A

DATA SHEET
SKY65146: 3.5 V Broadband MCM Power Amplifier

806–849 MHz
Applications Functional Block Diagram

● iDEN® (806–825 MHz) CMOS
● TETRA (806–825 MHz) Controller
● TDMA (824–849 MHz)
● AMPS (824–849 MHz)
● Wireless Local Loop (WLL)
50 Ω 50 Ω
Features
● Low voltage positive bias supply (3.5 V) Block Diagram
● High gain 39 dB, high power: PSAT 35.6 dBm VD4 VD2
VD3
● High efficiency: PAE 51% (28) (8) (22)
● Good linearity
VREG CMOS
● Dual mode operation (1) CONTROLLER
CIRCUIT
● Large dynamic range

● 28-pin LCC package (10 x 13.97 x 1.45 mm)
RF IN INTER INTER RF OUT
INPUT OUTPUT
● Power down control (5)
MATCH
PA 1 STAGE
MATCH 1
PA 2 STAGE
MATCH 2 MATCH
(15)
● Available on tape and reel GaAs HBT IC

OUTPUT
STAGE
● Available lead (Pb)-free and RoHS-compliant MODULE
Description
The SKY65146 is a fully matched 28-pin surface mount multi-chip No external supply side switch is needed as typical “off” leakage
module (MCM) amplifier designed for Private Mobile Radio, is a few microamperes with full primary voltage supplied from
Wireless Local Loop, and TDMA/AMPS mobile units operating in the the battery.
806-849 MHz cellular bandwidth. Microwave Monolithic Integrated The ICs are manufactured on an advanced InGaP HBT process and
Circuits (MMICs), comprised of Gallium Arsenide (GaAs) and on a silicon CMOS process, providing for all positive voltage DC
Si CMOS, contain all active circuitry in the module, which includes supply operation while maintaining high efficiency and good linearity.
on-board bias circuitry as well as input and interstage matching
The module can operate over the temperature range of -40 ˚C to
circuits. The input and output match is realized off-chip within the
85 ˚C. A populated evaluation board is available upon request.
mance (P3 dB_SAT ≅ 35.6 dBm) into a 50 Ω load.
module package to optimize efficiency and high power perfor-
Primary bias to the SKY65146 can be supplied directly from a NEW Skyworks offers lead (Pb)-free, RoHS (Restriction of
single cell lithium-ion or other suitable battery with a nominal Hazardous Substances)-compliant packaging.
output of 3.5 V.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200810 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • January 25, 2008 1
DATA SHEET • SKY65146
Electrical Specifications
VCC (VD) = 3.5 V, VREG = 2.75 V, Frequency = 815 MHz, TC = 25 °C, unless otherwise specified.
Parameter Symbol Condition Min. Typ. Max. Unit
Gain lS21l Small signal 38.7 dB
Power gain Gp PO = 29 dBm 35.5 38.7 40 dB
Input return loss lS11l Small signal 12 17 dB
Saturated output power P3 dB SAT Gain Comp < 3 dB 35.1 35.6 dBm
Power added efficiency PAE PO = P3 dB SAT 47 51 %
Current @ PSAT ICC SAT PO = P3 dB SAT 2 A
Quiescent current ICC No RF signal 270 329 370 mA
Harmonic Levels 2FO PO < P3 dB SAT -37 dBc

3FO PO < P3 dB SAT -60 dBc
4FO PO < P3 dB SAT -80 dBc
Noise power in Rx band RxBN PO < 29 dBm -85 dBm/Hz

FC + 30 MHz, BW = 18 kHz
Noise figure NF CW 6.8 8 dB

Stability (spurious output) S Output VSWR = 10:1 -36 dBm
Ruggedness - no damage Ru PO < 29 dBm 15:1 VSWR
Recommended Operating Conditions

Parameter Symbol Conditions Min. Typ. Max. Unit
Supply voltage VCC 3 3.5 4.4 V
Regulation voltage VREG 2.65 2.75 2.85 V
Operating frequency FO 806 815.5 825 MHz
Continuous RMS output power PoRMS 29 31 dBm
Operating temperature TC -40 +25 +85 °C
2 January 25, 2008 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200810 Rev. A
Typical Performance Data

-40 °C 25 °C 85 °C 3.0 V -3.5 V 4.0 V 4.5 V
42 42
40
40
Gain (dB)
Gain (dB)
38
38
36
36 34
805 810 815 820 825 -40 -15 10 35 60 85
Frequency (MHz) Temperature (°C )
Gain vs. Frequency Across Temperature Gain vs. Temperature Across Voltage
-40 °C 25 °C 85 °C 806 MHz 815.5 MHz 825 MHz

43 41
41
39
Gain (dB)
Gain (dB)
39
37
37
35
35
33 33
25 27 29 31 33 35 37 22 25 28 31 34 37
POUT (dBm) POUT (dBm)
Gain vs. POUT Across Temperature Gain vs. POUT Across Frequency
3.0 V -3.5 V 4.0 V 4.5 V -40 °C 25 °C 85 °C

42 -15
-16
39
-17
lS11l (dB)
Gain (dB)
36
-18
33
-19
30 -20
23 26 29 32 35 805 810 815 820 825
POUT (dBm) Frequency (MHz)
Gain vs. POUT Across VCC lS11l vs. Frequency Across Temperature

-40 °C 25 °C 85 °C 806 MHz 815.5 MHz 825 MHz
2.4 2.3
1.9
1.7
ICC (A)
ICC (A)
1.4
1.1
0.9
0.4 0.5
21 24 27 30 33 36 22 25 28 31 34 37
ICC vs. POUT Across Temperature ICC vs. POUT Across Frequency
3.0 V 3.5 V 4.0 V 4.5 V 3.0 V 3.5 V 4.0 V 4.5 V

2.5 0.43
2.0
0.38
ICC (A)
IQ (A)
1.5
0.33
1.0
0.5 0.28
23 26 29 32 35 38 -40 -15 10 35 60 85
POUT (dBm) Temperature (°C)
ICC vs. POUT Across VCC IQ vs. Temperature Across Voltage
-40 °C 25 °C 85 °C 3.0 V 3.5 V 4.0 V 4.5 V

8 8
7 7
NF (dB)
NF (dB)
6 6
5 5
805 810 815 820 825 -40 -15 10 35 60 85
Frequency (MHz) Temperature (°C)
NF vs. Frequency Across Temperature NF vs. Temperature Across Voltage

806 MHz 815.5 MHz 825 MHz -40 °C 25 °C 85 °C
56 58
47 48
38 38
PAE (%)
PAE (%)
29 28
20 18
11 8
22 25 28 31 34 37 21 25 29 33 37
PAE vs. POUT Across Frequency PAE vs. POUT Across Temperature
-10 dBm -9.5 dBm -9 dBm

3.0 V 3.5 V 4.0 V 4.5 V -8.5 dBm -8 dBm
56 44
44 42
2nd Harmonics (dB)
PAE (%)
40
32
38
20
36
8
23 26 29 32 35 38 34
-40 -15 10 35 60 85
POUT (dBm) Temperature (°C)
PAE vs. POUT Across VCC 2nd Harmonics vs. Temperature Across PIN
-10 dBm -9.5 dBm -9 dBm -10 dBm -9.5 dBm -9 dBm
-8.5 dBm -8 dBm -8.5 dBm -8 dBm
52 44
49
42
2nd Harmonics (dB)
2nd Harmonics (dB)
46
40
43
38
40
36
37
34 34
3.00 3.25 3.50 3.75 4.00 4.25 4.50 805 810 815 820 825
Voltage (V) Frequency (MHz)
2nd Harmonics vs. Voltage Across PIN 2nd Harmonics vs. Frequency Across PIN

-8.5 dBm -8 dBm -8.5 dBm -8 dBm
61 61
60
60
3rd Harmonics (dB)
3rd Harmonics (dB)

59
59
58
58
57
57
56
-40 -15 10 35 60 85 805 810 815 820 825
Temperature ( C ) Frequency (MHz)
3rd Harmonics vs. Temperature Across PIN 3rd Harmonics vs. Frequency Across PIN
-8.5 dBm -8 dBm -8.5 dBm -8 dBm
62 84
82
61
3rd Harmonics (dB)
4th Harmonics (dB)
80
60
78
59
76
58 74
3.00 3.25 3.50 3.75 4.00 4.25 4.50 -40 -15 10 35 60 85
Voltage (V) Temperature (°C)
3rd Harmonics vs. Voltage Across PIN 4th Harmonics vs. Temperature Across PIN
-8.5 dBm -8 dBm -8.5 dBm -8 dBm
83 82
81
4th Harmonics (dB)
4th Harmonics (dB)
80
79
78
77
75 76
805 810 815 820 825 3.00 3.25 3.50 3.75 4.00 4.25 4.50
Frequency (MHz) Voltage (V)
4th Harmonics vs. Frequency Across PIN 4th Harmonics vs. Voltage Across PIN
Application Circuit Notes Package and Handling Information

Center Ground. It is extremely important that the device paddle Since the device package is sensitive to moisture absorption, it is
be sufficiently grounded for both thermal and stability reasons. baked and vacuum packed before shipping. Instructions on the
Multiple small vias are acceptable and will work well under the shipping container label regarding exposure to moisture after the
device if solder migration is an issue. container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is sub-
VD2 (Pin 1). Supply voltage for output (final) stage collector bias
jected to high temperature during solder assembly.
(typically 3.5 V). Bypassing of VD3 is accomplished with C2 and
C3 and should be placed in the approximate location shown on Please refer to Skyworks’ solder reflow application note, available
the Evaluation Board, but placement is not critical. at www.skyworksinc.com, for instructions on mounting the
SKY65146 to a printed circuit board.
Ground (Pins 2, 3, 6, 11, 13, 16, 19, 20, 23–28).
Attach all ground pins to the RF ground plane with the largest Production quantities of this product are shipped in a standard
diameter and lowest inductance via that the layout will allow. tape and reel format. For packaging details, refer to the Skyworks
Multiple small vias are also acceptable and will work well under Application Note, Tape and Reel, document number 101568.
the device if solder migration is an issue.
No Connect (Pins 4, 5, 9, 10, 14, 17, 18, 21). The pins are open
Electrostatic Discharge (ESD) Sensitivity
and may or may not be connected to ground.
The SKY65146 is a static-sensitive electronic device. Do not
VD4 (Pin 7). Supply voltage for base bias circuitry to all stages operate or store near strong electrostatic fields. Take proper ESD
(typically 3.5 V). Bypassing of VD3 is accomplished with C1 which precautions.
should be placed in the approximate location shown on the
Evaluation Board, but placement is not critical.
Theory of Operation
VREG (Pin 8). VREG is the regulated bias enable control voltage to
the silicon CMOS controller, 0.0 V = Off, 2.75 V = On. Nominal The SKY65146 is a fully matched 3-stage GaAs HBT power
“On” operating range is between 2.65 VDC and 2.85 VDC. VREG set amplifier module consisting of on-chip interstage matching cir-
to 0 VDC will force the amplifier into standby mode. cuits and bias circuitry. The input and output match is realized
off-chip, but within the module package. The amplifier employs
RF_IN (Pin 12). Amplifier RF Input Pin. ZO = 50 Ω. The module series feedback on the first and second stages to provide for high
includes an onboard internal DC blocking capacitor. All imped- gain and stability and power of up to 4 W.
ance matching is provided internal to the module.
The module includes a silicon CMOS controller circuit to provide
VD3 (Pin 15). Supply voltage for driver collector bias (typically a regulated bias enable control, VREG (0–2.75 V) for amplifier
3.5V). Bypassing of VD3 is accomplished with C4 and C5 which On/Off operation. In off operation, supply current is a few
should be placed in the approximate location shown on the microamperes with VREG = 0 V. The module operates with all
Evaluation Board, but placement is not critical. positive DC voltages while maintaining high efficiency and good
RF_OUT (Pin 22). Amplifier RF Output Pin. ZO = 50 Ω. The linearity. The nominal operating voltage is 3.5 V for maximum
module includes an onboard internal DC blocking capacitor. All power, but can be operated at slightly lower voltages for other
impedance matching is provided internally to the module. mobile applications.
Application Circuit
VD2
C2 C3
10 F 1000 pF
VD4
C1
10 F NC NC
7 6 5 4 3 2 1
VREG 8 28
NC 9 27
NC 10 26
11 SKY65146 25
RF_IN 12 24
50 Ω
13 23
NC 14 22 RF_OUT
50 Ω
15 16 17 18 19 20 21
VD3 NC NC NC
C4 C5
10 F 1000 pF
Pin Assignments Pin Out
GND
GND
GND
Pin Pin Name Description
VD4
VD2
NC
NC
Supply voltage for output (final) stage collector 7 6 5 4 3 2 1
1 VD2
bias (typically 3.5 V) VREG 8 28 GND
2 GND Low inductance ground connection NC 9 27 GND
3 GND Low inductance ground connection NC 10 26 GND
4 N/C No connect GND 11 25 GND
5 N/C No connect RFIN 12 24 GND
6 GND Low inductance ground connection GND 13 23 GND
Supply voltage for base bias circuitry to all stages NC 14 22 RFOUT

7 VD4 15 16 17 18 10 20 21
(typically 3.5 V)
VD3
GND
NC
NC
GND
GND
NC
Regulated bias enable control voltage,
8 VREG
0.0 = Off, 2.75 V = On
9 N/C No connect
Absolute Maximum Ratings
10 N/C No connect
11 GND Low inductance ground connection Characteristic Value
12 RFIN 806–928 MHz RF input signal 50 Ω RF input power 11 dBm

Supply voltage (VCC & VREF) 6.9 V(1)
13 GND Low inductance ground connection
Supply voltage (VCC & VREF) VCC V (2)
14 N/C No connect
Operating temperature -40 °C to +85 °C
Supply voltage for driver collector bias
15 VD3 Storage temperature -55 °C to +125 °C
(typically 3.5 V)
1.When amplifier is biased off (VREG = 0 V).
16 GND Low inductance ground connection 2. Voltage on VREG pin may not exceed the applied VCC voltage.
17 N/C No connect Performance is guaranteed only under the conditions listed in the specifications table and is
not guaranteed under the full range(s) described by the Absolute Maximum specifications.
18 N/C No connect Exceeding any of the absolute maximum/minimum specifications may result in permanent
damage to the device and will void the warranty. Each absolute maximum rating listed is an
19 GND Low inductance ground connection individual parameter. Biasing and driving the amplifier with more than one absolute maximum
rating listed may result in permanent damage to the device. Exposure to maximum rating
20 GND Low inductance ground connection conditions for extended periods may reduce device reliability.
21 N/C No connect
22 RFOUT 806–928 MHz RF output signal 50 Ω CAUTION: Although this device is designed to be as robust as
23 GND Low inductance ground connection possible, ESD (Electrostatic Discharge) can damage
this device. This device must be protected at all times
from ESD. Static charges may easily produce poten-
tials of several kilovolts on the human body or
26 GND Low inductance ground connection equipment, which can discharge without detection.
27 GND Low inductance ground connection Industry-standard ESD precautions must be employed
28 GND Low inductance ground connection at all times.
Center attachment pad must have a low inductance and low thermal resistance connection to
the customer's printed circuit board ground plane.
Evaluation Board Evaluation Board Description

GND VCTL VREG VD4 VD3 VD2 VD1 GND The Skyworks SKY65146 Evaluation Board is used to test the
performance of the SKY65146 power amplifier module. The fol-
lowing design considerations are general in nature and must be
followed regardless of final use or configuration.
1. Paths to ground should be made as short as possible.
2. The ground pad of the SKY65146 power amplifier module has
+ C1
+ C2
special electrical and thermal grounding requirements. This
C3 pad is the main thermal conduit for heat dissipation. Since the
circuit board acts as the heat sink, it must shunt as much heat
INPUT
as possible from the amplifiers. As such, design the connection
to the ground pad to dissipate the maximum wattage produced
SKY65146
to the circuit. Multiple vias to the grounding layer are required.
NOTE: Junction temperature (TJ) of the device increases with a

poor connection to the slug and ground. This reduces the
C5 C6
+ + lifetime of the device.
C4 C7
IDEN TEST FIXTURE
Capacitors C6 and C7 are shown on EVB, but are not used.

Application Board Test Procedure
Step 1. Connect RF test equipment to Amplifier input/output SMA
connectors.
Recommended Solder Reflow Profiles Step 2. Connect DC ground.
Refer to the “Recommended Solder Reflow Profile”
Application Note. Step 3. Connect all VCC (VD) lines to 3.5 V supply and VREG to
2.75 V. Verify the ICQ current is approximately 329 mA.
Step 4. Apply RF signal data -30 dBm level and observe that the
Tape and Reel Information output level is approximately 8 dBm or the gain of the
Refer to the “Discrete Devices and IC Switch/Attenuators device is approximately 38 dB.
Tape and Reel Package Orientation” Application Note.
NOTE: It is important that the VD2, VD3, and VD4 voltage source
be adjusted such that 3.5 V is measured at the board. The
high collector currents will drop the collector voltage sig-
nificantly if long leads are used. Adjust the bias voltage to
compensate.
Bill of Material for Evaluation Board

Part ID QTY Size Value Units Manufacturer Product Number
1 C1 1 1206 10 µF AVX TAJA106M006R
2 C2 1 1206 10 µF AVX TAJA106M006R
3 C3 1 0402 1000 pF Murata GRM155R71H102KA01
4 C4 1 1206 10 µF AVX TAJA106M006R
5 C5 1 0402 1000 pF Murata GRM155R71H102KA01
Evaluation Board Stack-Up Package Outline

Cross Section Name Thickness (mm) Material εr 10.04
L1 0.035 Cu –
Pin 1 Indicator
Lam1 0.400 Rogers 4003 3.38
L2 0.035 Cu –
Top
Lam2 0.600 FR4 4.00
L3 0.035 Cu –
14.04
Lam3 0.400 FR4 4.00
L4 0.035 Cu –
Branding Specifications
1.45 ± 0.1
4X 3.81
4X 2.54
4X 1.27
Mark Pin 1 Pin 28
0
Identifier Manufacturing Part Number (0.2x 45°)
Pin 1 Indicator
Revision Number 28X SMT Pad See Detail A
Pin 1
SKY65146
EXXXXX.XX Lot Number
See Detail B
YYWW MX YY = Manufacture Year C
WW = Week Packaged 0
12X 1 4X 1.27
Sealed 12X 2
MX = Country Code 4X 2.54
12X 3
12X 4 4X 3.81
14X 4.873 14X 6.873
2.5
1.5
0.5
54X Solder Mask
Openings See Detail B
1.163 ± 0.05
(0.147) 0.889 ± 0.05

(R 0.508) 0.875 0.875
1.016 0.02X 45°
± 0.05 R 0.05
0.875 0.875 Max.
R 0.05
0.762 (R 0.381) Max.
± 0.05
Detail B Detail A Detail C
Recommended Footprint Solder Mask

10.34 mm 10.44 mm
28X
14X 18X 2.5 mm 0.862 mm
Pin 28
0.762 mm
Pin 28 0.20 X 45°
28X 1.286 mm
14X 1.186 mm Pin 1
Pin 1
12X
12X 14.44 mm
3 mm 1.27 mm Typ.
1 mm CL
14.34 mm
12X
CL 12X 2 mm
1.27 mm Typ. 0.6 mm 4 mm
0.875 mm Typ.
0.25 mm Typ. R0.431 mm Typ.

Package Outline
R0.381 mm Typ. CL
0.875 mm Typ.
18X 1.5 mm
0.25 mm Typ.
Thermal via array Ø0.3 mm on CL 18X 0.5 mm
0.7 mm pitch additional vias in
common ground pad will 0.6 mm
improve thermal performance
Thermal vias should be tented and filled with solder mask 30-35 µm copper plating recommended.
Stencil Pattern
10.34 mm
28X 28X
18X 2.5 mm 0.762 mm 1.186 mm
Pin 28
0.20 X 45°
Pin 1
12X 3 mm
12X 1 mm 1.27 mm 14.34 mm
CL
Typ.
12X 2 mm
12X 4 mm
0.875 mm
Typ.
Stencil aperture size Package
of 80 to 100% Outline
of the module/pkg
0.875 mm CL
solder mask
openings. Typ. 18X 1.5 mm
18X 0.5 mm
Ordering Information
Model Name Manufacturing Part Number Evaluation Kit Part Number
SKY65146: 3.5 V Broadband MCM Power Amplifier 806–849 MHz SKY65146-21 (Pb-free package) TW16-D390
Copyright © 2007, 2008, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided
by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or
information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and
Conditions of Sale.
THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY
DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS
SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any
damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and
names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are
incorporated by reference.

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DATA SHEET

SKY65146: 3.5 V Broadband MCM Power Amplifier

Applications Functional Block Diagram

● Large dynamic range

● Available on tape and reel GaAs HBT IC

● Available lead (Pb)-free and RoHS-compliant MODULE

Harmonic Levels 2FO PO < P3 dB SAT -37 dBc

Noise power in Rx band RxBN PO < 29 dBm -85 dBm/Hz

Noise figure NF CW 6.8 8 dB

Recommended Operating Conditions

Typical Performance Data

-40 °C 25 °C 85 °C 806 MHz 815.5 MHz 825 MHz

3.0 V -3.5 V 4.0 V 4.5 V -40 °C 25 °C 85 °C

Typical Performance Data

3.0 V 3.5 V 4.0 V 4.5 V 3.0 V 3.5 V 4.0 V 4.5 V

-40 °C 25 °C 85 °C 3.0 V 3.5 V 4.0 V 4.5 V

Typical Performance Data

-10 dBm -9.5 dBm -9 dBm

2nd Harmonics (dB)

Typical Performance Data

3rd Harmonics (dB)

4th Harmonics (dB)

4th Harmonics (dB)

Application Circuit Notes Package and Handling Information

Pin Assignments Pin Out

2 GND Low inductance ground connection NC 9 27 GND

3 GND Low inductance ground connection NC 10 26 GND

4 N/C No connect GND 11 25 GND

5 N/C No connect RFIN 12 24 GND

6 GND Low inductance ground connection GND 13 23 GND

Supply voltage for base bias circuitry to all stages NC 14 22 RFOUT

12 RFIN 806–928 MHz RF input signal 50 Ω RF input power 11 dBm

Evaluation Board Evaluation Board Description

NOTE: Junction temperature (TJ) of the device increases with a

Capacitors C6 and C7 are shown on EVB, but are not used.

Bill of Material for Evaluation Board

Evaluation Board Stack-Up Package Outline

14X 4.873 14X 6.873

(0.147) 0.889 ± 0.05

Recommended Footprint Solder Mask

14X 1.186 mm Pin 1

0.25 mm Typ. R0.431 mm Typ.

Copyright © 2007, 2008, Skyworks Solutions, Inc. All Rights Reserved.

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