HP ProLiant DL980 G7 Server Maintenance and Service Guide - Neu

HP ProLiant DL980 G7 Server Maintenance
and Service Guide
Abstract
This document describes service procedures for the HP ProLiant DL980 G7 Server. This document is intended for experienced
service technicians. HP assumes that you are qualified in the servicing of computer equipment, are trained in recognizing
hazards in products with hazardous energy levels, and are familiar with weight and stability precautions for rack installations.
HP Part Number: AM426-9001H

Published: May 2013
Edition: 8
Copyright 2010, 2013 Hewlett-Packard Development Company, L.P.
Notices
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall
not be liable for technical or editorial errors or omissions contained herein.
Windows and Windows Server are U.S. registered trademarks of Microsoft Corporation. Intel and Xeon are trademarks of Intel Corporation
in the United States and other countries.
Contents
1 Illustrated parts catalog...............................................................................5
Mechanical Components...........................................................................................................5
System components...................................................................................................................9
2 Removal and replacement procedures.........................................................21
Required tools........................................................................................................................21
Safety considerations..............................................................................................................21
Preventing electrostatic discharge.........................................................................................21
Server warnings and cautions..............................................................................................21
Power off the server.................................................................................................................22
SAS hard drive blank..............................................................................................................22
SAS/SATA hard drive..............................................................................................................22
DVD-ROM drive......................................................................................................................23
Power supply blank.................................................................................................................23
Hot-plug power supply............................................................................................................24
Fans.....................................................................................................................................25
Upper fans........................................................................................................................25
Lower fan module..............................................................................................................25
Remove the upper or lower processor memory drawer or processor memory drawer blank...............26
Remove a processor memory drawer cover................................................................................27
Memory cartridge...................................................................................................................27
DIMMs..................................................................................................................................30
Memory options................................................................................................................32
DIMM support...................................................................................................................34
Single-, dual-, and quad-rank DIMMs...................................................................................34
DIMM identification...........................................................................................................35
DIMM installation guidelines...............................................................................................35
Memory cartridge population guidelines...............................................................................36
Memory subsystem architecture............................................................................................36
Hemisphere mode..............................................................................................................37
Memory performance optimization.......................................................................................38
Memory RAS.....................................................................................................................38
Advanced ECC memory population guidelines......................................................................39
Online Spare memory population guidelines.........................................................................39
Mirrored Memory population guidelines...............................................................................40
Heatsink................................................................................................................................42
Processor...............................................................................................................................44
Expansion slot cover...............................................................................................................49
Low profile I/O expander........................................................................................................50
Non-hot-plug expansion board.................................................................................................52
Battery-backed write cache procedures......................................................................................53
Removing the BBWC cache module......................................................................................53
Removing the BBWC battery pack........................................................................................54
BBWC low profile I/O expander location.............................................................................55
Recovering data from the battery-backed write cache..............................................................55
Remove the SPI board.............................................................................................................56
Systems Insight Display assembly..............................................................................................57
Front bezel.............................................................................................................................58
Solid state drive......................................................................................................................59
Battery..................................................................................................................................60
I/O expansion board..............................................................................................................61
Expansion board options....................................................................................................63
Contents 3
SAS backplane......................................................................................................................67
XNC module..........................................................................................................................67
System board.........................................................................................................................68
Re-entering the server serial number and product ID...............................................................70
Power backplane....................................................................................................................70
HP Trusted Platform Module.....................................................................................................72
3 Upgrading a 4s configuration to an 8s configuration....................................74
4 Flashing firmware.....................................................................................75
Flashing firmware requirements.................................................................................................75
Flashing firmware using Offline Update.....................................................................................76
Flashing firmware using Smart Components...............................................................................77
Procedure for Windows and Linux operating systems..............................................................77
Procedure for Solaris and VMware operating systems.............................................................82
5 Component identification...........................................................................83
Front panel components...........................................................................................................83
Front panel LEDs.....................................................................................................................84
System Insight Display LEDs......................................................................................................85
Processor and memory board configuration / logical (physical) location...................................87
Hard drive LEDs.....................................................................................................................87
Hard drive LED combinations...................................................................................................87
Rear panel components...........................................................................................................88
Rear panel LEDs.....................................................................................................................90
Power supply LED...................................................................................................................91
Fan location...........................................................................................................................92
System board components.......................................................................................................94
System maintenance switch.................................................................................................95
SPI board components.............................................................................................................96
Expansion board components..................................................................................................96
DIMM slot locations................................................................................................................98
Device numbers......................................................................................................................99
Battery pack LEDs...................................................................................................................99
6 Cabling................................................................................................102
XNC cabling.......................................................................................................................102
DVD-ROM drive cabling........................................................................................................103
7 Specifications.........................................................................................104
Environmental Specifications..................................................................................................104
Server Specifications.............................................................................................................105
8 Acronyms and abbreviations....................................................................107
9 Documentation feedback.........................................................................109
Index.......................................................................................................110
4 Contents
1 Illustrated parts catalog
Mechanical Components
NOTE: The list of part numbers is current and correct as of the publication of the document. Part
numbers change often. Check the HP Partsurfer website (http://partsurfer.hp.com/search.aspx),
to ensure you have the latest part numbers associated with this product.
Item Description Spare part number Customer self repair
1 Access panel AM426-69016 Mandatory1
2 Processor memory drawer AM426-69002 Mandatory1

top
Bezel - Upper AM426-69019 Mandatory1

processor-memory drawer,
frontal access
3 Blank, hard drive 392613-001 Mandatory1
4 Bezel assembly, power, SID 591209-001 Mandatory1
5 Bezel - Frontal section of AM426-69021 Mandatory1

processor-memory drawer
6 Processor memory drawer AM426-69018 Mandatory1

bottom
Not shown Blank, lower processor AM426-69008 Mandatory1

memory drawer
Mechanical Components 5
Bezel - Lower AM426-69020 Mandatory1

processor-memory drawer,
frontal access
7 Tool, T-15 Torx screwdriver 199630-001 Mandatory1
8 Blank, power supply 496058-001 Mandatory1
Not shown Plastics Kit AM426-69014 Mandatory1
Not shown Hardware kit - contains a 496058-001 Mandatory1

heatsink blank, optical
device blank, fan blank,
full-length expansion slot
cover, low-profile expansion
slot cover, PCI retainer, PCI
top retainer, PCI end
retainer, and PCI removable
retainer
Not shown Bezel kit - Miscellaneous AM426-69022 Mandatory1

parts included
Not shown 3-8 U Slide rail kit AM426-2104A Mandatory1
1
MandatoryParts for which customer self repair is mandatory. If you request HP to replace these
parts, you will be charged for the travel and labor costs of this service.
2
OptionalParts for which customer self repair is optional. These parts are also designed for
customer self repair. If, however, you require that HP replace them for you, there may or may not
be additional charges, depending on the type of warranty service designated for your product.
3
NoSome HP parts are not designed for customer self repair. In order to satisfy the customer
warranty, HP requires that an authorized service provider replace the part. These parts are identified
as "No" in the Illustrated Parts Catalog.

1
Mandatory: ObligatoirePices pour lesquelles la rparation par le client est obligatoire. Si
vous demandez HP de remplacer ces pices, les cots de dplacement et main d'oeuvre du
service vous seront facturs.
2
Optional: FacultatifPices pour lesquelles la rparation par le client est facultative. Ces pices
sont galement conues pour permettre au client d'effectuer lui-mme la rparation. Toutefois, si
vous demandez HP de remplacer ces pices, l'intervention peut ou non vous tre facture, selon
le type de garantie applicable votre produit.
3
No: NonCertaines pices HP ne sont pas conues pour permettre au client d'effectuer lui-mme
la rparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pice
soit effectu par un Mainteneur Agr. Ces pices sont identifies par la mention Non dans le
Catalogue illustr.

1
Mandatory: ObbligatorieParti che devono essere necessariamente riparate dal cliente. Se il
cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera
per il servizio.
2
Optional: OpzionaliParti la cui riparazione da parte del cliente facoltativa. Si tratta comunque
di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP,
potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

3
No: Non CSRAlcuni componenti HP non sono progettati per la riparazione da parte del cliente.
Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza
autorizzato. Tali parti sono identificate da un No nel Catalogo illustrato dei componenti.
1
Mandatory: ZwingendTeile, die im Rahmen des Customer Self Repair Programms ersetzt werden
mssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten
fr diesen Service berechnet.
2
Optional: OptionalTeile, fr die das Customer Self Repair-Verfahren optional ist. Diese Teile
sind auch fr Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von
HP vornehmen lassen mchten, knnen bei diesem Service je nach den fr Ihr Produkt vorgesehenen
Garantiebedingungen zustzliche Kosten anfallen.
3
No: KeinEinige Teile sind nicht fr Customer Self Repair ausgelegt. Um den Garantieanspruch
des Kunden zu erfllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten
Teilekatalog sind diese Teile mit No bzw. Nein gekennzeichnet.
1
Mandatory: Obligatoriocomponentes para los que la reparacin por parte del usuario es
obligatoria. Si solicita a HP que realice la sustitucin de estos componentes, tendr que hacerse
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
2
Optional: Opcional componentes para los que la reparacin por parte del usuario es opcional.
Estos componentes tambin estn diseados para que puedan ser reparados por el usuario. Sin
embargo, si precisa que HP realice su sustitucin, puede o no conllevar costes adicionales,
dependiendo del tipo de servicio de garanta correspondiente al
producto.
3
No: NoAlgunos componentes no estn diseados para que puedan ser reparados por el
usuario. Para que el usuario haga valer su garanta, HP pone como condicin que un proveedor
de servicios autorizado realice la sustitucin de estos componentes. Dichos componentes se
identifican con la palabra No en el catlogo ilustrado de componentes.
1
Mandatory: VerplichtOnderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt
deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: OptioneelOnderdelen waarvoor reparatie door de klant optioneel is. Ook deze
onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen
voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van
het type garantieservice voor het product.
3
No: NeeSommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband
met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden
vervangen. Deze onderdelen worden in de gellustreerde onderdelencatalogus aangemerkt met
"Nee".
1
Mandatory: ObrigatriaPeas cujo reparo feito pelo cliente obrigatrio. Se desejar que a
HP substitua essas peas, sero cobradas as despesas de transporte e mo-de-obra do servio.
2
Optional: OpcionalPeas cujo reparo feito pelo cliente opcional. Essas peas tambm so
projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode
haver ou no a cobrana de taxa adicional, dependendo do tipo de servio de garantia destinado
ao produto.
3
No: NenhumaAlgumas peas da HP no so projetadas para o reparo feito pelo cliente. A
fim de cumprir a garantia do cliente, a HP exige que um tcnico autorizado substitua a pea.
Essas peas esto identificadas com a marca No (No), no catlogo de peas ilustrado.
Mechanical Components 7
System components
NOTE: The list of part numbers is current and correct as of the publication of the document. Part
numbers change often. Check the HP Partsurfer website (http://partsurfer.hp.com/search.aspx),
to ensure you have the latest part numbers associated with this product.
1 PCI-X/PCI Express I/O 591204-001 Mandatory1

expansion board 588139-B21
2 PCI Express I/O expansion 591205-001 Mandatory1

board 588137-B21
3 System board AM426-69015 Optional2
4 SPI board
HP ProLiant DL980 NC375i AM426-69017 Mandatory1

SPI Board
HP ProLiant DL980 331i SPI AM451-69002 Mandatory1

Board
5 Memory module 591198-001 Optional2
6 Heatsink assembly 591207-001 Optional2
7 Memory
System components 9
2 GB (128 MBx8), 133 501533-001 Mandatory1

PC3-10600R, DDR3 DIMM
memory module
4 GB (256MBx4), 133 501534-001 Mandatory1

MHz, PC3-10600R, DDR3
DIMM memory module1Rx4
4 GB, PC3-10600R, 595424-001 Mandatory1

DDR3-1333, single-rank
memory module
4 GB PC3L 10600R 606426-001 Mandatory1

DDR3-1333 memory module
8 GB 501536-001 Mandatory1
PC3-10600R-DDR3-133
MHz RDIMM
8GB PC3L 10600R 606427-001 Mandatory1

DDR3-1333 memory module
16 GB DDR3-106, 501538-001 Mandatory1

PC3-8500R memory module
(512 MBx4)
16GB (1x16GB) memory 632204-001 Mandatory1

DIMM - Dual rank x4,
PC3L-10600, DDR3-1333,
Registered CAS-9 LP
32GB memory DIMM 32GB 632205-001 Mandatory1

4RX4 PC3L-8500R-9A
8 Processors
Intel Xeon e7520 4 core 597821-001 Mandatory1

processor, 1.86 GHz [1 GB
Level-2 cache (256 KB per
core), LGA 1567 socket, 95
W TDP]
Intel Xeon E6540 6 core 594899-001 Mandatory1

processor, 2.00 GHz [1.5
GB Level-2 cache (256 KB
per core), LGA 1567 socket,
105 W TDP]
Intel Xeon X6550 8 core 594896-001 Mandatory1

core), LGA 1567 socket,
130 W TDP]
Intel Xeon X7500 8 core 594893-001 Mandatory1

core), LGA 1567 socket,
130W TDP]
HP DL980 6 Core E7-4807 653055-001 Mandatory1

1.86 processor kit

2.0 processor kit
Intel Xeon E7-2830 650017-001 Mandatory1

4-processor kit, 2.13GHz

(24MB Level-2 cache,

6.40GT/s)

2.26 processor kit

2.4 processor kit
Not shown Thermal grease kit 395532-001 Optional2
9 Power backplane AM426-69001 No3
11 Memory cartridge
Memory cartridge for Intel 591198-001 Optional2

Xeon 7500/6500 Series
processor
Memory cartridge for Intel 647058-001 Optional2

Xeon E7 Family processor:
HP DL980
13 SAS backplane 591203-001 Optional2
14 Systems Insight Display AM426-69003 Optional2

assembly
15 SFF hot-plug drives (not

shown)
a) 72-GB, 6G SAS, 512743-001B21 Mandatory1

15,000-rpm, 6.35-cm
(2.5-in)
b) 146-GB, 6G SAS, 512744-001 Mandatory1

15,000-rpm, 6.35-cm
(2.5-in)
c) 300 GB, 6G SAS, 507284-001 Mandatory1

10,000-rpm 6.35-cm:
DL980 (2.5-in)
d) 450 GB, 6G SAS, 581284-B21 Mandatory1

10,000 rpm 6.35 cm (2.5
in)
e) 600 GB, 6G SAS, 581286-B21 Mandatory1

10,000 rpm 6.35 cm (2.5
in)
f) 900 GB, 6G SAS, 10,000 619291-B21 Mandatory1

rpm 6.35 cm (2.5 in)
HP 300 GB SAS 10K SFF 507127-B21 Mandatory1

(2.5 in.) dual port enterprise
hard drive

hard drive

hard drive
Not shown Solid state drives
System components 11
a) 60 GB 3G SATA, 6.35 572071-B21 Mandatory1

cm (2.5 in), MDL SSD
b) 120 GB, 3G SATA, 6.35 572073-B21 Mandatory1

cm (2.5 in) MDL SSD
c) 200 GB, SAS, 6.35 cm 632492-B21 Mandatory1

(2.5 in) SSD SLC drive
e) 400 GB, SAS, 6.35 cm 632494-B21 Mandatory1

(2.5 in) SSD SLC drive
Not shown Media drives
a) SATA DVD-ROM drive 481428-001 Mandatory1

481041-B21
b) SATA DVD RW drive 481429-001 Mandatory1

481043-B21
16 Fan, lower module AM426-69013 Mandatory1
17 Small form factor PCI AM426-69012 Mandatory1

Express I/O expansion
module
18 XNC module AM426-69009 Mandatory1
19 Power supply PHB - 1200W, 579229-001 Mandatory1

12V, 1U form factor,
hot-pluggable, redundant,
high-efficiency
Not shown HP 1200W CS Platinum 578322-B21 Mandatory1

Power Supply Kit
Not shown I/O
SCSI U320e host bus 593120-001 Mandatory1

adapter (HBA), dual
channel, PCIe, with low
voltage differential (LVD)
Host channel adapter - IB 4x 593412-001 Mandatory1

quad data rate (QDR) CX-2
PCIe dual port host channel
adapter
HP SC08Ge HBA 488765-B21 Mandatory1
HP NC112T PCIe Gigabit 503746-B21 Mandatory1

Server Adapter
HP NC360T PCIe Dual Port 412648-B21 Mandatory1

1Gb Server Adapter
HP NC365T 4-port Ethernet 593722-B21 Mandatory1

Server Adapter
HP NC373F PCIe Mfn 1GbE 394793-B21 Mandatory1

Server Adapter
HP NC373T PCIe Mfn 1GbE 394791-B21 Mandatory1

Server Adapter
HP NC375T PCIe 4Prt 538696-B21 Mandatory1

Gigabit Server Adapter

HP NC382T PCIe Dual-Port 458492-B21 Mandatory1

Multifunction Gb Server
Adapter
HP NC523SFP 10Gb 2P 593717-B21 Mandatory1

Adapter
HP NC524SFP Dual Port 489892-B21 Mandatory1

10GbE Module
HP NC550SFP 2 -port PCIe 581201-B21 Mandatory1

x8 Ethernet Adapter
HP NC382T PCIe Dual Port 458491-001 Mandatory1

Multifunction Gigabit Server
Adapter
SAS controller board, for use 462594-001 Mandatory1

in the Smart Array P212
controller
HP P212/256 Smart Array 462834-B21 Mandatory1

controller
HP P411/256 Smart Array 462830-B21 Mandatory1

controller
SAS controller board, for 462918-001 Mandatory1

Smart Array P411 controller
with 256 MB memory
module
HP Smart Array P411 572531-B21 Mandatory1

controller w/1GB FBWC
controller

controller w/512MB FBWC
controller
HP Smart Array P812/1 487204-B21 Mandatory1

controller Gb flash, 8-ports
internal, 16-ports external,
PCIe x8
HP SC08e 6 Gb SAS HBA 614988-B21 Mandatory1
HP Smart Array P812 587224-001 Mandatory1

controller, 24 ports, 1 Gb,
PCIe, SAS, supports up to
108 hard drives
HP Smart Array E500/256 435129-B21 Mandatory1

external controller

SAS controller, PCIe RAID
controller with eight internal
Serial Attached SCSI ports
in a low-profile form factor,
supports up to 512MB
BBWC and RAID Level-6
(ADG)

rmkt controller
HP Smart Array cache 383280-B21 Mandatory1

battery kit - For Smart Array
P400 controller only

controller
HP P410/Zero Memory FIO 462860-B21 Mandatory1

Smart Array controller

controller

rmkt controller

MB BBWC controller
HP Smart Array P410 with 572532-B21 Mandatory1

1GB FBWC controller
HP P410 with 512MB 578230-B21 Mandatory1

FBWC controller
HP SAS Expander Card 468406-B21 Mandatory1
HP StorageWorks 81Q AK344A Mandatory1

PCI-e FC HBA
HP StorageWorks FC AE312A Mandatory1

1242SR 4Gb PCIe dual
channel HBA
HP StorageWorks FC A8003A Mandatory1

2242SR 4Gb PCIe dual
channel HBA
HP StorageWorks FC AE311A Mandatory1

1142SR 4Gb PCIe HBA
HP StorageWorks FC A8002A Mandatory1

2142SR 4Gb PCIe HBA
HP StorageWorks 82E 8Gb AJ763A Mandatory1

Dual-port PCIe FC HBA
HP StorageWorks 82Q 8Gb AJ764A Mandatory1

Dual Port PCI-e FC HBA
HP StorageWorks 81E 8Gb AJ762A Mandatory1

SP PCI-e FC HBA
HP StorageWorks 8 Gb 468508-001 Mandatory1

short wave FC SFF
transceiver
HP StorageWorks 42B PCIe AP768A Mandatory1

4Gb Dual Port

4Gb Single Port

8Gb Dual Port

8Gb Single Port

PCIe one-port FC 81q HBA 489190-001 Optional2

board
HP StorageWorks AW520A Mandatory1

CN1000E Dual Port
Converged Network
Adapter
HP StorageWorks BS668A Mandatory1

CN1000Q Dual Port
Converged Network
Adapter
HP StorageWorks BK835A Mandatory1

CN1100E Dual Port
Converged Network
Adapter
HP SC11Xe HBA 412911-B21 Mandatory1
HP StorageWorks PCIe AH627A Mandatory1

U320e SCSI HBA
HP IB 4X DDR CX-2 PCI-e 592521-B21 Mandatory1

G2 Dual Port HCA
HP IB 4X QDR CX-2 PCI-e 592520-B21 Mandatory1

G2 Dual Port HCA
HP IB 4X DDR Conn-X PCI-e 448397-B21 Mandatory1

G2 Dual Port HCA
HP IB 4X DDR PCI-e G2 Dual 409376-B21 Mandatory1

Port HCA
HP 160Gb SLC PCIe ioDrive 600278-B21 Mandatory1

accelerator card
HP 320Gb MLC PCIe 600279-B21 Mandatory1

ioDrive accelerator card
HP 320Gb SLC PCIe ioDrive 600281-B21 Mandatory1

Duo accelerator card
HP 640Gb MLC PCIe 600282-B21 Mandatory1

ioDrive Duo accelerator card
HP 1.28TB MLC PCIe 641027-B21 Mandatory1

ioDrive Duo
Not shown USB/video assembly 591201-001 Optional2
Not shown 256 BBWC memory module 462974-001 Mandatory1

- 40B wide - includes
controller, does not include
batteries
Not shown Smart Array cache module
Not shown a) Smart Array cache 405835-001 Optional2

module, 512 MB
Not shown b) Smart Array cache 405836-001 Optional2

module, 256 MB
Not shown Smart Array BBWC battery 398648-001 Mandatory1

pack
Not shown FBWC, cache module, 1-GB 505908-001 Mandatory1
Not shown HP 512 MB FBWC module 534915-B21 Mandatory1
Not shown HP 1 GB FBWC module 534562-B21 Mandatory1
Not shown FBWC module, 512 MB 578882-001 Mandatory1
Not shown FBWC capacitor pack 587324-001 Mandatory1
Not shown NC524SFP dual-port 10GBE 490712-001 Optional2

module
Not shown Super capacitor module 587225-001 Optional2
PCIe mezzanine NIC card - 436431-001 Mandatory1

4-port, 1000base-T fiber
connector (FC)
8-port external SAS HBA 489103-001 Mandatory1

board
PCIe dual-port FC 82q HBA 489191-001 Mandatory1

board
PC board - PCIe single -port 489192-001 Mandatory1

FC 81e HBA board
PC board - PCIe dual-port FC 489193-001 Mandatory1

82e HBA board
4Gb PCIe to FC HBA - 397739-001 Mandatory1

StorageWorks FC142SR
single-channel
4Gb PCIe to FC HBA - 397740-001 Mandatory1

dual-port
4 GB PCIe to FC HBA 407620-001 Mandatory1

(QLogic) Features one
4Gbps FC port with SFF
multimode optic with LC-style
connector, automatic speed
negotiation, and MPIO
PCIe dual FC HBA (QLogic)- 407621-001 Mandatory1

4GB, optical LC type
connector, automatic speed
negotiation, MPIO basic
Intel NC360T PCIe 2-port 412651-001 Mandatory1

Gb (1000 Base-T) server
NIC adapter - includes a
standard-height bracket
attached
HP NC522SFP Dual-Port 468332-B21 Mandatory1

10GbE Gigabit Server
Adapter
4Gb PCIe-to-FC HBA - 397740-001 Mandatory1

dual-channel
4Gb PCIe-to-FC HBA - 397740-001 Mandatory1

dual-channel
SCSI U320e (HBA) - dual 445009-001 Mandatory1

channel, PCIe, with LVD

Dual-channel Ultra320 PCIE 445009-002 Mandatory1

HBA
PC board - HBA, 81Q, FC, 466515-001 Mandatory1

PCIe
SPS-BD,NC522SFP+ 10 468349-001 Mandatory1

gigabit,SE
PCIe one-port FC 81q HBA 489190-001 Mandatory1

board
SPS-BD,NC112T,PCIe 503827-001 Mandatory1

gigabit ADP
SPS-BD NIC PXIE 4P 539931-001 Mandatory1

10/100/1000
HP NC550SFP 10Gb 2-port 581201-B21 Mandatory1

PCIe x8 Ethernet Adapter
NC550SFP dual-port 10GbE 586444-001 Mandatory1

server adapter
SPS-BD mezzanine 4X DDR 593413-001 Mandatory1

IB CX G2 dual-port
Quad port NC365T adapter 593743-001 Mandatory1

- 1 gigabit Ethernet (GbE)
PC board - ioDrive 600474-001 Mandatory1

accelerator card, 160 GB,
logical Not And (NAND)
flash, Single Level Cell (SLC),
bandwidth (64kB) 750MBs
writes, 770MBs reads,
access latency (512 Byte)
twenty-six microseconds,
123,000 Interface
Operating Procedures (IOPS)
75/25 R/W

accelerator card, 320GB,
logical NAND flash, MLC,
bandwidth (64kB) 510MBs
writes, 735M/s reads,
access latency (512 Byte)
twenty-nine microseconds,
67000 IOPS (75/25 R/W)

logical NAND flash, SLC,
bandwidth (64kB) 1.5GBs
writes 1.5GBs reads, access
latency (512 Byte) twenty-six
microseconds, 238,000
IOPS 75/25 R/W mix

logical NAND flash, MLC,
bandwidth (64kB) 1.0GBs
writes, 1.5GBs reads,
access latency (512 byte)
twenty-nine microseconds,
138, 000 IOPS 75/25

R/W mix
Not shown SPS-PCA Mini-DIMM 512MB 581135-001 Mandatory1
Not shown Battery, 3V, Lithium 153099-001 Mandatory1
Not shown Cable kit for DL980G7 AM426-69011 Mandatory1
Not shown a) Cable assembly, USB, Mandatory1

video
Not shown b) Cable assembly, power, Mandatory1

UID
Not shown c) Cable assembly, SAS Mandatory1

power
Not shown d) Cable, SATA DVD Mandatory1
Not shown e) Cable assembly, SSD Mandatory1
Not shown f) Cable assembly, power, Mandatory1

fan, backplane/SPI
Not shown g) Cable assembly, thermal Mandatory1

sensor
Not shown g) Cable assembly, Mini Mandatory1

SAS (SPI to SAS backplane)
Not shown SATA DVD power cable 496071-001 Mandatory1
Not shown Cable assembly, 5A BBWC 409124-001 Mandatory1

battery
Not shown Cable assembly, SATA 501025-001 Optional2

power/data
Not shown Cable assembly, mini-SAS, 498426-001 Mandatory1

83.8 cm (33-in)
Not shown Cable - Serial ATA (SATA), 531997-001 Mandatory1

power / data
Not shown Cable, XNC JLink, 35.56 cm AM426-69023 Mandatory1

(14 in)
Not shown Trusted Platform Module 488069-B21 No3

(TPM) kit
Not shown Trusted Platform Module 505836-001 No3

(TPM)
1
MandatoryParts for which customer self repair is mandatory. If you request HP to replace these
parts, you will be charged for the travel and labor costs of this service.
2
OptionalParts for which customer self repair is optional. These parts are also designed for
customer self repair. If, however, you require that HP replace them for you, there may or may not
be additional charges, depending on the type of warranty service designated for your product.
3
NoSome HP parts are not designed for customer self repair. In order to satisfy the customer
warranty, HP requires that an authorized service provider replace the part. These parts are identified
as "No" in the Illustrated Parts Catalog.


1
Mandatory: ObligatoirePices pour lesquelles la rparation par le client est obligatoire. Si
vous demandez HP de remplacer ces pices, les cots de dplacement et main d'oeuvre du
service vous seront facturs.
2
Optional: FacultatifPices pour lesquelles la rparation par le client est facultative. Ces pices
sont galement conues pour permettre au client d'effectuer lui-mme la rparation. Toutefois, si
vous demandez HP de remplacer ces pices, l'intervention peut ou non vous tre facture, selon
le type de garantie applicable votre produit.
3
No: NonCertaines pices HP ne sont pas conues pour permettre au client d'effectuer lui-mme
la rparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pice
soit effectu par un Mainteneur Agr. Ces pices sont identifies par la mention Non dans le
Catalogue illustr.
1
Mandatory: ObbligatorieParti che devono essere necessariamente riparate dal cliente. Se il
cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera
per il servizio.
2
Optional: OpzionaliParti la cui riparazione da parte del cliente facoltativa. Si tratta comunque
di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP,
potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.
3
No: Non CSRAlcuni componenti HP non sono progettati per la riparazione da parte del cliente.
Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza
autorizzato. Tali parti sono identificate da un No nel Catalogo illustrato dei componenti.
1
Mandatory: ZwingendTeile, die im Rahmen des Customer Self Repair Programms ersetzt werden
mssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten
fr diesen Service berechnet.
2
Optional: OptionalTeile, fr die das Customer Self Repair-Verfahren optional ist. Diese Teile
sind auch fr Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von
HP vornehmen lassen mchten, knnen bei diesem Service je nach den fr Ihr Produkt vorgesehenen
Garantiebedingungen zustzliche Kosten anfallen.
3
No: KeinEinige Teile sind nicht fr Customer Self Repair ausgelegt. Um den Garantieanspruch
des Kunden zu erfllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten
Teilekatalog sind diese Teile mit No bzw. Nein gekennzeichnet.
1
Mandatory: Obligatoriocomponentes para los que la reparacin por parte del usuario es
obligatoria. Si solicita a HP que realice la sustitucin de estos componentes, tendr que hacerse
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
2
Optional: Opcional componentes para los que la reparacin por parte del usuario es opcional.
Estos componentes tambin estn diseados para que puedan ser reparados por el usuario. Sin
embargo, si precisa que HP realice su sustitucin, puede o no conllevar costes adicionales,
dependiendo del tipo de servicio de garanta correspondiente al
producto.
3
No: NoAlgunos componentes no estn diseados para que puedan ser reparados por el
usuario. Para que el usuario haga valer su garanta, HP pone como condicin que un proveedor
de servicios autorizado realice la sustitucin de estos componentes. Dichos componentes se
identifican con la palabra No en el catlogo ilustrado de componentes.
1
Mandatory: VerplichtOnderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt
deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.
2
Optional: OptioneelOnderdelen waarvoor reparatie door de klant optioneel is. Ook deze
onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen
voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van
het type garantieservice voor het product.
3
No: NeeSommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband
met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden
vervangen. Deze onderdelen worden in de gellustreerde onderdelencatalogus aangemerkt met
"Nee".

1
Mandatory: ObrigatriaPeas cujo reparo feito pelo cliente obrigatrio. Se desejar que a
HP substitua essas peas, sero cobradas as despesas de transporte e mo-de-obra do servio.
2
Optional: OpcionalPeas cujo reparo feito pelo cliente opcional. Essas peas tambm so
projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode
haver ou no a cobrana de taxa adicional, dependendo do tipo de servio de garantia destinado
ao produto.
3
No: NenhumaAlgumas peas da HP no so projetadas para o reparo feito pelo cliente. A
fim de cumprir a garantia do cliente, a HP exige que um tcnico autorizado substitua a pea.
Essas peas esto identificadas com a marca No (No), no catlogo de peas ilustrado.

2 Removal and replacement procedures
Required tools
You need the following items for some procedures:
Torx T-15 screwdriver (provided with the server)
Phillips screwdriver
Flathead screwdriver
Diagnostics Utility
Safety considerations
Before performing service procedures, review all the safety information.
Preventing electrostatic discharge

To prevent damaging the system, be aware of the precautions you need to follow when setting up
the system or handling parts. A discharge of static electricity from a finger or other conductor may
damage system boards or other static-sensitive devices. This type of damage may reduce the life
expectancy of the device.
To prevent electrostatic damage:
Avoid hand contact by transporting and storing products in static-safe containers.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
Place parts on a grounded surface before removing them from their containers.
Avoid touching pins, leads, or circuitry.
Always be properly grounded when touching a static-sensitive component or assembly.
Server warnings and cautions

Before installing a server, be sure that you understand the following warnings and cautions.
WARNING! To reduce the risk of electric shock or damage to the equipment:

Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all
times.
Unplug the power cord from the power supply to disconnect power to the equipment.
Do not route the power cord where it can be walked on or pinched by items placed against
it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends
from the server.
WARNING! To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can lead
to thermal damage.
Required tools 21
Power off the server
WARNING! To reduce the risk of personal injury, electric shock, or damage to the equipment,
disconnect the power cord to remove power from the server. The front panel Power On/Standby
button does not completely shut off system power. Portions of the power supply and some internal
circuitry remain active until the power cord is disconnected.
NOTE: If installing a hot-plug device, it is not necessary to power down the server.
1. Back up the server data.
2. Shut down the operating system as directed by the operating system documentation.
3. If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs
illuminate on the front and rear panels of the server.
4. Press the Power On/Standby button to place the server in standby mode. When the server
activates standby power mode, the system power LED changes to amber.
5. If the server is installed in a rack, locate the server by identifying the illuminated rear UID LED
button.
6. Disconnect the power cords.
The system is now without power.
SAS hard drive blank

CAUTION: For proper cooling, do not operate the server without the access panel, baffles,
expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the
amount of time the access panel is open.
Remove the component as indicated.
To replace the blank, slide the blank into the bay until it locks into place.
SAS/SATA hard drive

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless
all bays are populated with either a component or a blank.
To remove the component:
1. Determine the status of the drive from the hot-plug SAS hard drive LED combinations (Hard
drive LED combinations (page 87)).
2. Back up all server data on the hard drive.
3. Remove the hard drive.

To replace the component, reverse the removal procedure.
DVD-ROM drive
1. Power down the server.
2. Extend the server from the rack.
3. Remove the access panel.
4. Disconnect the cable from the rear of the DVD-ROM drive.
5. Remove the DVD-ROM drive.
Power supply blank

Remove the component as indicated.
DVD-ROM drive 23
Hot-plug power supply

The server supports up to eight hot-plug power supplies. Install all power supplies to provide full
redundancy.
HP recommends installing redundant hot-plug power supplies in pairs.
To confirm the redundancy of your configuration, see the HP power advisor at the HP website
(http://www.hp.com/go/hppoweradvisor).
WARNING! To reduce the risk of electric shock or damage to the equipment:

Do not disable the power cord grounding plug. The grounding plug is an important safety
feature.
Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all
times.
Unplug the power cord from the power supply to disconnect power to the equipment.
Do not route the power cord where it can be walked on or pinched by items placed against
it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends
from the server.
1. Disconnect the power cord from the failed power supply.
2. Remove the failed power supply.

Fans
NOTE: If two fan fail or if a dual-rotor fan is removed and the "Shutdown" operating system
pop-up alert appears, if the hot-plug fans are immediately replaced, the fan sensor state returns to
"OK" (Green); however, the 60-second shutdown is not always aborted as it should be, and the
system continues with its graceful shutdown. This issue occurs because HP Integrated Lights-Out 3
(iLO 3) Firmware Version 1.10 detects that when two fans are failed and repaired in quick
succession, they may be flagged as "Failed" and then "OK" in a random order, so iLO 3 does
not detect that the shutdown should be canceled when the fans are hot-swapped. A future version
of iLO 3 firmware will prevent the graceful shutdown from continuing if the fans are immediately
replaced.
There is no workaround to prevent the possible shutdown; however, if the fans fail and need to be
replaced, perform the following instead of hot-swapping the fans:
1. Shut down the server and remove the power cord.
2. Replace any dual rotor fans (or two individual fans).
3. Power the server back on.
Upper fans
3. Remove the fan.
Lower fan module

2. Remove the fan module.
Fans 25
Remove the upper or lower processor memory drawer or processor memory

drawer blank
1. Power off the server (Power off the server (page 22)).
2. Release the latches on the release lever.
3. Lower the handle, and then extend the processor memory drawer from the server until the
release latches catch.
4. Firmly holding the processor memory drawer, press the release buttons and then remove the
drawer from the server.
The procedure is the same for the upper and lower processor memory drawers, and the processor
memory drawer blank.
CAUTION: XNC cabling (XNC cabling (page 102)) is required for eight processor systems.
Failure to cable the XNC will result in the lower processor memory drawer not being recognized
by the server.

Remove a processor memory drawer cover
2. Remove the processor memory drawer. (Remove the upper or lower processor memory drawer
or processor memory drawer blank (page 26))
3. Remove the processor memory drawer cover.
The procedure is the same for the upper and lower processor memory drawers, and the processor
memory drawer blank.
by the server.
Memory cartridge
NOTE: Be sure you are using the correct spare part number when replacing the memory cartridge.
The server ships with one of two different memory cartridges, which are not interchangeable.
2. Remove the processor memory drawer (Remove the upper or lower processor memory drawer
or processor memory drawer blank (page 26)).
3. Remove the processor memory drawer cover (Remove a processor memory drawer cover
(page 27)).
4. Remove the failed memory cartridge.
Remove a processor memory drawer cover 27

5. Open the memory cartridge cover.
6. Remove the DIMMs from the failed memory cartridge:

a. Open the DIMM slot latches.
b. Remove the DIMM.

To replace the component:
1. Install the DIMMs in the replacement memory cartridge:
b. Install the DIMM.
2. Close the memory cartridge cover.

3. Install the memory cartridge.
Memory cartridge 29
4. Install the processor memory drawer cover.
5. Install the processor memory drawer.
6. Power up the server.
DIMMs
(page 27)).
4. Remove the memory cartridge.
5. Open the memory cartridge cover.

6. Remove the failed DIMM from the memory cartridge:
b. Remove the DIMM.

1. Install the replacement DIMM in the memory cartridge:
b. Install the DIMM.
DIMMs 31
2. Close the memory cartridge cover.
3. Install the memory cartridge.

Memory options
This server contains eight memory cartridge connectors in each processor memory drawer. Each
memory cartridge can contain eight DIMMs, for a total of 128 DIMMs, for a maximum memory
configuration of 4 TB.
The server supports the following DIMM speeds:
Single- and dual-rank PC3-10600 (DDR-1333) DIMMs operating at 1066 MHz
Quad-rank PC3-8500 (DDR-1066) DIMMs operating at 1066 MHz

Depending on the processor model, the memory clock speed might be reduced to 1066 or 800
MHz.
WARNING! There is not enough available PCI memory to allocate to all devices installed in the
system. Devices which were not allocated requested resources may not operate properly.This occurs
during the I/O configuration phase of POST, after the System ROM has allocated most of the
available memory for some PCI devices, leaving insufficient memory for PCI devices that have not
yet been configured.The above message is an indication that the HP ProLiant DL980 G7 server
has encountered this MMIO limitation and does not indicate an issue with the server. It can occur
when the I/O configuration of the server demands resources beyond those which the platform
architecture allows.This message is an indication that the HP ProLiant DL980 G7 server has
encountered this MMIO limitation and does not indicate an issue with the server. It can occur when
the I/O configuration of the server demands resources beyond those which the platform architecture
allows.If some PCI devices are not allocated memory and the warning message appears during
POST, perform one or more of the following potential workarounds to allow the remaining PCI
devices to receive their requested memory allocations:If the server operating system documentation
states that it requires 2GB (or more) of memory below the 4GB address boundary, do not perform
Step 1 below because it may result in operating system boot failure.If the operating system
documentation does not specify its memory requirements below the 4GB boundary, the Step 1
procedure below may be attempted. However, if performing Step 1 results in operating system
boot failure, perform Step 1 again and change Memory Mapped I/O Options to the default value
of 2GB of Memory Mapped I/O , and then perform Step 2 below:
1. Change the MMIO Settings in the ROM-Based Setup Utility (RBSU).
a. Boot the server.
b. Press the F9 key during POST (when the F9 prompt appears).
c. Select Advanced Options.
d. Select Advanced System ROM Options.
e. Select Memory Mapped I/O Options.
f. Change the default selection of 2GB of Memory Mapped I/O to either 3GB of Memory
Mapped I/O or Automatically configure Memory Mapped I/O.
g. Reboot the server and verify that no warning messages appear during POST. If the
operating system will not boot, perform Step 1 again and reset Memory Mapped I/O
Options to the default value of 2GB of Memory Mapped I/O .
2. If the warning message continues to appear, ensure that all slotted PCI devices are using
updated firmware and drivers and reboot the server.
3. If the warning message continues to appear, determine which adapter is least critical for the
operating environment and remove or disable that adapter. Repeat this step until the server
completes POST without displaying this error message.
DIMMs 33
NOTE: ProLiant DL980 G7 servers may be unable to provide MMIO (Memory Mapped I/O)
memory to all slotted PCI devices during Power-On Self-Test (POST) in large I/O configurations,
resulting in the following warning message:
NOTE: When an HP ProLiant DL980 G7 server is configured with a DIMM that has an
uninitialized SPD area, and the server is running any version of the System ROM detailed in the
Scope section below, the Survey Utility in HP SmartStart will report the "Correctable Error Threshold
Count" for the DIMM as "Feature Not Supported." However, this is incorrect. The DIMM does
actually support "Correctable Error Threshold Count." This issue is only observed when using the
Survey Tool in HP SmartStart. In addition, this issue does not affect the operation or functionality
of the server or of ECC. It only affects the reporting of ECC capabilities in the DIMM SPD and does
not impact any other system operation. Any ProLiant DL980 G7 server configured with a P66
System ROM dated 07/07/2010, 07/27/2010, or 01/27/2011 and using the Survey Tool in
SmartStart (any version) may see this issue.
This is only a reporting issue and can be safely ignored. It does not affect the operation or
functionality of the server or of ECC. It only affects the reporting of ECC capabilities in the DIMM
SPD and does not impact any other system operation. To prevent this issue from occurring, or to
correct it after it has already occurred, update the System ROM to a version dated 03/24/2011
(or later).
DIMM support
The server supports the following DIMMs:
Single- and dual-rank PC3-10600 (DDR3-1333) DIMMs operating at 1066 MT/s
While single-rank DIMMs are supported, HP recommends dual-rank and quad-rank DIMMs
since they provide significant memory throughput and better memory protection (Online Spare
memory mode) over single-rank DIMMs.
Quad-rank PC3-8500 (DDR3-1066) DIMMs operating at 1066 MT/s
Single-, dual-, and quad-rank DIMMs

To understand and configure memory protection modes properly, an understanding of single-,
dual-, and quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on
these classifications.
A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from
the memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module,
with only one rank accessible at a time. A quad-rank DIMM is effectively two dual-rank DIMMs on
the same module. Only one rank is accessible at a time. The server memory control subsystem
selects the proper rank within the DIMM when writing to or reading from the DIMM.
Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology.
For example, if current DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM
would be 4-GB and a quad-rank DIMM would be 8-GB.
Although only one data rank is accessed at any given time for each DIMM, optimized command
and address pipelining via various interleaving schemes enables the Intel Xeon 7500-series
processor architecture to benefit from dual-rank and quad-rank DIMMs. A dual-rank DIMM performs
significantly better than its single-rank counterpart. A quad-rank DIMM provides further performance
improvement even at the same DIMM capacity.

DIMM identification
To determine DIMM characteristics, use the label attached to the DIMM and the following illustration
and table.
Item Description Definition
1 Size
2 Rank 1R = Single-rank2R = Dual-rank4R =

Quad-rank
3 Data width x4 = 4-bitx8 = 8-bit
4 Memory speed 10600 = 1333-MHz8500 =

1066-MHz
5 DIMM type R = RDIMM (registered)
For the latest supported memory information, see the QuickSpecs on the HP website (http://
www.hp.com).
DIMM installation guidelines

This server supports two memory cartridges per processor. Each memory cartridge can support up
to eight DIMMs. Eight memory cartridges provide a total of 128 DIMMs per system. When installing
DIMMs in the memory cartridge, observe the following minimum guidelines:
The minimum configuration is two DIMMs per cartridge. Running in Lockstep mode, such
DIMM pairs offer larger memory protection to provide increased memory fault resiliency.
DIMMs must be installed in quads with identical characteristics. When possible, for
configuration simplicity, HP recommends using DIMMs with identical part numbers throughout
the system.
DIMM quads must be populated in sequence by letter designation. Install DIMM quad (1A,
8A in both cartridges) first, followed by DIMM quad (3B, 6B in both cartridges), DIMM quad
(2C, 7C in both cartridges) and DIMM quad (4D, 5D in both cartridges).
To achieve maximum performance, balance DIMM quads by letter groupings across all memory
cartridges so that the (1A, 8A) pair is installed in all memory cartridges first, followed by the
B-pair, C-pair, and D-pair.
When installing mixed rank DIMMs in any cartridge, DIMMs with the highest number of ranks
must be installed in the white DIMM connector locations. This guarantees proper electrical
signaling on the DDR3 channel since DIMMs with higher rank counts present larger electrical
loading on the DDR3 channel and must be populated at the end point of the channel. For
more information, see the illustration below.
CAUTION: Failure to follow these guidelines may result in the inability to recognize memory,
memory errors, or reduced memory performance.
NOTE: To utilize more than 128GB per processor socket, 44-bit addressing mode must be
used (40-bit versus 44-bit addressing is configured in the RBSU). Not all supported operating
systems support 44-bit addressing mode; refer to the desired operating system documentation
to ensure 44-bit addressing is supported. In 40-bit mode, systems with 4 installed processors
are limited to a maximum of 512GB, and systems with 8 installed processors are limited to
a maximum of 1TB of addressable memory.
DIMMs 35
AMP modes Advanced ECC, Online Spare, and Mirrored Memory have further requirements
beyond the ones listed here. For additional memory configuration requirements, see the
corresponding AMP sections:
Advanced ECC memory population guidelines (Advanced ECC memory population
guidelines (page 39))
Online Spare memory population guidelines (Online Spare memory population
guidelines (page 39))
Mirrored Memory population guidelines (Mirrored Memory population guidelines (page
40))
Memory cartridge population guidelines

This server contains eight memory cartridge slots in each processor memory drawer.
Observe the following guidelines:
Memory must be loaded in quads, with a pair of DIMMs in each memory cartridge for a
corresponding processor.
Upper processor memory board is shown on the left. Lower processor memory board is shown on
the right.
Memory is only accessible to the system if the associated processor is installed. Do not install
memory cartridges in cartridge slots without the corresponding processor installed.
Two DIMM populated memory cartridges are required per processor.
To maximize performance in multi-processor configurations, distribute the total memory capacity
evenly across all processors.
NOTE: Be sure you are using the correct spare part number when replacing the memory
cartridge. The server ships with one of two different memory cartridges, which are not
interchangeable.
Memory subsystem architecture

The Intel Xeon 7500 processor memory architecture is designed to take advantage of multiple
stages of memory interleaving to reduce latency and increase bandwidth.
Each Intel Xeon 7500 processor contains two memory controllers as shown in the illustration below.
Each memory controller has two SMI buses operating in Lockstep mode. Each SMI bus connects
to a memory buffer. The buffer converts SMI to DDR3 and expands the memory capacity of the

system. Each buffer has two DDR3 channels and can support up to four DIMMs for a total of eight
DIMMs per cartridge.
Memory speed is not affected by number of DIMMs or ranks. All DIMMs run at the highest
possible speed for a given processor.
DDR3 memory speed is a function of the QPI bus speed supported by the processor:
Processors with a QPI speed of 6.4 GT/s run memory at 1066 MT/s.
Successive cache lines are interleaved between the DIMMs and the Lockstep SMI channels of
the two memory controllers in the processor such that adjacent cache lines reside on different
memory controllers, SMIs, DIMMs, and DIMM ranks for better performance. To take advantage
of this feature, DIMMs should be populated evenly between all SMI channels. If an SMI channel
pair has more DIMMs than others, the extra memory on that SMI channel pair does not benefit
from the interleaving mechanism across memory controllers.
Hemisphere mode
The Intel Xeon 7500-series processor architecture incorporates Hemisphere mode, a
high-performance interleaving technology. Hemisphere mode combines the tracking resources of
both memory controllers within each processor for a more aggressive cache line pipelining.
Hemisphere mode is the only supported configuration, and is enabled in RBSU when processors
in the system have identical DIMM population behind both of their memory controllers. That is to
say, all populated memory cartridges are populated the same way.
Hemisphere mode should produce the best overall performance for a variety of applications.
To enable each processor to enter Hemisphere mode, both memory cartridges must be installed
and populated with equal memory capacities based on the DIMM installation guidelines
(DIMM installation guidelines (page 35)).
Greater performance is obtained when all cartridges are populated with either four or eight
dual- or quad-rank DIMMs.
The server supports Mirrored Memory mode while Hemisphere mode is enabled.
DIMMs 37
Memory performance optimization
The server supports 128 DIMMS across eight Multi-core processors (64 DIMMs across four multi-core
processors, in each processor memory drawer). While there are many DIMM population
configurations that can support any total memory size, optimal performance is achieved when
populated DIMMs can take advantage of the Intel Xeon 7500-series processor architecture.
To achieve the best performance for a given memory processor configuration, observe the following
guidelines:
The largest contributor to maximum memory bandwidth performance is to use both memory
controllers inside the processor. To achieve maximum memory bandwidth performance,
populate both memory cartridges for each installed processor. This configuration is required
for this server.
The second largest contributor to performance is to populate each DDR3 channel in each
memory cartridge. To achieve this, the minimum DIMM count per cartridge is four DIMMs
installed in DIMM pair locations A and B.
The next largest contributor to performance is the number of ranks per DIMM. Dual-rank DIMMs
perform significantly better than single-rank DIMMs. Quad-rank DIMMs offer a further
performance boost.
The best performance is obtained when all installed processors are enabled for Hemisphere
mode. Hemisphere mode is optimum when four or eight DIMMs are installed per cartridge.
Hemisphere mode can be achieved with two or six DIMMs per cartridge (2 cartridges per
processor), but this configuration is not optimal for Hemisphere mode. Hemisphere mode is
required for this server.
Maximum throughput is achieved when all memory cartridges are fully populated with the
maximum number of eight quad-rank DIMMs per cartridge.
Plan the memory configurations using identical DIMMs to achieve the memory size target, taking
into account that 64- and 128-DIMM count configurations result in the highest performance. Using
a four-processor configuration as an example, do the following:
If the initial memory target is 64 GB, populate a four-processor system with eight cartridges
of four 2-GB DIMMs each for a total of 32 DIMMs.
For 4-GB DIMMs, the initial memory target is 128-GB using 32 DIMMs. The maximum
expansion target is 256 GB with 64 DIMMs.
For 8-GB DIMMs, the initial memory target is 256-GB using 32 DIMMs. The maximum
expansion target is 512 GB with 64 DIMMs.
The maximum system memory capability is achieved with an initial memory target of 1024
GB with 32 x 32-GB DIMMs and 2 TB with 64 x 32-GB DIMMs.
For an eight-processor configuration, the same example applies, but must be done for both processor
memory drawers, resulting a doubling of the memory capacity, and a 4 TB maximum with 128 x
32 GB DIMMs.
Memory RAS
The server supports the following AMP modes:
Advanced ECC memory mode provides the greatest memory capacity for a given DIMM size
and provides x4 and x8 SDDC. This mode is the default option for this server. For more
information, see "Advanced ECC memory population guidelines (Advanced ECC memory
population guidelines (page 39))."
Online Spare memory mode provides protection against persistent DRAM failure. Rank-sparing
is more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory

protection. For more information, see "Online Spare memory population guidelines (Online
Spare memory population guidelines (page 39))."
Mirrored Memory mode provides the maximum protection against failed DIMMs. Uncorrectable
errors in the DIMMs of one memory cartridge are corrected by the DIMMs in the mirrored
cartridge. The two memory controllers of each processor form a mirrored pair using two
memory cartridges. For more information, see "Mirrored Memory population guidelines
(Mirrored Memory population guidelines (page 40))."
AMP modes are configured in RBSU. If the requested AMP mode is not supported by the installed
DIMM configuration, the server boots in Advanced ECC mode. For more information, see "HP
ROM-Based Setup Utility."
For the latest memory configuration information, see the QuickSpecs on the HP website (http://
www.hp.com/go/ProLiant).
Advanced ECC memory population guidelines

Advanced ECC memory is the default memory protection mode for the server. Up to 2-TB of active
memory using 16-GB DIMMs is supported in this AMP mode.
Advanced ECC can correct single-bit and multi-bit memory errors on a single x8 or two adjacent
x4 DRAM devices.
The server provides notification when correctable error events have exceeded a pre-defined threshold
rate. When uncorrectable errors are detected using Advanced ECC, the server notifies the user
and shuts down the operating system.
NOTE: When attempting to install or boot VMware ESX 4.1 on a ProLiant DL980 G7 server
with Advanced Memory Protection (Memory Mirroring) enabled, the following error message will
be displayed:
The system has found a problem on your machine and cannot continue.The BIOS will report that
NUMA node 1 has no memory. When implementing memory mirroring on the ProLiant DL980 G7
server, the sockets are paired so that the even socket of each pair is considered primary and the
odd socket is the mirror. However, the system reports that the cores on the odd sockets do not have
any local memory.If Memory Mirroring is enabled prior to VMware installation, then immediately
after BIOS POST and when the VMware installation begins, press F2 and add the following line
to the boot options:useNUMAInfo=falseAfter installation, the system will reboot. Perform the
following:
1. At the boot menu, press "a" to modify the kernel argument and add "useNUMAInfo=false"
to the end of the "grub append>" line.
2. Boot to VMware ESX 4.1.
3. Log into the newly installed VMWare Server with vSphere Client or vCenter Client.
4. Navigate to: Configuration Panel -> Software Advanced Settings -> VMKernel
5. Uncheck "VMkernel.Boot.useNUMAInfo" to disable NUMA.
If Memory Mirroring will be enabled after VMware is installed, perform the following:
6. Log into the installed VMWare Server using the vSphere Client or vCenter Client application.
7. Navigate to Configuration Panel -> Software Advanced Settings -> VMKernel.
8. Uncheck "VMkernel.Boot.useNUMAInfo" to disable NUMA prior to enabling memory mirroring.
Online Spare memory population guidelines

Online spare memory provides protection against persistent DRAM failure. It monitors DIMMs for
excessive correctable errors and copies the content of an unhealthy rank to an available spare
rank in advance of multi-bit or persistent single-bit failures that may result in uncorrectable faults.
Rank-sparing is more efficient than DIMM-sparing since only a portion of a DIMM is set aside for
memory protection.
DIMMs 39
When Online Spare memory is enabled, the first ranks of DIMM pair, 1A/8A, are set aside as
the sparing ranks. Therefore, the available memory is reduced by the size of the first ranks of DIMM
pair 1A/8A.
If a DIMM rank on either of the SMI buses exceeds its correctable ECC threshold, then the contents
of the failing DIMM ranks are copied to the spare DIMM ranks. Once the copy is complete, all
memory accesses to the previous failing DIMM ranks go to the spare DIMM ranks.
No performance penalty occurs for rank-sparing, other than the time it takes to copy the data from
the failing rank to the spare rank upon an error condition.
The following population rules apply to each memory cartridge. Begin with the DIMM installation
guidelines (DIMM installation guidelines (page 35)) with these additional constraints:
All installed processors must contain a valid sparing configuration.
If installing mixed rank DIMMs in a cartridge, follow the mixed rank installation rules of the
DIMM installation guidelines (DIMM installation guidelines (page 35)).
Rank sparing requires that the spare ranks of the DIMM pair 1A/8A be at least as large as
any other DIMM rank on the DDR3 channels of the cartridge. To determine the size of a single
rank in a DIMM, divide the total DIMM size by the number of ranks.
For example, the rank size of a dual-rank 2-GB DIMM is 1 GB and the rank size of a dual-rank
4-GB DIMM is 2 GB. Therefore, it is possible to support rank sparing with mixed DIMM pair
sizes in the cartridge if the 1A/8A pair is populated with the 4-GB DIMMs and the other pairs
are populated with either the identical 4-GB or 2-GB DIMMs (pairs C and D are not required
to be populated). In this case, the 2-GB rank size of the 4-GB DIMMs in the 1A/8A pair is
equal to or greater than the rank size of the other installed DIMMs.
However, the server cannot support DIMM sparing in this example if the 2-GB DIMMs are
populated in the 1A/8A pair locations and the 4-GB DIMMs are populated in any of the
remaining DIMM pair locations. This is because it violates the rule requiring that the spare
rank size of DIMM pair 1A/8A (1 GB) be equal to or larger than the single rank size of the
other DIMM pair locations, since the rank size of a 4-GB DIMM in pairs B, C, or D would be
larger (2 GB) than the spare rank size of the 2-GB DIMM pair in 1A/8A (1 GB).
Mirrored Memory population guidelines

Errors that are not corrected by ECC or SDDC cannot be corrected by Online Spare memory. By
providing added redundancy in the memory sub-system, Mirrored Memory provides the greatest
protection against memory failure beyond ECC, SDDC, and Online Spare memory.
In Mirrored Memory mode, each Lockstep DIMM pair of a memory controller (of a memory cartridge
connected to a processor) has a mirrored DIMM pair on the other memory cartridge of the sibling
processor in the same QPI island.
Upon detecting an uncorrectable memory error from a DIMM pair of a memory cartridge, the
processor avoids a system crash by reading the mirrored DIMM pairs from the other memory
cartridge. In this case, the system management routine disables the failed DIMM. Further memory
reads and writes will only occur on the mirrored DIMM pairs.
The exceptions to Mirrored Memory mode are the following:
In Mirrored Memory mode, half of the memory is allocated to memory protection.
The available memory bandwidth is reduced by up to 50% in this mode.
Mirrored Memory mode, Online Spare mode, Hemisphere mode, and interleaving cannot be
enabled simultaneously.

To configure memory for Mirrored Memory mode, observe these additional constraints:
For the server to support Mirrored Memory, all processors must have a valid mirroring
configuration.
The minimum allowable configuration is two memory cartridges per processor.
Both memory cartridges for each processor must be populated with the same DIMM
configurations.
Both of the CPU sockets on the same QPI island must be loaded with identical memory.
NOTE: When attempting to install or boot VMware ESX 4.1 on a ProLiant DL980 G7 server
with Advanced Memory Protection (Memory Mirroring) enabled, the following error message
will be displayed:
The system has found a problem on your machine and cannot continue.The BIOS will report
that NUMA node 1 has no memory. When implementing memory mirroring on the ProLiant
DL980 G7 server, the sockets are paired so that the even socket of each pair is considered
primary and the odd socket is the mirror. However, the system reports that the cores on the
odd sockets do not have any local memory.If Memory Mirroring is enabled prior to VMware
installation, then immediately after BIOS POST and when the VMware installation begins,
press F2 and add the following line to the boot options:useNUMAInfo=falseAfter installation,
the system will reboot. Perform the following:
1. At the boot menu, press "a" to modify the kernel argument and add "useNUMAInfo=false"
to the end of the "grub append>" line.
2. Boot to VMware ESX 4.1.
3. Log into the newly installed VMWare Server with vSphere Client or vCenter Client.
4. Navigate to: Configuration Panel -> Software Advanced Settings -> VMKernel
5. Uncheck "VMkernel.Boot.useNUMAInfo" to disable NUMA.
If Memory Mirroring will be enabled after VMware is installed, perform the following:
6. Log into the installed VMWare Server using the vSphere Client or vCenter Client
application.
7. Navigate to Configuration Panel -> Software Advanced Settings -> VMKernel.
8. Uncheck "VMkernel.Boot.useNUMAInfo" to disable NUMA prior to enabling memory
mirroring.
NOTE: If all installed memory is configured for a single CPU on a ProLiant DL980 G7 server
running Red Hat Enterprise Linux 5, an error message similar to the following may appear
when the server is operating under a heavy workload, prior to the server becoming
unresponsive:
soft lockup - CPU#21 stuck for 10s!This occurs because configuring all server memory for a
single CPU results in contention of all other CPUs for communication to the single node
configured with memory. This contention is exacerbated when running processes with high
memory resource requirements.This issue is not specific to the HP ProLiant DL980 G7 server.
Any server using the Non-Uniform Memory Access (NUMA) multiprocessing architecture when
all memory is configured for a single CPU may be affected. Although this has been observed
under Red Hat Enterprise Linux 5, it may also occur under Red Hat Enterprise Linux 4 and
SUSE Linux Enterprise Server 10.Recent Linux kernels (for example, kernels in Red Hat Enterprise
Linux 6.x and SUSE Linux Enterprise Server 11) have improved methods for dealing with
memory and should not experience this issue. To avoid this issue when running Red Hat
Enterprise Linux 4, Red Hat Enterprise Linux 5, or SUSE Linux Enterprise Server 10, utilize the
DIMM installation guidelines (DIMM installation guidelines (page 35)) for the ProLiant DL980
G7server:
DIMMs 41
Heatsink
(page 27)).
4. Open the processor retaining bracket.
5. Remove the heatsink.

1. Clean the old thermal grease from the top of the processor with the alcohol swab. Allow the
alcohol to evaporate before continuing.
2. Remove the heatsink protective cover.
3. Install the heatsink.

4. Close and lock the processor retaining bracket.
Heatsink 43
Processor
WARNING! Use caution when installing the processor memory module or removing the processor
memory module. The processor memory module is very heavy when fully populated.
by the server.
CAUTION: Use care when handling components to avoid damaging connector pins.
CAUTION: To help avoid damage to the processor and system board, do not install the processor
without using the processor installation tool.
CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor
configurations must contain processors with the same part number.
CAUTION: To prevent damage to the processor memory drawer cover, be sure the handle
of the processor memory drawer is fully open before removing the cover.
(page 27)).

4. Remove the heatsink (Heatsink (page 42)).
5. Open the processor locking lever and the processor socket retaining bracket.
6. Using the processor tool, remove the processor from the system board:
a. Line up the processor tool, ensuring the locking lever graphic on the tool is oriented
correctly.
b. Press in on the plastic tabs, and then place the tool on the processor.
c. Release the tabs, and then carefully lift the processor and tool straight up.
7. Carefully rotate the tool, and then push in and release the tabs to secure the processor in the
tool.
Processor 45
CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,
especially the contact area.

1. Carefully insert the processor into the processor installation tool. Handle the processor by the
edges only, and do not touch the bottom of the processor, especially the contact area.
2. Be sure the tool is oriented correctly. Align the processor installation tool with the socket, and
then install the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY
DAMAGED.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
To avoid damage to the system board:
Never install or remove a processor without using the processor installation tool.
Do not touch the processor socket contacts.
Do not tilt or slide the processor when lowering the processor into the socket.
3. Press and hold the tabs on the processor installation tool to separate it from the processor,
and then remove the tool.
Processor 47
4. Close the processor socket retaining bracket and the processor locking lever.
CAUTION: Be sure to close the processor socket retaining bracket before closing the
processor locking lever. The lever should close without resistance. Forcing the lever closed
can damage the processor and socket, requiring system board replacement.
5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to
evaporate before continuing.
6. Apply all the grease to the top of the processor in the following pattern to ensure even
distribution.

7. Install the heatsink.
8. Close and lock the processor retaining bracket.

Expansion slot cover

all expansion slots have either an expansion slot cover or an expansion board installed.
2. Extend or remove the server from the rack.
Expansion slot cover 49

4. Check for the shipping screw, and remove if present.
5. Open the latch, and remove the expansion slot cover.
Low profile I/O expander

2. Press the release button, and open the lever.
3. Slide the I/O expander out of the server. Place a hand under the component to support it as
you remove it from the server.

4. Press the side buttons to remove the component cover.
5. To open the I/O card lock, push the blue tab, flip it back, then open the hinge forward.
Low profile I/O expander 51

6. Remove expansion slot covers as necessary.
Non-hot-plug expansion board

4. Open the expansion slot latch.
5. Disconnect any cables attached to the expansion board.

6. Remove the retaining screw, if installed.
7. Remove the expansion board.
Battery-backed write cache procedures

Two types of procedures are provided for the BBWC option:
Removal and replacement of failed components:
Removing the cache module (Removing the BBWC cache module (page 53))
Removing the battery pack (Removing the BBWC battery pack (page 54))
Recovery of cached data from a failed server (Recovering data from the battery-backed write
cache (page 55))
CAUTION: Do not detach the cable that connects the battery pack to the cache module.
Detaching the cable causes any unsaved data in the cache module to be lost.
Removing the BBWC cache module

CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED
before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do
not remove the cable from the cache module. The cache module is backing up data, and data is
lost if the cable is detached.
CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching
the cable causes any unsaved data in the cache module to be lost.
Battery-backed write cache procedures 53

4. If the existing cache is connected to a battery, observe the BBWC Status LED (Battery pack
LEDs (page 99)).
If the LED is flashing every 2 seconds, data is still trapped in the cache. Restore system
power, and then repeat the previous steps.
If the LED is not illuminated, disconnect the battery cable from the cache.
5. Disconnect the cable.
6. Remove the SPI board (Remove the SPI board (page 56)).
7. Open the cache slot latches.
8. Remove the cache module.
Removing the BBWC battery pack

CAUTION: After the server is powered down, wait 15 seconds and then check the amber LED
before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do
not remove the cable from the cache module. The cache module is backing up data, and data is
lost if the cable is detached.
CAUTION: Do not detach the cable that connects the battery pack to the cache module. Detaching
the cable causes any unsaved data in the cache module to be lost.
4. If the existing cache is connected to a battery, observe the BBWC Status LED (Battery pack
LEDs (page 99)).
If the LED is flashing every 2 seconds, data is still trapped in the cache. Restore system
power, and then repeat the previous steps.
If the LED is not illuminated, disconnect the battery cable from the cache.
5. Disconnect the cable.
6. Remove the battery pack.
The SPI board is removed for clarity.

BBWC low profile I/O expander location
BBWC procedures are the same for a BBWC located in the low profile I/O expander.
Recovering data from the battery-backed write cache

If the server fails, you can recover any data temporarily trapped in the BBWC by using the following
procedure.
CAUTION: Before starting this procedure, read the information about protecting against
electrostatic discharge (Preventing electrostatic discharge (page 21)).
Battery-backed write cache procedures 55

1. Perform one of the following:
Set up a recovery server station using an identical server model. Do not install any internal
drives or BBWC in this server. (This is the preferred option.)
Find a server that has enough empty drive bays to accommodate all the drives from the
failed server and that meets all the other requirements for drive and array migration.
2. Power down the failed server. If any data is trapped in the cache module, an amber LED on
the module blinks every 15 seconds.
CAUTION: Do not detach the cable that connects the battery pack to the cache module.
Detaching the cable causes any unsaved data in the cache module to be lost.
3. Transfer the hard drives from the failed server to the recovery server station.
4. Remove the BBWC [cache module and battery pack (Removing the BBWC battery pack
(page 54))] from the failed server.
5. Perform one of the following:
Install the BBWC into an empty BBWC DIMM socket on the system board of the recovery
server.
Install the BBWC into an empty BBWC DIMM socket on any Smart Array Controller in
the recovery server.
6. Power up the recovery server. A 1759 POST message is displayed, stating that valid data
was flushed from the cache. This data is now stored on the drives in the recovery server. You
can now transfer the drives (and controller, if one was used) to another server.
Remove the SPI board

4. Disconnect all cables from the SPI board.
NOTE: If replacing the SPI board or clearing NVRAM, you must re-enter the server serial
number through RBSU (Re-entering the server serial number and product ID (page 70)).
5. Raise the levers, and lift the SPI board from the server.

6. Remove all components from the failed SPI board.
Systems Insight Display assembly

CAUTION: When routing cables, always be sure that the cables are not in a position where
they can be pinched or crimped.
4. Using a T-10 Torx screwdriver, release the two locking latches on the top of the SID bezel.
5. Pull the bezel up and away from the server.
6. Disconnect the cable from the rear of the Systems Insight Display assembly.
7. Remove the retaining screw.
8. Remove the Systems Insight Display assembly.
Systems Insight Display assembly 57

Front bezel
CAUTION: Removal of the bezel will most likely destroy the component. Have a replacement
bezel on hand for immediate replacement before removing the bezel.
4. Remove the SID bezel (Systems Insight Display assembly (page 57)).
5. Remove the seven screws from the right side of the chassis and eight screws from the left side
of the chassis.
6. From the left and right insertion tabs, slide the upper part of the bezel forward.

7. Disengage the three bezel catches between the processor memory drawers, the three catches
on the lower part of the bezel, and remove the bezel.
To replace the component, reverse the removal procedure., inserting the left side tab as the bezel
is placed into position.
Solid state drive

4. Disconnect the cable from the solid state drive.
5. Remove the solid state drive.
Solid state drive 59

Battery
If the server no longer automatically displays the correct date and time, you may need to replace
the battery that provides power to the real-time clock.
WARNING! The computer contains an internal lithium manganese dioxide, a vanadium pentoxide,
or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled.
To reduce the risk of personal injury:
Do not attempt to recharge the battery.
Do not expose the battery to temperatures higher than 60C (140F).
Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
Replace only with the spare designated for this product.

5. Remove the battery.

For more information about battery replacement or proper disposal, contact an authorized reseller
or an authorized service provider.
I/O expansion board

NOTE: When either optional I/O expansion board in installed in a two-processor configuration,
the second processor must be installed in socket 3.
I/O expansion board 61

5. Lower the handle, and then extend the processor memory drawer from the server until the
release latches catch.
6. Remove any expansion boards from the failed I/O expansion board (Non-hot-plug expansion
board (page 52)).
7. Remove the I/O expansion board:
PCI-X/PCIe Express I/O expansion board
PCIe Express I/O expansion board

Expansion board options

In the main I/O tray the server supports up to 11 expansion slots. The server ships with 5 PCI
Express expansion slots.

To support the optional expansion slots, install one of the following options into the server:
PCI Express I/O Expansion BoardAdds six optional slots
PCI-X/PCI Express I/O Expansion BoardAdds five optional slots
WARNING! There is not enough available PCI memory to allocate to all devices installed
in the system. Devices which were not allocated requested resources may not operate
properly.This occurs during the I/O configuration phase of POST, after the System ROM has
allocated most of the available memory for some PCI devices, leaving insufficient memory for
PCI devices that have not yet been configured.The above message is an indication that the
HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not indicate
an issue with the server. It can occur when the I/O configuration of the server demands
resources beyond those which the platform architecture allows.This message is an indication
that the HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not
indicate an issue with the server. It can occur when the I/O configuration of the server demands
resources beyond those which the platform architecture allows.If some PCI devices are not
allocated memory and the warning message appears during POST, perform one or more of
the following potential workarounds to allow the remaining PCI devices to receive their
requested memory allocations:If the server operating system documentation states that it requires
2GB (or more) of memory below the 4GB address boundary, do not perform Step 1 below
because it may result in operating system boot failure.If the operating system documentation
does not specify its memory requirements below the 4GB boundary, the Step 1 procedure
below may be attempted. However, if performing Step 1 results in operating system boot
failure, perform Step 1 again and change Memory Mapped I/O Options to the default value
of 2GB of Memory Mapped I/O , and then perform Step 2 below:
1. Change the MMIO Settings in the ROM-Based Setup Utility (RBSU).
a. Boot the server.
b. Press the F9 key during POST (when the F9 prompt appears).
c. Select Advanced Options.
d. Select Advanced System ROM Options.
e. Select Memory Mapped I/O Options.
f. Change the default selection of 2GB of Memory Mapped I/O to either 3GB of
Memory Mapped I/O or Automatically configure Memory Mapped I/O.
g. Reboot the server and verify that no warning messages appear during POST. If the
operating system will not boot, perform Step 1 again and reset Memory Mapped
I/O Options to the default value of 2GB of Memory Mapped I/O .
2. If the warning message continues to appear, ensure that all slotted PCI devices are using
updated firmware and drivers and reboot the server.
3. If the warning message continues to appear, determine which adapter is least critical for
the operating environment and remove or disable that adapter. Repeat this step until the
server completes POST without displaying this error message.

NOTE: For ProLiant DL980 G7 servers, when there is an HP NC550SFP 10Gb 2-port PCIe
x8 Ethernet Adapter in I/O slot 9 and an HP CN1000E Converged Network Adapter in I/O
slot 10, during a network stress test (netperf), the connection in the second port of the CN1000E
may be dropped. This issue may also occur when there is an HP CN1000E Converged
Network Adapter in slot 9 and a HP CN1000E Converged Network Adapter in slot 10.
This issue occurs in the following scenario:
1. Run a network stress test (netperf).
2. Shut down the stress test and reboot the server.
3. Run netperf again.
4. The connections to the clients will be made at a slow rate and then finally the connection
to slot 9 and 10 will be dropped.
This occurs because the ServerEngines driver is not getting enough MSI messages at driver
load time. On a ProLiant DL980 system, the driver is not getting enough MSI-X interrupts, so
the system is reverting to legacy interrupt mode.For any ProLiant DL980 G7 server running
Windows Server 2008 that has either an NC550SFP in slot 9 and an HP CN1000E Converged
Network Adapter in slot 10 or an HP CN1000E Converged Network Adapter in slot 9 and
an HP CN1000E Converged Network Adapter in slot 10, perform the following to allow
netperf to run in this configuration without connections dropping:
1. Go to the Start menu, then "Run."
2. Type "cmd."
3. From the command prompt, type "bcdedit /set UsePhysicalDestination yes."
NOTE: When multiple LAN-On-Motherboard (LOM) ports on an NC375i Network Adapter
configured in a ProLiant DL980 G7 server are connected to a DHCP and a PXE server, booting
from the PXE server may not succeed with the following error message:
No filename or root path specified(There is no F12 key option available to boot from a PXE
server.)This occurs due to the PXE implementation in the adapter firmware, which is not
HP-specific.his issue only occurs when more than one LOM ports are connected AND Port 2
is used to boot from the PXE server. If only Port 2 is connected, the PXE boot will succeed.
NOTE: If an HP ProLiant DL980 G7 with System ROM 2010.07.27 or a ProLiant DL580
G7 with System ROM 2010.08.28 is used with Integrated Lights-Out 3 (iLO 3) Firmware
Version 1.15 (or later) and I/O cards are installed in SubIO (I/O expansion board) slots or
LPIO (Low Profile PCI-e I/O expansion board) slots, then the server Power-On-Boot process
may stop responding at the point where "Inlet Ambient Temperature" is displayed.
The issue has been detected with a large range of I/O cards including the HP NC522SFP
10G NIC, Smart Array P212 Controller, and Smart Array P800 Controller. In addition, this
may also potentially occur when any I/O card is installed in SubIO/LPIO slots with the
BIOS/iLO 3 firmware combination described above.When this occurs, there are no Integrated
Management Log (IML) events or other indications other than the boot sequence does not
progress past "Inlet Ambient Temperature" as shown above.To prevent the server from ceasing
to respond during the Power-On-Boot process, upgrade the System ROM to HP ProLiant DL980
G7 System ROM 2011.01.27 (or later).
NOTE: Any HP ProLiant DL980 server configured with any of the following HP IO Accelerator
cards:
160GB SLC PCIe ioDrive (part number 600278-B21)
320GB MLC PCIe ioDrive (part number 600279-B21)
320GB SLC PCIe ioDuo (part number 600281-B21)
640GB MLC PCIe ioDuo (part number 600282-B21)

1.28TB MCL PCIe ioDuo (part number 641027-B21)
may experience thermal throttling when the server is running a System ROM dated July 27,
2010 (2010.07.27) or July 7, 2010 under both of the following conditions:
An application has sustained high WRITE-bandwidth demands to the HP IO Accelerators.
High ambient (data center) temperature (>25deg C).

When the IO accelerator card begins thermal throttling, the system will display the following
warnings: Thermal throttling activated (<junction temp in degC>)When the IO accelerator
card stops thermal throttling, the system will display the following warning: Thermal throttling
deactivated (<junction temp in degC>)The above warning messages will be logged as follows:
For Linux operating systems in: /var/log/messages
For Windows operating systems in: the Windows system event log.
To avoid the temperature messages, perform either of the following:
Accept "reduced write bandwidth" when prompted by the server. (With reduced cooling,
the IO Accelerator cards will self manage the critical internal component temperature to
stay within specifications. With no firmware change, the IO Accelerator cards will reduce
WRITE bandwidth to remain within temperature specifications. The expected WRITE
bandwidth reduction is relatively small.)
Upgrade the System ROM to a version dated January 27, 2011 (1/27/2011) or later.
NOTE: When the HP ProLiant DL980 G7 server is configured with the Low-profile PCI
Express I/O expansion kit (Option Part Number AM434A) and no additional I/O backplane
options are installed, I/O devices installed in the Low Profile I/O backplane may not function,
causing the operating system to generate a machine check when attempting to access the
devices.
When this occurs, a message similar to the following will be displayed in the Integrate
Management Log (IML):Uncorrectable Machine Check Exception (Board 0, Processor 5 or 6,
APIC ID 0x000000A0, Bank 0x0000000B or 0x0000000C, Status 0xFA000000'00160F0F,
Address 0x00000000'00000000, Misc 0x65000000'00000090)This is targeted to be
resolved in a future version of the System ROM. As a workaround, perform either of the
following:
Remove the Low-profile PCI Express I/O expansion kit (Option Part Number AM434A)
Order either of the following I/O backplane options and then add them to the server:
PCI Express I/O expansion kit option part number 588139-B21
PCI-X / PCI Express I/O expansion kit option part number 588137-B21
NOTE: ProLiant DL980 G7 servers may be unable to provide MMIO (Memory Mapped
I/O) memory to all slotted PCI devices during Power-On Self-Test (POST) in large I/O
configurations, resulting in the following warning message:
NOTE: Five or more PCIe IO Accelerator Cards are now supported when running DL980
G7 System ROM version 2011.01.27 (or later) and PCIe IO Accelerator Card firmware driver
version 2.2.3 (or later).
The server supports up to 5 low profile PCI Express expansion slots in the optional low profile PCI
Express expansion module.

NOTE: On an HP ProLiant DL980 G7 server with a 128 logical CPU configuration, if an HP
NC382T PCI Express Dual Port Multifunction Gigabit Server Adapter is located in any Low Profile
IO slot, the network connection may drop or the NIC may stop responding. This can occur while
running Windows Server 2008 R2 and HP Network Configuration Utility for Windows Server
2008 R2 Version 10.10 or Version 10.20. To prevent network connections from dropping, upgrade
to HP Network Configuration Utility for Windows Server 2008 R2 Version 10.30 (or later).
SAS backplane
4. Remove all hard drives (SAS/SATA hard drive (page 22)).
5. Disconnect all cables from the SAS backplane.
6. Release the locking latch.
7. Remove the SAS backplane.
XNC module
SAS backplane 67
3. Lower the handle, and then remove the component from the server.
CAUTION: Do not replace either the SPI board, main I/O board, upper CPU board, lower
CPU board or XNC boards with new components at the same time.
CAUTION: If replacing this component with a new part, all component firmware must be
updated (Flashing firmware using Smart Components (page 77)) before replacing any other
component.
by the server.
System board
WARNING! The server weighs approximately 72.6 kg93 kg (160 lb205 lb). To reduce the
risk of injury due to the weight of the server, remove the following components before removing
the server from the rack:
Processor memory module
Hard drives
Power supplies
The server weighs 21.8 kg (48 lb) with these components removed and might require two
people to remove the server from the rack.
CAUTION: Before starting this procedure, read the information about protecting against
electrostatic discharge (Preventing electrostatic discharge (page 21)).
CAUTION: Only authorized technicians trained by HP should attempt to remove the system
board. If you believe the system board requires replacement, contact HP Technical Support before
proceeding.

2. Remove the server from the rack.
5. Disconnect all cables from all installed expansion boards.
6. Remove all expansion boards (Non-hot-plug expansion board (page 52)).
8. Remove the I/O expansion board, if installed.
9. Remove the system board.
To replace a system board:

1. Install the spare system board.
2. Replace all components removed from the failed system board.

3. Install the access panel.
System board 69
4. Slide the server back into the rack.
After you replace the system board, you must re-enter the server serial number and the product ID.
1. During the server startup sequence, press the F9 key to access RBSU.
2. Select the Advanced Options menu.
3. Select Service Options.
4. Select Serial Number. The following warnings appear:
WARNING! WARNING! WARNING! The serial number is loaded into the system during the
manufacturing process and should NOT be modified. This option should only be used by
qualified service personnel. This value should always match the serial number sticker located
on the chassis.
Warning: The serial number should ONLY be modified by qualified personnel. This value
should always match the serial number located on the chassis.
5. Press the Enter key to clear the warning.
6. Enter the serial number and press the Enter key.
7. Select Product ID. The following warning appears:
Warning: The Product ID should ONLY be modified by qualified personnel. This value should
always match the Product ID on the chassis.
8. Enter the product ID and press the Enter key.
9. Press the Esc key to close the menu.
10. Press the Esc key to exit RBSU.
11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.
Re-entering the server serial number and product ID

After you replace the SPI board, you must re-enter the server serial number and the product ID.
1. During the server startup sequence, press the F9 key to access RBSU.
2. Select the Advanced Options menu.
3. Select Serial Number. The following warning is displayed:
Warning: The serial number should ONLY be modified by qualified service personnel. This
value should always match the serial number located on the chassis.
4. Press the Enter key to clear the warning.
5. Enter the serial number.
6. Select Product ID. The following warning is displayed:
Warning: The Product ID should ONLY be modified by qualified service personnel. This value
should always match the Product ID located on the chassis.
7. Enter the product ID, and press the Enter key.
8. Press the Esc key to close the menu.
9. Press the Esc key to exit RBSU.
10. Press the F10 key to confirm exiting RBSU. The server automatically reboots.
Power backplane
4. Remove all power supplies (Hot-plug power supply (page 24)).
5. Remove the XNC module (XNC module (page 67)).

6. Remove the SPI board (SPI board components (page 96)).
7. Remove the processor memory drawers (Remove the upper or lower processor memory drawer
8. Remove the system board (System board (page 68)).
9. Disconnect the upper cables from the power supply backplane:
a. Disconnect the upper fan power cable.
b. Remove the screws and disconnect the power cable.
c. Remove the lower fan power cable from the cable management slot.
10. Disconnect the lower cables from the power supply backplane:
a. Disconnect the lower fan power cable from the power backplane.
b. Lift the release latch.
c. Disconnect the lower power cable from the power supply backplane.
Power backplane 71
11. Remove the two screws (if present), slide the plastic retainer to the rear of the server, and then
remove the backplane.
HP Trusted Platform Module

The TPM is not a customer-removable part.
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures
the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators
should consider the system compromised and take appropriate measures to ensure the integrity of
the system data.

If you suspect a TPM board failure, leave the TPM installed and remove the system board (System
board (page 68)). Contact an HP authorized service provider for a replacement system board
and TPM board.
HP Trusted Platform Module 73

3 Upgrading a 4s configuration to an 8s configuration
To upgrade your DL980 G7 server from a 4s configuration to an 8s configuration:
1. Verify that the current system firmware is the latest available and if necessary upgrade the
system firmware (Flashing firmware (page 75)).
2. Power off the server and disconnect the power cords (Power off the server (page 22)).
3. Remove the lower processor memory drawer (Remove the upper or lower processor memory
drawer or processor memory drawer blank (page 26)).
(page 27)).
5. Install processors 5 through 8 in the lower processor memory drawer. For instructions on
installing a processor, see the HP ProLiant DL980 G7 Server User Guide.
6. Install DIMMs in the lower processor memory drawer (DIMMs (page 30)).
CAUTION: Ensure that you follow DIMM installation guidelines (DIMM installation guidelines
(page 35)) and memory cartridge population guidelines (Memory cartridge population
guidelines (page 36)).
Failure to follow these guidelines may result in the inability to recognize memory, memory
errors, or reduced memory performance.
7. Connect XNC cabling (XNC cabling (page 102)).
CAUTION: XNC cabling is required for eight processor systems. Failure to cable the XNC
will result in the lower processor memory drawer not being recognized by the server.
8. Install any additional components, such as the power profile I/O assembly.
9. Connect the power cords and power on the server. Verify server operation by monitoring
POST messages and checking the iLO IML log.
74 Upgrading a 4s configuration to an 8s configuration

4 Flashing firmware
Flashing firmware requirements
A firmware update is required when upgrading to Intel Xeon E7 Family processors or when
replacing a SPI board, main I/O board, upper CPU board, lower CPU board, or XNC assembly
with a new part.
The system firmware must be upgraded to a minimum level of HWM5.1.
If upgrading the CPUs.The CPUs and heatsinks must be replaced with the new CPUs and
heatsinks.
The server must only contain supported I/O cards. The following cards are no longer supported
on the DL980 G7 Server with Intel Xeon E7 Family processors.
I/O Card Part number
HP NC364T PCIE 4 Port 1GbE 435508-B21
HP NC522SFP Dual Port 10GbE Server Adapter 468332-B21
SC08Ge 488765-B21
To upgrade system firmware, use one of the following methods:

Flashing firmware using Offline Update Method. This is the preferred method for all operating
system.
Flashing firmware using Smart Components. This method may be used for Windows and Linux
operating systems.
Before contacting HP, always attempt to resolve problems by completing the procedures in this
guide.
NOTE: Collect the appropriate server information and operating system information before
contacting HP for support.
For United States and worldwide contact information, see the Contact HP website (http://
www.hp.com/go/assistance).
In the United States:
To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may
be recorded or monitored.
If you have purchased a Care Pack (service upgrade), see the Support & Drivers website (http://
www8.hp.com/us/en/support-drivers.html). If the problem cannot be resolved at the website, call
Flashing firmware requirements 75

1-800-633-3600. For more information about Care Packs, see the HP website (http://
pro-aq-sama.houston.hp.com/services/cache/10950-0-0-225-121.html).
In other locations, see the Contact HP worldwide (in English) (http://welcome.hp.com/country/
us/en/contact_us.html) webpage.
CAUTION: If replacing a SPI board, main I/O board, upper CPU board, lower CPU board,
or XNC assembly with a new part, all component firmware must be updated before replacing
any other component. Do no replace either the SPI board, main I/O board, upper CPU board,
lower CPU board, or XNC assembly with new components at the same time.
CAUTION: Physical access to the server is required for updating these components. This
procedure cannot be performed remotely or with automated deployment.
NOTE: Read through the entire firmware update process before beginning.
Flashing firmware using Offline Update

This procedure can be used for Windows, Linux, Solaris and VMware operating systems.
CAUTION: Physical access to the server is required for updating these components. This procedure
cannot be performed remotely or with automated deployment. Do not use vMedia Functionality.
CAUTION: While upgrading the firmware, do not power off the server or attempt any operations.
CAUTION: All steps of this procedure must be performed in the exact order given in this
procedure. Once the upgrade is started, complete the entire update. Do not stop at any point
during the update.
NOTE: This procedure will take approximately 2 - 4 hours to complete.
1. Obtain the Flash System Programmable Logic Offline Update ISO Image and the latest BIOS
(System ROM):
a. Go to the Contact HP United States (http://welcome.hp.com/country/us/en/
contact_us.html) webpage.
b. Select Support and Driver downloads.
c. Select Drivers and Software.
d. Enter a product name/number (for example: DL980), and click Search.
e. Click HP ProLiant DL980 G7 Server.
f. To retrieve an index of all available drivers, system management applications, BIOS,
firmware, software, and utilities, click your operating system.
2. Flash BIOS (System ROM) by following the component installation instructions.
3. Power down to Stand-By (dc power off).
4. Using the web interface, flash iLO.
5. Using the Offline Update ISO Image by following the installation instructions in the README.txt
file included in the zip file with the ISO image, flash System Programmable Logic.
a. Insert the update media (CD or USB key) into the DL980 G7 server, and power up or
reset the system.
b. Allow the system to boot normally; it will auto-boot into the update media.
c. After several minutes you will be presented with a splash screen. Proceed with the update,
accepting each of the three updates as they occur.
76 Flashing firmware
6. Disconnect all power cables from the server, and wait at least 30 seconds.
CAUTION: After flashing the System Programmable Logic Devices, the power must cycle
for the changes to take effect. All power cables must be unplugged for at least 30 seconds to
allow the components to lose their residual charge. Pressing the power button is not sufficient.
7. If installing new processors (Processor (page 44)), install them now.

8. Connect the power cables to the server.
10. HP recommends verifying post by watching POST codes through iLO IRC (bottom banner).
Flashing firmware using Smart Components

CAUTION: Physical access to the server is required for updating these components. This procedure
cannot be performed remotely or with automated deployment.
Procedure for Windows and Linux operating systems

CAUTION: All steps of this procedure must be performed in the exact order given in this
procedure. Once the upgrade is started, complete the entire update. Do not stop at any point
during the update.
NOTE: While upgrading the firmware, do not power off the server or attempt any operations.
NOTE: This procedure will take approximately 2 - 4 hours to complete.
This procedure uses Smart Components. Smart Components are self-extracting executables, with
a filename based on the component number.
1. Obtain the latest BIOS (System ROM) and device drivers:
a. Go to the Contact HP United States (http://welcome.hp.com/country/us/en/
contact_us.html) webpage.
b. Select Support and Driver downloads.
c. Select Drivers and Software.
d. Enter a product name/number (for example: DL980), and click Search.
e. Click HP ProLiant DL980 G7 Server.
f. To retrieve an index of all available drivers, system management applications, BIOS,
firmware, software, and utilities, click your operating system.
2. The appropriate device driver must be installed and running before using this flash component.
CAUTION: If the appropriate device driver is not installed and running before using this
flash component, you will receive the following error message if the driver is not running. "The
software is not supported for installation on this system. You must install the iLO Channel
Interface driver to use this component."
On the Windows operating system, install the HP ProLiant iLO 3 Management Controller
Driver Package.
On the Linux operating system, install the HP ProLiant Channel Interface Device Driver
for iLO.
3. Follow the component installation instructions to flash BIOS (System ROM).
4. Power down to Stand-By.
Flashing firmware using Smart Components 77

5. Use the web interface to flash iLO.
6. Power on the system.
7. Boot the system to the OS.
8. If running, disable SNMP agents service.
For Windows operating systems:
a. Run Services.
b. Select SNMP Service.
c. Click Stop to stop the service.
d. Click yes to stop the services indicated.
For Linux operating systems, enter

service hp-snmp-agents stop
.
9. Flash the FPGA using the FPGA Smart Component.
NOTE: When updating the individual components, the Smart Components will detect if the
component is already at the correct revision by displaying the message pictured below. For
components other than is CPLD, you can select "Close" and continue with the rest of the
firmware update process. For the CPLD, you must select "install" and update the CPLD.
TIP: The estimated time for this update is 10 - 15 minutes.
a. Download the Smart Component to a directory on the hard drive and change to that
directory.
Download the FPGA firmware for the Windows operating system (ftp://ftp.hp.com/
pub/softlib2/software1/sc-windows-fw/p2013128495/v68025).
Download the FPGA firmware for the Linux operating system (ftp://ftp.hp.com/pub/
softlib2/software1/sc-linux-fw/p1486976799/v68026).
b. From that drive and directory, execute the downloaded file. Linux users can execute "sh
CPxxxxxx.scexe" where CPxxxxxx.scexe represents the filename of the component. Click
"Install" when prompted.
c. If the first update pass fails, retry flashing the FPGA.
d. If the second update pass fails, browse to the iLO web information Diagnostics tab, and
use the Reset button to reset iLO.
e. Retry flashing the FPGA.
f. Upon successful update, the following dialog boxes will appear. Do not restart the server
at this time.
CAUTION: Do not power off or power down the server until the firmware for all
components in this procedure have been updated.
g. Click Restart Later.

10. Flash the CPLD using the CPLD Smart Component.

TIP: The estimated time for this update is approximately one hour.
directory.
Download the CPLD firmware for the Windows operating system (ftp://ftp.hp.com/
Download the CPLD firmware for the Linux operating system (ftp://ftp.hp.com/pub/
c. If the first update pass fails, retry flashing the CPLD.
d. If the second update pass fails, browse to the iLO web information Diagnostics tab and
e. Retry flashing the CPLD.
f. Upon successful update, the following dialog box will appear. Do not restart the server
at this time.
11. Flash the FMP using the FMP Smart Component.
TIP: The estimated time for this update is approximately one hour.
directory.
Download the FMP firmware for the Windows operating system (ftp://ftp.hp.com/
Download the FMP firmware for the Linux operating system (ftp://ftp.hp.com/pub/
c. If the first update pass fails, retry flashing the FMP.
d. If the second update pass fails, browse to the iLO web information Diagnostics tab and
e. Retry flashing the FMP.
f. Upon successful update, the following dialog box will appear.
12. Shutdown the OS.

13. Unplug all power cables from the server, and wait at least 30 seconds.
CAUTION: After flashing the System Programmable Logic Devices, the power must cycle
for the changes to take effect. All power cables must be unplugged for at least 30 seconds to
allow the components to lose their residual charge. Pressing the power button is not sufficient.
14. If installing new processors (Processor (page 44)), install them now.
15. Connect the power cables to the server.
16. Power up the server (dc on).
17. Verify post by watching post codes through iLO IRC (bottom banner). This step is optional,
but recommended.

Procedure for Solaris and VMware operating systems
For Solaris and VMware operating systems use the Flashing firmware using Offline Update Method.
5 Component identification
Front panel components
Item Description
1 Hard drive bay 1
2 Hard drive bay 2
3 Hard drive bay 3
4 Hard drive bay 4
5 Hard drive bay 5
6 Hard drive bay 6
7 Hard drive bay 7
8 Hard drive bay 8
9 Optical drive bay
10 UID button and LED
11 Health LED
12 NIC 1 LED
13 NIC 2 LED
14 NIC 3 LED
15 NIC 4 LED
16 Power on/Standby button and LED
17 SID
18 USB connectors
19 Video connector
Front panel components 83

Item Description
20 Processor memory tray (upper)
21 Processor memory tray (lower)
Front panel LEDs
Item Description Status
1 UID button and LED BlueActivated

Blue (flashing)Server being managed
remotely
OffDeactivated
2 Health LED GreenNormal (system on)

Amber (flashing)Internal system health
degraded
Red (flashing)Internal system health
critical
OffNormal (system off)
3 NIC 1 LED GreenLinked to network

Green (flashing)Linked with activity
on the network
OffNo network connection

on the network

on the network
Item Description Status

on the network
7 Power on/Standby button and LED AmberSystem has AC power and is

in standby mode.
GreenSystem has AC power and is
powered on.
OffSystem has no AC power.
System Insight Display LEDs
LED Component Description
POWER System power GreenNormal (system on)

BOOT PROGRESS Boot progress GreenNormal (system on)

Green (flashing)Normal (system on
reset)
Amber (flashing)No POST code
within first timeout period
Red (flashing)No POST code within
a subsequent second timeout period
System Insight Display LEDs 85

LED Component Description
EXT HEALTH External component health GreenNormal (system on)

Amber (flashing)Internal system health
degraded
Red (flashing)Internal system health
critical
POWER CAP Powering capping GreenSystem on or requesting power

on
Flashing amberPower on denied
OffStandby
OVER TEMP Over temperature OffNormal

AmberFailed or missing component
AMP Advanced memory protection OffNo protection

GreenProtection enabled
AmberMemory failure occurred
Amber (flashing)Memory
configuration error
PS X Power supply OffNormal

FAN X Fan OffNormal

SPI ILK SPI board not properly seated OffNormal

XNC XNC board not properly seated OffNormal

CABLE XNC J-Link cables or management OffNormal

cable AmberFailed or missing component
LOWER CPU INK Lower processor memory drawer not OffNormal

fully seated AmberFailed or missing component
UPPER CPU ILK Upper processor memory drawer not OffNormal

fully seated AmberFailed or missing component
PROC X Processor OffNormal

UPPER CPU Indicates upper CPU tray with OffNormal

associated CPUs, memory risers and AmberFailed or missing component
DIMMs
LOWER CPU Indicates lower CPU tray with OffNormal

associated CPUs, memory risers and AmberFailed or missing component
DIMMs
MEMORY BOARD X DIMM 1A-8D DIMM slot OffNormal

Processor and memory board configuration / logical (physical) location
Upper processor memory board is shown on the left. Lower processor memory board is shown on
the right.
Hard drive LEDs
Item Description
1 Fault/UID LED (amber/blue)
2 Online LED (green)
Hard drive LED combinations

Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation
On, off, or flashing Alternating amber and blue The drive has failed, or a predictive
failure alert has been received for this
drive; it also has been selected by a
management application.
On, off, or flashing Steadily blue The drive is operating normally, and it
has been selected by a management
application.
On Amber, flashing regularly (1 Hz) A predictive failure alert has been

received for this drive.
Replace the drive as soon as possible.
On Off The drive is online, but it is not active

currently.
Flashing regularly (1 Hz) Amber, flashing regularly (1 Hz) Do not remove the drive. Removing a
drive may terminate the current
operation and cause data loss.
The drive is part of an array that is
undergoing capacity expansion or
stripe migration, but a predictive failure
alert has been received for this drive.
To minimize the risk of data loss, do
not replace the drive until the expansion
or migration is complete.
Hard drive LEDs 87

Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation
Flashing regularly (1 Hz) Off Do not remove the drive. Removing a

drive may terminate the current
operation and cause data loss.
The drive is rebuilding, or it is part of
an array that is undergoing capacity
expansion or stripe migration.
Flashing irregularly Amber, flashing regularly (1 Hz) The drive is active, but a predictive
failure alert has been received for this
drive. Replace the drive as soon as
possible.
Flashing irregularly Off The drive is active, and it is operating

normally.
Off Steadily amber A critical fault condition has been

identified for this drive, and the
controller has placed it offline. Replace
the drive as soon as possible.
Off Amber, flashing regularly (1 Hz) A predictive failure alert has been
received for this drive. Replace the drive
as soon as possible.
Off Off The drive is offline, a spare, or not

configured as part of an array.
Rear panel components
Item Description
1 Torx T-15 Tool
2 iLO 3 connector
3 Mouse connector
Item Description
4 Serial connector
5 NIC connector 2
6 NIC connector 4
7 UID
8 NIC connector 3
9 NIC connector 1
10 Video connector
11 Keyboard connector
12 USB connectors
13 I/O expansion slots
14 Small form factor I/O expansion slots (optional)
15 XNC connectors
16 XNC management connector
17 Power supply 8
18 Power supply 7
19 Power supply 6
20 Power supply 5
21 Power supply 4
22 Power supply 3
23 Power supply 2
24 Power supply 1
Rear panel components 89

Rear panel LEDs
Item Description LED color Status
1 iLO3 NIC Activity LED Green On or flashingNetwork

activity
OffNo network activity
2 iLO3 NIC Link LED Green OnLinked to network

OffNot linked to network
3 NIC 2 Activity LED Green On or flashingNetwork

activity
4 NIC 2 Link LED Green OnLinked to network


activity

Item Description LED color Status
7 UID LED Blue OnUID active

OffUID inactive


activity


activity
Power supply LED
Power LED Status
Off No AC power to power supply units
Green AC is present. Standby output is on, output is disabled.
Green AC is present. Standby output is on, power supply DC

output is on and OK.
Off Power supply failure (includes overvoltage and

overtemperature)
Power supply LED 91

Fan location
Item Description
1 Fan 4
2 Fan 3
3 Fan 2
4 Fan 1
5 Fan module 6
6 Fan module 5
Fan location 93
System board components
Item Description
1 Optional I/O expansion board connectors:

PCI-X/PCI Express I/O expansion board
PCI Express I/O expansion board
2 Slot 7 PCIe2 x8 (4, 2, 1)
3 Slot 8 PCIe2 x8 (4, 2, 1)
4 Slot 9 PCIe2 x16 (8, 4, 2, 1)
5 Slot 10 PCIe2 x8 (4, 2, 1)
6 Slot 11 PCIe2 x8 (8, 4, 2, 1)
7 SPI board connector
8 Internal USB connectors (2)
9 NMI jumper
10 System maintenance switch
11 Optical drive connector
12 Video/USB connector
13 Solid state drive connector
14 Power button/UID connector
System maintenance switch
The system maintenance switch (SW1) is an eight-position switch that is used for system
configuration. The default position for all eight positions is Off.
Position Description Function
S1 iLO3 security Off = iLO3 security is enabled.

On = iLO3 security is disabled.
S2 Configuration lock Off = System configuration can be

changed.
On = System configuration is locked.
S3 Reserved Reserved
S5 Password protection override Off = No function

On = Clears power-on password and
administrator password
S6 Invalidate configuration Off = Normal

On = Clears NVRAM
System board components 95

SPI board components
Item Description
1 Mini SAS connectors (2)
2 SAS cache connector
3 TPM connector
4 Fan data connector
5 RMII connector
6 SD card slot
7 Battery
8 10Gb NIC connector
9 NIC cache connector
10 NIC 3 connector
11 NIC 1 connector
12 Video connector
13 Keyboard connector
14 USB connectors (2)
15 iLO 3 connector
16 Mouse connector
17 Serial connector
18 NIC 2 connector
19 NIC 4 connector
Expansion board components

PCI-X/PCI Express I/O expansion board
Item Description
1 Slot 6 PCIe2 x16 (16, 8, 4, 2, 1)
2 Slot 4 PCIe2 x8 (4, 2, 1)

1
3 Slot 3 PCIe2 x16 (16, 8, 4, 2, 1)
4 Slot 2 PCI-X
5 Slot 1 PCI-X
1
Slot 4 is physically a x8 slot but operates electrically as a x4 slot.
PCI Express I/O expansion board
Item Description
1 Slot 6 PCIe2 x16 (8, 4, 2, 1)

1
2 Slot 5 PCIe2 x16 (8, 4, 2, 1)

2
3 Slot 4 PCIe2 x8 (4, 2, 1)

3
4 Slot 3 PCIe2 x16 (8, 4, 2, 1)

4
5 Slot 2 PCIe2 x16 (8, 4, 2, 1)
Expansion board components 97

Item Description
5
6 Slot 1 PCIe1 x8 (4, 2, 1)

6
1
Slots 2, 3, 5 and 6 are physically x16 slots but operate electrically as x8 slots.
2
3
Slots 1 and 4 are physically x8 slots but operate electrically as x4 slots.
4
5
6
Slots 1 and 4 are physically x8 slots but operate electrically as x4 slots.
Low profile I/O expansion board
Item Description
1 Slot 12 Low profile PCIe2 x8 (4, 2, 1)
2 Slot 13 Low profile PCIe2 x8 (4, 2, 1)
3 Slot 14 Low profile PCIe2 x4 (2, 1)
4 Slot 15 Low profile PCIe x8 (4, 2, 1)
5 Slot 16 Low profile PCIe x8 (4, 2, 1)
DIMM slot locations

Each memory module contains 8 DIMM slots. The paired banks are identified by the letters A
through D.
Device numbers
Battery pack LEDs
Item Color Description
1 Green System Power LED. This LED is on when

the system is powered up and 12 V
system power is available. This power
supply is used to maintain the battery
charge and provide supplementary
power to the cache microcontroller.
2 Green Auxiliary Power LED. This LED is on

when 3.3V auxiliary voltage is
detected. The auxiliary voltage is used
to preserve BBWC data and is
available any time that the system
power cords are connected to a power
supply.
Device numbers 99
Item Color Description
3 Amber Battery Health LED. To interpret the

illumination patterns of this LED, see the
following table.
4 Green BBWC Status LED. To interpret the

illumination patterns of this LED, see the
following table.
LED3 pattern LED4 pattern Interpretation
Off Flashing (2 Hz) The system is powered down, and the

cache contains data that has not yet
been written to the drives. Restore
system power as soon as possible to
prevent data loss.
Data preservation time is extended any
time that 3.3 V auxiliary power is
available, as indicated by LED 2. In the
absence of auxiliary power, battery
power alone preserves the data. A
fully-charged battery can normally
preserve data for at least 2 days.
The battery lifetime also depends on the
cache module size. For more
information, see the controller
QuickSpecs on the HP website (http://
www.hp.com).
Off Double flash, then pause The cache microcontroller is waiting for
the host controller to communicate.
Off Flashing (1 Hz) The battery pack is below the minimum

charge level and is being charged.
Features that require a battery (such as
write cache, capacity expansion, stripe
size migration, and RAID migration) are
unavailable temporarily until charging
is complete. The recharge process takes
between 15 minutes and 2 hours,
depending on the initial capacity of the
battery.
Off On The battery pack is fully charged, and

posted write data is stored in the cache.
Off Off The battery pack is fully charged, and

no posted write data exists in the
cache.
Flashing (1 Hz) Flashing (1 Hz) An alternating green and amber

flashing pattern indicates that the cache
microcontroller is executing from within
its boot loader and receiving new flash
code from the host controller.
On A short circuit exists across the battery

terminals or within the battery pack.
BBWC features are disabled until the
battery pack is replaced. The life
expectancy of a battery pack is
typically more than 3 years.
Flashing (1 Hz) An open circuit exists across the battery

terminals or within the battery pack.
BBWC features are disabled until the

LED3 pattern LED4 pattern Interpretation
battery pack is replaced. The life

expectancy of a battery pack is
typically more than 3 years.
Battery pack LEDs 101

6 Cabling
XNC cabling
by the server.
For best cable management, follow the recommend connection order.
102 Cabling
1. Make connections labeled 1 through 8 in the illustration.
2. Refer to cabling illustrations and table to make connections 9 though 16. For example, to
make the ninth connection, to upper board 1, use the cable connected to lower board 4.
Connection Board Number Connects to Connection Board Number

sequence sequence
Seventh Lower 4 Connects Ninth Upper 1
Third Lower 3 Connects Tenth Upper 2
Eighth Lower 2 Connects Eleventh Upper 3
Fourth Lower 1 Connects Twelfth Upper 4
Fifth Lower 8 Connects Thirteenth Upper 5
First Lower 7 Connects Fourteenth Upper 6
Sixth Lower 6 Connects Fifteenth Upper 7
Second Lower 5 Connects Sixteenth Upper 8
DVD-ROM drive cabling
DVD-ROM drive cabling 103

7 Specifications
Environmental Specifications
Specification Value
System inlet temperature
Operating 10 to 35C (50 to 95F) at sea level with an altitude

derating of 1.0C per every 305 m (1.8F per every 1000
ft) above sea level to a maximum of 3050 m (10,000 ft),
no direct sustained sunlight.
Maximum rate of change is 10C/hr (18F/hr). The upper
limit may be limited by the type and number of options
installed.
System performance may be reduced if operating with a
fan fault or above 30C (86F).
Non-operating -30 to 60C (-22 to 140F). Maximum rate of change is

20C/hr (36F/hr).
Relative humidity (non-condensing)
Operating 10 to 90% relative humidity (Rh), 28C (82.4F) maximum

wet bulb temperature, non-condensing.
Non-operating 5 to 95% relative humidity (Rh), 38.7C (101.7F)

maximum wet bulb temperature, non-condensing.
Altitude
Operating 3050 m (10,000 ft). This value may be limited by the type
and number of options installed. Maximum allowable
altitude change rate is 457 m/min (1500 ft/min).
Non-operating 9144 m (30,000 ft). Maximum allowable altitude change

rate is 457 m/min (1500 ft/min).
Acoustic noise Listed are the declared A-Weighted sound power levels
(LWAd) and declared average bystander position
A-Weighted sound pressure levels (LpAm) when the product
is operating in a 23C ambient environment. Noise
emissions were measured in accordance with ISO 7779
(ECMA 74) and declared in accordance with ISO 9296
(ECMA 109).
Idle L WAd 7.5 Bels

L pAm 59.7 dB
Operating L WAd 7.5 Bels

L pAm 89.7 dB
Emissions Classification (EMC)
FCC rating Class A
Normative Standards CISPR 22; EN55022; EN55024; FCC CFR 47, Pt 15;
ICES-003; CNS13438; GB9254; K22;K24; EN
61000-3-2; EN 61000-3-3; EN 60950-1; IEC 60950-1
104 Specifications
Server Specifications
Specification Value
Dimension
Height 35.36 cm (13.92 in)
Depth 87.63 cm (34.5 in)
Width 48.26 cm (19.0 in)
Weight (maximum) 93 kg (205 lb)
Weight (one hard drive, power supply and processor 75 kg (165 lb)
installed)
Input requirement1
Rated line voltage 100-240 VAC
Rates input current 9.3A @ 100 VAC

9.5A @ 108-120 VAC
6.6A @ 200-240 VAC
Rated input frequency 5060 Hz +/- 3hz
Input power (maximum) 4600 W
BTUs rating (maximum) 14,444 BTU/hr (worst case configuration and utilization)
Power supply output (per power supply)
Rated steady-state power 800 W @ 100 VAC

900 W @ 110-120 VAC
1200 W @ 200-240 VAC
Rated input power 950W @ 100 VAC

1075W @ 108120 VAC
1375W @ 200-240 VAC
Maximum peak power 960 W @ 100 VAC

1080 W @ 110-120 VAC
1440 W @ 200-240 VAC
1
To ensure the server has sufficient power during normal operation, a server configured with eight populated CPU sockets
or a detected high power GPU requires high line (200 - 240 V) ac server configuration. As a precaution, if these
configurations are detected on a low line (100 - 127 V) ac configured server the server will halt at Power-On Self-Test
with a "Low line (100-120 VAC) power delivery is not sufficient for this configuration. High line (200-240 VAC) delivery
is required to operate the system in its current configuration" message and only boot to RBSU.
At POST, the server automatically detects whether the power supplies are connected to high-line
power or low-line power. If the server is configured with eight populated CPU sockets or a detected
high power GPU, the system will halt if it detects that the server is plugged into low-line power.
This occurs by design because systems configured eight processors, and/ or high power graphics
cards, with a large amount of memory, hard drives, or other options might require more power
than can be provided by low-line power. POST halts this low-line configuration as a precaution
against the server having insufficient power during operation.
If a you wish to operate a server in this configuration when utilizing low-line power, the power
supply solution should be verified as sufficient using the HP Power Advisor (http://www.hp.com/
go/hppoweradvisor). If the power solution is not deemed sufficient, the server may not have
Server Specifications 105

sufficient power to operate normally. If the solution is deemed sufficient, a ROM-Based Setup Utility
option, outlined below, can be used to allow the system to operate in this configuration.
If the HP Power Advisor has determined that the server can be reliably powered at low-line power
in this configuration, perform the following steps to override the Power Supply Requirements setting
in ROM-Based Setup Utility (RBSU):
1. When the server halts, access RBSU.
2. Select "Advanced Options".
3. Scroll down to "Power Requirements Override" and choose to enable it.
4. Exit RBSU,which will reboot the server and should bypass the message on the subsequent
boot.
106 Specifications
8 Acronyms and abbreviations
ABEND
abnormal end
AMP
Advanced Memory Protection
ASR
Automatic Server Recovery
BBWC
battery-backed write cache
FBWC
flash-backed write cache
GPU
graphics processing unit
IEC
International Electrotechnical Commission
iLO 3
Integrated Lights-Out 3
IML
Integrated Management Log
NVRAM
nonvolatile memory
ORCA
Option ROM Configuration for Arrays
PCIe
peripheral component interconnect express
PCI-X
peripheral component interconnect extended
POST
Power-On Self Test
RBSU
ROM-Based Setup Utility
107
SAS
serial attached SCSI
SD
Secure Digital
SFF
small form factor
SIM
Systems Insight Manager
SPI
system peripheral interface
SSD
support software diskette
TPM
Trusted Platform Module
UID
unit identification
USB
universal serial bus
108 Acronyms and abbreviations

9 Documentation feedback
HP is committed to providing documentation that meets your needs. To help us improve the
documentation, send any errors, suggestions, or comments to Documentation Feedback. Include
the document title and part number, version number, or the URL when submitting your feedback.
109
Index
connector, video, 96
Symbols
4s to 8s upgrade, 74 D
device numbers, 99
B DIMM installation guidelines
battery DIMM installation guidelines, 35
Battery, 60 Hemisphere mode, 37
SPI board components, 96 DIMM slot locations, 98
battery pack LEDs, 99 DIMMs
battery-backed write cache (BBWC) DIMM identification, 35
Battery pack LEDs, 99 Single-, dual-, and quad-rank DIMMs, 34
Battery-backed write cache procedures, 53 drives, 22
BBWC low profile I/O expander location, 55 DVD drive, 103
Recovering data from the battery-backed write cache, DVD-ROM drive
55 DVD-ROM drive, 23
Removing the BBWC battery pack, 54 DVD-ROM drive cabling, 103
SPI board components, 96 DVD-ROM drive, removing, 23
battery-backed write cache battery pack
Battery-backed write cache procedures, 53 E
Removing the BBWC battery pack, 54 electrostatic discharge, 21
BBWC (battery-backed write cache) expansion board, 52
Battery pack LEDs, 99 expansion boards
Battery-backed write cache procedures, 53 Expansion board options, 63
Recovering data from the battery-backed write cache, Low profile I/O expander, 50
55 Non-hot-plug expansion board, 52
Removing the BBWC battery pack, 54 expansion slots, 94
Removing the BBWC cache module, 53
blank, power supply, 23 F
board, SPI (System Peripheral Interface) fans
Re-entering the server serial number and product ID, 70 Fans, 25
Remove the SPI board, 56 Hot-plug power supply, 24
SPI board components, 96 Upper fans, 25
System board components, 94 fans, removing
Fans, 25
C Upper fans, 25
cables, 102 fans, replacing
cabling, DVD-ROM drive, 103 Fans, 25
cabling, XNC, 102 Upper fans, 25
components, front panel features, 83
Front panel components, 83 firmware, 75
Front panel LEDs, 84 firmware requirements, 75
components, identification firmware update, 75
Component identification, 83 firmware, updating, 75
Illustrated parts catalog, 5 front bezel, 58
components, rear
Rear panel components, 88 H
Rear panel LEDs, 90 hard drive backplane, 67
components, SPI board, 96 hard drive LEDs
components, system board Hard drive LED combinations, 87
System board components, 94 Hard drive LEDs, 87
System maintenance switch, 95
connector, iLO3, 96 I
connector, keyboard, 96 I/O expansion boards, removing, 61
connector, mouse, 96 iLO 3 connector, 96
connector, NIC, 96
connector, USB, 96
110 Index
K Removal and replacement procedures, 21
keyboard connector, 96 Required tools, 21
L S
LED, health, 84 safety considerations, 21
LED, iLO 3 link safety information, 21
Rear panel components, 88 SAS backplane, 67
Rear panel LEDs, 90 SAS hard drive LEDs
LED, UID Hard drive LED combinations, 87
Front panel LEDs, 84 Hard drive LEDs, 87
Rear panel LEDs, 90 serial connector, 96
LEDs, 91 serial number, 70
LEDs, battery pack, 99 server asset text, 70
LEDs, front panel, 84 server specifications
LEDs, hard drive Server Specifications, 105
Hard drive LED combinations, 87 Specifications, 104
Hard drive LEDs, 87 server warnings and cautions, 21
LEDs, power supply, 91 SID, 57
LEDs, rear panel, 90 Solaris environments, 82
LEDs, Systems Insight Display, 85 solid state drive, removing, 59
LEDs, unit identification (UID), 84 specifications, environmental
Environmental Specifications, 104
M Specifications, 104
mechanical components specifications, server
Illustrated parts catalog, 5 Environmental Specifications, 104
Mechanical Components, 5 Specifications, 104
memory, 34 SPI (System Peripheral Interface) board
memory cartridge, 27 Re-entering the server serial number and product ID, 70
memory module population guidelines Remove the SPI board, 56
Advanced ECC memory population guidelines, 39 SPI board components, 96
Mirrored Memory population guidelines, 40 System board components, 94
memory options, 32 static electricity, 21
memory performance optimization, 38 status lights, battery pack, 99
memory requirements, 38 switch, system maintenance, 94
mirrored memory, 40 system battery, 96
mouse connector, 96 system board components
System board components, 94
N System maintenance switch, 95
NIC connectors, 96 system board replacement, 68
non-hot-plug expansion boards, removing, 52 system board switches, 95
NVRAM, clearing, 95 system components
Component identification, 83
P System components, 9
power LEDs, system, 99 system maintenance switch
power supplies, removing, 24 System board components, 94
power supply bays, 91 System maintenance switch, 95
power supply blank, 23 System Peripheral Interface (SPI) board, 96
power supply LEDs, 91 system power LED, 99
power supply, installing, 24
processor, 44 T
processor memory module three slot option card connectors, 94
Processor and memory board configuration / logical tools, 21
(physical) location, 87 TPM (Trusted Platform Module), 72
Remove a processor memory drawer cover, 27 Trusted Platform Module (TPM), 72
Remove the upper or lower processor memory drawer
or processor memory drawer blank, 26 U
upgrade
R 4s to 8s configuration, 74
required tools USB connectors, 96
111
V
video connector, 96
VMware ESX Server, configuring, 82
X
XNC Module, 67
112 Index

HP ProLiant DL980 G7 Server Maintenance and Service Guide - Neu

Caricato da

Informazioni sul documento

Titolo originale

Copyright

Formati disponibili

Condividi questo documento

Condividi o incorpora il documento

Opzioni di condivisione

Hai trovato utile questo documento?

Questo contenuto è inappropriato?

Copyright:

Formati disponibili

HP ProLiant DL980 G7 Server Maintenance and Service Guide - Neu

Caricato da

Copyright:

Formati disponibili

HP ProLiant DL980 G7 Server Maintenance

and Service Guide

HP Part Number: AM426-9001H

Item Description Spare part number Customer self repair

1 Access panel AM426-69016 Mandatory1

2 Processor memory drawer AM426-69002 Mandatory1

Bezel - Upper AM426-69019 Mandatory1

3 Blank, hard drive 392613-001 Mandatory1

4 Bezel assembly, power, SID 591209-001 Mandatory1

5 Bezel - Frontal section of AM426-69021 Mandatory1

6 Processor memory drawer AM426-69018 Mandatory1

Not shown Blank, lower processor AM426-69008 Mandatory1

Bezel - Lower AM426-69020 Mandatory1

7 Tool, T-15 Torx screwdriver 199630-001 Mandatory1

8 Blank, power supply 496058-001 Mandatory1

Not shown Plastics Kit AM426-69014 Mandatory1

Not shown Hardware kit - contains a 496058-001 Mandatory1

Not shown Bezel kit - Miscellaneous AM426-69022 Mandatory1

Not shown 3-8 U Slide rail kit AM426-2104A Mandatory1

6 Illustrated parts catalog

Item Description Spare part number Customer self repair

1 PCI-X/PCI Express I/O 591204-001 Mandatory1

2 PCI Express I/O expansion 591205-001 Mandatory1

3 System board AM426-69015 Optional2

HP ProLiant DL980 NC375i AM426-69017 Mandatory1

HP ProLiant DL980 331i SPI AM451-69002 Mandatory1

5 Memory module 591198-001 Optional2

6 Heatsink assembly 591207-001 Optional2

2 GB (128 MBx8), 133 501533-001 Mandatory1

4 GB (256MBx4), 133 501534-001 Mandatory1

4 GB, PC3-10600R, 595424-001 Mandatory1

4 GB PC3L 10600R 606426-001 Mandatory1

8GB PC3L 10600R 606427-001 Mandatory1

16 GB DDR3-106, 501538-001 Mandatory1

16GB (1x16GB) memory 632204-001 Mandatory1

32GB memory DIMM 32GB 632205-001 Mandatory1

Intel Xeon e7520 4 core 597821-001 Mandatory1

Intel Xeon E6540 6 core 594899-001 Mandatory1

Intel Xeon X6550 8 core 594896-001 Mandatory1

Intel Xeon X7500 8 core 594893-001 Mandatory1

HP DL980 6 Core E7-4807 653055-001 Mandatory1

HP DL980 10 Core E7-2850 650016-001 Mandatory1

Intel Xeon E7-2830 650017-001 Mandatory1

10 Illustrated parts catalog

(24MB Level-2 cache,

HP DL980 10 Core E7-2860 650015-001 Mandatory1

HP DL980 10 Core E7-4870 653050-001 Mandatory1

Not shown Thermal grease kit 395532-001 Optional2

9 Power backplane AM426-69001 No3

Memory cartridge for Intel 591198-001 Optional2

Memory cartridge for Intel 647058-001 Optional2

13 SAS backplane 591203-001 Optional2

14 Systems Insight Display AM426-69003 Optional2

15 SFF hot-plug drives (not

a) 72-GB, 6G SAS, 512743-001B21 Mandatory1

b) 146-GB, 6G SAS, 512744-001 Mandatory1

c) 300 GB, 6G SAS, 507284-001 Mandatory1

d) 450 GB, 6G SAS, 581284-B21 Mandatory1

e) 600 GB, 6G SAS, 581286-B21 Mandatory1

f) 900 GB, 6G SAS, 10,000 619291-B21 Mandatory1

HP 300 GB SAS 10K SFF 507127-B21 Mandatory1

HP 72 GB SAS 15K SFF 512545-B21 Mandatory1

HP 146 GB SAS 15K SFF 512547-B21 Mandatory1