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GP1A70R/GP1A71R

GP1A70R/GP1A71R

OPIC Photointerrupter with


Encoder Functions

Features

Outline Dimensions

1. 2-phase ( A, B ) digital output


2. Sensing accuracy
( GP1A70R Disk slit pitch : 1.14mm )
( GP1A71R Disk slit pitch : 0.7mm )
3. PWB mounting type
( Lead bending type )
4. TTL compatible output
5. Compact, lightweight

( Unit : mm )

6.0

7.2

Internal connection diagram

GP1A70R

6
5

4
3
OPIC

6.0

1 Anode
2 Cathode
3 V OB

2.5MIN.

10.5

0.75

1. Printers
2. Copiers
3. Numerical control machines

3 4 5 6

6.5

Applications

13.0

0.15

2.0 - 0.2
0.1

12.5

4 GND
5 V CC
6 V OA

2 - 2.0

0.1

2 - C0.2
2
3

1 4.0 0.1
6

3 - (1.27)

2 - (1.75)

(2.54)

12.0
(6.56 )

*Tolerance : 0.3mm
*( ) : Reference dimensions

*OPIC ( Optical IC ) is a trademark of the SHARP Corporation.


An OPIC consists of a light-detecting element and signalprocessing circuit integrated onto a single chip.

Absolute Maximum Ratings

Input

Output

Parameter
Forward current
*1
Peak forward current
Reverse voltage
Power dissipation
Supply voltage
Low level output current
Power dissipation
Operating temperature
Storage temperature
*2
Soldering temperature

( Ta = 25C )
Symbol
IF
I FM
VR
P
V CC
I OL
PO
T opr
T stg
Tsol

Rating
50
1
6
75
7
20
250
0 to + 70
- 40 to + 80
260

Unit
mA
A
V
mW
V
mA
mW
C
C
C

*1 Pulse width<=100 s, Duty ratio 0.01


*2 For 5 seconds

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.

GP1A70R/GP1A71R
Electro-optical Characteristics

( Ta = 25C unless otherwise specified )

Parameter
Symbol
Forward voltage
VF
Reverse current
IR
Operating supply voltage
VCC
High level output voltage
V OH
Low level output voltage
VOL
Supply current
I CC
GP1A70R *5
Duty ratio
DA , D B
GP1A71R
Response frequency
f MAX.

Input

Output

Transfer
characteristics

Conditions
I F = 20mA, Ta= 25C
V R = 3V, Ta= 25C
*3

V CC= 5V, I F = 20mA


I OL = 8mA, V CC= 5V, I F = 20mA
*4
V CC= 5V, I F = 20mA
*3

*3

V CC= 5V, I F = 20mA, f = 2.5kHz

*3

V CC= 5V, I F = 20mA

MIN.
4.5
2.4
25
25
-

TYP.
1.2
5.0
4.9
0.1
5
50
50
-

MAX.
1.4
10
5.5
0.4
20
75
75
10

*3 Measured under the condition shown in Measurement Conditions.


*4 In the condition that output A and B are low level.
t
t
*5 D A: AH x 100, D B : BH x 100, Duty ratio : Average disk rotation time per turn
t AP
t BP

Output Waveforms
Output A
( VOA)
t AH
t AP
Output B
( VOB)
tAB1

t BH

Rotational direction : Counterclockwise when seen


from OPIC light detector
t BP

Fig. 2 Output Power Dissipation vs.


Ambient Temperature

60

300

50

250

Output power dissipation P O ( mW )

Forward current I F ( mA )

Fig. 1 Forward Current vs. Ambient


Temperature

40

30

20

10

200

150

100

50
0

0
0

25

50

70 75

Ambient temperature T a ( C)

100

25

50

70 75

Ambient temperature T a ( C)

100

Unit
V
A
V
V
V
mA
%
%
kHz

GP1A70R/GP1A71R
Fig. 3-a Duty Ratio vs. Frequency
(GP1A70R)

Fig. 3-b Duty Ratio vs. Frequency


(GP1A71R)

80

80
VCC = 5V
I F = 20mA
T a = 25C

70

60

Duty ratio ( % )

Duty ratio ( % )

70

t AH
t AP x 100 ( Output A )

50

t BH
t BP x 100 ( Output B )

40

30

t AH
t AP x 100 ( Output A )

50

t BH
t BP x 100 ( Output B )

40

20
2
5
Frequency f ( kHz )

10

10

Frequency f ( kHz )

Fig. 4-a Phase Difference vs. Frequency


(GP1A70R )

Fig. 4-b Phase Difference vs. Freauency


(GP1A71R )
130

130
VCC = 5V
I F = 20mA
T a = 25C

VCC = 5V
I F = 20mA
120
Phase difference AB1 ( deg. )

120
Phase difference ABI ( deg. )

60

30

20

110
AB1 =

100

t AB1
360
t AP

90

80

110

AB1 =

t AB1
t AP x 360

100

90

80
70

70
2
5
Frequency f ( kHz )

10

Fig. 5-a Duty Ratio vs.


Ambient Temperature
(GP1A70R )
80

Duty ratio ( % )

t AH
t AP x 100 ( Output A )

t BH
t BP x 100 ( Output B )

40

30

10

80

VCC = 5V
I F = 20mA
f= 2.5kHz

70

60
50

2
5
Frequency f ( kHz )

Fig. 5-b Duty Ratio vs.


Ambient Temperature
(GP1A71R )

VCC = 5V
I F = 20mA
f= 2.5kHz

70

Duty ratio ( % )

VCC = 5V
I F = 20mA
T a = 25C

60
t AH
x 100 ( Output A )
t AP
50
t BH
x 100 ( Output B )
t BP

40

30

20

20
0

10

20
30 40
50
60
Ambient temperature T a ( C)

70

10

30
40
50
60
20
Ambient temperature T a ( C)

70

GP1A70R/GP1A71R
Fig. 6-a Phase Difference vs. Ambient
Temperature

Fig. 6-b Phase Difference vs. Ambient


Temperature
130

130
VCC = 5V
I F = 20mA
f= 2.5kHz

120
Phase difference AB1 ( deg. )

Phase difference ABI ( deg. )

120

110

AB1 =

100

t AB1
t AP x 360

90

80

110

t AB1
t AP x 360

100

90

70
0

10

20
30
40
50
Ambient temperature T a ( C)

60

70

80

50

60

70

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

60
Duty ratio ( % )

t BH
t BP x 100 ( Output B )

40

30

t AH
(
)
t AP x 100 Output A
50

40

t BH
(
)
t BP x 100 Output B

30

20
- 1.0

1.0

Distance X ( mm ) ( Shifting encoder )

130

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

AB1 =

140

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

130

110

100

1.0

Fig. 8-b Phase Difference vs. Distance


( X direction )
(GP1A71R )

Phase difference AB1 ( deg. )

120

0
Distance X ( mm ) ( Shifting encoder )

Fig. 8-a Phase Difference vs. Distance


( X direction )
(GP1A70R )

t AB1
t AP x 360

Reference position
(-)
(+)
GP1A70R

80
70
- 1.0

40

70

t AH
t AP x 100 ( Output A )

50

90

30

80

60

20
- 1.0

20

Fig. 7-b Duty Ratio vs.


Distance ( X direction )
(GP1A71R )

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

70

10

Ambient temperature T a ( C)

Fig. 7-a Duty Ratio vs.


Distance ( Xdirection )
(GP1A70R )

Phase difference ABI ( deg. )

AB1 =

80

70

Duty ratio ( % )

VCC = 5V
I F = 20mA
f = 2.5kHz

120

AB1 =

t AB1
t AP x 360

110

100

Reference position
(-)
(+)
GP1A71R

90
Disk
0
Distance X ( mm ) ( Shifting encoder )

1.0

80
- 1.0

Disk
0
Distance X ( mm ) ( Shifting encoder )

1.0

GP1A70R/GP1A71R
Fig. 9-a Duty Ratio vs.
Distance ( Ydirection )
(GP1A70R )
80

80

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

60
t AH
t AP x 100 ( Output A )

50

t BH
t BP x 100 ( Output B )

40

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

70

Duty ratio ( % )

70

Duty ratio ( % )

Fig. 9-b Duty Ratio vs.


Distance ( Y direction )
(GP1A71R )

30

60

t AH
t AP x 100 ( Output A )

50
t BH
t BP x 100 ( Output B )

40

30

20
- 1.0

20
- 1.0

1.0

Fig.10-a Phase Difference vs. Distance


( Y direction )
(GP1A70R )
VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

Phase difference ABI ( deg. )

120

110
AB1 =
100

GP1A70R
( +)
Reference
position
(- )

80

140

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

130

t AB1
t AP x 360

90

Fig.10-b Phase Difference vs. Distance


( Y direction )
(GP1A71R )

Phase difference AB1 ( deg. )

130

1.0

0
Distance Y ( mm ) ( Shifting encoder )

Distance Y ( mm ) ( Shifting encoder )

120

AB1 =

110
GP1A71R

100

( +)
Reference
position
(- )

90

Disk
70
- 1.0

80
- 1.0

1.0

Distance Y ( mm ) ( Shifting encoder )

80

Duty ratio ( % )

Duty ratio ( % )

80

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

70

t AH
t AP x 100 ( Output A )

50
40

1.0

Fig.11-b Duty Ratio vs.


Distance ( Z direction )
(GP1A71R )

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

60

Disk
0
Distance Y ( mm ) ( Shifting encoder )

Fig.11-a Duty Ratio vs.


Distance ( Z direction )
(GP1A70R )
70

t AB1
t AP x 360

t BH
t BP x 100 ( Output B )

30

60

t AH
(
)
t AP x 100 Output A

50

t BH
x 100 ( Output B )
t BP

40

30
20

20
0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

Distance Z ( mm ) ( Shifting encoder )

0.8

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.1
Distance Z ( mm ) ( Shifting encoder )

GP1A70R/GP1A71R
Fig.12-a Phase Difference vs. Distance
( Z direction )
(GP1A70R )
120

140

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C
t AB1
x 360
AB1 = t
AP

90

( Detecting side )
Z
OPIC Disk

( Detecting side )
100

GP1A71R
( Emitting side )

90
GP1A70R
( Emitting side )

60
0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

Disk

OPIC

80
0

0.8

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

Distance Z ( mm ) ( Shifting encoder)

Distance Z ( mm ) ( Shifting encoder)

( Unit : mm )

<Measurement Conditions>

3
1.5

6
3
R10.89

R13.45

RO
X'

7.2

RO
GP1A70R

GP1A71R

R13.24

X'

7.2

70

110

R15.8
13

Disk center

13

Disk center
6

8.625

2.0
6.5

0.3
0.1

10.5

11.185

0.75

0.1

6.5

0.5

2.0

< GP1A70R Basic Design>


RO ( distance between the disk center and half point of
a slit ) and S ( installing position of GP1A70R) will be
provided by the following equations.

< GP1A71R Basic Design>


RO ( distance between the disk center and half point of
a slit ) and S ( installing position of GP1A71R) will be
provided by the following equations.

RO=N /60 x 10.89 ( mm ) N : number of slits


S= RO- 2.265 (mm )

RO= N/120 x 13.45 ( mm ) N : number of slits


S= RO- 2.265 (mm)

Precautions for Use


( 1 ) This device is designed to be used under the condition of IF = 20mA
( 2 ) It is recommended that a by-pass capacitor of more than 0.01F be added
between V CC and GND near the device in order to stabilize power supply line.
( 3 ) As for other general cautions, refer to the chapter Precautions for Use .

10.5

80

t AB1
x 360
AB1 = t
AP
120

0.75

100

VCC = 5V
I F = 20mA
f= 2.5kHz
T a = 25C

130
Phase difference AB1 ( deg. )

110
Phase difference ABI ( deg. )

Fig.12-b Phase Difference vs. Distance


( Z direction )
(GP1A71R )

Application Circuits

NOTICE
The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
Contact and consult with a SHARP representative if there are any questions about the contents of this
publication.

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