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TUESDAY,DECEMBER15,2015

TIME SESSION
A.M.TUTORIAL
8:30 OverviewofTemporaryWaferBondingfor3DIntegration,MattLueck,RTIInternational
9:00 TemporaryWaferBondingandDebonding:Processes,Materials,andEquipment,FrankFournel,CEALeti
9:30 ThinWaferHandling:MethodsandChallenges,MollyHladik,BrewerScience
10:00 PolyimideWaferBondingAdhesivesfor2.5Dand3DPackaging,MelvinZussman,HDMicroSystems
10:3010:45 BREAK
10:45 TemporaryBondingMaterialsforFanOutWaferLevelPackaging,DavidFleming,DowElectronicMaterials
11:15 TemporaryBondingandDebonding:Process,Material,andEquipment,ShojiOtaka,TOK
11:45 TemporaryWaferBondingandDebonding:Processes,Materials,andEquipment,StefanLutter,SUSSMicroTec
12:151:00 LUNCH(notincluded)
P.M.TUTORIALSPONSOREDBYMENTORGRAPHICS
1:00 WelcomeandOpeningRemarks,HerbReiter,eda2asic
1:10 InterposerDesignandItsImpactontheSystem,BillIsaacson,eSilicon
1:30 PDNPathFinding,BillMartin,ESystemDesign
1:50 VerificationofPowerandThermalIntegrityforLargeVerticallyStackedDies,NormanChang,ApacheBU,ANSYS
2:10 2.5DSiliconInterposerDesign,BrandonWang,CadenceDesignSystems
2:30 InFODesignConsiderations,BillAcito,CadenceDesignSystems
2:503:10 BREAK
3:10 ImprovingDesignPerformancew/SystemlevelCodesign&MultiphysicsAnalysis,NarayananTerizhandurVaradharajan,
Zuken
3:30 ChippackageboardCrossdomainPlanning/OptimizationforAdvancedElectronicProducts,JohnFerguson,JohnPark,
MentorGraphics
5:25p.m. ClosingRemarks
6:008:00 WELCOMERECEPTIONSPONSOREDBYTEZZARON

WEDNESDAY,DECEMBER16,2015
TIME SESSION
7:458:45 REGISTRATIONANDCONTINENTALBREAKFASTSPONSOREDBYSUSSMicroTec
8:45 Welcome,PhilipGarrou,MicroelectronicConsultantsofNC
9:00 ComparisonofNewMemoryArchitectures,RozaliaBeica,YoleDveloppement
9:45 Statusof2.5/3DandOtherHighDensityPackagingOptions,BrandonPrior,PrismarkPartners
10:15 BREAKSPONSOREDBYAMKOR
10:45 TSVErainMemory,MinsukSuh,SKHynix
11:15 TSVTechnologyfor3DNANDFlashMemory,KazuyukiHigashi,Toshiba

11:45 TheLastCentimeter:ChallengesintheDevelopmentandDeploymentofUltraHighPerformance3DiDRAMSystems,
ThomasGregorich,MicronTechnology
12:15 TezzaronDiRAM4:MemoryArchitectureforFlexibilityandPerformance,BobPatti,Tezzaron
12:452:00 LUNCHSPONSOREDBYINVENSAS
2:00 FijiAMDModule,BryanBlack,AMD
2:20 LOGICStacked3DStructureCMOSImageSensors,TeruoHirayama,Sony
2:40 EnablingNextGenerationPlatformsUsingAlterasHeterogenous3DSiPTechnology,ArifurRahman,Altera

3:00 InflectionsinFoundryPackageOfferingsGLOBALFOUNDRIESPerspective,RamaAlapati,GLOBALFOUNDRIES
3:20 BREAK
3:45 BondingTechnologiesforHighVolume3DICManufacturing,MarkusWimplinger,EVGroup
4:05 MoreDie,StrongerDieSmallerandThinnerPackagesDriveDieSingulationbyPlasmaEtch,DavidButler,SPTS
4:25 AdvancesinProcessControlStrategiesforWaferLevelPackaging,PrashantAji,KLATencor
4:45 OpportunitiesandManufacturingChallengeswithFanoutWaferLevelPackaging,RajivRoy,RudolphTechnologies
6:008:00 EVENINGRECEPTIONSPONSOREDBYEVGROUP

THURSDAY,DECEMBER17,2015
TIME SESSION
7:458:45 REGISTRATIONANDCONTINENTALBREAKFAST
8:45 OpeningRemarksandPioneerAwards,PhilipGarrou,MicroelectronicConsultantsofNC
9:00 MyEarlyYearsin3DIC,MitsumasaKoyanagi,TohokuUniversity
9:30 OurEarlyandOurOngoingWorkin3DIC,PeterRamm,FraunhoferEMFT
10:00 TheTransformationofSubstrateTechnologyintheAreaofIoT,DyiChungHu,Unimicron
10:20 BREAKSPONSOREDBYAMKOR
10:45 SLITATSVless,CostEffectiveandHighInterconnectDensityTechnology,SureshRamalingam,Xilinx
11:15 SLIM&SWIFT:MostAdvancedInterconnectFirstIntegrationTechnologies,RonHuemoeller,AmkorTechnology
11:45 SimplifiedHighPerformanceIntegrationTechnology,DougYu,TaiwanSemiconductorManufacturingCo.
12:151:40 LUNCH
1:40 Title:TBA,DanGreen,DARPA
2:00 DAHIIntegrationTechnologyatNorthropGrumman,AugustoGutierrezAitken,NorthrupGrummanAerospaceSystems
2:20 3DHeterogeneousIntegrationofIIIVDevicesandSiCMOS,MiguelUrteaga,Teledyne
2:40 HeterogeneousIntegrationwithPrintingTechnology,ChrisBower,XCeleprint
3:00p.m. BREAK
3:30 AdvancedPackagingandInterconnectOptionsforHeterogeneousIntegration,JohnLannon,RTIInternational
3:50p.m. DesignandVerificationMethodologyforFanOutWaferLevelPackaging,JohnFerguson,MentorGraphics
4:10p.m. LiquidProcessLowkOxides:PotentialforPackagingApplications?HashPakbaz,SBAMaterials
4:30p.m. ClosingRemarks

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