SPBTLE-RF

Very low power module for Bluetooth Smart v4.1

Datasheet - production data

Applications
Watches
Fitness, wellness and sports
Consumer medical
Security/proximity
Remote control
Home and industrial automation
Assisted living
Mobile phone peripherals
PC peripherals

Features

Description

Bluetooth v4.1 compliant

Supports master and slave modes
Multiple roles supported simultaneously
Embedded Bluetooth low energy protocol stack
GAP, GATT, SM, L2CAP, LL, RFPHY
Bluetooth low energy profiles provided
separately
Bluetooth radio performance:
Embedded ST BlueNRG-MS
Tx power: + 4 dBm
Rx sensitivity: - 88 dBm
Provides up to 92 dB link budget with
excellent link reliability
Host interface
SPI, IRQ, and RESET
On-field stack upgrading available via SPI
AES security co-processor

The SPBTLE-RF is an easy to use Bluetooth

Smart master/slave network processor module,
compliant with Bluetooth v4.1. The SPBTLE-RF
B-SmarT module supports multiple roles
simultaneously, and can act at the same time as
Bluetooth Smart sensor and hub device.
The entire Bluetooth Smart stack and protocols
are embedded into SPBTLE-RF B-SmarT
module. The external host application processor,
where the application resides, is connected to the
SPBTLE-RF B-SmarT module through a standard
SPI interface.
The SPBTLE-RF B-SmarT module provides a
complete RF platform in a tiny form factor. Radio,
antenna, high frequency and LPO oscillators are
integrated to offer a certified solution to optimize
the time to market of the final applications.
The SPBTLE-RF can be powered directly with a
standard 3 V coin cell battery, a pair of AAA
batteries or any power source from 1.7 to 3.6 V.

Certification
CE qualified
FCC, IC modular approval certified
BQE qualified
On-board chip antenna
Operating supply voltage: from 1.7 to 3.6 V
Operating temperature range: -40 C to 85 C
January 2016
This is information on a product in full production.

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Contents

SPBTLE-RF

Contents
1

General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Software architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1

Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4.1

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.2

Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.3

Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

4.4

Current consumption comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4.5

Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4.6

Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.1

Bluetooth firmware implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1

6.2

FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1.1

Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6.1.2

Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2.1

Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

6.2.2

Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

6.3

CE certification for SPBTLE-RF module . . . . . . . . . . . . . . . . . . . . . . . . . 19

6.4

Bluetooth certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

ECOPACK

Traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

10

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

2/23

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

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General description

General description
The SPBTLE-RF is a single-mode Bluetooth low energy master/slave network processor
module compliant with Bluetooth v4.1.
The SPBTLE-RF B-SmarT module integrates a 2.4 GHz RF radio the ST BlueNRG-MS on
which a complete power-optimized stack for Bluetooth single mode protocol runs, providing

Master, slave role support

GAP: central, peripheral, observer or broadcaster roles

ATT/GATT: client and server

SM: privacy, authentication and authorization

L2CAP

Link Layer: AES-128 encryption and decryption

The BlueNRG-MS radio embeds nonvolatile Flash memory allows on-field stack upgrading.
In addition, according the Bluetooth specification v4.1 the SPBTLE-RF B-SmarT module
provides:

Multiple roles simultaneously support

Support simultaneous advertising and scanning

Support being slave of up to two masters simultaneously

Privacy V1.1

Low duty cycle directed advertising

Connection parameters request procedure

LE Ping

32 bits UUIDs

L2CAP connection oriented channels

The SPBTLE-RF B-SmarT module is equipped with Bluetooth low energy profiles in C
source code, available for the ST radio BlueNRG-MS.
The external host application processor, where the application resides, is interfaced with the
SPBTLE-RF B-SmarT module through an application controller interface protocol, which is
based on a standard SPI interface.
The SPBTLE-RF B-Smart module enables wireless connectivity into electronic devices, not
requiring any RF experience or expertise for integration into the final product. The SPBTLERF B-Smart module provides a complete RF platform in a tiny form factor and being a
certified solution optimizes the time to market of the final applications.
The SPBTLE-RF B-SmarT module allows applications to meet of the tight advisable peak
current requirements imposed with the use of standard coin cell batteries. Optimized results
are obtained when the embedded high-efficiency DC-DC step-down converter is used.
SPBTLE-RF can be powered directly with a standard 3 V coin cell battery, a pair of AAA
batteries or any power source from 1.7 to 3.6 V.

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Block diagram

SPBTLE-RF

Block diagram
Figure 1. HW block diagram

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SPBTLE-RF

Software architecture

Software architecture

3.1

Bluetooth firmware implementation

Figure 2. SPBTLE-RF application block diagram

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Hardware specifications

SPBTLE-RF

Hardware specifications
General conditions (VIN= 3.3 V and 25 C)

4.1

Absolute maximum ratings

Table 1. Absolute maximum ratings
Rating

Min

Typ.

Max

Unit

Storage temperature range

-40

+85

Supply voltage, VIN

-0.3

3.9

I/O pin Voltage (VIO five-volt tolerant pin)

-0.3

3.9

dBm

RF saturation input power

4.2

Recommended operating conditions

Table 2. Recommended operating conditions
Rating

Min

Typ.

Max

Unit

Storage temperature range

-40

+85

Supply voltage, VIN

1.7

3.3

3.6

Signals & I/O pin voltage

(according supply voltage)

1.7

3.6

2402

2480

MHz

RF Frequency

4.3

Current consumption
Table 3. Current consumption summary
Symbol

IDD

6/23

Parameter

Test conditions

Typ.

Unit

Shutdown / STANDBY

1.98

Peripheral in advertising (20 ms)

0.850

mA

Peripheral in advertising (80 ms)

0.250

mA

Peripheral in connection

0.103

mA

Central in scan mode

7.72

mA

Central in connection

0.105

mA

Supply current

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4.4

Hardware specifications

Current consumption comparison

The measured values reported in table 3 have been compared with the value calculated
with the BlueNRG current consumption estimation tool, available on ST.com at:
http://www.st.com/web/en/catalog/tools/PF260405
The comparison between measured and calculated values is reported in following Table 4.
Table 4. Current consumption comparison summary

Symbol

IDD

Parameter

Test conditions

Typ.

Peak

Calculated

Unit

Calculated
value reference

BlueNRG-MS
Datasheet Table
7

Shutdown /
STANDBY

1.98

Peripheral in
advertising (20 ms)

0.850

11.5

0.985

mA

Screenshot
Figure 3

Peripheral in
Supply current advertising (80 ms)

0.250

15.7

0.247

mA

Screenshot
Figure 4

Peripheral in
connection

0.103

15

0.119

mA

Screenshot
Figure 5

Central in scan
mode

7.72

8.5

7.1 - 7.4

mA

Screenshot
Figure 6

Central in
connection

0.105

12.85

0.106

mA

Screenshot
Figure 7

For each calculated value refer to the following screenshot

Figure 3. Peripheral in advertising (20 ms)

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Hardware specifications

SPBTLE-RF
Figure 4. Peripheral in advertising (80 ms)

Figure 5. Peripheral in connection

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Hardware specifications
Figure 6. Central in scan mode

Figure 7. Central in connection

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Hardware specifications

4.5

SPBTLE-RF

Pin assignment
Figure 8. Pin connection

Table 5. Pin assignment

Name

Type

Pin #

Description

V max. Tolerant

SPI Interface
SPI_IRQ

SPI IRQ (SLAVE has data for

MASTER)

Vin

SPI_CLK

SPI CLOCK (Max. 8 MHz)

Vin

SPI_MISO

SPI MISO (MASTER in / SLAVE out)

Vin

SPI_MOSI

SPI MOSI (MASTER out SLAVE in)

Vin

SPI_CS

10

SPI Chip select (SPI slave select)

Vin

Power and ground

Vin

Vin

GND

GND

(1.7V - 3.6V max.)

Reset
BT_RESET

11

Reset input (active low < 0.35 Vin)

LPO

EXT_LPCLK
GPIO2
ANA TEST 0

10/23

Not connected

I/O

Not connected

Not connected

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(1.7V - 3.6V max.)

SPBTLE-RF

4.6

Hardware specifications

Mechanical dimensions
Figure 9. Mechanical dimensions

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Hardware specifications

SPBTLE-RF
Figure 10. Recommend land pattern top view

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SPBTLE-RF

Hardware design

Hardware design
SPBTLE-RF module supports SPI hardware interfaces.

Note:

- All unused pins should be left floating; do not ground.

- All GND pins must be well grounded.
- The area around the module should be free of any ground planes, power planes, trace
routings, or metal for 6 mm from the module antenna position, in all directions.
- Traces should not be routed underneath the module.

5.1

Reflow soldering
The SPBTLE-RF is a high temperature strength surface mount Bluetooth module supplied
on a 11 pin, 4-layer PCB. The final assembly recommended reflow profiles are indicated
here below.
Soldering phase has to be executed with care: in order to avoid undesired melting
phenomenon, particular attention has to be taken on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on following
recommendations.
Table 6. Soldering
Profile feature
Average ramp up rate (TSMAX to Tp)

PB-free assembly
3C/ sec max

Preheat
Temperature min (TS mn)
Temperature max (TS max)
Time (tS min to tS max) (tS)

150 C
200 C
60-100 sec

Time maintained above:

Temperature TL
Time tL

217 C
60-70 sec

Peak temperature (TP)

240 + 0 C

Time within 5 C of actual peak temperature (TP)

10-20 sec

Ramp down rate

6 C/sec

Time from 25 C to peak temperature

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Hardware design

SPBTLE-RF
Figure 11. Soldering profiles

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SPBTLE-RF

Regulatory compliance

Regulatory compliance

6.1

FCC certification
This module has been tested and found to comply with the FCC part 15 rules. These limits
are designed to provide reasonable protection against harmful interference in approved
installations. This equipment generates, uses, and can radiate radio frequency energy and,
if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions:
1.

This device may not cause harmful interference,

and
2.

this device must accept any interference received, including interference that may
cause undesired operation.

Modifications or changes to this equipment not expressly approved by STMicroelectronics

may render void the user's authority to operate this equipment.

Modular approval
FCC ID: S9NSPBTLERF
In accordance with FCC part 15, the SPBTLE-RF is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple
transmitters must comply with colocation and RF exposure requirements in accordance with
FCC multi-transmitter product procedures. Collocated transmitters operating in portable RF
Exposure conditions (e.g. <20 cm from persons including but not limited to body worn and
hand held devices) may require separate approval.

6.1.1

Labeling instructions
When integrating the SPBTLE-RF into the final product, the OEM must ensure that the FCC
labeling requirements are satisfied. A statement must be included on the exterior of the final
product which indicates the product includes a certified module. The label should state the
following (or similar wording that conveys the same meaning):
Contains FCC ID: S9NSPBTLERF

OR
This product contains FCC ID: S9NSPBTLERF

The OEM must include the following statements on the exterior of the final product unless
the product is too small (e.g. less than 4 x 4 inches):
This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:

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Regulatory compliance
1.

SPBTLE-RF

this device may not cause harmful interference,

and
2.

6.1.2

this device must accept any interference received, including any interference that may
cause undesired operation.

Product manual instructions

This section applies to OEM final products containing the SPBTLE-RF module, subject to
FCC compliance. The final product manual must contain the following statement (or a
similar statement that conveys the same meaning):

Warning:

Changes or modifications not expressly approved by the

party responsible for compliance could void the user's
authority to operate the equipment. (Part. 15.21)

In the case where an OEM seeks Class B (residential) limits for the final product, the
following statement must be included in the final product manual:
Note:

This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

In the case where an OEM seeks the lesser category of a Class A digital device for the final
product, the following statement must be included in the final product manual:
Note:

This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference in which case the user will be required to correct
the interference at his expense.

6.2

IC certification
The SPBTLE-RF module has been tested and found compliant with the IC RSS-210 rules.
These limits are designed to provide reasonable protection against harmful interference in

16/23

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SPBTLE-RF

Regulatory compliance
approved installations. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications.
However, there is no guarantee that interference may not occur in a particular installation.
This device complies with RSS-210 of the IC rules. Operation is subject to the following two
conditions:
1.

this device may not cause harmful interference,

and
2.

this device must accept any interference received, including interference that may
cause undesired operation.

Modifications or changes to this equipment not expressly approved by STMicroelectronics

may render void the user's authority to operate this equipment.

Modular approval
IC: 8976C-SPBTLERF
In accordance with IC RSS-210, the SPBTLE-RF is listed as a modular transmitter device.
This module is evaluated for stand-alone use only. Finished products incorporating multiple
transmitters must comply with colocation and RF exposure requirements in accordance with
IC multi-transmitter product procedures. Collocated transmitters operating in portable RF
Exposure conditions (e.g. <20cm from persons including but not limited to body worn and
hand held devices) may require separate approval.

6.2.1

Labeling instructions
When integrating the SPBTLE-RF into the final product, the OEM must ensure that the IC
labeling requirements are satisfied. A statement must be included on the exterior of the final
product which indicates that the product includes a certified module. The label should state
the following (or similar wording that conveys the same meaning):
Contains IC: 8976C-SPBTLERF
OR
This product contains IC: 8976C-SPBTLERF
The OEM must include the following statements on the exterior of the final product unless
the product is too small (e.g. less than 4 x 4 inches):
This device complies with RSS-210 of the IC Rules. Operation is subject to the following two
conditions:
1.

this device may not cause harmful interference,

and
2.

this device must accept any interference received, including any interference that may
cause undesired operation.

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Regulatory compliance

6.2.2

SPBTLE-RF

Product manual instructions

This section applies to OEM final products containing the SPBTLE-RF module, subject to IC
compliance. The final product manual must contain the following statement (or a similar
statement that conveys the same meaning):

Warning:

Changes or modifications not expressly approved by the

party responsible for compliance could void the user's
authority to operate the equipment. (RSS-210)

In the case where an OEM seeks Class B (residential) limits for the final product, the
following statement must be included in the final product manual:
Note:

This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed and
used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

In the case where an OEM seeks the lesser category of a Class A digital device for the final
product, the following statement must be included in the final product manual:
Note:

18/23

This equipment has been tested and found to comply with the limits for a Class A digital
device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential
area is likely to cause harmful interference in which case the user will be required to correct
the interference at his expense.

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6.3

Regulatory compliance

CE certification for SPBTLE-RF module

The SPBTLE-RF module has been certified according to the following standards:

EN 60950-1:2006 + A11:2009 + A12:2011 + A1:2010 + A2:2013 + AC:2011

ETSI EN 301 489-1 V1.9.2:2011

ETSI EN 301 489-17 V2.2.1

ETSI EN 300 328 V1.8.1:2012

ETSI EN 300 328 V1.9.1 (2015)

EN62479:2010

CE Expert opinion: 0561-ARSP00053

The module is CE certified:

6.4

Bluetooth certification
The module with embedded stack and profile has been qualified in accordance with SIG
qualification rules:

Declaration ID: D028766

Qualified design ID: 71984

Product type: End Product

Core spec version: 4.1

Product description: Bluetooth Smart v4.1 module

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Ordering information

SPBTLE-RF

Ordering information
Table 7. Ordering information

20/23

Order code

Description

Packing

MOQ

SPBTLE-RF

Bluetooth V4.1 smart module

JEDEC tray

2448 pcs

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ECOPACK

SPBTLE-RF

ECOPACK
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.

Traceability
Each module is univocally identified by serial number stored in a 2D data matrix laser
marked on the bottom side of the module itself.
The serial number has the following format:
Table 8. Traceability information
Letter

Meaning

WW

Week

YY

Year

Product ID family

FF

Production panel coordinate identification

NNN

Progressive serial number.

Each module bulk is identified by a bulk ID.

BULK ID and module 2D data matrix are linked by a reciprocal traceability link.
The module 2D data matrix traces the lot number of any raw material used.

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Revision history

10

SPBTLE-RF

Revision history
Table 9. Document revision history

22/23

Date

Revision

Changes

07-May-2015

Initial release.

09-Jul-2015

Inserted: Section 4.3 and Section 4.4.

03-Nov-2015

Document status promoted from preliminary data to

production data.
Added Section 6.4: Bluetooth certification.

17-Dec-2015

Updated figure on the cover page.

11-Jan-2016

Updated BQE feature on the cover page.

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SPBTLE-RF

IMPORTANT NOTICE PLEASE READ CAREFULLY

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improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
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acknowledgement.

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the design of Purchasers products.

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Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

2016 STMicroelectronics All rights reserved

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