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TES-T-111.02, Rev. 0
TABLE OF CONTENTS
1.0
SCOPE
2.0
INTRODUCTION
3.0
GENERAL
4.0
DEFINITIONS
5.0
SINGLE-POINT GROUNDING
6.0
7.0
8.0
9.0
10.0
11.0
DESIGN CRITERIA
12.0
13.0
REFERENCES
14.0
APPENDIX A
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PAGE NO. 2 OF 35
1.0
TES-T-111.02, Rev. 0
SCOPE
This standard defines requirements for grounding and bonding of communication
facilities/equipments.
2.0
INTRODUCTION
2.1
GROUNDING
All telecommunications and electronic facilities are inherently related to earth by
capacitive coupling, accidental contact and intentional connection. Therefore ground
must be looked at from a total system view point, with various subsystems
comprising the total facility ground system. The facility ground system forms a
direct path of known low impedance between earth and the various power,
communications and other equipments that effectively extends in approximation of
ground reference through out the facility.
The facility ground system is composed of the following subsystems:
2.1.1
b.
A metallic pipe system (i.e. water, gas, fuel, etc.) that has no
insulation joints or
c.
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1.
2.
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3.
2.1.2
TES-T-111.02, Rev. 0
2.1.3
2.1.4
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TES-T-111.02, Rev. 0
GENERAL
3.1
3.2
The grounding and bonding shall protect personnel and equipment against harmful
voltages, and this shall be applied to all levels of lightning and faults currents.
3.3
Single-point ground system to isolate the electronic switching equipment from all
elements of the total central office grounding systems except at a single-point and to
minimize the flow of potentially damaging currents.
3.4
3.5
The bare conductor(s) connected to the grounding rod(s) shall be buried not less than
460 mn (18 in.) below grade of the completed site.
3.6
3.7
3.8
3.9
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4.0
TES-T-111.02, Rev. 0
DEFINITIONS
4.1
4.2
4.3
4.4
4.5
4.6
Fuse Link:
A length of fine gauge wire in series with a larger gauge wire, for the purpose of
"fusing" open during a current-surge condition. This element normally provides
protection from currents which could otherwise heat conductors and start fires.
4.7
4.8
Ground Loop:
Ground loops exist when there is more than one electric a path from a point in a
circuit to a reference ground connection. Such parallel paths to ground are normally
not a problem if associated with the nonsensitive circuitry located outside the IGZ.
Ground loops are undesirable for equipment located inside the IGZ.
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4.9
TES-T-111.02, Rev. 0
4.10
Insulating Joints:
Nonconducting inserts provided at specified points in metal framework of equipment
located inside the IGZ. These are provided for the purpose of insulating the IGZ
equipment from outside ground connections.
4.11
4.12
4.13
4.14
4.15
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4.16
TES-T-111.02, Rev. 0
4.17
4.18
4.19
4.20
4.21
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4.22
TES-T-111.02, Rev. 0
4.23
Bonding:
Bonding refers to the process by which a low impedance path for the flow of an
electric current is established between two metallic objects.
Other types of bonding which involve simply the physical attachment of one
substance or object to another through various mechnical or chemical means are not
treated.
4.24
Central Office:
can be classified as these facilities where the communication room is manned on a
daily basis.
4.25
Remote Terminal:
include these sites such as power plants, substations, bid-stations and repeater sites
where communication space is not normally manned.
5.0
SINGLE-POINT GROUNDING
5.1
5.2
5.3
Surge-Producers (P).
Surge-Absorbers (A).
Non-IGZ Equipment Grounds (N).
IGZ Equipment Grounds (I).
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5.3.2
TES-T-111.02, Rev. 0
6.0
5.3.3
An isolated Ground Zone (IGZ) surrounding the electronic switch and other
sensitive electronic equipment. The IGZ will consistently have the reference
to ground as the GAB.
5.3.4
A high voltage rise can occur between the point of strike and point(s) of
dissipation under momentary large surge conditions, such as those resulting
from direct or indirect lightning strikes to cable or other outside plant
connected to the MGB. The MGB bonding enable high current surges to be
concentrated and dissipated through the P and A sections of the bar (see
Figures 1 and 7). This maintains the lowest possible potential at the point of
MGB-GWB connection. The connection sequence of P-A-N-I as shown in
Figure 7 is very important to the overall protection effectiveness.
5.3.5
All equipment located within the IGZ electrically floats at essentially the
same potential as the GWB when the singl-point grounding concept is used.
When all switch modules are operating at the same potential , no damaging
voltages across sensitive components and surge currents are eliminated.
The MGB is the hub of the basic central office grounding system used as a common
point of connection for the P-surge producers and A-surge absorbers, as well as the
equipment grounds for both the N-non isolated and I-isolated equipment areas. The
MGB is a copper bar insulated from its support and may be either on a wall near the
MDF, or on the cable vault wall. In small offices, it may be located on the MDF. To
identify each various connections to the MGB, it shall be tagged or stencilled.
6.2
6.3
6.4
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TES-T-111.02, Rev. 0
6.6
6.7
Bonding of the power neutral and water pipe, on the MGB conform the requirements
of National Electrical Code for separately bonding the commercia1 power service.
6.8
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TES-T-111.02, Rev. 0
resistance. A bond still required between the local power ground electrode and the
MGB.
6.9
6.9.2
6.9.3
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TES-T-111.02, Rev. 0
owner of the water system is required when the pipe on the street side of the
meter is not owned by the Company or where there is an insulated coup1 ing
at the meter. The electrical service will be bonded to the water piping as
shown on Figure 1.
6.9.4
6.9.5
6.10
6.11
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TES-T-111.02, Rev. 0
6.12
The combined central office ground resistance from the three primary surge
absorbers, as defined in Section 5.7, should be 5 ohms or less when measured at the
MGB subject to the limitations of Section 5.13 where all three primary surge
absorbers are provided at a central office, the 5 ohms objective should be met when
any two of the grounds are connected. For central office buildings where only two
surge absorbers are available, the objective for the central office ground field is 5
ohms or less.
6.13
6.14
7.0
The resistance of the central office ground field should be determined prior to
selecting the specific equipment for installation. The manufacturers of equipment
should be advised when the 5 ohms central office ground field objective cannot be
achieved by established methods. Where extraordinary measures must be taken to
protect the equipment warranty, the added costs should be considered as described in
Section 2.8.
All equipment grounds that originate inside the IGZ are terminated on the GWB
which should preferably be physically located inside the IGZ and insulated from its
support. The use of a GWB which is provided by the equipment manufacturer as an
integral part of the switching equipment is acceptable. Normally, those ground
conductors originating inside the IGZ that are terminated on the GWB will be placed
by the personnel installing the switching equipment .
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TES-T-111.02, Rev. 0
7.2
A separate IGZ shall be established with its own GWB where additional electronic or
digital switching equipment is located in a remote area of the same floor or on
another floor of the building.
7.3
Connect each GWB to the MGB with a conductor following the most direct route.
This grounding conductor shall be 70 mm2 (2/0-gauge) or coarser copper with a
resistance of less than 0.005 ohms (Reference Section 9.0). The use of parallel
conductors for redundancy is acceptable as required by the manufacturer.
7.4
7.5
The frame grounds of ONLY that switching equipment and associated electrical
equipment located inside the IGZ should be connected to the GWB as may be
required by the equipment manufacturer. This includes, but is not limited to, those
items described in the following paragraphs:
7.5.1 All metal framework of the switching systems (e.g., frames; cabinets, bays,
etc.) should be connected to the GWB. The manufacturer's recommendations
for establishing these connections shall befollowed.
7.5.2 The cable racks, static control ground mats, discharge plates, transmission
equipment, and protective grounds of any other IGZ equipment that obtains
power from the main power plant should also be connected to the GWB. Any
special recommendations from the equipment manufacturer should be
complied with.
7.5.3
7.5.4
7.5.5
Hacks Insulated from the Building: The conduit carrying 127 Vac conductors
into the IGZ should be routed to a junction box located adjacent to the GWB.
The green wire should be solidl y connected t o the junction box and a wire
connect ion established between the junction box and the GUB. Use of
metallic or nonmetallic conduit for extending and bonding the ac conductors
into the IGZ is at the option of the manufacturer .Where metallic conduit is
used, care should be taken during installation to assure it is insulated from
foreign grounds (building structural steel and reinforced concrete members)
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TES-T-111.02, Rev. 0
8.0
7.5.7
Where overhead lighting fixtures located in the IGB are an integral part of or
are in electrical contact with the equipment frame(s), the associated green
protective ground wires should be connected to the GWB isolated ground
wire system. For convenience, they may also be connected to the GWB
where the connections above do not exist. All fixtures connected to the GWB
system need to be isolated from the building structural steel and reinforced
concrete members. Green wires associated with lighting fixtures having no
electrical contact with the equipment frames may be connected in the
conventional way to the ac distribution panel ground.
7.5.8
The protective grounds for teletypewriters, cathode ray tube consoles, test
equipment and other ac powered devices located or used within the IGZ area
are normally provided by the green wire leads in the attached power cords.
The green wire pins should not be removed from the 3-wire power cords of
such equipment and 2-wire adapters should not be used.
7.5.9
8.2
8.3
The metal framework, associated with digital electronic central office equipment and
associated peripheral equipment, should be installed and bonded in accordance with
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TES-T-111.02, Rev. 0
9.2
9.1.2
The MDFB should be insulated from the ironwork in all cases where it is
used as a MGB (Section 6.4). The MDFB may be insulated from its support
as required by the CO manufacturer.
9.1.3
9.1.4
Where the MDFB is used as the MGB in very small offices (Section 5.4), the
protective "ground connections" (Section 9.1.3) should be connected in the N
section of the bar. The MDF protector ground should be connected to the P
section o f the bar.
TEST11102R0/AAG
Protectors for all carrier equipment are normally located on the MDF. An
exception may be made to this rule. The protectors for some toll carrier
entrance cables are mounted in the carrier bays located in a non-IGZ area.
PAGE NO. 17 OF 35
9.3
TES-T-111.02, Rev. 0
9.2.2
The termination of analog and digital type toll carrier system on the same
protector assembly is not advisable. This practice minimizes coupling that
can produce analog carrier circuit noise.
9.2.3
9.2.4
Separation of the transmit and receive sides of the cable for T-carrier systems
should be maintained. This may be accomplished by using compartmental
separation or separate transmit and receive cables all the way to the MDF
protector assembly. Between that point and the carrier equipment, the
separation is usually maintained through the use of shielded jumpers,
separate shielded transmit and receive cables, or multipair cables within
dividually shielded pairs.
10.0
The point of reference for sizing all protective ground conductors, except green wire
conductors and dc power conductors, is the MGB.To determine the appropriate
conductor size, first establish the distance between the two points of connection via
the desired route (i.e. between the MGB and CEGB). Next, refer to Figure 1 to
determine the resistance objective between the two points. Finally from Table A,
find the wire size with a maximum footage for the desired resistance objective equal
to or greater than the wire distance between th e two points. Use of Table A or
calculated resistance values are permissible in lieu of measurement. The general
guidelines in the following paragraphs are also recommended.
10.1.1 The finest recommended conductor size is 16 mm2 (6-gauge), except for the
2.5 mm2 (14-gauge) protective grounds at the MDF described in Section
10.1.3.
10.1.2 The conductor between the MGB and GWB should always be 70 mn2 (2/0
gauge) or coarser. The suggested size provided in this paragraph pertains to
protective ground conductors only-not to dc power conductors. The
maximum resistance of this conductor should be less than 0.005 ohms.
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TES-T-111.02, Rev. 0
10.1.3 The conductor between the MGB and the neutral ground bar in the ac service
entrance panel board shall always be 70 mm2 (2/0 gauge) or coarser. The
maximum resistance of this conductor should not exceed 0.005 ohms.
10.1.4 The maximum conductor resistance from the MGB to the initial point of
connection with all surge producers should not exceed 0.0l ohms.
10.1.5 The maximum conductor resistance from the MGB to the point of connection
with all surge absorbers should not exceed 0.01 ohms, except as described in
Section 9.1.3.
10.1.6 The maximum conductor resistance from the MGB to the point of connection
with all equipment grounds should not exceed 0.01 ohms.
10.1.7 Where an intermediate ground bar (IGB) or connection is provided, the 0.01
ohm objective should be divided on either side for the IGB or connection.
10.2
The planning and installation of the wiring is critical to the provision of an effective
grounding system. Care should be taken to minimize induction that may appear in
grounding system wiring. Recommended guidelines for installation of grounding
system conductors include:
10.2.1 Ground conductors should be insulated to permit integrity testing.
Conductors should also be free of splices. splices must be made, only
compression connectors exothermic welding should be used.
10.2.2 Ground conductors should be routed in a manner that will avoid sharp or
right angle bends. Routes should follow the most direct path with gradual
bends to minimize the inductive reactance that tend t o impede surge currents
and reduce the overall effectiveness of the grounding system.
10.2.3 Ground conductors, except the green wires and dc power conductors, should
not be routed closely parallel to other conductors in the office so as to
minimize induction of surges in to equipment wiring. These conductors
should not be routed through cable racks or troughs, or within confines of any
iron work.
10.2.4 The ground conductor should only be placed in nonmetallic conduit. If it
must be routed through metallic conduit, both ends of the conduit should be
bonded to the grounding conductor. Further ground conductors should not be
encircled with metal clamps. This is essential to eliminate the high inductive
reactance that will impede the flow of surge current along the conductor.
10.2.5 Wire-to-wire and wire-to-ground rod connections should be made only with
compression connectors or exothermic weld connections. Solder joints
should not be used for any central office system grounding connection.
10.2.6 Wire-to-bonding-bar (busbar) connections should be made with lugs that
have a compression connectors or exothermic weld connection. The lugs
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TES-T-111.02, Rev. 0
should have bolt-on provisions for the busbar connections using copper bolts
and nuts. Periodically, some of the busbar connections may be removed for
test purposes.
10.3
11.0
DESIGN CRITERIA
11.1
11.2
For new facilities, the design criteria shall be used to retrofit the existing
communication facilities. Retrofit may be needed when performance is
unsatisfactory, for example, with respect to:
Impulse noise
Jitter
Crosstalk
Hum
False dialing, printouts, and traffic records.
Personnel electric shock hazards, fault protection.
Lightning effects (line surges)
Test equipment performance
Interference from strong fields (i.e. broadcast,. HF or MF fields)
11.3
11.4
11.5
11.6
For power system-power and equipment on adjacent floors and three floors, refer to
Figure #3 and Figure #4 respectively.
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11.7
12.0
TES-T-111.02, Rev. 0
For power system-separate power feed (common battery) on three floors and on two
floors, refer to Figure 5 and Figure 6
respectively.
Earth resistance for central office shall not exceed 3 ohms and for remote terminals
shall not exceed 5 ohms.
12.2
Bonding resistance for central office and remote terminals shall not exieed 0.2 ohms.
12.3
Bonding standard appl ies all elements and other communication grounding facilities
including:
a)
b)
c)
Radio Tower
d)
AC power generation/distribution
e)
Fuel tanks
f)
Conduit
g)
Rack-Lines
h)
i)
j)
k)
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TES-T-111.02, Rev. 0
APPENDIX "A"
VOLTAGE EFFECTS FROM RISING SURGE CURRENTS
1.0
2.0
General
1.1
1.2
Every conductor has self inductance which provides an impedance to lightning and
other surges, a significant voltage difference will occur between the ends of a
grounding conductor during the period a surge current is flowing. This potential
difference should not appear across sensitive electronic equipment. Further points in
the overall grounding system, between which the potential can appear, should not be
located so personnel can touch both simultaneously.
SELF INDUCTANCE
2.1
The self inductance (Lg) of a solid, round, non-magnetic and straight ground wire in
air or plastic conduit may be approximated with:
Lg= 0.20[log (3937/d) 0.95]
Equation ( I )
where:
Lg
=
=
=
All grounding connections in a typical small rural central office can probably be
made using only 16 mn2 (# 6 AWG) [4 mn (0.162") diameter] and 70 m2 (#2/0 AW [
9.27 mm (0.3648") diameter] conductors. Lengths of 9.1m (30f t) might be required
from some connections. From equation (I), the self inductance for 9.1 rn (30 ft) of 16
mm2 (#6 AWG) wire is 14.91 H and with 70 mm2 (#2/0 AWG) is 13.4 H.
2.2
The self inductance (Lg) of a ground wire in steel conduit where ends of conduit are
not bonded to wire is given as:
Lg= 0.20[log (3937/d) 0.95 + 1200 log (d1/d2)]
Equation (II)
where :
1200
d1
d2
TEST11102R0/AAG
=
=
=
PAGE NO. 22 OF 35
3. 0
TES-T-111.02, Rev. 0
2.2.1
The self induction of 9.1 m (30 ft) lengths of 16 mm2 (#6 AWG) and 70 mm2
(#2/0 AWG) wire encased in unibonded rigid steel conduit with an an OD of
33.4 mn (1.315") and ID of 26.6 mn (1.049") may now be determined from
equation(II). The self inductance of 16 mm2 (# 6 AWG) wire is 511.2 H
and 70 mm2 (# 2/0 AWG) is 509.7 H.
2.2.2
A grounding conductor 9.1 m (30 ft) long would not likely be placed in steel
conduit. A more common use of conduit is for carrying the conductor
through a wall via a 9.3 m (1 ft) length. A 0.3 m (1 ft) length of 16 mm2 (# 6
AW6) wire through a 0.3 m (1 ft) unbonded rigid steel conduit will have a
self inductance of 16.8 H and 70 mm2 (#2/0 AWG) will have 16.8 H. The self
inductance of 0.3m (1 ft) of wire in steel conduit is higher than for 9.1 m (30
ft) of bare wire in air.
The calculation of the momentary voltage that will develop across a length of
conductor using the conductor self inductance is possible. This voltage is given by
the differential relationship:
e = L (di/dt)
Equation (III)
where:
e
L
di
dt
3.1.1
=
=
=
=
voltage
inductance (Henries)
change in current (amperes)
change in time (seconds )
3.1.2
2980 volts
2680 volts
If this wire is placed in unbonded 9.1 mm (30 ft) rigid conduit as described in
Section 2.2.1, the voltage devel oped would be:
16 mm2 (#6 AWG)
TEST11102R0/AAG
101.940 volts
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3.1.3
TES-T-111.02, Rev. 0
Study of the example described in Section 3.2.2 where a 0.3 m (1 ft) length of
unbonded rigid steel conduit is used to pass the grounding conductor through a wall
is more practical from equation (III) the voltage developed across the 0.3 m (1 ft)
conductor length would be 3360 volts for either 16 mm2 (# 6 AWG) or 70 mm2 (#2/0
AWG) wire. The voltage developed across 0.3 m (1 ft) of wire 13% higher than 9.1m
(30 ft ) of bare 16 mm2 and 25% higher than for 9.1 m (30 ft) of70 mm2 (#2/0 AWG)
wire.
Table 02-01: Maximum Conductor Length to Meet the Grounding Conductor Resistance Objectives
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