l1421 - Practical Hints For The Installation of Sg's

HBM Publication
English
Practical Hints for the Installation of

Strain Gages
by Karl Hoffmann
L1421-2.0 en
Practical Hints for the Installation of Strain Gages
Important notice
We know from experience that the processes and materials mentioned or
recommended in this brochure are reliable and suitable for the purpose
described and also conform to the state of the art. They are to be understood
as guidance and advice for the use of strain gages. However, as applications
are so diverse and conditions so complex, it is not possible for either Hottinger
Baldwin Messtechnik GmbH or the author to offer any guarantees, nor can
they be held liable in any way whatsoever for any claims derived therefrom.
For critical cases, we recommend an initial test that takes into account the
special conditions applicable to you.
Please note in particular the safety and working regulations, applicable safety
data sheets can be obtained from the manufacturers for many of the products
mentioned here.
Neither the publisher not the author are aware of any industrial property rights
that would be affected by these implementations, although this cannot be
excluded with certainty.
Note: The numbers in square brackets (e.g. [1]) relate to additional literature,
see Section 6, Bibliography, Page 60.
We would be happy to provide you with more information about our program.
You can obtain detailed information documentation on the techniques and
processes used, as well as on the corresponding equipment. Our expert
engineers in the field service are always at your service for detailed
consultations. They will also be happy to provide you with non-binding
proposals for the solution of your measurement technology problems.
1979
4., completely revised and updated version 2011
Printed in the Federal Republic of Germany
All rights reserved. No part of this document may be reproduced in whole or in

part in any form or by any means, or translated, without the express written
permission of the publishers. Extracts may be photocopied for personal use.
L1421-2.0 en
Contents
Contents Page
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 The installation of SG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Task and function of the bonding material . . . . . . . . . . . . . . . . . . . . . 8
2.2 Type of bonding materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3 Characteristics of the various HBM SG adhesives . . . . . . . . . . . . . 14
2.4 Application of adhesives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4.1 Bonding surface preparation for metals . . . . . . . . . . . . . . . . . 16
2.4.2 Bonding surface preparation for non-metals . . . . . . . . . . . . . 22
2.4.3 Use of SG in medical technology. . . . . . . . . . . . . . . . . . . . . . 25
2.4.4 SG preparation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.4.5 Bonding process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2.4.6 Precautionary measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3 Connecting the cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

3.1 Soldering tools, soldering materials, connection materials . . . . . . . 39
3.1.1 Soldering irons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.1.2 Soldering tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.1.3 Solders (soft solders) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.1.4 Fluxes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3.1.5 Solder terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.1.6 Lead material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
3.2 Practical tips. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.2.1 Soldering tips . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.2.2 Hints for cable connection . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
4 Intermediate tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.1 Visual inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.2 SG contact resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.3 Connection cable resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.4 SG insulation resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.5 Connection cable insulation resistance . . . . . . . . . . . . . . . . . . . . . . 52
L1540-2.0 de 3
Hinweise zur Installation von DMS, Contents
5 Measuring point protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

5.1 Hints for the use and structure of protective covers for SG
measuring points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.2 Common covering agents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6 Bibliography . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4 L1540-2.0 de
Introduction
1 Introduction
Strain gages (SG) are designed to measure strains. The results of such
measurements can be used to make statements about the material stresses of
the measurement object, about the nature and amount of forces acting on the
measurement object, etc. An SG can however only perform the required task if
the strain to be measured is transferred faultlessly and without loss. This
requires an intimate connection between the SG and the measurement object.
The required intimate, full contact connection between the measurement
object and SG can only be achieved with special adhesives and methods.
Some bonding materials and methods are limited to special applications, e.g.
ceramic bonding materials in high temperature installations and spot welding
on steel work applications; both areas however also require special SG.
The quality of the installation has a long-term influence on the achievable
measurement errors and uncertainty. It can be said that an SG in the delivery
condition is not yet a complete measurement device and must be installed by
the user in order to be ready for use.
SG and their installation form a unit. Which part of this combination contributes
to errors and to which extent can only be determined through comprehensive
comparison measurements with other combinations. You should therefore
always use the recommended installation materials and methods, unless you
have the test equipment described in [1] and can implement the extremely
comprehensive and expensive tests yourself. All the components that form the
measuring point, such as SG, bonding material, covering agents and other
accessories have been tested in comprehensive test series for their
effectiveness, compatibility with each other and reliability before being
accepted into the delivery range of a manufacturer; their properties are
constantly monitored on the basis of quality assurance. Their reliability is
therefore not open to question if used properly. No guarantee can therefore
understandably be given if they are combined with other, foreign products or if
processed using different methods.
It is not just the bonding material itself, but also the careful and expert
application which contributes to success or failure. The instructions for use
supplied with the adhesives contain all necessary information and instructions,
and must be followed with the utmost accuracy.
Careful preparation is required, especially for larger projects, so that a
measurement can be implemented optimally. This requires, in addition to
objective test planning, personnel disposition. Only skilled personnel can
ensure success. HBM has for many years endeavored to pass on the
necessary specialist knowledge, including in cooperation with institutes of
engineering and technician training. The specialist information that the
installation technician must be provided with includes all data regarding type,
L1421-2.0 en 5
Installation of strain gages, Introduction
scope and application of the required measuring equipment. The test leader
must provide clear information here based on his knowledge of the task and
the test conditions. Table 1-1 provide various key points for this purpose.
The installation technician requires the following principal data:
Installation location and measuring grid direction on the object (installation
drawing, measuring points diagram)
Circuit diagram, cable plan
SG type being used
The bonding method and material (e.g. a special adhesive type)
Lead material (cable type, cross-section, insulation, etc.)
Protective measures against mechanical, chemical, electrical, thermal or
other influences on the measuring point or leads
Decision aids can be found in the technical information, e.g. in [17] and [18], or
in the technical literature. The question regarding suitable safety measures is
sometimes difficult to answer when complex disturbing and influencing factors
apply, or can be answered only after comprehensive trials under actual
conditions.
The highest level of reliability is required of the installation technician, together
with specialist knowledge, skill and experience, as the quality of the installation
is a prerequisite for reliable measurement results.
6 L1421-2.0 en
Introduction
Object of Measurement
Original, prototype or model
To measure on it
what how where when
Quantity Method Place Time schedule

Strain Strain gage Laboratory Preparation
Hall Instrumentation
Outdoors Trials
Installation
Required quantity Other Measurement
conditions Evaluation
Material stress Dismount
Force Static measuring Other
conditions Transport
Weight, mass Dynamic
Pressure measuring Stationary
Torque Zero related Mobile
Power Duration
etc. Frequency
Disturbances
Installation planning
Skilled men
Personnel
Experienced engineers
CF or DC instruments
Instrumentation
Single or multi-channel measurements, recording methods
Strain gages Type selection (see SG catalog)
Type, location and orientation of each gage

Installation plan
Installation method
Cables and leads material

Circuit and cabling plan
Accesories, e.g. tiers, pressure tight feed-through etc.
Mechanical
Protective methods Covering agents
Chemical
Electrical Screenings
Table 1-1: Schematic of installation planning.
L1421-2.0 en 7
Installation of strain gages, The installation of SG
2 The installation of SG
2.1 Task and function of the bonding material

The bonding materials have the task of firmly attaching the SG to the surface
of the measurement object and transfer the deformation of the object without
loss to the SG. Various conditions and influences, and the application options,
require different bonding materials and application methods. Bonding is the
most important factor. The particular advantages of this connection methods,
with regards to SG installation applications, are:
The possibility of connecting different materials, even dissimilar ones.
Depending on the type of adhesive, connection is implemented at room
temperature or higher temperatures.
No influence on the materials to be connected (some restrictions may apply
for plastics).
Chemically-hardening adhesives (only these are still used in SG
technology) are characterized by low moisture absorption.
Control of working speed through selection of different adhesive types or
curing conditions (hot or cold curing).
Higher specific electrical resistance contributes to higher insulation
resistance between SG and component.
The adhesion of bonded parts is based on the adhesion between the adhesive
and the surfaces wetted by the adhesive. Adhesion is mainly based on the
attractive forces between neighboring molecules. The contribution from
mechanical bonding of the adhesive in the pores of the roughened surfaces or
from capillary action is very small. The increase in bonding stability observed in
moderately rough surfaces is due to the increase in effective contact surface
caused by roughening and not mechanical adhesion.
Note 2.1-1:
The reasons for adhesion are very complicated and only partially explained [2], [3]. A
significant contribution to bonding forces comes from adsorption (also called secondary
valency bonds), some from chemical bonding (primary valency bonds) and other energy
sources.
Various types of bonding mechanisms in the adsorption sector are summarized under the
term van der Waal's forces and are basically distinguished by three types of reciprocal
orientation effects:
The dipole moment (Keesom forces). If positive and negative charges in a molecule are
distributed asymmetrically, the molecule is neutral but will have a dipole moment, i.e. it
will be polar. Neighboring molecules will try to align their dipole moment so that the
8 L1421-2.0 en
The installation of SG
positively charged side of a molecule will face towards the negatively charged side of a
molecule and vice versa. The average range of the Keesom forces is 0.4 to 0.5 nm (4-
5 ).
The induction effect (Debye forces). Interactions also result if the charge centre of gravity
in the electrical field of a molecule is shifted by the inductive effect of an outer field (e.g.
another molecule). Unlike Keesom forces, one particle has a permanent dipole and the
other an induced dipole moment in the case of Debye forces. The average range of the
Debye forces is 0.35 to 0.45 nm (3.5-4.5 ).
The dispersion effect (London forces). This effect may be explained by wave mechanic
considerations whereby the continuously changing probability density for the positions of
the electric charges in a system of two particles oscillating in phase induces a constant
dipole moment. The average range of the London forces is 0.35 to 0.45 nm (3.5-4.5 ).
The so-called hydrogen bridge bond holds a special position in the van der Waal's forces.
It is also based on the interaction of oriented dipoles, but has the peculiarity that the positive
pole of at least one dipole is formed by a hydrogen atom. The average range of the
hydrogen bridge is 0.26 to 0.3 nm (2.6-3 ). The percentage of chemical bond forces
(primary valency bonds) has not yet been fully explained. It appears however that these
force contribute less to the adhesive forces.
2.2 Type of bonding materials

Both the working conditions at the installation site and the various
requirements for the bonding material performance, particularly with regards to
operating temperature, have led to various types of bonding materials being
available. The same applies to the SG itself. This gives rise to matches
between various SG series and adhesive types with optimal properties within a
limited application range. The application limits are defined by the component
with the narrowest performance range in other combinations with different
performances. In addition, there are SG and bonding materials whose
combination is not possible for technological reasons. Please refer to the
recommendations in the brochures and technical data sheets.
Note 2.2-1:
It is essential not to use any adhesives other than the recommended adhesive. SG
adhesives must fulfill different requirements than general adhesives. This is why they are
generally based on special developments or modifications of commercial adhesives. That
an SG simply adheres to an object is not a sufficient criterion to evaluate the suitability of the
adhesive for measurement purposes, it must also ensure a faultless transmission of the
object strain. This requires more in-depth investigations (SG tests according to [1]
automatically include the adhesives).
Bonding materials can be differentiated as follows regarding the application

technology:
L1421-2.0 en 9
Cold-curing adhesives
These can be easily applied and do not require much effort. There are
single-component adhesives that start curing when e.g. air is excluded
(anaerobic) and two-component adhesives that must be mixed before
application. Adhesive with very short reaction times are also called
superglues. Their preferred field of application is in experimental stress
analysis.
Hot-curing adhesives
These adhesives can only be used where the test object can be brought up
to the required curing temperature. This is generally possible in the
manufacture of transducers, but also where SG can be installed before
machine assembly or where machines can be dismounted for SG
installation. In contrast to cold-curing adhesive, the hot-curing adhesive
offer a wider application range at higher temperatures and are suitable, in
combination with precision SG, for meeting the generally higher accuracy
requirements in transducer production.
Spot welding
This is one of the simpler installation methods. It requires very little
equipment (a small spot welder), little preparation and training. However, it
is not often used for the following reasons:
Special SG are needed, and there are not many types available.
Weldable SG can only be manufactured down to certain sizes, further
limiting their application range.
The measurement object must consist of a weldable material. On certain
objects, this type of application is not permitted despite welding suitability
as there is a danger of micro-corrosion, e.g. on highly stressed
components of steam boilers, austenitic steels, etc.
The measurement object must be so strong (thick) that the stress
distribution is not modified by the relatively large restoring force of the
SG, i.e. no noticeable strain impedance should occur.
Table 2-2 on page 12f. provides an overview of the SG bonding materials

offered by HBM and their main technical and processing-related data, Table 2-
1 contains an explanation of the letters and symbols.
10 L1421-2.0 en
Letter code SG properties
Y, C, V Polyimide carrier
G, K Phenolic fiberglass carrier
A, U PEEKF carrier
E PEEK carrier
S Metallic carrier (weldable SG)
Symbol Significance
Optimal combination of SG and bonding material
Suitable, but sacrificing a part of the SG or bonding material

temperature range
Unsuitable combination
Table 2-1: Explanation of letters and symbols in Table 2-2.
L1421-2.0 en 11
Useful temperature range (approx.)

for zero-point related 1
Bonding Main application Base for non zero-point related 2
material areas material measurements
-200C 0C +200C +400C
Experimental stress
Methacrylate
X60 superglue analysis, simple
mixture
transducer
Experimental stress
Z70 superglue Cyanacrylate
analysis, transducer With continuous oper.: Lowest temp. -55C
X280 cold- Experimental stress

Epoxy resin
curing adhesive analysis
Experimental stress For transducers

analysis at elevated
EP150 adhesive Epoxy resin
temperature range,
transducer
Experimental stress
For transducers
analysis at elevated
EP250 adhesive Epoxy resin
temperature range,
transducer
Experimental stress
EP310S analysis at elevated For transducers
Epoxy resin
adhesive temperature range,
transducer
Transducer
Stick-on SG Phenolic resin
construction
Spot welding Experimental stress
Temperature limits only dependent on SG
method analysis
Table 2-2: Overview of SG bonding materials in the HBM product range and their
combination options with various SG series.
1) With zero-point related measurement, the measured values are referenced to the zero point
(usually static measurements).
2) With non non zero-point related measurement, the zero point can fluctuate, only the dynamic part
is important (dynamic measurements).
12 L1421-2.0 en
Curing conditions Suitable for SG in series6)

components
Layer
Pot
Number of
Contact
Temp. thickness5)
life3) Time 4) pressure 4) Y, C G, K A, U V E S
in C in m
in N/mm2
0 60 min
Thumb
2 35 min 204) 10 min 65
pressure
35 2 min
5 10 min
Thumb
1 204) 1 min 6
pressure
30 0.5 min
RT 8h
2 30 min 65 2h 0.05 0.5 40
95 1h
160 6h
1 1704) 3h 0.3 0.5 10
190 1h
95 15 h
120 5h 0.1 1
2 24 h 25
1804) 2h 1.5
200 0.5 h
150 3h
0.1 0.5
2 4 weeks 180 1h 10
1.5
200 0.5 h
160 3.5 h 0.2 0.35 13 17
3) Pot life is the time available for adhesion after the adhesive components are mixed at 20C; this time
decreases at higher temperatures and vice versa.
4) Figures in bold are the preferred values, all others are alternative or limit values.
5) Typical values, dependent on the base and contact pressure.
6) SG series consisting of several SG series or SG families differing either in material and design
properties. The letters indicate the measuring grid carrier; an explanation of letters and symbols can
be found in Table 2-1 on Page 11.
L1421-2.0 en 13
2.3 Characteristics of the various HBM SG adhesives

X60 superglue
This pasty adhesive is preferentially used for stress analysis investigations
within the natural temperature range (approx. -20 ... +50 C). It can however
also be used for measurements down to -200C. The pasty consistency
makes it suitable for installing SG on porous, absorbent materials. It is
popular with installation engineers thanks to the relatively easy processing.
The necessity of mixing two components before each gluing process
compares positively to the working time available (at room temperature) of
approx. 3 minutes; this is long enough to permit complex installations (e.g.
where access to the adhesive point is difficult), but short enough to avoid
expensive waiting times.
The use of X60 for the manufacture of transducers is only restrictedly
recommended and should be limited to simple designs with permissible
error limits in the percentage range.
Z70 superglue
This low-viscosity cyano-acrylate adhesive, which dries in seconds, permits
- and requires! - a rapid working speed that requires good access to the
adhesive point. Due to the extremely thin adhesive layer and the higher
temperature limits, a lower measurement uncertainty can be achieved than
with the X60, especially in the temperature range above 50 C up to the
temperature limit. Z70 is very easy to handle.
Due to the low viscosity, Z70 is not suitable for applications on non-
absorbent materials. Z70 is suitable for medium accuracy class transducer
manufacturing.
X280 cold-curing adhesive
This adhesive is intended for applications where the measurement point is
subject to high temperatures but where installation with a hot-curing
adhesive is not possible. X280 enables static examinations up to 200 C and
dynamic examinations up to 280 C. Nevertheless, the adhesive hardens at
room temperature within 8 hours.
X280 is also suitable for applications on porous materials. It is not
recommended for use in transducer construction.
EP150 adhesive
EP150 adhesive is a hot-curing, one-component, epoxy resin adhesive. It is
very viscous, resulting in a thin adhesive layer, economic in use and has a
long pot life. The adhesive adheres extremely well to all commercial metals
14 L1421-2.0 en
and can be used for both static and dynamic measurements in the
temperature range between -70 and +150C. These temperature limits are
however fluid and depend on the SG being used, on the expected
measurement accuracy and on the curing process. Please note the
temperature ranges stated in the SG specifications.
EP150 is very suitable for the construction of transducers.
EP250 adhesive
This hot-curing two-component adhesive is suitable for both stress analysis
examinations in a wide temperature range and for transducer construction.
EP310S adhesive
This hot-curing two-component adhesive is free of fillers, resulting in thin
adhesive layers similar to Z70. In comparison to EP250, this results in a
lower reaction force of the installation, improved strain transfer from the
measurement object to the SG and therefore lower measurement
uncertainties. In the stress analysis field, the particular advantages of this
adhesive lie in the higher or extremely low temperature ranges that cannot
be covered with the above-mentioned adhesives.
EP310S is very suitable for the construction of transducers.
Self-adhesive SG (Stick-on SG)
The phenol resin based adhesive is hot-curing and already applied to the
bottom of the SG. No additional adhesives or activators are required to glue
these SG. The adhesive is dry to the touch and therefore facilitates the
handling and positioning of SG. Hardening is implemented under pressure
at 160C.
These SG are very suitable for the construction of transducers.
2.4 Application of adhesives

Strain gages can be applied to almost all kinds of solid materials. The
prerequisite is a suitable and careful preparation of the installation spot.
Further details about suitable methods can be found in the operating
instructions of the SG adhesives and in the following subsections.
Note 2.4-1:
The information below is more detailed than is possible in the instructions for use of the
adhesives. However, it is not possible to cover all properties of the various adhesives. If
there are any contradictions between the information here and the special data in any
instructions for use, then the latter instructions will apply.
L1421-2.0 en 15
2.4.1 Bonding surface preparation for metals

The type and extent of measures for bonding surface preparation depend on
the condition of the measurement object, extent and type of contamination and
the material being bonded. The following schematic lists the various stages of
pre-treating metallic objects. The aim is to create a surface without pores,
notches and oxides, not too rough and easily wetted. The individual
measurement object preparation stages:
Coarse cleaning
Smoothing
Cleaning
Roughening
Cleaning
Marking
Fine cleaning and degreasing
Pickling, rinsing and drying if necessary
Which of the steps are necessary and which materials should be used
depends mainly on the condition, size and sensitivity (against damage) of the
object. The installation technician must decide accordingly from case to case.
The respective measures are explained in the following descriptions.
The terms cleanliness and contamination must be explained first as it is

essential that they are clearly understood by the installation technician.
Every open surface must be seen in principle as contaminated even if it
appears smooth and clean to the eye. Deposits of dust, oxidation, adsorption
of moisture, vapors and gases occurs continuously, constantly re-
contaminating the surface and reducing bonding capability with adhesives.
This is why bonding should be implemented as rapidly as possible after the
bonding surface has been cleaned. Pauses between the individual stages of
measurement point preparation are not permitted. Even under laboratory
conditions and favorable air conditions, an interval of 3 hours between
cleaning and installation must be seen as the upper time limit. Bonding must
be implemented immediately after cleaning on rapidly oxidizing materials or in
industrial atmospheres.
Coarse cleaning
Remove all rust, scale, paint coatings, thick lubricant and dirt layers, and
other impurities or surface coatings from a generous area around the
16 L1421-2.0 en
measuring point. Use scrapers, spatulas, grinding equipment or similar

tools; household detergents can also be used for coarse cleaning of
lubricant and grease layers. Caustic soda solution is also a good fat solvent
for coarse cleaning, but must be used with great care. It has a corrosive
effect on the skin, rubber globes and protective glasses must therefore be
worn while using it. Caution! Do not use caustic acid on aluminum! Rinse
thoroughly with deionized or distilled water afterwards. Sufficient degreasing
is evidenced by an unbroken water film running off the surface. Dry the
measuring point with a clean cellulose pad.
Smoothing
Rust, scars and deep scratches produce notch strains on the surface of the
object and lead to incorrect measurement results. Humps and other uneven
features prevent the SG from bonding. You must therefore smooth the
bonding point by grinding, filing or other suitable methods. Grinding tools
with rubber plates and replaceable emery wheels are most suitable. The
rubber plate follows the contours of the object and the emery wheel grain
can be selected to match the purpose; start with a coarse grade followed by
finer and fine grades. To avoid misunderstandings: The bonding area must
not be flat (an SG can also be bonded to curved surfaces), it must simply
not be bumpy. Coatings with lead, cadmium, tin, indium, bismuth and
similar metals bind poorly or not at all with adhesives and must therefore be
removed. Nickel coatings may peel and should also be removed.
Cleaning
Dirt, grinding dust and grease should be removed in this step. Cleaning
must be thorough but not extreme as further steps will follow. Organic
solvents are recommended as cleaning agents. Further details can be found
under the keyword Fine cleaning below.
Mineral oils such as those used during rolling of sheet metals, boring
emulsions, cutting oil, etc. are insufficiently removed with general organic
solvents. Alkaline agents are more suitable in this case.
Roughening
Section 2.1 and Note 2.1-1 have explained that the bonding forces between
the fitting piece and adhesive are mainly chemical in nature. An increase in
bonding force is only possible by increasing the contact surfaces. This can
only be achieved by roughening. This is usually done mechanically, or in
rare cases chemically by pickling.
L1421-2.0 en 17
Adhesive
Fitting piece (measurement object)
Fig. 2-1: Influence of surface roughness on effective contact surface size

left: Contact line with ideal-smooth object surface
right: Extended contact line through light roughening (optimal condition)
Roughening with sandblasting

An ideal bonding base is achieved with sandblasting. The requirement for
perfect surfaces are oil and water-free compressed air, clean (unused)
abrasive medium and totally grease-free surfaces as grease particles that
are embedded by the sandblaster are extremely difficult to remove, at the
most with an ultrasonic cleaning device.
Corundum is recommended as the abrasive agent. It is sharp-edged, hard
and clean, does not cause corrosion and is physiologically harmless (no
silicosis). For extremely hard materials, (e.g. hard metals), boron carbide is
a proven medium, a material with a hardness between diamond and
corundum. The appropriate grain depends on the hardness of the material
being sandblasted, the air pressure, the distance between the nozzle and
object and the system used. Table 2-1 shows empirical values
(recommended values).
Roughening by sandblasting
Grinding
Corundum (Paper or
Component Air
material Distance Average cloth)
pressure
in cm Grain No. grain size Grain size
in bar
in m
Hardened
4 20 80 100 160 115 80 220
steel
Mild steel 4 20 100 150 115 75 100 220
Aluminum,
3 25 F240 F320 45 29 220 360
Al-cast parts
Table 2-1: Recommended values for the grain size of corundum or emery
paper/cloth for roughening workpieces before SG installation.
18 L1421-2.0 en
When using cyano-acrylate adhesives (e.g. Z70), less roughening (finer

grain) is recommended, while stronger roughening with coarser grains is
better for pasty bonding media. Table 2-2 provides recommended values for
optimal roughening depths (rms).
SG bonding material Average roughening depth in m
X60 superglue 3 10
Z70 superglue 24
X280 adhesive 2 10
EP150, EP250 and EP310S adhesive 24
Table 2-2: Recommended roughening depth of bonding surfaces on the

measurement object for various SG adhesives.
Roughening with grinding

Despite the obvious advantages of sandblasting, applications are limited
either due to lack of appropriate systems or because the measurement
object does not permit such treatment, e.g. being located near machine
bearings. In such cases, use emery paper. Used correctly, it also delivers
satisfactory results. The emery paper should be rubbed in circles across the
surface to prevent strength-reducing preferential directions. Always use new
emery paper (or emery cloth) and a grain size suitable for the material
hardness. Table 2-1 shows the recommended values for grain sizes, while
roughness depth values are recommended in Table 2-2.
Roughening with other mechanical methods
Even grinding may be too coarse a method for roughening the contact
surfaces on some objects and is therefore not permitted. This applies mainly
to notch-sensitive materials where the surface treatment must be retained.
The mildest form of mechanical pretreatment for roughening and removing
oxide layers is abrasion with a glass eraser (glass fibre eraser pen). Please
note that the abraded material must not be removed using the hand or by
blowing it away. Then there are also chemical methods that are described in
the section Pickling.
Marking
Indicate the exact position of the SG by marking the measurement object.
Foil SG have marks to identify the centre axes of the measuring grid.
Marking using a scribing iron is not recommended as the damage to the
L1421-2.0 en 19
surface can lead to damage or breakage of the object itself. An (empty)

ballpoint pen is far more suitable as the ball leaves a clearly visible line
without making any notches. If the pen still contains ink, the ink must be
removed after marking with a solvent (e.g. RMS1 or RMS1-Spray).
A sharp pencil can be used to mark soft materials, e.g. aluminum. The
necessary hardness (between 4H and 6H) should be checked first on a
material sample (the lines should still be visible after fine cleaning, but leave
no grooves).
Fine cleaning
The efficiency of the bonding forces described in Section 2.1, Page 8
decreases with the third to sixth power of the distance. It is therefore limited
to molecular layers. Very careful fine cleaning is therefore essential. Even
the thinnest layers of grease will affect or neutralize the effectiveness of the
boundary forces in particular. Silicone greases and oils are the most difficult
to remove and these are present in numerous cosmetic products (skin
cream, etc.). Such products should not be present during SG installation.
If equipment is available and the object permits, vapor degreasing is
recommended. In normal cases, degreasing is implemented by washing
with chemically pure grease solvents (e.g. RMS1 or RMS1-Spray). Note the
relevant health and safety regulations! Good ventilation is essential so that
formation of ignitable gas-air mixtures is prevented and so that collection of
solvent vapors heavier than air does not occur in pits, etc. (danger of
suffocation).
Cleaning agent
The organic solvents that are preferentially used for cleaning are usually
available in two different purity grades:
Technically pure means: free from solid contaminants;
Chemically pure, also indicated by the supplement pro analysi or p. a.
or very pure, means: also free of soluble contaminants within technically
feasible limits.
SG installation points should always be cleaned with chemically pure

solvents.
With RMS1 and RMS1-Spray, HBM offers you chemically high purity,
environmentally-friendly solvent combinations that remove all general
contaminants.
20 L1421-2.0 en
Other commercial solvents are e.g. acetone, methyl-ethyl-ketone, isopropyl

alcohol, ethyl alcohol and ethyl acetate.
Please note the following points when fine cleaning:

Wash hands beforehand and between each step if necessary.
Do not use skin creams; if necessary, then grease-free skin ointments (see
Section 2.4.6, Page 38).
Never use solvents directly from the supply container. Pour a small amount
into a clean vessel (Petri dish) and then use that. Never pour left-over liquid
back into the container, discard any excess.
Use clean, grease and lint-free cleaning pads. Cellulose pads are well-
proven. Only use each pad once! Paper tissues can only be used if they do
not contain any soluble components (perfumes)!
Do not immerse fingers in the solvent as this dissolves skin grease which
will then contaminate the solvent. Use rubber gloves, rubber fingers or
tweezers.
First, clean a larger area, then clean ever smaller areas, so that dirt and
impurities are not rubbed into the bonding point from the edges.
Continue cleaning until no sign of contamination can be seen on a pad.
Then use a new pad each time to wipe once from the centre to the outer
areas in at least 2 opposing directions. Use tweezers or clean tissue paper
to remove any lint that may still be present, do not blow off!
If moisture condenses on the bonding area (following cooling due to solvent
evaporation), use a hot air gun to dry the area.
Once surfaces are clean, do not touch them again with your hands.
Note 2.4-2:
With light metals (aluminum and titanium alloys), it is possible that oily substances bleed out
onto the surface, even after thorough cleaning and degreasing. This bleeding is probably
due to lubricants rolled into the metal surface. Countermeasure: Clean, heat, clean again,
etc. until the bonding area remains clean. However, subsequent loosening of the installation
cannot be wholly excluded.
Pickling
Chemical pretreatment of bonding areas by pickling is rarely implemented in
SG technology due to the workload. It is nonetheless mentioned here for the
sake of completeness.
L1421-2.0 en 21
Pickling can be used in addition to or instead of mechanical pretreatment. In

addition to activating boundary forces, it also produces a very fine
roughening. This microscopically fine roughness has the advantage that the
stability of the measurement object remains unaffected. A particular
advantage is that very thin objects are not bent or buckled. Pickling results
in a very good and uniform adhesion bonding strength.
Pickling must be implemented directly before adhesion. Special care must
be taken in neutralization, rinsing and drying of the bonding areas. Various
methods are listed in [4] for different metal materials. While pickling of
aluminum alloys leads to a noticeable improvement in bonding strength,
compared to other pretreatment methods, this influence cannot be seen for
steel [5].
2.4.2 Bonding surface preparation for non-metals

Concrete
Bonding surface preparation of concrete is aimed at the use of X60
superglue and is generally simpler than metal installations. It must be
determined whether the concrete was cast with oiled or dry molds. In the
former case, the oil-soaked layer must be removed with a grindstone.
Degreasing with solvents is not recommended as the solvent and the
dissolved oil will only penetrate deeper into the concrete. If dry molds were
used, simple remove the concrete laitance until solid concrete is reached.
Grinding is also recommended here to obtain as flat a surface as possible.
Blow off the grinding dust carefully with an air pump or with oil and water-
free compressed air. Seal pores with X60 thoroughly, filling them completely,
not just on the surface. Smooth the bonding areas, do not apply a layer.
After approx. 30 minutes, a thin aluminum foil can be applied as a barrier
layer or, under certain circumstances, the SG can be attached (see
Note 2.4-3).
Note 2.4-3:
Concrete requires a strong pore-filling adhesive that bonds reliably even if residual moisture
is still present. The superglue X60 has proven itself here.
The inhomogeneous structure of concrete requires SG with long measuring grids for mean
value calculation. For more information refer to [18].
Direct bonding of SG to concrete is only recommended for dry parts: if residual moisture is
present, it is recommended that a thin aluminum foil is applied first as a barrier layer and the
SG on top of the foil.
Zero-point related measurements are only possible on concrete if the sample is completely
dry or if the moisture content remains constant during the measurement. Concrete shrinks
22 L1421-2.0 en
or swells if the moisture content changes. This is why zero-point related measurements are
usually only possible over relatively short periods of time, unless an equivalent, unloaded
object is available for compensation. The rules for metal installation apply to installations on
reinforced concrete.
Note 2.4-4:
When measuring concrete, you should consider the use of mounted strain transducers, e.g.
the SLB700A.
Glass (silicate glass), glazed porcelain, enamel

The degreased glass surfaces can be bonded directly with the adhesives
X60, Z70 and EP250. Roughening or other preparations are not necessary.
X60 can be removed by dissolving it with methyl-ethyl-ketone or acetone,
Z70 can be removed by soaking in slightly alkaline (detergent) warm water.
EP250 can be scratched off polished glass. SG can be installed in the same
way on glazed or enameled materials, and on ground surfaces of stoneware
articles, etc. [6].
Plastics
Plastics can be divided roughly into two groups for which different
pretreatment methods must be used:
a) Soluble plastics that are easy to bond
b) Difficult or insoluble (usually non-polar) plastics that cannot be bonded or
only with great difficulty without pretreatment.
Group a) mainly comprises the amorphous structure plastics (e.g. polystyrene

[PS] and PS modifications, polyvinyl-chloride [PVC], polycarbonate [PC],
cellulose-acetobutyrate [CAB], polymethyl-methacrylate [PMMA]).
Group b) includes the partially-crystalline plastics (e.g. high density

polyethylene [HDPE], low density polyethylene [LDPE], polypropylene [PP],
polyoxymethylene [POM] (polyacetal), polyamide [PA]).
The physical or chemical pre-treatments used on plastics are intended to

activate the molecular structure of the surface.
Pre-treatment of soluble plastics involves the removal of processing additives,
particularly release agents (silicone, talcum), lubricants (stearates), surface
contamination and mold skins (on molded or injection molded parts).
Organic solvents, organic sulfonates or alkaline phosphates can be used for
degreasing. Roughening with fine emery paper (grain 220 to 360) is also a
suitable measure. The above-mentioned methods may sometimes provide
L1421-2.0 en 23
sufficient bonding capability in difficult or insoluble plastics, but in most cases

more rigorous treatment is required to modify the plastic structure surface and
achieve bonding capability. More detailed information about the pre-treatment
of plastics can be found in [7], [8].
Care must be taken when handling plastics with solvents as they can cause
swelling and/or stress corrosion. Pure benzene (not on polystyrene) and
isopropyl-alcohol are considered to be safe, particularly with regards to the
short contact time. In critical cases, a test should always be carried out first as
it is not possible to predict results due to the large number of modified plastics
in use.
In this regard, the work in [9] must be referred to as it reports comprehensively
on the installation of SG on plastics and the related problems.
Modern processes, particularly for pre-treatment, also include corona or
plasma treatment with significantly improves bonding force.
Note 2.4-5:
List of successful installations of various types of plastics after simple methods of pre-
treatments.
1) HD polyethylene (HDPE) structural foam: Bonding with Z70 superglue.
Preparation: Bonding area roughened with dry, clean emery paper grain 320 worked in
circles, dust carefully removed. Bonding strength sufficient for < 20,000 m/m.
2) Polypropylene(PP): Bonding with X60 superglue and Z70 superglue.
Preparation: as for 1). Strain level achieved: = 50,000 60,000 m/m.
3) Polyoxmethylene (POM), polyacetal. Bonding with Z70 superglue.
Preparation: Dry roughening with emery paper grain 220. Very good bonding strength.
4) Phenolic resins, cresolic resins, melamine resins and laminates thereof. Bonding with
X60 superglue.
Preparation: Dry roughening with emery paper grain 220.
5) Polymethyl-methacrylate (PMMA), acrylic glass. Bonding with X60 or Z70 superglue.
Preparation: Degrease only. Very good bonding strength.
6) Polyvinyl-chloride (PVC), without softeners. Bonding with X60 or Z70 superglue.
Preparation: Degrease only. Very good bonding strength.
7) Polycarbonate (PS). Bonding with X60 or Z70 superglue. Preparation: Dry roughening
with emery paper grain 220 to 320. Good bonding strength.
8) Polyester resins (fully cured, also fiberglass or carbon fiber reinforced). Bonding with
X60 or Z70 superglue.
Preparation: as for 7). Good bonding strength.
9) Epoxy resins (EP). Bonding with X60 or Z70 superglue.
Preparation: as for 7). Very good bonding strength.
10) Polystyrene (PS). Bonding with Z70 superglue.
Preparation: as for 7). Very good bonding strength.
Note 2.4-6:
Some methods for pre-treatment of polyolefines, see also [2], [4], [7], [8].
24 L1421-2.0 en
1) Low density polyethylenes (LDPE) - alternative methods.

a) Iron-on phenolic resin SG with heated tool.
b) Melt a fine surface layer on PE with a gas flame. Makes the PE bondable.
c) Corona or plasma treatment possible.
2) Polyamides (and other plastics) become bondable if treated with hydrogen peroxide [2].
Wood
Wood can be bonded with the X60 superglue after being dry grinded with
glass or flint paper.
Note 2.4-7:
Wood is an inhomogeneous, anisotropic and porous material. These properties, which
dominate in conifer wood used for building, make SG measurements problematic. In
addition to the extreme differences in the elasticity characteristics due to the structure of
wood, changes in these values due to penetration of the adhesive into surface layers must
be taken into account. Promising measurement results can be obtained where measuring
points can be calibrated and a sufficiently long SG measuring grid is used to average the
partial strains (as with concrete).
Rubber
After degreasing with a solvent named in Section Cleaning agent, Page 20,
rubber can be bonded with Z70 or X60 superglues. Light roughening with
emery paper may be necessary in some cases.
Note 2.4-8:
Strain measurements on rubber may be problematic because the strain suppression
resulting from the reaction force (resistance to expansion) increases the softer the rubber is.
In addition, it cannot be assumed, due to the high elongation properties of certain SG types,
that they are suitable for measuring great strains on rubber because this high elongation is
only available once (or at the most, a couple of times). Low reaction strain transducers are
more suitable for such applications. See also [10].
2.4.3 Use of SG in medical technology

SG technology has mainly found use in medical research in the sectors of
surgery, orthopedics and dentistry. If SG are to be used in conjunction with
metallic or non-metallic instrument, e.g. for measurements on osteosynthesis
plates, prostheses, etc ., the same installation techniques can be used as in the
technical sector. Toxic or allergic reactions caused by contact with the
installation media must be excluded if SG are used on or in living organisms.
Tissue-compatible materials must be selected for implants, materials that must
be resistant against digestive enzymes if in place for longer periods of time.
L1421-2.0 en 25
Information available to the author indicates that the following materials have
been used successfully in in-vivo installations:
For degreasing: Ether
For bonding: Histoacryl blue (manufacturer: B. Braun Melsungen AG)
SG: Series Y (polyimide measuring grid carrier)
For wiring: Leads insulated with polytetrafluorethylene (PTFE, Teflon) or
low density polyethylene (LDPE)
For protective covering: ABM75 covering tape or the viscous mass itself
used in ABM75, covered with PTFE foil
Detailed description of installation techniques for bones can be found in [11].

For further SG applications in the medical sector, refer to [12] to [15].
The Z70 superglue can be used for installations on dead organisms with
silicone rubber SG 250 as the protective cover. As the physiological properties
of these two materials are not known, their application in vivo is not
recommended.
Installations on soft tissues are not promising due to the reaction force
(resistance to expansion), unless investigations are limited to the purely
qualitative display of processes, e.g. muscle reflexes.
2.4.4 SG preparation
Cleaning
HBM strain gages are delivered ready for use and do not require any
special treatment. However, if the adhesive side of the SG is touched with
fingers or contaminated in any other way, clean it with a cotton bud soaked
in solvent (RMS1).
Adaptation to the workpiece contours
The flexibility of SG mainly depends on the properties of the measuring grid
carrier and, to a small extent, also on other components, e.g. integral solder
terminals. Table 2-3 lists the smallest curvature radii with which the SG can
be installed without requiring special treatment for the various SG series.
The polyimide carriers in the Y series strain gages are so flexible that they
can be bonded onto sharp edges without being damaged. Other carriers are
more brittle and will break if they are bent too sharply. However, they can be
easily prepared for installation on smaller radii by pre-forming them. This is
most easily done using a soldering station with controlled temperature,
26 L1421-2.0 en
replacing the bit with a pin made from copper, brass, aluminum or steel with
a diameter to suit the required radius, see Fig. 2-2.
Carrier material Minimum radius of curvature
Solder terminal Strain gage
Longitudinal in
in mm Transverse in mm
mm
Polyimide (Series Y/C) 2 <1 <1
Polyimide (series V) 100 100 100
PEEKF (series A/U) 5 0.5 0.5
PEEK (series E) 5 3 3
Phenolic fiberglass
3 3 3
(Series G/K)
Table 2-3: Smallest bending radii for SG without pre-forming.
Diameter as required
Handle of soldering station Forming tool
Fig. 2-2: Auxiliary tool for forming SG to fit small radii (only necessary for phenolic
resin carrier SG)
Proceed as follows:
Place a temperature-resistant self-adhesive tape on the back of the SG
(Fig. 2-3), e.g. the tape supplied with the EP250 and EP310 adhesive sets.
Mask according to sketch a or b, depending on whether the bending axis is
parallel or transverse to the SG. Cut adhesive tape along the SG edges to
L1421-2.0 en 27
be bent, otherwise there could be a problem when removing the forming

tool.
Apply the short end of the adhesive tape to the cold forming tool, so that the
bending axis lies in the required position (sketch c): longitudinal, transverse
or at an angle.
Heat-resistant adhesive tape A
l = SG length
Bending axis
Bending axis
approx. 5 mm approx. 5 mm Adhesive tape
b) Forming tool
a)
c)
View A
SG
Adhesive tape
Fig. 2-3: Pre-forming method for brittle SG to fit small radii
Set the temperature control to target temperature, switch on and wait until
the target temperature is reached (indicated by control lamp). The forming
temperature is 100 ... 130C for G/K series SG.
Hold free end of the adhesive tape and guide slowly around the forming tool
so that the SG smoothly follows the contour (see sketch c, view A). Stick
down the end of the adhesive tape, switch off the power and allow
everything to cool down.
Carefully peel off the tape, first from one SG end and then from the other
end (do not peel off completely from one end as the SG may break if radii
are small and it is pulled flat again). If you use the tape for fixing the SG
position as described in Section 2.4.5, remove only after installation of the
SG.
28 L1421-2.0 en
Installation aids and solder terminals (see also Section 3.1.5, Page 42)
LY61 series SG (Fig. 2-4, sketch a) have integrated, mechanically
decoupled solder terminals to which the measurement leads can be
soldered. Thin measurement leads can also be soldered directly to LY31
series SG (Fig. 2-4, sketch b). However, in most cases separate solder
terminals are recommended as is the case in designs with ribbon leads
(Fig. 2-4, sketch c). This facilitates the proper solder connection and
ensures that the measurement leads are not subject to tension.
a) Series LY61 b) Series LY41 c) Series LY11
Fig. 2-4: Types of SG connections

a) Integrated, mechanically decoupled solder terminals
b) Open ends of measuring grid tabs
c) Connection leads
The auxiliary techniques 1 and 2 described below permit SG installation with

minimum effort. The advantage is that more difficult work can be carried out in
the laboratory under favourable conditions while work at the installation site is
greatly simplified. This procedure makes installation more secure and
measurements more reliable.
Auxiliary technique 1
Some SG, as depicted in Fig. 2-4 may have an oxide layer on the nickel-coated
solder terminals, which could make subsequent soldering of the leads difficult.
It is therefore advisable to remove this oxide layer with a glass fibre eraser.
Apply a strip of adhesive tape as per Fig. 2-5 to the SG as shown in Fig. 2-4,
L1421-2.0 en 29
sketch a. The adhesive strip should cover the SG connections, but leave
edges and corners free where strain is to be applied.
Stick the prepared SG onto a cellophane or Teflon foil and keep it ready for
installation.
Prepare LY41 series SG (Fig. 2-4, sketch b) in the same way if thin
measurement leads are to be soldered on directly. Auxiliary technique 2 is
recommended for thicker measurement cables.
Do not cover these

SG corners and edges with
adhesive tape
Adhesive tape
approx.10 - 15 mm Cellophane or Teflon foil
Fig. 2-5: Auxiliary technique 1 for SG installation
Auxiliary technique 2
Combine SG as shown in Fig. 2-4, sketch c (if suitable, also sketch b) with an
appropriate solder terminal (see Note 2.4-9) to which connection leads can be
firmly fixed.
Method a)
Cut a pair of solder terminals from a strip (the overlapping edge should remain
at least 0.5 mm wide), Fig. 2-6, sketch a.
Remove any oxide from the metal surfaces with a glass fibre eraser.
Clean any fingerprints from the terminals (and SG if necessary), e.g. with
RMS1 and then use tweezers to handle the terminals.
30 L1421-2.0 en
Leave approx. 1 mm wide edges free

a) from adhesive tape
b)
0.5 m
m
Auxiliary plate
Separating foil
Adhesive strip
Adhesive strip
c) Adhesive strip
Lead
Thickness scale, Solder terminal
magnified
Basis foil of the measuring grid carrier
Covering foil of the measuring grid carrier
d)
0.5 1 mm
Adhesive tape for fixing the solder terminal
(should not overlap sides)
Fig. 2-6: Auxiliary technique 2 for SG installation

a) Cut off a pair of solder terminals
b) Prepare an auxiliary plate and fix the SG with adhesive tape
c) Position the solder terminals and cut leads to size
d) Fix the solder terminals with adhesive tape
Note 2.4-9:
Solder terminals are available in various sizes and designs: Technical details can be found
in the brochures. The criteria for selection are:
1) Spacing of SG connections
2) Space available on the measurement object
3) Thermal stability and mounting method
The temperature range of stick-on solder terminals is usually determined or limited by
the adhesive used.
L1421-2.0 en 31
Method b)
To facilitate the next step, use a clean support plate made of sheet metal or
plastic (approx. 10 cm x 10 cm), cover with cellophane or Teflon separating
foil (approx. 3 cm x 6 cm) and tape the edge to prevent slipping. Carry out
the next steps on this support.
Stick tape onto the top of the SG, overlapping the SG by approx. 10 -15 mm
over one side. The other three sides of the SG must remain free! See Fig. 2-
6, sketch. Stick the SG onto the separating foil with the overlapping section
of the tape.
Method c)
Insert the solder terminals between the basis foil of the measuring grid
carrier and connections, see Fig. 2-6, sketch c, and then shorten the
connection leads.
Method d)
Join the SG and solder terminal with tape; cover the entire metal surface
with tape, see Fig. 2-6, sketch d. Remove the prepared SG and separating
foil from the auxiliary support and keep ready for installation.
Note 2.4-10:
If hot curing adhesive is used, the adhesive tape must also be heat-resistant. Such tape is
supplied with the appropriate HBM adhesive sets.
2.4.5 Bonding process

Instructions for use, which must be complied with, are provided with every
adhesive set. The instructions contain precise and detailed information about
the handling and application of SG adhesive; this information is not repeated
here. The following information provides additional tips to facilitate installation
and avoid errors. Transferring the SG to the measurement object and aligning
it correctly on the measurement point is relatively simple.
Use tweezers to remove the SG prepared according to Section 2.4.4,
Page 26 from the protective foil (Caution! Only hold the adhesive tape, not
the SG itself!).
Align the SG on the measurement point prepared according to
Section 2.4.2, Page 22 so that the axis markings on the SG are aligned with
the position markings. Press on the adhesive tapes, see Fig. 2-7, so that a
hinge-like connection is formed between the SG and measurement object.
32 L1421-2.0 en
Adhesive tape SG
m
2m

Adhesive tape
1
SG
Solder
terminals
Fig. 2-7: Fixing the strain gage to the measurement object
You can also form a mask around the SG with adhesive tape at a distance of
3 to 5 mm. This is particularly recommended when using the superglue X60
because surplus glue will be squeezed out onto this tape when the SG is
pressed down, and the glue can then be removed easily after it has
hardened.
Refer to the instructions for use of the adhesive for further steps. Handling
hints are given below for cases where experience has shown that errors are
often made.
X60 superglue
The adhesive should have a pasty consistency, not too stiff so that the
adhesive layer does not become too thick and not too liquid as otherwise air
bubbles may be drawn under the SG. Air bubbles under the SG are a serious
installation defect. A trick can be used to prevent them (see Fig. 2-8).
Note 2.4-11:
The best tool for pressing the SG down during cold curing adhesive installation is the thumb
of the installation technician. It is better than any other tools if the advantage inherent in the
sense of touch is used correctly.
With X60, the surplus adhesive must first be carefully pressed outwards onto the mask of
tape by pressing and carefully rolling the fingertip. Do not push or pull to prevent the SG
from slipping. Then press down and squeeze out the rest more firmly until a very thin,
almost transparent adhesive layer is produced. Always using rolling movements, do not
push or pull!
L1421-2.0 en 33
The adhesive below the SG ensures that the separating foil clings firmly preventing air
bubbles from entering. There is then no need to keep pressing the SG down while the
adhesive hardens. If air bubbles do form, then the adhesive was too liquid.
The separating foil can be removed after several minutes (depending on the temperature).
Remove the mask with the surplus adhesive immediately as it is easier to do before the
adhesive is fully hardened. Also remove the auxiliary adhesive tape from the SG by carefully
and slowly peeling it off with tweezers.
SG
a)
Mask made of adhesive

b)
Separating foil
X60
c) d) surplus
X60
Fig. 2-8: Installing strain gages with X60 superglue

a) Fold up the SG, apply adhesive liberally with spatula
b) Fold down the SG and press down lightly
c) Paste adhesive onto the SG and cover with separating foil
d) Press out the surplus adhesive. See Note 2.4-11.
Z70 superglue
This adhesive hardens with seconds if applied very thinly, isolated from the air
with a separating Teflon foil, and pressed down with moderate pressure.
Application is quite simple and quick:
1. Lift up SG
2. Place 1 drop of adhesive on the component and immediately spread out
thinly and evenly with the Teflon strip provided in the set (do not press
down)
3. Fold down the SG, immediately apply the separating Teflon foil and press
down evenly for approx. 1 minute. See Note 2.4-12. If working upside down,
the drop of adhesive can be placed on the Teflon strip and spread onto the
installation point.
4. Carefully peel off the auxiliary adhesive tape with tweezers.
34 L1421-2.0 en
Note 2.4-12:
Any interruption in the curing process of Z70 adhesive is damaging. It is absolutely essential
that the SG is immediately and evenly pressed down across the entire area. Pressure
must remain uninterrupted until the adhesive is fully cured. A frequently observed error is
when the SG is only pressed down at points with a finger, i.e. the finger tip is wandering over
the SG. This makes it likely that the adhesive only partially cures when pressed so briefly
and no longer bonds correctly when pressed again. A pressure pad covered with soft rubber
is useful for larger SG where the thumb cannot provide complete pressure. The pad must be
adapted to the workpiece contours where necessary.
Another error is working too slowly as the adhesive will be completely or partly cured before
the SG is pressed down and will no longer bond. This must be taken into account in hot
weather in particular.
The chemical state of the surface to be bonded can also influence the hardening of the
adhesive: Materials with basic reaction speed up hardening, materials with acid reaction
slow down or even prevent hardening. The latter case is a rare exception; in most cases,
insufficient hardening is due to the adhesive layer being too thick. If an acid reaction is the
cause, curing can be forced by using the catalyzer BCY01. In this case, coat the acid side
thinly with the neutralizer and allow to dry; apply the adhesive to the SG and then press
down. Shock curing will then take place within several seconds. This results in residual
stresses in the adhesive layer which could affect the extensibility or stability of the bond over
a long period of time. The use of this catalyst should therefore be limited to special cases; it
is not recommended for routine applications.
X280 adhesive
The two components of the adhesive are packed in a bag and kept separate
from each other with a plastic clip. This ensures the optimal mixing ratio of the
components, weighing before use is not required.
After the plastic clip has been removed, both components can be mixed
together. The adhesive should not be warmed too much by the warmth of the
hands as this will reduce the pot life. The adhesive can be mixed by pulling the
bag, once the plastic clip is removed, several times over the edge of a table.
The pot life is approx. 30 minutes at room temperature. The adhesive is
thoroughly mixed when it has a uniform color without any streaks, etc. Please
note however that the layer thickness of the adhesive should not exceed 12
mm in depth if being mixed in a pot as otherwise an exothermic reaction will
occur, i.e. the adhesive will heat up and cure.
The adhesive can also be mixed with the assistance of a very precise scale to
obtain smaller amounts than the prepared quantity. 100 parts of component A
must be mixed with 52 parts of component B in a container for this purpose.
The adhesive must be liberally applied to the SG and workpiece. Use one of
the provided wooden sticks or a spatula. The SG can then be pressed on
lightly.
Cover the installation point with a piece of the provided Teflon tape and then
place a piece of the neoprene rubber that has also been provided on top of the
L1421-2.0 en 35
tape. The Teflon tape should be slightly larger than the rubber to prevent the
rubber from sticking to the workpiece.
Place a metal plate on the installation point and apply a pressure of at least
0.05 N/mm2. Weights, spring pressure, magnets or similar can be used to
apply this pressure.
The X280 curing time is eight hours at room temperature. Heating can reduce
the curing time, see Table 2-2 on Page 12f.
The adhesive does not cure at temperatures below 10C, curing time is 36
hours at 10C. If unsure, apply a small spot of the adhesive next to the
installation point so that you can check the curing process.
EP150, EP250 and EP310S adhesives

These adhesives require high temperatures and pressure must be applied
during curing. The contact pressure should be 0.1 to 0.5 N/mm2 for stress
analysis measurements, higher contact pressures can be used for precision
measurements and transducer construction, or when the measurement point is
subject to high hydrostatic pressure.
Spring-loaded clamps are suitable for generating the contact pressure as they
can be adapted to the object and are easy to produce with simple equipment:
Fig. 2-9a shows various examples.
To protect the SG against pointlike loading, insert a cushion between the thrust
piece and SG. The cheapest and best material has been proven to be a
cushion, approx. 2 mm thick, made of soft blotting paper. The advantage
compared to rubber is that the cushion is flexible in the pressure direction and
compensates differences in thickness without protruding sideways and
distorting the SG.
Fig. 2-9a: Examples of spring-loaded clamps for SG installation with hot curing
adhesives
36 L1421-2.0 en
Fig. 2-9b: Examples of spring-loaded clamps for SG installation with hot curing
adhesives
The springs are necessary both to generate a defined contact pressure and to
maintain this pressure when the cushioning material covering the SG gives
way under the influence of the heat.
Note 2.4-13:
Example for determining the contact pressure.
The spring has a spring constant of c = 100 N/mm.
The spring constant c, also known as spring stiffness or spring rate, is the force F required
to compress the spring with a spring displacement s = 1 mm.
F
c = ---
s
It can be determined by applying weights to light springs, or in a testing machine for heavier
springs. A weight with mass of 1 kg generates a weight force of approx. 10 N (Newton). In
this example, the spring used is compressed by 1 mm by a weight of 10 kg exerting a weight
force of 100 N.
The area to be compressed is 3 cm x 5 cm = 15 cm2.
This is the total area of the cushion being compressed, not just the SG itself!
The required contact pressure is 5 bar = 50 N/cm2.
The clamping screw has a pitch of s = 1.5 mm/revolution.
The required force F is then
2 2 N
F = 15cm 5bar = 15cm 50 ---------- = 750N
2
cm
With a screw pitch s = 1.5 mm and a spring constant c = 100 N/mm, the force increase F per
screw revolution is:
s mm N
F = ----------- c = 1.5 ----------
- 100 ---------- = 150N rev .
rev . rev . mm
The required force F = 750 N is achieved with:

F 750N
------- = ---------------------------------- = 5 spindle revolutions
F 150N rev .
L1421-2.0 en 37
2.4.6 Precautionary measures

The following hints are not intended to cause unnecessary fear; there is no
justifiable reason for this based on numerous years of experience. However,
they are intended to warn against excessive carelessness and the
consequences.
A filter mask must be used when roughening beryllium and its alloys.
Beryllium, in particular beryllium dust, is carcinogenic (can cause cancer).
When bonding SG, ensure that everything is extremely clean. This applies not
only to bonding points and SGs, it also applies to the same extent for hands.
Sensitive persons can have an allergic reaction when handling solvents and
chemically cured adhesives, which generally include most SG adhesives.
Avoid direct contact with skin where possible.
Always wash hands thoroughly with tepid water and neutral soap when
bonding is complete or at intervals when installations take longer.
A further hint is required in the case of Z70. Z70, a cyanoacrylate adhesive, is
supplied in small plastic phials with sealed plastic nozzles. During transport the
nozzle tip usually fills with adhesive. This adhesive may squirt out when the tip
of the nozzle is cut off. When opening the phial, hold it so that the adhesive
cannot squirt onto the face or clothes of anyone in the vicinity. If a drop of Z70
gets into the eye, it will cure immediately due to the tear liquid. This
polymerization reaction will produce heat that will slightly irritate the cornea of
the eye. A brief, but sharp pain will be felt during the first few minutes. Rinse
the eye immediately with tepid water! An optician should be consulted as a
precaution. Previous experience has shown that the cornea regenerates within
a few days, there is no permanent sight damage. Z70 cannot be removed from
clothing.
The use of skin creams must be mentioned here. Many creams contain
silicone grease. This spreads over any items (tools) that it comes into contact
with and is then transported further, even onto measurement points. It is hardly
visible and very difficult to remove. Even molecular layers can cause reduced
adhesive adhesion. The use of such creams is therefore not recommended.
Ensure good ventilation is available when installing SG as the vapors of the
solvents and adhesive should not be inhaled. Comply with the safety data
sheets and applicable rules for the prevention of accidents.
38 L1421-2.0 en
Connecting the cables
3 Connecting the cables

The best and most common method of electrical connection between the SG
and the measuring lead (cable) is soldering. The following chapters look at this
method in detail. Excellent connections can also be obtained with crimping
(squeezed connections). Clamp connections can cause zero point shifts due to
contact resistance fluctuations. Plug connections are even more critical; only
top quality plugs with gold-plated contact elements have been proven to be
sufficient, and only then when perfect function is not hindered by
contamination. In principle, it can be said that normal high current connections
are insufficient because of the low measurement voltages and currents
concerned.
3.1 Soldering tools, soldering materials, connection materials
3.1.1 Soldering irons

Temperature-controlled low voltage soldering irons are recommended. Use
models with sensitive, continuous electronic control and high heating power
(approx. 50 W or approx. 80 W for lead-free solders), as the heat lost at the
soldering tip is immediately replaced during soldering. The temperature control
range of commercial soldering stations lies between 120 and 400C, sufficient
for all soft solders used in SG technology.
3.1.2 Soldering tips

The selection of the right soldering tip for the application case is decisive for
the production of reliable solder joints. The designation soldering tip should
not be taken too literally as a pencil-shaped soldering tip is unsuitable (Fig. 3-
1a) because the heat flow from the tip to the solder joint is insufficient and
because the solder is pulled up away from the tip and is therefore missing at
the solder joint. A small area, suitable in size for the solder joint, is
recommended, Fig. 3-1 b, c and d. The accessibility of the solder joint
determines the use of a straight or curved solder tip.
Coated solder tips only take up solder at specific points so that the solder is
concentrated at the actual soldering joint. This coating also protects the tip
against oxidation.
L1421-2.0 en 39
Installation of strain gages, Connecting the cables
a) b) c) d)
a) unsuitable, too sharp

b) single-sided surface
c) double-sided surface
d) curved form
} Size of surface area matched
to soldering object
Fig. 3-1: Various soldering tip shapes
3.1.3 Solders (soft solders)

Numerous types of soft solder are available. They optimally meet various
requirements dependent on the alloy components and compositions. Good
wetting and flow properties, as well as melt temperatures suitable to
application conditions, are essential for SG installations.
The maximum operating temperature, taking into account the mechanical
strength of the solder connection, should lie at least 30 K below the solder
melting point.
Note 3.1-1:
It is occasionally noted that tin solders undergo a phase transformation at low temperatures,
decomposing from normal white tin (-phase) into grey, powdery tin (-phase). This
phenomenon, called tin pest, only occurs in high purity tin and then only under unfavorable
conditions. Normal tin solders with alloy components or residual contamination with lead,
antimony, bismuth, copper, arsenic, iron, etc. do not evidence deterioration, even after
storage for 10 years at -40C. This is reported in detail in [16].
Small amounts of copper prevent annoying corrosion of soldering tips (copper

protective solder). Solders with high fatigue resistance are an advantage for
dynamic continuous loading.
Some common soft solders are listed in Table 3-1. Further information can be
found in DIN EN 61 190-1/1-3 and the solder manufacturer lists.
40 L1421-2.0 en
Solder Alloy component Recommended Notes

designation as in percent by Melting
solder tip
per DIN EN 29453 weight point
temperature
in C
Sn Ag Pb in C
Sn 96.5 Ag 3.5 with Lead-

flux C3 (2.5% or 98.5 3.5 221 300 free
3.4%) solder
SN60, Pb38, Cu2

Leaded
with resin core 60 38 183 190 250
solder
1.1.3.
Table 3-1: Soft solders.
Note 3.1-2:
Welded connections should be implemented in the high temperature range.
Hard solders should only be used with caution due to the aggressive fluxes!
3.1.4 Fluxes
Fluxes are used to free the solder joint from oxides and to prevent new
oxidation during soldering. They therefore ensure a perfect connection of the
solder with the components to be soldered. The selection of the flux depends
on the type of soldering (e.g. soft soldering), the type of materials being
soldered (e.g. heavy metals) and the type of the soldering object (e.g. electrical
circuitry).
Highly corrosive or halogen-containing fluxes are useful as they can be used
for soldering poorly cleaned solder joints, however, their disadvantage is that
residues cause corrosion and significantly reduce the electrical insulation
properties of the insulating sections. They are therefore not suitable for
soldering electric circuits. Never use soldering grease!
Non-corrosive fluxes are manufactured on the basis of natural or modified
natural resins. The most well-known is colophony. It is used as the core in
solder wires or as a liquid, dissolved in spirit. This soft flux requires that the
solder joint is thoroughly cleaned and made bright directly before soldering.
Highly suitable for SG installation.
Note 3.1-3:
The flux cores in numerous solder wires can be either corrosive or non-corrosive in nature.
Ensure you know the type of flux used in the core before using the solder wire. The
standards sheet DIN EN 29454-1 contains information about the various flux materials:
Soft soldering fluxes.
Fluxes with type designation 1.1.1 and 1.1.3 do not leave any corrosive residues.
L1421-2.0 en 41
3.1.5 Solder terminals

The task of solder terminals and their applications have already been
mentioned in Section 2.4.4, Page 26. Solder terminals are produced in various
designs and sizes, including ones that are fixed with spot welding. (Fig. 3-2
shows some typical forms of solder terminals; the actual range can be found in
the latest, applicable brochures.) Usual designs consist of polyimide foil to
which the nickel-plated copper surface is fixed with a heat-resistant adhesive.
Thermal stability is 180C for continuous applications and 260C for short-term
operation.
Select the size of the solder terminals according to the size of the SG and the
thickness of the cable wired to be soldered. Smaller solder terminals are better
for high dynamic loading, alternatively, you can install the solder terminals
transverse to the strain direction. You can also cut the solder terminals through
the middle and then align the cut edge to the SG so that short circuiting is
prevented. Bonding is implemented directly with the SG (as described in
Section 2.4.4, Page 26) and using the same adhesive used for the SG.
LS4
LS5
LS2
LS7
Fig. 3-2: Some solder terminal forms (examples)
3.1.6 Lead material

The success of a measurement also depends on selecting the correct, i.e.
suitable connection leads and measurement cables. They should not only
transmit the measurement signals between the measurement chain elements
(transducer - amplifier), but also limit noise signals to an acceptable minimum
and withstand the operating and ambient stresses.
Short connections, e.g. internal wiring inside a transducer, can be implemented
with jumper wires or stranded wires with relative thin cross-sections. Wire
insulation must be high and suitable for the expected temperatures. Good
solderability of the wires is also necessary. So-called very flexible stranded
wire can be advantageous if the measurement object is subject to extreme
dynamic stress. The core consists of numerous very thin strands surrounded
42 L1421-2.0 en
by flexible insulation. Ensure that wiring within the bridge is symmetrical, i. e.,
that identical wires with the same length are used.
Additional requirements must be met for longer connections and cables. The
correct selection of the cable cross-section is important to keep the ohmic
resistance within acceptable limits. Low-capacitance cable is recommended for
carrier frequency operation, and for DC operation if higher frequency signals
are to be transmitted. A copper mesh sheathing the cores helps to make core
capacitances symmetrical to each other and also protects against disturbing
stray effects from electric fields (electric shielding). Lay the cables in steel
tubes, or similar, for protection against magnetic fields.
Note 3.1-4:
Electrostatic influences occur if capacitive coupling of a voltage source electrical field acts
on the measurement circuit. The best protection is to sheath the cable or lead with a closed
shield. A copper mesh is usually sufficient protection. Special measurement cables contain
such a shield. It is important to earth the shield as a shield on a free potential has no effect.
Electromagnetic influences occur when measuring circuit cables are laid in the vicinity of
conductors carrying a current or electrical equipment (e.g. generators, welding equipment,
transformers, motors, etc.). Disturbing electrical voltages are induced in the measuring
leads based on the transformer principle. An effective protection is to twist the cores (the
cores are twisted in prefabricated measurement cables). Where this is insufficient,
additional shielding with steel armored tube or metallic water tubes can help.
The carrier frequency method is less sensitive to disturbing interferences than the DC
method because all interference frequencies outside the transmission band are eliminated
due to the process.
A high insulation resistance of the core insulation is important as it should not

be significantly changed by temperature, moisture, etc. (see Table 3-2a).
The symmetry of neighboring bridge branches must be maintained when
connecting half and full bridge circuits, both with regards to resistance and the
cable capacity between the cores. The cable sheath should protect against
external influences and be resistant to moisture, water, oil, chemicals,
temperatures (high and low) and mechanical stresses. Commercial measuring
cables meet numerous requirements but a cable that can do everything does
not yet exist.
Tables 3-2a and 3-2b list the main insulating materials and some information
about their properties.
Note 3.1-5:
You can find the currently valid equipment price lists in the cable product range offered by
HBM, while flexible and very flexible leads can be found in the SG price list.
L1421-2.0 en 43
Material name
Polytetrafluoroethylene
Polyvinylchloride
Polyurethane
Polyethylene
(low density)
(Teflon)
PTFE
PUR
PVC
PE
Criterion
Thermal stability in C
Continuous -10 70 -50 80 -90 350 -10 80
short-term 80 100 120
Specific contact
resistance at 20C in 1011 1015 1016 >1018 1011 1014
cm
Abrasion resistance Average Average Moderate Very good
Flammability1 se fr nfr se
Resistance against
Dilute acids Good Very good Very good2 Poor
Dilute alkalis Good Very good Very good Poor
Resistance against
Oil Moderate Moderate Very good Good
Usually not Partially
Solvents Very good Not resistant
resistant resistant
Water absorption in % 12 0 0 1.4
Table 3-2a: The main cable (lead) insulation materials and some technical data.
1)
se = self-extinguishing; fr = flame-retardant; hfr= highly flame-retardant; nfr = not flame-retardant
2)
Not resistant against molten alkalis and fluorine
44 L1421-2.0 en
Material name
Silicone rubber
Polyamide
Polyimide
SIR
PA
Criterion
PI
Thermal stability in C
Continuous -60 200 -40 90 -240 280
short-term 250 125 400
Specific contact
resistance at 20C in 1014 1015 1012 1013 1014 1016
cm
Abrasion resistance Moderate Very good Very good
Flammability1 se fr se
Resistance against
Dilute acids Good2 Not resistant Very good
Dilute alkalis Good Good Poor
Resistance against
Oil Partially resistant Good Very good
Solvents Partially resistant Partially resistant Resistant
Water absorption in % 0.1 0.4 2 10 13
Table 3-2b: The main cable (lead) insulation materials and some technical data.
1)
se = self-extinguishing; fr = flame-retardant; hfr= highly flame-retardant; nfr = not flame-retardant
2)
Not resistant in steam over 130C
e)
d)
a) Sheath
b) Shield
c) c) Protective tubing
d) Core insulation
b) e) Wire
a)
Fig. 3-3: Structure of a 4-wire HBM measuring cable
L1421-2.0 en 45
Note 3.1-6:
HBM cables are characterized by a high capacitive symmetry; there are no systematic
deviations even with longer cables. Resistive symmetry is essentially insignificant (different
resistances of the different wires). A symmetry test can indicate wiring faults during error
recognition if there are balancing problems, e.g. in wrong plug connections, soldering
connections, or in rare cases defective cables. The concepts below apply to work with CF
measuring instruments.
Testing with capacitance measurement (measurement frequency 1,000 10,000 Hz, where
possible):
The capacitances
1) 1 + shield to 2 (C1, 2) and 1 + shield to 3 (C1, 3) must be identical in size. Permissible
differences, independent of cable length, are 100 ... 200 pF. (Condition also required for
3-wire cable.)
2) 4 to 2 (C4, 2) and 4 to 3 (C4, 3) must be identical in size. Permissible differences,
independent of cable length, are 100 ... 200 pF.
Different capacitance values between the measurements as per 1 and 2 are not significant;
the difference is significant due to the shielding connected with 1 (approx. 30%). If no wiring
errors are present, any asymmetry exceeding one of the above values can be compensated
by additional capacitors. These capacitors can be connected at either end of the cable.
3.2 Practical tips
3.2.1 Soldering tips

Remove oxide from solder terminal tabs before bonding with a glass fibre
eraser, then clean with RMS1 and cotton buds.
Before soldering the cable, tin the solder tabs: Twist ends of wires together
(between paper not bare fingers) and pre-tin. Touch the soldering tip to the
soldering object, add enough solder with flux core so that the flux thoroughly
wets the solder. If solid solder wire is used, wet the soldering point
beforehand with a flux pen (order no. 1-FS01). Use flux and solder
sparingly!
Soldering the cable wires: Lay the tinned wire end on the tinned solder
terminal or insert into a solder tag, fix in place if necessary with adhesive
tape and solder without adding further solder.
46 L1421-2.0 en
Adhesive tape or X60
Three-wire connection
Fig. 3-1: Soldering cable wires onto SG with connection leads
A solder terminal should also be set (as can be seen in Fig. 3-1) for SG with
open solder tabs (see Fig. 2-4 on Page 29, sketch b). The connection
between the solder tab and solder terminal should be flexible. A single
strand of the cable wire should be connected from the solder terminal to the
solder tab (see Fig. 3-2). Avoid short circuits due to protruding blank wires! If
necessary, bond insulating foil underneath.
Connect strand with relief loop to SG
Fig. 3-2: Connecting cable wires onto SG with open solder tabs
Keep soldering iron steady during soldering until the solder flows, which
should occur within approx. 2 seconds (otherwise the solder joint will
overheat).
L1421-2.0 en 47
Do not move the iron during soldering (no brushing, this can result in cold
solder joints).
Do not move the components while the solder is hardening (defective solder
joints may result).
Do not try to accelerate hardening of the solder by blowing on it (this could
produce hairline cracks in the solder, leading to fatigue failure).
The contours of the soldered parts must still be recognizable; they must not
be submerged in solder.
Like this Not like this!
Fig. 3-3: Soldered spot in cross-section
The edges of the solder must show that the solder has wetted the parts
properly.
Like this Not like this!
Fig. 3-4: Solder edges
Be careful that short circuits are not produced through contact of bright wire
ends with the measurement object.
Always remove all flux residues. Wash away colophony completely with
pure spirit, isopropyl alcohol or RMS1.
Check the solder joints with a magnifying glass.
Note 3.2-1:
Flux residues, including colophony residues, can cause changes in insulation resistance,
even then when small amounts of moisture penetrate through diffusion or migrate out
through drying. Colophony, like other resins, also drastically changes its insulation
48 L1421-2.0 en
resistance dependent on the temperature. The insulation resistance of a measurement point

can be easily measured against the object, but not between the two SG connections. A
change in the insulation resistance between these connections does however generate a
zero point drift, which is then incorrectly attributed to the SG. Colophony can even act
corrosively under unfavorable conditions. It is therefore extremely important to remove all
flux residues with great care!
3.2.2 Hints for cable connection

When producing transducers, only use full bridge circuits. Keep the internal
bridge connection lines as short as possible. Ensure that the connection
lines in all bridge branches are identical in length (at least the lines in
neighboring bridge arms should be the same length).
Additional strain relief on the measurement cable is recommended, e.g. by
bonding the cable end in place with X60 superglue.
X60
Fig. 3-5: Cable connection with X60
The remaining cable can be fixed with cable clips in the usual manner.
Adhesive (or screw-on) cable clips are particularly easy to use.
Fig. 3-6: Cable fixing with cable clips
After connecting the cables, remove all flux residues and check the
insulation resistance and cable resistance (contact resistance), see also
Note 3.2-1.
If the measuring point is subject to extreme stresses, e.g. pressurized water
or submerged storage for longer periods of time, remove approx. 5 to 10 cm
L1421-2.0 en 49
of the cable sheath first so that the cable wires can be individually
embedded in the covering medium. This results in long creepage distances
at the most endangered spot, the exit of the cable from the protective
medium. (For more information about measuring point protection, see
Section 5, Page 53.)
X60 X60 X60
Fig. 3-7: Various options for cable fixing with X60
50 L1421-2.0 en
Intermediate tests
4 Intermediate tests
4.1 Visual inspection

Check the SG and cable connections using a good magnifying glass with
approx. 6-fold magnification for:
Air bubbles under the SG
Poorly bonded edges
Unreliable solder connections
Flux residues
4.2 SG contact resistance

SG in delivery condition are adjusted to the nominal resistance with a strict
tolerance. The control measurement should indicate whether the SG
resistance has been significantly changed by incorrect installation (resistance
changes up to +0.25% can be tolerated).
4.3 Connection cable resistance

Connection cable resistance can (in unregulated measuring systems with
constant voltage supply) apparently reduce SG sensitivity; it should therefore
be measured and the value recorded in the test record. The known systematic
deviation caused by the cable resistance must be corrected when evaluating
the measurement.
Note 4.3-1:
Example: With a measuring point distance from the amplifier of 20 m and a standard cable
with cross-section of 0.17mm2, resistance is 4.23 Ohm (supply and return lines). This
results in a sensitivity loss of:
3.4% with an SG resistance of 120 Ohm
4.4 SG insulation resistance

Measure the SG insulation resistance to ground. Only use instruments with a
test voltage below 50 Volt.
An SG installed under laboratory conditions should have, at room temperature,
an insulation resistance of minimum 20,000 M. At least 2,000 M should be
L1421-2.0 en 51
Installation of strain gages, Intermediate tests
reached in outdoor installations (also see [18]). A lower insulation resistance

indicates either insufficient cleaning of the solder joints (see Section 3.2.1,
Soldering tips, Page 46), or subsequent contamination, e.g. due to sweaty
fingers or absorbed moisture. The latter can occur in humid atmospheres. In
this case, the insulation must be heated until a sufficiently high and stable
insulation resistance is reached (80 ... 100C for cold curing adhesives, 120 ...
180C for hot curing adhesives).
4.5 Connection cable insulation resistance

The insulation resistance between the wires of the connection cable depends
on the quality of the insulation materials (see Note 3.1-6) and the length of the
cable. It should have a similar magnitude to the insulation resistance of the SG.
It can however no longer be measured after installation, as only the SG
resistance can then be measured.
52 L1421-2.0 en
Measuring point protection
5 Measuring point protection

SG measuring points must be protected against mechanical or chemical
influences. Even under ideal conditions, e.g. in the laboratory, the measuring
point properties will be affected over time if suitable countermeasures are not
implemented. These countermeasures are as diverse as the influences on the
measuring point. Light protection against contact (hand perspiration) may be
sufficient in laboratories with dry enough air, while protection in rough rolling
mill operations must be proof against vapor, water, oil, heat and mechanical
influences. In the first case, a simple varnish seal is appropriate, in the second
case a barrier must be built up in several layers of various protective covers.
It must be made clear here that absolute protection over unlimited time can
only be ensured by hermetically sealed metallic encapsulation. This degree of
protection is therefore used in commercial transducers, where the function
permits. All other covering agents, even the best, only provide temporary
protection. The duration of protection depends both on the type and thickness
of the covering agent used and from the type of attacking medium. The
protection period ranges from several hours to several years, depending on
the circumstances. Which protection period is required depends not only on
the required service life of the measuring point, but also on the duration of the
individual measurements, the possibility of intermediate zero point checks and
finally on the requirements regarding measurement uncertainty.
Slight impairments to the measuring point, e.g. caused by migration of
moisture due to diffusion, will generally affect the zero point. If these can be
controlled, e.g. by relieving the measurement object, and if they are within
acceptable limits (e.g. 100 200 m/m), then measurements can still be
implemented with a measurement uncertainty acceptable for stress analysis
measurements. Insulation resistance is another indicator for the suitability of a
measuring point. A reduction in insulation resistance from 1,000 M to 1 M
causes a zero point shift of -60 m/m in a 120 SG, -175 m/m in a 350 SG
and -350 m/m in a 700 SG! This means that the lower limit of the insulation
resistance also depends on the measuring grid resistance of the SG used.
The measuring point can be heavily affected by the diffusion of caustic or
conductive substances and by corrosion. Corrosion is greatly promoted by the
use of DC current to supply the SG! Experience shows that galvanic elements
are formed and their voltages are superimposed on the measurement signal,
causing large measurement errors (with DC feed!). Finally, it must not be
forgotten that the requirements for measuring point protection apply equally to
the connection lines, the cables (see also Section 3.1.6, Lead material,
Page 42).
The protective measures must be effective, but they must not change the
properties of the measurement object. Thin objects must not be made so rigid
L1421-2.0 en 53
Installation of strain gages, Measuring point protection
that they cannot be deformed under load; plastics must not be attacked by
materials containing solvents.
It is not possible to provide definitive instructions for every case. The following
hints should however be sufficient to determine the correct measures for the
majority of problems that may occur.
5.1 Hints for the use and structure of protective covers for SG
measuring points
When selecting the protection materials, consider the following factors:
The ambient conditions (see also [17]: Chemical resistance of HBM
covering agents).
The duration of the measurement or the required service life of the
measuring point.
The required measurement uncertainty.
The measuring object must not be stiffened in an impermissible manner.
Material that comes in contact with the measuring point, including the
connection cable, must have a very high insulation resistance and must not
trigger any chemical reactions or corrosion.
The following applies for the application:

The measuring point must be in perfect condition before being covered.
Adhesives and any other covering agents must be fully cured/hardened.
Trapped moisture, perspiration, flux residues from soldering, etc. are like
time fuses, leading sooner or later to measurement errors or even failure of
the measuring point. Remember that effective covering agents not only
keep out external moisture, they also keep internal moisture in!
The measuring point must be covered directly after installation.
If SG installation is unavoidable under humid conditions (deadlines, poor
weather, humid rooms), the measurement object should be baked dry in an
oven (temperature approx. 110 ... 120C) where possible or, if this is not
possible, the measuring point should be dried using a hot air gun (hair dryer,
etc.).
The covering agent must be fully bonded with the area surrounding the
measuring point. Defects and capillaries (scratches, grooves) are access
points through which aggressive media can migrate. The covering agent
bond with the surrounding area must remain unchanged during the entire
54 L1421-2.0 en
service life of the measuring point. The surrounding area must therefore be
cleaned as thoroughly as the adhesive point and should reach approx. 1 to
2 cm over the outer adhesive edges. Hand perspiration (fingerprints) can
cause rust to creep under the covering agent rendering it ineffective, despite
the initial perfect condition.
Cable entries must be very carefully sealed. The covering agent must
surround the wire ends on all sides, including from underneath, to ensure
that no channels or capillaries form through which moisture could penetrate
inside the cover. Embed cable wires individually in the covering agent, in the
case of multi-core cables, and cover a part of the cable sheath as well with
the covering agent (Fig. 5-1 on Page 55). In critical ambient conditions,
roughen the cable insulation first and degrease it with chemically pure
solvent.
Comply with the instructions for use when using commercial covering
agents for SG measuring points.
Connection cable
20
AK22
Adhesive edge
AK22 base for all-round embedding of the

5 10
cable wires
Fig. 5-1: Measuring point with protective cover
5.2 Common covering agents

Polyurethane varnish PU140
Air-drying varnish. Suitable for light protection against hand contact
(perspiration), dust, normal air humidity and the usual humidity fluctuations
in moderate climate zones. Also suitable as insulating layer under other
L1421-2.0 en 55
covering agents, oil resistant, good abrasion resistance. Caution: Do not

use in combination with NG150. Complete curing takes 96 hours at room
temperature.
Nitrile rubber varnish NG150
Air-drying varnish. Resistant to oil and gasoline, preferred application for
contact with liquefied gases (not oxygen!). Caution: Do not use in
combination with PU140.
Silicone varnish SL450
Hot curing varnish. Used preferentially to protect high temperature
installations against moisture absorption and contamination.
AK22, permanently plastic putty
Advantages:
Easy application by kneading it on.
Excellent adhesion due to strong intrinsic adhesive force.
Very good protection against moisture and water; can also be used under
water; protection in water at approx. 20C up to approx. 1 year, water at
75C up to approx. 3 weeks; tested in pressurized water up to 400 bar for
several days, limit values still unknown.
Very good weather resistance. Long term protection can be significantly
enhanced by kneading on some aluminum (household) foil as a diffusion
barrier.
Mechanical protection against impacts and falling objects can be easily
implemented by pressing some sheet metal onto the self-adhesive putty.
Temperature resistance in air -50 +170C.
Unlimited shelf life.
Disadvantages:
Not resistant to oils and solvents.
Cannot be used externally on objects with high centrifugal forces.
ABM75, permanently plastic putty with aluminum foil
Application areas and properties similar to AK22, but with the following
exceptions:
The plate-shaped material is already laminated with a 50 m thick aluminum
foil as a diffusion barrier.
The temperature range is -200 +75C, whereby the upper limit is set by
the start of flowing.
56 L1421-2.0 en
SG200, white, solvent-free silicone rubber

Suitable for protection against moisture and weather, against water at room
temperature, limited resistance to oil.
The rubber-like topcoat offers very good mechanical protection.
Temperature resistance: -55 +200C, the material remains elastic within
this range.
SG250, transparent, solvent-free silicone rubber
Suitable for protection against moisture and weather, against water at room
temperature, limited resistance to oil.
The rubber-like topcoat offers very good mechanical protection.
Temperature resistance: -70 +250C, the material remains elastic within
this range.
Vaseline (petroleum jelly), unbleached
Advantages:
Inexpensive, easy to apply, very good protection against moisture and
water, can also be used under water.
Disadvantages:
Cannot be used in flowing water, rain or spray water; can be easily wiped
away accidentally from open surfaces; melts at approx. 50C.
Silicone grease
Despite its good properties, the use of silicone grease is not recommended
as it easily transfers to tools and from there to other objects. Because of its
great adhesion, silicone grease is difficult to remove completely. As it is an
excellent release agent, the slightest traces prevent proper bonding of SG.
Micro-crystalline waxes
Good protection against moisture and general atmospheric influences.
Must be applied in melted condition on the warmed object to obtain a perfect
bond.
Low mechanical protection.
Temperature range approx. -70 +100C.
Poly-sulfide rubber
Two-component material, produces a rubbery mass that is extremely
solvent and ageing resistant. It is also characterized by good weather
resistance.
Temperature range -50 +120C.
L1421-2.0 en 57
Epoxy resin (trade names: Araldite, UHU-plus, etc.)

Resins that do not set too hard are generally suitable for SG covers. The
material available under the trade name UHU-plus, a two-component resin,
is primarily suitable as protection against oil, engine fuels, dilute acids, dilute
alkalis, numerous solvents and also provides good mechanical protection.
Temperature limits are dependent on the curing conditions (cold or hot
curing).
Aluminum adhesive strips
Adhesive strips laminated with aluminum foil form a good water vapor
barrier (diffusion barrier). As an additional cover for the measuring point,
they are suitable for improving the properties of the underlying covering
agents, particularly long-term stability. Aluminum foils are also very suitable
as additional protective covers for measurement cables which are, in
numerous cases, the weakest link in the measuring point.
Liquid measuring point protection agents
Some measuring point protection problems can be resolved by using
insulating liquids. One example is the internal installation in a small vessel
to be subjected to a pressure test. If a pressure medium other than the
usual pressure liquid water is used, numerous problems are resolved in a
simple manner. The requirement is that the selected pressure medium
offers good insulation properties and is free of additives that could attack the
SG. Options include:
Water-free and acid-free oil
Paraffin oil
Pure petroleum
This type of measuring point protection using liquid agents has already been
successfully used for the protection of permanently installed measuring
points where a surrounding capsule is filled with the protection agent.
Another excellent agent can be mentioned in this regard:
Poly-isobutyls, where the low molecular versions can be as liquid as oil or
as viscous as honey (trade names: Oppanol B 3, B 10 and B 15.)
Combined agents
A single covering agent is often not enough for sufficient measuring point
protection. Examples for combinations of several agents are given by the
AK22 and ABM75 (plastic mass plus aluminum foil). In order to add
58 L1421-2.0 en
additional mechanical protection to the metal foil, apply an extra layer of e.g.
silicone rubber SG250.
When producing multi-layer covers, ensure that each layer is fully hardened
before applying the next layer. In addition, each layer must overlap the
underlying layer by several millimeters on all sides.
Frequently, there are several different media acting on a measuring point,
e.g. oil and water. In such cases, for example, the oil-soluble ABM75 should
be applied directly to the SG, covered with the aluminum foil as a diffusion
barrier followed by a oil-resistant epoxy resin as the final layer.
Multi-layer protection is absolutely essential for indefinable media such as
e.g. seawater. The top layers that do not come into contact with the SG can
be made of other materials than those mentioned here, e.g. asphalt. These
materials must however not dissolve or chemically change the underlying
layers. Apart from that, their electrical insulation resistance is not relevant.
The problem of protecting measuring points is so multi-faceted that only a

general overview can be given. In critical cases, prior investigations under
application conditions is highly recommended.
L1421-2.0 en 59
Installation of strain gages, Bibliography
6 Bibliography
[1] VDI/VDE-Richtlinie 2635, Blatt 1: Dehnungsmessstreifen mit
metallischem Messgitter; Kenngren und Prfbedingungen. Beuth
Verlag GmbH, Berlin.
[2] Michel, M.: Adhsion und Klebetechnik. Carl Hanser Verlag, Mnchen
(1969).
[3] Mittrop, F.: Das Kleben als Befestigungsverfahren fr

Dehnungsmestreifen in Haus der Technik e.V. Essen
Vortragsverffentlichungen Heft 31 (1965), S. 15-27.
[4] DIN 53281, Teil 1: Prfung von Metallklebstoffen und Metallklebungen

Proben Klebeflchenvorbehandlung Sept. 1979. Beuth Verlag GmbH,
Berlin.
[5] Kleinert, H. und W. Krimmling: Das Alterungsverhalten von

Metallklebeverbindungen in Abhngigkeit von der
Oberflchenvorbehandlung der Fgeteile. Plaste und Kautschuk 12
(1965), H. 8, S. 472-475.
[6] N.N.: Nullpunktstabilitt von DMS-Mestellen auf Steingut.

Metechnische Briefe 3. Jg. (1967), H 3, S. 52. Publisher: Hottinger
Baldwin Messtechnik GmbH, Darmstadt.
[7] VDI-Richtlinie 3821 (Sept. 1978): Kunststoffkleben, Beuth Verlag GmbH,

Berlin.
[8] Merkblatt DVS 2204: Kleben von thermoplastischen Kunststoffen, Teil 2:

Polyolefine (Februar 1977). Deutscher Verlag fr Schweitechnik (DVS)
GmbH, Dsseldorf.
[9] Oberbach, K., und G. Heese: Dehnungsmestreifen-Hilfsmittel zum

Prfen von Kunststoff-Formteilen. Kunststoffe 64 (1974) H. 9, S. 488-
493.
[10] Kern, W. F.: Meelemente fr die Anwendung auf Gummiprodukten. VDI-

Bildungswerk, Manuskript BW 2556 (1973).
[11] Diehl, K., U. Hanser und W. Hort: Erfassung mechanischer

Beanspruchung von Skeletteilen bei der Osteosynthese mittels
60 L1421-2.0 en
Bibliography
Dehnungsmestreifen. Medizinisch-orthopdische Technik 95 (1975)

H. 3, S. 72-74. A. W. Geutner-Verlag, Stuttgart.
[12] Korber, K. H.: Elektrisches Messen mechanischer Gren in der

zahnmedizinischen Grundlagenforschung. Metechnische Briefe 6. Jg.
(1970) H. 2, S. 38-43. Publisher: Hottinger Baldwin Messtechnik GmbH,
Darmstadt.
[13] Kramer, J.: Messung der Zugkrfte bei Anwendung der

Wirbelsulenstreckbandage. Metechnische Briefe 6. Jg. (1970) H. 2,
S. 44-45. Publisher: Hottinger Baldwin Messtechnik GmbH, Darmstadt.
[14] Windecker, D.: Untersuchungen der Belastbarkeit und der Verformung

von zahnrztlichen Prothesen mit Hilfe von Dehnungsmestreifen.
Metechnische Briefe 7. Jg. (1971) H. 2, S. 34-40. Publisher: Hottinger
Baldwin Messtechnik GmbH, Darmstadt.
[15] Reuther, J.F.: Druckplattenosteosynthese und freie

Knochentransplantation zur Unterkieferrekonstruktion Experimentelle
und klinische Untersuchungen. Med. habil.-Schrift, Johannes Gutenberg-
Universitt, Mainz (1977).
[16] Macintosh, R.M.: Zinn bei tiefen Temperaturen, Zeitschrift Zinn und
seine Verwendung, Nr. 72 (1967), S. 6-10.
[17] Strain gages and accessories. Hottinger Baldwin Messtechnik GmbH,

Darmstadt.
[18] Hoffmann, K.: An Introduction to Measurements using Strain Gages.

Publisher: Hottinger Baldwin Messtechnik GmbH, Darmstadt.
L1421-2.0 en 61
Installation of strain gages, Bibliography
62 L1421-2.0 en
Hottinger Baldwin Messtechnik GmbH.
All rights reserved.

All details describe our products in general form only.
They are not to be understood as express warranty and do
not constitute any liability whatsoever.
Hottinger Baldwin Messtechnik GmbH

Im Tiefen See 45 64293 Darmstadt Germany
7-2002.1421
Tel. +49 6151 803-0 Fax: +49 6151 803- 9100

E-mail: info@hbm.com www.hbm.com
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Practical Hints for the Installation of

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3 Connecting the cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

5 Measuring point protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

what how where when

Quantity Method Place Time schedule

Strain gages Type selection (see SG catalog)

Type, location and orientation of each gage

Cables and leads material

Table 1-1: Schematic of installation planning.

2.1 Task and function of the bonding material

2.2 Type of bonding materials

Bonding materials can be differentiated as follows regarding the application

Table 2-2 on page 12f. provides an overview of the SG bonding materials

Letter code SG properties

G, K Phenolic fiberglass carrier

S Metallic carrier (weldable SG)

Optimal combination of SG and bonding material

Suitable, but sacrificing a part of the SG or bonding material

Table 2-1: Explanation of letters and symbols in Table 2-2.

Useful temperature range (approx.)

X280 cold- Experimental stress

Experimental stress For transducers

is important (dynamic measurements).

Curing conditions Suitable for SG in series6)

160 3.5 h 0.2 0.35 13 17

2.3 Characteristics of the various HBM SG adhesives

2.4 Application of adhesives

2.4.1 Bonding surface preparation for metals

The terms cleanliness and contamination must be explained first as it is

measuring point. Use scrapers, spatulas, grinding equipment or similar

Fitting piece (measurement object)

Fig. 2-1: Influence of surface roughness on effective contact surface size

Roughening with sandblasting

Mild steel 4 20 100 150 115 75 100 220

When using cyano-acrylate adhesives (e.g. Z70), less roughening (finer

SG bonding material Average roughening depth in m

EP150, EP250 and EP310S adhesive 24

Table 2-2: Recommended roughening depth of bonding surfaces on the

Roughening with grinding

surface can lead to damage or breakage of the object itself. An (empty)

SG installation points should always be cleaned with chemically pure

Other commercial solvents are e.g. acetone, methyl-ethyl-ketone, isopropyl

Please note the following points when fine cleaning:

Pickling can be used in addition to or instead of mechanical pretreatment. In

2.4.2 Bonding surface preparation for non-metals

Glass (silicate glass), glazed porcelain, enamel

Group a) mainly comprises the amorphous structure plastics (e.g. polystyrene

Group b) includes the partially-crystalline plastics (e.g. high density

The physical or chemical pre-treatments used on plastics are intended to

sufficient bonding capability in difficult or insoluble plastics, but in most cases

1) Low density polyethylenes (LDPE) - alternative methods.

2.4.3 Use of SG in medical technology

Detailed description of installation techniques for bones can be found in [11].

Carrier material Minimum radius of curvature

Solder terminal Strain gage

Polyimide (Series Y/C) 2 <1 <1

Polyimide (series V) 100 100 100

PEEKF (series A/U) 5 0.5 0.5

Table 2-3: Smallest bending radii for SG without pre-forming.

Handle of soldering station Forming tool