Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Keywords--6T SRAM cell, less power, read access time, write access time, 1kb, CMOS technologies
I. INTRODUCTION
In today technological changes happening, there is a
huge demand for finding out devices with low power.
The demand of low power becomes the key of the
VLSI designs rather than high speed, particularly in
embedded SRAMs and caches [3]. In deep submicron
CMOS technology, we scaled down channel length of
CMOS transistor, so that area of CMOS transistor is
less. If area reduced then automatically power is less
consumption. A few critical circuits in a system not
only affect the design metrics but may fail to operate
in deep submicron technology. Hence the SRAM
arrays are designed, analysed and checked for its
design metrics in deep submicron CMOS
technologies.
Six-transistor (6T) SRAM cell is shown in Fig 1. 6T
SRAM cell consists of two cross-coupled inverters
(M1-M3 and M2-M4) [1-3].
Fig 2.1kb 6T SRAM cell Structure
1kb SRAM structure has 32 rows and 32 columns of
SRAM cell. Row indicates wordline of SRAM cell.
Column indicates bitline of SRAM cell [4,6-7]. In
figure has some other circuit like write driver circuit,
precharger circuit, address decoder and sense
amplifier, which has special function for the SRAM
Fig 1.Six-transistor (6T) SRAM cell cell.
Transistors connected to the bitlines are called A: WRITE DRIVER CIRCUIT
access transistors (M5-M6). Transistors pull the cell The function of the SRAM write driver is to write
values input data to the bitlines when Write Enable (WE)
to VDD are called load transistor (M3-M4), and the signal is enabled; otherwise the data is not written
ones connected to ground are called driver onto the bitlines [1]. Only one write driver is needed
transistors (M1-M2). for each SRAM column. The schematic of the write
This paper review section wise as under as: Section II driver circuit is shown in Fig 3.
deals with 1kb SRAM structure, section III deals with
Write/Read Operation of both SRAM cell, simulation
and results are discussed in section IV. Finally the
conclusion is given in section V.
II. 1KB 6T SRAM CELL STRUCTURE
Fig 2 Shows 1kb 6T SRAM cell structure.
C: ADDRESS DECODER
Address decoder is used to decode the given input
address and to enable a particular wordline (WL). In
particular dynamic NAND CMOS decoder is used [9-
12]. For an n-word memory, an m: n dynamic NAND
CMOS decoder is used where m=log2n. The
schematic of 2:4 dynamic NAND CMOS decoder is
shown in Fig 5. 5:32 dynamic NAND CMOS decoder
Fig 6. latch-type SA for 6T SRAM cell
made for 1Kb SRAM cell. According to selection of
III. Write/Read Operation
input we can enable particular wordline row of
Firstly the write operation of the cell is described as
SRAM structure. All the outputs of the array are high
follows. Write operation means store data into the
by default, with the exception of the selected row,
nod of SRAM cell. In order to store logic 1 to the
which is low. Since the interface between decoder
cell, BL is charged to V DD and BLB is charged to
and memory often includes a buffer, it can be made
ground and vise verse for storing logic 0. Then the
inverting to enable the WL.
wordline voltage is switched to VDD to turn on the
NMOS access transistors. When the access
transistors are turned on, the values of the bitlines
are written into Q and QB [2].
The read operation means data read from the SRAM
cell. To read from the cell the bitlines are charged to
ground instead of VDD and the wordline voltage is set
to VDD to turn on the NMOS access transistors. The
node with logic 1 stored will pull the voltage on the
corresponding bitline up to a high (not Vdd because
of the voltage drop across the NMOS access
transistor) voltage level. The other bitline is pulled to
ground. The sense amplifier will detect which bitline
is at a high voltage and which bitline is at ground [6].
If the cell was storing logic 0 the voltage level of BL
Fig .5 2:4 Dynamic NAND Decoder will be lower than BLB so the sense amplifier will
D: SENSE AMPLIFIER output logic 0. If the cell was storing logic 1 then
The function of SRAM cell in Sense amplifiers (SA) is the voltage level of BL will be higher than BLB then
sensing signal from BLB and BL. Sense amplifier is an the sense amplifier will output logic 1.
important component in memory design. One of the IV. SIMULATION AND RESULTS
major issues in the design of SRAMs is the speed of The following configuration of SRAM arrays were
read operation. SA is present in every column of designed and analysed using the Standard 6T SRAM
1*1 37.4946 w
16*16 696.4672 w
65 nm 32*32 1412.22 w
Table 2. Power Dissipation of 6T SRAM Cell In 65 nm
Fig 11. 32*32 Write/read operation of 6T SRAM cell
in 65nm CMOS technology CMOS Technology.
CMOS Configuration TDP
Technology
1*1 20.73 w
16*16 383.44 w
45nm 32*32 768.00 w
Table 3. Power Dissipation of 6T SRAM Cell In 45nm
CMOS Technology
The total number of transistors used for various
configurations of 6T SRAM cells has been tabulated
as shown in Table 4. If we reduce the CMOS
technology then we have scale down channel length
of transistor. so that automatic reduce the area of
CMOS transistor structure. So that 45nm CMOS
technology has required less area compared to other
technology.
Configuration Total number of transistors
Fig 12. 32*32 Write/read operation of 6T SRAM cell 1*1 31T
in 45 nm CMOS technology 16*16 2136 T
Access time is most important parameter for SRAM 32*32 7402 T
operation. Access time is nothing but propagation Table 4. Total Number of Transistors
delay to getting proper SRAM operation. The Read
Access time is the time measured from the point at V. CONCLUSION
which the RE signal reaches 10% of VDD to the point 1 kb 6T SRAM cell is designed in 65nm, 45nm CMOS
at which the output signal becomes +/- 10% VDD of technologies. Above all the result from we can
the required logic value Sense amplifier required conclude that smaller deep submicron CMOS
some time to sensing output from BLB and BL. technology is used less power consumption and less
The Write Access time is the time measured from the area required. Here 45nm CMOS technology has 45%
point at which the WE reaches 50% of VDD to the less power consumption compared to 65 CMOS
point at which the storage node of the cell reaches technology and also less area.
50% of VDD. SRAM required some time to stored VI. REFERENCES
value at node QB and Q. Read access times and write [1]Sandeep R , Narayan T Deshpande , and A R
access time for 6T SRAM cells result show in Aswatha, Designand Analysis of a New Loadless 4T
SRAM Cell in Deep Submicron CMOS Technologies,
table .1
Second International Conference on Emerging Trends
1KB SRAM cell 65nm 45nm
in Engineering and Technology, ICETET-09..
CMOS CMOS
[2]Jinshen Yang and Li Chen, A New loadless 4-
Technology Tech-nology
transistor SRAM cell with a 0.18m CMOS
Read Access Time 304 ps 232.52 ps
technology, Electrical and Computer Engineering,
Write Access Time 97.93 ps 87.42 ps