Journal of Magnetism and Magnetic Materials

Volume 270, Issues 12, March 2004, Pages 167173

Finite element modeling of magnetostriction

for multilayered MEMS devices
Ho-Mun Si ,

Chongdu Cho,

Abstract
In multilayered MEMS devices, magnetostrictive thin film structures have very large ratio of
length or width to thickness. This study is supposed to resolve the difficulties encountered in the
finite element modeling of magnetostrictive thin film structures of large aspect ratios. A model is
proposed and applied to the bending of the multilayered cantilever. The results of the proposed
model are validated by comparing with theoretical calculations and experiments elsewhere.

Keywords
Magnetostrictive film;

Finite element modeling;

Magnetostriction;

MEMS

Computer Methods in Applied Mechanics and Engineering

Volume 198, Issue 2, 1 December 2008, Pages 234244

A continuum-based modeling of MEMS
devices for estimating their resonant
frequencies
Abstract
A continuum-based modeling of coupled electrostatics-structure interactions is presented for the
frequency computations of MEMS devices. The present general formulation of electrostatics
accounting for free space is validated first by specializing it to one-dimensional uniform motion
of conducting surfaces and comparing the resulting electrostatics to conventional lumped
models. The general coupled electrostatics-structure interactions are then applied for the
prediction of resonant frequencies of MEMS devices due to bias-voltage changes and
temperature variations. Comparisons of predicted resonant frequencies obtained by the present
coupled electrostatics-structure interaction models with experimental results available in the
literature demonstrate that the proposed continuum-based interaction modeling yields high-
confidence predictions of resonant frequencies of MEMS devices.

Keywords
Electric stiffness;

Mesh motion;

Electric field;

Finite element method;

Total Lagrangian

Procedia Engineering

Volume 5, 2010, Pages 13121315

Eurosensor XXIV Conference

Eurosensor XXIV Conference

Finite element analysis of piezoelectric
microgeneratortowards optimal
configuration
R. Daukseviciusa, , ,

G. Kulvietisa,

V. Ostaseviciusb,

I. Milasauskaiteb

Abstract
The paper provides results of dynamic numerical analysis of piezoelectric cantilever-type
microgenerator intended for wireless MEMS applications. This analysis constitutes an initial
phase of ongoing research work aimed at microgenerator optimal design. It is based on beneficial
utilization of higher vibration modes, which may offer significant benefits in terms of dynamic
performance. Here we report preliminary results of simulations that were performed with a
developed 3-D finite element model of the microgenerator that constitutes a bilayer cantilever
structure with proof mass at the free end. The structure was subjected to harmonic base
excitation by applying vertical acceleration through body load. The resulting characteristics
reveal strong dependence of magnitude of generated voltage on design and excitation parameters
(frequency, acceleration). Initial findings indicate the necessity to develop microgenerator design
with self-tuning of the resonance frequency, i.e. the device should adapt to varying excitation
frequency so as to be driven in resonance thereby achieving maximal electrical power output.

Keywords
Micropower energy harvesting;

MEMS;
 Ambient vibrations;

Piezoelectric conversion;

Cantilever;

Finite element modeling

International Journal of Mechanical Sciences

Volume 74, September 2013, Pages 7382

A finite element analysis of thermoelastic

damping in vented MEMS beam resonators
X. Guoa,

Y.-B. Yia, , ,

S. Pourkamalib

Thermoelastic damping in resonators is studied using the finite element method.

The vent width plays a more important role than the vent length.

Vents at the clamped end can raise the quality factor significantly.

 Vents reduce the structural rigidity and thus reduce the resonant frequency.

Abstract
The effect of geometry on thermoelastic damping in micro-beam resonators is evaluated using an
eigenvalue formulation and a customized finite element method. The vented clampedclamped
(CC) and clamped-free (CF) beams with square-shaped vents along their centerlines, are both
analyzed by the finite element method. The quality factor and the resonant frequency are
obtained as functions of various geometrical parameters including the location, number and size
of the vents. The numerical results reveal that the addition of vent sections in the clamped end
region can significantly increase the quality factor. The maximum improved quality factor as
high as 3801 and 2257 times those of the CC and CF solid beams are realized. The methodology
presented in this work provides a useful tool in design optimization of micro beam resonators
against thermoelastic damping.

Keywords
Thermoleastic damping;

MEMS beam resonator;

Finite element method;

Eigenvalue method;

Vents

Computational Materials Science

Volume 85, 1 April 2014, Pages 253258

Correlation between residual stresses and
bending in functional electroceramic-based
MEMS actuator
M.A. Matina, , ,

K. Ozakib,

D. Akaic,

K. Sawadab, c,

M. Ishidab, c

Highlights

Fabrication of novel Pt/PZT/SRO/Pt/-Al2O3 functional thin films on n-Si (1 1 1).

Combined experiment and modeling to characterize bending of actuator.

Significant reduction of stress with an extra layer of AlSi (1%) thin film.

Advanced 3D finite element simulations to obtain optimal device structure.

Abstract
Micro-electro-mechanical systems (MEMS) technology can offer a viable alternative to realize
miniaturized and less expensive actuators for deformable mirror in adaptive optics to obtain high
resolution retinal imaging. During fabrication of such devices, functional multilayered thin films
are deposited at elevated temperatures. These films are therefore subjected to residual stresses
which may result in bending of the structure. The bending thus occurred may lead to failure at
interfaces between films. A successful fabrication of device therefore relies on the engineering
justification of multi-structured device design and growth parameters used in fabrication. In this
paper, we present the design of a piezoelectric (ceramic) thin film based MEMS actuator for
deformable mirror used in retinal imaging. A proto-type piezoelectric thin film structure of
Pt/PZT/SRO/Pt/-Al2O3 has been epitaxially fabricated on Si (1 1 1) substrate. Advanced 3D
finite element simulations were conducted to correlate the bending of fabricated structure with
residual stresses. A smart alternative design was also proposed employing an extra layer of AlSi
(1%) in the diaphragm region. Simulation results predict a failsafe structure when the thickness
of extra AlSi (1%) layer is tailored to an optimal thickness. The outcome of this research can be
used to overcome the challenge encountered (bending due to residual stresses) to obtain a failsafe
MEMS actuator for deformable mirror.

Keywords
FE modeling;

Electroceramic;

MEMS;

Residual stress;

Epitaxy;

Thin films

Finite Elements in Analysis and Design

Volume 46, Issue 12, December 2010, Pages 10681076

Coupled electrothermalmechanical analysis

for MEMS via model order reduction
David Binion,

Xiaolin Chen,
Abstract
This paper investigates model order reduction (MOR) techniques that can be used in conjunction
with finite element schemes to generate computationally efficient solutions for multiphysics
MEMS simulation. The Lanczos and Arnoldi algorithms are implemented to extract low
dimensional Krylov subspaces from the finite element discretized system for model order
reduction. A deflation procedure is employed in both algorithms to improve the solution
convergence of the implicit iterations together with stopping criteria to automatically determine
the reduced model size. Reduced order electrothermalmechanical models are generated for a
MEMS microgripper using the developed programs. A Guyan-based ANSYS substructuring
analysis of the same device is also performed. Results discussion on all three techniques
including preservation of full scale model properties such as dynamic behavior and stability are
presented along with comparisons of reduced and full model simulation. The developed
programs automatically generate compact structure preserving models and can be used to
significantly improve the computational efficiency without much loss in accuracy and model
stability for coupled-field MEMS simulation.

Keywords
MEMS;

Model order reduction;

Arnoldi;

Lanczos;

Guyan;

Deflation

Procedia Engineering

Volume 48, 2012, Pages 338345

Modelling of Mechanical and Mechatronics Systems

MEMS Piezoelectric Pressure Sensor-
modelling and Simulation
Vladimr Kutia, , ,

Jaroslav Dzubab,

Juraj Paulecha,

Justn Murna,

Tibor Lalinskb

Abstract
The paper examines the modeling and simulation of piezoelectric MEMS pressure sensor which
is AlGaN/GaN based circular high electron mobility transistor (C-HEMT) structure. The
influence of the residual stress plays an important role in correct modeling of MEMS
piezoelectric pressure sensor. Residual stresses which were measured by micro-Raman
spectroscopy are included in the model using initial stress state of the membrane. Two different
geometries of MEMS piezoelectric pressure sensor are considered -circular and ring.
Piezoelectric analysis of the MEMS sensor is performed by FEM code ANSYS. 2D simplified
axisymmetric FEM model, which is very effective from computational time viewpoint, is
verified by full 3D FEM model. The influence of position of electrode is investigated in verified
2D simplified axisymmetric FEM model.

Microelectronics Journal

Volume 44, Issue 9, September 2013, Pages 860868

Finite element analysis of miniature
thermoelectric coolers with high cooling
performance and short response time
Wei Zhua,

Yuan Denga, , ,

Yao Wanga,

Anliang Wangb, ,

Abstract
The miniature thermoelectric cooler (TEC) is a promising device for microelectronics
applications with high cooling performance and short response time. In this paper, a
comprehensive numerical analysis focusing on the cooling performance and response time of the
TEC is performed by finite element methods (FEMs). The effects of load current, geometric size,
ratio of length to cross-sectional area and substrate's thermal resistance on the performance of the
TEC are studied. The results show that the performance of TECs has been improved by reducing
the TEC's size and ratio of length to cross-sectional area, resulting in a maximum cooling
temperature difference of 88 C, a cooling power density of 1000 W cm2 and a short response
time on the order of milliseconds. Furthermore, the substrate, which hinders the circulation of
heat between the TEC and the atmosphere, also has a significant influence on the performance of
the TEC.

Keywords
Thermoelectric cooler;

Finite element methods;

 Size effect;

Cooling performance;

Response time

Journal of Sound and Vibration

Volume 333, Issue 9, 28 April 2014, Pages 26882700

Analytical modeling of squeeze-film damping

for perforated circular microplates
Pu Lia, , , ,

Yuming Fangb,

Feifei Xua

Abstract
Predicting squeeze-film damping due to the air gap between the vibrating microstructure and a
fixed substrate is crucial in the design of microelectromechanical system (MEMS). The amount
of squeeze-film damping can be controlled by providing perforations in microstructures. In the
past, to include perforation effects in squeeze-film damping calculations, many analytical models
have been proposed. However, only the rectangular perforated microplates are considered in the
previous works. There is lack of works that model the squeeze-film damping of circular
perforated microplates. In fact, the circular perforated microplates are also common elements in
MEMS devices.

In this paper, the squeeze-film damping in a perforated circular rigid microplate is modeled using
a modified Reynolds equation that includes compressibility and rarefaction effect. The pressure
distribution under the vibrating plate is obtained using the Bessel series. Analytical expressions
for the squeeze-film damping and spring constants have been found. For a flexible perforated
circular microplate, based on Reyleighs method, this paper presents an approximate model to
estimate the squeeze-film damping in the flexible plate vibrating in the fundamental mode. The
accuracy of the present models is verified by comparing its results with the finite element
method (FEM) results.

Chemical Engineering Science

Volume 66, Issue 23, 1 December 2011, Pages 62446253

Finite element analysis of oxygen transport in microfluidic cell culture devices with
varying channel architectures, perfusion rates, and materials

M. Zahorodny-Burke,

B. Nearingburg,

A.L. Elias,

Abstract

Numerical simulations were done both as an exploration into the nature of oxygen transport
within microfluidic cell culture devices and an investigation of the relative importance of various
design parameters. A rectangular channel comprised of an oxygen permeable polymer layer
bonded to a glass substrate seeded with a monolayer of oxygen-consuming cells was modeled.
Oxygen transport by both convection and diffusion within the cell culture media and by diffusion
in the polymer layer were explored using finite element analysis. Stiff spring analysis was
applied at the interface between these two regions to ensure a continuous flux of O2 across the
boundary. The O2 utilization of the cells was approximated by a constant flux of oxygen from the
bottom of the channel. The model was verified against an analytical solution from the literature.
Design parameters including flow rate, diffusive layer thickness, and material selection were
manipulated within the model to determine their relative importance in ensuring adequate
supplies of oxygen for cell growth. The solubility and diffusivity of oxygen within the polymer
layer were found to be key parameters in determining the amount of oxygen available to the
cells, along with the flow rate of the media perfusing the system. These explorations will enable
rational design choices to be undertaken during the implementation of microfluidic devices for
cell culture.

Highlights
We model oxygen transport and consumption in microfluidic cell culture devices. Numeric
analysis is applied using mass balance and stiff spring boundary conditions. O2 is supplied by
diffusion through a polymer cap and by a convective flow of media. Consumption of O2 by
cells is modeled as a constant flux out of the channel. Effects of varying device geometry,
material, and perfusion rate are examined.

Keywords

Numerical analysis;

Convective transport;

Diffusion;

Mass transfer;

Polymers;

Microfluidics

Applied Surface Science

Volume 248, Issues 14, 30 July 2005, Pages 503508

4th International Conference on Photo-Excited Processes and Applications 4-ICPEPA

Design, analysis and fabrication of a new
MEMS scanning device actuator
S. Eliahou-Niv,

Abstract
In this paper, an improved mechanical device for producing a large angular movement of an
optical element is described. The device can be used either for angular positioning or as a
dynamic angular deflecting driver for optical components or systems. The device was designed
using graph-presentation methods and numerical finite element method (FEM). The device was
fabricated and tested as an angular driver of thin-film tilt interference filter for dense-wavelength
division demultiplexing systems (DWDM) applications. Scaling-down analysis was carried out
to show micro-electro-mechanical-systems (MEMS) suitability.

Keywords
Tunable-filter;

Thin-film tilt interference filter;

Scanning device;

MEMS actuator