3.2 Platform Power Control .............................................................. 80
5.1.3.3 Turbo Time Parameter (Tau) ...................................................... 81
5.1.4 Configurable TDP (cTDP) and Low-Power Mode ........................................... 81
5.1.4.1 Configurable TDP ...................................................................... 81
5.1.4.2 Low-Power Mode....................................................................... 82
5.1.5 Thermal Management Features ................................................................ 82
5.1.5.1 Adaptive Thermal Monitor .......................................................... 82
5.1.5.2 Digital Thermal Sensor .............................................................. 85
5.1.5.3 PROCHOT# Signal..................................................................... 86
5.1.5.4 Bi-Directional PROCHOT#........................................................... 86
5.1.5.5 Voltage Regulator Protection using PROCHOT# ............................. 86
5.1.5.6 Thermal Solution Design and PROCHOT# Behavior ........................ 86
5.1.5.7 Low-Power States and PROCHOT# Behavior ................................. 87
5.1.5.8 THERMTRIP# Signal .................................................................. 87
5.1.5.9 Critical Temperature Detection.................................................... 87
5.1.5.10 On-Demand Mode ..................................................................... 87
5.1.5.11 MSR Based On-Demand Mode..................................................... 87
5.1.5.12 I/O Emulation-Based On-Demand Mode ....................................... 88
5.1.6 Intel® Memory Thermal Management ........................................................ 88
5.1.7 Scenario Design Power (SDP)................................................................... 88
5.2 U/Y-Processor Line Thermal and Power Specifications............................................. 89
5.3 Thermal Metrology ............................................................................................ 91
6 Signal Description ................................................................................................... 93
6.1 System Memory Interface................................................................................... 94
6.2 Reset and Miscellaneous Signals .......................................................................... 99
6.3 embedded DisplayPort* (eDP*) Signals ................................................................ 99
6.4 Display Interface Signals .................................................................................. 100
6.5 Testability Signals ........................................................................................... 100
6.6 Error and Thermal Protection Signals ................................................................. 101
6.7 Power Sequencing Signals ................................................................................ 102
Datasheet, Volume 1 of 2 5
6.8 Processor Power Rails.......................................................................................103
6.9 Ground, Reserved, and Non-Critical to Function (NCTF) Signals..............................104
6.10 Processor Internal Pull-Up/Pull-Down Terminations...............................................104
7 Electrical Specifications .........................................................................................105
7.1 Processor Power Rails.......................................................................................105
7.1.1 Power and Ground Pins..........................................................................105
7.1.2 VCC Voltage Identification (VID) ..............................................................105
7.2 DC Specifications .............................................................................................106
7.2.1 Processor Power Rails DC Specifications ...................................................106
7.2.1.1 Vcc DC Specifications ...............................................................106
7.2.1.2 VccGT and VccGTX DC Specifications ...........................................108
7.2.1.3 VDDQ DC Specifications ...........................................................109
7.2.1.4 VccSA DC Specifications ...........................................................110
7.2.1.5 VccIO DC Specifications ...........................................................111
7.2.1.6 VccOPC DC Specifications .........................................................111
7.2.1.7 VccEOPIO DC Specifications ......................................................112
7.2.1.8 VCC_OPC_1p8 DC Specifications ...............................................112
7.2.1.9 VccST DC Specifications ...........................................................113
7.2.1.10 VccPLL DC Specifications ..........................................................113
7.2.2 Processor Interfaces DC Specifications .....................................................114
7.2.2.1 DDR3L/-RS DC Specifications ....................................................114
7.2.2.2 LPDDR3 DC Specifications ........................................................115
7.2.2.3 DDR4/-RS DC Specifications .....................................................116
7.2.2.4 Digital Display Interface (DDI) DC Specifications .........................117
7.2.2.5 embedded DisplayPort* (eDP*) DC Specification..........................118
7.2.2.6 CMOS DC Specifications ...........................................................118
7.2.2.7 GTL and OD DC Specifications ...................................................118
7.2.2.8 PECI DC Characteristics............................................................119
8 Package Mechanical Specifications.........................................................................121
8.1 Package Mechanical Attributes ...........................................................................121
8.2 Package Loading Specifications ..........................................................................121
8.3 Package Storage Specifications ..........................................................................122
9 U-Processor Ball Information .................................................................................123
10 Y-Processor Ball Information .................................................................................167
Figures
1-1 U-Processor Line and Y-Processor Line Platforms........................................................ 12
1-2 Merged XDP connector for Processor and PCH............................................................ 15
2-1 Intel® Flex Memory Technology Operations ............................................................... 23
2-2 Interleave (IL) and Non-Interleave (NIL) Modes Mapping ............................................ 26
2-3 Video Analytics Common Use Cases ......................................................................... 30
2-4 Gen 9 LP Block Diagram ......................................................................................... 31
2-5 Processor Display Architecture (with 3 DDI Ports as an Example) ................................. 35
2-6 DisplayPort* Overview............................................................................................ 36
2-7 HDMI* Overview ................................................................................................... 37
2-8 Example for PECI Host-Clients Connection................................................................. 43
2-9 Example for PECI EC Connection ............................................................................. 44
3-1 Device to Domain Mapping Structures ...................................................................... 48
3-2 Processor Camera System ...................................................................................... 57
3-3 Platform Imaging Infrastructure............................................................................... 58
4-1 Processor Power States .......................................................................................... 60
4-2 Processor Package and IA Core C-States ................................................................... 61
4-3 Idle Power Management Breakdown of the Processor IA Cores ..................................... 64
6 Datasheet, Volume 1 of 2
4-4 Package C-State Entry and Exit ................................................................................ 67
5-1 Package Power Control............................................................................................ 80
5-2 Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location............... 92
7-1 Input Device Hysteresis ........................................................................................ 120
9-1 U-Processor Ball Map (Top View, Upper-Left Quadrant).............................................. 124
9-2 U-Processor Ball Map (Top View, Upper-Right Quadrant)............................................ 125
9-3 U-Processor Ball Map (Top View, Lower-Left Quadrant).............................................. 126
9-4 U-Processor Ball Map (Top View, Lower-Right Quadrant)............................................ 127
10-1 Y-Processor Ball Map (Top View, Upper-Left, Columns 64-44)..................................... 168
10-2 Y-Processor Ball Map (Top View, Upper-Middle, Columns 43-23) ................................. 169
10-3 Y-Processor Ball Map (Top View, Upper-Right, Columns 22-1) .................................... 170
10-4 Y-Processor Ball Map (Top View, Lower-Left, Columns 64-44)..................................... 171
10-5 Y-Processor Ball Map (Top View, Lower-Middle, Columns 43-23) ................................. 172
10-6 Y-Processor Ball Map (Top View, Lower-Right, Columns 22-1) .................................... 173
Tables
1-1 Processor Lines ...................................................................................................... 11
1-2 Terminology .......................................................................................................... 15
1-3 Related Documents ................................................................................................ 18
2-1 Processor DRAM Support Matrix ............................................................................... 19
2-2 Supported DDR3L/-RS Non-ECC SODIMM Module Configurations (U-Processor Line)........ 20
2-3 Supported DDR3L/-RS Memory Down Module Configurations (U-Processor Line) ............. 20
2-4 Supported DDR4/-RS Non-ECC SODIMM Module Configurations (U-Processor Line) ......... 21
2-5 Supported DDR4/-RS Memory Down Module Configurations (U-Processor Line)............... 21
2-6 Supported LPDDR3 x32 DRAMs Configurations (U/Y-Processor Line).............................. 21
2-7 Supported LPDDR3 x64 DRAMs Configurations (U/Y-Processor Line).............................. 22
2-8 DRAM System Memory Timing Support ..................................................................... 22
2-9 Interleave (IL) and Non-Interleave (NIL) Modes Pin Mapping........................................ 25
2-10 Hardware Accelerated Video Decoding....................................................................... 28
2-11 Hardware Accelerated Video Encode ......................................................................... 28
2-12 Switchable/Hybrid Graphics Support ......................................................................... 30
2-13 GT2/3/4 Graphics Frequency (U/Y-Processor Line) ...................................................... 31
2-14 embedded DisplayPort* (eDP*)/DDI Ports Availability ................................................. 32
2-15 Display Technologies Support .................................................................................. 33
2-16 Display Resolutions and Link Bandwidth for Multi-Stream Transport calculations ............. 33
2-17 Processor Supported Audio Formats over HDMI and DisplayPort*.................................. 38
2-18 Display Resolution .................................................................................................. 38
2-19 Y-Processor Line Display Resolution Configuration....................................................... 39
2-20 U-Processor Line Display Resolution Configuration ...................................................... 39
2-21 U-Processor Line Display Resolution Configuration when DP@30 Hz .............................. 40
2-22 HDCP Display supported Implications ........................................................................ 40
2-23 Display Link Data Rate Support ................................................................................ 40
2-25 Display Bit Per Pixel (BPP) Support .......................................................................... 41
2-26 Supported Resolutions1 for HBR2 (5.4Gbps) by Link Width ......................................... 41
2-27 Supported Resolutions1 for HBR (2.7Gbps) by Link Width ........................................... 41
2-24 Display Resolution and Link Rate Support .................................................................. 41
2-28 Display Bit Per Pixel (BPP) Support .......................................................................... 42
4-1 System States ....................................................................................................... 61
4-2 Processor IA Core/Package State Support .................................................................. 62
4-3 G, S, and C Interface State Combinations .................................................................. 62
4-4 Deepest Package C-State Available ........................................................................... 70
4-5 Targeted Memory State Conditions ........................................................................... 73
5-1 Configurable TDP Modes.......................................................................................... 81
5-2 TDP Specifications (U/Y-Processor Line) .................................................................... 90
Datasheet, Volume 1 of 2 7
5-3 Package Turbo Specifications (U/Y-Processor Line) ..................................................... 91
5-4 Junction Temperature Specifications (U/Y-Processor Line) ........................................... 91
6-1 Signal Tables Terminology ...................................................................................... 93
6-2 DDR3L/-RS Memory Interface ................................................................................. 94
6-3 LPDDR3 Memory Interface ...................................................................................... 96
6-4 DDR4/-RS Memory Interface ................................................................................... 97
6-5 System Memory Reference and Compensation Signals ................................................ 98
6-6 Reset and Miscellaneous Signals .............................................................................. 99
6-7 embedded DisplayPort* Signals ............................................................................... 99
6-8 Display Interface Signals .......................................................................................100
6-9 Testability Signals.................................................................................................100
6-10 Error and Thermal Protection Signals.......................................................................101
6-11 Power Sequencing Signals......................................................................................102
6-12 Processor Power Rails Signals.................................................................................103
6-13 GND, RSVD, and NCTF Signals ...............................................................................104
6-14 Processor Internal Pull-Up/Pull-Down Terminations....................................................104
7-1 Processor Power Rails............................................................................................105
7-2 Processor IA Core (Vcc) Active and Idle Mode DC Voltage and Current Specifications .....106
7-3 Processor Graphics (VccGT and VccGT-X) Supply DC Voltage and Current Specifications ...108
7-4 Memory Controller (VDDQ) Supply DC Voltage and Current Specifications ....................109
7-5 System Agent (VccSA) Supply DC Voltage and Current Specifications ..........................110
7-6 Processor I/O (VccIO) Supply DC Voltage and Current Specifications ............................111
7-7 VCCOPC Voltage levels ...........................................................................................111
7-8 Processor OPC (VccOPC) Supply DC Voltage and Current Specifications .........................111
7-9 VCCEOPIO Voltage Levels (Separate VR) ...................................................................112
7-10 Processor EOPIO (VccEOPIO) Supply DC Voltage and Current Specifications ...................112
7-11 Processor OPC (VCC_OPC_1p8) Supply DC Voltage and Current Specifications ..............112
7-12 Vcc Sustain (VccST) Supply DC Voltage and Current Specifications ..............................113
7-13 Vcc Sustain Gated (VccSTG) Supply DC Voltage and Current Specifications...................113
7-14 Processor PLL (VccPLL) Supply DC Voltage and Current Specifications..........................113
7-15 Processor PLL OC (VccPLL_OC) Supply DC Voltage and Current Specifications ...............114
7-16 DDR3L/-RS Signal Group DC Specifications ..............................................................114
7-17 LPDDR3 Signal Group DC Specifications ...................................................................115
7-18 DDR4/-RS Signal Group DC Specifications ................................................................116
7-19 Digital Display Interface Group DC Specifications (DP*/HDMI*)...................................117
7-20 embedded DisplayPort* (eDP*) Group DC Specifications ............................................118
7-21 CMOS Signal Group DC Specifications......................................................................118
7-22 GTL Signal Group and Open Drain Signal Group DC Specifications ...............................118
7-23 PECI DC Electrical Limits........................................................................................119
8-1 Package Mechanical Attributes................................................................................121
8-2 Package Loading Specifications...............................................................................121
8-3 Package Storage Specifications...............................................................................122
9-1 U-Processor Ball List .............................................................................................128
10-1 Y-Processor Ball List..............................................................................................174
8 Datasheet, Volume 1 of 2
Revision History
Revision
Description Revision Date
Number
Datasheet, Volume 1 of 2 9
Revision
Description Revision Date
Number
• Table 7-5, System Agent (VccSA) Supply DC Voltage and Current Specifications
— Added AC_LL parameter
— Added Note 8
• Updated Table 7-18, DDR4/-RS Signal Group DC Specifications
• Updated Table 7-12, Vcc Sustain (VccST) Supply DC Voltage and Current Specifications.
Removed Note 4.
• Updated Table 7-13, Vcc Sustain Gated (VccSTG) Supply DC Voltage and Current
004 Specifications. Removed Note 4. March 2016
(cont.)
• Updated Table 7-21, embedded DisplayPort* (eDP*) Group DC Specifications
• Updated Table 7-22, CMOS Signal Group DC Specification. Removed reference to Note 5.
• Updated Table 7-23, GTL Signal Group and Open Drain Signal Group DC Specifications.
Removed reference to Note 5.
• Updated Table 7-24, PECI DC Electrical Limits
• Updated Table 8-1, Package Mechanical Attributes
• Updated Table 8-2, Package Loading Specifications. Removed Notes 4 and 5
• Added Chapter 9, U-Processor Ball Information
005 January 2017
• Added Chapter 10, Y-Processor Ball Information
• Updated Table 2-5, “Supported DDR4/-RS Memory Down Module Configurations”
006 • Updated Table 2-14, “embedded DisplayPort* (eDP*)/DDI Ports Availability” August 2017
• Updated Section 4-9, “ROP (Rest Of Platform) PMIC”
§§
10 Datasheet, Volume 1 of 2
Introduction
1 Introduction
The 6th Generation Intel® Core™ processor family is a 64-bit, multi-core processor
built on 14-nanometer process technology.
The U-processor line and Y-processor line processors are offered in a 1-Chip Platform
that includes the 6th Generation Intel® Processor I/O Platform Controller Hub (PCH) die
on the same package as the processor die. See the following figure.
Some of the processor SKUs are offered with On-Package Cache.
The following table describes the different processor lines.
U-Pentium®/Celeron®
BGA1356 SKL-U, 15W 15W 2 GT1 N/A 1-Chip
processor line
This document covers all processor client segments (U, Y) based on the processor
architecture. Not all processor interfaces and features are present in all segments. The
presence of various interfaces and features will be indicated within the relevant
sections and tables.
Throughout this document, the 6th Generation Intel® Core™ processor family may be
referred to simply as “processor”.
Throughout this document, the 6th Generation Intel® Processor I/O Platform Controller
Hub (PCH) may be referred to simply as “PCH”.
This document is for the following SKUs:
• 6th Generation Intel® Core™ processor family U processors
— i7-6660U, i7-6650U, i7-6600U, i7-6567U, i7-6560U, i7-6500U, i5-6360U, i5-
6300U, i5-6287U, i5-6267U, i5-6260U, i5-6200U, i3-6167U, i3-6100U
• 6th Generation Intel® Core™ processor family Y processors
— 6Y75, 6Y57, 6Y54, 6Y30
• Intel® Pentium® processors
— 4405U, 4405Y
• Intel® Celeron® processors
— 3955U, 3855U
Datasheet, Volume 1 of 2 11
Introduction
12 Datasheet, Volume 1 of 2
Introduction
Note: The availability of the features may vary between processor SKUs.
Datasheet, Volume 1 of 2 13
Introduction
14 Datasheet, Volume 1 of 2
Introduction
Note: When separate XDP connectors will be used at C8–C10 states, the processor will need
to be waked up using the PCH.
The processor includes boundary-scan for board and system level testability.
1.6 Terminology
Datasheet, Volume 1 of 2 15
Introduction
DP DisplayPort*
LPDDR3 Low Power Third-generation Double Data Rate SDRAM memory technology
Low-Power Mode.The LPM Frequency is less than or equal to the LFM Frequency. The
LPM LPM TDP is lower than the LFM TDP as the LPM configuration limits the processor to
single thread operation
Multi Chip Package - includes the processor and the PCH. In some SKU’s it might
MCP
have additional On-Package Cache.
Minimum Frequency Mode. MFM is the minimum ratio supported by the processor
MFM
and can be read from MSR CEh [55:48].
16 Datasheet, Volume 1 of 2
Introduction
Platform Controller Hub. The chipset with centralized platform capabilities including
the main I/O interfaces along with display connectivity, audio features, power
PCH
management, manageability, security, and storage features. The PCH may also be
referred as “chipset”.
The term “processor core” refers to Si die itself, which can contain multiple
Processor Core execution cores. Each execution core has an instruction cache, data cache, and 256-
KB L2 cache. All execution cores share the LLC.
Scenario Design Power. The Power consumed by a typical scenario. For more
SDP information, refer to the Scenario Design Power (SDP) Implementation
Considerations document (see Related Documents section).
Datasheet, Volume 1 of 2 17
Introduction
§§
18 Datasheet, Volume 1 of 2
Interfaces
2 Interfaces
Datasheet, Volume 1 of 2 19
Interfaces
Note: Maximum system capacity is referred to 2 channels populated with 2 ranks per channel.
20 Datasheet, Volume 1 of 2
Interfaces
Notes:
1. The maximum system capacity for x8 devices refers to 2 channels, 2 ranks systems.
2. The maximum system capacity for x16 devices refers to 2 channels, 1 rank systems.
Notes:
1. x32 devices are 178 balls.
2. SDP = Single Die Package, DDP = Dual Die Package, QDP = Quad Die Package
Datasheet, Volume 1 of 2 21
Interfaces
Notes:
1. x64 devices are 253 balls.
2. SDP = Single Die Package, DDP = Dual Die Package, QDP = Quad Die Package
1333 10 12 12 7 1 0.5N
LPDDR3
1600 12 15 15 8 1 0.5N
22 Datasheet, Volume 1 of 2
Interfaces
Single-Channel Mode
In this mode, all memory cycles are directed to a single channel. Single-Channel mode
is used when either the Channel A or Channel B DIMM connectors are populated in any
order, but not both.
The IMC supports Intel Flex Memory Technology Mode. Memory is divided into a
symmetric and asymmetric zone. The symmetric zone starts at the lowest address in
each channel and is contiguous until the asymmetric zone begins or until the top
address of the channel with the smaller capacity is reached. In this mode, the system
runs with one zone of dual-channel mode and one zone of single-channel mode,
simultaneously, across the whole memory array.
Note: Channels A and B can be mapped for physical channel 0 and 1 respectively or vice
versa; however, channel A size must be greater or equal to channel B size.
Figure 2-1. Intel® Flex Memory Technology Operations
Datasheet, Volume 1 of 2 23
Interfaces
opposite channels. Use Dual-Channel Symmetric mode when both Channel A and
Channel B DIMM connectors are populated in any order, with the total amount of
memory in each channel being the same.
When both channels are populated with the same memory capacity and the boundary
between the dual channel zone and the single channel zone is the top of memory, IMC
operates completely in Dual-Channel Symmetric mode.
Note: The DRAM device technology and width may vary from one channel to the other.
The memory controller has an advanced command scheduler where all pending
requests are examined simultaneously to determine the most efficient request to be
issued next. The most efficient request is picked from all pending requests and issued
to system memory Just-in-Time to make optimal use of Command Overlapping. Thus,
instead of having all memory access requests go individually through an arbitration
mechanism forcing requests to be executed one at a time, they can be started without
interfering with the current request allowing for concurrent issuing of requests. This
allows for optimized bandwidth and reduced latency while maintaining appropriate
command spacing to meet system memory protocol.
Command Overlap
Command Overlap allows the insertion of the DRAM commands between the Activate,
Pre-charge, and Read/Write commands normally used, as long as the inserted
commands do not affect the currently executing command. Multiple commands can be
issued in an overlapping manner, increasing the efficiency of system memory protocol.
Out-of-Order Scheduling
While leveraging the Just-in-Time Scheduling and Command Overlap enhancements,
the IMC continuously monitors pending requests to system memory for the best use of
bandwidth and reduction of latency. If there are multiple requests to the same open
page, these requests would be launched in a back to back manner to make optimum
use of the open memory page. This ability to reorder requests on the fly allows the IMC
to further reduce latency and increase bandwidth efficiency.
24 Datasheet, Volume 1 of 2
Interfaces
Note: The Y-processor line package is optimized only for Non-Interleaving (NIL) mode
Table 2-9. Interleave (IL) and Non-Interleave (NIL) Modes Pin Mapping
IL NIL
Datasheet, Volume 1 of 2 25
Interfaces
The new processor graphics architecture delivers high dynamic range of scaling to
address segments spanning low power to high power, increased performance per watt,
support for next generation of APIs and extends heterogeneous programmability with
IA core/GPU and Shared Virtual memory (SVM). Gen 9 LP scalable architecture is
partitioned by usage domains along Render/Geometry, Media, and Display. The
architecture also delivers very low-power video playback and next generation analytics
and filters for imaging related applications. The new Graphics Architecture includes 3D
26 Datasheet, Volume 1 of 2
Interfaces
The Display Engine handles delivering the pixels to the screen. GSA (Graphics in
System Agent) is the primary channel interface for display memory accesses and “PCI-
like” traffic in and out.
The display engine supports the latest display standards such as eDP* 1.3, DP* 1.2,
HDMI* 1.4, HW support for blend, scale, rotate, compress, high PPI support, and
advanced SRD2 display power management.
DirectX* extensions:
• PixelSync, InstantAccess, Conservative Rasterization, Render Target Reads,
Floating-point De-norms, Shared Virtual memory, Floating Point atomics, MSAA
sample-indexing, Fast Sampling (Coarse LOD), Quilted Textures, GPU Enqueue
Kernels, GPU Signals processing unit. Other enhancements include color
compression.
Note: All supported media codecs operate on 8 bpc, YCbCr 4:2:0 video profiles.
The HW decode is exposed by the graphics driver using the following APIs:
• Direct3D* 9 Video API (DXVA2)
• Direct3D11 Video API
• Intel Media SDK
• MFT (Media Foundation Transform) filters.
Datasheet, Volume 1 of 2 27
Interfaces
Main
MPEG2 Main
High 1080p
Advanced L3
VC1/WMV9 Main High 3840x3840
Simple Simple
High
AVC/H264 Main L5.1 2160p(4K)
MVC & stereo
Expected performance:
• More than 16 simultaneous decode streams @ 1080p.
Note: Actual performance depends on the processor SKU, content bit rate, and memory
frequency. Hardware decode for H264 SVC is not supported.
The HW encode is exposed by the graphics driver using the following APIs:
• Intel Media SDK
• MFT (Media Foundation Transform) filters
Main
AVC/H264 L5.1 2160p(4K)
High
28 Datasheet, Volume 1 of 2
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There is support for Hardware assisted Motion Estimation engine for AVC/MPEG2
encode, True Motion, and Image stabilization applications.
The HW video processing is exposed by the graphics driver using the following APIs:
• Direct3D* 9 Video API (DXVA2).
• Direct3D 11 Video API.
• Intel Media SDK.
• MFT (Media Foundation Transform) filters.
• Intel CUI SDK.
Note: Not all features are supported by all the above APIs. Refer to the relevant
documentation for more details.
Expected performance:
• Y-processor line: 10x 1080p30 RT (previous generation is 5x 1080p30 RT).
• U-processor line: 12x 1080p30 RT (same as previous generation).
Note: Actual performance depends on processor line, video processing algorithms used,
content bit rate, and memory frequency.
Datasheet, Volume 1 of 2 29
Interfaces
Switchable graphics: The Switchable Graphics feature allows you to switch between
using the Intel integrated graphics and a discrete graphics card. The Intel Integrated
Graphics driver will control the switching between the modes. In most cases it will
operate as follows: when connected to AC power - Discrete graphic card; when
connected to DC (battery) - Intel integrated GFX
Hybrid graphics: Intel integrated graphics and a discrete graphics card work
cooperatively to achieve enhanced power and performance.
Notes:
1. Contact your graphics vendor to check for support.
2. Intel does not validate any SG configurations on Win8.1 or Win10.
30 Datasheet, Volume 1 of 2
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Datasheet, Volume 1 of 2 31
Interfaces
Note: The processor platform supports DP Type-C implementation with additional discrete
components.
The technologies supported by the processor are listed in the following table.
32 Datasheet, Volume 1 of 2
Interfaces
Note:
1. HDMI* 2.0 support is possible using LS-Pcon converter chip connected to the DP port. The LS-Pcon
supports 2 modes:
a. Level shifter for HDMI 1.4 resolutions.
b. DP-HDMI 2.0 protocol converter for HDMI 2.0 resolutions.
• The HDMI* interface supports HDMI with 3D, 4Kx2K@24Hz, Deep Color, and
x.v.Color.
• The processor supports High-bandwidth Digital Content Protection (HDCP) for high
definition content playback over digital interfaces, HDCP is not supported for eDP.
• The processor supports eDP* display authentication: Alternate Scrambler Seed
Reset (ASSR).
• The processor supports Multi-Stream Transport (MST), enabling multiple monitors
to be used via a single DisplayPort connector.
The max MST DP supported resolution for U/Y-processor line is shown in the
following table.
Table 2-16. Display Resolutions and Link Bandwidth for Multi-Stream Transport
calculations (Sheet 1 of 2)
Link
Refresh Pixel Clock
Pixels per line Lines Bandwidth
Rate [Hz] [MHz]
[Gbps]
Datasheet, Volume 1 of 2 33
Interfaces
Table 2-16. Display Resolutions and Link Bandwidth for Multi-Stream Transport
calculations (Sheet 2 of 2)
Link
Refresh Pixel Clock
Pixels per line Lines Bandwidth
Rate [Hz] [MHz]
[Gbps]
34 Datasheet, Volume 1 of 2
Interfaces
2.3.1 DisplayPort*
The DisplayPort* is a digital communication interface that uses differential signaling to
achieve a high-bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays.
A DisplayPort* consists of a Main Link, Auxiliary channel, and a Hot-Plug Detect signal.
The Main Link is a unidirectional, high-bandwidth, and low-latency channel used for
transport of isochronous data streams such as uncompressed video and audio. The
Datasheet, Volume 1 of 2 35
Interfaces
Auxiliary Channel (AUX CH) is a half-duplex bi-directional channel used for link
management and device control. The Hot-Plug Detect (HPD) signal serves as an
interrupt request for the sink device.
HDMI includes three separate communications channels: TMDS, DDC, and the optional
CEC (consumer electronics control). CEC is not supported on the processor. As shown in
the following figure, the HDMI cable carries four differential pairs that make up the
TMDS data and clock channels. These channels are used to carry video, audio, and
auxiliary data. In addition, HDMI carries a VESA DDC. The DDC is used by an HDMI
Source to determine the capabilities and characteristics of the Sink.
Audio, video, and auxiliary (control/status) data is transmitted across the three TMDS
data channels. The video pixel clock is transmitted on the TMDS clock channel and is
used by the receiver for data recovery on the three data channels. The digital display
data signals driven natively through the PCH are AC coupled and needs level shifting to
convert the AC coupled signals to the HDMI compliant digital signals.
36 Datasheet, Volume 1 of 2
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Datasheet, Volume 1 of 2 37
Interfaces
Table 2-17. Processor Supported Audio Formats over HDMI and DisplayPort*
Audio Formats HDMI* DisplayPort*
The processor will continue to support Silent stream. Silent stream is an integrated
audio feature that enables short audio streams, such as system events to be heard
over the HDMI* and DisplayPort* monitors. The processor supports silent streams over
the HDMI and DisplayPort interfaces at 44.1 kHz, 48 kHz, 88.2 kHz, 96 kHz, 176.4 kHz,
and 192 kHz sampling rates.
38 Datasheet, Volume 1 of 2
Interfaces
HDMI* 1.4
4096x2160 @ 24 Hz, 24 bpp 4096x2160 @ 24 Hz, 24 bpp 1, 2
(native)
Datasheet, Volume 1 of 2 39
Interfaces
Note:
1. eDP* with 3840x2160@60 resolution is very close to maximum limit and may not be supported for U-
Processor.
The HDCP 1.4 keys are integrated into the processor and customers are not required to
physically configure or handle the keys.
40 Datasheet, Volume 1 of 2
Interfaces
eDP* 24,30,36
DisplayPort* 24,30,36
HDMI* 24,36
Notes:
1. The examples assumed 60 Hz refresh rate and 24 bpp.
2. The actual Max pixel clock for HBR2 is limited by the CD clock to 540 MHz for Y-processor line and
675 MHz for U-processor line.
Note:
1. The examples assumed 60Hz refresh rate and 24 bpp.
Datasheet, Volume 1 of 2 41
Interfaces
eDP* 24,30,36
DisplayPort* 24,30,36
HDMI* 24,36
42 Datasheet, Volume 1 of 2
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Datasheet, Volume 1 of 2 43
Interfaces
§§
44 Datasheet, Volume 1 of 2
Technologies
3 Technologies
The implementation of the features may vary between the processor SKUs.
Details on the different technologies of Intel processors and other relevant external
notes are located at the Intel technology web site: http://www.intel.com/technology/
Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture
(Intel® VT-x) added hardware support in the processor to improve the virtualization
performance and robustness. Intel® Virtualization Technology for Directed I/O (Intel®
VT-d) extends Intel VT-x by adding hardware assisted support to improve I/O device
virtualization performance.
Intel® VT-x specifications and functional descriptions are included in the Intel® 64 and
IA-32 Architectures Software Developer’s Manual, Volume 3. Available at:
http://www.intel.com/products/processor/manuals/index.htm
The Intel VT-d specification and other VT documents can be referenced at:
http://www.intel.com/technology/virtualization/index.htm
https://sharedspaces.intel.com/sites/PCDC/SitePages/Ingredients/
ingredient.aspx?ing=VT
Datasheet, Volume 1 of 2 45
Technologies
• More secure: The use of hardware transitions in the VMM strengthens the isolation
of VMs and further prevents corruption of one VM from affecting others on the
same system.
The processor supports the following added new Intel VT-x features:
• Extended Page Table (EPT) Accessed and Dirty Bits
— EPT A/D bits enabled VMMs to efficiently implement memory management and
page classification algorithms to optimize VM memory operations, such as de-
fragmentation, paging, live migration, and check-pointing. Without hardware
support for EPT A/D bits, VMMs may need to emulate A/D bits by marking EPT
paging-structures as not-present or read-only, and incur the overhead of EPT
page-fault VM exits and associated software processing.
• EPTP (EPT pointer) switching
— EPTP switching is a specific VM function. EPTP switching allows guest software
(in VMX non-root operation, supported by EPT) to request a different EPT
paging-structure hierarchy. This is a feature by which software in VMX non-root
operation can request a change of EPTP without a VM exit. Software will be able
to choose among a set of potential EPTP values determined in advance by
software in VMX root operation.
• Pause loop exiting
— Support VMM schedulers seeking to determine when a virtual processor of a
multiprocessor virtual machine is not performing useful work. This situation
may occur when not all virtual processors of the virtual machine are currently
scheduled and when the virtual processor in question is in a loop involving the
PAUSE instruction. The new feature allows detection of such loops and is thus
called PAUSE-loop exiting.
46 Datasheet, Volume 1 of 2
Technologies
The key Intel VT-d objectives are domain-based isolation and hardware-based
virtualization. A domain can be abstractly defined as an isolated environment in a
platform to which a subset of host physical memory is allocated. Intel VT-d provides
accelerated I/O performance for a virtualized platform and provides software with the
following capabilities:
• I/O device assignment and security: for flexibly assigning I/O devices to VMs and
extending the protection and isolation properties of VMs for I/O operations.
• DMA remapping: for supporting independent address translations for Direct
Memory Accesses (DMA) from devices.
• Interrupt remapping: for supporting isolation and routing of interrupts from devices
and external interrupt controllers to appropriate VMs.
• Reliability: for recording and reporting to system software DMA and interrupt errors
that may otherwise corrupt memory or impact VM isolation.
Intel VT-d accomplishes address translation by associating transaction from a given I/O
device to a translation table associated with the Guest to which the device is assigned.
It does this by means of the data structure in the following illustration. This table
creates an association between the device's PCI Express* Bus/Device/Function (B/D/F)
number and the base address of a translation table. This data structure is populated by
a VMM to map devices to translation tables in accordance with the device assignment
restrictions above, and to include a multi-level translation table (VT-d Table) that
contains Guest specific address translations.
Datasheet, Volume 1 of 2 47
Technologies
Intel VT-d functionality, often referred to as an Intel VT-d Engine, has typically been
implemented at or near a PCI Express* host bridge component of a computer system.
This might be in a chipset component or in the PCI Express functionality of a processor
with integrated I/O. When one such VT-d engine receives a PCI Express transaction
from a PCI Express bus, it uses the B/D/F number associated with the transaction to
search for an Intel VT-d translation table. In doing so, it uses the B/D/F number to
traverse the data structure shown in the above figure. If it finds a valid Intel VT-d table
in this data structure, it uses that table to translate the address provided on the PCI
Express bus. If it does not find a valid translation table for a given translation, this
results in an Intel VT-d fault. If Intel VT-d translation is required, the Intel VT-d engine
performs an N-level table walk.
For more information, refer to Intel Virtualization Technology for Directed I/O
Architecture Specification http://www.intel.com/content/dam/www/public/us/en/
documents/product-specifications/vt-directed-io-spec.pdf
48 Datasheet, Volume 1 of 2
Technologies
The processor supports the following added new Intel VT-d features:
• 4-level Intel VT-d Page walk – both default Intel VT-d engine as well as the IGD VT-
d engine are upgraded to support 4-level Intel VT-d tables (adjusted guest address
width of 48 bits)
• Intel VT-d superpage – support of Intel VT-d superpage (2MB, 1GB) for default
Intel VT-d engine (that covers all devices except IGD)
IGD Intel VT-d engine does not support superpage and BIOS should disable
superpage in default Intel VT-d engine when iGfx is enabled.
Datasheet, Volume 1 of 2 49
Technologies
The Intel TXT platform helps to provide the authenticity of the controlling environment
such that those wishing to rely on the platform can make an appropriate trust decision.
The Intel TXT platform determines the identity of the controlling environment by
accurately measuring and verifying the controlling software.
Another aspect of the trust decision is the ability of the platform to resist attempts to
change the controlling environment. The Intel TXT platform will resist attempts by
software processes to change the controlling environment or bypass the bounds set by
the controlling environment.
Intel TXT is a set of extensions designed to provide a measured and controlled launch
of system software that will then establish a protected environment for itself and any
additional software that it may execute.
The enhanced platform provides these launch and control interfaces using Safer Mode
Extensions (SMX).
50 Datasheet, Volume 1 of 2
Technologies
Intel AES-NI consists of six Intel SSE instructions. Four instructions, AESENC,
AESENCLAST, AESDEC, and AESDELAST facilitate high performance AES encryption and
decryption. The other two, AESIMC and AESKEYGENASSIST, support the AES key
expansion procedure. Together, these instructions provide full hardware for supporting
AES; offering security, high performance, and a great deal of flexibility.
Some possible usages of the RDRAND instruction include cryptographic key generation
as used in a variety of applications, including communication, digital signatures, secure
storage, and so on.
See the Intel 64 and IA-32 Architectures Software Developer's Manuals for more
detailed information.
Datasheet, Volume 1 of 2 51
Technologies
With verification based in the hardware, Boot Guard extends the trust boundary of the
platform boot process down to the hardware level.
Benefits of this protection is that Boot Guard can help maintain platform integrity by
preventing re-purposing of the manufacturer’s hardware to run an unauthorized
software stack.
Note: Boot Guard availability may vary between the different SKUs.
For more information, refer to the Intel ® 64 and IA-32 Architectures Software
Developer's Manual, Volume 3A: http://www.intel.com/Assets/PDF/manual/253668.pdf
An Intel® MPX enabled compiler inserts new instructions that tests memory boundaries
prior to a buffer access. Other Intel® MPX commands are used to modify a database of
memory regions used by the boundary checker instructions.
The Intel® MPX ISA is designed for backward compatibility and will be treated as no-
operation instructions (NOPs) on older processors.
52 Datasheet, Volume 1 of 2
Technologies
Intel® MPX emulation (without hardware acceleration) is available with the Intel® C++
Compiler 13.0 or newer.
Software Guard Extensions (SGX) creates and operates in protected regions of memory
named Enclaves.
Enclave code can be accessed using new special ISA commands that jump into per
Enclave predefined addresses. Data within an Enclave can only be accessed from that
same Enclave code.
The latter security statements hold under all privilege levels including supervisor mode
(ring-0), System Management Mode (SMM) and other Enclaves.
Software Guard Extensions (SGX) features a memory encryption engine that both
encrypt Enclave memory as well as protect it from corruption and replay attacks.
Datasheet, Volume 1 of 2 53
Technologies
Compared with previous generation products, Intel Turbo Boost Technology 2.0 will
increase the ratio of application power towards TDP and also allows to increase power
above TDP as high as PL2 for short periods of time. Thus, thermal solutions and
platform cooling that are designed to less than thermal design guidance might
experience thermal and performance issues since more applications will tend to run at
the maximum power limit for significant periods of time.
Note: Intel Turbo Boost Technology 2.0 may not be available on all SKUs.
Any of these factors can affect the maximum frequency for a given workload. If the
power, current, voltage, or thermal limit is reached, the processor will automatically
reduce the frequency to stay within its TDP limit. Turbo processor frequencies are only
54 Datasheet, Volume 1 of 2
Technologies
active if the operating system is requesting the P0 state. If turbo frequencies are
limited, the cause is logged in IA_PERF_LIMIT_REASONS register. For more information
on P-states and C-states, see Power Management.
Intel® Advanced Vector Extensions (Intel® AVX) are designed to achieve higher
throughput to certain integer and floating point operation. Due to varying processor
power characteristics, utilizing AVX instructions may cause a) parts to operate below
the base frequency b) some parts with Intel® Turbo Boost Technology 2.0 to not
achieve any or maximum turbo frequencies. Performance varies depending on
hardware, software and system configuration and you should consult your system
manufacturer for more information. Intel® Advanced Vector Extensions refers to Intel®
AVX, Intel® AVX2 or Intel® AVX-512.
Specifically, x2APIC:
• Retains all key elements of compatibility to the xAPIC architecture:
— Delivery modes
— Interrupt and processor priorities
— Interrupt sources
— Interrupt destination types
• Provides extensions to scale processor addressability for both the logical and
physical destination modes
• Adds new features to enhance performance of interrupt delivery
• Reduces complexity of logical destination mode interrupt delivery on link based
architectures
The key enhancements provided by the x2APIC architecture over xAPIC are the
following:
• Support for two modes of operation to provide backward compatibility and
extensibility for future platform innovations:
Datasheet, Volume 1 of 2 55
Technologies
For more information, see the Intel® 64 Architecture x2APIC Specification at http://
www.intel.com/products/processor/manuals/.
56 Datasheet, Volume 1 of 2
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Datasheet, Volume 1 of 2 57
Technologies
Intel® VTune™ Amplifier for Systems and the Intel® System Debugger are part of
Intel® System Studio 2015, which includes updates for new debug and trace features
on this latest platform, including Intel PT and Intel® Trace Hub.
An update to the Linux perf utility, with support for Intel PT, is available for download at
https://github.com/virtuoso/linux-perf/tree/intel_pt. It requires rebuilding the kernel
and the perf utility.
§§
58 Datasheet, Volume 1 of 2
Power Management
4 Power Management
Datasheet, Volume 1 of 2 59
Power Management
60 Datasheet, Volume 1 of 2
Power Management
G0/S0 Full On
G1/S3-Cold Suspend-to-RAM (STR). Context saved to memory (S3-Hot is not supported by the
processor).
G2/S5 Soft off. All power lost (except wake-up on PCH). Total reboot.
Datasheet, Volume 1 of 2 61
Power Management
C1E AutoHALT processor IA core state with lowest frequency and voltage operating point
(package C0 state).
C2 All processor IA cores in C3 or deeper. Memory path open. Temporary state before Package
C3 or deeper.
C3 Processor IA execution cores in C3 or deeper, flush their L1 instruction cache, L1 data cache,
and L2 cache to the LLC shared cache. LLC may be flushed. Clocks are shut off to each core.
C6 Processor IA execution cores in this state save their architectural state before removing core
voltage. BCLK is off.
C7 Processor IA execution cores in this state behave similarly to the C6 state. If all execution
cores request C7, LLC ways may be flushed until it is cleared. If the entire LLC is flushed,
voltage will be removed from the LLC.
C9 C8 plus most Uncore voltages at 0V. IA, GT and SA reduced to 0V, while VccIO stays on.
C10 C9 plus all VRs at PS4 or LPM. 24MHz clock off
G0 S0 C0 Full On On Full On
Deep Power
G0 S0 C6/C7 On Deep Power Down
Down
62 Datasheet, Volume 1 of 2
Power Management
For more details, refer to the following document (see related documents section):
• Intel® 64 and IA-32 Architectures Software Developer’s Manual (SDM), volume 3B.
Datasheet, Volume 1 of 2 63
Power Management
Caution: Long term reliability cannot be assured unless all the Low-Power Idle States are
enabled.
Figure 4-3. Idle Power Management Breakdown of the Processor IA Cores
While individual threads can request low-power C-states, power saving actions only
take place once the processor IA core C-state is resolved. processor IA core C-states
are automatically resolved by the processor. For thread and processor IA core C-states,
a transition to and from C0 state is required before entering any other C-state.
For legacy operating systems, P_LVLx I/O reads are converted within the processor to
the equivalent MWAIT C-state request. Therefore, P_LVLx reads do not directly result in
I/O reads to the system. The feature, known as I/O MWAIT redirection, must be
enabled in the BIOS.
The BIOS can write to the C-state range field of the PMG_IO_CAPTURE MSR to restrict
the range of I/O addresses that are trapped and emulate MWAIT like functionality. Any
P_LVLx reads outside of this range do not cause an I/O redirection to MWAIT(Cx) like
request. They fall through like a normal I/O instruction.
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When P_LVLx I/O instructions are used, MWAIT sub-states cannot be defined. The
MWAIT sub-state is always zero if I/O MWAIT redirection is used. By default, P_LVLx I/
O redirections enable the MWAIT 'break on EFLAGS.IF’ feature that triggers a wake up
on an interrupt, even if interrupts are masked by EFLAGS.IF.
The normal operating state of a processor IA core where code is being executed.
C1/C1E is a low-power state entered when all threads within a processor IA core
execute a HLT or MWAIT(C1/C1E) instruction.
While a processor IA core is in C1/C1E state, it processes bus snoops and snoops from
other threads. For more information on C1E, see Section 4.2.5.
Individual threads of a processor IA core can enter the C3 state by initiating a P_LVL2
I/O read to the P_BLK or an MWAIT(C3) instruction. A processor IA core in C3 state
flushes the contents of its L1 instruction cache, L1 data cache, and L2 cache to the
shared LLC, while maintaining its architectural state. All processor IA core clocks are
stopped at this point. Because the processor IA core’s caches are flushed, the processor
does not wake any processor IA core that is in the C3 state when either a snoop is
detected or when another processor IA core accesses cacheable memory.
Datasheet, Volume 1 of 2 65
Power Management
Individual threads of a processor IA core can enter the C6 state by initiating a P_LVL3
I/O read or an MWAIT(C6) instruction. Before entering processor IA core C6 state, the
processor IA core will save its architectural state to a dedicated SRAM. Once complete,
a processor IA core will have its voltage reduced to zero volts. During exit, the
processor IA core is powered on and its architectural state is restored.
Individual threads of a processor IA core can enter the C7, C8, C9, or C10 state by
initiating a P_LVL4, P_LVL5, P_LVL6, P_LVL7 I/O read (respectively) to the P_BLK or by
an MWAIT(C7/C8/C9/C10) instruction. The processor IA core C7-C10 state exhibits the
same behavior as the processor IA core C6 state.
C-State Auto-Demotion
In general, deeper C-states, such as C6 or C7, have long latencies and have higher
energy entry/exit costs. The resulting performance and energy penalties become
significant when the entry/exit frequency of a deeper C-state is high. Therefore,
incorrect or inefficient usage of deeper C-states have a negative impact on battery life
and idle power. To increase residency and improve battery life and idle power in deeper
C-states, the processor supports C-state auto-demotion.
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The processor exits a package C-state when a break event is detected. Depending on
the type of break event, the processor does the following:
• If a processor IA core break event is received, the target processor IA core is
activated and the break event message is forwarded to the target processor IA
core.
— If the break event is not masked, the target processor IA core enters the
processor IA core C0 state and the processor enters package C0.
— If the break event is masked, the processor attempts to re-enter its previous
package state.
• If the break event was due to a memory access or snoop request,
— But the platform did not request to keep the processor in a higher package C-
state, the package returns to its previous C-state.
— And the platform requests a higher power C-state, the memory access or snoop
request is serviced and the package remains in the higher power C-state.
Figure 4-4. Package C-State Entry and Exit
Package C0
This is the normal operating state for the processor. The processor remains in the
normal state when at least one of its processor IA cores is in the C0 or C1 state or
when the platform has not granted permission to the processor to go into a low-power
state. Individual processor IA cores may be in deeper power idle states while the
package is in C0 state.
Datasheet, Volume 1 of 2 67
Power Management
Package C2 State
Package C3 State
Package C6 State
In package C6 state, all processor IA cores have saved their architectural state and
have had their voltages reduced to zero volts. It is possible the LLC shared cache is
flushed and turned off in package C6 state.
Package C7 State
The processor enters the package C7 low-power state when all processor IA cores are
in the C7 or deeper state and the operating system may request that the LLC will be
flushed.
Processor IA core break events are handled the same way as in package C3 or C6.
Upon exit of the package C7 state, the LLC will be partially enabled once a processor IA
core wakes up if it was fully flushed, and will be fully enabled once the processor has
stayed out of C7 for a preset amount of time. Power is saved since this prevents the
LLC from being re-populated only to be immediately flushed again. Some VRs are
reduce to 0V.
68 Datasheet, Volume 1 of 2
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Package C8 State
The processor enters C8 states when the processor IA cores lower numerical state is
C8.
The C8 state is similar to C7 state, but in addition, the LLC is flushed in a single step,
Vcc and VccGT are reduced to 0V. The display engine stays on.
Package C9 State
The processor enters C9 states when the processor IA cores lower numerical state is
C9.
Package C9 state is similar to C8 state; the VRs are off, Vcc, VccGT and VccSA at 0V,
VccIO and VccST stays on.
The processor enters C10 states when the processor IA cores lower numerical state is
C10.
Package C10 state is similar to the package C9 state, but in addition the IMVP8 VR is in
PS4 low-power state, which is near to shut off of the IMVP8 VR. The VccIO is in low-
power mode as well. Package C10 is the processor package state regardless of
InstantGo support/implementation.
InstantGo
InstantGo is a platform state. On display time out the OS requests the processor to
enter package C10 and platform devices at RTD3 (or disabled) in order to attain low
power in idle. InstantGo requires proper BIOS and OS configuration.
Note: Display resolution is not the only factor influencing the deepest Package C-state the
processor can get into. Device latencies, interrupt response latencies, and core C-
Datasheet, Volume 1 of 2 69
Power Management
states are among other factors that influence the final package C-state the processor
can enter.
The following table lists display resolutions and deepest available package C-State. The
display resolutions are examples using common values for blanking and pixel rate.
Actual results will vary. The table shows the deepest possible Package C-state. System
workload, system idle, and AC or DC power also affect the deepest possible Package C-
state.
Notes:
1. All Deep states are with Display ON. The deepest C-state with Display OFF is C10 for U/Y-processors
2. The deepest C-state has variance, dependent various parameters such SW and Platform devices.
3. N/A
4. Processor will see PC10, but PCH may still keep devices ON.
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When a given rank is not populated, the corresponding control signals (CLK_P/CLK_N/
CKE/ODT/CS) are not driven.
At reset, all rows must be assumed to be populated, until it can be proven that they are
not populated. This is due to the fact that when CKE is tri-stated with a DRAMs present,
the DRAMs are not ensured to maintain data integrity. CKE tri-state should be enabled
by BIOS where appropriate, since at reset all rows must be assumed to be populated.
The CKE is one of the power-saving means. When CKE is off, the internal DDR clock is
disabled and the DDR power is reduced. The power-saving differs according to the
selected mode and the DDR type used. For more information, refer to the IDD table in
the DDR specification.
The processor supports four different types of power-down modes in package C0 state.
The different power-down modes can be enabled through configuring PM PDWN config
register. The type of CKE power-down can be configured through PDWN_mode (bits
15:12) and the idle timer can be configured through PDWN_idle_counter (bits 11:0).
The different power-down modes supported are:
• No power-down (CKE disable)
• Active power-down (APD): This mode is entered if there are open pages when
de-asserting CKE. In this mode the open pages are retained. Power-saving in this
mode is the lowest. Power consumption of DDR is defined by IDD3P. Exiting this
mode is fined by tXP – small number of cycles. For this mode, DRAM DLL must be
on.
• PPD/DLL-off: In this mode the data-in DLLs on DDR are off. Power-saving in this
mode is the best among all power modes. Power consumption is defined by IDD2P.
Exiting this mode is defined by tXP, but also tXPDLL (10–20 according to DDR type)
cycles until first data transfer is allowed. For this mode, DRAM DLL must be off.
• Precharged power-down (PPD): This mode is entered if all banks in DDR are
precharged when de-asserting CKE. Power-saving in this mode is intermediate –
better than APD, but less than DLL-off. Power consumption is defined by IDD2P.
Exiting this mode is defined by tXP. The difference from APD mode is that when
waking-up, all page-buffers are empty.) The LPDDR does not have a DLL. As a
result, the power savings are as good as PPD/DDL-off but will have lower exit
latency and higher performance.
The CKE is determined per rank, whenever it is inactive. Each rank has an idle counter.
The idle-counter starts counting as soon as the rank has no accesses, and if it expires,
the rank may enter power-down while no new transactions to the rank arrives to
queues. The idle-counter begins counting at the last incoming transaction arrival.
It is important to understand that since the power-down decision is per rank, the IMC
can find many opportunities to power down ranks, even while running memory
intensive applications; the savings are significant (may be few Watts, according to DDR
specification). This is significant when each channel is populated with more ranks.
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Power Management
The default value that BIOS configures in PM PDWN config register is 6080 – that is,
PPD/DLL-off mode with idle timer of 0x80, or 128 DCLKs. This is a balanced setting with
deep power-down mode and moderate idle timer value.
The idle timer expiration count defines the # of DCLKs that a rank is idle that causes
entry to the selected power mode. As this timer is set to a shorter time the IMC will
have more opportunities to put the DDR in power-down. There is no BIOS hook to set
this register. Customers choosing to change the value of this register can do it by
changing it in the BIOS. For experiments, this register can be modified in real time if
BIOS does not lock the IMC registers.
The target behavior is to enter self-refresh for package C3 or deeper power states as
long as there are no memory requests to service.
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C0, C1, C1E Dynamic memory rank power-down based on Dynamic memory rank power-down based on
idle conditions. idle conditions.
C3, C6, C7 or If the processor graphics engine is idle and If there are no memory requests, then enter
deeper there are no pending display requests, then self-refresh. Otherwise use dynamic memory
enter self-refresh. Otherwise use dynamic rank power-down based on idle conditions.
memory rank power-down based on idle
conditions.
If dynamic power-down is enabled, all ranks are powered up before doing a refresh
cycle and all ranks are powered down at the end of refresh.
The I/O buffer for an unused signal should be tri-stated (output driver disabled), the
input receiver (differential sense-amp) should be disabled, and any DLL circuitry
related ONLY to unused signals should be disabled. The input path must be gated to
prevent spurious results due to noise on the unused signals (typically handled
automatically when input receiver is disabled).
In C3 or deeper power state, the processor internally gates VDDQ for the majority of
the logic to reduce idle power while keeping all critical DDR pins such as CKE and VREF
in the appropriate state.
In C7 or deeper power state, the processor internally gates VCCIO for all non-critical
state to reduce idle power.
In S3 or C-state transitions, the DDR does not go through training mode and will
restore the previous training information.
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Power Management
Hot Plug like* is only supported at Processor PEG-PCIe using Thunderbolt Device.
Note: The PCI Express* and DMI interfaces are present only in 2-Chip platform processors.
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Intel® DPST 6.0 has improved the software algorithms and has minor hardware
changes to better handle backlight phase-in and ensures the documented and validated
method to interrupt hardware phase-in.
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Power Management
When workload is low and SA Enhanced Speedstep Technology is enabled, the DDR
data rate may drop temporally as follows:
• DDR3L/LPDDR3 – 1066 MT/s
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Power Management
Before changing the DDR data rate, the processor sets DDR to self-refresh and changes
needed parameters. The DDR voltage remains stable and unchanged.
BIOS/MRC DDR training at high and low frequencies sets I/O and timing parameters.
§§
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Thermal Management
5 Thermal Management
5.1 Processor Thermal Management
The thermal solution provides both component-level and system-level thermal
management. To allow optimal operation and long-term reliability of Intel processor-
based systems, the system/processor thermal solution should be designed so that the
processor:
• Remains below the maximum junction temperature (TjMAX) specification at the
maximum thermal design power (TDP).
• Conforms to system constraints, such as system acoustics, system skin-
temperatures, and exhaust-temperature requirements.
Caution: Thermal specifications given in this chapter are on the component and package level
and apply specifically to the processor. Operating the processor outside the specified
limits may result in permanent damage to the processor and potentially other
components in the system.
Note: Intel® Turbo Boost Technology 2.0 availability may vary between the different SKUs.
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Thermal Management
Note: Implementation of Intel® Turbo Boost Technology 2.0 only requires configuring PL1,
PL1 Tau and PL2.
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Thermal Management
When the Psys signal is properly implemented, the system designer can utilize the
package power control settings of PsysPL1/Tau, PsysPL2 and PsysPL3 for additional
manageability to match the platform power delivery and platform thermal solution
limitations for Intel® Turbo Boost Technology 2.0. The operation of the PsysPL1/tau,
PsysPL2 and PsysPL3 is analogous to the processor power limits described in
Section 5.1.3.1.
• Platform Power Limit 1 (PsysPL1): A threshold for average platform power that will
not be exceeded - recommend to set to equal platform thermal capability.
• Platform Power Limit 2 (PsysPL2): A threshold that if exceeded, the PsysPL2 rapid
power limiting algorithms will attempt to limit the spikes above PsysPL2.
• Platform Power Limit 3 (PsysPL3): A threshold that if exceeded, the PsysPL3 rapid
power limiting algorithms will attempt to limit the duty cycle of spikes above
PsysPL3 by reactively limiting frequency.
• PsysPL1 Tau: An averaging constant used for PsysPL1 exponential weighted moving
average (EWMA) power calculation.
• The Psys signal and associated power limits/Tau are optional for the system
designer and disabled by default.
• The Psys data will not include power consumption for charging.
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Note: Configurable TDP and Low-Power Mode technologies are not battery life improvement
technologies.
Note: Configurable TDP availability may vary between the different SKUs.
With cTDP, the processor is now capable of altering the maximum sustained power with
an alternate processor IA core base frequency. Configurable TDP allows operation in
situations where extra cooling is available or situations where a cooler and quieter
mode of operation is desired. Configurable TDP can be enabled using Intel's DPTF
driver or through HW/EC firmware. Enabling cTDP using the DPTF driver is
recommended as Intel does not provide specific application or EC source code.
The average power dissipation and junction temperature operating condition limit, specified in
Table 5-2, and Table 5-3 for the SKU Segment and Configuration, for which the processor is
Base
validated during manufacturing when executing an associated Intel-specified high-complexity
workload at the processor IA core frequency corresponding to the configuration and SKU.
The SKU-specific processor IA core frequency where manufacturing confirms logical
functionality within the set of operating condition limits specified for the SKU segment and
TDP-Up Configurable TDP-Up configuration in Table 5-2, and Table 5-3. The Configurable TDP-Up
Frequency and corresponding TDP is higher than the processor IA core Base Frequency and
SKU Segment Base TDP.
The processor IA core frequency where manufacturing confirms logical functionality within the
set of operating condition limits specified for the SKU segment and Configurable TDP-Down
TDP-Down configuration in Table 5-2, and Table 5-3. The Configurable TDP-Down Frequency and
corresponding TDP is lower than the processor IA core Base Frequency and SKU Segment
Base TDP.
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Thermal Management
In each mode, the Intel® Turbo Boost Technology 2.0 power limits are reprogrammed
along with a new OS controlled frequency range. The DPTF driver assists in all these
operations. The cTDP mode does not change the max per-processor IA core turbo
frequency.
Through the DPTF driver, LPM can be configured to use each of the following methods
to reduce active power:
• Restricting package power control limits and Intel® Turbo Boost Technology
availability
• Off-Lining processor IA core activity (Move processor traffic to a subset of cores)
• Placing a processor IA Core at LFM or LSF (Lowest Supported Frequency)
• Utilizing IA clock modulation
• Reducing number of active EUs to GT2 equivalent (applicable for GT3 SKUs Only)
• LPM power as listed in the TDP Specifications table is defined at point which
processor IA core working at LSF, GT = RPn and 1 IA core active
Off-lining processor IA core activity is the ability to dynamically scale a workload to a
limited subset of cores in conjunction with a lower turbo power limit. It is one of the
main vectors available to reduce active power. However, not all processor activity is
ensured to be able to shift to a subset of cores. Shifting a workload to a limited subset
of cores allows other processor IA cores to remain idle and save power. Therefore,
when LPM is enabled, less power is consumed at equivalent frequencies.
Minimum Frequency Mode MFM of operation, which is the lowest supported frequency
(LSF) at the LFM voltage, has been made available for use under LPM for further
reduction in active power beyond LFM capability to enable cooler and quieter modes of
operation.
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Thermal Management
The Adaptive Thermal Monitor can be activated when the package temperature,
monitored by any digital thermal sensor (DTS), meets its maximum operating
temperature. The maximum operating temperature implies maximum junction
temperature TjMAX.
Reaching the maximum operating temperature activates the Thermal Control Circuit
(TCC). When activated the TCC causes both the processor IA core and graphics core to
reduce frequency and voltage adaptively. The Adaptive Thermal Monitor will remain
active as long as the package temperature remains at its specified limit. Therefore, the
Adaptive Thermal Monitor will continue to reduce the package frequency and voltage
until the TCC is de-activated.
TjMAX is factory calibrated and is not user configurable. The default value is software
visible in the TEMPERATURE_TARGET (0x1A2) MSR, bits [23:16].
The Adaptive Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines. It is not intended as a mechanism to maintain
processor thermal control to PL1 = TDP. The system design should provide a thermal
solution that can maintain normal operation when PL1 = TDP within the intended usage
range.
TCC Activation Offset can be set as an offset from Tj_max to lower the onset of TCC
and Adaptive Thermal Monitor. In addition, the processor has added an optional time
window (Tau) to manage processor performance at the TCC Activation offset value
using an EWMA (Exponential Weighted Moving Average) of temperature.
If enabled, the offset should be set lower than any other passive protection such as
ACPI _PSV trip points
To manage the processor with the EWMA (Exponential Weighted Moving Average) of
temperature, an offset (degrees Celsius) is written to the TEMPERATURE_TARGET
(0x1A2) MSR, bits [29:24], and the time window (Tau) is written to the
TEMPERATURE_TARGET (0x1A2) MSR [6:0]. The Offset value will be subtracted from
the value found in bits [23:16] and be the temperature.
The processor will manage to this average temperature by adjusting the frequency of
the various domains. The instantaneous Tj can briefly exceed the average temperature.
The magnitude and duration of the overshoot is managed by the time window value
(Tau).
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Thermal Management
Once the temperature has dropped below the trigger temperature, the operating
frequency and voltage will transition back to the normal system operating point.
Once a target frequency/bus ratio is resolved, the processor IA core will transition to
the new target automatically.
• On an upward operating point transition the voltage transition precedes the
frequency transition.
• On a downward transition the frequency transition precedes the voltage transition.
• The processor continues to execute instructions. However, the processor will halt
instruction execution for frequency transitions.
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Clock modulation will not be activated by the Package average temperature control
mechanism.
Unlike traditional thermal devices, the DTS outputs a temperature relative to the
maximum supported operating temperature of the processor (TjMAX), regardless of TCC
activation offset. It is the responsibility of software to convert the relative temperature
to an absolute temperature. The absolute reference temperature is readable in the
TEMPERATURE_TARGET MSR 1A2h. The temperature returned by the DTS is an implied
negative integer indicating the relative offset from TjMAX. The DTS does not report
temperatures greater than TjMAX. The DTS-relative temperature readout directly
impacts the Adaptive Thermal Monitor trigger point. When a package DTS indicates
that it has reached the TCC activation (a reading of 0x0, except when the TCC
activation offset is changed), the TCC will activate and indicate an Adaptive Thermal
Monitor event. A TCC activation will lower both processor IA core and graphics core
frequency, voltage, or both. Changes to the temperature can be detected using two
programmable thresholds located in the processor thermal MSRs. These thresholds
have the capability of generating interrupts using the processor IA core's local APIC.
Refer to the Intel 64 and IA-32 Architectures Software Developer’s Manual for specific
register and programming details.
The error associated with DTS measurements will not exceed ±5 °C within the entire
operating range.
Digital Thermal Sensor based fan speed control (TFAN) is a recommended feature to
achieve optimal thermal performance. At the TFAN temperature, Intel recommends full
cooling capability before the DTS reading reaches TjMAX.
Datasheet, Volume 1 of 2 85
Thermal Management
The processor package will remain at the lowest supported P-state until the system de-
asserts PROCHOT#. The processor can be configured to generate an interrupt upon
assertion and de-assertion of the PROCHOT# signal.
86 Datasheet, Volume 1 of 2
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Datasheet, Volume 1 of 2 87
Thermal Management
MSR. In this mode, the duty cycle can be programmed in either 12.5% or 6.25%
increments (discoverable using CPUID). Thermal throttling using this method will
modulate each processor IA core's clock independently.
When a physical thermal sensor is not available to report temperature, the processor
supports Open Loop Thermal Management (OLTM) that estimates the power consumed
per rank of the memory using the processor's DRAM power meter. A per rank power is
associated with the warm and hot thresholds that, when exceeded, may trigger
memory thermal throttling.
SDP requires that the POWER_LIMIT_1 (PL1) to be set to the cooling level capability
(SDP level, or higher). While the SDP specification is characterized at Tj of 80 °C, the
functional limit for the product remains at TjMAX. Customers may choose to program
the TCC Offset to have TCC Activation at 80 °C, but it is not required.
The processors that have SDP specified can still exceed SDP under certain workloads
such as TDP workloads. TDP power dissipation is still possible with the intended usage
models, and protection mechanisms to handle levels beyond cooling capabilities are
recommended. Intel recommends using such thermal control mechanisms to manage
situations where power may exceed the thermal design capability.
Note: cTDP-Down mode is required for Intel Core products in order to achieve SDP.
88 Datasheet, Volume 1 of 2
Thermal Management
Note Definition
The TDP and Configurable TDP values are the average power dissipation in junction temperature
operating condition limit, for the SKU Segment and Configuration, for which the processor is validated
1
during manufacturing when executing an associated Intel-specified high-complexity workload at the
processor IA core frequency corresponding to the configuration and SKU.
TDP workload may consist of a combination of processor IA core intensive and graphics core intensive
2
applications.
3 Can be modified at runtime by MSR writes, with MMIO and with PECI commands.
'Turbo Time Parameter' is a mathematical parameter (units of seconds) that controls the processor
4 turbo algorithm using a moving average of energy usage. Do not set the Turbo Time Parameter to a
value less than 0.1 seconds. refer to Section 5.1.3.2 for further information.
Shown limit is a time averaged power, based upon the Turbo Time Parameter. Absolute product power
5
may exceed the set limits for short durations or under virus or uncharacterized workloads.
Processor will be controlled to specified power limit as described in Section 5.1.2. If the power value
and/or 'Turbo Time Parameter' is changed during runtime, it may take a short period of time
6
(approximately 3 to 5 times the 'Turbo Time Parameter') for the algorithm to settle at the new control
limits.
7 This is a hardware default setting and not a behavioral characteristic of the part.
8 For controllable turbo workloads, the PL2 limit may be exceeded for up to 10 ms.
9 Refer to Table 5-1 for the definitions of 'base', 'TDP-Up' and 'TDP-Down'.
LPM power level is an opportunistic power and is not a guaranteed value as usages and
10
implementations may vary.
Power limits may vary depending on if the product supports the 'TDP-up' and/or 'TDP-down' modes.
11
Default power limits can be found in the PKG_PWR_SKU MSR (614h).
The processor die and OPCM die do not reach maximum sustained power simultaneously since the
sum of the 2 die's estimated power budget is controlled to be equal to or less than the package TDP
12
(PL1) limit. For additional information, refer to the appropriate Mobile TMDG for more information
(see Related Documents).
cTDP down power is based on GT2 equivalent graphics configuration. cTDP down does not decrease
13 the number of active Processor Graphics EUs, but relies on Power Budget Management (PL1) to
achieve the specified power level.
16 Sustained residencies at high voltages and temperatures may temporarily limit turbo frequency.
Datasheet, Volume 1 of 2 89
Thermal Management
Configurable TDP-
1.5 GHz 7
Up
Base 900 MHz to 300 MHz to 4.5 1, 9,
Dual Core GT2 1.2 GHz 1.0 GHz 3.0 10, 11,
4.5W 15
Configurable TDP- 15
600 MHz 3.5/3.8
Y-Processor Down/LFM
Line BGA
LPM 400 MHz 100 MHz 3.5
90 Datasheet, Volume 1 of 2
Thermal Management
Notes:
1. The thermal solution needs to ensure that the processor temperature does not exceed the TDP Specification Temperature.
2. The processor junction temperature is monitored by Digital Temperature Sensors (DTS). For DTS accuracy, refer to
Section 5.1.5.2.1.
3. For this SKU to be specification compliance to the 90ºC TDP specification temperature, a TCC Offset = 10 and a Tau value
must be programed into MSR 1A2h. The recommended TCC_Offset averaging Tau value is 5s.
Datasheet, Volume 1 of 2 91
Thermal Management
Figure 5-2. Thermal Test Vehicle (TTV) Case Temperature (TCASE) Measurement Location
The following supplier can machine the groove and attach a thermocouple to the IHS.
The following supplier is listed as a convenience to Intel's general customers and may
be subject to change without notice. THERM-X OF CALIFORNIA, 3200 Investment Blvd,
Hayward, Ca 94544. George Landis +1-510-441-7566 Ext. 368 george@therm-x.com.
The vendor part number is XTMS1565.
§§
92 Datasheet, Volume 1 of 2
Signal Description
6 Signal Description
This chapter describes the processor signals. They are arranged in functional groups
according to their associated interface or category. The notations in the following table
are used to describe the signal type.
The signal description also includes the type of buffer used for the particular signal (see
the following table).
I Input pin
O Output pin
Availability Signal Availability condition - based on segment, SKU, platform type or any other factor
1
Asynchronous Signal has no timing relationship with any reference clock.
Note:
1. Qualifier for a buffer type.
Datasheet, Volume 1 of 2 93
Signal Description
94 Datasheet, Volume 1 of 2
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Datasheet, Volume 1 of 2 95
Signal Description
96 Datasheet, Volume 1 of 2
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Chip Select: (1 per rank). These signals are [1:0] applicable for All
DDR0_CS#[3:0] used to select particular SDRAM components
O DDR4/-RS SE processor lines.
DDR1_CS#[3:0] during the active state. There is one Chip
Select for each SDRAM rank.
Datasheet, Volume 1 of 2 97
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Note:
1. When using eDP* bifurcation:
— x2 eDP lanes for eDP panel (eDP_TXP[0:1], eDP_TXN[0:1])
— x2 lanes for DP (eDP_TXP[2:3], eDP_TXN[2:3])
Datasheet, Volume 1 of 2 99
Signal Description
Notes:
1. N/A
2. DDI3_AUXN and DDI3_AUXP are valid in SKL-U but should be considered as reserved pins.
VccEOPIO_SENSE Processors w/ on
VssEOPIO_SENSE package cache
Arbitrary connection of these signals to VCC, VDDQ, VSS, or to any other signal
(including each other) may result in component malfunction or incompatibility with
future processors. See Table 6-13.
§§
7 Electrical Specifications
VccSA System Agent Power Rail SVID/Fixed (SKU dependent) All processor lines
Notes:
1. N/A
2. Rail is unconnected for processors without GT3/4.
3. Rail is unconnected for processors without OPC.
4. VCCPLL_OC power rail should be sourced from the VDDQ VR. The connection can be direct or through a load switch,
depending desired power optimization. In case of direct connection (VCCPLL_OC is shorted to VDDQ, no load switch),
platform should ensure that VccST is ON (high) while VCCPLL_OC is ON (high).
5. VCCSTG power rail should be sourced from the VR as VCCST. The connection can be direct or through a load switch,
depending desired power optimization.
6. Intel has added the option of merging the GT/GTx power rails for the U-processor line 2+3e product family.
current load changes in order to minimize the power of the part. A voltage range is
provided in Section 7-2. The specifications are set so that one voltage regulator can
operate with all supported frequencies.
Individual processor VID values may be set during manufacturing so that two devices
at the same processor IA core frequency may have different default VID settings. This
is shown in the VID range values in Section 7-2. The processor provides the ability to
operate while transitionally to an adjacent VID and its associated voltage. This will
represent a DC shift in the loadline.
7.2 DC Specifications
The processor DC specifications in this section are defined at the processor signal pins,
unless noted otherwise.
• The DC specifications for the DDR3L/-RS/DDR4/-RS signals are listed in the Voltage
and Current Specifications section.
• The Voltage and Current Specifications section lists the DC specifications for the
processor and are valid only while meeting specifications for junction temperature,
clock frequency, and input voltages. Read all notes associated with each parameter.
• AC tolerances for all DC rails include dynamic load currents at switching frequencies
up to 1 MHz.
Table 7-2. Processor IA Core (Vcc) Active and Idle Mode DC Voltage and Current
Specifications (Sheet 1 of 2)
Symbol Parameter Segment Min. Typ. Max. Unit Note1
Voltage Range
Operating for Processor 1,2,3,
All 0.55 — 1.52 V
Voltage Active Operating 7,12
Mode
Voltage Range
for Processor
Idle Voltage Idle Mode 1,2,3,
All 0 — 0.55 V 7
(Package C6/
C7)
Y(4.5W) 24
Y(6W) 24
Table 7-2. Processor IA Core (Vcc) Active and Idle Mode DC Voltage and Current
Specifications (Sheet 2 of 2)
Symbol Parameter Segment Min. Typ. Max. Unit Note1
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and
cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same
frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor
during a power management event (Adaptive Thermal Monitor, Enhanced Intel SpeedStep® Technology, or low-power
states).
3. The voltage specification requirements are measured across Vcc_SENSE and Vss_SENSE as near as possible to the processor
with a 20 MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum
length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the
oscilloscope probe.
4. Processor IA core VR to be designed to electrically support this current.
5. Processor IA core VR to be designed to thermally support this current indefinitely.
6. Long term reliability cannot be assured if tolerance, ripple, and core noise parameters are violated.
7. Long term reliability cannot be assured in conditions above or below Max./Min. functional limits.
8. PSx refers to the voltage regulator power state as set by the SVID protocol.
9. N/A
10. LL measured at sense points.
11. Typ column represents ICCmax for commercial application it is NOT a specification - it is a characterization of limited samples
using limited set of benchmarks that can be exceeded.
12. Operating voltage range in steady state.
13. LL specification values should not be exceeded. If exceeded, power, performance and reliability penalty are expected.
14. By Improving Load Line (Lower LL than EDS values, and reporting it to BIOS), customers may obtain slightly better
performance; although, the frequencies will not be changed.
15. Subject to change. Data is still under evaluation.
Table 7-3. Processor Graphics (VccGT and VccGT-X) Supply DC Voltage and Current
Specifications (Sheet 1 of 2)
Symbol Parameter Segment Min. Typ. Max. Unit Note1
Max. —
V_OVS_Max — — 70 mV
Overshoot
Table 7-3. Processor Graphics (VccGT and VccGT-X) Supply DC Voltage and Current
Specifications (Sheet 2 of 2)
Symbol Parameter Segment Min. Typ. Max. Unit Note1
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and
cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same
frequency may have different settings within the VID range. This differs from the VID employed by the processor during a
power or thermal management event (Intel Adaptive Thermal Monitor, Enhanced Intel SpeedStep® Technology, or low-power
states).
3. The voltage specification requirements are measured across VccGT_SENSE and VssGT_SENSE as near as possible to the
processor with a 100-MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1-M minimum impedance. The
maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not
coupled into the oscilloscope probe.
4. PSx refers to the voltage regulator power state as set by the SVID protocol.
5. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and
cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same
frequency may have different settings within the VID range. This differs from the VID employed by the processor during a
power or thermal management event (Intel Adaptive Thermal Monitor, Enhanced Intel SpeedStep® Technology, or low-power
states).
6. N/A
7. LL measured at sense points.
8. Operating voltage range in steady state.
9. LL specification values should not be exceeded. If exceeded, power, performance and reliability penalty are expected.
10. By Improving Load Line (Lower LL than EDS values, and reporting it to BIOS), customers may obtain slightly better
performance although the frequencies will not be changed.
11. Subject to change. Data is still under evaluation.
12. N/A
13. For merged GT/GTx rails, the sense point need to be taken from VCCGT_SENSE/VSSGT_SENSE, the VCCGTx_SENSE/
VSSGTx_SENSE should be unconnected (not connected). For merged VRs, IccMAX=GT+GTx IccMAX = 57A+7A=64A."
Table 7-4. Memory Controller (VDDQ) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. The current supplied to the DIMM modules is not included in this specification.
3. Includes AC and DC error, where the AC noise is bandwidth limited to under 20 MHz, measured on package pins.
4. No requirement on the breakdown of AC versus DC noise.
5. The voltage specification requirements are measured with a 100-MHz bandwidth oscilloscope, 1.5 pF maximum probe
capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm.
Ensure external noise from the system is not coupled into the oscilloscope probe.
Table 7-5. System Agent (VccSA) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1,2
PS0 +30/
— — ±10 ±15
-10
PS2 +30/
— — +30/-10 +30/-10
-10
PS3 +30/
— — +30/-10 +30/-10
-10
T_OVS_ Max.
Overshoot — — — 10 μs
Max time
V_OVS_ Max.
Overshoot — — — 70 mV
Max
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Max./Min. functional limits.
3. The voltage specification requirements are measured on VccSA_SENSE and VssSA_SENSE with a 100-MHz bandwidth
oscilloscope, 1.5 pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on
the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
4. PSx refers to the voltage regulator power state as set by the SVID protocol.
5. VCCSA voltage during boot (Vboot)1.05V for a duration of 2 seconds.
6. LL measured at sense points.
7. LL specification values should not be exceeded. If exceeded, power, performance and reliability penalty are expected.
8. IPU designs with SKL U Pentium/Celeron require additional 0.5A, SA ICCMAX=5A.
Table 7-6. Processor I/O (VccIO) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1,2
Y — — 3
ICCMAX_VCCIO Max. Current for VCCIO Rail A
U — — 3.1
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Max./Min. functional limits.
3. The voltage specification requirements are measured across VccIO_SENSE and VssIO_SENSE as near as possible to the
processor with a 100-MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1-M minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not
coupled into the oscilloscope probe.
4. For low BW bus connection between processor and PCH -> VCCIO=0.85V.
5. For high BW bus connection between processor and PCH -> VCCIO=0.95V.
6. For Y-processor line, Setting VCCIO to 0.95V may lead to a power penalty up to 250mW.
7. OS occurs during power on only—not during normal operation
0 0 V
Table 7-8. Processor OPC (VccOPC) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1,2
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Max./Min. functional limits.
3. The voltage specification requirements are measured on VccOPC_ESNSE and VssOPC_SENSE with a 100-MHz bandwidth
oscilloscope, 1.5 pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on
the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
4. OS occurs during power on only. Not during normal operation.
0 X 0 V
Table 7-10. Processor EOPIO (VccEOPIO) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1,2
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Max./Min. functional limits.
3. The voltage specification requirements are measured on VccEOPIO_ESNSE and VssEOPIO_SENSE with a 100-MHz
bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of
ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the
oscilloscope probe.
4. OS occurs during power on only; not during normal operation.
Table 7-11. Processor OPC (VCC_OPC_1p8) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Note1,2
Table 7-12. Vcc Sustain (VccST) Supply DC Voltage and Current Specifications
1,2
Symbol Parameter Segment Min. Typ. Max. Units Notes
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Max./Min. functional limits.
3. The voltage specification requirements are measured on package pins with a 100-MHz bandwidth oscilloscope, 1.5 pF
maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be
less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
Table 7-13. Vcc Sustain Gated (VccSTG) Supply DC Voltage and Current Specifications
1,2
Symbol Parameter Segment Min. Typ. Max. Units Notes
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Max./Min. functional limits.
3. The voltage specification requirements are measured on package pins with a 100-MHz bandwidth oscilloscope, 1.5 pF
maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be
less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
Table 7-14. Processor PLL (VccPLL) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Notes1,2
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Max./Min. functional limits.
3. The voltage specification requirements are measured on package pins with a 100-MHz bandwidth oscilloscope, 1.5 pF
maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be
less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
Table 7-15. Processor PLL OC (VccPLL_OC) Supply DC Voltage and Current Specifications
Symbol Parameter Segment Min. Typ. Max. Unit Notes1,2
Notes:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These
specifications will be updated with characterized data from silicon measurements at a later date.
2. Long term reliability cannot be assured in conditions above or below Max./Min. functional limits.
3. The voltage specification requirements are measured on package pins with a 100-MHz bandwidth oscilloscope, 1.5 pF
maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be
less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value.
4. VIH and VIL may experience excursions above VDDQ. However, input signal drivers must comply with the signal quality
specifications.
5. This is the pull up/down driver resistance after compensation. Note that BIOS power training may change these values
significantly based on margin/power trade-off.
6. DDR_RCOMP resistance must be provided on the system board with ±1% resistors installed on package). DDR_RCOMP
resistors are connected to VSS.
7. DDR_DRAMPWROK must have a maximum of 15 ns rise or fall time over VDDQ * 0.30 ±100 mV and the edge must be
monotonic.
8. DDR_VREF is defined as VDDQ/2 for DDR3L/-RS
9. RON tolerance is preliminary and might be subject to change.
10. Max.-Min. range is correct but center point is subject to change during MRC boot training.
11. Processor may be damaged if VIH exceeds the maximum voltage for extended periods.
12. Final value determined by BIOS power training, values might vary between bytes and/or units.
13. VREF values determined by BIOS training, values might vary between units.
14. DDR0_Vref_DQ - Not in use in DDR4, DDR1_Vref_DQ = DDR4_CA_ch1, DDR_Vref_CA = DD4_CA_ch0.
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. VIL is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
3. VIH is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high value.
4. VIH and VIL may experience excursions above VDDQ. However, input signal drivers must comply with the signal quality
specifications.
5. This is the pull up/down driver resistance after compensation. Note that BIOS power training may change these values
significantly based on margin/power trade-off.
6. DDR_RCOMP resistance must be provided on the system board with ±1% resistors. DDR_RCOMP resistors are to VSS.
7. DDR_DRAMPWROK must have a maximum of 15 ns rise or fall time over VDDQ * 0.30 ±100 mV and the edge must be
monotonic.
8. DDR_VREF is defined as VDDQ/2 for LPDDR3
9. RON tolerance is preliminary and might be subject to change.
10. Max.-Min. range is correct but center point is subject to change during MRC boot training.
11. Processor may be damaged if VIH exceeds the maximum voltage for extended periods.
12. Final value determined by BIOS power training, values might vary between bytes and/or units.
13. VREF values determined by BIOS training, values might vary between units.
14. DDR0_Vref_DQ - Not in use in DDR4, DDR1_Vref_DQ = DDR4_CA_ch1, DDR_Vref_CA = DD4_CA_ch0.
Notes:
1. VCCIO depends on segment.
2. VOL and VOH levels depends on the level chosen by the Platform.
Notes:
1. COMP resistance is to VCOMP_OUT.
2. eDP_RCOMP resistor must be provided on the system board.
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The Vcc referred to in these specifications refers to instantaneous VccST/IO.
3. For VIN between “0” V and VccST. Measured when the driver is tri-stated.
4. VIH and VOH may experience excursions above VccST. However, input signal drivers must comply with the signal quality
specifications.
Table 7-22. GTL Signal Group and Open Drain Signal Group DC Specifications (Sheet 1 of
2)
Symbol Parameter Min. Max. Units Notes1
Table 7-22. GTL Signal Group and Open Drain Signal Group DC Specifications (Sheet 2 of
2)
Symbol Parameter Min. Max. Units Notes1
Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The VccST referred to in these specifications refers to instantaneous VccST/IO.
3. For VIN between 0 V and VccST. Measured when the driver is tri-stated.
4. VIH and VOH may experience excursions above VccST. However, input signal drivers must comply with the signal quality
specifications.
VccST nominal levels will vary between processor families. All PECI devices will operate
at the VccST level determined by the processor installed in the system.
Notes:
1. VccST supplies the PECI interface. PECI behavior does not affect VccST Min./Max. specifications.
2. The leakage specification applies to powered devices on the PECI bus.
3. The PECI buffer internal pull-up resistance measured at 0.75* VccST.
The input buffers in both client and host models must use a Schmitt-triggered input
design for improved noise immunity. Use the following figure as a guide for input buffer
design.
§§
8 Package Mechanical
Specifications
Package Type Flip Chip Ball Grid Array Flip Chip Ball Grid Array
Halogenated Flame
Yes Yes
Retardant Free
Notes:
1. The thermal solution attach mechanism must not induce continuous stress to the package. It may only
apply a uniform load to the die to maintain a thermal interface.
2. This specification applies to the uniform compressive load in the direction perpendicular to the dies’ top
surface. Load should be centered on processor die center.
3. This specification is based on limited testing for design characterization.
Notes:
1. Refers to a component device that is not assembled in a board or socket that is not to be electrically
connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount re-flow are specified
by applicable JEDEC standards.
3. TABSOLUTE STORAGE applies to the un-assembled component only and does not apply to the shipping
media, moisture barrier bags or desiccant.
4. Intel-branded board products are certified to meet the following temperature and humidity limits that are
given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity 50% to 90%,
non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are
not specified for non-Intel branded boards.
5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
6. Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by TSUSTAINED STORAGE and customer shelf life in applicable Intel boxes and bags.
§§
The U-Processor is available in the BGA package (BGA1356). Figure 9-1, Figure 9-2,
Figure 9-3, and Figure 9-4 provide a top view of the Ball map per quadrant. Table 9-1
provides the Ball list.
DDR0 DDR0 DDR0 DDR0 DDR0 DDR0 DDR0 DDR0 DDR0 GPP_A GPP_A
_DQ[4 _DQS _DQ[4 _DQ[5 _DQS _DQ[5 _DQ[6 _DQS _DQ[6 HDA_ HDA_ GPP_A GPP_A 14 / 17 /
GPD8 GPD5 GPD3 5/ SD_P GPP_A GPP_A GPP_B
5] / P[5] / 6] / 3] / N[6] / 4] / 1] / P[7] / 2] / SYNC SDI0/ PCH_P 2/ SUS_S
/ / / LAD1 / LFRAM 19 / 21 / 3/
BA VSS VSS --- VSS / --- VSS VSS TAT#/ VSS WR_E ISH_G VSS CPU_ RSVD
DDR1 DDR1 DDR1 DDR1 DDR1 DDR1 DDR1 DDR1 DDR1 RSVD VSS VSS
I2S0_ I2S0_ WROK SUSCL SLP_S PWRB E# / ISH_G
_DQ[1 _DQS _DQ[1 _DQ[3 _DQS _DQ[3 _DQ[4 _DQS _DQ[4 ESPI_I ESPI_ ESPI_ N# /
SFRM RXD K 4# TN# P1 P3 GP2
O1 CS# RESET
3] P[1] 4] 7] N[4] 8] 5] P[5] 6] ISH_G
# P7
DDR0 DDR0 DDR0 DDR0 DDR0 DDR0 DDR0 DDR0 DDR0 GPP_A GPP_A GPP_A GPP_A GPP_A GPP_A
_DQ[4 _DQS _DQ[4 _DQ[4 _DQS _DQ[5 _DQ[5 _DQS _DQ[5 HDA_ HDA_ GPD10 GPD1 1/ 4/ 10 / GPP_B
0] / N[5] / 2] / 8] / P[6] / 0] / 6] / N[7] / 8] / BLK / SDI1 / I2S1_ RSMR / / 6/ 18 / 22 / 4/
AY --- --- --- --- --- --- --- LAD0 / LAD3 / SERIR --- CLKO --- TP1 RSVD RSVD RSVD
DDR1 DDR1 DDR1 DDR1 DDR1 DDR1 DDR1 DDR1 DDR1 I2S0_ I2S1_ SFRM ST# SLP_S ACPRE ESPI_I ESPI_I UT_LP ISH_G ISH_G CPU_
_DQ[8 _DQS _DQ[1 _DQ[3 _DQS _DQ[3 _DQ[4 _DQS _DQ[4 SCLK RXD 5# SENT O0 O3 Q C1 P0 P4 GP3
] N[1] 0] 2] P[4] 4] 0] N[5] 2]
GPP_A
DDR0 DDR0 DDR0 DDR0 DDR0 DDR0 HDA_ 9/
_DQ[4 _DQ[4 _DQ[4 _DQ[5 _DQ[5 _DQ[5 RST# GPD11 GPP_A GPP_A
GPP_A CLKO GPP_B
AW 1] / 3] / 9] / 1] / 7] / 9] / I2S1_ / SLP_L 8/ 23 / SPI0_ SPI0_I RSVD
VSS VSS VSS VSS VSS --- VSS / VSS --- VSS VSS VSS 0/ VSS VSS UT_LP VSS VSS 14 / N/A
DDR1 DDR1 DDR1 DDR1 DDR1 DDR1 I2S1_ TXD LANPH AN# CLKRU ISH_G MISO O2
RCIN# C0 / SPKR
_DQ[9 _DQ[1 _DQ[3 _DQ[3 _DQ[4 _DQ[4 SCLK YPC N# P5
ESPI_
] 1] 3] 5] 1] 3] CLK
SPI0_ SPI0_
AV --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- VSS
MOSI CLK
DDR1 DDR1 GPP_B GPP_B
_DQ[4 _DQ[4 GPD0
DDR1 DDR1 DDR1 DDR1 DDR_ PCH_ GPP_A 9/ 10 /
1] / 2] / / SPI0_I SPI0_ SPI0_ SPI0_
AU VDDQ --- VSS --- --- VDDQ _DQ[4 --- _DQ[5 --- VDDQ _DQ[5 _DQ[5 VSS --- RCOM --- OPIRC VSS --- --- 11 / VSS --- SRCCL SRCCL --- TP5
DDR1 DDR1 BATLO O3 CS0# CS1# CS2#
8] 1] 7] 8] P[2] OMP PME# KREQ KREQ
_DQ[2 _DQ[2 W# 4# 5#
5] 6]
DDR1 DDR1 DDR1
_DQ[4 _DQS _DQ[4 GPP_B GPP_B GPP_B GPP_B
DDR1 DDR1 DDR1 DDR1 DDR_ PROC_ GPD7 DRAM 8/ 7/ 6/ EMMC
0] / N[5] / 3] / 12 /
AT VSS --- --- --- VSS _DQ[4 --- _DQ[5 --- VSS _DQ[5 _DQ[5 VSS --- RCOM --- POPIR / --- _RESE --- SLP_S SRCCL --- SRCCL SRCCL --- TP6 VSS --- VSS _RCO
DDR1 DDR1 DDR1 9] 0] 6] 9] P[1] COMP RSVD T# KREQ KREQ KREQ MP
_DQ[2 _DQS _DQ[2 0# 3# 2# 1#
4] N[3] 7]
GPP_A
DDR1 DDR1 DDR1 13 / GPP_B
_DQ[4 _DQS _DQ[4 SUSW GPP_B
DDR1 DDR1 DDR1 DDR1 DDR_ 5/
4] / P[5] / 6] / ARN# 18 /
AR VSS --- --- --- VSS _DQS --- _DQS --- VSS _DQS _DQS VSS --- RCOM --- VSS VSS --- --- VSS SRCCL --- VSS --- VSS --- --- --- ---
DDR1 DDR1 DDR1 / GSPI0
P[6] N[6] N[7] P[7] P[0] KREQ
_DQ[2 _DQS _DQ[3 SUSP _MOSI
0#
8] P[3] 0] WRDN
ACK
Sx_EX
IT_HO
LDOFF
DDR1 DDR1 #/ GPP_B GPP_F GPP_F GPP_F GPP_F
_DQ[4 _DQ[4 GPD4 GPP_A GPP_B GPP_B
DDR1 DDR1 DDR1 DDR1 GPP_A 15 / 13 / 14 /
5] / 7] / INTRU / 15 / 17 / 16 / 21 / 12 / EMMC
AP VSS --- VSS --- --- VSS _DQ[5 --- _DQ[5 --- VSS _DQ[6 _DQ[6 VSS --- VSS --- --- 12 / --- VSS --- --- EMMC EMMC
DDR1 DDR1 DER# SLP_S SUSA GSPI0 GSPI0 GSPI1 EMMC _DATA
2] 5] 1] 2] BM_B _DATA _DATA
_DQ[2 _DQ[3 3# CK# _MISO _CLK _MISO _CMD
USY# 2 0 1
9] 1] /
ISH_G
P6
GPP_F GPP_F GPP_F
GPD6 GPP_B GPP_B GPP_B GPP_B GPP_B GPP_B
DDR1 DDR1 DDR1 DDR1 16 / 18 / 17 /
SRTCR / SLP_S 1/ 0/ 13 / 15 / 20 / 22 /
AN VSS --- VSS VSS --- VSS --- VSS _DQ[5 --- _DQ[5 --- VSS _DQ[6 _DQ[6 VSS --- --- --- --- --- --- --- EMMC EMMC EMMC
ST# SLP_A US# CORE CORE PLTRS GSPI0 GSPI1 GSPI1
3] 4] 0] 3] _DATA _DATA _DATA
# _VID1 _VID0 T# _CS# _CLK _MOSI 3 5 4
GPP_B
GPD2 GPP_B 23 /
GPP_B GPP_B GPP_F GPP_F GPP_F
VCCIO VSSIO / 11 / SML1A 19 / GPP_F 20 /
RTCRS LAN_ 2/ 19 / EMMC 22 / 21 / EMMC
AM VCC --- VCC VCC --- VCCIO --- VCCIO VSS --- VSS --- _SENS _SENS VSS RTCX2 --- RTCX1 --- --- VSS --- EXT_P --- VSS LERT# ---
T# VRALE GSPI1 _DATA EMMC EMMC _DATA
E E WAKE WR_G /
RT# _CS# _CLK _RCLK
# ATE# PCHH 6 7
OT#
DCPD
VCCPL
AL VSS --- VCC VSS --- VCCIO --- VSS RSVD --- RSVD --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- VSS --- VSS SW_1
L_OC p0
GPP_F GPP_F GPP_F GPP_F
VCCPR VCCRT VCCRT
VCCS VCCS VCCP RSVD RSVD 3/ 2/ 1/ 0/
AK VCC --- VCC RSVD --- VCCIO --- VCCIO VSS --- --- VSS VSS IM_1p VSS CPRIM VSS --- VSS VSS --- --- --- --- ---
A A C GPPA _TP _TP I2S2_ I2S2_ I2S2_ I2S2_
0 _3p3 RXD TXD SFRM SCLK
VCCPR VCCD
VCCH SW_3 VCCSP USB2P USB2P USB2
AJ --- --- --- --- --- --- --- --- --- --- --- --- --- --- IM_3p VSS VSS VSS --- --- --- --- --- --- --- --- --- --- VSS
DA I _3 _5 N_5
3 p3
GPP_F GPP_F GPP_F GPP_F
7/ 6/ 5/ 4/ USB2P USB2 USB2 USB2P USB2
AH --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- VSS VSS --- ---
I2C3_ I2C3_ I2C2_ I2C2_ _10 N_10 N_3 _7 N_7
SCL SDA SCL SDA
USB2_ USB2_ USB2P USB2
VCCP
AG --- --- --- --- --- --- --- --- --- --- --- --- --- --- VSS VSS VSS VSS VSS VSS GPPB --- --- --- --- --- --- --- --- --- --- VBUS ID _9 N_9
SENSE
GPP_F GPP_F
VCCS VCCS VCCPR VCCPR VCCP GPP_F 9/ 8/ USB2P USB2 USB2P USB2
AF --- --- --- --- --- --- --- --- --- --- --- --- --- --- RAM_ RAM_ IM_CO IM_CO VSS GPPF VSS --- 23 I2C4_ I2C4_ VSS _8 N_8 _6 N_6 --- VSS --- VSS VSS
1P0 1P0 RE RE SCL SDA
AE --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GPP_F GPP_F
11/ 10 / GPP_C GPP_C GPP_C GPP_C
VCCD VCCD I2C5_ I2C5_ USB2P USB2 23 /
VCCP USB2P USB2 22 / 21 / 20 /
AD --- --- --- --- --- --- --- --- --- --- --- --- --- --- VSS VSS VSS SW_3 SW_3 VSS --- VSS SCL / SDA / VSS --- UART2 UART2
GPPG _4 N_4 _2 N_2 _CTS _RTS# UART2 UART2
p3 p3 ISH_I ISH_I _TXD _RXD
2C2_S 2C2_S #
CL DA
GPP_C GPP_C GPP_C
14 / 13 / 12 /
UART1 UART1 UART1
_RTS# _TXD _RXD
AC --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- / / /
ISH_U ISH_U ISH_U
ART1_ ART1_ ART1_
RTS# TXD RXD
GPP_C
15 /
GPP_G GPP_G GPP_G UART1 GPP_C
11 / GPP_C GPP_C
VCCPR VCCPR VCCPR 1/ 2/ 0/ USB2P USB2 SD_R USB2_ _CTS UART0 9/ 8/
AB --- --- --- --- --- --- --- --- --- --- --- --- --- --- VSS IM_1P IM_1P VSS IM_1p VSS VSS --- VSS ---
SD_D SD_D SD_C _1 N_1 COMP COMP #/ UART0 UART0
0 0 0 ATA0 ATA1 MD ISH_U _CTS _TXD _RXD
#
ART1_
CTS#
AA VCC VCC VCC VSS VCC VCC VSS VCC VCC --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GT GT GT GT GT GT GT
VCC
Y --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GT
W VCC VCC VCC VCC VCC VCC VCC VCC VCC --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GT GT GT GT GT GT GT GT GT
VCC
V --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
OPC
VCC VSS VSS VCC VSS VSS VCC VSS VSS
U --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GT GT GT
VCC
T --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GT
VCC VCC VCC VCC VCC VCC VCC VCC VCC
R --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GT GT GT GT GT GT GT GT GT
VCC
P --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
OPC
VCC VCC VCC VSS VCC VCC VSS VCC VCC
N --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GT GT GT GT GT GT GT
VCC
M --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GT
VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC
L --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
GT GT GT GT GT GT GT GT GT GT
VSS VCC VCC VCC VCC VCC VCC VCC VCC RSV RSV
K VSS VSS --- VSS VSS VSS VSS VSS VSS --- --- --- --- --- --- --- --- VCC VCC --- VCC --- VCC VCC ---
GT GT GT GT GT GT GT GT D D
VCC VSS
RSV GT_ GT_ RSV VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VSS
J --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- VCC --- VSS VCC ---
D SEN SEN D GT GT GT GT GT GT GT GT GT GT GT
SE SE
OPC OPC VCC
VSS CFG[ CFG[ E_R _RC _OP
H --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
12] 14] COM OMP C_1P
P 8
VCC DDI1 DDI1 DDI1
G CFG[ CFG[ CFG[ CFG[ _OP RSV VSS
--- VSS VSS --- VSS --- C_1P VSS --- VSS --- _TXP VSS --- _TXP VSS --- _AU --- VSS --- --- VSS VCC --- VCC --- VCC VCC ---
13] 15] 9] 11] D
[3] [2] XN
8
CLK
DDI1 DDI1 DDI1 DDI1 RSV DDI1 DDI2 EDP OUT
F CFG[ CFG[ CFG[ VSS CFG[ RSV RSV RSV _AU
--- VSS --- --- --- --- _TXP --- _TX _TXP --- _TX --- _AU --- _AU --- --- _ITP VSS --- VSS --- VSS VSS ---
8] 10] 19] 17] D D N[2] D D
[1] N[3] [0] XP XP XP XDP
_N
CLK CLK
OUT XCL CLK
RSV CFG DDI1 DDI1 eDP_ DDI2 EDP OUT OUT XTAL
VSS CFG[ CFG[ CFG[ VSS CFG[
E --- --- --- --- _RC --- _TX --- VSS _TX --- VSS RCO --- VSS --- _AU --- VSS _AU --- _ITP K_BI --- _PCI --- _PCI 24_I ---
4] 0] 18] 16] D OMP N[1] N[0] MP XN XN XDP ASR E_N
EF E_P5 N
_P 5
CLK CLK CLK
PRO PCH PRO
CFG[ VSS CFG[ VIDS CATE VSS C_P PRO C_P BPM RSV VSS DDI2 DDI2 DDI2 EDP OUT OUT OUT CSI2 CSI2 CSI2
RSV VSS CFG[ _JTA VSS
D --- REQ C_T --- _TXP _TX _TXP --- VSS VSS _TX VSS VSS --- _PCI _PCI _PCI VSS _DP _CLK _DP
D 6] 3] 2] OUT RR# DI G_T RDY #[1] D [1] N[3] [0] N[1] E_N E_N E_N 1 P0 2
# DI # 0 2 3
DDR1_MA[15] /
AN53 DDR1_CAA[8]/ DDR1_MA[15] DDR1_CAA[8] DDR1_ACT# -9777.984 5596.636
DDR1_ACT#
DDR1_MA[2] /
AY47 DDR1_CAB[5]/ DDR1_MA[2] DDR1_CAB[5] DDR1_MA[2] -6162.802 9688.576
DDR1_MA[2]
BB46 DDR1_MA[3] -5463.032 11314.176
DDR0_DQ[41] /
AW35 DDR0_DQ[41] DDR1_DQ[9] 620.268 9363.456
DDR1_DQ[9]
DDR0_DQ[42] /
AY33 DDR0_DQ[42] DDR1_DQ[10] 1847.088 10013.696
DDR1_DQ[10]
DDR0_DQ[43] /
AW33 DDR0_DQ[43] DDR1_DQ[11] 1847.088 9363.456
DDR1_DQ[11]
DDR0_DQ[44] /
BB35 DDR0_DQ[44] DDR1_DQ[12] 521.208 11314.176
DDR1_DQ[12]
DDR0_DQ[45] /
BA35 DDR0_DQ[45] DDR1_DQ[13] 521.208 10663.936
DDR1_DQ[13]
DDR0_DQ[46] /
BA33 DDR0_DQ[46] DDR1_DQ[14] 1847.088 10663.936
DDR1_DQ[14]
DDR0_DQ[47] /
BB33 DDR0_DQ[47] DDR1_DQ[15] 1847.088 11314.176
DDR1_DQ[15]
DDR0_DQ[48] /
AY31 DDR0_DQ[48] DDR1_DQ[32] 3147.568 10013.696
DDR1_DQ[32]
DDR0_DQ[49] /
AW31 DDR0_DQ[49] DDR1_DQ[33] 3147.568 9363.456
DDR1_DQ[33]
DDR0_DQ[50] /
AY29 DDR0_DQ[50] DDR1_DQ[34] 4374.388 10013.696
DDR1_DQ[34]
DDR0_DQ[51] /
AW29 DDR0_DQ[51] DDR1_DQ[35] 4374.388 9363.456
DDR1_DQ[35]
DDR0_DQ[52] /
BB31 DDR0_DQ[52] DDR1_DQ[36] 3147.568 11314.176
DDR1_DQ[36]
DDR0_DQ[53] /
BA31 DDR0_DQ[53] DDR1_DQ[37] 3147.568 10663.936
DDR1_DQ[37]
DDR0_DQ[54] /
BA29 DDR0_DQ[54] DDR1_DQ[38] 4473.448 10663.936
DDR1_DQ[38]
DDR0_DQ[55] /
BB29 DDR0_DQ[55] DDR1_DQ[39] 4473.448 11314.176
DDR1_DQ[39]
DDR0_DQ[56] /
AY27 DDR0_DQ[56] DDR1_DQ[40] 5601.208 10013.696
DDR1_DQ[40]
DDR0_DQ[57] /
AW27 DDR0_DQ[57] DDR1_DQ[41] 5601.208 9363.456
DDR1_DQ[41]
DDR0_DQ[58] /
AY25 DDR0_DQ[58] DDR1_DQ[42] 6828.028 10013.696
DDR1_DQ[42]
DDR0_DQ[59] /
AW25 DDR0_DQ[59] DDR1_DQ[43] 6828.028 9363.456
DDR1_DQ[43]
DDR0_DQ[60] /
BB27 DDR0_DQ[60] DDR1_DQ[44] 5502.148 11314.176
DDR1_DQ[44]
DDR0_DQ[61] /
BA27 DDR0_DQ[61] DDR1_DQ[45] 5502.148 10663.936
DDR1_DQ[45]
DDR0_DQ[62] /
BA25 DDR0_DQ[62] DDR1_DQ[46] 6828.028 10663.936
DDR1_DQ[46]
DDR0_DQ[63] /
BB25 DDR0_DQ[63] DDR1_DQ[47] 6828.028 11314.176
DDR1_DQ[47]
DDR1_DQ[0] /
AF65 DDR1_DQ[0] DDR0_DQ[16] -16412.972 2147.57
DDR0_DQ[16]
DDR1_DQ[1] /
AF64 DDR1_DQ[1] DDR0_DQ[17] -15762.732 2147.57
DDR0_DQ[17]
DDR1_DQ[2] /
AK65 DDR1_DQ[2] DDR0_DQ[18] -16412.972 3976.37
DDR0_DQ[18]
DDR1_DQ[3] /
AK64 DDR1_DQ[3] DDR0_DQ[19] -15762.732 3976.37
DDR0_DQ[19]
DDR1_DQ[4] /
AF66 DDR1_DQ[4] DDR0_DQ[20] -17063.212 2147.57
DDR0_DQ[20]
DDR1_DQ[5] /
AF67 DDR1_DQ[5] DDR0_DQ[21] -17713.452 2147.57
DDR0_DQ[21]
DDR1_DQ[6] /
AK67 DDR1_DQ[6] DDR0_DQ[22] -17713.452 3976.37
DDR0_DQ[22]
DDR1_DQ[7] /
AK66 DDR1_DQ[7] DDR0_DQ[23] -17063.212 3976.37
DDR0_DQ[23]
DDR1_DQ[8] /
AF70 DDR1_DQ[8] DDR0_DQ[24] -19664.172 1839.976
DDR0_DQ[24]
DDR1_DQ[9] /
AF68 DDR1_DQ[9] DDR0_DQ[25] -18363.692 1939.036
DDR0_DQ[25]
DDR1_DQ[10] /
AH71 DDR1_DQ[10] DDR0_DQ[26] -20314.412 3165.856
DDR0_DQ[26]
DDR1_DQ[11] /
AH68 DDR1_DQ[11] DDR0_DQ[27] -18363.692 3165.856
DDR0_DQ[27]
DDR1_DQ[12] /
AF71 DDR1_DQ[12] DDR0_DQ[28] -20314.412 1839.976
DDR0_DQ[28]
DDR1_DQ[13] /
AF69 DDR1_DQ[13] DDR0_DQ[29] -19013.932 1939.036
DDR0_DQ[29]
DDR1_DQ[14] /
AH70 DDR1_DQ[14] DDR0_DQ[30] -19664.172 3165.856
DDR0_DQ[30]
DDR1_DQ[15] /
AH69 DDR1_DQ[15] DDR0_DQ[31] -19013.932 3165.856
DDR0_DQ[31]
DDR1_DQ[16] /
AT66 DDR1_DQ[16] DDR0_DQ[48] -17093.184 7547.356
DDR0_DQ[48]
DDR1_DQ[17] /
AU66 DDR1_DQ[17] DDR0_DQ[49] -17093.184 8197.596
DDR0_DQ[49]
DDR1_DQ[18] /
AP65 DDR1_DQ[18] DDR0_DQ[50] -16178.784 6246.876
DDR0_DQ[50]
DDR1_DQ[19] /
AN65 DDR1_DQ[19] DDR0_DQ[51] -16178.784 5596.636
DDR0_DQ[51]
DDR1_DQ[20] /
AN66 DDR1_DQ[20] DDR0_DQ[52] -17093.184 5596.636
DDR0_DQ[52]
DDR1_DQ[21] /
AP66 DDR1_DQ[21] DDR0_DQ[53] -17093.184 6246.876
DDR0_DQ[53]
DDR1_DQ[22] /
AT65 DDR1_DQ[22] DDR0_DQ[54] -16178.784 7547.356
DDR0_DQ[54]
DDR1_DQ[23] /
AU65 DDR1_DQ[23] DDR0_DQ[55] -16178.784 8197.596
DDR0_DQ[55]
DDR1_DQ[24] /
AT61 DDR1_DQ[24] DDR0_DQ[56] -14349.984 7547.356
DDR0_DQ[56]
DDR1_DQ[25] /
AU61 DDR1_DQ[25] DDR0_DQ[57] -14349.984 8197.596
DDR0_DQ[57]
DDR1_DQ[26] /
AP60 DDR1_DQ[26] DDR0_DQ[58] -13435.584 6246.876
DDR0_DQ[58]
DDR1_DQ[27] /
AN60 DDR1_DQ[27] DDR0_DQ[59] -13435.584 5596.636
DDR0_DQ[59]
DDR1_DQ[28] /
AN61 DDR1_DQ[28] DDR0_DQ[60] -14349.984 5596.636
DDR0_DQ[60]
DDR1_DQ[29] /
AP61 DDR1_DQ[29] DDR0_DQ[61] -14349.984 6246.876
DDR0_DQ[61]
DDR1_DQ[30] /
AT60 DDR1_DQ[30] DDR0_DQ[62] -13435.584 7547.356
DDR0_DQ[62]
DDR1_DQ[31] /
AU60 DDR1_DQ[31] DDR0_DQ[63] -13435.584 8197.596
DDR0_DQ[63]
DDR1_DQ[32] /
AU40 DDR1_DQ[32] DDR1_DQ[16] -2462.784 8197.596
DDR1_DQ[16]
DDR1_DQ[33] /
AT40 DDR1_DQ[33] DDR1_DQ[17] -2462.784 7547.356
DDR1_DQ[17]
DDR1_DQ[34] /
AT37 DDR1_DQ[34] DDR1_DQ[18] -633.984 7547.356
DDR1_DQ[18]
DDR1_DQ[35] /
AU37 DDR1_DQ[35] DDR1_DQ[19] -633.984 8197.596
DDR1_DQ[19]
DDR1_DQ[36] /
AR40 DDR1_DQ[36] DDR1_DQ[20] -2462.784 6897.116
DDR1_DQ[20]
DDR1_DQ[37] /
AP40 DDR1_DQ[37] DDR1_DQ[21] -2462.784 6246.876
DDR1_DQ[21]
DDR1_DQ[38] /
AP37 DDR1_DQ[38] DDR1_DQ[22] -633.984 6246.876
DDR1_DQ[22]
DDR1_DQ[39] /
AR37 DDR1_DQ[39] DDR1_DQ[23] -633.984 6897.116
DDR1_DQ[23]
DDR1_DQ[40] /
AT33 DDR1_DQ[40] DDR1_DQ[24] 1194.816 7547.356
DDR1_DQ[24]
DDR1_DQ[41] /
AU33 DDR1_DQ[41] DDR1_DQ[25] 1194.816 8197.596
DDR1_DQ[25]
DDR1_DQ[42] /
AU30 DDR1_DQ[42] DDR1_DQ[26] 3023.616 8197.596
DDR1_DQ[26]
DDR1_DQ[43] /
AT30 DDR1_DQ[43] DDR1_DQ[27] 3023.616 7547.356
DDR1_DQ[27]
DDR1_DQ[44] /
AR33 DDR1_DQ[44] DDR1_DQ[28] 1194.816 6897.116
DDR1_DQ[28]
DDR1_DQ[45] /
AP33 DDR1_DQ[45] DDR1_DQ[29] 1194.816 6246.876
DDR1_DQ[29]
DDR1_DQ[46] /
AR30 DDR1_DQ[46] DDR1_DQ[30] 3023.616 6897.116
DDR1_DQ[30]
DDR1_DQ[47] /
AP30 DDR1_DQ[47] DDR1_DQ[31] 3023.616 6246.876
DDR1_DQ[31]
AU27 DDR1_DQ[48] 4852.416 8197.596
DDR1_DQSP[1] /
AG70 DDR1_DQSP[1] DDR0_DQSP[3] -19339.052 2502.916
DDR0_DQSP[3]
DDR1_DQSP[2] /
AR65 DDR1_DQSP[2] DDR0_DQSP[6] -16178.784 6897.116
DDR0_DQSP[6]
DDR1_DQSP[3] /
AR60 DDR1_DQSP[3] DDR0_DQSP[7] -13435.584 6897.116
DDR0_DQSP[7]
DDR1_DQSP[4] /
AR38 DDR1_DQSP[4] DDR1_DQSP[2] -1548.384 6897.116
DDR1_DQSP[2]
DDR1_DQSP[5] /
AR32 DDR1_DQSP[5] DDR1_DQSP[3] 2109.216 6897.116
DDR1_DQSP[3]
AR27 DDR1_DQSP[6] 4852.416 6897.116
§§
The Y-Processor is available in the BGA package (BGA1515). Figure 10-1 through
Figure 10-6 provide a top view of the Ball map. Table 10-1 provides the Ball list.
Figure 10-1. Y-Processor Ball Map (Top View, Upper-Left, Columns 64-44)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44
BP VDDQ VSS VSS VDDQ VDDQ VSS VSS VDDQ VDDQ VSS VSS
DDR0_BA[ DDR0_MA[
0] / 1] / DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR0_DQ[
DDR0_CAB DDR0_ODT DDR0_CAB 20] / 21] / 29] / 28] / DDR_VTT_ 48] /
BN VDDQ
[4]/ [0] [8]/ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ CNTL DDR1_DQ[
DDR0_BA[ DDR0_MA[ 52] 53] 61] 60] 32]
0] 1]
DDR0_MA[
10] / DDR1_DQ DDR1_DQ[ DDR1_DQ DDR1_DQ[ DDR0_DQ[ DDR0_DQ
BM DDR0_CAB SN[2] / 22] / SP[3] / 31] / 49] / SP[6] /
DDR0_PAR
[7]/ DDR0_DQ DDR0_DQ[ DDR0_DQ DDR0_DQ[ DDR1_DQ[ DDR1_DQ
DDR0_MA[ SN[6] 54] SP[7] 63] 33] SP[4]
10]
DDR0_CAS DDR0_BA[
#/ 1] / DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR0_DQ[
DDR0_CAB DDR0_CAB DDR0_MA[ 17] / 19] / 24] / 26] / 53] /
BL RSVD_TP [1]/ [6]/ VSS
4] DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
DDR0_MA[ DDR0_BA[ 49] 51] 56] 58] 37]
15] 1]
DDR0_MA[
13] / DDR1_DQ DDR1_DQ[ DDR1_DQ DDR1_DQ[ DDR0_DQ[ DDR0_DQ
DDR0_CAB SP[2] / 23] / SN[3] / 30] / 51] / SN[6] /
BK VSS
[0] / DDR0_DQ DDR0_DQ[ DDR0_DQ DDR0_DQ[ DDR1_DQ[ DDR1_DQ
DDR0_MA[ SP[6] 55] SN[7] 62] 35] SN[4]
13]
DDR0_WE
#/ DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ DDR0_DQ[
DDR_RCO DDR0_CAB DDR0_CS# 16] / 18] / 25] / 27] / 54] /
BJ VSS VSS
MP[1] [2]/ [1] DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
DDR0_MA[ 48] 50] 57] 59] 38]
14]
BH VSS VSS VSS VSS VSS VSS VSS VSS
DDR0_MA[
14] / DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[
DDR0_CAA DDR0_ALE 21] / 18] / 28] / 29] / 43] /
BG VSS RSVD_TP
[9]/ RT# DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
DDR0_BG[ 37] 34] 44] 45] 11]
1]
DDR0_MA[
6] / DDR0_DQ DDR0_DQ[ DDR0_DQ DDR0_DQ[ DDR0_DQ[ DDR0_DQ
DDR_RCO DDR0_CAA SP[2] / 23] / SN[3] / 30] / 47] / SP[5] /
BF MP[0] [2] / VSS VSS DDR0_DQ DDR0_DQ[ DDR0_DQ DDR0_DQ[ DDR1_DQ[ DDR1_DQ
DDR0_MA[ SP[4] 39] SN[5] 46] 15] SP[1]
6]
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[
DDR0_CKE 16] / 19] / 25] / 27] / 46] /
BE VSS
[2] DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
32] 35] 41] 43] 14]
DDR0_MA[ DDR0_MA[
15] / 11] / DDR0_DQ DDR0_DQ[ DDR0_DQ DDR0_DQ[ DDR0_DQ[ DDR0_DQ
DDR0_CAA DDR0_CAA SN[2] / 22] / SP[3] / 31] / 41] / SN[5] /
BD VSS VSS
[8]/ [7] / DDR0_DQ DDR0_DQ[ DDR0_DQ DDR0_DQ[ DDR1_DQ[ DDR1_DQ
DDR0_ACT DDR0_MA[ SN[4] 38] SP[5] 47] 9] SN[1]
# 11]
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[
DDR_RCO DDR0_CKN DDR0_CKP DDR0_CKE 17] / 20] / 24] / 26] / 44] /
BC VSS
MP[2] [0] [0] [1] DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ DDR1_DQ[
33] 36] 40] 42] 12]
DDR0_MA[
2] /
DDR0_MA[ DDR0_CAB DDR0_CKE
BB VSS VSS VSS VSS VSS VSS VSS
3] [5]/ [0]
DDR0_MA[
2]
DDR0_MA[
12]/
DDR0_CKP DDR0_CKN DDR0_CAA
BA VSS VSS VSS VDDQ VDDQ VDDQ VDDQ
[1] [1] [6]/
DDR0_MA[
12]
AY VSS VSS VSS VSS VSS
DDR0_MA[ DDR0_MA[ DDR0_MA[
5]/ 7]/ 9]/
DDR0_CS# DDR0_CKE DDR0_CAA DDR0_CAA DDR0_CAA DDR1_VRE VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD
AW [0] [3] [0]/ [4]/ [1]/ F_DQ R R R R
DDR0_MA[ DDR0_MA[ DDR0_MA[
5] 7] 9]
DDR0_MA[ DDR0_RAS DDR0_BA[ DDR0_MA[
0] / #/ 2] / 8] /
DDR0_CAB DDR0_CAB DDR0_CAA DDR0_CAA VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD
AV VDDQ VSS VSS
[9]/ [3]/ [5]/ [3] / R R R R
DDR0_MA[ DDR0_MA[ DDR0_BG[ DDR0_MA[
0] 16] 0] 8]
AU VSS VSS VSS VSS VSS VSS
DDR1_DQ[ DDR1_DQ[
DDR0_DQ[ DDR0_DQ[ 5] / 0] /
AT VDDQ VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
15] 10] DDR0_DQ[ DDR0_DQ[
21] 16]
DDR1_DQ[ DDR1_DQ[
DDR0_DQ[ DDR0_DQ[ 4] / 1] / DDR_VREF
AR 14] 11] VSS VSS VSS VSS VSS VSS VSS
DDR0_DQ[ DDR0_DQ[ _CA
20] 17]
DDR1_DQ DDR1_DQ
DDR0_DQ DDR0_DQ SP[0] / SN[0] /
AP VSS VSS
SN[1] SP[1] DDR0_DQ DDR0_DQ
SP[2] SN[2]
DDR1_DQ[ DDR1_DQ[
DDR0_DQ[ DDR0_DQ[ 2] / 3] / DDR0_VRE
AN VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
13] 12] DDR0_DQ[ DDR0_DQ[ F_DQ
18] 19]
DDR1_DQ[ DDR1_DQ[
DDR0_DQ[ DDR0_DQ[ 6] / 7] /
AM VSS VSS
9] 8] DDR0_DQ[ DDR0_DQ[
22] 23]
DDR1_DQ[ DDR1_DQ[
DDR0_DQ[ DDR0_DQ[ 9] / 8] /
AL VSS VSS VSS VSS VSS VSS VSS VSS
7] 6] DDR0_DQ[ DDR0_DQ[
25] 24]
DDR1_DQ[ DDR1_DQ[
DDR0_DQ[ DDR0_DQ[ 12] / 13] /
AK VDDQ VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
2] 3] DDR0_DQ[ DDR0_DQ[
28] 29]
DDR1_DQ DDR1_DQ
DDR0_DQ DDR0_DQ SN[1] / SP[1] /
AJ VSS VCCGT
SP[0] SN[0] DDR0_DQ DDR0_DQ
SN[3] SP[3]
DDR1_DQ[ DDR1_DQ[
DDR0_DQ[ DDR0_DQ[ 10] / 11] /
AH VDDQ VSS VSS VSS VSS VSS VSS VSS
4] 1] DDR0_DQ[ DDR0_DQ[
26] 27]
Figure 10-2. Y-Processor Ball Map (Top View, Upper-Middle, Columns 43-23)
43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
BP VDDQ VDDQ VSS VSS VDDQ VDDQ VSS VSS VDDQ VDDQ
DDR1_BA[ DDR1_MA[ DDR1_MA[
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ 2] / 14] / 9] / DDR1_DQ[ DDR1_DQ[ DDR1_DQ[
52] / 57] / 59] / DDR1_CAA DDR1_CAA DDR1_CKE DDR1_CAA 33] / 36] / 45] /
BN DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ VSS
[5]/ [9]/ [0] [1] / DDR1_DQ[ DDR1_DQ[ DDR1_DQ[
36] 41] 43] DDR1_BG[ DDR1_BG[ DDR1_MA[ 17] 20] 29]
0] 1] 9]
DDR1_MA[ DDR1_MA[
DDR0_DQ[ DDR0_DQS 15] / 6] / DDR1_DQ[ DDR1_DQS DDR1_DQ[
BM 56] / N[7] / DDR1_CKP DDR1_CAA DDR1_CAA DDR1_CS# 32] / P[4] / 40] /
VSS
DDR1_DQ[ DDR1_DQS [0] [8]/ [2] / [0] DDR1_DQ[ DDR1_DQS DDR1_DQ[
40] N[5] DDR1_ACT DDR1_MA[ 16] P[2] 24]
# 6]
DDR1_MA[
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ 8] / DDR1_DQ[ DDR1_DQ[ DDR1_DQ[
50] / 61] / 62] / DDR1_CAA 37] / 35] / 44] /
BL VSS VSS VSS VSS
DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ [3] / DDR1_DQ[ DDR1_DQ[ DDR1_DQ[
34] 45] 46] DDR1_MA[ 21] 19] 28]
8]
DDR1_MA[
DDR0_DQ[ DDR0_DQS 5] / DDR1_DQ[ DDR1_DQS DDR1_DQ[
60] / P[7] / DDR1_CKN DDR1_MA[ DDR1_CKE DDR1_CAA 34] / N[4] / 41] /
BK DDR1_DQ[ DDR1_DQS VSS
[0] 4] [1] [0] / DDR1_DQ[ DDR1_DQS DDR1_DQ[
44] P[5] DDR1_MA[ 18] N[2] 25]
5]
DDR1_MA[ DDR1_MA[
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ 12] / 11] / DDR1_DQ[ DDR1_DQ[ DDR1_DQ[
BJ 55] / 58] / 63] / DDR1_CAA DDR1_CAA DDR1_CS# DDR1_MA[ 39] / 38] / 43] /
VSS
DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ [6] / [7] / [1] 3] DDR1_DQ[ DDR1_DQ[ DDR1_DQ[
39] 42] 47] DDR1_MA[ DDR1_MA[ 23] 22] 27]
12] 11]
DDR1_CKE
BH VSS VSS VSS VSS VSS VSS VSS VSS VSS
[3]
DDR1_MA[ DDR1_MA[ DDR1_MA[
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ 13] / 10] / 7] /
42] / 34] / 38] / DDR1_CAB DDR1_CAB DDR1_CKE DDR1_CAA DDR1_DQ[ DDR1_DQ[ DDR1_DQ[
BG VSS
DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ [0] / [7]/ [2] [4] / 52] 50] 61]
10] 2] 6] DDR1_MA[ DDR1_MA[ DDR1_MA[
13] 10] 7]
DDR1_MA[ DDR1_RAS DDR1_MA[
DDR0_DQ[ DDR0_DQS 0] / #/ 2] /
36] / P[4] / DDR1_CAB DDR1_CAB DDR1_CKP DDR1_CAB DDR1_DQ[ DDR1_DQS DDR1_DQ[
BF DDR1_DQ[ DDR1_DQS VSS [9]/ [3]/ [1] [5]/ 48] P[6] 56]
4] P[0] DDR1_MA[ DDR1_MA[ DDR1_MA[
0] 16] 2]
DDR1_CAS
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ #/
45] / 39] / 35] / DDR1_CAB DDR1_DQ[ DDR1_DQ[ DDR1_DQ[
BE VSS VSS VSS VSS
DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ [1]/ 53] 54] 60]
13] 7] 3] DDR1_MA[
15]
DDR1_BA[
DDR0_DQ[ DDR0_DQS 1] /
37] / N[4] / DDR1_CAB DDR1_ALE DDR1_CKN DDR1_DQ[ DDR1_DQS DDR1_DQ[
BD VSS DDR1_PAR
DDR1_DQ[ DDR1_DQS [6]/ RT# [1] 49] N[6] 57]
5] N[0] DDR1_BA[
1]
DDR1_WE DDR1_BA[ DDR1_MA[
DDR0_DQ[ DDR0_DQ[ DDR0_DQ[ #/ 0] / 1] /
40] / 32] / 33] / DDR1_CAB DDR1_ODT DDR1_CAB DDR1_CAB DDR1_DQ[ DDR1_DQ[ DDR1_DQ[
BC VSS
DDR1_DQ[ DDR1_DQ[ DDR1_DQ[ [2]/ [0] [4]/ [8]/ 51] 55] 59]
8] 0] 1] DDR1_MA[ DDR1_BA[ DDR1_MA[
14] 0] 1]
BB VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
BA VDDQ VDDQ VDDQC VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ VDDQ TP5
AY VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
AW VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VSS VSS
R R R R R R R R R
VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD VCCIO_DD
AV VSS
R R R R R R R R R
AU
VCCSA_DD VCCSA_DD VCCIO_SE
AT VCCGT VCC VCC VCC VCC VCC VCC VCC VSS VCCIO VCCHDA
R R NSE
VSSIO_SE VCCSRAM_
AR VSS VCC VSS VCCG1 VSS VCCG1 VSS VCC VSS VCCSA VSS VCCIO NSE 1P0
AP
VCCSRAM_
AN VCCGT VCC VSS VCCG1 VSS VCCG1 VSS VCC VCCSA VCCSA VSS VCCIO VSS 1P0
AM
VCCSRAM_
AL VSS VCC VSS VCCG1 VSS VCCG1 VSS VCC VSS VCCSA VSS VCCIO VSS 1P0
VCCSRAM_
AK VCCGT VCC VSS VCCG1 VSS VCCG1 VSS VCC VCCSA VCCSA VSS VCCIO VSS 1P0
AJ
AH VSS VCC VSS VCCG1 VSS VCCG1 VSS VCC VSS VCCSA VSS VCCIO VSS VSS
Figure 10-3. Y-Processor Ball Map (Top View, Upper-Right, Columns 22-1)
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
GPP_A5 / GPP_A4 /
DRAM_RES PCH_OPIR PCH_PWR
BP VSS RTCX2 SLP_LAN# WAKE# LFRAME# / LAD3 / RSVD VSS
ET# COMP OK ESPI_CS# ESPI_IO3
DDR1_DQ[ GPP_A16 /
BN 42] / PROC_POP DSW_PWR GPP_A6 /
RTCX1 RTCRST# SLP_SUS# VSS SD_1P8_S RSVD TP4
DDR1_DQ[ IRCOMP OK SERIRQ EL
26]
DDR1_DQ
SN[5] /
BM VSS VSS VSS VSS VSS
DDR1_DQ
SN[3]
DDR1_DQ[ HDA_RST GPP_A13 / GPP_A17 /
47] / #/ HDA_SDI1 HDA_SDI0 SUSWARN
I2S1_SFR GPP_A0 / SD_PWR_ GPP_A21 /
BL DDR1_DQ[ I2S1_SCL / / VSS #/ VSS
M RCIN# EN_# / ISH_GP3
31] K I2S1_RXD I2S0_RXD SUSPWRD ISH_GP7
NACK
DDR1_DQ HDA_BLK / HDA_SDO GPP_A1 /
BK SP[5] / VSS I2S0_SCL / I2S1_TXD LAD0 /
DDR1_DQ K I2S0_TXD ESPI_IO0
SP[3]
Sx_EX-
GPP_A14 / IT_HOLDO
DDR1_DQ[ HDA_SYNC GPP_A9 / GPP_A2 / SUS_STAT FF# /
46] / / CLKOUT_L GPP_A22 / GPP_A20 /
BJ TP2 TP1 RSMRST# LAD1 / #/ GPP_A12 / ISH_GP4
DDR1_DQ[ I2S0_SFR PC0 / ISH_GP2
ESPI_IO1 ESPI_RESE BM_BUSY
30] M ESPI_CLK T# #/
ISH_GP6
GPD9 /
BH VSS VSS SRTCRST# GPD10 / GPP_A8 /
SLP_WLAN SLP_S5# CLKRUN#
#
GPP_A3 /
DDR1_DQ[ INTRUDER
BG VSS VSS VSS LAD2 / VSS VSS VSS VSS
58] # ESPI_IO2
GPP_A10 /
DDR1_DQ GPD5 / GPD3 / GPP_A18 / GPP_A15 / GPP_A11 / GPP_A7 / SD_RCOM
BF VSS RSVD CLKOUT_L
SN[7] SLP_S4# PWRBTN# ISH_GP0 SUSACK# PME# PIRQA# P
PC1
GPD2 /
DDR1_DQ[ GPD6 /
BE 63] RSVD SLP_A# LAN_WAKE VSS
#
GPD1 / GPP_B7 /
DDR1_DQ GPD0 / GPP_B3 / GPP_B2 / GPP_A23 / GPP_A19 /
BD VSS RSVD ACPRESEN SRCCLKRE
SP[7] BATLOW# CPU_GP2 VRALERT# ISH_GP5 ISH_GP1
T Q2#
GPP_B11 / GPP_B10 / GPP_B15 /
DDR1_DQ[ GPD11 / GPP_B4 / GPP_B12 / EXT_P- EMMC_RC
BC RSVD VSS SRCCLKRE GSPI0_CS
62] LANPHYPC CPU_GP3 SLP_S0# WR_GATE OMP
Q5# #
#
GPP_B23 /
GPP_B1 / GPP_B5 / GPP_B18 / GPP_B19 /
GPD7 / GPP_B13 / SML1ALER
BB VSS VSS RSVD RSVD CORE_VID SRCCLKRE GSPI0_MO GSPI1_CS
RSVD PLTRST# T# /
1 Q0# SI #
PCHHOT#
GPP_B0 /
GPD8 /
BA RSVD RSVD RSVD_TP CORE_VID VSS VSS VSS VSS VSS VSS
SUSCLK 0
GPD4 /
AY TP6 RSVD RSVD_TP VSS SLP_S3#
GPP_B20 / GPP_B16 / GPP_B22 / GPP_B17 / GPP_B21 /
AW VSS VSS VSS GSPI1_CL GSPI0_CL GSPI1_MO GSPI0_MI GSPI1_MI VCCPGPPB
K K SI SO SO
GPP_B6 / GPP_B9 / GPP_B8 / GPP_B14 /
AV VCCHDA VSS DCPRTC VSS VCCSPI SPI0_IO3 SPI0_IO2 SRCCLKRE SRCCLKRE SRCCLKRE VCCPGPPB
SPKR
Q1# Q4# Q3#
SPI0_MIS SPI0_CS2 SPI0_CS1 SPI0_CS0
AU SPI0_CLK VCCPGPPA
O # # #
GPP_F11/
GPP_F1 / GPP_F0 / I2C5_SCL
VCCPRIM_ VCCPRIM_ GPP_F7 / GPP_F3 / SPI0_MOS
AT VCCRTC DCPRTC VCCSPI I2S2_SFR I2S2_SCL / VCCPGPPA
1P0 CORE I2C3_SCL I2S2_RXD I
M K ISH_I2C2_
SCL
VCCPRIM_ VCCPRIM_
AR VCCRTC VSS VSS VSS VSS VSS VSS VSS VSS
1P0 CORE
GPP_F14 /
GPP_F2 / GPP_F5 / GPP_F6 / GPP_F4 /
AP VCCPGPPG EMMC_DA VCCPGPPF
I2S2_TXD I2C2_SCL I2C3_SDA I2C2_SDA
TA1
GPP_F13 / GPP_F15 / GPP_F20 / GPP_F9 / GPP_F8 /
AN VSS VSS VSS VSS VCCPGPPG EMMC_DA EMMC_DA EMMC_DA VCCPGPPF
I2C4_SCL I2C4_SDA
TA0 TA2 TA7
GPP_F10 /
GPP_F12 / GPP_F17 / I2C5_SDA
VCCDSW_ DCPDSW_
AM EMMC_CM EMMC_DA / USB2P_2 USB2N_2
3P3 1P0
D TA4 ISH_I2C2_
SDA
VCCRT- GPP_F18 / GPP_F21 /
CPRIM_3P VCCPRIM_ VCCDSW_ GPP_F22 / DCPDSW_
AL VSS VSS EMMC_DA EMMC_RCL USB2N_3 USB2P_3
1P0 3P3 EMMC_CLK 1P0
3 TA5 K
VCCRT-
VCCPRIM_
AK CPRIM_3P VCCPRIM_ VSS VSS VSS VSS VSS VSS VSS VSS VSS
3P3 3 1P0
GPP_F19 / GPP_F16 /
AJ EMMC_DA EMMC_DA GPP_F23 USB2N_1 USB2P_1 VCCPGPPC
TA6 TA3
VCCPRIM_ VCCPRIM_ VCCPRIM_ VCCPRIM_ VCCPRIM_ GPP_G1 / GPP_G0 /
AH VSS RSVD USB2N_5 USB2P_5 VCCPGPPC
3P3 1P0 1P0 1P0 1P0 SD_DATA0 SD_CMD
Figure 10-4. Y-Processor Ball Map (Top View, Lower-Left, Columns 64-44)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44
DDR1_DQ[ DDR1_DQ[
DDR0_DQ[ DDR0_DQ[ 15] / 14] /
AG VSS VCCGT
5] 0] DDR0_DQ[ DDR0_DQ[
31] 30]
AF VSS VSS VSS VSS VSS VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
AE VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VSS VSS VSS VSS VSS VSS
AC VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
AA VSS VSS VSS VSS VSS VCCGT VSS VSS VSS VSS VSS VSS
Y VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
V VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VSS VSS VSS VSS VSS VSS
T VSS VSS VSS VSS VSS VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT VCCGT
R VCC VCC VCC VCC VSS VCCGT VCCGT VSS VSS VSS VSS VSS
VSSGT_SE
P VCC VCC VCC VCC VCC VSS
NSE
VCCGT_SE
N VCC VCC VCC VCC VCC VCC VCCGT VCCGT VCCGT VCCGT
NSE
M VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC
L VCC VSS VSS VSS VCC VCC VCC VCC VCC VCC
THERMTRI EDP_TXN[
H VCC CFG[14] CFG[15] CFG[4] CFG[3] BPM#[0] CATERR# P# 0]
EDP_TXP[2 EDP_TXP[1
G CFG[9] CFG[18] CFG[17] CFG[0] BPM#[3] PROC_TDO ] ]
PROC_TRS EDP_TXP[0
F VCC VSS CFG[11] CFG[7] CFG[1] BPM#[2] PECI T# ]
Figure 10-5. Y-Processor Ball Map (Top View, Lower-Middle, Columns 43-23)
43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
AG
AF VCCGT VCC VSS VCCG1 VSS VCCG1 VSS VCC VCCSA VCCSA VCCPLL_O VCCIO VCCIO VSS
C
AE VSS VCC VCC VCC VCC VCC VCC VCC VSS VCCSA VCCPLL_O VCCIO VCCIO VCCIO
C
AD
AC VCCGT VCC VSS VCCG0 VSS VCCG0 VSS VCC VCCSA VCCSA VSS VCCSTG VCCIO VCCIO
AB
AA VSS VCC VSS VCCG0 VSS VCCG0 VSS VCC VSS VCCSA VSS VCCSTG VSS VCCSRAM_
1P0
Y VCCGT VCC VSS VCCG0 VSS VCCG0 VSS VCC VCCSA VCCSA VSS VCCST VSS VCCCLK3
V VSS VCC VSS VCCG0 VSS VCCG0 VSS VCC VSS VCCSA VSS VCCST VSS VCCCLK3
T VCCGT VCC VSS VCCG0 VSS VCCG0 VSS VCC VCCSA VCCSA VCCPLL VCCSTG VSS VSS
R VSS VCC VSS VCCG0 VSS VCCG0 VSS VCC VSS VCCSA VCCPLL VCCSTG VSS VCCCLK5
P
VSSSA_SE
N VCC VCC VCC VCC VCC VCC VCCSA NSE VSS VSS
VCCSA_SE
M VCC VCC VCC VCC VCC VCC VCCSA RSVD RSVD RSVD
NSE
VCC_SENS VSS_SENS
L VCC VCC RSVD RSVD VCCSA RSVD RSVD RSVD
E E
K VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
PCIE7_TXP
DDI2_AUX CLKOUT_P- CLKOUT_P- CLKOUT_IT
J EDP_AUXN CSI2_DN3 CSI2_DN2 PCIE9_TXP / PCIE5_TXP
N CIE_N3 CIE_N2 PXDP_N SATA0_TXP
PCIE8_TXP
EDP_TXN[3 DDI1_AUX CLKOUT_P- CLKOUT_P- CLKOUT_P- CSI2_CLKN PCIE10_TX /
H CSI2_DP1 CSI2_DN0 PCIE6_TXP
] N CIE_N5 CIE_N4 CIE_N1 0 P SATA1A_TX
P
PCIE7_TXN
DDI2_AUX CLKOUT_P- CLKOUT_P- CLKOUT_IT
G EDP_AUXP CSI2_DP3 CSI2_DP2 PCIE9_TXN / PCIE5_TXN
P CIE_P3 CIE_P2 PXDP_P SATA0_TXN
PCIE8_TXN
EDP_TXP[3 DDI1_AUX CLKOUT_P- CLKOUT_P- CLKOUT_P- CSI2_CLKP PCIE10_TX /
F CSI2_DN1 CSI2_DP0 PCIE6_TXN
] P CIE_P5 CIE_P4 CIE_P1 0 N SATA1A_TX
N
E VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS
PCIE8_RXP
DDI2_TXP[ DDI2_TXP[ CSI2_CLKN CSI2_DN1 CSI2_CLKN PCIE10_RX /
D CSI2_DN8 CSI2_DN7 CSI2_DN4 PCIE6_RXP
3] 2] 3 0 1 P SATA1A_R
XP
PCIE7_RXN
DDI2_TXP[ CSI2_DN1 CSI2_CLKN /
C VSS CSI2_DN9 CSI2_DN5 CSI2_DN6 PCIE9_RXN PCIE5_RXN
0] 1 2 SATA0_RX
N
PCIE8_RXN
DDI2_TXN[ DDI2_TXN[ CSI2_CLKP CSI2_CLKP PCIE10_RX /
B CSI2_DP10 CSI2_DP8 CSI2_DP7 CSI2_DP4 PCIE6_RXN
3] 2] 3 1 N SATA1A_R
XN
PCIE7_RXP
DDI2_TXN[ EDP_DISP_ CSI2_CLKP
A CSI2_DP11 CSI2_DP9 CSI2_DP5 CSI2_DP6 PCIE9_RXP / PCIE5_RXP
0] UTIL 2 SATA0_RXP
Figure 10-6. Y-Processor Ball Map (Top View, Lower-Right, Columns 22-1)
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
GPP_C14 / GPP_C15 /
UART1_RT UART1_CT
GPP_C19 / GPP_C18 / GPP_C17 /
AB VSS S# / S# / VCCPGPPE
I2C1_SCL I2C1_SDA I2C0_SCL
ISH_UART ISH_UART
1_RTS# 1_CTS#
Y VCCCLK4 VCCCLK2 VCCCLK1 VSS VSS VSS VSS VSS VSS VSS VSS VSS
GPP_C2 /
GPP_C7 / GPP_C1 / GPP_C3 / VCCMPHYA
W GPP_D21 SMBALERT
SML1DATA # SMBDATA SML0CLK ON_1P0
GPP_D16 /
VCCAM- VCCAM- GPP_D20 / ISH_UART GPP_D19 /
GPP_D23 / VCCMPHYA
V VCCCLK4 VCCCLK2 VCCCLK1 PHYPLL_1P PHYPLL_1P VSS DMIC_DAT 0_CTS# / GPP_D22 DMIC_CLK
I2S_MCLK ON_1P0
0 0 A0 SML0BALE 0
RT#
GPP_D13 / GPP_D14 /
GPP_D17 / ISH_UART GPP_D18 / GPP_D15 / ISH_UART VCCMPHYG
U DMIC_CLK 0_RXD / DMIC_DAT ISH_UART 0_TXD / T_1P0
1 SML0BDAT A1 0_RTS# SML0BCLK
A
GPP_D7 / GPP_D8 /
VCCMPHYG VCCMPHYG VCCMPHYG
T VSS VCCCLK6 VSS VSS GPP_D12 ISH_I2C1_ GPP_D10 GPP_D11 ISH_I2C1_
T_1P0 T_1P0 T_1P0
SDA SCL
VCCAPLLE VCCAPLLE
R VCCCLK5 VCCCLK6 VSS RSVD VSS VSS VSS VSS VSS
BB_1P0 BB_1P0
GPP_E2 /
GPP_E9 / GPP_D4 /
SATAXPCIE USB2_CO
N VSS VSS VSS VSS VSS USB2_OC0 GPP_D2 GPP_D0 FLASHTRI
2/ MP
# G
SATAGP2
GPP_E10 / GPP_E15 /
GPP_E7 /
M RSVD RSVD RSVD RSVD USB2_OC1 DDPD_HP GPP_E22 VSS XTAL24_IN
CPU_GP1
# D2
GPP_E14 / GPP_E18 /
GPP_E6 / XTAL24_O
L RSVD RSVD RSVD RSVD VSS DDPC_HPD DDPB_C- GPP_E23
DEVSLP2 UT
1 TRLCLK
PCIE1_TXP GPP_E1 /
/ USB3_3_T USB3_1_T SATAXPCIE SYS_PWR
J PCIE3_TXP VSS VSS VSS VSS VSS
USB3_5_T XP XP 1/ OK
XP SATAGP1
PCIE1_TXN GPP_E0 /
/ USB3_3_T USB3_1_T SATAXPCIE
G PCIE3_TXN VSS
USB3_5_T XN XN 0/
XN SATAGP0
GPP_E3 /
E VSS VSS VSS VSS VSS CPU_GP0
PCIE2_RXP USB3_2_R
D PCIE4_RXP / USB3_4_R XP / CL_DATA VSS VSS VSS eDP_BKLE eDP_VDDE VSS
USB3_6_R XP N N
SSIC_RXP
XP
PCIE1_RX GPP_E13 /
PCIE3_RX N/ USB3_3_R USB3_1_R
C VSS DDPB_HPD
N USB3_5_R XN XN 0
XN
PCIE1_RXP
/ USB3_3_R USB3_1_R CSI2_COM PCIE_RCO GPP_E17 /
A PCIE3_RXP VSS VSS
USB3_5_R XP XP P MPN EDP_HPD
XP
DDR1_DQ[10] /
AH58 DDR1_DQ[10] DDR0_DQ[26] -7806.69 322.07
DDR0_DQ[26]
AH60 DDR0_DQ[1] -8299.45 322.07
AH62 DDR0_DQ[4] -8792.21 322.07
AH64 VDDQ -9310.37 322.07
AH7 RSVD 7806.69 322.07
AH9 GPP_G0 / SD_CMD 7313.93 322.07
AJ10 GPP_F16 / EMMC_DATA3 7067.55 644.14
AJ12 GPP_F19 / EMMC_DATA6 6574.79 644.14
AJ2 VCCPGPPC 9038.59 644.14
AJ4 USB2P_1 8545.83 644.14
AJ53 VCCGT -6574.79 644.14
DDR1_DQSP[1] /
AJ55 DDR1_DQSP[1] DDR0_DQSP[3] -7067.55 644.14
DDR0_DQSP[3]
DDR1_DQSN[1] /
AJ57 DDR1_DQSN[1] DDR0_DQSN[3] -7560.31 644.14
DDR0_DQSN[3]
AJ59 VSS -8053.07 644.14
AJ6 USB2N_1 8053.07 644.14
AJ61 DDR0_DQSN[0] -8545.83 644.14
AJ63 DDR0_DQSP[0] -9038.59 644.14
AJ8 GPP_F23 7560.31 644.14
AK1 VSS 9310.37 966.22
AK11 VSS 6821.17 966.22
AK13 VSS 6328.41 971.3
AK15 VSS 5846.1 924.29
AK16 VSS 5350.8 924.29
AK18 VCCPRIM_1P0 4855.5 924.29
AK19 VCCRTCPRIM_3P3 4360.2 924.29
AK21 VCCPRIM_3P3 3864.9 924.29
AK23 VCCSRAM_1P0 3369.6 924.29
AK24 VSS 2874.3 924.29
AK26 VCCIO 2379 924.29
AK27 VSS 1883.7 924.29
AK29 VCCSA 1388.4 924.29
AK3 VSS 8792.21 966.22
AK30 VCCSA 893.1 924.29
AK32 VCC 397.8 924.29
AK33 VSS -97.5 924.29
AK35 VCCG1 -592.8 924.29
AK36 VSS -1088.1 924.29
AK38 VCCG1 -1583.4 924.29
AK40 VSS -2078.7 924.29
AK41 VCC -2574 924.29
AK43 VCCGT -3069.3 924.29
DDR0_DQ[44] /
BC45 DDR0_DQ[44] DDR1_DQ[12] -3864.86 4805.43
DDR1_DQ[12]
BC47 VSS -4509.01 4805.43
DDR0_DQ[26] /
BC49 DDR0_DQ[26] DDR0_DQ[42] -5153.15 4805.43
DDR0_DQ[42]
BC5 GPP_B10 / SRCCLKREQ5# 8299.45 4831.08
DDR0_DQ[24] /
BC51 DDR0_DQ[24] DDR0_DQ[40] -5797.3 4805.43
DDR0_DQ[40]
DDR0_DQ[20] /
BC53 DDR0_DQ[20] DDR0_DQ[36] -6441.44 4805.43
DDR0_DQ[36]
DDR0_DQ[17] /
BC55 DDR0_DQ[17] DDR0_DQ[33] -7085.58 4805.43
DDR0_DQ[33]
BC58 DDR0_CKE[1] -7806.69 4831.08
BC60 DDR0_CKP[0] -8299.45 4831.08
BC62 DDR0_CKN[0] -8792.21 4831.08
BC64 DDR_RCOMP[2] -9310.37 4831.08
GPP_B11 /
BC7 7806.69 4831.08
EXT_PWR_GATE#
BC9 GPP_B12 / SLP_S0# 7313.93 4831.08
BD10 GPP_B7 / SRCCLKREQ2# 7067.55 5148.58
BD14 GPD1 / ACPRESENT 6119.37 5051.81
BD16 GPD0 / BATLOW# 5475.22 5051.81
BD18 RSVD 4831.08 5051.81
BD2 GPP_A19 / ISH_GP1 9038.59 5153.15
BD20 VSS 4186.94 5051.81
BD22 DDR1_DQSP[7] 3542.79 5051.81
BD24 DDR1_DQ[57] 2898.65 5051.81
BD26 DDR1_DQSN[6] 2254.5 5051.81
BD28 DDR1_DQ[49] 1610.36 5051.81
BD30 DDR1_PAR 966.22 5051.81
BD32 DDR1_CKN[1] 322.07 5051.81
BD34 DDR1_ALERT# -322.07 5051.81
DDR1_BA[1] /
BD36 DDR1_CAB[6]/ DDR1_BA[1] DDR1_CAB[6] DDR1_BA[1] -966.22 5051.81
DDR1_BA[1]
BD38 VSS -1610.36 5051.81
BD4 GPP_A23 / ISH_GP5 8545.83 5153.15
DDR0_DQSN[4] /
BD40 DDR0_DQSN[4] DDR1_DQSN[0] -2254.5 5051.81
DDR1_DQSN[0]
DDR0_DQ[37] /
BD42 DDR0_DQ[37] DDR1_DQ[5] -2898.65 5051.81
DDR1_DQ[5]
DDR0_DQSN[5] /
BD44 DDR0_DQSN[5] DDR1_DQSN[1] -3542.79 5051.81
DDR1_DQSN[1]
DDR0_DQ[41] /
BD46 DDR0_DQ[41] DDR1_DQ[9] -4186.94 5051.81
DDR1_DQ[9]
DDR0_DQ[31] /
BD48 DDR0_DQ[31] DDR0_DQ[47] -4831.08 5051.81
DDR0_DQ[47]
DDR0_DQSP[3] /
BD50 DDR0_DQSP[3] DDR0_DQSP[5] -5475.22 5051.81
DDR0_DQSP[5]
DDR0_DQ[22] /
BD52 DDR0_DQ[22] DDR0_DQ[38] -6119.37 5051.81
DDR0_DQ[38]
DDR0_DQSN[2] /
BD54 DDR0_DQSN[2] DDR0_DQSN[4] -6763.51 5051.81
DDR0_DQSN[4]
BD56 VSS -7407.66 5051.81
DDR0_MA[11] /
BD59 DDR0_CAA[7] / DDR0_MA[11] DDR0_CAA[7] DDR0_MA[11] -8133.08 5237.48
DDR0_MA[11]
BD6 GPP_B2 / VRALERT# 8053.07 5153.15
DDR0_MA[15] /
BD61 DDR0_CAA[8]/ DDR0_MA[15] DDR0_CAA[8] DDR0_ACT# -8545.83 5153.15
DDR0_ACT#
BD63 VSS -9038.59 5153.15
BD8 GPP_B3 / CPU_GP2 7560.31 5153.15
BE12 VSS 6441.44 5298.19
BE15 GPD2 / LAN_WAKE# 5797.3 5298.19
BE17 GPD6 / SLP_A# 5153.15 5298.19
BE19 RSVD 4509.01 5298.19
BE21 DDR1_DQ[63] 3864.86 5298.19
BE23 DDR1_DQ[60] 3220.72 5298.19
BE25 DDR1_DQ[54] 2576.58 5298.19
BE27 DDR1_DQ[53] 1932.43 5298.19
BE29 VSS 1288.29 5298.19
BE31 VSS 644.14 5298.19
BE33 VSS 0 5298.19
BE35 VSS -644.14 5298.19
DDR1_CAS#/
BE37 DDR1_CAB[1]/ DDR1_CAS# DDR1_CAB[1] DDR1_MA[15] -1288.29 5298.19
DDR1_MA[15]
DDR0_DQ[35] /
BE39 DDR0_DQ[35] DDR1_DQ[3] -1932.43 5298.19
DDR1_DQ[3]
DDR0_DQ[39] /
BE41 DDR0_DQ[39] DDR1_DQ[7] -2576.58 5298.19
DDR1_DQ[7]
DDR0_DQ[45] /
BE43 DDR0_DQ[45] DDR1_DQ[13] -3220.72 5298.19
DDR1_DQ[13]
DDR0_DQ[46] /
BE45 DDR0_DQ[46] DDR1_DQ[14] -3864.86 5298.19
DDR1_DQ[14]
BE47 VSS -4509.01 5298.19
DDR0_DQ[27] /
BE49 DDR0_DQ[27] DDR0_DQ[43] -5153.15 5298.19
DDR0_DQ[43]
DDR0_DQ[25] /
BE51 DDR0_DQ[25] DDR0_DQ[41] -5797.3 5298.19
DDR0_DQ[41]
DDR0_DQ[19] /
BE53 DDR0_DQ[19] DDR0_DQ[35] -6441.44 5298.19
DDR0_DQ[35]
DDR0_DQ[16] /
BE55 DDR0_DQ[16] DDR0_DQ[32] -7085.58 5298.19
DDR0_DQ[32]
BE57 DDR0_CKE[2] -7729.73 5298.19
Sx_EXIT_HOLDOFF# /
BJ4 GPP_A12 / BM_BUSY#/ 8451.85 6253.23
ISH_GP6
DDR0_DQ[58] /
BJ41 DDR0_DQ[58] DDR1_DQ[42] -2576.58 6283.71
DDR1_DQ[42]
DDR0_DQ[55] /
BJ43 DDR0_DQ[55] DDR1_DQ[39] -3220.72 6283.71
DDR1_DQ[39]
DDR0_DQ[54] /
BJ45 DDR0_DQ[54] DDR1_DQ[38] -3864.86 6283.71
DDR1_DQ[38]
BJ47 VSS -4509.01 6283.71
DDR1_DQ[27] /
BJ49 DDR1_DQ[27] DDR0_DQ[59] -5153.15 6283.71
DDR0_DQ[59]
DDR1_DQ[25] /
BJ51 DDR1_DQ[25] DDR0_DQ[57] -5797.3 6283.71
DDR0_DQ[57]
DDR1_DQ[18] /
BJ53 DDR1_DQ[18] DDR0_DQ[50] -6441.44 6283.71
DDR0_DQ[50]
DDR1_DQ[16] /
BJ55 DDR1_DQ[16] DDR0_DQ[48] -7085.58 6283.71
DDR0_DQ[48]
BJ57 DDR0_CS#[1] -7729.73 6283.71
GPP_A14 / SUS_STAT#/
BJ6 8022.59 6253.23
ESPI_RESET#
DDR0_WE#/
BJ61 DDR0_CAB[2]/ DDR0_WE# DDR0_CAB[2] DDR0_MA[14] -8451.85 6253.23
DDR0_MA[14]
BJ62 VSS -8881.11 6253.23
BJ64 DDR_RCOMP[1] -9310.37 6177.03
BJ8 GPP_A2 / LAD1 / ESPI_IO1 7593.33 6253.23
BK11 GPP_A1 / LAD0 / ESPI_IO0 6763.51 6530.09
BK14 I2S1_TXD 6119.37 6530.09
BK16 HDA_SDO / I2S0_TXD 5475.22 6530.09
BK18 HDA_BLK / I2S0_SCLK 4831.08 6530.09
BK20 VSS 4186.94 6530.09
DDR1_DQSP[5] /
BK22 DDR1_DQSP[5] DDR1_DQSP[3] 3542.79 6530.09
DDR1_DQSP[3]
DDR1_DQ[41] /
BK24 DDR1_DQ[41] DDR1_DQ[25] 2898.65 6530.09
DDR1_DQ[25]
DDR1_DQSN[4] /
BK26 DDR1_DQSN[4] DDR1_DQSN[2] 2254.5 6530.09
DDR1_DQSN[2]
DDR1_DQ[34] /
BK28 DDR1_DQ[34] DDR1_DQ[18] 1610.36 6530.09
DDR1_DQ[18]
DDR1_MA[5] /
BK30 DDR1_CAA[0] / DDR1_MA[5] DDR1_CAA[0] DDR1_MA[5] 966.22 6530.09
DDR1_MA[5]
BK32 DDR1_CKE[1] 322.07 6530.09
BK34 DDR1_MA[4] -322.07 6530.09
BK36 DDR1_CKN[0] -966.22 6530.09
BK38 VSS -1610.36 6530.09
DDR0_DQSP[7] /
BK40 DDR0_DQSP[7] DDR1_DQSP[5] -2254.5 6530.09
DDR1_DQSP[5]
DDR0_DQ[60] /
BK42 DDR0_DQ[60] DDR1_DQ[44] -2898.65 6530.09
DDR1_DQ[44]
DDR0_DQSN[6] /
BK44 DDR0_DQSN[6] DDR1_DQSN[4] -3542.79 6530.09
DDR1_DQSN[4]
DDR0_DQ[51] /
BK46 DDR0_DQ[51] DDR1_DQ[35] -4186.94 6530.09
DDR1_DQ[35]
DDR1_DQ[30] /
BK48 DDR1_DQ[30] DDR0_DQ[62] -4831.08 6530.09
DDR0_DQ[62]
DDR1_DQSN[3] /
BK50 DDR1_DQSN[3] DDR0_DQSN[7] -5475.22 6530.09
DDR0_DQSN[7]
DDR1_DQ[23] /
BK52 DDR1_DQ[23] DDR0_DQ[55] -6119.37 6530.09
DDR0_DQ[55]
DDR1_DQSP[2] /
BK54 DDR1_DQSP[2] DDR0_DQSP[6] -6763.51 6530.09
DDR0_DQSP[6]
BK56 VSS -7407.66 6530.09
DDR0_MA[13] /
BK59 DDR0_CAB[0] / DDR0_MA[13] DDR0_CAB[0] DDR0_MA[13] -8102.6 6453.89
DDR0_MA[13]
BL1 VSS 9310.37 6631.69
BL10 GPP_A0 / RCIN# 7085.58 6776.47
BL12 I2S1_SFRM 6441.44 6776.47
BL15 HDA_SDI0/ I2S0_RXD 5797.3 6776.47
BL17 HDA_SDI1 / I2S1_RXD 5153.15 6776.47
BL19 HDA_RST# /I2S1_SCLK 4509.01 6776.47
DDR1_DQ[47] /
BL21 DDR1_DQ[47] DDR1_DQ[31] 3864.86 6776.47
DDR1_DQ[31]
DDR1_DQ[44] /
BL23 DDR1_DQ[44] DDR1_DQ[28] 3220.72 6776.47
DDR1_DQ[28]
DDR1_DQ[35] /
BL25 DDR1_DQ[35] DDR1_DQ[19] 2576.58 6776.47
DDR1_DQ[19]
DDR1_DQ[37] /
BL27 DDR1_DQ[37] DDR1_DQ[21] 1932.43 6776.47
DDR1_DQ[21]
BL29 VSS 1288.29 6776.47
BL3 GPP_A21 / ISH_GP3 8881.11 6682.49
BL31 VSS 644.14 6776.47
BL33 VSS 0 6776.47
BL35 VSS -644.14 6776.47
DDR1_MA[8] /
BL37 DDR1_CAA[3] / DDR1_MA[8] DDR1_CAA[3] DDR1_MA[8] -1288.29 6776.47
DDR1_MA[8]
DDR0_DQ[62] /
BL39 DDR0_DQ[62] DDR1_DQ[46] -1932.43 6776.47
DDR1_DQ[46]
GPP_A17 / SD_PWR_EN# /
BL4 8451.85 6682.49
ISH_GP7
DDR0_DQ[61] /
BL41 DDR0_DQ[61] DDR1_DQ[45] -2576.58 6776.47
DDR1_DQ[45]
DDR0_DQ[50] /
BL43 DDR0_DQ[50] DDR1_DQ[34] -3220.72 6776.47
DDR1_DQ[34]
DDR0_DQ[53] /
BL45 DDR0_DQ[53] DDR1_DQ[37] -3864.86 6776.47
DDR1_DQ[37]
DDR1_DQ[31] /
BM48 DDR1_DQ[31] DDR0_DQ[63] -4831.08 7022.85
DDR0_DQ[63]
DDR1_DQSP[3] /
BM50 DDR1_DQSP[3] DDR0_DQSP[7] -5475.22 7022.85
DDR0_DQSP[7]
DDR1_DQ[22] /
BM52 DDR1_DQ[22] DDR0_DQ[54] -6119.37 7022.85
DDR0_DQ[54]
DDR1_DQSN[2] /
BM54 DDR1_DQSN[2] DDR0_DQSN[6] -6763.51 7022.85
DDR0_DQSN[6]
BM56 DDR0_PAR -7407.66 7022.85
DDR0_MA[10] /
BM59 DDR0_CAB[7]/ DDR0_MA[10] DDR0_CAB[7] DDR0_MA[10] -8098.79 6923.28
DDR0_MA[10]
BN1 TP4 9310.37 7086.35
BN10 SLP_SUS# 7085.58 7269.23
BN12 RTCRST# 6441.44 7269.23
BN15 DSW_PWROK 5797.3 7269.23
BN17 PROC_POPIRCOMP 5153.15 7269.23
BN19 RTCX1 4509.01 7269.23
DDR1_DQ[42] /
BN21 DDR1_DQ[42] DDR1_DQ[26] 3864.86 7269.23
DDR1_DQ[26]
DDR1_DQ[45] /
BN23 DDR1_DQ[45] DDR1_DQ[29] 3220.72 7269.23
DDR1_DQ[29]
DDR1_DQ[36] /
BN25 DDR1_DQ[36] DDR1_DQ[20] 2576.58 7269.23
DDR1_DQ[20]
DDR1_DQ[33] /
BN27 DDR1_DQ[33] DDR1_DQ[17] 1932.43 7269.23
DDR1_DQ[17]
BN29 VSS 1288.29 7269.23
BN3 RSVD 8881.11 7111.75
DDR1_MA[9] /
BN31 DDR1_CAA[1] / DDR1_MA[9] DDR1_CAA[1] DDR1_MA[9] 644.14 7269.23
DDR1_MA[9]
BN33 DDR1_CKE[0] 0 7269.23
DDR1_MA[14] /
BN35 DDR1_CAA[9]/ DDR1_MA[14] DDR1_CAA[9] DDR1_BG[1] -644.14 7269.23
DDR1_BG[1]
DDR1_BA[2] /
BN37 DDR1_CAA[5]/ DDR1_BA[2] DDR1_CAA[5] DDR1_BG[0] -1288.29 7269.23
DDR1_BG[0]
DDR0_DQ[59] /
BN39 DDR0_DQ[59] DDR1_DQ[43] -1932.43 7269.23
DDR1_DQ[43]
BN4 GPP_A16 / SD_1P8_SEL 8451.85 7111.75
DDR0_DQ[57] /
BN41 DDR0_DQ[57] DDR1_DQ[41] -2576.58 7269.23
DDR1_DQ[41]
DDR0_DQ[52] /
BN43 DDR0_DQ[52] DDR1_DQ[36] -3220.72 7269.23
DDR1_DQ[36]
DDR0_DQ[48] /
BN45 DDR0_DQ[48] DDR1_DQ[32] -3864.86 7269.23
DDR1_DQ[32]
BN47 DDR_VTT_CNTL -4509.01 7269.23
DDR1_DQ[28] /
BN49 DDR1_DQ[28] DDR0_DQ[60] -5153.15 7269.23
DDR0_DQ[60]
DDR1_DQ[29] /
BN51 DDR1_DQ[29] DDR0_DQ[61] -5797.3 7269.23
DDR0_DQ[61]
DDR1_DQ[21] /
BN53 DDR1_DQ[21] DDR0_DQ[53] -6441.44 7269.23
DDR0_DQ[53]
DDR1_DQ[20] /
BN55 DDR1_DQ[20] DDR0_DQ[52] -7085.58 7269.23
DDR0_DQ[52]
DDR0_MA[1] /
BN58 DDR0_CAB[8]/ DDR0_MA[1] DDR0_CAB[8] DDR0_MA[1] -7777.48 7178.04
DDR0_MA[1]
BN6 VSS 8022.59 7111.75
BN61 DDR0_ODT[0] -8451.85 7111.75
DDR0_BA[0] /
BN62 DDR0_CAB[4]/ DDR0_BA[0] DDR0_CAB[4] DDR0_BA[0] -8881.11 7111.75
DDR0_BA[0]
BN64 VDDQ -9310.37 7086.35
BN8 GPP_A6 / SERIRQ 7593.33 7111.75
BP1 VSS 9310.37 7541.01
BP11 SLP_LAN# 6763.51 7541.01
BP14 PCH_PWROK 6119.37 7541.01
BP16 PCH_OPIRCOMP 5475.22 7541.01
BP18 RTCX2 4831.08 7541.01
BP20 DRAM_RESET# 4186.94 7541.01
BP22 VSS 3542.79 7541.01
BP24 VDDQ 2898.65 7541.01
BP26 VDDQ 2254.5 7541.01
BP28 VSS 1610.36 7541.01
BP3 RSVD 8855.71 7541.01
BP30 VSS 966.22 7541.01
BP32 VDDQ 322.07 7541.01
BP34 VDDQ -322.07 7541.01
BP36 VSS -966.22 7541.01
BP38 VSS -1610.36 7541.01
BP40 VDDQ -2254.5 7541.01
BP42 VDDQ -2898.65 7541.01
BP44 VSS -3542.79 7541.01
BP46 VSS -4186.94 7541.01
BP48 VDDQ -4831.08 7541.01
BP5 GPP_A4 / LAD3 / ESPI_IO3 8401.05 7541.01
BP50 VDDQ -5475.22 7541.01
BP52 VSS -6119.37 7541.01
BP54 VSS -6763.51 7541.01
BP56 VDDQ -7407.66 7541.01
BP58 VDDQ -7946.39 7541.01
BP60 VSS -8401.05 7541.01
BP62 VSS -8855.71 7541.01
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