Code No: 117EX Set No.

1
JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY HYDERABAD
IV B.Tech. I Sem., I Mid-Term Examinations, September-2017
MEMS NEMS DESIGN AND APPLICATIONS
Objective Exam
Name: ______________________________ Hall Ticket No. A
Answer All Questions. All Questions Carry Equal Marks. Time: 20 Min. Marks: 10.

I. Choose the correct alternative:

1. Pure and single crystal silicon
a) Exists in nature b) Is grown from special processes
c) Is made by electrolysis d) Cannot be prepared [ ]

2. Ion implantation is implanting foreign substances by

a) Melting b) Insertion by force c) Slow diffusion d) hand [ ]

3. Epitaxy involves the growth of

a) Single crystal films b) Organic films
c) Metallic films over a substrate made of the same material d) cleaning [ ]

4. The geometric aspect ratio in MEMS structures is defined as the ratio of dimensions in
a) Depth to surface b) Surface to depth
c) Width to length d) Length to width [ ]

5. The largest market share of MEMS products currently belongs to

a) Microfluidics b) Microsensors
c) Microaccelerometers d) microgears [ ]

6. Photolithography is used in microfabrication because

a) We need to take a photograph of the microdevice
b) To create patterns in microsclae on substrates
c) To create pictures in microscale
d) Give strength to pattern [ ]

7. Microsystem packaging needs to be considered in every stage of design to ensure

a) Low packaging costs b) High consumer demand
c) Acceptable product appearance d) Better design [ ]

8. For closely spaced microstructural components, the force that causes most problem is
a) Thermal force b) Electrostatic force
c) Vander walls force d) Hydraulic force [ ]

9. Microshells can be created by

a) Bulk micromanufacturing b) Surface micromanufacturing
c) LIGA process d) etching [ ]

10. Packages for bioMEMS must be

a) Inert to biological attack of human systems b) Inert to the body temperature
c) Inert to mishandling by the user d) Chemically inert [ ]
Cont..2
Code No:117EX :2: Set No. 1

II Fill in the Blanks

11. Any measuring device that contain a biological element is known as----------------------

12. ------------ material is suitable for the nanotechnology based products.

13. ------------ is considered as removal of selective materials from the wafer.

14. If structuring is performed on the thin film the process is called --------------- micromachining.

15. The impure materials added to the material of interest in doping are known as ---------

16. Integration of Microsystems and microelectronics on a chip is known as -------------

17. The parts of Microsystems that are obviously vulnerable to creep failure are --------

18. A sublayer in MEMS is known as ----------

19. The primary objective of three-dimensional microsystems packaging is to achieve volumetric

efficiency.(True / False)

20. One major problem in microsystem assembly is lack of ------------

-oOo-
Code No: 117EX Set No. 2
JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY HYDERABAD
IV B.Tech. I Sem., I Mid-Term Examinations, September-2017
MEMS NEMS DESIGN AND APPLICATIONS
Objective Exam
Name: ______________________________ Hall Ticket No. A
Answer All Questions. All Questions Carry Equal Marks. Time: 20 Min. Marks: 10.

I. Choose the correct alternative:

1. The geometric aspect ratio in MEMS structures is defined as the ratio of dimensions in
a) Depth to surface b) Surface to depth
c) Width to length d) Length to width [ ]

2. The largest market share of MEMS products currently belongs to

a) Microfluidics b) Microsensors
c) Microaccelerometers d) microgears [ ]

3. Photolithography is used in microfabrication because

a) We need to take a photograph of the microdevice
b) To create patterns in microsclae on substrates
c) To create pictures in microscale
d) Give strength to pattern [ ]

4. Microsystem packaging needs to be considered in every stage of design to ensure

a) Low packaging costs b) High consumer demand
c) Acceptable product appearance d) Better design [ ]

5. For closely spaced microstructural components, the force that causes most problem is
a) Thermal force b) Electrostatic force
c) Vander walls force d) Hydraulic force [ ]

6. Microshells can be created by

a) Bulk micromanufacturing b) Surface micromanufacturing
c) LIGA process d) etching [ ]

7. Packages for bioMEMS must be

a) Inert to biological attack of human systems b) Inert to the body temperature
c) Inert to mishandling by the user d) Chemically inert [ ]

8. Pure and single crystal silicon

a) Exists in nature b) Is grown from special processes
c) Is made by electrolysis d) Cannot be prepared [ ]

9. Ion implantation is implanting foreign substances by

a) Melting b) Insertion by force c) Slow diffusion d) hand [ ]

10. Epitaxy involves the growth of

a) Single crystal films b) Organic films
c) Metallic films over a substrate made of the same material d) cleaning [ ]

Cont..2
Code No: 117EX :2: Set No. 2

II Fill in the Blanks

11. If structuring is performed on the thin film the process is called --------------- micromachining.

12. The impure materials added to the material of interest in doping are known as ---------

13. Integration of Microsystems and microelectronics on a chip is known as -------------

14. The parts of Microsystems that are obviously vulnerable to creep failure are --------

15. A sublayer in MEMS is known as ----------

16. The primary objective of three-dimensional microsystems packaging is to achieve volumetric

efficiency.(True / False)

17. One major problem in microsystem assembly is lack of ------------

18. Any measuring device that contain a biological element is known as----------------------

19. ------------ material is suitable for the nanotechnology based products.

20. ------------ is considered as removal of selective materials from the wafer.

-oOo-
Code No: 117EX Set No. 3
JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY HYDERABAD
IV B.Tech. I Sem., I Mid-Term Examinations, September-2017
MEMS NEMS DESIGN AND APPLICATIONS
Objective Exam
Name: ______________________________ Hall Ticket No. A
Answer All Questions. All Questions Carry Equal Marks. Time: 20 Min. Marks: 10.

I. Choose the correct alternative:

1. Photolithography is used in microfabrication because

a) We need to take a photograph of the microdevice
b) To create patterns in microsclae on substrates
c) To create pictures in microscale
d) Give strength to pattern [ ]

2. Microsystem packaging needs to be considered in every stage of design to ensure

a) Low packaging costs b) High consumer demand
c) Acceptable product appearance d) Better design [ ]

3. For closely spaced microstructural components, the force that causes most problem is
a) Thermal force b) Electrostatic force
c) Vander walls force d) Hydraulic force [ ]

4. Microshells can be created by

a) Bulk micromanufacturing b) Surface micromanufacturing
c) LIGA process d) etching [ ]

5. Packages for bioMEMS must be

a) Inert to biological attack of human systems b) Inert to the body temperature
c) Inert to mishandling by the user d) Chemically inert [ ]

6. Pure and single crystal silicon

a) Exists in nature b) Is grown from special processes
c) Is made by electrolysis d) Cannot be prepared [ ]

7. Ion implantation is implanting foreign substances by

a) Melting b) Insertion by force c) Slow diffusion d) hand [ ]

8. Epitaxy involves the growth of

a) Single crystal films b) Organic films
c) Metallic films over a substrate made of the same material d) cleaning [ ]

9. The geometric aspect ratio in MEMS structures is defined as the ratio of dimensions in
a) Depth to surface b) Surface to depth
c) Width to length d) Length to width [ ]

10. The largest market share of MEMS products currently belongs to

a) Microfluidics b) Microsensors
c) Microaccelerometers d) microgears [ ]

Cont..2
Code No: 117EX :2: Set No. 3

II Fill in the Blanks

11. Integration of Microsystems and microelectronics on a chip is known as -------------

12. The parts of Microsystems that are obviously vulnerable to creep failure are --------

13. A sublayer in MEMS is known as ----------

14. The primary objective of three-dimensional microsystems packaging is to achieve volumetric

efficiency.(True / False)

15. One major problem in microsystem assembly is lack of ------------

16. Any measuring device that contain a biological element is known as----------------------

17. ------------ material is suitable for the nanotechnology based products.

18. ------------ is considered as removal of selective materials from the wafer.

19. If structuring is performed on the thin film the process is called --------------- micromachining.

20. The impure materials added to the material of interest in doping are known as ---------

-oOo-
Code No: 117EX Set No. 4
JAWAHARLAL NEHRU TECHNOLOGICAL UNIVERSITY HYDERABAD
IV B.Tech. I Sem., I Mid-Term Examinations, September-2017
MEMS NEMS DESIGN AND APPLICATIONS
Objective Exam
Name: ______________________________ Hall Ticket No. A
Answer All Questions. All Questions Carry Equal Marks. Time: 20 Min. Marks: 10.

I. Choose the correct alternative:

1. For closely spaced microstructural components, the force that causes most problem is
a) Thermal force b) Electrostatic force
c) Vander walls force d) Hydraulic force [ ]

2. Microshells can be created by

a) Bulk micromanufacturing b) Surface micromanufacturing
c) LIGA process d) etching [ ]

3. Packages for bioMEMS must be

a) Inert to biological attack of human systems b) Inert to the body temperature
c) Inert to mishandling by the user d) Chemically inert [ ]

4. Pure and single crystal silicon

a) Exists in nature b) Is grown from special processes
c) Is made by electrolysis d) Cannot be prepared [ ]

5. Ion implantation is implanting foreign substances by

a) Melting b) Insertion by force c) Slow diffusion d) hand [ ]

6. Epitaxy involves the growth of

a) Single crystal films b) Organic films
c) Metallic films over a substrate made of the same material d) cleaning [ ]

7. The geometric aspect ratio in MEMS structures is defined as the ratio of dimensions in
a) Depth to surface b) Surface to depth
c) Width to length d) Length to width [ ]

8. The largest market share of MEMS products currently belongs to

a) Microfluidics b) Microsensors
c) Microaccelerometers d) microgears [ ]

9. Photolithography is used in microfabrication because

a) We need to take a photograph of the microdevice
b) To create patterns in microsclae on substrates
c) To create pictures in microscale
d) Give strength to pattern [ ]

10. Microsystem packaging needs to be considered in every stage of design to ensure

a) Low packaging costs b) High consumer demand
c) Acceptable product appearance d) Better design [ ]

Cont..2
Code No: 117EX :2: Set No. 4

II Fill in the Blanks

11. A sublayer in MEMS is known as ----------

12. The primary objective of three-dimensional microsystems packaging is to achieve volumetric

efficiency.(True / False)

13. One major problem in microsystem assembly is lack of ------------

14. Any measuring device that contain a biological element is known as----------------------

15. ------------ material is suitable for the nanotechnology based products.

16. ------------ is considered as removal of selective materials from the wafer.

17. If structuring is performed on the thin film the process is called --------------- micromachining.

18. The impure materials added to the material of interest in doping are known as ---------

19. Integration of Microsystems and microelectronics on a chip is known as -------------

20. The parts of Microsystems that are obviously vulnerable to creep failure are --------

-oOo-