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Latest News
ONFI standard 3.2 increases I/O speed by 33%
and adds 4-channel BGA package types

a shared
easy full platform
The industry leaders in NAND standard definition since 2006 integration features of NAND
innovation

Improving Interoperability with Enabling Lower Power and Higher Transfer

ONFI 3.1/3.2 Speeds with Future ONFI 4.0
JEDEC and ONFI developed JESD230 packaging standard I/O speeds extended beyond 533 MT/s
I/O speeds extended to 533 MT/s (ONFI 3.2) I/O switching levels reduced to 1.2V swings
Industry-standard package types available Continuity of industry-standard packages defined in ONFI 3.2
Backward-compatible with ONFI 3.2

ONFI Features and Benefits

ONFI 2.2/2.3 ONFI 3.1/3.2 ONFI 4.0
Feature* Benefit Preliminary
SDR NV-DDR SDR NV-DDR NV-DDR2

Standardized electrical specs

More consistency among vendors Yes Yes Yes Yes Yes Yes
and protocol
Eases burden on firmware to identity
Simplified host discovery of
features based on manufacturer and Yes Yes Yes Yes Yes Yes
NAND features
device IDs
DDR-400 (3.1) DDR-800
Maximum transfer speed MT/s Faster interface reduces data access time 50 DDR-200 50 DDR-200
DDR-533 (3.2) (NV-DDR3)
Lower I/O voltage means lower 1.8V, 1.2V
I/O signaling voltage 3.3V 1.8V/3.3V* 1.8V/3.3V* 1.8V/3.3V*
switching power SSTL_18 (NV-DDR3)
Drives high bandwidth with small form TSOP TSOP TSOP
Industry-standard packages BGA BGA BGA
factors (4-channel BGA, ONFI 3.2) LGA BGA LGA
Interface backwards Enables fastest devices to be run using SDR, SDR, NV-DDR,
SDR SDR
compatibility slower interfaces NV-DDR NV-DDR2
Improved power management
Lowers power consumption Yes Yes Yes Yes
with ability to stop the clock
Reports extended ECC correction details
Enhanced ECC reporting Yes Yes Yes Yes Yes Yes
to host
Interleaved reads of LUNs Improves pipelined reads Yes Yes Yes Yes Yes Yes
Minimizes the SRAM required for lower-
Small data move Yes Yes Yes Yes Yes Yes
cost controllers
Improves the ability to save host data
Change row address command Yes Yes Yes Yes Yes Yes
fragments (short pages)
Improves writes with interleaved reads
Program clear (PC) parameter Yes Yes Yes Yes Yes Yes
on another LUN

ECC ZERO (EZ NAND ) interface ECC and provides corrected data to host Yes Yes Yes Yes Yes Yes
Combines some signals enabling
System signal reduction Yes Yes Yes Yes
fewer signals to be routed to the host
Improves signal integrity enabling faster
Differential signaling Yes Yes
speeds
Improves signal integrity enabling faster
On-die termination Yes Yes
speeds
Output drive impedance variance
ZQ calibration Yes
improvement

*Contact vendor for specific supported features. New in this version of the specification.
 ONFI 3.2 NV-DDR2 Flash Performance
MLC Flash SLC Flash
16KB Page Performance* 16KB Page Performance*

MB/s

533 MB/s

533 MB/s

291 MB/s

533 MB/s

533 MB/s
533 MB/s

533 MB/s

533 MB/s

533 MB/s

533 MB/s
163.8
164 MB/s

Cache Program
Cache Read

146 MB/s
82 MB/s
41 MB/s
20 MB/s

73 MB/s
1 2 4 8 1 2 4 8
Number of die per channel Number of die per channel
*Maximum sequential performance assuming no controller overhead *Maximum sequential performance assuming no controller overhead

Founders

Additional ONFI Members

AboUnion Technology ENE Technology Lotes Silicon Motion, Inc.
A-DATA Eonsil LLC LSI Silicon Storage Tech
Alcor Micro Entorian Technologies Macronix InternationalMarvell STEC
Aleph One Evatronix MemoCom Corp. Skymedi Corporation
AMD FCI Mentor Graphics Smart Modular Technologies
Apacer FormFactor,Inc Metaram Solid State System Co
Arasan Chip Systems Foxconn Moai Electronics Corp. Super Talent Electronics
ASMedia Technology Fresco Logic Mobile Semiconductor Synopsys
Asolid Tech Fusion Media Tech Molex System Level Solutions, Inc.
Avid Electronics Corp Genesys Logic NeoMagic Corporation Tandon
BitMicro Hagiwara Sys-Com Nvidia Tanisys
Biwin Technology HiperSem Telechips
Orient Semiconductor Electronics
Blunk Microsystems, Inc. HGST Teradyne Inc.
PACTron
Cadence Hyperstone Testmetrix
Palmchip Corporation
Chipsbank InCOMM Transcend Information, Inc
Inphi Corp.
PMC Sierra
Cypress TycoElectronics
DataFab Systems Inc. Integrated Device Technology, Inc. Power Quotient International UCA Technology
Data I/O IntelliProp Inc. Powerchip Semiconductor University of York
Datalight,Inc. ITE Tech. Inc Prolific Technology Viking Technology
Delkin Devices, Inc. Jinvani Systech Seagate Virident Systems
Densbits Technologies Kingston Technology Shenzhen Netcom Electronics Co Western Digital
Diablo Technologies Lauron Technologies LLC Silicon Integrated Systems WinBond

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2010 ONFI, Open NAND Flash Interface. Rev. 7/13. PDF: 09005aef83d4fbe6 / Source: 09005aef83d4fc07