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Laboratory Assignment 2
The T-pipe and hollowed pin arrangement was initially set up as shown in figure below:
Due to symmetry, only half the assembly has been shown. In Figure 1, the hollowed pin
was just about to touch the T-pipe. Dimensions of the hollowed pin are as followed:
Table 1: Hollowed Pin Dimensions
The following Ansys inital setup have been modified to suit the model:
Table 2: Ansys configurations
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Mesh has been generated to achieve a more accurate result, which takes longer
calculation time however. Mesh setting (ASF on) have been shown below:
In addition to that shown in Figure 2, other configurations have also been established.
Contact settings for the T-pipe and hollowed pin have been set to frictionless as
illustrated below:
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A 3-load step has been set up for analysis settings as illustrated below:
The hollowed pin was set to be inserted by -900 (mm) along the z-axis into the hole.
Settings for this Displacement hav been shown as below:
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A fixed-support has been applied to the bottom face of the T-pipe as below:
Results of the analysis regarding von Mises stress have been shown in Figure 7 & 8:
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Figure 8: Von Mises Stress Detail
As shown in Figure 8, the maximum stress of 5612.7 (MPa) occurs at the bottom of
inner and outer radii of the hollowed pin.
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Figure 9: Reaction Forces Fixed Support Boundary Condition
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Figure 10: Reaction Forces T-pipe and Hollowed Pin Contact Surfaces
Results from Figure 9 and 10 shows that a force of 30585 (N) is required to fully insert
the hollowed pin into the T-pipe.
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Part 4: Thermal Analysis
A new model has been constructed which comprised of three seperate parts, i.e. an
aluminium alloy cylinder, symmetrical bases in which one was made of aluminium
alloy whilst the other was made of copper Alloy. Illustration of the model has been
shown in Figure below:
Three contact regions have been set up including contact between base (Al)-base (Cu),
base (Al)-cylinder (Al), base (Cu)-cylinder (Al). All of which have been defined as
Bonded contact. Illustration of connections have been shown in Figure 12, 13, & 14
respectively:
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Figure 12: Thermal Analysis Base(Cu)-Base(Al) Contact