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Procedia CIRP 22 (2014) 3 14
* Corresponding author. Tel.: +49 (0)30 39006-295; fax: +49 (0)30 3930246. E-mail address: hendrik.grosser@ipk.fraunhofer.de
Abstract
Increasing competitive pressure within industries producing long-living, cost intensive products drive the need to optimize product life cycles
in terms of faster time to market, sustainable operation, reengineering and recycling. In this context, complexity of IT systems is growing and
has to connect different life cycle phases. Especially new concepts of Product Service Systems (PSS) lead to a connection between product
design, maintenance, repair and overhaul (MRO). There are still many challenges concerning interface problems between different IT-Systems.
They are caused by different data formats, continuous demand for information or integration of new technologies. Thus, Life Cycle
Engineering (LCE) has gained an important role and needs to consider integration of new industry 4.0 solutions like cloud services, big data or
cyber physical systems. This paper gives an overview about these challenges, future development and new research approaches. A deeper view
is taken at one promising approach in the field of maintenance of Printed Circuit Boards (PCB). This approach is about invention and
implementation of a new process that combines both electrical and optical measuring techniques to automate circuit and layout plan
reconstruction of long-living and cost intensive electronic boards.
2014
B.V. This
is an open
access article
2014Elsevier
The Authors.
Published
by Elsevier
B.V. under the CC BY-NC-ND license
(http://creativecommons.org/licenses/by-nc-nd/3.0/).
Peer-review under responsibility of the Programme Chair of EPSRC Centre for Innovative Manufacturing in Through-life Engineering
Peer-review
Services. under responsibility of the Programme Chair of the 3rd InternationalThrough-life Engineering Conference
Keywords: Life cycle engineering; sustainability; PSS; design; MRO; maintenance; netlist; circuit diagram; PCB; computed tomography; 3D scan; flying probe
2212-8271 2014 Elsevier B.V. This is an open access article under the CC BY-NC-ND license
(http://creativecommons.org/licenses/by-nc-nd/3.0/).
Peer-review under responsibility of the Programme Chair of the 3rd InternationalThrough-life Engineering Conference
doi:10.1016/j.procir.2014.07.118
2.1.1. Sustainability
10
economic damage. This means violation of patent law, maskwork rights, copyright law or competition law have to be
avoided [36].
All inspection or reverse engineering principles for PCBs
offered by service providers are legal because they are not
related to value creation with a product. It depends on the goal
of the product owner. Unfortunately many of those services
can be abused for illegal activities. In case of product piracy
cheap principles are used for maximization of financial
advantages. Chap principles are destructive and characterized
by high manual efforts. For maintenance purposes of longliving PCBs destruction is no option, because of their high
value and the mentioned problem of obsolescence. Obsolete
PCBs which are last of their kind need either to be repaired or
to be overhauled. Nondestructive principles are expensive on
the one hand and deliver detailed information and data that
makes them ideal tools for process automation. In this case a
high degree of automation is beneficial for maintenance
companies for cost reduction.
5. New advanced technologies
Based on state of the art technologies and solution
approaches described in Chapter 3 the following chapter
presents new advanced technologies in Life Cycle
Engineering to improve actual available technologies in the
field of PCB maintenance. The pictured INPIKO process
chain (fig. 5) aims to realize a new, highly automated and
non-destructive approach optimized by the combination of
different technologic approaches.
fig. 6. CT scan of industrial PCB with highlighted pins and tracks for
segmentation process
11
12
6. Conclusion
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