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PHARMACEUTICAL ENGINEERING
The Official Technical Magazine of ISPE
This article presents a project management vision that uses the reduction of
risk, value-added sustainability, and improved operations and maintenance
to minimize conflicts, waste, and costs.
B
Introduction Although many of the benefits of BIM are viewed as direct
uilding Information Modeling (BIM) benefits, perhaps the greatest benefits are actually indirect.
is a process gaining traction within Direct benefits include such items as improved visualization
the Architect, Engineer, and Construc- and the centralization of project and building information.
tion (AEC) industry as a method to The indirect benefits include the necessity of collaboration,
improve the project delivery process. resulting in better project understanding and reducing proj-
The fundamental characteristic of BIM ect risk. Risk reduction comes through improved under-
is the development of critical informa- standing and coordination in the management of a project
tion through a feedback loop that can by decreasing construction conflicts, eliminating construc-
continue throughout a facilitys life- tion waste, and ultimately reducing project cost.
cycle. BIM combines the ability to develop a virtual model of
a facility, beginning with design (space planning), then move
to construction execution (cost, scheduling, interference
detection), and finally, operations and maintenance (asset
management). Even though the technology for implementa-
tion of BIM will change, and probably change rapidly, the
process and underlying concepts will likely change very
little. BIM allows a project team to visualize, understand,
communicate, and collaborate as seen in Figure 11: visual-
izing to see the project, understanding to know the project
elements, communicating to ensure that understanding, and
finally collaborating to provide the necessary input at the
proper time. These benefits of collaboration also can be the
greatest challenge. BIM requires openness among the team
players to share information that will support the project
goals. Figure 1. The process of building information modeling.
Project Risk
Most owners want their projects to be delivered on time,
on budget, and without injury. Project risk comes in many
forms:
schedule. The model can be used for quality control (see tion of facility operations with manufacturing operations.
Figure 5) to ensure that the installation is done according to The incorporation of an intelligent facility model can then
the agreed upon model. provide decision support tools that will impact lifecycle cost
and increase manufacturing effectiveness, provide real time
O&M information exchange, automate critical performance
Parametric design, the basis for factors, simulate factory performance, and develop predic-
design is developed, embedded information becomes more
component or object. specific depending on the project needs. The challenge is
to develop an easy-to-use and consistent means of defining
objects and instances appropriate for current and later use.
The BIM also can be used during the commissioning The 2D and 3D geometric representations of physical
process making a virtual model the basis for operations and objects, such as doors, windows, and/or higher level assem-
maintenance information to track installed equipment, main- blies such as walls, roofs, and floors are Building Element
tenance schedules, and operating information. With all the Models (BEMs). For process equipment, the information
information regarding the equipment attached to the model, embedded in BEMs can create a tool model library that
operations and maintenance information is readily available would become a strategic asset for an owner, representing
to operators and technicians so equipment can be operated the knowledge available about a tool or tool set. The risk
the most efficiently, reducing operating costs and improving of errors regarding tool installation for example, would
reliability. The National Institute for Standards and Technol- decrease as higher quality models are developed and utilized
ogy (NIST) study of the additional cost incurred by building as intelligent tool models.
owners as a result of inadequate interoperability indicates For example, within the semiconductor industry, the di-
that insufficient interoperability accounts for an increase in versity and complexity of process equipment creates difficult
construction costs by $6.12 per SF for new construction and challenges for facilities design, and equipment installation.
an increase in $0.23 per SF for Operations and Maintenance To help facilitate the necessary exchange of information,
(O&M), resulting in a total added cost of
$15.8 billion.2 The study involved both
the exchange and management of infor- Data Sheet Data Sheet Title
Number
mation, in which individual systems were
unable to access and use the informa- 100 Equipment Identification
tion imported from other systems. It was
200 Environmental Conditions
determined that additional costs associ-
ated with redundant computer systems, 300 Physical Characteristics
inefficient business process management,
400 Electrical Power
manual reentry of data, inefficient Re-
quest For Information (RFI) management 500 Water
can be attributed to insufficient interop-
600 Bulk Chemicals
erability and resulted in increased project
costs. It was estimated that 68% of these 700 Drains
additional expenses ($10.6 billion) were
800 Gases
incurred by building owners and opera-
tors.2 900 Vacuum
The final step is a virtual as-built 1000 Exhaust
model, which can be the basis for an in-
telligent facility model allowing integra- Figure 6. Building element model intelligent tool model.
SEMI E6, Guide for Semiconductor Equipment Installation purchased will operate within specific facility parameters or
Documentation,3 benefits equipment suppliers and semi- note areas where the facility infrastructure may not support
conductor manufacturers by communicating information a specific tool. Each tool would then be supplied in a facility
necessary to install process equipment. As seen in Figure ready state to work within the parameters of a specific facil-
6, support utilities, such as power, water, and/or gases ity. A site specific facilities service and termination matrix
and chemicals, as well as the tools physical characteristics can become the basis for an intelligent facility model, which
(weight, height, length) can be provided in a standardized is linked to the tool matrix data to support the process layout
format. The tool model with embedded information with the during the concept and programming stage.
Points Of Connections (POC) located on the tool model can The reference to the site specific facilities services (E51
greatly improve the communication of necessary data for data) provides a basis for understanding that can be estab-
tool accommodation and hook-up. lished to resolve installation issues prior to tool arrival. Ad-
However, the SEMI E6 Guide only applies to the facility ditional facility requirements not identified by site specific
interface with the semiconductor equipment. Another SEMI information can be reviewed before a tool is purchased.
Guide, SEMI E51, Guide to Typical Facilities Services and Utilizing an electronic form of data collection and storage
Termination Matrix, was conceived to provide the equipment provides a basis for integration into a BIM that can be used
supplier with an understanding of the typical support facili- during the facility lifecycle.
ties available at the tool POCs, giving the tool manufacturer a
much better basis for tool design. The objective of SEMI E51 is Intersection of Facility and Process Tool Data
to help provide timely and cost-effective tool installation with Utilizing the standard terminology established by these
minimum impact on existing customer facilities, systems, guideline documents provide a basis for developing the
and services, and to ensure that the quality of infrastructure methodology for data transfer between the tool manufactur-
supplied (e.g., water, gases, chemicals, power) is not compro- ers, the owner, the design and construction community, and
mised once connected to the tool.4 When typical facility ser- various suppliers. Figure 8 illustrates the intersection of the
vices are considered by tool manufacturers during tool design, two databases and how they can be integrated into a build-
additional cost and lead times associated with customizing ing information model.
each tool installation could be minimized resulting in reduced
costs to build and install semiconductor equipment. Intersection Diagram
SEMI E51 is not intended to be site-specific, but rather The site specific document generally refers to the base
to identify utilities, performance, and connections available build portion of the main facility structure. Base build typi-
at a typical semiconductor facility, giving the tool manu- cally includes the buildings (manufacturing space, central
facturers a range of operating conditions (see Figure 7). Site utility building and all other support buildings such as of-
specific data can be provided to the tool manufacturer dur- fices, warehouse, restrooms etc.), the architectural, electri-
ing the procurement process to ensure that the equipment cal, mechanical, HVAC and process systems, systems piping
500 Water
700 Drains
800 Gases
900 Vacuum
1000 Exhaust
Conclusion
The future of BIM in the capital projects
industry is the development and use of
Figure 8. Intersection of tool and facility.
an automated project and facility man-
agement environment that is fully inte-
grated from programming, through design and construction, ligent models evolve, more sophisticated, even intelligent
through operations and maintenance, ultimately through the product specifications will be able to provide information for
end of the buildings life. Data-rich 3D models, whether the such tasks as structural analysis, LEED compliance, or in-
data is physical (dimensions, location) or parametric (distin- stallation and operating requirements. Intelligent tool mod-
guishing one object from another similar object), whether it els will become the core information source for construction
is in BIM, single building modeling, parametric modeling, installation methods, quantities of material, fabrication and
or any other type of computer modeling, must be used in ultimately, resource utilization during operation.
an intelligent fashion. The activities conducted throughout Productivity increases for the construction industry will
the lifecycle of any facility generates an enormous quantity be needed to ensure that capital projects are continued to
of data that needs to be stored, retrieved, communicated, be provided in a cost effective manner, meeting the needs of
and usable by all parties involved. Advances in technology owners. Building Information Modeling (BIM) is proving to
have increased the opportunities for gathering, providing be such a technology that will have an impact on the delivery
access to, exchanging, and achieving all of this information process of the architectural, engineering, and construction
for future reference. Continuing advances in smart building community. The BIM model is a shared resource that can be
technologies, BIM technologies and construction practices used in many different ways and some of those possibilities
have not only increased the amount and detail of data gener- have not yet been realized. The goals of a better, faster, and
ated and exchanged, but also have further raised expecta- more cost effective construction can be achieved, reducing
tions about its use and value as an asset. The AEC industry risk, making building information modeling a key tool for
has begun to realize that a greater degree of harmonization the future of project delivery.
in classifying information is now necessary and possible.
This harmonization and reuse of information for multiple References
purposes is at the heart of value and cost savings presented 1. Kymmell, William, Building Information Modeling:
by building information modeling. Planning and Managing Construction and Projects with
BIM is a significant improvement in the way architects, 4D CAD and Simulation, McGraw Hill, 2008.
engineers, and contractors have traditionally worked. BIM 2. NIST, Cost Analysis of Inadequate Interoperability in
allows visualization of a building design along with imple- the U.S. Capital Facilities Industry, August 2004.
mentation of methodologies to add scheduling and estimat- 3. SEMI Draft Document 3287 (2002), revision to E6,
ing data to each building element determine conflicts and Guide for Semiconductor Equipment Installation Docu-
develop clash free installations. As BIM becomes more mentation, August, 2002, Semiconductor Equipment
standard, building products (intelligent tool models) will be and Materials International, San Jose, CA.
inserted directly into a model in electronic form, including 4. SEMI E51 (2000), Guide for Typical Facilities Services
hyperlinked references for parts lists, operating and mainte- and Termination Matrix, Semiconductor Equipment and
nance manuals, and vendor/supplier information. As intel- Materials International, San Jose, CA.