SE2521A80

2.4 GHz Wireless LAN Front End

Preliminary

Applications Product Description

ƒ IEEE802.11b DSSS WLAN The SE2521A80 is a complete 802.11 b/g WLAN RF
ƒ IEEE802.11g OFDM WLAN front-end module providing all the functionality of the
power amplifier, power detector, T/R switch, diversity
ƒ Access Points, PCMCIA, PC cards switch and associated matching. The SE2521A80
provides a complete 2.4 GHz WLAN RF solution from
Features the output of the transceiver to the antennas in an
ƒ Dual Mode IEEE802.11b & IEEE802.11g ultra compact form factor.
ƒ All RF ports matched to 50 Ω
Designed for ease of use, all RF ports are matched to
ƒ Integrated PA, TX Filter, DPDT T/R and Diversity 50 Ω to simplify PCB layout and the interface to the
switches transceiver RFIC. The SE2521A80 also includes a
ƒ Integrated Power Detector transmitter power detector with 20 dB of dynamic
ƒ 20 dBm @ 3.0 % EVM, 802.11g, 54 Mbits range and a digital enable control for transmitter
ƒ 20 dBm, 802.11b, ACPR = -37 dBr, 11 Mbits power ramp on/off control. The power ramp rise/fall
ƒ Single supply voltage: 3.3 V ± 10 % time is 1 μsec typical.
ƒ Small lead free package, 8 mm x 7 mm x 1.2
The SE2521A80 is pin for pin compatible to SiGe’s
mm, MSL 3
SE2521A34 for easy transition of medium power
designs to higher power designs.
Ordering Information
The device also provides a notch filter from 3.2-3.3
GHz prior to the input of the power amplifier.
Part Number Package Remark
SE2521A80 24 pin LGA Samples
SE2521A80-R 24 pin LGA Tape and Reel
SE2521A80-EK1 N/A Evaluation kit

Functional Block Diagram

VCC V CC3

TX EN Bias Circuitry

50 Ohm Notch 50 Ohm Switch ANT_A (50 Ohm)

TXIN
Match Filter OMN + LPF

ANT_B (50 Ohm)

Power
PD_OUT
Detector Switch
Control

50 Ohm C1
RXOUT Match
C2
C3
C4

Figure 1: Functional Block Diagram

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2.4 GHz Wireless LAN Front End
Preliminary

Pin Out Diagram

ANT_A

ANT_B
GND

GND

GND

GND

GND
24 23 22 21 20 19 18

GND 1 17 C4

VCC3 2 16 C3

VCC 3 15 C2

GND 4 14 C1

GND 5 13 PD_OUT

6 7 8 9 10 11 12
RX_OUT

TXEN
GND

GND

GND
TX_IN

N/C

Figure 2: SE2521A80 Pin-Out (Top View Through Package)

Pin Out Description

Pin No. Name Description

1 GND Ground
2 VCC3 +3.3 V DC for 3rd stage power amplifier collector voltage
3 VCC +3.3 V DC
4,5 GND Ground
6 TX_IN Transmit Input
7,8,9 GND Ground
10 RX_OUT Receive Output
11 N/C No Connect
12 TXEN Transmit Enable
13 PD_OUT Power Detector
14 C1 Control 1 Input
15 C2 Control 2 Input
16 C3 Control 3 Input
17 C4 Control 4 Input
18 ANT_B Antenna B (50 ohm)
19,20 GND Ground
21 ANT_A Antenna A (50 ohm)
22,23,24 GND Ground

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 SE2521A80
2.4 GHz Wireless LAN Front End
Preliminary

Absolute Maximum Ratings

These are stress ratings only. Exposure to stresses beyond these maximum ratings may cause permanent damage
to, or affect the reliability of the device. Avoid operating the device outside the recommended operating conditions
defined below. This device is ESD sensitive. Handling and assembly of this device should be at ESD protected
workstations.

Symbol Definition Min. Max. Unit

VCC Supply Voltage on VCC -0.3 4.0 V

TXEN Power Amplifier Enable -0.3 4.0 V
TXRF RF Input Power - 2.0 dBm
TA Operating Temperature Range -20 85 °C
TSTG Storage Temperature Range -40 150 °C

Recommended Operating Conditions

Symbol Parameter Min. Typ. Max. Unit

VCC Supply Voltage 3.0 3.3 3.6 V

TA Ambient Temperature 0 25 85 °C

DC Electrical Characteristics
Conditions: VCC = VEN = 3.3 V, TA = 25 °C, as measured on SiGe Semiconductor’s SE2521A80-EV1 evaluation
board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted
Symbol Parameter Conditions Min. Typ. Max. Unit

POUT = 20 dBm, 54 Mbps

ICC-G Total Supply Current - 275 - mA
OFDM signal, 64 QAM
POUT = 20 dBm, 11 Mbps
ICC-B Total Supply Current - 300 - mA
CCK signal, BT = 0.45
VEN = 0 V, No RF Applied,
ICC_OFF Total Supply Current - 2 10 μA
C1 = C2 = C3 = C4 = 0 V

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 SE2521A80
2.4 GHz Wireless LAN Front End
Preliminary

Logic Characteristics
Conditions: VCC = VEN = 3.3 V, TA = 25 °C, as measured on SiGe Semiconductor’s SE2521A80-EV1 evaluation
board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted.
Symbol Parameter Conditions Min. Typ. Max. Unit

Logic High Voltage

VENH - 2.0 - VCC V
(Module On)
Logic Low Voltage
VENL - 0 - 0.5 V
(Module Off)
Input Current Logic
IENH - - 100 200 μA
High Voltage
Input Current Logic
IENL - - 0.2 - μA
Low Voltage

Switch Characteristics
Conditions: VCC = VEN = 3.3 V, TA = 25 °C, as measured on SiGe Semiconductor’s SE2521A80-EV1 evaluation
board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted.
Symbol Parameter Conditions Min. Typ. Max. Unit

Control Voltage
VCTL_ON - 3.0 - 3.6 V
(On State)
Control Voltage
VCTL_OFF - 0.0 - 0.2 V
(OFF State)
Low Loss Switch High State = VCTL_ON -
SWON 2.8 - VCC V
Control Voltage VCTL_OFF
High Loss Switch Low State = VCTL_OFF -
SWOFF 0 - 0.3 V
Control Voltage VCTL_OFF
On pin (C1,C2,C3,C4)
Switch Control Bias
ICTL_ON being driven high. RF - - 100 μA
Current (RF Applied)
Applied
Switch Control Bias On pin (C1,C2,C3,C4)
ICTL_ON - - 30 μA
Current (No RF) being driven high. No RF
Control Input
CCTL - - - 100 pF
Capacitance

Switch Control Logic Table

Switch Logic Operational Mode

C1 C4 C2 C3 TXRF – ANTA TXRF – ANTB RXRF – ANTA RXRF – ANTB

SWON SWOFF SWOFF SWOFF ON OFF OFF OFF

SWOFF SWON SWOFF SWOFF OFF ON OFF OFF
SWOFF SWOFF SWON SWOFF OFF OFF ON OFF
SWOFF SWOFF SWOFF SWON OFF OFF OFF ON

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 SE2521A80
2.4 GHz Wireless LAN Front End
Preliminary

AC Electrical Characteristics

802.11g Transmit Characteristics

Conditions: VCC = VEN = 3.3 V, TA = 25 °C, as measured on SiGe Semiconductor’s SE2521A80-EV1 evaluation
board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted.
Symbol Parameter Condition Min. Typ. Max. Unit

FIN Frequency Range - 2400 - 2500 MHz

54 Mbps OFDM signal,
P802.11g Output power - 20 - dBm
64QAM, EVM = 3.0 %
11 Mbps CCK signal,
BT = 0.45
P802.11b Output power - 20 - dBm
ACPR(Adj) < -35 dBr
ACPR(Alt) < -55 dBr
P1dB P1dB - - 26 - dBm
S21 Small Signal Gain - 27.0 30 34.0 dB
Small Signal Gain
ΔS21 - - 1.0 2.5 dB
Variation Over Band
S213.2 Gain @ 3.2 to 3.3 GHz - - 3 7 dB
Pout = 20 dBm, 2 Mbps,
2f,3f Harmonics - -47 -42 dBm/MHz
802.11b CCK
rd
3 Order Inter- f1 and f2 at Fc +/- 312.5
IM3 - -35 - dBc
modulation kHz, P = 20 dBm
th
5 Order Inter- f1 and f2 at Fc +/- 312.5
IM5 - -50 - dBc
modulation kHz, P = 20 dBm
10 % to 90% of final
tr Rise Time - 0.20 - μs
output power level
50 % of VEN edge and
Delay and rise/fall
tdr, tdf 90/10 % of final output - 1.0 - μs
Time
power level
S11 Input Return Loss - 6.5 9.5 - dB
PIN ≤ -2 dBm All non-harmonically related outputs less than
STAB Stability
Load VSWR = 6:1 -50 dBc/MHz

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 SE2521A80
2.4 GHz Wireless LAN Front End
Preliminary

Receive Characteristics

Conditions: VCC = VEN = 3.3 V, TA = 25 °C, as measured on SiGe Semiconductor’s SE2521A80-EV1 evaluation
board (de-embedded to device), all unused ports terminated with 50 ohms, unless otherwise noted.
Symbol Parameter Condition Min. Typ. Max. Unit

FOUT Frequency Range - 2400 - 2500 MHz

RXIL Insertion Loss - - 0.8 1.2 dB
RXRL Return Loss - - -15 -10 dB

Delta between Rx ANT_A to RX_OUT or

Delta Rx - - 0.5 dB
paths ANT_B to RX_OUT
C1 or C4 = SWON, C2 =
C3 = SWOFF, Device
TRISOL-2 Rx Leakage transmitting 20 dBm @ - - 6 dBm
ANTA or ANTB, Power
measured @ RX_OUT
Small signal input into
ANT_A or ANT_B, Device
Isolation between
not transmitting, Power
ANTRISOL ANT_A and ANT_B to 14 - 24 dB
measured @ RX_OUT,
RX_OUT
C1 AND C4 = SWON, C2
and C3 = SWOFF

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 SE2521A80
2.4 GHz Wireless LAN Front End
Preliminary

Power Detector Characteristics

Conditions: VCC = VEN = 3.3 V, TA = 25 °C, as measured on SiGe Semiconductor’s SE2521A80-EV1 evaluation
board (de-embedded to device), unless otherwise noted.
Symbol Parameter Condition Min. Typ. Max. Unit

FOUT Frequency Range - 2400 - 2500 MHz

Power detect range, Measured at ANT_A or
PDR 0 - 20 dBm
peak power ANT_B
PDZLOAD DC load impedance - - 2.6 - kohm
Output Voltage, POUT =
PDVNoRF - 0.90 0.96 1.04 V
No RF
Output Voltage, POUT =
PDVp20 - - 0.50 - V
20 dBm
Output Voltage, POUT =
PDVp22 - - 0.37 - V
22 dBm

SE2521A80 Power Detector Response

1

0.8

0.6
VDET (V)

0.4

0.2

0
5 7 9 11 13 15 17 19 21 23 25

POUT (dBm)

Figure 3: SE2521A80 Power Detector Performance Curve

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2.4 GHz Wireless LAN Front End
Preliminary

Typical Performance Data

Conditions: VCC = VEN = 3.3 V, Channel = 7, TA = 25 °C, as measured on SiGe Semiconductor’s SE2521A80-EV1
evaluation board , all unused ports terminated with 50 ohms, unless otherwise noted.

802.11g Typical Performance

Conditions: 54Mbps 802.11g OFDM Signal

SE2521A80 802.11g EVM vs. POUT over Frequency SE2521A80 802.11g EVM vs. POUT over Voltage
2400 MHz 2425 MHz 2450 MHz 2500 MHz 2.7 V 3V 3.3 V 3.6 V
5 5

4 4

EVM (%)
3
EVM (%)

2 2

1 1

0 0
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 11 12 13 14 15 16 17 18 19 20 21
POUT (dBm) POUT (dBm)

(a) (b)
Figure 4: SE2521A80 802.11g 54 Mbps EVM vs. POUT (a) Over Frequency (b) Over Voltage

802.11b Performance

SE2521A80 802.11b ACPR vs. POUT SE2521A80 Harmonics vs. POUT (802.11b CCK 1Mbps)
ACPR-ADJ ACPR-ALT 2fo 3fo

-30 -45

-35
Harmonic (dBm/1MHz)

-50
-40
ACPR (dBc)

-45 -55
-50
-60
-55

-60
-65
-65

-70 -70
15 16 17 18 19 20 21 22 23 24 25 10 11 12 13 14 15 16 17 18 19 20
POUT (dBm) POUT (dBm)

(a) (b)
Figure 5: SE2521A80 802.11b Performance (a) ACPR vs. POUT, (b) Harmonics vs. POUT

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 SE2521A80
2.4 GHz Wireless LAN Front End
Preliminary

CW Typical Performance

SE2521A80 P1dB, Small Signal Gain vs. Frequency SE2521A80 ICC vs. POUT over Frequency
P1dB SSG 2400 MHz 2425 MHz 2450 MHz 2500 MHz
29 33 600

28.5 32
500
P1dB (dBm)

28 31

SSG (dB)

I CC (mA)
400
27.5 30

300
27 29

26.5 28
200

26 27 100
2400 2420 2440 2460 2480 2500 6 8 10 12 14 16 18 20 22 24 26
Frequency (MHz) POUT (dBm)

(a) (b)

SE2521A80 Power Detector Response over Frequency

2400 MHz 2425 MHz 2450 MHz 2500 MHz
1

0.8

0.6
VDET (V)

0.4

0.2

0
5 7 9 11 13 15 17 19 21 23 25

POUT (dBm)

(c)
Figure 6: SE2521A80 CW Typical Performance (a) P1dB, Gain vs. Frequency, (b) ICC vs. POUT over Frequency
and (c) Power Detector Response over Frequency

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 SE2521A80
2.4 GHz Wireless LAN Front End
Preliminary

Package Information
Figure 7 shows the detailed device package diagram. The pads on the SiGe RF modules are plated with gold over
nickel, with a gold thickness of nominally 0.75 um. The modules can be reflowed onto FR4 based material using
eutectic SnPb or common tin based Pb free solder pastes.

5 4 3 2 1
1 2 3 4 5

6 24 24 6

GND GND GND GND GND

GND GND GND GND GND
7 23 23 7
GND GND
GND GND

8 22 22 8
GND GND
GND GND

21 9
9 21
GND GND
GND GND

10 20 20 10

GND GND
GND GND
GND GND
11 19 19 11
GND GND GND GND GND
GND GND GND GND GND

12 18 18 12

17 16 15 14 13
13 14 15 16 17

TOP SIDE

GROUND PAD
NOTES : SIGNAL PAD DETAIL
DETAIL

BOTTOM SIDE

Figure 7: SE2521A80 Package Diagram

Package Handling Information

Because of its sensitivity to moisture absorption, instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly. The SE2521A80 is capable of
withstanding a Pb free solder reflow. Care must be taken when attaching this product, whether it is done manually or
in a production solder reflow environment. If the part is manually attached, precaution should be taken to insure that
the device is not subjected to temperatures above its rated peak temperature for an extended period of time. For
details on both attachment techniques, precautions, and handling procedures recommended by SiGe, please refer to:
ƒ SiGe’s Application Note: “Land Grid Array Module Solder Reflow & Rework Information”, Document Number 69-
APP-01.
ƒ SiGe’s Application Note: “Handling, Packing, Shipping and Use of Moisture Sensitive LGA”, Document Number
69-APP-02.

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 SE2521A80
2.4 GHz Wireless LAN Front End
Preliminary

Recommended PCB Footprint

Figure 8 shows the recommended PCB footprint for the SE2521A80.

LAND PATTERN MASK PATTERN

GROUND SIGNAL
PAD DETAIL LAND DETAIL
VIA IN SIGNAL LAND TABLE
PIN NAME DESCRIPTION RECOMMENDED

NOTES :
RECOMMENDED FOOTPRINT
LGA100P800X700-24-610X505
PASTE SCREEN PATTERN
01

Figure 8: SE2521A80 Recommended PCB Footprint

Branding Information
The device branding is shown in Figure 9.

Pin 1 Identifier

Terminal Finish
Pin 1

Part Number e4
SiGe
Lot Code
2521A80
Lot Code

Figure 9: SE2521A80 Branding and Pin 1 Location

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 SE2521A80
2.4 GHz Wireless LAN Front End
Preliminary

Tape and Reel

Production quantities of this product are shipped in a standard tape-and-reel format. Specific tape and reel
dimensions and sizing is shown in Table 1 and Figure 10.

Parameter Value
Devices Per Reel 2500
Reel Diameter 13 inches

Table 1: Tape and Reel Dimensions

Figure 10: SE2521A80 Tape and Reel Information

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2.4 GHz Wireless LAN Front End
Preliminary

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http://www.sige.com

Email: sales@sige.com

Customer Service Locations:

North America: Hong Kong

1050 Morrison Drive, Suite 100 Phone: +852 3428 7222
Ottawa ON K2H 8K7 Canada Fax: +852 3579 5450

Phone: +1 613 820 9244 San Diego

Fax: +1 613 820 4933 Phone: +1 858 668 3541 (ext. 226)
Fax: +1 858 668 3546

United Kingdom
Phone: +44 1279 464217
Fax: +44 1279 464201

Product Preview
The datasheet contains information from the product concept specification. SiGe Semiconductor, Inc. reserves the right to change
information at any time without notification.

Preliminary Information
The datasheet contains information from the design target specification. SiGe Semiconductor, Inc. reserves the right to change
information at any time without notification.

Production testing may not include testing of all parameters.

Information furnished is believed to be accurate and reliable and is provided on an “as is” basis. SiGe Semiconductor, Inc. assumes
no responsibility or liability for the direct or indirect consequences of use of such information nor for any infringement of patents or
other rights of third parties, which may result from its use. No license or indemnity is granted by implication or otherwise under any
patent or other intellectual property rights of SiGe Semiconductor, Inc. or third parties. Specifications mentioned in this publication
are subject to change without notice. This publication supersedes and replaces all information previously supplied. SiGe
Semiconductor, Inc. products are NOT authorized for use in implantation or life support applications or systems without express
written approval from SiGe Semiconductor, Inc.

Copyright 2006 SiGe Semiconductor, Inc.

All Rights Reserved

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