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SEMICONDUCTOR
RoHS
RoHS
FRED
Ultrafast Soft Recovery Diode, 2 x 10 A
FEATURES
Ultrafast recovery
Ultrasoft recovery
Very low l RRM
Very low Q rr
Specified at operating conditions
Designed and qualified for industrial level
BENEFITS
Reduced RFI and EMI
Reduced power loss in diode
and switching transistor.
Higher frequency operation
Reduced snubbing
Reduced parts count
TO-3PB
common
cathode
2
APPLICATIONS
Switching mode power supplies
UPS
DC/DC converters
Free wheeling diodes
Inverters
Motor drives
1
Anode
1
2
Common
cathode
3
Anode
2
DESCRIPTION
D92-02 is a state of the art center tap ultrafast
recovery diode. Employing the latest in epitaxial
construction and advanced processing techniques
it features a superb combination of characteristics
which result in performance which is unsurpassed
by any rectifier previously available. With basic
ratings of 200V and 10 A per leg continuous current,
the D92-02 is especially well suited for use as the
companion diode for IGBTs and MOSFETs. The FRED
features combine to offer designers a rectifier with
lower noise and significantly lower switching losses
in both the diode and the switching transistor. These
FRED advantages can help to significantly reduce
snubbing, component count and heatsink sizes.
PRODUCT SUMMARY
VR
200 V
VF at 10A at 25 C
0.95 V
IF(AV)
2 x 10 A
trr (typical)
35 ns
TJ (maximum)
150 C
Qrr (typical)
25 nC
lRRM (typical)
1.9 A
PARAMETER
Cathode to anode voltage
TEST CONDITIONS
VR
per leg
per device
VALUES
UNIT
200
10
IF
50Hz square
wave duty = , T C =115C
20
l FSM
100
l FRM
40
T J , T Stg
- 55 to + 150
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Page 1 of 5
N-D92-02
SEMICONDUCTOR
RoHS
RoHS
Cathode to anode
breakdown voltage
SYMBOL
VFM
IRM
Junction capacitance
CT
Series inductance
LS
UNIT
MIN.
TYP.
MAX.
200
IF = 10 A
0.9
0.95
IF = 20 A
IF = 10 A, TJ = 125 C
0.8
V R = V R rated
15
T J = 125C, V R = V R rated
250
V R = 200V
55
pF
nH
UNIT
IR = 100 A
VBR
Maximum reverse
leakage current
TEST CONDITIONS
SYMBOL
t rr
MIN.
TYP.
MAX.
14
20
30
t rr1
TJ = 25 C
21
t rr2
TJ = 125 C
35
1.9
4.8
TEST CONDITIONS
IF= 10A
dIF/dt = -200 A/s
VR = 160 V
ns
l RRM1
TJ = 25 C
l RRM2
TJ = 125 C
Q rr1
TJ = 25 C
25
Q rr2
TJ = 125 C
78
MIN.
TYP.
MAX.
UNITS
300
1.5
0.7
nC
Lead temperature
Junction to case,
single leg conduction
Junction to case,
both legs conducting
SYMBOL
Tlead
TEST CONDITIONS
RthJC
K/W
Thermal resistance,
junction to ambient
RthJA
40
Thermal resistance,
case to heatsink
RthCS
0.25
5.5
0.19
g
oz.
6
(5)
12
(10)
kgf . cm
(lbf . in)
Weight
Mounting torque
Marking device
D92-02
D92
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02
3
Page 2 of 5
RoHS
RoHS
N-D92-02
SEMICONDUCTOR
100
10
T J =150C
T J =125C
T J =25C
T J =125 C
T J =100 C
0.1
T J =25 C
0.01
0.001
0.1
0
0.4
0.8
1.6
1.2
2.0
50
100
150
200
250
1000
T J =150C
10
T J =25 C
100
10
0
10
100
160
150
140
DC
130
Square wave (D = 0.50)
Rated V R applied
120
110
100
0
1000
15
12
1
P DM
0.1
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
t1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
0.001
t2
Notes:
1. Duty Factor D =t 1 /t 2.
2.Peak T J = PDM x R th(j-c) +T C
0.01
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Page 3 of 5
0.1
.
1
N-D92-02
SEMICONDUCTOR
RoHS
RoHS
15
50
12
40
RMS limit
t rr (ns)
D = 0.01
D = 0.02
D = 0.05
D = 0.10
D = 0.20
D = 0.50
12
20
l F = 20A
l F = 10A
l F = 5A
V R = 160V
0
100
0
0
30
10
DC
T J =125C
T J =25C
15
1000
dl F /dt(A/ s)
Q rr (nC)
250
200
T J =125C
T J =25C
150
l F = 20A
l F = 10A
l F = 5A
V R =200V
0.01
L=70H
D.U.T.
100
dl F /dt
adjust
50
V R = 160V
0
100
IRFP250
1000
dl F /dt(A/ s)
Note
(1) Formula used:T C = T J - (Pd+Pd REV ) x R thJC ;
Pd = Forward power loss = l F(AV) x V FM at (l F(AV) /D)(see fig.6);
Pd REV = lnverse power loss = V R1 x l R (1-D); l R at V R1 = Rated V R
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Page 4 of 5
N-D92-02
SEMICONDUCTOR
RoHS
RoHS
(3)
t rr
IF
ta
tb
Q rr
(2)
l RRM
(4)
0.5 l RRM
dl (rec)M /dt (5)
0.75 l RRM
(1) dl F /dt
Qrr =
t rr xl RRM
2
1.8
4.0
4.80.2
2.00.1
3.2 0,1
4.0 max
20.0 min
19.90.3
2.0
15.60.4
9.6
5.0 0 . 2
TO-3PB
5.450.1
+0.2
1.05 -0.1
+0.2
0.65 -0.1
5.450.1
1.4
common
cathode
2
3
1
Anode
1
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Page 5 of 5
2
Common
cathode
3
Anode
2