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Chemlok

Chemlok 252X
Rubber-to-Metal Adhesive
Features and Benefits

Chemlok 252X is a general purpose, one-coat


adhesive that will bond a variety of vulcanized or
unvulcanized rubber compounds to metal or other
dissimilar rubber compounds.
A single coat of Chemlok 252X adhesive will bond
compounds based on natural rubber (NR),
polyisoprene (IR), styrene-butadiene (SBR),
polybutadiene (BR), polychloroprene (CR), nitrile
(NBR), butyl (IIR), and EPDM polymers to metals
such as carbon and alloy steels, stainless steel,
aluminum, copper and copper alloys, magnesium,
zinc, as well as a variety of plastics.

Excellent Performance - bonds a wide range of


elastomers and tolerates a variety of differences in
compounding.
Single, Non-Chlorinated Solvent System - suitable
for solvent incineration or recovery equipment.
One-Coat - provides a reduction in labor, solvent
usage, inventory, and shipping costs.

Typical Properties* of Chemlok 252X Adhesive


Composition

A mixture of polymers, organic compounds, and mineral


fillers dissolved or dispersed in an organic solvent system.

Appearance

Black liquid

Non-Volatile Content
by weight

22.0 - 24.0%

Density
kgs/m3
lbs/gal

953 - 989
7.95 - 8.25

Viscosity
Brookfield LVT, Spindle No. 2
30 rpm @ 25C (77F)
Zahn No. 2
Zahn No. 3

80 seconds
20 - 40 seconds

Flash Point (Seta)

26C (79F)

Solvents

Xylene

Shelf Life

One year from date of shipment, unopened container,


21C - 27C (70F - 80F) storage temperature.

250 cps

*Data is typical and not to be used for specification purposes.

product information

Description

Surface Preparation
Substrate surfaces must be free of debris and
organic contaminants to ensure good adhesion of the
adhesive. An effective and common cleaning
method is grit blasting followed by solvent
degreasing; grit blasting removes coarse
imperfections like scale and rust while vapor
degreasing removes grease, oils, and other organic
contaminants. Another effective and widely used
surface treatment is zinc phosphatizing, a multi-step
conversion coating process. Both of these surface
preparation methods improve adhesion by increasing
the surface area of the substrate and cleaning it.
For further details on surface preparation of specific
substrates, refer to Bulletin DS10-7101, Preparation
of Substrates for Bonding.

Application
Thoroughly mix Chemlok 252X adhesive prior to use
and agitate sufficiently during use to keep dispersed
solids uniformly suspended. Mix drums for 8 hours
at 30 - 60 rpm before using.
Chemlok 252X adhesive can be applied using spray,
dip, or brush application methods. Proper dilution for
the various application methods is best achieved by
experience. For optimum bond and environmental
resistance when using Chemlok 252X adhesive as a
one-coat, the dry film thickness should be 0.8 - 1.0
mils (20.3 - 25.4 microns).
For extremely aggressive environmental conditions,
Chemlok 252X adhesive should be used over
Chemlok 205 primer. In these instances, the dry film
thickness of the Chemlok 252X adhesive should be
0.4 - 0.7 mils (10.2 - 17.8 microns).
Chemlok 252X adhesive is best suited for spray
application. The adhesive should be diluted to 25 - 28
seconds using a Zahn No. 2 viscosity cup with
xylene or toluene (approximately 40 parts solvent to
60 parts adhesive, by weight or by volume). Tip
sizes of 1.07 - 1.40 mm (0.042 - 0.055 in) are
appropriate. Atomization pressures should be
maintained in the 0.345 - 0.379 MPa (50 - 55 psi)
range for best atomization.

In many instances, a single dip application of


Chemlok 252X adhesive will be sufficient to provide
excellent adhesion (see Table 1). Where rubber-tometal bonded assemblies are likely to be exposed to
aggressive environmental conditions, it may be
necessary to double dip Chemlok 252X adhesive
diluted at a ratio of 5 parts adhesive to 1 part
solvent, by volume, in order to achieve dry film
thicknesses of 0.8 - 1.0 mils (20.3 - 25.4 microns). A
single dip is appropriate when Chemlok 205 primer is
used under Chemlok 252X adhesive.
For brush applications, Chemlok 252X adhesive
should be used full strength.

Drying
The applied adhesive should be allowed to dry until
visual examination of the film has shown that all
solvent has evaporated. This will usually be
accomplished in 30 to 60 minutes at room
temperature.
Drying times may be shortened by either preheating
the metal inserts or oven drying after application.
Metal parts may be preheated prior to application to
a maximum of 65C (150F). For coated parts,
moderate drying temperatures should be used, but
temperatures as high as 149C (300F) may be used
for short periods of time. Maximum air flow at
minimum temperatures will give the best results.

Subsequent Processing
Dried films of Chemlok 252X adhesive are nontacky; therefore, coated parts can be piled into tote
pans for subsequent processing. Take precautions
to prevent contamination of the coated parts by dirt,
dust, grease, oil, etc. Wear clean gloves when
handling coated parts.
Long layover times between adhesive application
and bonding (e.g. 30 days) usually have no adverse
effect on the bond, provided the coated parts are
covered to prevent contamination. If Chemlok 252X
adhesive has been removed by chipping or abrasion
during handling, these damaged areas can be
recoated before bonding.

Table 1: Typical Primary Adhesion of Chemlok 252X Adhesive Single Dip Application
to Grit Blasted Steel
Natural Rubber
Prebake time

Neoprene
10

10

Chemlok 252X

9.82 kN/m (56#)


100R

10.17 kN/m (58#)


100R

14.91 kN/m (85#)


100R

19.99 kN/m (114#)


100R

Chemlok 205/252X

12.54 kN/m (71#)


100R

11.93 kN/m (68#)


100R

14.56 kN/m (83#)


100R

17.36 kN/m (99#)


100R

Chemlok 252X adhesive dry film thickness = 0.45 - 0.50 mils (11.4 - 12.7 microns)
Chemlok 205/252X adhesive dry film thickness = 0.85 - 1.00 mils (21.6 - 25.4 microns)
Bonded per ASTM D429-B, Assemblies tested @ 45 peel angle, 2/minute.

Preparation of Elastomer Compounds


Good bonding practice requires the presentation of a
fresh, free-flowing rubber surface to the bond
interface.
While Chemlok 252X adhesive is tolerant of wide
variations in rubber formulations, avoid excessive
amounts of oily or waxy compounding ingredients
having limited solubility in the polymer. Milling or
mixing techniques used should ensure maximum
dispersion of all ingredients. Rubbers compounded
to give minimum viscosity with adequate scorch time
will afford improved adhesion because of better
wetting at the elastomer-adhesive interface.
Rubber preforms used in compression molding
should be freshened or wiped with an aromatic
solvent to remove surface bloom or other
contamination prior to molding.
Avoid prolonged storage of compounded rubber
stocks.

Molding and Curing


Chemlok 252X adhesive can be used to bond rubber
by compression, transfer, injection molding, or by any
other molding procedures normally used to make
bonded parts. As with other Chemlok adhesives,
maximum adhesion is obtained when the rubber has
reached the optimum state of cure.
Ideal bonding conditions exist when both the
adhesive and the rubber cure at the same time. To
accomplish this, load both the adhesive-coated metal
parts and fill the cavities with rubber in a minimum
amount of time.
While it is desirable to keep mold loading cycles to a
minimum to prevent precure of the adhesive and the
rubber, Chemlok 252X adhesive will resist prebaking
times up to 15 minutes at 160C (320F) or the
equivalent at other temperatures without deleterious
affect on the bond. Transfer or injection molds
should have runners and sprues properly designed
and use adequate pressures to prevent precure of
the rubber before the mold cavities are completely
filled.

Postbonding Treatment
Take care when removing parts from the mold.
The bond formed by Chemlok 252X adhesive will
resist the normal postbonding treatments such as
flash removal, machining, plating, etc. Avoid
procedures that generate excessive heat or
exposure to deleterious environments.

PV Bonding
Chemlok 252X adhesive exhibits excellent (PV) postvulcanization bonding capability with vulcanized
compounds of NR, SBR, chloroprene, nitrile, butyl,
Hypalon , and EPDM.
For further details on post-vulcanization bonding,
refer to Bulletin DS10-2046, Chemlok PostVulcanization Bonding Guide.

Packaging
1 Gallon Container (3.8 Liter)
5 Gallon Pail (19 Liter)
55 Gallon Drum (208 Liter)
Storage
Store in well ventilated area at a temperature
between 21C - 27C (70F - 80F). Do not store or
use near heat, sparks, or open flames.

Cautionary Information
Before using this or any other Lord product refer to the
Material Safety Data Sheet (MSDS) and label for safe
use and handling.

Typical Chemlok 252X Adhesive Performance


Primary Adhesion
NR, 40 Duro.

NR, 50 Duro.

Chemlok 205/252
5.09 kN/m (29#) 100R
Chemlok 205/252X 5.26 kN/m (30#) 100R
Chemlok 252
5.09 kN/m (29#) 100R
Chemlok 252X
4.91 kN/m (28#) 100R

CR, 51 Duro

SBR, 63 Duro.

9.12 kN/m (52#) 100R


15.96 kN/m (91#) 100R
24.03 kN/m (137#) 100R
11.40 kN/m (65#) 100R
16.14 kN/m (92#) 100R
23.15 kN/m (132#) 100R
13.50 kN/m (77#) 99R CM 18.07 kN/m (103#) 92R CM 27.01 kN/m (154#) 98R CM
12.45 kN/m (71#) 100R
15.96 kN/m (91#) 97R CM 26.31 kN/m (150#) 99R CM

Salt Fog Resistance


Test Conditions: 72 Hrs. @ 5% NaCI
NR, 40 Duro.
Chemlok
Chemlok
Chemlok
Chemlok

205/252
205/252X
252
252X

NR, 50 Duro.

100R
99R CM
80R RC
72R 20 RC CM

100R
100R
92R CM
95R CM

CR, 51 Duro
100R
99R CM
87R CM
92R CM

SBR, 63 Duro.
100R
100R
83R CM
83R CM

Boiling Water Resistance


Test Conditions: 2 Hrs. @ 100C (212F)
NR, 40 Duro.
Chemlok 205/252
Chemlok 205/252X

87R RC
93R RC

NR, 50 Duro.
98R CM
99R CM

CR, 51 Duro
98R CM
99R CM

SBR, 63 Duro.
99R CM
99R CM

Post Vulcanization Bonding


Cured natural rubber. Adhesive cured 7 minutes at 154C (310F)
Bonded per ASTM D429-D to grit blasted/degreased steel

Chemlok 252
Chemlok 252X

Film Thickness

Results

25.4 microns (1.0 mils)


25.4 microns (10. mils)

.82 MPa (683 psi) 93R RC


.95 MPa (783 psi) 98R RC

Note: R = rubber tear, RC = rubber to cement failure, CM = cement to metal failure.


NR = natural rubber, CR = chlorinated rubber, SBR = styrene butadiene rubber.

Values stated in this bulletin represent typical values as not all tests
are run on each lot of material produced. For formalized product
specifications for specific product end uses, contact the Customer
Service Department.
Information provided herein is based upon tests believed to be
reliable. Inasmuch as Lord Corporation has no control over the
manner in which others may use this information, it does not
guarantee the results to be obtained. In addition, Lord Corporation
does not guarantee the performance of the product or the results
obtained from the use of the product or this information where the
product has been repackaged by any third party including but not
limited to any product end user. Nor does the company make any
express or implied warranty of merchantability, or fitness for a
particular purpose concerning the effects or results of such use.
Lord and Chemlok are registered trademarks of Lord Techmark, Inc., a
subsidiary of Lord Corporation.
Hypalon is a registered trademark of E.I. DuPont de Nemours.

Printed in USA

2000, Lord Corporation DS-9252XR 10/00

For additional information, contact Lord Corporation at:


814/868-3611 extension 3211, FAX: 814/864-3452 or
write: Lord Corporation, Chemical Products, 2000
West Grandview Blvd., P.O. Box 10038, Erie, PA
16514-0038

LORD

Chemical
Products

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