5060 MGC-8 Hardware Guide

Title page
Alcatel-Lucent Gateway Platform

Release 8.0.1
Hardware Guide for 5060 MGC-8
255-400-209R8.0.1
ISSUE 3
JUNE 2010
Legal notice
Legal notice
Alcatel, Lucent, Alcatel-Lucent and the Alcatel-Lucent logo are trademarks of Alcatel-Lucent. All other trademarks are the property of their respective
owners.
The information presented is subject to change without notice. Alcatel-Lucent assumes no responsibility for inaccuracies contained herein.
Copyright 2010 Alcatel-Lucent. All rights reserved.
Notice
Every effort has been made to ensure that the information in this document was complete and accurate at the time of printing. However, information is
subject to change.
Safety
Always observe the Safety Instructions when operating the system.

Ordering information
The ordering number of this document is 255-400-209

Technical support
Please contact your Alcatel-Lucent Services Business Group (SBG) for technical questions about the information in this document.
Contents
About this document
Purpose
.......................................................................................................................................................................................... xiii
xiii
Reason for revision
................................................................................................................................................................... xiii
xiii
Audience ........................................................................................................................................................................................ xiv

xiv
Part number
.................................................................................................................................................................................. xiv
xiv
Document organization
............................................................................................................................................................ xiv
xiv
Relationship between documents
.......................................................................................................................................... xv
xv
Contact information ................................................................................................................................................................ xviii

xviii
How to comment .......................................................................................................................................................................... xx
xx
1
Platform description
Overview ....................................................................................................................................................................................... 1-1
1-1
Platform design ........................................................................................................................................................................... 1-2
1-2
Hardware components
Overview ....................................................................................................................................................................................... 2-1
2-1
Cabinet (NRA244AA)
Chassis (SAV2AB)
............................................................................................................................................................. 2-2
2-2
.................................................................................................................................................................... 2-4
2-4
OAM server (NBRZAL) ....................................................................................................................................................... 2-13

2-13
Hub (NBMASW1)
.................................................................................................................................................................. 2-14
2-14
Processor blade (FM016JB or FM016JP)
..................................................................................................................... 2-17
Rear Transition Modules (NASYS or RPCMHDDA)
............................................................................................... 2-19
Shelf management controller (NBSHMC) ..................................................................................................................... 2-23

Power supply ............................................................................................................................................................................. 2-26
2-26
Fillers
........................................................................................................................................................................................... 2-29
2-29
....................................................................................................................................................................................................................................
255-400-209R8.0.1
iii
Issue 3 June 2010
Contents
....................................................................................................................................................................................................................................
OAM server hardware details

Overview ....................................................................................................................................................................................... 3-1
3-1
OAM server module
................................................................................................................................................................. 3-2
3-2
Hardware details ......................................................................................................................................................................... 3-3

3-3
Hardware description
Front panel ports
4
............................................................................................................................................................. 3-11
3-11
...................................................................................................................................................................... 3-12
3-12
Hub hardware
Overview ....................................................................................................................................................................................... 4-1
4-1
4-2
Hardware architecture
.............................................................................................................................................................. 4-9
4-9
Hub RTM .................................................................................................................................................................................... 4-10

4-10
Front panel ports
5
...................................................................................................................................................................... 4-12
4-12
Processor blade hardware

Overview ....................................................................................................................................................................................... 5-1
5-1
5-2
.............................................................................................................................................................. 5-9
5-9
Processor blade RTM
............................................................................................................................................................. 5-10
5-10
Front panel ports
...................................................................................................................................................................... 5-12
5-12
SS7 AMC module

6
................................................................................................................................................................... 5-14
5-14
Cabling and connections

Overview ....................................................................................................................................................................................... 6-1
6-1
Hardware connections
.............................................................................................................................................................. 6-2
6-2
Wiring for 5060 MGC-8 ports

7
.............................................................................................................................................. 6-3
Part information
Overview ....................................................................................................................................................................................... 7-1
7-1
Chassis system components
................................................................................................................................................... 7-2
7-2
....................................................................................................................................................................................................................................
255-400-209R8.0.1
iv
Issue 3 June 2010
Contents
....................................................................................................................................................................................................................................
CLEI codes ................................................................................................................................................................................... 7-4

7-4
Field Replaceable Units ........................................................................................................................................................... 7-5
7-5
Customer documentation
........................................................................................................................................................ 7-7
7-7
Glossary
Index
....................................................................................................................................................................................................................................
255-400-209R8.0.1
v
Issue 3 June 2010
List of tables
1
Reason for reissue
..................................................................................................................................................... xiii
xiii
Manuals and part numbers
Other documentation
1-1
Chassis slot description
1-2
Cabinet configuration components
1-3
Module list
2-1
Cabinet dimensions ................................................................................................................................................... 2-3

2-3
2-2
Chassis slots ................................................................................................................................................................. 2-5

2-5
2-3
Chassis dimensions
2-4
Environmental specifications
2-5
Chassis power specifications ................................................................................................................................. 2-7
2-6
Functions of physical components
2-7
Fan tray dimensions
2-8
Processor blade dimensions
2-9
Hub dimensions
2-10
Shelf management controller dimensions
3-1
OAM server module physical specifications ................................................................................................... 3-5
3-2
OAM server module interfaces
3-3
OAM server with AMC - front panel ports
3-4
Management LEDs for OAM server with AMC
3-5
X3401 and 3501 pin assignment
3-6
X3402 pin assignment
........................................................................................................................................... 3-12
3-7
........................................................................................................................................... 3-13
....................................................................................................................................... xv
............................................................................................................................................... xvii
xvii
........................................................................................................................................... 1-5
1-5
..................................................................................................................... 1-6
................................................................................................................................................................... 1-6
1-6
................................................................................................................................................... 2-7
2-7
................................................................................................................................ 2-7
...................................................................................................................... 2-8
............................................................................................................................................... 2-12
2-12
................................................................................................................................ 2-13
....................................................................................................................................................... 2-15
2-15
...................................................................................................... 2-25
............................................................................................................................ 3-7
................................................................................................... 3-10
......................................................................................... 3-10
....................................................................................................................... 3-12
....................................................................................................................................................................................................................................
255-400-209R8.0.1
vii
Issue 3 June 2010
List of tables
....................................................................................................................................................................................................................................
3-8
CPU debug connector pins
.................................................................................................................................. 3-13
3-9
IPMC debug connector pins ................................................................................................................................ 3-14
4-1
Hub physical specifications
4-2
Hub I/O interfaces
4-3
Hub front panel ports
4-4
Hub management LEDs
4-5
Hub port reservations ............................................................................................................................................. 4-12
4-6
Ethernet port X3401 and 3501 pin assignment
4-7
........................................................................................................................................... 4-13
4-8
........................................................................................................................................... 4-14
4-9
4-10
5-1
Processor blade physical specifications ............................................................................................................. 5-3
5-2
Processor blade interfaces
5-3
Processor blade front panel ports ......................................................................................................................... 5-6
5-4
Management LEDs for processor blade
5-5
Processor blade configuration options
5-6
........................................................................................................................................... 5-12
5-7
........................................................................................................................................... 5-12
5-8
5-9
5-10
Processor blade front panel ports
...................................................................................................................... 5-14
6-1
Single-chassis port designations
.......................................................................................................................... 6-3
6-2
Cables for single-chassis configuration ............................................................................................................. 6-3
7-1
Chassis system components ................................................................................................................................... 7-2
7-2
Cabinet system components
7-3
CLEI Codes
................................................................................................................................... 4-3
..................................................................................................................................................... 4-5
4-5
............................................................................................................................................... 4-8
.......................................................................................................................................... 4-8
............................................................................................ 4-13
.................................................................................................................................. 4-14
...................................................................................................................................... 5-5
............................................................................................................ 5-7
............................................................................................................... 5-8
.................................................................................................................................. 5-13
.................................................................................................................................. 7-3
................................................................................................................................................................. 7-4
7-4
....................................................................................................................................................................................................................................
255-400-209R8.0.1
viii
Issue 3 June 2010
List of tables
....................................................................................................................................................................................................................................
7-4
List of Field Replaceable Units
............................................................................................................................ 7-5
....................................................................................................................................................................................................................................
255-400-209R8.0.1
ix
Issue 3 June 2010
List of figures
1-1
5060 MGC-8/VSG single-chassis configuration
........................................................................................... 1-5
2-1
Cabinet (NRA244AA)
2-2
ATCA chassis (SAV2AB) photograph
2-3
Functional single-chassis configuration
2-4
Chassis front view
2-5
Chassis top view
2-6
Hub front panel
2-7
Processor blade front panel
2-8
Hub RTM front panel
2-9
Processor blade RTM (RPCMHDDA)
2-10
Shelf manager front panel
2-11
Power Distribution Unit (SAPDUAA) ............................................................................................................ 2-27
2-12
Alarm module (RALARMAA)
3-1
OAM server architecture overview ..................................................................................................................... 3-4
3-2
OAM server side view and front panel .............................................................................................................. 3-5
3-3
OAM server front panel
3-4
CPU and IPMC Debug connector
4-1
Hub side view and front panel
4-2
Hub front panel ........................................................................................................................................................... 4-7

4-7
4-3
Hub architecture overview
4-4
Hub RTM front view .............................................................................................................................................. 4-11
4-5
5-1
Processor Blade (FM016JB or FM016JP) ........................................................................................................ 5-3
............................................................................................................................................. 2-2
............................................................................................................... 2-4
............................................................................................................ 2-6
..................................................................................................................................................... 2-9
2-9
...................................................................................................................................................... 2-11
2-11
........................................................................................................................................................ 2-16
2-16
................................................................................................................................. 2-18
............................................................................................................................................ 2-20
............................................................................................................ 2-22
.................................................................................................................................... 2-24
.......................................................................................................................... 2-28
.......................................................................................................................................... 3-9
..................................................................................................................... 3-13
.............................................................................................................................. 4-3
..................................................................................................................................... 4-9
..................................................................................................................... 4-14
....................................................................................................................................................................................................................................
255-400-209R8.0.1
xi
Issue 3 June 2010
List of figures
....................................................................................................................................................................................................................................
5-2
Processor blade architecture overview
.............................................................................................................. 5-9
5-3
Processor blade RTM front panel
...................................................................................................................... 5-11
5-4
..................................................................................................................... 5-13
....................................................................................................................................................................................................................................
255-400-209R8.0.1
xii
Issue 3 June 2010
About this document

About this document
Purpose
The Alcatel-Lucent Gateway Platform Hardware Guide for the 5060 MGC-8,
(255-400-209) is part of the overall Alcatel-Lucent Gateway Platform switch
documentation set. It is referred to as the Hardware Guide throughout this manual.
The Hardware Guide provides an overview of the switch and its features. Descriptions
and illustrations of the switch hardware are included, along with system specifications,
site engineering information, interconnect drawings, part numbers, and ordering
information for all hardware.
This section describes the Hardware Guide, how it relates to other manuals within the
switch documentation set, and reasons for reissuing this document. The following topics
are described in this introduction:
Reason for Reissue
Scope and Audience

Hardware Guide Organization
Using the CD-ROM
Relationship Between Manuals

Documentation Set
Reason for revision
This is Issue 1 of the Alcatel-Lucent Gateway Platform 5060 MGC-8/VSG Hardware

Guide.
Table 1
Reason for reissue
Chapter/Section
Description
Issue 3
Throughout
Changed product name 5060 MGC-8/VSG to 5060

MGC-8
Issue 2
...................................................................................................................................................................................................................................
255-400-209R8.0.1
xiii
Issue 3 June 2010
About this document

....................................................................................................................................................................................................................................
Table 1
Reason for reissue
(continued)
Chapter/Section
Description
Throughout
Minor edits
All
Issue 1
Audience
This manual is intended for personnel who are responsible for or who help to plan for the
installation, ordering, replacing, handling, and provisioning of the switch equipment using
TL1 commands and/or the 1310 OMC-P interface. These personnel must have a thorough
knowledge of telecommunications.
Note: The 1310 OMC-P interface sometimes refers to the modules in the switch as
cards. This document refers to such equipment as I/O module, IOM, or module. When
ordering modules, the name of the module, as listed in Chapter 6, Part Information,
should be used.
Part number
The part number for this guide is 255-400-209.

Document organization
This Hardware Guide contains an overview of all hardware supported by and needed to
run the Alcatel-Lucent Gateway Platform switch.
In addition to providing an overview of hardware needed to support the Alcatel-Lucent
Gateway Platform switching system, the Hardware Guide also contains the following
information:
A description of the switch manuals and Hardware Guide organization, general

information about the switch documentation, and information for contacting
Alcatel-Lucent technical services.
Physical dimensions and power and wire information about switch hardware.
Rack and physical locations of the front and rear modules, protection slots, LEDs,
push buttons, fan tray, fan filter, rear cables, and power and ground locations.
Building requirements, chassis dimensions, space requirements, grounding
requirements, power requirements, system interfaces, slot assignments, tools and test
equipment, an Installation Planning Checklist, and the switch configuration.
Parts information, which provides a list of part numbers for every switch-related
product which can be ordered.
For information regarding initial engineering, monitoring, and re-engineering for growth
in existing applications, refer to the Alcatel-Lucent Gateway Platform System Capacity,
Monitoring, and Engineering (SCME) Guidelines, (255-400-005).
....................................................................................................................................................................................................................................
255-400-209R8.0.1
xiv
Issue 3 June 2010
About this document

....................................................................................................................................................................................................................................
Relationship between documents
The Hardware Guide contains information and many illustrations of the hardware
components that must be provisioned before you can use the switch. Therefore, the
Hardware Guide is mostly independent of all other Alcatel-Lucent Gateway Platform
documentation, although other documentation may be useful during actual installation
and provisioning procedures. Descriptions and illustrations of IOMs, cables, and other
hardware encountered are contained within the Hardware Guide.
While the Alcatel-Lucent Gateway Platform TL1 Commands Reference Guide,
(255-400-xxx) has no direct correlation to the Hardware Guide, it does contain the TL1
commands needed to provision the hardware and software for the switch and its
components. The same can be said about the 1310 OMC-P documentation, as it is specific
to provisioning the switch via the 1310 OMC-P interface.
The Alcatel-Lucent Gateway Platform System Capacity, Monitoring, and Engineering
(SCME) Guidelines, (255-400-xxx) contains information that supports planning for the
number of required modules and the number of required switches in the network. Careful
attention to this document ensures the appropriate system hardware sizing.
Table 2, Manuals and part numbers (p. xv), lists the standard set of Alcatel-Lucent
Gateway Platform documentation, their part numbers, and a brief description. Other
manuals, which are available upon purchase of additional software, are listed in Table 3,
Other documentation (p. xvii).
Table 2
Product
Part
Number
Alcatel-Lucent Gateway Platform Operations

Guide
255-400000
Contains the platform

provisioning procedures for the
Alcatel-Lucent GP.
Alcatel-Lucent Gateway Platform

Maintenance and Diagnostic Procedures Guide
255-400001
Contains procedures for adding

and upgrading modules, and for
diagnosing error messages on
the the Alcatel-Lucent GP.
Alcatel-Lucent Gateway Platform Alarms and

Troubleshooting Procedures Guide
255-400019
Contains procedures for

troubleshooting and clearing
switch alarms on the
Alcatel-Lucent GP.
Alcatel-Lucent Gateway Platform TL1

Commands Reference Guide
255-400002
Contains a description of all the

TL1 commands needed to
provision the Alcatel-Lucent
GP platform, functional entities
and services.
Product Description
....................................................................................................................................................................................................................................
255-400-209R8.0.1
xv
Issue 3 June 2010
About this document

....................................................................................................................................................................................................................................
Table 2
(continued)
Product
Part
Number
Alcatel-Lucent Gateway Platform Hardware

Guide
255-400003
Contains the information

necessary for designing an
installation site including:
hardware specifications;
cabling schematics; and
cabling, floor plan,
environmental and power
requirements.
Alcatel-Lucent Gateway Platform System

Capacity, Monitoring, and Engineering
(SCME) Guidelines
255-400005
Contains Alcatel-Lucent GP
engineering rules, system
monitoring information, critical
triggers and measurements,
geographic redundancy
information, and ethernet
interfacing, IP addressing and
SS7 transport provisioning.
Alcatel-Lucent Gateway Platform Release

Notes
255-400006
Contains new features and

feature enhancements, new and
modified TL1 commands,
hardware and software
limitations and other important
release-specific information for
the Alcatel-Lucent GP.
Alcatel-Lucent Gateway Platform Feature

Guide
255-400012
Contains detailed feature

descriptions for existing and
new features supported by the
Alcatel-Lucent GP.
Alcatel-Lucent Gateway Platform Software

Change Procedure Guide
255-400013
Contains procedures for

upgrading and downgrading,
and for provisioning for
geographic redundancy on the
Alcatel-Lucent GP.
Product Description
....................................................................................................................................................................................................................................
255-400-209R8.0.1
xvi
Issue 3 June 2010
About this document

....................................................................................................................................................................................................................................
Table 3
Other documentation
Product
Part
Number
1310 OMC-P for Alcatel-Lucent GP

Management User Guide
255-400400
Contains 1310 OMC-P

provisioning reference
information.
1310 OMC-P Installation and Upgrade Guide
255-400401
Contains installation
information for installing the
1310 OMC-P software on a Sun
workstation.
1310 OMC-P Software Release Notice
255-400402

feature enhancements, software
the OMC-P.
Alcatel-Lucent Gateway Platform Billing and

Traffic System (BTS) User's Guide
255-400403
Contains installation, upgrade,

and applications procedures for
the BTS.
Alcatel-Lucent Gateway Platform BTS

Release Notes
255-400404

feature enhancements, software
the BTS.
1310 OMC-P Server, BTS Server, and ATC

Server Security Guidelines
255-400417
Contains suggested security

guidelines for system
administrators using the
OMC-P server, BTS server and
ATC server.
1310 OMC-P Web API User's Guide
255-400419
Contains reference information

for the Web API application.
1310 OMC-P for the Alcatel- Lucent GP

Control Platform User Guide for Managing the
5420 Converged Telephony Server (CTS) and
the 5450 IP Session Control (ISC)
255-400420
Describes functions available

from the GUI used to provision
and manage the Alcatel-Lucent
CP
1310 OMC-P for the Alcatel-Lucent GP

Personal Communication Manager
255-400600
Describes functions available

from the GUI used to provision
and manage an Alcatel-Lucent
CM system.
1310 OMC-P Advanced Reporting System

User Guide
255-400200
Contains ARS provisioning

information.
Product Description
....................................................................................................................................................................................................................................
255-400-209R8.0.1
xvii
Issue 3 June 2010
About this document

....................................................................................................................................................................................................................................
Table 3
Other documentation
(continued)
Product
1310 OMC-P Advanced Reporting System and
Advanced Traffic Collector Installation and
Upgrade Guide
Part
Number
255-400201
Product Description
Contains installation and
upgrade information for the
ARS software.
Contact information
Installation support
On-site installation support is provided during the installation of the initial release and, if
necessary, during an upgrade. An Alcatel-Lucent Installation Technician will be on site
with you to perform the installation on a previously scheduled date.
Note: Most upgrades are done remotely.
The Alcatel-Lucent Installation Technician may arrange for a third-party installation
contractor to help with the installation, if necessary.
The Alcatel-Lucent Installation Technician will verify acceptance of the installation with
you by obtaining your signature on an acceptance form.
Questions about the Alcatel-Lucent installation support should be directed to your
Alcatel-Lucent Services Customer Team.
Technical support
The Services Business Group (SBG) provides customer support for the switch 24 hours a
day, 7 days a week.
SBG uses an Action Request (AR) system to assign, document, track, and report all
customer call activity. All calls are assigned an AR number and are fully documented in
the system, no matter what the level of severity.
Calls usually fall into one of several categories:
Calls that can be solved on the telephone at the time of the call
Calls that inquire about returning hardware
Calls that require escalation
Complaints
When a call is first received, it must be determined whether the call is a new call or an
open call. If it is a new call, an AR number is assigned immediately, and the information
entered into the system. If the call is in reference to an open call, you must know the AR
number so that SBG can retrieve the AR information.
Calls That can be Solved Immediately
....................................................................................................................................................................................................................................
255-400-209R8.0.1
xviii
Issue 3 June 2010
About this document

....................................................................................................................................................................................................................................
After determining whether the call is new or open, the SBG may be able to solve the
problem while you are on the telephone. In this case, the SBG will document the
resolution and close the call. Every effort will be made to resolve the issue on the first
call.
Calls for Returning Hardware
Switch components being returned for repair or replacement must be processed through
the Alcatel-Lucent RMA procedures. A hardware repair is defined as an item returned to
Alcatel-Lucent due to a failure, with the returned item being repaired and returned to you,
the customer. All hardware components and I/O modules are described in the section
Hardware Description.
Calls That Require Escalation
When a call is received and an action request number is assigned, a level of severity is
also determined. Levels of severity are categorized as follows:
Level of Severity
Symptom
Examples
Minor
Problem does not

significantly impair
function of the system
Requests for system service, equipment,

documentation, training, information, or
routine maintenance
Major
Conditions that seriously

affect system operation
Short system outages, reduction in

measurement function
Critical
Affects service
Total system failure, reduction in capacity

or traffic handling capability
If personnel are not immediately available when a call is received, your call will be
returned according to the severity assigned. For instance, a minor call is returned within
eight hours, and a major call within four hours. If the call is critical, you will be placed on
hold until an SBG engineer can be located.
You may, at any time, ask that the issue be escalated to management. The SBG will then
notify the appropriate manager. If required, on-site technical support will be provided
within 24 hours of a customer request.
Complaints
Customers have the ability to submit complaints by entering an action request via the
Alcatel-Lucent CARES Trouble tracking system athttp://www.alcatel-lucent.com/support/
(http://www.alcatel-lucent.com/support/). However, if you have an engineering complaint,
you must file form EO-143, in accordance with GR-230-CORE. Engineering complaints
will also be recorded in the AR system, but acknowledgement of form EO-143 will be
made by returning an acknowledgement report, form 79-7020-ECCnfrmtn, by the end of
the working day following receipt of the complaint.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
xix
Issue 3 June 2010
About this document

....................................................................................................................................................................................................................................
Regular and engineering complaints will be handled by an assigned department, with the
SBG Manager monitoring the engineering complaint until the issue is resolved.
Closing Action Requests
ARs will only be closed when all deliverables required to resolve the AR, such as
information, documentation, and software, are provided.
RMA procedure
You may identify equipment that needs to be repaired or replaced. Alcatel-Lucent is

pleased to offer comprehensive hardware repair and exchange services. For contact
information for your service, product, and location, refer to
http://support.lucent.com/portal/rmaForm.doc.
Using the method of contact shown at the site (either online or by phone) for the different
services will ensure the most timely handling of your request.
How to comment
....................................................................................................................................................................................................................................
255-400-209R8.0.1
xx
Issue 3 June 2010
1
Overview
Purpose
The 5060 MGC-8/VSG is a hardware and software platform compliant with Advanced
Telecommunications Computing Architecture (ATCA) standards. This chapter provides
an overview of the standards and the application of these standards to the 5060
MGC-8/VSG hardware.
Contents
Platform design
1-2
...................................................................................................................................................................................................................................
255-400-209R8.0.1
1-1
Issue 3 June 2010
Platform design
....................................................................................................................................................................................................................................
Platform design
ATCA standards
The 5060 MGC-8/VSG is a standardized platform for the telecommunications industry

based on the Advanced Telecommunication Architecture (ATCA). The 5060 MGC-8/VSG
platform can support multiple applications which are not hardware-dependent. The open
architecture enables high performance computing and telecommunication solutions,
hence offering improved carrier-grade performance, and consequently, better reliability,
manageability and serviceability.
Standard design
Alcatel-Lucent follows the practice of standards-based design which reduces

incompatibility across operating systems, locations, and environments.
The ATCA PICMG 3.0 standard prescribes the mechanical dimensions for plug-in blades,
a printed circuit blade, and a faceplate (Height 8 U and Width 280 mm / 11.032 inches).
The blade pitch is 6 hp (1.2 inches, or 30.48 mm). The blades connect to the standard
ATCA backplane connectors and to the rear transition modules (RTMs). The connector
provides the interfaces between the ATCA backplane and the various nodes and fabric
switches.
Design implications
The 5060 MGC-8/VSG is based on the ATCA platform which is characterized by its
ability to support high capacity telecommunications applications.
The benefits of the platform, which are a result of its advanced architecture and design,
include:
Power dissipation up to 300W per blade

Higher component density (RAM capacity similar to the rack-mounted server
capacity)
Redundant data-plane which facilitates discrete transport for control plane and user
plane
Bandwidth between slots: 2 GBit/s in compliance with PICMG 3.1
-48 V / 60 V power supply distributed on each blade
....................................................................................................................................................................................................................................
255-400-209R8.0.1
1-2
Issue 3 June 2010
Platform design
....................................................................................................................................................................................................................................
Certification
The 5060 MGC-8/VSG platform has certifications for the entire platform architecture
including specifications for PICMG 3.0, as well as ETSI and EBS Level 3 certifications.
The 5060 MGC-8/VSG platform adheres to the following standards:
PICMG 3.0, EC 001 and EC 002

PICMG 3.1
AMC.0 for the Mezzanine module
AMC.1 for PCI Express

AMC.3 for storage
IPMI
SA Forum OpenHPI
Safety according to PICMG 3.0 (IEC60950, E60950, UL60950)
EMC enables PICMG 3.0 at chassis level
All configurations are certified for EBS Level 3, Earthquake Zone 4.
NOTE: Use of the term EBS implies global physical design environmental and safety
standards, including Telcordia EBS, ETSI, Verizon EBS and TCG.

ATCA hardware elements
The platform hardware is a combination of the chassis, blades, and a single-blade

computer that performs hardware management, platform diagnostics, and switching
control interface services on the platform operating system.
The ATCA base platform offers a consistent set of deliveries which are independent of
middle-ware. The implementation of the ATCA platform can create an ecosystem which
encompasses most of the core applications offered by Alcatel-Lucent, hence enabling
smooth product integration and convergences.
The ATCA platform hardware broadly comprises the following hardware elements
classified on the basis of their functionality:
Processing elements
Storage elements
Switching elements
Implementation rules
The following rules apply to the hardware implementation in the 5060 MGC-8/VSG
chassis:
....................................................................................................................................................................................................................................
255-400-209R8.0.1
1-3
Issue 3 June 2010
Platform design
....................................................................................................................................................................................................................................
Functions
Three blade types and two RTMs fulfull the functions in this release as follows:
Hub function - Hub (NBMASW1)

OAM function - Processor blade (NBRZAL)
Traffic function - Processor blade (FM016JB)
SS7 function - Processor blade (FM016JP) + RTM (RPCMHDDA)
Shelf controller
Two Shelf Management Controllers (ShMC) are mandatory per chassis and they must be
installed in slots M16 and M15 respectively.
Fan trays
A top fan tray and bottom fan tray are required for each chassis.
Mechanical parts
The following mechanical parts are mandatory for each chassis:
1- 3U bottom deflector and 1 - 4U deflector

1 - front air filter
1 - rear air filter
1 - front cable tray
1 - rear cable tray
Hub function
The following parts are required to fulfill this function:
2 - Ethernet blades installed in the M07 and M08 slots in the chassis.
2 - Rear Transmission Modules (RTMs) (NASYS) installed in the M67 and M68
slots.
Unused slots
Unused board slots must always be filled by a Front Filler (NBFILL) and unused RTM
slots must be filled by an RTM filler (NAFILL).
Configurations
This release supports both a stand-alone configuration and a 1-chassis configuration in a

cabinet. The stand-alone configuration does not include a PDU or an alarm board. A
cabinet configuration with one chassis does require both a PDU and an alarm board.
The single-chassis configuration is supported for the 5060 MGC-8/VSG platform. This
figure shows an example of a single-chassis configuration.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
1-4
Issue 3 June 2010
Platform design
....................................................................................................................................................................................................................................
Figure 1-1 5060 MGC-8/VSG single-chassis configuration
FMD16BC
NBRZAL
NBRZAL
FMD16BC
FMD16BC
NBDM14
NBDM14
NBDM14
NBDM14
NBDM14
NBDM14
3CMO2685
ABAA
3CMO2685
ABAA
3CMO2685
ABAA
3CMO2685
ABAA
3CMO2685
ABAA
BS0815U
OKJJ
BS0815U
OKJJ
BS0815U
OKJJ
GE1
BS0815U
OKJJ
GEO
BS0815U
OKJJ
GE1
GE1
GEO
NBFILL
12
3CM02578
AAAC
NBFILL
13
3CM02578
AAAC
NBFILL
3CM02578
AAAC
NBFILL
14
3CM02578
AAAC
NBFILL
GE1
NBAFIM
NBAFIM
NBFILL
11
3CM02660
AAAD04
NBAFIM
GEO
NBMASW1
NBAFIM
10
3CM02660
AAAD04
BS0815U
OKJJ
GEO
9
3CM02660
AAAD04
NBMASW1
FMD16BC
3CMO2685
ABAA
8
3CM02660
AAAD04
3CMO2859
ALAB03
3CMO2859
ALAB03
NBAFIM
NBAFIM
CP
CP
CI
CI
NBSHMC
3CMO2741
AAAB
3CMO2741
AAAB
RST
RST
RST
Pwr
A/S
3CMO2741
AAAB
RST
F
E
T
H
O
3CMO2741
AAAB
RST
RST
GEO
GE1
GEO
GE1
GEO
GE1
GEO
GE1
GE2
GE3
GE2
GE3
GE2
GE3
GE2
GE3
GE4
GE5
GE4
GE5
USB
Base T
USB
Base T
1
2
C
R
S
Lk F
Ac 0
Lk F
Ac 1
CP
CP
CP
H/S
CP
USB
USB
CP
CP
CI
CI
NBSHMC
USB
USB
U
P
L
0
U
P
L
0
U
P
L
1
U
P
L
1
Pwr
A/S
F
E
T
H
O
USB
USB
1
2
C
R
S
Lk F
Ac 0
Lk F
RST
RST
Ac 1
H/S
B50847
UE 1R5
B50847
UE 1R5
BS0847
UE 22L
BS0847
UE 22M
The following table describes the contents and function of each slot shown in the Chassis
Front graphic.
Table 1-1
Slot
Number
Chassis slot description

Module description
Mnemonic
Module function
1-2
OAM Server
NBRZAL
Monitors chassis,
Traffic blades, and
Switch hubs
3-6
Processor Blade
FM016JB or FM016JP
Traffic
7-8
Ethernet Switch
NBMASW1
Switch Hub
9 - 14
Board Filler
NBFILL
Traffic growth
ShMC
NBSHMC
Shelf control
management
15
....................................................................................................................................................................................................................................
255-400-209R8.0.1
1-5
Issue 3 June 2010
Platform design
....................................................................................................................................................................................................................................
When a cabinet is being used in the configuration, the following items are required in
addition to the Base Requirements shown in Chassis system components (p. 7-2).
Table 1-2
Cabinet configuration components
Part Number
Quantity
Mnemonic
Description
3CM02769AA
NRA244AA
AL5 Cabinet
3CM03649AA
KMPJ1
generic mounting kit
3CM02902AA
SAPDUAA
PDU
3CM02949AA
RALARMAA
Alarm board
3CM03235AA
MABAFBAA
Bottom air deflector
3CM03302AA
MABAF4AA
Middle air deflector
3CM02588AA
MABAFTAA
Top air deflector
Modules
This section provides a list of the 5060 MGC-8/VSG modules.

Table 1-3
Module list
Module
Part number
Mnemonic
Hub Switch 1GB
3CM02660CA
NBMASW1
OAM Server with 1HDD 147G 8GB Memory
3CM02859CL
NBRZAL
Processor Blade 16GB
3CM03285JB
FMO16JB
Processor Blade 16GB with SS7
3CM03285JP
FMO16JP
RTM Synchro & Switching
3CM02570AA
NASYS
RTM 8E1/T1 75/120 + 1xHDD 300G
3CM02682AA
RPCMHDDA
Shelf Manager Board of ATCA Shelf
3CM02418AA
NBSHMC
....................................................................................................................................................................................................................................
255-400-209R8.0.1
1-6
Issue 3 June 2010
Hardware components
2
Overview
Purpose
This chapter provides an overview of the hardware components of the 5060 MGC-8/VSG
platform.
Contents
Cabinet (NRA244AA)
2-2
Chassis (SAV2AB)
2-4
OAM server (NBRZAL)
2-13
Hub (NBMASW1)
2-14
2-17
2-19
Shelf management controller (NBSHMC)
2-23
Power supply
2-26
Fillers
2-29
...................................................................................................................................................................................................................................
255-400-209R8.0.1
2-1
Issue 3 June 2010
Hardware components
Cabinet (NRA244AA)
....................................................................................................................................................................................................................................
Cabinet (NRA244AA)
Overview
The configuration consists of one chassis within a cabinet.

This configuration has the following requirements:
Single 44U enclosed cabinet

One ATCA chassis
Optional RTMs used by the Hub cards to expand the number of transport connections.
Six pairs of slots for the node blades. One slot pair for OAM Servers (NBRZAL) and
five slot pairs for traffic processing (NBRZAM, FMO16JB, and FMO16JP).
Cables and other accessories required to support a maximum cabinet configuration

with two shelves.
Figure 2-1 Cabinet (NRA244AA)
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-2
Issue 3 June 2010
Hardware components
Cabinet (NRA244AA)
....................................................................................................................................................................................................................................
Components
The ATCA cabinet includes:
One of the following deflectors, depending upon the number of shelves that are being
used. These air deflectors provide air flow circulation and fire enclosure
3U 300W bottom deflector (MABAFBAA)
4U 300W middle deflector (MAMAF4AA)
3U 300W top deflector (MABAFTAA)
3U -48V Power Distribution Unit (SAPDUAA) at the top of the cabinet with an
Alarm card
Cabinet dimensions
The following table shows the dimensions of the 44U cabinet shown in Figure 2-1,
Cabinet (NRA244AA) (p. 2-2).
Table 2-1
Cabinet dimensions
Characteristic
Dimension
Height
600 mm/19.68 inches
Depth
600 mm/19.68 inches
Height
2125 mm/83.66 inches
Weight
138 kg/304.23 lbs for an empty cabinet
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-3
Issue 3 June 2010
Hardware components
Chassis (SAV2AB)
....................................................................................................................................................................................................................................
Chassis (SAV2AB)
Overview
The ATCA chassis (SAV2AB) provides the mechanical and hardware management
interface to PICMG 3.0 blades.
This section provides technical details for chassis slots, dimensions, environmental
conditions, and power feeds.
This photograph shows an empty ATCA chassis.
Figure 2-2 ATCA chassis (SAV2AB) photograph
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-4
Issue 3 June 2010
Hardware components
Chassis (SAV2AB)
....................................................................................................................................................................................................................................
Functional description
The chassis performs the following functions:
Environmental performance
Blades/customer interfaces
Dust filter management
Fan tray management
Hardware management
Power filter interface and distribution

Thermal management
EMC containment
Industrial design management
Chassis slots
Each 5060-MGC chassis has 14 slots to hold OAM processors, Ethernet hubs, and
processor blades. Each slot has a front side in which a node or hub blade can be installed
and a rear side in which a Rear Transition Module (RTM) can be installed.
Each 5060 MGC-8/VSG chassis contains the following blades:
2 Ethernet hubs for internal communications in front slots 7 and 8.

RTMs for external connectivity to customer networks in rear slots 7 and 8.
Processor blades and AMCs for the OAM server in slots 1 and 2.
Processor blades in the remaining front modules with Hard Disk Drives (HDD) or
RTM modules in the rear for slots 2 through 10. Optionally, AMC SS7 modules can
be located in the front slots to provide TDM connectivity for SS7 links.
Table 2-2
Chassis slots
Number of Slots
Description
15
Slots total
Slot dedicated as a dual-chassis manager
14
Slots for I/O, working, and protection
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-5
Issue 3 June 2010
Hardware components
Chassis (SAV2AB)
....................................................................................................................................................................................................................................
Slot assignments
The single-chassis configuration is supported for the 5060 MGC-8/VSG platform. This
figure shows an overview of proper use of the slots in a single-chassis configuration.
Figure 2-3 Functional single-chassis configuration
Fan tray
09
10
11
12
13
14
AMC SS7
AMC SS7
AMC SS7
AMC SS7
AMC SS7
08
AMC SS7
07
RTM (GigE)
06
RTM (GigE)
05
AMC SS7
AMC HDD
04
AMC SS7
AMC HDD
03
AMC SS7
02
AMC SS7
01
GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1
GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3
GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5
GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5
ShMC
ShMC
ADCM
ADCM
ADCM
ADCM
ADCM
ADCM
Ethernet Switch
Ethernet Switch
ADCM
ADCM
ACCM
ACCM
LCP OAM Server
LCP OAM Server
First chassis to be equipped
In a single-chassis configuration, the Processor blades that are installed in slots 1 and 2
will function as the OAM servers. In a multiple chassis configuration, the first chassis to
be configured will have Processor blades in slots 1 and 2 that function as OAM servers.
Subsequent chassis' in the same are not required to have OAM servers in slots 1 and 2.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-6
Issue 3 June 2010
Hardware components
Chassis (SAV2AB)
....................................................................................................................................................................................................................................
Chassis dimensions
The following table provides the technical dimensions of the Chassis. The chassis is 11U
and 13U with airflow deflectors.
Table 2-3
Chassis dimensions
MECHANICAL SPECIFICATIONS
Height
489 mm
Width
482 mm
Depth
383.14 mm from module
Weight
75.1 kg fully equipped

26 kg empty except for fan units
Chassis environmental specifications
The ATCA chassis must always be operated in a temperature and humidity controlled
room according to the environmental specifications shown in the following table.
Table 2-4
Environmental specifications
Environmental Conditions
Value
Operating temperature
+5 to +45 (C)
0C to +55C in degraded
conditions
Relative humidity
Up to 85%
Conforms with ANSI T1.304
Power
Two independent and secured DC power sources are required for the chassis. The 5060
MGC-8/VSG chassis is always equipped with two redundant power modules, allowing
the chassis to be fed in uninterrupted redundant mode.
Refer to for power specifications.
Table 2-5
Chassis power specifications
Requirement
Input/Output Power
DC power inputs
2x2 redundant accesses
Input voltage
-48 V/-60 V, based on duplicated distribution

Note: the current range is from -36 Volts to -72
Volts
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-7
Issue 3 June 2010
Hardware components
Chassis (SAV2AB)
....................................................................................................................................................................................................................................
Table 2-5
Chassis power specifications
(continued)
Requirement
Input/Output Power
Operating Voltage
- 48 V DC
Voltage Range
-39 V to -60 V DC
Maximum Consumption
Configuration 200Wper slot
Power Dissipation
Up to 300W per blade

Up to 400W per slot
Functions and physical components
This section describes the function of the main physical components of this configuration.
Table 2-6
Functions of physical components
Function
Component
Mnemonic
Hub function
Hub
NBMASW1
OAM function
Processor blade
NBRZAL
Traffic function
Processor blade
FMO16JB/FMO16JP
Technical specifications
The chassis is a 19 inch 11U dual-star backplane mechanical chassis consisting of the
following components:
1 - Mechanical chassis with dual star backplane

2 - Front and rear air filters (NDAFF and NDAFR)
Redundant power entry modules (PEM)

Dual fan trays at the top and bottom of the chassis, each with 6 fans
2 - Shelf Management Controller (NBSHMC) blades located on the right side of the
chassis in physical slot 15
14 - Slots for node and hub blades. Each slot has a front side to accommodate a blade
and a rear side to accommodate a rear transition module (RTM)
Push-pull air forced cooling with a capacity of up to 300W per slot

Update channels between even and odd slots
Processor CPU blades; maximum of twelve
2 - Ethernet hubs for internal communication
3 - Backplanes
1 - Backplane to host up to 14 blades

An additional slot to host two chassis manager blades
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-8
Issue 3 June 2010
Hardware components
Chassis (SAV2AB)
....................................................................................................................................................................................................................................
Separate top and bottom air deflectors

A large air compression chamber which ensures even thermal performance among the
14 slots
Figure 2-4 Chassis front view
Fan Tray
N
o
d
e
N
o
d
e
N
o
d
e
N
o
d
e
N
o
d
e
N
o
d
e
H
u
b
H
u
b
N
o
d
e
N
o
d
e
N
o
d
e
N
o
d
e
N
o
d
e
N
o
d
e
S
h
M
C
S
h
M
C
Fan Tray
Requirements
The 5060 MGC-8/VSG chassis has been designed to meet the following requirements.
Mechanical requirements
The 5060 MGC-8/VSG chassis supports the Midplane concept which is characterized by:
Rear Transition Module (RTM) for rear I/O

RTM power feeds distribution done by the associated front board
Direct connections between front boards and RTMs
Mandatoary Mechanical parts
Each chassis includes the following mandatory mechanical parts:
1 - 3U Bottom Deflector (MABAFBAA) and one 4U deflector (MABAF4AA) for the

first chassis
1 - Front air filter (NDAFF)
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-9
Issue 3 June 2010
Hardware components
Chassis (SAV2AB)
....................................................................................................................................................................................................................................
1 - Rear air filter (NDAFR)

1 - Front cable tray (KMFT1)
1- Rear cable tray (KMRT2)
Backplane
The 5060 MGC-8/VSG chassis backplane is based on three zones of functionality. Zone 1
provides dual 48V power and chassis management system connections, zone 2 provides
the data transport interfaces, and zone 3 is the RTM face plate for the I/O functions.
Zones 1 and 2 are part of the same printed circuit board while zone 3 is a connection
between the front board and RTMs through on-board connectors.
On zone 2, the data transport interfaces support four separate types of interfaces which
provide connectivity for up to 14 slots along the backplane. These four interfaces are the
Base Interface, Fabric Interface, Update Channel Interface, and the Synchronization
Clock Interface.
Note: The Synchronization Clock Interface is not supported in Release 8.0.1.
The backplane accommodates three types of plug-in modules: Ethernet hubs, Processor
blades, and Shelf controller modules. In addition the backplane provides connections to
the upper fan tray through small transition PCBs, connections for the -48V power supply
inputs for the chassis, and it directly plugs into the lower fan try for cooling purposes.
The following figure shows the backplane in a top view drawing of the chassis.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-10
Issue 3 June 2010
Hardware components
Chassis (SAV2AB)
....................................................................................................................................................................................................................................
Figure 2-5 Chassis top view
Rear side
RTM
RTM
08
11
10
12
12
13
14
14
RTM
06
10
RTM
04
09
RTM
02
08
RTM
01
07
RTM
RTM
03
06
RTM
05
05
RTM
07
04
RTM
Logical slot
RTM
RTM
RTM
Physical slot
13
11
09
01
02
03
Node
Node
Node
05
05
06
03
07
01
08
02
09
04
10
06
11
08
12
10
ShMC
Node
04
07
J
A
U
C
S
Node
Hub
03
09
J
A
U
C
S
Node
Hub
J
A
U
C
S
Node
J
A
U
C
S
Node
J
A
U
C
S
Node
01
02
13
11
Physica l slot
J
A
U
C
S
Node
Node
Node
BACKPLA NE
13
14
12
14
Logical slot
Front side
Cooling unit
The 5060 MGC-8/VSG chassis uses adaptive, forced air convection cooling. Air is drawn
through the bottom front side of the chassis and exhausted out the top rear side of the
chassis by means of air deflectors separated from the chassis.
The design of the chassis cooling units allows a maximum power dissipation of 300W per
5060 MGC-8/VSG front blade slot.
Deflectors
The chassis is installed with an upper and a lower deflector. The lower deflector acts as an
air intake for the blades and RTM, and the upper deflector acts as a rear exhaust. Another
function of the deflectors is to close the fire enclosure. The deflectors are fixed to the
front rack uprights and not to the chassis. In addition, the deflectors are designed to help
mount the chassis into a rack with guide rails that provide guidance.
Note: Racks are not included in Release 8.0.0
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-11
Issue 3 June 2010
Hardware components
Chassis (SAV2AB)
....................................................................................................................................................................................................................................
Two types of deflectors are used depending on the rack layout:
1U orthogonal 3-sided air intake
2U diagonal deflector 1-sided air intake
Fan tray (NSFANV2)
The cooling unit of the 5060 MGC-8/VSG chassis is made of two field replaceable fan
trays, with each fan tray containing six fans. The fan tray draws air from the bottom front
side and pressurizes air to flow through the chassis. Air then exits the chassis through a
dedicated rear upper exhaust. A control for each cooling unit provides fan speed
monitoring and an alarm interface. To ensure balanced air flow in partially populated
systems, filler blades and faceplate assemblies are required to complete the enclosure.
The mechanical design of the chassis tends to create static (not changing over time) and
spatial (changing within space) variations in the cooling performance between slots, as
well as within the depth of a slot. The 5060 MGC-8/VSG chassis is mechanically
designed to provide the same cooling capabilities for each slot.
The cooling unit equipment is made of:
1 - mechanical structure with 2 guides to aid with insertion and 2 locking screws to
lock each module in place
1 - fan control blade with power and signal connectors

No grids are implemented. A mechanical key is used to protect the operator while
manipulating the fan tray.
Fan tray dimensions
The following table provides the technical dimensions of the fan tray.
Table 2-7
Fan tray dimensions
Characteristic
Dimension
Height
600 mm
Depth
600 mm
Height
138 kg
Maximum Consumption
220W
Typical Consumption
150W
without AMC
Weight
4 to 5 Kg
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-12
Issue 3 June 2010
Hardware components
OAM server (NBRZAL)
....................................................................................................................................................................................................................................
OAM server (NBRZAL)

Overview
The OAM server (NBRZAL) runs on a pair of processor blades that are dedicated for this
purpose. This single board computer includes the following components:
One Dual Core Intel T 7400 processor running at 2.16 GHz with 8 GB of memory
One AMC with 147 GB SAS disk
Six Gigabit Ethernet ports are auto-negotiated and auto-MDIX. Two of these GigE
ports link to the host processor for out-of-band external management.
An optional RPCMHDDA RTM to provide additional disk storage
OAM server function
The OAM server supports the following services:
Hardware monitoring management of the chassis, node cards, and switch cards using
the shelf manager (ShMC).
ACCM and ADCM growth, OS installation, software installation, upgrades, and
downgrades, and FRU replacement.
Alarming, both visible and audible, to the 1310 OMC-P via the MI on the OAM
server.
Internal IP Address configuration
Dimensions
The following table provides the technical dimensions of the processor blades.
Table 2-8
Processor blade dimensions
Characteristic
Dimension
Height
8U/322.25 mm
Depth
280 mm
Pitch
30.48 mm
Input power voltage
36 & 75 VDC (48 VDC nom.)
Power consumption per processor blade with

AMC
190 W max
Ambient temperature
between +5 C and +40 C
Weight
2.24 kg (with 1 AMC)

2.056 kg (no AMC)
Common power supply for two AMCs
50 W max
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-13
Issue 3 June 2010
Hardware components
Hub (NBMASW1)
....................................................................................................................................................................................................................................
Hub (NBMASW1)
Overview
Ethernet hubs in the 5060 MGC-8 5060 platform are responsible for internal
communications. Their purpose is to provide a star topology backplane that provides
connectivity to multiple processor blades within the backplane. Each processor blade is
connected through the backplane to the two Hub. Two Ethernet hubs comprise a
single-blade computer in switch-only mode. Slots 7 and 8 are dedicated to the hub blades.
The main functions of the Ethernet hubs are to provide:
Switching capabilities
Accesses to the external Ethernet backbone
Uplink accesses to other racks in a cabinet (not supported in this release).
Synchronization module
The 5060 MGC-8 platform contains two Ethernet hubs for internal communications, each
consisting of the following hardware:
1 - single blade computer in switch-only mode

RTMs (NASYS) for the hub switches for inter-chassis communications.
Note:The Hub RTMs do not provide Chassis Reference Clock generation and
distribution.
Single blade functions
The single-blade computer includes the following components:
1 - Dual-core Intel T 7400 processor running at 2.16 GHz with 1 GB of memory

Dual star Ethernet switching fabric
4 - 1000 Base-T Ethernet links to the base interface on front panel
1 - 10 GE interface connected to the fabric interface on front panel
1 - 10/100/1000 Base-T interface connected to the on-blade CPU
CPU features
The CPU has the following features
1 Dual-core 2.13 GHz chipset, 32/64-bit, 4M L2 cache
Up to 8 GB memory
2 - Gigabit Ethernet ports
USB 2.0 port (bootable)
RS-232 port
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-14
Issue 3 June 2010
Hardware components
Hub (NBMASW1)
....................................................................................................................................................................................................................................
Embedded GigE switch
The embedded GigE switch is characterized by
Full GigE connectivity between backplane AMC sites and the CPU
4 - GigE external (front) ports and 2 - GigE ports on the NASYS RTM (1 - 1000
interface connected to each CPU blade slot)
Dimensions
The following table provides the technical dimensions of the Hub.

Table 2-9
Hub dimensions
Characteristic
Dimension
Height
8U/322.25 mm
Depth
280 mm
Pitch
30.48 mm
Maximum Consumption
150W(with 1 AMC)
Typical Consumption
78W(load 10%)
without AMC
90W(load 50%)
98W(load 100%)
Weight
2.24 Kg (with 1 AMC)

2.056 Kg (without AMC)
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-15
Issue 3 June 2010
Hardware components
Hub (NBMASW1)
....................................................................................................................................................................................................................................
Diagram of Hub front panel
The following diagram provides an example of the front panel of a hub blade.
Figure 2-6 Hub front panel
3CM02660
AAAD04
NBMASW1
NBAFIM
2 AMC slots
for PCI Express and Storage
interfaces
NBAFIM
CI
3CMO2741
AAAB
GEO
GE1
GE2
GE3
4 * 1000Base-T Ethernet
links
(Base interface)
debug Fast Ethernet port
debug USB port

U
P
L
0
10GE electrical interface

U
P
L
1
BS0847
UE 22L
FRONT PANEL
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-16
Issue 3 June 2010
Hardware components
....................................................................................................................................................................................................................................

Overview
Up to 12 Processor blades run 5060 MGC-8 services. The minimum requirement is one
single-blade computer with one dual-core Intel T 7400 processor running at 2.16 GHz
with 8 GB of memory, one AMC with 146 GB SAS disk, and two front panel GE links to
the host processor (for out-of-band external management). The hardware variant depends
on the blades function.
5060 MGC-8 services
The processor blade supports the following 5060 MGC-8 services
Management interface
Configuration server
ACCM director
Shared network services
Processor characteristics
Key characteristics of the 1 Merom T 7400 Dual core processor blade are:
32/64-bit operation
L1 cache: 32K I-cache, 32K write-back cache
L2 cache: 4 MB
Up to 8 GB memory
2 - GigE ports to CPU

USB 2.0
Boot options: HDD, USB, IDE flash, TFTP
RS-232 console port for debugging, through mini-USB plug
2 - AMC sites
Embedded GigE switch offering full GigE connectivity to backplane
1 - GigE to each AMC slot
2 - 1GigE to CPU
4 - GigE external (front)
2 - GigE on RTM
120Watts power consumption for base blade, plus 20WRTM, 50WAMC and 15W
DIMM.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-17
Issue 3 June 2010
Hardware components
....................................................................................................................................................................................................................................
Diagram of processor blade front panel
The following diagram provides an example of the front panel of a processor blade.
Figure 2-7 Processor blade front panel
FMD16BC
NBDM14
3CMO2685
ABAA
LED 1
LED 2
LED 3
BS0815U
OKJJ
3 Management LEDs
GEO
GE1
2 x Gigabit Ethernet Ports
Reset Button
RST
RS232 CPU Access
CP
RS232 IPMC Access
C1
1 Management Blue LED

USB Connector
USB
FRONT PANEL
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-18
Issue 3 June 2010
Hardware components
....................................................................................................................................................................................................................................

Overview
A Rear Transition Module (RTM) is installed in the rear of the chassis. An RTM is mated
with a Front Board through Zone 3 connectors to provide I/O connectivity for E1/T1. Up
to 14 RTMs can be plugged into the 14 rear slots in a chassis.
Two types of RTMS are used in this chassis configuration:
RTM Synchro & Switching (NASYS) for the Hub that functions to provide
synchronization and switching
RTM 8E1/T1 75/120 + 1xHDD 300G (RPCMHDDA) for the Processor blade T1/E1
to terminate the low-speed TDM links.
RTM for Hub (NASYS)
The RTM (NASYS) is an optional element used to expand the number of electrical
Ethernet connections to the service-provider network.
NOTE: TDM clock ports are not applicable.
This RTM is mounted at the rear end of the hub slots and provides the following
interfaces:
8 - 1000 Base-T Ethernet links on the Fabric Interface

1 - 10 GE link to the Base interface (reserved for future use)
1 - 10 GE link to the Fabric interface (reserved for future use)
2 - 10/100/1000Base-T to Hub module host CPUs (reserved for future use)
For additional details about the RTM interfaces and their functions, see Table 4-2, Hub
I/O interfaces (p. 4-5)
The following figure shows the front view of the Hub RTM front panel.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-19
Issue 3 June 2010
Hardware components
....................................................................................................................................................................................................................................
Figure 2-8 Hub RTM front panel
NASYS
10
G
E
B
10 Gigabit Ethernet Base Port
10
G
E
F
10 Gigabit Ethernet Fabric Port
CPU
2 x CPU Access
8 x LIU Access
B
I
T
S
BITS
S
S
U
SSU
W
e
s
t
IOCLK 1/ 2/ 3 West
E
a
s
t
C
L
K
IOCLK 1/ 2/ 3 East
L
I
U
LIU CLK 1/ 2
D
b
g
RS232 Synchro
POWER
H/S
Power LED
BS0847
UE 22L
FRONT PANEL
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-20
Issue 3 June 2010
Hardware components
....................................................................................................................................................................................................................................
RTM for the Processor Blade (RPCMHDDA)
The RPCMHDDA RTM is associated with the 8-port E1/T1 rear access SS7 AMC hosted
by the FM016JP processor blade.
RPCMHDDA RTM performs the following functions:
8 - physical E1/T1 links coming from an AMC site located on the FM016JP
Uses an HE5-High Density connector for 8 E1/T1
Supports 75/100/120 ohm line impedance matching
2 - 1000 Base-T Ethernet coming from the CPU located on the front board which uses
an RJ45 connector on the face plate
Supports a 2.5 inch Hard Disk Drive with 300 GB capacity
The following figure shows the front panel of the RPCMDDA RTM.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-21
Issue 3 June 2010
Hardware components
....................................................................................................................................................................................................................................
Figure 2-9 Processor blade RTM (RPCMHDDA)

RPCMHDxA
P
C
M
POWER
H/S
FRONT PANEL
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-22
Issue 3 June 2010
Hardware components
....................................................................................................................................................................................................................................

Overview
The Shelf Management Controller blade (ShMC) provides out-of-band management of

chassis hardware. The ShMC is a half-height blade that controls the slots and blades that
are located in the same chassis. There are always two ShMC blades per chassis and they
are located in slot 15.
Functional description
Each 5060 MGC-8 5060 chassis includes two Shelf Management Controllers (ShMC)
that run in active/standby mode. ShMCs supervise all elements of the chassis (fan trays,
blades, RTMs, air filters and PEMs) through an Intelligent Platform Management Bus
(IPMB) and Inter Integrated Circuit (I2C) connections.
The ShMC controller performs the following functions within the 5060 MGC-8 chassis:
Monitors temperatures and voltages for chassis components

Monitors blade and fan tray presence and fan speeds
Monitors power supply status
Controls power states for automated power sequencing and power supply inhibition
Controls blade power states and fan speed for automatic recovery in case of
temperature events
Manages the chassis through supporting scripts for system status and corrective
actions.
Provisions interfaces for remote management
Logs chassis status events
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-23
Issue 3 June 2010
Hardware components
....................................................................................................................................................................................................................................
Diagram of ShMC
This figure shows the front view of the Shelf management controller (ShMC).
Figure 2-10 Shelf manager front panel
NBSHMC
Pwr
A/S
Power LED
F
E
T
H
O
1
2
C
Active / Standby LED
Debug
Fast Ethernet
R
S
Lk F
Debug RS232
Fast Ethernet 0
Ac 0
Lk F
Ac 1
HS Blue LED
Fast Ethernet 1
H/S
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-24
Issue 3 June 2010
Hardware components
....................................................................................................................................................................................................................................
Dimensions
The following table provides the technical dimensions of the ShMC.

Table 2-10
Shelf management controller dimensions
Characteristic
Dimension
Height
83.4 mm
Depth
282 mm
Pitch
14.96 mm
Maximum Consumption
15W
Typical Consumption
10W
Weight
332 g
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-25
Issue 3 June 2010
Hardware components
Power supply
....................................................................................................................................................................................................................................
Power supply
Power supply module
In a chassis-only configuration, the 5060 MGC-8 5060 chassis power supply module
provides all the necessary on-blade power supply from the back-panel. The input power is
-48 V or -60 V, based on duplicated distribution. Two independent and secured DC power
sources are required for all configurations. Optionally, for AMC sites, a maximum
common power supply of 50W is supported.
In a cabinet configuration, a power distribution Unit (PDU) is required. On the PDU
(SAPDUAA) the DC sources are -48 V DC or -60 V DC nominal voltage (40.5 to 72 V).
The power supply module provides a secondary power supply for the overall blade and it
includes the following on-blade voltage functions:
Conversion and distribution

EMI filtering
Capacitors for the 5060 MGC-8 hold time

-48 V monitoring
Power entry module (PEM)
The chassis is designed to sustain a maximum power requirement of 5460W. The power
zone is divided into two independent feeds (A feed and B feed) and each zone is fed by
both feeds. This ensures that if Feed-A is accidentally shut off, Feed-B will maintain
power functionality. In addition, each feed is split into two distributions, in order to
reduce the maximum current in each distribution. External power is supplied to each feed
of the chassis using feed-through 75 Amp connectors. The fan trays are powered by the
backplane.
Alarms
Each on-blade alarm is monitored to deliver an alarm to the 16-bit I2 C I/O port.
Additionally, the remote VB alarms (from the secondary shelf management controller) are
delivered to the PCA. Each alarm is based on a minimum threshold value.
Power distribution unit (SAPDUAA)
In a cabinet configuration, the SAPDUAA PDU supplies power distribution to the

cabinets with the capacity to supply up to 3 shelves. The SAPDUAA is a 19 standard
form factor, 3U high.
Configuration maintenance or evolution operations are performed via the front or the rear
of the SAPDUAA (without removing the top of the cabinet). All the circuit-breakers and
fuses can be removed.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-26
Issue 3 June 2010
Hardware components
Power supply
....................................................................................................................................................................................................................................
The SAPDUAA can host an alarm board (RALARMAA). The alarm board is used by the
central office maintenance operator to handle the visual and audio alarms generated by
the system hosted in the rack. In addition, the alarm board provides 2 external input ports.
See Alarm module (RALARMAA) (p. 2-28) for more information.
Figure 2-11 Power Distribution Unit (SAPDUAA)
Physical characteristics
The SAPDUAA is a 19-wide 3U-high, 160 mm-deep shelf. It is consists of a mechanical

frame with 3 slots:
one for the A-branch bank of circuit-breakers and fuse block

one for the B-branch bank of circuit-breakers and fuse block
one for the RALARMAA board
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-27
Issue 3 June 2010
Hardware components
Power supply
....................................................................................................................................................................................................................................
Alarm module (RALARMAA)
In a cabinet configuration, the optional alarm module is located at the top of the cabinet.
All fuses and circuit-breakers can be accessed from the front of the cabinet.
Figure 2-12 Alarm module (RALARMAA)
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-28
Issue 3 June 2010
Hardware components
Fillers
....................................................................................................................................................................................................................................
Fillers
Fillers are required in all unused slots of a 5060 MGC-8/VSG chassis. The purpose of the
fillers is to maintain the proper and balanced air flow within a chassis by sealing any
unused slots in the enclosure of a partially populated system.
The following types of fillers are used in the 5060 MGC-8/VSG:
Board Filler (NBFILL) is used to close unused front slots in the chassis
RTM Filler (NAFILL) is used to close any unused rear slots in the chassis.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
2-29
Issue 3 June 2010
3 AM server hardware
O
details
Overview
Purpose
This chapter describes the functions and features of the OAM server module (NBRZAL)
and its connections to external interfaces.
Contents
OAM server module
3-2
Hardware details
3-3
3-11
Front panel ports
3-12
...................................................................................................................................................................................................................................
255-400-209R8.0.1
3-1
Issue 3 June 2010
OAM server module
....................................................................................................................................................................................................................................
OAM server module

Introduction
The OAM server (NBRZAL) module is an Advanced Telecom Computing Architecture

(ATCA) control (CPU) module.
The OAM server module is a general purpose, flexible applicative module that adheres to
the following standards:
PICMG 3.0
PICMG 3.1
AMC.0 for the two standardized Advanced Mezzanine Card (AMC) slots
AMC.1 for PCI Express
AMC.3 for storage interfaces
OAM server blade and the ATCA chassis
The OAM server module must be installed in Slot 1 and Slot 2 in the ATCA 5060
MGC-8/VSG chassis as shown in Figure 1-1, 5060 MGC-8/VSG single-chassis
configuration (p. 1-5)
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-2
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Hardware details
Introduction
This section describes the physical and functional features of the OAM server module,
including size, power consumption, and hardware details. The OAM module also
provides full connectivity through a set of I/O interfaces. See I/O interfaces (p. 3-6) for
a list of available I/O interfaces located on the front panel, the back panel, RTMs or AMC
slots.
The OAM server module has the following blocks:
A CPU which provides computing power,
A local switch which offers most of the OAM server module connectivity.
A set of 2 AMC slots offering SAS hard disk connectivity, two 4lane PCI-Express
interfaces and eight E1 ports.
OAM server module architecture is based on a CPU chipset and up to 2 HDDs. OAM
server module management is performed by an IPMC component.
The following diagram shows a simple overview of the OAM server architecture. The
diagram shows the module with the following components:
A CPU block that provides computational power.

A local switch for Ethernet switching
A card-management and common-card-resource block.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-3
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Figure 3-1 OAM server architecture overview
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-4
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Physical specifications
The following figure shows a OAM server module side view and front view. Both views
show the OAM server with an AMC module installed.
Figure 3-2 OAM server side view and front panel
3CMO2859
ALAB03
NBRZAL
NBDM14
3CMO2685
ABAA
1
BS0815U
OKJJ
NBAFIM
3CMO2741
AAAB
GEO
GE1
GE2
GE3
GE4
GE5
USB
CP
CI
RST
B50847
UE 1R5
SIDE VIEW
Table 3-1
FRONT PANEL
OAM server module physical specifications
Characteristic
Dimension
Height
8U/322.25 mm
Depth
280 mm
Pitch
30.48 mm
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-5
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Table 3-1
OAM server module physical specifications
Characteristic
(continued)
Dimension
Input power voltage
36 & 75 VDC (48 VDC nom.)
Power consumption per OAM server with

AMC
190 W max
Ambient temperature
Weight

2.056 kg (no AMC)
50 W max
CPU
The OAM server CPU is based on a 16.2 SPECint_rate2006 and it has the following
technical specifications:
2.16 GHz Standard Voltage Intel Merom Dual-Core T7400 processor

Lindenhurst Chipset (MCH7520 & ESB6300)
Up to 8 GB of RAM (2 x 4 GB DDR2) in two 240-pin DIMM slots with ECC

2 GB of local IDE Flash Disk
I/O interfaces
The OAM server module has interfaces to communicate with external elements such as
the chassis, and configuration and debug tools.
Two ports are provided for transport functions on the front of the OAM server blade (GE4
and GE5) Four JLCAT6 cords are provided for this function.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-6
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
The following table describes the I/O interfaces of the OAM server module.
Table 3-2
Interfaces
Back panel
Specifications
2 x SERDES Gigabit Ethernet interfaces for

communication with the fabric interface of up to 2
hub modules.
2 x 1000Base-T Gigabit Ethernet interfaces for

communication with the base interface of up to 2 hub
modules.
1 redundant IPMI interface for connection to the shelf

manager.
1 synchronization interface for the 5060

MGC-8/VSG chassis.
1 redundant -48 V power supply interface.
Front panel
See OAM server front panel (p. 3-9) for details on the
front-panel ports.
RTM (NASYS)
For functional applications:
1 PCI-Express 4X interface connected to the pilot

CPU.
1 IPMC and management interface for RTM FRU

management.
2 groups of 8 E1/T1 ports connected to both AMC

slots.
4 SAS ports for hard disk connectivity.
Signals for RTM FPGA configuration.
12 V payload power supply and 3.3 V management

power supply interfaces.
For debug or engineering applications:
1 ICE port for disk controller debug.
1 RS232 debug port connected to LSI controller.
1 JTAG interface, including reserved signal for

firmware upgrade and debug purposes.
2 USB ports.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-7
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Table 3-2
Interfaces
AMC slot
(continued)
Specifications
1 synchronization interface (including 3

synchronization clocks and I2C control bus) with a
Synchronization module located on the RTM module.
1 IPMC and management interface for AMC FRU

management.
2 groups of 8 E1/T1 interfaces connected to both

AMC slots.
2 4-lane PCI-Express interfaces connected to the

control CPU with associated synchronization.
2 SAS ports for hard disk connectivity.

....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-8
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
OAM server front panel
The following figure shows the front panel of the OAM server.
Figure 3-3 OAM server front panel
3CMO2859
ALAB03
NBRZAL
NBDM14
3CMO2685
ABAA
1
BS0815U
OKJJ
3 Management LEDs
2 AMC Slots
for PCI Express
and Storage Interfaces
NBAFIM
3CMO2741
AAAB
GEO
GE1
GE2
GE3
GE4
GE5
USB
1 Debug USB Port
CP
RS232 CPU Access
CI
RS232 IPMC Access
RST
B50847
UE 1R5
FRONT PANEL
The front panel of the OAM server module is equipped with the following:
ports or interfacing with external devices

LEDs for access to module status
AMC slots
a push button
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-9
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
The following table describes the functions of the front-panel ports.

Table 3-3
OAM server with AMC - front panel ports
Front-panel Ports
Function
4 x 1000Base-T Gigabit Ethernet
For external communication with the base interface.
2 x 10/100/1000Base-T Ethernet
Connected directly to the CPU.
Debug USB
For debug or engineering purposes. Connected directly to

the CPU.
2 serial ports
For debug or engineering purposes. One connected to the

CPU, the other connected to the IPMC module.
Push button
For module reset
Management LEDs
The OAM server front panel includes 4 LEDs as described in the following table.
Table 3-4
Management LEDs for OAM server with AMC
LED
Ready for Hot
Swap Blue LED
Color
Blue
State
Hot swap indicator as defined in
the 5060 MGC-8/VSG standard.
Shows OAM server IPMI status.
Steady blue when hot-swap ready.
Out of Service
LED 1
Red
Blinking when a failure is

detected during selftest.
Steady red when an alarm is
detected.
LED 2
Green
OFF until BIOS execution

completes.
Blinking when BIOS is correct.
Steady when OS is ready.
LED 3
Amber
Steady as soon as the IPMC

module triggers payload
power-on.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-10
Issue 3 June 2010
....................................................................................................................................................................................................................................
Introduction
This section describes the physical and functional features of the OAM server module,
including details on size, power consumption and hardware.
A OAM server module is made up of the following main blocks:
CPU to provide computing power

0, 1, or 2 SAS hard drive disks with two 4lane PCI-Express interfaces
The OAM server module also provides full connectivity through a set of I/O interfaces.
See the I/O interfaces (p. 4-5)section for a list of available I/O interfaces located on the
front panel, the back panel or RTMs.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-11
Issue 3 June 2010
Front panel ports
....................................................................................................................................................................................................................................
Front panel ports

Ports and connectors
This section describes the front panel ports and connectors of the OAM server..
Table 3-5
X3401 and 3501 pin assignment
Pin #
Pin name
1
FP_DA+ (TX+)
FP_DA- (TX-)
FP_DB+ (RX+)
FP_DC+
FP_DC-
FP_DB- (RX-)
FP_DD+
FP_DD-
Stacked Fast Ethernet ports
One stacked connector (labelled X3402) provides interfaces for two standard FastEthernet RJ45 ports.
Table 3-6
Pin #
Pin name
1
DBG_DA+ (TX+)
DBG_DA- (TX-)
DBG_DB+ (RX+)
DBG_DC+
DBG_DC-
DBG_DB- (RX-)
DBG_DD+
DBG_DD-
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-12
Issue 3 June 2010
Front panel ports
....................................................................................................................................................................................................................................
USB connector
The X5505 connector provides a USB port. The connector integrates the Ethernet
magnetics.
Table 3-7

USB interface
1
+5V
DATA-
DATA+
GND
Mini-USB debug connectors
Two mini USB connectors provide interfaces for two 9pin standard DB9 links. The
mechanical ground is connected to the connector shield via the PCB.
This figure shows a mechanical overview of the mini-USB connectors:
Figure 3-4 CPU and IPMC Debug connector
IPMC Debug / RS232 link
Table 3-8

Pin
Signal on X5503
Nc
CPU _TX_DEBUG
CPU _RX_DEBUG
MLOG
Braid shield (mechanical ground)
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-13
Issue 3 June 2010
Front panel ports
....................................................................................................................................................................................................................................
Table 3-9
IPMC debug connector pins

Pin
Signal on X5504
Nc
IPMC _TX_DEBUG
IPMC _RX_DEBUG
MLOG
....................................................................................................................................................................................................................................
255-400-209R8.0.1
3-14
Issue 3 June 2010
Hub hardware
4
Overview
Purpose
This chapter describes the functions and features of the Hub module and its connections
to external interfaces.
Contents
Hardware details
4-2
4-9
Hub RTM
4-10
Front panel ports
4-12
...................................................................................................................................................................................................................................
255-400-209R8.0.1
4-1
Issue 3 June 2010
Hub hardware
Hardware details
....................................................................................................................................................................................................................................
Hardware details
Introduction
The Ethernet hubs in the 5060 MGC-8 platform are responsible for internal
communications. The slots 7 and 8 are dedicated to the hub cards. Each processor CPU
board and ShMC is connected through the backplane to the two hub cards.
The Hub is an Advanced Telecom Computing Architecture (ATCA) control (CPU)
module that complies with PICMG 3.0 R2.0 and PICMG 3.1 standards. The Hub is a
layer 2 switch with two standardized Advanced Mezzanine Card (AMC) slots that comply
with AMC.1 and AMC.3 standards for PCI Express and Storage interfaces. AMCs are not
used in the switch-only configuration in the 5060 MGC-8 configuration.
Hub and the chassis
Ethernet hubs have associated RTMs in the rear of the chassis. The RTM (NASYS) must
be used in conjunction with the Hub. The RTM provides a Fabric expansion based on 8
Gigabit Ethernet links and direct connectivity to the Hub host processor through 2 GbE
accesses.
The following figure shows a Hub extracted from the chassis:

Table 4-1, Hub physical specifications (p. 4-3) shows the side view of the Hub and
front panel of the Hub.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-2
Issue 3 June 2010
Hub hardware
Hardware details
....................................................................................................................................................................................................................................
Figure 4-1 Hub side view and front panel

3CM02660
AAAD04
NBMASW1
NBAFIM
NBAFIM
CP
CI
3CMO2741
AAAB
RST
GEO
GE1
GE2
GE3
USB
Base T
U
P
L
0
U
P
L
1
BS0847
UE 22L
SIDE VIEW
FRONT PANEL
MA-ATCA-014-10
Table 4-1
Characteristic
Dimension
Height
8U/322.25 mm
Depth
280 mm
Pitch
30.48 mm
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-3
Issue 3 June 2010
Hub hardware
Hardware details
....................................................................................................................................................................................................................................
Table 4-1
(continued)
Characteristic
Dimension
Input power voltage
36 & 75 VDC (48 VDC nom.)
Power consumption per Hub
300W max
Power consumption per RTM
14 W max
Ambient temperature
Weight

2.056 kg (no AMC)
50 W max
CPU
The Hub CPU is based on 1 16.2 SPECint_rate2006 64bit capable platform with the
following technical specifications:
2.16 GHz Standard Voltage Intel Merom Dual-Core T7400 processor

Lindenhurst Chipset (MCH7520 & ESB6300)
Up to 8 GB of RAM (2 x 4 GB DDR2) in two 240-pin DIMM slots with ECC
2 GB of local IDE Disk
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-4
Issue 3 June 2010
Hub hardware
Hardware details
....................................................................................................................................................................................................................................
I/O interfaces
The Hub interfaces communicate with external elements such as the chassis, and
configuration and debug tools.
Table 4-2
Hub I/O interfaces
Interfaces
Back
panel
Specifications
24 x 1000BASE-BX Ethernet interfaces communicate with the fabric interface

of up to 12 node boards.
12 x 1000Base-T Ethernet interfaces communicate with the base interface of up

to 12 node boards.
1 - Interface communicates to the ShMC configurable (by specific resistor

equipment) either as 2 x 100 base-TX, either 1 x 1000 base-T through the base
switch plan.
1 - Crossed 1000Base-BX Ethernet interface for CPU/Base communicates with

the remote Hub.
1 - Redundant IMPI interface for the connection to the chassis manager.
1 - Synchronization interface for the chassis. It also uses some Update Channel
links between the two Ethernet hubs.
1- Redundant 48 V power supply interface.
Front
panel
See Front panel (p. 4-6) for details on the front-panel ports.
RTM
2 x 10 GE interfaces connected to the Fabric Switching plan.
1 10 GE interface connected to the base switching plan.
1 - PCI-Express 4X interface connected to the Pilot CPU.
1 - IPMC and management interface for the RTM FRU
2 - Groups of four E1/T1 interfaces connected to both AMC slots.
4 - SAS ports for Hard disks connectivity.
12 V payload power supply and 3.3 V management power supply interfaces.
1 - ICE port for disk controller debug.
1 - RS232 debug port connected to LSI controller.
1 - JTAG interface with reserved signal for firmware upgrade/debug
2 - USB ports.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-5
Issue 3 June 2010
Hub hardware
Hardware details
....................................................................................................................................................................................................................................
Front panel
The front panel of the Hub is equipped with the following:
Ports to interface with external devices

LEDs to access module status
AMC slots for housing the AMCs (not used)
Push button
The following figure shows a line drawing of the front of the Hub including LEDs, AMC
slots, and other details.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-6
Issue 3 June 2010
Hub hardware
Hardware details
....................................................................................................................................................................................................................................
Figure 4-2 Hub front panel

3CM02660
AAAD04
NBMASW1
NBAFIM
2 AMC slots
for PCI Express and Storage
interfaces
NBAFIM
CI
3CMO2741
AAAB
GEO
GE1
GE2
GE3
4 * 1000Base-T Ethernet
links
(Base interface)
debug Fast Ethernet port
debug USB port

U
P
L
0
10GE electrical interface

U
P
L
1
BS0847
UE 22L
FRONT PANEL
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-7
Issue 3 June 2010
Hub hardware
Hardware details
....................................................................................................................................................................................................................................
Hub ports
The following table describes the functions of the front-panel ports.

Table 4-3
Hub front panel ports
Front-panel Ports
Function
4 x 1000Base-T Gigabit Ethernet
For external communication with the base interface.
2 x 10 Gigabit Ethernet electrical

interfaces
One for communication with the base switching plan,

the other for communication with Fabric Switching plan.
Debug USB
For debug or engineering purposes.
1 x 10/100/1000Base-T interface
For direct CPU access
2 serial ports
For debug or engineering purposes. One connected to

the CPU, the other connected to the IPMC module.
Push button
For module reset
Management LEDs
The Hub front panel includes 4 LEDs as defined in the ATCA standards. The following
table describes the functions of the front-panel ports.
Table 4-4
Hub management LEDs
LED
Ready for Hot
Swap Blue LED
Color
Blue
State
Hot swap indicator as defined in
the ATCA standard. Shows Hub
IPMI status.
Out of Service
LED 1
Red
Blinking when a failure is

detected during selftest.
Steady red when an alarm is
detected.
LED 2
Green
OFF until Hub is in M4 status.

LED 3
Amber
Steady as soon as the IPMC

module triggers payload
power-on.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-8
Issue 3 June 2010
Hub hardware
....................................................................................................................................................................................................................................
Hub hardware architecture is based on a CPU chipset and a base switch. Hub
management relies on an Intelligent Platform Management Component (IPMC)
component. Physical IP connectivity will be centralized through the Ethernet hubs.
The following diagram shows the Hub with the following components:
A CPU block that provides computational power
A switching base block, for Ethernet switching

A switching fabric block
A module-management and common-module-resource block
Figure 4-3 Hub architecture overview
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-9
Issue 3 June 2010
Hub hardware
Hub RTM
....................................................................................................................................................................................................................................
Hub RTM
The Ethernet RTM (NASYS) provides the following functions to the Hub:
Fabric expansion for 8 LIU shelves interconnect
Direct connectivity to the Hub host processor through 2 fast Ethernet accesses
10 GbE physical interface to the chassis switch Base
10 GbE physical interface to the chassis switch Fabric
Debug interface
Remote inventory data storage
The following figure shows the front view of the Hub RTM.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-10
Issue 3 June 2010
Hub hardware
Hub RTM
....................................................................................................................................................................................................................................
Figure 4-4 Hub RTM front view
NASYS
10
G
E
B
10 Gigabit Ethernet Base Port
10
G
E
F
10 Gigabit Ethernet Fabric Port
CPU
2 x CPU Access
8 x LIU Access
B
I
T
S
BITS
S
S
U
SSU
W
e
s
t
IOCLK 1/ 2/ 3 West
E
a
s
t
C
L
K
IOCLK 1/ 2/ 3 East
L
I
U
LIU CLK 1/ 2
D
b
g
RS232 Synchro
POWER
H/S
Power LED
BS0847
UE 22L
FRONT PANEL
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-11
Issue 3 June 2010
Hub hardware
Front panel ports
....................................................................................................................................................................................................................................
Front panel ports

The following table describes the port reservations on the Hub ports on the chassis.
Table 4-5
Hub port reservations
Board type/location
Label
Marker
Function
NBMASW1
GEO
X01
Transport F-0
AB/M07
GE1
X02
Transport F-1
GE2
X03
Alarm panel
GE3
X04
Transport F-2
BaseT
X06
Serial Over LAN
UPF
X07
LSN Cross-connect
UPB
X08
Not used
CP
X09
SoL access
CI
X10
Installation
NBMASW1
GEO
X01
Transport F-0
AB/M08
GE1
X02
Transport F-1
GE2
X03
Alarm panel
GE3
X04
Transport F-2
BaseT
X06
Serial Over LAN
UPF
X07
LSN Cross-connect
UPB
X08
Not used
CP
X09
SoL access
CI
X10
Installation
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-12
Issue 3 June 2010
Hub hardware
Front panel ports
....................................................................................................................................................................................................................................
Gigabit Ethernet ports
This section provides details about the Hub front panel ports and pin assignments.
The following table describes the X3401 and 3501 pin assignments for the Gig-E ports.
Table 4-6
Ethernet port X3401 and 3501 pin assignment
Pin #
Pin name
1
FP_DA+ (TX+)
FP_DA- (TX-)
FP_DB+ (RX+)
FP_DC+
FP_DC-
FP_DB- (RX-)
FP_DD+
FP_DD
Stacked Fast-Ethernet ports
The following table describes the X3402 pin assignments for the stacked Fast-Ethernet
ports.
Table 4-7
Pin #
Pin name
1
DBG_DA+ (TX+)
DBG_DA- (TX-)
DBG_DB+ (RX+)
DBG_DC+
DBG_DC-
DBG_DB- (RX-)
DBG_DD+
DBG_DD-
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-13
Issue 3 June 2010
Hub hardware
Front panel ports
....................................................................................................................................................................................................................................
USB connector
The X5505 connector provides a USB port. The connector integrates the Ethernet
magnetics.
The following table describes the X5505 pin assignements for the USB connector.
Table 4-8

USB interface
+5V
DATA-
DATA+
GND
Two mini USB connectors provide interfaces for two 9pin standard DB9 links. The
The following table describes the X5503 pin connectors on the CPU debug port.
Table 4-9

Pin
Signal on X5503
Nc
CPU _TX_DEBUG
CPU _RX_DEBUG
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-14
Issue 3 June 2010
Hub hardware
Front panel ports
....................................................................................................................................................................................................................................
Table 4-9
(continued)
Pin
Signal on X5503
MLOG
The following table describes the X5504 pin connectors on the IPMC debug connector.
Table 4-10

Pin
Signal on X5504
Nc
IPMC _TX_DEBUG
IPMC _RX_DEBUG
MLOG
....................................................................................................................................................................................................................................
255-400-209R8.0.1
4-15
Issue 3 June 2010

5
Overview
Purpose
This chapter describes the functions and features of the Processor blade and describes the
connections to external interfaces.
Contents
Hardware details
5-2
5-9
Processor blade RTM
5-10
Front panel ports
5-12
SS7 AMC module
5-14
...................................................................................................................................................................................................................................
255-400-209R8.0.1
5-1
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Hardware details
Introduction
The Processor blade (FMO16JB or FM016JP) is an Advanced Telecom Computing

Architecture (ATCA) control (CPU) module. The processor blade is a general purpose,
flexible module that complies with ATCA PICMG 3.0 R2.0 and PICMG 3.1 option 1
standards. The Processor blade also has two standardized Advanced Mezzanine Card
(AMC) slots in compliance with ATCA AMC.1 and AMC.3 standards for PCI Express
and Storage interfaces.
Processor blade and the chassis
The processor blade can be installed in any node slot in the 5060 chassis. The chassis can
house:
2 hub modules
12 node modules
2 dedicated shelf managers
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-2
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
The processor node module meets 5060 MGC-8 standard requirements. The following
figure shows the processor module extracted from the chassis with the side view and front
panel of the processor module.
Figure 5-1 Processor Blade (FM016JB or FM016JP)
FMD16BC
NBDM14
3CMO2685
ABAA
1
BS0815U
OKJJ
GEO
GE1
RST
CP
USB
SIDE
FRONT
Table 5-1
Processor blade physical specifications
Characteristic
Dimension
Height
8U/322.25 mm
Depth
280 mm
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-3
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Table 5-1
Processor blade physical specifications
(continued)
Characteristic
Dimension
Pitch
30.48 mm
Input power voltage
36 & 75 VDC (48 VDC nom.)
Power consumption per Processor blade with

AMC
290 W max
Ambient temperature
Weight

2.85 kg (no AMC)
Power supply for AMC
50 W max
CPU
The CPU platform implements eight double data rate 2 (DDR2) DIMM slots for a
maximum memory capacity of 32 GB using the current 4-GB DIMMs and is open for 64
GB depending on 8 GB RDIMM availability.
The processor blade CPU has the following technical specifications:
Two AMD HE2344, Opteron Quad core Processor,

Up to 32Gbytes (8x 4GB DDR2) organized in eigth DIMMs slots 240pins with ECC
running at 667MHz,
Two BCM HyperTransport(HT) System I/O Controller
Two Intel 82571EB dual Gigabit Ethernet Controller
One BCM57710 dual 10 Gigabit Ethernet Controller

One LSISAS1064E SAS Controller
One SST55LD019 IDE controller
One SCH4304 super I/O controller
One LCMXO2280C (GSTPMO) for hardware management
I/O interfaces
The processor blade has interfaces to communicate with external elements such as the
chassis, and configuration and debug tools.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-4
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
The following table describes the I/O interfaces of the processor blade.
Table 5-2
Interfaces
Back panel
Specifications
2 x SERDES Gigabit Ethernet interfaces for

communication with the fabric interface of up to 2
hub modules.
2 x 1000Base-T Gigabit Ethernet interfaces for

communication with the base interface of up to 2 hub
modules.
1 redundant IPMI interface for connection to the shelf

manager.
1 synchronization interface for the 5060 MGC-8

chassis.
1 redundant -48 V power supply interface.

Front panel
See Processor blade front panel ports (p. 5-6) for

details on the front-panel ports.
RTM
2 - PCI-Express 4X interface connected to the pilot

CPU.
1 - IPMC and management interface for RTM FRU

management.
1 - Group of 8 E1/T1 ports connected to both AMC

slots.
4 - SAS ports for hard disk connectivity.
12 V payload power supply and 5 V management

power supply interfaces.
1 - ICE port for disk controller debug.
1 - RS232 debug port connected to LSI controller.
1 - JTAG interface, including reserved signal for

2 - USB ports.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-5
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Table 5-2
(continued)
Interfaces
Specifications
AMC slot
1 - IPMC and management interface for AMC FRU

management.
1 - Group of 8 E1/T1 interfaces connected to the

AMC slot.
1 - 4-lane PCI-Express interfaces connected to the

control CPU with associated synchronization.
2 - SAS ports for hard disk connectivity.
1 - JTAG interface, including reserved signal for

Processor blade front panel
The front panel of the processor blade is equipped with the following:
ports or interfacing with external devices

LEDs for access to module status
AMC slot
a push button
The following table describes the functions and connections of the front-panel ports for
processor blades.
Table 5-3
Front-panel Ports
Function
2 x 10/100/1000Base-T Ethernet

the CPU.
Debug USB

the CPU.
2 serial ports
For debug or engineering purposes. One connected to the

CPU, the other connected to the IPMC module.
Push button
For module reset
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-6
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Management LEDs
The processor blade front panel includes 4 LEDs in compliance with the 5060 MGC-8
standard. The front panel also includes two Ethernet LEDs for each of the two Ethernet
ports.
The following table lists and describes the LEDs on the processor blade front panel.
Table 5-4
Management LEDs for processor blade
LED
Color
Ready for
Hot Swap
Blue LED
Blue
Out of
Service LED
1
Red
LED 2
Green
LED 3
Amber
State
Hot swap indicator as defined in the ATCA standard. Shows

processor blade IPMI status.
Blinking when a failure is detected during self-test.
Steady red when an alarm is detected.
OFF until card is in M4 status.
Steady as soon as the IPMC module triggers payload

power-on.
Off is a power supply error is detected.
Front panel Ethernet LEDs
The processor blade front panel includes also two Ethernet LEDs; one for each of the two
Ethernet ports. There is no standard associated with these LEDs.
However a platform policy is defined so that the LEDs on the RJ45 interface are
configured to report as follows:
Link status - LED is yellow in the case of an established link. Otherwise the LED is
off.
Link activity - LED is green when transmit or receive activity is detected. The LED is
off if no activity is detected or if no link is connected.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-7
Issue 3 June 2010
Hardware details
....................................................................................................................................................................................................................................
Processor blade configurations
Each processor blade has one AMC slot. Alcatel-Lucent equips this slot with AMC
modules as required for a particular configuration. The following table provides examples
of how the processor blade is equipped in various configurations.
The following table describes the configuration options for the processor blade with or
without the AMC.
Table 5-5
Processor blade configuration options
CLEI
Mnemonic
Orderable
Item (OI)
Description
NGC5ANYMAA
FM016JB
3CM03285JB
Processor card with 16GB

memory
NGC5ANZMAA
FM016JP
3CM03285JP
Processor card with 16GB

memory + SS7 AMC
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-8
Issue 3 June 2010
....................................................................................................................................................................................................................................
The Processor blade is an Advanced TCA embedded dual processor AMD Opteron
Socket-F (1207) multiprocessing single board computer (SBC) designed to operate as a
node board in an ATCA shelf.
The processor blade includes:
A pilot CPU block that provides computational power
A card-management and common-card-resource block
The following diagram shows an architectural overview of the processor blade.

Figure 5-2 Processor blade architecture overview
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-9
Issue 3 June 2010
Processor blade RTM
....................................................................................................................................................................................................................................
Processor blade RTM

The RTM (RPCMHDDA) for the Processor (FM016JP) is an optional element. The
RPCMHDDA RTM is associated with the 8-port E1/T1 rear access SS7 AMC hosted by
the processor blades. It can also be associated with traffic or database cards without a SS7
AMC for its disk storage.
The following connections are provided:
8x physical E1/T1 links coming from an AMC site located on the front board:
Uses a HE5-HD (High Density) connector for 8 E1/T1
Supports 75/100/120 ohm line impedance matching
2x 1000 Base-T Ethernet coming from the CPU located on the front board which uses
the RJ45 connector on the face plate.
Support for one Hard Disk drive:
2.5 inch drive
300GB capacity
The following figure shows the processor blade RTM front panel details.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-10
Issue 3 June 2010
Processor blade RTM
....................................................................................................................................................................................................................................
Figure 5-3 Processor blade RTM front panel

RPCMHDxA
P
C
M
POWER
H/S
FRONT PANEL
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-11
Issue 3 June 2010
Front panel ports
....................................................................................................................................................................................................................................
Front panel ports

This section provides details about the Processor blade front panel ports and pin
assignments.
Stacked Fast-Ethernet ports
One stacked connector (labelled X5101) provides interfaces for two standard 1000Base-T
Ethernet RJ45 ports for debug purposes. The following table describes the X5101 pin
assignements.
Table 5-6
Pin #
Pin name
1
DBG_DA+ (TX+)
DBG_DA- (TX-)
DBG_DB+ (RX+)
DBG_DC+
DBG_DC-
DBG_DB- (RX-)
DBG_DD+
DBG_DD
USB connector
The X5504 connector provides a USB port. The connectors integrate the Ethernet
magnetics.
Table 5-7

USB interface
1
+5 V
DATA-
DATA+
GND
2 - Mini USB connectors provide interfaces for two 9pin standard DB9 links. The
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-12
Issue 3 June 2010
Front panel ports
....................................................................................................................................................................................................................................
The following table describes the X5506 signal on the CPU debug connector pins.
Table 5-8

Pin
Signal on X5506
MLOG
CPU _TX_DEBUG
CPU _RX_DEBUG
MLOG
The following table describes the X5505 signal on the IPMC debug port.
Table 5-9

Pin
Signal on X5505
MLOG
IPMC _TX_DEBUG
IPMC _RX_DEBUG
MLOG
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-13
Issue 3 June 2010
SS7 AMC module
....................................................................................................................................................................................................................................
SS7 AMC module

Description
The Interphase iSPAN 3640 Advanced Mezzanine Card (AMC) enhances the Processor
card FM016JP with E1/T1 connectivity and SS No. 7 functionality.
The Interphase iSPAN 3640 AMC has the following charicteristics:
8 E1/T1/J1 interfaces
31 SS7 Low Speed Links (LSL) per interface
rear acces ports
MPC8568 processor
Front panel LEDs
The following table describes the functions and connections of the front-panel ports for
SS7 AMCs.
Table 5-10
LED
Color
States
Normal State
Ready for Hot

Swap Blue
LED
Blue
Out of
Service
Red
Driven by the MMC
Off
PGD
Amber / Green (Healthy

/ Power- Good)
Driven by the MMC
Green
Amber ON while
payload is not
powered on
On
Set to green by the

shelf manager after
the payload is
powered on
Hot swap LED

driven by the MMC
Steady blue when

hot-swap ready
On
CPU
Amber / Green
Driven by the MPC8568

user programmable
(slightly ON when
power is available)
On
T1/E1 LEDs
0 to 3 (or 7)
Green / Red
Green
Green when the link

is up
On
Red when there is a

red alarm on the line
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-14
Issue 3 June 2010
SS7 AMC module
....................................................................................................................................................................................................................................
....................................................................................................................................................................................................................................
255-400-209R8.0.1
5-15
Issue 3 June 2010

6
Overview
Purpose
This chapter provides details about the internal and external connections of the ATCA
chassis (SAV2AB).
Contents
6-2
6-3
...................................................................................................................................................................................................................................
255-400-209R8.0.1
6-1
Issue 3 June 2010
....................................................................................................................................................................................................................................
Intra-chassis connections
Within a chassis, the intra-chassis communications are provided by the 5060 MGC-8
chassis backplane and the blades.
Transport network connections
A transport hub terminates external transport interfaces for the system. The term transport
hub applies to the hub blades in the chassis that is equipped first. A pair of hub blades
terminate external connections. The left and right LANs grow outward from the Transport
Hubs. A new chassis is grown by inserting it into the Local Secure Network (LSN) in the
position of the wrap-around (dashed) link, which is normally disabled, and then
reconnecting the wrap-around link to a new chassis.
Depending on the required capacity and the operator's network configuration, up to six
transport network interfaces can be created. Connections 1 to 4 are primary transport
network interfaces and connections 5 and 6 are extended transport network interfaces.
Three transport network connections on the RTM (NASYS) will be used for connectivity
to the customer's network. Two transport connections on the front panel will be used for
port mirroring and alarm panel connectivity.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
6-2
Issue 3 June 2010
....................................................................................................................................................................................................................................

Port designations
Table 6-1
Single-chassis port designations
Part
Port number
Purpose
Shelf Manager Board

(NBSMC)
FE0
FE port
Hub blades (NBMASW1)
GE0 to GE3
Base accesses, GE,

auto-negotiated, and auto-MDIX
ports
Base T
Ethernet port
GE0 to GE3
Base accesses, GE,

ports
GE4 to GE5
GE, auto-negotiated, and

auto-MDIX ports; Directly
connected to each CPU
GE0 to GE1
Base accesses, GE,

ports
OAM Processor (NBRZAL)
Processor blades
(FM016JB/FM016JP)
Wiring types
The following types of wiring are required for an 5060 MGC-8 platform in a
single-chassis configuration:
Serial cables for debug and/or installation

Ethernet cables, on copper cable or optical fiber medium
Alarm link cables (for optional Alarm Module)
Table 6-2
Object
Cables for single-chassis configuration

Code
Function
JLCAT6
1AB2298300xx
CAT6 S-FTP straight cord
LSMUD9
1AB360300001
DB9F-to-mini USB Serial link
DLANM120
3BL02197AA
120 ohms E1 link to DDF
KRACG121
3BW12321AB
4 x 8 pairs terminal blocks kit
PVTBSYM
1AB227470001
External 120/75 ohms terminal
....................................................................................................................................................................................................................................
255-400-209R8.0.1
6-3
Issue 3 June 2010
....................................................................................................................................................................................................................................
Serial link cables
Serial links cables (LSMUD9) are used for debugging and/or installation mode only. Two
LSMUD9 cables are required for each chassis. The LSMUD9 cable connects to the serial
ports of the processor blade or Hub on the 5060 MGC-8 side and connect to the DB9
Serial port on an external PC.
Ethernet link cables
For Ethernet, Fast Ethernet (FE), and Giga Ethernet (GE) links, all cables must be GE
compliant. All Ethernet links are from the 5060 MGC-8 chassis or S/R accesses.
Four ports (GE0, GE1, GE3 and Base T) on the front of the Hub (NBMASW1) and five
ports (CPU0, GE0, GE1, GE2, and GE3) on the Hub RTM (NASYS) provide SoL and
Transport to customer accesses.
Transport access is provided by ports GE4 and GE5 on the OAM Server (NBRZAL) of
the first chassis. Eight JLCAT6 cables are provided to fulfill this function. Their lengths
are customer dependent. If the target is in the same chassis the 3m length cables should be
used.
Alarm link cables
If the optional Alarm Module (RALARMAA) is used in a cabinet configuration, the

JLDAW cable is used to make the connection between the rear of the PDU (SAPDUAA)
and the top of the rack.
....................................................................................................................................................................................................................................
255-400-209R8.0.1
6-4
Issue 3 June 2010
Part information
7
Overview
Purpose
This chapter provides an explanation of part numbers and their associated Orderable
Items (OI) number, Mnemonic number, CLEI codes, and descriptions of the switch
modules.
Contents
7-2
CLEI codes
7-4
Field Replaceable Units
7-5
7-7
...................................................................................................................................................................................................................................
255-400-209R8.0.1
7-1
Issue 3 June 2010
Part information
....................................................................................................................................................................................................................................

The table below provides a list of components and part numbers for the base system of a
chassis and its respective components for a stand-alone configuration.
Table 7-1
Description
Quantity
Mnemonic
Part Number
Chassis
SAV2AB
3CM02395AB
Hub Switch 1GB
NBMASW1
3CM02660CA
OAM Server
NBRZAL
3CM02859CL
Traffic Processor 16 GB
Up to 10
FM016JB
3CM03285JB
Traffic Processor 16 GB +
SS7 AMC
Up to 10
FM016JP
3CM03285JP
NASYS
3CM02570AA
RPCMHDDA
3CM03238DA
RTM 8E1/T1 75/120 +

1xHDD 300GB
Up to 10
Fan Tray Bottom
SFB300AA
3CM03108AA
Fan Tray Top
SFT300AA
3CM03109AA
Shelf Manager of ATCA Shelf
NBSHMC
3CM02418AA
RTM Rear Filler
4 - 14
NAFILL
3CM02577AA
Front Board Filler
0-8
NBFILL
3CM02578AA
Air Filter Board Side
NDAFF
3CM02587AA
Air Filter RTM Side
NDAFR
3CM02588AA
3U Bottom Deflector for

Chassis
MABAFBAA
3CM03235AA
3U Top Deflector for Chassis
MABAFTAA
3CM03302AA
Front Cable Tray for Chassis
KMFT1
3CM03070AA
Rear Cable Tray for Chassis
KMRT2
3CM03071AA
....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-2
Issue 3 June 2010
Part information
....................................................................................................................................................................................................................................
Cabinet components
In a configuration using a cabinet, the following components are required in addition to

the Chassis System Components list in Table 7-1, Chassis system components (p. 7-2).
Table 7-2
Cabinet system components
Description
Quantity
Mnemonic
Part Number
Cabinet 44U
NRA244AA
3CM02769AA
DC Power Distribution
SAPDUAA
3CM02902AA
Alarm Module
RALARMAA
3CM02949AA
Mounting Kit
KPDUJ1
3CM03650AA
....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-3
Issue 3 June 2010
Part information
CLEI codes
....................................................................................................................................................................................................................................
CLEI codes
The Common Language Equipment Identification (CLEI) Code contains intelligent
ten-character codes that can identify telecommunications equipment with great precision.
Accepted by telecommunications providers as the industry standard, its primary
applications include inventory control, investment tracking and provisioning. There is
also a 1:1 relationship between a CLEI code and a vendor's Product ID. The Product ID
defines the manufacturer, part number and manufacturing version of that part number. For
further information on code types, refer to the Telcordia document GR-485-CORE,
"Generic Requirements for Common Language Equipment Coding Processes and
Guidelines."
The following table provides a list of CLEI codes for the switching system equipment.
Table 7-3
CLEI Codes
Component
Mnemonic
Part Number
CLEI Code
Chassis
SAV2AB
3CM02395AB
NGMNH00DRA
Hub 1GB
NBMASW1
3CM02660CA
NGC5AHWMAA
OAM Server 1HDD 147G 8GB
NBRZAL
3CM02859CL
NGC5AH1MAA
Processor Blade 16GB
FM016JB
3CM03285JB
NGC5ANYMAA
Processor Blade 16GB + SS7

AMC
FM016JP
3CM03285JP
NGC5ANZMAA
NASYS
3CM02570AA
NGC5AHZMAA
RTM 8E1/T1 75/120 + 1xHDD

300GB
RPCMHDDA
3CM03238DA
NG17AXT2AA
Top Fan Tray 300W
SFT300AA
3CM03109AA
NGC5ANCFAA
Bottom Fan Tray 300W
SFB300AA
3CM03108AA
NGC5ANBFAA
Shelf Manager
NBSHMC
3CM02418AA
NGC5AGJMAA
Alarm Module
RALARMAA
3CM02949AA
NGC5AGLMAA
....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-4
Issue 3 June 2010
Part information
....................................................................................................................................................................................................................................

The following elements are considered to be Field-Replaceable Units (FRU) within the
5060 MGC-8. FRU status indicates that customers can order these items as spare units,
and use them as replacements using published procedures.
Table 7-4
Component
Type
Mnemonic
Part Number
Hub
Blade
NBMASW1
3CM02660CA
OAM server
Blade
NBRZAL
3CM02859CL
Processor 16 GB memory
Blade
FM016JB
3CMO3285JB
Processor 16 GB memory +SS7
Blade
FM016JP
3CMO3285JP
RTM - Synchro & Switching

for Hub
Blade
NASYS
3CM02570AA
RTM - T1/E1 + 1xHDD 300G
Blade
RPCMHDDA
3CM03238DA
Shelf Management Controller
Blade
NBSHMC
3CM02418AA
Fan Tray - Bottom (300W)
Module
SFB300AA
3CM03108AA
Fan Tray - Top (300W)
Module
SFT300AA
3CM03109AA
Air filter Front
Mechanical
NDAFF
3CM02587AA
Air filter Rear
Mechanical
NDAFR
3CM02588AA
10G Cable 0.5M
Mechanical
JLE10G
1AB370280001
10G Cable 1M
Mechanical
JLE10G
1AB370280002
10G Cable 2M
Mechanical
JLE10G
1AB370280003
10G Cable 3M
Mechanical
JLE10G
1AB370280004
10G Cable 4M
Mechanical
JLE10G
1AB370280005
10G Cable 5M
Mechanical
JLE10G
1AB370280006
10G Cable 10M
Mechanical
JLE10G
1AB370280007
10G Cable 7M
Mechanical
JLE10G
1AB370280008
Front Filler Blanks
Mechanical
NBFILL
3CM02578AA
Rear Filler Blanks
Mechanical
NAFILL
3CM02577AA
DC Power Distribution
Mechanical
SAPDUAA
3CM02902AA
Alarm Module
Module
RALARMAA
3CM02949AA
Fuse Kit
Mechanical
KPDUJ1
3CM03650AA
Cabinet
Mechanical
NRA244AA
3CM02769
Mounting Kit for Cabinet
Mechanical
KMPJ1
3CM03649AA
....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-5
Issue 3 June 2010
Part information
....................................................................................................................................................................................................................................
Table 7-4
Component
Type
(continued)
Mnemonic
Part Number
Cords Support
Mechanical
KMFT1
3CM03070AA
Cords Support
Mechanical
KMRT2
3CM03071AA
Deflector 3U 300W Bottom
Mechanical
MABAFBAA
3CM03235AA
Deflector 4U 300W Middle
Mechanical
MABAF4AA
3CM03302AA
Deflector 3U 300W Top
Mechanical
MABAFTAA
3CM03236AA
....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-6
Issue 3 June 2010
Part information
....................................................................................................................................................................................................................................
For a list of customer documentation related to this release, see Table 2, Manuals and
part numbers (p. xv) . Manuals and Part Numbers, lists the standard set of
Alcatel-Lucent Gateway Platform documentation, their part numbers and a brief
description. Other manuals, which are available upon purchase of additional software, are
listed in Table 3, Other documentation (p. xvii).
....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-7
Issue 3 June 2010
Glossary
...................................................................................................................................................................................................................................
Numerics
1310 OMC-P
1310 Operations & Maintenance Center - Plus

3GPP2
Third Generation Partnership Project

...................................................................................................................................................................................................................................
ACCM
ATCA Centralized Compute Module

ADCM
ATCA Distributed Compute Module

ALG
Application Level Gateway

AMC
Advanced Mezzanine Card

API
Application Programming Interface

ATCA
Advanced Telecommunication Architecture

...................................................................................................................................................................................................................................
B2BUA
back-to-back user agent

BCF
Border Controller Function

BGW
Border Gateway
BTS
Billing and Traffic System

....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-1
Issue 3 June 2010
Glossary
....................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
CAC
Context admission control

CCS
Connection Control and Signaling process

CDMA
Code Division Multiple Access

CDR
Call Detail Record

CLI
command line interface

CRBT
Caller Ring Back Tone

...................................................................................................................................................................................................................................
DB
Database Blade
DDoS
Distributed Denial of Service

DHCP
Dynamic Host Configuration Protocol

DoS
Denial of Service
DSCP
Differentiated Services Code Point

DSP
Digital Signal Processing

...................................................................................................................................................................................................................................
EMC
Electro Magnetic Compatibility

EO
End Office
ETSI
European Telecommunications Standards Institute

....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-2
Issue 3 June 2010
Glossary
....................................................................................................................................................................................................................................
EVRC
Enhanced Variable Rate CODEC

...................................................................................................................................................................................................................................
FCAPS
Fault, Configuration, Accounting, Performance, and Security

FGCP
FortiGate Clustering Protocol

FRU
Field-Replaceable Unit
...................................................................................................................................................................................................................................
GMSC
Gateway Mobile Switching Center

...................................................................................................................................................................................................................................
HDD
Hard Disk Drive

HSS
home subscriber server

...................................................................................................................................................................................................................................
I-CSCF
Interrogating Call Session Control Function

I2C
inter Integrated Circuit

IBCF
Interconnect Border Control Function

IBGF
Interworking Border Gateway Function

IMS
IP Multimedia Subsystem
INAP
Intelligent Network Application Part

IP
Internet Protocol
....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-3
Issue 3 June 2010
Glossary
....................................................................................................................................................................................................................................
IPDC
Internet Protocol Domain Connection

IPMB
Intelligent Platform Management Bus

IPMC
Intelligent Platform Management Controller

IPMI
Intelligent Platform Management Interface

IPS
Intrusion Prevention Service

IRAP
IP realm availability package

ISDN
Integrated Services Digital Network

...................................................................................................................................................................................................................................
LCR
Least Cost Routing

LED
Light Emitting Diode

LMSD
Legacy of Mobile Station Domain

LNP
Local Number Portability

LRN
Local Routing Number

LSN
local secure network

...................................................................................................................................................................................................................................
MGC
Media Gateway Controller

MGW
Media Gateway
....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-4
Issue 3 June 2010
Glossary
....................................................................................................................................................................................................................................
MSC
Mobile Services Switching Center

...................................................................................................................................................................................................................................
NAP
Network Access Point

NAPT
network address port translation

NAT
Network Address Translation

NEBS
Network Equipment Building Standards

NGN
Next Generation Networks

...................................................................................................................................................................................................................................
OAM
operations, administration, and maintenance

OAM
Operation and Maintenance

OAM&P
Operations, Administration, Maintenance, and Provisioning

OB
OAM Blade
OMC
Operations and Maintenance Center

...................................................................................................................................................................................................................................
P-CSCF
Proxy-Call Session Control Function

PDU
Power Distribution Unit

PEM
power entry module

PSTN
Public Switched Telephone Network

....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-5
Issue 3 June 2010
Glossary
....................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................
QoS
Quality of Service
...................................................................................................................................................................................................................................
RACF
Resource Access Control Facility

RTCP
Real Time Transport Control Protocol

RTM
rear transition module

RTP
Real Time Transport Protocol

...................................................................................................................................................................................................................................
S-CSCF
Serving Call Session Control Function

SCTP
Stream Control Transport Protocol

SDP
Session Description Profile

SFW
Signaling Firewall
ShMC
Shelf Management Controller blade

SIP
Session Initiation Protocol

SNMP
Simple Network Management Protocol

SOL
Serial over LAN

...................................................................................................................................................................................................................................
TDM
Time Division Multiplexing
....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-6
Issue 3 June 2010
Glossary
....................................................................................................................................................................................................................................
TGW
trunking gateway
TISPAN
Telecommunications and Internet Converged Services and Protocols for Advanced Networking
TL1
Transaction Language 1
TrFO
Transcoder Free Operation

...................................................................................................................................................................................................................................
UDP
User Datagram Protocol

UE
User Equipment
URI
Uniform Resource Identifiers

USB
Universal Serial Bus

...................................................................................................................................................................................................................................
VDOM
Virtual domain
VLAN
Virtual Local Area Network

VMG
virtual media gateway
....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-7
Issue 3 June 2010
Index
Numerics
5060 MGC-8
wiring types, 6-3
5060 MGC-8/VSG
description, 1-1
cabling and connections

intra-chassis connections, 6-2
transport network connections,
6-2
chassis
.............................................................
D dimensions
chassis, 2-7
Hub, 2-15
design, 1-2
dimensions, 2-7
shelf management controller,

2-25
hardware elements, 1-3
environmental specifications,
2-7
standards, 1-2
.............................................................
functional description, 2-4

A Advanced Telecommunications
Computing Architecture
See: ATCA
ATCA
standards, 1-2
ATCA standards
functions, 2-8
mechanical standards, 2-9
physical components, 2-8

power, 2-7
slot assignments, 2-6
design implications, 1-2
slots, 2-5
.............................................................
B backplane
description, 2-10
base system, 7-2
.............................................................
C cables
Ethernet link, 6-4

serial link, 6-3
part number, xiv

relationships between, xv
.............................................................
modules, 1-6
certification, 1-3
audience, xiv
documentation
standards, 2-9
technical description, 2-8
CLEI codes, 7-4
contact information
how to comment, xx
F Field Replaceable Units
See: FRU
FRU
Hub, 7-5
processor blade, 7-5
RTM, 7-5
RTM T1/E1, 7-5
Shelf management controller,
7-5
functions of components, 2-8
installation support, xviii
.............................................................
RMA process, xx
G glossary, GL-1
technical support, xviii
.............................................................
customer documentation
organization, xiv
H Hub
CPU, 4-4
....................................................................................................................................................................................................................................
255-400-209R8.0.1
IN-1
Issue 3 June 2010
Index
....................................................................................................................................................................................................................................
description, 2-14
preface, xiii
dimensions, 2-15
processor blade
front panel diagram, 2-16

hub
Hub
configurations, 5-8
CPU, 5-4
CPU debug connector, 5-13
description, 2-17
front panel ports, 4-8, 4-12
front panel, 5-6
hardware architecture, 4-9
I/O interfaces, 4-5
front panel ports, 5-12
management LEDs, 4-8
GigE ports, 5-12
physical specifications, 4-2
hardware architecture, 5-9
RTM, 4-10
hardware details, 5-2
.............................................................
I/O interfaces, 5-4
K KMFT1, 2-9
IPMC debug connector, 5-13
KMRT2, 2-9
.............................................................
M MABAF4AA, 2-9
MABAFBAA, 2-9
modules
management LEDs, 5-6

mini-USB debug connectors,
5-12
RTM, 5-10
USB connector, 5-12
.............................................................
part numbers, 1-6

R rear transition modules
.............................................................
N NASYS, 2-19, 2-19
See: RTM
RTM
NDAFF, 2-9
description, 2-19
NDAFR, 2-9
NASYS description, 2-19
.............................................................
O OAM server, 2-13
description, 2-13
.............................................................
P part numbers
documentation, xv
power
chassis, 2-7
overview, 2-19
.............................................................
S SAV2AB, 2-4
shelf management controller, 2-23

dimensions, 2-25
.............................................................
W wiring
5060 MGC-8 ports, 6-3
power supply, 2-26

....................................................................................................................................................................................................................................
255-400-209R8.0.1
IN-2
Issue 3 June 2010

Lingua

Benvenuto in Scribd!

5060 MGC-8 Hardware Guide

Caricato da

Informazioni sul documento

Descrizione:

Data di caricamento

Copyright

Formati disponibili

Condividi questo documento

Condividi o incorpora il documento

Opzioni di condivisione

Hai trovato utile questo documento?

Questo contenuto è inappropriato?

Descrizione:

Copyright:

Formati disponibili

5060 MGC-8 Hardware Guide

Caricato da

Descrizione:

Copyright:

Formati disponibili

Titoli correlati

Title page

Alcatel-Lucent Gateway Platform

Always observe the Safety Instructions when operating the system.

The ordering number of this document is 255-400-209

Reason for revision

Audience ........................................................................................................................................................................................ xiv

Relationship between documents

Contact information ................................................................................................................................................................ xviii

OAM server (NBRZAL) ....................................................................................................................................................... 2-13

Processor blade (FM016JB or FM016JP)

Rear Transition Modules (NASYS or RPCMHDDA)

Shelf management controller (NBSHMC) ..................................................................................................................... 2-23

OAM server hardware details

Hardware details ......................................................................................................................................................................... 3-3

Hub RTM .................................................................................................................................................................................... 4-10

Processor blade hardware

Processor blade RTM

Front panel ports

SS7 AMC module

Cabling and connections

Wiring for 5060 MGC-8 ports

CLEI codes ................................................................................................................................................................................... 7-4

Reason for reissue

Manuals and part numbers

Chassis slot description

Cabinet configuration components

Cabinet dimensions ................................................................................................................................................... 2-3

Chassis slots ................................................................................................................................................................. 2-5

Chassis power specifications ................................................................................................................................. 2-7

Functions of physical components

Fan tray dimensions

Processor blade dimensions

Shelf management controller dimensions

OAM server module physical specifications ................................................................................................... 3-5

OAM server module interfaces

OAM server with AMC - front panel ports

Management LEDs for OAM server with AMC

X3401 and 3501 pin assignment

X3402 pin assignment

X5505 pin assignment

CPU debug connector pins

IPMC debug connector pins ................................................................................................................................ 3-14

Hub physical specifications

Hub I/O interfaces

Hub front panel ports

Hub management LEDs

Hub port reservations ............................................................................................................................................. 4-12

Ethernet port X3401 and 3501 pin assignment

X3402 pin assignment

X5505 pin assignment

CPU debug connector pins

IPMC debug connector pins ................................................................................................................................ 4-15

Processor blade physical specifications ............................................................................................................. 5-3

Processor blade interfaces

Processor blade front panel ports ......................................................................................................................... 5-6

Management LEDs for processor blade

Processor blade configuration options