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Title page

Alcatel-Lucent Gateway Platform


Release 8.0.1
Hardware Guide for 5060 MGC-8

255-400-209R8.0.1
ISSUE 3
JUNE 2010

Legal notice
Legal notice

Alcatel, Lucent, Alcatel-Lucent and the Alcatel-Lucent logo are trademarks of Alcatel-Lucent. All other trademarks are the property of their respective
owners.
The information presented is subject to change without notice. Alcatel-Lucent assumes no responsibility for inaccuracies contained herein.
Copyright 2010 Alcatel-Lucent. All rights reserved.
Notice

Every effort has been made to ensure that the information in this document was complete and accurate at the time of printing. However, information is
subject to change.
Safety

Always observe the Safety Instructions when operating the system.


Ordering information

The ordering number of this document is 255-400-209


Technical support

Please contact your Alcatel-Lucent Services Business Group (SBG) for technical questions about the information in this document.

Contents
About this document
Purpose

.......................................................................................................................................................................................... xiii
xiii

Reason for revision

................................................................................................................................................................... xiii
xiii

Audience ........................................................................................................................................................................................ xiv


xiv
Part number

.................................................................................................................................................................................. xiv
xiv

Document organization

............................................................................................................................................................ xiv
xiv

Relationship between documents

.......................................................................................................................................... xv
xv

Contact information ................................................................................................................................................................ xviii


xviii
How to comment .......................................................................................................................................................................... xx
xx
1

Platform description
Overview ....................................................................................................................................................................................... 1-1
1-1
Platform design ........................................................................................................................................................................... 1-2
1-2

Hardware components
Overview ....................................................................................................................................................................................... 2-1
2-1
Cabinet (NRA244AA)
Chassis (SAV2AB)

............................................................................................................................................................. 2-2
2-2

.................................................................................................................................................................... 2-4
2-4

OAM server (NBRZAL) ....................................................................................................................................................... 2-13


2-13
Hub (NBMASW1)

.................................................................................................................................................................. 2-14
2-14

Processor blade (FM016JB or FM016JP)

..................................................................................................................... 2-17

Rear Transition Modules (NASYS or RPCMHDDA)

............................................................................................... 2-19

Shelf management controller (NBSHMC) ..................................................................................................................... 2-23


Power supply ............................................................................................................................................................................. 2-26
2-26
Fillers

........................................................................................................................................................................................... 2-29
2-29

....................................................................................................................................................................................................................................
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Contents
....................................................................................................................................................................................................................................

OAM server hardware details


Overview ....................................................................................................................................................................................... 3-1
3-1
OAM server module

................................................................................................................................................................. 3-2
3-2

Hardware details ......................................................................................................................................................................... 3-3


3-3
Hardware description
Front panel ports
4

............................................................................................................................................................. 3-11
3-11

...................................................................................................................................................................... 3-12
3-12

Hub hardware
Overview ....................................................................................................................................................................................... 4-1
4-1
Hardware details ......................................................................................................................................................................... 4-2
4-2
Hardware architecture

.............................................................................................................................................................. 4-9
4-9

Hub RTM .................................................................................................................................................................................... 4-10


4-10
Front panel ports
5

...................................................................................................................................................................... 4-12
4-12

Processor blade hardware


Overview ....................................................................................................................................................................................... 5-1
5-1
Hardware details ......................................................................................................................................................................... 5-2
5-2
Hardware architecture

.............................................................................................................................................................. 5-9
5-9

Processor blade RTM

............................................................................................................................................................. 5-10
5-10

Front panel ports

...................................................................................................................................................................... 5-12
5-12

SS7 AMC module


6

................................................................................................................................................................... 5-14
5-14

Cabling and connections


Overview ....................................................................................................................................................................................... 6-1
6-1
Hardware connections

.............................................................................................................................................................. 6-2
6-2

Wiring for 5060 MGC-8 ports


7

.............................................................................................................................................. 6-3

Part information
Overview ....................................................................................................................................................................................... 7-1
7-1
Chassis system components

................................................................................................................................................... 7-2
7-2

....................................................................................................................................................................................................................................
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Contents
....................................................................................................................................................................................................................................

CLEI codes ................................................................................................................................................................................... 7-4


7-4
Field Replaceable Units ........................................................................................................................................................... 7-5
7-5
Customer documentation

........................................................................................................................................................ 7-7
7-7

Glossary
Index

....................................................................................................................................................................................................................................
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List of tables
1

Reason for reissue

..................................................................................................................................................... xiii
xiii

Manuals and part numbers

Other documentation

1-1

Chassis slot description

1-2

Cabinet configuration components

1-3

Module list

2-1

Cabinet dimensions ................................................................................................................................................... 2-3


2-3

2-2

Chassis slots ................................................................................................................................................................. 2-5


2-5

2-3

Chassis dimensions

2-4

Environmental specifications

2-5

Chassis power specifications ................................................................................................................................. 2-7

2-6

Functions of physical components

2-7

Fan tray dimensions

2-8

Processor blade dimensions

2-9

Hub dimensions

2-10

Shelf management controller dimensions

3-1

OAM server module physical specifications ................................................................................................... 3-5

3-2

OAM server module interfaces

3-3

OAM server with AMC - front panel ports

3-4

Management LEDs for OAM server with AMC

3-5

X3401 and 3501 pin assignment

3-6

X3402 pin assignment

........................................................................................................................................... 3-12

3-7

X5505 pin assignment

........................................................................................................................................... 3-13

....................................................................................................................................... xv

............................................................................................................................................... xvii
xvii
........................................................................................................................................... 1-5
1-5
..................................................................................................................... 1-6

................................................................................................................................................................... 1-6
1-6

................................................................................................................................................... 2-7
2-7
................................................................................................................................ 2-7

...................................................................................................................... 2-8

............................................................................................................................................... 2-12
2-12
................................................................................................................................ 2-13

....................................................................................................................................................... 2-15
2-15
...................................................................................................... 2-25

............................................................................................................................ 3-7
................................................................................................... 3-10
......................................................................................... 3-10

....................................................................................................................... 3-12

....................................................................................................................................................................................................................................
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List of tables
....................................................................................................................................................................................................................................

3-8

CPU debug connector pins

.................................................................................................................................. 3-13

3-9

IPMC debug connector pins ................................................................................................................................ 3-14

4-1

Hub physical specifications

4-2

Hub I/O interfaces

4-3

Hub front panel ports

4-4

Hub management LEDs

4-5

Hub port reservations ............................................................................................................................................. 4-12

4-6

Ethernet port X3401 and 3501 pin assignment

4-7

X3402 pin assignment

........................................................................................................................................... 4-13

4-8

X5505 pin assignment

........................................................................................................................................... 4-14

4-9

CPU debug connector pins

4-10

IPMC debug connector pins ................................................................................................................................ 4-15

5-1

Processor blade physical specifications ............................................................................................................. 5-3

5-2

Processor blade interfaces

5-3

Processor blade front panel ports ......................................................................................................................... 5-6

5-4

Management LEDs for processor blade

5-5

Processor blade configuration options

5-6

X5101 pin assignment

........................................................................................................................................... 5-12

5-7

X5505 pin assignment

........................................................................................................................................... 5-12

5-8

CPU debug connector pins

5-9

IPMC debug connector pins ................................................................................................................................ 5-13

5-10

Processor blade front panel ports

...................................................................................................................... 5-14

6-1

Single-chassis port designations

.......................................................................................................................... 6-3

6-2

Cables for single-chassis configuration ............................................................................................................. 6-3

7-1

Chassis system components ................................................................................................................................... 7-2

7-2

Cabinet system components

7-3

CLEI Codes

................................................................................................................................... 4-3

..................................................................................................................................................... 4-5
4-5
............................................................................................................................................... 4-8
.......................................................................................................................................... 4-8

............................................................................................ 4-13

.................................................................................................................................. 4-14

...................................................................................................................................... 5-5

............................................................................................................ 5-7

............................................................................................................... 5-8

.................................................................................................................................. 5-13

.................................................................................................................................. 7-3

................................................................................................................................................................. 7-4
7-4

....................................................................................................................................................................................................................................
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List of tables
....................................................................................................................................................................................................................................

7-4

List of Field Replaceable Units

............................................................................................................................ 7-5

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List of figures
1-1

5060 MGC-8/VSG single-chassis configuration

........................................................................................... 1-5

2-1

Cabinet (NRA244AA)

2-2

ATCA chassis (SAV2AB) photograph

2-3

Functional single-chassis configuration

2-4

Chassis front view

2-5

Chassis top view

2-6

Hub front panel

2-7

Processor blade front panel

2-8

Hub RTM front panel

2-9

Processor blade RTM (RPCMHDDA)

2-10

Shelf manager front panel

2-11

Power Distribution Unit (SAPDUAA) ............................................................................................................ 2-27

2-12

Alarm module (RALARMAA)

3-1

OAM server architecture overview ..................................................................................................................... 3-4

3-2

OAM server side view and front panel .............................................................................................................. 3-5

3-3

OAM server front panel

3-4

CPU and IPMC Debug connector

4-1

Hub side view and front panel

4-2

Hub front panel ........................................................................................................................................................... 4-7


4-7

4-3

Hub architecture overview

4-4

Hub RTM front view .............................................................................................................................................. 4-11

4-5

CPU and IPMC Debug connector

5-1

Processor Blade (FM016JB or FM016JP) ........................................................................................................ 5-3

............................................................................................................................................. 2-2
............................................................................................................... 2-4
............................................................................................................ 2-6

..................................................................................................................................................... 2-9
2-9

...................................................................................................................................................... 2-11
2-11

........................................................................................................................................................ 2-16
2-16
................................................................................................................................. 2-18

............................................................................................................................................ 2-20
............................................................................................................ 2-22

.................................................................................................................................... 2-24

.......................................................................................................................... 2-28

.......................................................................................................................................... 3-9
..................................................................................................................... 3-13

.............................................................................................................................. 4-3

..................................................................................................................................... 4-9

..................................................................................................................... 4-14

....................................................................................................................................................................................................................................
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List of figures
....................................................................................................................................................................................................................................

5-2

Processor blade architecture overview

.............................................................................................................. 5-9

5-3

Processor blade RTM front panel

...................................................................................................................... 5-11

5-4

CPU and IPMC Debug connector

..................................................................................................................... 5-13

....................................................................................................................................................................................................................................
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Issue 3 June 2010

About this document


About this document

Purpose

The Alcatel-Lucent Gateway Platform Hardware Guide for the 5060 MGC-8,
(255-400-209) is part of the overall Alcatel-Lucent Gateway Platform switch
documentation set. It is referred to as the Hardware Guide throughout this manual.
The Hardware Guide provides an overview of the switch and its features. Descriptions
and illustrations of the switch hardware are included, along with system specifications,
site engineering information, interconnect drawings, part numbers, and ordering
information for all hardware.
This section describes the Hardware Guide, how it relates to other manuals within the
switch documentation set, and reasons for reissuing this document. The following topics
are described in this introduction:

Reason for Reissue

Scope and Audience


Hardware Guide Organization
Using the CD-ROM

Relationship Between Manuals


Documentation Set

Reason for revision

This is Issue 1 of the Alcatel-Lucent Gateway Platform 5060 MGC-8/VSG Hardware


Guide.
Table 1

Reason for reissue

Chapter/Section

Description
Issue 3

Throughout

Changed product name 5060 MGC-8/VSG to 5060


MGC-8
Issue 2

...................................................................................................................................................................................................................................
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About this document


....................................................................................................................................................................................................................................

Table 1

Reason for reissue

(continued)

Chapter/Section

Description

Throughout

Minor edits

All

Issue 1

Audience

This manual is intended for personnel who are responsible for or who help to plan for the
installation, ordering, replacing, handling, and provisioning of the switch equipment using
TL1 commands and/or the 1310 OMC-P interface. These personnel must have a thorough
knowledge of telecommunications.
Note: The 1310 OMC-P interface sometimes refers to the modules in the switch as
cards. This document refers to such equipment as I/O module, IOM, or module. When
ordering modules, the name of the module, as listed in Chapter 6, Part Information,
should be used.
Part number

The part number for this guide is 255-400-209.


Document organization

This Hardware Guide contains an overview of all hardware supported by and needed to
run the Alcatel-Lucent Gateway Platform switch.
In addition to providing an overview of hardware needed to support the Alcatel-Lucent
Gateway Platform switching system, the Hardware Guide also contains the following
information:

A description of the switch manuals and Hardware Guide organization, general


information about the switch documentation, and information for contacting
Alcatel-Lucent technical services.
Physical dimensions and power and wire information about switch hardware.
Rack and physical locations of the front and rear modules, protection slots, LEDs,
push buttons, fan tray, fan filter, rear cables, and power and ground locations.
Building requirements, chassis dimensions, space requirements, grounding
requirements, power requirements, system interfaces, slot assignments, tools and test
equipment, an Installation Planning Checklist, and the switch configuration.
Parts information, which provides a list of part numbers for every switch-related
product which can be ordered.

For information regarding initial engineering, monitoring, and re-engineering for growth
in existing applications, refer to the Alcatel-Lucent Gateway Platform System Capacity,
Monitoring, and Engineering (SCME) Guidelines, (255-400-005).
....................................................................................................................................................................................................................................
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....................................................................................................................................................................................................................................

Relationship between documents

The Hardware Guide contains information and many illustrations of the hardware
components that must be provisioned before you can use the switch. Therefore, the
Hardware Guide is mostly independent of all other Alcatel-Lucent Gateway Platform
documentation, although other documentation may be useful during actual installation
and provisioning procedures. Descriptions and illustrations of IOMs, cables, and other
hardware encountered are contained within the Hardware Guide.
While the Alcatel-Lucent Gateway Platform TL1 Commands Reference Guide,
(255-400-xxx) has no direct correlation to the Hardware Guide, it does contain the TL1
commands needed to provision the hardware and software for the switch and its
components. The same can be said about the 1310 OMC-P documentation, as it is specific
to provisioning the switch via the 1310 OMC-P interface.
The Alcatel-Lucent Gateway Platform System Capacity, Monitoring, and Engineering
(SCME) Guidelines, (255-400-xxx) contains information that supports planning for the
number of required modules and the number of required switches in the network. Careful
attention to this document ensures the appropriate system hardware sizing.
Table 2, Manuals and part numbers (p. xv), lists the standard set of Alcatel-Lucent
Gateway Platform documentation, their part numbers, and a brief description. Other
manuals, which are available upon purchase of additional software, are listed in Table 3,
Other documentation (p. xvii).
Table 2

Manuals and part numbers

Product

Part
Number

Alcatel-Lucent Gateway Platform Operations


Guide

255-400000

Contains the platform


provisioning procedures for the
Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform


Maintenance and Diagnostic Procedures Guide

255-400001

Contains procedures for adding


and upgrading modules, and for
diagnosing error messages on
the the Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform Alarms and


Troubleshooting Procedures Guide

255-400019

Contains procedures for


troubleshooting and clearing
switch alarms on the
Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform TL1


Commands Reference Guide

255-400002

Contains a description of all the


TL1 commands needed to
provision the Alcatel-Lucent
GP platform, functional entities
and services.

Product Description

....................................................................................................................................................................................................................................
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....................................................................................................................................................................................................................................

Table 2

Manuals and part numbers

(continued)

Product

Part
Number

Alcatel-Lucent Gateway Platform Hardware


Guide

255-400003

Contains the information


necessary for designing an
installation site including:
hardware specifications;
cabling schematics; and
cabling, floor plan,
environmental and power
requirements.

Alcatel-Lucent Gateway Platform System


Capacity, Monitoring, and Engineering
(SCME) Guidelines

255-400005

Contains Alcatel-Lucent GP
engineering rules, system
monitoring information, critical
triggers and measurements,
geographic redundancy
information, and ethernet
interfacing, IP addressing and
SS7 transport provisioning.

Alcatel-Lucent Gateway Platform Release


Notes

255-400006

Contains new features and


feature enhancements, new and
modified TL1 commands,
hardware and software
limitations and other important
release-specific information for
the Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform Feature


Guide

255-400012

Contains detailed feature


descriptions for existing and
new features supported by the
Alcatel-Lucent GP.

Alcatel-Lucent Gateway Platform Software


Change Procedure Guide

255-400013

Contains procedures for


upgrading and downgrading,
and for provisioning for
geographic redundancy on the
Alcatel-Lucent GP.

Product Description

....................................................................................................................................................................................................................................
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....................................................................................................................................................................................................................................

Table 3

Other documentation

Product

Part
Number

1310 OMC-P for Alcatel-Lucent GP


Management User Guide

255-400400

Contains 1310 OMC-P


provisioning reference
information.

1310 OMC-P Installation and Upgrade Guide

255-400401

Contains installation
information for installing the
1310 OMC-P software on a Sun
workstation.

1310 OMC-P Software Release Notice

255-400402

Contains new features and


feature enhancements, software
limitations and other important
release-specific information for
the OMC-P.

Alcatel-Lucent Gateway Platform Billing and


Traffic System (BTS) User's Guide

255-400403

Contains installation, upgrade,


and applications procedures for
the BTS.

Alcatel-Lucent Gateway Platform BTS


Release Notes

255-400404

Contains new features and


feature enhancements, software
limitations and other important
release-specific information for
the BTS.

1310 OMC-P Server, BTS Server, and ATC


Server Security Guidelines

255-400417

Contains suggested security


guidelines for system
administrators using the
OMC-P server, BTS server and
ATC server.

1310 OMC-P Web API User's Guide

255-400419

Contains reference information


for the Web API application.

1310 OMC-P for the Alcatel- Lucent GP


Control Platform User Guide for Managing the
5420 Converged Telephony Server (CTS) and
the 5450 IP Session Control (ISC)

255-400420

Describes functions available


from the GUI used to provision
and manage the Alcatel-Lucent
CP

1310 OMC-P for the Alcatel-Lucent GP


Personal Communication Manager

255-400600

Describes functions available


from the GUI used to provision
and manage an Alcatel-Lucent
CM system.

1310 OMC-P Advanced Reporting System


User Guide

255-400200

Contains ARS provisioning


information.

Product Description

....................................................................................................................................................................................................................................
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....................................................................................................................................................................................................................................

Table 3

Other documentation

(continued)

Product
1310 OMC-P Advanced Reporting System and
Advanced Traffic Collector Installation and
Upgrade Guide

Part
Number
255-400201

Product Description
Contains installation and
upgrade information for the
ARS software.

Contact information
Installation support

On-site installation support is provided during the installation of the initial release and, if
necessary, during an upgrade. An Alcatel-Lucent Installation Technician will be on site
with you to perform the installation on a previously scheduled date.
Note: Most upgrades are done remotely.
The Alcatel-Lucent Installation Technician may arrange for a third-party installation
contractor to help with the installation, if necessary.
The Alcatel-Lucent Installation Technician will verify acceptance of the installation with
you by obtaining your signature on an acceptance form.
Questions about the Alcatel-Lucent installation support should be directed to your
Alcatel-Lucent Services Customer Team.
Technical support

The Services Business Group (SBG) provides customer support for the switch 24 hours a
day, 7 days a week.
SBG uses an Action Request (AR) system to assign, document, track, and report all
customer call activity. All calls are assigned an AR number and are fully documented in
the system, no matter what the level of severity.
Calls usually fall into one of several categories:

Calls that can be solved on the telephone at the time of the call
Calls that inquire about returning hardware
Calls that require escalation
Complaints

When a call is first received, it must be determined whether the call is a new call or an
open call. If it is a new call, an AR number is assigned immediately, and the information
entered into the system. If the call is in reference to an open call, you must know the AR
number so that SBG can retrieve the AR information.
Calls That can be Solved Immediately
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....................................................................................................................................................................................................................................

After determining whether the call is new or open, the SBG may be able to solve the
problem while you are on the telephone. In this case, the SBG will document the
resolution and close the call. Every effort will be made to resolve the issue on the first
call.
Calls for Returning Hardware
Switch components being returned for repair or replacement must be processed through
the Alcatel-Lucent RMA procedures. A hardware repair is defined as an item returned to
Alcatel-Lucent due to a failure, with the returned item being repaired and returned to you,
the customer. All hardware components and I/O modules are described in the section
Hardware Description.
Calls That Require Escalation
When a call is received and an action request number is assigned, a level of severity is
also determined. Levels of severity are categorized as follows:
Level of Severity

Symptom

Examples

Minor

Problem does not


significantly impair
function of the system

Requests for system service, equipment,


documentation, training, information, or
routine maintenance

Major

Conditions that seriously


affect system operation

Short system outages, reduction in


measurement function

Critical

Affects service

Total system failure, reduction in capacity


or traffic handling capability

If personnel are not immediately available when a call is received, your call will be
returned according to the severity assigned. For instance, a minor call is returned within
eight hours, and a major call within four hours. If the call is critical, you will be placed on
hold until an SBG engineer can be located.
You may, at any time, ask that the issue be escalated to management. The SBG will then
notify the appropriate manager. If required, on-site technical support will be provided
within 24 hours of a customer request.
Complaints
Customers have the ability to submit complaints by entering an action request via the
Alcatel-Lucent CARES Trouble tracking system athttp://www.alcatel-lucent.com/support/
(http://www.alcatel-lucent.com/support/). However, if you have an engineering complaint,
you must file form EO-143, in accordance with GR-230-CORE. Engineering complaints
will also be recorded in the AR system, but acknowledgement of form EO-143 will be
made by returning an acknowledgement report, form 79-7020-ECCnfrmtn, by the end of
the working day following receipt of the complaint.
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Regular and engineering complaints will be handled by an assigned department, with the
SBG Manager monitoring the engineering complaint until the issue is resolved.
Closing Action Requests
ARs will only be closed when all deliverables required to resolve the AR, such as
information, documentation, and software, are provided.
RMA procedure

You may identify equipment that needs to be repaired or replaced. Alcatel-Lucent is


pleased to offer comprehensive hardware repair and exchange services. For contact
information for your service, product, and location, refer to
http://support.lucent.com/portal/rmaForm.doc.
Using the method of contact shown at the site (either online or by phone) for the different
services will ensure the most timely handling of your request.
How to comment

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Platform description
1

Overview
Purpose

The 5060 MGC-8/VSG is a hardware and software platform compliant with Advanced
Telecommunications Computing Architecture (ATCA) standards. This chapter provides
an overview of the standards and the application of these standards to the 5060
MGC-8/VSG hardware.
Contents
Platform design

1-2

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Issue 3 June 2010

Platform description

Platform design

....................................................................................................................................................................................................................................

Platform design
ATCA standards

The 5060 MGC-8/VSG is a standardized platform for the telecommunications industry


based on the Advanced Telecommunication Architecture (ATCA). The 5060 MGC-8/VSG
platform can support multiple applications which are not hardware-dependent. The open
architecture enables high performance computing and telecommunication solutions,
hence offering improved carrier-grade performance, and consequently, better reliability,
manageability and serviceability.
Standard design

Alcatel-Lucent follows the practice of standards-based design which reduces


incompatibility across operating systems, locations, and environments.
The ATCA PICMG 3.0 standard prescribes the mechanical dimensions for plug-in blades,
a printed circuit blade, and a faceplate (Height 8 U and Width 280 mm / 11.032 inches).
The blade pitch is 6 hp (1.2 inches, or 30.48 mm). The blades connect to the standard
ATCA backplane connectors and to the rear transition modules (RTMs). The connector
provides the interfaces between the ATCA backplane and the various nodes and fabric
switches.
Design implications

The 5060 MGC-8/VSG is based on the ATCA platform which is characterized by its
ability to support high capacity telecommunications applications.
The benefits of the platform, which are a result of its advanced architecture and design,
include:

Power dissipation up to 300W per blade


Higher component density (RAM capacity similar to the rack-mounted server
capacity)
Redundant data-plane which facilitates discrete transport for control plane and user
plane
Bandwidth between slots: 2 GBit/s in compliance with PICMG 3.1
-48 V / 60 V power supply distributed on each blade

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Platform description

Platform design

....................................................................................................................................................................................................................................

Certification

The 5060 MGC-8/VSG platform has certifications for the entire platform architecture
including specifications for PICMG 3.0, as well as ETSI and EBS Level 3 certifications.
The 5060 MGC-8/VSG platform adheres to the following standards:

PICMG 3.0, EC 001 and EC 002


PICMG 3.1
AMC.0 for the Mezzanine module

AMC.1 for PCI Express


AMC.3 for storage
IPMI

SA Forum OpenHPI
Safety according to PICMG 3.0 (IEC60950, E60950, UL60950)
EMC enables PICMG 3.0 at chassis level

All configurations are certified for EBS Level 3, Earthquake Zone 4.

NOTE: Use of the term EBS implies global physical design environmental and safety

standards, including Telcordia EBS, ETSI, Verizon EBS and TCG.


ATCA hardware elements

The platform hardware is a combination of the chassis, blades, and a single-blade


computer that performs hardware management, platform diagnostics, and switching
control interface services on the platform operating system.
The ATCA base platform offers a consistent set of deliveries which are independent of
middle-ware. The implementation of the ATCA platform can create an ecosystem which
encompasses most of the core applications offered by Alcatel-Lucent, hence enabling
smooth product integration and convergences.
The ATCA platform hardware broadly comprises the following hardware elements
classified on the basis of their functionality:

Processing elements

Storage elements
Switching elements

Implementation rules

The following rules apply to the hardware implementation in the 5060 MGC-8/VSG
chassis:

....................................................................................................................................................................................................................................
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Platform description

Platform design

....................................................................................................................................................................................................................................

Functions

Three blade types and two RTMs fulfull the functions in this release as follows:

Hub function - Hub (NBMASW1)


OAM function - Processor blade (NBRZAL)
Traffic function - Processor blade (FM016JB)
SS7 function - Processor blade (FM016JP) + RTM (RPCMHDDA)

Shelf controller

Two Shelf Management Controllers (ShMC) are mandatory per chassis and they must be
installed in slots M16 and M15 respectively.
Fan trays

A top fan tray and bottom fan tray are required for each chassis.
Mechanical parts

The following mechanical parts are mandatory for each chassis:

1- 3U bottom deflector and 1 - 4U deflector


1 - front air filter
1 - rear air filter
1 - front cable tray

1 - rear cable tray

Hub function

The following parts are required to fulfill this function:

2 - Ethernet blades installed in the M07 and M08 slots in the chassis.
2 - Rear Transmission Modules (RTMs) (NASYS) installed in the M67 and M68
slots.

Unused slots

Unused board slots must always be filled by a Front Filler (NBFILL) and unused RTM
slots must be filled by an RTM filler (NAFILL).
Configurations

This release supports both a stand-alone configuration and a 1-chassis configuration in a


cabinet. The stand-alone configuration does not include a PDU or an alarm board. A
cabinet configuration with one chassis does require both a PDU and an alarm board.
The single-chassis configuration is supported for the 5060 MGC-8/VSG platform. This
figure shows an example of a single-chassis configuration.

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Platform description

Platform design

....................................................................................................................................................................................................................................

Figure 1-1 5060 MGC-8/VSG single-chassis configuration

FMD16BC

NBRZAL

NBRZAL

FMD16BC

FMD16BC

NBDM14

NBDM14

NBDM14

NBDM14

NBDM14

NBDM14

3CMO2685
ABAA

3CMO2685
ABAA

3CMO2685
ABAA

3CMO2685
ABAA

3CMO2685
ABAA

BS0815U
OKJJ

BS0815U
OKJJ

BS0815U
OKJJ

GE1

BS0815U
OKJJ

GEO

BS0815U
OKJJ

GE1

GE1

GEO

NBFILL

12
3CM02578
AAAC

NBFILL

13
3CM02578
AAAC

NBFILL

3CM02578
AAAC

NBFILL

14
3CM02578
AAAC

NBFILL

GE1

NBAFIM

NBAFIM

NBFILL

11
3CM02660
AAAD04

NBAFIM

GEO

NBMASW1

NBAFIM

10
3CM02660
AAAD04

BS0815U
OKJJ

GEO

9
3CM02660
AAAD04

NBMASW1

FMD16BC

3CMO2685
ABAA

8
3CM02660
AAAD04

3CMO2859
ALAB03

3CMO2859
ALAB03

NBAFIM

NBAFIM

CP

CP

CI

CI

NBSHMC

3CMO2741
AAAB

3CMO2741
AAAB

RST

RST

RST

Pwr
A/S

3CMO2741
AAAB

RST

F
E
T
H
O

3CMO2741
AAAB

RST

RST

GEO

GE1

GEO

GE1

GEO

GE1

GEO

GE1

GE2

GE3

GE2

GE3

GE2

GE3

GE2

GE3

GE4

GE5

GE4

GE5

USB

Base T

USB

Base T

1
2
C

R
S

Lk F
Ac 0
Lk F
Ac 1

CP

CP

CP

H/S

CP

USB

USB

CP

CP

CI

CI

NBSHMC

USB

USB

U
P
L
0

U
P
L
0

U
P
L
1

U
P
L
1

Pwr
A/S
F
E
T
H
O

USB

USB

1
2
C

R
S

Lk F
Ac 0
Lk F

RST

RST

Ac 1
H/S

B50847
UE 1R5

B50847
UE 1R5

BS0847
UE 22L

BS0847
UE 22M

The following table describes the contents and function of each slot shown in the Chassis
Front graphic.
Table 1-1
Slot
Number

Chassis slot description


Module description

Mnemonic

Module function

1-2

OAM Server

NBRZAL

Monitors chassis,
Traffic blades, and
Switch hubs

3-6

Processor Blade

FM016JB or FM016JP

Traffic

7-8

Ethernet Switch

NBMASW1

Switch Hub

9 - 14

Board Filler

NBFILL

Traffic growth

ShMC

NBSHMC

Shelf control
management

15

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Platform description

Platform design

....................................................................................................................................................................................................................................

When a cabinet is being used in the configuration, the following items are required in
addition to the Base Requirements shown in Chassis system components (p. 7-2).
Table 1-2

Cabinet configuration components

Part Number

Quantity

Mnemonic

Description

3CM02769AA

NRA244AA

AL5 Cabinet

3CM03649AA

KMPJ1

generic mounting kit

3CM02902AA

SAPDUAA

PDU

3CM02949AA

RALARMAA

Alarm board

3CM03235AA

MABAFBAA

Bottom air deflector

3CM03302AA

MABAF4AA

Middle air deflector

3CM02588AA

MABAFTAA

Top air deflector

Modules

This section provides a list of the 5060 MGC-8/VSG modules.


Table 1-3

Module list
Module

Part number

Mnemonic

Hub Switch 1GB

3CM02660CA

NBMASW1

OAM Server with 1HDD 147G 8GB Memory

3CM02859CL

NBRZAL

Processor Blade 16GB

3CM03285JB

FMO16JB

Processor Blade 16GB with SS7

3CM03285JP

FMO16JP

RTM Synchro & Switching

3CM02570AA

NASYS

RTM 8E1/T1 75/120 + 1xHDD 300G

3CM02682AA

RPCMHDDA

Shelf Manager Board of ATCA Shelf

3CM02418AA

NBSHMC

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Hardware components
2

Overview
Purpose

This chapter provides an overview of the hardware components of the 5060 MGC-8/VSG
platform.
Contents
Cabinet (NRA244AA)

2-2

Chassis (SAV2AB)

2-4

OAM server (NBRZAL)

2-13

Hub (NBMASW1)

2-14

Processor blade (FM016JB or FM016JP)

2-17

Rear Transition Modules (NASYS or RPCMHDDA)

2-19

Shelf management controller (NBSHMC)

2-23

Power supply

2-26

Fillers

2-29

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Issue 3 June 2010

Hardware components

Cabinet (NRA244AA)

....................................................................................................................................................................................................................................

Cabinet (NRA244AA)
Overview

The configuration consists of one chassis within a cabinet.


This configuration has the following requirements:

Single 44U enclosed cabinet


One ATCA chassis
Optional RTMs used by the Hub cards to expand the number of transport connections.
Six pairs of slots for the node blades. One slot pair for OAM Servers (NBRZAL) and
five slot pairs for traffic processing (NBRZAM, FMO16JB, and FMO16JP).

Cables and other accessories required to support a maximum cabinet configuration


with two shelves.

Figure 2-1 Cabinet (NRA244AA)

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Issue 3 June 2010

Hardware components

Cabinet (NRA244AA)

....................................................................................................................................................................................................................................

Components

The ATCA cabinet includes:

One of the following deflectors, depending upon the number of shelves that are being
used. These air deflectors provide air flow circulation and fire enclosure
3U 300W bottom deflector (MABAFBAA)
4U 300W middle deflector (MAMAF4AA)
3U 300W top deflector (MABAFTAA)

3U -48V Power Distribution Unit (SAPDUAA) at the top of the cabinet with an
Alarm card

Cabinet dimensions

The following table shows the dimensions of the 44U cabinet shown in Figure 2-1,
Cabinet (NRA244AA) (p. 2-2).
Table 2-1

Cabinet dimensions

Characteristic

Dimension

Height

600 mm/19.68 inches

Depth

600 mm/19.68 inches

Height

2125 mm/83.66 inches

Weight

138 kg/304.23 lbs for an empty cabinet

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Issue 3 June 2010

Hardware components

Chassis (SAV2AB)

....................................................................................................................................................................................................................................

Chassis (SAV2AB)
Overview

The ATCA chassis (SAV2AB) provides the mechanical and hardware management
interface to PICMG 3.0 blades.
This section provides technical details for chassis slots, dimensions, environmental
conditions, and power feeds.
This photograph shows an empty ATCA chassis.
Figure 2-2 ATCA chassis (SAV2AB) photograph

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Issue 3 June 2010

Hardware components

Chassis (SAV2AB)

....................................................................................................................................................................................................................................

Functional description

The chassis performs the following functions:

Environmental performance
Blades/customer interfaces
Dust filter management
Fan tray management
Hardware management

Power filter interface and distribution


Thermal management
EMC containment

Industrial design management

Chassis slots

Each 5060-MGC chassis has 14 slots to hold OAM processors, Ethernet hubs, and
processor blades. Each slot has a front side in which a node or hub blade can be installed
and a rear side in which a Rear Transition Module (RTM) can be installed.
Each 5060 MGC-8/VSG chassis contains the following blades:

2 Ethernet hubs for internal communications in front slots 7 and 8.


RTMs for external connectivity to customer networks in rear slots 7 and 8.
Processor blades and AMCs for the OAM server in slots 1 and 2.
Processor blades in the remaining front modules with Hard Disk Drives (HDD) or
RTM modules in the rear for slots 2 through 10. Optionally, AMC SS7 modules can
be located in the front slots to provide TDM connectivity for SS7 links.

Table 2-2

Chassis slots

Number of Slots

Description

15

Slots total

Slot dedicated as a dual-chassis manager

14

Slots for I/O, working, and protection

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Hardware components

Chassis (SAV2AB)

....................................................................................................................................................................................................................................

Slot assignments

The single-chassis configuration is supported for the 5060 MGC-8/VSG platform. This
figure shows an overview of proper use of the slots in a single-chassis configuration.
Figure 2-3 Functional single-chassis configuration
Fan tray
09

10

11

12

13

14

AMC SS7

AMC SS7

AMC SS7

AMC SS7

AMC SS7

08

AMC SS7

07

RTM (GigE)

06

RTM (GigE)

05

AMC SS7

AMC HDD

04

AMC SS7

AMC HDD

03

AMC SS7

02

AMC SS7

01

GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1 GE0 GE1
GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3 GE2 GE3
GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5

GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5 GE4 GE5

ShMC
ShMC

ADCM

ADCM

ADCM

ADCM

ADCM

ADCM

Ethernet Switch

Ethernet Switch

ADCM

ADCM

ACCM

ACCM

LCP OAM Server

LCP OAM Server

First chassis to be equipped

In a single-chassis configuration, the Processor blades that are installed in slots 1 and 2
will function as the OAM servers. In a multiple chassis configuration, the first chassis to
be configured will have Processor blades in slots 1 and 2 that function as OAM servers.
Subsequent chassis' in the same are not required to have OAM servers in slots 1 and 2.

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Hardware components

Chassis (SAV2AB)

....................................................................................................................................................................................................................................

Chassis dimensions

The following table provides the technical dimensions of the Chassis. The chassis is 11U
and 13U with airflow deflectors.
Table 2-3

Chassis dimensions
MECHANICAL SPECIFICATIONS

Height

489 mm

Width

482 mm

Depth

383.14 mm from module

Weight

75.1 kg fully equipped


26 kg empty except for fan units

Chassis environmental specifications

The ATCA chassis must always be operated in a temperature and humidity controlled
room according to the environmental specifications shown in the following table.
Table 2-4

Environmental specifications

Environmental Conditions

Value

Operating temperature

+5 to +45 (C)
0C to +55C in degraded
conditions

Relative humidity

Up to 85%
Conforms with ANSI T1.304

Power

Two independent and secured DC power sources are required for the chassis. The 5060
MGC-8/VSG chassis is always equipped with two redundant power modules, allowing
the chassis to be fed in uninterrupted redundant mode.
Refer to for power specifications.
Table 2-5

Chassis power specifications

Requirement

Input/Output Power

DC power inputs

2x2 redundant accesses

Input voltage

-48 V/-60 V, based on duplicated distribution


Note: the current range is from -36 Volts to -72

Volts
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Issue 3 June 2010

Hardware components

Chassis (SAV2AB)

....................................................................................................................................................................................................................................

Table 2-5

Chassis power specifications

(continued)

Requirement

Input/Output Power

Operating Voltage

- 48 V DC

Voltage Range

-39 V to -60 V DC

Maximum Consumption

Configuration 200Wper slot

Power Dissipation

Up to 300W per blade


Up to 400W per slot

Functions and physical components

This section describes the function of the main physical components of this configuration.
Table 2-6

Functions of physical components

Function

Component

Mnemonic

Hub function

Hub

NBMASW1

OAM function

Processor blade

NBRZAL

Traffic function

Processor blade

FMO16JB/FMO16JP

Technical specifications

The chassis is a 19 inch 11U dual-star backplane mechanical chassis consisting of the
following components:

1 - Mechanical chassis with dual star backplane


2 - Front and rear air filters (NDAFF and NDAFR)

Redundant power entry modules (PEM)


Dual fan trays at the top and bottom of the chassis, each with 6 fans
2 - Shelf Management Controller (NBSHMC) blades located on the right side of the
chassis in physical slot 15
14 - Slots for node and hub blades. Each slot has a front side to accommodate a blade
and a rear side to accommodate a rear transition module (RTM)

Push-pull air forced cooling with a capacity of up to 300W per slot


Update channels between even and odd slots
Processor CPU blades; maximum of twelve
2 - Ethernet hubs for internal communication
3 - Backplanes

1 - Backplane to host up to 14 blades


An additional slot to host two chassis manager blades

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Issue 3 June 2010

Hardware components

Chassis (SAV2AB)

....................................................................................................................................................................................................................................

Separate top and bottom air deflectors


A large air compression chamber which ensures even thermal performance among the
14 slots

Figure 2-4 Chassis front view

Fan Tray

N
o
d
e

N
o
d
e

N
o
d
e

N
o
d
e

N
o
d
e

N
o
d
e

H
u
b

H
u
b

N
o
d
e

N
o
d
e

N
o
d
e

N
o
d
e

N
o
d
e

N
o
d
e

S
h
M
C

S
h
M
C

Fan Tray

Requirements

The 5060 MGC-8/VSG chassis has been designed to meet the following requirements.
Mechanical requirements

The 5060 MGC-8/VSG chassis supports the Midplane concept which is characterized by:

Rear Transition Module (RTM) for rear I/O


RTM power feeds distribution done by the associated front board
Direct connections between front boards and RTMs

Mandatoary Mechanical parts

Each chassis includes the following mandatory mechanical parts:

1 - 3U Bottom Deflector (MABAFBAA) and one 4U deflector (MABAF4AA) for the


first chassis
1 - Front air filter (NDAFF)

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Hardware components

Chassis (SAV2AB)

....................................................................................................................................................................................................................................

1 - Rear air filter (NDAFR)


1 - Front cable tray (KMFT1)
1- Rear cable tray (KMRT2)

Backplane

The 5060 MGC-8/VSG chassis backplane is based on three zones of functionality. Zone 1
provides dual 48V power and chassis management system connections, zone 2 provides
the data transport interfaces, and zone 3 is the RTM face plate for the I/O functions.
Zones 1 and 2 are part of the same printed circuit board while zone 3 is a connection
between the front board and RTMs through on-board connectors.
On zone 2, the data transport interfaces support four separate types of interfaces which
provide connectivity for up to 14 slots along the backplane. These four interfaces are the
Base Interface, Fabric Interface, Update Channel Interface, and the Synchronization
Clock Interface.
Note: The Synchronization Clock Interface is not supported in Release 8.0.1.
The backplane accommodates three types of plug-in modules: Ethernet hubs, Processor
blades, and Shelf controller modules. In addition the backplane provides connections to
the upper fan tray through small transition PCBs, connections for the -48V power supply
inputs for the chassis, and it directly plugs into the lower fan try for cooling purposes.
The following figure shows the backplane in a top view drawing of the chassis.

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Issue 3 June 2010

Hardware components

Chassis (SAV2AB)

....................................................................................................................................................................................................................................

Figure 2-5 Chassis top view

Rear side

RTM

RTM

08
11

10
12

12
13

14
14

RTM

06
10

RTM

04
09

RTM

02
08

RTM

01
07

RTM

RTM

03
06

RTM

05
05

RTM

07
04

RTM

Logical slot

RTM

RTM

RTM

Physical slot
13
11
09
01
02
03

Node

Node

Node

05
05

06
03

07
01

08
02

09
04

10
06

11
08

12
10

ShMC

Node

04
07

J
A
U
C
S

Node

Hub

03
09

J
A
U
C
S

Node

Hub

J
A
U
C
S

Node

J
A
U
C
S

Node

J
A
U
C
S

Node

01
02
13
11
Physica l slot

J
A
U
C
S

Node

Node

Node

BACKPLA NE

13
14
12
14
Logical slot

Front side
Cooling unit

The 5060 MGC-8/VSG chassis uses adaptive, forced air convection cooling. Air is drawn
through the bottom front side of the chassis and exhausted out the top rear side of the
chassis by means of air deflectors separated from the chassis.
The design of the chassis cooling units allows a maximum power dissipation of 300W per
5060 MGC-8/VSG front blade slot.
Deflectors

The chassis is installed with an upper and a lower deflector. The lower deflector acts as an
air intake for the blades and RTM, and the upper deflector acts as a rear exhaust. Another
function of the deflectors is to close the fire enclosure. The deflectors are fixed to the
front rack uprights and not to the chassis. In addition, the deflectors are designed to help
mount the chassis into a rack with guide rails that provide guidance.
Note: Racks are not included in Release 8.0.0
....................................................................................................................................................................................................................................
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Hardware components

Chassis (SAV2AB)

....................................................................................................................................................................................................................................

Two types of deflectors are used depending on the rack layout:

1U orthogonal 3-sided air intake

2U diagonal deflector 1-sided air intake

Fan tray (NSFANV2)

The cooling unit of the 5060 MGC-8/VSG chassis is made of two field replaceable fan
trays, with each fan tray containing six fans. The fan tray draws air from the bottom front
side and pressurizes air to flow through the chassis. Air then exits the chassis through a
dedicated rear upper exhaust. A control for each cooling unit provides fan speed
monitoring and an alarm interface. To ensure balanced air flow in partially populated
systems, filler blades and faceplate assemblies are required to complete the enclosure.
The mechanical design of the chassis tends to create static (not changing over time) and
spatial (changing within space) variations in the cooling performance between slots, as
well as within the depth of a slot. The 5060 MGC-8/VSG chassis is mechanically
designed to provide the same cooling capabilities for each slot.
The cooling unit equipment is made of:

1 - mechanical structure with 2 guides to aid with insertion and 2 locking screws to
lock each module in place

1 - fan control blade with power and signal connectors


No grids are implemented. A mechanical key is used to protect the operator while
manipulating the fan tray.

Fan tray dimensions

The following table provides the technical dimensions of the fan tray.
Table 2-7

Fan tray dimensions

Characteristic

Dimension

Height

600 mm

Depth

600 mm

Height

138 kg

Maximum Consumption

220W

Typical Consumption

150W

without AMC
Weight

4 to 5 Kg

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Issue 3 June 2010

Hardware components

OAM server (NBRZAL)

....................................................................................................................................................................................................................................

OAM server (NBRZAL)


Overview

The OAM server (NBRZAL) runs on a pair of processor blades that are dedicated for this
purpose. This single board computer includes the following components:

One Dual Core Intel T 7400 processor running at 2.16 GHz with 8 GB of memory
One AMC with 147 GB SAS disk
Six Gigabit Ethernet ports are auto-negotiated and auto-MDIX. Two of these GigE
ports link to the host processor for out-of-band external management.
An optional RPCMHDDA RTM to provide additional disk storage

OAM server function

The OAM server supports the following services:

Hardware monitoring management of the chassis, node cards, and switch cards using
the shelf manager (ShMC).
ACCM and ADCM growth, OS installation, software installation, upgrades, and
downgrades, and FRU replacement.
Alarming, both visible and audible, to the 1310 OMC-P via the MI on the OAM
server.
Internal IP Address configuration

Dimensions

The following table provides the technical dimensions of the processor blades.
Table 2-8

Processor blade dimensions

Characteristic

Dimension

Height

8U/322.25 mm

Depth

280 mm

Pitch

30.48 mm

Input power voltage

36 & 75 VDC (48 VDC nom.)

Power consumption per processor blade with


AMC

190 W max

Ambient temperature

between +5 C and +40 C

Weight

2.24 kg (with 1 AMC)


2.056 kg (no AMC)

Common power supply for two AMCs

50 W max

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Hardware components

Hub (NBMASW1)

....................................................................................................................................................................................................................................

Hub (NBMASW1)
Overview

Ethernet hubs in the 5060 MGC-8 5060 platform are responsible for internal
communications. Their purpose is to provide a star topology backplane that provides
connectivity to multiple processor blades within the backplane. Each processor blade is
connected through the backplane to the two Hub. Two Ethernet hubs comprise a
single-blade computer in switch-only mode. Slots 7 and 8 are dedicated to the hub blades.
The main functions of the Ethernet hubs are to provide:

Switching capabilities
Accesses to the external Ethernet backbone
Uplink accesses to other racks in a cabinet (not supported in this release).

Synchronization module

The 5060 MGC-8 platform contains two Ethernet hubs for internal communications, each
consisting of the following hardware:

1 - single blade computer in switch-only mode


RTMs (NASYS) for the hub switches for inter-chassis communications.
Note:The Hub RTMs do not provide Chassis Reference Clock generation and
distribution.

Single blade functions

The single-blade computer includes the following components:

1 - Dual-core Intel T 7400 processor running at 2.16 GHz with 1 GB of memory


Dual star Ethernet switching fabric
4 - 1000 Base-T Ethernet links to the base interface on front panel
1 - 10 GE interface connected to the fabric interface on front panel
1 - 10/100/1000 Base-T interface connected to the on-blade CPU

CPU features

The CPU has the following features

1 Dual-core 2.13 GHz chipset, 32/64-bit, 4M L2 cache

Up to 8 GB memory
2 - Gigabit Ethernet ports
USB 2.0 port (bootable)

RS-232 port

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Issue 3 June 2010

Hardware components

Hub (NBMASW1)

....................................................................................................................................................................................................................................

Embedded GigE switch

The embedded GigE switch is characterized by

Full GigE connectivity between backplane AMC sites and the CPU
4 - GigE external (front) ports and 2 - GigE ports on the NASYS RTM (1 - 1000
interface connected to each CPU blade slot)

Dimensions

The following table provides the technical dimensions of the Hub.


Table 2-9

Hub dimensions

Characteristic

Dimension

Height

8U/322.25 mm

Depth

280 mm

Pitch

30.48 mm

Maximum Consumption

150W(with 1 AMC)

Typical Consumption

78W(load 10%)

without AMC

90W(load 50%)
98W(load 100%)

Weight

2.24 Kg (with 1 AMC)


2.056 Kg (without AMC)

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Issue 3 June 2010

Hardware components

Hub (NBMASW1)

....................................................................................................................................................................................................................................

Diagram of Hub front panel

The following diagram provides an example of the front panel of a hub blade.
Figure 2-6 Hub front panel
3CM02660
AAAD04

NBMASW1

NBAFIM

2 AMC slots
for PCI Express and Storage
interfaces

NBAFIM

CI

3CMO2741
AAAB

GEO

GE1

GE2

GE3

4 * 1000Base-T Ethernet
links
(Base interface)

debug Fast Ethernet port

debug USB port


U
P
L
0

10GE electrical interface


U
P
L
1

BS0847
UE 22L

FRONT PANEL

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Issue 3 June 2010

Hardware components

Processor blade (FM016JB or FM016JP)

....................................................................................................................................................................................................................................

Processor blade (FM016JB or FM016JP)


Overview

Up to 12 Processor blades run 5060 MGC-8 services. The minimum requirement is one
single-blade computer with one dual-core Intel T 7400 processor running at 2.16 GHz
with 8 GB of memory, one AMC with 146 GB SAS disk, and two front panel GE links to
the host processor (for out-of-band external management). The hardware variant depends
on the blades function.
5060 MGC-8 services

The processor blade supports the following 5060 MGC-8 services

Management interface

Configuration server
ACCM director
Shared network services

Processor characteristics

Key characteristics of the 1 Merom T 7400 Dual core processor blade are:

32/64-bit operation
L1 cache: 32K I-cache, 32K write-back cache
L2 cache: 4 MB
Up to 8 GB memory

2 - GigE ports to CPU


USB 2.0
Boot options: HDD, USB, IDE flash, TFTP
RS-232 console port for debugging, through mini-USB plug

2 - AMC sites
Embedded GigE switch offering full GigE connectivity to backplane
1 - GigE to each AMC slot

2 - 1GigE to CPU
4 - GigE external (front)
2 - GigE on RTM
120Watts power consumption for base blade, plus 20WRTM, 50WAMC and 15W
DIMM.

....................................................................................................................................................................................................................................
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Issue 3 June 2010

Hardware components

Processor blade (FM016JB or FM016JP)

....................................................................................................................................................................................................................................

Diagram of processor blade front panel

The following diagram provides an example of the front panel of a processor blade.
Figure 2-7 Processor blade front panel

FMD16BC

NBDM14
3CMO2685
ABAA

LED 1

LED 2

LED 3

BS0815U
OKJJ

3 Management LEDs

GEO

GE1

2 x Gigabit Ethernet Ports

Reset Button

RST

RS232 CPU Access

CP

RS232 IPMC Access

C1

1 Management Blue LED


USB Connector

USB

FRONT PANEL

....................................................................................................................................................................................................................................
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Issue 3 June 2010

Hardware components

Rear Transition Modules (NASYS or RPCMHDDA)

....................................................................................................................................................................................................................................

Rear Transition Modules (NASYS or RPCMHDDA)


Overview

A Rear Transition Module (RTM) is installed in the rear of the chassis. An RTM is mated
with a Front Board through Zone 3 connectors to provide I/O connectivity for E1/T1. Up
to 14 RTMs can be plugged into the 14 rear slots in a chassis.
Two types of RTMS are used in this chassis configuration:

RTM Synchro & Switching (NASYS) for the Hub that functions to provide
synchronization and switching
RTM 8E1/T1 75/120 + 1xHDD 300G (RPCMHDDA) for the Processor blade T1/E1
to terminate the low-speed TDM links.

RTM for Hub (NASYS)

The RTM (NASYS) is an optional element used to expand the number of electrical
Ethernet connections to the service-provider network.
NOTE: TDM clock ports are not applicable.

This RTM is mounted at the rear end of the hub slots and provides the following
interfaces:

8 - 1000 Base-T Ethernet links on the Fabric Interface


1 - 10 GE link to the Base interface (reserved for future use)
1 - 10 GE link to the Fabric interface (reserved for future use)
2 - 10/100/1000Base-T to Hub module host CPUs (reserved for future use)

For additional details about the RTM interfaces and their functions, see Table 4-2, Hub
I/O interfaces (p. 4-5)
The following figure shows the front view of the Hub RTM front panel.

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Issue 3 June 2010

Hardware components

Rear Transition Modules (NASYS or RPCMHDDA)

....................................................................................................................................................................................................................................

Figure 2-8 Hub RTM front panel

NASYS

10
G
E
B

10 Gigabit Ethernet Base Port

10
G
E
F

10 Gigabit Ethernet Fabric Port

CPU

2 x CPU Access

8 x LIU Access

B
I
T
S

BITS

S
S
U

SSU

W
e
s
t

IOCLK 1/ 2/ 3 West

E
a
s
t

C
L
K

IOCLK 1/ 2/ 3 East

L
I
U

LIU CLK 1/ 2

D
b
g

RS232 Synchro
POWER
H/S

Power LED
1 Management Blue LED

BS0847
UE 22L

FRONT PANEL

....................................................................................................................................................................................................................................
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Issue 3 June 2010

Hardware components

Rear Transition Modules (NASYS or RPCMHDDA)

....................................................................................................................................................................................................................................

RTM for the Processor Blade (RPCMHDDA)

The RPCMHDDA RTM is associated with the 8-port E1/T1 rear access SS7 AMC hosted
by the FM016JP processor blade.
RPCMHDDA RTM performs the following functions:

8 - physical E1/T1 links coming from an AMC site located on the FM016JP
Uses an HE5-High Density connector for 8 E1/T1
Supports 75/100/120 ohm line impedance matching

2 - 1000 Base-T Ethernet coming from the CPU located on the front board which uses
an RJ45 connector on the face plate
Supports a 2.5 inch Hard Disk Drive with 300 GB capacity

The following figure shows the front panel of the RPCMDDA RTM.

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Issue 3 June 2010

Hardware components

Rear Transition Modules (NASYS or RPCMHDDA)

....................................................................................................................................................................................................................................

Figure 2-9 Processor blade RTM (RPCMHDDA)


RPCMHDxA

P
C
M

POWER
H/S

FRONT PANEL

....................................................................................................................................................................................................................................
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Issue 3 June 2010

Hardware components

Shelf management controller (NBSHMC)

....................................................................................................................................................................................................................................

Shelf management controller (NBSHMC)


Overview

The Shelf Management Controller blade (ShMC) provides out-of-band management of


chassis hardware. The ShMC is a half-height blade that controls the slots and blades that
are located in the same chassis. There are always two ShMC blades per chassis and they
are located in slot 15.
Functional description

Each 5060 MGC-8 5060 chassis includes two Shelf Management Controllers (ShMC)
that run in active/standby mode. ShMCs supervise all elements of the chassis (fan trays,
blades, RTMs, air filters and PEMs) through an Intelligent Platform Management Bus
(IPMB) and Inter Integrated Circuit (I2C) connections.
The ShMC controller performs the following functions within the 5060 MGC-8 chassis:

Monitors temperatures and voltages for chassis components


Monitors blade and fan tray presence and fan speeds
Monitors power supply status

Controls power states for automated power sequencing and power supply inhibition
Controls blade power states and fan speed for automatic recovery in case of
temperature events
Manages the chassis through supporting scripts for system status and corrective
actions.
Provisions interfaces for remote management

Logs chassis status events

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Issue 3 June 2010

Hardware components

Shelf management controller (NBSHMC)

....................................................................................................................................................................................................................................

Diagram of ShMC

This figure shows the front view of the Shelf management controller (ShMC).
Figure 2-10 Shelf manager front panel

NBSHMC
Pwr
A/S

Power LED
F
E
T
H
O

1
2
C

Active / Standby LED

Debug
Fast Ethernet

R
S

Lk F

Debug RS232

Fast Ethernet 0

Ac 0
Lk F
Ac 1

HS Blue LED

Fast Ethernet 1

H/S

....................................................................................................................................................................................................................................
255-400-209R8.0.1
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Issue 3 June 2010

Hardware components

Shelf management controller (NBSHMC)

....................................................................................................................................................................................................................................

Dimensions

The following table provides the technical dimensions of the ShMC.


Table 2-10

Shelf management controller dimensions

Characteristic

Dimension

Height

83.4 mm

Depth

282 mm

Pitch

14.96 mm

Maximum Consumption

15W

Typical Consumption

10W

Weight

332 g

....................................................................................................................................................................................................................................
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Issue 3 June 2010

Hardware components

Power supply

....................................................................................................................................................................................................................................

Power supply
Power supply module

In a chassis-only configuration, the 5060 MGC-8 5060 chassis power supply module
provides all the necessary on-blade power supply from the back-panel. The input power is
-48 V or -60 V, based on duplicated distribution. Two independent and secured DC power
sources are required for all configurations. Optionally, for AMC sites, a maximum
common power supply of 50W is supported.
In a cabinet configuration, a power distribution Unit (PDU) is required. On the PDU
(SAPDUAA) the DC sources are -48 V DC or -60 V DC nominal voltage (40.5 to 72 V).
The power supply module provides a secondary power supply for the overall blade and it
includes the following on-blade voltage functions:

Conversion and distribution


EMI filtering

Capacitors for the 5060 MGC-8 hold time


-48 V monitoring

Power entry module (PEM)

The chassis is designed to sustain a maximum power requirement of 5460W. The power
zone is divided into two independent feeds (A feed and B feed) and each zone is fed by
both feeds. This ensures that if Feed-A is accidentally shut off, Feed-B will maintain
power functionality. In addition, each feed is split into two distributions, in order to
reduce the maximum current in each distribution. External power is supplied to each feed
of the chassis using feed-through 75 Amp connectors. The fan trays are powered by the
backplane.
Alarms

Each on-blade alarm is monitored to deliver an alarm to the 16-bit I2 C I/O port.
Additionally, the remote VB alarms (from the secondary shelf management controller) are
delivered to the PCA. Each alarm is based on a minimum threshold value.
Power distribution unit (SAPDUAA)

In a cabinet configuration, the SAPDUAA PDU supplies power distribution to the


cabinets with the capacity to supply up to 3 shelves. The SAPDUAA is a 19 standard
form factor, 3U high.
Configuration maintenance or evolution operations are performed via the front or the rear
of the SAPDUAA (without removing the top of the cabinet). All the circuit-breakers and
fuses can be removed.
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Issue 3 June 2010

Hardware components

Power supply

....................................................................................................................................................................................................................................

The SAPDUAA can host an alarm board (RALARMAA). The alarm board is used by the
central office maintenance operator to handle the visual and audio alarms generated by
the system hosted in the rack. In addition, the alarm board provides 2 external input ports.
See Alarm module (RALARMAA) (p. 2-28) for more information.
Figure 2-11 Power Distribution Unit (SAPDUAA)

Physical characteristics

The SAPDUAA is a 19-wide 3U-high, 160 mm-deep shelf. It is consists of a mechanical


frame with 3 slots:

one for the A-branch bank of circuit-breakers and fuse block


one for the B-branch bank of circuit-breakers and fuse block

one for the RALARMAA board

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Issue 3 June 2010

Hardware components

Power supply

....................................................................................................................................................................................................................................

Alarm module (RALARMAA)

In a cabinet configuration, the optional alarm module is located at the top of the cabinet.
All fuses and circuit-breakers can be accessed from the front of the cabinet.
Figure 2-12 Alarm module (RALARMAA)

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Issue 3 June 2010

Hardware components

Fillers

....................................................................................................................................................................................................................................

Fillers
Fillers are required in all unused slots of a 5060 MGC-8/VSG chassis. The purpose of the
fillers is to maintain the proper and balanced air flow within a chassis by sealing any
unused slots in the enclosure of a partially populated system.
The following types of fillers are used in the 5060 MGC-8/VSG:

Board Filler (NBFILL) is used to close unused front slots in the chassis

RTM Filler (NAFILL) is used to close any unused rear slots in the chassis.

....................................................................................................................................................................................................................................
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Issue 3 June 2010

3 AM server hardware
O
details

Overview
Purpose

This chapter describes the functions and features of the OAM server module (NBRZAL)
and its connections to external interfaces.
Contents
OAM server module

3-2

Hardware details

3-3

Hardware description

3-11

Front panel ports

3-12

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3-1
Issue 3 June 2010

OAM server hardware details

OAM server module

....................................................................................................................................................................................................................................

OAM server module


Introduction

The OAM server (NBRZAL) module is an Advanced Telecom Computing Architecture


(ATCA) control (CPU) module.
The OAM server module is a general purpose, flexible applicative module that adheres to
the following standards:

PICMG 3.0

PICMG 3.1
AMC.0 for the two standardized Advanced Mezzanine Card (AMC) slots
AMC.1 for PCI Express
AMC.3 for storage interfaces

OAM server blade and the ATCA chassis

The OAM server module must be installed in Slot 1 and Slot 2 in the ATCA 5060
MGC-8/VSG chassis as shown in Figure 1-1, 5060 MGC-8/VSG single-chassis
configuration (p. 1-5)

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Issue 3 June 2010

OAM server hardware details

Hardware details

....................................................................................................................................................................................................................................

Hardware details
Introduction

This section describes the physical and functional features of the OAM server module,
including size, power consumption, and hardware details. The OAM module also
provides full connectivity through a set of I/O interfaces. See I/O interfaces (p. 3-6) for
a list of available I/O interfaces located on the front panel, the back panel, RTMs or AMC
slots.
The OAM server module has the following blocks:

A CPU which provides computing power,

A local switch which offers most of the OAM server module connectivity.
A set of 2 AMC slots offering SAS hard disk connectivity, two 4lane PCI-Express
interfaces and eight E1 ports.

Hardware architecture

OAM server module architecture is based on a CPU chipset and up to 2 HDDs. OAM
server module management is performed by an IPMC component.
The following diagram shows a simple overview of the OAM server architecture. The
diagram shows the module with the following components:

A CPU block that provides computational power.


A local switch for Ethernet switching
A card-management and common-card-resource block.

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Issue 3 June 2010

OAM server hardware details

Hardware details

....................................................................................................................................................................................................................................

Figure 3-1 OAM server architecture overview

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Issue 3 June 2010

OAM server hardware details

Hardware details

....................................................................................................................................................................................................................................

Physical specifications

The following figure shows a OAM server module side view and front view. Both views
show the OAM server with an AMC module installed.
Figure 3-2 OAM server side view and front panel
3CMO2859
ALAB03

NBRZAL

NBDM14
3CMO2685
ABAA

1
BS0815U
OKJJ

NBAFIM

3CMO2741
AAAB

GEO

GE1

GE2

GE3

GE4

GE5

USB

CP

CI

RST

B50847
UE 1R5

SIDE VIEW

Table 3-1

FRONT PANEL

OAM server module physical specifications

Characteristic

Dimension

Height

8U/322.25 mm

Depth

280 mm

Pitch

30.48 mm

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255-400-209R8.0.1
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Issue 3 June 2010

OAM server hardware details

Hardware details

....................................................................................................................................................................................................................................

Table 3-1

OAM server module physical specifications

Characteristic

(continued)
Dimension

Input power voltage

36 & 75 VDC (48 VDC nom.)

Power consumption per OAM server with


AMC

190 W max

Ambient temperature

between +5 C and +40 C

Weight

2.24 kg (with 1 AMC)


2.056 kg (no AMC)

Common power supply for two AMCs

50 W max

CPU

The OAM server CPU is based on a 16.2 SPECint_rate2006 and it has the following
technical specifications:

2.16 GHz Standard Voltage Intel Merom Dual-Core T7400 processor


Lindenhurst Chipset (MCH7520 & ESB6300)

Up to 8 GB of RAM (2 x 4 GB DDR2) in two 240-pin DIMM slots with ECC


2 GB of local IDE Flash Disk

I/O interfaces

The OAM server module has interfaces to communicate with external elements such as
the chassis, and configuration and debug tools.
Two ports are provided for transport functions on the front of the OAM server blade (GE4
and GE5) Four JLCAT6 cords are provided for this function.

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Issue 3 June 2010

OAM server hardware details

Hardware details

....................................................................................................................................................................................................................................

The following table describes the I/O interfaces of the OAM server module.
Table 3-2

OAM server module interfaces

Interfaces
Back panel

Specifications

2 x SERDES Gigabit Ethernet interfaces for


communication with the fabric interface of up to 2
hub modules.

2 x 1000Base-T Gigabit Ethernet interfaces for


communication with the base interface of up to 2 hub
modules.

1 redundant IPMI interface for connection to the shelf


manager.

1 synchronization interface for the 5060


MGC-8/VSG chassis.

1 redundant -48 V power supply interface.

Front panel

See OAM server front panel (p. 3-9) for details on the
front-panel ports.

RTM (NASYS)

For functional applications:

1 PCI-Express 4X interface connected to the pilot


CPU.

1 IPMC and management interface for RTM FRU


management.

2 groups of 8 E1/T1 ports connected to both AMC


slots.

4 SAS ports for hard disk connectivity.

Signals for RTM FPGA configuration.

12 V payload power supply and 3.3 V management


power supply interfaces.

For debug or engineering applications:

1 ICE port for disk controller debug.

1 RS232 debug port connected to LSI controller.

1 JTAG interface, including reserved signal for


firmware upgrade and debug purposes.

2 USB ports.

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Issue 3 June 2010

OAM server hardware details

Hardware details

....................................................................................................................................................................................................................................

Table 3-2

OAM server module interfaces

Interfaces
AMC slot

(continued)
Specifications

1 synchronization interface (including 3


synchronization clocks and I2C control bus) with a
Synchronization module located on the RTM module.

1 IPMC and management interface for AMC FRU


management.

2 groups of 8 E1/T1 interfaces connected to both


AMC slots.

2 4-lane PCI-Express interfaces connected to the


control CPU with associated synchronization.

2 SAS ports for hard disk connectivity.

For debug or engineering applications:

1 JTAG interface, including reserved signal for


firmware upgrade and debug purposes.

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Issue 3 June 2010

OAM server hardware details

Hardware details

....................................................................................................................................................................................................................................

OAM server front panel

The following figure shows the front panel of the OAM server.
Figure 3-3 OAM server front panel
3CMO2859
ALAB03

NBRZAL

NBDM14
3CMO2685
ABAA

1
BS0815U
OKJJ

3 Management LEDs

2 AMC Slots
for PCI Express
and Storage Interfaces

NBAFIM

3CMO2741
AAAB

GEO

GE1

GE2

GE3

GE4

GE5

4 x Gigabit Ethernet Ports

2 x Gigabit Ethernet Ports

USB

1 Management Blue LED

1 Debug USB Port

CP

RS232 CPU Access

CI

RS232 IPMC Access

RST

B50847
UE 1R5

FRONT PANEL

The front panel of the OAM server module is equipped with the following:

ports or interfacing with external devices


LEDs for access to module status
AMC slots
a push button

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Issue 3 June 2010

OAM server hardware details

Hardware details

....................................................................................................................................................................................................................................

The following table describes the functions of the front-panel ports.


Table 3-3

OAM server with AMC - front panel ports

Front-panel Ports

Function

4 x 1000Base-T Gigabit Ethernet

For external communication with the base interface.

2 x 10/100/1000Base-T Ethernet

Connected directly to the CPU.

Debug USB

For debug or engineering purposes. Connected directly to


the CPU.

2 serial ports

For debug or engineering purposes. One connected to the


CPU, the other connected to the IPMC module.

Push button

For module reset

Management LEDs

The OAM server front panel includes 4 LEDs as described in the following table.
Table 3-4

Management LEDs for OAM server with AMC

LED
Ready for Hot
Swap Blue LED

Color
Blue

State
Hot swap indicator as defined in
the 5060 MGC-8/VSG standard.
Shows OAM server IPMI status.
Steady blue when hot-swap ready.

Out of Service
LED 1

Red

Blinking when a failure is


detected during selftest.
Steady red when an alarm is
detected.

LED 2

Green

OFF until BIOS execution


completes.
Blinking when BIOS is correct.
Steady when OS is ready.

LED 3

Amber

Steady as soon as the IPMC


module triggers payload
power-on.

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OAM server hardware details

Hardware description

....................................................................................................................................................................................................................................

Hardware description
Introduction

This section describes the physical and functional features of the OAM server module,
including details on size, power consumption and hardware.
A OAM server module is made up of the following main blocks:

CPU to provide computing power


0, 1, or 2 SAS hard drive disks with two 4lane PCI-Express interfaces

The OAM server module also provides full connectivity through a set of I/O interfaces.
See the I/O interfaces (p. 4-5)section for a list of available I/O interfaces located on the
front panel, the back panel or RTMs.

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Issue 3 June 2010

OAM server hardware details

Front panel ports

....................................................................................................................................................................................................................................

Front panel ports


Ports and connectors

This section describes the front panel ports and connectors of the OAM server..
Table 3-5

X3401 and 3501 pin assignment

Pin #

Pin name
1

FP_DA+ (TX+)

FP_DA- (TX-)

FP_DB+ (RX+)

FP_DC+

FP_DC-

FP_DB- (RX-)

FP_DD+

FP_DD-

Stacked Fast Ethernet ports

One stacked connector (labelled X3402) provides interfaces for two standard FastEthernet RJ45 ports.
Table 3-6

X3402 pin assignment

Pin #

Pin name
1

DBG_DA+ (TX+)

DBG_DA- (TX-)

DBG_DB+ (RX+)

DBG_DC+

DBG_DC-

DBG_DB- (RX-)

DBG_DD+

DBG_DD-

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OAM server hardware details

Front panel ports

....................................................................................................................................................................................................................................

USB connector

The X5505 connector provides a USB port. The connector integrates the Ethernet
magnetics.
Table 3-7

X5505 pin assignment


USB interface
1

+5V

DATA-

DATA+

GND

Mini-USB debug connectors

Two mini USB connectors provide interfaces for two 9pin standard DB9 links. The
mechanical ground is connected to the connector shield via the PCB.
This figure shows a mechanical overview of the mini-USB connectors:
Figure 3-4 CPU and IPMC Debug connector

IPMC Debug / RS232 link

Table 3-8

CPU debug connector pins


Pin

Signal on X5503

Nc

CPU _TX_DEBUG

CPU _RX_DEBUG

MLOG

Braid shield (mechanical ground)

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OAM server hardware details

Front panel ports

....................................................................................................................................................................................................................................

Table 3-9

IPMC debug connector pins


Pin

Signal on X5504

Nc

IPMC _TX_DEBUG

IPMC _RX_DEBUG

MLOG

Braid shield (mechanical ground)

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Issue 3 June 2010

Hub hardware
4

Overview
Purpose

This chapter describes the functions and features of the Hub module and its connections
to external interfaces.
Contents
Hardware details

4-2

Hardware architecture

4-9

Hub RTM

4-10

Front panel ports

4-12

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255-400-209R8.0.1
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Issue 3 June 2010

Hub hardware

Hardware details

....................................................................................................................................................................................................................................

Hardware details
Introduction

The Ethernet hubs in the 5060 MGC-8 platform are responsible for internal
communications. The slots 7 and 8 are dedicated to the hub cards. Each processor CPU
board and ShMC is connected through the backplane to the two hub cards.
The Hub is an Advanced Telecom Computing Architecture (ATCA) control (CPU)
module that complies with PICMG 3.0 R2.0 and PICMG 3.1 standards. The Hub is a
layer 2 switch with two standardized Advanced Mezzanine Card (AMC) slots that comply
with AMC.1 and AMC.3 standards for PCI Express and Storage interfaces. AMCs are not
used in the switch-only configuration in the 5060 MGC-8 configuration.
Hub and the chassis

Ethernet hubs have associated RTMs in the rear of the chassis. The RTM (NASYS) must
be used in conjunction with the Hub. The RTM provides a Fabric expansion based on 8
Gigabit Ethernet links and direct connectivity to the Hub host processor through 2 GbE
accesses.
Physical specifications

The following figure shows a Hub extracted from the chassis:


Table 4-1, Hub physical specifications (p. 4-3) shows the side view of the Hub and
front panel of the Hub.

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Issue 3 June 2010

Hub hardware

Hardware details

....................................................................................................................................................................................................................................

Figure 4-1 Hub side view and front panel


3CM02660
AAAD04

NBMASW1

NBAFIM

NBAFIM

CP

CI

3CMO2741
AAAB

RST
GEO

GE1

GE2

GE3

USB

Base T

U
P
L
0

U
P
L
1

BS0847
UE 22L

SIDE VIEW
FRONT PANEL
MA-ATCA-014-10

Table 4-1

Hub physical specifications

Characteristic

Dimension

Height

8U/322.25 mm

Depth

280 mm

Pitch

30.48 mm

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255-400-209R8.0.1
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Issue 3 June 2010

Hub hardware

Hardware details

....................................................................................................................................................................................................................................

Table 4-1

Hub physical specifications

(continued)

Characteristic

Dimension

Input power voltage

36 & 75 VDC (48 VDC nom.)

Power consumption per Hub

300W max

Power consumption per RTM

14 W max

Ambient temperature

between +5 C and +40 C

Weight

2.24 kg (with 1 AMC)


2.056 kg (no AMC)

Common power supply for two AMCs

50 W max

CPU

The Hub CPU is based on 1 16.2 SPECint_rate2006 64bit capable platform with the
following technical specifications:

2.16 GHz Standard Voltage Intel Merom Dual-Core T7400 processor


Lindenhurst Chipset (MCH7520 & ESB6300)
Up to 8 GB of RAM (2 x 4 GB DDR2) in two 240-pin DIMM slots with ECC
2 GB of local IDE Disk

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Hub hardware

Hardware details

....................................................................................................................................................................................................................................

I/O interfaces

The Hub interfaces communicate with external elements such as the chassis, and
configuration and debug tools.
Table 4-2

Hub I/O interfaces

Interfaces
Back
panel

Specifications

24 x 1000BASE-BX Ethernet interfaces communicate with the fabric interface


of up to 12 node boards.

12 x 1000Base-T Ethernet interfaces communicate with the base interface of up


to 12 node boards.

1 - Interface communicates to the ShMC configurable (by specific resistor


equipment) either as 2 x 100 base-TX, either 1 x 1000 base-T through the base
switch plan.

1 - Crossed 1000Base-BX Ethernet interface for CPU/Base communicates with


the remote Hub.

1 - Redundant IMPI interface for the connection to the chassis manager.

1 - Synchronization interface for the chassis. It also uses some Update Channel
links between the two Ethernet hubs.

1- Redundant 48 V power supply interface.

Front
panel

See Front panel (p. 4-6) for details on the front-panel ports.

RTM

For functional applications:

2 x 10 GE interfaces connected to the Fabric Switching plan.

1 10 GE interface connected to the base switching plan.

1 - PCI-Express 4X interface connected to the Pilot CPU.

1 - IPMC and management interface for the RTM FRU

2 - Groups of four E1/T1 interfaces connected to both AMC slots.

4 - SAS ports for Hard disks connectivity.

Signals for RTM FPGA configuration.

12 V payload power supply and 3.3 V management power supply interfaces.

For debug or engineering applications:

1 - ICE port for disk controller debug.

1 - RS232 debug port connected to LSI controller.

1 - JTAG interface with reserved signal for firmware upgrade/debug

2 - USB ports.

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Hub hardware

Hardware details

....................................................................................................................................................................................................................................

Front panel

The front panel of the Hub is equipped with the following:

Ports to interface with external devices


LEDs to access module status
AMC slots for housing the AMCs (not used)
Push button

The following figure shows a line drawing of the front of the Hub including LEDs, AMC
slots, and other details.

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Hub hardware

Hardware details

....................................................................................................................................................................................................................................

Figure 4-2 Hub front panel


3CM02660
AAAD04

NBMASW1

NBAFIM

2 AMC slots
for PCI Express and Storage
interfaces

NBAFIM

CI

3CMO2741
AAAB

GEO

GE1

GE2

GE3

4 * 1000Base-T Ethernet
links
(Base interface)

debug Fast Ethernet port

debug USB port


U
P
L
0

10GE electrical interface


U
P
L
1

BS0847
UE 22L

FRONT PANEL

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Hub hardware

Hardware details

....................................................................................................................................................................................................................................

Hub ports

The following table describes the functions of the front-panel ports.


Table 4-3

Hub front panel ports

Front-panel Ports

Function

4 x 1000Base-T Gigabit Ethernet

For external communication with the base interface.

2 x 10 Gigabit Ethernet electrical


interfaces

One for communication with the base switching plan,


the other for communication with Fabric Switching plan.

Debug USB

For debug or engineering purposes.

1 x 10/100/1000Base-T interface

For direct CPU access

2 serial ports

For debug or engineering purposes. One connected to


the CPU, the other connected to the IPMC module.

Push button

For module reset

Management LEDs

The Hub front panel includes 4 LEDs as defined in the ATCA standards. The following
table describes the functions of the front-panel ports.
Table 4-4

Hub management LEDs

LED
Ready for Hot
Swap Blue LED

Color
Blue

State
Hot swap indicator as defined in
the ATCA standard. Shows Hub
IPMI status.
Steady blue when hot-swap ready.

Out of Service
LED 1

Red

Blinking when a failure is


detected during selftest.
Steady red when an alarm is
detected.

LED 2

Green

OFF until Hub is in M4 status.


Blinking when BIOS is correct.
Steady when OS is ready.

LED 3

Amber

Steady as soon as the IPMC


module triggers payload
power-on.

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Hub hardware

Hardware architecture

....................................................................................................................................................................................................................................

Hardware architecture
Hub hardware architecture is based on a CPU chipset and a base switch. Hub
management relies on an Intelligent Platform Management Component (IPMC)
component. Physical IP connectivity will be centralized through the Ethernet hubs.
The following diagram shows the Hub with the following components:

A CPU block that provides computational power

A switching base block, for Ethernet switching


A switching fabric block
A module-management and common-module-resource block

Figure 4-3 Hub architecture overview

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Hub hardware

Hub RTM

....................................................................................................................................................................................................................................

Hub RTM
The Ethernet RTM (NASYS) provides the following functions to the Hub:

Fabric expansion for 8 LIU shelves interconnect

Direct connectivity to the Hub host processor through 2 fast Ethernet accesses
10 GbE physical interface to the chassis switch Base
10 GbE physical interface to the chassis switch Fabric

Debug interface
Remote inventory data storage

The following figure shows the front view of the Hub RTM.

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Hub hardware

Hub RTM

....................................................................................................................................................................................................................................

Figure 4-4 Hub RTM front view

NASYS

10
G
E
B

10 Gigabit Ethernet Base Port

10
G
E
F

10 Gigabit Ethernet Fabric Port

CPU

2 x CPU Access

8 x LIU Access

B
I
T
S

BITS

S
S
U

SSU

W
e
s
t

IOCLK 1/ 2/ 3 West

E
a
s
t

C
L
K

IOCLK 1/ 2/ 3 East

L
I
U

LIU CLK 1/ 2

D
b
g

RS232 Synchro
POWER
H/S

Power LED
1 Management Blue LED

BS0847
UE 22L

FRONT PANEL

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Hub hardware

Front panel ports

....................................................................................................................................................................................................................................

Front panel ports


The following table describes the port reservations on the Hub ports on the chassis.
Table 4-5

Hub port reservations

Board type/location

Label

Marker

Function

NBMASW1

GEO

X01

Transport F-0

AB/M07

GE1

X02

Transport F-1

GE2

X03

Alarm panel

GE3

X04

Transport F-2

BaseT

X06

Serial Over LAN

UPF

X07

LSN Cross-connect

UPB

X08

Not used

CP

X09

SoL access

CI

X10

Installation

NBMASW1

GEO

X01

Transport F-0

AB/M08

GE1

X02

Transport F-1

GE2

X03

Alarm panel

GE3

X04

Transport F-2

BaseT

X06

Serial Over LAN

UPF

X07

LSN Cross-connect

UPB

X08

Not used

CP

X09

SoL access

CI

X10

Installation

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Hub hardware

Front panel ports

....................................................................................................................................................................................................................................

Gigabit Ethernet ports

This section provides details about the Hub front panel ports and pin assignments.
The following table describes the X3401 and 3501 pin assignments for the Gig-E ports.
Table 4-6

Ethernet port X3401 and 3501 pin assignment

Pin #

Pin name
1

FP_DA+ (TX+)

FP_DA- (TX-)

FP_DB+ (RX+)

FP_DC+

FP_DC-

FP_DB- (RX-)

FP_DD+

FP_DD

Stacked Fast-Ethernet ports

The following table describes the X3402 pin assignments for the stacked Fast-Ethernet
ports.
Table 4-7

X3402 pin assignment

Pin #

Pin name
1

DBG_DA+ (TX+)

DBG_DA- (TX-)

DBG_DB+ (RX+)

DBG_DC+

DBG_DC-

DBG_DB- (RX-)

DBG_DD+

DBG_DD-

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Hub hardware

Front panel ports

....................................................................................................................................................................................................................................

USB connector

The X5505 connector provides a USB port. The connector integrates the Ethernet
magnetics.
The following table describes the X5505 pin assignements for the USB connector.
Table 4-8

X5505 pin assignment


USB interface

+5V

DATA-

DATA+

GND

Mini-USB debug connectors

Two mini USB connectors provide interfaces for two 9pin standard DB9 links. The
mechanical ground is connected to the connector shield via the PCB.
This figure shows a mechanical overview of the mini-USB connectors:
Figure 4-5 CPU and IPMC Debug connector

IPMC Debug / RS232 link

The following table describes the X5503 pin connectors on the CPU debug port.
Table 4-9

CPU debug connector pins


Pin

Signal on X5503

Nc

CPU _TX_DEBUG

CPU _RX_DEBUG

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Hub hardware

Front panel ports

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Table 4-9

CPU debug connector pins

(continued)

Pin

Signal on X5503

MLOG

Braid shield (mechanical ground)

The following table describes the X5504 pin connectors on the IPMC debug connector.
Table 4-10

IPMC debug connector pins


Pin

Signal on X5504

Nc

IPMC _TX_DEBUG

IPMC _RX_DEBUG

MLOG

Braid shield (mechanical ground)

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Processor blade hardware


5

Overview
Purpose

This chapter describes the functions and features of the Processor blade and describes the
connections to external interfaces.
Contents
Hardware details

5-2

Hardware architecture

5-9

Processor blade RTM

5-10

Front panel ports

5-12

SS7 AMC module

5-14

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Processor blade hardware

Hardware details

....................................................................................................................................................................................................................................

Hardware details
Introduction

The Processor blade (FMO16JB or FM016JP) is an Advanced Telecom Computing


Architecture (ATCA) control (CPU) module. The processor blade is a general purpose,
flexible module that complies with ATCA PICMG 3.0 R2.0 and PICMG 3.1 option 1
standards. The Processor blade also has two standardized Advanced Mezzanine Card
(AMC) slots in compliance with ATCA AMC.1 and AMC.3 standards for PCI Express
and Storage interfaces.
Processor blade and the chassis

The processor blade can be installed in any node slot in the 5060 chassis. The chassis can
house:

2 hub modules
12 node modules

2 dedicated shelf managers

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Processor blade hardware

Hardware details

....................................................................................................................................................................................................................................

Physical specifications

The processor node module meets 5060 MGC-8 standard requirements. The following
figure shows the processor module extracted from the chassis with the side view and front
panel of the processor module.
Figure 5-1 Processor Blade (FM016JB or FM016JP)

FMD16BC

NBDM14
3CMO2685
ABAA

1
BS0815U
OKJJ

GEO

GE1

RST

CP

USB

SIDE
FRONT

Table 5-1

Processor blade physical specifications

Characteristic

Dimension

Height

8U/322.25 mm

Depth

280 mm

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Processor blade hardware

Hardware details

....................................................................................................................................................................................................................................

Table 5-1

Processor blade physical specifications

(continued)

Characteristic

Dimension

Pitch

30.48 mm

Input power voltage

36 & 75 VDC (48 VDC nom.)

Power consumption per Processor blade with


AMC

290 W max

Ambient temperature

between +5 C and +40 C

Weight

3.07 kg (with 1 AMC)


2.85 kg (no AMC)

Power supply for AMC

50 W max

CPU

The CPU platform implements eight double data rate 2 (DDR2) DIMM slots for a
maximum memory capacity of 32 GB using the current 4-GB DIMMs and is open for 64
GB depending on 8 GB RDIMM availability.
The processor blade CPU has the following technical specifications:

Two AMD HE2344, Opteron Quad core Processor,


Up to 32Gbytes (8x 4GB DDR2) organized in eigth DIMMs slots 240pins with ECC
running at 667MHz,
Two BCM HyperTransport(HT) System I/O Controller
Two Intel 82571EB dual Gigabit Ethernet Controller

One BCM57710 dual 10 Gigabit Ethernet Controller


One LSISAS1064E SAS Controller
One SST55LD019 IDE controller
One SCH4304 super I/O controller

One LCMXO2280C (GSTPMO) for hardware management

I/O interfaces

The processor blade has interfaces to communicate with external elements such as the
chassis, and configuration and debug tools.

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Processor blade hardware

Hardware details

....................................................................................................................................................................................................................................

The following table describes the I/O interfaces of the processor blade.
Table 5-2

Processor blade interfaces

Interfaces
Back panel

Specifications

2 x SERDES Gigabit Ethernet interfaces for


communication with the fabric interface of up to 2
hub modules.

2 x 1000Base-T Gigabit Ethernet interfaces for


communication with the base interface of up to 2 hub
modules.

1 redundant IPMI interface for connection to the shelf


manager.

1 synchronization interface for the 5060 MGC-8


chassis.

1 redundant -48 V power supply interface.

1 JTAG interface, including reserved signal for


firmware upgrade and debug purposes.

Front panel

See Processor blade front panel ports (p. 5-6) for


details on the front-panel ports.

RTM

For functional applications:

2 - PCI-Express 4X interface connected to the pilot


CPU.

1 - IPMC and management interface for RTM FRU


management.

1 - Group of 8 E1/T1 ports connected to both AMC


slots.

4 - SAS ports for hard disk connectivity.

Signals for RTM FPGA configuration.

12 V payload power supply and 5 V management


power supply interfaces.

For debug or engineering applications:

1 - ICE port for disk controller debug.

1 - RS232 debug port connected to LSI controller.

1 - JTAG interface, including reserved signal for


firmware upgrade and debug purposes.

2 - USB ports.

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Processor blade hardware

Hardware details

....................................................................................................................................................................................................................................

Table 5-2

Processor blade interfaces

(continued)

Interfaces

Specifications

AMC slot

1 - IPMC and management interface for AMC FRU


management.

1 - Group of 8 E1/T1 interfaces connected to the


AMC slot.

1 - 4-lane PCI-Express interfaces connected to the


control CPU with associated synchronization.

2 - SAS ports for hard disk connectivity.

For debug or engineering applications:

1 - JTAG interface, including reserved signal for


firmware upgrade and debug purposes.

Processor blade front panel

The front panel of the processor blade is equipped with the following:

ports or interfacing with external devices


LEDs for access to module status

AMC slot
a push button

Processor blade front panel ports

The following table describes the functions and connections of the front-panel ports for
processor blades.
Table 5-3

Processor blade front panel ports

Front-panel Ports

Function

2 x 10/100/1000Base-T Ethernet

For debug or engineering purposes. Connected directly to


the CPU.

Debug USB

For debug or engineering purposes. Connected directly to


the CPU.

2 serial ports

For debug or engineering purposes. One connected to the


CPU, the other connected to the IPMC module.

Push button

For module reset

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Processor blade hardware

Hardware details

....................................................................................................................................................................................................................................

Management LEDs

The processor blade front panel includes 4 LEDs in compliance with the 5060 MGC-8
standard. The front panel also includes two Ethernet LEDs for each of the two Ethernet
ports.
The following table lists and describes the LEDs on the processor blade front panel.
Table 5-4

Management LEDs for processor blade

LED

Color

Ready for
Hot Swap
Blue LED

Blue

Out of
Service LED
1

Red

LED 2

Green

LED 3

Amber

State

Hot swap indicator as defined in the ATCA standard. Shows


processor blade IPMI status.

Steady blue when hot-swap ready.

Blinking when a failure is detected during self-test.

Steady red when an alarm is detected.

OFF until card is in M4 status.

Blinking when BIOS is correct.

Steady when OS is ready.

Steady as soon as the IPMC module triggers payload


power-on.

Off is a power supply error is detected.

Front panel Ethernet LEDs

The processor blade front panel includes also two Ethernet LEDs; one for each of the two
Ethernet ports. There is no standard associated with these LEDs.
However a platform policy is defined so that the LEDs on the RJ45 interface are
configured to report as follows:

Link status - LED is yellow in the case of an established link. Otherwise the LED is
off.
Link activity - LED is green when transmit or receive activity is detected. The LED is
off if no activity is detected or if no link is connected.

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Processor blade hardware

Hardware details

....................................................................................................................................................................................................................................

Processor blade configurations

Each processor blade has one AMC slot. Alcatel-Lucent equips this slot with AMC
modules as required for a particular configuration. The following table provides examples
of how the processor blade is equipped in various configurations.
The following table describes the configuration options for the processor blade with or
without the AMC.
Table 5-5

Processor blade configuration options

CLEI

Mnemonic

Orderable
Item (OI)

Description

NGC5ANYMAA

FM016JB

3CM03285JB

Processor card with 16GB


memory

NGC5ANZMAA

FM016JP

3CM03285JP

Processor card with 16GB


memory + SS7 AMC

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Processor blade hardware

Hardware architecture

....................................................................................................................................................................................................................................

Hardware architecture
The Processor blade is an Advanced TCA embedded dual processor AMD Opteron
Socket-F (1207) multiprocessing single board computer (SBC) designed to operate as a
node board in an ATCA shelf.
The processor blade includes:

A pilot CPU block that provides computational power

A card-management and common-card-resource block

The following diagram shows an architectural overview of the processor blade.


Figure 5-2 Processor blade architecture overview

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Processor blade hardware

Processor blade RTM

....................................................................................................................................................................................................................................

Processor blade RTM


The RTM (RPCMHDDA) for the Processor (FM016JP) is an optional element. The
RPCMHDDA RTM is associated with the 8-port E1/T1 rear access SS7 AMC hosted by
the processor blades. It can also be associated with traffic or database cards without a SS7
AMC for its disk storage.
The following connections are provided:

8x physical E1/T1 links coming from an AMC site located on the front board:
Uses a HE5-HD (High Density) connector for 8 E1/T1
Supports 75/100/120 ohm line impedance matching

2x 1000 Base-T Ethernet coming from the CPU located on the front board which uses
the RJ45 connector on the face plate.
Support for one Hard Disk drive:
2.5 inch drive

300GB capacity

The following figure shows the processor blade RTM front panel details.

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Processor blade hardware

Processor blade RTM

....................................................................................................................................................................................................................................

Figure 5-3 Processor blade RTM front panel


RPCMHDxA

P
C
M

POWER
H/S

FRONT PANEL

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Processor blade hardware

Front panel ports

....................................................................................................................................................................................................................................

Front panel ports


This section provides details about the Processor blade front panel ports and pin
assignments.
Stacked Fast-Ethernet ports

One stacked connector (labelled X5101) provides interfaces for two standard 1000Base-T
Ethernet RJ45 ports for debug purposes. The following table describes the X5101 pin
assignements.
Table 5-6

X5101 pin assignment

Pin #

Pin name
1

DBG_DA+ (TX+)

DBG_DA- (TX-)

DBG_DB+ (RX+)

DBG_DC+

DBG_DC-

DBG_DB- (RX-)

DBG_DD+

DBG_DD

USB connector

The X5504 connector provides a USB port. The connectors integrate the Ethernet
magnetics.
Table 5-7

X5505 pin assignment


USB interface
1

+5 V

DATA-

DATA+

GND

Mini-USB debug connectors

2 - Mini USB connectors provide interfaces for two 9pin standard DB9 links. The
mechanical ground is connected to the connector shield via the PCB.
This figure shows a mechanical overview of the mini-USB connectors:
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Processor blade hardware

Front panel ports

....................................................................................................................................................................................................................................

Figure 5-4 CPU and IPMC Debug connector

IPMC Debug / RS232 link

The following table describes the X5506 signal on the CPU debug connector pins.
Table 5-8

CPU debug connector pins


Pin

Signal on X5506

MLOG

CPU _TX_DEBUG

CPU _RX_DEBUG

MLOG

Braid shield (mechanical ground)

The following table describes the X5505 signal on the IPMC debug port.
Table 5-9

IPMC debug connector pins


Pin

Signal on X5505

MLOG

IPMC _TX_DEBUG

IPMC _RX_DEBUG

MLOG

Braid shield (mechanical ground)

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Processor blade hardware

SS7 AMC module

....................................................................................................................................................................................................................................

SS7 AMC module


Description

The Interphase iSPAN 3640 Advanced Mezzanine Card (AMC) enhances the Processor
card FM016JP with E1/T1 connectivity and SS No. 7 functionality.
The Interphase iSPAN 3640 AMC has the following charicteristics:

8 E1/T1/J1 interfaces
31 SS7 Low Speed Links (LSL) per interface
rear acces ports

MPC8568 processor

Front panel LEDs

The following table describes the functions and connections of the front-panel ports for
SS7 AMCs.
Table 5-10

Processor blade front panel ports

LED

Color

States

Normal State

Ready for Hot


Swap Blue
LED

Blue

Out of
Service

Red

Driven by the MMC

Off

PGD

Amber / Green (Healthy


/ Power- Good)

Driven by the MMC

Green

Amber ON while
payload is not
powered on

On

Set to green by the


shelf manager after
the payload is
powered on

Hot swap LED


driven by the MMC

Steady blue when


hot-swap ready

On

CPU

Amber / Green

Driven by the MPC8568


user programmable
(slightly ON when
power is available)

On

T1/E1 LEDs
0 to 3 (or 7)

Green / Red

Green

Green when the link


is up

On

Red when there is a


red alarm on the line

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Processor blade hardware

SS7 AMC module

....................................................................................................................................................................................................................................

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Cabling and connections


6

Overview
Purpose

This chapter provides details about the internal and external connections of the ATCA
chassis (SAV2AB).
Contents
Hardware connections

6-2

Wiring for 5060 MGC-8 ports

6-3

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Cabling and connections

Hardware connections

....................................................................................................................................................................................................................................

Hardware connections
Intra-chassis connections

Within a chassis, the intra-chassis communications are provided by the 5060 MGC-8
chassis backplane and the blades.
Transport network connections

A transport hub terminates external transport interfaces for the system. The term transport
hub applies to the hub blades in the chassis that is equipped first. A pair of hub blades
terminate external connections. The left and right LANs grow outward from the Transport
Hubs. A new chassis is grown by inserting it into the Local Secure Network (LSN) in the
position of the wrap-around (dashed) link, which is normally disabled, and then
reconnecting the wrap-around link to a new chassis.
Depending on the required capacity and the operator's network configuration, up to six
transport network interfaces can be created. Connections 1 to 4 are primary transport
network interfaces and connections 5 and 6 are extended transport network interfaces.
Three transport network connections on the RTM (NASYS) will be used for connectivity
to the customer's network. Two transport connections on the front panel will be used for
port mirroring and alarm panel connectivity.

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Cabling and connections

Wiring for 5060 MGC-8 ports

....................................................................................................................................................................................................................................

Wiring for 5060 MGC-8 ports


Port designations
Table 6-1

Single-chassis port designations

Part

Port number

Purpose

Shelf Manager Board


(NBSMC)

FE0

FE port

Hub blades (NBMASW1)

GE0 to GE3

Base accesses, GE,


auto-negotiated, and auto-MDIX
ports

Base T

Ethernet port

GE0 to GE3

Base accesses, GE,


auto-negotiated, and auto-MDIX
ports

GE4 to GE5

GE, auto-negotiated, and


auto-MDIX ports; Directly
connected to each CPU

GE0 to GE1

Base accesses, GE,


auto-negotiated, and auto-MDIX
ports

OAM Processor (NBRZAL)

Processor blades
(FM016JB/FM016JP)

Wiring types

The following types of wiring are required for an 5060 MGC-8 platform in a
single-chassis configuration:

Serial cables for debug and/or installation


Ethernet cables, on copper cable or optical fiber medium

Alarm link cables (for optional Alarm Module)

Table 6-2
Object

Cables for single-chassis configuration


Code

Function

JLCAT6

1AB2298300xx

CAT6 S-FTP straight cord

LSMUD9

1AB360300001

DB9F-to-mini USB Serial link

DLANM120

3BL02197AA

120 ohms E1 link to DDF

KRACG121

3BW12321AB

4 x 8 pairs terminal blocks kit

PVTBSYM

1AB227470001

External 120/75 ohms terminal

....................................................................................................................................................................................................................................
255-400-209R8.0.1
6-3
Issue 3 June 2010

Cabling and connections

Wiring for 5060 MGC-8 ports

....................................................................................................................................................................................................................................

Serial link cables

Serial links cables (LSMUD9) are used for debugging and/or installation mode only. Two
LSMUD9 cables are required for each chassis. The LSMUD9 cable connects to the serial
ports of the processor blade or Hub on the 5060 MGC-8 side and connect to the DB9
Serial port on an external PC.
Ethernet link cables

For Ethernet, Fast Ethernet (FE), and Giga Ethernet (GE) links, all cables must be GE
compliant. All Ethernet links are from the 5060 MGC-8 chassis or S/R accesses.
Four ports (GE0, GE1, GE3 and Base T) on the front of the Hub (NBMASW1) and five
ports (CPU0, GE0, GE1, GE2, and GE3) on the Hub RTM (NASYS) provide SoL and
Transport to customer accesses.
Transport access is provided by ports GE4 and GE5 on the OAM Server (NBRZAL) of
the first chassis. Eight JLCAT6 cables are provided to fulfill this function. Their lengths
are customer dependent. If the target is in the same chassis the 3m length cables should be
used.
Alarm link cables

If the optional Alarm Module (RALARMAA) is used in a cabinet configuration, the


JLDAW cable is used to make the connection between the rear of the PDU (SAPDUAA)
and the top of the rack.

....................................................................................................................................................................................................................................
255-400-209R8.0.1
6-4
Issue 3 June 2010

Part information
7

Overview
Purpose

This chapter provides an explanation of part numbers and their associated Orderable
Items (OI) number, Mnemonic number, CLEI codes, and descriptions of the switch
modules.
Contents
Chassis system components

7-2

CLEI codes

7-4

Field Replaceable Units

7-5

Customer documentation

7-7

...................................................................................................................................................................................................................................
255-400-209R8.0.1
7-1
Issue 3 June 2010

Part information

Chassis system components

....................................................................................................................................................................................................................................

Chassis system components


The table below provides a list of components and part numbers for the base system of a
chassis and its respective components for a stand-alone configuration.
Table 7-1

Chassis system components

Description

Quantity

Mnemonic

Part Number

Chassis

SAV2AB

3CM02395AB

Hub Switch 1GB

NBMASW1

3CM02660CA

OAM Server

NBRZAL

3CM02859CL

Traffic Processor 16 GB

Up to 10

FM016JB

3CM03285JB

Traffic Processor 16 GB +
SS7 AMC

Up to 10

FM016JP

3CM03285JP

RTM Synchro & Switching

NASYS

3CM02570AA

RPCMHDDA

3CM03238DA

RTM 8E1/T1 75/120 +


1xHDD 300GB

Up to 10

Fan Tray Bottom

SFB300AA

3CM03108AA

Fan Tray Top

SFT300AA

3CM03109AA

Shelf Manager of ATCA Shelf

NBSHMC

3CM02418AA

RTM Rear Filler

4 - 14

NAFILL

3CM02577AA

Front Board Filler

0-8

NBFILL

3CM02578AA

Air Filter Board Side

NDAFF

3CM02587AA

Air Filter RTM Side

NDAFR

3CM02588AA

3U Bottom Deflector for


Chassis

MABAFBAA

3CM03235AA

3U Top Deflector for Chassis

MABAFTAA

3CM03302AA

Front Cable Tray for Chassis

KMFT1

3CM03070AA

Rear Cable Tray for Chassis

KMRT2

3CM03071AA

....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-2
Issue 3 June 2010

Part information

Chassis system components

....................................................................................................................................................................................................................................

Cabinet components

In a configuration using a cabinet, the following components are required in addition to


the Chassis System Components list in Table 7-1, Chassis system components (p. 7-2).
Table 7-2

Cabinet system components

Description

Quantity

Mnemonic

Part Number

Cabinet 44U

NRA244AA

3CM02769AA

DC Power Distribution

SAPDUAA

3CM02902AA

Alarm Module

RALARMAA

3CM02949AA

Mounting Kit

KPDUJ1

3CM03650AA

....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-3
Issue 3 June 2010

Part information

CLEI codes

....................................................................................................................................................................................................................................

CLEI codes
The Common Language Equipment Identification (CLEI) Code contains intelligent
ten-character codes that can identify telecommunications equipment with great precision.
Accepted by telecommunications providers as the industry standard, its primary
applications include inventory control, investment tracking and provisioning. There is
also a 1:1 relationship between a CLEI code and a vendor's Product ID. The Product ID
defines the manufacturer, part number and manufacturing version of that part number. For
further information on code types, refer to the Telcordia document GR-485-CORE,
"Generic Requirements for Common Language Equipment Coding Processes and
Guidelines."
The following table provides a list of CLEI codes for the switching system equipment.
Table 7-3

CLEI Codes

Component

Mnemonic

Part Number

CLEI Code

Chassis

SAV2AB

3CM02395AB

NGMNH00DRA

Hub 1GB

NBMASW1

3CM02660CA

NGC5AHWMAA

OAM Server 1HDD 147G 8GB

NBRZAL

3CM02859CL

NGC5AH1MAA

Processor Blade 16GB

FM016JB

3CM03285JB

NGC5ANYMAA

Processor Blade 16GB + SS7


AMC

FM016JP

3CM03285JP

NGC5ANZMAA

RTM Synchro & Switching

NASYS

3CM02570AA

NGC5AHZMAA

RTM 8E1/T1 75/120 + 1xHDD


300GB

RPCMHDDA

3CM03238DA

NG17AXT2AA

Top Fan Tray 300W

SFT300AA

3CM03109AA

NGC5ANCFAA

Bottom Fan Tray 300W

SFB300AA

3CM03108AA

NGC5ANBFAA

Shelf Manager

NBSHMC

3CM02418AA

NGC5AGJMAA

Alarm Module

RALARMAA

3CM02949AA

NGC5AGLMAA

....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-4
Issue 3 June 2010

Part information

Field Replaceable Units

....................................................................................................................................................................................................................................

Field Replaceable Units


The following elements are considered to be Field-Replaceable Units (FRU) within the
5060 MGC-8. FRU status indicates that customers can order these items as spare units,
and use them as replacements using published procedures.
Table 7-4

List of Field Replaceable Units

Component

Type

Mnemonic

Part Number

Hub

Blade

NBMASW1

3CM02660CA

OAM server

Blade

NBRZAL

3CM02859CL

Processor 16 GB memory

Blade

FM016JB

3CMO3285JB

Processor 16 GB memory +SS7

Blade

FM016JP

3CMO3285JP

RTM - Synchro & Switching


for Hub

Blade

NASYS

3CM02570AA

RTM - T1/E1 + 1xHDD 300G

Blade

RPCMHDDA

3CM03238DA

Shelf Management Controller

Blade

NBSHMC

3CM02418AA

Fan Tray - Bottom (300W)

Module

SFB300AA

3CM03108AA

Fan Tray - Top (300W)

Module

SFT300AA

3CM03109AA

Air filter Front

Mechanical

NDAFF

3CM02587AA

Air filter Rear

Mechanical

NDAFR

3CM02588AA

10G Cable 0.5M

Mechanical

JLE10G

1AB370280001

10G Cable 1M

Mechanical

JLE10G

1AB370280002

10G Cable 2M

Mechanical

JLE10G

1AB370280003

10G Cable 3M

Mechanical

JLE10G

1AB370280004

10G Cable 4M

Mechanical

JLE10G

1AB370280005

10G Cable 5M

Mechanical

JLE10G

1AB370280006

10G Cable 10M

Mechanical

JLE10G

1AB370280007

10G Cable 7M

Mechanical

JLE10G

1AB370280008

Front Filler Blanks

Mechanical

NBFILL

3CM02578AA

Rear Filler Blanks

Mechanical

NAFILL

3CM02577AA

DC Power Distribution

Mechanical

SAPDUAA

3CM02902AA

Alarm Module

Module

RALARMAA

3CM02949AA

Fuse Kit

Mechanical

KPDUJ1

3CM03650AA

Cabinet

Mechanical

NRA244AA

3CM02769

Mounting Kit for Cabinet

Mechanical

KMPJ1

3CM03649AA

....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-5
Issue 3 June 2010

Part information

Field Replaceable Units

....................................................................................................................................................................................................................................

Table 7-4

List of Field Replaceable Units

Component

Type

(continued)
Mnemonic

Part Number

Cords Support

Mechanical

KMFT1

3CM03070AA

Cords Support

Mechanical

KMRT2

3CM03071AA

Deflector 3U 300W Bottom

Mechanical

MABAFBAA

3CM03235AA

Deflector 4U 300W Middle

Mechanical

MABAF4AA

3CM03302AA

Deflector 3U 300W Top

Mechanical

MABAFTAA

3CM03236AA

....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-6
Issue 3 June 2010

Part information

Customer documentation

....................................................................................................................................................................................................................................

Customer documentation
For a list of customer documentation related to this release, see Table 2, Manuals and
part numbers (p. xv) . Manuals and Part Numbers, lists the standard set of
Alcatel-Lucent Gateway Platform documentation, their part numbers and a brief
description. Other manuals, which are available upon purchase of additional software, are
listed in Table 3, Other documentation (p. xvii).

....................................................................................................................................................................................................................................
255-400-209R8.0.1
7-7
Issue 3 June 2010

Glossary
...................................................................................................................................................................................................................................

Numerics
1310 OMC-P

1310 Operations & Maintenance Center - Plus


3GPP2

Third Generation Partnership Project


...................................................................................................................................................................................................................................

ACCM

ATCA Centralized Compute Module


ADCM

ATCA Distributed Compute Module


ALG

Application Level Gateway


AMC

Advanced Mezzanine Card


API

Application Programming Interface


ATCA

Advanced Telecommunication Architecture


...................................................................................................................................................................................................................................

B2BUA

back-to-back user agent


BCF

Border Controller Function


BGW

Border Gateway
BTS

Billing and Traffic System


....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-1
Issue 3 June 2010

Glossary
....................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

CAC

Context admission control


CCS

Connection Control and Signaling process


CDMA

Code Division Multiple Access


CDR

Call Detail Record


CLI

command line interface


CRBT

Caller Ring Back Tone


...................................................................................................................................................................................................................................

DB

Database Blade
DDoS

Distributed Denial of Service


DHCP

Dynamic Host Configuration Protocol


DoS

Denial of Service
DSCP

Differentiated Services Code Point


DSP

Digital Signal Processing


...................................................................................................................................................................................................................................

EMC

Electro Magnetic Compatibility


EO

End Office
ETSI

European Telecommunications Standards Institute


....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-2
Issue 3 June 2010

Glossary
....................................................................................................................................................................................................................................

EVRC

Enhanced Variable Rate CODEC


...................................................................................................................................................................................................................................

FCAPS

Fault, Configuration, Accounting, Performance, and Security


FGCP

FortiGate Clustering Protocol


FRU

Field-Replaceable Unit
...................................................................................................................................................................................................................................

GMSC

Gateway Mobile Switching Center


...................................................................................................................................................................................................................................

HDD

Hard Disk Drive


HSS

home subscriber server


...................................................................................................................................................................................................................................

I-CSCF

Interrogating Call Session Control Function


I2C

inter Integrated Circuit


IBCF

Interconnect Border Control Function


IBGF

Interworking Border Gateway Function


IMS

IP Multimedia Subsystem
INAP

Intelligent Network Application Part


IP

Internet Protocol

....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-3
Issue 3 June 2010

Glossary
....................................................................................................................................................................................................................................

IPDC

Internet Protocol Domain Connection


IPMB

Intelligent Platform Management Bus


IPMC

Intelligent Platform Management Controller


IPMI

Intelligent Platform Management Interface


IPS

Intrusion Prevention Service


IRAP

IP realm availability package


ISDN

Integrated Services Digital Network


...................................................................................................................................................................................................................................

LCR

Least Cost Routing


LED

Light Emitting Diode


LMSD

Legacy of Mobile Station Domain


LNP

Local Number Portability


LRN

Local Routing Number


LSN

local secure network


...................................................................................................................................................................................................................................

MGC

Media Gateway Controller


MGW

Media Gateway

....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-4
Issue 3 June 2010

Glossary
....................................................................................................................................................................................................................................

MSC

Mobile Services Switching Center


...................................................................................................................................................................................................................................

NAP

Network Access Point


NAPT

network address port translation


NAT

Network Address Translation


NEBS

Network Equipment Building Standards


NGN

Next Generation Networks


...................................................................................................................................................................................................................................

OAM

operations, administration, and maintenance


OAM

Operation and Maintenance


OAM&P

Operations, Administration, Maintenance, and Provisioning


OB

OAM Blade
OMC

Operations and Maintenance Center


...................................................................................................................................................................................................................................

P-CSCF

Proxy-Call Session Control Function


PDU

Power Distribution Unit


PEM

power entry module


PSTN

Public Switched Telephone Network


....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-5
Issue 3 June 2010

Glossary
....................................................................................................................................................................................................................................
...................................................................................................................................................................................................................................

QoS

Quality of Service
...................................................................................................................................................................................................................................

RACF

Resource Access Control Facility


RTCP

Real Time Transport Control Protocol


RTM

rear transition module


RTP

Real Time Transport Protocol


...................................................................................................................................................................................................................................

S-CSCF

Serving Call Session Control Function


SCTP

Stream Control Transport Protocol


SDP

Session Description Profile


SFW

Signaling Firewall
ShMC

Shelf Management Controller blade


SIP

Session Initiation Protocol


SNMP

Simple Network Management Protocol


SOL

Serial over LAN


...................................................................................................................................................................................................................................

TDM

Time Division Multiplexing

....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-6
Issue 3 June 2010

Glossary
....................................................................................................................................................................................................................................

TGW

trunking gateway
TISPAN

Telecommunications and Internet Converged Services and Protocols for Advanced Networking
TL1

Transaction Language 1
TrFO

Transcoder Free Operation


...................................................................................................................................................................................................................................

UDP

User Datagram Protocol


UE

User Equipment
URI

Uniform Resource Identifiers


USB

Universal Serial Bus


...................................................................................................................................................................................................................................

VDOM

Virtual domain
VLAN

Virtual Local Area Network


VMG

virtual media gateway

....................................................................................................................................................................................................................................
255-400-209R8.0.1
GL-7
Issue 3 June 2010

Index

Numerics

5060 MGC-8
wiring types, 6-3
5060 MGC-8/VSG
description, 1-1

cabling and connections


intra-chassis connections, 6-2
transport network connections,
6-2
chassis

.............................................................
D dimensions

chassis, 2-7
Hub, 2-15

design, 1-2

dimensions, 2-7

shelf management controller,


2-25

hardware elements, 1-3

environmental specifications,
2-7

standards, 1-2

.............................................................

functional description, 2-4


A Advanced Telecommunications

Computing Architecture
See: ATCA
ATCA
standards, 1-2
ATCA standards

functions, 2-8
mechanical standards, 2-9

physical components, 2-8


power, 2-7
slot assignments, 2-6

design implications, 1-2

slots, 2-5

.............................................................
B backplane

description, 2-10
base system, 7-2
.............................................................
C cables

Ethernet link, 6-4


serial link, 6-3

part number, xiv


relationships between, xv
.............................................................

modules, 1-6

certification, 1-3

audience, xiv

documentation

standards, 2-9
technical description, 2-8
CLEI codes, 7-4
contact information
how to comment, xx

F Field Replaceable Units

See: FRU
FRU
Hub, 7-5
processor blade, 7-5
RTM, 7-5
RTM T1/E1, 7-5
Shelf management controller,
7-5
functions of components, 2-8

installation support, xviii

.............................................................

RMA process, xx

G glossary, GL-1

technical support, xviii

.............................................................

customer documentation
organization, xiv

H Hub

CPU, 4-4

....................................................................................................................................................................................................................................
255-400-209R8.0.1
IN-1
Issue 3 June 2010

Index
....................................................................................................................................................................................................................................

description, 2-14

preface, xiii

dimensions, 2-15

processor blade

front panel diagram, 2-16


hub
front panel diagram, 4-5
Hub

configurations, 5-8
CPU, 5-4
CPU debug connector, 5-13
description, 2-17

front panel ports, 4-8, 4-12

front panel, 5-6

hardware architecture, 4-9

front panel diagram, 2-18

I/O interfaces, 4-5

front panel ports, 5-12

management LEDs, 4-8

GigE ports, 5-12

physical specifications, 4-2

hardware architecture, 5-9

RTM, 4-10

hardware details, 5-2

.............................................................

I/O interfaces, 5-4

K KMFT1, 2-9

IPMC debug connector, 5-13

KMRT2, 2-9
.............................................................
M MABAF4AA, 2-9

MABAFBAA, 2-9
modules

management LEDs, 5-6


mini-USB debug connectors,
5-12
RTM, 5-10
USB connector, 5-12
.............................................................

part numbers, 1-6


R rear transition modules
.............................................................
N NASYS, 2-19, 2-19

See: RTM
RTM

NDAFF, 2-9

description, 2-19

NDAFR, 2-9

NASYS description, 2-19

.............................................................
O OAM server, 2-13

description, 2-13
.............................................................
P part numbers

documentation, xv
power
chassis, 2-7

overview, 2-19
.............................................................
S SAV2AB, 2-4

shelf management controller, 2-23


dimensions, 2-25
.............................................................
W wiring

5060 MGC-8 ports, 6-3

power supply, 2-26


....................................................................................................................................................................................................................................
255-400-209R8.0.1
IN-2
Issue 3 June 2010