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General Description
N channel vertical power MOSFET with charge pump, ground referenced CMOS compatible input and
diagnostic feedback, monolithically integrated in Smart SIPMOS technology.
Providing embedded protective functions
Applications
C compatible high-side power switch with diagnostic feedback for 12V and 24V grounded loads
All types of resistive, inductive and capacitve loads
Most suitable for loads with high inrush currents, so as lamps
Replaces electromechanical relays, fuses and discrete circuits
Basic Functions
Very low standby current
CMOS compatible input
Improved electromagnetic compatibility (EMC)
Fast demagnetization of inductive loads
Stable behaviour at undervoltage
Wide operating voltage range
Logic ground independent from load ground
Functional diagram
channel 1
IN2
control and protection circuit
ST2 equivalent to
channel 1
OUT2
1) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150
resistor for the GND connection is recommended.
2) RI = internal resistance of the load dump test pulse generator
3) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
4) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for Vbb
connection. PCB is vertical without blown air. See page 14
5) only for testing
Infineon Technologies AG 4 2003-Oct-01
BTS 5215L
Thermal Characteristics
Parameter and Conditions Symbol Values Unit
min typ max
Thermal resistance
junction - Case6) each channel: RthjC -- -- 5 K/W
junction ambient6) Rthja -- -- --
@ 6 cm2 cooling area one channel active: -- 45 --
all channels active: -- 40 --
Electrical Characteristics
Parameter and Conditions, each of the four channels Symbol Values Unit
at Tj = -40...+150C, Vbb = 12 V unless otherwise specified min typ max
6) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70m thick) copper area for Vbb
connection. PCB is vertical without blown air. See page 14
7) not subject to production test, specified by design
8) See timing diagram on page 12.
Infineon Technologies AG 5 2003-Oct-01
BTS 5215L
Parameter and Conditions, each of the four channels Symbol Values Unit
at Tj = -40...+150C, Vbb = 12 V unless otherwise specified min typ max
Operating Parameters
Operating voltage Vbb(on) 5.5 -- 40 V
Undervoltage switch off9) Tj =-40C...25C: Vbb(u so) -- -- 4.5 V
Tj =125C: -- -- 4.510)
Overvoltage protection11) Vbb(AZ) 41 47 52 V
I bb = 40 mA
Standby current12) Tj =-40C...25C: Ibb(off) -- 4.5 10 A
VIN = 0; see diagram page 11 Tj =150C: -- -- 15
Tj =125C: -- -- 1010)
Off-State output current (included in Ibb(off)) IL(off) -- 1 5 A
VIN = 0; each channel
Operating current 13), VIN = 5V,
one channel on: IGND -- 0.6 1.2 mA
all channels on: -- 1.2 2.4
Protection Functions14)
Current limit, Vout = 0V, (see timing diagrams, page 12)
Tj =-40C: IL(lim) -- -- 23 A
Tj =25C: -- 15
Tj =+150C: 9 -- ----
Repetitive short circuit current limit,
Tj = Tjt each channel IL(SCr) -- 12 -- A
two channels -- 12 --
(see timing diagrams, page 12)
Initial short circuit shutdown time Tj,start =25C: toff(SC) -- 2 -- ms
Vout = 0V (see timing diagrams on page 12)
Output clamp (inductive load switch off)15) VON(CL) 41 47 52 V
at VON(CL) = Vbb - VOUT, IL= 40 mA
Thermal overload trip temperature Tjt 150 -- -- C
Thermal hysteresis Tjt -- 10 -- K
9) is the voltage, where the device doesnt change its switching condition for 15ms after the supply voltage
falling below the lower limit of Vbb(on)
10) not subject to production test, specified by design
11) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins (a 150
resistor for the GND connection is recommended). See also VON(CL) in table of protection functions and
circuit diagram on page 9.
12) Measured with load; for the whole device; all channels off
13) Add IST, if IST > 0
14 Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not
designed for continuous repetitive operation.
15) If channels are connected in parallel, output clamp is usually accomplished by the channel with the lowest
VON(CL)
Infineon Technologies AG 6 2003-Oct-01
BTS 5215L
Parameter and Conditions, each of the four channels Symbol Values Unit
at Tj = -40...+150C, Vbb = 12 V unless otherwise specified min typ max
Reverse Battery
Reverse battery voltage 16) -Vbb -- -- 32 V
Drain-source diode voltage (Vout > Vbb) -VON -- 600 -- mV
IL = - 2.0 A, Tj = +150C
Diagnostic Characteristics
Open load detection voltage V OUT(OL) 1 1.7 2.8 4.0 V
16) Requires a 150 resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Power dissipation is higher compared to normal operating
conditions due to the voltage drop across the drain-source diode. The temperature protection is not active
during reverse current operation! Input and Status currents have to be limited (see max. ratings page 4 and
circuit page 9).
17) If ground resistors R
GND are used, add the voltage drop across these resistors.
18) not subject to production test, specified by design
Truth Table
( each channel )
IN OUT ST
Normal operation L L H
H H H
Open load L Z L19)
H H H
Overtemperature L L H
H L L
L = "Low" Level X = don't care Z = high impedance, potential depends on external circuit
H = "High" Level Status signal valid after the time delay shown in the timing diagrams
Parallel switching of channel 1 and 2 is easily possible by connecting the inputs and outputs in parallel (see truth
table). If switching channel 1 to 2 in parallel, the status outputs ST1 and ST2 have to be configured as a 'Wired
OR' function with a single pull-up resistor.
Terms
Ibb
12,6 V
Leadframe ON1
V V
bb I IN1 ON2
Vbb
2 I L1
IN1 10
I IN2 OUT1
4 PROFET
IN2 I L2
I ST1 3 8
ST1 OUT2
VIN1 V IN2 I ST2 5
ST2 GND
V
V OUT1
ST1 V ST2 1
I V
GND OUT2
R
GND
Input circuit (ESD protection), IN1 or IN2 Overvolt. and reverse batt. protection
+ 5V
+ Vbb
R
I R ST
IN V
Z2
RI
IN
ESD-ZD I
I Logic
I
GND R ST ST OUT
V
Z1
R
EXT
Inductive and overvoltage output clamp, OFF
OUT1 or OUT2
V
OUT
+Vbb
V ON
Signal GND
OUT
GND disconnect
Power GND
PROFET OUT
ST
GND
V V V V
bb IN ST GND
Vbb E AS
IN
ELoad
PROFET OUT
Vbb
IN
ST
GND
PROFET OUT
= L
ST
{
EL
V V V GND
V IN ST GND
bb ZL
ER
R
Any kind of load. If VGND > VIN - VIN(T+) device stays off L
Due to VGND > 0, no VST = low signal available.
Energy stored in load inductance:
2
Vbb disconnect with energized inductive EL = 1/2LI L
load While demagnetizing load inductance, the energy
dissipated in PROFET is
EAS= Ebb + EL - ER= VON(CL)iL(t) dt,
high Vbb
IN
with an approximate solution for RL > 0 :
PROFET OUT IL L ILRL
EAS= (V + |VOUT(CL)|)
2RL bb
ln (1+ |V )
ST OUT(CL)|
GND
100
10
1
1 2 3 4 5 6
IL [A]
RON [mOhm]
Tj = 150C
160
120
80 25C
-40C
40
0
5 7 9 11 30 40
Vbb [V]
Ibb(off) [A]
45
40
35
30
25
20
15
10
0
-50 0 50 100 150 200
Tj [C]
Timing diagrams
All channels are symmetric and consequently the diagrams are valid for channel 1 to
channel 4
V bb ST
V
OUT1
V
OUT
V
OUT2
VOUT I
L1
90% I
L(lim)
t on dV/dtoff
I
L(SCr)
dV/dton t
off
10%
t
off(SC)
ST
IL
t
I +I
L1 L2 VOUT1
2xIL(lim)
I L1
I
L(SCr)
ST
t
off(SC)
ST1/2
10s 500s
IN1
IN
ST
ST
30s 20s
V
OUT
T
J
A B
2.6 max.
2.35 0.1
8 8
0.25 +0.075
(1.55)
-0.035
2)
Attention please!
0 +0.1
5 3
The information herein is given to describe certain
0.8
Warnings
Due to technical requirements components may contain
dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies
Printed circuit board (FR4, 1.5mm thick, one layer
Office.
70m, 6cm2 active heatsink area) as a reference for
max. power dissipation Ptot, nominal load current Infineon Technologies Components may only be used in life-
IL(NOM) and thermal resistance Rthja support devices or systems with the express written approval
of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-
support device or system, or to affect the safety or
effectiveness of that device or system. Life support devices
or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect
human life. If they fail, it is reasonable to assume that the
health of the user or other persons may be endangered.