Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Folder
Sample &
Buy
Support &
Community
Tools &
Software
Technical
Documents
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
3 Description
PACKAGE
SOIC (16)
10.30 mm 7.50 mm
2 Applications
OUT
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Pin Configuration and Function ...........................
Specifications.........................................................
1
1
1
2
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
4
4
4
5
5
6
7
26
26
26
26
26
4 Revision History
Changes from Original (June 2015) to Revision A
Page
5 Description (continued)
The readiness for the gate driver to be operated is under the control of two undervoltage-lockout circuits
monitoring the input side and output side supplies. If either side has insufficient supply the RDY output goes low,
otherwise this output is high.
The ISO5851 is available in a 16-pin SOIC package. Device operation is specified over a temperature range from
40C to 125C ambient.
ISO5851
www.ti.com
16
GND1
DESAT
15
VCC1
GND2
14
RST
NC
13
FLT
VCC2
12
RDY
OUT
11
IN-
CLAMP
10
IN+
VEE2
ISOLATION
VEE2
GND1
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
VEE2
1, 8
DESAT
GND2
NC
Not connected
VCC2
OUT
CLAMP
GND1
9, 16
Input ground
IN+
10
IN-
11
RDY
12
FLT
13
RST
14
VCC1
15
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings (1)
Over operating free-air temperature range (unless otherwise noted)
VCC1
VCC2
(VCC2 GND2)
V(EE2)
(VEE2 GND2)
V(SUP2)
(VCC2 - VEE2)
VOUT
I(OUTH)
I(OUTL)
V(LIP)
I(LOP)
V(DESAT)
Voltage at DESAT
V(CLAMP)
Clamp voltage
V(SURGE)
TJ
Junction temperature
TSTG
Storage temperature
PID
POD
PD
(1)
(2)
MIN
MAX
UNIT
GND1 - 0.3
0.3
35
17.5
0.2
0.3
35
V(EE2) - 0.3
VCC2 + 0.3
2.7
5.5
VCC1 + 0.3
10
mA
GND2 - 0.3
VCC2 + 0.3
V(EE2) - 0.3
VCC2 + 0.3
40
150
65
150
100
mW
600
mW
700 (2)
mW
12800
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
Full chip power dissipation is de-rated 10.7 mW/C beyond 85C ambient temperature. At 125C ambient temperature, a maximum of
272 mW total power dissipation is allowed. Power dissipation can be optimized depending on ambient temperature and board design,
while ensuring that Junction temperature does not exceed 150C.
Electrostatic discharge
4000
500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
VCC2
NOM
MAX
UNIT
5.5
15
30
V(EE2)
15
V(SUP2)
15
30
VIH
0.7 x VCC1
VCC1
VIL
0.3 x VCC1
tUI
tRST
TA
40
ns
800
ns
Ambient temperature
-40
25
125
ISO5851
www.ti.com
16 PINS
JA
91.8
JCtop
51.9
JB
56.6
JT
20.2
JB
56.1
(1)
UNIT
C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
TEST CONDITIONS
MIN
TYP
MAX
UNIT
2.25
VOLTAGE SUPPLY
VIT+(UVLO1)
VIT-(UVLO1)
VHYS(UVLO1)
VIT+(UVLO2)
VIT-(UVLO2)
VHYS(UVLO2)
IQ1
2.8
4.5
mA
IQ2
3.6
mA
1.7
V
0.24
12
9.5
V
13
11
LOGIC I/O
VIT+(IN,RST)
VIT-(IN,RST)
VHYS(IN,RST)
IIH
IN+ = VCC1
IIL
IPU
VOL
I(FLT) = 5 mA
0.7 x VCC1
0.3 x VCC1
V
V
0.15 x VCC1
100
-100
100
A
0.2
50
mV
V(OUTH)
IOUT = 20 mA
V(OUTL)
IOUT = 20 mA
I(OUTH)
1.5
2.5
I(OUTL)
3.4
VCC2 - 0.5
VCC2 - 0.24
13
I(CLP) = 20 mA
I(CLP)
V(CLTH)
V(EE2) + 0.015
VEE2 + 0.08
1.6
2.5
1.6
2.1
2.5
A
V
0.8
1.3
1.3
0.7
Clamping voltage
(VOUT - VCC2)
V(CLP_CLAMP)
Clamping voltage
(VCLP - VCC2)
V
1.1
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
0.58
mA
DESAT PROTECTION
I(CHG)
V(DESAT) - V(GND2) = 2 V
0.42
0.5
I(DCHG)
V(DESAT) - V(GND2) = 6 V
14
V(DSTH)
8.3
V(DSL)
0.4
mA
9.5
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tr
12
20
35
ns
tf
12
20
37
ns
tPLH, tPHL
Propagation Delay
76
110
ns
tsk-p
tsk-pp
Part-to-part skew
tGF
tDESAT
(10%)
tDESAT
(GF)
tDESAT
(FLT)
see Figure 15
tLEB
tGF(RSTFLT)
CMTI
(1)
(2)
ns
ns
20
30
40
ns
300
415
500
ns
330
330
2420
ns
400
500
ns
800
ns
2
100
ns
2000
300
(2)
CI
20
30 (1)
120
pF
kV/s
ISO5851
www.ti.com
7.0
6.0
0.0
VCC2 - VOUT = 15 V
VCC2 - VOUT = 20 V
-0.5
-1.0
-1.5
-2.0
-2.5
5.0
4.0
3.0
2.0
-3.0
-40
-20
20
40
60
80
100
Ambient Temperature (qC)
120
0.0
-40
140
-20
D001
VOUT - VEE2 = 15 V
VOUT - VEE2 = 20 V
20
40
60
80
100
Ambient Temperature (qC)
120
140
D002
0.0
TA = -40qC
TA = 25qC
TA = 125qC
-0.5
1.0
-1.0
-1.5
-2.0
-2.5
-3.0
5
4
3
2
TA = -40qC
TA = 25qC
TA = 125qC
-3.5
10
15
20
Output Voltage (V)
25
30
10
15
20
Output Voltage (V)
D003
25
30
D004
9.5
VCC2 - VEE2 = VCC2 - GND2 = 15 V
VCC2 - VEE2 = VCC2 - GND2 = 30-V
9.3
CH1: OUT
9.2
9.1
3 V/div
9.4
CH2: DESAT
8.9
8.8
CH3: /FLT
8.7
8.6
8.5
-40
Time - 50 ns/div
-20
20
40
60
80
Ambient Temperature (C)
100
120
140
D005
CL = 1 nF
RG = 0
VCC2 - VEE2 = VCC2 - GND2 = 20 V
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
3 V/div
3 V/div
Time - 50 ns/div
CL = 1 nF
RG = 10
VCC2 - VEE2 = VCC2 - GND2 = 20 V
CL = 10 nF
RG = 0
VCC2 - VEE2 = VCC2 - GND2 = 20 V
Figure 8. OUT Transient Waveform
3 V/div
3 V/div
Time - 1 ms/div
CL = 10 nF
RG = 10
VCC2 - VEE2 = VCC2 - GND2 = 20 V
CL = 100 nF
RG = 0
VCC2 - VEE2 = VCC2 - GND2 = 20 V
Figure 10. OUT Transient Waveform
3 V/div
5 V/div
3 V/div
10 V/div
CH2: DESAT
CH3: FLT
Time - 1 ms/div
Time - 2 ms/div
CL = 100 nF
RG = 10
VCC2 - VEE2 = VCC2 - GND2 = 20 V
CL = 100 nF
RG = 10
VCC2 - VEE2 = VCC2 - GND2 = 20 V
Figure 11. OUT Transient Waveform
CH1: OUT
ISO5851
www.ti.com
IN-
0V
50 %
IN+
50 %
50 %
tr
IN+
tr
tf
90%
90%
50%
50%
10%
tPLH
VCC1
tf
OUT
50 %
OUT
10%
tPLH
tPHL
tPHL
DESAT
DESAT
tLEB
tLEB
tDESAT (10%)
tDESAT (FLT)
9V
tRST
VDESAT
OUT
10%
50 %
FLT
RST
Figure 15. DESAT, OUT, FLT, RST Delay
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
VCC2
VCC1
0.1F
1F
9, 16
14
10
S1
11
13
GND1
GND2
15V
VEE2 1, 8
RST
Isolation Barrier
3 V...5.5 V
IN+
IN-
FLT
CL
DESAT
12
CLAMP
RDY
NC
VCM
OUT
Pass-Fail Criterion:
1nF OUT must remain stable
10
ISO5851
www.ti.com
9 Detailed Description
9.1 Overview
The ISO5851 is an isolated gate driver for IGBTs and MOSFETs. Input CMOS logic and output power stage are
separated by a capacitive, silicon dioxide (SiO2), isolation barrier.
The IO circuitry on the input side interfaces with a micro controller and consists of gate drive control and RESET
(RST) inputs, READY (RDY) and FAULT (FLT) alarm outputs. The power stage consists of power transistors to
supply 2.5-A pull-up and 5-A pull-down currents to drive the capacitive load of the external power transistors, as
well as DESAT detection circuitry to monitor IGBT collector-emitter overvoltage under short circuit events. The
capacitive isolation core consists of transmit circuitry to couple signals across the capacitive isolation barrier, and
receive circuitry to convert the resulting low-swing signals into CMOS levels. The ISO5851 also contains under
voltage lockout circuitry to prevent insufficient gate drive to the external IGBT, and active output pull-down
feature which ensures that the gate-driver output is held low, if the output supply voltage is absent. The ISO5851
also has an active Miller clamp which can be used to prevent parasitic turn-on of the external power transistor,
due to Miller effect, for unipolar supply operation.
OUT
11
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
12
ISO5851
www.ti.com
TEST CONDITIONS
MIN
TYP
MAX
UNIT
mm
mm
CTI
600
1012
RIO
CIO
L(I02)
(1)
(2)
(1)
11
10
pF
NOTE
Creepage and clearance requirements should be applied according to the specific
equipment isolation standards of an application. Care should be taken to maintain the
creepage and clearance distance of a board design to ensure that the mounting pads of
the isolator on the printed-circuit board do not reduce this distance.
Creepage and clearance on a printed-circuit board become equal in certain cases.
Techniques such as inserting grooves and/or ribs on a printed circuit board are used to
help increase these specifications.
9.3.6.2 Insulation Characteristics
PARAMETER
DTI
VIOWM
TEST CONDITIONS
SPECIFICATION
UNIT
21
1500
VRMS
2121
VDC
VPR
2121
Method A, After Input/Output safety test subgroup 2/3,
VPR = 1.2 x VIORM, t = 10 sec,
Partial discharge < 5 pC
2545
3393
3976
VPK
VIOTM
8000
VIOSM
8000
RS
Insulation resistance
VIO = 500 V at TS
> 109
Pollution degree
UL 1577
VISO
5700
VRMS
13
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
CSA
UL
Reinforced insulation per CSA 610101-12 and IEC 61010-1 (3rd Ed.), 300
VRMS max working voltage);
Reinforced insulation per CSA 609501- 07+A1+A2 and IEC 60950-1 (2nd
Ed.), 800 VRMS max working voltage
Single Protection, 5700 VRMS
(pollution degree 2, material group I) ;
2 MOPP (Means of Patient Protection)
per CSA 60601-1:14 and IEC 60601-1
Ed. 3.1, 250 VRMS (354 VPK) max
working voltage
Certification planned
Certification planned
(1)
CQC
Certification planned
(1)
Certification planned
14
TEST CONDITIONS
Material Group
SPECIFICATION
I
I-IV
I-III
ISO5851
www.ti.com
TS
Case Temperature
TEST CONDITIONS
MIN
TYP
MAX
378
248
UNIT
mA
45
150
The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum
Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Information table is that of a device installed in the High-K Test Board for Leaded Surface-Mount
Packages. The power is the recommended maximum input voltage times the current. The junction temperature is
then the ambient temperature plus the power times the junction-to-air thermal resistance.
400
VCC1 = 3.6 V
VCC1 = 5.5 V
VCC2 - VEE2 = 30 V
350
300
250
200
150
100
50
0
0
50
100
150
Case Temperature (qC)
200
15
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
VCC2
IN+
IN-
RST
RDY
OUT
PU
PD
Low
Low
PD
PU
Low
Low
PU
PU
Low
High
Low
PU
Open
Low
Low
PU
PU
Low
High
Low
PU
PU
High
High
Low
PU
PU
High
Low
High
High
High
(1)
16
PU: Power Up (VCC1 2.25-V, VCC2 13-V), PD: Power Down (VCC1 1.7-V, VCC2 9.5-V), X: Irrelevant
ISO5851
www.ti.com
17
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
VALUE
3-V to 5.5-V
15-V to 30-V
15-V to 30-V
0-V to 15-V
Output current
2.5-A
15
VCC1
VCC2
ISO5851
10R
0.1F
3V-5.5V
15V
9,16
10
10k
10k
11
12
GND1
GND2
IN+
VEE2
IN-
DESAT
RDY
CLAMP
13
14
FLT
OUT
RST
NC
3V - 5.5V
9,16
10
1,8
1N
DDST
10k
10k
11
12
7
RG
13
14
VCC1
ISO5851
VCC2
5
1F
0.1F
GND1
GND2
IN+
VEE2
IN-
DESAT
RDY
CLAMP
FLT
OUT
RST
NC
15V
3
1F
15V
1,8
1N
DDST
7
RG
6
4
220
pF
220
pF
18
15
1F
ISO5851
www.ti.com
15
ISO5851
VCC1
0.1F
3V - 5V
9, 16
10k
GND1
10k
12
13
RDY
FLT
C
14
10
11
RST
IN+
IN-
Figure 21. FLT and RDY Pin Circuitry for High CMTI
10.2.2.3 Driving the Control Inputs
The amount of common-mode transient immunity (CMTI) can be curtailed by the capacitive coupling from the
high-voltage output circuit to the low-voltage input side of the ISO5851. For maximum CMTI performance, the
digital control inputs, IN+ and IN-, must be actively driven by standard CMOS, push-pull drive circuits. This type
of low-impedance signal source provides active drive signals that prevent unwanted switching of the ISO5851
output under extreme common-mode transient conditions. Passive drive circuits, such as open-drain
configurations using pull-up resistors, must be avoided. There is a 20 ns glitch filter which can filter a glitch up to
20 ns on IN+ or IN-.
19
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
ISO5851
VCC1
15
0.1F
3V - 5V
10k
9,16
GND1
10k
12
10k
14
10
11
VCC1
ISO5851
GND1
10k
12
RDY
13
15
0.1F
3V - 5V
9,16
C
10R
RDY
13 FLT
FLT
C
14
RST
10
IN+
11
IN-
RST
IN+
IN-
Figure 22. Local Shutdown and Reset for Noninverting (left) and Inverting Input Configuration (right)
10.2.2.5 Global-Shutdown and Reset
When configured for inverting operation, the ISO5851 can be configured to shutdown automatically in the event
of a fault condition by tying the FLT output to IN+. For high reliability drives, the open drain FLT outputs of
multiple ISO5851 devices can be wired together forming a single, common fault bus for interfacing directly to the
micro-controller. When any of the six gate drivers of a three-phase inverter detects a fault, the active low FLT
output disables all six gate drivers simultaneously; thereby, providing protection against further catastrophic
failures.
10R
15
VCC1
ISO5851
0.1F
3V - 5V
9,16
10k
10k
12
13
C
14
10
11
to other
RSTs
GND1
RDY
FLT
RST
IN+
IN-
to other
FLT s
20
ISO5851
www.ti.com
10.2.2.6 Auto-Reset
In this case, the gate control signal at IN+ is also applied to the RST input to reset the fault latch every switching
cycle. Incorrect RST makes output go low. A fault condition, however, the gate driver remains in the latched fault
state until the gate control signal changes to the 'gate low' state and resets the fault latch.
If the gate control signal is a continuous PWM signal, the fault latch will always be reset before IN+ goes high
again. This configuration protects the IGBT on a cycle by cycle basis and automatically resets before the next
'on' cycle.
10R
15
10R
ISO5851
VCC1
9, 16
10k
9, 16
GND1
10k
10k
12
13
C
14
10
11
ISO5851
VCC1
0.1F
3V - 5V
0.1F
3V - 5V
15
GND1
10k
12
RDY
13
FLT
C
RST
14
IN+
10
IN-
11
RDY
FLT
RST
IN+
IN-
Figure 24. Auto Reset for Non-inverting and Inverting Input Configuration
10.2.2.7 DESAT Pin Protection
Switching inductive loads causes large instantaneous forward voltage transients across the freewheeling diodes
of IGBTs. These transients result in large negative voltage spikes on the DESAT pin which draw substantial
current out of the device. To limit this current below damaging levels, a 100- to 1-k resistor is connected in
series with the DESAT diode.
Further protection is possible through an optional Schottky diode, whose low forward voltage assures clamping of
the DESAT input to GND2 potential at low voltage levels.
ISO5851
VCC2
GND2
VEE2
5
1F
15V
3
1F
15V
1,8
DDST
RS
DESAT
CLAMP
OUT
NC
2
7
RG
VFW-Inst
220 pF
VFW
Figure 25. DESAT Pin Protection with Series Resistor and Schottky Diode
21
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
(1)
(2)
(3)
(4)
With:
and:
then:
In comparison to POL, the actual dynamic output power under worst case condition, POL-WC, depends on a variety
of parameters:
POL-WC = 0.5 fINP QG
(VCC2
ron-max
roff-max
+
- VEE2 )
roff-max + RG
ron-max + RG
where
(5)
Once RG is determined, Equation 5 is to be used to verify whether POL-WC < POL. Figure 26 shows a simplified
output stage model for calculating POL-WC.
22
ISO5851
www.ti.com
ISO5851
VCC2
ron-max
15V
RG
OUT
QG
roff-max
8V
VEE2
(6)
+
10
2.5
+
10
(7)
Because POL-WC = 72.61 mW is below the calculated maximum of POL = 109.25 mW, the resistor value of RG =
10 is suitable for this application.
23
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
ISO5851
GND2
VEE2
DESAT
CLAMP
OUT
NC
5
1F
15V
3
1F
1,
8
2
1N
15V
DDST
7
6
rG
10
220
pF
5 V/div
CH2: DESAT
CH3: /FLT
CH3: /FLT
Time - 2 ms/div
Time - 50 ns/div
CL = 10 nF
RG = 10
VCC2 - VEE2= 23 V GND2 - VEE2 = 8 V
CL = 1 nF
RG = 0
VCC2 - VEE2 = VCC2 - GND2 = 20 V
Figure 28. OUT Transient Waveform
24
CH1: OUT
CH2: DESAT
10 V/div
3 V/div
CH1: OUT
ISO5851
www.ti.com
12 Layout
12.1 Layout Guidelines
A minimum of four layers is required to accomplish a low EMI PCB design (see Figure 30). Layer stacking should
be in the following order (top-to-bottom): high-current or sensitive signal layer, ground plane, power plane and
low-frequency signal layer.
Routing the high-current or sensitive traces on the top layer avoids the use of vias (and the introduction of
their inductances) and allows for clean interconnects between the gate driver and the microcontroller and
power transistors. Gate driver control input, Gate driver output OUT and DESAT should be routed in the top
layer.
Placing a solid ground plane next to the sensitive signal layer provides an excellent low-inductance path for
the return current flow. On the driver side, use GND2 as the ground plane.
Placing the power plane next to the ground plane creates additional high-frequency bypass capacitance of
approximately 100 pF/inch2. On the gate-driver VEE2 and VCC2 can be used as power planes. They can share
the same layer on the PCB as long as they are not connected together.
Routing the slower speed control signals on the bottom layer allows for greater flexibility as these signal links
usually have margin to tolerate discontinuities such as vias.
For more detailed layout recommendations, including placement of capacitors, impact of vias, reference planes,
routing etc. see Application Note SLLA284, Digital Isolator Design Guide.
Keep this
space free
from planes,
traces , pads,
and vias
FR-4
0r ~ 4.5
Power plane
10 mils
Low-speed traces
25
ISO5851
SLLSEN5A JUNE 2015 REVISED JUNE 2015
www.ti.com
13.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
26
PACKAGE OUTLINE
DW0016B
SOIC
PIN 1 ID
AREA
10.63
TYP
9.97
SEATING PLANE
0.1 C
16
14X 1.27
2X
8.89
10.5
10.1
NOTE 3
9
B
7.6
7.4
NOTE 4
0.51
0.31
0.25
C A
16X
2.65 MAX
0.38
TYP
0.25
SEE DETAIL A
0.25
GAGE PLANE
0.3
0.1
0 -8
1.27
0.40
(1.4)
DETAIL A
TYPICAL
4221009/A 08/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
5. Reference JEDEC registration MO-013, variation AA.
www.ti.com
DW0016B
SYMM
16X (2)
1
SYMM
16X (1.65)
SEE
DETAILS
SEE
DETAILS
16
16
16X (0.6)
16X (0.6)
SYMM
SYMM
14X (1.27)
14X (1.27)
9
8
(9.75)
(9.3)
HV / ISOLATION OPTION
8.1 mm CLEARANCE/CREEPAGE
IPC-7351 NOMINAL
7.3 mm CLEARANCE/CREEPAGE
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
DW0016B
SYMM
16X (2)
SYMM
16X (1.65)
16
16X (0.6)
16
16X (0.6)
SYMM
SYMM
14X (1.27)
14X (1.27)
9
8
(9.3)
(9.75)
IPC-7351 NOMINAL
7.3 mm CLEARANCE/CREEPAGE
HV / ISOLATION OPTION
8.1 mm CLEARANCE/CREEPAGE
4221009/A 08/2013
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
www.ti.com
30-Jun-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
ISO5851DW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
ISO5851
ISO5851DWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
ISO5851
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
www.ti.com
30-Jun-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
30-Jun-2015
Device
ISO5851DWR
DW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
10.75
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
10.7
2.7
12.0
16.0
Q1
30-Jun-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ISO5851DWR
SOIC
DW
16
2000
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TIs goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
www.ti.com/automotive
Amplifiers
amplifier.ti.com
www.ti.com/communications
Data Converters
dataconverter.ti.com
www.ti.com/computers
DLP Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
www.ti.com/energy
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
www.ti.com/video
RFID
www.ti-rfid.com
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright 2015, Texas Instruments Incorporated