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Outline
6.1. Generalities
6.2. Power-Supply Rejection
6.3. Output Stages
6.4. Two-Stage Class-A Transconductor
6.5. Class-AB Amplifiers
6.6. Current-Mode Amplifiers
Page 1
Analog IC Design
Null Ports:
High ZIN
Low VOFFSET
Low ZO
High SR dvO/dt
High AV
High iO(MAX)
High fBW
High ICMR
Low PVDD/VSS
High vO(MAX)
Low Cost
High SNR
Low Headroom
Actual Op Amp
Differential- and common-mode response:
"v +v %
v O = ( v P v N ) A V + $ P N ' A C v ID A D + v IC A C
# 2 &
(
)(
)
)
Page 2
Analog IC Design
v PSRR+ =
v dd A VDD
v dd
=
AD
PSRR +
v PSRR =
v ss A VSS
v ss
=
AD
PSRR
v CMRR =
v ic A C
v ic
=
AD
CMRR
RO = Output resistance
B. Composition
Differential Input Stage:
Buffer differential input signals High input impedance.
Convert differential input to ground-referenced signal (although not always).
Gain Stage: Amplify signals.
Output Buffer: Drive heavy loads Low output impedance.
Compensation: Stabilize circuit when looped with negative feedback.
Bias: Establish bias currents and voltages.
Design Strategy:
Translate
Voltages to Currents
Currents to Currents
Currents to Voltages
Voltages to Voltages
Page 3
Analog IC Design
Internal Components
Loads
Gain Stages
Bias Circuits
AV
v dd/ss =0
A VDD/VSS
v id =0
=
1+ A V
AV
PSRR +/
Page 4
Analog IC Design
A. Power-Supply Gain
Voltage-Divider Model: Model what connects to the output vO.
Output transistors MT and MB
couple (voltage-divide) supply noise.
High supply impedances
limit supply noise.
Output transconductors igmt and igmb
inject supply noise.
Grounded loads ZLOAD shunt output noise.
Shunt feedback shunts output noise with
ZSHUNT =
Z OL
Z OL
1
1
A OL FB A G.OL Z OL FB A G.OL FB G LG
High supply impedance limits noise current iac iIN's ZO should be high.
Page 5
Analog IC Design
and
Page 6
Analog IC Design
vO(MAX)
Power-Supply Rejection
MT's igmt reproduces gate noise vdd or vss in vO.
MB's igmb mirrors RBIAS's noise vss/RBIAS and vdd/RBIAS.
MT's 1/gmT shunts MB's noise in igmb and
MT's and MB's rds noise contributions.
vo
1
v dd/ssg mT rdsB v dd
v
v dd
v ss
+
+ ss +
+
v dd/ss
1+ g mT rdsB R BIAS R BIAS rdsT +1/g mT rdsB +1/g mT g mT
Page 7
Analog IC Design
Power Efficiency
For maximum power efficiency (i.e., long operational life), reduce power losses
Low vDS(AVG) For sinusoids, vO(PEAK)'s swing close to the supplies vDD and |vSS|.
Ideal Maximum-Efficiency MAX Waveforms:
When vDD = |vSS|, vO(MAX) |vO(MIN)| vDD.
vDS1(MIN) 0, vDS1(MAX) vDD vSS = 2vDD.
At vO(MIN) and vDS1(MAX), iD1 can near zero.
For a symmetrical vO, iO(MAX)+ iO(MAX) = IQ.
iD1(MAX) 2IQ at vO(MAX) and vDS1(MIN).
PM1 = vDS1iD1 = [vDD(1 + sint)] [IQ(1 sint)]
= vDDIQ(1 sin2t) PM1(MAX) = vDDIQ at Q point.
Fraction of PSUPPLIES delivered:
Maximum Possible
v R(PK) i R(PK)
v R(RMS)i R(RMS)
v R(PK)i R(PK)
v I
PO
2 2
=
=
=
=
< DD Q = 25%
PSUPPLIES ( v DD v SS ) i DD(AVG)
(v DD v SS ) IQ 2 (v DD v SS ) IQ 4v DDIQ
Page 8
Analog IC Design
Design Example
Objective:
Select RL for maximum efficiency
when vTN 0.5 V, VDS(SAT) = 0.2 V,
vIN(MAX) vDD = vSS = 5 V, and IQ2 = 2 mA.
Solution:
Efficiency =
PO
PSUPPLIES
v R(PK)
4.3m
1 4.3
=
= = 21.5%
20m 2 ( v DD v SS ) 4 5
!v
$! I $ (4.3)(2m)
PO = v R(RMS)i R(RMS) = # R(PK) &# Q2 & =
= 4.3 mW
2
" 2 %" 2 %
PSUPPLIES = ( v DD v SS ) i DD(AVG) = (2v DD )IQ2 = (10)2m = 20 mW
ii. Transconductor
Class-A
NMOS
CS Stage
" v O(MIN)
%
2
$$
+1m '' 2.17 V
(150)(300) # 1.5k
&
Page 9
Analog IC Design
Design Example
Objective:
Select RL for maximum efficiency
when vTN = 0.5 V, VDS(SAT) = 0.2 V,
vIN(MAX) vDD = vSS = 5 V, and IQ2 = 2 mA.
Solution:
Efficiency =
v R(PK)
PO
4.8m
1 4.8
=
=
=
= 24%
PSUPPLIES 20m 2 ( v DD v SS ) 4 5
!v
$! I $ (4.8)(2m)
PO = v R(RMS)i R(RMS) = # R(PK) &# Q2 & =
= 4.8 mW
2
" 2 %" 2 %
PSUPPLIES = ( v DD v SS ) i DD(AVG) = (2v DD )IQ2 = (10)2m = 20 mW
Power-Supply Rejection
When driven by a P-type mirror, MT's vg vdd and igmt 0.
MB's igmb mirrors RBIAS's noise vss/RBIAS and vdd/RBIAS.
MT's rdsT and MB's rdsB voltage-divide supply noise.
v
v
v r
v r
v o dd + ss ( rdsB || rdsT ) + dd dsB + ss dsT
rdsT + rdsB rdsT + rdsB
R BIAS R BIAS
Distortion
Characterized by influence on a pure sinusoid vin = VPsin(t).
Output with distortion: vo = a1VPsin(t) + a2VPsin(2t) + + aNVPsin(Nt)
Harmonic Distortion: Harmonic-to-fundamental signal-strength ratio: HDi |ai|/|a1|
Total Harmonic Distortion: Combined squareroot contributions:
THD
Large signals and square law for FETs and exponential for BJTs.
a 2 + a 3 +... + a N
a1
2
Page 10
Analog IC Design
In BJT
vIN = VBE + vin
(
(
"V %
" v %+
"v % +
v O = R L ( I Q i C ) = R L *I Q I S exp $ BE ' exp $ in '- = R L I Q *exp $ in ' 1# Vt &
# Vt &,
# Vt & ,
)
)
Where
a1 =
R L IQ
Vt
a2 =
R L IQ
2Vt
a3 =
R L IQ
6Vt
v O = a 1VP sin (t ) +
a 3 VP 3 #
a 2 VP 2 #
$1 cos ( 2t )%& +
$3sin (t ) sin (3t )%& +...
2
4
" a V 2 %" 1 % V
HD 2 $ 2 P '$
'= P
# 2 &# a1VP & 4Vt
Example
Class-A CE NPN with vO(PEAK) = 0.6 V, RL = 1 k, and IQ = 1.86 mA:
AV gm1RL = 70.6 vIN(PEAK) vO(PEAK)/AV = 0.6/70.6 = 8.5 mV
HD2 = VP/4Vt = 8.5m/4(26m) = 8.2% Significant.
HD3 = VP2/24Vt2 = (8.5m)2/24(26m)2 = 0.45% Less significant.
Origin of distortion: Gain variation across vO's swing.
0.6
1.86m
iC(MIN)
IQ i R(PK)
1k (1k) = 49
AV v
=
R L =
R L =
O(MAX)
Vt
26m
Vt
0.6
1.86m +
iC(MAX)
IQ + i R(PK)
1k (1k) = 95
AV v
=
R L =
R L =
O(MIN)
V
V
26m
t
t
The gain of the follower varies less (i.e., is more linear) because
inherent negative feedback suppresses gain sensitivity.
Page 11
Analog IC Design
B. Class B/AB
Class-B Transistor: Conducts half the sinusoid cycle Conduction angle is 180.
Less conduction than Class A More power efficient than A.
iC/D, gm, and gain = 0 when vO crosses zero Less linear than A.
Class-AB Transistor: Conducts more than half, but less than a full cycle.
Conduction angle is between 180 and 360.
Less conduction than Class A More efficient, but less linear than A.
More conduction than Class B Less efficient than B.
iC/D, gm, and gain > 0 when vO crosses zero More linear than B.
Class-B/AB Stage: Two Class-B/AB pushpull transistors.
One transistor conducts when the other does not.
i. Followers
vIN, vGS1 and vSG2 (and RL) limit vO(MAX).
vIN and vO limit gate drive Limit iO(MAX).
IQ does not limit iO(MAX).
Bulk effect reduces vO(MAX) and iO(MAX).
M1 and M2 conduct less than the full cycle More efficient than Class A.
Maximum possible power efficiency with lowest vDS When vR(PK) vDD.
v R(RMS)i R(RMS)
PO
=
PSUPPLIES v DDi DD(AVG) + v SS i SS(AVG)
%
"v
%" v
Maximum Possible
$$ R(PK) ''$ R(PK) '
$
'
v R(PK) v DD
# 2 &# R L 2 &
=
=
<
= 78.5%
"v
%
"v
% 2 2v
4v DD
DD
v DD $$ R(PK) '' + v SS $$ R(PK) ''
# R L &
# R L &
Page 12
E.g.: If vDD = 5 V
and vR(PK) = 4 V,
62.8%.
Analog IC Design
Distortion
iD1 and iD2 rise with a higher gategate bias voltage.
Higher vG1 vG2 Higher gate drive vGS1 + vGS2.
iL, iC/D, and gm fall to minimum when vO crosses zero.
Produces cross-over distortion.
Class AB
Class B
Page 13
Analog IC Design
Operation:
When M2 sinks iL, vSG2 is higher VBAT reduces vGS1 to set iD1.
When M1 supplies iL, vGS1 is higher VBAT reduces vSG2 to set iD2.
When vO is zero, iD1 = iD2 and VBAT sets iD12.
If VBAT is low, iD12 = 0 when vO = 0 Class B.
If VBAT is high, iD12 > 0 when vO = 0 Class AB.
ii. Transconductors
VDS1(SAT) and VSD2(SAT) (and RL) limit vO(MAX).
vGS does not limit vO(MAX).
vIN limits gate drive Limits iO(MAX).
vO and IQ do not limit iO(MAX).
vDS(MIN) of CS < vDS(MIN) of Follower More efficient than ABB followers.
Example: If vDD = vSS = 5 V and vR(PK) = 4.8 V.
4.8
PO
v
= R(PK) = 75.4% Closer to 78.5%.
PSUPPLIES 2 v DD v SS 4 5
Page 14
Analog IC Design
Distortion
iD1 and iD2 rise with a lower gategate bias voltage.
Lower vG2 vG1 Higher gate drives |vGS's|.
iL, iC/D, and gm fall to minimum when vO crosses zero.
Produces cross-over distortion.
Class B
Class AB
Page 15
Analog IC Design
Diode-Stack Example
MPOMNO: PushPull Output
MPPMNP: Push Bias
Operation:
MNN and MPP voltage-buffer vIN.
Adaptive-Stack Example
Operation: MNIN amplifies and drives vIN.
pG+
pG
Bias: VGN and MNB bias MNO and VGP and MPB bias MPO.
Class AB: iNO = iPO > 0 when vO = 0 if VGN > vSS + 2vTN and VGP < vDD 2|vTP|.
Class B: iNO = iPO = 0 when vO = 0 otherwise.
Page 16
Analog IC Design
C. Summary
Conduction Angle: Class A's > AB's > B's.
vGS/BE limits followers' vO(MAX) and VDS(SAT)/CE(MIN) limits transconductors' vO(MAX).
vO limits gate drive in followers, but not in transconductors.
More efficient when transistors conduct less B > AB > A.
More efficient when vDS/CE is low CS/CE > Followers.
1
= 25%
4
More linear when current and gain vary less
Maximum Efficiency:
A <
and
B <
= 78.5%
4
Less in AB.
Little in A.
Design Feature:
vSD3 = vSG3 vSD4 = vSGA and vDS1 vDS2 when vSG3 vSGA.
Systemic input-referred offset VOS(S) is practically nil.
Page 17
Analog IC Design
A. Static Parameters
Bias Currents (where Si Wi/Li):
IT = IBIAS(ST/SB)
IA = IBIAS(SB2/SB)
With negative Feedback, vN vP.
I13 I24 0.5IT.
To match VSD3(SAT) and VSDA(SAT),
I13/S3 should match IA/SA.
Limits:
B. Slew Rate
Slew-Rate Limit Maximum possible dvO/dt.
Largest C's limit circuit to dvC/dt iC/C Consider largest C's CC and CL.
IT
iA+
IT
IT
SR
IT
iL
IT
iL
IB2
SR+
IB2
Slew-Rate Scenarios: CC by i2 or i4
SRC = IT/CC
SRL
= (IB2 IT)/CL
Design usually
ensures:
iA+ >> IB2 >> IT.
vo/vgA is high Large vO's result from small vGA's: vGA 0 SRC SRO.
Worst-Case SRO: SRO+ = Min{SRC+, SRL+} IT/CC, SRO = Min{SRC, SRL} IT/CC.
Page 18
Analog IC Design
2
2
2
2
i i
i i
i3A
i TBA
*
VOS = 12 + 34 +
+
12 + 34
g m1 g m1 g mAg m1 ( rds2 ||rds4 ) g mAg m1 ( rds2 ||rds4 )
g m1 g m1
Electronic Noise vN*: Gain gmAGDRD2 suppresses iAB2* i1234* and gm12 set noise vN*.
vN
2
2
2
2
*
*
i *
i*
i *
i*
iA
i BA
3
1
= 2 12 + 2 34 +
2
+
+
2
g m1
g m1
g m1 g mAg m1 ( rds2 ||rds4 ) g mAg m1 ( rds2 ||rds4 )
g m1
D. Small-Signal Response
Small-Signal Parameters:
RID
Page 19
Analog IC Design
PSRR Model
Z gmA =
vo
igmA
1
R O1 +
vo
sCC
=
=
v o R O1g mA g mA R O1
R O1 + Z C
1
>>R O1
sCC
1
g mA R O1sCC
Slightly below
Miller pole pMiller.
fM
1
<p Miller
2R O1g mA rdsACC
rdsA
r +r
From fM, AVDD climbs rdsA + rdsB2 Frequency rises dsA dsB2 .
rdsB2
rdsB2
rdsA + rdsB2
r +r
1
f = fM dsA dsB2
p Miller
2R
r
g
C
dsB2
O1 mA C rdsA rdsB2
1+
rdsB2 || Z CO
r + r 2fM
A VDD =
dsA dsB2
(rdsA || Z gmA ) + (rdsB2 || Z CO ) 1+ s 1+ s
2p Miller 2p O
Page 20
Analog IC Design
Positive PSRR
+
PSRR 0 =
r +r
A V0
= g m1 ( rds2 || rds4 ) g mA ( rdsA || rdsB2 ) dsA dsB2 = g m1 ( rds2 || rds4 ) g mA rdsA
A VDD0
rdsB2
PSRR +
g ( r || r ) g r
AV
PSRR 0
A VDD
s
s
1+
1+
2fM
2fM
+
g ( r || r ) g r
PSRR 0
= m1 ds2 ds4 mA dsA 1
2f0dB g m1
R O1g mA rdsA CC
2fM CC
+
g
f0dB m1 >>fM
2CC
1+
rdsA || Z gmA || Z CO
rdsB2 + rdsA 2fgmA
A VSS =
1+
2p Miller 2p O
A VSS
1/g mA
after fgmA and before pO.
rdsB2
Page 21
Analog IC Design
Negative PSRR
PSRR 0 =
r +r
A V0
= g m1 ( rds2 || rds4 ) g mA ( rdsA || rdsB2 ) dsA dsB2 = g m1 ( rds2 || rds4 ) g mA rdsB2
A VSS0
rdsA
PSRR
g ( r || r ) g r
AV
PSRR 0
A VSS
s
s
1+
1+
2fgmA
2fgmA
g ( r || r ) g r
PSRR 0
= m1 ds2 ds4 mA dsB2 g mA rdsB2
2f
g m1
0dB
R O1CC
CC
2fgmA
f0dB
g m1
>>fgmA
2CC
v. Summary
P-type mirror reproduces vdd and cancels vss in MA's vGA.
MA cancels vdd in vGA with vdd in vSA.
IBIAS's ZO suppresses vdd and vss in igmB2.
CL shunts both input and supply
signals No effects in PSRR.
CC diode-connects MA.
rdsA || ZgmA falls to 1/gmA.
CC couples vdd and shunts vss PSRR+ << PSRR.
Page 22
Analog IC Design
F. Nulling Zero
Challenge:
Fix:
Limit CC's iFF, transform zRHP into an in-phase zero zM, and
use zLHP to recover pO's phase with current-limiting resistor RM.
Design:
RM =
1 C L + CC
g mA CC
But:
Since gmA >> gm1 and CGA << CC, RM's KC/gmA is low and pNULL >> f0dB.
CMOS Implementation
When moderate-resistance, low voltage-coefficient, and low temperature-drift
(analog) resistors are not available, channel resistance RCHANNEL is useful:
MR's IDR = 0 VSDR = 0 and MR is biased in triode as RCHANNEL.
Derive required vSGR from desired RCHANNEL = vSD/iD TRIODE 1/KP'SR(vSGR |vTP|).
Design desired vSGR with MB3 and MB4's vSGB3 + vSGB4 = vSGR + vSGA.
Page 23
Analog IC Design
G. Design Variables
Low-Frequency Gain AV0:
gm1,A and rds2,4,A,B2.
Unity-Gain Frequency f0dB:
gm1 and CC.
Phase Margin PM:
f0dB, pO, and zM.
gm1,A, CC, CL, and RM.
Input Common-Mode Range ICMR:
VDST,1,3(SAT).
IT and CC.
H. Design Example
Specifications:
1 vIC 1.8 V 2 vO 2 V
PQ 1 mW
80 iO 80 A
CL 10 pF
SR 10 V/s
f0dB 5 MHz
PM 60
IBIAS = 6 A
Process: L 0.6 m, LOL = 100 nm, COX'' = 2.4 fF/m2, KN' = 115 A/V2,
KP' = 40 A/V2, |VTP0| = 0.9 V, VTN0 = 0.65 V, and 1/L = 30 V for L = 3 m.
Sample Design:
1. Differential pair from ICMR and supplies.
Headroom to vDD = vDD vIC(MAX) = 2.5 1.8 = 0.7 V.
Headroom to vSS = vIC(MIN) vSS = (1) (2.5) = 1.5 V.
Negative Margin > Positive Margin.
Accommodate tail current with an N-type pair
and if possible, connect bulk to source No bulk effect on vTN.
Page 24
Analog IC Design
Designed:
CC 5 pF
IT 60 A
S12 10
IT 50 A 60 A.
ST 10
S34 15
Designed:
CC 5 pF
IT 60 A
S12 10
ST 10
S34 15
IB2 90 A
SB2 15
SA 45
Page 25
L's 3 m
Analog IC Design
Designed:
IB2 90 A
CC 5 pF
SA 45
IT 60 A
SB2 15
S12 10
L's 3 m
ST 10
RM 3 k
S34 15
SB 1
Designed:
IT 60 A
(263)(0.5M)(569)(167k)
S12 10
ST 10
S34 15
IB2 90 A
SA 45
SB2 15
Page 26
L's 3 m
RM 3 k
SB 1
Analog IC Design
Designed:
IT 60 A
S12 10
ST 10
S34 15
IB2 90 A
SA 45
SB2 15
L's 3 m
RM 3 k
SB 1
Differential Currents:
Page 27
Analog IC Design
i. Static Parameters
Bias Currents (where Si Wi/Li):
IT = IBIAS(ST/SB)
With negative Feedback, VN VP
I13 I24 0.5IT.
IAB1 IAB2 Design must ensure:
(S5/S3)(SAB1/S6) (SAB2/S4).
IAB12 = I12(SAB2/S4) = (0.5IT)(SAB2/S4)
Limits:
vIC(MAX) = vDD vSG3 VDS1(SAT) + vGS1
AV0 = gm1(SAB2/S4)RO
RO = rdsAB1 || rdsAB2
RID
pO 1/2RO(CL + CPAR)
f0dB GBW = AV0pO
= gm1(SAB2/S4)/2(CL + CPAR)
pG3 and pG4 each affect half of AV.
They produce the effect of one pole.
pG3 = gm3/2CG3, pG4 = gm4/2CG4
pG6 = gm6/2CG6, zAB1 = zMirror 2pG6
Example: If gm12AB12 = 200 S, gm3456 = 100 S, CGS12AB12 = 200 fF,
CGS3456 = 100 fF, rdsAB12 = 2 M, and CL = 10 pF.
Results: RID , RO = 1 M, AV0 = 400 V/V, pO 16 KHz, f0dB 6.4 MHz,
pG4 = pG6 53 MHz, pG3 80 MHz pO << f0dB << pG4, pG6 < pG3.
Page 28
Analog IC Design
1
Slew Rate: iAB1(MAX) and iAB2(MAX) slew CL + CPAR SR = I T AB2
.
S4 C L + C PAR
+
=
+
AV
AV
S
/S
g
g
S
/S
r
||
r
r
( 5 3 ) m1 m1 ( AB2 4 ) ( dsAB1 dsAB2 ) ds5 (S5 /S3 ) gm1
Random Offset: Mismatches in the differential pair and all mirrors contribute High.
VOS
2
2
i
i i i35
i 6AB1
4AB2
= 12 + 34 +
+
+
g
g
S
/S
g
S
/S
S
/S
g
S
/S
g
m1 m1 ( 5 3 ) m1 ( AB1 5 )( 5 3 ) m1 ( AB2 4 ) m1
Electronic Noise: Differential pair and all mirrors inject noise Noisy.
2
i * i * S i * S i * S i * S
i *
*
v N = 2 12 + 2 34 + 5 3 + 6 3 + AB1 4 + AB2 4
g m1
g m1 g m1 S5 g m1 S5 g m1 SAB2 g m1 SAB2
Page 29
Analog IC Design
B. Two-Stage Hybrid
AB CS input amplifies and AB follower/transconductor drives the load.
MOB shuts when MOT drives iOT(MAX) iO(MAX)+ = iOT(MAX) f(IT).
MOB mirrors IT when MOT is off iO(MAX) = iOB(MAX) = IT(SOB/S6)(S5/S3).
iOT = iOB = 0.5IT(SOB/S6)(S5/S3) > 0 when vO = 0.
Class AB Little cross-over distortion.
Distortion:
MOT's AV MOB's AV.
AV(PK)+ AV(PK).
Gain distortion.
Power-Supply Rejection:
Gain stage cancels vdd
and reproduces vss.
MOT reproduces vss
and shunts rdsOT's
and MOB's injection.
PSR: Gain stage cancels vdd and reproduces vss and followers reproduce vss.
Page 30
Analog IC Design
D. Two-Stage Transconductor
MBOT and MBOB bias MOT and MOB:
When MOB pulls iO(MAX), MBOB shuts and MBOT cascodes MAB2 and biases MOT.
When MOT supplies iO(MAX)+, MBOT shuts and MBOB cascodes MAB1 and biases MOB.
CCT and CCB split poles and RM impedes out-of-phase feed-forward currents.
Without M5C, RDBOT magnifies igAB1's vdd and vss noise Higher supply gain.
Page 31
Analog IC Design
Page 32
Analog IC Design
Page 33
Analog IC Design
Current Amplifier
AI .
RINP
RINN
iO = (iP iN)AI
RL Should shunt iO 0 .
A. Current-Mode Concept
Conceptual Development:
High accuracy with negative feedback.
Highest bandwidth fI 0dB when FB does not attenuate AI LG.
Use current amplifier in unity-gain feedback.
Translate vIN to iIN with RIN.
A load RL steals current away from iFB.
iFB iO with RL.
Should not load the circuit Buffer the output.
AG
1 A I
iO i IN iO 1
=
A I(CL) =
=
v IN v IN i IN R IN
R IN 1+ A I
Page 34
Analog IC Design
" A A %" R %
v O " i IN %" i O %" v OI %" v O % " 1 %
= $$
''$$ ''$$
''$$
'' = $$
'' A I(CL) R OI A V = $$ I V ''$$ OI ''
v IN # v IN &# i IN &# i O &# v OI & # R IN &
# 1+ A I &# R IN &
Frequency Response:
AI(CL) sets vO/vIN's bandwidth fV BW to fI 0dB.
ROI/RIN sets vO/vIN's gain, but not fV BW.
fV BW = fI 0dB f(Gain).
No fall in fV BW for higher gain.
B. Example: i. Operation
RIN translates vin to iin.
M1M2 amplifies iin ifb.
ROI translates io to vg8.
M8 buffers and reproduces vg8.
M34567 bias M1M2 and M8.
v
g m8 ( rds7 || R L )
1
S /S
i
v in
i
v
= in o g8 o
2 1 (R OI )
v o v in i in io v g8 R IN 1+ S2 /S1
1
1+ g m8 +
( rds7 || R L )
r
ds8
Design Notes:
M2's rds2 and M4's rds4 steal current from ROI Reduce ROI, lengthen M2's L2
and M4's L4, degenerate M2 and M4, and/or cascode M2 and M4.
1/gm1 adds load to vIN Raise RIN and/or gm1 (i.e., I34 and/or W12).
Page 35
Analog IC Design
AI OL io/ie = S2/S1
FB ifb/io 1 if ROI << rds2 || rds4
AI CL io/iin = AI OL/(1 + AI OL)
AV IO = vo/vin (1/RIN)AI CL(ROI)
if iin vin/RIN RIN >> 1/gm1.
fV BW = fI 0dB GBWI = AI OLpG8
(S2/S1)/2ROICG8
fV 0dB GBW = AV IOfV BW
pO gm8/2(CGS8 + CL)
I C "(W/L)
I K '(W/L)
I t
gm
D
D OX
D OX3
C PAR
COX"WL
COX"WL
WL
Higher currents raise gm/CPAR (i.e., gain and bandwidth), but also power.
Shorter channel lengths raise gm/CPAR more than shorter tOX lowers gm/CPAR.
Finer-pitch technologies reach higher bandwidths.
Each stage introduces at least one bandwidth-limiting pole.
Because BJTs are exponential and FETs are square law,
BJT gm's are normally higher than MOS gm's.
1Compensating
Since:
2Low
And:
3Poles
Page 36
Analog IC Design
Chapter 7. Comparators
Outline
7.1. Generalities
7.2. Open-Loop Comparators
7.3. Summing Comparators
7.4. Hysteretic Comparators
7.5. Regenerative Comparators
7.6. High-Speed Comparators
Page 37
Analog IC Design
B. Dynamic Response
Step Response
Propagation Delay:
From vID's VID(MID) = 0.5(VIL + VIH).
To vO's VO(MID) = 0.5(VOL + VOH).
t P(RISE) + t P(FALL)
2
Bandwidth-Limited Response:
Linear single-pole system produces an exponential response.
AV =
A V0
s
1+
2p1
)
# t &,
v O = v ID A V0 +1 exp % (.
$ 1 '*
Page 38
Analog IC Design
vID KOvID(MIN)
# 2K &
O
t P = 1 ln %%
((
$ 2K O 1 '
With a linear circuit, response tP is a negative exponential Fast at first, then slow.
C
dv O i O(MAX)
0.5 ( VOH VOL )
v
=
t P(SR) = t C = L v O = O =
dt
CL
SR
SR
iO(MAX)
Example
Parameters: pBW = 1.6 kHz, AV0 = 1 kV/V, SR = 1 V/s,
VOH = 1.5 V, VOL = 0.5 V, and vID = 10 mV.
Solution:
Page 39
Analog IC Design
C. Noise
Noise in vID produces uncertainty in transition and jitter at the output.
Comparator
threshold
vin
vout
VOH
Noise
Jitter
VOL
VTRP+
VTRPVOH
VOL
vout
No Jitter
Performance Parameters:
VTRIP = VGSA(IQ ) + v SS = VTN0 +
2I B
+ v SS
K N'(W/L)A
R DSA(ON) =
v DS
1
K N'(W/L)A v GSTA
iD
SR+ = IB = IBIAS(SB/S1)/CL
SR = (iA IB)/CL
pO 1/2(rdsB || rdsB)CL
= [0.5KN'(W/L)AvGSTA2 IB]/CL
Page 40
Analog IC Design
B. Class-AB Transconductor
Performance Parameters:
VOH = vDD because iAB1 = 0.
VOL = vSS because iAB2 = 0.
ICMR is same as in op amp.
AV0 gm1(SAB2/S4)(rdsAB1 || rdsAB2)
pO 1/2(rdsAB1 || rdsAB2)CL
SR+ IT(SAB2/S4)/CL
SR IT(S5/S3)(SAB1/S6)/CL
Low gain (one gain stage), limited SR (by IT), symmetrical SR (MAB12 pushpull),
high-swing (rail-to-rail to vDD and vSS), one low-frequency pole (at vO), and
poor offset and poor noise (from several transistors in first stage).
v SD
1
K P'(W/L)A v SGTA(MAX)
iD
SR = IB2/CL = IBIAS(SB2/SB)/CL
pO 1/2(rdsA || rdsB2)CL
= [0.5KP'(W/L)AvSGTA(MAX)2 I5]/CL
Page 41
Analog IC Design
Step Response
Differential stage trips when vP crosses vN.
Class-A transconductor trips when vGA crosses VTRIPA: Analyze when circuit balances.
2I B2
VTRIPA = v DD v SGA(IBIAS ) = v DD VTP 0 +
K P'(W/L)A
IT limits SRGA delays tGA+ and tGA Faster with higher IT.
Wide gate swing at vGA delays falling response (tGA+) Faster with lower swing.
Two
equivalent
poles.
Reducing the
second pole pO Removes
pGA.
slows response.
All poles slow response Shift as many poles as possible to high frequency.
Page 42
Analog IC Design
(2) Raise
(3) Raise
Lowest delay with e 2.67 larger stages, but inverters dissipate power
use 5 to 10 larger stages.
Example if VTN0 = |VTP0|:
(1) W
PI1
2.5WNI1
(2) L
G1,G2,I1,I2
LMIN
(2) W
G1,G2,NI1
WMIN
(3) W
PI2
5WPI1
(3) W
NI2
5WNI1
Page 43
Analog IC Design
VTRIP+ = v P
VTRIP = v P
v O =VOH
v O =VOL
VHYS = VTRIP =
(V
VOH R IN
R FB + R IN
VOL R IN
R FB + R IN
OH
VOL R IN
R FB + R IN
Inserting a voltage between RIN and ground shifts VTRIP+ and VTRIP
by the same amount without affecting VHYS.
Trip points are sensitive to supplies via VOH and VOL Variable and noisy.
VTRIP+ = v IN
VTRIP = v IN
v P =0 and v O =VOL
v P =0 and v O =VOH
" V %
= i RFB R IN = $$ OL '' R IN
# R FB &
" V %
= i RFB R IN = $$ OH '' R IN
# R FB &
#R &
VHYS = VTRIP = VOH VOL %% IN ((
$ R FB '
Page 44
Analog IC Design
Schmidt Trigger
2
2
Positive
Feedback
M5 is off and about to trip: vS5 = VTRIP + |vTP5|. Trip points are insensitive to K',
2
vO is initially low,
MFB is off and iH is 0, so
vO rises when i2 overcomes i1.
When vP falls towards vN,
vO is initially high,
MFB is on and iH > 0, so
vO falls when i1 overcomes i2 + iH.
Page 45
Analog IC Design
iH
g m1
2 (i2 + iH )
2i 2
S2 K N '
S1K N'
C. Voltage Defined
vH produces an offset that vID must overcome to transition vO.
MH1MH2:
Page 46
Analog IC Design
2i 2 (S5 /S4 )
2i 2
S1K N'
S2 K N '
S1K N'
S2 K N '
Page 47
Analog IC Design
Example
Parameters:
vI1 = vIN, vI2 = VREF = 1 V,
S1 = S2 = S5 = S6 = 10,
S3 = S4 = 2, IT = 20 A,
vDD = 2.5 V, vSS = 2.5 V,
and KN' = 100 A/V2.
VOH vDD
vO(MAX)
Solution:
iO(MAX)+ = IT(SAB1/S3)
iO(MAX) = IT(S7/S4)(SAB2/S8)
Page 48
Analog IC Design
Operation:
Small vI1 vI2 difference vid
produces imbalance.
Positive feedback
Positive
Feedback
regenerates
initial imbalance.
B. Response Time
Small Differential Input:
+t
C t v 1
v O(FIN) = v O(INI) exp GS = id g m1
exp
g
g
2
m3
m3
LATCH
Positive Exponential
i1 = 0.5vidgm1 i2 = 0.5vidgm2
vO1(INI) = vO2(INI)
R EQ
v O1
v O1
1
=
g m3
i3
v O2g m3
C EQ CGS
Propagation Delay:
vO(FIN) reaches 0.5(VOH VOL) in tP.
V V
OL
t P = LATCH ln OH
2v
O(INI)
Page 49
Analog IC Design
Regenerative Response
Linear Response
Fast at first,
Slow at first,
B. Design Notes
Low resistances raise bandwidth and lower gain.
Poles near f0dB are harmless.
Use multiple low-gain, high-bandwidth stages.
Linear stages are faster with low overdrive vIN.
Regenerative stages are faster with high overdrive vIN.
Low-voltage swings vO shorten propagation delay.
Use linear low-swing preamplifier and regenerative high-swing output.
To drive large CL with least delay, use increasingly 2.67 larger AB inverters.
But to reduce power, build drive with 5 to 10 larger AB inverters.
Page 50
Analog IC Design
Example
Two low-gain, low-swing pre-amplifiers with regenerative Class-AB output.
Three balanced
Gate-Drive Booster
5 larger
Class-AB inverters.
Page 51