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Analysis of the wire-drawing process with friction and thermal conditions obtained by
inverse engineering
--Manuscript Draft-Manuscript Number:
J2011-1725R1
Full Title:
Analysis of the wire-drawing process with friction and thermal conditions obtained by
inverse engineering
Article Type:
Original Paper
Keywords:
Corresponding Author:
Sogang University
Changsun Moon
Changsun Moon
Naksoo Kim, Ph.D.
Response to Reviewers:
1. Reviewer #1: There are English mistakes even in the first line of the abstract.
In the cold wire-drawing process, although performed at room temperature, heat is
generated due to plastic work ant friction at the workpiece-die interface.
The word ant was changed to and.
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Analysis of the wiredrawing process with friction and thermal conditions obtained
by inverse engineering
Changsun Moon1, Naksoo Kim1*
1
(Manuscript Received 000 0, 2009; Revised 000 0, 2009; Accepted 000 0, 2009) -please leave blank
----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Abstract
In the cold wire-drawing process, although performed at room temperature, heat is generated due to plastic work and friction at the
workpiece-die interface. The temperature distribution in both the workpiece and the die affects thermal expansion, deformation
pattern, and elastic recovery, resulting in the final dimension of drawn products. We proposed inverse engineering procedures to
determine the friction and thermal conditions by comparing simple measurements with computation results of the drawing power
and temperature changes of the die. The conditions were then used to simulate numerically the deformation behavior of wire and
the temperature distribution in the die. Thermal effects on the quality of drawn products were investigated based on the prediction
of the final dimensions of the products. It is concluded that thermal effects should not be ignored even in the cold wire-drawing
process and reasonable numerical results were acquired in comparison with experiments.
Keywords: Wire-drawing; Dimensional change; Quality of drawn product; Friction condition; Thermal condition; Inverse Engineering
----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
1. Introduction
In the wiredrawing process, the diameter of a wire is
reduced by pulling it through a conical die. The major
variables in the drawing process are the reduction ratio,
die angle, friction at the interface of wire and die, and
drawing velocity. Plastic deformation of the wire and
heat generated due to the friction between the wire and
die raise the temperature of die, resulting in thermal expansion of the die. The trend of using high speeds in the
wiredrawing process to meet the demands for increased
productivity is often difficult to manufacture the drawn
products as a designated diameter because of the uncontrolled thermal expansion of the die. The magnitude and
the distribution of temperature in the wire and die depend
on the initial temperatures, heat generation due to plastic
deformation of the wire and friction at the wiredie interface, and heat transfer between the deforming wire, the
die, and the surrounding environment, such as lubricant
This paper was recommended for publication in revised form by Associate Editor
000 000-please leave blank.
*
Corresponding author. Tel.: +82 2 705 8635, Fax.: +82 2 712 0799
E-mail address: nskim@sogang.ac.kr
KSME & Springer 2010
and air.
Heat generation in the wiredrawing process was first
studied by Siebel and Kobitzsch[1]. In their analysis, the
plastic deformation work per unit volume was simply
added to the frictional work and both of them were converted to heat. Snidle further expanded the theory of Siebel and Kobitzsch in that the acceleration of the wire as it
passes through the die is considered [2]. Lucca and
Wright discussed the assumptions which might be taken
into consideration in predicting the temperature rise resulting from frictional heating in the wire-drawing [3].
They mentioned that the coefficient of friction at the
wiredie interface can be assumed to be constant and
independent of pressure and temperature. They also reported that the frictional heating was concentrated on the
interface between the wire and die, resulting in a severe
temperature gradient.
There are many process variables, other than heat from
the drawing process, that affect the quality of drawn
products. U.S. Dixit and P.M. Dixit studied the effect of
process variables such as the reduction ratio, the die
semiangle, and the coefficient of friction of the interface
on the quality of drawn product [4]. Castro et al. analyzed
the effect of the dies semiangle on the mechanical
0000
To minimize the drawing force, they determined the reduction ratio and the coefficient of friction between the
wire and die. Shinohara and Yoshida carried out multi
pass drawing of the stainless steel wire with an artificial
crack, and investigated growth and disappearance of a
crack from both sides by experiments and the finite element analysis(FEA) [19]. Komori presented a new equation that denotes a change in the void volume fraction so
that the fracture defects in highcarbon steel wire could
be investigated [20]. McAllen and Pheland analyzed ductile fracture initiation and propagation by central bursting in 2011 Aluminium wire, and the damage incurred
before the ductile fracture was analyzed using the modified damage model [21].
Because a temperature rise in the die affects the lubricating condition, equipment life, and quality of the drawn
products, it is crucial to accurately predict the temperature distribution in the die. The previous studies on the
temperature and products in the wiredrawing process
primarily address the dies temperature rise as result of
the deformation and frictional heating generated as the
wire passes through the die; they also discuss the temperature rise due to the process variables such as the reduction ratio, reduction angle, and drawing velocity. In contrast, there is no information available about FEA procedures for conducting a practical analysis of the temperature distribution in the die that considers the friction condition and heat transfer to the surroundings, such as air.
This study tries to propose procedures to utilize the
measured drawing power and temperature curves of the
die at a certain position in determining the friction and
thermal conditions by inverse engineering. The process
variables obtained reasonably will be, in turn, used to
numerically simulate the deformation behavior of the
workpiece and die temperature distribution by FEA. Then
it is expected that the effect of the temperature distribution on the final dimension or the quality of drawn products can be investigated.
2. Drawing conditions
2.1 Process parameters
The dimensions of tooling used in the wire-drawing
process are illustrated schematically in Fig. 1. As shown
in Fig. 1(a), the inlet and the outlet diameters of the die
are D0 =10 mm and D f =8.1 mm, respectively; the
height of the die and case assembly (h) is 30.95mm and
the width of the case (w) is 35mm. The wire, die and case
were made of S45CS, WC, and AISIH13, respectively.
Fig. 1(b) shows the die geometry. The parameters that
define the die geometry include the back relief angle,
reduction angle, entrance angle, and bearing length.
Fig. 2 shows the flow stress of S45CS at 20 C and
200 C . Table 1 displays the thermal properties of the
1263
S45CS
Heat conductivity( W / mK )
51.9
Heat capacity( J / mmK )
0.486
Thermal Expansion coefficient 1.397e-05
( 1/ K )
WC
59
15
5e-05
AISIH13
24
2.7
1.17e-05
2.2 Experiments
In the wiredrawing process, wires are pulled through a
die at a consistent drawing velocity. Friction acts on the
interface between the wire and die, disrupting the relative
motion of the wire. The drawing force will differ, depending on the magnitude of the friction. To estimate the
friction stress, we will use a simple friction model of
constant friction factor. The friction stress in the actual
process can be determined inversely by measuring the
drawing power using the drawing equipment [22]. The
drawing power was measured by wire rolling gauge behind the die. The drawing powers were measured with
several combinations of the diameter of the wires, the
inner diameter of the die, and the reduction ratio. Fig.
3(a) contains the schematic diagram illustrating the measurement of temperature on the die in the wiredrawing
process. A thermocouple was installed to measure the die
temperature at a certain position. For approximately 4,000
seconds, the wire was pulled through a die and the temperature at a specific position was recorded. Fig. 3(b) shows the
temperature curve measured for 4,000 seconds; the temperature reached as high as 107.4 C during the wire
drawing process.
(a)
(a)
(b)
Fig. 1. (a) Schematic outline of the model used in experiments and
FEA and (b) parameters defining the die geometry
(b)
Fig. 3. Measurement of the die temperature during the wire drawing
process: (a) experimental setup; (b) temperature transition at channel 1
0000
(1)
Fdrawing d Af
(2)
d Y0 2(1
m
R 2
)ln 0 tan
sin 2
Rf 3
(3)
If we measure the drawing power Pdrawing at constant Vdrawing velocity , the drawing stress, d can be easily
estimated using Eqs. (1) and (2). Ideally, the friction factor m is calculated by Eq. (3). But since Eq. (3) does
not consider excessive or redundant deformation and
ignores temperature effects on the yield stress Y0 , it is
expected that the estimated value of friction factor using
Eq. (3) will be far from the actual one.
We measured the drawing powers for three cases with
the same materials and the same condition of lubrications
except having different geometrical dimensions, like the
diameter of the wire, the inner diameter of the die, and
the reduction ratio, as summarized in Table 2. We can
f
(4)
1265
Df
CASE
(mm)
(mm)
CASE 1
10
8.1
CASE 2
12
10
CASE 3
14
13
V
(mm/s)
916
mf
P(kw)
(Experiment)
F(N)
(Experiment)
Eq. (3)
F(N)
(FEA)
Differences (%)
(Experiment vs FEA)
25,565
27,904
0.086
28,298
1.3
35,214
38,437
0.093
38,309
0.3
30,563
33,366
0.091
32,725
1.9
Average
1.2
(a)
(b)
Fig. 4. (a) Temperature distribution of dies after 2.25sec and (b)
temperature curves of node 1, 2, and 3
The convective heat transfer coefficient ( h1 ) is between 0.02~0.025 kW / m2 K when in contact with air
of 1 atmosphere pressure; it was assumed to have the
value of 0.025 kW / m 2 K [24, 25].
As shown in Fig. 6, a simple method was used to determine hlub . Fig. 6(a) is a oneobject model with two
different materials, and Fig. 6(b) is a twoobject model
with two different materials. As shown in 6(a), the
model was heated at a certain temperature and the
temperature at a certain position was measured. The
model in Fig. 6(b) was heated at the same temperature
as the model in Fig. 6(a) but hlub was changed to
compare the temperature curve of the models in Fig.
6(a) and (b). As can be seen in Fig. 6(c), the temperature curves coincide with that of one-object model for
hlub over 10 kW / m2 K , and thus it is reasonable to
assume that hlub of 10 kW / m 2 K is applicable.
0000
(a)
(b)
(c)
Fig. 6. Two models and effects of interfacial heat transfer coefficient: (a) One-object model, (b) two-object model, and (c) temperature
curves with different hlub values
2
c 1,142,818hlub1
18,480h12 235,274 hlub1
(5)
0000
hlub1 ( kW / m K )
2
h1 ( kW / m K )
Initial value
Level 0
Level 1
Level 2
0.101
0.100
0.101
0.102
0.025
0.020
0.025
0.030
(a)
(b)
Fig. 8. Measurement method for the dimensional change: (a)
experiment; (b) FEA
CASE
CASE 1-1
CASE 1-2
CASE 1-3
D0
Df
(mm)
(mm)
(mm)
L
(mm)
( )
10
8.1
0
2.4
2.4
3.645
3.645
5.265
12
5. Conclusions
The procedures of inverse engineering to determine the
friction and thermal conditions in the wire-drawing
process are proposed by measuring the drawing force and
the transition curve of temperature at a certain position of
the die assembly. The analysis tool used in inverse engineering was a commercial finite element analysis program based on elastic-plastic deformation and coupled
heat transfer algorithm. Based on the close investigations
on the comparisons of the computation results with measurements obtained in experiments, the followings are
concluded:
(1) With the determined friction factor via inverse engineering, the computed drawing forces showed strong
correlation. Also with the determined thermal conditions or the heat transfer coefficients, we obtained
close temperature curves to experiments. Therefore
the procedures and methodology of inverse engineering to determine the friction and thermal conditions is
reasonable. Moreover, since the measurements include the drawing force and temperature monitoring
at a convenient position, it is simple and useful to be
applied in reality.
(2) The computed dimensional changes considering
thermal effect was much closer to measurements than
those without considering thermal effect. It means
that the simulation of the cold wire-drawing process
with FEA always should consider thermal effect. Correct values of the friction and thermal conditions
should be used to yield reliable computation results.
( )
0
6
6
Dimensional changes(mm),
(Deviation from measurement, %)
ExperiFEA with therIsothermal
ment
mal effect
FEA
0.009
0.008(11%)
0.011(25%)
0.013
0.011(15%)
0.015(18%)
0.010
0.009(10%)
0.012(22%)
Acknowledgements
We would like to thank to the members of instrumentation and control team in Dongbu steel Co. Ltd. for their
supporting the research. This work was also supported by
the National Research Foundation of Korea(NRF) grant
funded by the Korea government(MEST) (No. 2010
0023152) and Sogang university research program with a
Grant No. 201010042.01.
1263
0000
Nomenclature
d : Drawing stress
Y0
: Yield stress
m f : Friction factor
R0
Rf
Re
: Reduction ratio
D0
Df
Af
F
P
: Drawing force
: Power
V
: Drawing velocity
Eerror : Averageerror
h1
References
[1] E. Siebel and R. Kobitzsch, Die Erwarmung des Ziehgutes beim Drahtziehen. Stahl U. Eisen, (63) (1943) 110
113.
[2] R. W. Snidle, Contribution on the theory of frictional
heating and the distribution of temperature in wire and strip
drawing. Wear, (44) (1977) 279294.
[3] D. A. Lucca and R. N. Wright, Heating effect in the
drawing of wire and strip under hydrodynamic lubrication
conditions. Journal of Manufacturing Science and Engineering, (188) (1996) 628638.
[4] U. S. Dixit and P. M. Dixit, An analysis of the steadystate wire drawing of strain-hardening materials. Journal of
Materials Processing Technology, (47) (1995) 201229.
[5] A. L. R. de Castro, H. B. Campos, and P. R. Cetlin, Influence of die semi-angle on mechanical properties of single
and multiple pass drawn copper. Journal of Materials
Processing Technology, (60) (1996) 179182.
[6] S. Norasethasopon and K. Yoshida, Influences of inclusion shape and size in drawing of copper shaped-wire. Journal of Materials Processing Technology, (172) (2006) 400
406.
[7] G. Vega, A. Haddi, and A. Imad, Temperature effects on
wire-drawing process: experimental investigation. International Journal of Material Forming, (2) (2009) Suppl 1:229
232.
[8] D. K. Leu, Evaluation of friction coefficient using simplified deformation model of plastic hemispherical contact
with a rigid flat. Journal of Mechanical Science and Technology, (24) (2010) 16971707.
[9] J. S. Ajiboye, K. H. Jung, and Y. T. Im, Sensitivity study
of frictional behavior by dimensional analysis in cold forg-
1263
0000
0000
Table list:
Table 1. Thermal property of selected materials
Material
S45CS
WC
Heat conductivity( W / mK )
51.9
Heat capacity( J / mmK )
0.486
Thermal Expansion coefficient 1.397e-05
( 1/ K )
59
15
5e-05
AISIH13
24
2.7
1.17e-05
Table 2. Friction factors calculated by Eq. (3) and a comparison of the drawing force between the experiments and FEA ( m f 0.1765 )
D0
Df
CASE
(mm)
(mm)
CASE 1
10
8.1
CASE 2
12
10
CASE 3
14
13
V
(mm/s)
916
mf
P(kw)
(Experiment)
F(N)
(Experiment)
Eq. (3)
F(N)
(FEA)
Differences (%)
(Experiment vs FEA)
25,565
27,904
0.086
28,298
1.3
35,214
38,437
0.093
38,309
0.3
30,563
33,366
0.091
32,725
1.9
Average
1.2
Initial value
Level 0
Level 1
Level 2
hlub1 ( kW / m2 K )
0.101
0.100
0.101
0.102
0.025
0.020
0.025
0.030
h1 ( kW / m2 K )
hlub1 ( kW / m2 K )
Object
function
h1 ( kW / m2 K )
0.100
0.100
0.100
0.101
0.101
0.101
0.102
0.102
0.102
Area( mm2 )
393,927
392,099
390,296
389,404
382,639
380,947
379,276
378,449
372,160
0.020
0.025
0.030
0.020
0.025
0.030
0.020
0.025
0.030
Error (%)
3.40
2.92
2.45
2.22
0.44
0.0007
0.43
0.65
2.30
CASE
CASE 1-1
CASE 1-2
CASE 1-3
(mm)
L
(mm)
( )
0
2.4
2.4
3.645
3.645
5.265
12
D0
Df
(mm)
(mm)
8.1
10
( )
0
6
6
Dimensional changes(mm),
(Deviation from measurement, %)
ExperiFEA with thermal
Isothermal FEA
ment
effect
0.009
0.008(11%)
0.011(25%)
0.013
0.011(15%)
0.015(18%)
0.010
0.009(10%)
0.012(22%)
Figure list:
(a)
(b)
Fig. 1. (a) Schematic outline of the model used in experiments and FEA and (b) parameters defining the die geometry
1263
0000
(a)
(b)
Fig. 3. Measurement of the die temperature during the wire drawing process: (a) experimental setup; (b) temperature transition at channel 1
(a)
(b)
Fig. 4. (a) Temperature distribution of dies after 2.25sec and (b) temperature curves of node 1, 2, and 3
0000
(a)
(b)
(c)
Fig. 6. Two models and effects of interfacial heat transfer coefficient: (a) One-object model, (b) two-object model, and (c) temperature curves
with different hlub values
0000
(a)
(b)
Fig. 8. Measurement method for the dimensional change: (a) experiment; (b) FEA