APPLICATION OF PHYSICAL VAPOUR

DEPOSITION AND CHEMICAL VAPOUR

DEPOSITION FOR INDUSTRIAL COMPONENTS

TRIBOLOGY
ASSIGNMENT 1
A SAI DHEERAJ
14BME0922

APPLICATION OF PHYSICAL VAPOUR DEPOSITION AND CHEMICAL

VAPOUR DEPOSITION FOR INDUSTRIAL COMPONENTS

INTRODUCTION:

Physical Vapor Deposition (PVD):

Physical Vapor Deposition (PVD) is a collective set of processes used to deposit thin layers
of material, typically in the range of few nanometers to several micrometers. PVD processes
are environmentally friendly vacuum deposition techniques consisting of three fundamental
steps :

Vaporization of the material from a solid source assisted by high temperature vacuum
or gaseous plasma.

Transportation of the vapor in vacuum or partial vacuum to the substrate surface.

Condensation onto the substrate to generate thin films.

Different PVD technologies utilize the same three fundamental steps but differ in the methods
used to generate and deposit material. The two most common PVD processes are thermal
evaporation and sputtering. Thermal evaporation is a deposition technique that relies on
vaporization of source material by heating the material using appropriate methods in vacuum.
Sputtering is a plasma-assisted technique that creates a vapor from the source target through
bombardment with accelerated gaseous ions (typically Argon). In both evaporation and
sputtering, the resulting vapor phase is subsequently deposited onto the desired substrate
through a condensation mechanism.

Deposited films can span a range of chemical compositions based on the source material or
materials. Further compositions are accessible through reactive deposition processes.
Relevant examples include co-deposition from multiple sources, reaction during the
transportation stage by introducing
a reactive gas (nitrogen, oxygen or simple hydrocarbon containing the desired reactant), and
post-deposition modification through thermal or mechanical processing.

Chemical vapor deposition (CVD)

Chemical vapor deposition is a technique for depositing thin films of materials on wafers or
other substrates. Source gases are introduced into a reaction chamber and energy is applied
through heat, high frequency high voltage (RF Power), or other techniques that result in the
decomposition of the source gas and reaction of the chemicals to form a film. Chemical vapor
deposition (CVD) is a chemical process used to produce high-purity, high-performance solid
materials. The process is often used in the semiconductor industry to produce thin films.

The semiconductor industry is the aggregate collection of companies engaged in the design
and fabrication of semiconductor devices. A thin film is a layer of material ranging from
fractions of a nanometer to several micrometers in thickness. In a typical CVD process, the
wafer (substrate) is exposed to one or more volatile precursors, which react and/or
decompose on the substrate surface to produce the desired deposit. A wafer is a thin slice of
semiconductor material, such as a silicon crystal, used in the manufacture of integrated

circuits and other micro devices.

Frequently, volatile by-products are also produced, which are removed by gas flow through
the reaction chamber.

APPLICATIONS IN INDUSTRIAL COMPONENTS

Briefly Physical Vapor Deposition (PVD) is used in a variety of applications, including

fabrication of microelectronic devices, interconnects, battery and fuel cell electrodes,
diffusion barriers, optical and conductive coatings, and surface modifications whereas
(CVD) is often used in the semiconductor industry to produce thin films. The semiconductor
industry is the aggregate collection of companies engaged in the design and fabrication of
semiconductor devices.

Benefits of Physical Vapor Deposition

Environmentally friendly alternative to other metal coating technologies such as

electroplating

Reduces weight and increases performance

Protects against corrosion

Low friction

Can be applied to a variety of materials

 Protects against wear and fretting

Higher hardness

Thermal stability

Heat and wear resistance

-PVD for Fretting Wear Protection in Aerospace industry

In the aerospace industry, fretting, or the adhesive transfer of material between contacting
surfaces, can lead to abrasive wear and crack formations in mechanical components.
Applying PVD coatings to mechanical components in jet engines can help protect against
fretting. PVD coatings have high hardness and low friction, which makes it an ideal
functional metal coating in the aerospace industry.

Because of the high temperatures PVD coatings are applied at, they are perfectly suited for
the aerospace industry. Fluctuating temperatures from the negatives to the high hundreds of
degrees celsius require a metal coating that can withstand the extremes. Choosing PVD for
its thermal stability and corrosion resistance makes it a great option for aerospace metal
finishing.

From turbines and compression blades to bearings, mounts and knuckle joints, there are many
applications for physical vapor deposition in the aerospace industry. Contact Bend Plating for
more information about physical vapor deposition can be applied on mechanical components
for the aerospace industry.

Benefits of Chemical Vapour Deposition

Coatings for a variety of applications such as wear resistance, corrosion resistance, high
temperature protection, erosion protection and in Semiconductors and related devices such as
Integrated circuits, sensors and optoelectronic devices. It is also used to produce ceramic
matrix composites such as carbon-carbon, carbon-silicon carbide and silicon carbide-silicon
carbide composites.

-Chemical Vapor Deposition for Integrated Circuits and Nanostructures

As integrated circuits, microelectromechanical systems (MEMS), and other electronic and

photonic systems become more complex, the increasing constraints on deposited layers
require deposition over widely varying conditions. Chemical vapor deposition (CVD)
provides the needed flexibility. Single and multiple layers of CVD semiconductors,
dielectrics, and metals can be formed over a wide range of deposition conditions in reactors
of different geometries. Plasma-enhanced CVD (PECVD), high-density plasma CVD
(HDPCVD), and atomic-layer deposition (ALD) demonstrate the evolution of CVD to meet
increasingly complex needs.

-High temperature protection and enhancing resistance to wear using CVD

There are a wide range of ceramic coatings that can be applied to metal components in order
to enhance their functional properties. Most ceramic coatings are electrically nonconductive
(making them excellent insulators), have a significantly higher level of abrasion resistance
than most metals, and are capable of maintaining their integrity under severely elevated
temperatures, sometimes up to 4,500 degrees Fahrenheit. Wear-resistant ceramics, such as
titanium nitride and chromium carbide, can be applied to work steels and air-hardening tool
steels via chemical vapor deposition (CVD), which is one of the more common application
methods currently in use.