Documenti di Didattica
Documenti di Professioni
Documenti di Cultura
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Contents
EMC Fundamentals
EMC Design
EMC Measurements
EMC Standards
Using Decibels
Frequency versus Wavelength
Commonly Used Equations
Miscellaneous Information
Useful Software
References
Books
EMC Magazines
EMC Organizations
EMC Standards Organizations
LinkedIn Groups
Common Symbols
EMC Acronyms
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11
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25
27
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EMC Fundamentals
What is EMC?
Electromagnetic Compatibility is achieved when:
Electronic products do not interfere with their
environments (emissions)
The environments do not upset the operation of
electronic products (immunity)
The electronic product does not interfere with
itself (signal integrity)
Path
Source
Receiver
Aperture
Inductive
coupling
Radiated
emissions
Conducted
emissions
Capacitive
coupling
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Amplitude
Amplitude
uenc
Freq
Tim
Tim
Amplitude
uenc
Freq
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t
tr
tf
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Cm
2At
T
0 dB/decade
20 dB/decade
At
T
40 dB/decade
1
pt
1
ptr
Cm
(dBmV )
130
120
110
100
90
80
70
60
50
40
30
20
20 dB per
decade
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Trapezoidal
waveform with 100
MHz fundamental
and 0.1 ns rise time
40 dB per
decade
Trapezoidal
waveform with 100
MHz fundamental
and 0.5 ns rise time
Fundamental
frequency
108
10
1
ptr1
109
1
ptr 2
1010
f (Hz)
10
Cm
(dBmV )
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11
20 dB per
decade
Trapezoidal waveform with a
10 MHz fundamental frequency
and a 50% duty cycle
130
120
110
40 dB per
100 The rise time is
decade
1 ns for both
90
waveforms
80
70
Trapezoidal waveform with a
60
10 MHz fundamental frequency
50
and a 25% duty cycle
40
Fundamental
1
30
frequency
ptr
20
107
108
109
f (Hz)
11
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PC board
G+
Icm
Icm
CI, RI or ESD
I/O Cable
RE or CE
FIGURE 7
Icm
I/O Cable
+
RE or CE
FIGURE 8
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Connector Bonding
Connector shields must be bonded in multiple
places to the shielded enclosure. If this is not
done, then high-frequency common-mode
currents generated on the PC board may flow out
the I/O or power cables and cause radiated
emissions. Equally, cables may pick up outside
radiated or conducted sources, which can cause
circuit upsets.
Gaps between connector
housing and metal enclosure.
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14
Shield
I
Internal
electronics
Wire
(cable)
FIGURE 10
14
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ide
nt
Tra
ted
n
inc smitt
ide ed
nt
ec
fl
Re
Tra
ns
tte
tte
mi
ns
Tra
mi
FIGURE 11
15
Reflection Loss
RdB = 168 + 10 log10
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16
r
r f
2
0
2t/ j2t
= 20 log10 1
e
e
0 +
MdB
= 20 log10 1 e2t/ e j2t/
For most good shields, M is zero.
SE versus Slot Length
Freq (MHz)
20 dB SE
40 dB SE
10
100 cm
19 cm
30
75 cm
5 cm
100
15 cm
1.5 cm
300
5 cm
0.5 cm
500
2.5 cm
1000
1.5 cm
16
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17
17
Gap in return
plane
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Source
current
Source
+
+
+
+
18
Load
Return
current
Printed circuit board
Source
current
V
+
+
+
+
Return
current
V = M(di/dt)
FIGURE 12
18
Source
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Signal Layer
Plane 1
Via
Plane 2
Signal Layer
Load
FIGURE 13
Analog plane
Signal
IC1
IC2
Return
Digital plane
FIGURE 14
19
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20
20
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0
10
20
Transfer impedance dB
above 1 Ohm ( 2 dB)
+10
30
0.1
10
100
1000
Frequency (MHz)
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Preamp
(If required)
E-field (V/m)
EUT
Spectrum analyzer
22
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23
23
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24
70
FCC-A
60
FCC/CISPR-A CISPR-A
dB mV/m
50
FCC-B
FCC/CISPR-A CISPR-B
FCC/CISPR-A
FCC/CISPR-A
40
30
20
10
10
100
230
88
216
1000
Frequency (MHz)
24
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EMC Standards
Common Basic EMC Standards
Type
Standard
Commercial
CISPR 11
Test/Scope
ISM Equipment
CISPR 22
ITE Equipment
CISPR 16
Methods of Measurement
IEC 61000-3-2
Harmonics
IEC 61000-3-3
Flicker
IEC 61000-4-2
IEC 61000-4-3
Radiated Immunity
IEC 61000-4-4
IEC 61000-4-5
Surge (Lightning)
IEC 61000-4-6
Conducted Immunity
IEC 61000-4-8
Magnetic Immunity
IEC 61000-4-11
ITE Equipment
ANSI C63.4
Methods of Measurement
Medical
IEC 60601-1-2
Medical Products
Automotive
SAE J1113
Automotive EMC
Military
Aerospace
DO-160
SAE ARP5412B
SAE ARP5416A
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FIGURE 18
Class A
nonresidential
Class B
residential
Emissions
increase
industrial
residential,
commercial,
light industrial
Immunity
disturbances
70
60
CISPR A
50
FCC B
CISPR B
40
FCC A
30
20
10
10
100
88
216
230
FIGURE 19
EMC Pocket Guide
960
1000
Frequency (MHz)
26
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80
70
Class A average limit
60
40
30
0.1
0.45 1
10
100
Frequency (MHz)
FIGURE 20
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dBV = 20 log(V)
dBV = 20 log(V) + 120
V = 10(dBV/20)
V = 10((dBV120)/20)
dBV = dBV + 120
dBV = dBV 120
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dBV
20
127
10
117
107
10
97
20
87
30
77
40
67
50
57
60
47
70
37
80
27
90
17
100
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Power
0.1
10 dB
Voltage or Current
20 dB
0.2
7.0 dB
14.0 dB
0.3
5.2 dB
10.5 dB
0.5
3.0 dB
6.0 dB
0 dB
0 dB
3.0 dB
6.0 dB
4.8 dB
9.5 dB
7.0 dB
14.0 dB
8.5 dB
16.9 dB
9.0 dB
18.1 dB
9.5 dB
19.1 dB
10
10 dB
20 dB
20
13.0 dB
26.0 dB
30
14.8 dB
29.5 dB
50
17.0 dB
34.0 dB
100
20 dB
40 dB
1,000
30 dB
60 dB
1,000,000
60 dB
120 dB
30
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Freq Range
Wavelength
HF
330 MHz
100 m 10 m
VHF
30300 MHz
10 m 1 m
UHF
3001000 MHz
1 m 30 cm
12 GHz
30 cm 15 cm
24 GHz
15 cm 7.5 cm
48 GHz
7.5 cm 3.75 cm
812 GHz
3.75 cm 2.5 cm
Ku
1218 GHz
2.5 cm 1.67 cm
1827 GHz
1.67 cm 1.11 cm
Ka
2740 GHz
1.11 cm 0.75 cm
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Wavelength
1/4
10 Hz
30,000 km
7,500 km
1/20th
1,500 km
60 Hz
5,000 km
1,250 km
250 km
400 Hz
750 km
187.5 km
37.5 km
1 kHz
300 km
125 km
37.5 km
10 kHz
30 km
7.5 km
1.5 km
100 kHz
3 km
750 m
150 m
15 m
1 MHz
300 m
75 m
10 MHz
30 m
7.5 m
1.5 m
100 MHz
3m
75 cm
15 cm
300 MHz
100 cm
25 cm
5 cm
500 MHz
60 cm
15 cm
3 cm
1 GHz
30 cm
7.5 cm
1.5 cm
10 GHz
3 cm
.75 cm
.15 cm
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Wavelength
1/4
1/20th
10 MHz
18 m
4.5 m
90 cm
25 MHz
7.2 m
1.8 m
36 cm
50 MHz
3.6 m
90 cm
18 cm
100 MHz
1.8 m
45 cm
9 cm
200 MHz
90 cm
22.5 cm
4.5 cm
300 MHz
60 cm
15 cm
3 cm
400 MHz
45 cm
11 cm
2.25 cm
500 MHz
36 cm
9 cm
1.8 cm
600 MHz
30 cm
7.5 cm
1.5 cm
700 MHz
25.7 cm
6.4 cm
1.3 cm
800 MHz
22.5 cm
5.6 cm
1.1 cm
900 MHz
20 cm
5 cm
1 cm
1000 MHz
18 cm
4.5 cm
0.9 cm
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P = power
RI
RI
PR
I
R
amps ohms
P
V
I = current
V
R
V = voltage
P
I
watts volts
P
V
VI
RP
V2
R
V
I
V2
P
P
I2
R = resistance
1+
VSWR =
1
Prev
Pfwd
Prev
Pfwd
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VSWR =
Z1 Z2
=
Z1 + Z2
Reflection coefficient, , given fwd/rev power
Prev
Pfwd
RL(dB) = 10 log
Return Loss, given VSWR
RL(dB) = 20 log
Pfwd
Prev
VSWR 1
VSWR + 1
ML(dB) = 10 log
EMC Pocket Guide
Pfwd
Pfwd Prev
37
Wyatt-4670090
wyat4670090-book
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ML(dB) = 10 log 1 2
|I D | f 2 L S
d
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Height (a)
Depth (b)
Width (c)
( f )mnp
1
=
2
m 2
a
n 2
b
p 2
c
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For
a h/2.03
For a circular cavity
f = 2.4049/2a 0 0
Example: for a = 9 cm and h = 6 cm (a typical
cookie tin):
f =
2(0.09)
2.4049
f = 1, 275 MHz
Antenna (Far Field) Relationships
Gain, dBi to numeric
Gainnumeric = 10(dBi/10)
EMC Pocket Guide
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30P G
V /m =
d
Field strength, given Power (watts), antenna gain
(dBi) and distance (meters)
30P10(dBi/10)
V /m =
d
Transmit power required, given desired V/m,
antenna gain (numeric) and distance (meters)
Ptransmit =
((V /m)d)2
30G
((V /m)d)2
30(10(dBi/10 )
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Near field
High impedance
(electric) field
3,000
Zw (ohms)
1,000
Zo = 120p = 377
300
100
Low impedance
(magnetic) field
30
10
0.1
1.0
10
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V/m at 3 m
V/m at 10 m
V/m at 1 m
5.5
1.8
0.6
12.3
4.1
1.2
10
17.4
5.8
1.7
25
27.5
9.2
2.8
50
38.9
13.0
3.9
100
55.0
18.3
5.5
1000
173.9
58.0
17.4
Citizens
Band
27 MHz
5W
12
FRS
465 MHz
500 mW
GMRS
465 MHz
1 to 5 W
5.5 to 12
3G Mobile
Phone
830 MHz /
1.8 GHz
400 mW
3.5
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Zinc
1.05 .029
Cadmium
Stainless steel
Nickel, monel
Copper, bronze
Brass
Iron, steel
Chromium
Brass
Chromium
Iron, steel
Tin
.075
Aluminum
Tin
Cadmium
Aluminum
Zinc
Cathode
Magnesium
Anode
Stainless steel 1.67 0.91 0.64 0.64 0.35 0.32 0.20 0.11 0.02 0.08
Silver
1.78 1.02 0.75 0.75 0.44 0.43 0.31 0.22 0.21 0.19 0.11
1. For units which will be subjected to salt spray or salt water, metal should be
chosen where the potential difference is less than 0.25V.
2. Where it is possible the unit will be subjected to high humidity that is not salt
laden, then the potential difference should not exceed 0.45V.
Triboelectric Series
The triboelectric series determines how different
materials will accept or give up electrons when
rubbed together, to determine which material
becomes more positive and which becomes more
negative.
EMC Pocket Guide
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Useful Software
PC
LTspice (free from Linear Technology)
Various PC board layout viewers (refer to layout
manufacturers)
Macintosh
EasyDraw (for producing schematics, drawings
and graphics)
McCAD (reviewing PC board layouts)
MacSpice (spice simulator)
iPad/iPhone
dB Calculator (Rohde & Schwarz)
Field Strength & Power Estimator (Rohde &
Schwarz)
Interference Hunter (Rohde & Schwarz)
Aviation RF Link (Rohde & Schwarz)
Wireless Communication Calculator (Rohde &
Schwarz)
iCircuit (schematic capture and analysis)
LineCalc (coax cable loss and electrical length)
Electronic TB (multitude of handy electronic
design aids)
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References
Books
ARRL, The RFI Handbook, 3rd edition, 2010.
Eric Bogatin, Signal Integrity - Simplified,
Prentice Hall PTR, 2004.
Stephen H. Hall, Garrett W. Hall & James A.
McCall, High-Speed Digital System Design: A
Handbook of Interconnect Theory and Design
Practices, John Wiley & Sons, 2000.
Howard W. Johnson & Martin Graham,
High-Speed Digital Design: A Handbook of Black
Magic, Prentice Hall PTR, 1993.
Howard W. Johnson & Martin Graham,
High-Speed Signal Propagation: Advanced Black
Magic, Prentice Hall PTR, 2003.
Elya B. Joffe and Kai-Sang Lock, Grounds for
Grounding: A Circuit to System Handbook,
Wiley, 2010.
Kenneth L. Kaiser, Handbook of Electromagnetic
Compatibility, CRC Press, 2005.
Ralph Morrison, Grounding and Shielding
Circuits and Interference, 5th ed.,
Wiley-Interscience, 2007.
Henry W. Ott, Electromagnetic Compatibility
Engineering, John Wiley & Sons, 2009.
EMC Pocket Guide
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LinkedIn Groups
LinkedIn is the worlds largest professionals
networking and discussion forum. Several
discussion groups related to EMC are listed here.
Create your free profile at: www.linkedin.com.
Common Symbols
55
AM
cm
dBm
dBA
dBV
DC
E
E/M
EM
EMC
EMI
FM
GHz
H
Hz
I
kHz
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Amplitude modulated
Centimeter, one hundredth of a meter
dB with reference to 1 mW
dB with reference to 1 A
dB with reference to 1 V
Direct Current
E is the electric field component of an
electromagnetic field.
Ratio of the electric field (E) to the magnetic field (H), in the far-field this is the
characteristic impedance of free space, approximately 377
Electromagnetic
Electromagnetic compatibility
Electromagnetic Interference
Frequency modulated
Gigahertz, one billion Hertz
(1,000,000,000 Hertz)
H is the magnetic field component of an
electromagnetic field.
Hertz, unit of measurement for frequency
Electric current
Kilohertz, one thousand Hertz (1000
Hertz)
Lambda, symbol for wavelength, distance
a wave travels during the time period necessary for one complete oscillation cycle
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MHz
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EMC Acronyms
AF (Antenna Factor) The ratio of the received
field strength to the voltage at the terminals of a
receiving antenna. Units are 1/m.
ALC (Absorber-Lined Chamber) A shielded
room with RF-absorbing material on the walls
and ceiling. In many cases, the floor is reflective.
AM (Amplitude Modulation) A technique for
putting information on a sinusoidal carrier signal
by varying the amplitude of the carrier.
BCI (Bulk Current Injection) An EMC test
where common-mode currents are coupled onto
the power and communications cables of an EUT.
CE (Conducted Emissions) The RF energy
generated by electronic equipment, which is
conducted on power cables.
CE Marking The marking signifying a product
meets the required European Directives.
CENELEC French acronym for the European
Committee for Electrotechnical Standardization.
CI (Conducted Immunity) A measure of the
immunity to RF energy coupled onto cables and
wires of an electronic product.
CISPR French acronym for Special
International Committee on Radio Interference.
EMC Pocket Guide
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