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Design of Low Power 4-Bit Flash ADC Based on

Standard Cells
Marcel Siadjine Njinowa,Hung Tien Bui

Franois-Raymond Boyer

Department of Applied Sciences


Universit du Qubec Chicoutimi
msiadjine@gmail.com,ht2bui@uqac.ca

Department of Computer Engineering


Ecole Polytechnique de Montral
Francois-R.Boyer@Polymtl.ca

AbstractIn this paper, a standard cell low power 4-bit flash


analog-to-digital converter (ADC) is proposed. The converter
utilizes comparators created using only logic gates for
converting analog input signals to digital values. This novel flash
architecture consists of several CMOS gates with inputs
connected to a common input node or to one of the supply lines.
Depending on the relationship between the input signal and a
given gates threshold voltage, the output will either be 0 or
1. The comparator is followed by an encoder to convert the
thermometer code to binary code. Low power consumption is
achieved by switching off the unused parallel voltage
comparators. The proposed ADC was implemented at the
transistor level in a 180nm CMOS technology with a 1.8 V
supply voltage and was simulated using Cadence Spectre
simulator. Simulation results show that for the same speed, this
ADC provides about 70% power reduction compared to a
previously proposed design.

I.

INTRODUCTION

The ADC is a key component in many modern electronics


systems. For high-speed applications, flash and pipeline
ADCs are often used. The flash type is the faster of the two,
but limited to lower resolution and consumes more power due
to a large number of components. In applications such as onchip direct digitization of a wideband RF signal and digital
receivers, flash architectures are often preferred [1].
Many flash ADCs architectures [2-4] are reported in the
literature. Traditionally, flash converters include 2N-1
comparators for N-bit resolution and have the advantage of
having a very high sampling frequency. However, this
structure occupies a large area and consumes a large amount
of power when its resolution becomes high. This is not
desirable for low power applications. To improve the design
of flash type converters, several architectures have been
proposed such as the two-stage architecture [5, 6], the folding
and averaging converters [7, 8]. The major issue with these
approaches is that it uses analog components that are difficult

978-1-4799-0620-8/13/$31.00 2013 IEEE

to integrate and whose performances are degraded as


technology scales down. Furthermore, these ADCs need high
gain differential comparators that are inherently more complex
and require a resistor ladder circuit to deliver reference
voltages. Other disadvantages of this approach are the
reduction in throughput and poor differential linearity.
Recently, some authors have proposed simple and faster flash
converters based on the TIQ technique (Threshold Inverter
Quantization) [9-12]. Although this technique reduces the
complexity of the converter, it is sensitive to process variation
and consumes considerable power. The idea behind this
technique is to use the digital inverter as an analog voltage
comparator. By keeping the transistor length constant and by
varying its width, one can adjust the comparators threshold.
Varying the transistor width to obtain correct configuration,
however, is a long and repetitive task. To reduce the required
design time and also reduce the risk of having non functional
designs, it is therefore interesting to investigate ways to
migrate these designs into a more digital form by using
standard-cells.
In this paper, we propose an ADC that can be fully
implemented using only standard-cells. This allows the
designer to stay within the mature digital design flow and
effectively reduce risks and time-to-market.
The rest of this paper is organized as follows. In Section II,
the design of the ADC is described in details, considering each
basic building block. Section III reports the transistor-level
simulations of the proposed flash ADC. Finally, conclusions
are drawn in Section IV.

II.

ADC DESIGN

The proposed 4-bit flash architecture shown in Fig. 1


consists of two main components: a bank of comparators and
an encoder.

whose inputs are respectively connected to VIN and 1. In


such a configuration, the gate operates like an inverter but the
threshold will be lower than that of the inverter. In addition,
by connecting a gate parallel to an initial gate, one can also
increase or decrease its threshold voltage. Mathematically,
the threshold voltage of a gate calculated as being [12]:
VG TH =

C
C

Figure 1.Proposed 4-bit flash ADC

A. Comparator
Flash ADCs generate the output by comparing the input
signal with all the reference voltages. In the case of the
proposed system, the threshold voltage of each gate serves as
a reference voltage. We define the threshold as the input
voltage at which the output voltage is VDD/2. The
comparators with a threshold voltage above the input value
will output 0 whereas the ones with lower threshold
voltages will output 1. This is what generates the
thermometer code output.
To explain the principle of operation, let us consider a Kinput NAND (K=2, 3, 4) gate whose inputs are connected
together. In such a configuration, the gate operates much like
an inverter. If the NMOS and the PMOS gates had identical
VTH and were sized to have identical COX(W/L), the threshold
of the NAND would be higher than that of the inverter and
NOR gates. This is because, for the same VGS, the PMOS
network would generate more current since it has a parallel
connection whereas the NMOS network has a series
connection. For the currents to be equal, the NMOS
transistors would need to have higher VGS which explains the
rise in gates threshold voltage. A similar reasoning can be
applied to NOR gates. Let us consider a 2-input NAND gate

VDD VTH + M VTH


M +1

(1)

In this equation M is the number of NMOS transistors connected in


parallel (M becomes fractional when NMOS are connected in
series), VTH is the threshold voltage of both PMOS and NMOS
transistors and VDD is the supply voltage. Using this technique,

however, one of the drawbacks is the limited input voltage


range which is limited to between VTH and VDD-VTH.
In the proposed architecture, the logic gates include
controllable inputs to allow the gates to operate in stand-by or
active mode. For active mode, the controllable inputs of NOR
gates are set to 0 and those of the NAND gates are set to
1.This situation is shown in Figure 1. It is important to note
that the inverter at the top of this figure is set to 0. The
purpose of this is to increase the threshold of this comparator.
For stand-by mode, the controllable inputs of NOR
gates are set to 1 and those of the NAND gates are set to
0. In this case, the NAND and NOR gates output 1 and 0
respectively for any given input. This leads to a reduction in
power consumption of the comparator in the case where the
input voltage is not VDD or VSS and the ADC is not in
operation. When the comparator consists of a NAND and a
NOR gate, this type of connection can lead to a short circuit
current. However, tests show that this short circuit current
dissipates less power than the power it saves by going into
standby.
B. Encoder
The encoder is often found to be the bottleneck of many flash
ADCs. To help maximize operating speed, the proposed
design uses the Fat-tree method [13, 14] since it is faster than
other types of encoders.
III.

SIMULATION RESULTS

In this section, the functional simulation of the proposed


ADC is presented. In addition, a thorough characterization
process was performed to ensure its suitability for high speed
and low power applications.
A. Functional Simulation
To ensure the functionality of the design, transient and DC
analyses were performed. The simulation results from Fig. 2
show that the output results are correct. The top plot shows
the voltage ramp introduced at the input for the simulation.
The four bottom plots show the output of the ADC, with the
lowest plot representing the LSB. It can be shown from the
figure that the bit duration at the output is not even. This is
not due to a non-linearity issue but rather to uneven response

and step width is small. In absence of device mismatch, the


error is bounded within 0.005 LSB.

0.2

IN L i

0.2

DNLi

times of the different comparators. Fig. 3 shows the DC


response of the proposed ADC. This figure shows that the
intervals between two adjacent comparators are similar thus
minimizing the risk of having missing codes.
As previously mentioned, the input voltage range is
limited to between VTH and VDD-VTH. With the chosen
fabrication technology, this translates to a minimum value of
0.587v and a maximum of 1.102v. For a 4-bit ADC, the LSB
value is found to be 36.7mV.

-0.2

2 4 6 8 10 12 14

i
a) DNL

-0.2

2 4 6 8 10 12 14

i
b) INL

Figure 4. a) DNL and b) INL Curves for the Proposed 4-bit


ADC

Figure 2. Transient Analysis of 4-Bit ADC

Figure 3. DC Response of the Proposed 4-Bit ADC

B. Spefications
In order to ensure that the conversion errors of the proposed
ADC are within the specification limits, it is important to
perform tests to validate it. In this paper, these conversion
errors are characterized by the differential non linearity (DNL)
and integral non linearity (INL) as shown in fig. 4. From these
figures, we can observe that any deviation from the ideal line

To measure the dynamic parameters of the ADC, an ideal


sine wave is applied to the input and the digitized output
signal is converted to its frequency-domain representation.
The frequency domain representation is used to characterize
the dynamic parameters of the ADC. In our test, the input
signal is a 1MHz sine wave. The ADC outputs a digital sine
wave which is converted back into the analog domain using
an ideal DAC and a low-pass filter. Both the input and the
resulting sine waves are shown in Fig. 5. The frequency
domain representation of the output signal is shown in Fig. 6
where the fundamental component is at 1 MHZ. From this
spectral representation, the ADC dynamic parameters can be
measured. The signal-to-noise ratio (SNR) and spurious-free
dynamic range (SFDR) values are respectively 56.14 dB and
25.16 dB which are considered adequate [4].
The performance comparison between the proposed ADC
and state-of-the-art designs is presented in Table I. In terms
of power consumption and conversion speed, data show that
the proposed design has significantly better performance. For
the same resolution, the proposed ADC provides 66% and
44% lower power consumption when compared to [5] and
[6], respectively. The only design that achieved lower power
consumption was the one proposed in [11]. However, this
design has lower resolution and can only operate at lower
speeds. In addition to consuming less power than comparable
designs, the proposed ADC design has the advantage of being
portable.
Further simulations have been done to test the proposed
designs robustness to variations in process, temperature and
supply voltage. According to the results, the proposed ADC is
monotonic and very linear. Considering the PVT change, the
DNLs remain within acceptable range until the temperature
reaches 85oC, the supply voltage reaches 1.89 V and when the
fabrication process is considered FAST-FAST. Thus, the
proposed ADC has the same drawbacks as other TIQ ADCs: it
is sensitive to process, temperature and supply voltage
variations. To minimize some of these drawbacks, it is
possible to employ certain techniques such as isolating the
substrate or filtering the supply voltage.

using Cadences Spectre simulator. The DC and AC analyses


of the proposed ADC have also been done. Results show that
this ADC offers excellent characteristics when compared to
circuits with similar characteristics. It offers very low power
consumption while its conversion rate is fast at approximately
400 MS/s. With these performances, the proposed ADC may
well be suitable for complete SoC integration.
ACKNOWLEDGMENT
The authors would like to acknowledge financial support
from NSERC and RESMiQ.
REFERENCES
Figure 5. ADC Input and Output Signals

[1]

[2]
[3]

[4]

[5]

[6]

Figure 6. Frequency domain representation


[7]

Characteristic

This
Work

[5]

[6]

[11]
[8]

Technology
0.18
0.18
0.35
0.8
(m)
Resolution
4
4
4
3
Input analog 0.587 ~
0.5~1.9
range(V)
1.102
DNL(LSB)
0.0016
0.4
0.2/-0.9
0.33
INL(LSB)
0.024
1.1
0.2/-0.5
0.22
Power
6.9mW
20mW
12.4mW
4.86 mW
consumption
Sampling
400
400
200
300 MHz
Speed
MHz
MHz
MSPS
Portability
YES
NO
NO
NO
Table I: Comparison with state-of-the-art designs

[9]

[10]

[11]

[12]

[13]

IV.

CONCLUSION

In this paper, a novel 4-bit flash ADC, called standard cells


flash ADC, has been developed. Using a parallel combination
of inverters, NAND gates and NOR gates, it was possible to
obtain comparators with different thresholds. To test its
functionality, transistor-level simulations have been executed

[14]

M. Wang and C. H. Chen, A High Spurious-Free Dynamic Range 4bit ADC with Nyquist Signal Bandwidth for Wideband
Communication, Proceedings of IEEE Instrumentation and
Measurement Technology Conference, Warsaw, Porland, May 1-3,
2007.
S. Naraghi and D. Johns, A 4-analog-to-digital converter for high
speed serial, Micronet annual Workshop, pp. 3334, April 2004
S. T. Yamamoto, S. -I. Gotoh, T. Takahashi, K. Irie, K. Ohshima and
N. Mimura, A mixed-signal 0.18 um CMOS SoC for DVD systems
with 432-Msample/s PRML read channel and 16-Mb embedded
DRAM, IEEE Journal of Solid- State Circuits, vol. 36, pp. 1785
1794, November 2001
D. J. Foley and M. P, Flynn, A low-power 8-PAM serial transceiver
in 0.5 um digital CMOS, IEEE Journal of Solid-State Circuits, vol. 37,
pp. 310316, March 2002
S. Banik, D. Gangopadhyay, T.K. Bhattacharyya, A Low Power 1.8 V
4-Bit 400 MHz Flash ADC in 0.18 um Digital CMOS, International
Conference on Embedded Systems and Design, 2006
S. S. Chauhan, S. Manabala, S. C. Bose, R. Chandel A New
Approach To Design Low Power CMOS Flash A/D Converter,
International Journal of VLSI design & Communication Systems, June
2011
J. Vandenbussche, K. Uyttenhove, E. Lauwers, M. Steyaert and G.
Gielen, A 8-bit 200 MS/s Interpolation/Averaging CMOS A/D
Converter, IEEE Custom
Y. Li, and E. S. Sinencio, A Wide Input Bandwidth 7-bit 300MSample/s Folding and Current-Mode Interpolating ADC, IEEE
Journal of Solid-State Circuit, Vol.38, No. 8, August 2003, pp. 14051410.
J. Yoo, K. Choi, and J. Ghaznavi, Quantum Voltage Comparator for
0.07 m CMOS Flash A/D Converters, IEEE Computer Society
Annual Symposium on VLSI, pp. 135139, April 2003.
M. Wang, C. H. Chen, and S. Radhakrishnan, Low-power 4-b 2.5
GSPS Pipelined Flash Analog-to-Digital Converter in 130 nanometer
CMOS, IEEE Transactions on Instrumentation and Measurement,
Vol. 56, No. 3. pp 10641073, June 2007
P. Iyappan, P. Jamuna, and S. Vijayasamundiswary, Design of analog
to digital converter using CMOS logic, International Conference on
Advances in Recent Technologies in Communication and Computing,
2009
M. Njinowa, H. Bui and F. Boyer, Novel Threshold-Based StandardCell Flash ADC, Circuits and Systems, Vol. 3, No. 1, pp. 2934,
January 2012.
L. Daegyu, Y. Jincheol, C. Kyusun, and J. Ghaznavi, Fat tree encoder
design for ultra high speed flash A/D converters, in Circuits and
Systems,the 45 th Midwest Symposium on, pp. 8790, 2002
B. V. Hieu, S. Choi, Y. Oh, C. Park, J. Park, H. Kim and T. Jeong, A
New Approach to Thermometer-to-Binary Encoder of Flash ADCsBubble Error Detection Circuit, Phil. Trans. Roy. Soc. London, Vol.
A247, pp. 529551, April 1955

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