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DATA SHEET
TDA7056B
5 W mono BTL audio amplifier with
DC volume control
Product specification
Supersedes data of 1996 May 28
1997 Aug 15
NXP Semiconductors
Product specification
TDA7056B
FEATURES
GENERAL DESCRIPTION
DC volume control
PARAMETER
VP
supply voltage
PO
output power
Gv(max)
CONDITIONS
MIN.
TYP.
4.5
RL = 16
RL = 8
MAX.
UNIT
18
3.5
5.5
39.5
40.5
41.5
dB
VP = 12 V
gain control
68
73.5
dB
Iq(tot)
VP = 12 V; RL =
9.2
13
mA
THD
PO = 0.5 W
0.3
ORDERING INFORMATION
TYPE
NUMBER
TDA7056B
1997 Aug 15
PACKAGE
NAME
SIL9MPF
DESCRIPTION
plastic single in-line medium power package with fin; 9 leads
VERSION
SOT110-1
NXP Semiconductors
Product specification
TDA7056B
BLOCK DIAGRAM
VP
2
n.c.
n.c.
input
DC volume control
TDA7056B
I + i
I i
positive output
3
5
STABILIZER
Vref
negative output
TEMPERATURE
PROTECTION
MSA708 - 1
power
ground
signal
ground
PINNING
SYMBOL
PIN
DESCRIPTION
handbook, halfpage
n.c.
not connected
VP
VI
voltage input
GND1
signal ground
VC
DC volume control
OUT+
positive output
GND2
power ground
OUT
OUT
negative output
GND2
n.c.
not connected
OUT
n.c.
VP
VI
GND1
VC
n.c.
TDA7056B
9
MSA707
1997 Aug 15
NXP Semiconductors
Product specification
TDA7056B
The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stage has a logarithmic control
characteristic. Therefore, the total gain can be controlled
from 40.5 dB to 33 dB. If the DC volume control voltage
falls below 0.4 V, the device will switch to the mute mode.
Power dissipation
Assume VP = 12 V; RL = 16 .
The maximum sine wave dissipation is = 1.8 W.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
18
V3, 5
IORM
1.25
IOSM
1.5
Ptot
Tamb
40
+85
Tstg
storage temperature
55
+150
Tvj
+150
Tsc
short-circuit time
Tcase 60 C
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
55
K/W
Rth j-c
10
K/W
1997 Aug 15
NXP Semiconductors
Product specification
TDA7056B
CHARACTERISTICS
VP = 12 V; VDC = 1.4 V; f = 1 kHz; RL = 16 ; Tamb = 25 C; unless otherwise specified (see Fig.13).
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VP
Iq(tot)
4.5
18
note 1; RL =
9.2
13
mA
output power
THD = 10%; RL = 16
3.5
THD = 10%; RL = 8
5.5
THD
PO = 0.5 W
0.3
Gv(max)
39.5
40.5
41.5
dB
VI
1.0
Vno
210
bandwidth
at 1 dB
0.02 to 300
kHz
SVRR
note 3
34
38
dB
VO
V8 v6
200
mV
ZI
15
20
25
35
45
68
73.5
dB
20
25
30
Mute position
VO
note 4; V5 0.4 V;
VI = 1.0 V
gain control
I5
control current
V5 = 0 V
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 and B = 5 kHz.
3. The ripple rejection is measured with RS = 0 and f = 100 Hz to 10 kHz. The ripple voltage VR of 200 mV
(RMS value) is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 k unweighted.
5. The DC volume control can be configured in several ways. Two possible circuits are shown in Figs 14 and 15.
The circuits at the volume control pin will influence the switch-on and switch-off behaviour and the maximum voltage
gain.
1997 Aug 15
NXP Semiconductors
Product specification
TDA7056B
MBH372
40
MBH365
handbook, halfpage
handbook, halfpage
Gv
(dB)
Vno
(mV)
101
40
80
120
0.4
0.8
1.2
102
1.6
2.0
VDC (V)
0.4
0.8
1.2
1.6
2
VDC (V)
Fig.3
Fig.4
MBH376
25
MBH367
20
handbook, halfpage
handbook, halfpage
IDC
(A)
IP
(mA)
15
15
5
10
15
25
Fig.5
0.4
0.8
1.2
1.6
2.0
VDC (V)
12
16
VP (V)
20
Measured with RL = .
1997 Aug 15
NXP Semiconductors
Product specification
TDA7056B
MBH361
10
MBH362
10
handbook, halfpage
handbook, halfpage
THD
(%)
8
THD
(%)
8
(1)
(2)
(1)
(2)
0
10-1
0
102
10
PO (W)
(1) RL 16 .
(2) RL = 8 .
Fig.7
101
10
f (kHz)
102
PO = 0.1 W.
(1) Gv(max) = 40 dB.
(2) Gv(max) = 30 dB.
MBH363
MBH364
6
Pd
(W)
5
10
handbook, halfpage
handbook, halfpage
PO
(W)
4
6
3
(2)
(1)
(1)
(2)
2
2
0
0
12
16
VP (V)
20
12
16
VP (V)
20
(1) RL = 8 .
(2) RL = 16 .
1997 Aug 15
NXP Semiconductors
Product specification
TDA7056B
MBH374
20
MBH375
2.0
VI
(V)
handbook, halfpage
handbook, halfpage
SVRR
(dB)
30
1.6
(1)
40
1.2
50
0.8
(2)
60
70
102
0.4
101
10
f (kHz)
102
12
16
VP (V)
1997 Aug 15
20
NXP Semiconductors
Product specification
TDA7056B
(1)
VP = 12 V
220 F
100 nF
2
n.c.
n.c.
input
0.47 F
1
9
TDA7056B
I+i
3
5
RL = 8
Ii
RS
5 k
DC
volume
control
STABILIZER
TEMPERATURE
PROTECTION
MSA709 - 2
ground
To avoid instabilities and too high distortion, the input- and power ground must be separated as long as possible and connected together as close as
possible to the IC.
(1) This capacitor can be omitted if the 220 F electrolytic capacitor is connected close to pin 2.
For single-end application the output peak current may not exceed 100 mA; at higher output currents the short circuit
protection (MLC) will be activated.
1997 Aug 15
NXP Semiconductors
Product specification
handbook, halfpage
TDA7056B
VP = 12 V
handbook, halfpage
volume
control
volume
control
100 k
5
1 F
1 M
1 F
22 k
MSA710
MBH366
1997 Aug 15
10
NXP Semiconductors
Product specification
TDA7056B
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D1
q
A2
P1
A3
q1
q2
A
A4
seating plane
E
pin 1 index
L
1
9
b
b2
w M
b1
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
max.
A3
A4
b1
b2
D (1)
D1
E (1)
P1
q1
q2
Z (1)
max.
mm
18.5
17.8
3.7
8.7
8.0
15.8
15.4
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
6.48
6.20
2.54
3.9
3.4
2.75
2.50
3.4
3.2
1.75
1.55
15.1
14.9
4.4
4.2
5.9
5.7
0.25
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
95-02-25
03-03-12
SOT110-1
1997 Aug 15
EUROPEAN
PROJECTION
11
NXP Semiconductors
Product specification
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
1997 Aug 15
TDA7056B
12
NXP Semiconductors
Product specification
TDA7056B
PRODUCT
STATUS(2)
DEFINITION
Development
This document contains data from the objective specification for product
development.
Qualification
Production
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Right to make changes NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
DEFINITIONS
Product specification The information and data
provided in a Product data sheet shall define the
specification of the product as agreed between NXP
Semiconductors and its customer, unless NXP
Semiconductors and customer have explicitly agreed
otherwise in writing. In no event however, shall an
agreement be valid in which the NXP Semiconductors
product is deemed to offer functions and qualities beyond
those described in the Product data sheet.
DISCLAIMERS
Limited warranty and liability Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
1997 Aug 15
13
NXP Semiconductors
Product specification
1997 Aug 15
TDA7056B
14
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
RM5/03/pp15