c01885192 PDF

HP Integrity cx2620 Site Preparation Guide
HP Part Number: AB587-96013

Published: January 2007
Copyright 2007 Hewlett-Packard Development Company, L.P

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The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
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Table of Contents
About This Document.......................................................................................................11
Intended Audience...................................................................................................................................11
New and Changed Information in This Edition..........................................................................................11
Publishing History...................................................................................................................................11
Document Organization...........................................................................................................................11
Typographic Conventions...................................................................................................................11
Related Information.................................................................................................................................12
HP Encourages Your Comments...............................................................................................................12
1 System Specifications...................................................................................................13
System Configuration...............................................................................................................................13
Dimensions and Weights..........................................................................................................................14
Electrical Specifications............................................................................................................................14
dc Source and Main dc Power Disconnect.............................................................................................14
Grounding the Server..........................................................................................................................15
Disconnect Device and Branch Circuit Protection..................................................................................16
System Power Specifications................................................................................................................16
Environmental Specifications....................................................................................................................17
Temperature and Humidity.................................................................................................................17
Operating Environment......................................................................................................................17
Environmental Temperature Sensor.....................................................................................................17
Non-operating Environment................................................................................................................17
Cooling..............................................................................................................................................18
Overall System Cooling.................................................................................................................18
CPU/Memory Cooling...................................................................................................................18
Power Supply Cooling...................................................................................................................19
PCI-X/Mass Storage Section Cooling...............................................................................................19
Typical Power Dissipation and Cooling...........................................................................................19
Acoustic Noise Specification................................................................................................................19
Physical and Environmental Specifications................................................................................................19
2 General Site Preparation Guidelines.........................................................................21

Electrical Factors......................................................................................................................................21
Synopsis.............................................................................................................................................21
DC Electrical Distribution System...................................................................................................21
AC Power Quality Devices.............................................................................................................22
UPS Recommendations..................................................................................................................22
Power Consumption......................................................................................................................22
Grounding Systems.......................................................................................................................22
Comprehensive Discussion..................................................................................................................23
Computer Room Safety.......................................................................................................................23
Fire Protection...............................................................................................................................23
Fire Suppression............................................................................................................................24
Lighting Requirements for Equipment Servicing.............................................................................24
Cabinet Recommendations.............................................................................................................24
Working Space for Server Access....................................................................................................24
Power Consumption...........................................................................................................................24
Electrical Load Requirements (Circuit Breaker Sizing)...........................................................................25
Power Quality....................................................................................................................................25
Sources of Voltage Fluctuations......................................................................................................25
Power System Protection................................................................................................................25
Distribution Hardware........................................................................................................................26
Wire Selection...............................................................................................................................26
Table of Contents
Raceway Systems (electrical conduits) (LAHJ).................................................................................26

Building Distribution.....................................................................................................................26
Grounding Systems............................................................................................................................26
Power Distribution Safety Grounding (LAHJ)..................................................................................26
Cabinet Performance Grounding (High Frequency Ground).............................................................27
Raised Floor High Frequency Noise Grounding...........................................................................27
Equipment Grounding Implementation Details...............................................................................28
System Installation Guidelines.............................................................................................................29
Wiring Connections.......................................................................................................................29
Data Communications Cables.........................................................................................................29
Environmental Elements...........................................................................................................................29
Synopsis.............................................................................................................................................29
Air Quality....................................................................................................................................29
Airflow.........................................................................................................................................30
Equipment Orientation..................................................................................................................30
Electrostatic Discharge...................................................................................................................30
Cellular Telephone and Wireless Usage...........................................................................................31
Comprehensive Discussion..................................................................................................................31
Computer Room Preparation...............................................................................................................31
Airflow..............................................................................................................................................31
Row Orientation............................................................................................................................32
Dust and Pollution Control............................................................................................................32
Metallic Particulate Contamination.................................................................................................32
Cooling Requirements.........................................................................................................................33
Basic Air Conditioning Equipment Requirements............................................................................33
Air Conditioning System Guidelines...............................................................................................33
Air Conditioning System Types......................................................................................................34
Basic Air Distribution Systems.......................................................................................................34
Air Conditioning System Specifications..........................................................................................35
Air Conditioning Ducts..................................................................................................................35
Humidity Level..................................................................................................................................35
Electrostatic Discharge (ESD) Prevention..............................................................................................35
Humidity Levels Influence the Creation of Static Charges......................................................................35
Relative Humidity..............................................................................................................................36
Static Protection Measures...................................................................................................................36
Acoustics...........................................................................................................................................36
Facility Characteristics..............................................................................................................................36
Floor Loading.....................................................................................................................................36
Floor Loading Terms......................................................................................................................36
Raised Floor Loading.....................................................................................................................37
Average Floor Loading..................................................................................................................37
Typical Raised Floor Site................................................................................................................37
Windows............................................................................................................................................38
Space Requirements.................................................................................................................................38
Delivery Space Requirements..............................................................................................................38
Operational Space Requirements.........................................................................................................38
Floor Plan Grid...................................................................................................................................39
Power Plug Configuration........................................................................................................................39
Conversion Factors and Formulas.............................................................................................................42
Example of an Installation Schedule..........................................................................................................43
Sample Site Inspection Checklist...............................................................................................................43
Delivery Survey.......................................................................................................................................46
A Physical and Environmental Specifications...............................................................49

Glossary............................................................................................................................51
Table of Contents
Index.................................................................................................................................53
Table of Contents
List of Figures
1-1
1-2
1-3
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
2-13
2-14
HP Integrity cx2620 Server............................................................................................................14

Chassis Ground Lug......................................................................................................................15
Airflow Through the Server..........................................................................................................18
Raised Floor Metal Strip Ground System......................................................................................28
C20 Male Receptacle (at Power Supply)........................................................................................40
C19 Female Plug (on One End of the Power Cord).......................................................................40
Unterminated Plug........................................................................................................................40
L6-20 Plug......................................................................................................................................40
IEC 309 Plug..................................................................................................................................41
CEE 7-7 Plug..................................................................................................................................41
L6-30 Plug......................................................................................................................................41
NEMA 5-20P Plug (left) and receptacle (right).............................................................................41
ISI 32 Plug....................................................................................................................................41
L6-20 Power Cable.......................................................................................................................42
L6-20 Power Cable.......................................................................................................................42
Delivery Survey (Part 1)..............................................................................................................46
Delivery Survey (Part 2)..............................................................................................................47
List of Tables
1
Publishing History Details.................................................................................................................11
1-1
Minimum/Maximum Configuration.............................................................................................13
1-2
Server Dimensions and Weights....................................................................................................14
1-3
System Power Specifications.........................................................................................................16
1-4
System Power Requirements.........................................................................................................16
1-5
CPU Power Consumption.............................................................................................................17
1-6
Minimum and Maximum Airflow Rates for cx2620 Chassis........................................................18
1-7
Typical Configuration Power Consumption Values......................................................................19
1-8
.......................................................................................................................................................2 0
2-1
Effect of Humidity on ESD Charge Levels....................................................................................36
2-2
Floor Loading Term Definitions....................................................................................................37
2-3
Typical Raised Floor Specifications...............................................................................................38
2-4
Product Technical Requirements Based on Customer Environments..........................................39
2-5
Customer and Hewlett-Packard Information................................................................................44
2-6
Site Inspection Checklist................................................................................................................44
A-1
.......................................................................................................................................................4 9
10
About This Document

This document describes how to prepare your site for installation of your HP Integrity cx2620
server.
The document printing date and part number indicate the documents current edition. The
printing date changes when a new edition is printed. Minor changes may be made at reprint
without changing the printing date. The document part number changes when extensive changes
are made.
Document updates may be issued between editions to correct errors or document product changes.
To ensure that you receive the updated or new editions, subscribe to the appropriate product
support service. See your HP sales representative for details.
The latest version of this document can be found on the Web at:
http://www.docs.hp.com
Intended Audience
This document is intended to provide technical product and support information for authorized
service providers, customer system administrators, and HP support personnel.
New and Changed Information in This Edition

This document release includes the following updates:
Combined the Service Guide with the Installation Guide and the Site Preparation Guide.
Revised the memory DIMMs loading procedure.
Revised the graphic of the LAN ports.
Publishing History
Table 1 lists the publishing history details for this document.
Table 1 Publishing History Details
Document Manufacturing Part Number
Publication Date
AB587-96013
January 2007
AB58796008
September 2006
Document Organization
The HP Integrity cx2620 Site Preparation Guide contains the following chapters:
Chapter 1
System SpecificationsThis chapter provides the server's weight, dimensions,
electrical, physical, and environmental specifications.
Chapter 2
General Site Preparation Guidelines Use this chapter to prepare the computer
room facility for the server.
Typographic Conventions
This document uses the following conventions:
audit(5)
Book Title
An HP-UX manpage. In this example, audit is the name and 5 is the section in
the HP-UX Reference. On the Web and on the Instant Information CD, it may
be a hot link to the manpage itself. From the HP-UX command line, you can
enter man audit or man 5 audit to view the manpage. See man(1).
The title of a book. On the Web and on the Instant Information CD, it may be
a hot link to the book itself.
Intended Audience
11
KeyCap
Emphasis
Bold
Bold
ComputerOut
UserInput
Command
Variable
[]
{}
...
|
The name of a keyboard key. Note that Return and Enter both refer to the
same key.
Text that is emphasized.
Text that is strongly emphasized.
The defined use of an important word or phrase.
Text displayed by the computer.
Commands and other text that you type.
A command name or qualified command phrase.
The name of a variable that you may replace in a command or function or
information in a display that represents several possible values.
The contents are optional in formats and command descriptions. If the contents
are a list separated by a pipe (|), you must choose one of the items.
The contents are required in formats and command descriptions. If the contents
are a list separated by a pipe (|), you must choose one of the items.
The preceding element may be repeated an arbitrary number of times.
Separates items in a list of choices.
Related Information
You can find other information on HP server hardware management and diagnostic support
tools on the following Web sites.
Web Site for HP Technical Documentation:
Server Hardware Information:
http://www.docs.hp.com
http://www.docs.hp.com/hpux/hw/
Diagnostics and Event Monitoring: Hardware Support Tools

Complete information about HPs
hardware support tools, including online and offline diagnostics and event monitoring tools, is
at :http://www.docs.hp.com/hpux/diag/
HPs IT resource center Web site:
http://us-support2.external.hp.com/ This site
provides comprehensive support information for IT professionals on a wide variety of topics,
including software, hardware, and networking.
You can find other information on HP server hardware management and diagnostic support
tools in the following publications.
Books about HP-UX Published by Prentice Hall
The http://www.hp.com/hpbooks/ Web
site lists the HP books that Prentice Hall currently publishes, such as HP-UX books including:
HP-UX 11i v2 System Administration Handbook
http://www.hp.com/hpbooks/prentice/ptr_0130600814.html
HP-UX Virtual Partitions
http://www.hp.com/hpbooks/prentice/ptr_0130352128.html
HP Books are available worldwide through bookstores, online booksellers, and office and
computer stores.
HP Encourages Your Comments

HP encourages your comments concerning this document. We are truly committed to providing
documentation that meets your needs.
Send comments to:
netinfo_feedback@cup.hp.com
Include document title, manufacturing part number, and any comments, errors found, or
suggestions for improvement you have concerning this document. Also, please include what we
did right so we can incorporate it into other documents.
12
About This Document
1 System Specifications
This chapter provides information on the basic system configuration, physical specifications,
and requirements for the HP Integrity cx2620 server.
This chapter addresses the following topics:
System Configuration (page 13)
Dimensions and Weights (page 14)
Electrical Specifications (page 14)
Environmental Specifications (page 17)
Physical and Environmental Specifications (page 19)
System Configuration
Table 1-1 lists the minimum and maximum configurations for the server.
Table 1-1 Minimum/Maximum Configuration
System Name
Minimum
Maximum
CPU
One
Two
One
Two
Power Supplies1
Memory
32 GB (8 X 4 GByte DIMMs)
Optional Internal Disks
One Hot Plug Disk Drive:36 GB Three Hot Plug Disk Drives: 36 GB
15K Ultra 320 or 73 GB 15K HDD 15K Ultra 320 or 73 GB 15K HDD or
or 146 GB 10K HDD
146 GB 10K HDD
Optional Internal Media
One DVD or One CD-RW / DVD One DVD, or one CD-RW/DVD
Optional I/O
1 GB (4 X 256 MByte DIMMs)
Zero
Four 64-bit, 133 MHz PCI-X slots

holding any of the following: Four
port 100base TX Ethernet LAN
adapter
The standard configuration of the server includes two power supplies. While only one power supply can be used
to power the HP server, N+1 redundancy requires that a second power supply be installed. In normal operations,
both power supplies are in use at all times.
System Configuration
13
Figure 1-1 HP Integrity cx2620 Server
chasoblq
Dimensions and Weights

This section provides dimensions and weights of the server.
Table 1-2 Server Dimensions and Weights
Dimension
Value
Height
17.8 cm (7 in) (4U)
Width
44.5 cm (17.5 in)
Depth
50.8 cm (20 in)
Weight
28.1 kg (62 lb) Unloaded

31.75 kg (70 lb) Fully loaded
Electrical Specifications
This section provides electrical specifications for the server.
CAUTION:
Connection with a dc source should only be performed by trained service personnel.
dc Source and Main dc Power Disconnect

The server with dc input is to be installed in a Restricted Access Location in accordance with
articles 110-16, 110-17, and 110-18 of the National Electric Code, ANSI/NFPA 70. The dc source
14
System Specifications
must be electrically isolated by double or reinforced insulation from any hazardous ac source.
The dc source must be capable of providing up to 650 Watts of continuous power per feed pair.
WARNING! You are responsible for installing a properly rated dc power disconnect for the
server system. This main disconnect must be readily accessible, and it must be labeled as
controlling power to the server. The circuit breaker of a centralized dc power system may be
used as a disconnect device when easily accessible and should be rated no more than 10 amps.
Grounding the Server

The site building shall provide a safety ground/protective earth ground to all cabinets. The
required chassis grounding lug for NEBS compliance is provided on the server rear panel
(Figure 1-2).
WARNING! To avoid the potential for an electrical shock hazard, you must reliably connect
an earth grounding conductor to the server. The earth grounding conductor must be a minimum
14AWG connected to the earth ground stud(s) on the rear of the server. The safety ground
conductor should be connected to the chassis stud with a Listed closed two-hole crimp terminal
with a maximum width of 0.25 inch. The nuts on the chassis earth ground studs should be
installed with a 10 in/lbs torque. The safety ground conductor provides proper grounding only
for the server. You must provide additional, proper grounding for the rack and other devices
installed in it.
Figure 1-2 Chassis Ground Lug
Chassis
Ground
Lug
chasgndlug
Install a PE (protective earthing) conductor that is identical in size, insulation material, and
thickness to the branch-circuit supply conductors. The PE conductor must be green with yellow
stripes. The earthing conductor is to be connected from the unit to the building installation earth
or, if supplied by a separately derived system, at the supply transformer or motor-generator set
grounding point.
Electrical Specifications
15
Disconnect Device and Branch Circuit Protection

WARNING! Failure to provide an appropriate disconnect device and branch circuit protection
may endanger service personnel. Serious injury and equipment damage may result if this warning
is not observed.
A suitable disconnect device must be provided as part of the building installation. The purpose
of the disconnect device is to provide an easy and accessible means for removing power from
the product for servicing.
A suitable branch circuit protection device must be provided as part of the building installation.
The purpose of branch circuit protection is to limit current in the case of a fault.
The disconnect device may also provide branch circuit protection (for example, a circuit breaker).
Alternately, separate disconnect and branch circuit protection devices (fuses and a disconnect
switch) may be employed.
The devices must be rated based on the plate rating of the product in accordance with the
applicable local codes and specific customer requirements. Branch circuit protection is commonly
selected based on 125% of the product input rating. Such derating is to avoid nuisance tripping
due to load surges or power transients and to meet code requirements. Applicable codes and
customer requirements will vary.
System Power Specifications

The following tables provide information to help determine the amount of power needed for
your computer room.
Table 1-3 list the power specifications for the server.
Table 1-3 System Power Specifications
Specification
Value
Nominal Input Voltage
-48 VDC (-40 to -60 VDC)
Minimum Operating Voltage
-36 VDC
Maximum Operating Voltage
-72 VDC
Input Current
12A DC typical (with VIN -48 VDC)
Input Power
580W typical (@ 85% efficiency)
Maximum Inrush Current
25 A
Maximum Output Current from each Power

Supply
49A DC for the 12V output 3.5A DC for the V3.3 sb output
Efficiency
82% (minimum)
Table 1-4 list the system power requirements for the server including CPUs.
Table 1-4 System Power Requirements
Power Required
1
Watts
Maximum configuration
650
Typical configuration
580
Comments
Maximum Theoretical
Maximum power is the sum of the worst case power consumption values of every subsystem in your server. These
worst case values should be used to calculate the worst case power consumption for your facility installation.
The server can support one or two processors of the same type and speed.
Table 1-5 list the power consumption values for the CPUs.
16
Table 1-5 CPU Power Consumption

Core
CPU
Watts
Single-core Itanium (1P/1C)
1.6 GHz with 3 MB of cache
100
Dual-core Itanium (1P/2C)
1.4 GHZ with 12 MB of cache
100
Dual-core Itanium (1P/2C)
1.6 GHZ with 18 MB of cache
100
Environmental Specifications
This section provides the temperature and humidity requirements, noise emission, and air flow
specifications for the server.
Temperature and Humidity

Ambient intake air temperature is often different from ambient room temperature. You should
measure the operating temperature and humidity directly in front of the cabinet cooling air
intakes rather than just checking ambient room conditions.
Operating Environment
The system is designed to run continuously and meet reliability goals in an ambient temperature
of 5C 40C at sea level. The maximum allowable temperature is derated 1C per 1,000 feet of
elevation above 5,000 feet above sea level up to 30C at 10,000 feet. For optimum reliability and
performance, the recommended operating range is 20C to 25C and 40%-50% relative humidity.
Environmental Temperature Sensor

To ensure that the system is operating within the published limits, the ambient operation
temperature is measured using a sensor placed on the front panel LED status board. Data from
the sensor is used to control the fan speed and also to initiate system overtemp shutdown.
Non-operating Environment
The system is designed to withstand ambient temperatures between 40C to 70C under
nonoperating conditions.
Environmental Specifications
17
Cooling
Figure 1-3 Airflow Through the Server
airflow2
Overall System Cooling

The cabinet incorporates front to back airflow across the entire chassis. Four 80 mm, dual blade
fans, mounted vertically in the front of the chassis, push air through the CPU, memory, and
PCI-X sections. One 80 mm, dual blade fan and the internal power supply fans cool the lower
section of the chassis. The five 80 mm fans are controlled by circuits of the fan control board. The
fan control circuits receive fan input from the baseboard management controller (BMC) on the
system board, and return fan status information. The fan circuit generate power and the
pulse-width-modulated control signals to the fans and monitor the speed indicator signals from
each of the fans. Fan failures are reported through the front panel diagnostic LEDs and in error
messages. Room ambient air temperature is sensed on the front panel LED status board and
provided to the system board.
Table 1-6 lists the minimum and maximum CFM (cubic feet minute) airflow rates.
Table 1-6 Minimum and Maximum Airflow Rates for cx2620 Chassis
With Air Baffle
Without Air Baffle
Minimum: 146 CFM
Minimum: 166 CFM
Maximum: 185 CFM
Maximum: 216 CFM
CPU/Memory Cooling
Cooling for the processors (CPUs) and memory is provided by three 80 mm fans mounted in the
front of the server chassis (fans 2, 3, and 4). Fan 2 is controlled by room ambient air temperature
and provides air through the memory section of the chassis. Fans 3 and 4 are controlled by room
ambient air temperature and processor (CPU) temperature. These two fans direct airflow across
processor 1 (fan 4) and 2 (fan 3).
18
Power Supply Cooling

Cooling for the power supplies is provided by the 60 mm fans mounted in each of the power
supply assemblies. Air is pushed through the power supply by the 60 mm fans and exhausted
out the rear of the chassis.
PCI-X/Mass Storage Section Cooling

One 80 mm, dual blade fan pushes airflow through the PCI-X card cage. The fan is controlled
by the room ambient temperature and runs at the speed necessary to maintain proper internal
temperature throughout the PCI-X card cage.
Typical Power Dissipation and Cooling

The system configurations shown in Table 1-7 are typical of most systems and show the power
and cooling values required for the listed components. These power and cooling values are
considered typical and not maximum for the configurations shown.
Table 1-7 Typical Configuration Power Consumption Values
CPU
Memory
PCI-X Cards
(assuming 10
Watts each)
Hard Disk
Drives
Typical
Power
Typical
Cooling
Qty
Gigabytes
Qty
Qty
Watts
BTU/Hr
1 GB (4 DIMMs @ 256 MB ea.)
360
1144
32 GB (8 DIMMs @ 4 GB ea.)
385
1212
575
1809
596
1876
531
1673
574
1809
596
1876
617
1944
Acoustic Noise Specification

The acoustic noise specification for the server is as follows:
55 db LpA (sound pressure level at bystander position in a dedicated computer room

environment temperature of <25C).
Physical and Environmental Specifications

Table 1-8 provides temperature and airflow information for minimum, typical, and maximum
configurations for the server. It also lists the server and rack weights and dimensions.
Physical and Environmental Specifications
19
Table 1-8
Condition
Typical
Heat
Release
Airflow, Nominal
Voltage
-40 to -60
Vdc
Minimum
Config.
340 Watts
Maximum
Config.
650 Watts
Typical
Config.
580 Watts
Airflow, Maximum at
35C 1
Server
178 CFM
302 m/hr
216 CFM
367 m/hr
ASHRAE
Class 1
28.1 kg 31.75 kg
(62 lb - 70
lb)
31.75 kg
(70 lb)
Rack
W: 44.5 cm
(17.5 in)
D: 50.8 cm
(20 in)
H: 17.8 cm
(7 in)
Minimum
Config.
Maximum
Config.
Two CPUs, two power

supplies, 32 GB DIMMs,
one DVD or one
CD-RW/DVD, four PCIX
card, three HDDs.
Typical
Config.
One CPU, two power

one DVD or one
CD-RW/DVD, two PCIX
cards, two HDDs.
Front to Rear (F-R)
20
Rack
One CPU, one power

supply, 2 1 GB DIMM,
one DVD or one
CD-RW/DVD, zero
PCIX cards, one HDD.
Air Flow Diagram Cooling Scheme (F - R)
1
2
Overall
System
(W x D x H)
Weight
Derate maximum dry bulb temperature 1oC/300 m above 900 m.

While only one power supply can be used, N+1 redundancy requires that a second power supply be installed.
2 General Site Preparation Guidelines

This chapter contains recommendations and best practices to consider for improving site efficiency
and tolerance before the installation or operation of an HP server system. This general information
is intended for different server models and vendor sites around the world and is not a substitute
for recommendations or requirements from the manufacturer or vendor of a specific product.
NOTE: Refer to the specific server service guide for the guidelines required to support the
specific server.
The following information provides general principles and practices to consider before the
installation or operation of the system. These guidelines apply to all of the customer environments
an HP product is likely to be installed in:
Controlled computer room
Controlled office
Uncontrolled office/home
Light industrial
Mobile/portable
However, the implementation of these guidelines will change from customer to customer and
from one environment to another.
This section addresses the following topics:
Electrical Factors (page 21)

Environmental Elements (page 29)
Facility Characteristics (page 36)
Space Requirements (page 38)
Conversion Factors and Formulas (page 42)
Example of an Installation Schedule (page 43)
Sample Site Inspection Checklist (page 43)
Delivery Survey (page 46)
Electrical Factors
Synopsis
DC Electrical Distribution System
HP recommends using an electrical distribution system that might exceed your normal electrical
guidelines. This recommendation is based on experiences with HP customers who have a low
occurrence of unexpected interruptions. As your system availability needs increase, these
recommendations become more important.
Recommended electrical distribution hardware includes receptacles, dc wiring, conduits, and
breakers that are sized for maximum-rated loads, rather than for typical loads. Between the
receptacle and nearest X0bond and the transformers, do not exceed 75 feet (22.86 m) because
connection points can become loose over time and subject to loading problems.
HP recommends sourcing a higher input voltage to the stepdown transformer within 75 feet
(22.86 m). For example, if 480-volt current is available in the building, ensure that distribution
transformers in the server room are 480/208-volt stepdown. In an optimum electrical distribution
system:
Electrical infrastructure is rated for maximum load.
The distance from a receptacle to power source X0 is less than 75 feet (22.86 m).
Electrical Factors
21
There are no daisy-chained receptacles, hot, neutral, or ground wires.

The system is sourced from higher distribution voltages.
AC Power Quality Devices

HP products have a wide range of voltage tolerances. In general, approximately 10 percent of
the nominal voltage is sufficient for the marked electrical rated voltage. The best operating margin
is in the middle of this range. Your business needs will dictate the business risk you can withstand.
Although utility-fed AC power is usually error free, your particular building or area might be
subject to local problems.
HP recommends the use of uninterruptible power supplies (UPSs), backup generators, auto
transfer devices, floor-mounted distribution transformers (less than 75-foot distances), and other
alternatives for critical systems and applications demanding high availability. To ensure sufficient
power quality, keep in mind:
The best voltage operating margin is in the middle of the distribution range.
Higher availability equipment should have UPS sourcing and dedicated breakers.
A few large UPSs provide more protection than numerous smaller cabinet UPSs.
UPS Recommendations
HP recommends the use of online versus offline UPSs for the highest availability environment.
HP does not recommend the practice of sourcing a cabinet UPS from a room UPS. This practice
can increase costs without providing more system availability. Indeed, this practice can introduce
more system downtime than just a room-level or system-level UPS. UPSs that are more compatible
with present-day technology generally use pulse width modulation (PWM) and have ratings
that are appropriate for a nonlinear load.
Power Consumption
Safety and regulatory labels on computer equipment list the ratings for maximum power
consumption conditions. Even though you will not normally reach maximum conditions, HP
recommends sizing all electrical distribution infrastructure to meet maximum conditions. It is
best to rate up rather than down. For example, if the marked electrical current is 16 amperes (A)
on a server, depending on your local electrical code, the electrical infrastructure should include
20-ampere receptacles, 20-ampere sized wiring, and 20-ampere breakers. Undersizing the wiring
might save costs in the beginning, but it will cause problems as infrastructure grows.
Average-sized wiring can be used with power quality devices, such as UPSs, but not with the
electrical infrastructure.
In determining the power requirements:
Size electrical infrastructure for maximum rated consumption.
Size air conditioning and UPSs with typical ratings, but realize that overloading might take
place with additional growth of the infrastructure.
NOTE: HP recommends that cooling be planned for maximum rated power output of the room
and that there is a growth plan for the cooling infrastructure.
Grounding Systems
WARNING! Follow electrical code when connecting equipment AC power ground wire to the
AC distribution point. Failure to properly ground the equipment or the floor can lead to shock
hazard.
HP computer hardware has been tested only on systems where protective earth is integral to the
electrical distribution system. This grounding is crucial for personnel safety and for maximum
equipment availability and use. Observe the following precautions:
22
General Site Preparation Guidelines
Neutral and ground wires have specific uses. Do not interchange them.
Do not use conduit grounds in place of a separate grounding conductor to each receptacle.
Size ground wires to be equal to the power source wires.
Do not daisy chain phase, neutral, and ground wires.
If the system is on raised flooring, use a 2-foot x 2-foot (61-cm x 61-cm) grounding grid.
Comprehensive Discussion
IMPORTANT: Electrical practices and suggestions in this guide are based on North American
practices. For regions and areas outside North America, local electrical codes will take precedence
over North American electrical codes.
An example would be the recommendation that the PE (Protective Earthing) conductor be green
with yellow stripes. This requirement is a North American directive and does not override the
local code requirements for a region or area outside North America.
Local Authority Has Jurisdiction (LAHJ) and should make the final decision regarding adherence
to region-specific or area-specific electrical codes and guidelines.
Proper design and installation of a power distribution system requires specialized skills. Those
responsible for this task must have a thorough knowledge and understanding of appropriate
electrical codes and the limitations of the power systems for computer and data processing
equipment.
In general, a well-designed power distribution system exceeds the requirements of most electrical
codes. A good design, when coupled with proper installation practices, produces the most
trouble-free operation.
A detailed discussion of power distribution system design and installation is beyond the scope
of this information. However, electrical factors relating to power distribution system design and
installation must be considered during the site preparation process.
The electrical factors discussed in this section are:
Computer room safety

Power consumption
Electrical load requirements (circuit breaker sizing)
Power quality
Distribution hardware
System installation guidelines
Computer Room Safety

WARNING! The safety of personnel must be paramount in consideration of performing the
following recommendations. Failure to comply can create life-threatening scenarios.
Inside the computer room, fire protection and adequate lighting (for equipment servicing) are
important safety considerations. Federal and local safety codes govern computer installations.
Fire Protection
The National Fire Protection Associations Standard for the Protection of Electronic Computer
Data Processing Equipment, NFPA 75, contains information on safety monitoring equipment
for computer rooms.
Electrical Factors
23
Most computer room installations are equipped with the following fire protection devices:
Smoke detectors
Fire and temperature alarms
Fire extinguishing system
Additional safety devices are:
Circuit breakers
An emergency power cutoff switch
Devices specific to the geographic location for example, earthquake protection
Fire Suppression
Though fires in computer rooms are rare, they are a critical safety and business consideration.
HP recommends the use of gaseous agents as primary fire control, with water as a backup system.
Gaseous agents include CO2, and Halon substitutes, like Intergen. Where fire suppresssion using
water is dictated, HP recommends the use of dry pipe water valving, with suitably rated
temperature heads. Dry pipe water valving lowers the business risks associated with accidental
water pipe discharge.
Lighting Requirements for Equipment Servicing

Adequate lighting and utility outlets in a computer room reduce the possibility of accidents
during equipment servicing. Safer servicing is also more efficient and, therefore, less costly. For
example, adequate lighting reduces the chances of connector damage when cables are installed
or removed.
The minimum recommended illumination level is 70 foot-candles (756 lumens per square meter)
when the light level is measured at 30 inches (76.2 cm) above the floor.
Cabinet Recommendations
HP only recommends the use of third party cabinets whose product designs have been carefully
considered. Consider the following important cabinet attributes:
Strength
Airflow considerations
Cabling restrictions
Seismic or earthquake resistance can also be an important attribute in certain parts of the world.
Working Space for Server Access

The recommended working space for performing maintenance on the server is three feet (91.4cm).
The work space shall permit at least a 90 opening of equipment doors or hinged panels. When
planning for the working space area, consider whether access to the server will be at the front,
side, or rear of the server.
Power Consumption
Power consumption can be divided into two broad categories:
Marked electrical amperage, which is listed on the required safety and regulatory labels,
generally represents a worst case scenario that the customer cannot measure. Use this
amperage to size the electrical infrastructure.
Typical consumption, which is measured under normal circumstances, should be used only
in customer calculations with UPS and air conditioning sizing where remaining capacities
are needed.
.In addition to the HP server hardware, you must consider any peripheral equipment that will
be installed during initial installation or a later update. Refer to the safety and regulatory labels
24
on equipment or applicable product-specific documentation for such devices to determine the

power required to support these devices.
NOTE:
HP recommends that you have dedicated breakers for peripheral equipment.
Electrical Load Requirements (Circuit Breaker Sizing)

IMPORTANT: Local Authority Has Jurisdiction (LAHJ) and should make the final decision
regarding adherence to country- specific electrical codes and guidelines.
It is good practice to derate power distribution systems for one or more of the following reasons:
To avoid nuisance tripping from load shifts or power transients, circuit protection devices
should never be run above 80% of their root-mean-square (RMS) current ratings.
Safety agencies derate most power connectors to 80% of their RMS current ratings.
Power Quality
The intended source voltage for telco systems is -48 VDC. The server is designed to operate over
the range of -40 to -60 volts dc nominal. The server utilizes a dc to dc power supply to provide
stable operation with a uniform internal voltage. (Refer to the HP Corporate Power Standard
HP-00005-03 at http://standards.inet.cpqcorp.net/smc/hpstd/AHP0000503.htm.)
The servers are tested and shown to comply with EMC Specification EN50082. However, damage
can occur if these ranges are exceeded. Severe electrical disturbances can exceed the design
specifications of the equipment.
Sources of Voltage Fluctuations

Voltage fluctuations, sometimes called glitches, affect the quality of electrical power. Common
sources of these disturbances are:
Fluctuations occurring within the facilitys distribution system

Utility service low-voltage conditions (such as sags or brownouts)
Wide and rapid variations in input voltage levels
Wide and rapid variations in input power frequency
Electrical storms
Large inductive sources (such as motors and welders)
Faults in the distribution system wiring (such as loose connections)
Microwave, radar, radio, or cell phone transmissions
Power System Protection

Protect the server from the sources of many of these electrical disturbances by using:
A dedicated power distribution system

Power conditioning equipment
Over- and under-voltage detection and protection circuits
Screening to cancel out the effects of undesirable transmissions
Lightning arresters on power cables to protect equipment against electrical storms
Precautions have been taken during power distribution system design to provide immunity to
power outages of less than one cycle. However, testing cannot conclusively rule out loss of
service. Therefore, adherence to the following guidelines provides the best possible performance
of power distribution systems for HP computer equipment:
Dedicated power source
Isolates a server power distribution system from other

circuits in the facility.
Electrical Factors
25
Missing-phase and low-voltage

detectors
Online uninterruptible power
supply (UPS)
Shuts equipment down automatically when a severe power

disruption occurs. For peripheral equipment, these devices
are recommended but optional.
Keeps input voltage to devices constant and should be
considered if outages of one-half cycle or more are common
Refer to qualified contractors or consultants for each situation.
Distribution Hardware
This section describes wire selection and the types of raceways (electrical conduits) used in the
distribution system.
Wire Selection
Use copper conductors instead of aluminum, because aluminums coefficient of expansion differs
significantly from that of other metals used in power hardware. Because of this difference,
aluminum conductors can cause connector hardware to work loose, overheat, and fail.
Raceway Systems (electrical conduits) (LAHJ)

Raceways (electrical conduits) form part of the protective ground path for personnel and
equipment. Raceways protect the wiring from accidental damage and also provide a heatsink
for the wires.
Any of the following types may be used:
Electrical metallic tubing (EMT) thin-wall tubing

Rigid (metal) conduit
Liquidtight with RFI shield grounded (most commonly used under raised floors)
Armored cable
Building Distribution
All building feeders and branch circuitry should be in rigid metallic conduit with proper
connectors (to provide ground continuity). Conduit that is exposed and subject to damage should
be constructed of rigid galvanized steel.
Grounding Systems
HP systems are tested and certified only with grounding systems in which a neutral return path
and a protective earth are separate conductors without any inserted impedances. Additionally,
protective earth and return neutral are shorted together at the X0 bonding junction on the
secondary side of the newly derived power source.
IT Power System
This product has not been evaluated for connection to an IT power system
(an dc distribution system having no direct connection to earth according to IEC 60950). A server
requires two methods of grounding:
Power distribution safety grounding
High frequency intercabinet grounding
Power Distribution Safety Grounding (LAHJ)

The power distribution safety grounding system consists of connecting various points in the
power distribution system to earth ground using green (green/yellow) wire ground conductors.
Having these ground connections tied to metal chassis parts that may be touched by computer
room personnel protects them against shock hazard from current leakage and fault conditions.
Power distribution systems consist of several parts. HP recommends that these parts be solidly
interconnected to provide an equipotential ground to all points.
26
Main Building Electrical Ground

The main electrical service entrance equipment should have
an earth ground connection, as required by applicable codes. Connections such as a grounding
rod, building steel, or a conductive type cold water service pipe provide an earth ground.
Electrical Conduit Ground
All electrical conduits should be made of rigid metallic conduit that
is securely connected together or bonded to panels and electrical boxes, so as to provide a
continuous grounding system.
Power Panel Ground
Ground each power panel to the electrical service entrance with green
(green/yellow) wire ground conductors. Size the green (green/yellow) wire ground conductors
per applicable codes (based on circuit-over-current device ratings).
NOTE: The green wire ground conductor mentioned above may be a black wire marked with
green tape (LAHJ).
Computer Safety Ground
Ground all computer equipment with the green (green/yellow) wire
included in the branch circuitry. The green (green/yellow) wire ground conductors should be
connected to the appropriate power panel and should be sized per applicable codes (based on
circuit over current device ratings).
Dual Power Source Grounding
When using dual power sources, measure voltage potentials
with a high impedence digital multi-meter (DMM). The use of dual power might create an
electrical potential that can be hazardous to personnel and might cause performance issues for
the equipment.
Dual power sources might originate from two different transformers or two different UPS devices.
Voltage potentials from ground pin to ground pin of these sources should be measured and
verified to be at or near 0.0 volts. Voltage levels that deviate or are measured above 3.0 volts
should be further investigated. Increased voltages might be hazardous to personnel, and should
be further investigated.
Cabinet Performance Grounding (High Frequency Ground)

In some cases power distribution system green (green/yellow) wire ground conductors are too
long and inductive to provide adequate high frequency ground return paths. Therefore, a ground
strap (customer-supplied) should be used for connecting the system cabinet to the site grounding
grid (customer-supplied). When connecting this ground, ensure that the raised floor is properly
grounded for high frequency.
WARNING! Do not use cabinet-to-floor ground strap in place of a properly installed safety
(5060Hz) grounding system, nor in place of a properly installed Signal Reference Grid. An
improperly installed grounding system can present a shock hazard to personnel.
Connect power panels ground buses and transformers XO bond in close proximity to the computer
equipment to the site grounding grid as well. Methods of achieving a sufficiently high-frequency
ground grid are described in the next sections.
Raised Floor High Frequency Noise Grounding

If a raised floor system is used, install a complete signal grounding grid for maintaining equal
potential over a broad band of frequencies. The grounding grid should be connected to the
equipment cabinet and electrical service entrance ground at multiple connection points using a
minimum #6 AWG (16mm2) wire ground conductor. The following figure illustrates a metallic
strip grounding system.
Electrical Factors
27
IMPORTANT: Regardless of the grounding connection method used, the raised floor should be
grounded as an absolute safety minimum.
HP recommends the following approaches to create an effective and safe 2-foot by 2-foot signal
reference grid::
Good
Better
Best
Use the raised floor structure as a ground grid. In this case, the floor must be designed
as a ground grid with bolted down stringers and corrosion-resistant plating (to provide
low resistance and attachment points for connection to service entrance ground and
HP computer equipment). The use of conductive floor tiles with this style of grid
further enhances ground performance. The structure needs to be mechanically bonded
to a known good ground point.
Add a grounded #6 AWG (16mm) minimum copper wire grid mechanically clamped
to floor pedestals and properly bonded to the building or site ground.
Add a grounding grid to the subfloor. Build the grounding grid with copper strips
mounted to the subfloor. Use strips that are 0.032 inches (0.08 cm) thick and a minimum
of 3.0 inches (8.0 cm) wide.
Connect each pedestal to four strips using 1/4-inch (6.0-mm) bolts tightened to the
manufacturers torque recommendation.
Figure 2-1 Raised Floor Metal Strip Ground System
Floor panel
Ground wire
to power panel
Hex bolt
Grounding grid elemen

Grounding clamp
Band and pedestal
Grounding braid
to computer equipment
Equipment Grounding Implementation Details

Connect all HP equipment cabinets to the site ground grid as follows:
1.
2.
28
Attach one end of each ground strap to the applicable cabinet ground lug.
Check that the braid contact on each end of the ground strap consists of a terminal and
connection hardware (a 1/4-inch (6.0-mm) bolt, nuts, and washers).
3.
4.
5.
Check that the braid contact connection points are free of paint or other insulating material
and treated with a contact enhancement compound (similar to Burndy Penetrox).
Attach the other end to the nearest pedestal base (raised floor) or cable trough ground point
(nonraised floor).
After achieving a safe and effective 5060Hz grounding system and a safe and effective SRG,
then consider cabinet-to-floor grounding. HP does not require this step.
System Installation Guidelines

This section contains information about installation practices and highlights some common
installation pitfalls. It addresses both power cable and data communications cable installations,
and highlights installation.
NOTE: In domestic installations, the proper receptacles should be installed prior to the arrival
of HP equipment. Refer to the appropriate installation guide for installation procedures.
Wiring Connections
Expansion and contraction rates vary among different metals. Therefore, the integrity of an
electrical connection depends on the restraining force applied. Connections that are too tight
compress or deform the hardware and cause it to weaken. This usually leads to high impedance,
preventing circuit breakers from tripping when needed, or can contribute to a buildup of high
frequency noise.
CAUTION: Connections that are too loose or too tight can have a high impedance that causes
serious problems, such as erratic equipment operation. A high impedance connection overheats
and sometimes causes fire or high temperatures that can destroy hard-to-replace components
such as distribution panels or system bus bars.
Wiring connections must be properly torqued. Many equipment manufacturers specify the proper
connection torque values for their hardware.
Ground connections must only be made on a conductive, nonpainted surface. When equipment
vibration is present, lock washers must be used on all connections to prevent connection hardware
from working loose.
Data Communications Cables

Power transformers create high-energy fields in the form of electromagnetic interference (EMI).
Heavy foot traffic can create electrostatic discharge (ESD) that can damage electronic components.
Route data communications cables away from these areas. Use shielded data communications
cables that meet approved industry standards to reduce the effects of external fields.
Environmental Elements
Synopsis
Air Quality
Proper computer room preparation improves air quality. It provides a return on investment by
making a system more stable and by decreasing unexpected downtime. HP recommends putting
appropriate effort into maximizing electrical and air conditioning efficiency to ensure higher
reliability to meet business needs.
HP temperature and humidity recommendations follow newly established industry standards.
HP recommends the following operating ranges:
Temperature of 2025C (6877F)
Humidity of 4055 percent relative humidity
29
Filtration at 3555 percent spot efficiency per American Society of Heating, Refrigerating,
and Air-Conditioning Engineers (ASHRAE)
Air conditioning heat load limits at 80 percent of total heating, ventilation and air conditioning
(HVAC) capacity
Airflow
An incorrect public perception exists that cool, ambient air is consistent throughout a datacenter.
That is, if the temperature of the room is measured at 20 C (68F), then the equipment should
be stable. In reality, microclimates can exist in various parts of the room such that generated heat
in the equipment might not efficiently make its way out. Microclimates are difficult to detect
and prove; therefore, prevent microclimates by encouraging a high rate of airflow from source
to intake of HVAC and uniform distribution of the heated air. Underflow blockages, such as
cabling and piping, can disrupt the airflow predictability. Improperly positioned floor vent tiles
or equipment can create air dams and decrease airflow. Follow these general precautions to
ensure proper airflow:
Use a heat load to 80 percent of total HVAC capacity (maintain a thermal safety margin).
Place vented floor tiles only in heat load areas.
Do not place vented floor tiles within two floor tiles of HVAC (thermal short circuit).
Do not place heat loads closer than two floor tiles of HVAC.
Be sure the maximum distance from the HVAC to the heat load is less than 75 feet (22.86
m).
Seal all cable openings (unsealed openings create a loss of static air pressure).
Lay out equipment aisles parallel to airflow, not perpendicular to it.
Concentrate high-density heat loads in a tightly controlled area. High-density loads are
equivalent to one cabinet of 3 kilowatts or more.
Maintain airspeed through vent tiles at more than 500 feet per minute (152.4 meters per
minute), but at less than 700 feet per minute (213.36 meters per minute) for high-density
cooling.
Equipment Orientation
Data center equipment orientation or heat load must encourage sufficient airflow. If exhausted
heat must move over or around a cabinet, air vortexes might be created, resulting in airflow
inefficiency throughout the data center and inside the equipment. Equipment might develop
internal hot spots, resulting in sluggish performance or even system failure.
Rather than designing a layout to maximize a planning grid worksheet whitespace, consider
creating hot and cold aisles. In a hot aisle, equipment is oriented so that exhaust vents face
other exhaust vents. In a cold aisle, intake vents face other intake vents. Place vent tiles in the
cold aisles, with few to no vent tiles in the hot aisle. Position equipment in parallel to encourage
the lowest air resistance and turbulences. Consider the following when determining equipment
orientation:
Orient equipment in parallel to airflow.
Place cabling in such a way as to aid airflow rather than impede it.
Layout equipment to form hot and cold aisles.
Use vent tiles to control airflow in heat load areas.
Place vent tiles in cold aisles.
Place higher heat load devices at floor level.
Electrostatic Discharge
Computer equipment is increasing in processor and memory density even as size continues to
decrease. These smaller, more densely packed pieces of equipment are at greater risk to damage
from electrostatic discharge (ESD). ESD created by the human body is consistent at approximately
30
3,000 volts. HP recommends building this consideration into your designs for floor coverings,
humidity control, airflow, dust control, and personnel traffic. Consider the following precautions
against ESD:
Use antistatic flooring.
Maintain humidity at 4055 percent relative humidity.
Follow airflow recommendations.
If raised flooring is present, use a 2-foot x 2-foot (61-cm x 61-cm) grounding grid.
Always use appropriately sized AC power ground wires.
Limit personnel traffic to two floor tiles away from equipment.
Cellular Telephone and Wireless Usage

HP recommends not using cell phones within a data center, especially within 9.8 feet (3 m) of
any high-availability equipment.
Comprehensive Discussion
The following environmental elements can affect a server installation:
Computer room preparation

Airflow
Cooling requirements
Humidity level
Electrostatic discharge (ESD) prevention
Acoustics (noise reduction)
Computer Room Preparation

The following guidelines are recommended when preparing a computer room for the server:
Locate the computer room away from the exterior walls of the building to avoid the heat
gain from windows and exterior wall surfaces.
When exterior windows are unavoidable, use windows that are double- or triple-glazed
and shaded to prevent direct sunlight from entering the computer room.
Maintain the computer room at a positive pressure relative to surrounding spaces.
Use a vapor barrier installed around the entire computer room envelope to restrain moisture
migration.
Caulk and vapor seal all pipes and cables that penetrate the envelope.
Use at least a 12-inch raised floor system for minimum favorable room air distribution system
(underfloor distribution).
Ensure a minimum clearance of 12 inches between the top of the server cabinet and the
ceiling to allow for return air flow and ensure that all ceiling tiles are in place.
Allow 18 inches (or local code minimum clearance) from the top of the server cabinet to the
fire sprinkler heads.
Airflow
Ensure that hot and cold aisles are parallel to airflow patterns. This recommendation causes
cooling air to be released into cold aisles, where opposing rows have intake grills oriented.
Additionally, ensure that opposing row exhaust grills face each other, without cooling air.
A parallel orientation encourages low impedance airflow back to the HVAC.
If raised flooring is used, route cables underneath the floor to be parallel to the airflow to
prevent airdams
Keep air throws from HVAC equipment to the heat loads they serve within 75 feet of each
other.
31
Row Orientation
Row orientation has an impact on the airflow, temperature, particulate contamination, and power
distribution of the environment. Consider the following when planning equipment layout:
HP recommends the use of hot aisle (exhaust) and cold aisle (intake) orientation.
HP further recommends that the airflow (air conditioned supply and return) be parallel to
the aisleways.
HP recommends adherence to the temperature and humidity standards located at:
http://standards.inet.cpqcorp.net/smc/hpstd/AHP0000501.htm.
HP product specifications for temperature and humidity are measured at 200 mm from air intake
center of device.
Dust and Pollution Control

Computer equipment can be adversely affected by dust and microscopic particles in the site
environment. Specifically, disk drives, tape drives, and some other mechanical devices can have
bearing failures resulting from airborne abrasive particles. Dust might also blanket such electronic
components as printed circuit boards, causing premature failure due to excess heat or humidity
buildup on the boards. Other failures to power supplies and other electronic components can
be caused by metallically conductive particles, including zinc whiskers. These metallic particles
are conductive and can short circuit electronic components. Use every effort to ensure that the
environment is as dust- and particulate-free as possible. Refer to Metallic Particulate
Contamination for additional details.
Smaller particles can pass through some filters and, over time, cause problems in mechanical
parts. Prevent small dust particles from entering the computer room by maintaining the
air-conditioning system at a high static air pressure level.
Other sources of dust, metallic, conductive, abrasive, and microscopic particles can be present.
Some sources of these particulates are:
Subfloor shedding
Raised-floor shedding
Ceiling-tile shedding
These particulates are not always visible to the naked eye. A good check to determine their
possible presence is to check the underside of the tiles. The tile should be shiny, galvanized, and
rust-free.
Keep the computer room clean. HP recommends the following guidelines:
Smoking
Establish a no-smoking policy. Particulates of cigarette smoke will
not improve the operation or reliability of surrounding equipment.
Printer
Locate printers and paper products in a separate room to eliminate
paper particulate problems.
Eating or drinking
Establish a no-eating-or-drinking policy. Spilled liquids can cause
short circuits in equipment such as keyboards.
Tile floors
Use a dust-absorbent cloth mop rather than a dry mop to clean tile
floors.
Cleaning
Use only HP-approved cleaners.
Special precautions are necessary if the computer room is near a source of air pollution. Some
air pollutants, especially hydrogen sulfide (H2S), are not only unpleasant, but corrosive as well.
H2S damages wiring and delicate sound equipment. The use of activated charcoal filters reduces
this form of air pollution.
Metallic Particulate Contamination

Metallic particles can be especially harmful around electronic equipment. This type of
contamination can enter the data center environment from a variety of sources, including but
32
not limited to raised floor tiles, worn air-conditioning parts, heating ducts, rotor brushes in
vacuum cleaners, or printer component wear. Because metallic particles conduct electricity, they
have an increased potential for creating short circuits in electronic equipment. This problem is
exaggerated by the increasingly dense circuitry of electronic equipment.
Over time, very fine whiskers of pure metal can form on electroplated zinc, cadmium, or tin
surfaces. If these whiskers are disturbed, they can break off and become airborne, possibly causing
failures or operational interruptions. For more than 50 years, the electronics industry has been
aware of the relatively rare but possible threat posed by metallic particulate contamination.
During recent years, concern has increased regarding metallic particulate contamination in
computer rooms, where these conductive contaminants are formed on the bottom of some raised
floor tiles.
Although this problem is relatively rare, it can be an issue within your computer room. Because
metallic contamination can cause intermittent or permanent failures on your electronic equipment,
HP strongly recommends that your site be evaluated for metallic particulate contamination
before installation of electronic equipment.
Cooling Requirements
Air conditioning equipment requirements and recommendations are described in the following
sections.
Basic Air Conditioning Equipment Requirements

The cooling capacity of the installed air conditioning equipment for the computer room should
be sufficient to offset the computer equipment dissipation loads, as well as any space envelope
heat gain. This equipment should include:
Air filtration
Cooling or dehumidification
Humidification
Reheating
Air distribution
System controls adequate to maintain the computer room within specified operating ranges
When calculating cooling requirements, include the heat generated by lighting and by personnel.
For example, a person dissipates about 450 BTUs per hour while performing a typical computer
room task.
At altitudes above 10,000 feet (3048 m), the lower air density reduces the cooling capability of
air-conditioning systems. If your facility is located above this altitude, you might need to modify
the recommended temperature ranges. For each 1,000 foot (305 m) increase in altitude above
10,000 feet (up to a maximum of 15,000 feet), subtract 0.83C (33.5F) from the upper limit of the
temperature range.
Air Conditioning System Guidelines

Use the following guidelines when designing an air-conditioning system and selecting the
necessary equipment:
The computer room air-conditioning system should be capable of operating 24 hours a day,
365 days a year. It should also be independent of other systems in the building.
Consider the long-term value of server availability, redundant air-conditioning equipment,
or capacity.
The system should be capable of handling any future server expansion.
33
Air conditioning equipment air filters should have a minimum rating of 45% (based on
ASHRAE Standard 52-76, Dust Spot Efficiency Test).
Introduce only enough outside air into the system to meet building code requirements (for
human occupancy) and to maintain a positive air pressure in the computer room.
Air Conditioning System Types

The following three air conditioning system types are listed in order of recommendation:
Complete self-contained package unit(s) with remote condenser(s). These systems are
available with up or down discharge and are usually located in the computer room.
Chilled water package unit with remote chilled water plant. These systems are available
with up or down discharge and are usually located in the computer room.
Central station air handling units with remote refrigeration equipment. These systems are
usually located outside the computer room.
Basic Air Distribution Systems

A basic air-distribution system includes supply air and return air. Refer to Table 2-4 (page 39)
for more information.
Configure the air-distribution system to deliver adequate supply air to the cooling air intake
vents of the server equipment cabinets. Maintain supply air temperature within the following
parameters:
Ceiling supply system
Floor supply system
From 55 F (12.8 C) to 60 F (15.6 C)

At least 60 F (15.6 C)
If you use a ceiling plenum return air (CPRA) system or a ducted ceiling return air system, place
the return air grills in the ceiling above the exhaust area or the exhaust row.
The following three types of air distribution system are listed in order of recommendation:
Underfloor air distribution system
Downflow air conditioning equipment located on the raised

floor of the computer room uses the cavity beneath the
raised floor as a plenum for the supply air.
Return air from an underfloor air distribution system can
be ducted return air (DRA) above the ceiling.
Locate perforated floor panels (available from the raised
floor manufacturer) around the front of the system cabinets.
Supply air emitted though the perforated floor panels is
then available near the cooling air intake vents of the server
cabinets.
Ceiling plenum air distribution

system (CPRA)
Supply air is ducted into the ceiling plenum from upflow

air conditioning equipment located in the computer room
or from an air handling unit (remote).
The ceiling construction should resist air leakage. Place
perforated ceiling panels (with down discharge airflow
characteristics) around the front of the system cabinets.
The supply air emitted downward from the perforated
ceiling panels is then available near the cooling air intake
vents of the server cabinets.
Direct the return air back to the air-conditioning equipment
though the return air duct above the ceiling.
34
Above ceiling ducted air distribution Supply air is ducted into a ceiling diffuser system from
system
upflow air conditioning equipment located in the computer
room or from an air handling unit (remote).
Return air from an above ceiling ducted air-distribution
system can be DRA above the ceiling or CPRA.
Adjust the supply air diffuser system grilles to direct the
cooling air downward around the front of the server
cabinets. The supply air is then available near the cooling
air intake vents of the server cabinets.
Air Conditioning System Specifications

All air conditioning equipment, materials, and installation must comply with any applicable
construction codes. Installation of the various components of the air conditioning system must
also conform to the air conditioning equipment manufacturers recommendations.
Air Conditioning Ducts

Ensure that the air-conditioning duct work in the computer room is separate from the duct work
used for the rest of the building. If the computer room duct work is not separate from the rest
of the building, it might be difficult to control cooling and air pressure levels.
Humidity Level
The recommended humidity level is between 40 and 55 percent relative humidity (RH). High
humidity causes galvanic actions to occur between some dissimilar metals. This eventually causes
a high resistance between connections, leading to equipment failures. High humidity can also
have an adverse affect on some magnetic tapes and paper media.
CAUTION: Low humidity contributes to undesirably high levels of electrostatic charges. This
increases the electrostatic discharge (ESD) voltage potential. ESD can cause component damage
during servicing operations. Paper feed problems on high-speed printers are usually encountered
in low-humidity environments.
Low humidity levels are often the result of the facility heating system and occur during the cold
season. Most heating systems cause air to have a low humidity level, unless the system has a
built-in humidifier.
Electrostatic Discharge (ESD) Prevention

Static charges (voltage levels) occur when objects are separated or rubbed together. The voltage
level of a static charge is determined by the following factors:
Types of materials
Relative humidity
Rate of change or separation
Humidity Levels Influence the Creation of Static Charges

Table 2-1 compares the static charges generated by different activities in different humidity levels.
35
Table 2-1 Effect of Humidity on ESD Charge Levels

Personnel Activity1
Humidity2 and Charge Levels (voltages)3

26%
32%
40%
50%
Person walking across a linoleum floor
6,150 V
5,750 V
4,625 V
3,700 V
Person walking across a carpeted floor
18,450 V
17,250 V
13,875 V
11,100 V
Person getting up from a plastic chair
24,600 V
23,000 V
18,500 V
14,800 V
1
2
3
Source: B.A. Unger, Electrostatic Discharge Failures of Semiconductor Devices (Bell Laboratories, 1981)
For the same relative humidity level, a high rate of airflow produces higher static charges than a low airflow rate.
Some data in this table has been extrapolated.
For more information regarding ESD, refer to the HP ESD Standard HP-00005-04 at:
http://standards.inet.cpqcorp.net/smc/hpstd/AHP0000504.htm
Relative Humidity
Where possible, maintain a humidity range of 40 percent to 55 percent.
Static Protection Measures

Follow these precautions to minimize possible ESD-induced failures in the computer room:
Maintain recommended humidity level and airflow rates in the computer room.
Install conductive flooring (conductive adhesive must be used when laying tiles).
Use conductive wax if waxed floors are necessary.
Ensure that all equipment and flooring are properly grounded and are at the same ground
potential.
Use conductive tables and chairs.
Use a grounded wrist strap (or other grounding method) when handling circuit boards.
Store spare electronic modules in antistatic containers.
Acoustics
Computer equipment and air conditioning blowers cause computer rooms to be noisy. Ambient
noise level in a computer room can be reduced as follows:
Dropped ceiling
Sound deadening
Removable partitions
Cover with a commercial grade of fire-resistant, acoustic rated,

fiberglass ceiling tile.
Cover the walls with curtains or other sound deadening material.
Use foam rubber models for most effectiveness.
Facility Characteristics
This section contains information about facility characteristics that must be considered for the
installation or operation of the server. Facility characteristics are:
Floor loading
Windows
Floor Loading
The computer room floor must be able to support the total weight of the installed server plus
the weight of the individual cabinets, cabling and peripheral devices.
Floor Loading Terms

Table 2-2 provides floor loading terms and definitions.
36
Table 2-2 Floor Loading Term Definitions

Term
Definition
Dead load
The weight of the raised panel floor system, including the understructure. Expressed
in lb/ft2 (kg/m2).
Live load
The load that the floor system can safely support. Expressed in lb/ft2 (kg/m2).
Concentrated load
The load that a floor panel can support on a 1-in2 (6.45 cm2) area at the panels weakest
point (typically the center of the panel), without the surface of the panel deflecting
more than a predetermined amount.
Ultimate load
The maximum load (per floor panel) that the floor system can support without failure.
Failure is expressed by floor panels breaking or bending.
Ultimate load is usually stated as load per floor panel.
Rolling load
The load a floor panel can support (without failure) when a wheel of specified
diameter and width is rolled across the panel.
Average floor load
Computed by dividing total equipment weight by the area of its footprint. This value
is expressed in lb/ft2 (kg/m2).
Floor loading can be an issue in both raised and nonraised flooring environments. Rolling load
can be the most detrimental in a raised flooring environment, while total dead load can be an
issue for either. The information presented in this section addresses raised floor installations.
NOTE: Have a floor system consultant for the appropriate flooring environment verify any
floor system under consideration for a server installation.
Raised Floor Loading

Raised floor loading is a function of the manufacturers load specification and the positioning
of the equipment relative to the raised floor grid. While HP cannot assume responsibility for
determining the suitability of a particular raised floor system, it does provide the following
guidelines:
Because many raised floor systems do not have grid stringers between floor stands, the
lateral support for the floor stands depends on adjacent panels being in place. To avoid
compromising this type of floor system while gaining under-floor access, remove only one
floor panel at a time.
Larger floor grids (bigger panels) are generally rated for lighter loads.
CAUTION: Do not position or install any equipment cabinets on the raised floor system until
you have carefully examined it to verify that it is adequate to support the appropriate installation.
Average Floor Loading

The average floor load value is not appropriate for addressing raised floor ratings at the floor
grid spacing level. However, it is useful for determining floor loading at the building level, such
as the area of solid floor or span of raised floor tiles covered by the server footprint.
Typical Raised Floor Site

This section contains an example of a computer room raised floor system that is satisfactory for
the installation of a server.
Based on specific information provided by HP, Tate Access Floors has approved its Series 800
all-steel access floor with bolt-together stringers and 24 in. (61.0 cm) by 24 in. (61.0 cm) floor
panels.
Facility Characteristics
37
When the flooring is replaced or a new floor is installed, Tate Access Floors recommends using
the Series 1250 all-steel access floor with bolt-together stringers and 24 inches (61.0 cm) by 24
inches (61.0 cm) floor panels to support the HP installation.
NOTE: If the specific floor being evaluated or considered is other than a Tate Series 800 floor,
the specific floor manufacturer must be contacted to evaluate the floor being used.
Table 2-3 lists specifications for the Tate Access Floors Series 800 raised floor system.
Table 2-3 Typical Raised Floor Specifications
Item
Rating
Dead load
7 lb/ft2 (34.2 kg/m2)
Live load
313 lb/ft2 (1528.3 kg/m2)
Concentrated load1
1250 lb (567 kg)
Ultimate load
4,000 lb (1814 kg) per panel
Rolling load
400 lb (181 kg)
Average floor load
500 lb (227 kg)
With 0.08 in (0.2 cm) of span maximum deflection
Windows
Avoid housing computers in a room with windows. Sunlight entering a computer room may
cause problems. Magnetic tape storage media is damaged if exposed to direct sunlight. Also, the
heat generated by sunlight places an additional load on the cooling system.
Space Requirements
This section contains information about space requirements for the server. Use this data as the
basic guideline for space plan developments. Also consider factors as airflow, lighting, and
equipment space requirements.
Delivery Space Requirements

There should be enough clearance to move equipment safely from the receiving area to the
computer room. Permanent obstructions, such as pillars or narrow doorways, can cause equipment
damage.
Delivery plans should include the possible removal of walls or doors.
Operational Space Requirements

Consider the following factors in addition to the basic equipment dimensions:
Eliminate obstructions to equipment intake or exhaust flow.
The locations of lighting fixtures and utility outlets affect sevicing operations. Plan equipment
layout to take advantage of lighting and utility outlets. Do not forget to include clearance
for opening and closing equipment doors.
Provide sufficient clearance around the cabinets for proper cooling airflow through the
equipment.
If other equipment is located so that it exhausts heated air near the cooling air intakes of the
server cabinets, more space is needed to keep ambient air intake to the server cabinets within
the specified temperature and humidity ranges. Refer to Table 2-4 for operating ranges.
38
Table 2-4 Product Technical Requirements Based on Customer Environments

Environment
Industry
Equivalent:1
ASHRAE
Operating Environment (ambient)2

Temp (C, dry bulb)3
Relative Humidity %:
Noncondensing
Dewpoint Rate
(max)4
of Chg
(C/hr,
Allowable5 Recommended Allowable6 Recommended7
max)
Controlled Computer
Room
15 to 32
20 to 25
20 to 80
40 to 55
17
Office
10 to 35
20 to 25
20 to 80
40 to 55
21
5 to 35
NA
8 to 85
NA
28
NA
Home
5 to 35
NA
8 to 85
NA
28
NA
Light Industrial
5 to 40
NA
8 to 90
NA
28
NA
Portable/Mobile
5 to 40
NA
8 to 90
NA
28
NA
Controlled
Uncontrolled
Special (or Contract)

1
2
3
4
5
6
7
8
Product specifications controlled by contract or other requirements.
The values in each row meet or exceed the stated industry equivalent class specifications.
The maximum elevation for all operating environmental classes is 3050 m.
Dry bulb temperature is the regular ambient temperature. Derate maximum dry bulb temperature 1C/300 m above
900 m.
Must be noncondensing environment.
With installed media, the minimum temperature is 10C and the maximum relative humidity is limited to 80 percent.
Specific media requirements may vary.
Allowable: equipment design extremes as measured at the equipment inlet.
Recommended: target facility design and operational range.
For all values listed as NA: local product groups must make business decisions for the appropriate values.
Include the possible addition of equipment or other changes in space requirements to the space
plan, and create an equipment layout plan which contains provisions for the following:
Channels or fixtures used for routing data cables and power cables
Access to air conditioning ducts, filters, lighting, and electrical power hardware
Power conditioning equipment
Cabinets for cleaning materials
Maintenance area and spare parts
Floor Plan Grid

A floor plan grid is used to plan the location of equipment in the computer room. In addition to
its use for planning, the floor plan grid should also be used when planning the locations of the
following items:
Air conditioning vents

Lighting fixtures
Utility outlets
Doors
Access areas for power wiring and air conditioning filters
Equipment cable routing
Power Plug Configuration

Several different power cables are designed for use with HP servers. The region the server ships
to will determine which power cable ships with the server. Figures 1-2 to 1-11 provide an overview
of the possible power plug configurations available.
39
NOTE: Several examples follow, though this list is not meant to be all-inclusive nor is this list
meant to imply every plug shown is one that is available for the server.
Female End of Power Cable
The female end of the HP server is a C19 plug that mates with the
C20 receptacle in each power supply installed in the HP server.
Figure 2-2 C20 Male Receptacle (at Power Supply)
Figure 2-3 C19 Female Plug (on One End of the Power Cord)
Male End of Power Cable

The male plug on the other end of the power cable will vary
depending on the region the HP server ships.
Figure 2-4 Unterminated Plug
Figure 2-5 L6-20 Plug
40
Figure 2-6 IEC 309 Plug
Figure 2-7 CEE 7-7 Plug
Figure 2-8 L6-30 Plug
Figure 2-9 NEMA 5-20P Plug (left) and receptacle (right)
Figure 2-10 ISI 32 Plug
41
Figure 2-11 L6-20 Power Cable
Power Cable
The power cable length and configuration varies based on the region the server
ships to. Figure 1-12 provides an example of one power cable configuration used to supply power
to the server.
Figure 2-12 L6-20 Power Cable
Conversion Factors and Formulas

The conversion factors provided here are intended to ease data calculation for systems that do
not conform specifically to the configurations listed in this Site Preparation Guide. Listed below
are the conversion factors used in this document, as well as additional conversion factors which
may be helpful in determining those factors required for site planning.
Conversion Factors
Refrigeration
1 watt =.86 kcal/h
1 watt = 3.412 Btu/h
1 watt = 2.843 x 10-4 tons
1 ton = 200 Btu/min.
1 ton = 12,000 Btu/h
1 ton = 3,517.2 W
42
Metric Equivalents
1 centimeter = 0.3937 in
1 meter = 3.28 ft.
1 meter = 1.09 yds
1 in. = 2.54 cm
1 ft. = 0.305 m
1 CFM = 1.7m3/h
kVA Conversions
Three phase
kVA = V A 3 / 1000
Single phase
kVA = V A / 1000
Formulas
kVA = Voltage x Current (amps)
Watts = VA x PF
BTU = Watts x 3.41
Example of an Installation Schedule

The following schedule lists the sequence of events for a typical system installation:
60 days before installation

Floor plan design completed and mailed to Hewlett-Packard (if required to be an HP
task)

Primary power and air conditioning installation completed
Telephone and data cables installed
Fire protection equipment installed
Major facility changes completed
Special delivery requirements defined
Site inspection survey completed
Delivery survey completed
A signed copy of the site inspection and delivery survey mailed to Hewlett-Packard
Site inspection and predelivery coordination meeting arranged with a Hewlett-Packard
representative to review the inspection checklist and arrange an installation schedule.

Final check made with an Hewlett-Packard site preparation specialist to resolve any
last minute problems
NOTE: Not all installations follow a schedule like the one noted above. Sometimes, a server is
purchased through another vendor, which can preclude a rigid schedule. Other conditions could
also prevent following this schedule. For those situations, consider a milestone schedule.
Site Preparationschedule with the customer as soon as possible after the order is placed.
Site Verificationschedule with the customer a minimum of one to two days before the
product is scheduled to be installed.
Sample Site Inspection Checklist

Table 2-5 and Table 2-6 provide sample checklists. Enter the appropriate information in the areas
provided.
Example of an Installation Schedule
43
Table 2-5 Customer and Hewlett-Packard Information

Customer Information
Name:
Phone No:
Street Address:
City
or
Town:
State or Province:
Country
Zip or postal code:

Primary customer contact:
Phone No.:
Secondary customer contact:
Phone No.:
Traffic coordinator:
Phone No.:
Hewlett-Packard information
Sales representative:
Order No:
Representative making survey:
Date:
Scheduled delivery date:
Table 2-6 Site Inspection Checklist

Please check either Yes or No. If No, include comment# or date
Comment or Date
Computer room
No.
Area or condition
1.
Is there a completed floor plan?
2.
Is there adequate space for maintenance needs?

Front 36 in (91.4 cm) minimum, rear 36 in (91.4 cm) minimum are
recommended clearances.
3.
Is access to the site or computer room restricted?
4.
Is the computer room structurally complete?

Expected date of completion?
5.
Is a raised floor installed and in good condition?
6.
Is the raised floor adequate for equipment loading?
7.
Are there channels or cutouts for cable routing?
8.
Is there a remote console telephone line available with an RJ11 jack?
9.
Is a telephone line available?
10.
Are customer supplied peripheral cables and LAN cables available

and of the proper type?
11.
Are floor tiles in good condition and properly braced?
12.
Is floor tile underside shiny or painted? If painted, judge the need

for particulate test.
Yes
No
Yes
No
Power and lighting
44
No.
Area or condition
13.
Are lighting levels adequate for maintenance?
Table 2-6 Site Inspection Checklist (continued)

Please check either Yes or No. If No, include comment# or date
14.
Are there dc outlets available for servicing needs? (for example,

vacuuming)
15.
Does the input voltage correspond to equipment specifications?
15A
Is dual source power used? If so, identify type(s) and evaluate

grounding.
16
Does the input frequency correspond to equipment specifications?
17.
Are lightning arrestors installed inside the building?
18.
Is power conditioning equipment installed?
19.
Is there a dedicated branch circuit for equipment?
20.
Is the dedicated branch circuit less than 250 feet (72.5 meters)?
21.
Are the input circuit breakers adequate for equipment loads?
Comment or Date
Safety
No.
Area or condition
22.
Is there an emergency power shut-off switch?
23.
Is there a telephone available for emergency purposes?
24.
Is there a fire protection system in the computer room?
25.
Is antistatic flooring installed?
26.
Are there any equipment servicing hazards (loose ground wires,

poor lighting, and so on)?
Yes
No
Yes
No
Yes
No
Cooling
No.
Area or condition
27.
Can cooling be maintained between 20 C and 55 C (up to 5,000

ft.)? Derate 1 C/1,000 ft. above 5,000 ft. and up to 10,000 ft.
28.
Can temperature changes be held to 10 C per hour with tape

media? Can temperature changes be held to 20 C per hour without
tape media?
29.
Can humidity level be maintained at 40% to 60% at 35 C

noncondensing?
30.
Are air conditioning filters installed and clean?
Storage
No.
Area or condition
31.
Are cabinets available for tape and disc media?
32.
Is shelving available for documentation?
Training
No.
Area or Condition
33
Are personnel enrolled in the System Administrators Course?
34
Is on-site training required?
Sample Site Inspection Checklist
45
Delivery Survey
The delivery survey forms list delivery or installation requirements. If any of the items on the
list apply, enter the appropriate information in the areas provided on the form.
Special instructions or recommendations should be entered on the special instructions or
recommendations form. The following list gives examples of special instructions or issues:
Packaging restrictions at the facility, such as size and weight limitations

Special delivery procedures
Special equipment required for installation, such as tracking or hoists
What time the facility is available for installation (after the equipment is unloaded)
Special security requirements applicable to the facility, such as security clearance
Figure 2-13 Delivery Survey (Part 1)

DELIVERY CHECKLIST
DOCK DELIVERY
Is dock large enough for a semitrailer?
Yes ___________ No ___________
Circle the location of the dock and give street name if different than address.
North
West
East
South
STREET DELIVERY
Circle the location of access door and list street name if different than address.
North
West
East
South
List height ___________ and width ___________ of access door.
List special permits (if required) for street delivery.
46
Permit type:
Agency obtained from:
______________________________________
______________________________________
______________________________________
______________________________________
Figure 2-14 Delivery Survey (Part 2)

ELEVATOR
Fill in the following information if an elevator is required to move equipment.
Capacity (lb. or kg) ________________
Depth ________________
Height ________________
Width ________________
Height
Dept
Widt
STAIRS
Please list number of flights and stairway dimensions.
Number of flights _____________________
Number of flights _____________________
Width ______________________
Width ______________________
Width ______________________
Width ______________________
Widt
Widt
Delivery Survey
47
48
A Physical and Environmental Specifications

Table A-1 provides temperature and airflow information for minimum, typical, and maximum
configurations for the server. It also lists the server and rack weights and dimensions. Use this
table as a convenient point of reference.
Table A-1
Condition
Typical
Heat
Release
Airflow, Nominal
Voltage
-40 to -60
Vdc
Minimum
Config.
340 Watts
Maximum
Config.
650 Watts
Typical
Config.
580 Watts
Airflow, Maximum at
35C 1
Server
178 CFM
302 m/hr
216 CFM
367 m/hr
ASHRAE
Class 1
28.1 kg 31.75 kg
(62 lb - 70
lb)
Rack
31.75 kg
(70 lb)
Rack
W: 44.5 cm
(17.5 in)
D: 50.8 cm
(20 in)
H: 17.8 cm
(7 in)
Minimum
Config.
One CPU, one power

supply, 2 1 GB DIMM,
one DVD or one
CD-RW/DVD, zero
PCIX cards, one HDD.
Maximum
Config.
Two CPUs, two power

one DVD or one
CD-RW/DVD, four PCIX
card, three HDDs.
Typical
Config.
One CPU, two power

one DVD or one
CD-RW/DVD, two PCIX
cards, two HDDs.
Air Flow Diagram Cooling Scheme (F - R)
Front to Rear (F-R)
1
2
Overall
System
(W x D x H)
Weight
Derate maximum dry bulb temperature 1oC/300 m above 900 m.

While only one power supply can be used, N+1 redundancy requires that a second power supply be installed.
49
50
Glossary
A-B
ASHRAE
Standard 52-76
Industry standard for air filtration efficiency set forth by the American Society of Heating,
Refrigerating, and Air-Conditioning Engineers, Inc.
ASL
Above sea level.
board
A printed circuit assembly (PCA). Also called a card or adapter.
Btu/h
The abbreviation for British thermal units. The amount of heat required to raise one pound of
water one degree fahrenheit per hour, a common measure of heat transfer rate.
C
CFM
The abbreviation for cubic feet per minute, commonly used to measure the rate of air flow in
an air conditioning system.
Chilled water
system
A type of air conditioning system that has no refrigerant in the unit itself. The refrigerant is
contained in a chiller, which is located remotely. The chiller cools water, which is piped to the
air conditioner to cool the space.
CompactPCI
The newest specification for PCI-based industrial computers is called CompactPCI. It is

electrically a superset of desktop PCI with a different physical form factor. See
http://www.picmg.org/pdf/PICMG3_xIntro.pdf for details.
D-K
Dehumidification
The process of removing moisture from the air within a critical space.
Derate
To lower the rated capability of an electrical or mechanical apparatus.
Downflow
Refers to a type of air conditioning system that discharges air downward, directly beneath a
raised floor, commonly found in computer rooms and modern office spaces.
EIA unit
The Electronic Industries Association (EIA) defines this unit of measurement to be 1.75 inches
in height. So then, 1U equals 1.75 inches (1U equals 44.45 mm).
Humidification
The process of adding moisture to the air within a critical space.
Inrush current
The peak current flowing into a power supply the instant power is applied. This peak is usually
much higher than the typical input current due to the charging of the input filter capacitors.
When switching power supplies are first turned on, they present high initial currents as a result
of filter capacitor impedance. These large filter capacitors act like a short circuit, producing an
immediate inrush surge current with a fast rise time. The peak inrush current can be several
orders of magnitude greater than the supplys typical current.
KVA
Abbreviation for kilovolt-amperes. (1,000 x volt-amperes).
L-N
Latent cooling
capacity
An air conditioning systems capability to remove heat from the air.
Maximum input
current
The operating current of the product equal to the maximum load divided by the minimum
input voltage.
NEBS
All electronic equipment has the potential to interfere with other electronic equipment.
Interference can be caused by electromagnetic radiation, the grounding system, the electrical
power connection, excessive heat, or blocking the natural airflow, and connecting wires or
cables. The FCC (Federal Communications Commission) regulates a portion of this problem
through Part 15 of their rules and regulations. Even more stringent than the FCC Part 15
requirements, Network Equipment Building Standards (NEBS) covers a large range of
requirements including criteria for personnel safety, protection of property, and operational
continuity. The documents cover both physical requirements including: Space Planning,
Temperature, Humidity, Fire, Earthquake, Vibration, Transportation, Acoustical, Air Quality
and Illumination; and electrical criteria including: Electrostatic Discharge (ESD), Electromagnetic
51
Interference (EMI), Lightning and AC Power Fault, Steady State Power Induction, Corrosion,
DC Potential Difference, Electrical Safety and Bonding and Grounding.
O-R
PCA
Abbreviation for Printed Circuit Assembly also referred to as a Printed Circuit Board (PCB).
PCI
Currently, the most popular local I/O bus, the Peripheral Component Interconnect (PCI) bus
was developed by Intel and introduced in 1993.
PICMG
A consortium of companies involved in utilizing PCI for embedded applications. The PCI
Industrial Computer Manufacturers Group (PICMG) controls the PICMG specification.
S-T
Theoretical
maximum power
consumption
Represents the maximum wattage of a given configuration, assuming worst-case conditions

(thermal tolerances, workloads, and so forth) on all system components. It is extremely unlikely
that any customer will experience this level of power consumption.
Tonnage
The unit of measure used in air conditioning to describe the heating or cooling capacity of a
system. One ton of heat represents the amount of heat needed to melt one ton (2,000 lbs.) of ice
in one hour. 12,000 Btu/hr equals one ton of heat.
Typical input
current
The operating current of the product measured using a typical load and target voltage.
Typical power
consumption
Represents the expected power consumption of a given configuration. The typical value is the
approximate power consumption that a customer will most likely experience and can use for
power budgeting purposes.
U-Z
Vapor seal
A vapor seal is an essential part of preventing moisture infiltration into or migration out of a
critical space, such as a data processing center or other room that contains sensitive electronic
instrumentation. Essentially, a vapor seal is a barrier that prevents air, moisture, and
contaminants from migrating through tiny cracks or pores in the walls, floor, and ceiling into
the critical space. Vapor barriers may be created using plastic film, vapor-retardant paint, vinyl
wall coverings and vinyl floor systems, in combination with careful sealing of all openings
(doors and windows) into the room.
Watt
A unit of electricity consumption representing the product of amperage and voltage. When the
power requirement of a product is listed in watts, you can convert to amps by dividing the
wattage by the voltage. (e.g., 1200 watts divided by 120 volts is 10 amps.
52
Glossary
Index
A
air conditioning
ducts, 35
equipment requirements, 33
system recommendations, 34
air distribution system
above ceiling, 35
ceiling plenum, 34
room space return air, 34
underfloor, 34
B
branch circuit protection, 16
C
CFM, 18
circuit breaker, 16
computer room safety, fire protection, 23
cooling requirements, 33
D
data communications cables, 29
dc source and main dc power disconnect, 15
disconnect device, 16
ducts, air conditioning, 35
characteristics, 36
floor loading terms, 36
floor-plan grid, 39
typical raised floor site, 37
windows, 38
fire protection, 23
floor loading, raised floor, 37
G
grounding systems, electrical conduit ground, 27
H
humidity level, 35
I
installation schedule, 43
K
Keystone system
temperature and humidity specifications, 17
keystone system
environmental elements, 31
power system protection, 25
typical installation schedule, 43
M
main building electrical ground, 27
electrical and environmental guidelines

air distribution system, 34
computer equipment grounds, 27
computer room safety, fire protection, 23
electrical conduit ground, 27
grounding systems, 26
lighting requirements, 24
main building electrical ground, 27
power distribution safety grounding, 26
power panel grounds, 27
power quality, 25
power quality, sources of electrical disturbances, 25
system installation guidelines, 29
electrical specifications, 14
environmental elements, 31
acoustics, 36
air conditioning equipment requirements, 33
air conditioning recommendations, 33
air distribution systems, 34
computer room considerations, 31
cooling requirements, 33
electrostatic discharge
prevention, 35
humidity level, 35
static protection measures, 36
wiring, connections, 29
noise emission specifications, 19
P
physical and environmental specifications, 49
power
consumption, 24
distribution hardware, 26
distribution safety grounding, 26
quality, 25
system protection, 25
R
raised floor, ground system, 28
S
sources of electrical disturbances, 25
space requirements, delivery, 38
system installation guidelines, 29
data communications cables, 29
wiring connections, 29
T
temperature and humidity specifications, 17
facility guidelines
53

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HP Integrity cx2620 Site Preparation Guide

HP Part Number: AB587-96013

Copyright 2007 Hewlett-Packard Development Company, L.P

2 General Site Preparation Guidelines.........................................................................21

Raceway Systems (electrical conduits) (LAHJ).................................................................................26

A Physical and Environmental Specifications...............................................................49

HP Integrity cx2620 Server............................................................................................................14

About This Document

New and Changed Information in This Edition

Diagnostics and Event Monitoring: Hardware Support Tools

HP Encourages Your Comments

About This Document

Optional Internal Disks

Optional Internal Media

One DVD or One CD-RW / DVD One DVD, or one CD-RW/DVD

1 GB (4 X 256 MByte DIMMs)

Four 64-bit, 133 MHz PCI-X slots

Figure 1-1 HP Integrity cx2620 Server

Dimensions and Weights

17.8 cm (7 in) (4U)

44.5 cm (17.5 in)

50.8 cm (20 in)

28.1 kg (62 lb) Unloaded

Connection with a dc source should only be performed by trained service personnel.

dc Source and Main dc Power Disconnect

Grounding the Server

Disconnect Device and Branch Circuit Protection

System Power Specifications

Nominal Input Voltage

-48 VDC (-40 to -60 VDC)

Minimum Operating Voltage

Maximum Operating Voltage

12A DC typical (with VIN -48 VDC)

580W typical (@ 85% efficiency)

Maximum Inrush Current

Maximum Output Current from each Power

Table 1-5 CPU Power Consumption

Single-core Itanium (1P/1C)

1.6 GHz with 3 MB of cache

Dual-core Itanium (1P/2C)

1.4 GHZ with 12 MB of cache

Dual-core Itanium (1P/2C)

1.6 GHZ with 18 MB of cache

Temperature and Humidity

Environmental Temperature Sensor

Overall System Cooling

Without Air Baffle

Minimum: 146 CFM

Minimum: 166 CFM

Maximum: 185 CFM

Maximum: 216 CFM

Power Supply Cooling

PCI-X/Mass Storage Section Cooling

Typical Power Dissipation and Cooling

1 GB (4 DIMMs @ 256 MB ea.)

Acoustic Noise Specification

55 db LpA (sound pressure level at bystander position in a dedicated computer room

Physical and Environmental Specifications

Physical and Environmental Specifications

Two CPUs, two power

One CPU, two power

Front to Rear (F-R)

One CPU, one power