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Common Module
AESAs4CM
Industry Structure, TRMs and MMICs
ENGALCO
Strategic Support for High-Tech Organizations
www.engalco-research.com
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Table of Contents
Page
Front page and Introductory Part 2
Section CM1 What is an AESA? 5
BAE Systems 26
Cassidian 27
IAI (Elta) 28
Lockheed Martin 29
Northrop Grumman 30
Raytheon 31
Selex ES 33
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List of Figures
Page
Figure CM.11 Typical Overall Supply Chain Applicable to Many TRM OEMs 23
Figure CM.12 Basic Industry Supply Chain from Materials & Basic
Components through to TRM Assembly 23
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List of Tables
Page
Table CM-9 Lockheed Martin Sales Revenues and Net Income 2010-2012 29
Table CM-12 Northrop Grumman Sales Revenues and Net Income 2012 30
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The first few paragraphs here are largely taken from the following item:
Active Electronically Steered Array (AESA) Airborne Radar
- Posted on the Internet by Vijainder K Thakur on Sunday, September 11, 2005
However, some editing has been introduced and further material has been
added.
Although the item above refers to airborne radar all the principles also apply
to other applications including land-based, shipboard and space-based. The
material has been slightly edited to fit with the main focus of this report.
An Active Electronically Steered (or Scanned) Array (AESA) takes the
concept of using an array antenna a step further on from the passive
electronically-scanned phased array (PESA). Instead of shifting the phase of
signals from a single high power transmitter every AESA employs a grid of
hundreds, thousands or more small "transmitter-receiver (TR)" modules (or
TRMs) that are linked together by high-speed processors.
Each TRM has its own transmitter, receiver, processing power, and a relatively
small radiator antenna on top. For some AESAs this radiating element is a
microstrip patch whilst for others (notably the US AN/APG series) the structure is
spike-like. The TRM can be programmed to act as a transmitter, receiver, and/or
radar. The TRMs in the AESA system can all work together to create a powerful
radar, but they can do different tasks in parallel, with some operating together
as a radar warning receiver, others operating together as a jammer, and the rest
operating as a radar. TRMs can be reassigned to any role, with output power or
receiver sensitivity of any one of the "subsystems" defined by such temporary
associations proportional to the number of modules.
The antenna elements are generally spaced at half-wavelength intervals
around the array.
An AESA provides 10-30 times more net radar capability plus significant
advantages in the areas of range resolution, countermeasure resistance and
flexibility. In addition, it supports high reliability combined with low maintenance
operation, which translate into lower lifecycle costs. Since the power supplies,
final power amplification and input receive amplification are distributed, MTBF is
substantially higher (typically by a factor of 10-100 than that of a passive ESA or
mechanical array). This results in higher system readiness and significant
savings in terms of life cycle cost of a weapon system, especially a fighter
aircraft.
The use of multiple TRMs also means failure of up to 10% of the TR modules
in an AESA will not cause the loss of the antenna function, but will merely
marginally degrade its performance. From a reliability and support perspective,
this graceful degradation effect is invaluable. A radar that has lost several TRMs
can continue to be operated until scheduled downtime is organized to swap the
antenna.
AESA technology has not been easy to acquire. It has derived from years of
research and heavy investmentsgenerally in order of the hundreds of millions
of dollars.
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TRM 1
TRM 2
TRM 3
Radar
Signal
Inputs
(Transmit-
side) and
Outputs (to TRM 4
DSPs and
Display/s)
TRM 5
TRM 6
In Figure CM1.1 only 30 elements are shownas small squares on the circular
AESA arraywhereas in practice this number can be almost anything between
10 and 100,000or occasionally even more.
Although shown separately in Figure CM1.1, in practice each antenna element
is physically very close to its own dedicated TRM. Also for simplicity only six
TRMs are indicated in bold outline and labelled. In practice every one of the 30
elements would need an associated TRM so the total number of TRMs would also
be 30.
The acronym COTS stands for commercial off the shelf, DSP stands for
digital signal processor and TRM stands for transmit-receive module. It
should be noted that the RF (microwave) signal is generated, modulated, phase-
shifted and amplified on the transmit side of each TRM and processed on both
transmit and receive sides.
Each array (antenna) element is inherently associated with a TRM and there
are thus N TRMs for a system having N elements. Again we would stress:
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The issue of standard frequency bands is very important for any appreciation of
communications or radar systems. There are many frequency band specification
ranges but the most significant three will be introduced here.
The first standard in this respect is the ITU standard ranges all of which begin
and end with frequencies that are multiples of 3. Thus:
Very High Frequency (v.h.f.) is 30 to 300 MHz
Ultra High Frequency (u.h.f.) is 300 to 3,000 MHz (0.3 to 3 GHz)
Super High Frequency (s.h.f.) is 3,000 to 30,000 MHz (3 to 30 GHz)
Extra High Frequency (e.h.f.) is 30,000 to 300,000 MHz (30 to 300 GHz)
etc., etc.
The reason for the 3 multiple is found in the relative simplicity with which
wavelength can be calculated the number 3 x 108 ms-1 being a very good
approximation to the free-space velocity of the signal. Thus the wavelength @ 3
GHz is easily calculated as 10 cm (100 mm).
The great majority of radars operate across frequency bands within u.h.f. or
s.h.f. but a far more precise knowledge of the frequency ranges is required.
Although dating back to World War II technology when microwave rectangular
waveguides were prevalent the letter designated waveguide bands remain
highly popular today. These bands were also established in an IEEE publication
dated 1984. They are indicated with their approximate limits in Table CM-1.
In practical terms this means that an AESA operating in the frequency range
1.3 to 1.6 GHz works in L-band. Another AESA operating in the frequency range
8.4 to 10 GHz works within X-band, etc.
Several years back a NATO committee, recognizing (hoping?) that the
waveguide bands would quite soon become obsolete, decided upon a new
designation sequence that operates alphabetically: A through M. These are
shown in Table CM-2.
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Waveguide Bands:- 1.12 2.26 3.95 8.2 12.4 18.0 26.5 36 46 56 100
Designation letter:- L S C X Ku K Ka Q V W
Designation letter:- D E F GH I J K L M
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Reference:
http://www.google.com/imgres?imgurl=http://www.microwaves101.com/encycl
opedia/images/TR%2520Module/block%2520diagram1.jpg&imgrefurl=http://ww
w.microwaves101.com/encyclopedia/transmitreceivemodules.cfm&h=396&w=69
5&sz=33&tbnid=PoAbdGSqEBRQSM:&tbnh=71&tbnw=124&prev=/search%3Fq
%3Dtransmit%2Breceive%2Bmodule%2Bdesign%26tbm%3Disch%26tbo%3Du
&zoom=1&q=transmit+receive+module+design&usg=__V7wO5L4slh921jRNzMq
3t-
Eh1_E=&docid=Cr9UZxfrFc9d_M&sa=X&ei=DeVmUfS1G6KI0AW_r4CADQ&ved=
0CFcQ9QEwBw&dur=419
Since this is not a technical report the details concerning the components
within the TRM will not be considered in detail and only the necessary overall
points are described.
In Figure CM.2 what is termed a manifold to the left of the attenuator
comprises the computer-controlled signal processing parts of the AESA. Most of
these functions are digital but this is also where the microwave signal is
generated, preceding transmission, and also where the received signal is
ultimately processed. The antenna element is to the top right of the block
diagram.
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In any transmit-receive module there are two major signal paths: the
transmit path and the receive path. In Figure CM.2 the transmit path runs
through the uppermost section whilst the receive path runs through the lower
section. The components labelled circulators can actually be realized as ferrite
circulators or (increasingly) this function can be performed using MEMS.
The common leg amplifier feeds the digitally-controlled phase-shifter
which has a pivotal role to play in any phased-array radar (an AESA is one type
of phased-array radar).
In using this report it is important to appreciate that there exist two classes of
MMIC (see below) that are always implemented in any AESA TRM:
In Figure CM.2 the non-PA MMICs include the attenuator, the three switches
(all embodied within one MMIC), the LNA, the phase-shifter (with its common leg
amplifier) and the driver amplifier. In most instances there is further
consolidation resulting in a total of typically four non-PA MMICs per TRM.
The RF power amplifier (or PA) is unique in terms of specification and is
always considerably more expensive than any of the non-PA MMICs.
GaAs MMIC technology pervades most of the AESA scene but some production
AESAs already implement gallium nitride (GaN) for the PAs at least in the first
instance. These matters are discussed further below in the sub-section on
technology trends.
An example of a production TRM is the module shown in Figure CM.3.
Several MMICs and other components are visible in this module. Most notable
is the PA which is just to the left of the grey-colored three-port circulator. This
TRM operates over 9-10 GHz (X-band) and the peak output power available from
the PA is 8.5 W.
Main OEMs manufacturing TRMs are identified later in this section but the next
TRM shown in detail in Figure CM.4 is Cassidians Standard Module.
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Recent historical and current (2013) unit prices were generated for AESA
TRMs by starting with known industrial unit prices for the constituent MMICs and
then working upwards using a process introducing bills-of-materials (BoM),
engineering costs and profit margin (where applicable).
We then applied a price-decrease formula that is mainly based upon volume-
related breakpoint price reductions. Therefore, as the volume shipments of
AESAs increases substantially (hence the volume of TRMs even more because
there are hundreds or even thousands of TRMs per AESA) so the unit price
decreases slowly but steadily.
At this point an important caveat must be noted. We are assuming
that within the forecast period single-MMIC (or even dual-MMIC) TRMs
do not enter production. If in any year they do enter service then we
would expect the new TRM unit prices to initially be more expensive
than current multi-MMIC TRMs. Although in the longer-run costs would
come down as a result of the simpler unit designs.
Figure CM.5 shows the unit price data with the different frequency bands as
the parameter.
700
Ku-band
600
X-band
500
C-band
400
S-band
300
L-band
200
100
2011 2012 2013 2014 2015 2016 2017
Year
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Each type of module attracts a markedly different unit price. Also in all
instances unit prices drift downwards with time, but at different rates of
decrease.
Table CM-4 summarizes the situation.
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Many types of transistors and MMICs are manufactured using the above
semiconductor materials. The choice is generally termed the process by MMIC
design houses and manufacturing fabs. Specific types of transistor processes
include:
HBT and pHEMT processes are applicable to either GaAs or the more recent
GaN MMIC technologies.
SiGe-based MMICs offer some important advantages for TRMs but in this
report the focus is on the important GaAs and GaN MMIC
implementations.
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Currently and likely for many years ahead by far the great majority of
AESA TRMs implement GaAs MMICs. But there are already several production
GaN-based AESA implementations and this trend will almost certainly continue
as new designs enter the market.
Returning to Figure CM.2 (above) it is worth summarizing the MMICs involved
as follows:
Attenuator.
Switches (x3).
N-bit Phase-shifter (together with its common leg amplifier).
Driver amplifier.
RF power amplifier (or PA).
The first four MMICs are defined for the purposes of this report as non-PA.
As mentioned above the PA is by far the most critical (and relatively expensive)
MMIC. Amongst many suppliers the following are mentioned here: Cassidian
(Germany), Cree (GaN), Northrop Grumman GaAs and GaN), (RFcore (Korea),
RFMD, TriQuint (GaAs and GaN), UMS (GaAs & GaN. France & Germany). Cree,
Northrop, RFMD and TriQuint are all US-based. Further information is provided in
sub-section CM7 below. The MMICs are either obtained in standard QFN
packages (e.g. RF2M Microwave see Figure CM.3 above) or in bare chip (die)
form (e.g. Cassidian see Figure CM.4 above). Unit prices or average selling
prices vary considerably and depend on many technological and economic
factors.
Unit prices were obtained for AESA TRM MMICs from a number of sources.
Using the same basic methodology that we employed for TRMs we again
applied a price-decrease formula that is mainly based upon volume-related
breakpoint price reductions. Therefore as the volume shipments of MMICs
increases substantially so the unit price decreases over time but at different
rates. When considering MMICs it is necessary to bear in mind that whilst there
will be hundreds or even (often) thousands of TRMs per array each TRM contains
several MMICs (a variable number that we expect to decrease somewhat over
the forecast period).
Once again we must repeat some of the important caveats cited
above:
At this point an important caveat must be noted. We are assuming
that within the forecast period single-MMIC (or even dual-MMIC) TRMs
do not enter production. If in any year they do enter service then we
would expect the new TRM unit prices to initially be more expensive
than current multi-MMIC TRMs. Although in the longer-run costs would
come down as a result of the simpler unit designs.
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Figure CM.6 shows the unit price data for GaAs PA MMICs with the different
frequency bands as the parameter.
22 X-band PA
20 C-band PA
18 S-band PA
16 L-band PA
14
12
10
2011 2012 2013 2014 2015 2016 2017
Year
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Figure CM.7 shows the unit price data for GaAs non-PA MMICs with the
different frequency bands as the parameter.
13
Ku-band non-PA
12
MMIC Unit Price US$
X-band non-PA
11 C-band non-PA
10 S-band non-PA
9 L-band non-PA
6
2011 2012 2013 2014 2015 2016 2017
Year
The main contrast between these data and those applying to GaAs PA MMICs
is the much lower unit prices.
The decreases over time are similar and for the same reasons as given above
for GaAs PA MMICs.
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Figure CM.8 shows the unit price data for GaN PA MMICs with the different
frequency bands as the parameter.
70
X-band PA
MMIC Unit Price US$
65
C-band PA
60
S-band PA
55 L-band PA
50
45
40
2011 2012 2013 2014 2015 2016 2017
Year
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Figure CM.9 shows the unit price data for GaN non-PA MMICs with the
different frequency bands as the parameter.
21 X-band non-PA
20 C-band non-PA
19 S-band non-PA
18 L-band non-PA
17
16
15
14
2011 2012 2013 2014 2015 2016 2017
Year
The main contrast between these data and those applying to GaN PA MMICs
is the much lower unit prices. The price ratio is approximately one-third.
The decreases over time are similar and for the same reasons as given above
for GaN PA MMICs.
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Two of the most significant aspects relating to technology and choices are:
Availability.
Reliability.
The MMICs and other RF/microwave components required for AESAs are
generally available in the necessary production numbers. The vital aspect of
reliability is well assured whether GaAs-based or the newer GaN-based
technology is chosen.
TRM reliability (and very importantly yield) is another matter. Back in the
1990s and the early-2000s there were serious questions relating to TRM yield
but currently and foreseeably the yield generally obtainable with TRMs is greatly
improved.
In common with practically all electronic systems there is a trend toward more
complex functionality in the ICs mainly MMICs in the case of AESAs. The one
exception is the RFPA where (as described above) special requirements apply.
With time however more complex functionality should be expected in the non-PA
chip-sets.
Some details concerning two programs are next provided here: one from
Northrop Grumman and one from Raytheon.
Northrop Grumman is actively involved in its AESA ManTech
(manufacturing technology) program which aims for continuing high-density,
low-cost technology solutions. In particular the company is developing:
Conformal Aperture Technology.
Advanced Printed Circuit Board (PCB) Fabrication Technology.
GaAs Flip Chip Assembly to Low Temperature Co-Fired Ceramic (LTCC).
The last bullet above effectively addresses the important subject of Integrated
Microwave Assemblies and there is much to be gained in terms of increased
reliability combined with decreased production costs associated with this
approach.
Northrop Grumman is also highly active in GaN MMIC developments.
The Raytheon Company Northrops main competitor is also deep into
GaN activities notably the following (abridged) extracts from the Companys
website:
Raytheon TEGaN DARPA supported 11 April '12.htm
The aim of this project is to increase the power-handling capabilities of GaN
devices.
TEWKSBURY, Mass., April 11, 2012 /PRNewswire/ -- Raytheon Company
(NYSE: RTN) has been awarded an 18-month, $1.8 million contract by the
Defense Advanced Research Projects Agency (DARPA) to develop next-
generation Gallium Nitride devices bonded to diamond substrates. The
technology, called Thermally Enhanced Gallium Nitride (TEGaN), seeks to
increase the power handling capability of GaN devices by at least three times.
TEGaN enables state-of-the-art transistors and monolithic microwave integrated
circuits (MMICs) to achieve their full performance potential by reducing thermal
resistance. TEGaN acts as a multiplier for GaN's unique qualities, which may
dramatically reduce the cost, size, weight and power of defense systems. Over
the course of the 18-month contract, Raytheon seeks to develop and test
TEGaN's capabilities and establish a clear path to technology insertion into
military systems.
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A summary of the basic overall industry supply chain applying to many AESA
systems OEMs is provided as Figure CM.10.
Figure CM.10 Typical Overall Supply Chain Applicable to Many AESA Systems
OEMs
Manufacturer of
ceramic packages
(housings)
AESA Systems
MMIC supplier OEM
(fabless or pure-
play fab)
Supplier of other
RF & related
components
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Figure CM.11 Typical Overall Supply Chain Applicable to Many TRM OEMs
Manufacturer of
ceramic packages
(housings)
Supplier of other
RF & related
components
The only difference between the supply chain indicated in Figure CM.10 and
CM.11 is the nature of the OEM at the end point.
In practice whether an AESA final systems manufacturer or a TRM
manufacturer is being considered substantial feedback and feed-forward
interactions occur and these are shown in Figure CM.12.
Figure CM.12 Basic Industry Supply Chain from Materials & Basic Components
through to TRM Assembly
From Figure CM.12 it can be seen that much feed-around occurs between
the major stages.
Basic materials include ceramics, aluminium block and semiconductors. These
materials are prepared and marketed by specialist companies. Examples of
important semiconductors include: silicon (Si), silicon-germanium (SiGe),
compounds involving gallium arsenide (GaAs), indium phosphide (InP) and
increasingly gallium nitride (GaN) or silicon carbide (SiC).
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Further specific supply chains are provided within the profiles of contractors
and OEMs below.
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In this section the main contractors and OEMs are identified, together with
information concerning their current operating status. Table CM-7 summarizes
this information.
Table CM-7 Contractors and OEMs
Contractor/OEM AESA TRM MMICs Comments
Manufacturer Manufacturer Fabricator
BAE Systems Yes No No Buy-in TRMs
Cassidian Yes Yes No Buy-in
MMICs1
CEA Technologies Yes No No Buy-in TRMs2
IAI (Elta) Yes No No Buy-in TRMs
ITT Gilfillan Yes No No Buy-in TRMs
Lockheed Martin Yes Yes3 No Buy-in MMICs
Northrop Yes Yes4 Yes5
Grumman
Raytheon Yes No6 No6 Buy-in TRMs
RF2M Microwave7 No Yes No Buy-in MMICs
RFcore8 No Yes Yes
Saab Yes No No Buy-in TRMs
Selex ES Yes Yes No Buy-in
MMICs9
Thales Yes Yes10 Yes:
Thales/Cassidian
(1) From UMS (Ulm). UMS fab GaAs and GaN MMICs.
(2) Likely operate a TRM manufacturing agreement with RFcore (Korea).
(3) At least the TRMs for the AN/TPQ-53 (previously EQ-36).
(4) AESA ManTech program. GaAs flip-chip assembly onto LTCC.
(5) Internal GaAs foundry.
(6) Raytheon retains in-house capabilities for both TRM manufacture and
GaN-based MMICs. However, Kyocera America makes TRMs for
Raytheon under contract.
www.KYOCERA _ Semiconductor Parts _ Government & Aerospace _
Phased Array.htm
(7) RF2M Microwave was previously Cobham MAL. RF2M manufactures an
S-band LDMOS-based TRM and an X-band MMIC-based TRM. RF2M
Microwave is owned by API Technologies Corp.
www.rf2mapitech.com/aesa.html
(8) Korea-based RFcore manufactures an X-band TRM, a much wider-band
TRM and a 2-6 GHz MMIC phase-shifter.
(9) Selex ES has a Strategic Supply Agreement with RFMD which runs
through until at least the end of 2013. Under this Agreement Selex ES
purchases MMICs from RFMD Newton Aycliffe (UK).
(10) For Thales capability see: www.thalesgroup.com/microelectronics
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Company Profiles.
In this sub-section the following companies are briefly profiled:
BAE Systems.
Cassidian.
IAI.
Lockheed Martin.
Northrop Grumman.
Raytheon.
Selex ES.
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Cassidian. www.cassidian.com
Cassidian also has a strong interest in the Eurofighter Consortium (see BAE
Systems profile above).
The Companys total revenue for 2012 was approximately US$7.5B which
was down by about 11% on the 2011 result. The Company is the only one of
EADS subsidiaries that suffered a decrease in sales during 2012.
GaAs-based or GaN-based MMICs are obtained from United Monolithic
Semiconductors (UMS):
http://www.ums-gaas.com
Supply chain:
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IAI generates annual revenues in the region of US$7B with net income
exceeding US$200M.
The Company is structured into the following six main groups:
Commercial Aircraft.
Bedek Aviation.
Elta Systems.
Engineering.
Military Aircraft.
Missiles, Systems & Space.
Amongst these the Elta Systems Group is by far the most important for this
report because Elta Systems manufactures radars. Every Elta Systems radar
bears the initial prefix EL/ in its code description. Financially, Eltas
contribution to IAIs annual revenues is probably around 10-12%.
The AESAs that Elta Systems are summarized in Table CM-8.
Further details are provided for all these systems in the appropriate modules
of this report: Airborne, Land-based and Shipboard.
Likely supply chain:
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Table CM-9 Lockheed Martin Sales Revenues and Net Income 2010-2012
Further details are provided for all these systems in the Land-based and
Shipboard modules of this report.
Lockheed Martin is amongst seven contractors bidding for the FlexDAR
distributed array radar and the 3DELRR systems.
The Corporation has internal capability for manufacturing TRMs but buys-in
MMICs from the likes of Cree, RFMD or TriQuint.
Supply chain:
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Table CM-12 Northrop Grumman Sales Revenues and Net Income 2012
Item 2012
Revenues US$B 25.22
Net Income US$B 1.98
As % 7.8
Northrop Grumman also quotes the Corporation as having experienced a
3.63% decline in annual sales revenues over the past five years.
The Corporation remains sensitive to changes in US Defense expenditure. In
particular the future of the F-35 Lightning II JSF remains uncertain and there
are likely to be cut-backs to the Global Hawk program. It can be seen from Table
CM.8 that Northrop Grumman manufactures AESAs for both programs.
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The worlds largest radar manufacturer, Raytheon supplies the following AESA
radars:
Table CM-13 Summary Details of Raytheons AESAs
Code Platform Comments
AN/APG-63(V3) Airborne For F-15
AN/APG-77 Airborne Northrop
Grumman/Raytheon JV.
For F-22 Raptor. Likely
revival with possible export
orders
AN/APG-79 Airborne For F-18E/F & EA-18
Growler
AN/APG-82 (V)1 Airborne For F-15E
AN/APQ-181 Airborne For B2A Spirit
AN/APS-149 Airborne Raytheon-Boeing JV for
AEW&C aircraft
AN/ZPY-2 (previously MP- Airborne JV led by Northrop
RTIP) Grumman; Raytheon, US
Air Force Electronics.
For Global Hawk UAV
(except Triton).
RACR Airborne Upgrades & retrofits
VADER Airborne UAVs & some manned
aircraft. Pod-mounted.
AN/SPY-3 Shipboard X-band part of AMDR GaN-
based MMICs
AN/TPN-31 ATNAVICS Land-based
AN/TPY-2 Land-based Radar within the THAAD
(THAAD-GBR/FBX-T) system
BMEWS Land-based
Further details are provided for all these systems in the appropriate modules
of this report: Airborne, Land-based and Shipboard.
Raytheon is also competing with Lockheed Martin and Northrop Grumman for
the 3DELRR development contract.
The Company retains in-house capabilities for both TRM manufacture and
GaN-based MMICs. However, Kyocera America makes TRMs for Raytheon under
contract and it is likely Raytheon frequently acquires GaAs MMICs and other
strategically vital components from MMIC manufacturers such as RFMD,
Skyworks and TriQuint.
Supply chain:
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Raytheons financial performance over the past three years is shown in Table
CM-14.
* Unpublished but judging from the income before tax it looks most likely
similar to the 2011 figure.
Somewhat like Northrop Grumman (q.v.) although not so markedly
Raytheons revenues have been slowly declining for at least the past three
years. The Company would appear to maintain a good level of profitability.
Raytheon also remains sensitive to changes in US Defense expenditure but
perhaps only to be cut-backs to the Global Hawk program.
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With these eleven AESA radars Selex ES is easily the leading European
manufacturer in this regard.
Selex ES has a Strategic Supply Agreement with RFMD which runs through at
least until the end of 2013. Under this Agreement Selex ES purchases MMICs
from RFMD Newton Aycliffe (UK).
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In the sections of each module, concerning AESAs (i.e. the final systems),
when we consider monetary values we use the following unique derived term:
We used the Excel application program to insert and process all data as well
as to generate associated forecast charts.
Geographically, data was always generated for Europe and the USA)and
then worldwide (West-friendly) by adding all these results together.
The basic underlying data have been obtained from a variety of sources
including several in the public domain (mainly using Internet-based resources).
Although judicious Internet surfing revealed much we also used data from Janes
publications and from various professional magazines. In the above parts of this
Common Module we have identified as many specific AESAs as possible, existing
and planned, for the airborne, land-based and shipboard application segments
and therefore we generated estimated and forecasted delivery (shipments) data
for every AESA.
In several instances we have addressed the important aspect of retrofitting
new AESAs onto existing platforms. Raytheons Advanced Combat Radar (RACR)
and Northrop Grummans SABR are good examples for retrofitting as upgrades
onto F-16s and F-18A through D aircraft. We used data on the existing fleets
obtained from several sources and judiciously spread the retrofit upgrade
program over several years out to and beyond the time scale of this report.
Therefore both shipment numbers and TMVs were obtained for the full AESA
systems including forecasts to 2017 (we assume a slow, graceful time decline
in AESA costs).
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Starting with all the above data we then associated this with detailed
(approximate) information of each AESA as presented above, initially for TRMs
numbers per array, unit prices (per module) and the total TRM-content array
cost. TRM unit prices were also obtained from several sources and were checked
out for consistency. With due consideration for various factors we believe will
significantly influence the markets we then generated TRM Unit Price forecast
data.
By associating these data we were able to generate:
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Appendix
Glossary of Abbreviations
AN/SPY-3 = new X-band AESA radar for future Littoral-class ships and upgrades
- The AMDR system (also: SPY-3 q.v.)
AN/SPY-4 = new S-band AESA radar for future Littoral-class ships and upgrades
- The AMDR system (also: SPY-4 q.v.)
AN/TPQ-53 = truck-mounted AESA radar from Lockheed Martin. Previously
designated EQ-36 q.v.
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CEAFAR and CEAMOUNT operate mutually (parts of the same AESA system)
COBRA = - believed must simply amount to a recognisable name
(i.e. not actually an acronym)
COTS = commercial off the shelf
DA = digitally-controlled attenuator
D/A (= DAC) = digital-to-analogue converter
DDS = direct digital (frequency) synthesiser
d = digital phase-shifter
DSP = digital signal processor
DTED = digital terrain and elevation data
EADS = European Aeronautic Defence and Space (Company)
EIRP = equivalent isotropic radiated power (from antenna or radiating element)
EL/M-2052 = phased array fire control radar (ELTA Systemswithin IAI)
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SPY-3 = new X-band AESA radar for the coming Littoral ships and also upgrades
Within the AMDR system (same as AN/SPY-3 q.v.)
SPY-4 = new S-band AESA radar for the coming Littoral ships and also upgrades
Within the AMDR system (same as AN/SPY-4 q.v.)
SSPA = solid-state power amplifier (RF in this context)
SSR = secondary surveillance radar
STARS = surveillance targeting and attack radar system (E8-C)
T/R = transmit/receive
TCM = transformational communications
TCRFS = total costs per RF subsystem
TDL = tactical common data link
TerraSAR = space-based (X-band) AESA radar. German manufacture.
THAAD = theater highaltitude airborne defense (see AN/TPY-2 AESA)
TMD-GBR = theater missile defense ground based radar
T/R (or TR) = transmit-receive (usually relating to the radar switch)
TRM = transmit-receive modules (shortened abbreviation)
TWT = travelling-wave tube (microwave valve type of wideband amplifier)
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