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1
Semiconductor Devices 2005 Semiconductor Devices 2005
Collector
contact Top view IB
IE -IC IE > 0
IE = 0
-VCB
Cross-
Base VEB
sectional
Collector view Emitter-base junction Collector-base junction
forward biased reverse biased
I. Shih VII-5 I. Shih VII-6
E-B and B-C junctions at zero bias E-B and B-C junctions at zero bias
P P ξ ( electric field )
ξ ( electric field ) EC
EC
EF
N EF
Ei
Ei EV
EV
WE W WC
ρ ξ ξ
qNB qNB
-qNE -qNC
2
Semiconductor Devices 2005 Semiconductor Devices 2005
x” x x’
3
Semiconductor Devices 2005 Semiconductor Devices 2005
IB = IE - IC 0” 0
w 0’
P JN/diff
N JN/diff
JN/drift
JN/drift N
P
J = JN(-xp) + JP(xn) J = JN(-xp) + JP(xn) -xp xn
I. Shih VII-13 I. Shih VII-14
4
Base
Semiconductor Devices 2005 Semiconductor Devices 2005
at x = 0 ∆p B (0) = B x x”
0” 0 w
x
0’
x’
0 w
at x = w ∆p B (w ) = Aw + B (1) Low level injection Ideal BJT : w << LB ⇒ τ B = ∞
(2) Electric fields small
x d 2 ∆p B ( x ) ∆pB ( x )
∴ pB ' ( x ) = p Bo exp EB − 11 − + pBo exp CB − 1
qV x qV (3) No other generation
= =0
kT w kT w (4) Steady state dx 2 DBτ B
(5) ∆pB(0) is a function of VEB x x
−
(6) ∆PB(w) is a function of VCB ∆pB ( x ) = C1e LB + C2 e LB
5
Semiconductor Devices 2005 Semiconductor Devices 2005
=
qADB
[∆pB (0) − ∆pB (w)] − qADC nCo qVCB − 1
Ideal BJT : w << LB ⇒ τ B = ∞ ∆p B ( x ) = C2 + C1 x
w LC kT
qVEB
D n D p qV
d 2 ∆pB ( x ) ∆pB ( x ) ∆pB (0) − ∆pB (w) ∴ I C = qA DB pBo e
− 1 − qA C Co + B Bo CB − 1
∆pB (0) = C2 , C1=
kT
= =0 w w kT
dx 2 τB w LC
x” x” wx x’
0” 0 wx 0’ x’ 0” 0 0’
IE IB IC IE IB IC
d∆p B d∆nE
D n D p EB
qV
D p CB
qV
I E = I Ep (0 ) + I En (0") = −qADB − qADE
I E = qA E Eo + B Bo e kT − 1 − qA B Bo e kT − 1 dx x =0 dx" x"= 0
E
L w w
d∆nB ( x ) d∆nE ( x")
D p EB
qV
D n D p CB
qV = −qADB + qADE
I C = qA B Bo e kT − 1 − qA C Co + B Bo e kT − 1 dx x"= 0 dx" x =0
w LC w qVEB 1
D n EB
qV
D n
qVCB
= qADE nEo e kT − 1 + qADB nBo [∆pB (0 ) − ∆p B (w)]
I B = I E − I C = qA E Eo e kT − 1 + qA C Co e kT
− 1 LE
LE LC
∴ I E = qA DE nEo + DB pBo (e D p
qVEB qVCB
nEo =
ni2
, p Bo =
ni2 n2
, nCo = i
kT
) − 1 − qA B Bo e kT − 1
NE NB NC LE w w
I. Shih VII-23 I. Shih VII-24
6
Semiconductor Devices 2005 Semiconductor Devices 2005
x” 0” 0 wx 0’ x’ x” 0” 0 wx 0’ x’
IE IB IC IE IB IC
D D CB
qV
I E = qAn E + B e kT = I Ep + I En
2
D
i
LE N E wN B I E ⇒ −qAni2 E
LE N E
D qVEB qVEB >> 1 qVCB << 1
I C = qAni2 B e kT = I Ep 2 DC qVEB << 1 qVCB << 1
kT kT I C = qAni kT kT
wN B LC N C
D EB
qV
I B = I E − I C = qAni2 E e kT = I En D D
I B = I E − I C = − qAni2 E − qAni2 C
LE N E LE N E LC N C
IE IB IC
D D CB
qV
I C = − qAni2 C + B e kT VEB VBC
LC N C wN B Cutoff
D CB
qV
qVEB qVCB
I E = − qAni2 B e kT kT << 0 kT >> 0 DB pBo
wN B I Cp + I Cn
1
D
qVCB
α dc = w = =
I B = I E − I C = qAni2 C e kT
DB p Bo
+
DE n Eo 1 + DE N B w I Ep + I En
LC N C w LE DB N E LE
I. Shih VII-27 I. Shih VII-28
7
Semiconductor Devices 2005 Semiconductor Devices 2005
D n D n qV
= I F − α R I R = qA C Co + B Bo CB − 1
IB=0
LC w kT
D p EB D n D n qV
qV
VEB VEC I C = qA B Bo e kT − 1 − qA C Co + B Bo CB − 1
w C
L w kT
Cutoff
= αF IF − IR
D
qV EB
I C = qApBo B e kT
I B = I E − I C = (1 − α F )I F + (1 − α R )I R
w
D EB
qV DB N E LE I C
I B = qAnEo E e kT β dc = =
DE N B w I B An equivalent circuit can be constructed
LE
I. Shih VII-29 I. Shih VII-30
8
Semiconductor Devices 2005 Semiconductor Devices 2005
IB
IE ICn IC
Cutoff Inverted
IEn IB > 0
IB1 IB2 IB3
IEp ICp Inverted active region
IB Output characteristics
I. Shih VII-35 I. Shih VII-36
9
Semiconductor Devices 2005 Semiconductor Devices 2005
P P-region is
P+ P+ P
5 um formed for
N NE(x) N
isolation
NB(x)
P
P
Discrete P+NP transistor NC <NB
Integrated P+NP transistor
IB IB IE=IEp+IEn
I E = I Ep + I En
I E = I Ep + I En I C = I Cp + I Cn
D D qVA Dn ≈ D p Ln ≈ L p I B = I B1 + I B 2 − I B 3
= qA n n po + p pno e kT − 1
Ln Lp I Cp
p po = 1018 cm −3 ⇒ n po = 102 cm −3 Base Transport Factor : α T = →1
qV A
I Ep
= I o e kT
− 1 nno = 1016 cm −3 ⇒ pno = 10 4 cm −3
∴ I Ep = 100 I En I Ep
Emitter Injection Efficiency : γ = →1
IE
I. Shih VII-39 I. Shih VII-40
10
Semiconductor Devices 2005 Semiconductor Devices 2005
DC Alpha: DC Beta:
IE ICp IC IE ICp IC
IEp IEp
IB1 IB2 IB3 IB1 IB2 IB3
IEn ICn IEn ICn
IB IE=IEp+IEn IB IE=IEp+IEn
0
I C I Cp + I Cn
α dc = = ( I Cn → 0 ) β dc =
IC
=
IC
I E I Ep + I En I B I E − IC
IC I Cp
1 Base Transport Factor : α T = →1
I Cp I I Ep I α dc I Ep
= = Cp = E =
I Ep 1 + I En I Ep I Ep + I En
I
1 − C 1 − α dc Emitter Injection Efficiency : γ =
I Ep
→1
I Ep α dc = α T γ ⇒ 1 I E IE
IB IE=IEp+IEn
IB IE=IEp+IEn
I C = α dc [I C + I B ] + I CBO
I C = I Cp + I Cn = α T I Ep + I Cn ∴ I C [1 − α dc ] = α dc I B + I CBO
I Ep α dc 1
= αT γ + I Cn = α dc I E + I Cn IC = I + I
γ [1 − α dc ] B [1 − α dc ] CBO
I C = α dc I E + I CBO = β dc I B + [1 + β dc ] I CBO
Collector-Base current Collector-Emitter current
I C = β dc I B + I CEO
with emitter open with base open
I. Shih VII-43 I. Shih VII-44
11
Bipolar Junction Transistors
A bipolar junction transistor consists of two back-to-back p-n junctions, that share a thin common region
called the base. If the base region is n-type, the transistor is a pnp. If the base is p-type, the transistor is an
npn. Contacts are made to all three regions. The two outer regions called the emitter and the collector. The
structure of an npn bipolar transistor is shown below. The device is called “bipolar” since its operation
involves both types of mobile carriers, electrons and holes.
Figure 1
VBE VBC
For an npn device, VBE and VBC are both positive in the normal operating mode, called forward active. That
is, the base is put at a higher potential that the emitter or the collector. For example, one might ground the
collector, then bias the base at 5.0 V and the emitter at 4.3 V. The currents are defined as positive flowing
into the base and collector, and out of the emitter, for an npn. For a pnp device all of the biases and currents
are reversed. VBE and VBC are both negative in forward active. And the currents are defined as positive
flowing out of the base and the collector and into the emitter. In either case:
Eq. 1
The operation of the device is illustrated below for an npn. Only the first order effects for the forward
active bias mode of operation are shown. The base-emitter junction has been forward biased and the base-
collector junction has been reverse biased. Under these conditions, electrons diffuse from the emitter into
the base and holes diffuse from the base into the emitter. The bipolar device is constructed in such a way
that two important effects occur under these conditions. The first is that the emitter is normally doped with
a much higher concentration of impurities than the base. As a result, when the emitter base junction is
forward biased, many more electrons enter the base from the emitter than holes from the base entering the
emitter. There is a strict ratio between these two currents. The number of electrons from the emitter is
SAC 01/05
proportional to the number of holes from the base. The second effect is that the base is physically narrow.
This means that most of the electrons sent from the emitter find their way into the collector and constitute
the vast majority of the collector current. Most of the base current typically is injected into the emitter or
recombines with the electrons injected from the emitter.
Figure 2
Hole current for npn
transistor
The transport factor, α, is defined as the ratio of the collector and emitter current:
Eq. 2
Using Kirchoff’s current law, we show that the base current equals the difference between the emitter and
collector current. The current gain, β, is defined as the ratio of the collector and base current. From
Equations 1 and 2 one can show that:
(5.2.15)
This explains how a bipolar junction transistor can provide current amplification. If the collector current is
almost equal to the emitter current, as is the case for most devices, the transport factor, α, approaches one.
The current gain, β, can therefore become much larger than one. Thus a small base current can be used to
modulate (control) a much larger collector current. Finally it should be noted that α and β are not constants,
but vary slightly with the bias conditions.
SAC 01/05
9-BIPOLAR JUNCTION TRANSISTOR (BJT)
I. Basic Structure and Band Diagrams
Basic bipolar transistor structure: Two pn junctions J1 and J2 are
placed back-to-back a distance W apart, forming an n-p-n structure.
The simple, idealized transistor shown below has doping density
of 1016 cm-3 in the emitter and collector and 1014 cm-3 in the base.
(a) Equilibrium (b) Cutoff Energy-band diagrams and electron-density for the
ideal transistor sketched on page 1 for the following
conditions:
(a) thermal equilibrium (zero bias)
(b) both junctions reverse-biased (cutoff mode)
(c) both junctions forward-biased (saturation mode)
(d) J1 forward-biased and J2 reverse-biased (active
mode)
(c) Saturation
(d) Active
1
Current voltage characteristics
B B
E E
pnp npn
Symbol
2
Doping profile in a realistic IC npn transistor
Collector is formed by
epitaxy and base and emitter
by ion implantation
XB
E N+ P N– N+ C
most
e– of the
e–
B
holes for recombination
! 0.7 volts and injection into emitter
B
The E-B junction is
Ec forward biased and
EF
the C-B junction is
Ev reverse biased
V
x
"
x
!
3
The BJT operates basically as follows:
1. An external voltage is applied to forward
bias the B-E junction (≈ 0.7 volts).
2. Electrons are injected from the emitter IC
into the base (holes are also injected
from the base into the emitter, but their
numbers are much smaller because NdE >
NaB).
3. If xB << Ln in the base, most of the
injected electrons get to the collector
without recombining. A few do
recombine; the holes necessary for this
are supplied as base current.
4. The electron reaching the collector are
collected across the B-C depletion region.
5. Since most of the injected electrons
reach the collector and only a few holes
are injected into the emitter, or
recombine with the electrons in the base,
IB << IC . The device has a substantial
current gain.
4
dn
In a modern ion implanted base J n = qµnB n"x + qDnB
dx
transistor, dp/dx ≠ 0, hence εx kTµnB dp dn
≠ 0. The direction of this field = n + qDnB
p dx dx
aids electron flow from E to C,
qD # dp dn &
and retards electron flow from = nB %n + p (
C to E. p $ dx dx '
qDnB d ( pn )
=
p dx
xB xB
The electron flow between ! p
emitter and collector is given by
Jn " qD dx = " d( pn)
0 nB 0
= pn ( x B ) # pn (0)
[
I n = I s eqVBC / kT " eqVBE / kT ] (3)
5
xB
QB = q " p dx (5)
0
Which is the total undepleted charge in the base
A = E-B cross-sectional area
1. Only one of the two exponential terms is important in
forward or reverse active bias region. When the device
is in saturation, both junctions are forward biased and
both terms must be included.
2. The quantity
QB x B xB
(6)
= " p dx # " N aB dx
q 0 0
is called the base Gummel number.
6
III. Current Gain
A number of factors can contribute to base current in a BJT.
We consider them individually.
N+ N
np n
p
pn npo pno
pn o
7
Excess Minority Carrier Profiles for Different xB/Ln Ratios
(
n p " n po eqVBE /kT #1 ) sinhsinh[( x(BxB# /xL) nB/ LnB) ]
Most minority carriers make it
across the base if xB ≤ Ln
N+ N
np n
p
pn npo pno
pn o
qADnB n po xB
I nE = I n ( x = 0 ) =
LnB
(eqV BE / kT
)
"1 coth
LnB (9)
qADnB n po xB
I nC = I n ( x = X B ) =
LnB
(eqV BE /kT
)
"1 csch
LnB
(10)
The ratio of these two currents is defined as the base
transport factor.
I x (11)
"T = nC = sech B
I nE LnB
8
In modern IC BJTs, xB << LnB and there is little recombination
in the neutral base. The minority carrier distribution is nearly
linear. 1 x2
"T # 1$ 2B (12)
2 L nB
In a typical modern BJT, xB ≤ 1 µm and LnB ≥ 30 µm so that α
T ≈ 0.9994. αT is NOT a limiting factor in current gain.
9
The injected hole currents in each case come directly from
the analysis of the long and short base pn junction diodes.
qAni2 D pE
I pE =
N dE L pE
(eqV BE / kT
)
"1 for x E >> L pE
(14)
qAni2 D pE
I pE =
N dE x E
(eqV BE / kT
"1 for x E << L pE ) (15)
(The subscript E is used to refer to emitter properties.)
The emitter injection efficiency is defined as
I nE I nE 1
"= = =
I nE + I pE I TOT x N D (16)
1+ B aB pE
xE N dE DnB
10
Summarizing our discussion of current gain,
I I nC In InE (17)
"F = C = = C = "T #
I E InE + I pE InE InE + I pE
p Collect. p Collect.
Constant base width,
independent of V CB More depletion with
VCB V CB : smaller x B VCB
11
Base Width Modulation: Early Voltage
This is known as Early effect (after Jim Early) and is usually modeled as
" V %
( #
)
IC = IS eqVBE / kT ! 1 $ 1 + CE '
VA &
(19)
2
qN aBWB
Where VA "
#Si
is known as the Early voltage, which is a measure of how independent the base
width xB is from VCB . Small |VA| means large base width modulation.
EE 216 Bipolar Transistor (Winter 2005) S araswat/Pease 23
V EB V EB
p+ Emit. p+ Emit.
n+ Base n+ Base
p Collect. p– collect.
VCB VCB
IC IC
12
Avalanche Multiplication and Breakdown
P-N-P transistor
Breakdown!
Base current is held constant in the common emitter configuration,
so the only place that excess electrons in the base (4) can go is into
the emitter. This produces an internal bias that causes an injection
of holes, Ip = βIn, which is regenerative and leads to a much lower
breakdown voltage
EE 216 Bipolar Transistor (Winter 2005) S araswat/Pease 25
13
IV. Low and High Current Level Effects on β
Theoretically,∝T and γ are independent of VBE, implying that
the ratio of collector current to base current (i.e., current gain
β) is a constant, independent of VBE or IC. In practice, the
ratio of the two currents is NOT independent of IC.
e–
recombination
injection
*
hole
injection
14
High Current Effects
A. High Level Injection in the Base
E B C
Nd
Na + n
e–
injection
e- J = qv(x)
15
If the electrons are traveling at the saturated drift velocity, vsat, then at
any given time, the density of electrons in the depletion region is J/qv(x),
hence the net charge density is
J
" = N ( x) # where N(x) = Nd -Na
qv(x)
XB ! and "#
D. Base Resistance
16
E. Current Crowding
As IB and IC increase, the voltage drop across RB becomes significant. This means that the
effective VBE across the active (center) portion of the device is not as great as the externally
applied VBE. The edge of the emitter thus has the highest electron current density (current
crowding). This plays a double role as the bandgap of the material shrinks with increased
temperature, further increasing the injection around the emitter periphery. The total
collector current decreases below the ideal eqVBE/kT behavior.
To minimize the impact of this
(1) The emitter should be made narrower. For higher current capability multiple emitters
can be used in a single base.
(2) In the extrinsic base region a N+ diffusion should be done.
Motivation:
Reduce IEp by making
hole injection into the
emitter more difficult.
Emitter Base
Ec
Solution:
Use different materials with different Si SiGe
17
HBT Current Gain
If we go back to eqs. (7) and (14) used to calculate the injection efficiency,
but do not cancel out the ni2 terms since they will be different when you have
an emitter and base with different Eg ’s. The injection ratio becomes
1
"=
D W N B # niE2 &
1+ E %% 2 ((
DB LE N E $ niB '
2
# D L N %n (
"~ ~ B E E ' iB *
1$ # DE W N B & niE )
" niB %2
And if Δεg = 0.356 eV, then $ ' = 10 6
# niE &
Which means NB can be 100-1000NE and we still have very high current gain.
EE 216 Bipolar Transistor (Winter 2005) S araswat/Pease 35
18
VI. High Frequency Limitations
A. Base Transit Time E B C
How long does it take from the np
In the absence of ε fields in the base (NaB = constant, low level injection), then
the injected electron concentration varies linearly across the base The total
electron charge in the base is
1 1
qB = qAn p x B = qAn p o (e q VBE / kT ) x B
2 2
qADn n po
Since IC =
xB
(eqV
BE /kT
)
"1
! q x2
The transit time across the base is simply "B = B # B (21)
I C 2DnB
!
EE 216 Bipolar Transistor (Winter 2005) S araswat/Pease 38
19
B. Emitter Capacitance Charging Time
E B C
re
Cje
Rc
E
Cµ
B
The B-C junction is reverse biased so the junction impedance
is very high.
" C = R CC µ (23)
where
RC = collector series resistance
Cµ = B-C depletion capacitance
20
D. Collector Depletion Layer Transit Time
For moderate or high B-C reverse biases, the ε field across
the depletion layer is high, so the electrons can be
assumed to move at VSAT
xDBC
"D # (24)
2VSAT
21
VII. Ebers-Moll Model
"E "C
E !R " R !F " F C
where
αF = forward alpha ≈ IC/IE if VBE is +ve and VBC is -ve
αR = reverse alpha ≈ IE/IC if VBC is +ve and VBE is -ve
IES = emitter reverse saturation current
ICS = collector reverse saturation current
The Ebers-Moll model may be used under all junction bias
conditions (i.e., cut-off, forward active, reverse active and
saturation) to estimate the terminal currents.
22
VIII. Hybrid π Equivalent Circuit
A useful small signal, AC equivalent circuit for the BJTs in
forward active region is shown below.
r C
b µ
B C
+
r! vbe Cd + gmvbe
– C je
E
The parameters are defined as follows
dIC qI
gm = transconductane= " C (30)
dVBE kT
dVBE $
r" = base/emitter resistance = # (31)
dI B gm
C je = depletion capacitance of B - E junction
23
The AC gain decreases to 0.707β0 when "r# C # = 1 or
1
f" =
2 #r# C#
A more widely used measure is when the current gain goes to 1
"r# C # = $0 = g mr# and
g 1
f% = m &
2 #C # 2 #% EC
Even if the current gain is less than unity, the transistor can
still produce power gain due to the impedance transformation
and the unity power gain or maximum frequency of oscillation
is 1 This is the performance parameter
$ f" ' 2
fmax = & ) which is dramatically improved by
% 8# rBC BC ( HBTs because of the ability to heavily
dope the base region and lower rB
EE 216 Bipolar Transistor (Winter 2005) S araswat/Pease 47
24
BIPOLAR JUNCTION TRANSISTOR (BJT)
Weaknesses
1. High Power ⇒ relatively low levels of integration
2. No effective complementary circuit technology
3. Device based upon minority carriers ⇒ charge storage and
diffusion rather than drift
4. Difficult compromises for device optimization
• Base resistance: RC time constants and transit time favor a
very thin, highly doped base
• high injection efficiency requires NE >> NB
• Bandgap shrinkage, lower defect densities and E-B
capacitance all favor moderate emitter doping
5. Far greater processing complexity, larger number of mask levels
with tight alignment tolerances on high performance devices.
25
Bipolar-Junction (BJT) transistors
References:
Barbow (Chapter 7), Hayes & Horowitz (pp 84-141), Rizzoni (Chapters 8 & 9)
A bipolar junction transistor is formed by joining three sections of semiconductors with
alternatively different dopings. The middle section (base) is narrow and one of the other two
regions (emitter) is heavily doped. Two variants of BJT are possible: NPN and PNP.
C NPN Transistor C PNP Transistor
C C C C
n p
B B B B B B
p n
n+ p+
E E E E
We will focus on NPN BJTs. Operation of a PNP transistor is analogous to that of a NPN
transistor except that the role of “majority” charge carries reversed. In NPN transistors,
electron flow is dominant while PNP transistors rely mostly on the flow of “holes.” Therefore,
to zeroth order, NPN and PNP transistors behave similarly except the sign of current and
voltages are reversed. i.e., PNP = − NPN ! In practice, NPN transistors are much more
popular than PNP transistors because electrons move faster in a semiconductor. As a results,
a NPN transistor has a faster response time compared to a PNP transistor.
At the first glance, a BJT looks like 2 diodes placed back to back.
Indeed this is the case if we apply voltage to only two of the three
terminals, letting the third terminal float. This is also the way that
we check if a transistor is working: use an ohm-meter to ensure both
diodes are in working conditions. (One should also check the resistance
between CE terminals and read a vary high resistance as one may have
a burn through the base connecting collector and emitter.)
The behavior of the BJT is different, however, when voltage sources are
attached to both BE and CE terminals. The BE junction acts like a
diode. When this junction is forward biased, electrons flow from emitter
to the base (and a small current of holes from base to emitter). The
base region is narrow and when a voltage is applied between collector
and emitter, most of the electrons that were flowing from emitter to
base, cross the narrow base region and are collected at the collector
region. So while the BC junction is reversed biased, a large current can
flow through that region and BC junction does not act as a diode.
The amount of the current that crosses from emitter to collector region depends strongly
on the voltage applied to the BE junction, vBE . (It also depends weakly on voltage applied
Thus, only four of these 6 parameters are independent parameters. The relationship among
these four parameters represents the “iv” characteristics of the BJT, usually shown as i B vs
vBE and iC vs vCE graphs.
The above graphs show several characteristics of BJT. First, the BE junction acts likes
a diode. Secondly, BJT has three main states: cut-off, active-linear, and saturation. A
description of these regions are given below. Lastly, The transistor can be damaged if (1) a
large positive voltage is applied across the CE junction (breakdown region), or (2) product
of iC vCE exceed power handling of the transistor, or (3) a large reverse voltage is applied
between any two terminals.
Several “models” available for a BJT. These are typically divided into two general categories:
“large-signal” models that apply to the entire range of values of current and voltages, and
“small-signal” models that apply to AC signals with small amplitudes. “Low-frequency” and
“high-frequency” models also exist (high-frequency models account for capacitance of each
junction). Obviously, the simpler the model, the easier the circuit calculations are. More
complex models describe the behavior of a BJT more accurately but analytical calculations
become difficult. PSpice program uses a high-frequency, Eber-Mos large-signal model which
is a quite accurate representation of BJT. For analytical calculations here, we will discuss a
simple low-frequency, large-signal model (below) and a low-frequency, small-signal model in
the context of BJT amplifiers later.
Since the collector and emitter currents are very small for any vCE , the effective resistance
between collector and emitter is very large (100’s of MΩ) making the transistor behave as
an open circuit in the cut-off region.
When the BE junction is forward-biased, transistor is ON. The behavior of the transistor,
however, depends on how much voltage is applied between collector and emitter. If vCE > vγ ,
the BE junction is forward biased while BC junction is reversed-biased and transistor is in
active-linear region. In this region, iC scales linearly with iB and transistor acts as an
amplifier.
iC
Active-Linear: vBE = vγ , iB > 0, = β ≈ constant, vCE ≥ vγ
iB
If vCE < vγ , both BE and BC junctions are forward biased. This region is called the
saturation region. As vCE is small while iC can be substantial, the effective resistance
between collector and emitter in saturation region is small and the BJT acts as a closed-
circuit.
iC
Saturation: vBE = vγ , iB > 0, < β, vCE ≈ vsat
iB
Our model specifies vCE ≈ vsat , the saturation voltage. In reality in the saturation region
0 < vCE < vγ . As we are mainly interested in the value of the collector current in this region,
vCE is set to a value in the middle of its range in our simple model: vCE ≈ vsat ∼ 0.5vγ .
Typically a value of vsat ≈ 0.2 − 0.3 V is used for Si semiconductors.
BJT OFF
iC
BE-KVL: 4 = 40 × 103 iB + vBE +
40 kΩ iB
CE-KVL: 3
12 = 10 iC + vCE , vCE
+
+ 4V vBE _ _
-
Assume BJT is in cut-off. Set iB = 0 in BE-KVL: iE
So BJT is not in cut off and BJT is ON. Set vBE = 0.7 V and use BE-KVL to find iB .
4 − 0.7
BE-KVL: 4 = 40 × 103 iB + vBE → iB = = 82.5 µA
40, 000
Assume BJT is in active linear, Find iC = βiB and use CE-KVL to find vCE :
As vCE = 3.75 > vγ , the BJT is indeed in active-linear and we have: vBE = 0.7 V, iB =
82.5 µA, iE ≈ iC = 8.25 mA, and vCE = 3.75 V.
40 kΩ iB +
CE-KVL: 12 = 1, 000iC + vCE + 1, 000iE vCE
+
+ 4V vBE _ _
Assume BJT is in cut-off. -
iE
Set iB = 0 and iE = iC = 0 in BE-KVL:
1 kΩ
So BJT is not in cut off and vBE = 0.7 V and iB > 0. Here, we cannot find iB right away
from BE-KVL as it also contains iE .
As vCE = 7.2 > vγ , the BJT is indeed in active-linear and we have: vBE = 0.7 V, iB = 24 µA,
iE ≈ iC = 2.4 mA, and vCE = 7.2 V.
Load line
The operating point of a BJT can be found graphically using the concept of a load line. A
load line is the relationship between iC and vCE that is imposed on BJT by the external
circuit. For a given value of iB , the iC vCE characteristics curve of a BJT is the relationship
between iC and VCE as is set by BJT internals. The intersection of the load line with the
BJT characteristics represent a pair of iC and vCE values which satisfy both conditions and,
therefore, is the operating point of the BJT (often called the Q point for Quiescent point)
The equation of a load line for a BJT should include only iC and vCE (no other unknowns).
This equation is usually found by writing a KVL around a loop containing vCE . For the
example above, we have (using iE ≈ iC ):
An example of a load line, iC vCE characteristics of a BJT, and the Q-point is shown below.
VCC
The basic element of logic circuits is the transistor switch. A
schematic of such a switch is shown. When the switch is open, iC RC
The above BJT circuit is also an “inverter” or a “NOT” logic gate. Let’s assume that the
“low” states are voltages between 0 to 0.5 V, “high” states voltages are between 4 to 5 V,
and VCC = 5 V. When the input voltage is “low” (vi ≈ 0), BJT will be in cut-off and
vo = VCC = 5 V (“high” state). When input voltage is “high,” with proper choice of RB ,
BJT will be in saturation, and vo = vCE = Vsat ≈ 0.2 V (“low” state).
vi − v γ
iB =
RB
VCC − Vsat
v i = v γ + R B iB > v γ + R B × = VIH
βRC
Therefore, for input voltages larger than the a certain value (VIH ) , the gate output is low.
For vi values between these two limits, the BE junction is forward biased but the BJT is
NOT in saturation, therefore, it is in active linear. In this case, the output voltage smoothly
changes for its high value to its low value as is shown in the plot of transfer characteristics.
This range of vi is a “forbidden” region and the gate would not work properly in this region.
This behavior can also seen in the plot of the BJT load line. For small values of vi (iB = 0)
BJT is in cut-off. As vi is increased, iB is increased and the operating point moves to the
left and up on the load line and enters the active-linear region. When iB is raised above
certain limit, the operating point enters the saturation region.
A major drawback of the this RTL inverter gate is the limited VCC
input range for the “low” signal (VIL ). Our analysis indicated
iC RC
that VIL = vγ , that is the gate input is low for voltages between 0
and vγ ≈ 0.7 V. For this analysis, we have been using a piecewise vo
linear model for the BE junction diode. In reality, the BJT RB iB
vi
will come out of cut-off (BE junction will conduct) at smaller
i2
voltages (0.4–0.5 V). To resolve this shortcoming, one can add R1 i1
a resistor between the base and ground (or between base and a
negative power supply) as is shown. (You have seen this circuit
in ECE20A, motor drive circuit.)
To see the impact of this resistor, note that VIL is the input voltage when BJT is just leaving
the cut-off region. At this point, vBE = vγ , and iB is positive but very small (effectively
vBE vBE
i1 = i2 = i B + i 1 ≈ i 1 =
R1 R1
RB RB
VIL = vi = RB i2 + vBE = vBE + vBE = vγ 1 +
R1 R1
This value should be compared with VIL = vγ in the absence of resistor R1 . It can be seen
that for RB = R1 , VIL is raised from 0.7 to 1.4 V and for RB = 2R1 , VIL is raised to 2.1 V.
R1 does not affect VIH as iB needed to put the BJT in saturation is typically several times
larger than i1 .
V
CC
RTL NOR Gate
RC
RTLs were the first digital logic circuits using transistors. They were replaced with other
forms (DDT, TTL, and ECL) with the advent of integrated circuits. The major problem
with these circuits are the use of large resistors that would take large space on an IC chip (in
today’s chip, resistor values are limited to about 20 kΩ and capacitance to about 100 pF).
Before we move on to more modern gates, we consider two important characteristics of a
digital gate.
Before BJT can enter saturation, it should traverse the active-linear region. The rise time,
tr (on the order of 1-10 ns) account for this transition. The time that takes for the gate to
switch “ON” is represented by ton .
Suppose that the input voltage to gate is then reduced instantaneously to low state. BJT
will leave saturation region and go to cut-off. Again, this not occur instantaneously. When
a BJT is in saturation, both BE and BC junctions are forward biased and conducting. As
such, an excess minority charge is stored in the base. For the transistor to leave saturation
and enter active-linear (BC junction to become reversed biased), this excess charge must be
removed. The time required for the removal of excess charge determines the storage time, t s
(order of 100 ns). Then, transistor traverses the active-linear region before entering cut-off.
This account for the fall time tf (1-10 ns). The total time it takes for the gate to switch
“OFF’ is represented by tof f . As can be seen, BJT switching is mainly set by the storage
time, ts .
Propagation delays introduced by transistor switching time are important constraints in
designing faster chips. Gate designs try to minimize propagation delays as much as possible.
Fan-out: All digital logic circuits are constructed with cross-coupling of several basic gates
(such as NOR or NAND). As such, a basic gate may be attached to several other gates.
The maximum number of gates that can be attached to a digital gate is called “fan-out.”
Obviously, one would like to have large fan-out.
The basic gate of DTL logic circuits is a NAND gate which is constructed by a combination
of a diode AND gate and a BJT inverter gate.
V
CC
Diode AND Gate: First, let’s consider the diode AND
iA
gate as is shown. To study the behavior of the gate we will RA
consider the state of the circuit for different values of v1 and
D1 i1
v2 (either 0 or 5 V corresponding to low and high states). v1 vo
To aid the analysis, let’s assume VCC = 5 V and RA = 1 kΩ. D2 i2
We note that by KCL, iA = i1 + i2 (assuming that there is v2
Current iA will be divided between two diodes by KCL, each carrying one half of iA (because
of symmtery). Thus, i1 = i2 = 2.1 mA. Since diode currents are positive, our assumption of
both diode being forward biased is justified and, therefore, vo = 0.7 V.
So, when v1 and v2 are low, D1 and D2 are ON and vo is low.
Case 2, v1 = 0, v2 = 5 V: Again, we note that the 5-V supply will tend to forward bias
D1 . Assume D1 is ON: vD1 = vγ = 0.7 V and i1 > 0. Then:
vo = v1 + vD1 = 0.7 V
vo = v2 + vD2 → vD2 = −4.3 V < vγ
VCC − vo 5 − 0.7
iA = = = 4.3 mA
RA 1, 000
i1 = iA − i2 = 4.3 − 0 = 4.3 mA
Since i1 > 0, our assumption of D1 being forward biased is justified and, therefore, vo = 0.7 V.
So, when v1 is low and v2 is high, D1 is ON and D2 is OFF and vo is low.
iA = i 1 + i 2 = 0
vo = VCC − i1 RA = 5 − 0 = 5 V
vD1 = vo − v1 = 5 − 5 = 0 < vγ and vD2 = vo − v2 = 5 − 5 = 0 < vγ
iC RC iC RC
iA iA
RA RA
vo vo
D1 i1 RB iB D1 i1 D3 D4 iB
v1 v1
D2 i2 D2 i2
v2 v2 R1
Voltage v3 = 0.9 V is not sufficient to froward bias D3 and D4 as v3 = vD3 + vD4 + vBE and we
need at least 1.4 V to forward bias the two diodes. So both D3 and D4 are OFF and i4 = 0.
(Note that D3 and D4 can be forward biased without BE junction being forward biased as
long as the current i4 is small enough such that voltage drop across the 5 kΩ resistor parallel
to BE junction is smaller than 0.7 V. In this case, i5 = i4 and iB = 0.) Then:
5 − v3 5 − 0.9
i1 + i 2 = i A = = = 0.82 mA
5, 000 5, 000
And by symmetry, i1 = i2 = 0.5iA = 0.41 mA. Since both i1 and i2 are positive, our
assumption of D1 and D2 being ON are justified. Since i4 = 0, iB = 0 and BJT will be in
cut-off with iC = 0 and vo = 5 V.
So, in this case, D1 and D2 are ON, D3 and D4 are OFF, BJT is in cut-off, and vo = 5 V.
Case 2: v1 = 0.2 V, v2 = 5 V Following arguments of case 1, assume D1 is ON. Again,
v3 = 0.7 + 0.2 = 0.9 V, and D3 and D4 will be OFF with i4 = 0. We find that voltage across
D2 is vD2 = v3 − v2 = 0.9 − 5 = −4.1 V and, thus, D2 will be OFF and i2 = 0. Then:
5 − v3 5 − 0.9
i1 = i A = = = 0.82 mA
5, 000 5, 000
and since i1 > 0, our assumption of D1 ON is justified. Since i4 = 0, iB = 0 and BJT will
be in cut-off with iC = 0 and vo = 5 V.
So, in this case, D1 is ON, D2 is OFF, D3 and D4 are OFF, BJT is in cut-off, and vo = 5 V.
5 − v3 5 − 2.1
i4 = i A = = = 0.58 mA
5, 000 5, 000
vBE 0.7
i5 = = = 0.14 mA
5, 000 5, 000
iB = i4 − i5 = 0.58 − 0.14 = 0.44 mA
and since i4 > 0 our assumption of D3 and D4 being ON are justified and since iB > 0 our
assumption of BJT not in cut-off is justified.
We still do not know if BJT is in active-linear or saturation. Assume BJT is in saturation:
vo = vCE = Vsat = 0.2 V and iC /iB < β. Then, assuming no gate is attached to the circuit,
we have
5 − Vsat 5 − 0.2
iC = = = 4.8 mA
1, 000 1, 000
and since iC /iB = 4.8/0.44 = 11 < β = 40, our assumption of BJT in saturation is justified.
So, in this case, D1 and D2 are OFF, D3 and D4 are ON, BJT is in saturation and vo = 0.2 V.
Overall, the output in “low” only if both inputs are “high”, thus, this is a NAND gate.
Note: It is interesting to note that at the input of this gate, the current actually flows out
of the gate. In the example above, when both inputs were high i1 = i2 = 0, when both were
low i1 = i2 = 0.4 mA, and when one input was low, e.g., v1 was low, i1 = 0.8mA. The input
current flowing in (or out of the gate in this case) has implications for the fan-out capability
of logic gates as is shown in the example below.
iR i
1kΩ
iA
5kΩ iL
vo
D1 i1 D3 D4 iB iC
v1
i4
D2 i2
v2 i5 5kΩ
The circuit is the same DTL NAND gate of previous example and we can use results from
previous example here. “N ” other NAND gates are attached to the output of this gate.
Fan-out is the maximum value of N . Since we want to make sure that our gate operates
properly under all conditions, we should consider the worst case, when all of the second stage
gates have maximum currents.
For a NAND DTL gate, the maximum current i occurs when all of the inputs are high with
exception of one input. We found this value to be 0.82 mA (Cases 2 & 3 in the previous
example). Therefore, the worst case is when the input of all second stage gates are low (for
the first stage, vo = 0.2 V) and each draw a current 0.82 mA (a total of iL = N × 0.82 mA
is drawn from the first stage gate).
Considering the first stage gate, we had found that vo = 0.2 V only for Case 4. For that
case, we found iB = 0.44 mA. Then:
5 − Vsat 5 − 0.2
iR = = = 4.8 mA
1, 000 1, 000
iC = iR + 0.82N = 4.8 + 0.82N
The first stage gate operates properly as long as the BJT is in saturation, i.e.,
As the fan-out should be integer, the fan-out for this gate is 13.
Fan-out of DTL gates can be greatly increased by a small modification. Fan-out can be
increased by increasing the base current of the BJT. iB is, however, limited by the current iA
(and i4 ). Reducing the value of RA in the AND diode part of the circuit will have increase
iB . Unfortunately, as this resistor is reduced, power dissipation in the gate increases and the
fan-out capability decreases dramatically.
R1
Bipolar power devices are the traditional power devices because of their capability to provide
high currents and high blocking voltages. The bipolar-based power devices include high-power
bipolar transistors, Darlington transistors consisting of two transistors with a common collector,
thyristors – also called silicon controlled rectifiers (SRCs) and triacs, a complementary thyristor
structure suitable to control AC power.
Power MOSFETs and power devices that combine MOSFETs and bipolar transistors are covered
in chapter 7.
The power dissipation is managed by minimizing the power dissipation and spreading the
resulting heat dissipation onto a large area. The Kirk effect is normally avoided by increasing the
collector doping density. However, for devices with a very high blocking voltage, this may not
be an option. Power BJTs therefore are operated at rather low current density of 100 A/cm2
since the lower current density reduces the power dissipation per unit area and eliminates the
Kirk effect. Large currents – up to 1000 A – are obtained by making a large area device. Silicon
BJTs dominate the power device market, in part because of the low cost of large area silicon
devices and the high thermal conductivity of silicon compared to GaAs. Silicon carbide (SiC)
has been hailed as the perfect material for high-power BJTs. The higher thermal conductivity
(3x) and breakdown field (10x) compared to silicon give it a clear performance advantage. The
high saturation velocity (3x compared to silicon) also shifts the onset of the Kirk effect to higher
current densities. The proliferation of its use will heavily depend on the material cost and quality
of the SiC wafers.
Base
n+ n+
Q1 p p
Q2 n-
n+ substrate
Emitter
Collector
a) b)
The operation of the device is best explained by considering the equivalent circuit, shown in
Figure 5.9.2. It consists of two bipolar transistors, a n-p-n transistors, Q1, and a p-n-p transistor,
Q2. Both transistors share a p-type and n-type layer. For instance, the p-type base layer of
transistor Q1 is also the collector layer of transistor Q2, while the n-type base of transistor Q2 is
also the collector of transistor Q1. The Thyristor is controlled by the gate electrode, which is the
gate of Q1. By applying a current to the gate one forward biases the base-emitter junction of Q1,
which leads to a collector current in Q1, which in turn provides a base current to Q2. Since Q2 is
a complementary p-n-p transistor, this negative current also forward biases the base-emitter
junction of transistor Q2, resulting in collector current which forms an additional base current
into the base of transistor Q1. The applied current to the gate of the Thyristor therefore causes an
additional current into Q1, which can be large enough that both transistors remain in turned on
even if the original gate current is removed. This latching behavior is not unlike that of a flip-
flop, where the inputs of two devices are connected to the output as shown in Figxxx. This self-
sustaining effect will occur if the product of the current gain of both transistors equals unity,
while one of the transistors can have a current gain less than unity. As a result one has
considerable flexibility to choose the doping density and thickness of each of the layers to obtain
a high blocking voltage and high Early voltage for each transistor, while maintaining sufficient
current gain.
The Thyristor has a lower on-state voltage than the Darlington pair and typically requires an
even smaller turn-on current, which only needs to be applied temporarily because of the internal
positive feedback between the two transistors of the equivalent circuit.
This latter property is also the main disadvantage of the Thyristor: since the device latches into
the on-state once sufficient gate current is supplied, the device can not be turned off by removing
the gate current. Instead one has to disconnect the power supply to turn off the device.
Furthermore, since both transistors are in saturtion in the on-state, a significant amount of
minority carriers are accumulated in the base region of each transistor. These minority carriers
must be remove prior to reconnecting the power supply since these carriers would temporarily
lead to a base current in each device and trigger the turn-o of the Thyristor. Finally, one has to
slowly ramp up the power supply voltage to avoid the so-called dV/dt effect. Since a rapid
increase of the applied voltage with time causes a displacement current proportional to the
capacitance of the junctions, this displacement current could again provide a temporary base
current in Q1 and Q2, which is large enough to trigger the Thyristor.
Q1 Gate
Anode Cathode n+ p+
p Q1
Q2 Q2
n
Gate
p+ substrate
Anode
Anode
Figure 5.9.2. Thyristor structure: a) circuit symbol, b) device cross-section and c) equivalent
circuit.
A very attractive feature of a Thyristor is that it can be scaled easily to very large area devices
even if that causes a significant lateral resistance though the thin and lowly-doped base and
collector regions. As one applies a current to the gate electrode, the Thyristor would be triggered
locally. The turned-on region would then spread laterally thoughout the structure without a need
for an additional gate current. The local triggering also exists in the light-controlled Thyristor.
This structure does not contain a gate electrode. Instead the p-n-p-n structure is locally
illuminated with photons whose energy exceeds the bandgap energy of the semiconductor. The
photogenerated current then acts as the gate current, which triggers the Thyristor.
Gate turn-off Thyristor (GTO)
The triode AC switch (TRIAC) also contains the same vertical structure as a DIAC. In addition a
contact is made to the p-type gate of the npnp structure as well as the n-type gate of the pnpn
structure. This additional gate contact allows lowering the threshold for latching for both positive
and negative applied voltages applied between terminal 1 and terminal 2.
n+ n+ n+
p p
n n
p n+ p n+
Terminal 2 Terminal 2
Figure 5.9.3. Circuit symbol and device cross-section of a) a Diode AC switch (DIAC) and b) a
Triode AC switch (TRIAC).
PHY2003 (Practical Electronics II) Homework Worksheet 9
Introduction
PHY2003 does not require a knowledge of the semiconductor physics underlying how transistors
work, they are treated as nonlinear three-terminal devices. Figure 1 defines the current conventions
used in PHY2003. The rules-of-thumb for analysing bipolar junction transistor (BJT) circuits at low-
frequencies are:
Required Reading
+12V
R1 1M
R2 3K3 R1 R2
C1 10N
VC VE X1 BC107 3
V3
NPN IC PNP IE C1
IB IB V1
2
VB VB X1
IE IC
VE VC
1
PHY2003 (Practical Electronics II) Homework Worksheet 9
12V
R1 R3
C1
4
V1 V4
2
C1 0µ1 X1
R1 33K 3
R2 10K
R3 2K7
R4 1K0 R2 R4
X1 BC107
Exercise 9.1 Analyse circuit 9.1 using typical values from the BC107 datasheet and find:
Answers: (a) 6.4 V (assuming HFE = 150) (b) 2.2 kΩ, 7.2 kHz (c) –60 and –400
Exercise 9.2 Analyse circuit 9.2 using typical values from the BC107 datasheet and find:
Answers: (a) 2.1 V (b) 6.3 V (b) –60 and –400 (c) v4 v1 = −2.7
2
University of Geneva TPA-Electronique
Contents
1 Transistors 1
2 Amplifiers 2
2.1 h parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Power amplifiers 11
5.1 Class A power amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1.1 Voltage and power gain . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1.2 Power gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1.3 Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.2 Class B and class AB power amplifiers . . . . . . . . . . . . . . . . . . . . . . 13
5.2.1 Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3 Class C power amplifiers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Differential amplifier 15
6.1 Two inputs and two ouputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.2 One input and two ouputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.3 Two inputs and one ouputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.4 One input and one ouput . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1 Transistors
Transistors are three terminal semicounductor amplifying device that regulates current or
voltage. A small change in the current or voltage at an inner semiconductor layer (which
acts as the control electrode) produces a large, rapid change in the current passing through
the entire component. The component can thus act as a switch, opening and closing an
electronic gate. A transistor is a active device that can amplify, producing an output signal
with more power in it than the input signal
E. Cortina Page 1
University of Geneva TPA-Electronique
RS
vs ii RO
vi Ri Avi vo RL
Figure 1: Thevenin’s equivalent of an amplifier with signal source connected to input and a
load impedance connected to the ouput
There are two kind of transistors, the bipolar transistor (also called the junction transistor),
and the field effect transistor (FET).
Invented in 1947 at Bell Labs, transistors have become the key ingredient of all digital
circuits, including computers. Prior to the invention of transistors, digital circuits were com-
posed of vacuum tubes, which had many disadvantages: they were much larger, required
more energy, dissipated more heat, and were more prone to failures. For a good introduction
about vacuum tubes and how to use them visit the web page http://www.hans-egebo.dk
2 Amplifiers
An amplifier is a device that takes an input signal and magnifies it by a factor A where
vout = Avin . These gain is the so called open-loop gain. In order to study how an ideal
amplifier looks like, an amplifier has been sketched in figure 1. In this figure the amplifier
has been replaced by a Thevenin’s equivalent and an input source and output load have
been added. In these conditions the “real” amplification factor (Ar ) can be expressed as:
i Av
vo io R L R R
Ar = = = o L RL
vs vs vs
taking into account that the input source equivalent circuit we can state
Ri
vi = vs
Rs + Ri
and substituting in the upper expression
Ri RL
Ar = A
Rs + Ri Ro + RL
Looking that expression we can easily sees that the real gain is smaller than the open-loop
gain. For an ideal amplifier we can express that:
a) Ri → ∞, so the entire source voltage vs is developed across Ri . In other words all vs
is placed across the amplifier input and the input source vs does not have to develop
any power (ii = 0 when Ri = ∞)
b) Ro → 0 so all the availabe voltage is developed across RL and none of it is lost inter-
nally.
c) A → ∞ for obvious reasons.
d) A should be constant with frequency, that is, amplify all frequencies equally.
E. Cortina Page 2
University of Geneva TPA-Electronique
i1 i2 h 11
v1 v2 h v
12 2
h i
21 1
h 22
2.1 h parameters
An amplifier can be seen as a quadrupole. h parameters cames from a direct application of
Thevenin theorem to the input dipole and Norton theoreme to the output dipole. See figure
2.
The Kirchoff equations for this model are:
v1 = h11 i1 + h12 v2
i2 = h21 i1 + h22 v2
If the output is short-circuited v2 = 0 then
v1
h11 = i1
= hi input impedance
i2
h21 = i1
= hf current gain
If the input is open i1 = 0
v1
h12 = v2
= hr inverse voltage gain
i2
h22 = v2
= ho output admitance
These four last relations gives the meaning of the h parameters. Beware, that the mean-
ing is with the conditions imposed up, that is, output short-circuit (no load) and open input
(no input). Typical values of these parameters are:
h11 = 3.5kΩ
h12 = 1.3 × 10−4
h21 = 120
h22 = 8.5µS
E. Cortina Page 3
University of Geneva TPA-Electronique
forward biased reverse bias
n+ p n p+ n p
I c = αIe I c = αIe
Ie Ie
Ι b = (1−α ) Ιe Ι b = (1−α ) Ιe
e c e c
b b
Figure 3:
a) Electrons are majoritary carriers in the emitters, so they can pass with no problems
to the base. As the emitter is intended to provide the charge carriers will be heavely
doped.
b) The base is slightly doped and made very thin. This allows that the recombination
current, that will exit by the base is small and that the diffussion length is longer than
the base length and consequently almost all electrons from emitter will pass to the
collector
For PNP transistors the explanation is exactly the same just changing electrons for holes
and inversing the currents.
In order to study the transistor we are going to mount the so called common emitter
configuration. In figure 4 is shown how this configuration.
The parameters αcc and βcc , defined for direct current are:
IC
αcc = ∼ 0.99
IE
IC
βcc = ∼ 100
IB
αcc
IE = IB + IC → βcc =
1 − αcc
In the right side of the figure 4 have been plotted a family of characterisic courbes of a
transistor. For a fixed value of VBB , that fix IB , we can increase VCC from 0V. For lower
values of VCC both diodes are forward bias so VCE will increase accordingly, this region is
called saturation. With VCC high enough will enter in the active or linear region, where the
base-collector jounction is reverse bias. At this moment IC becames stable (or almost) and
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Rc
Rb VCB +
VCE VCC
−
vs VBE
+
VBB
−
Breakdown region
IC
I B8
I B7
I B6
Saturation regeion
I B5
I B4
I B3
I B2
I B1
IB = 0
Blockage region
VCE
Figure 4: Transistor charactersitic curves IB1 < IB2 < IB3 ,etc
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IC
Ic
Ib
A
Q
I CQ I BQ
VCEQ VCE
Vce
Figure 5: Q point. Variations induced in collector current IC and VCE by a variation of the
base current IB
does not change with VCE . In fact, IC increas just a bit due to the larger depletion region in
the base-collector junction. So in this region the value of IC is controlled by IB in such a way
that IC = βCC IB . With VCE large enough the base-collector junction breakdown increasing
IC quickly. Note that if IB = 0 then IC = 0 so the transistor does not conduct. In this situation
thetransistor is in the so called blockage state.
Applying directly Kirchoff’s laws to the circuit we can find directly in the output circuit that
the summation of voltages around the loop gives
VCC − IC RC − VCE = 0
VCC 1
IC = − VCE
RC RC
this is the equation of a straight line, known as load line. Superimposing the load line on the
output characteristics in effect gives us a graphical solution to two simultaneous equations:
one equation, belonging to the transistor, non-linear equation given by the family of IC −V CE
graphs, and the other the load line. The intersection points show the possible values that
may exist in the circuit. In absence of the any input signal, vs = 0, the operational point is
called Q-point. In case of an input signal provoques the variation of the VCE value, modifiyng
consequently the operational point. In figure 5 is shown how the operational point moves in
the transistor characteristic-plot.
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RC IC = 0 RC RC I sat
C
RC
RB C RB C
0V +VBB
IB = 0 E E
IB
• Common Emitter. From AC point of view the emitter is connected to the ground. Input
signal is in the base and output in the collector
• Common Collector. From AC point of view the collector is connected to the ground.
Input signal is in base and output in the emitter.
• Common base. From AC point of view the base is connected to the ground. Input
signal is in the emitter and output in the collector.
+VCC +VCC
R1 RC C3 R1
V out
RS C1 Rs V in C1
V in
C2
R load V out
v v R2 RE
s R2 RE C2
s
R load
+VCC
R1 RC C3
C2 V out
C1 R load
Rs
V in
v s
R2 RE
Figure 7: The three amplifier configurations. On the left the common emitter amplifier, in the
center the common collector amplifier and on the left the common base amplifier
In figure 8 are shown the definition of h parameters for these three configurations. In
table 1 are shown the ratios for the three configurations.
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h ie
h ic
Base Collector Base Emitter
ib h vc h ib h ib h ve h ib h
re fe oe rc fc oc
Emitter Collector
h ib
Emitter Collector
ie h vc h ie h
rb fb ob
Base
Common Base
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3.2.1 r parameters
It is much more easy to work with resistances than with h-parameters. This is why has been
defined a second set of parameters, called r-parameters. Their definitions are:
αca = hf b
βca = hf e
hre 25mV
re0 = '
hoe IE
hre + 1
rc0 =
hoe
hre
rb0 = hie − (1 + hf e )
hoe
• C2 is the so called derivation capacitor allows the maximum gain at the setup.
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5 Power amplifiers
Up to now we have studied single stage amplifiers, but a practical amplifier consists of sev-
eral stages which are cascaded to produce a gain high enough in order to drive a signal.
Typically input signals (from a microphone, a radio station or a particle detector), are on the
order of µV , whereas usable signals should be in the volt range. Once the signal is in this
range, it can be considered inmune from interference by noise or other disturbing signals.
Firsts stages of the amplifier are voltage gain amplifiers as the ones we have seen previ-
ously coupled either directly or via a capacitor or a transformer. Usually the last stage of an
amplifier is a power amplifier. This section does not contribute to voltage gain, it is basically
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a current amplifier. Another way of looking at it is that the voltage section is a signal ampli-
fier with no significant power an its output. It is the task of the power amplifier to produce
substantial power at the output, which it does by amplifying the currents. Power amplifiers
should be feed by large noise-free voltage signals.
There are four different power amplifiers, called of class A, class B, class AB and class
C. This classification is determined by the percentage of input cycle that the amplifier works
in the linear region.
VCEQ = ICQ Rc
5.1.3 Efficiency
Efficiency (η) is given by the ratio of AC signal power to DC power supplied.
PAC 0.5
η= = = 0.25
PDC 2
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IC
∆I C2
∆I C1
∆VBE ∆VBE
V cc
v in
v out
v in RE
v out
where
1 1
PAC = √ VCEQ √ ICQ = 0.5VCEQ ICQ
2 2
PCC = 2VCEQ ICQ
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V cc V cc
Q1 Q1
v out
v out
v in Q2 RL v in Q2 RL
−Vcc −Vcc
v in
v out
Figure 11: In the upper plot is shown how a class push-pull works. In the lower plot is shown
the distorsion in the push-pull amplifier. The transistors onlye are propoerly po-
larized in the shadowed regions.
around a base polarisation region around 0V none of the transistors will conduct, because
both base-emitter junctions will not be properly polarized, what produces a gap in the output,
known as crossover distorsion. In order to avoid this gap, both transistors should be slightly
polarized before the blocakge point. This variation is called as class AB amplifier. In the
case of the push-pull setupt this polarization can be done either by a resistor divider or
with a couple of diodes. This last configuration is prefered because its behaviour with the
temperature is much stable. In figure 12 are shown both setups.
5.2.1 Efficiency
PAC
η= = 0.25π = 0.79
PDC
where
1 1
PAC = √ VCEQ √ ICQ = 0.5VCC ICsat
2 2
For each transistor, output is a half-wave signal, so the current mean value is
VCC ICsat
PCC =
π
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V cc V cc
R1 R1
C1 C1
Q1 C3 Q1 C3
v out D1 v out
v R2 v
in in D2
Q2 Q2
RL RL
C2 C2
R3 R2
Figure 12: Push-pull polarization in class AB in order to avoid the crossover distorsion
6 Differential amplifier
Is a configuration used to amplify the difference voltage between two input signals. In the
ideal case the output is enterely independent of the individual signals levels (only difference
matters). When both inputs change levels togethers that’s a common-mode input change. A
differential change is called normal-mode.
With discrete components one can imagine four configurations, show in figure 13, re-
garding the number of input and outputs possibles.
The output tension in all cases can be expressed in the form:
vo = Adif f (v1 − v2 )
The input that is in phase with the output (v1 ) is called non-inverting input, while the other
(v2 ), that has opposite phase with the output is called inverting output. The gain Adif f will
change for each configuration. This gain is called differential gain.
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+VCC +VCC
RC RC RC RC
vo vo
v1 v2 v1
RE RE RE RE
R1 R1
−VEE −VEE
a) b)
+VCC +VCC
RC RC
vo vo
v1 v2 v1
RE RE RE RE
R1 R1
−VEE −VEE
c) d)
Figure 13: Differential amplifiers: a) Two inputs, two outputs. b) One input, two outputs. c)
Two inputs, one output. d) One input, one output
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. The factor 2 cames from the fact that there is only one RC . The input impedance (for any
of both inputs) is:
ri = 2βre0
.
The common mode input gain is expressed as:
RC
ACM = −
2R1 + RE + re0
An important parameter is the so called Common Mode Rejection Ratio (CMRR), that
express, usually in db, the ratio of responso of normal mode signal to the response for a
common-mode signal of the same amplitude. CMRR is defined then as:
Adif f 2R1 + RE + re0
CM RR = =
ACM 2(RE + re0 )
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