Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
Technologies de l'informatiON
INRIA Rennes Bretagne Atlantique IRISA UMR CNRS 6074
UMR CNRS 5270 - Institut des Nanotechnologies de Lyon Ecole Centrale de Lyon
Optical Layer
Memory Layer
Processing Layer
Computation
NoC
HO-COMP
HE-COMP
Communication
HO-COMM
HE-COMM
Monitors
Application
Benchmark
Analysis tools
Models:
Flexible (Parameterized)
Support different computation, memory and communication
components
Processors, accelerators
Memory organizations (shared, distributed)
Electrical NoC, Bus, crossbar, optical NoC
Simulation:
Scalable
Fast
Parallel
Framework:
Documented
Accepted by the scientific community
Acceptable complexity
Free if possible
Tool
Language
Type of model
Simics
C++, Fortran
Functionalaccurate
SimpleScalar
Cycle-accurate
OVP
SystemC
Instructionaccurate
Rabbits
SystemC,
QEMU
Cycle-accurate
Gem5
C++, Python
Cycle-accurate
Components
Processors (ALPHA,
ARM,MIPS, Power PC,
SPARC, x86)
O.S (Linux, VxWorks,
Solaris, FreeBSD, QNX
RTEMS)
Processors (ALPHA, ARM,
Power PC, x86)
O.S (Linux)
Processors (Open Cores,
RISC, ARM,MIPS, Power
PC, MicroBlaze,..)
O.S (Linux)
Processors (ARM, x86,
Power PC)
Processors (ALPHA, ARM,
Power PC, MIPS, SPARC,
x86)
O.S (Linux, Android,..)
Memory
architecture
Documented
Availability
Yes (***)
Wind River
System
Liscenced
No anymore
Open
Yes (**)
Imperas
Open/
Liscenced
Yes (*)
Open
Yes (***)
Open
COMM-design
Model 1
HO-COMP
HO-COMM SM
Model 1b
HO-COMP
HO-COMM
DM
Model 3
HE-COMP
HO-COMM
Model 3b
HE-COMP
HO-COMM
DM
Model 5
HE-COMP (GPU)
HO-COMM
Model 5b
HE-COMP (GPU)
HO-COMM DM
COMP-design
Model 2
HO-COMP
HE-COMM
Model 4
HE-COMP
HE-COMM
Model 6
HE-COMP (GPU)
HE-COMM
Existing models
2014
P. Grani, From Hybrid Electro-Photonic to All-Optical On-chip Interconnections for Future CMPs. In Proc.
International conference on High Performance Computing & Simulation (HPCS), 2014.
P. Grani, Sandro Bartolini. Simultaneous Optical Path Setup for Reconfigurable Photonic Networks in Tiled CMPs. In
Proc. International conference on High Performance Computing & Simulation (HPCS), 2014.
Z. Li, A. Qouneh, M. Joshi, W. Zhang, X. Fu, T. Li. Aurora: A Cross-Layer Solution for Thermally Resilient Photonic
Network-on-Chip. In IEEE Transactions on Very Large Scale Integration (VLSI) Systems, February, 2014.
Processing:
Computation:
Call of different processors
Memory mapping
Communication:
New optical components (garnet/simple network)
Modification in protocols (ruby management)
3D Latency and bandwidth model (link and router
parameters)
Memory:
Distributed memory management
3D design
Topology exploration
(Islands, stacked, clusters)
Thermal management
Routing
(Crosstalk avoidance, adaptive)
Mapping
(Performance, cost and thermal)
Complexity
(*)
(***)
(**)
(**)
Protocol
Protocol exploration
Services for optical networks
(QoS and security)
(**)
(**)
Applications
Traffic patterns
Benchmarking
(*/**/***)
Other applications (Neural coding)
(*)
(*)
Thermal issues?
Distributed memory?
(*/**/***)
Delay
Mandatory
queue
Ruby
Port
Sequencer
L1
Cache
controller
L1 latency
DIRECTORY
RUBY
Mem
controller
Message
Buffer
Message
Buffer
Message
Buffer
Message
Buffer
Mem
controller
1.
2.
3.
4.
MessageBuffer
Entry point of coherence messages to the NoC
Connected according the NoC topology
5.