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T H I S DOCUMENT CONTAINS
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33 PAGES.
Copyright Aviation & Missile Command
Provided by IHS Licensee=Huntington Ingalls Industries Inc/6112333100, User=xiaowen, wang
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:DOD-STD-1866N O T I C E 1 SO W 7777711 0067210 T M
1 -
DoD-STD-1866
DEPARTMENT OF DEFENSE
WASHINGTON, DC 20301
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ii
A
DoD-STD-1866
FORWARD
iii
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DATE SUPERSEDED
PAGE DATE
NEW PAGE
User activities:
Army - ME
Navy - OS
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CONTENTS
Page
Paragraph 1 . SCOPE ........................................ 1
1.1 Coverage ..................................... 1
1.2 C l a s s i f i c a t i o n of soldering
Usage
methods ..........
........................................ 1
1
1.3
1.4 Method Reference
of .......................... 2
2 . REFERENCED
I s s u eosf
DOCUMENTS
Documents
.........................
.......................... 3
3
2.1
2 92 O t hPeur b l i c a t i o n s ........................... 4
3. DEFINITIONS .................................. 5
3 -1 Contractor/Manufacturer ...................... 5
4. GENERAL REQUIREMENTS ......................... 6
4.1
4.2
Soldering
Procedure
Equipment ..........................
....................................
6
6
4.2.1 Procedure Record ............................. 6
4.2.2 Sample Specimen ............................... 6
5 . DETAIL REQUIREMENTS .......................... 7
5.1 Solder Metals ................................ 7
5.1.1 Tin-lead Solder .............................. 7
5.1.2 Tin-antimony - Lead Solder ................... 7
5.1.3 Tin-antimony - T i n - s i l v e r and ................ 7
Lead-silver Solders ......................... 7
5.1.4 Tin-lead-zinc. Tin-zinc.
Tin-zinc - .......... 7
5.1.5
Aluminum and
Fusable Alloy Solders
Zinc-aluminum
Solders ..........
........................
7
7
5.1.6 . Indium Solders ............................... 8
5 -2 Flux
Types .................................... 8
5.2.1 S e l e c t i o n of Fluxes .......................... 8
5.2.2 Corrosive Fluxes ............................. 8
5.2.3 Intermediate Fluxes .......................... 8
5.2.4 Non Corrosive Fluxes ......................... 9
5.3 J o iPn rt e p a r a t i o n ............................ 9
5.3.1 Cleaning ..................................... 9
5'3.2 Deburring .................................... 9
5.3.3 Precoating ................................... 9
5.3.4 J o iD
n et s i g n ................................. 9
5.3.5 J o i nSte l e c t i o n .............................. 10
5.3.6 Fit .......................................... 10
5 :3.7 Assembly of P a r t s ............................ 10
5.3.8 A p p l i c a t i o n of Flux .......................... 10
5.3.9 A p p l i c a t i o n of Solder Metal .................. 10
5.4 S o l d e r i n g Methods ............................ 11
5.4.1 Conduction Soldering ......................... 11
5.4.1.1 Procedure .................................... 11
iv
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TIOP-STD-1866
.Continued
a
CONTENTS
.
.r
Page
Paagraph 5.4.2
5.4.2.1 Procedute
..............................
....................................
Flame Soldering 11
11
12
5.4.3
5.4.3.1 Procedure ...................................
Dip solde ring..............^.^...............
............................. 12
12
..................................
Resistance Method
5.4.4 .
12
5.4.401
5.4.5
Proceduret
Oven or Furnace Method ....................... 12
13
5.4.5.1
5.4.6 Induction Eiethod ............................
pro ce dure........................^.^^^^^^^^^
13
13
5.4. 6.1
5.4.7 ...........................
pro ce dure.............^^..^^^...^^.^^^^^^^^^
Procedure...................................
Ultrasonic Method 13
13
5.4.7.1
5.4.8 ............................
Procedure...................................
Spray Gun Method 13
14
5.4.8.1
5.4.9 .................................
Procedure...................................
Wave Method 14
14
5.4.9.1
5.5 Post Soldering Treatment .................... 14
14
5.5.1
5.5.2 Flux Removal ................................ ...
coo ling...............................^.^^^^
14
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15
5.5.3
5.6 Quality Considerations ......................
Passivation of Stainless Steel Assemblies
15
15
Appearance ..................................
5.6.1 workman ship.................^.^^^^.^^^^^^^^^
a 5.6.2
5.6. 3
5.6.4
Flow and Wetting Action
Line od Demarcation
.....................
.........................
15
15
15
16
Porosity....................................
5.6.5 con tour...............................^...^^
16
Blisters ....................................
5.6.6
16
5.6.7
5.6.8
.
Residual Flux ...............................
...............................
16
16
5.6. 9
5.6.10
Excess Solder
Unmelted Solder ............................. 16
16
5.6. 11
5.6.12 Cold Solder .................................
penetration..................^..^^^^^^^^^^^^
............................
16
16
5.6.13
5.6.14
Disturbed Solder
Aggregate Area ..............................
.....................
16
17
Resoldering .................................
5.6.15 Extent of Single Defect
17
5.6.16
5.6. 17 Humidity Test ...............................
................................
17
17
Procedure...................................
5.6. 17.1 Test Cabinet "
I/
Data ............................
5.6.17.2
5.7
5.7.1
5.7.2
Application
....................
Steels......................................
Copper and Copper Alloys
17
17
18
a Reprinted without .
change
V
18.
18
18
18
18
18
19
14
19
19
6.. 19a
60.1 1%
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vi
DOD-STD-1866
l. SCOPE
1.1 C o v e r a g e T . h i ss t a n d a r dr e p r e s e n t sg e n e r a lf a b r i c a t i o na n ds o l d e r i n g
r e q u i r e m e n t sf o rs o l d e r i n g of n o n - e l e c t r i c a la s s e m b l i e s of s t e e l , c o a t e d ' s t e e l
( t i n n e d ;t e r n e ;g a l v a n i z e d ;o re l e c t r o p l a t e dw i t hz i n c , cadmium, o r n i c k e l )
c l a dc o p p e r ,c o p p e ra l l o y s ,l e a d and l e a da l l o y s ,z i n c a n dz i n ca l l o y s ,n i -
c k e l and n i c k e l a l l o y s , t i n and t i n a l l o y s , andaluminumandaluminum alloys.
The f o r e g o i n g are produced by s o l d e r i n g p r o c e s s e s u s i n g s o l d e r f i l l e r metals
having a l o w e rm e l t i n gp o i n tt h a nt h eb a s e metal. F i l l e r metals used f o r
making s o l d e r e dj o i n t sh a v e a flowtemperaturebelow 800'F (426" C). The
f i l l e r metal is d i s t r i b u t e d between t h e j o i n t s u r f a c e s , u s u a l l y by c a p i l a r y
action in closely fitted components,and by g r a v i t y i n cases of a i r gaps.
1.2 C l a s s i f i c a t i o no fs o l d e r i n g methods.Solderingmethodsshallbe
c l a s s i f i e d as f o l l o w s :
5Pe 1 - C o n d u c t i o n( s o l d e r i n gi r o n )s o l d e r i n g
Type 11 - Flame h e a t ( o i l o r g a s b u r n e r ) s o l d e r i n g
Type III - Dip s o l d e r i n g
Type IV - Resistancesoldering
Type v - Oven o r f u r n a c e s o l d e r i n g
Type VI - I n d u c t i o ns o l d e r i n g
Type VI1 - Ulstrasonic soldering
Type VI11 - Spray gun s o l d e r i n g
Type IX - Wave s o l d e r i n g
a. Heat exchangers(lowpressure)
b * Automotive r a d i a t o r s
C. Brackets
d . Finnedtubing
e. W a t e r l i n e s
f . F l e x i b l e metal hose
g * Fueltanks and c a n s
h. Metal p a i l s
i. Radio c h a s s i s
j * Air c l e a n e r s
k. Grids
1. Frames
m. E l e c t r o n i c equipment c h a s s i s
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a. This s t a n d a r d number.
b. Type of s o l d e r i n g method (see 1.2) .
C. Solder metal, i f d i f f e r e n t (see 5.1).
d.Fluxes, i f d i f f e r e n t (see 5.2).
e. F i t ,i fd i f f e r e n t (see 5.3.6).
f .I fp r e h e a t i n g i s r e q u i r e df o rd i ps o l d e r i n g (see 5.4.3.1).
g .P a s s i v a t i o n ,i fd i f f e r e n t( s t a i n l e s s steel) (see 5.5.3).
h.Humidity t e s t , i fr e q u i r e d (see 5.6.17).
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NOTE: Becauseof thecomprehensivenature of procedurescontained inthis
s t a n d a r d , some l a t i t u d e h a s b e e n a l l o w e d i n p a r a g r a p h s r e f e r e n c e d
i nt h ef o r e g o i n g method of r e f e r e n c i n g .N o r m a l l y ,o n l yt h ef i r s t
two r e f e r e n c e s needbeincluded.
DOD-STD-1866
2. REFERENCED DOCUMENTS
STANDARDS
FEDERAL
FED-STD-151 - Metals: Test Methods.
MILITARY
MIL-STD-105 - Sampling Procedures and Tables for
Inspection by Attributes.
-
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0 Supersedes
page 3 of
21
August 1981.
DOD-STD-1866
4
Supersedes page 4 of 21 August 1981.
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DoD-STD-1866
4. GENERAL REQUIREMENTS
a . Drawing o rs k e t c h of item t ob es o l d e r e d .
b. Basis metal(s).
c . Soldertype.
d.
Fluxtype.
e. Heating medium.
f . Heat range.
g.Fluxremovalmethod.
5. DETAIL REQUIREMENTS
5.1-1 T i n - l e a ds o l d e r s .S e l e c t i o no ft i n - l e a ds o l d e r s (see t a b l e I) s h a l l
dependupontypes of metals t o bejoined.Tin-leadsoldershave good corro-
s i o n r e s i s t a n c e t o mostof t h e common media.Fluxes of a l l t y p e s may beused
w i t ht h e s es o l d e r s .T r e a t m e n to ff l u xr e s i d u e sw i t ht h et i n - l e a ds o l d e r s
s h a l l b e d i c t a t e d by f l u x u s e d .
5.1.3Tin-antimony,tin-silver,andlead-silversolders.Tin-antimony
s o l d e r s (see t a b l e III) have a h i g h e r e l e c t r i c a l c o n d u c t i v i t y t h a n t h e
tin-lead solders, and shall be used where lead contamination must be avoided;
such as f o o dc o n t a i n i n g vessels. T i n - l e a ds o l d e r s (see t a b l e III), similar t o
t h et i n - a n t i m o n y ,s h o u l db eu s e df o rf i n ei n s t r u m e n t work, as they are a p p l i e d
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5.1.4 Tin-lead-zinc,tin-zinc,tin-zinc-aluminumandzinc-aluminum
s o l d e r s . The tin-lead-zinc,tin-zincandtin-zinc-aluminumsolders (see t a b l e
I V ) s h o u l db eu s e df o rt h ej o i n i n g ofaluminum. The t i n - z i n cs o l d e r s ,e s p e c -
i a l l y t h o s e w i t h a z i n c c o n t e n t of 20 t o 30 percent,shouldbeusedtomini-
m i z et h ee l e c t r o g a l v a n i cc o r r o s i o n of s o l d e r e dj o i n t s . By i n c r e a s i n gt h ez i n c
c o n t e n t s ,o rw i t ht h ea d d i t i o n of aluminum, t h e s e s o l d e r s w i l l e x h i b i t g r e a t e r
corrosionresistance;however,greaterapplicationdifficulty will beexperi-
encedbecause of thehighliquidustemperature.Similarly,zinc-aluminum
s o l d e r sw i t hh i g hs o l i d u st e m p e r a t u r e s , l i m i t a p p l i c a t i o nw h e r es u c hs o l d e r s
may beused. The f l u x f o r the zinc-aluminum s o l d e rs h o u l db el i m i t e dt ot h e .
reactiontype.
DoD-STD-1866
nearbyjoints,orontemperaturesensitivedevices where f a i l u r e of a s o l d e r e d
j o i n t i s r e q u i r e d a t lowtemperature.
5 . 2 . 1S e l e c t i o no ff l u x e s .U n l e s so t h e r w i s es p e c i f i e d (see 1.4), f l u x e s
s h a l l conform t o 0-F-506, QQ-S-571,MIL-F-12784, o r MIL-F-14256, as a p p l i c a -
b l e .F l u x e ss h a l lb e employed as n e c e s s a r yt o promotewetting of t h ep a r e n t
metal s u r f a c e s . The q u a n t i t y of t h e f l u x o r f l u x e s employed s h a l l be nomore
t h a nn e c e s s a r yt oo b t a i ns a t i s f a c t o r y i l ys o l d e r e dj o i n t s .F l u x e ss h a l l
d i s s o l v e o r remove a n yo x i d e s ,a n dp r e v e n ta d d i t i o n a lo x i d a t i o n of t h e s o l d e r
metal and t h eb a s e metal duringheating.Fluxes may b e a p p l i e d i n t h e formof
p a s t e ,l i q u i d , powder, o r as t h ec o r e of f i l l e d s o l d e r . Withapproval of t h e
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p r o c u r i n ga c t i v i t y ,o t h e rs o l d e rf l u x e s may b e u s e d , p r o v i d e d t h e f l u x o r
f l u x e s employed are no more a c t i v e c h e m i c a l l y t h a n n e c e s s a r y t o o b t a i n satis-
factorilysolderedjointsthat comply w i t h t h e d e t a i l e d r e q u i r e m e n t s c o n t a i n e d
herein.
5 . 2 . 2C o r r o s i v ef l u x e s .S o l d e r i n gf l u xc o n f o r m i n gt o 0-F-506 i s classi-
f i e d as a h i g h l yc o r r o s i v ef l u x .T h i sf l u x may beusedwhereconditions
r e q u i r e a r a p i d and h i g h l y active f l u x i n g , t o b e s t a b l e o v e r . v a r i o u s t e m p e r -
aturerangesand when u s i n gt h eh i g h e rm e l t i n gt e m p e r a t u r es o l d e r s . As t h e
r e s i d u er e m a i n sc h e m i c a l l y active a f t e r s o l d e r i n g , t h e r e s i d u e mustbe removed
t op r e v e n t severe c o r r o s i o n a t t h ej o i n t .C o r r o s i v ef l u x e ss h a l ln o tb eu s e d
i n t h e s o l d e r i n g ofclosedcontainerssuch as t h e r m o s t a t so rb e l l o w s .
5.2.3Intermediatefluxes.Solderingfluxconformingto MIL-F-12784 i s
c l a s s i f i e d as a n i n t e r m e d i a t e f l u x . T h i s f l u x s h a l l b e u s e d i n q u i c k s p o t
s o l d e r i n g o p e r a t i o n s , w h e r e minimum c o n t r o l l e d q u a n t i t i e s may be applied and
where s u f f i c i e n t h e a t c a n b e a p p l i e d t o f u l l y decompose o r v o l a t i l i z e t h e
c o r r o s i v ec o n s t i t u e n t s .I n t e r m e d i a t ef l u x e ss h a l ln o tb eu s e dw h e r e undecom-
posed f l u x may be spread onto undesirable areas, o r i n s o l d e r i n g c l o s e d
systemswherecorrosivefumes may d e p o s i t on c r i t i c a l p a r t s of theassembly.
Intermediatefluxesshouldnotbeusedwithtorchorflameheating,duetothe
t e n d e n c yt oc h a r ,b u r n , o r v o l a t i l i z e when heated.
DoD-STD-1866
5 . 3J o i nm
t eDaration.
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b l a s t i n g ,m e c h a n i c a lg r i n d i n go rs a n d i n g ,f i l i n g , wire b r u s h i n g o r o t h e r
mechanicalmethods may beused where e f f e c t i v e . S h o t o r g r i t b l a s t i n g s h o u l d
be p r e f e r a b l et os a n db l a s t i n g . Blast c l e a n i n gs h a l ln o tb eu s e dw i t hl e a d ,
orleadalloys.
5.3.3Precoating.Precoatingshould beused so t h a ts o l d e r i n g w i l l be
more r a p i d anduniform, as w e l l as t o a v o i d t h e u s e of s t r o n g a c i d f l u x e s f o r
assembly. Metals, such as aluminum,aluminum b r o n z e s ,h i g h l ya l l o y e d steels
and cast i r o ns h a l lb ep r e c o a t e d ,u n l e s so t h e r w i s es p e c i f i e d .S t e e l ,b r a s s
andcoppershouldbeprecoated, if t h e a p p l i c a t i o n w a r r a n t s and when s p e c i -
f i e d . To f a c i l i t a t es o l d e r i n g ,c o a t i n g s of t i n ,c o p p e r ,s i l v e r , cadmium,
i r o n , n i c k e l and a l l o y s of t i n - l e a d ,t i n - z i n c ,a n dt i n - c o p p e rs h a l l beappli-ed
to b a s i s metal s u r f a c e s .P r e c o a t i n g by e l e c t r o d e p o s i t i o n ,c h e m i c a lc o n v e r -
sion,orhotdippingshallbeinaccordancewithapplicablespecifications.
5.3.7Assemblyof p a r t s .P a r t st o b ej o i n e ds h a l lb eh e l di np o s i t i o n by
j i g s ,c l a m p s ,s u p p o r t s . ,o r by s e l f - f i x t u r i n g .F i x t u r e su s e dt oh o l dp a r t sa n d
assembliesinalignmentduringsolderingshallbedesignedtoallowexpansion
and c o n t r a c t i o n .J i g s ,f i x t u r e s ,a n dc l a m p ss h a l lb e of noncontaminative ma-
t e r i a l s a n ds h o u l do n l yi n v o l v ep o i n to rl i n ec o n t a c t . When a u t h o r i z e d by t h e
p r o c u r i n g 'a c t i v i t y ,s t a k i n g ,p i n n i n g ,r i v e t i n g ,t a c k - w e l d i n go rs p o t - w e l d i n g
may beused f o r p o s i t i o n i n g of p a r t s , b u t s h a l l n o t b e l o c a t e d i n areas sub-
ject t oh i g h stresses i n s e r v i c e . On c l o s e da s s e m b l i e s ,v e n th o l e ss h a l lb e
l o c a t e d and d r i l l e d as specified.Stop-off materials may beused t o r e s t r i c t
the flow of s o l d e r metal when r e q u i r e d .
5.3.9 A p p l i c a t i o no fs o l d e r metal. S u f f i c i e n ts o l d e r i n ga l l o y ,i nt h e
formof wire, s h i m s , s t r i p , powdar w i t h a r e s i d u e f r e e of chemicalagents,or
p l a t e d f o r m( s o l d e r - f l u xp a s t e ) ,s h a l lb ep r e p l a c e do rf e di nc l o s ep r o x i m i t y
tothejoint,preferably on one s i d e o n l y , i n s u f f i c i e n t q u a n t i t y t o p r o d u c e a
s a t i s f a c t o r yj o i n t .J o i n t sh a v i n go n e end i n a c c e s s i b l et ov i s u a li n s p e c t i o n ,
s h a l l h a v et h es o l d e r metal placed a t t h e b l i n d end p r i o r t o a s s e m b l y ,
whenever i t i s p r a c t i c a b l e t o do so.
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10
DOD-STD-i866
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5.4.1.1 Procedure. The areas to be joined shall be heated above the
liquidus temperature of the solder. To deliver maximum heat to the part, th
copper bit of the soldering iron shall be applied at the correct angle. Th
flat side of the bit shall be applied to secure the maximum area of cont
Excessive time and temperature shall be avoided to prevent unreliable join
and damage to parts. If required, thermal shunts (heat sinks) shall be used
for protection of parts. The parts to be joined shall be held together in
such manner that parts shall not move in relation to one another during
soldering operation. The solder shall be appliedto the joint and not to the
soldering iron. The joint shall not be disturbed until the solder has
completely solidified.
DOD-STD-1866
I
-
5,4.3 Type 111. Dip. soldering. Dip soldering shall be performed by
immersing the assembled joint with preplaced solder metal
flux, by immersing the assembled joint into
a bathin of molten
a flux solution and then into a
bath ofmol.t;en soldar
bath of molten solder, or by dipping the parts ainto
alloy covered witha layer of flux. Pots for the bath, either electrically
a
heated or gas heated units, shall be of such capacity and constructlsn
as to
of the bath,
allow production without appreciably lowering the temperature
The flux shaIl be a oftype which hasa stable flowability within the
soldering temperature range, and processes satisfactory fluxing properties.
The flux bath shall be free of metallic impurities.
5*4.3..1 Procedure. When required or specified (see 1.4)9 assemblies
shall be preheated in a suitable furnace and atmosphere atotemperature of
25 to.-10Oo-F below the solidus temperature of the soldering alloy, Generally
when a molten bath of solder is employed, no preheating is required. The
assembly, together with jigs or fixtures, when used immediately upon removal
from the preheat furnace, shall be dipped into the molten batha at uniform
rate so that the positionof the prepared solder metal is not disturbed.
Soldering times are dependent upon the shape and cross of section
the
assembly. Soldering is complete when the solder metal has flowed evenly into
the joints. At this point, the assembly shall be removed slowly from the
bath at a rate that will not cause loss of the molten solder metal. The
composition and quantity of solder flux or molten solder be shall
adjusted
periodically. The operating temperature of the molten flux bath shall not
exceed the liquidus temperature of the specified soldering alloy by more than
20F.
5,4,5 Type V -
Oven and furnace soldering. Ovens and furnaces shall be
of suitable design and size to maintain uniforms constant temperature within
the soldering area. Devices shall control the.working temperature within one
and one half percent of the temperature required for the item or items to be
soldered. Ovens and furnaces shall be equipped with
a means of controlling
the atmosphere within the oven or furnace, as required, to prevent oxidation
of the basis metals.
12
DOD-STD-1866
5.4.8 Type VI11 - Spray gun soldering. Spray guns shall be of suitable
design and construction,so las to permit heating and spraying
a continuous
feed solid solder wire. Depending upon gun design, propane, acetylene,
or
natural gas with oxygen may be used for heating and spraying. Equipment
shall be similar to that specified MIL-"3800.
in
13
DOD-STD-1866
5.4.8.1 Procedure. Parts shall be assembled with proper fit and fixed
in alignment as required. .Using ordinary metal spraying techniques, the vast
majority of soider is melted by the neutral flame of the gun. The solder
should contact the part in a semi-liquid form. The balance of heat required,
to melt the filler metal and bring the entire joint uniformly to the liquidus
--```,`,`,`,,,`,,,`,`,,,,,,,,,,`-`-`,,`,,`,`,,`---
14
Supersedes page 14 of 21 August
1981.
DoD-STD-1866
fused residue. Flux residue shall be removed by a method which is not injuri-
ous to the surface finish, and which will not remove parent metal and solder
metal to below tolerances specified on applicable drawings. Areas soldered
using chloride-containing flux residues
should-betested for completeness of
flux removal by leaching the area with a small quantity of distilled or
deionized water. Industrial or tap water from pipe lines or conduits, as used
for processing tanks and vats, shall not be used because of impurities. A few
drops of nitric acid and a few drops of
5 percent silver nitrate solution
shall be added to the leach.If a white precipitate is formed, in an amount
greater than that formed in an equal volume of standard sodium chloride solu-
tion (equivalent to125 ppm as chloride) treated in a like manner, the flux
removal is not complete.
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5.6.1 Workmanship. Soldered assemblies shall be processed in a careful
and workmanlike manner. The soldering shall be free of scratches, roughness,
sharp edges, dullness, looseness, blistering, foreign matter and other evi-
dence of poor workmanship that will render the assemblies unsuitable for the
purposes intended. Defects in quality of workmanship, as detailed5.6.2
in
through 5.6.15, shall be considered as failure at some point in the process,
and the part shall be rejected unless it can be repaired prior to final
inspection.
5.6.3 Flow and wetting action. The solder connection shall indicate
compatability between the solder and the surfaces being joined, evidenced by
good flow and wetting action. Wetting and proper compatability shall be
achieved when the solder fillet feathers and thins out at the .edges, and bo
to the base material in those areas where sufficient joint area exist to all
solder spread. Solder fillets at cylindrical surfaces, formed at a direction
other than parallel with the cylinder axis, shall form a fillet which blend
to the cylindrical surface tangentially.
5.6.4 Lines of demarcation. A line of demarcation, where solder fillet
blends to surfaces being joined, shall be acceptable provided wetting has been
achieved.
15
5 . 6 . 6P o r o s i t y . A p o r o s i t yd e f e c t i s t h er e s u l t of gasesbeingexpelled.
It appears as small, round,smooth-edgedpocketsonthesurfaceofthesolder
metal. The presence of p o r o s i t y i s u n d e s i r a b l eb u t i s a c c e p t a b l e ,u n l e s s
o t h e r w i s es p e c i f i e d ,p r o v i d e dt h e number, depthand area of c o n c e n t r a t i o n d o e s
notinterferewiththefunction of thecompletedassembly.
5.6.8Residualflux. No r e s i d u a lf l u xs h a l l bepermittedonthesurface
of a s o l d e r e d i o - i n t , except those from organic-based orrosin-basedfluxes
where r e s i d u e s are n o n c o r r o s i v e .I nt h ef o r e g o i n g cases, r e s i d u a l f l u x may be
l e f t i n p l a c e u n l e s s removal i s d i c t a t e d by t h e a p p l i c a b l e d r a w i n g o r s p e c i f i -
c a t i o n ,a p p e a r a n c e ,o rb e c a u s et h ej o i n t area i s t o b ep a i n t e do ro t h e r w i s e
coated.
5 . 6 . 9E x c e s s i v es o l d e ra l l o y .S o l d e r i n g metal i n excess of t h a tr e q u i r e d
forthejoint i s acceptable,provided the e x c e s ss o l d e r metal d o e s n o t i n t e r -
fere w i t h t h e f u n c t i o n of thecompletedassembly.
5.6.11Penetration.Solderalloymustappearon a l l edges of a j o i n t ,
i n d i c a t i n gp r o p e rf l o wt h r o u g ht h ej o i n t . Lack of p e n e t r a t i o ns h a l lb ec a u s e
f o r r e j e c t i o n of t h e p a r t .
5.6.12Cold s o l d e rj o i n t .S o l d e rs h a l la d h e r es m o o t h l yt ot h ep a r t sb e i n g
j o i n e d . The j o i n ts h a l ln o tb ec h a l k yi na p p e a r a n c e ,l a c k i n g metallic l u s t e r ,
n o r s h a l l i t have a r o u g h ,g r i t t y ,p i l e d up s u r f a c e . A c o l d s o l d e r j o i n t
s h a l l becauseforrejection of t h e p a r t .
5 . 6 . 1 3D i s t u r b e ds o l d e rj o i n t . The s o l d e rc o n n e c t i o ns h a l ln o th a v ea n
i r r e g u l a r ,d u l l ,r o u g ha p p e a r a n c ec a u s e d by movement of t h e j o i n t b e f o r e t h e
s o l d e rh a sf u l l ys o l i d i f i e d .T h i sd e f e c ts h a l lb ec a u s ef o rr e j e c t i o n , as
t h e r e may be a poormechanicalconnection.
16
5.6.17 Humidity test. When specified (see 1.4), soldered areas shall be
tested for completenessof flux removal residue, and corrosive action on the
materials involved; by the humidity test specified in method
507 of
MIL-STD-8 10
5.6.17.1 Test cabinet. The humidity test cabinet shall be lined with
sheet metal, with soldered or welded joints, to form a vapor tight cham
The. walls shall be heavily insulated to minimize heat loss and condensatio
Temperature and humidity controls shall be automatic, and shall be capable
maintaining a dry bulb temperature 100 of + 2
F and a wet bulb temperature sf
'
98 f- 2'F. There shall not be more than2OT temperature difference between
anytwo points in the test area at anytime.
5.6.17.2 Procedure. Selected samples shall be placed in the humidity
cabinet and exposed to the conditions specified 5.6.1in
7.1 for a period of
72 hours. The samples at the end of the test period shall be examined
visually, or at a magnification 4ofX, to determine evidence of corrosion
caused by contamination from flux residues or cleaning solutions.
5.7 Applications data. This standard is intended for use in the control
of non-electric soldering processes as applied to various metals and alloy
in manufacturing. These soldering procedures are used to obtain desired
properties, such as leak tightness, pressure tightness, and heat conductivi
within the limits of the respective materials. The solders required for the
processes detailed in this standard, as structural materials, are weak when
compared to the materials which they are generally used to join. To avoid
depending upon the strength of the solder, joints for sheet metal structur
assemblies should beso designed that surfaces to be soldered by the various
methods will require the solder only to seal and stiffen the assembly.
5.7.1 Copper and copper alloys. Copper and copper alloys are soldered
--```,`,`,`,,,`,,,`,`,,,,,,,,,,`-`-`,,`,,`,`,,`---
17
DOD-STD-1866
5.7.2 Steels. Tin plated steel used for air ducts, amplifier frames,
condensor and capacitor -cans, air filters, and gas meter cases are often
soldered by the dip soldering process. Terne steel is soldered for assembly
into air cleaners, gasoline tanks, cans, radiator parts, oil pans, fire
extinguisher bodies and burial caskets. Frames, tube covers, and chassis for
electronic equipment, made of galvanized steel, are soldered for assembly.
Stainless steel cans, pails and buckets are often soldered after spot welding
or riveting to provide leak tight joints.
5.7.3 Nickel and nickel alloys. Nickel and nickel alloys are
solderable. Application should be used only where resistanceto corrosion is
not an important factor. Solder can be used for'sealing non-pressurized
water containers, provided the strength of the joints is supplied by rivets,
bolts, staking, lock seams, spot welds or other mechanical means. The
soldering process should be limited to joints in sheet metal not more than
5/8 inch wide. Since the solders are weak compared to the basis nickel and
nickel alloys, they should not be -used for attaching fittings to
nickel-copper fuel tanksor pressurized water containers. In the event
soldering must be used for joining nickel and nickel alloys, only the
corrosive fluxes (see5.2.2), are recommended.
5.7.4 Lead and lead alloys. Lead pipe with soldered joints, or soldered
copper fittings, are used to convey water underground, or in drainage and
venting systems. Leaded sheathed cables for telephone, telegraph, and
electrical power transmission conduit also require solder processing for
joining- purposes and waterproofing.
5.7.5 Aluminum and aluminum alloys. Tube fin assemblies and cellular
assemblies for aluminum and aluminum alloys are joined by dip soldering.
5.7.8
Cadmium-silver and cadmium-zinc solders. Cadmium-silver and
cadmim-zinc solders have been used for the joining of aluminum and its alloys
to itself, or to dissimilar metals, by processes detailed in this standard.
These solders are extremely dangerous and are of a highly toxic nature.
Overheating the solder during joining can vaporize the cadmium to produce
highly dangerous and practically odorless fumes. Precautions must be taken
for proper ventilation which may not be suitable or available, during
soldering processes. Their use is not recommended as there are other
materials,
18
--```,`,`,`,,,`,,,`,`,,,,,,,,,,`-`-`,,`,,`,`,,`---
DOD-STD-1866
5.7 .9.2 Chemical and reaction fluxes. Chemical and reaction fluxes are a
special group of corrosive fluxes developed for soldering aluminum.A
chemica1 flux is generally composed of an organic fluoboride (such as boron
trifluoride monoethanolamine), a metal fluoborate (such as cadmium
fluoborate), a vehicle (such as methyl alcohol), and a plasticizer (such as
stearic acid). Modifiers such as zinc fluoride, zinc chloride, or ammonium
chloride may also be incorporated into the formulation.
,Reaction fluxes
usually are composed of zinc chloride, tin chloride,
or combinations of other
metallic halides and ammonium chloride.
--```,`,`,`,,,`,,,`,`,,,,,,,,,,`-`-`,,`,,`,`,,`---
19
DOD-STD-1866
6. NOTES
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DoD-STD-1866
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i
Eutectic 15.5 32 -" 52.5 "- 203 203 O is required.
Rose ' S 22 28 "- 50 "- 204 229 25
14.5 28.5 "- 217 440 223
Matrix
Mold and "- 44.5 "-9 '48
55.5 "- 255 255 O
pattern
1
I Nominal composition
I
I Temperature (OF)
Pasty
I
I
Tin IndiumBismuthLeadCadmiumSolidus Liquidus Application
I
8- 3 5.3
19.1 22.6 44.7 117 117 O I Special
12 21 I 49 I 18 I --- I 136 136 O I purposes
25.6 48
12.8
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9.6
"-
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243
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149
260
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Glass to
metal, or
glass to
glass
soldering
I J
applicable specifications.
24
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