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LM78L05, LM78L09
LM78L12, LM78L15, LM78L62
SNVS754K JANUARY 2000 REVISED DECEMBER 2016
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM78L05, LM78L09
LM78L12, LM78L15, LM78L62
SNVS754K JANUARY 2000 REVISED DECEMBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 11
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 11
3 Description ............................................................. 1 8 Application and Implementation ........................ 12
4 Revision History..................................................... 2 8.1 Application Information............................................ 12
8.2 Typical Applications ................................................ 12
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 16
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 16
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 16
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 16
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 17
6.5 Electrical Characteristics LM78L05 ...................... 5 11.1 Documentation Support ........................................ 17
6.6 Electrical Characteristics LM78L09 ...................... 5 11.2 Related Links ........................................................ 17
6.7 Electrical Characteristics LM78L12 ...................... 6 11.3 Receiving Notification of Documentation Updates 17
6.8 Electrical Characteristics LM78L15 ...................... 6 11.4 Community Resources.......................................... 17
6.9 Electrical Characteristics LM78L62 ...................... 7 11.5 Trademarks ........................................................... 17
6.10 Typical Characteristics ............................................ 8 11.6 Electrostatic Discharge Caution ............................ 17
7 Detailed Description ............................................ 10 11.7 Glossary ................................................................ 17
7.1 Overview ................................................................. 10 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ....................................... 10 Information ........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,
Recommended Operating Conditions table, Detailed Description section, Application and Implementation section,
Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
Deleted LM78L82 from the data sheet ................................................................................................................................... 1
Added Thermal Information table. .......................................................................................................................................... 1
Deleted Lead temperature (soldering) information ................................................................................................................. 4
Changed RJA values for D (SOIC) From: 180 To: 128.8, LP (TO-92) from 230 to 158.7, and YPB (DSBGA) From:
230.9 To 108.4 ....................................................................................................................................................................... 4
Changed RJC values for LP (TO-92) From: 60 To 75.2......................................................................................................... 4
VOUT 1 8 VIN
GND 3 6 GND
NC 4 5 NC
2 VOUT GND
Not to scale
1 VIN VIN NC
Not to scale
LP Package
3-Pin TO-92
Bottom View
3 VIN
2 GND
1 VOUT
Not to scale
Pin Functions
PIN
I/O DESCRIPTION
NAME DSBGA SOIC TO-92
GND C2, C3 2, 3, 6, 7 2 Ground
NC B3, C1 4, 5 No connection
VIN A1, B1 8 3 I Input supply voltage pin
VOUT A2, A3 1 1 O Output voltage pin
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Input voltage 35 V
Power dissipation Internally limited
LM78LxxACZ (TO-92) 0 125
LM78LxxACM (SOIC) 0 125
Operating junction temperature, TJ C
LM78LxxAIM (SOIC) 40 125
LM78LxxITP (thin DSBGA) 40 85
Storage temperature, Tstg 65 150 C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation 0.75 W.
(4) Recommended minimum load capacitance of 0.01 F to limit high-frequency noise.
(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation 0.75 W.
(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation 0.75 W.
(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation 0.75 W.
(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation 0.75 W.
(4) Recommended minimum load capacitance of 0.01 F to limit high-frequency noise.
LP Package
7 Detailed Description
7.1 Overview
The LM78Lxx series of positive regulators is available in the following fixed output voltages: 5 V, 6.2 V, 8.2 V, 9
V, 12 V, and 15 V. The regulator can be configured to an adjustable output by connecting the GND pin to the
center of a resistive voltage divider as shown in Figure 10. In this configuration, the fixed output voltage acts as
the reference voltage across R1 allowing the output to be adjusted by changing the resistor.
7.3.2 Protection
The LM78Lxx series of regulators has internal thermal overload protection that automatically shuts off the device
if the operating temperature becomes too high. There is also internal short-circuit current limit and output
transistor safe area protection that shuts down the device if the output current becomes too high.
7.4.2 Shutdown
The device automatically shuts down if the output current or its internal temperature becomes too high.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TIs customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
*Required if the regulator is located more than 3 inches from the power supply filter.
**Recommended minimum load capacitance of 0.01 F to limit high-frequency noise.
1.8
1.6
1.5
1.4
1.3
25qC
1.2
0 20 40 60 80 100
Load Current (mA)
VO = 5 V + (5 V / R1 + IQ) R2*
* The 5 V represents the fixed output voltage of the LM78L05. If using one of the other LM78Lxx devices, use that
fixed output voltage value when calculating VO.
IQ < 5 V / (3 R1)
Load regulation (LR) of LM78L05 (R1 + R2) / R1
*Solid tantalum
**Heat sink Q1
***Optional: Improves ripple rejection and transient response.
Load Regulation = 0.6%, IL = 0 mA to 250 mA pulsed with tON = 50 ms.
*Solid tantalum
*Solid tantalum
VO = VG + 5 V, R1 = (VIN / IQ(LM78L05))
VO = 5 V (R2 / R4) for (R2 + R3) = (R4 + R5)
A 0.5-V output will correspond to (R2 / R4) = 0.1, (R3 / R4) = 0.9
10 Layout
GND
U1
C1 C2
VIN VOUT
11.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.7 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 14-Jul-2016
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 14-Jul-2016
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 14-Jul-2016
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2016
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2016
Pack Materials-Page 2
PACKAGE OUTLINE
YPB0008 SCALE 9.000
DSBGA - 0.575 mm max height
DIE SIZE BALL GRID ARRAY
B E A
BALL A1
CORNER
0.575 MAX C
SEATING PLANE
0.15 BALL TYP
0.11 0.05 C
1
TYP
1
TYP SYMM
B
D: Max = 1.337 mm, Min =1.276 mm
0.5
TYP E: Max = 1.337 mm, Min =1.276 mm
A
0.18 1 2 3
8X
0.16
0.015 C A B
0.5
TYP
SYMM
4215100/B 07/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YPB0008 DSBGA - 0.575 mm max height
DIE SIZE BALL GRID ARRAY
(0.5)
TYP
8X ( 0.16)
1 2 3
(0.5) TYP
SYMM
B
SYMM
4215100/B 07/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YPB0008 DSBGA - 0.575 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
(R0.05) TYP
8X ( 0.3)
1 2 3
(0.5) TYP
SYMM
B
METAL
TYP
SYMM
4215100/B 07/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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