1.

Name of Course/Module

INTRODUCTION TO ELECTRONIC MANUFACTURING

2.

Course Code

EE3140
3.

Name(s) of academic staf

Mr. Permesh Jethi

4.

Rationale for the inclusion of the course in the programme

The main objective of this course is to provide understanding on basic
physical properties of materials used in electronics. Manufacturing
techniques used in the making of electronic products are also covered in
this course apart from description on product development stages from an
original design to a complete and tested artefact. Student will learn how
PCBs are designed, developed and manufactured including CAD layout
generation. Impacts of manufacturing on the environment are also covered
in this course.

5.

Semester and Year ofered

Two / Year ONE

6.

7.

Total
Student
Learning
Time (SLT)
L = Lecture
T = Tutorial
P = Practical
O= Others
Credit Value

Face to Face

42

10

3 credit hours

8.

Prerequisite (if any)

None.

Total Guided and Independent

Learning
O
Guided: 56 hours
Independent Learning: 64 hours
Total: 120 hours

9.

Objective(s)
The main objective is to equip students with the understanding on
manufacturing techniques used in the making of electronic products.
Impacts of manufacturing on the environment are also covered in this
course.

10.

Learning Outcomes
LO1 Perform study on basic physical properties of materials used in
electronics (cognitive application, level 3);
LO2 Analyse PCB circuit design and fabrication (cognitive analysis, level
4);
LO3 Describe the manufacturing process for integrated circuits and its
effect on environment (cognitive comprehension, level 2).

11.

Transferable Skills
Transferable Skills developed through content-related lectures, tutorial and
practical work, continuous assessments as well as exam papers are as
follows:

12.

Transferable Skills
Taught
Practised
Self-Management

Learning

Communication

Teamwork

Problem Solving

Information Technology

Teaching-learning and assessment strategy

Assessed

Students will be given the opportunity to attend lectures, gain more

focused practice and understanding at tutorials, and hands-on experience
at the laboratory. Assessments would be conducted via test, lab, final
examination and assignment that would be evaluated based on a report
and presentation.

13.

Synopsis
This course covers every aspect of electronic packaging from development
and design to manufacturing, facilities, and testing. Students are taught
about materials, thermal management, mechanical and thermo mechanical
stress behaviour, wiring and cabling, soldering technology, integrated
circuit packaging, surface mount technologies, rigid and flexible printed
wiring boards. Students should be able to use tools and techniques to help
them in the design and analysis of analogue and digital circuits.

14.

Mode of Delivery:
Lectures, tutorials and laboratory.

15.

Assessment Methods and Type

Assessments of learning are based on a variety of information sources:
Assessment Methods
40 % Course work Assignment (20%)
Test (10%)
Lab (10%)
60% Final
Examination

16.

Exam (60%)

Assessment Type
Report writing
Written exam
Practical work & report
writing
Written exam

Mapping of the Course to the Learning Outcomes

LO1
LO2
LO3

Test

Assignme
nt

Lab

Exam

Learning Outcomes
LO1 Perform study on basic physical properties of materials used in
electronics;
LO2 Analyse PCB circuit design and fabrication;
LO3 Describe the manufacturing process for integrated circuits and its
effect on environment.

17.

Mapping of the Course to the Program Outcomes

LO1
LO2
LO3

PO
1

PO
2

PO
5

PO
7

Program Outcomes
PO1 Engineering Knowledge - Apply knowledge of
mathematics, science, engineering fundamentals and an engineering
specialization to the solution of complex engineering problems;
PO2 Problem Analysis - Identify, formulate, research
literature and analyse complex engineering problems reaching
substantiated conclusions using first principles of mathematics, natural
sciences and engineering sciences;
PO5 Modern Tool Usage - Create, select and apply
appropriate techniques, resources, and modern engineering and IT
tools, including prediction and modelling, to complex engineering
activities, with an understanding of the limitations;
PO7 Environment and Sustainability - Understand the
impact of professional engineering solutions in societal and
environmental contexts and demonstrate knowledge of and need for
sustainable development.

18.
Week

Content outline of the course/module and the SLT per topic

Topic
L

Materials for electronic packaging.

- Roles
of
engineering
materials,
relationship
between
products,
material
properties
and
their
processing.
Principles of Electronic Production
- Product life cycle, product and process
relationship, productivity.

SLT Hours
T
P/
IL
O
3

Tot
7

2- 3

4-5

6-7

8-9

10
11
12
13
14

Printed circuit boards

- Design, construction and manufacture
of rigid and flexible printed circuit
board versus multilayer boards. Use of
surface mount technologies
Lab 1
Passive
discrete
devicescapacitors, inductors
Physical
dimensions
and
manufacturing process.
Lab 2

resistors,

15

14

Active discrete devices- diodes, bipolar and

MOS transistors. Single chips PAL and Gate
Arrays technologies packaging in electronic
fabrications.
Integrated
circuits
construction
and
manufacture, semiconductor packaging. Chip
scale packaging and direct chip attach
technologies.

15

15

Reliability of electronic products. Connector

and interconnect technology and cabling.
Electronics
manufacturing
and
the
environment. Packaging of high speed and
microwave products. Packaging of high
voltage electronic products.
Production economics and comparative
studies on various packaging technologies.
Impact of manufacturing on the environment.
Product life cycle and process relationship.
Production reliability of electronic products.
Continuous Assessments (Test,
Assignment)
Examination

electronic

14

14

10

10

10
64

10
120

42
Total SLT

10

4
120

19.

Main references supporting the course

o

Harper C. A. (2008). Electronic Packaging and Interconnection

Handbook (4th ed.). New York: McGraw-Hill
Additional references supporting the course

o
o

Herniter, M. E. (2003).Schematic Capture with Electronics

Workbench Multisim. New Jersey: Prentice Hall
Callister W.D. (2007) Materials Science and Engineering: An
Introduction. (7th ed.). New York: John Willey

o
20.

Other additional information

Nil