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Abstract
Sensors are key components in an overwhelming wealth of systems for industrial and consumer applications. Further system miniaturization
will demand for continuous down-scaling of sensor functions in such systems most likely towards nanoscale. Then new sensor device concepts
will emerge to improve performance, e.g. sensitivity, or to utilize unique functional properties of nanoscale structures. This paper presents
concepts and demonstrators of nano electromechanical sensors based on carbon nanotubes (CNTs). First, different transducer concepts based
on the unique electrical, mechanical and electromechanical properties of single-walled carbon nanotubes (SWNTs) are addressed and discussed.
Second, fabrication techniques and methods for the integration of SWNTs in micro or nanosystems are presented. Finally, demonstrators of
suspended SWNT-based cantilever structures and a membrane-based nanotube pressure sensor are introduced and evaluated. Electromechanical
measurements on these test devices prove SWNTs as exceptional piezoresistive electromechanical transducers with gauge factors far above the
values of state-of-the-art strain gauges.
2007 Elsevier B.V. All rights reserved.
Keywords: NEMS; MEMS; Transducers; Carbon nanotubes; Process integration; Nanotechnology
Contents
1.
2.
3.
4.
5.
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electromechanical transducer concepts based on carbon nanotubes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synthesis of SWNT-based NEMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1. NEMS by local CNT growth and integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2. NEMS by CNT assembly and integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Evaluation of SWNT electromechanical transducers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1. Suspended carbon nanotube electromechanical transducers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2. Membrane-based carbon nanotube electromechanical transducers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Conclusions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1. Introduction
In general, further system miniaturization will certainly create demands for a continuous down-scaling of sensor functions
Corresponding author at: Micro and Nanosystems, Department of Mechanical and Process Engineering, ETH Zurich, Tannenstrasse 3, CH-8092 Zurich,
Switzerland. Tel.: +41 44 63 23143; fax: +41 44 63 21462.
E-mail address: hierold@micro.mavt.ethz.ch (C. Hierold).
0924-4247/$ see front matter 2007 Elsevier B.V. All rights reserved.
doi:10.1016/j.sna.2007.02.007
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Fig. 1. Matrix of possible carbon nanotube based electrical, mechanical and optical transducers and their applications for sensing and actuation purposes. For more
information please refer to the text (See references [3639,4144,46,48,49,5153]).
54
Fig. 2. Schematic diagram of the process flow. (a) PMMA spin coating (2
6000 rpm during 45 s resulting in 400 nm resist thickness, post-bake at 180 C
during 20 min each); (b) electron beam lithography followed by resist development MIBK:IPA 1:3 for 3 min); (c) catalyst deposition (droplet onto chip placed
at hot plate 40 C or Al/Ni bi-layer evaporation/sputtering) and lift-off in acetone
during 4 min under weak sonication; (d) CNT growth (using ATV PEO 603 at
900 C during 10 min CH4 at 200 mbar); (e) metallization; (f) HF release [68A].
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Fig. 4. (a) Scanning electron microscopy (SEM) image of a typical (released) poly silicon microheater; (b) schematic of experimental setup for the fabrication
process; (c) temperature distribution measured by confocal Raman scattering of the structure shown in Fig. 4a; (d) microheater tip containing carbon nanotubes [74],
please notice that this heater structure is different from the structure shown in Figs. 4a and 4c.
step towards the process integration of nanotubes into functional devices. Since the synthesis is carried out globally at room
temperature the suggested process is compatible with standard
CMOS technology.
Microheaters were designed from a triple polysilicon
layer surface micromachining process [7476]. They can be
defined in any of the releasable polysilicon layers. The chip is
acetone stripped and HF released before catalyst deposition.
Fig. 4a shows an image of an uncoated released microheater.
The sample is then coated with a catalytic solution containing
iron nitride, molybdenum and alumina nanoparticles dissolved
in methanol [40]. The evaporation of the solvent is enhanced
in air using a hot plate (40 C). After evaporation the chip is
die bonded onto a support chip containing large contact pads
using non-permanent hot-wax and wire bonds. The system is
then transferred into a vacuum chamber featuring electrical in
situ connection. Please refer to Fig. 4b.
The vacuum chamber is first subjected to argon purge and
evacuation cycles. Subsequently methane is fed at 150 sccm
and the pressure is kept at 75 mbar. Heat is produced through
resistive heating (Joule heating) by applying electrical power at
the polysilicon beams. The temperature of the micro heater tips
has been measured for heater structures by Raman spectroscopy
56
Fig. 5. Process flow for the fabrication of SWNT-based pressure sensors. (a)
100 nm alumina is grown by ALD on a 300 m thick Si substrate. The membrane
cavity on the backside is aligned to global front side alignment markers and
etched by the BOSCH process; (b) local markers are patterned by e-beam; (c)
SWNTs are randomly adsorbed on the alumina surface. The local markers are
used to find the relative position of the adsorbed SWNTs by AFM imaging; (d)
contact electrodes are patterned by e-beam; (e) formed by PVD of 1 nm Ti and
30 nm Au and lift-off; (f) the membrane is released in an isotropic dry etching
step [68A].
the Al2 O3 thin film during the next processing steps. The next
steps are the adsorption and contacting of the SWNT sensing
elements. This is done on an area in the centre of the membrane
(Fig. 5a red area). By electron beam (e-beam) lithography local
alignment markers are patterned and created by physical vapor
deposition (PVD) of 1 nm Ti and 30 nm Au followed by a lift-off
(Fig. 5b). Before the deposition of nanotubes, the alumina surface is functionalized with DAS. Highly purified SWNTs from
an arc-discharge fabrication process are dispersed from sodiumdodecylsulphate (SDS) solution and adsorbed randomly on the
Al2 O3 surface on the sample (Fig. 5c). Deposited local reference
alignment markers serve to map the location of the randomly
distributed nanotubes. This is done using AFM imaging. The
contact electrodes of the SWNTs are patterned by a second ebeam lithography step (Fig. 5d) followed by PVD of 1 nm Ti
and 30 nm Au and lift-off (Fig. 5e). For the pressure sensor Ti is
used instead of Cr to achieve better contacts between the electrodes and the SWNT. For a further improvement of the contacts
an annealing step at 400 C for 10 min under argon atmosphere
is carried out. The final process step is the release of the ALD
alumina membrane from the remained few microns of bulk Si
(Fig. 5f). For this, an isotropic release in reactive ion etching
(RIE) equipment is performed. Before the release takes place,
the front side is covered with photoresist to prevent the SWNT
from incurring damage due to the plasma. A final cleaning step
removes the protective photoresist layer. The schematic of the
final device is shown in Fig. 8a. In Fig. 8b, a released Al2 O3 circular membrane with gold lines and contacted SWNTs is shown.
This basic process flow is also applied for the fabrication of
the suspended cantilevers in Figs. 6 and 7 with two variations:
The membrane pre-etch and final release (bulk micromachning
of the membrane) have been substituted by a surface micromachining process module to release the Cr/Au cantilevers from
the surface by HF (diluted) wet etching and a subsequently
drying by CO2 critical point drying. We use discrete, highly
purified and chemically stable CNTs (fabricated by an arcdischarge process) as active elements to reliably withstand HF
release.
4. Evaluation of SWNT electromechanical transducers
4.1. Suspended carbon nanotube electromechanical
transducers
Fig. 6a shows an illustration of a concept for a nanoscaled
force sensor based on individual SWNTs. The basic functionality of this device is as following: an individual SWNT is
connected to and fixed by electrodes and it is suspended from
the substrate. If now an external out-of-plane force acts on the
freestanding cantilever, it will deflect, which finally leads to
a mechanical deformation (mainly stretching of the nanotube
branches) of the clamped SWNT.
The cantilever (i.e. MEMS like beams, see Fig. 6a and b) provides a precise mechanical interface to the tube, applying local
deformation at the edges and axial strain in the branches of the
nanotubes. To investigate the proposed transducer concept we
studied cantilever and bridge based structures which have been
57
actuated by an atomic force microscope. The mechanical characterization of the structures revealed the following conclusions:
The deflection of the 3050 nm Au structures is well described
by the elastic beam theory (EulerBernoulli theory of beams) in
the small deflection regime. The SWNT in the given set up contributes significantly to the stiffness of the system (spring constant) and is well described by modeling the tube mechanics like
a string. Electromechanical measurements on a cantilever-based
structure are shown in Fig. 7b. An AFM-tip is used to deflect the
cantilever by z at the point where the nanotube is mechanically
connected to the beam. The electrical measurement of the resistance of the SWNTs under mechanical load showed a significant
and reversible increase of the tubes resistance in dependence of
the deflection of the nanotube. We plot the resistance R in dependence of the deflection of the single-walled carbon nanotube. At
zero-deflection the resistances is in the range of 300 k. It then
increases to 5.5 M at a nanotube deflection of 35 nm. The insert
of Fig. 7b shows the reproducibility of these measurements. Thus
this concept of nano electromechanical systems has been proven.
The strong electromechanical response of the investigated
nanotube can be understood in terms of a strain dependent
bandgap opening, which consequently leads within the thermal activated transport model to an exponential increase of the
resistance R as a function of applied strain.
Fig. 7. (a) Finalized device of a cantilever-based test structure; (b) electromechanical measurements on a cantilever-based structure. The resistance R is
plotted on a log scale as a function of the nanotube deflection z. () Indicate the measurement points related to pushing down and () to the release of
the force. Note that (a) and (b) origin from different devices [68A].
Complementary to the suspended CNT electromechanical transducers, which are discussed in previous section, a
membrane-based CNT transducer has been demonstrated [14].
As an advantage of the membrane-based test stands the local
deformation of the tube at the edges of the cantilevers or bridges
is avoided and axial stress is applied to the tube by straining
the membrane. This device is a SWNT-based pressure sensor,
utilizing the tube as electromechanical piezoresistive transducer
(Figs. 8 and 9).
Based on the process flow described in brief above SWNT
pressure sensors were fabricated with membrane diameters
between 100 and 250 m (Fig. 8a). Fig. 8b provides a total
overview of the bulk micromachined Al2 O3 membrane with
multiple electrode configurations to contact up to four SWNTs
independently. The SWNTs are adhered to the membrane surface by van der Waals forces and are electrically connected
to and clamped by the Ti/Au electrodes. Differential pressure
58
Fig. 8. (a) Illustration of the pressure sensor concept based on alumina membranes and single-walled carbon nanotubes as functional elements; (b) bulk
micromachined 100 nm thick alumina membrane diameter 200 m) with multiple electrode configurations (30 nm Ti/Au electrodes) and SEM image of a
close-up view after all processing [1,68A].
(up to 1.4 105 Pa) is applied to strain the membrane and the
adhered SWNTs. For a given membrane with 108 m diameter
a pressure difference of 105 Pa results in straining the SWNT
to 0.05%.
The resistance of the metallic SWNT is determined by measuring the IU transfer characteristics of the tube for each applied
differential pressure (Fig. 9) by applying voltages between 50
and 0 mV and recording the respective current for 100 measurement points. The error bars shown in Fig. 9 are determined by the
variance of these measurement points. The pressure dependent
The feasibility of CNT-based nano electromechanical systems (NEMS) is confirmed by the research results of several
groups. The review and results presented in this paper confirm
the potential and excellent performance of SWNTs for sensors
by the integration of tubes in well-defined MEMS structures
to reproducibly quantify electromechanical device properties,
e.g. sensitivity. Further investigations are necessary to evaluate
noise properties and to investigate the influence of the fabrication process on these properties. The direct integration of CNTs
into devices will result in the next generation of nanotransducers
for mechanical loads. To develop these NEMS it is mandatory
to continue research on the control and the reproducibility of
the assembly, or even better the growth of CNTs. Self-assembly
or self-assembled growth of nanostructures instead of structuring by photolithographic means will be the preferred process
technology approach for nano device integration. Continuous
basic research is also needed to integrate CNTs into MEMS on
wafer level and to provide fast and efficient methods for CNT
pre-evaluation and CNT growth process control.
Acknowledgments
The authors thank the operational teams of ETH Zurichs
cleanroom facilites (FIRST and CLA labs) and EMEZ for support. We thank Prof. Victor Bright and Prof. Steven George,
both University of Colorado at Boulder, for many helpful discussions and for supporting the project with ALD alumina
substrates. Support of the nanotransducers research program
by ETH Zurich (TH 18/03-1) and by Swiss National Science
Foundation (20021-108059/1) is gratefully acknowledged.
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Biographies
Christofer Hierold has been a Professor of Micro and Nanosystems at ETH
Zurich since April 2002. Previously, he was with Siemens AG, Corporate
Research, and Infineon Technologies AG in Germany, working manly on
CMOS compatible microsystems. At ETH Zurich he started his research on
the evaluation of new materials for MEMS, on advanced microsystems, and
on nanotransducers. Christofer Hierold is a member of the International Steering Committees of major conferences in the field (MEMS, TRANSDUCERS,
EUROSENSORS) and he is a member of the editorial boards of IEEE/ASME
Journal of Microelectromechanical Systems and of IoP Journal of Micromechanics and Microengineering, and he is joint editor of the book series Advanced
Micro and Nanosystems (WileyVCH).
Alain Jungen graduated from the Swiss Federal Institute of Technology (EPFL)
Lausanne, Switzerland where he received the MSc degree in microtechnology
with emphasis on integrated products. Mr. Jungen had carried out his thesis work
at a nanotechnology company called Zyvex based in the greater Dallas area,
Texas, USA. He investigated 2D micro scanning mirrors as well as creep and
friction issues in MEMS. Mr. Jungen came aboard the Micro and Nanosystems
group at ETH Zurich to research the process integration of carbon nanotube
growth into microsystems.
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Thomas Helbling received the MSc degree in electrical engineering and information technology from the ETH Zurich, Switzerland with main focus on
integrated electronic circuits and microsystems technology. Mr. Helbling joined
the group of Micro and Nanosystems at the ETH Zurich, Switzerland during his
Master thesis, where he investigated the use of carbon nanotubes as piezoresistive sensing elements in pressure sensors. Currently he is a PhD student with
the same group where he focuses the electromechanical properties of carbon
nanotubes and their possible use for future nanoscaled sensors.