FAQ related to Mid Sem Test on 6 Apr 2017

Compiled on 5 Apr 2017

Q. What level of details is necessary to memorize about different processes discussed?

ANS: There is a lot of information on each process in the slides and the DVDs. However, since the
self-study tutorial questions required brief answers (3-4 sentences), you should concentrate on
general principles/applications rather than the minute details. You should know what the process
does, how it does it and why we use it, as was practiced in 2min lab tests. Also, process limitations
are important (e.g. in what cases we cannot use it, what workpiece material properties are required,
e.g. conductivity).

Q. Rephrased from email: It is not clear how this past test question should be answered: List two
differences between electroplating aluminium and anodizing aluminium. In both cases the work
piece or substrate is aluminium.

ANS: Recall tutorial 3 (week 4), discussion question 1b. Differences between electroplating and
anodizing were explained. So imagine you have (a) aluminium that has to be electroplated with a
metal, e.g. Ni, and (b) aluminium that has to be anodized. Can you see any differences in both
processes?

Q. From email: CVD which is a reaction based has a higher temperature than PVD which is physically
evaporated coating material? Is that due to heat required for reaction to take place?

ANS: Yes, to proceed chemical reactions require energy. High temperature is one source of energy.
For a chemical reaction to proceed at a lower temperature you need to reduce pressure (e.g. LPCVD)
or introduce plasma as a second source of energy (e.g. PECVD).

Q. From email: In our lecture slides on PVD and CVD i noted both processes were used for TiN
coatings but only specified that CVD was used as an example for TiN on carbide tools whereas PVD
was used for TiN coatings on Mill cutting discs and broaches.

Is that specifically due to tool base material not working in either or processes?

Is it correct to say that both PVD and CVD could be used for TiN coating on any of these types of
tools?

ANS: Recall also tutorial 3 (week 4), discussion question 3. TiN deposition by CVD can be used for
substrates not sensitive to high temp. (e.g., WC-Co tool inserts discussed in tutorials). TiN deposition
by PVD is a lower temp process compared to typical CVD. It is used to deposit TiN on WC-Co
substrates in some cases. Think what materials are used for milling cutters and broaches and if these
materials might be sensitive to elevated temperatures used in most CVD processes.
 Q. From email: How does this make sense? We are shown in the lecture notes that SINTERING
occurs below melting temperature, 70-90% of Tm, although on the online quiz 5, one of the questions
state. "Which one of the following sentences below is TRUE?" *correct answer:* Sintering process
can include melting... This is very confusing.

ANS: See slide 33 in L5. There are cases where in a mixture of powders one powder has a much
lower melting temperature than the other powder (usually in lower concentration). So during
sintering at 0.7-0.9 Tm of the dominating powder the other melts. So sintering, in special cases, can
include melting. When you do quizzes you are able to consult all sources so some questions are
more difficult.