Service Manual KX Tgd210ag1

ORDER NO.
KM41410868CE
Telephone Equipment
Model No. KX-TGD210AG1
Caller ID Compatible
KX-TGD212AG1
KX-TGDA20AG1
Digital Cordless Phone
B: Black Version
(for Argentina)
KX-TGDA20
(Handset)
KX-TGD210
(Base Unit)
(Charger Unit)
Configuration for each model

Model No
KX-TGD210
KX-TGD212
KX-TGDA20
Base Unit Handset Charger Unit

1 (TGD210) 1 (TGDA20)
1 (TGD210) 2 (TGDA20)
1
1 (TGDA20)
1
Panasonic System Networks Co., Ltd. 2014

Unauthorized copying and distribution is a violation
of law.
KX-TGD210AG1/KX-TGD212AG1/KX-TGDA20AG1
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE

There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these critical parts should be replaced with manufacturers specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
L The illustrations in this Service Manual may vary slightly from the actual product.
TABLE OF CONTENTS
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.2.1. Suggested PbF Solder ------------------------------ 5
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. US-DECT Description ------------------------------------ 7
4.1.1. TDD Frame Format ---------------------------------- 7
4.1.2. TDMA system------------------------------------------ 7
4.1.3. Signal Flowchart in the Radio Parts-------------- 8
4.2. Block Diagram (Base Unit_Main)---------------------- 9
4.3. Block Diagram (Base Unit_RF Part) -----------------10
4.4. Circuit Operation (Base Unit) -------------------------- 11
4.4.1. BBIC (Base Band IC: IC501) --------------------- 11
4.4.2. EEPROM (IC611) ------------------------------------ 11
4.4.3. Power Supply Circuit/Reset Circuit--------------12
4.4.4. Telephone Line Interface---------------------------14
4.4.5. Parallel Connection Detect Circuit/Auto
Disconnect Circuit -----------------------------------15
4.4.6. Calling Line Identification (Caller ID)/Call
Waiting Caller ID -------------------------------------16
4.5. Block Diagram (Handset)-------------------------------18
4.6. Circuit Operation (Handset)----------------------------19
4.6.1. Outline --------------------------------------------------19
4.6.2. Power Supply Circuit/Reset Circuit--------------19
4.6.3. Charge Circuit ----------------------------------------19
4.6.4. Battery Low/Power Down Detector--------------19
4.6.5. Speakerphone ----------------------------------------19
4.7. Signal Route -----------------------------------------------20
5 Location of Controls and Components ------------------22
6 Installation Instructions ---------------------------------------22
7 Operating Instructions-----------------------------------------22
8 Test Mode ----------------------------------------------------------23
8.1. Engineering Mode ----------------------------------------23
8.1.1. Base Unit ----------------------------------------------23
8.1.2. Handset ------------------------------------------------25
9 Service Mode -----------------------------------------------------27
9.1. How to Clear User Setting (Handset Only)---------27
10 Troubleshooting Guide ----------------------------------------28
10.1. Troubleshooting Flowchart -----------------------------28
10.1.1. Check Power------------------------------------------29
10.1.2. Check Record ----------------------------------------30
10.1.3. Check Playback -------------------------------------31
10.1.4. Check Battery Charge ------------------------------31
10.1.5. Check Link---------------------------------------------32
10.1.6. Check the RF part -----------------------------------34
10.1.7. Registering a Handset to the Base Unit--------38
10.1.8. Deregistering a Handset ---------------------------38
10.1.9. Check Handset Transmission --------------------39
10.1.10. Check Handset Reception-------------------------39
10.1.11. Check Caller ID --------------------------------------39
11 Disassembly and Assembly Instructions ---------------40
11.1. Disassembly Instructions -------------------------------40
11.1.1. Base Unit ----------------------------------------------40
11.1.2. Handset ------------------------------------------------41
12
13
14
15
16
PAGE
11.1.3. Charger Unit ------------------------------------------ 42
11.2. How to Replace the Handset LCD------------------- 43
Measurements and Adjustments -------------------------- 44
12.1. Equipment Required ------------------------------------ 44
12.2. The Setting Method of JIG----------------------------- 44
12.2.1. Connections (Base Unit) -------------------------- 44
12.2.2. Connections (Handset) ---------------------------- 45
12.2.3. How to install Batch file into P.C. ---------------- 46
12.2.4. Commands-------------------------------------------- 46
12.3. Adjustment Standard (Base Unit) -------------------- 47
12.3.1. Bottom View ------------------------------------------ 47
12.4. Adjustment Standard (Handset) ---------------------- 48
12.4.1. Component View ------------------------------------ 48
12.5. Things to Do after Replacing IC or X'tal ------------ 49
12.5.1. How to download the data ------------------------ 49
12.6. Frequency Table------------------------------------------ 51
Miscellaneous---------------------------------------------------- 52
13.1. How to Replace the Flat Package IC --------------- 52
13.1.1. Preparation-------------------------------------------- 52
13.1.2. How to Remove the IC ----------------------------- 52
13.1.3. How to Install the IC -------------------------------- 53
13.1.4. How to Remove a Solder Bridge ---------------- 53
13.2. Terminal Guide of the ICs, Transistors and
Diodes ------------------------------------------------------ 54
13.2.1. Base Unit ---------------------------------------------- 54
13.2.2. Handset ------------------------------------------------ 54
Schematic Diagram -------------------------------------------- 55
14.1. For Schematic Diagram -------------------------------- 55
14.1.1. Base Unit (Base Unit (Main)) --------------------- 55
14.1.2. Handset (Handset (Main)) ------------------------ 55
14.2. Base Unit (Main) ----------------------------------------- 56
14.2.1. KX-TGD210------------------------------------------- 56
14.3. Handset (Main) ------------------------------------------- 58
Printed Circuit Board ------------------------------------------ 61
15.1. Base Unit (Main) ----------------------------------------- 61
15.1.1. Component View ------------------------------------ 61
15.1.2. Bottom View ------------------------------------------ 62
15.2. Handset----------------------------------------------------- 63
15.2.1. Component View ------------------------------------ 63
15.2.2. Bottom View ------------------------------------------ 64
Exploded View and Replacement Parts List ----------- 65
16.1. Cabinet and Electrical Parts (Base Unit) ----------- 65
16.1.1. KX-TGD210------------------------------------------- 65
16.2. Cabinet and Electrical Parts (Handset)------------- 66
16.3. Cabinet and Electrical Parts (Charger Unit) ------- 67
16.4. Accessories and Packing Materials ----------------- 68
16.4.1. KX-TGD210AG1------------------------------------- 68
16.4.2. KX-TGD212AG1------------------------------------- 69
16.5. Replacement Parts List--------------------------------- 70
16.5.1. Base Unit ---------------------------------------------- 70
16.5.2. Handset ------------------------------------------------ 71
16.5.3. Charger Unit ------------------------------------------ 72
16.5.4. Accessories and Packing Materials ------------ 72
16.5.5. Screws ------------------------------------------------- 72
16.5.6. Fixtures and Tools----------------------------------- 72
1 Safety Precautions
1.1.
For Service Technicians
Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.

2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufactures Instructions.
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
PbF solder has a melting point that is 50 F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 F 20 F (370 C 10 C).
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 F (600 C).
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Remove all of the

excess solder
Component
pin
Solder
(Slice View)
Component
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
0.3 mm X 100 g
2.3.
0.6 mm X 100 g
1.0 mm X 100 g
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
3 Specifications
N Standard:
DECT 6.0 (Digital Enhanced Cordless
Telecommunications 6.0)
N Number of channels:
60 Duplex Channels
N Frequency range:
1.91 GHz to 1.93 GHz
N Duplex procedure:
TDMA (Time Division Multiple Access)
N Channel spacing:
1,728 kHz
N Bit rate:
1,152 kbit/s
N Modulation:
GFSK (Gaussian Frequency Shift Keying)
N RF transmission power:
115 mW (max.)
N Voice coding:
ADPCM 32 kbit/s
Handset
Base Unit
Power source
Receiving Method
Oscillation Method
Detecting Method
Tolerance of OSC Frequency
Modulation Method
ID Code
Ringer Equivalence No. (REN)
Dialing Mode
Redial
Speed Dialer
Power Consumption
AC Adaptor
(PNLV226AG0Z, 220240 V AC,
50/60 Hz)
Super Heterodyne
PLL synthesizer
Quadrature Discriminator
13.824 MHz 100 Hz
Frequency Modulation
40 bit
0.1B
Standby: Approx. 0.6 W (*1)

Maximum: Approx. 3.2 W (*1)
Operating Conditions
0 C - 40 C (32 F 104 F)
20 % 80 % relative air humidity
(dry)
Dimensions (W x D x H)
Approx. 143 mm x 103 mm x 48 mm(*1)

Approx. 143 mm x 103 mm x 48 mm(*2)
Mass (Weight)
Approx. 140 g (*1)

Approx. 170 g (*2)
Rechargeable Ni-MH battery

AAA (R03) size (1.2 V 400 mAh)
Charger
AC Adaptor
(PNLV233AGAZ, 220240 V AC,
50/60 Hz)
Super Heterodyne
PLL synthesizer
Quadrature Discriminator
10.368 MHz 100 Hz
Frequency Modulation
40 bit
Tone (DTMF)/Pulse
Up to 48 digits
Up to 32 digits (Phonebook)
6 days at Standby,
10 hours at Talk
Standby: Approx. 0.1 W,

Maximum: Approx. 1.8 W
0 C - 40 C (32 F 104 F)
(dry)
Approx. 48 mm x 30 mm x 168 mm
0 C - 40 C (32 F 104 F)
(dry)
Approx. 72 mm x 72 mm x 45 mm
Approx. 130 g
Approx. 100 g
Note for Service:

Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
Analog telephone connection: Telephone Line
4 Technical Descriptions
4.1.
US-DECT Description
The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.51).
4.1.1.
TDD Frame Format
RX1
5 ms
5 ms
Up Link ( Handset -> Base Unit )
Down Link ( Base Unit -> Handset )
RX2
RX3
RX4
RX5
RX6
TX1
TX2
TX3
TX4
TX5
TX6
DATA rate : 1.152 Mbps

417 s (available) 417 s (blind)
4.1.2.
TDMA system
This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 s, the 10 ms of voice data is transmitted.
2 - Handsets Link
Traffic Bearer
Base unit
Handset 1
(Stand by)
Handset 2
(Link)
Handset 3
(Link)
Dummy bearer
RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
TX
RX
TX
RX
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
4.1.3.
Signal Flowchart in the Radio Parts
Reception
A voice signal from TEL line is encoded to digital data "TXDATA" by BBIC (IC501) in a base unit.
Then TXDATA goes to RF PART and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a selected antenna.
As for a handset RF, RF signal is received in one antenna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
A voice signal from microphone is encoded to digital data "TXDATA" by BBIC (IC1) in a handset.
Then TXDATA goes to RF PART, and it's modulated to 1.9 GHz. The RF signal is amplified and fed to a antenna.
As for a base unit RF, RF signal is received in two antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
VBAT
RF_PART
RSTN
RESET
TXn
TXp
RXn
RXp
STM/CKM
KEY 1
VDD
FLASH
MEMORY
IC601
KEY C, D, E
CLK,DO
DL,CS
ANT1
SPOUTP
SPOUTN
BBIC
EEPROM
MEMORY
IC611
VCC
X501
13.824 MHz
IC501
SP
SCL, SDA
WP
KEYS
ANS_LED
VCCA
MSG_LED
DOUBOUT
VBAT
VCCPA
VBAT_APU
VCC_IF
VCC_FE
VCC_VCO
LOUT
LIN
HOOK
DCIN 2
DCIN 1
BELL
HSMIP
HSMIN
3.0V
RECEIVE
AMP
Q171
SIDE TONE
CIRCUIT
Q161
INUSE
DETECT 2
R151,R152
BELL
DETECT
Q111
D101
R371
R372
DCM
DCP
L1R
CHARGE_CONTACT
DC JACK
TEL JACK
L1T
KX-TGD210/212 BLOCK DIAGRAM (Base Unit_Main)
3.0 V
REGULATOR
IC302
INUSE
DETECT 1
R131, R133
RLY
Q141
4.2.
Operational P.C. Board
Block Diagram (Base Unit_Main)
4.3.
Block Diagram (Base Unit_RF Part)

TXp
TXn
ANT1
RXp
RXn
KX-TGD210/212 BLOCK DIAGRAM (Base Unit_RF Part)
10
4.4.
Circuit Operation (Base Unit)
General Description:
(BBIC, Flash Memory, EERROM) is a digital speech/signal processing system that implements all the functions of speech
compression, record and playback, and memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
TDD & TDMA

with FHSS
Processor
ADPCM
ADPCM
Digital
Speech
Processor
RF part
Analog
Front
End
TEL
Line
Interface
&
Host CPU
Caller ID
Modem
BBIC (IC501)
Multiplexer
Digital TAM System *1
EEPROM IC611
4.4.1.
BBIC (Base Band IC: IC501)
Voice Message Recording/Play back

The BBIC system uses a proprietary speech compression technique to record and store voice message in Flash Memory.
An error correction algorithm is used to enable playback of these messages from the Flash Memory.
DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
Synthesized Voice (Pre-recorded message)
The BBIC implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary.
Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
Block Interface Circuit
RF part, LED, Key scan, Speaker, Telephone line.
4.4.2.
EEPROM (IC611)
Following information data is stored.

Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse
11
4.4.3.
Power Supply Circuit/Reset Circuit
The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:
+3.0V
VBAT
IC302
5.5V
AC Adaptor
3.0V
REGULATOR
VBAT
pin 10
IC501
IC601
FLASH
RSTN(Reset)
pin 54
pin 15
BBIC
DOUBLER OUT
For peripherals
STM/CKM
VDDC (1.2V)
pin 57
pin 9
IC611
EEPROM
RF Part
Receive
Amp.
ANS LED
MSG LED
VBAT
VDDC (1.2 V)
Reset (RSTN)
(IC501_54 pin)
Startmonitor
(IC501 57pin)
(CKM/STM)
BBIC chip initialize
12
4.4.3.1.
Charge Circuit
R371
The voltage from the AC adaptor is supplied to the charge circuits.
R372
+5.5V
D362
F301
DCM
C351
CHARGE+
D361
( )
DCP
CHARGE-
13
4.4.4.
Telephone Line Interface
Telephone Line Interface Circuit:

Function
Bell signal detection
ON/OFF hook and pulse dial circuit
Side tone circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T R111 C111 Q111 BBIC pin 5 [BELL]
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T D101 Q141 Q161 R163 D101 P101 R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook condition.
Pulse Dial Circuit:
Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
+3.0V
*Q141
R161
2.7k
100k
10M
R131
2.7k
25V
R142
NC
R164
1k
*D143
C142 K0.01u
R177
0.1u
100k
*D142
R165
47k
*R162
27k
C101 680p
R151
Q142
D101
300V
L1T
C102 680p
NC
Pin 28 of IC501
R121
390k
C121
680p
R122
390k
C122
680p
R112
100k
0.047u
0.047u
C112
C111
K0.68u
C113
D113
Pin 17 of IC501
10k
47k
R114
14
R113
1k
BELL
Pin 5 of IC501
Q111
Pin 18 of IC501
Pin 24 of IC501
Pin 25 of IC501
RA151
K
A
+3.0V
D133
D153 NC
C123
Pin 16 of IC501
1000p
C124
C120
100k
R111
Hook
Pin 6 of IC501
NC
NC
VDDC
NC
*R115
1u
NC
10p
C181
C186
C184
SA103
NC
*C115
*SA101
*SA102
NC
330k
K0.01u
R133
2.2k
130k
0.01u
39
R152
C152
NC
R163
R171
C168
Q171
C132
100k
R145
R168
4.7k
10u
C167
1000p
C163 NC
220
C178
R141
C173
560p
0.033u
Q161
C
0.022u
680k
C175
C171
NC
C164
1k
3.9k
R172
C161
820
R175
C176 1u
R176
R160
*P101
L1R
4.4.5.
Parallel Connection Detect Circuit/Auto Disconnect Circuit
Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:
When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after
detecting parallel connection is off hook.
Q141
Pin 18 of IC501
DCIN2
R145
C102
Pin 17 of IC501
DCIN1
HOOK
SA101
C132
Q142
R133
R152
C152
C101
D101
R163
R151
RA151
R131
R142
R141
Q161
Pin 6 of IC501
15
L1R
TEL JACK
P101
RA151
L1T
4.4.6.
Calling Line Identification (Caller ID)/Call Waiting Caller ID
Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
Single message format

1st Ring
2 sec
2nd Ring
2 sec
Silent interval 4 sec

0.5 s 575 ms
min 0.5 s
DATA
STD Ring / 20 Hz
Tip-Ring
0.1 Vrms
70 Vrms
DATA in
1200 Hz
=DATA "1"
2200 Hz
=DATA "0 "
DATA out
1 bit=833 s
month
04
day
15
hour
16
minute
35
number
2013487000
Plural message format

1st Ring
2 sec
0.5 s
718 ms
2nd Ring
DATA
DATA CODE NAME

201
John Smith
month
04
day
16
16
hour
16
minute
35
number
2013487000
Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line P101 C121, C122 R121, R122 IC501 (25, 24).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
R121 C121
BBIC
IC501
25
24
C120
R122 C122
SA101
P101
17
L1T Telephone
Line
L1R
"FSK"
data
18
LCD
CP3V
R45
Q2, Q3, Q4,

Q9, R8
CHARGE
CIRCUIT
KEY LED
LCD-BACK LIGHT
BATTERY
TERMINAL
BATT-
CHARGE(+)
CHARGE
CONTACTS
MIC
RECEIVER
32
63
64
SDA
SCL
61
77
73
76
1.8 V
24
1.8 V
Q1
65
VBAT
SDA 67
RESET
CSB
CD
IC7
EEPROM
33
CHARGE_CTRL
SCL 66
34
CHARGE_DET
18
22
17
37
21
35
LDO_CTRL
CPU
Analog
Front
End
A/D
D/A
Pin 71
Reset
Reset
DSP
ADPCM
Codec
Filter
Speech
Decoding
Speech
Encoding
IC1
BBIC
45
CP 4V
CP3V
44
Charge
Pump
86
87
QSPI
Control
11, 12, 13, 14, 55
57, 58, 59, 60
BMC
RF
PLL
MOD/DEMOD
Burst
Decoding
Burst
Encoding
10.368
MHz
XTAL
X1
CP 3.0 V
KX-TGDA20 BLOCK DIAGRAM (Handset)
QSPI
FLASH MEMORY
IC4
ANT1
ANT1
BATTERY
47, 48, 51, 53 QSPI-IO 0-3

52 QSPI-SCK
49 QSPI-CS
COLUMNS
KEYPAD
ON SWITCH
ROWS
46
TXn
TXp
RXp
RXn
4.5.
SPEAKER
Block Diagram (Handset)
4.6.
4.6.1.
Circuit Operation (Handset)

Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.18).
DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, DC/DC Converter, EEPROM, LCD, RF Power Amp.)
- PLL Oscillator
- Detector
- Compress/Expander
- Reception
- Integrated 1.9 GHz PA for DECT
QSPI FLASH MEMORY: IC4
- Main Program D/L Area
EEPROM: IC3
- Temporary operating parameters (for RF, etc.)
4.6.2.
Power Supply Circuit/Reset Circuit
Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) F1 Q1 (1.8 V), IC1-44pin (3.0V)
The Reset signal generates IC1 (71 pin) and 1.8 V.
Battery +
1.8 V
Reset
(IC1_71pin)
4.6.3.
Charge Circuit
Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
Q2
R8
DC+(5.5 V) R371 R372 D362 CHARGE+(Base) CHARGE+(Handset)

Battery...
BATTERY- R45 GND CHARGE-(Handset) CHARGE-(Base) GND DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).
4.6.4.
Battery Low/Power Down Detector
Circuit Operation:
Battery Low and Power Down are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
Battery Low
Battery voltage: V(Batt) 2.25 V 50 mV
The BBIC detects this level and "
" starts flashing.
Power Down
Battery voltage: V(Batt) 2.0 V 50 mV
The BBIC detects this level and power down.
4.6.5.
Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
19
Q3 F1 BATTERY+...
4.7.
Signal Route
ROUTE
SIGNAL ROUTE
IN
HANDSET TX
MIC (+) - C13 - IC1 (17)

IC1(86)
C859 - ANT to BASE
MIC () - C11 - IC1 (18)
IC1(87)
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161 - Q141
- D101 - P101 - T/R(TEL LINE)
HANDSET RX
T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177 - C173 - Q171 - C178
- IC501(16 - 44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. --IC1 (21) - RECEIVER (+)
from BASE UNIT ANT 1
IC1 (1)
IC1 (2)
IC1 (22) - RECEIVER ()
HANDSET
SP-Phone TX
MIC (+) - C13 - IC1 (17)

MIC () - C11 - IC1 (18)
IC1(86)
IC1(87)
OUT
C859 - ANT to BASE
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161 - Q141

- D101 - P101 -T/R(TEL LINE)
HANDSET
SP-Phone RX
T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177- C173 - Q171 - C178 -R178
- IC501(16-44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. --from BASE UNIT ANT IC1 (1) IC1 (35) - SP ()
IC1 (2) IC1 (37) - SP (+)
GREETING
RECORDING
MIC (+) - C13 - IC1 (17)

MIC () - C11 - IC1 (18)
IC1(86)
IC1(87)
C859 - ANT to BASE
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47- 73/74) - IC601

GREETING PLAY
TO TEL LINE
IC601 - IC501(73/74 - 28) - C184 - Q161 - Q141 - D101 - P101

- T/R(TEL LINE)
ICM RECORDING
T/R(TEL LINE) - P101 - D101 - Q141 - R165 - R177- C173 - Q171 - C178 - R178
- IC501(16 - 73/74) - IC601
ICM PLAY TO
SPEAKER
IC601 - IC501(73/74 - 29/31) - SPEAKER
DTMF SIGNAL
TO TEL LINE
IC501(28) - C184 - Q161 - Q141 - D101 - P101 - T/R(TEL LINE)
CALLER ID
T/R(TEL LINE) - P101 - C121/C122 - R121/R122 - IC501(24/25)
BELL DETECTION
T/R(TEL LINE) - P101 - R111/R112 - C111/C112 - Q111 - IC501(5)
Note:
: inside of Handset
20
RF part signal route
SIGNAL ROUTE
IN
HANDSET RF
[ TX_ROUTE ]
IC1(86/87) - C859 - ANT
HANDSET RF
[ RX_ROUTE ]
ANT - IC(1/2)
BASE UNIT RF
[ TX_ROUTE ]
IC501(44/45) - C819 - C872 - ANT
BASE UNIT RF
[ RX_ROUTE ]
ANT - C872 - C895 - IC501(46/47)
ROUTE
Note:
: inside of Handset
21
OUT
5 Location of Controls and Components

Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Note:
7 Operating Instructions
Note:
22
8 Test Mode
8.1.
Engineering Mode
8.1.1.
Base Unit
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
Navigator key/
? (Volume) key/
(Phonebook)/
CID (Caller ID) key/
REDIAL (Redial) key/
{OFF } (Off)
} {TALK:Talk }
Dial keypad
{FLASH}
{CALL WAIT} (Call wait)
H/S LCD
H/S key operation

1). Press { MENU }.
2). Select "Initial Setup" using {^}or{V}

then press {OK } .
3). Select "Line Setup" using {^}or{V}

then press {OK } or {>}.
4). Enter "7", "2", "6", "2", "7", "6", "6", "4".
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys)
Service Mode
5). Select "Write EEP" using {^} or{V}

Read EEP
Write EEP
Get S/W Ver.
OK
Set Addr.:
Default Data
6). Enter " ", " ", " ", " " (Address). (*1)
C
7). Enter " ", " " (New Data). (*1)
OK
Set Addr.:
New Data
8). Press {OK } , a long confirmation beep

will be heard.
C
____
9). Press
(off) to return to standby mode.
After that, turn the base unit power off and then power on.
23
OK
Set Addr.:
__
Frequently Used Items (Base Unit)

ex.)
Items
C-ID (FSK) sensitivity
Address
06 DE/06 DD
Default Data
00/28
06 F8/06F7
00/01
Frequency
ID
00 07 / 00 08
00 02 ~ 00 06
00/01
Given value
Bell length
03 D4
3C (6 sec) (*3)
C-ID (DTMF) sensitivity
New Data
00/1C
00/14
(3 dB up)
(6 dB up)
0B/4C
0F/F6
(3 dB up)
(6 dB up)
1E (3 sec)
14 (2 sec)
Remarks
When hex changes from 00/28 to 00/1C or
00/14, gain increases by 3 dB or 6 dB.
When hex changes from 00/01 to 0B/4C or
0F/F6, gain increases by 3 dB or 6 dB.
Use these items in a READ-ONLY mode to
confirm the contents. Careless rewriting may
cause serious damage to the computer system.
This is time until bell stops ringing.
(Unit: 100 msec)
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex)

A
B
C
D
E
F
(*2)
Bell length
3C (hex) = 60 (dec) 60 100 msec = 6000 msec (6 sec)
24
Input Keys
[R] + 0
[R] + 1
[R] + 2
[R] + 3
[R] + 4
[R] + 5
8.1.2.
Handset
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
Navigator key/
?(Volume) key/
(Phonebook)/
CID (Caller ID) key/
REDIAL (Redial) key/
{OFF } (Off)
} {TALK:Talk }
Dial keypad
{FLASH}
{CALL WAIT} (Call wait)
H/S LCD
H/S key operation

1). Press { MENU }.
2). Select "Initial Setup" using {^}or{V}

then press {OK } .
3). Enter "7", "2", "6", "2", "7", "6", "6", "4".
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys)
Service Mode
4). Select "Write EEP" using {^} or{V}

Read EEP
Write EEP
Get S/W Ver.
OK
Set Addr.:
Default Data
5). Enter " ", " ", " ", " " (Address). (*1)
C
6). Enter " ", " " (New Data). (*1)
OK
Set Addr.:
New Data
7). Press {OK } , a long confirmation beep

will be heard.
OK
Set Addr.:
____ __
8). Press
(off) to return to standby mode.
After that, turn the base unit power off and then power on.
25
Frequently Used Items (Handset)

ex.)
Items
Address
Default Data
New Data
Battery Low
Frequency
ID
00 09
00 07 / 00 08
00 02 ~ 00 06
70
70/02
Given value
Possible Adjusted
Value MAX (hex)
-
Possible Adjusted
Value MIN (hex)
-
Remarks
(*2)
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.)
0
1
.
.
.
9
Input Keys
0
1
.
.
.
9
Desired Number (hex.)

A
B
C
D
E
F
Input Keys
[Flash] + 0
[Flash] + 1
[Flash] + 2
[Flash] + 3
[Flash] + 4
[Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.
26
9 Service Mode
9.1.
How to Clear User Setting (Handset Only)
Handset
Press 2 , 5 , 8 , 0 simultaneously until a beep sound is heard. Then single handset is initialized.
(The contents of user setting are reset to factory default)
*Usage time is not cleared.
27
10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
FLOW CHART
Not working
Power ON Base Unit
Check Power
OK
Playback Pre-Message
Not playback
Check Playback
OK
Not record
Record
Check Record
OK
Link
No link
Battery Charge
OK
No charge
Check Battery Charge
OK
Check Link
NG
Range
Check the RF part
OK
Handset Voice Transmission
No voice
Check Handset Transmission
OK
Handset Voice Reception
No voice
Check Handset Reception
OK
Caller ID Reception
Caller ID Error
Cross Reference:
Check Power (P.29)
Check Playback (P.31)
Check Record (P.30)
Check Battery Charge (P.31)
Check Link (P.32)
Check the RF part (P.34)
Check Handset Transmission (P.39)
Check Handset Reception (P.39)
Check Caller ID (P.39)
28
Check Caller ID
10.1.1. Check Power

10.1.1.1. Base Unit
Is the AC Adaptor inserted into AC outlet? (*1)
Is output voltage of AC adaptor 5.5 V?
NO
Check AC Adaptor.
YES
Check VDDC (1.2 V): Test Point [VDDC]
NO
Check Power Supply Circuit.
OK
RSTN: Reset = "High"?
NO
Check Reset Circuit.
YES
Check Xtal CLK = 13.824 MHz?
NO
Check X501.
YES
Check BBIC.
Cross Reference:
Power Supply Circuit/Reset Circuit (P.12)
Note:
BBIC is IC501.
(*1) Refer to Specifications (P.6) for part number and
supply voltage of AC adaptor.
(*2) Refer to Base Unit (Main) (P.61).
10.1.1.2. Handset
Is the battery inserted BATT+ and BATT-?
YES
NO
Is the voltage of BATT+ 2.3 V more?
Check F1 is not open.

YES
YES
Check the battery and around BATT+ and

BATT- are not shorted.
NO
Check Power Supply Circuit/Reset Circuit .
Is the voltage of +1.8V about 1.8 V?

YES
Is the voltage of CP3V about 3.0 V?
NO
YES
Is the voltage of CP4V about 4.0V ?
(When LED is On)
NO
Check BBIC (IC1).
YES
NO
Does BBIC (IC1: 7) oscillate at 10.368 MHz?
YES
Check BBIC (IC1).
Cross Reference:
29
Check X1.
10.1.2. Check Record

10.1.2.1. Base Unit
A) Not record Incoming Message
NO
Check Bell signal.

OK
Does the unit catch line?
NO
YES
Check Line In: Pin 16 of BBIC.
NO
Check Telephone Line Interface

[Bell].
Check Telephone Line Interface
[OFF HOOK].
Check ICM Recording in Signal Route.
OK
Check Auto Disconnect Circuit.
OK
Check Parallel Connection Detection
Circuit.
OK
Check BBIC and Flash Memory.
Note:
Flash Memory is IC601.
BBIC is IC501.
Cross Reference:
Signal Route (P.20)
Telephone Line Interface (P.14)
Parallel Connection Detect Circuit/Auto Disconnect
Circuit (P.15)
30
10.1.3. Check Playback

10.1.3.1. Base Unit
Check VDDC (1.2 V): Test Point [VDDC]
NO
Check Power Supply Circuit.
OK
Check output of BBIC (Pin 29, 31).
NO
Check BBIC and Flash Memory.
OK
Check Speaker and its surroundings.
Cross Reference:
Note:
Flash Memory is IC601.
BBIC is IC1.
(*1) Refer to Base Unit (Main) (P.61).
10.1.4. Check Battery Charge

10.1.4.1. Base Unit
Plug in the AC Power source.
Charge Handset on Base Unit.
Is the voltage of two charge contacts about

3 V or more?
NO
Check Charge Circuit of Base Unit.

OK
YES
Check Handset.
Check Charge Contacts at

Base Unit from mechanical point of view.
Cross Reference:
Charge Circuit (P.13)
10.1.4.2. Handset
NO
Is Check Power OK?
Check Power of Handset.
YES
NO
Check Charge Circuit.
Is BBIC (IC1: 34) high at charge state?

Cross Reference:
Check Power (P.29)
10.1.4.3. Charger Unit

Plug in the AC Power source.
Charge Handset on Charger Unit.
Is the voltage of two charge contacts about

3 V or more?
NO
Check Charge Circuit of Charger Unit.

OK
YES
Check Handset.
Check Charge Contacts at Charger Unit
from mechanical point of view.
Cross Reference:
31
10.1.5. Check Link

10.1.5.1. Base Unit
Does Base Unit make link with normal working
Handset?
YES
Base Unit is OK. Check Handset.
NO
Is the voltage of VBAT about 3.0 V?
NO
Check around Power Supply Circuit.
YES
Is the voltage of VDDC about 1.2 V?
NO
YES
Is the voltage of +3.0V about 3.0 V?
NO
YES
Does the RF clock (CLK) oscillate at 13.824 MHz in

Base Unit Test Mode?
Adjust +3.0V voltage to 3.0 V. *1

OK
NO
Check around X501 and RF module and adjust

clock frequency.*2
YES
Check the RF part
Cross Reference:
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.49) for Base Unit.
*2 How to adjust the frequency of X501:
To see the frequency, execute the command SFR, then check the TP_CKM (IC501-57pin).
To adjust frequency, send command SFR
until the frequency counter becomes13.824 MHZ55HZ.
32
10.1.5.2. Handset
Does Handset make link with Base Unit?
(Correct working unit)
YES
Handset is OK. Check Base Unit.
NO
Is the voltage of "1.8V" about 1.8 V?
NO
Adjust 1.8V voltage to 1.8 V.

OK
YES
NO
Check around Power Supply Circuit/Reset Circuit .

Is the voltage of CP3V about 3.0 V?
NO
YES
Is the voltage of CP4V about 4.0V?
(When LED is ON)
NO
Check BBIC (IC1)
YES
Is the voltage of CP2.8V about 2.8 V?
NO
Check D3
YES
Does the RF clock (CLK) oscillate: 10.368 MHz

in Handset Test Mode?
NO
Check around X1 and adjust clock frequency.
YES
Check the RF part.
Cross Reference:
Note:
(*1) Refer to Troubleshooting by Handset (P.31)
To see the frequency, execute the command SFR, then check the TP_CKM (IC1-55pin).
To adjust frequency, send command SFR
until the frequency counter becomes10.368 MHz55HZ.
Refer to Things to Do after Replacing IC or X'tal (P.50) for Handset.
33
10.1.6. Check the RF part

10.1.6.1. Finding out the Defective part
1. Prepare Regular HS(*1) and Regular BU(*2).
2. a. Re-register regular HS (Normal mode) to base unit (to be checked).
If this operation fails in some ways, the base unit is defective.
b. Re-register handset (to be checked) to regular BU (Normal mode).
If this operation fails in some ways, the handset is defective.
After All the Checkings or Repairing
1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
START
No
Base unit is defective
Registration of
handset to
Regular BU
Registration of
Regular HS to
base unit
Yes
Yes
(other checkings)
Registration of Regular HS to Regular BU
Registration of handset to base unit

(checked ones)
Note:
(*1) HS: Handset
(*2) BU: Base Unit
34
No
Handset is defective
10.1.6.2. RF Check Flowchart

Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.36).
Please refer to the each item.
Start
2
Link
confirmation
Normal
NG
Control
signal
confirmation
OK
NG
Check BBIC interface parts.

(RF Block <->BBIC on BU/HS P.C.B)
OK
3
X'tal
Frequency
confirmation
NG
Adjust X'tal Frequency. (*1)
OK
4
NG
TX confirmation
Check TX Block.
OK
5
NG
RX confirmation
Check RX Block.
OK
6
Range
confirmation
Normal
NG
TEST RANGE Check.
OK
GOOD
Note:
(*1) Refer to Check Link (P.32).
35
10.1.6.3. Check Table for RF part

No.
Item
1 Link Confirmation Normal
HS, BU Mode [Normal Mode]
2
X'tal Frequency confirmation
HS, BU Mode: [Adjustment]

TX confirmation
Regular HS (BU) Mode:
[Test RX Mode]
BU (HS) Mode:
[Test TX_Burst Mode]
RX confirmation
Regular HS (BU) Mode:
[Test TX_Burst Mode]
BU (HS) Mode:
[Test RX Mode]
Range Confirmation Normal
HS, BU Mode: [Normal Mode]
BU (Base Unit) Check

1. Register Regular HS to BU (to be
checked).
2. Press [Talk] key of the Regular HS to
establish link.
Check X'tal Frequency.
(13.824000 MHz 100 Hz)
HS (Handset) Check
1. Register HS (to be checked) to Regular
BU.
2. Press [Talk] key of the HS to establish link.
Check X'tal Frequency.
(10.368000 MHz 100 Hz)
1. Place Regular HS 15 cm away from a

checked BU.
2. Confirm "TXDATA" waveform of BU (*1)
and RXDATA waveform of Regular HS by
Digital Oscilloscope.
1. Place Regular BU 15 cm away from a

checked HS.
2. Confirm "TXDATA" waveform of HS (*2)
and "RXDATA" waveform of Regular BU by
1. Place Regular HS 15 cm away from a

checked BU.
2. Confirm "RXDATA" waveform of BU (*1)
and TXDATA waveform of Regular HS by
1. Place Regular BU 15 cm away from a

checked HS.
2. Confirm "RXDATA" waveform of HS (*2)
and "TXDATA" waveform of Regular BU by
1. Register Regular HS to BU (to be

checked).
2. Press [Talk] key of the Regular HS to
establish link.
3. Compare the range of the BU (being
checked) with that of the Regular BU.
1. Register HS (to be checked) to Regular

BU.
2. Press [Talk] key of the HS to establish link.
3. Compare the range of the HS (being
checked) with that of the Regular HS.
Note:
(*1) Adjustment Standard (Base Unit) (P.47)
(*2) Adjustment Standard (Handset) (P.48)
36
10.1.6.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.
Item
Range Confirmation TX TEST
(TX Power check)
HS, BU setting
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1)
Range Confirmation RX TEST

(RX sensitivity check)
HS, BU setting
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1)
BU (Base Unit) Check

1. Register Regular HS to BU (to be checked).
HS (Handset) Check
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the BU and the Regular HS

according to CHART1.
2. Set TX Power of the HS and the Regular BU

3. At distance of about 20m between HS and BU,

Link OK = TX Power of the BU is OK.
No Link = TX Power of the BU is NG.
1. Register Regular HS to BU (to be checked).

Link OK = TX Power of the HS is OK.
No Link = TX Power of the HS is NG.
1. Register HS (to be checked) to Regular BU.
2. Set TX Power of the BU and the Regular HS

2. Set TX Power of the Checking HS and the Regular BU according to CHART1.

Link OK= RX Sensitivity of the BU is OK.
No Link = RX Sensitivity of the BU is NG.

Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the HS is NG
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (Base Unit) TX Power Check

BU (Base Unit) RX Sensitivity Check
BU (to be checked)
TX Power
Low
High
Regular_HS
TX Power
High
Low
HS (Handset) TX Power Check

HS (Handset) RX Sensitivity Check
HS (to be checked)
TX Power
Low
High
Regular_BU
TX Power
High
Low
Note:
(*1) Refer to Commands (P.46).
37
10.1.7. Registering a Handset to the Base Unit

1
Handset:
{MENU} # 1 3 0
Base unit:
Press and hold {LOCATOR} for about 5 seconds.
L If all registered handsets start ringing, press {LOCATOR}
repeat this step. (KX-TGD212)
L The next step must be completed within 90 seconds.
Handset:
Press {OK}, then wait until a long beep sounds.
10.1.8. Deregistering a Handset

1
{MENU} # 1 3 1
L All handsets registered to the base unit are displayed.
^
2 { V } : Select the handset you want to cancel. i {SELEC.}
3 {^
V } : S i {SELEC.} i {OFF}
38
again to stop, then
10.1.9. Check Handset Transmission

Check MIC of handset.
Check handset Tx in Signal Route.

Cross Reference:
Signal Route (P.20)
10.1.10. Check Handset Reception

Check speaker of handset.
Check handset Rx in Signal Route.

Cross Reference:
Signal Route (P.20)
Note:
When checking the RF part, Refer to Check the RF part
(P.34).
10.1.11. Check Caller ID

BASE UNIT
NO
Did bell ring?
(Message indicator
blinks)
Check bell signal detection in

Telephone Line Interface.
YES
Check Calling Line Identification (Caller ID)/
Call Waiting Caller ID.
Cross Reference:
Telephone Line Interface (P.14)
Calling Line Identification (Caller ID)/Call Waiting Caller
ID (P.16)
Note:
Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.
It is also recommended to confirm that the customer is really
a subscriber of the service.
39
11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions
11.1.1.
Base Unit
11.1.1.1. KX-TGD210
Remove the 4 screws to remove

the cabinet cover.
Remove the solders.
4 screws
Solders
Remove the main P.C. board.
Main P.C. board
40
11.1.2.
Handset
Remove the 2 screws.
Insert a plastic card.

(Ex. Used SIM card etc.)
between the cabinet body
and the cabinet cover, then
pull it along the gap to open
the cabinet.
2 screws
Cabinet body
Cabinet cover
Likewise, open the other

side of the cabinet.
Remove the cabinet cover

by pushing it upward.
Remove the solders.
Cabinet cover
Screw
Solders
Remove the solders to remove

the 2 charge terminals.
Main P.C. board
Remove the screw to remove

the Main P. C. board.
Solders
2 charge terminals
41
11.1.3.
Charger Unit
Cabinet cover
Remove the cabinet cover.
AC Adaptor
Remove the solders to remove

the AC adaptor.
Solders
Remove the 2 charge terminals.
2 charge terminals
42
11.2. How to Replace the Handset LCD

Note:
The illustrations are simplified in this page.
They may differ from the actual product.
P. C. board
Vertical Interval
Tolerance
Peel off the FFC (Flexible Flat Cable) from

the LCD, in the direction of the arrow. Take
care to ensure that the foil on the P.C. board
is not damaged.
0.2 mm
Horizontal Interval
Tolerance
0.2 mm
If interval tolerance between center lines

is less than 0.2 mm, it is o.k.
New LCD
OK
Fit the heatseal of a new LCD.
NG
(Inclined)
Tip of Soldering Iron

(Part No. PQZZ430PIR)
Rubber of Soldering Iron
(Part No. PQZZ430PRB)
Heatweld with the tip of the soldering
iron about 5 to 8 seconds
(in case of 60W soldering iron).
NG
(Vertical interval tolerance is
more than 0.2 mm.)
NG
(Horizontal interval tolerance is
more than 0.2 mm.)
43
12 Measurements and Adjustments

This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.28)
12.1. Equipment Required

Digital multi-meter (DMM): it must be able to measure voltage and current.
Oscilloscope.
Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; 4 ppm)
Hewlett Packard, 53131A is recommended.
DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG

Note:
*: If you have the JIG Cable for TCD500 series
(PQZZ1CD505E), change the following values of
resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
<Preparation>
Serial JIG cable: PQZZ1CD300E*
PC which runs in DOS mode
Batch file CD-ROM for setting: PNZZGD210AG1
Resistor
R2
R3
R4
R7
Old value (k)

22
22
22
4.7
New value (k)

3.3
3.3
4.7
10
12.2.1. Connections (Base Unit)

1 Connect the AC adaptor.
2 Connect the JIG Cable GND (black).
3 Connect the JIG Cable RX (red) and TX (yellow).
JIG Cable
UTX
3 UTX (yellow)
URX
2 UGND (black)
UGND
To Serial Port
(COM port 1*)
3 URX (red)
PC
DC JACK
1
AC adaptor
Base unit P. C. board

Note:
*: COM port names may vary depending on what your PC calls it.
44
12.2.2. Connections (Handset)

1Connect the DC Power or Battery to BATT+ and BATT-.
2Connect the JIG cable GND (black) to GND.
3Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
3 URX (red)
3 UTX (yellow)
UTX
URX
BATT+
DC Power
or Battery
To Serial Port
(com port 1*)
2 GND (black)
GND
JIG Cable
BATT-
PC
Handset P. C. board
Note:
*: COM port names may vary depending on what your PC calls it.
45
12.2.3. How to install Batch file into P.C.
1. Insert the Batch file CD-ROM into CD-ROM drive and

copy PNZZTG**** folder to your PC (example: D drive).
<Example for Windows>
On your computer, click [Start], select Programs
(All Programs for Windows XP/Windows Server 2003),
then click
MS-DOS Prompt. (for Windows 95/Windows 98)
Or
Accessories-MS-DOS Prompt. (for Windows Me)
Or
Command Prompt. (for Windows NT 4.0)
Or
Accessories-Command Prompt.
(for Windows 2000/Windows XP/Windows Server 2003)
2. Open an MS-DOS mode window.
3. At the DOS prompt, type "D:" (for example) to select the

drive, then press the Enter key.
<Example>
4. Type "CD PNZZTG****", then press the Enter key.

5. Type "SET_COM=X", then press the Enter key
(X: COM port number used for the serial connection on your PC).
6. Type "READID", then press the Enter key.

If any error messages appear, change the port number or
check the cable connection.
If any value appear, go to next step.
7. Type "DOSKEY", then press the Enter key.
C: >Documents and Settings>D:

D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
00 52 4F A8 A8
D: >PNZZTG****>DOSKEY
D: >PNZZTG****>
<Example: error happens>

C: >Documents and Settings>D:
D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
CreateFile error
ERROR 10: Can't open serial port
D: >PNZZTG ****>
Note:
***** varies depending on the country or models.
12.2.4. Commands
See the table below for frequently used commands.
Command name
rdeeprom
Function
Read the data of EEPROM
readid
writeid
Read ID (RFPI)
Write ID (RFPI)
hookoff
hookon
getchk
wreeprom
Off-hook mode on Base

On-hook mode on Base
Read checksum
Write the data of EEPROM
Example
Type rdeeprom 00 00 FF, and the data from address
00 00 to FF is read out.
Type readid, and the registered ID is read out.
Type writeid 00 18 E0 0E 98, and the ID 0018 E0 0E
98 is written.
Type hookoff.
Type hookon.
Type getchk.
Type wreeprom 01 23 45. 01 23 is address and 45
is data to be written.
46
12.3. Adjustment Standard (Base Unit)

When connecting the simulator equipment for checking, please refer to below.
12.3.1. Bottom View

Frequency Counter (*1)
* Send command "SFR", then

the frequency output on this TP.
Oscilloscope (*2)
* Start Monitor
UTX
+5.5V
URX
UGND
C171
C167
R164
C173
PCB
R172
C175
R175
C176
IC611
TMS
RA611
R176
TD0
ANT1_Short
C611
R112
RTCK
TDI
+3.0V
TCK
L1R
C112
BRN
R114
VDDC
R115
R111
Spectrum Analyzer
ANT1_S-GND
R171
Q171
C178
PNLB2317Z
R168
Q111
TEL
SA101
STM/CKM/P15
C111
R113
LT1
YLW
C115
C113
D113
IC601
GAP1
C601
ANT1
RSTN
C515
VREF
C120
GRY
PUR
C513
DCM
F301
R322
R372
IC302
C351
+
R321
BLU
SP
8
Volt Meter
Oscilloscope
Note:
(*1) is referred to No.2 of Check Table for RF part (P.36)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)
47
ORG
CHG
C342
DCP
C321
R371
DC
5.5V
DC
VCCA
12.4. Adjustment Standard (Handset)

When connecting the simulator equipment for checking, please refer to below.
12.4.1. Component View

Oscilloscope
ANT-Short-GND
ANT-Short
BL
UE
LCD_SID
LCD_SCL
LCD_CD
LCD_RESET
LCD_CS
AN
RA
C77 C76
C95
ER
IV
O
RA
D21
R55
NG
E
Spectrum Analyzer
R54
R53
R52
R51
C70
CE
C94
C93
RE
C92
C91
40
C65
NG
AF VOLT METER
_T
LE
T1
When measure RF, short "ANT-Short" and "ANT-Short-GND" with copper wire which length 5mm.
After measure do not forget to remove the wire.
C62 C64 C96

C61 C63
RE
EN
D22
C71
CP3V
C79
RA5
C72
BLUE
D13
ORANGE
C57
C56
STM
15 H
C52
C55
C53 C29
C30
C44
RST
R61
C45
IC1
C12
R23 RA7
CP3V
C22
C13 C11
C47
C43
R1
Q1
1.8V
STB_E
Oscilloscope
C862 R20
100
CP4V
C190
C863
C859
15 H
C59 C98
C36
R15
X1
Q6
RA2
KEY_LED
RA3
CKM
* Send command "SFR", then

the frequency output on this TP.
C1
C41
C191 C99
C860 C46
1.8V
DC Volt Meter
CP+3.0V
JTAG
IC4
1.8V
R60
AF VOLT METER
C69
100
R77
C78
D14
SP-PHONE_SPEAKER
C73
R76
C866
STB_D
Frequency Counter
POWER
PNLB2319Z
PbF
KIN_3
STB_C
MIC+ +
47
AF VOLT METER
MIC+ RCV-
KIN_2
47
+
CHG_CTRL
40
MIC- RCV+
Q9
Q4
R6
Q2
KIN_1
R2 C19
R9
R45
C15
R8
CHG+
URX
F1
C6
DC POWER SUPPLY
2.6V
VBAT
VBAT
BATT+
GND
BATTKIN_4
GND
CHG-
DC VOLT METER
UTX
R7
C5
48
Oscilloscope
Q3
MIC Load
MIC-
STB_B
OSC
1.1 kHz
STB_A
12.5. Things to Do after Replacing IC or X'tal

If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment
data, etc. in memory.
The set doesn't operate if it is not executed.
12.5.1. How to download the data

12.5.1.1. Base Unit
First, operate the PC setting according to The Setting Method of JIG(P.44).
Then download the appropriate data according to the following procedures.
EEPROM (IC611)
X'tal (X501)
Items
How to download/Required adjustment
Adjusted parameter data is stored in memory. 1) Change the address 0001 of EEPROM to AA to download
(country version batch file, default batch file, the data.
2) Default batch file: Execute the command default.bat.
etc.)
3) Country version batch file: Execute the command
TGD21VEUS_WW_RevXXX_YYY.bat (KX-TGD210)(*1)
4) Clock adjustment
System clock
Clock adjustment data is in EEPROM, adjust the data again
after replacing it.
1) Apply 5.5V between DCP ad DCM with DC power.
2) Input Command "sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz 100 Hz).
4) If the frequency is not 13.824 MHz 100 Hz, adjust the
frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz 15 Hz.
Note:
(*1) WW: country code, XXX_YYY: revision number
XXX_YYY vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.44).
49
12.5.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG (P.44).
Then download the appropriate data according to the following procedures.
EEPROM (IC7)
Items
Adjusted parameter data is
stored in memory.
(country version batch file,
default batch file, etc.)
Battery Monitor Check
Battery Low Confirmation
Battery Clock Adjustment

(X1)
CLK
How to download/Required adjustment

1) Default batch file: Execute the command default.bat.
2) Default batch file (remaining): Execute the command
TGDA20US_DEF_RevXXX_YYY.bat. (*2)
3) Country version batch file: Execute the command
TGDA20US_WW_RevXXX_YYY.bat.(*2)
4) Clock adjustment
5) 2.35 V setting and battery low detection
1) Apply 2.25 V between BATT+ and BATT-.
2) Execute the command
sendchar PAD
sendchar LED 0
sendchar CRX 0 1
sendchar AD1
It assumes that the return value is XX.
a) 6c XX 71: No need to adjust
b) XX: 6A ~ 6B: Need to adjust
XX: 72 ~ 74: Need to adjust
Write AD value of 2.25 V to EEPROM.
ex) read data: XX = 6A, write data:YY = 6A
read data: XX =73, write data: YY = 73
EEPROM = 0009 (Low Voltage) write YY
Execute the command wreeprom 00 09 01 YY.
EEPROM = 000A (No Voltage) write YY - 1D
Execute the command xwreeprom 00 0A 01 ZZ.
Note:
No Voltage writing data limit is 00.
c) XX: 00 ~ 69: Reject
XX: 75 ~ FF: Reject
1) Apply 2.40 V between BATT+ and BATT-.
2) Confirm that there is no flashing of Battery lcon.
3) Apply 2.25 V 0.08 V between BATT+ and BATT-.
4) Confirm that there is flashing of Battery lcon.
1) Apply 2.6 V between BATT+ and BATT- with DC power.
2) Input Command sendchar sfr, then you can confirm the current value.
3) Check Xtal Frequency. (10.368 MHz 100 Hz).
4) If the frequency is not 10.368 MHz 100 Hz, adjust the frequency of CLK
execute in the command sendchar sfr xx xx (where xx is the value) so that the
reading of the frequency counter is 10.368000 MHz 5 Hz.
Note:
(*2) WW: country code, XXX_YYY: revision number
XXX_YYY vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The Setting
Method of JIG (P.44).
50
12.6. Frequency Table

Channel 0
Channel 1
Channel 2
Channel 3
Channel 4
Ch. (hex)
00
01
02
03
04
TX/RX Frequency (MHz)

1928.448
1926.720
1924.992
1923.264
1921.536
51
13 Miscellaneous
13.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.1.1. Preparation
PbF (: Pb free) Solder
Soldering Iron
Tip Temperature of 700 F 20 F (370 C 10 C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
Flux
Recommended Flux: Specific Gravity 0.82.
Type RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4)
13.1.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
52
13.1.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.1.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
53
13.2. Terminal Guide of the ICs, Transistors and Diodes

13.2.1. Base Unit
4
Cathode
(Reverse View)
88
67
66
1
1
2
3
Anode
DY2J25000L
22
C2HBCY000151
PNWIGD220LAH
Anode
DSC7003S0L
Anode
DA2J10100L
B0EDER000009
C
8
B
E
1
C3FBLY000162
PNWIGDA20LAR
2SC6054JSL
B1ABDM000001
Cathode
13.2.2. Handset
45
44
Cathode
2SA1776P
1
23
C0DBEYY00102
B1ADGE000012
B1ABGE000011
B1ADCF000040
2SC6054JSL
UNR9216J0L
(Reverse View)
89 pin
67
88
(GND)
66
1
22
23
Anode
45
44
C1CB00003837
54
(Reverse View)
Cathode
B3ACB0000216
B0ECKM000008
14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Base Unit (Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
Important Safety Notice:

Components identified by
mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Handset (Main))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagrams may be modified at any time with the development of new technology.
55
14.2. Base Unit (Main)

14.2.1. KX-TGD210
RF Block
ANT1
2
ANTPattern
MSL
Wm=0.4mm
Lm=10mm
C872
1.5p
SHORT
MSL
W=0.25
L=2mm
open-stub
SL
W=2.2mm
L=5.0mm
TXn
1.5p
SPN
(1)
SPP
(2)
SHORT4
Pre-matching
VBAT
SHORT
open-stub
SL
W=2.0mm
L=10.8mm
MSL
W=0.25
L=2mm
SHORT
TXp
10p
C811
SHORT5
open-stub
SL
W=2.9mm
L=3.8mm
C810
Tx-balun
SL
W=0.3
L=40mm
NC
D472
A
K
GND
10p
SL
W=0.2mm
L=20mm
RXp
NC
D473
A
K
SL
W=0.3mm
L=6.5mm
SHORT1
C477 NC
SL
SL
W=0.3mm W=0.3mm
L=12.45mm L=6.95mm
C819
C820
1.5p
GND
C478 NC
GND
GND
W 0.15mm
L 6.2mm
1st layer
SHORT
L803
15p
GND
C874
GND
GND
W 0.2mm
L 3.8mm
1st layer
C895
2p
SHORT2
GND
SHORT
SHORT
SHORT3
SHORT6
GND
RXn
1.3p
C873 C871
2p
1.5p
ANT1_S-GND
C863
GND
2.7n
ANT1_Short
X501
10p
GND
C508
TXn
TXp
RXp
RXn
13.824M
(3)
(4)
VBAT
10u
(5)
(6)
C511
C513 2.2u
TO RF BLOCK
+3.0V
KEYIN2
KEYS_C
KEYIN1
KEYS_E
KEYIN3
KEYS_D
*R651
C518 0.1u
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_RTCK
NC
NC
*C652
10k
10k
10k
10k
NC
(10)
(11)
(12)
MSG_LED
1
NC
JTAG_TDO
RTCK JTAG_RTCK
JTAG_TCK
TCK
JTAG_TMS
TMS
JTAG_TDI
TDI
URX
URX
UGND
UTX
UTX
EEP_SCL
EEP_SDA
EEP_WP
*SW1
*Q652
NC: No Components
56
*C601
MSG_LED
ANS_LED
SPI_DI
*C651
*C650
NC
*R652
VDDC
+3.0V
*Q651
R506
R502
R503
R504
NC
NC
ANS_LED
1
C516 0.1u
C517 0.1u
(8)
(9)
67
68
69
70
71
72
73
KEYIN2
KEYS_C
KEYIN1
KEYS_E
KEYIN3
KEYS_D
ANS_LED
MSG_LED
LED_VDD
RSTN
STM/CKM/P15
NC
*R507
VBAT
1u
GND
TXp
RXp
RXn
GND_RF
TRSW_p
ANT_n
ATST_n
ATST_p
TEST
RSTN
NC
VCC_VCO
GPIO[27]
VDDUSB
DM_USB/GPI28
DP_USB/GPI29
VDDC1
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TMS
JTAG_RTCK
GPIO[0]/SCL_IIC
GPIO[1]/SDA_IIC
GPIO[2]
GPIO[3]
GPIO[4]
GPIO[5]
GPIO[6]
NC
PARALLEL WIRE
C515
*WBX01
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
TXn
TRSW_n
ANT
VCC_FE
VDD_IF
VCC_IF
VDD_APU
44
43
42
41
40
39
38
(7)
NC
*IC601
NC
1
*CS
DO/IO1
*HOLD/IO37
*WP/IO2
CLK 6
GND
VCC8
DI/IO0 5
(13)
(14)
(15)
(16)
(17)
(18)
(19)
(20)
(21)
10M
R131
R142
2.7k (3216)
NC
D143
100k
C101 680p
D101
C102 680p
NC
R115
C184
1
2
NC
NC
C181
1u
L1R
(GREEN)
P101 22
C115
68k
L1T
(YELLOW)
330k
0.01u
R133
SA101 270V
Q142
2.2k
220
R163
39
0.022u
R151
100k
R145
2.7k
C142 K0.01u
R164
1k
D142 25V
R177
0.1u
130k
K0.01u
C173
REFERENCE
1XX : TEL LINE
3XX : POWER, CHARGE
4XX : MIC, SP
5XX : BBIC
6XX : FLASH, EEPROM, KEY, LCD
7XX : FOR DK/BT
8XX : RF
27k
R141
R152
C152
680k
560p
C171
R162
1000p 4.7k
R165 27k
10u
C167 R168
NC
C161
Q141
R172
33k
R332
C331 NC
R331
+5.5V
Q161
C175
0.033u
R171
(2)
C164
1k
3.9k
R175
C176 1u
R176
820
Q171
C178
(1)
Tx
R160
C132
Rx
+3.0V
12p
(4)
R121
390k C121
680p
C509
(3)
R122
390k C122
680p
Caller ID
(5)
(6)
+5.5V
3.0A
C519
0.1u
R371
1
1
R372
A
D362
0.047u
C112
10k
1SR154
0.047u
C111
1u
C351
1k
Bell
NC
D361
CHARGE-
3.0V
+5.5V
VBAT
IC302
100
140
OUT1 IN 3
OUT2
ADJ
1
1u
R322
R321
C341
C342
HOOK
BELL
KEYS_E
KEYS_D
KEYS_C
UTX
URX
VDDC
6.3
330u
2
4
C321
L501
100n
C501
0.1u
VDDC
+3.0V
R510
1.2V
SPI_CLK
SPI_DO KEYIN1
SPI_DI KEYIN2
SPI_CS KEYIN3
1
2
0.1u
1u
1u
C502
10u
+3.0V
0.1u
RA611
3.3k
10k
VCC8
A0
A1
WP7
A2
SCL 6
GND
SDA 5
1
2
3
4
8
7
6
C611
*IC611
(16)
(17)
(18)
(19)
(20)
(21)
K0.68u
RA151
C504
C521
CHG+
CHARGE+
1u
C520
0.1u
SPI_CS
SPI_DO
SPI_CLK
+3.0V
C113
C506
89
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
D113
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
10u
MIN
VCCA
VREF
DCIN3/LIN1
DCIN2
DCIN1
DCIN0/LIN0
DOUBOUT
DOUBCAPP1
DOUBCAPP
DOUBCAPN
DOUBCAPN1
VBAT
COREOUT
VDDC2
GPIO[26]
GPIO[25]
GPIO[24]
GPIO[23]
GPIO[22]
GPIO[21]
GPIO[20]
(12)
(13)
47k
R114
C505 10u
GPIO[7]
GPIO[8]
VDDIO1
GPIO[9]
GPIO[10]
GPIO[11]
GPIO[12]
GPIO[13]
GPIO[14]
GPIO[15]
GPIO[16]
GPIO[17]
VDDIO2
GPIO[18]
GPIO[19]
(10)
VCCA
EEP_WP
EEP_SCL
EEP_SDA
GND
VREF
C503
*IC501
Q111
R501 10
DCM
R113
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
VCCA
VBAT_APU
XIN
XOUT
DCINS
PWM0
PWM1
SPOUTP
VCCPA
SPOUTN
LOUT
HSSPOUTP
MPWR
HSMIP
HSMIN
MIP
(9)
R112
100k
D133
C507
2.2u
+3.0V
1000p
+3.0V+3.0V
(8)
100k
R111
1u
C510
C120
DCP
HOOK
BELL
(14)
(15)
!
F301
VDDC
(7)
(11)
+5.5V
ZA1
NC
10
12
GND
PNLB2317ZA-GW
11
HAK_CL1
PCB
RE1
GND
NC: No Components
KX-TGD210AG1 SCHEMATIC DIAGRAM (Base Unit_Main)
57
14.3. Handset (Main)

Charge Current
VBAT
VBAT
!
F1 2.5A
BATT+
C6
K0.1u
GND
BATT-
R45
0.1
C15
J39p
SOCn
SHORT
To Battery
(1)
(2)
C1
6.3V
220u
SOCp
GND
OJ4
EEP_WP
LCD_CD
LCD_SCL
LCD_SID
Q2
C19
K1000p
CHG+
KEY_LED
KIN_1
KIN_2
KIN_3
KIN_4
STB_F
* When "SFR" command is executed,

13.824MHz frequency will be output.
GND
R2
30k
R9
30k
CHG+
C5
K0.1u
To Charge
Terminal
R84.3
(3216)
R7
820
CP3V
Q3
C69
Q4
K0.1u
R6
10k
GND
Q9
GND
CHARGE_CTRL
CHARGE_DET
1 A0
2 A1
VCC 8
WP 7
3 A2
4 VSS
SCL 6
SDA 5
C57
K0.1u
IC7
GND
CKM
RA5
3.3k
67
68
69
70
C44
71
K0.1u RST72
73
74
75
76
77
78
79
80
81
C45
82
K0.1u
83
C46
84
10p
85
86
87
88
UTX
URX
LCD_CS
EEP_WP
GND
LCD_RESET
LCD_LED0
for TGC
Not Used
Not Used
Not Used
AST
FLASH
Not Used
Not Used
Not Used
Not Used
TX _RF
for TGD
SHARP
LEFT
SP
TO RF BLOCK
KIN_4
for TGC
Not Used
for TGD
RF_TXn
RF_TXp
SOFT_A1
UP
SOFT_A2
RF_RXn
RF_RXp
KIN_3
for TGC
89
VBAT
Not Used
Not Used
Not Used
Not Used
C866
K0.1u
Not Used
Not Used
GND RX
for TGD
5
GND
(7)
(8)
_RF
TALK1
6
(6)
IC1
1
2
3
R20
4
F56k
5
6
7
C47
8
1u
9
10
C43 D10p 11
12
13
14
15
16
JTAG
GND
P0_2/SDA2/UTX2
P0_1/URX/PWM0
P0_0/UTX
VDD2
*RSTn
JTAG
P2_5/PCM_FSC/SF
P2_4/SCL1/PCM_DO/DP3
P2_3/SDA1/PCM_DI/DP2
P2_2/PCM_CLK/CLK100
WLED_CUR_0
WLED_CUR_1
P2_1/ECZ2/PWM1/LED4
P2_0/ECZ1/PWM0/LED3
LDORF_CTRL
VDD3
RFP0n
RF_SUPPLY2
RF_SUPPLY_PA
RF_TXn
RF_TXp
RFP2
RF_RXn
RF_RXp
RFP1
RFP0
REF_RES
AVS_XTAL
XTAL2
XTAL1
AVD_XTAL
RF_SUPPLY1
P3_4/PARADET
P3_5/RINGOUT/RINGING
P3_6/RINGn
P3_7/RINGp
P3_2/CIDINp
VREFp
R61
1k
P0_3/SCL2/URX2
P0_4/SPI_EN
P0_5/SPI_CLK
P0_6/SPI_DO
P0_7/SPI_DI/PWM1
P2_6/WTF_IN
P1_1/INT1/LE
P1_2/INT2/SK
P1_3/INT3/SIO
P1_4/INT4/TDOD
P1_5/INT5/RDI/VDDE
P2_7/BXTAL
VDD1
QSPI_IO0
QSPI_SCK
QSPI_IO3
+1.8V
R60
NC
(3)
(4)
(5)
GND
STM
+1.8V
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
GND
CHG-
X1
10.368M
INT
TALK2
GND
KIN_2
for TGC
for TGD
Not Used
SOFT_C1
Not Used
Not Used
1Vp-p
9
DOWN
RIGHT
SOFT_C2
0.85V
KIN_1
STB_B
STB_C
STB_D
STB_E
LCD_SID
13 LCD
14 LCD
15 LCD
VB1+
VLCD
GND
C95
16V K1u
C93
16V K1u
11 LCD
12 LCD
VB0-
VB1-
9 LCD
8 LCD
VSS
10 LCD
7 LCD
VDD
VB0+
6 LCD
SDA
C65 NC R55 330

5 LCD
SCK
58
VSS
LCD_CD
LCD_SCL
A0
C64 NC R54 330

4 LCD
RES
C63 NC R53 3.3k
LCD_CS
LCD_RESET
C62 NC R52 10k
3 LCD
C61 NC R51 10k
*LED2 .
*R15
1.5k
2 LCD
GND
*RA3
680
C94
C92
16V K1u 16V K1u
C91
16V K1u
1 LCD
*Q6
NC: No Components
*LED3 Amber
*LED4 .
*LED1 .
.
*LED5
*LED6 .
*RA2
680
C96
K1u
CS1
*RA1
NC
CP3V
GND
GND GND
*LED7
*LED8
*LED9
*C76
NC
KEY B/L LED

(TGC/TGD = Amber)
(WP = NC)
KEY_LED
STB_F
STB_E
CP4V
LCD B/L LED
(TGC = Amber)
(TGD = White)
+
*WLED
-
*C77
NC
STB_D
STB_C
STB_B
LCD_LED0
STB_A
0V
GND
(9)
(1)
(2)
ANT-Short
50 ohm line
L=2mm
ANT-Short-GND
GND
OJ7
open-stub
SL
W=2.2mm
L=5.0mm
MSL
W=0.25mm
L=5mm
TX_RF
RF_TXp
SHORT
GND
POWER
for TGC
VBAT
OJ3
SHORT
Not Used
CP4V
CP3V
OFF1
50
49
48
47
46
45
OFF2
for TGD
GND
VDDIO_QSPI
QSPI_CS
QSPI_IO1
QSPI_IO2
P1_6/PON
CP_VOUT2
C55
D10p
open-stub
SL
W=0.6mm
L=20.0mm
Not Used
C52 K1u
CP3V
C53
K2.2u
CIDINn/MICp
CIDOUT/MICn
MICh
VREFm
LSRp
LSRn
CP_VOUT1
CP_C2y
CP_VBAT2
CP_C1y
CP_C2x
CP_C1x
CP_VBAT1
P3_0/DP0/PAOUTn
VDDPA
P3_1/DP1/PAOUTp
P1_7/CHARGE
CHARGE_CTRL
VBAT
DC_CTRL
DC_I
DC_SENSE
SOCn
SOCp
P1_0/INT0/ADC1
P3_3/ADC0
LDO_CTRL
VDD/AVD
44 C30
GND
K1u
43
VBAT
42
C191
41 C29
K1u
40 K1u
VBAT
39
C59
K1u
38
37
36
35
CHARGE_DET
34
CHARGE_CTRL
33
32
31
C190
K0.1u
30
SOCn
29
28
C36
J39p SOCp
27
26
STB_A
25
R110k
24
23 (MAX500mA)
+1.8V
1.8V
17
18
19
20
21
22
1.8V
C22
K1u
Sp-phone RX
C11 K0.1u
C13 K0.1u
C72 D13
NC NC
+
C73 D14
NC NC
C98
D10p
C99
D10p
R76
1
C79
K2200p
SP-PHONE_SPEAKER
-
R77
1
C78
K2200p
SL
W=0.15mm
L=6.3mm :3.6nH + 0.4nH
GND GND
FbB"C
9mm2 :1.75pF
GND GND
GND GND
GND GND
LC
Q1
RCV+
C70 D21
68p NC
RECEIVER+
GND
(8)
open-stub
SL
W=2.0mm
L=10.8mm
LPF
CP4V
(7)
open-stub
SL
W=2.9mm
L=2.8mm
SL
W=0.2mm
L=20.0mm
C41
K0.1u
(3)
(4)
(5)
(6)
RF_TXn
TX-balun
SL
W=0.3mm
L=39.0mm
OJ2
10p
8
MSL
W=0.25mm
L=5mm
GND
GND
C860
1.1p
IC4
1 *CS
VCC
2 DO/IO1
*HOLD/IO3
3 *WP/IO2 CLK
4 GND DI/IO0
RF_RXp
SHORT
SL
SL
W=0.3mm W=0.3mm
L=6.95mm L=6.5mm
C859
C862
1.5p
C863
1.8p
+1.8V
RX_RF
MSL
W=0.25mm
L=2mm
OJ1
50 ohm line
Total L=4mm
C56
K1u
MSL
W=0.25mm
L=2mm
RF_RXn
ANT1_TP
GND
GND
*open-stub
SLx2
W1=0.2mm
L1=3.3mm
W2=0.7mm
L2=5.0mm
RX-balun
MSL
W=0.170mm
L=3.6mm
S=0.125mm
SHORT
SHORT
OJ5
RF BLOCK
C71 D22
68p NC
MIC_POWER
RA7 820
SL
W=0.15mm
L=6.3mm :3.6nH + 0.4nH
RCV-
Handset RX
2
1
RECEIVER
-
RECEIVER-
GND
GND GND
GND GND
R23
1k
FbB"C
9mm2 :1.75pF
3
4
C12
K2.2u
MIC+
GND
MICp
MIC AP1
MICn
MIC-
Handset TX/Sp-phone TX
(9)
ZA1 NC
10 9
8 7
11
12
Test Pattarn for Pattern

HAK_CL1
Test Pattarn for Carbon

CARBON_CL1
PNLB2319xx-LV
*PCB
RE1
GND
NC: No Components
KX-TGDA20AG1 SCHEMATIC DIAGRAM (Handset_Main)
59
Memo
60
15 Printed Circuit Board

15.1. Base Unit (Main)
LED_VDD
MSG_LED
ANS_LED
KEYS_D
KEYIN3
KEYS_E
KEYIN1
KEYS_C
KEYIN2
R163
C161
R652
R160
C164
C142
R152
R162
D142
D143
R165
R177
PCB
Q161
R133
Q141
PNLB2317Z
Q651
Q652
C651
C152
R651
C652
C650
R151
P101
R131
R145
R141
C184
Q142
C132
R142
+
R503
R504
C519
C520
C101
R510
D101
R502
C102
R506
SW1
C502
C518
L501
C501
R507
C517
C874
C873
C819
C863
C872
C871
C503
L803
C516
C895
C504
C521
D133
C121
C122
IC501
C820
RA151
R121
R122
C506
C505
C8
10
C181
R501
R332
C507
C509
C510
C508
X501
C341
C811
C511
C331
R331
D361
D362
D472
HAK_CL1
C477
D473
C478
KX-TGD210 MAIN BOARD (Base Unit (Component View))
61
15.1.2. Bottom View

for JIG
}
UGND
URX
UTX
UTX
+5.5V
URX
UGND
C171
C167
R164
C173
PCB
R172
C175
R175
C176
IC611
TMS
RA611
R176
TD0
ANT1_Short
ANT1_S-GND
R171
Q171
C178
PNLB2317Z
R168
C611
+3.0V
R112
R115
R114
VDDC
BRN
SA101
Q111
TEL
TCK
L1R
C112
R111
VDDC
RTCK
TDI
+3.0V
STM/CKM/P15
C111
R113
LT1
YLW
C115
C113
IC601
GAP1
C601
ANT1
RSTN
C515
D113
STM/CKM
VREF
C120
GRY
PUR
C513
DCM
R322
R372
IC302
C342
DCP
C321
R371
F301
DC
VCCA
C351
+
R321
SP
BLU
ORG
CHG
KX-TGD210 MAIN BOARD (Base Unit (Bottom View)
62
15.2. Handset
ANT-Short-GND
ANT-Short
BL
UE
LCD_SID
LCD_SCL
LCD_CD
LCD_RESET
LCD_CS
AN
_T
RA
C77 C76
C95
NG
ER
D21
R55
RE
CE
R54
R53
R52
R51
C70
IV
C94
C93
RA
C92
C91
C65
NG
LE
T1
C62 C64 C96

C61 C63
G
RE
EN
D22
C71
CP3V
C79
C73
C72
C78
BLUE
D14
D13
C69
ORANGE
C57
C52
C55
C56
STM
C53 C29
R60
JTAG
IC4
C30
C44
RST
R61
C45
IC1
C59 C98
CP4V
C190
C36
C863
C859
C862 R20
R1
C22
C13 C11
C47
C43
Q1
1.8V
C12
R23 RA7
STB_E
C41
C191 C99
C860 C46
R15
X1
Q6
RA2
KEY_LED
RA3
CKM
C1
SP-PHONE_SPEAKER
RA5
R76
R77
C866
STB_D
POWER
PNLB2319Z
PbF
KIN_3
STB_C
STB_A
STB_B
MIC+ RCV-
KIN_2
CHG_CTRL
MIC- RCV+
Q9
Q4
R6
Q2
KIN_1
R2 C19
R9
R45
C15
R8
CHG+
CHG (+)
Q3
UTX
VBAT
GND
F1
C6
BATT+
URX
BATT+
BATTKIN_4
URX
UTX
GND
BATTERY
BATT-
CHG-
CHG (-)
R7
C5
KX-TGDA20 HANDSET BOARD (Component View)
63
for JIG
15.2.2. Bottom View
LCD
UP
LEFT
LED3
RIGHT
DOWN
LED5
LED2
LED1
LED4
LED6
CARBON_CL1
MIC
KX-TGDA20 HANDSET BOARD (Bottom View)
64
16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)
16.1.1. KX-TGD210
1
2
4
6
5
PCB1
8
A
Ref.No.
Figure
A
2.6 x 8mm
65
16.2. Cabinet and Electrical Parts (Handset)

CUSHION RUBBER
*STICK IT WITHIN THE FRAMEWORK ON P.C.B.
E104
E103
104
E102
E101
115
102
105
103
E105
101
116
MIC100
PCB100
106
107
114
112
109
110
113 (*3)
108
(*2)
105
Battery cover
111
Ref.No.
Spacer (No.113)
Stick it between
Figure
ribs.
Put it in the center.
2 8 mm
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.43).
(*2) The rechargeable Ni-MH battery HHR-4MY is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 113) to the exact location described above.
66
117
16.3. Cabinet and Electrical Parts (Charger Unit)
200
200-1
200-5
200-3
200-2
200-4
67
16.4. Accessories and Packing Materials

16.4.1. KX-TGD210AG1
A4
A3
A1
A2
P1
68
16.4.2. KX-TGD212AG1
A103
A101
A104
A102
P101
69
16.5. Replacement Parts List
16.5.1.2. Main P.C. Board Parts

Note:
(*1) When replacing IC601, C611 or X501, make the
adjustment using PNZZGD210AG1. Refer to How to
download the data (P.49) of Things to Do after
Replacing IC or X'tal (P.49).
(*2) When replacing IC501, refer to How to Replace the
Flat Package IC (P.52).
1. RTL (Retention Time Limited)

Note:
The RTL marking indicates that its Retention Time is
Limited.
When production is discontinued, this item will
continue to be available only for a specific period of
time.
This period of time depends on the type of item, and
the local laws governing parts and product retention.
At the end of this period, the item will no longer be
available.
2. Important safety notice
Components identified by the mark indicates special
characteristics important for safety. When replacing any
of these components, only use specified manufacture's
parts.
3. The S mark means the part is one of some identical parts.
For that reason, it may be different from the installed part.
4. ISO code (Example: ABS-94HB) of the remarks column
shows quality of the material and a flame resisting grade
about plastics.
5. RESISTORS & CAPACITORS
Unless otherwise specified;
All resistors are in ohms () k=1000, M=1000k
All capacitors are in MICRO FARADS (F) p=F
*Type & Wattage of Resistor
Safety
Ref.
No.
PCB1
IC302
IC501
IC611
Q111
Q141
Q142
Q161
Q171
D101
D113
D133
D142
D362
L501
L803
Type
ERC:Solid
ERDS:Carbon
ERJ:Chip
ERX:Metal Film
ERG:Metal Oxide
ER0:Metal Film
RA151
RA611
PQ4R:Chip
ERS:Fusible Resistor
ERF:Cement Resistor
SA101
Wattage
10,16:1/8W 14,25:1/4W
12:1/2W
1:1W 2:2W 3:3W
*Type & Voltage Of Capacitor
Type
ECFD:Semi-Conductor
ECCD,ECKD,ECBT,F1K,ECUV:Ceramic
ECQS:Styrol
ECQE,ECQV,ECQG:Polyester
ECUV,PQCUV, ECUE:Chip ECEA,ECST,EEE:Electlytic
ECQP:Polypropylene
ECQMS:Mica
Voltage
ECQ Type ECQG
ECQV Type
1H:50V
05:50V
2A:100V
1:100V
2E:250V
2:200V
2H:500V
ECSZ Type
0F:3.15V
1A:10V
1V:35V
0J:6.3V
R111
R112
R113
R114
R121
R122
R131
R133
R141
R142
R145
R151
R152
R160
R162
R163
R164
R165
R168
R171
R172
R175
R176
R177
R321
R322
R331
R332
R371
R372
R501
R502
R503
R504
R506
Others
0J :6.3V
1A :10V
1C :16V
1E,25:25V
1V :35V
50,1H:50V
1J
:16V
2A
:100V
16.5.1. Base Unit

16.5.1.1. Cabinet and Electrical Parts
Safety
Ref.
No.
1
2
3
4
5
6
7
8
Part No.
PNKM1547W3
K2ECYZ000002
PQJJ1T039H
PNKE1321Z3
PNJT1191Z
PNBC1562Z1
PNKF1327Y2
PQHA10023Z
Part Name & Description Remarks

CABINET BODY
JACK, DC
JACK, MODULAR
CASE, CHARGE TERMINAL
CHARGE TERMINAL
BUTTON, LOCATOR
CABINET COVER
RUBBER PARTS, FOOT
CUSHION
ABS-HB
PS-HB
PS-HB
70
Part No.
PNWPGD210AGH MAIN
P.C.BOARD
ASS'Y
(RTL)
(ICs)
C0DBEYY00102 IC
C2HBCY000141 IC (*2)
PNWIGD220LAH IC (EEPROM)(*1)
(TRANSISTORS)
2SC6054JSL
TRANSISTOR(SI)
B1ACGP000008 TRANSISTOR(SI)
B1ABDM000001 TRANSISTOR(SI)
TRANSISTOR(SI)
DSC7003S0L
2SC6054JSL
TRANSISTOR(SI)
(DIODES)
B0EDER000009 DIODE(SI)
DA2J10100L
DIODE(SI)
DA2J10100L
DIODE(SI)
DY2J25000L
DIODE(SI)
B0ECKM000008 DIODE(SI)
(COILS)
G1CR10J00010 COIL
G1C2N7Z00009 COIL
(RESISTOR ARRAYS)
EXB24V102JX RESISTOR ARRAYS
(VARISTOR)
J0LE00000047 VARISTOR
(RESISTORS)
PQ4R10XJ104 100k
PQ4R10XJ104 100k
ERJ3GEYJ103 10k
ERJ2GEJ473
47k
ERJ3GEYJ394 390k
ERJ3GEYJ394 390k
PQ4R18XJ106 10M
ERJ3GEYJ334 330k
ERJ3GEYJ104 100k
PQ4R18XJ272 2.7k
ERJ2GEJ222
2.2k
ERJ2GEJ104
100k
ERJ2GEJ134X 130k
ERJ3GEYJ821 820
ERJ3GEYJ273 27k
D0GG390JA007 39
ERJ3GEYJ272 2.7k
ERJ3GEYJ273 27k
ERJ3GEYJ472 4.7k
ERJ2GEJ221
220
ERJ2GEJ684
680k
D0GA392JA015 3.9k
ERJ2GEJ102
1k
ERJ2GEJ102
1k
ERJ2RKF1400 140
ERJ2RKF1000 100
ERJ2RKF6802 68k
ERJ2RKF3302 33k
ERJ8GEYJ1R0 1
ERJ8GEYJ1R0 1
ERJ3GEYJ100 10
ERJ2GEJ103
10k
ERJ2GEJ103
10k
ERJ2GEJ103
10k
ERJ2GEJ103
10k
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
Safety
Ref.
No.
R510
Part No.
ERJ2GEJ103
C101
C102
C111
C112
C113
C120
C121
C122
C132
C142
C152
C161
C167
C171
C173
C175
C176
C178
C184
C321
C341
C342
C351
C501
C502
C503
C504
C505
C506
C507
C508
C509
C510
C511
C513
C515
C516
C517
C518
C519
C520
C521
C611
C810
C811
C819
C820
C863
C871
C872
C873
C874
C895
F1K2H681A008
F1K2H681A008
F1J2A473A024
F1J2A473A024
PQCUV1A684KB
ECUE1H102KBQ
F1K2H681A008
F1K2H681A008
ECUV1H103KBV
ECUV1H103KBV
ECUE1C103KBQ
F1K1E1060001
ECUV1H102KBV
ECUV1C223KBV
ECUE1A104KBQ
ECUE1H561KBQ
ECUE0J105KBQ
ECUV1C333KBV
ECUV1C105KBV
ECUV1C105KBV
F2G0J331A146
ECUE1A104KBQ
ECUV1C105KBV
ECUE1A104KBQ
ECJ1VB0G106M
ECJ1VB0G106M
ECUE0J105KBQ
ECJ1VB0G106M
ECUE0J105KBQ
ECUV0J225KBV
ECUE1H100DCQ
ECUE1H120JCQ
ECUE0J105KBQ
ECJ1VB0G106M
ECUV0J225KBV
ECUE0J105KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE0J105KBQ
ECUE1A104KBQ
F1G1H1R5A765
ECUE1H100DCQ
ECUE1H100DCQ
F1G1H1R5A765
F1G1H1R5A765
F1G1H1R5A765
F1G1H1R3A765
F1G1H2R0A765
ECUE1H150JCQ
F1G1H2R0A765
F301
K5H302Y00003
P101
SW1
X501
D4DAY220A022 THERMISTOR
K0H1BA000259 SPECIAL SWITCH
H0J138500011 CRYSTAL
OSCILLATOR
(*1)
Safety

10k
(CAPACITORS)
680p
680p
0.047
0.047
0.68
0.001
680p
680p
0.01
0.01
0.01
10
0.001
0.022
0.1
560p
1
0.033
1
1
330
0.1
1
0.1
10
10
1
10
1
2.2
10p
12p
1
10
2.2
1
0.1
0.1
0.1
0.1
0.1
1
0.1
1.5p
10p
10p
1.5p
1.5p
1.5p
1.3p
2p
15p
2p
(OTHERS)
FUSE
S
S
S
S
S
Part No.
PNGP1328Z2
PNYE1128Z
PNKM1549Y3
L0AD01A00029
PNYE1129Z
S
S
Safety
Ref.
No.
PCB100
IC1
IC4
IC7
S
Q1
Q2
Q3
Q4
Q6
Q9
LED1
LED2
LED3
LED4
LED5
LED6
RA2
RA3
RA5
RA7
R1
R2
R6
R7
R8
R9
R15
R20
R23
R45
R51
R52
R53
R54
R55
R61
R76
R77

PANEL, LCD
TAPE, DOUBLE SIDED
CABINET BODY
RECEIVER
SPACER, CUSHION LCD
PNBC1560Y2
PNJK1228W
PNMH1308Z
L0AD02A00026
PNHS1502Z
PQJC10056W
PNKF1328Y2
PNHS1079Z
PNKK1038X1

BUTTON, VOLUME KEY
KEYBOARD SWITCH
GUIDE, SPEAKER
SPEAKER
SPACER, SPEAKER NET
BATTERY TERMINAL
CABINET COVER
SPACER, BATTERY
LID, BATTERY
ABS-HB
ABS-HB
ABS-HB
Note:
(*1) Reconfirm the model No. written on the handset's name
plate when replacing PCB100. Because the model No. of
the optional handset may differ from the included handset.
(*2) When replacing IC7 or X1, make the adjustment
using PNZZGD210AG1. Refer to How to download the
data (P.49) of Things to Do after Replacing IC or X'tal
(P.49).
(*3) When replacing the handset LCD, See How to
Replace the Handset LCD (P.43).
(*4) When replacing IC1, refer to How to Replace the Flat
Package IC (P.52).
16.5.2.1. Cabinet and Electrical Parts

Ref.
No.
101
102
103
104
105
Part No.
16.5.2.2. Main P.C. Board Parts
16.5.2. Handset
Safety
Ref.
No.
106
107
108
109
110
111
112
113
114
PMMA-HB
ABS-HB
71
Part No.
PNWPDA20AG1R MAIN
P.C.BOARD
ASS'Y
(RTL) (*1)
(ICs)
C1CB00003837 IC (*4)
C3FBLY000162 IC
PNWIGDA20LAR IC (EEPROM)(*2)
(TRANSISTORS)
B1ADGE000012 TRANSISTOR(SI)
B1ADCF000040 TRANSISTOR(SI)
B1ABGE000011 TRANSISTOR(SI)
B1ADCF000040 TRANSISTOR(SI)
2SC6054JSL
TRANSISTOR(SI)
UNR9216J0L
TRANSISTOR(SI)
(LEDS)
B3ACB0000216 LED
B3ACB0000216 LED
B3ACB0000216 LED
B3ACB0000216 LED
B3ACB0000216 LED
B3ACB0000216 LED
(RESISTOR ARRAYS)
(RESISTORS)
ERJ2GEJ103
10k
ERJ2GEJ303
30k
ERJ2GEJ103
10k
ERJ2GEJ821
820
ERJ8GEYJ4R3V 4.3
ERJ2GEJ303
30k
D0GA152JA021 1.5k
D0GA563ZA006 56k
ERJ2GEJ102
1k
D0GBR10JA113 0.1
ERJ2GEJ103
10k
ERJ2GEJ103
10k
ERJ2GEJ332
3.3k
ERJ2GEJ331
330
ERJ2GEJ331
330
ERJ2GEJ102
1k
ERJ2GEJ1R0
1
ERJ2GEJ1R0
1
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
Safety
Ref.
No.
C1
C5
C6
C11
C12
C13
C15
C19
C22
C29
C30
C36
C41
C43
C44
C45
C46
C47
C52
C53
C55
C56
C57
C59
C69
C70
C71
C78
C79
C91
C92
C93
C94
C95
C96
C98
C99
C190
C191
C859
C860
C862
C863
C866
F1
X1
MIC100
E101
E102
E103
E104
E105
E106
E107
E108
Part No.
16.5.3. Charger Unit
(CAPACITORS)
220
0.1
0.1
0.1
2.2
0.1
39p
0.001
1
1
1
39p
0.1
10p
0.1
0.1
10p
1
1
2.2
10p
1
0.1
1
0.1
68p
68p
0.0022
0.0022
1
1
1
1
1
1
10p
10p
0.1
1
10p
CERAMIC CAPACITOR
CERAMIC CAPACITOR
CERAMIC CAPACITOR
0.1
(OTHERS)
K5H252Y00002 FUSE
16.5.3.1. Cabinet
EEE0JA221WP
ECUV1C104KBV
ECUV1C104KBV
ECUE1A104KBQ
ECUV0J225KBV
ECUE1A104KBQ
ECUE1H390JCQ
ECUE1H102KBQ
ECUE0J105KBQ
ECUE0J105KBQ
ECUV1A105KBV
ECUE1H390JCQ
ECUE1A104KBQ
ECUE1H100DCQ
ECUE1A104KBQ
ECUE1A104KBQ
ECUE1H100DCQ
ECUE0J105KBQ
ECUE0J105KBQ
ECUV1A225KBV
ECUE1H100DCQ
ECUE0J105KBQ
ECUE1A104KBQ
ECUE0J105KBQ
ECUE1A104KBQ
ECUE1H680JCQ
ECUE1H680JCQ
ECUE1H222KBQ
ECUE1H222KBQ
ECUV1C105KBV
ECUV1C105KBV
ECUV1C105KBV
ECUV1C105KBV
ECUV1C105KBV
ECUE0J105KBQ
ECUE1H100DCQ
ECUE1H100DCQ
ECUE1A104KBQ
ECUE0J105KBQ
ECUE1H100DCQ
F1G1H1R1A765
F1G1H1R5A765
F1G1H1R8A765
ECUE1A104KBQ
Safety
Ref.
No.
WLED
PNLC1056S1
200-1
200-2
200-3
200-4
PNKM1550Y3
PNJT1147Z
PNKF1279Z1
PQHA10023Z
200-5
PNLV233AGAZ

CHARGER UNIT ASS'Y
without NAME PLATE
(RTL)(for KX-TGD212AG1)
CABINET BODY
PS-HB
CHARGE TERMINAL
CABINET COVER
PS-HB
RUBBER PARTS, FOOT
CUSHION
AC ADAPTOR
16.5.4.1. KX-TGD210AG1
Safety
Ref.
No.
A1
Part No.
PNLV226AG0Z
AC ADAPTOR
A2
A3
A4
P1
PQJA10075Z
PNKE1054Z1
PNKL1001Y1
PNPK3840001Z
CORD, TELEPHONE
HANGER, BELT CLIP
WALL MOUNT ADAPTOR
GIFT BOX
ABS-HB
ABS-HB
16.5.4.2. KX-TGD212AG1
Safety
Ref.
No.
A101
Part No.
PNLV226AG0Z
AC ADAPTOR
A102
A103
A104
P101
PQJA10075Z
PNKE1054Z1
PNKL1001Y1
PNPK3841001Z
CORD, TELEPHONE
HANGER, BELT CLIP
WALL MOUNT ADAPTOR
GIFT BOX
ABS-HB
ABS-HB
16.5.5. Screws
Safety
Ref.
No.
A
B
Part No.
XTB26+8GFJ
XTB2+8GFJ

TAPPING SCREW
TAPPING SCREW
16.5.6. Fixtures and Tools
H0J103500038 CRYSTAL
OSCILLATOR
(*2)
L0CBAY000053 BUILT IN-MICROPHONE
S
L5DYBYY00067 LIQUID CRYSTAL DISPLAY
(*3)
PNHR1953Z
TRANSPARENT PLATE
PMMA-HB
PNHR1951Z
GUIDE, LCD
ABS-HB
PQHG10729Z
RUBBER PARTS, RECEIVER
PNHX1263Z
COVER, LCD
PNVE1002Z
BATTERY TERMINAL
PNJT1195Z
CHARGE TERMINAL (L)
PNJT1196Z
CHARGE TERMINAL (R)
Part No.
Part No.
16.5.4. Accessories and Packing Materials
Note:
(*1) See Equipment Required (P.44), and The Setting
Method of JIG (P.44)
(*2) When replacing the Handset LCD, See How to
Replace the Handset LCD (P.43)
Safety
Ref.
No.
Part No.
PQZZ1CD300E
JIG CABLE (*1)
PNZZGD210AG1 BATCH FILE CD-ROM (*1)
PQZZ430PIR
TIP OF SOLDERING IRON
(*2)
PQZZ430PRB
RUBBER OF SOLDERING IRON
(*2)
16.5.2.3. LED Board Parts

Safety
Ref.
No.
200
B3AFB0000370 LED
RAD
KXTGD210AG1
KXTGD212AG1
KXTGDA20AG1
72

Service Manual KX Tgd210ag1

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Configuration for each model

Base Unit Handset Charger Unit

Panasonic System Networks Co., Ltd. 2014

IMPORTANT SAFETY NOTICE

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

For Service Technicians

1. Danger of explosion if battery is incorrectly replaced.

About Lead Free Solder (PbF: Pb free)

Remove all of the

Suggested PbF Solder

Standby: Approx. 0.6 W (*1)

Approx. 143 mm x 103 mm x 48 mm(*1)

Approx. 140 g (*1)

Rechargeable Ni-MH battery

Standby: Approx. 0.1 W,

Note for Service:

TDD Frame Format

Up Link ( Handset -> Base Unit )

Down Link ( Base Unit -> Handset )

DATA rate : 1.152 Mbps

Signal Flowchart in the Radio Parts

KX-TGD210/212 BLOCK DIAGRAM (Base Unit_Main)

Operational P.C. Board

Block Diagram (Base Unit_Main)

Block Diagram (Base Unit_RF Part)

KX-TGD210/212 BLOCK DIAGRAM (Base Unit_RF Part)

Circuit Operation (Base Unit)

TDD & TDMA

Digital TAM System *1

BBIC (Base Band IC: IC501)

Voice Message Recording/Play back

Following information data is stored.

Power Supply Circuit/Reset Circuit

BBIC chip initialize

The voltage from the AC adaptor is supplied to the charge circuits.

Telephone Line Interface

Telephone Line Interface Circuit:

Parallel Connection Detect Circuit/Auto Disconnect Circuit

Calling Line Identification (Caller ID)/Call Waiting Caller ID

Single message format

Silent interval 4 sec

Plural message format

DATA CODE NAME

Call Waiting Caller ID

Q2, Q3, Q4,

11, 12, 13, 14, 55

57, 58, 59, 60

KX-TGDA20 BLOCK DIAGRAM (Handset)

47, 48, 51, 53 QSPI-IO 0-3

Block Diagram (Handset)

Circuit Operation (Handset)

Power Supply Circuit/Reset Circuit

DC+(5.5 V) R371 R372 D362 CHARGE+(Base) CHARGE+(Handset)

Battery Low/Power Down Detector

MIC (+) - C13 - IC1 (17)

MIC (+) - C13 - IC1 (17)

C859 - ANT to BASE

---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - C184 - Q161 - Q141

MIC (+) - C13 - IC1 (17)

C859 - ANT to BASE

---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47- 73/74) - IC601

IC601 - IC501(73/74 - 28) - C184 - Q161 - Q141 - D101 - P101