Water cooled minichannel heat sinks for microprocessor

cooling: Effect of fin spacing

Saad Ayub, Wajahat Ali, Hafiz Muhammad, Aysha Maryam
Department of Mechanical and Aeronautical Engineering
University of Engineering and Technology, Taxila, Pakistan
Department of Electrical Engineering,
Comsats Institute of Information Technology, Wah, Pakistan

Presenters
Danial Sohail
Osaid Haq
Daniyal Iqbal
Owais Ali

ME-089
ME-102
ME-103
ME-105

Abstract
Heat Sinks With Five Different Fin Spacing
Lowest Base Temperature achieved from finest fin spacing
Modifying Geometry results in 9% less base temperature than commercial heat sink
60% Higher Heat Transfer Coefficient in case of 0.2 mm fin spacing

Introduction
Microprocessor Operating Temperature 60 to 80
Air Cooling Limitations
Optimize Liquid Cooling
Modify Thermophysical Properties of Coolant
Modify Heat Sink Geometry Using Ordinary Coolant

Optimize Liquid Cooling

Modify Thermophysical Properties of Coolant

Use of Nanofluids
Heat Transfer Enhancement from 20% to 160%
Use is still Ambiguous due to:

Higher Cost
More Maintenance

Modify Heat Sink Geometry

Heat Transfer increases by decreasing Channel

Width

Miniature Jet Stream

This paper deals with effect of Sink Geometry

Literature Review
Authors
X.L. Xie
W.Q. Tao
Y.L. He
B.P. Whelan
R. Kempers
P. Naphon
S. Wongwises

Area of Study
Heat transfer characteristics of water cooled mini
channel heat sinks

Conclusion

Heat removal increased with

decrease in channel width.

Thermal resistance increase with

increase in channel width
CPU cooling by liquid jet array impingement water Increased heat transfer than
block
commercial cooling block
Experimental analysis of liquid jet impingement

Lowered CPU temperature than

cooling system on real processor
commercial cooling blocks

M.R.O. Pano
J.P.P.V. Guerreiro

Analysis of intermittent multi-jet spray system

C. Bower
A. Ortega
C. Green

Water cooled Silicon carbide mini channel heat

sink for high power electronic appliances

Higher efficiency and intelligent

thermal management
Resulted higher performance than
air cooled Silicon carbide.

Authors
J.A. Eastman
S.U.S. Choi
S. Li

Area of Study
Conclusion

40% increase in thermal

Anomalously increased effective thermal
conductivity observed
conductivities of ethylene glycol based nano fluids
containing copper nanoparticles

A. Ijam
B. R. Saidur

Comparison of water cooled and nano fluid cooled

multichannel heat sinks

N.A. Roberts
D.G. Walker

Performance of Al2O3 water nano fluid in

commercial cooling system

M.R.O. Pano
J.P.P.V. Guerreiro
A.L.N. Moreieira
C.T. Nguyen
G. Roy
C. Gauthier
N. Galanis

Analysis of intermittent multi-jet spray system

Heat transfer enhancement using Al2O3 - water

nano fluid for an electronic liquid cooling system

Nano fluid performed better than

water.
20% enhancement in heat transfer
and comparatively higher nano
fluid temperature at outlet under
same heat flux conditions.
Higher efficiency and intelligent
thermal management
Resulted 38%increase in
convective heat transfer coefficient

Base
Temperature
(T base)

Experiment

Overall heat transfer

coefficient
(U)

Parameters for
comparison of 5 heat
sinks with
different fin spacing

Thermal
Resistance
(R th)

Active Area Enhancement

(A en)

Enhanced overall heat

transfer coefficient
(U en)

( )
()

Schematic of experimental setup

Experimental Apparatus
Heat sink

Heating
block

Fin Material
Copper

Block Material
Copper

Fin thickness
1.0 mm
Fin height
3.0 mm

Heating Power
325 watts

Vendor product
Gigabyte - galaxy

DC power

Fin base area

28.7 28.7 mm

197 watts 1.65 amp

Fin base protrusion

Insulation
Fiberglass wool

0.5 mm

Liquid
cooling
system

Coolant
Water

Experiment
Fin
Spacings

Flow
rates

0.2 mm
0.5 mm
1.0 mm
1.5 mm
Flat surface

0.5 LPM
0.75 LPM
1.0 LPM

Results

Conclusion

Comparison with commercially available Nano fluid.

Temperature of base is directly proportional to flow rate

Lowest Base Temperature of 40.50C

Usage of water
Focus on Altering Geometries