LTC2604/LTC2614/LTC2624

Quad 16-Bit Rail-to-Rail DACs

in 16-Lead SSOP
FEATURES

DESCRIPTION

The LTC2604/LTC2614/LTC2624 are quad 16-,14- and

12-bit 2.5V to 5.5V rail-to-rail voltage output DACs in
16-lead narrow SSOP packages. These parts have separate
reference inputs for each DAC. They have built-in high performance output buffers and are guaranteed monotonic.

Smallest Pin Compatible Quad 16-Bit DAC:

LTC2604: 16-Bits
LTC2614: 14-Bits
LTC2624: 12-Bits
Guaranteed 16-Bit Monotonic Over Temperature
Separate Reference Inputs for each DAC
Wide 2.5V to 5.5V Supply Range
Low Power Operation: 250A per DAC at 3V
Individual DAC Power-Down to 1A, Max
Ultralow Crosstalk Between DACs (<5V)
High Rail-to-Rail Output Drive (15mA)
Double Buffered Digital Inputs
LTC2604-1/LTC2614-1/LTC2624-1: Power-On Reset
to Midscale
16-Lead Narrow SSOP Package

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These parts establish advanced performance standards

for output drive, crosstalk and load regulation in singlesupply, voltage output multiples.
The parts use a simple SPI/MICROWIRE compatible
3-wire serial interface which can be operated at clock rates
up to 50MHz. Daisy-chain capability and a hardware CLR
function are included.
The LTC2604/LTC2614/LTC2624 incorporate a power-on
reset circuit. During power-up, the voltage outputs rise less
than 10mV above zero scale; and after power-up, they stay
at zero scale until a valid write and update take place. The
power-on reset circuit resets the LTC2604-1/LTC2614-1
/LTC2624-1 to midscale. The voltage outputs stay at midscale until a valid write and update take place.

APPLICATIONS
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Mobile Communications
Process Control and Industrial Automation
Instrumentation
Automatic Test Equipment

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L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.

BLOCK DIAGRAM
VCC

GND
1
REF LO
2
REF A

REF B

DAC B

DAC
REGISTER

VOUT D

1.0

14

0.8

VCC = 5V
VREF = 4.096V

0.6

DAC
REGISTER

VOUT C
DAC C

13
REF C
12

ERROR (LSB)

DAC D

Differential Nonlinearity (LTC2604)

0.4
INPUT
REGISTER

VOUTB

INPUT
REGISTER

DAC A

INPUT
REGISTER

DAC
REGISTER

VOUTA

DAC
REGISTER

INPUT
REGISTER

16
REF D
15

0.2
0
0.2
0.4

CLR
11

0.6
0.8

CS/LD
7

CONTROL
LOGIC

DECODE

SCK
8

32-BIT SHIFT REGISTER

SDO
10
SDI
9

1.0

16384

32768
CODE

49152

65535
2604 TA01

2604 BD

2604fd

LTC2604/LTC2614/LTC2624
ABSOLUTE MAXIMUM RATINGS

PIN CONFIGURATION

(Note 1)
TOP VIEW

Any Pin to GND ............................................ 0.3V to 6V

Any Pin to VCC ............................................. 6V to 0.3V
Maximum Junction Temperature .......................... 125C
Operating Temperature Range
LTC2604C/LTC2614C/LTC2624C ............. 0C to 70C
LTC2604C-1/LTC2614C-1/
LTC2624C-1 ............................................. 0C to 70C
LTC2604I/LTC2614I/LTC2624I .............40C to 85C
LTC2604I-1/LTC2614I-1/
LTC2624I-1 ..........................................40C to 85C
Storage Temperature Range .................. 65C to 150C
Lead Temperature (Soldering, 10 sec)................... 300C

GND

16 VCC

REF LO

15 REF D

REF A

14 VOUT D

VOUT A

13 VOUT C

VOUT B

12 REF C

REF B

11 CLR

CS/LD

10 SDO

SCK

SDI

GN PACKAGE
16-LEAD PLASTIC SSOP
TJMAX = 125C, JA = 150C/W

ORDER INFORMATION
LEAD FREE FINISH

TAPE AND REEL

PART MARKING

PACKAGE DESCRIPTION

TEMPERATURE RANGE

LTC2604CGN#PBF

LTC2604CGN#TRPBF

2604

16-Lead Narrow SSOP Package

0C to 70C

LTC2604CGN-1#PBF

LTC2604CGN-1#TRPBF

26041

16-Lead Narrow SSOP Package

0C to 70C

LTC2604IGN#PBF

LTC2604IGN#TRPBF

2604I

16-Lead Narrow SSOP Package

40C to 85C

LTC2604IGN-1#PBF

LTC2604IGN-1#TRPBF

2604I1

16-Lead Narrow SSOP Package

40C to 85C

LTC2614CGN#PBF

LTC2614CGN#TRPBF

2614

16-Lead Narrow SSOP Package

0C to 70C

LTC2614CGN-1#PBF

LTC2614CGN-1#TRPBF

26141

16-Lead Narrow SSOP Package

0C to 70C

LTC2614IGN#PBF

LTC2614IGN#TRPBF

2614I

16-Lead Narrow SSOP Package

40C to 85C

LTC2614IGN-1#PBF

LTC2614IGN-1#TRPBF

2614I1

16-Lead Narrow SSOP Package

40C to 85C

LTC2624CGN#PBF

LTC2624CGN#TRPBF

2624

16-Lead Narrow SSOP Package

0C to 70C

LTC2624CGN-1#PBF

LTC2624CGN-1#TRPBF

26241

16-Lead Narrow SSOP Package

0C to 70C

LTC2624IGN#PBF

LTC2624IGN#TRPBF

2624I

16-Lead Narrow SSOP Package

40C to 85C

LTC2624IGN-1#PBF

LTC2624IGN-1#TRPBF

2624I1

16-Lead Narrow SSOP Package

40C to 85C

Consult LTC Marketing for parts specied with wider operating temperature ranges.
Consult LTC Marketing for information on non-standard lead based nish parts.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specications, go to: http://www.linear.com/tapeandreel/

ELECTRICAL CHARACTERISTICS

The denotes specications which apply over the full operating

temperature range, otherwise specications are at TA = 25C. REF A = REF B = REF C = REF D = 4.096V (VCC = 5V), REF A = REF B =
REF C = REF D = 2.048V (VCC = 2.5V), REF LO = 0V, VOUT unloaded, unless otherwise noted. (Note 10)

SYMBOL PARAMETER

CONDITIONS

LTC2624/LTC2624-1

LTC2614/LTC2614-1

LTC2604/LTC2604-1

MIN

MIN

MIN

TYP

MAX

TYP

MAX

TYP

MAX

UNITS

DC Performance
Resolution

12

Monotonicity

12

(Note 2)

DNL

Differential Nonlinearity (Note 2)

INL

Integral Nonlinearity

(Note 2)

14

16

14

16

0.5
0.9

Bits
Bits

1
4

16

1
14

64

LSB
LSB
2604fd

LTC2604/LTC2614/LTC2624
ELECTRICAL CHARACTERISTICS

The denotes specications which apply over the full operating

temperature range, otherwise specications are at TA = 25C. REF A = REF B = REF C = REF D = 4.096V (VCC = 5V), REF A = REF B =
REF C = REF D = 2.048V (VCC = 2.5V), REF LO = 0V, VOUT unloaded, unless otherwise noted. (Note 10)
SYMBOL PARAMETER
Load Regulation

ZSE
VOS

CONDITIONS

LTC2614/LTC2614-1

LTC2604/LTC2604-1

MIN

MIN

MIN

TYP

MAX

0.025 0.125
0.025 0.125

0.1
0.1

VREF = VCC = 2.5V, Midscale

IOUT = 0mA to 7.5mA Sourcing l
IOUT = 0mA to 7.5mA Sinking l

0.05
0.05

0.25
0.25

1.5

1.5

VREF = VCC = 5V, Midscale

IOUT = 0mA to 15mA Sourcing
IOUT = 0mA to 15mA Sinking

Zero-Scale Error
Offset Error

LTC2624/LTC2624-1

(Note 7)

l
l

VOS Temperature
Coefcient
GE

TYP

MAX

TYP

MAX

0.5
0.5

0.3
0.3

2
2

LSB/mA
LSB/mA

0.2
0.2

1
1

0.7
0.7

4
4

LSB/mA
LSB/mA

1.5

1.5

mV

1.5

1.5

5
l

Gain Error
Gain Temperature
Coefcient

0.1

5
0.7

0.1

5
0.7

0.1

UNITS

mV
V/C

0.7

%FSR
ppm/C

The denotes specications which apply over the full operating temperature range, otherwise specications are at TA = 25C. REF
A = REF B = REF C = REF D = 4.096V (VCC = 5V), REF A = REF B = REF C = REF D = 2.048V (VCC = 2.5V), REF LO = 0V, VOUT unloaded,
unless otherwise noted. (Note 10)
SYMBOL

PARAMETER

CONDITIONS

PSR

Power Supply Rejection

VCC = 5V 10%
VCC = 3V 10%

ROUT

DC Output Impedance

VREF = VCC = 5V, Midscale; 15mA IOUT 15mA

VREF = VCC = 2.5V, Midscale; 7.5mA IOUT 7.5mA

DC Crosstalk (Note 4)

Due to Full Scale Output Change (Note 5)

Due to Load Current Change
Due to Powering Down (per Channel)

Short-Circuit Output Current

VCC = 5.5V, VREF = 5.5V

Code: Zero Scale; Forcing Output to VCC
Code: Full Scale; Forcing Output to GND

l
l

15
15

34
36

60
60

mA
mA

VCC = 2.5V, VREF = 2.5V

Code: Zero Scale; Forcing Output to VCC
Code: Full Scale; Forcing Output to GND

l
l

7.5
7.5

18
24

50
50

mA
mA

VCC

128

160

ISC

MIN

TYP

MAX

80
80
l
l

0.025
0.030

UNITS
dB
dB

0.15
0.15

5
1
3.5

V
V/mA
V

Reference Input
Input Voltage Range
Resistance

Normal Mode

88

Capacitance

14

Reference Current, Power Down Mode All DACs Powered Down

VCC

Positive Supply Voltage

For Specied Performance

ICC

Supply Current

VCC = 5V (Note 3)
VCC = 3V (Note 3)
All DACs Powered Down (Note 3) VCC = 5V
All DACs Powered Down (Note 3) VCC = 3V

l
l
l
l

Digital Input High Voltage

VCC = 2.5V to 5.5V

VCC = 2.5V to 3.6V

l
l

IREF

0.001

pF
1

Power Supply
2.5
1.3
1
0.35
0.10

5.5

2
1.6
1
1

mA
mA
A
A

Digital I/O
VIH

2.4
2.0

V
V
2604fd

LTC2604/LTC2614/LTC2624
ELECTRICAL CHARACTERISTICS

The denotes specications which apply over the full operating

temperature range, otherwise specications are at TA = 25C. REF A = REF B = REF C = REF D = 4.096V (VCC = 5V), REF A = REF B =
REF C = REF D = 2.048V (VCC = 2.5V), REF LO = 0V, VOUT unloaded, unless otherwise noted. (Note 10)
SYMBOL

PARAMETER

CONDITIONS

MIN

VIL

Digital Input Low Voltage

VCC = 4.5V to 5.5V

VCC = 2.5V to 5.5V

l
l

VOH

Digital Output High Voltage

Load Current = 100A

VOL

Digital Output Low Voltage

Load Current = +100A

0.4

pF

ILK

Digital Input Leakage

VIN = GND to VCC

CIN

Digital Input Capacitance

(Note 6)

TYP

MAX

UNITS

0.8
0.6

V
V

VCC 0.4

The denotes specications which apply over the full operating temperature range, otherwise specications are at TA = 25C. REF
A = REF B = REF C = REF D = 4.096V (VCC = 5V), REF A = REF B = REF C = REF D = 2.048V (VCC = 2.5V), REF LO = 0V, VOUT unloaded,
unless otherwise noted. (Note 10)
SYMBOL PARAMETER

CONDITIONS

LTC2624/LTC2624-1

LTC2614/LTC2614-1

LTC2604/LTC2604-1

MIN

MIN

MIN

TYP

MAX

TYP

MAX

TYP

MAX

UNITS

AC Performance
ts

Settling Time (Note 8)

0.024% (1LSB at 12 Bits)

0.006% (1LSB at 14 Bits)
0.0015% (1LSB at 16 Bits)

7
9

7
9
10

s
s
s

Settling Time for

1LSB Step (Note 9)

0.024% (1LSB at 12 Bits)

0.006% (1LSB at 14 Bits)
0.0015% (1LSB at 16 Bits)

2.7

2.7
4.8

2.7
4.8
5.2

s
s
s

Voltage Output Slew Rate

0.80

0.80

0.80

V/s

Capacitive Load Driving

1000

1000

1000

pF

Glitch Impulse

At Midscale Transition

Multiplying Bandwidth
en

12

12

12

nV s

180

180

180

kHz

Output Voltage Noise

Density

At f = 1kHz
At f = 10kHz

120
100

120
100

120
100

nVHz
nVHz

Output Voltage Noise

0.1Hz to 10Hz

15

15

15

VPP

TIMING CHARACTERISTICS

The denotes specications which apply over the full operating temperature
range, otherwise specications are at TA = 25C. REF A = REF B = REF C = REF D = 4.096V (VCC = 5V), REF A = REF B = REF C = REF D
= 2.048V (VCC = 2.5V), REF LO = 0V, VOUT unloaded, unless otherwise noted. (Note 10)
SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

VCC = 2.5V to 5.5V

t1

SDI Valid to SCK Setup

ns

t2

SDI Valid to SCK Hold

ns

t3

SCK High Time

ns

t4

SCK Low Time

ns

t5

CS/LD Pulse Width

10

ns

t6

LSB SCK High to CS/LD High

ns

t7

CS/LD Low to SCK High

ns

t8

SDO Propagation Delay from SCK Falling Edge

t9

CLR Pulse Width

CLOAD = 10pF
VCC = 4.5V to 5.5V
VCC = 2.5V to 5.5V

l
l
l

20
45
20

ns
ns
ns
2604fd

LTC2604/LTC2614/LTC2624
TIMING CHARACTERISTICS

The denotes specications which apply over the full operating temperature
range, otherwise specications are at TA = 25C. REF A = REF B = REF C = REF D = 4.096V (VCC = 5V), REF A = REF B = REF C = REF D
= 2.048V (VCC = 2.5V), REF LO = 0V, VOUT unloaded, unless otherwise noted. (Note 10)
SYMBOL

PARAMETER

CONDITIONS

MIN

t10

CS/LD High to SCK Positive Edge

SCK Frequency

50% Duty Cycle

Note 1: Stresses beyond those listed under Absolute Maximum Ratings

may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: Linearity and monotonicity are dened from code kL to code
2N 1, where N is the resolution and kL is given by kL = 0.016(2N/VREF),
rounded to the nearest whole code. For VREF = 4.096V and N = 16,
kL = 256, linearity is dened from code 256 to code 65,535.
Note 3: Digital inputs at 0V or VCC.
Note 4: DC crosstalk is measured with VCC = 5V and VREF = 4.096V, with
the measured DAC at midscale, unless otherwise noted.

TYP

MAX

UNITS

ns
50

MHz

Note 5: RL = 2k to GND or VCC.

Note 6: Guaranteed by design and not production tested.
Note 7: Inferred from measurement at code 256 (LTC2604), code 64
(LTC2614) or code 16 (LTC2624), and at full scale.
Note 8: VCC = 5V, VREF = 4.096V. DAC is stepped 1/4 scale to 3/4 scale and
3/4 scale to 1/4 scale. Load is 2k in parallel with 200pF to GND.
Note 9: VCC = 5V, VREF = 4.096V. DAC is stepped 1LSB between half scale
and half scale 1. Load is 2k in parallel with 200pF to GND.
Note 10: These specications apply to LTC2604/LTC2604-1, LTC2614/
LTC2614-1, LTC2624/LTC2624-1.

TYPICAL PERFORMANCE CHARACTERISTICS

(LTC2604/LTC2604-1, LTC2614/LTC2614-1, LTC2624/LTC2624-1)
Current Limiting
CODE = MIDSCALE

0.4

0.02
0
0.02

VREF = VCC = 3V

0.04

0.2
0
0.2

VREF = VCC = 5V

0.4

VREF = VCC = 5V

0.06

0.6

VREF = VCC = 3V

0.04

CODE = MIDSCALE

0.8

VREF = VCC = 5V

0.06

Offset Error vs Temperature

3

OFFSET ERROR (mV)

0.08

VOUT (V)

Load Regulation
1.0

VOUT (mV)

0.10

1
2

0.8

0.10
40 30 20 10 0
10
IOUT (mA)

20

30

1.0
35

40

25

15

5
5
IOUT (mA)

15

2604 G01

25

3
50

35

Zero-Scale Error vs Temperature

Gain Error vs Temperature

90

Offset Error vs VCC

2

0.2

OFFSET ERROR (mV)

GAIN ERROR (%FSR)

1.0

70

0.3

2.5

1.5

10 10
30
50
TEMPERATURE (C)

2604 G03

0.4

2.0

30

2604 G02

ZERO-SCALE ERROR (mV)

VREF = VCC = 3V

0.6

0.08

0.1
0
0.1

1
0
1

0.2
2

0.5
0
50

0.3
30

10 10
30
50
TEMPERATURE (C)

70

90

2604 G04

0.4
50

30

10 10
30
50
TEMPERATURE (C)

70

90

2604 G05

3
2.5

3.5

4
VCC (V)

4.5

5.5
2604 G06

2604fd

LTC2604/LTC2614/LTC2624
TYPICAL PERFORMANCE CHARATERISTICS
(LTC2604/LTC2604-1, LTC2614/LTC2614-1, LTC2624/LTC2624-1)
Gain Error vs VCC

ICC Shutdown vs VCC

Large-Signal Settling

450

0.3

400

0.2

350

0.1

300
ICC (nA)

GAIN ERROR (%FSR)

0.4

0
0.1

VOUT
0.5V/DIV

250
200

VREF = VCC = 5V
1/4-SCALE TO 3/4-SCALE

150
0.2
100
0.3

2.5s/DIV

50

0.4
2.5

3.5

4
VCC (V)

4.5

0
2.5

5.5

3.5

4
VCC (V)

4.5

2604 G07

2604 G09

5.5
2604 G08

Midscale Glitch Impulse

Power-On Reset Glitch

Power-On Reset to Midscale

VREF = VCC

VOUT
10mV/DIV

VCC
1V/DIV

12nV-s TYP

VOUT
10mV/DIV
2604 G10

2.5s/DIV

2604 G11

250s/DIV

Headroom at Rails
vs Output Current

500s/DIV

Supply Current vs Logic Voltage

2604 G34

Exiting Power-Down to Midscale

2.0

5.0

VCC = 5V
SWEEP SCK, SDI
AND CS/LD
0V TO VCC

5V SOURCING

4.5

1.8

4.0
3.5
3.0

VCC = 5V
VREF = 2V
VOUT
0.5V/DIV

1.6

3V SOURCING
ICC (mA)

VOUT (V)

VCC
1V/DIV
VOUT
1V/DIV

4mV PEAK

CS/LD
5V/DIV

2.5
2.0

DACs A-C IN
POWER-DOWN MODE

1.4
CS/LD
5V/DIV

1.2

1.5
5V SINKING

1.0

1.0

3V SINKING

0.5
0
0

4 5 6
IOUT (mA)

10

2604 G12

2.5s/DIV

2604 G14

0.8
0

0.5

1.5 2 2.5 3 3.5

LOGIC VOLTAGE (V)

4.5

2604 G13

2604fd

LTC2604/LTC2614/LTC2624
TYPICAL PERFORMANCE CHARATERISTICS
(LTC2604/LTC2604-1, LTC2614/LTC2614-1, LTC2624/LTC2624-1)
Hardware CLR

Hardware CLR to Midscale

Multiplying Frequency Response

0

VCC = 5V
VREF = 4.096V
CODE = FULL SCALE

VOUT
1V/DIV

VOUT
1V/DIV

3
6
9
12
dB

15

CLR
5V/DIV

18
21

CLR
5V/DIV

24

VCC = 5V
VREF (DC) = 2V
VREF (AC) = 0.2VP-P
CODE = FULL SCALE

27
2604 G15

1s/DIV

30

2604 G35

1s/DIV

33
36

1k

1M

10k
100k
FREQUENCY (Hz)

2604 G16

Output Voltage Noise,

0.1Hz to 10Hz

Short-Circuit Output Current vs

VOUT (Sourcing)

Short-Circuit Output Current vs

VOUT (Sinking)
0

50
V CC = 5.5V
V REF = 5.6V
CODE = 0
V OUT SWEPT 0V TO V CC

10mA/DIV

VOUT
10V/DIV

4 5 6
SECONDS

10

10mA/DIV

40

30

20

2604 G17

20

30

40

10

10

V CC = 5.5V
V REF = 5.6V
CODE = FULL SCALE
V OUT SWEPT V CC TO 0V

50
0

3
1V/DIV

3
1V/DIV

6
2604 G19

2604 G18

(LTC2604/LTC2604-1)
Integral Nonlinearity (INL)
32

Differential Nonlinearity (DNL)

1.0

VCC = 5V
VREF = 4.096V

24

INL vs Temperature
32

VCC = 5V
VREF = 4.096V

0.8

24

0.6

16

16

0
8

0.2

INL (LSB)

DNL (LSB)

INL (LSB)

0.4
8

0
0.2

32

16384

32768
CODE

49152

65535
2604 G20

1.0

INL (NEG)

24

0.8
0

16

0.6
24

INL (POS)

0.4

16

VCC = 5V
VREF = 4.096V

16384

32768
CODE

49152

65535
2604 G21

32
50

30

10 10
30
50
TEMPERATURE (C)

70

90

2604 G22

2604fd

LTC2604/LTC2614/LTC2624
TYPICAL PERFORMANCE CHARATERISTICS
(LTC2604/LTC2604-1)
DNL vs Temperature

INL vs VREF

1.0

32

VCC = 5V
0.8 VREF = 4.096V

DNL vs VREF
1.5

VCC = 5.5V

24

1.0

0.6
16
DNL (POS)

0
0.2

0.5

INL (POS)

INL (LSB)

0.2

DNL (LSB)

0.4
DNL (LSB)

VCC = 5.5V

0
8

DNL (NEG)

INL (NEG)

DNL (POS)
0
DNL (NEG)
0.5

0.4
16

0.6

1.0

24

0.8
1.0
50

30

10 10
30
50
TEMPERATURE (C)

70

32

90

2
3
VREF (V)

2604 G23

1.5

2
3
VREF (V)

2604 G24

Settling to 1LSB

5
2604 G25

Settling of Full-Scale Step

VOUT
100V/DIV

VOUT
100V/DIV

12.3s

9.7s
CS/LD
2V/DIV

CS/LD
2V/DIV
2604 G26

2s/DIV

5s/DIV

VCC = 5V, VREF = 4.096V

1/4-SCALE TO 3/4-SCALE STEP
RL = 2k, CL = 200pF
AVERAGE OF 2048 EVENTS

2604 G27

VCC = 5V, VREF = 4.096V

CODE 512 TO 65535 STEP
AVERAGE OF 2048 EVENTS
SETTLING TO 1LSB

(LTC2614/LTC2614-1)
Integral Nonlinearity (INL)
8

Differential Nonlinearity (DNL)

1.0

VCC = 5V
VREF = 4.096V

Settling to 1LSB

VCC = 5V
VREF = 4.096V

0.8
0.6

0.4
DNL (LSB)

INL (LSB)

2
0
2

VOUT
100V/DIV

0.2
0

CS/LD
2V/DIV

0.2
0.4

0.6

6
8

2s/DIV

0.8
0

4096

8192
CODE

12288

16383
2604 G28

1.0

8.9s

4096

8192
CODE

12288

16383

2604 G30

VCC = 5V, VREF = 4.096V

1/4-SCALE TO 3/4-SCALE STEP
RL = 2k, CL = 200pF
AVERAGE OF 2048 EVENTS

2604 G29

2604fd

LTC2604/LTC2614/LTC2624
TYPICAL PERFORMANCE CHARATERISTICS
(LTC2624/LTC2624-1)
Integral Nonlinearity (INL)
2.0

Differential Nonlinearity (DNL)

1.0

VCC = 5V
VREF = 4.096V

1.5

0.6
6.8s

0.4

0.5

DNL (LSB)

INL (LSB)

VCC = 5V
VREF = 4.096V

0.8

1.0

0
0.5

VOUT
1mV/DIV

0.2
0

CS/LD
2V/DIV

0.2
0.4

1.0

0.6

1.5
2.0

Settling to 1LSB

2s/DIV

0.8
0

1024

2048
CODE

3072

4095

1.0

1024

2604 G31

2048
CODE

3072

4095

2604 G33

VCC = 5V, VREF = 4.096V

1/4-SCALE TO 3/4-SCALE STEP
RL = 2k, CL = 200pF
AVERAGE OF 2048 EVENTS

2604 G32

PIN FUNCTIONS
GND (Pin 1): Analog Ground.
REF LO (Pin 2): Reference Low. The voltage at this pin
sets the zero scale (ZS) voltage of all DACs. This pin can
be raised up to 1V above ground at VCC = 5V or 100mV
above ground at VCC = 3V.
REF A, REF B, REF C, REF D (Pins 3, 6, 12, 15): Reference Voltage Inputs for each DAC. REF x sets the full scale
voltage of the DACs. 0V REF x VCC.
VOUT A to VOUT D (Pins 4, 5, 13, 14): DAC Analog Voltage
Outputs. The output range is from REF LO to REF x.
CS/LD (Pin 7): Serial Interface Chip Select/Load Input. When
CS/LD is low, SCK is enabled for shifting data on SDI into
the register. When CS/LD is taken high, SCK is disabled
and the specied command (see Table 1) is executed.
SCK (Pin 8): Serial Interface Clock Input. CMOS and TTL
compatible.
SDI (Pin 9): Serial Interface Data Input. Data is applied to
SDI for transfer to the device at the rising edge of SCK.

The LTC2604/LTC2604-1, LTC2614/LTC2614-1, LTC2624/

LTC2624-1 accept input word lengths of either 24 or
32 bits.
SDO (Pin 10): Serial Interface Data Output. This pin is
used for daisy-chain operation. The serial output of the
shift register appears at the SDO pin. The data transferred
to the device via the SDI pin is delayed 32 SCK rising
edges before being output at the next falling edge. SDO
is an active output and does not go high impedance, even
when CS/LD is taken to a logic high level.
CLR (Pin 11): Asynchronous Clear Input. A logic low at
this level-triggered input clears all registers and causes
the DAC voltage outputs to drop to 0V for the LTC2604/
LTC2614/LTC2624. A logic low at this input sets all registers
to midscale code and causes the DAC voltage outputs to
go to midscale for the LTC2604-1/LTC2614-1/LTC2624-1.
CMOS and TTL compatible.
VCC (Pin 16): Supply Voltage Input. 2.5V VCC 5.5V.

2604fd

LTC2604/LTC2614/LTC2624
BLOCK DIAGRAM
VCC

GND
1
REF LO
2
REF A

16
REF D
15

DAC B

5
REF B

INPUT
REGISTER

DAC
REGISTER
DAC
REGISTER

VOUTB

VOUT D
DAC D

INPUT
REGISTER

DAC
REGISTER

DAC A

INPUT
REGISTER

DAC
REGISTER

VOUTA

INPUT
REGISTER

DAC C

14

VOUT C
13
REF C
12
CLR
11

6
CONTROL
LOGIC

CS/LD
7

SDO

DECODE

10

SCK

SDI
9

32-BIT SHIFT REGISTER

2604 BD

TIMING DIAGRAM
t1
t2
SCK

t3
1

t6

t4

23

24
t10

SDI
t5

t7

CS/LD
t8
SDO
2604 F01

Figure 1

OPERATION
Power-On Reset
The LTC2604/LTC2614/LTC2624 clear the outputs to
zero scale when power is rst applied, making system
initialization consistent and repeatable. The LTC2604-1/
LTC2614-1/LTC2624-1 set the voltage outputs to midscale
when power is rst applied.
For some applications, downstream circuits are active
during DAC power-up, and may be sensitive to nonzero

outputs from the DAC during this time. The LTC2604/

LTC2614/LTC2624 contain circuitry to reduce the poweron glitch; furthermore, the glitch amplitude can be made
arbitrarily small by reducing the ramp rate of the power
supply. For example, if the power supply is ramped to 5V
in 1ms, the analog outputs rise less than 10mV above
ground (typ) during power-on. See Power-On Reset Glitch
in the Typical Performance Characteristics section.
2604fd

10

LTC2604/LTC2614/LTC2624
OPERATION
Power Supply Sequencing

Table 1.

The voltage at REF (Pins 3, 6, 12 and 15) should be kept

within the range 0.3V REF x VCC + 0.3V (see Absolute Maximum Ratings). Particular care should be taken
to observe these limits during power supply turn-on and
turn-off sequences, when the voltage at VCC (Pin 16) is
in transition.
Transfer Function
The digital-to-analog transfer function is

k 
VOUT(IDEAL) =  [REF x REFLO]+REFLO
 2N 
where k is the decimal equivalent of the binary DAC input
code, N is the resolution and REF x is the voltage at REF
A, REF B, REF C and REF D (Pins 3, 6, 12 and 15).
Serial Interface
The CS/LD input is level triggered. When this input is taken
low, it acts as a chip-select signal, powering-on the SDI
and SCK buffers and enabling the input shift register. Data
(SDI input) is transferred at the next 24 rising SCK edges.
The 4-bit command, C3-C0, is loaded rst; then the 4-bit
DAC address, A3-A0; and nally the 16-bit data word. The
data word comprises the 16-, 14- or 12-bit input code,
ordered MSB-to-LSB, followed by 0, 2 or 4 dont-care bits

COMMAND*
C3 C2 C1 C0
0
0
0
0 Write to Input Register n
0
0
0
1 Update (Power Up) DAC Register n
0
0
1
0 Write to Input Register n, Update (Power Up) All n
0
0
1
1 Write to and Update (Power Up) n
0
1
0
0 Power Down n
1
1
1
1 No Operation
ADDRESS (n)*
A3 A2 A1 A0
0
0
0
0 DAC A
0
0
0
1 DAC B
0
0
1
0 DAC C
0
0
1
1 DAC D
1
1
1
1 All DACs
*Command and address codes not shown are reserved and should not
be used.

(LTC2604, LTC2614 and LTC2624 respectively). Data can

only be transferred to the device when the CS/LD signal
is low. The rising edge of CS/LD ends the data transfer
and causes the device to carry out the action specied in
the 24-bit input word. The complete sequence is shown
in Figure 2a.
The command (C3-C0) and address (A3-A0) assignments
are shown in Table 1. The rst four commands in the table
consist of write and update operations. A write operation
loads a 16-bit data word from the 32-bit shift register
into the input register of the selected DAC, n. An update

INPUT WORD (LTC2604)

COMMAND
C3

C2

C1 C0

ADDRESS
A3

A2

A1

DATA (16 BITS)

A0

D15 D14 D13 D12 D11 D10 D9

D8 D7 D6 D5

D4

D3

D2

D1 D0

MSB

LSB
2604 TBL01

INPUT WORD (LTC2614)

COMMAND
C3

C2

C1 C0

ADDRESS
A3

A2

A1

DATA (14 BITS + 2 DONT-CARE BITS)

A0

D13 D12 D11 D10 D9

D8 D7 D6 D5

D4

D3

D2

D1 D0

MSB

LSB
2604 TBL02

INPUT WORD (LTC2624)

COMMAND
C3

C2

C1 C0

ADDRESS
A3

A2

A1

DATA (12 BITS + 4 DONT-CARE BITS)

A0

D11 D10 D9
MSB

D8 D7 D6 D5

D4

D3

D2

D1 D0

LSB
2604 TBL03

2604fd

11

LTC2604/LTC2614/LTC2624
OPERATION
operation copies the data word from the input register to
the DAC register. Once copied into the DAC register, the
data word becomes the active 16-, 14- or 12-bit input
code, and is converted to an analog voltage at the DAC
output. The update operation also powers up the selected
DAC if it had been in power-down mode. The data path
and registers are shown in the block diagram.
While the minimum input word is 24 bits, it may optionally
be extended to 32 bits. To use the 32-bit word width, 8
dont-care bits are transferred to the device rst, followed
by the 24-bit word as just described. Figure 2b shows the
32-bit sequence. The 32-bit word is required for daisychain operation, and is also available to accommodate
microprocessors which have a minimum word width of
16 bits (2 bytes).
Daisy-Chain Operation
The serial output of the shift register appears at the SDO
pin. Data transferred to the device from the SDI input is
delayed 32 SCK rising edges before being output at the
next SCK falling edge.
The SDO output can be used to facilitate control of multiple
serial devices from a single 3-wire serial port (i.e., SCK,
SDI and CS/LD). Such a daisy-chain series is congured
by connecting SDO of each upstream device to SDI of the
next device in the chain. The shift registers of the devices
are thus connected in series, effectively forming a single
input shift register which extends through the entire
chain. Because of this, the devices can be addressed and
controlled individually by simply concatenating their input
words; the rst instruction addresses the last device in
the chain and so forth. The SCK and CS/LD signals are
common to all devices in the series.
In use, CS/LD is rst taken low. Then the concatenated
input data is transferred to the chain, using SDI of the
rst device as the data input. When the data transfer is
complete, CS/LD is taken high, completing the instruction
sequence for all devices simultaneously. A single device
can be controlled by using the no-operation command
(1111) for the other devices in the chain.

Power-Down Mode
For power-constrained applications, power-down mode can
be used to reduce the supply current whenever less than
four outputs are needed. When in power-down, the buffer
ampliers, bias circuits and reference inputs are disabled,
and draw essentially zero current. The DAC outputs are
put into a high-impedance state, and the output pins are
passively pulled to ground through individual 90k resistors. Input- and DAC-register contents are not disturbed
during power-down.
Any channel or combination of channels can be put into
power-down mode by using command 0100b in combination with the appropriate DAC address, (n). The 16-bit
data word is ignored. The supply current is reduced by
approximately 1/4 for each DAC powered down. The effective resistance at REF x (pins 3, 6, 12 and 15) are at
high-impedance input (typically > 1G) when the corresponding DACs are powered down.
Normal operation can be resumed by executing any command which includes a DAC update, as shown in Table 1.
The selected DAC is powered up as its voltage output is
updated. When a DAC which is in a powered-down state
is powered up and updated, normal settling is delayed. If
less than four DACs are in a powered-down state prior to
the update command, the power-up delay time is 5s. If on
the other hand, all four DACs are powered down, then the
main bias generation circuit block has been automatically
shut down in addition to the individual DAC ampliers and
reference inputs. In this case, the power up delay time is
12s (for VCC = 5V) or 30s (for VCC = 3V).
Voltage Outputs
Each of the four rail-to-rail ampliers contained in these
parts has guaranteed load regulation when sourcing or
sinking up to 15mA at 5V (7.5mA at 3V).
Load regulation is a measure of the ampliers ability to
maintain the rated voltage accuracy over a wide range of
load conditions. The measured change in output voltage
per milliampere of forced load current change is expressed
in LSB/mA.

2604fd

12

SDI

SDO

SCK

CS/LD

C3

SDI

DONT CARE

C2

2
C1

COMMAND WORD

SCK

CS/LD

C0

A3

A2

6
A1

7
A0

8
D15

9
D14

10
D12

12
D11

13
D10

14

24-BIT INPUT WORD

D13

11
D9

15
D7

17

DATA WORD

D8

16
D6

18
D5

19

C1

11

C2

C1

COMMAND WORD

C2

10

C0

C0

A3

A3

A2

14
A1

15

A2

A1

ADDRESS WORD

13

A0

A0

16
17

D15

D15

PREVIOUS 32-BIT INPUT WORD

12

D14

D14

18

t2

t8

D9

D9

t4

23

PREVIOUS D15

t3

17

D10

D10

22

SDO

t1

D11

D11

21

D15

D12

D12

20

SDI

SCK

D13

D13

19

Figure 2b. LTC2604 32-Bit Load Sequence

LTC2614 SDI/SDO Data Word: 14-Bit Input Code + 2 Dont Care Bits
LTC2624 SDI/SDO Data Word: 12-Bit Input Code + 4 Dont Care Bits

C3

C3

Figure 2a. LTC2604 24-Bit Load Sequence (Minimum Input Word)

LTC2614 SDI Data Word: 14-Bit Input Code + 2 Dont Care Bits
LTC2624 SDI Data Word: 12-Bit Input Code + 4 Dont Care Bits

ADDRESS WORD

24

25
D7

D3

21

18

D7

D6

D6

26

22
D2

PREVIOUS D14

D14

D8

DATA WORD

D8

D4

20

27

D5

D5

D1

23

28

D4

D4

D0

24

D3

D3

29

2604 F02a

D2

D2

30

D1

D1

31

2604 F02b

CURRENT
32-BIT
INPUT WORD

D0

D0

32

LTC2604/LTC2614/LTC2624

OPERATION

2604fd

13

LTC2604/LTC2614/LTC2624
OPERATION
DC output impedance is equivalent to load regulation, and
may be derived from it by simply calculating a change in
units from LSB/mA to Ohms. The ampliers DC output
impedance is 0.025 when driving a load well away from
the rails.

the devices ground pin as possible. Ideally, the analog

ground plane should be located on the component side of
the board, and should be allowed to run under the part to
shield it from noise. Analog ground should be a continuous
and uninterrupted plane, except for necessary lead pads
and vias, with signal traces on another layer.

When drawing a load current from either rail, the output

voltage headroom with respect to that rail is limited by
the 30 typical channel resistance of the output devices;
e.g., when sinking 1mA, the minimum output voltage =
30 1mA = 30mV. See the graph Headroom at Rails vs
Output Current in the Typical Performance Characteristics
section.

The GND pin functions as a return path for power supply currents in the device and should be connected to
analog ground. Resistance from the GND pin to system
star ground should be as low as possible. When a zero
scale DAC output voltage of zero is desired, the REFLO pin
(pin 2) should be connected to system star ground.

The ampliers are stable driving capacitive loads of up

to 1000pF.

Rail-to-Rail Output Considerations

In any rail-to-rail voltage output device, the output is limited
to voltages within the supply range.

Board Layout
The excellent load regulation and DC crosstalk performance
of these devices is achieved in part by keeping signal
and power grounds separate.

Since the analog outputs of the device cannot go below

ground, they may limit for the lowest codes as shown in
Figure 3b. Similarly, limiting can occur near full scale when
the REF pins are tied to VCC. If REF x = VCC and the DAC
full-scale error (FSE) is positive, the output for the highest
codes limits at VCC as shown in Figure 3c. No full-scale
limiting can occur if REF x is less than VCC FSE.

The PC board should have separate areas for the analog

and digital sections of the circuit. This keeps digital signals
away from sensitive analog signals and facilitates the use
of separate digital and analog ground planes which have
minimal capacitive and resistive interaction with each
other.

Offset and linearity are dened and tested over the region
of the DAC transfer function where no output limiting
can occur.

Digital and analog ground planes should be joined at only

one point, establishing a system star ground as close to

VREF = VCC

VREF = VCC

POSITIVE
FSE

OUTPUT
VOLTAGE

OUTPUT
VOLTAGE
INPUT CODE
OUTPUT
VOLTAGE

(c)
0

NEGATIVE
OFFSET

0V
INPUT CODE

32,768
INPUT CODE

65,535

(a)
2600 F03

(b)
Figure 3. Effects of Rail-to-Rail Operation On a DAC Transfer Curve. (a) Overall Transfer Function (b) Effect
of Negative Offset for Codes Near Zero Scale (c) Effect of Positive Full-Scale Error for Codes Near Full Scale
2604fd

14

LTC2604/LTC2614/LTC2624
PACKAGE DESCRIPTION
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 .196*
(4.801 4.978)

.045 .005

16 15 14 13 12 11 10 9

.254 MIN

.009
(0.229)
REF

.150 .165
.229 .244
(5.817 6.198)

.0165 .0015

.150 .157**
(3.810 3.988)

.0250 BSC

RECOMMENDED SOLDER PAD LAYOUT

1
.015 .004
45
(0.38 0.10)
.007 .0098
(0.178 0.249)

2 3

5 6

.0532 .0688
(1.35 1.75)

8
.004 .0098
(0.102 0.249)

0 8 TYP

.016 .050
(0.406 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)

.008 .012
(0.203 0.305)
TYP

.0250
(0.635)
BSC

GN16 (SSOP) 0204

3. DRAWING NOT TO SCALE

*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

2604fd

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

15

LTC2604/LTC2614/LTC2624
TYPICAL APPLICATION
5V

5V
1k

1k

10k

10k

0.1F

10k
0.01F

0.1F

10k

20

49.9

70MHz IN
47pF

ZC830

0.01F
OUT

10pF

49.9
20pF

49.9

ZC830

DAC A

DAC B

DAC C

DAC D

OPTIONAL
20k
0.1F

OPTIONAL
20k
0.1F

CS/LD
SCK
SDI
LTC2604

5V

5V
LO

2.74k
1%

100k

2.74k
1%

100k

2.74k
1%

90

2.74k
1%

I+Q
MODULATOR

Q INPUT

I INPUT

5V

5V
2.74k
1%

2.74k
1%

RF
*ZETEX

2.74k
1%
2.74k
1%
2604 F04

(516) 543-7100

Figure 4. Using DAC A and DAC B for Nearly Continuous Attenuation Control and DAC C and
DAC D to Trim for Minimum LO Feedthrough in a Mixer

RELATED PARTS
PART NUMBER

DESCRIPTION

COMMENTS

LTC1458/LTC1458L

Quad 12-Bit Rail-to-Rail Output DACs with Added Functionality

LTC1458: VCC = 4.5V to 5.5V, VOUT = 0V to 4.096V

LTC1458L: VCC = 2.7V to 5.5V, VOUT = 0V to 2.5V

LTC1654

Dual 14-Bit Rail-to-Rail VOUT DAC

Programmable Speed/Power

LTC1655/LTC1655L

Single 16-Bit VOUT DAC with Serial Interface in SO-8

VCC = 5V(3V), Low Power, Deglitched

LTC1657/LTC1657L

Parallel 5V/3V 16-Bit VOUT DAC

Low Power, Deglitched, Rail-to-Rail VOUT

LTC1660/LTC1665

Octal 8-Bit/10-Bit VOUT DAC in 16-Pin Narrow SSOP

VCC = 2.7V to 5.5V, Micropower, Rail-to-Rail Output

LTC1821

Parallel 16-Bit Voltage Output DAC

Precision 16-Bit Settling in 2s for 10V Step

LTC2600/LTC2610/LTC2620

Octal 16-Bit/14-Bit/12-Bit Rail-to-Rail DACs in 16-Lead SSOP

250A per DAC, 2.5V to 5.5V Supply Range

LTC2602/LTC2612/LTC2622

Dual 16-Bit/14-Bit/12-Bit Rail-to-Rail DACs in 8-Lead MSOP

300A per DAC, 2.5V to 5.5V Supply Range

2604fd

16 Linear Technology Corporation

LT 0309 REV D PRINTED IN USA

1630 McCarthy Blvd., Milpitas, CA 95035-7417

(408) 432-1900 FAX: (408) 434-0507

www.linear.com

LINEAR TECHNOLOGY CORPORATION 2004