Finite Element Analysis of

MEMS
Balaji VRT

Introduction to MEMS
Micro-electromechanical systems (MEMS) is a technology that
combines computers with tiny mechanical devices such as sensors,
valves, gears, mirrors, and actuators embedded in semiconductor
chips.

Courtesy: Poonwil1 - Own work, CC BY-SA 3.0,

https://commons.wikimedia.org/w/index.php?curid=23260794

Introduction to FEA
Architecture Design

Basic Architecture
Interface Architecture

Feasibility analysis

Architecture Feasibility
Interface Feasibility
Environmental feasibility

Engineering Design

Various parts, features

Part Interface
Subassembly interface
Drawing to manufacture

Introduction to FEA

How can the FEM Help the Design Engineer?

Easily applied to
complex, irregularshaped objects
Applicable to
composed
steady-state, time
of several different dependent and
eigenvalue
materials and
problems.
having complex
boundary
conditions.

Applicable to
linear and
nonlinear
problems.

Can solve a wide

variety of
problems

General-purpose
FEM software
packages are
available

Can be coupled to
CAD programs to
facilitate solid
modeling and
mesh generation

Discretization
Complicated shapes to simplified primitive shapes
Follow continuum
Simply put, the various points of the structure can be
converted to closely placed points connected by
these primitive shaped ELEMENTS.
Formulating these elements to ensure continuum of
the degree required for the purpose

Need for FEM in Microsystems and MEMS

Development of micro systems takes between four and ten years
A lot of products or product ideas will never be produced
No sufficient tool support available
Traditional design methods take a long time and cost intensive
New methods and tools necessary
FEA is one of the tools that can be effectively used for MEMS /Micro
system design

Behavioural
Structural
Processors
Hardware modules
ALUs, Registers
Gates
Transistors

System
Algorithm
Register transfer
Boolean expressions
Differential equations

Physical/
Geometrical
Boards, Complete
Systems
MCMs, hybrids
Floor Plans
Cells, Modules
Polygons

MEMS Process

General MEMS Process

MEMS Require Multi Physics solutions

Out
In

Thermal

Electrical

Thermal

Electrical

Electromagnetic

Mechanical

Heat conduction

Seeback effect,
Pyroelectricity

Radioactive heat
transport

Thermal Expansion

Joule Heating, Peltier Electrical Conduction,

Optical recombination
Effect
Polarization

Piezo electricity

Electromagnetic

Eddy Current heating,

radiation heat loss

Optical carrier
generation

Induction EM waves

Radiation pressure

Mechanical

Friction

Piezo-resistance

Photo Elasticity

Transfer forces

Micro tools for Surgery

Microneedles
Formulation systems
Implantable systems

Stent implant
Stent implant procedure is a widely used procedure that is performed
for patients with cardiovascular disease. The procedure involves
inserting a balloon into your heart to open the heart artery narrowed
by plaque. It also involve placement of a stent to keep the vessel
open.

Stent Implant procedure

An invasive procedure that starts with an angiography test to
determine the number and exact location of blockages
Stents are inserted through a catheter to the treatment site in the
coronary artery

Stent Implant procedure

An invasive procedure that starts with an angiography test to determine the
number and exact location of blockages
Stents are inserted through a catheter to the treatment site in the coronary
artery
A tiny deflated balloon is then inserted inside the blockage and once inside, will
be inflated
Another tiny deflated balloon with a stent mounted on it will be inserted to the
blockage. The balloon will be inflated and it will expand the stent that surrounds
it.
Most people are able to return to work and their normal routines after about a
week from the procedure. Stents help prevent arteries from becoming narrow or
blocked again in the months or years after angioplasty. However, making lifestyle
changes can help prevent plaque/fatty material from building up in arteries again

Basic simulations on Stents

FEA on Other MEMS

Structural analysis of membrane deformation

Deflection of the 1 mm x 1 mm silicon membrane is

predicted by structural analysis.

Voltage distribution of a simple four terminal

sensor under uniaxial stress

Piezoresistive Pressure Sensor

MPX100 series pressure sensors originally produced by the semiconductor products division of
Motorola Inc

Model geometry.

Detail showing the piezoresistor geometry

Diaphragm displacement as a result of a 100

kPa applied pressure.

Shear stress, shown in the local co-ordinate system of the

piezoresistor (rotated 45 about the z-axis of the global system).
The shear stress is has its highest magnitude close to the
piezoresistor with a value of approximately -35 MPa.

Arrows: Current density, Contours: Electric Potential, for a

device driven by a 3 V bias with an applied pressure of 100 kPa.

Difference in FEA of Micro and Macro scale products

Analysis procedure remains same
Approach and Methodologies Varies
Non Standard testing methodologies
Non Standard specimen Dimensions
Non Standard FEA verification methods

Conclusion
Simulation is important ingredient of MEMS
FEM is a Useful Simulation tool in the MEMS Design Process
Most MEMS Structures can be modeled as rods, beams or plates
The DOFS can be displacements, Velocities, Electric field, Magnetic
field, Temperature etc.
Optimization coupled with FEM model helps to obtain the optimum
design