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This Report Is Submitted In Partial Fulfillment Of The Requirement For The Award Of
Bachelor Of Electronic Engineering (Computer Engineering)
With Honours
May 2011
Tajuk Projek
Sesi
Pengajian
2010/2011
3.
Perpustakaan dibenarkan membuat salinan laporan ini sebagai bahan pertukaran antara
institusi pengajian tinggi.
4.
Sila tandakan ( ) :
SULIT*
TERHAD*
TIDAK TERHAD
Disahkan oleh:
__________________________
(TANDATANGAN PENULIS)
___________________________________
(COP DAN TANDATANGAN PENYELIA)
Tarikh: ..
Tarikh: ..
iii
a
I hereby declare that this report is the result of my own work except for quotes as cited
in the references.
Singnature
:..
Author
:.
Date
:..
iv
I hereby declare that I have read this report and in my opinion this report is sufficient in
terms of the scope and quality for the award of Bachelor of Electronic Engineering
(Computer Engineering) With Honours.
Signature
:..
Supervisors Name
:.
Date
:..
vi
ACKNOWLEDGEMENT
In the name of Allah S.W.T, the most Merciful and the most Gracious
vii
ABSTRACT
viii
ABSTRAK
ix
TABLE OF CONTENTS
CHAPTER
CONTENT
PAGE
DECLARATION
iii
DEDICATION
iv
ACKNOWLEDGEMENTS
vi
ABSTRACT
vii
ABSTRAK
viii
TABLE OF CONTENTS
ix
LIST OF TABLES
xii
LIST OF FIGURES
xiii
LIST OF ABBREVIATIONS
xv
LIST OF APPENDIX
xvi
INTRODUCTION
1.1
Project Overview
1.2
Problem Statement
1.3
Objectives
1.4
Scope
1.5
Project Outline
II
LITERATURE REVIEW
2.1
Introduction
2.2
Microstrip Line
2.2.1
2.2.2
2.2.3
Substrate Materials
2.2.4
Applications
2.2.5
2.2.6
Microstrip Couplers
10
13
III
Filter
13
14
2.3.1
Filter Circuits
14
2.3.2
Filters Technologies
17
2.4
Parallel-Coupled Filters
19
2.5
Filter Loss
21
2.5.1
Insertion Loss
21
2.5.2
Return Loss
21
2.6
Microwave Board
22
PROJECT METHADOLOGY
3.1
Introduction
23
3.2
Overview of Procedure
23
3.3
24
3.3.1
24
3.4
Design
Project Development
26
xi
IV
VI
3.4.1
Simulation
26
3.4.2
Fabrication
26
3.4.3
Testing
27
Design Specification
28
4.2
Calculation
29
4.3
Simulation
35
4.4
Fabrication
41
Introduction
47
5.2
47
5.3
Discussions
50
Conclusion
52
6.2
Future Work
52
REFERENCES
xii
LIST OF TABLES
TABLE NO.
TITLE
PAGE
2.2.7 (i)
13
2.2.7 (ii)
13
2.6
22
4.1 (i)
28
4.2 (ii)
32
4.2 (iii)
33
4.2 (iii)
34
5.2 (i)
49
5.2 (ii)
50
xiii
LIST OF FIGURES
FIGURE NO.
TITLE
PAGE
2.2.1
2.2.2
2.2.5
2.2.6 (i)
11
2.2.6 (ii)
11
2.2.6 (iii)
12
2.3.1(i)
15
2.3.1(ii)
16
2.3.1(iii)
Bandpass filter
16
2.31(iv)
17
2.4(i)
2.4 (ii)
20
21
2.5.2
23
3.3
24
3.3.1
25
4.2(i)
Fractional Bandwidth
29
4.2(ii)
30
4.2(iii)
30
4.2(iv)
31
xiv
4.2(vi)
34
4.3(i)
36
4.3 (ii)
36
4.3 (iii)
37
4.3 (iv)
37
4.3 (v)
38
4.3 (vi)
38
4.3 (vii)
39
4.3(viii)
40
4.3 (ix)
40
4.4(i)
41
4.4(ii)
42
4.4(iii)
56
4.4(iv)
56
4.4(v)T
he etching process
57
4.4(vi)
59
4.4(vii)
59
4.4(viii)
59
4.4(ix)
60
4.4(x)
60
xv
LIST OF ABBREVIATIONS
LPF
Lowpass filter
BPF
Bandpass filter
BSF
Bandstop filter
IL
Insertion loss
RT
Return loss
BW
Bandwidth
PCB
I/O
Input/output
Zo
High impedence
Zoo
Z odd
Zoe
Z even
ADS
dB
Decibel
Dielectric constant
Dielectric substrate
SIW
TEM
Transverse electromagnetic
NEMA
FR
Fire resistant
HFSS
Number of element
xvi
LIST OF APPENDICES
APPENDIX
TITLE
PAGE
61
62
63
(N=1 to10)
CHAPTER I
INTRODUCTION
1.1
Project Overview
This project will develop a bandpass filter using planar couple microstrip lines.
Using Advance Design System (ADS) the planar couple will be design and then
determine the best specs refer to simplicity in fabricating. The planar couple will be
simulate, fabricate and tested.
Filters are essential in the RF front end of microwave wireless communication
system. In planar microstrip and stripline realization, one of the most common
implementation methods for bandpass and bandstop filters with required bandwidths up
to a 40% of central frequency is to use a cascade of parallel coupled sections.
The synthesis procedure which consists of the design equation for the coupled
line physical parameters (space-gap between parallel lines, line widths and lengths) is
easy and can be found in any classical microwave books. Based on this, a well defined
systematic procedure, for the required parallel coupled microstrip filter physical
parameters can be easily derived for both Butterworth and Chebyshev response of any
order. The filter can be fabricated easily and it exhibits reasonably good performance
compared with other planar circuit filters.
Although parallel coupled bandpass microstrip filter is very popular and simple,
the traditional design does suffer from a fundamental limitation, namely, the presence of
spurious response at twice the basic passbands at the design frequency.
1.2
Problem Statement
Microstrip is a cheaper, reliable and easy to connect with the other planar device.
1.3
Objectives
The objectives of this project are:
i.
To design, develop and test a bandpass filter using microstrip planar couple
lines.
ii.
1.4
Scope
The scope of this project is to design microstrip parallel coupled bandpass filter
using Advanced Design System (ADS) 2008 software, matching to 50 microstrip line
parallel coupled and analysis of insertion loss and return loss using Chebyshev response
characteristic with passband ripple of 0.5dB between the passband frequencies of
8.5GHz and 9.5GHz. The frequency is operate in X band range between 8GHz to
12GHz. This project will involve simulation and fabrication of microstrip bandpass
filter. The design will be fabricate on FR4 board with dielectric constant is 4.7. After
that it will be compare with regtangular waveguide bandpass and SIW bandpass filter.
1.5
Project Outline
This thesis comprises of six chapters. The first chapter briefly discusses the
overviews about the project such as introduction, objectives, problem statements and
scope of this project.
Chapter 2 describes about the research and information about the project. Every
facts and information, which found through by any references had been selected. This
literature review has been explained about the planar couple microstrip lines.
Chapter 3 will discuss about the project methodology used in this project such as
calculation, simulation, fabrication and testing. All these methodology should be
followed for a better performance.
Chapter 4, describe about the discussion and project finding such as the result
and analysis. The result is presented by calculation. All the initial simulation results of
planar couple microstrip line and collected data are documented using the table and
discussed it. This is including the graphs that have obtained during the simulation.
Chapter five describe about expected result and the comparison results between
simulation and measurement.
Finally the conclusion has been made and recommendation for the future works.
The recommendation is added to give an opinion and also an improvement on how the
future works should have done.
CHAPTER II
LITERATURE REVIEW
2.1
Introduction
This chapter gives a literature review and information relating to the microstrip
design with the basic information related to this project and the design formulas for
calculating.
2.2
Microstrip Line
2.2.1
5
microstrip transmission line, the track on top of the substrate will serve as a "hot"
conductor, whereas the backplane on the bottom serves as a "return" conductor.
Microstrip can therefore be considered a variant of a two wire transmission line [1].
Metallic Strip
Dielectric substrate
Ground Plane
2.2.2
If one solves the electromagnetic equations to find the field distributions, one
will tend to find very nearly a completely TEM (transverse electromagnetic) pattern.
This means that there are only a few regions in which there is a component of electric or
magnetic field in the direction of wave propagation. The field pattern is commonly
referred to as a Quasi-TEM pattern. Shown in figure 2.2.2 is the electromagnetic field
pattern of the basic microstrip transmission line.
Magnetic Field
Electric Field
7
is observed, which gives rise to a longitudinal magnetic field component from the
second Maxwell's equation, curl E = - dB/dt. Since some of the electric energy is stored
in the air and some in the dielectric, the effective dielectric constant for the waves on the
transmission line will lie somewhere between that of the air and that of the dielectric.
Typically the effective dielectric constant will be 50-85% of the substrate dielectric
constant. Since the microstrip structure is not uniform, it will support the quasi-TEM
mode [2].
2.2.3
Substrate Materials
ii.
iii.
iv.
v.
The cost
vi.
vii.
viii.
ix.
x.
Since the substrate dimensions and dielectric constant are functions of substrate
temperature, the operating temperature range becomes an important property in the
design of any microstrip filter. In addition, the dielectric constant and loss tangent are
also functions of frequency. As for a physical property which is important in fabrication
8
of the filter, they are resistance to chemicals, tensile and structural strengths, flexibility,
machinability, impact resistance, strain relief, formability, bondability and substrate
characteristic s when clad. Generally, there are two types of substrates used: soft and
hard substrates [2]. Soft substrates are flexible, cheap and can be fabricated easily.
However, it possesses higher thermal expansion coefficients. Typical examples of soft
substrates are RT Duriod 5870 (r = 2.3), RT Duriod 5880 (r = 2.2) and RT Duriod
6010.5 (r = 10.5). As for hard substrates, it has better reliability and lower thermal
expansion coefficients. On the other hand, it is more expensive and non-flexible. Typical
examples of hard substrates are quartz (r = 3.8), alumina (r = 9.7), sapphire (r = 11.7)
and Gallium Arsenide GaAs (r = 12.3).
Normally, thick substrates with low dielectric constants are often used as it
provides better efficiency, larger bandwidth and loosely bound fields for radiation into
space. However, it would also result in a larger filter size. On the other hand, using thin
substrates with higher dielectric constants would result in smaller filter size. The
drawbacks are that it is less efficient and has relatively smaller bandwidths. Therefore,
there must be a design trade-off between the filter size and good filter performance.
2.2.4
Applications
Due to the fact that most present-day systems demand for small size, lightweight
and low cost the employment of microstrip technology arises extensively over the years.
Microstrip are particularly suited to those applications where low profile because it can
conform to a given shape easily. Shown below are some typical system applications
which employ microstrip technology [8]:
i.
Satellite communications
ii.
iii.
Radio altimeter
iv.