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What is Floorplan?
Die Size Estimation
pin/pad location
hard macro placement
placement and routing blockage
location and area of the soft macros and its pin locations
number of power pads and its location.
Note:- For block level Die size and Pin placement comes from TOP
Flyline analysis is required before placing the macros
While fixing the location of the pin or pad always consider the surrounding environment with
which the block or chip is interacting.
This avoids routing congestion and also benefits in effective circuit timing
Provide sufficient number of power/ground pads on each side of the chip for effective power
distribution.
In deciding the number of power/ground pads, Power report and IR-drop in the design should
also be considered