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Descriptions
The 15-21 SMD Taping is much smaller
than lead frame type components, thus
enable smaller board size, higher
packingdensity, reduced storage space and
finally smaller equipment to be obtained.
Besides, lightweight makes them ideal for
miniature applications. etc.
Applications
Telecommunication: indicator and backlighting in
telephone and fax.
Flat backlight for LCD, switch and symbol.
General use.
Chip
Material
Emitted Color
AlGaInP
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Prepared date: 19-Aug-2005
Rev
Lens Color
Water Clear
Page: 1 of 9
1.5
3.2
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Prepared date: 19-Aug-2005
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Symbol
Rating
Unit
Reverse Voltage
VR
Forward Current
IF
25
mA
Operating Temperature
Topr
-40 ~ +85
Storage Temperature
Tstg
-40~ +90
Electrostatic Discharge(HBM)
ESD
2000
Power Dissipation
Pd
60
mW
IF
60
mA
Tsol
Luminous Intensity
Viewing Angle
Peak Wavelength
Symbo *Chip
Min.
l
Rank
E2
15
Iv
E3
25
E4
35
E5
45
21/2 ---------
Typ.
Max.
Unit
21
32
43
54
130
---------------------
mcd
deg
-----
-----
575
-----
nm
-----
-----
573
nm
-----
-----
20
---------
Forward Voltage
VF
IR
1.7
-----
2.0
-----
2.4
10
Reverse Current
---------
Dominant Wavelength
Spectrum
IF=20 mA
nm
RadiatioBandwidth
VR=5V
*15-21SYGC/S530-XX/TR8
Chip Rank
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Prepared date: 19-Aug-2005
Rev
Page: 3 of 9
VV
Everlight Electronics Co., Ltd.
Device No:SZDSE-151-022
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Prepared date: 19-Aug-2005
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Page: 4 of 9
xxxxxx
xxxxxx
RoHS
xxxxxxxxxxxx
xxxx
xxxxxxxx
Reel Dimensions
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Prepared date: 19-Aug-2005
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Page: 5 of 9
Label
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Desiccant
Rev
Label
Page: 6 of 9
No.
Items
Test Condition
Reflow Soldering
Temp. : 2605
5 sec.
Test
Sample
Ac/Re
Hours/Cycles Size
22 Pcs.
0/1
Temperature Cycle
H : +100 15min
5 min
L : -40 15min
0/1
Thermal Shock
H : +100 5min
10 sec
L : -10 5min
0/1
High Temperature
Storage
Temp. : 100
1000 Hrs.
22 PCS.
0/1
Low Temperature
Storage
Temp. : -40
1000 Hrs.
22 PCS.
0/1
DC Operating Life
IF = 20 mA
1000 Hrs.
22 PCS.
0/1
High Temperature /
High Humidity
85/85%RH
1000 Hrs.
22 PCS.
0/1
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Prepared date: 19-Aug-2005
6 Min.
Rev
Page: 7 of 9
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
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Prepared date: 19-Aug-2005
Rev
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Rev
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